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TW567931U - An improved positioning ring for wafer polishing - Google Patents

An improved positioning ring for wafer polishing

Info

Publication number
TW567931U
TW567931U TW92200893U TW92200893U TW567931U TW 567931 U TW567931 U TW 567931U TW 92200893 U TW92200893 U TW 92200893U TW 92200893 U TW92200893 U TW 92200893U TW 567931 U TW567931 U TW 567931U
Authority
TW
Taiwan
Prior art keywords
positioning ring
wafer polishing
improved positioning
improved
polishing
Prior art date
Application number
TW92200893U
Other languages
Chinese (zh)
Inventor
Shui-Yuan Chen
Shui-Sheng Chen
Tien-Ting Chen
Original Assignee
Shui-Yuan Chen
Shui-Sheng Chen
Tien-Ting Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shui-Yuan Chen, Shui-Sheng Chen, Tien-Ting Chen filed Critical Shui-Yuan Chen
Priority to TW92200893U priority Critical patent/TW567931U/en
Publication of TW567931U publication Critical patent/TW567931U/en

Links

TW92200893U 2003-01-17 2003-01-17 An improved positioning ring for wafer polishing TW567931U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92200893U TW567931U (en) 2003-01-17 2003-01-17 An improved positioning ring for wafer polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92200893U TW567931U (en) 2003-01-17 2003-01-17 An improved positioning ring for wafer polishing

Publications (1)

Publication Number Publication Date
TW567931U true TW567931U (en) 2003-12-21

Family

ID=32504114

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92200893U TW567931U (en) 2003-01-17 2003-01-17 An improved positioning ring for wafer polishing

Country Status (1)

Country Link
TW (1) TW567931U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344434B2 (en) 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
CN115106932A (en) * 2021-11-10 2022-09-27 华海清科股份有限公司 Chemical mechanical polishing head and polishing equipment

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344434B2 (en) 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
US8585468B2 (en) 2003-11-13 2013-11-19 Applied Materials, Inc. Retaining ring with shaped surface
US9937601B2 (en) 2003-11-13 2018-04-10 Applied Materials, Inc. Retaining ring with Shaped Surface
US10766117B2 (en) 2003-11-13 2020-09-08 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
US11577361B2 (en) 2003-11-13 2023-02-14 Applied Materials, Inc. Retaining ring with shaped surface and method of forming
US11850703B2 (en) 2003-11-13 2023-12-26 Applied Materials, Inc. Method of forming retaining ring with shaped surface
CN115106932A (en) * 2021-11-10 2022-09-27 华海清科股份有限公司 Chemical mechanical polishing head and polishing equipment
CN115106932B (en) * 2021-11-10 2024-03-05 华海清科股份有限公司 Chemical mechanical polishing head and polishing equipment

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