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TW412059U - Positioning ring of wafer polish machine - Google Patents

Positioning ring of wafer polish machine

Info

Publication number
TW412059U
TW412059U TW88211319U TW88211319U TW412059U TW 412059 U TW412059 U TW 412059U TW 88211319 U TW88211319 U TW 88211319U TW 88211319 U TW88211319 U TW 88211319U TW 412059 U TW412059 U TW 412059U
Authority
TW
Taiwan
Prior art keywords
positioning ring
polish machine
wafer polish
wafer
machine
Prior art date
Application number
TW88211319U
Other languages
Chinese (zh)
Inventor
Shuei-Yuan Chen
Shuei-Sheng Chen
Tian-Ding Chen
Original Assignee
Chen Shuei Yuan
Chen Shuei Sheng
Chen Tian Ding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Shuei Yuan, Chen Shuei Sheng, Chen Tian Ding filed Critical Chen Shuei Yuan
Priority to TW88211319U priority Critical patent/TW412059U/en
Publication of TW412059U publication Critical patent/TW412059U/en

Links

TW88211319U 1999-07-07 1999-07-07 Positioning ring of wafer polish machine TW412059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88211319U TW412059U (en) 1999-07-07 1999-07-07 Positioning ring of wafer polish machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88211319U TW412059U (en) 1999-07-07 1999-07-07 Positioning ring of wafer polish machine

Publications (1)

Publication Number Publication Date
TW412059U true TW412059U (en) 2000-11-11

Family

ID=21650583

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88211319U TW412059U (en) 1999-07-07 1999-07-07 Positioning ring of wafer polish machine

Country Status (1)

Country Link
TW (1) TW412059U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344434B2 (en) 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344434B2 (en) 2003-11-13 2008-03-18 Applied Materials, Inc. Retaining ring with shaped surface
US8585468B2 (en) 2003-11-13 2013-11-19 Applied Materials, Inc. Retaining ring with shaped surface
US9937601B2 (en) 2003-11-13 2018-04-10 Applied Materials, Inc. Retaining ring with Shaped Surface
US10766117B2 (en) 2003-11-13 2020-09-08 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
US11577361B2 (en) 2003-11-13 2023-02-14 Applied Materials, Inc. Retaining ring with shaped surface and method of forming
US11850703B2 (en) 2003-11-13 2023-12-26 Applied Materials, Inc. Method of forming retaining ring with shaped surface

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004