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TW584275U - Heat sink assembly - Google Patents

Heat sink assembly

Info

Publication number
TW584275U
TW584275U TW092211552U TW92211552U TW584275U TW 584275 U TW584275 U TW 584275U TW 092211552 U TW092211552 U TW 092211552U TW 92211552 U TW92211552 U TW 92211552U TW 584275 U TW584275 U TW 584275U
Authority
TW
Taiwan
Prior art keywords
heat sink
sink assembly
assembly
heat
sink
Prior art date
Application number
TW092211552U
Other languages
English (en)
Inventor
Hsieh-Kun Lee
Dong-Yun Lee
Zhi-Jie Zhang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW092211552U priority Critical patent/TW584275U/zh
Publication of TW584275U publication Critical patent/TW584275U/zh
Priority to US10/877,716 priority patent/US7086456B2/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW092211552U 2003-06-25 2003-06-25 Heat sink assembly TW584275U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092211552U TW584275U (en) 2003-06-25 2003-06-25 Heat sink assembly
US10/877,716 US7086456B2 (en) 2003-06-25 2004-06-25 Combination of fan and heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092211552U TW584275U (en) 2003-06-25 2003-06-25 Heat sink assembly

Publications (1)

Publication Number Publication Date
TW584275U true TW584275U (en) 2004-04-11

Family

ID=33538549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092211552U TW584275U (en) 2003-06-25 2003-06-25 Heat sink assembly

Country Status (2)

Country Link
US (1) US7086456B2 (zh)
TW (1) TW584275U (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7277290B2 (en) * 2005-11-02 2007-10-02 Asia Vital Components Co., Ltd. Secure device for a heat dissipating component
US7289330B2 (en) * 2005-11-10 2007-10-30 Fu Shun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fan mounting device
TWI267347B (en) * 2005-11-25 2006-11-21 Foxconn Tech Co Ltd Heat dissipation device
US7414839B2 (en) * 2006-11-28 2008-08-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan
DE202007003846U1 (de) * 2007-03-13 2007-05-24 Jet Computer Products Gmbh Lüfter
CN101296601A (zh) * 2007-04-25 2008-10-29 鸿富锦精密工业（深圳）有限公司 散热装置
KR100957374B1 (ko) * 2007-08-27 2010-05-11 현대자동차주식회사 연료전지차량용 수소재순환장치의 블로어 하우징
CN101772293B (zh) * 2009-01-07 2013-06-05 富准精密工业(深圳)有限公司 散热装置
CN101841986B (zh) * 2009-03-16 2014-03-26 富准精密工业(深圳)有限公司 扣件及使用该扣件的散热装置
CN103185022A (zh) * 2011-12-27 2013-07-03 鸿富锦精密工业（深圳）有限公司 风扇组件及其卡锁
CN103294144A (zh) * 2012-03-05 2013-09-11 鸿富锦精密工业（深圳）有限公司 风扇固定装置
USD732655S1 (en) * 2013-11-21 2015-06-23 Sanyo Denki Co., Ltd. Fan
CN104329865B (zh) * 2014-03-28 2017-01-18 海尔集团公司 一种风扇以及具有该风扇的翅片热交换器和冰箱
CN216306294U (zh) * 2021-10-30 2022-04-15 王兴奎 一种三合一固定支架

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
US5353863A (en) * 1994-03-07 1994-10-11 Yu Chi T Pentium CPU cooling device
US5677829A (en) * 1995-06-07 1997-10-14 Thermalloy, Inc. Fan attachment clip for heat sink
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6301113B1 (en) * 1999-05-07 2001-10-09 Psc Computer Products, Inc. Retainer clip for heat sink for electronic components
TW458384U (en) * 2000-01-25 2001-10-01 Global Win Technology Co Ltd Fixing device of heat sink
TW516800U (en) * 2000-07-01 2003-01-01 Foxconn Prec Components Co Ltd Heat sink assembly
TW509348U (en) * 2001-06-18 2002-11-01 Global Win Technology Co Ltd Heat dissipation apparatus
US6459584B1 (en) * 2001-12-13 2002-10-01 Kuo Yung-Pin Fixing frame for positioning heat dispensing device of computers
US6415853B1 (en) * 2002-01-22 2002-07-09 Chaun-Choung Technology Corp. Wind cover locking element structure of heat radiator
EP1341230A1 (en) * 2002-02-27 2003-09-03 Spark Electronic S.R.L. Heat dissipator for integrated circuits
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
TW584260U (en) * 2002-06-28 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink device
TW536139U (en) * 2002-09-09 2003-06-01 Hon Hai Prec Ind Co Ltd Dissipating assembly

Also Published As

Publication number Publication date
US7086456B2 (en) 2006-08-08
US20040265121A1 (en) 2004-12-30

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees