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TWD146468S1 - Chip - Google Patents

Chip

Info

Publication number
TWD146468S1
TWD146468S1 TW100302530F TW100302530F TWD146468S1 TW D146468 S1 TWD146468 S1 TW D146468S1 TW 100302530 F TW100302530 F TW 100302530F TW 100302530 F TW100302530 F TW 100302530F TW D146468 S1 TWD146468 S1 TW D146468S1
Authority
TW
Taiwan
Prior art keywords
wire frame
rectangular wire
line
rectangular
center
Prior art date
Application number
TW100302530F
Other languages
Chinese (zh)
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW100302530F priority Critical patent/TWD146468S1/en
Priority to US29/406,549 priority patent/USD668234S1/en
Publication of TWD146468S1 publication Critical patent/TWD146468S1/en

Links

Abstract

【物品用途】;本創作係關於一種半導體晶片。;【創作特點】;如各圖所示，本創作之晶片包括有大致呈矩形之基板，於該基板上具有可導電的電極線路，包含有兩個分離的電極線路；其中一電極線路係為下方形成有一段缺口的矩形線框，於矩形線框上方的左右兩轉角處分別形成有一圓餅造形，同時在矩形線框上端的橫向線段中央連接一條向下延伸的線段。另一電極線則位在前述矩形線框內，形成上方具有開口之Ｕ形線框，且於Ｕ形線框底線的中央具有兩個圓餅造形。;本創作尚未揭露於申請日前之公開物品，符合新穎性及創作性之新式樣專利要件，爰依法提出新式樣專利申請。[Use of Article];This invention is about a semiconductor chip. ;[Features of the invention];As shown in the figures, the chip of the invention includes a roughly rectangular substrate, on which there is a conductive electrode line, including two separated electrode lines; one of the electrode lines is a rectangular wire frame with a gap formed at the bottom, and a circular shape is formed at the left and right corners above the rectangular wire frame, and a line segment extending downward is connected to the center of the horizontal line segment at the upper end of the rectangular wire frame. The other electrode line is located in the aforementioned rectangular wire frame, forming a U-shaped wire frame with an opening at the top, and there are two circular shapes in the center of the bottom line of the U-shaped wire frame. ;This invention has not yet disclosed any public article before the application date, and meets the new patent requirements of novelty and creativity, so a new patent application is filed in accordance with the law.

TW100302530F 2001-05-24 2011-05-24 Chip TWD146468S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100302530F TWD146468S1 (en) 2011-05-24 2011-05-24 Chip
US29/406,549 USD668234S1 (en) 2001-05-24 2011-11-16 LED chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100302530F TWD146468S1 (en) 2011-05-24 2011-05-24 Chip

Publications (1)

Publication Number Publication Date
TWD146468S1 true TWD146468S1 (en) 2012-04-11

Family

ID=46925113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100302530F TWD146468S1 (en) 2001-05-24 2011-05-24 Chip

Country Status (2)

Country Link
US (1) USD668234S1 (en)
TW (1) TWD146468S1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD177216S (en) * 2015-02-05 2016-07-21 榮創能源科技股份有限公司 Light emitting diode package
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD1012330S1 (en) * 2020-11-18 2024-01-23 Epistar Corporation Light-emitting diode device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
TW200400608A (en) * 2002-06-17 2004-01-01 Kopin Corp Bonding pad for gallium nitride-based light-emitting device
KR100576853B1 (en) * 2003-12-18 2006-05-10 삼성전기주식회사 Nitride semiconductor light emitting device
KR100631969B1 (en) * 2005-02-28 2006-10-11 삼성전기주식회사 Nitride semiconductor light emitting device
KR100706944B1 (en) * 2005-10-17 2007-04-12 삼성전기주식회사 Nitride semiconductor light emitting device
KR100833309B1 (en) * 2006-04-04 2008-05-28 삼성전기주식회사 Nitride semiconductor light emitting device
USD566056S1 (en) * 2006-12-20 2008-04-08 Cree, Inc. LED chip
KR100833311B1 (en) * 2007-01-03 2008-05-28 삼성전기주식회사 Nitride semiconductor light emitting device
USD578536S1 (en) * 2007-08-27 2008-10-14 Podium Photonics (Guangzhou) Ltd. Chip
USD583338S1 (en) * 2007-09-07 2008-12-23 Cree, Inc. LED chip
TWI376817B (en) * 2007-11-23 2012-11-11 Epistar Corp Light emitting device, light source apparatus and backlight module
KR100930195B1 (en) * 2007-12-20 2009-12-07 삼성전기주식회사 Nitride Semiconductor Light Emitting Diode with Electrode Pattern
KR100988041B1 (en) * 2008-05-15 2010-10-18 주식회사 에피밸리 Semiconductor light emitting device
US8384115B2 (en) * 2008-08-01 2013-02-26 Cree, Inc. Bond pad design for enhancing light extraction from LED chips
USD619976S1 (en) * 2009-10-12 2010-07-20 Tekcore Co., Ltd. Light-emitting diode
USD633876S1 (en) * 2009-10-30 2011-03-08 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD627747S1 (en) * 2010-03-18 2010-11-23 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD638377S1 (en) * 2010-03-23 2011-05-24 Liang-Jyi Yan High-power light emitting diode chip
KR101110937B1 (en) * 2010-05-17 2012-03-05 엘지이노텍 주식회사 Nitride semiconductor light emitting diode
KR101039609B1 (en) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 Light emitting device, method for fabricating the light emitting device and light emitting device package
TWD140991S1 (en) * 2010-07-16 2011-06-11 宏齊科技股份有限公司 LED base
USD648287S1 (en) * 2011-03-30 2011-11-08 Epistar Corporation Light-emitting diode
USD656908S1 (en) * 2011-07-05 2012-04-03 Epistar Corporation Light emitting device

Also Published As

Publication number Publication date
USD668234S1 (en) 2012-10-02

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