TW544877B - Method for electroplating IC encapsulated substrate - Google Patents

Abstract

A method for electroplating an IC encapsulated substrate mainly comprises: applying a hole electroplating process on a dual-faced encapsulation substrate (both sides of an insulation substrate material on the base of the encapsulation substrate being applied with a copper film) to enable an electric conduction between the copper films on both sides of the encapsulation substrate; coating a resist on the surface layer of the substrate; etching off the non-circuitry portion; removing the resist to expose the circuitry portion; coating a resist on the substrate to expose a circuitry portion reserved for electroplating and a periphery portion; performing a nickle plating operation and a gold plating operation, in which one end of the electroplating electrode is mounted on the surface layer of the encapsulation substrate, and the other end is mounted on the bottom layer of the encapsulation substrate; electroplating the circuitry portion (with a suitable metal, e.g. Cu, Ni, gold, etc.) without the need of reserving electroplating lines on the surface layer of the encapsulation substrate; removing the resist to complete the production of the circuitry on the front face; performing a production of the circuitry on the back face which comprises: using a resist to cover the line position on the back face of the substrate; performing an etching operation to reserve the line; and applying an organic solderability perservaties (OSP) or a pre-flux to form a thin and uniform film to protect the copper film portion of the circuitry. The invented special electroplating method increases the circuitry quality of the encapsulation substrate without the need of installing an electroplated line on the electroplated nickle/gold layer on the front face of the encapsulation substrate.

Description

544877 Fix

No. 1 91104213 V. Description of the invention (1) The present invention is a method of making circuit wires by using electroless metal plating on the circuit board substrate for integrated circuits to make circuit wires, so that ^ is completely absent. Electroplated wires can be as old as the circuit quality of the substrate. Please refer to the figure-for general package.-Generally speaking, in the type of double-sided package circuit, the double-sided board is connected by wires or the double-sided pin is double-circle type. However, in recent years, After the development of perforated electroplating technology has gradually matured, the form of plated double-sided packaging substrates has become the main way to mass-produce high-quality road boards. On the package substrate, the surface circuit is made using the traditional method: at a suitable position on the main circuit diagram (such as gold " finger), pull a plated wire 3 'to the gold-plated rod 4 outside the board, (puting Bar), connect the electrode to make a plated circuit 2 ', wait for the plated circuit 2, and cut it off from the load 5 after the master is finished. At this time, the plated wire 3 will be left on the package substrate. ', This residual wire will also generate heat when the current passes, and it will also easily cause noise to affect the circuit quality. This is undoubtedly a big loss for the packaging substrate Γ with a high accumulation density, so it is highly anticipated by the industry Correspondence (the industry still has an electroless plating method electr0Uss platlng, also known as chemical deposit method chemical deposit, which uses a reducing agent H added to reduce the metal ions to metal and deposits on the object to be plated = fying This method can also form a ore layer without the need for electroplated wires, but this conversion = is not easy to control, the failure rate is high, and its plating growth rate is slow, which is currently not suitable for mass production production line applications). The primary object of the present invention is to provide a metal plating method for a packaging substrate. The copper film is electrically conductive on both sides after the plating of the through holes of the double-sided packaging substrate. Specially, the bottom copper film layer is used as a gold plating rod to make the packaging substrate. Λ Correction charm 91104213 V. Description of the invention 0: Table: U does not need to be provided with electroplated wires, so that the circuit wires do not leave the quality of the conductive path. The necessary heat and noise are generated to enhance the electrical layer of the sealing substrate. The secondary purpose of this layer is on the day of the launch. The secondary purpose is to process the gold (metal) of the power mine of the present invention. It can be covered without any side etching during the subsequent process of inferior gas etching, without causing low circuit line quality. The preferred embodiment of the present invention will be described in detail with reference to the drawings. a. Eyes / Xing second picture *, the main manufacturing method of the present invention is: the packaging substrate i with steel film 1 1 on the surface is perforated to form column holes 4 (the second picture A shows the correction (the second picture G (Shown in the figure). After a few moments in the second figure, the back surface of the package substrate 1 is left with the wiring 32 (please refer to Section I) outside the wiring (32), and the surface soldering liquid mux) is coated with a resist 2 and The previous treatment reported that only BC was addicted, and the part of the circuit (3 2) on the back surface of the Jinhuan substrate was injured to form a protective film 6 (see the second figure 1). According to the above process, φ soil PJ can be used to make the electroless metal plating route of the surface of the package substrate, and this process can be made by M + + h A so that the electroplated metal of the product perfectly covers the fresh steel circuit wires. f | 彳 shell surface, side elevation can prevent the copper circuit wire from being short-circuited by side I insects. : 1. As mentioned above, when it is known that the metal electric money method of the integrated circuit package substrate invented in this case has industrial applicability and progress, and meets the requirements of the invention patent, the above is only a preferred implementation of the present invention. The examples are not intended to limit the scope of implementation of the present invention. That is, all equal changes and modifications made by the household according to the scope of patent application of the present invention are covered by the scope of patent of the present invention.

544877 _Case No. 91104213_ Year Month Amendment _ Brief Description of Drawings Description of Drawings: The first picture A and B are schematic diagrams of metal plating residual wires of conventional package substrates. The second figures A to I are schematic diagrams of the metal plating method of the present invention. Conventional < Technical part: 1 '. Package substrate 2'. Plating circuit 3 '. Plating wire 4'. Gold-plated rod 5 '. Cut-off part of the present invention: 1. Package substrate 11. Copper film 1 2. Electroplated copper layer 2. Resistor 3. Circuit 31 · Electroplated metal (nickel gold) 3 2. Circuit 4. Column hole 5. Erection agent 6. Protective film

Page 10

Claims (1)

544877 Its main system is a metal plating method for integrated circuit packaging substrates. A) Perforation of the packaging substrate with copper film on both sides to form pillar holes; b) Plating pillar holes to electrically connect the surface and bottom layers of the packaging substrate; c) Applying a resist on the packaging substrate at the appropriate position for the wiring and the entire bottom layer; d) Carving # to make circuitless wires on the front of the packaging substrate and removing the resist; e) On the packaging substrate The entire back surface and the front surface of the front panel are left with the position of the circuit to be plated and the agent; f) the plating electrode is provided on the surface layer and the bottom layer (nickel layer and gold layer) of the package substrate to remove the resistance after the circuit is made: metal plating (G) Continue to make some circuits on the back side of the package substrate, first apply a resist on the first surface, and leave only the back lines on the resist. H) Leave the back circuit on the package substrate after etching. 1) On the package substrate The area other than the back circuit part is covered with a soldering flux. The circuit coated on the back part of the package substrate is coated with a resist, but the outer area of the package-based circuit is not coated, and the plating is started. The part and the circuit are located on the front surface of the package substrate; the resist is applied, and the front part is protected. Page 11