TWD145128S1 - Light emitting diode lead-frame - Google Patents
Light emitting diode lead-frameInfo
- Publication number
- TWD145128S1 TWD145128S1 TW100303525F TW100303525F TWD145128S1 TW D145128 S1 TWD145128 S1 TW D145128S1 TW 100303525 F TW100303525 F TW 100303525F TW 100303525 F TW100303525 F TW 100303525F TW D145128 S1 TWD145128 S1 TW D145128S1
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- cup
- carrier body
- light
- carrier
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 2
- 238000005192 partition Methods 0.000 abstract 2
Abstract
【物品用途】;本創作係為一種發光二極體載具,用於封裝發光二極體晶片。;【創作特點】;如各附圖所示,本創作之發光二極體載具具有一長矩形之載具本體;如立體圖及俯視圖所示,該載具本體的一角隅具有一缺角,同時具有自頂面向下凹陷且呈縮口狀之一杯槽狀空間,該杯槽狀空間之開口概呈長矩形,並且在杯槽開口的四個角隅皆形成有一斜切角;此外,該杯槽狀空間的底部具有進一步再向下凹陷的二凹槽,且於二凹槽之間形成有一道區隔部,該區隔部的一端呈Y狀分岐開叉。;如仰視圖及另一立體圖所示,載具本體底面的短邊兩側對稱地具有朝向外側凸出之長條狀二金屬接腳,以及在載具本體底面具有位於二金屬接腳之間的二矩形散熱塊。;本創作尚未揭露於申請日前之公開物品,符合新穎性及創作性之新式樣專利要件,爰依法提出新式樣專利申請。[Use of the article]; This invention is a light-emitting diode carrier, which is used to package light-emitting diode chips.; [Features of the invention]; As shown in the attached figures, the light-emitting diode carrier of the invention has a long rectangular carrier body; as shown in the three-dimensional figure and the top view, one corner of the carrier body has a missing corner, and at the same time has a cup-shaped space that is concave downward from the top surface and has a contracted mouth shape, the opening of the cup-shaped space is generally a long rectangle, and a bevel angle is formed at the four corners of the cup-shaped opening; in addition, the bottom of the cup-shaped space has two grooves that are further concave downward, and a partition is formed between the two grooves, and one end of the partition is forked in a Y shape. ;As shown in the bottom view and another three-dimensional view, the short sides of the bottom surface of the carrier body are symmetrically provided with two long strip-shaped metal pins protruding outward, and the bottom surface of the carrier body is provided with two rectangular heat sinks located between the two metal pins. ;This creation has not been disclosed in the public articles before the application date, and meets the new patent requirements of novelty and creativity, so a new patent application is filed in accordance with the law.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100303525F TWD145128S1 (en) | 2011-07-11 | 2011-07-11 | Light emitting diode lead-frame |
US29/406,686 USD667384S1 (en) | 2011-07-11 | 2011-11-17 | Light emitting diode lead-frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100303525F TWD145128S1 (en) | 2011-07-11 | 2011-07-11 | Light emitting diode lead-frame |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD145128S1 true TWD145128S1 (en) | 2012-01-21 |
Family
ID=46801064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100303525F TWD145128S1 (en) | 2011-07-11 | 2011-07-11 | Light emitting diode lead-frame |
Country Status (2)
Country | Link |
---|---|
US (1) | USD667384S1 (en) |
TW (1) | TWD145128S1 (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD133320S (en) * | 2008-06-20 | 2010-02-11 | 三星電機股份有限公司 | Case for light-emitting diode |
US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
TW201128812A (en) * | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
USD622680S1 (en) * | 2009-12-04 | 2010-08-31 | Silitek Electronic (Guangzhou) Go., Ltd. | Package of a light emitting diode |
USD626095S1 (en) * | 2009-12-11 | 2010-10-26 | Everlight Electronics Co., Ltd. | Light emitting diode |
TWD139999S1 (en) * | 2010-02-10 | 2011-04-11 | 隆達電子股份有限公司 | Chip leadframe |
TWD140001S1 (en) * | 2010-02-10 | 2011-04-11 | 隆達電子股份有限公司 | Chip leadframe |
KR101298406B1 (en) * | 2010-05-17 | 2013-08-20 | 엘지이노텍 주식회사 | Light Emitting Device |
USD647070S1 (en) * | 2010-12-22 | 2011-10-18 | Lite-On Technology Corp. | Light emitting diode carrier |
USD654032S1 (en) * | 2011-01-07 | 2012-02-14 | Silitek Electronic (Guangzhou) Co., Ltd. | Package of a light emitting diode |
USD652808S1 (en) * | 2011-01-10 | 2012-01-24 | Advanced Optoelectronic Technology, Inc. | Light-emitting diode encapsulating structure |
USD645425S1 (en) * | 2011-02-01 | 2011-09-20 | Silitek Electronic (Guangzhou) Co., Ltd. | Light emitting diode carrier |
-
2011
- 2011-07-11 TW TW100303525F patent/TWD145128S1/en unknown
- 2011-11-17 US US29/406,686 patent/USD667384S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD667384S1 (en) | 2012-09-18 |
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