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TWD137196S1 - Wafer carrier support for semiconductor manufacturing equipment - Google Patents

Wafer carrier support for semiconductor manufacturing equipment

Info

Publication number
TWD137196S1
TWD137196S1 TW098304263F TW98304263F TWD137196S1 TW D137196 S1 TWD137196 S1 TW D137196S1 TW 098304263 F TW098304263 F TW 098304263F TW 98304263 F TW98304263 F TW 98304263F TW D137196 S1 TWD137196 S1 TW D137196S1
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
manufacturing equipment
wafer carrier
carrier support
upper plate
Prior art date
Application number
TW098304263F
Other languages
Chinese (zh)
Inventor
Izumi Sato
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD137196S1 publication Critical patent/TWD137196S1/en

Links

Abstract

【物品用途】;本創作係關於一種半導體製造裝置用晶圓載板支撐台。;【創作特點】;本創作具有一圓形上盤及一圓形下盤，並設置一連接上盤與下盤的支柱，並於上盤上側面設有四根突出之組裝桿，各組裝桿呈大致圓柱形，且圓柱之頂面呈大致階梯狀。[Article Use];This invention is about a wafer carrier support for semiconductor manufacturing equipment.; [Article Features];This invention has a circular upper plate and a circular lower plate, and is provided with a support column connecting the upper plate and the lower plate, and is provided with four protruding assembly rods on the upper side of the upper plate, each assembly rod is roughly cylindrical, and the top surface of the cylinder is roughly stepped.

TW098304263F 2009-03-11 2009-09-10 Wafer carrier support for semiconductor manufacturing equipment TWD137196S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009005411 2009-03-11

Publications (1)

Publication Number Publication Date
TWD137196S1 true TWD137196S1 (en) 2010-10-01

Family

ID=42184700

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098304263F TWD137196S1 (en) 2009-03-11 2009-09-10 Wafer carrier support for semiconductor manufacturing equipment

Country Status (2)

Country Link
US (1) USD616395S1 (en)
TW (1) TWD137196S1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD726133S1 (en) 2012-03-20 2015-04-07 Veeco Instruments Inc. Keyed spindle
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD712852S1 (en) 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (en) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 Wafer boat for substrate processing equipment
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
TWD167988S (en) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD168827S (en) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD165429S (en) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
JP1537629S (en) * 2014-11-20 2015-11-09
JP1537312S (en) * 2014-11-20 2015-11-09
JP1537313S (en) * 2014-11-20 2015-11-09
JP1537630S (en) * 2014-11-20 2015-11-09
JP1563649S (en) * 2016-02-12 2016-11-21
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
JP1651258S (en) * 2019-07-29 2020-01-27
JP1706322S (en) * 2021-08-27 2022-01-31

Also Published As

Publication number Publication date
USD616395S1 (en) 2010-05-25

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