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TW506622U - Packaging structure improvement photosensitive semiconductor device - Google Patents

Packaging structure improvement photosensitive semiconductor device

Info

Publication number
TW506622U
TW506622U TW90217882U TW90217882U TW506622U TW 506622 U TW506622 U TW 506622U TW 90217882 U TW90217882 U TW 90217882U TW 90217882 U TW90217882 U TW 90217882U TW 506622 U TW506622 U TW 506622U
Authority
TW
Taiwan
Prior art keywords
semiconductor device
packaging structure
structure improvement
photosensitive semiconductor
photosensitive
Prior art date
Application number
TW90217882U
Other languages
Chinese (zh)
Inventor
Shin-Nan Chen
Original Assignee
Taiwan Ic Packaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Ic Packaging Corp filed Critical Taiwan Ic Packaging Corp
Priority to TW90217882U priority Critical patent/TW506622U/en
Publication of TW506622U publication Critical patent/TW506622U/en

Links

TW90217882U 2001-10-19 2001-10-19 Packaging structure improvement photosensitive semiconductor device TW506622U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90217882U TW506622U (en) 2001-10-19 2001-10-19 Packaging structure improvement photosensitive semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90217882U TW506622U (en) 2001-10-19 2001-10-19 Packaging structure improvement photosensitive semiconductor device

Publications (1)

Publication Number Publication Date
TW506622U true TW506622U (en) 2002-10-11

Family

ID=27622374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90217882U TW506622U (en) 2001-10-19 2001-10-19 Packaging structure improvement photosensitive semiconductor device

Country Status (1)

Country Link
TW (1) TW506622U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10658255B2 (en) 2017-01-03 2020-05-19 Advanced Semsconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10658255B2 (en) 2017-01-03 2020-05-19 Advanced Semsconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US11276616B2 (en) 2017-01-03 2022-03-15 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US11862525B2 (en) 2017-01-03 2024-01-02 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model