TW508644B - Die bonding device - Google Patents

Abstract

A die bonding device comprises: a transmission mechanism, a pre-heat mechanism, at least one carrier, a adhesive applying mechanism, a die picking mechanism, and a heating mechanism, in which the transmission mechanism is continuously operated in a circular movement; these carriers are loaded on the transmission mechanism for positioning the substrate; the pre-heat mechanism is used to bake the substrate to remove the moisture in the substrate; the adhesive applying mechanism is to apply an adhesive on the substrate, and the die picking mechanism is used to place a die at the location with spotted adhesive on the substrate; and, then, the heating mechanism is used to bake and cure the adhesive so as to bond the die with the substrate.

Description

508644 V. Description of the Invention (l) [Field of the Invention] The present invention relates to a crystal sticking device, and more particularly to a crystal sticking device that can maintain the flatness of a substrate in a sticking process and improve the yield per unit time. > [Known technology] Sticking crystal is one of the very important procedures in the IC packaging process. It removes and cuts the die from the wafer and adheres it to the US board and substrate. To provide subsequent procedures such as soil bonding and molding. With the development of packaging technology and the progress of process technology, the volume of packaging structure is becoming lighter, thinner, shorter, and smaller. In response to this trend, the larger the size of the grains, and the thinner the thickness, The thickness of the substrate connected to its signal is also getting thinner. For example, the thickness of the substrate has now developed to ultra-thin substrates below 0.26mm. As shown in FIG. 1, the conventional sticky crystal device 3 00 mainly includes a point glue mechanism 30, a grain pick-and-place mechanism (only the mechanical arm is shown in the figure) 30 2, and a pressing mechanism 3 0 4. Among them, the dispensing mechanism 3 0j is used to dot the silver paste 311 on the substrate 3 03; the grain pick-and-place mechanism 3 02 is to finish the die 312 after the silver paste 311 is finished. Place them one by one on the substrate 303. Before the substrate is subjected to the die bonding process, the product is shot and baked to remove the moisture (m0 丨 sture) from the substrate, but the substrate 3 0 3 = After baking at high temperature, due to the evaporation of moisture and thermal stress, it will & form a substrate fork thermal deformation and warpage (warpage), so that the substrate can maintain its flatness during the process of dispensing and crystal placement. , So the press mechanism (the picture only

508644 V. Description of the invention (2) Shows the pressure rod) 304 or vacuum suction to hold or hold the substrate 3 03. However, after the process of setting the crystal is completed, the substrate 3 0 3 needs to be placed in an oven, or a post-heated heating method is used to cure and cure the silver glue 311. At this time, the substrate 3 0 3 is mostly It will be released from the compression mechanism 304 or the vacuum will be released, so in this state, the substrate 303 will cause warpage. Because the substrate will cause the substrate to bend during the die-bonding process, even during the dispensing and die-bonding process, the substrate is leveled by a pressing mechanism or vacuum suction. However, when the pressure or suction is released, the substrate will still recover. The shape of warping and deformation leads to the shrinkage of the silver glue, so that holes (v oid) are generated, thereby reducing the reliability of the product. After the sticky crystal process is completed, the silver glue must be baked and cured ----------- Therefore, the substrate with the die must be placed in the substrate box, and then sent to the oven for baking, or later Thermal heating directly heats the silver glue on the track. However, no matter if the glue is baked by the oven or post_heat heating method, the substrate must be stagnated for a period of time to cooperate with the operation of the oven or the machine 'causing a delay in time' and thus leading to a decrease in the output per unit time. Therefore, how to keep the substrate flat without warping and deforming the plate due to heating, and to accelerate the overall process of the die attach process. Ma Mayi $ [Summary of the invention] ί Γ The above-mentioned subject, so the purpose of the present invention is to provide a kind of 黏 3L soil-free plate warping deformation of the sticky crystal device during the sticky crystal process. ’, 508644

The purpose is to provide an accelerated die attach process and another embodiment of the present invention. However, the present invention uses a lot of money to make the substrate deform in the whole process of sticking the substrate. The moving conveying mechanism can continuously provide the curing process to increase the amount of sticky crystals. The high-temperature carrier can continuously position the substrate, which can maintain its flatness in order to avoid it. In addition, the present invention further performs a dispensing process, a crystal setting process and a program rate through a cycle, and the yield per unit time is therefore To achieve the above-mentioned object, the present invention includes: a conveying mechanism, a preheating mechanism: to;! Mechanism,-grain pick-and-place mechanism, and a plus mechanism: continued operations; these carriers are placed in the Conveying mechanism: == Baking the substrate, the dispensing mechanism is placed on the substrate at the-: position; on the contrary, the crystal picking and placing mechanism is placed at the point where the adhesive stagnates, and the crystal is placed; the heating mechanism is used to bake and solidify the adhesion. Because the sticky crystal device of the present invention is a high-temperature-resistant carrier II, and the carrier system can keep the substrate flat,: II = after baking treatment to remove moisture, it will not; As a result, the silver glue that stagnates on the substrate will shrink and create holes, which will reduce the yield of the product. In addition, the conveying mechanism is used to continuously perform dispensing, sticking, and baking. Among them, in the silver glue supply baking process, since the substrate is positioned on the carrier I, the

508644

In other words, the stagnation of the silver glue on the substrate can be said, in the baking process, the plate will not be in a stagnant state, so the yield can be avoided. Maintaining the state of continuous baking, it is necessary to make the base glue free of time delay due to baking and curing the silver glue, and then add a single order [Detailed description of the preferred embodiment] The following will refer to the related drawings to explain the present invention. As shown in FIG. 2, the sticking crystal device of the preferred embodiment is shown in FIG. 2. The sticking device of the preferred embodiment of the present invention 丨 mainly includes a conveying mechanism π, a preheating mechanism 12, more than one load 13, a glue mechanism 14, a die The pick-and-place mechanism 15 and a heating mechanism 16. The second tool 13 is used to position the substrate 17 on it, and the carriers are transported by the conveying mechanism 11. The preheating mechanism 12 is used to pre-bake the substrate, and the dispensing mechanism 14 is on the substrate. The sticking point is like an adhesive of silver glue 141, and then the grain picking / putting mechanism 15 places the die 151 on the substrate 17 at the point where the silver glue 141 stagnates, and the silver glue 141 is baked and cured by the heating mechanism 16 to The die 151 is electrically connected to the substrate 17. It should be noted here that the preheating mechanism 丨 2, the dispensing mechanism 丨 4, the grain taking and placing mechanism 15, and the heating mechanism 16 are located above the conveying mechanism 丨 丨, but for the sake of convenience, it is drawn on Above the side of the transport mechanism. As shown in FIG. 3, the four sides of the carrier 13 are respectively provided with a pressing sheet 3 for pressing the substrate 17 placed in the carrier 13. First, the substrate n is placed into the carrier 13 and then pressed. The sheet 131 moves in the direction indicated by the arrow in the figure, so that the pressed sheets 1 3 1 can press the substrate 17. In addition, the carrier 3 can also have a plurality of suction holes ’, which can generate a vacuum suction force, so that the substrate can absorb

Page 7 508644 V. Description of the invention (5) The vacuum suction of the holes enables the substrate 17 to be positioned on a load and made of a high temperature resistant material, such as: 埶: 、 8 1 3 series si mm ^ 口 raw clothes louse Resin, polyurethane; again; consider enough, the placement device 够 substrate π is placed on top and the pre-Λ region Γ is the substrate pressing substrate! 7 on the carrier 13. :: The machine 3 only presses the tablet ⑶ with a plurality of rollers, so that the conveying mechanism can move in the horizontal direction, that is, cyclically move in the direction of the arrow in FIG. 2. ° Clothing and 'in the preparatory zone U0', the substrate 17 is placed on the carrier 13, and then transported by the conveyance mechanism 丨 丨 into the next pre-pre-bake zone 111, several carriers 13 can be placed, And the substrate 17 placed on the load 3 ° is moved by the conveying mechanism u on the one hand, and the preheating mechanism 12 performs pre-baking 'so that the moisture in the substrate 17 can be eliminated', And the substrate Π can be transferred while being baked. Since the substrate is pressed by 13, even if the substrate 17 is baked at a high temperature, the straight surface can be maintained ^ flat, that is, the phenomenon of warping and deformation of the substrate 17 does not occur, and the baking substrate 17 is combined with the stagnation substrate 7 Its transmission. 'After the substrate 17 is baked in the pre-baking area 111, it enters the dispensing area 112. In this area, the substrate 17 is still positioned by the carrier 13, that is, the substrate 1 7 is pressed by the pressing sheets 1 3 1 provided on the four sides of the carrier 1 3, and the dispensing mechanism 4 is used on the substrate 17 Use the silver glue 1 41 or other adhesives in the area where the grains are placed. After the silver glue 141 is placed, it enters the crystal placement area U3. In this area, the Zhongguang substrate is still placed on the carrier 13 and is moved by the action of the conveying mechanism 丨 丨 so that the crystal grain picking and placing mechanism 1 5Cut the finished grain 丨 5 丨 One by one

ΙΗ1 PAGE 8 INTRODUCTION (6) The ground is placed on the substrate 17 with silver glue 141. The CUring is tight, so that the die 151 can be placed in the area 17 of the substrate 17 with a plurality of bases, 17 and two sides, and it can be transported by the mechanism 11 because the substrate continues to cause : In the second aspect, the state of the mechanism heart can be heated for baking, so the overall second can be increased without further increasing the unit yield. s knife is the degree of the shovel, this area == solid! ^ after the completion of the sequence ′ enter the substrate removal area 115, and can: move to the four sides of the pressed piece 131, to remove.彳 The substrate 17 is moved from the carrier 13 by the tractor 18. Then, the carrier i with the substrate Π removed = continuous running in a circular direction in the direction of the wide water surface can be repeatedly used. Attention 19 ^ η From 4 temples 13 to 13 will be the substrate 17 again; at the same time, the substrate placement device baking area 111, the dispensing area 112, the crystal, so that the substrate 17 continues to enter the pre-exit area 1 1 5 Go to the west with an anvil, bake area 1 1 4 'and take the substrate ^ to repeatedly repeat the pre-bake, dispensing, crystal setting, bake, etc. Figure 4 is another preferred embodiment of the preferred embodiment of the present invention Embodiment The die attach device 2 mainly includes the present invention 25, and a heating mechanism 26. Day and day " Pick and place mechanism 5〇8644 V. Description of the invention (7) In this embodiment, the conveying mechanism 21 can perform continuous and cyclic operation in the vertical direction. The conveying mechanism 21 has a vehicle storage box 23a, which is used to store the vehicle 23, and cooperates with a lifter (not shown) to enable the vehicle storage box 23a to move up and down, thereby enabling the vehicle 23 For relative movement. When the carrier 23 is moved to the preparation area 21o, the substrate setter 20 places the substrate 27 into the carrier 23, and moves the pressing sheet 231 to press the substrate 27. Then, when the carrier 23 enters the pre-bake area 211, the pre-heating mechanism 22 bakes the substrate 27 to remove moisture from the substrate 27. Next, after entering the dispensing area 212, after the stomach glue 241 is finished by the dispensing mechanism 24, the wafer placement area ⑴ is entered again, and the grains 251 are placed by the grain taking and placing mechanism ^. After the crystal setting process is completed, baking must be performed to make the previously stagnant silver glue 2 melt, so that the crystal grains 251 and the substrate 27 can be replaced by the predecessors, and the pre-baking area 211 and the baking area 214 are baked. I have: the two sides are hunting the conveyer to carry the conveyance without hindering the roaster from crying. After the second order is completed, the user enters the substrate removal area 215 and pulls the substrate 2 7 out of the carrier 2 3 by pulling w 2 8. Halo In this embodiment, when the substrate 27 is taken out, it is fed into the carrier storage box 23a to store the equal loads ^, 23, and the carriers 23_, 23 /, 23 are stored in the box 23a in the figure. When the storage of the vehicle is matched with the lifter, so that the 23 doors of the vehicle can be described, the storage box of the vehicle moves upward in the direction of C in the figure. According to the storage box 23a " ^ 23 ^ ^ ^ ^ ^ 21 , t ^ 〇 ^ Fu% is running and can be repeated. Page 10 508644 Five invention instructions (8) Reuse. Since the crystal sticking device of the present invention uses a high temperature resistant carrier to carry the substrate, and the carrier can keep the substrate flat, so even if the substrate is subjected to baking treatment to remove moisture before the crystal sticking, it will not be caused by After baking, the substrate is warped and deformed due to the evaporation of water vapor and the generation of thermal pressure, which results in the shrinkage of the silver glue that stagnates on the substrate, resulting in holes and reducing the yield of the product. In addition, the carrier uses a conveyor mechanism to feed a series of pre-baking, dispensing, crystal setting, and baking procedures, especially in the pre-baking and baking procedures. Selectively place on the calculation carrier 'and these carriers are transported by the conveying mechanism. Because the lagging silver glue can be continuously baked, it will not be: glue, and the substrate needs to be stopped, This results in delayed supply of roasted silver with low yield per unit time. u, roasting, and then falling into the technology described in the detailed description of this embodiment, which is easy to explain the invention, and the embodiment is only limited to this embodiment, so it does not exceed this Issue: In the narrow sense, the scope of patents can be implemented in various ways. Spirit and following applications

Page 11 508644 Brief description of the drawing [Simplified description of the drawing] Fig. 1 is a schematic diagram of a conventional process of pressing a substrate by a pressing mechanism to perform the dispensing and sticking processes. FIG. 2 is a schematic plan view of pre-baking, dispensing, and sticking crystals of a die attaching device according to a preferred embodiment of the present invention. Figure 3 is a schematic perspective view of a substrate pressed by a carrier. FIG. 4 is a schematic perspective view of another embodiment of pre-baking, dispensing, and sticking crystals of the sticking crystal device of the preferred embodiment of the present invention. [Symbol description] 1 Sticking device 10 Substrate placement device 11 Conveying mechanism 110 Preparing area 111 Pre-baking area 112 Dispensing area 113 Crystal placement area 114 Baking area 115 Substrate taking-out area 12 Preheating mechanism 13 Carrier 131 Pressing Piece 14 Dispense mechanism 141 Silver glue

Page 12 508644 Brief description of the drawings 15 Grain picking and placing machine 151 Grain 16 Adding mechanism 17 Substrate 18 Retractor 2 Sticky crystal device 20 Substrate placement OXJ 21 m Feeding mechanism 210 Preparing area 211 Pre-baking 212 Dispensing area 213 Crystal placement area 214 Baking area 215 Substrate removal 22 Pre-mechanism 23 Carrier 231 Pressed piece 23a Carrier storage each 24 Dispensing mechanism 241 Silver glue 25 Die pick and place machine 251 Die 26 Rail adding mechanism 27 Substrate

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Claims (1)

508644 6. Scope of patent application 1. A sticky crystal device 'is used to dry crystal grains on a substrate' includes: a conveying mechanism, which is continuously operated in a loop; more than one carrier, which is placed on The conveying mechanism is used to position the substrate; a glue mechanism is used to stagnate the adhesive on the substrate; and a grain pick-and-place mechanism is located at the substrate where the adhesive is stagnate. Put a grain. 2. For example, the crystal sticking device of the first patent application scope further includes: a preheating mechanism, which is used to bake the substrate before retarding the adhesive. 3. The crystal sticking device according to item 1 of the patent application scope, further comprising: a heating mechanism, which is used to bake and cure the adhesive so that the crystal particles are bonded to the substrate. 4. The crystal sticking device according to item 1 of the application, wherein the conveying mechanism has a linear slide. 5. The crystal sticking device according to item 1 of the patent application scope, wherein the conveying mechanism has a plurality of rollers. 6. The crystal sticking device according to item 1 of the patent application range, wherein the conveying mechanism is cyclically operated in the horizontal direction. Page 15 508644 6. Scope of patent application 7. For the crystal sticking device of item 1 of the patent application scope, the conveying mechanism is cyclically operated in the vertical direction. 8. For the crystal sticking device of the first patent application scope, the carrier has a plurality of pressed pieces, which are arranged on the carrier, and the substrate is pressed by the pressed pieces so that the substrate can be positioned at It's on the vehicle. 9. The crystal sticking device according to item 1 of the patent application scope, wherein the carrier has a plurality of suction holes for providing a vacuum suction force to position the substrate on the carrier. 10. The crystal sticking device according to item 1 of the patent application scope, wherein the carrier is made of a material resistant to south temperature. 11 · If the scope of patent application. Item 1 of the die-bonding device, further includes: a substrate placement device, which is to place the substrate on the carrier 1 2 · If the patent application scope of the first item of the die-bonding device And further includes: traction is' it removes the substrate from the carrier. The conveying mechanism package = ... If the sticky crystal device of the first scope of the patent application, which contains " climbing vehicle storage box, which is used to store such vehicles; lifting benefit, which makes the vehicle storage box Able to move up and down; and Page 16 508644 Page 17