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TWD145128S1 - Light emitting diode lead-frame - Google Patents

Light emitting diode lead-frame

Info

Publication number
TWD145128S1
TWD145128S1 TW100303525F TW100303525F TWD145128S1 TW D145128 S1 TWD145128 S1 TW D145128S1 TW 100303525 F TW100303525 F TW 100303525F TW 100303525 F TW100303525 F TW 100303525F TW D145128 S1 TWD145128 S1 TW D145128S1
Authority
TW
Taiwan
Prior art keywords
emitting diode
cup
carrier body
light
carrier
Prior art date
Application number
TW100303525F
Other languages
Chinese (zh)
Original Assignee
隆達電子股份有限公司;
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司; filed Critical 隆達電子股份有限公司;
Priority to TW100303525F priority Critical patent/TWD145128S1/en
Priority to US29/406,686 priority patent/USD667384S1/en
Publication of TWD145128S1 publication Critical patent/TWD145128S1/en

Links

Abstract

【物品用途】;本創作係為一種發光二極體載具,用於封裝發光二極體晶片。;【創作特點】;如各附圖所示,本創作之發光二極體載具具有一長矩形之載具本體;如立體圖及俯視圖所示,該載具本體的一角隅具有一缺角,同時具有自頂面向下凹陷且呈縮口狀之一杯槽狀空間,該杯槽狀空間之開口概呈長矩形,並且在杯槽開口的四個角隅皆形成有一斜切角;此外,該杯槽狀空間的底部具有進一步再向下凹陷的二凹槽,且於二凹槽之間形成有一道區隔部,該區隔部的一端呈Y狀分岐開叉。;如仰視圖及另一立體圖所示,載具本體底面的短邊兩側對稱地具有朝向外側凸出之長條狀二金屬接腳,以及在載具本體底面具有位於二金屬接腳之間的二矩形散熱塊。;本創作尚未揭露於申請日前之公開物品,符合新穎性及創作性之新式樣專利要件,爰依法提出新式樣專利申請。[Use of the article]; This invention is a light-emitting diode carrier, which is used to package light-emitting diode chips.; [Features of the invention]; As shown in the attached figures, the light-emitting diode carrier of the invention has a long rectangular carrier body; as shown in the three-dimensional figure and the top view, one corner of the carrier body has a missing corner, and at the same time has a cup-shaped space that is concave downward from the top surface and has a contracted mouth shape, the opening of the cup-shaped space is generally a long rectangle, and a bevel angle is formed at the four corners of the cup-shaped opening; in addition, the bottom of the cup-shaped space has two grooves that are further concave downward, and a partition is formed between the two grooves, and one end of the partition is forked in a Y shape. ;As shown in the bottom view and another three-dimensional view, the short sides of the bottom surface of the carrier body are symmetrically provided with two long strip-shaped metal pins protruding outward, and the bottom surface of the carrier body is provided with two rectangular heat sinks located between the two metal pins. ;This creation has not been disclosed in the public articles before the application date, and meets the new patent requirements of novelty and creativity, so a new patent application is filed in accordance with the law.

TW100303525F 2011-07-11 2011-07-11 Light emitting diode lead-frame TWD145128S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100303525F TWD145128S1 (en) 2011-07-11 2011-07-11 Light emitting diode lead-frame
US29/406,686 USD667384S1 (en) 2011-07-11 2011-11-17 Light emitting diode lead-frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100303525F TWD145128S1 (en) 2011-07-11 2011-07-11 Light emitting diode lead-frame

Publications (1)

Publication Number Publication Date
TWD145128S1 true TWD145128S1 (en) 2012-01-21

Family

ID=46801064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100303525F TWD145128S1 (en) 2011-07-11 2011-07-11 Light emitting diode lead-frame

Country Status (2)

Country Link
US (1) USD667384S1 (en)
TW (1) TWD145128S1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD133320S (en) * 2008-06-20 2010-02-11 三星電機股份有限公司 Case for light-emitting diode
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
TW201128812A (en) * 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD626095S1 (en) * 2009-12-11 2010-10-26 Everlight Electronics Co., Ltd. Light emitting diode
TWD139999S1 (en) * 2010-02-10 2011-04-11 隆達電子股份有限公司 Chip leadframe
TWD140001S1 (en) * 2010-02-10 2011-04-11 隆達電子股份有限公司 Chip leadframe
KR101298406B1 (en) * 2010-05-17 2013-08-20 엘지이노텍 주식회사 Light Emitting Device
USD647070S1 (en) * 2010-12-22 2011-10-18 Lite-On Technology Corp. Light emitting diode carrier
USD654032S1 (en) * 2011-01-07 2012-02-14 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode
USD652808S1 (en) * 2011-01-10 2012-01-24 Advanced Optoelectronic Technology, Inc. Light-emitting diode encapsulating structure
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier

Also Published As

Publication number Publication date
USD667384S1 (en) 2012-09-18

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