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TW353137B - Manufacturing apparatus with cleaning mechanism and cleaning method - Google Patents

Manufacturing apparatus with cleaning mechanism and cleaning method

Info

Publication number
TW353137B
TW353137B TW086103451A TW86103451A TW353137B TW 353137 B TW353137 B TW 353137B TW 086103451 A TW086103451 A TW 086103451A TW 86103451 A TW86103451 A TW 86103451A TW 353137 B TW353137 B TW 353137B
Authority
TW
Taiwan
Prior art keywords
enclosure
manufacturing apparatus
cleaning
environment
cleaning mechanism
Prior art date
Application number
TW086103451A
Other languages
English (en)
Inventor
Yuji Tsutsui
Masataka Morita
Hiroyuki Naka
Akihiro Yamamoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7353596A external-priority patent/JPH09264575A/ja
Priority claimed from JP11597396A external-priority patent/JP3168914B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW353137B publication Critical patent/TW353137B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Ventilation (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Cleaning In General (AREA)
TW086103451A 1996-03-28 1997-03-19 Manufacturing apparatus with cleaning mechanism and cleaning method TW353137B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7353596A JPH09264575A (ja) 1996-03-28 1996-03-28 製造装置及び清浄方法
JP11597396A JP3168914B2 (ja) 1996-05-10 1996-05-10 清浄機能付きロボット装置および清浄方法

Publications (1)

Publication Number Publication Date
TW353137B true TW353137B (en) 1999-02-21

Family

ID=30002097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103451A TW353137B (en) 1996-03-28 1997-03-19 Manufacturing apparatus with cleaning mechanism and cleaning method

Country Status (4)

Country Link
KR (1) KR100308365B1 (zh)
MY (1) MY120929A (zh)
SG (2) SG114601A1 (zh)
TW (1) TW353137B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727271B (zh) * 2018-03-06 2021-05-11 日商夏普股份有限公司 接合裝置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854292B1 (ko) * 2007-03-09 2008-08-26 조영호 클린부스

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7215945A (zh) * 1972-11-24 1974-05-28
US4927438A (en) * 1987-12-01 1990-05-22 Varian Associates, Inc. Horizontal laminar air flow work station
JPH0756879B2 (ja) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 半導体の無塵化製造装置
FR2659782B1 (fr) * 1990-03-14 1992-06-12 Sgn Soc Gen Tech Nouvelle Procede et dispositif de separation dynamique de deux zones.
JPH04287341A (ja) * 1991-03-18 1992-10-12 Fujitsu Ltd ウェーハのハンドリング装置
JPH05205988A (ja) * 1992-01-24 1993-08-13 Fujitsu Ltd 無塵室用製造装置
US5316560A (en) * 1993-03-19 1994-05-31 Hughes Aircraft Company Environment control apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727271B (zh) * 2018-03-06 2021-05-11 日商夏普股份有限公司 接合裝置
US11145618B2 (en) 2018-03-06 2021-10-12 Sharp Kabushiki Kaisha Bonding equipment

Also Published As

Publication number Publication date
KR970077092A (ko) 1997-12-12
SG98361A1 (en) 2003-09-19
MY120929A (en) 2005-12-30
SG114601A1 (en) 2005-09-28
KR100308365B1 (ko) 2001-11-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees