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TW290743B - - Google Patents

Info

Publication number
TW290743B
TW290743B TW085102056A TW85102056A TW290743B TW 290743 B TW290743 B TW 290743B TW 085102056 A TW085102056 A TW 085102056A TW 85102056 A TW85102056 A TW 85102056A TW 290743 B TW290743 B TW 290743B
Authority
TW
Taiwan
Application number
TW085102056A
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6805195A external-priority patent/JPH08264836A/ja
Priority claimed from JP6804795A external-priority patent/JPH08264835A/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW290743B publication Critical patent/TW290743B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/914—Doping
    • Y10S438/925—Fluid growth doping control, e.g. delta doping

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
TW085102056A 1995-03-27 1996-02-23 TW290743B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6805195A JPH08264836A (ja) 1995-03-27 1995-03-27 化合物半導体発光素子およびその製造方法
JP6804795A JPH08264835A (ja) 1995-03-27 1995-03-27 化合物半導体発光素子およびその製造方法

Publications (1)

Publication Number Publication Date
TW290743B true TW290743B (zh) 1996-11-11

Family

ID=26409291

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102056A TW290743B (zh) 1995-03-27 1996-02-23

Country Status (6)

Country Link
US (2) US5665986A (zh)
EP (1) EP0735598A3 (zh)
KR (1) KR960036160A (zh)
CN (1) CN1082255C (zh)
CA (1) CA2170922C (zh)
TW (1) TW290743B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909040A (en) * 1994-03-09 1999-06-01 Kabushiki Kaisha Toshiba Semiconductor device including quaternary buffer layer with pinholes
JP3771952B2 (ja) * 1995-06-28 2006-05-10 ソニー株式会社 単結晶ｉｉｉ−ｖ族化合物半導体層の成長方法、発光素子の製造方法およびトランジスタの製造方法
JPH0983017A (ja) * 1995-09-08 1997-03-28 Sumitomo Electric Ind Ltd エピタキシャルウェハおよびその製造方法
JP2925004B2 (ja) * 1996-03-22 1999-07-26 日本電気株式会社 窒化ガリウムの結晶成長方法
JP3164016B2 (ja) * 1996-05-31 2001-05-08 住友電気工業株式会社 発光素子および発光素子用ウエハの製造方法
US6030848A (en) * 1996-06-28 2000-02-29 Kabushiki Kaisha Toshiba Method for manufacturing a GaN-based compound semiconductor light emitting device
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
JPH111399A (ja) * 1996-12-05 1999-01-06 Lg Electron Inc 窒化ガリウム半導体単結晶基板の製造方法並びにその基板を用いた窒化ガリウムダイオード
US6091083A (en) * 1997-06-02 2000-07-18 Sharp Kabushiki Kaisha Gallium nitride type compound semiconductor light-emitting device having buffer layer with non-flat surface
DE19725900C2 (de) * 1997-06-13 2003-03-06 Dieter Bimberg Verfahren zur Abscheidung von Galliumnitrid auf Silizium-Substraten
US6559467B2 (en) * 1997-11-18 2003-05-06 Technologies And Devices International, Inc. P-n heterojunction-based structures utilizing HVPE grown III-V compound layers
JP4166885B2 (ja) 1998-05-18 2008-10-15 富士通株式会社 光半導体装置およびその製造方法
US6194742B1 (en) 1998-06-05 2001-02-27 Lumileds Lighting, U.S., Llc Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices
KR100495215B1 (ko) * 2002-12-27 2005-06-14 삼성전기주식회사 수직구조 갈륨나이트라이드 발광다이오드 및 그 제조방법
JP3841092B2 (ja) 2003-08-26 2006-11-01 住友電気工業株式会社 発光装置
JP2005191530A (ja) * 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
US7872268B2 (en) * 2004-04-22 2011-01-18 Cree, Inc. Substrate buffer structure for group III nitride devices
CN101656288B (zh) * 2005-07-06 2013-06-12 Lg伊诺特有限公司 氮化物半导体led
CN100550443C (zh) * 2005-07-06 2009-10-14 Lg伊诺特有限公司 氮化物半导体led及其制造方法
US7585769B2 (en) * 2006-05-05 2009-09-08 Applied Materials, Inc. Parasitic particle suppression in growth of III-V nitride films using MOCVD and HVPE
TWI309439B (en) * 2006-09-05 2009-05-01 Ind Tech Res Inst Nitride semiconductor and method for forming the same
US9064706B2 (en) * 2006-11-17 2015-06-23 Sumitomo Electric Industries, Ltd. Composite of III-nitride crystal on laterally stacked substrates
WO2010017136A1 (en) * 2008-08-04 2010-02-11 Amir Dassoud Dabiran Microchannel plate photocathode
JP5378829B2 (ja) * 2009-02-19 2013-12-25 住友電気工業株式会社 エピタキシャルウエハを形成する方法、及び半導体素子を作製する方法
US8933543B2 (en) 2010-04-02 2015-01-13 Panasonic Intellectual Property Management Co., Ltd. Nitride semiconductor element having m-plane angled semiconductor region and electrode including Mg and Ag
DE102011002146B4 (de) * 2011-04-18 2023-03-09 Aixtron Se Vorrichtung und Verfahren zum Abscheiden von Halbleiterschichten mit HCI-Zugabe zur Unterdrückung parasitären Wachstums
DE102011002145B4 (de) * 2011-04-18 2023-02-09 Aixtron Se Vorrichtung und Verfahren zum großflächigen Abscheiden von Halbleiterschichten mit gasgetrennter HCI-Einspeisung
CN103258722A (zh) * 2013-04-27 2013-08-21 中国电子科技集团公司第十三研究所 GaAs衬底采用AlGaInN缓冲层生长三族氮化物的方法
CN106328771B (zh) * 2015-07-04 2018-08-17 东莞市中镓半导体科技有限公司 一种在金属氮化镓复合衬底上外延无裂纹高晶体质量led外延层的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5218216A (en) * 1987-01-31 1993-06-08 Toyoda Gosei Co., Ltd. Gallium nitride group semiconductor and light emitting diode comprising it and the process of producing the same
US5278433A (en) * 1990-02-28 1994-01-11 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using gallium nitride group compound with double layer structures for the n-layer and/or the i-layer
US5281830A (en) * 1990-10-27 1994-01-25 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using gallium nitride group compound
JPH088217B2 (ja) * 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
DE69229265T2 (de) * 1991-03-18 1999-09-23 Trustees Of Boston University, Boston Verfahren zur herstellung und dotierung hochisolierender dünner schichten aus monokristallinem galliumnitrid
JP3155007B2 (ja) * 1991-07-05 2001-04-09 三菱化学株式会社 化合物半導体とその製造方法
JP2666228B2 (ja) * 1991-10-30 1997-10-22 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
US5400740A (en) * 1992-02-06 1995-03-28 Mitsubishi Chemical Corporation Method of preparing compound semiconductor
JP3247437B2 (ja) * 1992-03-10 2002-01-15 旭化成株式会社 窒化物系半導体素子およびその製造方法
US5578839A (en) * 1992-11-20 1996-11-26 Nichia Chemical Industries, Ltd. Light-emitting gallium nitride-based compound semiconductor device
US5523589A (en) * 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime

Also Published As

Publication number Publication date
CA2170922C (en) 2000-02-01
CN1082255C (zh) 2002-04-03
EP0735598A3 (en) 1998-09-23
US5665986A (en) 1997-09-09
CA2170922A1 (en) 1996-09-28
KR960036160A (ko) 1996-10-28
US5756374A (en) 1998-05-26
EP0735598A2 (en) 1996-10-02
CN1137690A (zh) 1996-12-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees