TW517411B - System and method for connecting a power converter to a land grid array socket - Google Patents

Abstract

A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

Description

517411 A7 B7 V. Description of the invention (彳) Scope of the invention The present invention relates to the transmission of power to electronic circuits, and in particular to an improved pad grid array (LGA) central processing unit (CPU) socket. BACKGROUND OF THE INVENTION A standard computer system includes an integrated circuit device mounted on a large printed circuit board called a motherboard using a socket or similar type of electrical connector. The voltage on the motherboard from the power supply is usually a higher DC level than that required for integrated circuit devices. Currently, in high-performance computer systems, a voltage regulator (ie, a DC-DC converter) and a pin grid array (PGA) socket are used. The central processing unit (CPU) of the socket is encapsulated and consists of integrated circuit devices (ie silicon wafers), which are soldered to the encapsulation substrate using flip chip ball grid array (FCBGA), and then use ball grid array (BGA) technology Solder on one side of the interposer. The encapsulation substrate is connected to the PGA socket using multiple contacts in a matrix device, each contact having a pin-type tail. The DC-DC converter connection includes a multilayer bent plate and an edge card connector to connect to the edge of the interposer base. This configuration requires the CPU package to be inserted into the PGA socket in a vertical direction (Z-axis). A complicated retention mechanism is required to connect the DC-DC converter in the X-axis sliding direction. In the recently developed grid array (LGA) socket, a chelate array, rather than a pin, provides the necessary electrical connection between the integrated electrical span and the printed circuit board. LGA sockets are excellent because they do not require soldering between the socket and the CPU enclosure. Furthermore, the LGA socket reduces the height of the socket / encapsulation / CPU solution (because it does not require the use of long pins), which results in a shorter circuit path and improved electrical performance. In addition, in order to connect the current DC-DC converter to the LGA socket, an inline connector is required to improve the paper size. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm).

Binding

517411 A7 B7 V. Description of the Invention (2) Edge card interface for DC-DC converter. The inline will increase the height, electrical path length and parasitic inductance in the socket / encapsulation / CPU solution, so the advantages of the LGA socket will be negated. Although multiple one ounce copper power supply layers can be used to supply power from the DC-DC converter to the CPU socket through the motherboard, an excessive number of power and ground contacts must be provided, and additional power supplies and ground layers can route the motherboard difficult. Transmitting high DC current through the motherboard to the LG A socket is an expensive solution and has technical challenges that have nothing to do with transmitting the current directly to the LGA socket assembly. Therefore, if it can provide a low inductance and resistance inline, which can improve the current carrying capacity from the DC-DC converter to the LGA socket, it is very beneficial. If the inline only requires the inline of the assembly in one direction (vertical or Z axis), it can save time and manufacturing costs, and it is also very helpful. The drawings briefly illustrate the present invention by way of example and not limitation. The accompanying reference numerals in the drawings represent the same components, in which: FIG. 1A is an LGA integrated circuit package encapsulation of an embodiment of the present invention that has not been assembled, and DC -DC converter top view. FIG. 1B is a top view of an assembled LGA integrated circuit device package and a DC-DC converter according to an embodiment of the present invention. FIG. 2 is a cross-sectional perspective view of details of a DC-Dq converter according to an embodiment of the present invention after the contacts are mounted on a power outlet interface. FIG. 3 is a cross-sectional perspective view of contacts of an LGA socket mounted on a motherboard according to an embodiment of the present invention. Figure 4A is an unassembled LGA integrated circuit encapsulation according to an embodiment of the present invention. -5- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm).

Binding

Line 517411 A7 ______ B7 V. Description of the invention (3) " 'and the cross-sectional view of the spatial relationship of the components of the DC-DC converter. 4B is a cross-sectional view of the spatial relationship between the assembled LGA integrated circuit device and the DC-DC converter according to an embodiment of the present invention. SUMMARY OF THE INVENTION In the following description, specific details are provided to provide a thorough understanding of the invention. However, the invention may be practiced without such details. In other instances, well-known elements have not been described in detail to avoid confusion with the present invention. As such, the specifications and drawings are illustrative and not restrictive. Compression contact technology has been used in the computer industry for several years. Different types of this technology have been developed, including polymer-based contacts with conductive metal particles ′ or wires embedded in polymers and stamped metal contact springs. For example, there are commercially available socket 'connectors and in-line products using this technology. However, compression contact technology has never been used to connect a voltage regulator (DC_DC converter) to a Grid Array (LGA) socket. The use of compressive contacts (ie, metal, conductive polymer, or other) to eliminate edge card connectors in such applications is very beneficial, and thus, 'the loop inductance and contact resistance of the connection can be reduced. In addition, it provides a way from the vertical direction instead of the horizontal direction. For example, the traditional edge card connector needs to contact the LGA socket. Compression contact can simplify the retention and installation mechanism of the LGA socket, which is very beneficial. An embodiment of the present invention provides a power connector including a circuit board connected to one end of an output circuit board of a DC-DC converter. Since the connector must carry the negative high current level from the DC_DC converter to the LGA socket and return (ground), these connections on the circuit board consist of one or more layers of wide and thick metal, such as four pans or six ounces Copper. Compression contacts can have a sufficient number and cross-sectional area -6-This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 517411

The other end of the board is connected to carry the required current. This board can be connected to the LGA socket with appropriate contact patterns, and the contacts can be compressed by clamping or retaining mechanisms. The retaining mechanism raises the clamping force and the compression stops, and the 俾 contact is compressed to a predetermined position 卞, so that it will not continue to compress. The LG A socket has a required metal conductor layer to carry a negative current from the power contact to the CPU. Referring to FIG. 1A ', a top view of an unassembled LGA integrated circuit device and a DC-DC converter 100 according to an embodiment of the present invention is shown. The integrated circuit device HQ (ie, silicon wafer) can be mounted on the LGA package 120 in a manner well known in microelectronic manufacturing technology. The LGA encapsulation 120 includes a substrate that can be used as a sheet of fiberglass or bismaleimide-three-field (BT) material, coated aluminum, ceramic or other suitable material, and multi-conductive The layers are made of 'these materials are stacked or co-heated between different dielectric layers. The integrated circuit device 110 can be an analog device, a microprocessor, an application specific device or other types of integrated circuit devices, and can be electrically connected to the LGA-encapsulated end point array (ie, a circular or rectangular pad). (Not shown). The 塾 ′ on the LGA encapsulation 12 ′ ‘when aligned with the socket 13 0’ corresponds to the contact array pattern on the LGA socket 130 (this car list is not shown). The socket 130 itself is sandwiched between the LG A package 120 and a motherboard (not shown). The socket 130 includes a substrate formed of a non-conductive material to receive the LGA package ι20. The contacts on the socket 130 may be made of conductive material, and extend laterally from the surface of the substrate to the bottom surface of the substrate and pass through the substrate. The function of these contacts is that the electrical coupling socket 130 and the LGA encapsulate 120 to the lower motherboard, and the socket 130 is installed thereon. The socket 130 can be connected to the motherboard by a force applied downward on the socket 130, and then the conductive element is compressed so as to form between the socket 1 30 and its contact pad. This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 male). 517411 A7 B7 5. Description of the invention (5) Reliable electrical contact, and electrical contact between the motherboard and its contact pads. To maintain the alignment between the ridges, a retention mechanism such as a frame element (not shown) can be provided on the socket 13 Around 0. In addition, spring clips that extend across the body of the frame element or any other suitable coupling mechanism can be used to hold the socket 130 down against each ridge on the motherboard. Of course 'note that the socket 1 3 0 It can be connected to the motherboard (surface mounting) using traditional reflow floor connection methods, or mounted on the motherboard using other techniques known in the art. The LGA power socket interface 140 includes a contact pad array 142, 144, 146 It is located on one side of the power socket interface 140, and its function is to connect the power socket interface 140 to the DC-DC converter 150. The power socket interface 140 may be part of the socket 130, or it may exist as an independent contact device (Not shown). The contact pads 142, 144, 146, etc. may be made of a conductive polymer made of metal material, or other suitable materials. The contact pads 142, 144, 146 on the power socket interface 140 correspond to the DC-DC converter 150. Contact pad array 152, 1 54, 1 56, etc. The number and arrangement of power contacts 塾 142, 144, 146, 152, 154, 156 can minimize the resistance and inductance of the inline. This method to minimize inductance It is well known to those skilled in manufacturing microelectronic encapsulation. These two devices can be connected together in the manner described above using compression contact technology. The alignment holes 162 and 164 on the power socket interface 14 and DC-DC The alignment holes 166 and 168 on the converter 150 can help ensure proper alignment between the power socket interface i40 and the DC-DC converter i 50. (When the two devices are compressed and installed, the alignment pins (not shown) are inserted into the alignment Positive holes Z 162, 164, 166, 168 to assist in the alignment of the device). Although the alignment pins have been described in this embodiment, other types of bolting mechanisms such as spring clips can also be used 0 -8-

517411 A7 B7

The DC-DC converter 150 is connected to a power supply (not shown), which supplies a higher voltage (i.e., 12V or 48V and ground), which is higher than the voltage required by the integrated circuit u. The DC-DC converter 150 includes a conventional voltage conversion circuit in a housing to convert a higher voltage to a lower voltage to supply a power socket interface 140 and then a motherboard, in a manner well known to those skilled in the art . A heat sink contains heat-conducting materials (ie, copper, aluminum, and titanium) to form, for example, the housing of this converter 150. The heat generated by the conversion circuit can be dissipated by convection directly in the surrounding 2 air. Familiar. It should be noted that manufacturing the DC-DC converter 150 in a manner consistent with the embodiments of the present invention may make the manufacturer noticeable because the DC-DC converter 150 may be tested before the DODC converter 150 is connected to the power socket interface 140. Referring to FIG. 1B, there is shown a top view of an assembled LGA integrated circuit device package and a DC-DC converter / rotator 180 according to an embodiment of the present invention. The contact array 1 52, 1 54, 1 56 on the DC-DC converter 15 and the contact array (not shown) on the power socket interface 14 are compressed and installed together. The alignment pins 1 66, 1 68 inserted through the DC-DC converters 50, the alignment pins (not shown), and the alignment holes (not shown) in the power socket interface 140 can assist the two devices. Proper alignment. A retention mechanism 170 performs an additional alignment function and maintains this—such as the converter 150 making electrical contact with the power socket interface 140. The retention mechanism ι70 may be made of plastic, aluminum, or other suitable materials. In this embodiment, the retaining mechanism i 70 includes a rectangular frame element that can be fixed to the motherboard (not shown) with screws and nuts, although other fastening techniques well known in the art can also be used. A lga socket 130 'includes an LGA encapsulation 12o (which includes an integrated circuit device no)' is mounted on the socket 13o in a manner well known in microelectronic manufacturing technology, and can be used in -9 · I paper sizes for China Standard (CNS) A4 Regulation 4 (210 X 297 public director) 517411 A7 ----- ----- B7 V. Description of the invention (7) Via an undulation in the retention mechanism 17 (not shown) Installed on the motherboard. It should be understood that, although the retention mechanism i 7 〇 is illustrated in FIG. 1B, the socket i 3 0 itself may be used as the retention mechanism, or other similar retention mechanisms well known in the art may be used. Referring to FIG. 2 ′, a sectional perspective view of the details of the contacts of the DC-DC converter mounted on the power socket interface 2000 according to the embodiment of the present invention is shown. On the DC-DC converter 240, the contact arrays 21, 220, 230, and the contact arrays 250, 260, and 270 on the power socket interface 280 are compression-mounted. ]) The C-DC converter 240 is compressed downward from the vertical direction to the power socket interface 2g0, so it can be assembled in a single direction. Referring to FIG. 3, there is shown a sectional perspective view of a contact detail of an LGA socket mounted on a motherboard 300 according to an embodiment of the present invention. The socket base 31o includes contact arrays 3 12 and 3 14 ′. This contact is formed to receive a corresponding grid pad encapsulated by a (not shown). The contacts 312 and 314 may be formed of a conductive material (and a conductive polymer, metal or other), and extend from the top surface of the socket base 310 to the bottom surface of the socket base 310, and provide an integrated circuit device (not shown) (Out) is electrically coupled to a motherboard 320. Coaxial structures 322, 324, 326 for high-signal integration can be metallized for socket 330, and a stopper for socket 33 can be provided, so that it can be compressed when the mother board 320 is compressed downward in the vertical direction. To a predetermined level, but no longer continue to learn. The copper rod 340 (and a plurality of other copper rods, not shown) coupled to the socket base 31 can be used for EMI shielding and / or for grounding the crystal circuit device I / O structure. In the embodiment of Fig. 3, the copper rod 340 and a plurality of other copper rods are quite wide and thick (6 ounces), but other sizes of copper rods can be used. -10- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 517411 A7 B7 V. Description of the invention (8)

Referring to FIG. 4A, there is shown a cross-sectional view of the space of an unassembled LGA integrated circuit device package and a component portion of a DC-DC converter 400 according to an embodiment of the present invention. The integrated circuit device 410 can be connected to the LGA encapsulation 420, and its connection uses end arrays (gate pads) 422, 424, and 426 as shown in FIG. 1A. The contact array (not shown) on the LGA socket 430 corresponds to the grid pads 422, 424, and 426 on the LGA package 420. The contacts on the socket 430 may be made of a conductive polymer or a suitable material and coupled to the socket base 440. The contacts include compression contacts to receive electrical signals from the integrated circuit device 410, and compression contacts 432, 434, 436, and 438 to receive power from the DC-DC converter 450. Ψ DC-DC converter 450 includes a base body 452 made of a stack such as FR-4, fiberglass, and any suitable material, an output voltage plane (ie, VCC voltage plane) 454 to provide output voltage to the socket 430, and A ground plane (GND) 456 completes the circuit path in a manner well known in power transmission technology. A GND plane 442 can also be included in the socket base 440. The package of the integrated circuit LGA device and the DC-DC converter can be assembled (not shown) and mounted on the motherboard 460 using the conventional bolting technique of the embodiment shown in FIG. 1A. The LGA converter 470 can be mounted on the DC-DC converter 450 in the manner described in the embodiment of FIG. 1A. Referring to FIG. 4B, an assembled LGA integrated circuit device package and a DC-DC converter 490 according to an embodiment of the present invention are shown. The components in FIG. 4B are the same as those in FIG. 4A, so the same numbers are retained. The above describes a structure and method for transmitting high current, low voltage DC power from a DC-DC converter to an LGA socket, and corresponding microelectronic encapsulation, and this current does not pass through the motherboard. Although the above description and accompanying drawings illustrate and discuss special embodiments, it should be understood that the present invention is limited only by the scope of the following patent applications. -11-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

517411 Patent Application No. 090124150 The above-mentioned patent application Fan Xiu edition (October 91 patent application Fanyuan charge J! Power transmission system, including a power converter; and a grid array socket, installed in the power converter The contact array on the table corresponds to the contact array on the grid array socket. 2. The power transmission system according to item 1 of the patent application scope, wherein the power conversion system is on < the contact array and the pad array socket The contact array is a contact pad made of a conductive material. 3. The power transmission system according to item 丨 of the application, wherein the pad grid array socket is electrically coupled to the printed circuit board and includes a pad mounted on the pad grid. Integral circuit device of array socket. 4. If the power transmission system of item 1 of the patent application scope, wherein the power converter converts the voltage received from the power supply to a lower voltage, and transmits the lower voltage to the grid Array sockets. '5_ The power transmission system according to item 1 of the patent application scope, wherein the pad grid array socket is installed in the power converter by using unidirectional assembly and compression contact technology. Printed circuit board. 6 · A power transmission system, including: a power converter; a printed circuit board; and-grid array sockets' are mounted on the surface of the power converter's contact array using a unidirectional main mounting, And the surface of the printed circuit board. 7. If the power transmission system of item 6 of the patent application scope, wherein the contact array on the power converter and the printed circuit board corresponds to the < contact array on the thumb array socket, this connection The dot array is made of electrical material. 6. Scope of patent application 8. If the power transmission system of item 6 of the patent application scope, the power sockets of the MOSFET include-integrated circuit devices enclosed in a grid array. 9. For example, please refer to the power transmission unit 6 of the patent scope, wherein the power converter converts the voltage received from the power supply to a lower voltage and transmits the lower voltage to the grid array socket. 10. The power transmission system according to item 6 of the patent application, in which the grid array socket is mounted on a power converter and a printed circuit board using compression contact technology. 11. · A method for mounting a pad grid socket on a power converter, the method comprising: / providing a contact array on the surface of the power converter; a contact array provided on the pad grid interface corresponding to the power converter The contact array on the surface; the contact array on the power converter is vertically compressed to the contact array on the socket interface of the thumb array, and the pad array socket interface is installed on the power converter. 12. The method according to item " of the scope of patent application, wherein the step of installing the grid array socket to the power converter provides an electrical connection between the grid array socket and the power converter. 13. The method according to item U of the patent application, wherein the grid array socket includes a integrated circuit device enclosed in a pad grid array. 14. The method called the scope of the patent application, wherein the step of installing the pad grid array socket to the power converter further includes a step of vertically compressing the pad array socket with the contact array of the pad grid socket to install the pad grid. Array insert -2- This paper size applies to China National Standard (CNS) A4 specifications (210X297 public director) 7 1X 5 Seat on a printed circuit board. 5. The method according to item 14 of the patent application, wherein the step of mounting the pad grid array on the printed circuit board can provide an electrical connection between the pad grid socket and the printed circuit board. 6 'As for the method of applying for item No. 丨 丨, the step of installing the pad grid array on the printed circuit board still includes a step, namely, installing the pad grid array socket table retention mechanism' on the pad grid socket. Array, the contact array is mounted on the printed circuit board through the protrusion of the Baotian mechanism. For example, the method of claim 11 of the patent scope, wherein the grid array socket is used as a retention mechanism to keep the pad grid array properly aligned with the printed circuit board and with the power converter properly aligned. 18. The method according to the patent application, wherein the power converter converts the voltage received from the power supply to a lower voltage and transmits it to the grid array socket. This paper size applies to China National Standard (CNS) A4 (210X297 mm)