TW434379B - Modular surface mount mass flow and pressure controller - Google Patents

Abstract

A modular surface mount mass flow and pressure controller of the present invention includes a modular flow sensor and a modular control valve. The modular flow sensor measures the amount of gas flowing through a modular gas stick and the modular control valve adjusts and controls the flow rate of gas through the modular gas stick. Both the modular flow sensor and the modular control valve are mounted on a surface of a modular base.

Description

Ά3 · ^ Τ9 Hammer case No. 89107284 a Amendment V. Description of the invention (1) Field of the invention In general, the present invention relates to a gas delivery system and a measurement device, especially for a module gas delivery system that integrates different components Systems and methods, particularly for semiconductor manufacturing, integrate airflow components in module gas channels. BACKGROUND OF THE INVENTION There are many manufacturing methods today that require gas to be passed through an airflow channel and have several components for regulating, filtering, and monitoring the airflow passing through it. For example, the current popular semiconductor manufacturing methods, such as chemical vapor deposition, require Transport ultra-pure gas to the processing chamber in an appliance at a suitable flow rate and flow rate. Several gas components are typically integrated in the airflow channel (usually refer to semiconductor manufacturing methods, such as gas channels), including mass flow. Monitors, humidity monitors, valves, regulators, gas purifiers, pressure sensors, diffusers, capacity diaphragm meters, displays, pressure converters and other commercially available components. Figure 1 shows a gas channel 10, or gas channel, of a prior art example. In Figure 1, gas flows from the source through the gas channel 10 may include, for example, an isolation valve 12, a regulator 14, a pressure converter or Sensor 16, a filter 18, an isolation valve 20, a mass flow controller 22, and a downstream isolation air operation valve 26 to the processing chamber (not shown). Each gas component is an independent unit, and a series of Connector 24 is connected. This is an example manufacturing system. Any number of additional and alternate components may also be included in the gas channel from the source to the processing chamber. In short, a gas channel 10 series circuit is added with a gas component. Due to the length of the component and the length of the connector, the full length of the gas passage 10 is increased.

O: \ 63 \ ti3744.ptc Page 4 'JA3 Case No. 89107284 a. Amendment V. Description of the Invention (2) Existing gas channels, the other problem is that the mass flow controller 22 is typically built only for special gases. It must be operated under a certain range of flow- and pressure conditions. If it exceeds its original parameters, the sensor part of the mass flow controller 2 2 must be recalibrated, but the attached control valve may not be accepted in the new Under the conditions (pressure, flow, gas type), the calibration of the mass flow controller needs to pay a high price. In a typical semiconductor manufacturing plan, up to 50 to 200 different mass flow controllers may be required. Cope with various changes. In the existing gas channel, the mass flow controller is typically divided into a thermal-based instrument or a pressure-based instrument. When the existing gas channel is converted from thermal-based to pressure-based flow control, the entire mass flow controller device must be replaced. Pay a very high price. Recently, the semiconductor industry has begun to promote a module gas channel with a standard footprint. When the standard mount for a module gas channel is approximately 1.5x 1.5, according to SEMI Design 圊 Doc. 2787.1 (shown in Figure 4) ), Some gas components may not be suitable for the module gas channel 1.5 x 1.5 inch module mount. For example, the basic size of the standard mass flow controller 22, Figure 2 shows about 4x1.5 inches (size A = 4 inches, size B = 1.5 inches), which is not a module mount for the module gas channel 1.5x1 5 SUMMARY OF THE INVENTION The present invention provides an improved gas component integration system and method, which substantially eliminates or reduces the disadvantages and problems of the previously developed airflow channels from a source through several components to a destination.

O: \ 63 \ 63744.ptc Page 5 4343 Case No. 89107234 Amendment V. Description of the invention (3) Specifically, the module surface device flow sensor of the present invention, as shown in FIG. 1, is in a module A method for integrating a mass flow controller 22 is provided in the gas channel. On a module board surface, gas components are stacked vertically in the original airflow axis. This gas component can be manufactured separately, and the components can also be connected together using standard VCR or Connected according to the specifications of SEMI design drawing Doc. 2787, the present invention is implemented as a module surface device mass flow and pressure controller, which includes a module flow sensor and a module control valve. The module flow sensor measures The gas flow through the module gas channel, the module control valve regulates and controls the flow rate through the module gas channel, and both the module flow sensor and the module control valve are installed on a module base (for example, (Top) ° The present invention provides an important technical advantage, which is to provide a combined function method of a mass flow controller in the design of the module gas channel. .. Another technical advantage provided by the present invention is to reduce the related costs for easy maintenance and replacement of the module gas components that make up the mass flow controller. Another technical advantage provided by the present invention is that in order to reduce the number of replacements of the existing mass flow controller, the mass flow controller is used in all different processing ranges of various types of gases in semiconductor manufacturing. Another technical advantage provided by the present invention is to provide more flexible placement of gas components in the design of the gas channel. Another technical advantage provided by the present invention is to provide a method for easy conversion from the design of a thermal base gas channel to the design of a pressure base gas channel, or from a pressure base to a design of a thermal base gas channel. Another technical advantage provided by the present invention is that the relevant electronic device designed for the provided gas channel can be either a remote control or a local. Schematic description

O: \ 63V63744.ptc Page 6 4343 79® Amendment No. 89107284 V. Description of the Invention (4) For a more complete understanding of the invention and its advantages, please refer to the following description in conjunction with the drawings, which is described here The reference numerals in the figure indicate the characteristics: Figure 1 shows a prior art gas channel, which has a series of individual, separate function gas components, including a mass flow controller connected linearly along the gas flow axis; Figure 2 shows the basic size of the prior art mass flow controller; Figure 3 shows a specific example of the present invention, the mass flow controller has been divided into a module flow sensor and a module control valve; Figure 4 shows the module flow sensor The basic dimensions of the detector and the module valve; Figure 5 shows the structure of the module gas channel under the thermal base flow; and Figure 6 shows the bottle manufacturing of the module gas channel under the pressure base flow. Detailed description of the invention The specific examples provided by the present invention are illustrated in the drawings, and corresponding numbers are assigned to different parts in the drawings. The module surface device mass flow and pressure controller of the present invention includes a module flow sensor and a module control valve. The module flow sensor measures the gas flow rate through the module gas channel, and the module control valve adjusts And control the gas flow rate through the module gas channel, both the module flow sensor and the module control valve are based on the module. Module flow sensors, module control valves and other gas components are usually connected on the basis of the module, including connectors, which can be in accordance with the design drawing SEM I 2787 (SEMI design drawing Doc. 2787. Cooperation as a reference), such as B1 · seal, C-seal, CS-seal, W-seal and Z-seal connection, such as module gas components based on the module, including gas

O: \ 63 \ 63744.ptc Page 7 4: ^ 43 7 9 Case No. 89107284 Amendment V. Description of Invention (5) Filter, gas purifier, pressure converter, mass flow controller, display, humidity monitor, Measuring instruments, valves, diffusers, capacity diaphragm gauges and pressure regulators. The present invention is a standard mass flow controller, including a flow sensor and a control valve device on a modular basis. It must be understood that, when The multifunctional air module of the present invention further shows that it is especially used outside the semiconductor gas channel. This system and method of separately installing a flow sensor and a control valve on a module basis is also applicable to other gas flow channels. This is a specific example of a module gas channel 10 compared to the traditional line series gas channel in Figure 1. The module gas channel 10 is placed on the module foundation 3 8 'This module gas channel conforming to the SEMI 2787 specification (including all (Required height, length, and width) "Figure 1 shows the gas channel 10 line structure of each gas component combination. A connector 2 # is required before and after each gas component. The standard mass flow controller 22 in 圊 1 The length of the foundation table is typically more than twice that of other gas components in the gas channel. In the typical previous technology, the size of the foundation of the flow controller is 4x 1,5 inches, as shown in Figure 2, which is quite larger than the suitable mold The size of the module mounting base required for group foundation 3 8 1.5 X 1.5 (as shown in Figure 4) inch, so the mass flow controller 2 2 of the previous technology in Figure 1 cannot be installed in the module foundation 3 8 on. Circle 3 shows that the flow sensor 25 and the control valve 30, which constitute the mass flow controller 22 in the prior art provided by the present invention, are respectively installed on the module base 38, so that the level along the gas flow axis 28 can be reduced. Space, the flow sensor 25 and the control valve 30 of the present invention are each suitable for a module mounting seat of 1.5 X 1.5 pairs, as shown in FIG. 4 (size C is approximately equal to 1.5 leaves), can be seated The flow sensor 25 and the control valve 30 are used as a module base 38. In addition, the length of the gas channel 10 can be reduced because the standard mass flow controller 22 base 4 needs 4

O: \ 63 \ 637d4.ptc page 8 434379a ___ cable number 89107284_year q 5. Description of the invention (6) inch, if the combination of the flow sensor 25 and the control valve 3 〇, the basis is only 3 hours, This may save horizontal space along the gas flow channel 28 and may provide other-several benefits. 1. In Figure 1, a typical standard mass flow controller 22 is built to operate under a certain range of flow and pressure conditions for special gases. If it exceeds its original parameters, the sensor part of the mass flow controller 22 must be operated. Correction or rerangement, but the attached control valve may no longer accept C pressure 'force 11 · moving or gas vessel type) operation under new conditions'. As a result of the correction of the mass flow controller's change, 'need to pay' the invention To avoid this, set the range and calibration again. In some cases, it can completely replace the standard mass flow controller 22. The separated flow sensor 25 can be used under more than 5 to 6 different types of gases, different concentrations and different heat transfer ranges. The working 'separated control valve 30 can also work in more than 5 to 6 different ranges. With different combinations of the flow sensor 25 and the control valve 30, it can cover 50 to 200 standard mass flows. Other changes that can be established by the controller 22, and at the same time if the flow sensor 25 or the control valve 3 fails, only a partial replacement is required, comparing the replacement of all standard mass motion controllers 22 The price is low. The present invention provides another important advantage. It is very flexible to place gas components at different positions along the gas channel. For example, a standard mass flow controller 22 for a certain type of gas to correct the thermal measurement has a problem. , Other gas & standard mass flow control valve 2 2 for calibration of pressure base measurement problems, when encountering the use of special gas must be converted from a thermal basis to a pressure basis (or vice versa), then all standard mass controllers 2 2 Must be replaced. Because the present invention uses a separate module flow sensor 25 and control valve 3 0, the replacement of all mass flow controllers 22 can be eliminated. If the gas flows through the gas channel 丨 0,

4343 79 ^ ___Case No. 89107284_year month_ charm__ V. Description of the Invention (7) or procedure requires a thermal basis measurement, which can be installed on the module gas channel 10-a thermal flow sensor, if the gas flow Pass through the gas channel 10, or the program-pressure-based measurement is required, a pressure-based flow sensor can be installed on the module gas channel 10, and the module gas channel is converted from a thermal-based measurement gas channel to a pressure-based measurement gas channel At this time, it is not necessary to replace the control valve 30, and the existing mass flow sensor 25 is controlled by electronic equipment, which can be remotely controlled or controlled locally. A specific example shown in FIG. 5 is a morphology of a module gas channel 10 under a thermal basis measurement. In FIG. 5, the flow sensor 25 is a thermal basis flow sensor, and the preferred one is a fast one. Along the gas flow channel 2 8 is placed before the control valve 30, the electronic device can remotely or locally control the module sensor 2 5 and the module control valve 30, and the module gas channel 1 0 measures the state from the thermodynamic test. To switch to the pressure-based state, first remove the thermal flow sensor 25 and the control valve 30, secondly place the control valve 30 at the thermal flow sensor 25 position, and finally place the pressure-based flow sensor 25 at the control valve At position 30, the pressure base state of the module gas channel 10 can be seen in FIG. 6. In FIG. 6, the control valve 30 can be preferably arranged along the gas flow channel 28 before the pressure base flow sensor 25. The flow sensor 25 must be replaced only when the module gas channel 10 is changed from the thermal base measurement state to the pressure base state. This part has a lower replacement cost. Briefly, the module surface device mass flow and pressure controller of the present invention includes a module flow sensor and a module control valve. The module flow sensor measures the gas flow through the module gas cross channel. The module control valve regulates and controls the gas flow rate through the module gas channel. Both the module flow sensor and the module control valve are installed on a module basis.

O: \ 63 \ 63744.ptc Case No. 89107284 on page 10, Rev. 5 'Description of the Invention (8) Although the present invention has been described in detail with reference to specific examples, it must be clear that this description is only an example and does not need to constitute As a limited concept, it is necessary to further understand that some detailed changes in specific examples of the present invention. Obviously, those skilled in the art can refer to this description for specific examples that may be added to the present invention. It is worth considering that all these modified examples are included in the spirit and essence of the present invention, such as the following patents.

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Claims (1)

Case No. 89107284 _η Amendment 6. Scope of patent application 1. A module surface device mass flow and pressure controller includes: a module flow sensor that can measure the gas flow through a module gas channel; A module control valve can perform regulation and control of the gas flow rate through a module gas channel; and a module foundation, the module flow sensor and the module control valve are both installed on the surface of the module foundation. 2. For example, the mass flow and pressure controller for surface devices in the scope of patent application item 1, where the module flow sensor can be a chess set · heat-based flow sensor or a module pressure-based flow sensor. 3. For example, the mass flow and pressure controller of the surface device in the scope of the patent application, wherein the module flow sensor is a module thermal foundation flow sensor, which is located in front of the module control valve to form a Thermal base mass flow pattern, so the gas flows through the module's thermal base flow sensor first, and then through the module control valve. 4. If the mass flow and pressure controller of the surface device of the patent application item 1 is applied, the module flow sensor is a module pressure-based flow sensor, and the device forms a pressure behind the module control valve. Basic mass flow pattern, so the gas flows through the module control valve first and then through the module pressure basic flow sensor. 5. For the surface device mass flow and pressure controller of item 1 of the patent application scope, the module flow sensor and the module control valve have a module mounting seat. 6. Mass flow and pressure control of surface devices such as the scope of patent application No. 5 O: \ 63 \ 63744.ptc Page 13 43 «Yes 9 pairs Case No. 89107284 said Amendment 6. Scope of patent application, in which the module mounting base is attached to the SEMI design drawing Doc. 2 7 8 7. 7. If the surface device mass flow and pressure-force controller of item 6 of the patent application, the module flow sensor and control valve are both used as connectors on the basis of the module and attached to the SEMI design circle Doc . 2787. 8. If the surface device mass flow and pressure controller of item 1 of the patent application scope, the module flow sensor and module control valve can be interchanged with any module component at any place along the module gas channel. 9. For the mass flow and pressure controller of the surface device in the scope of the patent application, the module flow sensor and the other module flow sensor with different measurement range, different concentrations or different thermal conductivity of the gas Can be easily interchanged for flow measurement. 10. For the surface device mass, flow and pressure controllers in the first patent application scope, the module control valve and the other module control valve can be easily interchanged when controlling the flow of gases of different concentrations. 11. For the mass flow and pressure controller of surface device in the scope of patent application, the electronic equipment can remotely or locally control the module flow sensor and module control valve. 1 2. —A method for controlling and suppressing the flow of gas through a module, including the steps of: measuring the flow of gas through the gas channel of the module with a module flow sensor; controlling and adjusting with a module control valve The gas flow through the gas channel of the module; and the module flow sensor and the module control valve are both based on the module. O: \ 63 \ 63744.ptc Page 14 43 ^ 3.79® Barrier 89107284 a__a. A Amendment 6. Patent application scope 13. If applying for a patent, the method of enclosing a group of gas channels' its thermal base flow sensor or 14. For example, the method of applying a patent for a group of gas passages, the control valve is a thermal basic type. 15. If the method of applying for a patent scope group gas channel, the basic flow sensor is more packaged before the module control valve, such as a device, and then flows through the module control valve 1 6. If the method of applying a patent scope group gas channel method The basic flow sensor is further included behind the module control valve, such as the over-pressure basic flow sensor 17. If the method of applying for a patent group g gas channel, each has a module mounting seat. 18. For patent-applied methods of grouping gas channels, Doc. 2787. 19 .If the control and suppression gas of item 12 in the scope of the patent application flows through a mold, the module flow sensor may be a -module-pressure-based flow sensor β control and suppression of item 12 Gas flow through a mold includes the device flow sensor and module volume flow pattern or a pressure-based mass flow item 12 control and suppression of gas flow through a mold. The module flow sensor is a The module's thermal power includes steps to install the thermal-based flow sensor. Then the gas flows through the thermal-based flow sensor first. The control and suppression of the gas flow through a mold in item 12. The module's flow sensor is a module. Pressure includes steps to install the pressure-based flow sensor. Then the gas flows through the module control valve first, and then the flow of the 12th item of control and suppression gas flows through a mold. The mold flow sensor and module Control valve No. 17 control and pressurized gas flow through a mold The module mounting base is attached to the SEMI design drawing No. 12 control and pressurized gas flow through a mold 0: V63V63744.ptc Page 15 _: _ Case No. 89107284 Sixth, the patent application scope year correction group gas channel method, in which the module flow sensor and the module control valve are both used as connectors on the basis of the module And attached S Ε Μ I design drawing 2 7 8 7-specification, such as B-seal, C-seal, CS-seal, W-seal and Z-seal connector 20, as described in item 12 of the scope of patent application A method for controlling and suppressing the flow of gas through a module gas channel, wherein the module flow sensor and the module control valve can be interchanged with any other module components at any location along the module gas channel. 21. If the method of controlling and suppressing the flow of gas through a module gas channel in item 12 of the scope of the patent application, the method further includes that the module flow sensor can be used with other Steps for interchange of module flow sensors with different measurement ranges. 22. If the method for controlling and suppressing the flow of gas through a module gas channel in item 12 of the scope of the patent application, the method further includes the step of exchanging the module control valve with other module control valves when controlling the flow of gases of different concentrations. O: \ 63 \ 63744.ptc Page 16