TW202433693A - Electronic package and manufacturing method thereof - Google Patents

Abstract

An electronic package is provided, in which a heat dissipation structure covers an electronic component disposed on a carrier, wherein the heat dissipation structure is made by a method of injecting insulating material, and the heat dissipation structure is embedded with a phase change material object exposed from at least one opening formed on the heat dissipation structure. Therefore, the heat dissipation structure is formed by insulating material to reduce weight of the heat dissipation structure.

Description

Electronic packaging and its manufacturing method

The present invention relates to a semiconductor packaging process, in particular to an electronic packaging component with a heat dissipation structure and its manufacturing method.

As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits, so semiconductor chips will generate more heat during operation.

Therefore, in order to quickly dissipate heat to the outside, the industry usually configures a heat sink or heat spreader in the semiconductor package. The heat sink is usually bonded to the back of the semiconductor chip through a heat sink, such as a thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated through the heat sink and the heat sink.

As shown in FIG. 1 , the manufacturing method of the known semiconductor package 1 is to first place a semiconductor chip 11 on a package substrate 10 with its active surface 11a by flip chip bonding (i.e., through conductive bumps 110 and bottom glue 111), and then place a heat sink 13 with its top sheet 130 bonded to the inactive surface 11b of the semiconductor chip 11 through a TIM layer 12, and the support legs 131 of the heat sink 13 are mounted on the package substrate 10 through an adhesive layer 14.

During operation, the heat energy generated by the semiconductor chip 11 is transferred to the top plate 130 of the heat sink 13 through the inactive surface 11b and the TIM layer 12 to dissipate the heat to the outside of the semiconductor package 1.

However, in the known semiconductor package 1, a metal frame is used as the heat sink 13, so a complicated process such as etching metal and/or electroplating metal is required to manufacture the heat sink 13. Therefore, the heat sink 13 is not only very expensive to manufacture, but also difficult to reduce in weight, making the semiconductor package 1 not conducive to meeting the demand for lightness.

Therefore, how to overcome the above-mentioned problems of known technology has become a difficult problem that the industry needs to overcome urgently.

In view of the various deficiencies of the above-mentioned prior art, the present invention provides an electronic package, comprising: a carrier having at least one circuit layer; an electronic component disposed on the carrier and electrically connected to the circuit layer; and an insulating material heat dissipation structure disposed on the carrier and covering the electronic component, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object.

The present invention also provides a method for manufacturing an electronic package, which includes: manufacturing an insulating material heat dissipation structure by injection molding an insulating material, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object; and arranging the insulating material heat dissipation structure on a carrier having at least one circuit layer, wherein at least one electronic component electrically connected to the circuit layer is arranged on the carrier, so that the insulating material heat dissipation structure covers the electronic component.

In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure is in contact with the electronic component.

In the aforementioned electronic package and its manufacturing method, the insulating material heat dissipation structure has a shielding layer, so that after the insulating material heat dissipation structure is arranged on the carrier, the shielding layer is located between the phase-changing material object and the electronic component.

In the aforementioned electronic package and its manufacturing method, the manufacturing process of the insulating material heat dissipation structure includes: manufacturing a first heat dissipation member and a second heat dissipation member respectively by injection molding an insulating material; forming the opening on the first heat dissipation member; and joining the first heat dissipation member and the second heat dissipation member so that the phase-changing material object is sandwiched between the first heat dissipation member and the second heat dissipation member, wherein the insulating material heat dissipation structure is provided with the second heat dissipation member on the carrier so that the second heat dissipation member covers the electronic component.

In the aforementioned electronic package and its manufacturing method, the phase change material object includes wax, organic acid, inorganic salt or saline compound.

As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by injection molding insulating material to simplify the manufacturing process. Therefore, compared with the conventional metal heat sink, the present invention can not only significantly reduce the manufacturing cost of the insulating material heat dissipation structure, but also reduce the weight of the insulating material heat dissipation structure, so that the electronic package meets the demand for lightness.

1:Semiconductor packages

10: Packaging substrate

11: Semiconductor chip

11a, 21a: Action surface

11b, 21b: non-active surface

110,210: Conductive bumps

111,211: Base glue

12: TIM layer

13: Heat sink

130: Top piece

131,400: Foot support

14,24: Adhesive layer

2: Electronic packaging components

2a: Insulation material heat dissipation structure

2b: Substrate structure

20: Carrier board

200: Insulation layer

201: Circuit layer

21: Electronic components

22: Phase change material

23: Shielding layer

3: Heat dissipation frame

3a: Bracket

30: First heat sink

30a,402: Insulation materials

300: Opening

301: convex part

40: Second heat sink

40a: Sheet

401: Concave part

70,80: First module

71,81: Second module

9,9a: Carrier

S: Storage space

L: cutting path

Figure 1 is a schematic cross-sectional view of a conventional semiconductor package.

Figures 2A to 2H are cross-sectional schematic diagrams of the manufacturing method of the electronic package of the present invention.

Figure 2D-1 is a top view schematic diagram of another embodiment of Figure 2D.

Figure 2E-1 is a top view schematic diagram of another embodiment of Figure 2E.

Figures 3A to 3B are schematic cross-sectional views of the manufacturing process of the first heat sink of the insulating material heat sink structure of the electronic package of the present invention.

Figures 4A to 4B are cross-sectional schematic diagrams of the manufacturing process of the second heat sink of the insulating material heat dissipation structure of the electronic package of the present invention.

The following is a specific and concrete example to illustrate the implementation of the present invention. People familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this manual.

It should be noted that the structures, proportions, sizes, etc. depicted in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by people familiar with this technology, and are not used to limit the restrictive conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "above", "first", "second" and "one" used in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments in their relative relationships shall also be regarded as the scope of implementation of the present invention without substantially changing the technical content.

Figures 2A to 2H are cross-sectional schematic diagrams of the manufacturing method of the electronic package 2 of the present invention.

As shown in FIG. 2A , a first heat sink 30 having a plurality of protrusions 301 and a second heat sink 40 having a plurality of concave portions 401 are provided.

In this embodiment, the first heat sink 30 is a plate, and the second heat sink 40 is a sheet connected to a plurality of supporting legs 400, so that the recess 401 is formed on one side of the supporting legs 400. For example, the second heat sink 40 is surrounded by the plurality of supporting legs 400 to form a cover shape to form a containing space S.

Furthermore, the first heat sink 30 is an insulating material, such as prepreg (PP), epoxy packaging colloid, molding compound or other plastic materials. For example, the first heat sink 30 can be manufactured by injection molding, such as the first mold 70 and the second mold 71 shown in FIG. 3A, and after demolding, the excess insulating material 30a is removed, as shown in FIG. 3B.

Furthermore, the second heat sink 40 is an insulating material, such as prepreg (PP), epoxy encapsulation colloid, encapsulation material or other plastic material. For example, the second heat sink 40 can be made by injection molding, such as the first module 80 and the second module 81 shown in FIG. 4A, and after demolding, the excess insulating material 402 is removed, as shown in FIG. 4B. It should be understood that the materials of the first heat sink 30 and the second heat sink 40 can be the same or different.

As shown in FIG. 2B to FIG. 2C, a plurality of openings 300 are first formed on the first heat sink 30, and then a phase change material (PCM) object (Mass) 22 is placed between the first heat sink 30 and the second heat sink 40 to press the first heat sink 30 and the second heat sink 40, so that the PCM object 22 is sandwiched between the first heat sink 30 and the second heat sink 40, and the PCM object 22 is exposed outside the plurality of openings 300.

In this embodiment, the plurality of openings 300 penetrate the sheet of the first heat sink 30, and the first heat sink 30 is inserted into the recess 401 of the second heat sink 40 with its protrusion 301, so that the first and second heat sinks 30, 40 are connected.

Furthermore, the phase change material object 22 is in the form of a sheet, and the material forming the phase change material object 22 is paraffin, organic acid, inorganic salt, salt water compound or other phase change materials.

As shown in FIG. 2D , a shielding layer 23 is formed on the second heat sink 40 to form an insulating material heat sink structure 2a.

In this embodiment, the shielding layer 23 is formed on the sheet 40a in the accommodation space S of the second heat sink 40 and on the surface of the supporting foot 400. For example, the shielding layer 23 includes a metal material, such as a metal layer formed on the second heat sink 40 by electroplating such as gold (Au), silver (Ag), nickel (Ni) or other metal layers.

Furthermore, the first heat sink 30 and the second heat sink 40 can be manufactured by injection molding to form a full panel specification or a wafer level specification, such as the heat sink frame 3 shown in FIG. 2D-1, which is connected to a plurality of array-arranged insulating material heat sink structures 2a by a plurality of brackets 3a.

Alternatively, a single insulating material heat dissipation structure 2a can be placed on a single carrier 9 with its first heat dissipation component 30 as required, so as to facilitate transportation to the machine used in the subsequent process, as shown in FIG2E. It should be understood that, as shown in FIG2E-1, multiple insulating material heat dissipation structures 2a can also be arranged in an array on a carrier 9a of full-page specifications or wafer-level specifications.

As shown in FIG. 2F to FIG. 2G, a substrate structure 2b of full-page specification or wafer-level specification is provided, which includes a plurality of adjacent carriers 20, and at least one electronic component 21 is arranged on each of the carriers 20. Then, following the process shown in FIG. 2E-1, each of the insulating material heat dissipation structures 2a is removed from the carrier 9a, so as to place each of the insulating material heat dissipation structures 2a on each of the carriers 20 respectively.

In this embodiment, the carrier 20 is, for example, a packaging substrate having a core layer and a circuit structure, a packaging substrate having a coreless circuit structure, a silicon interposer (TSI) with conductive through-silicon vias (TSV), or other board types, which includes at least one insulation layer 200 and at least one circuit layer 201 combined with the insulation layer 200, such as at least one fan-out type redistribution layer (RDL). For example, the material forming the circuit layer 201 is copper, and the material forming the insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. It should be understood that the substrate structure 2b can also be a single carrier 20 (not shown) or other chip-carrying plate, such as a lead frame, a wafer, or other plates with metal routing, etc., but is not limited to the above.

Furthermore, the electronic component 21 is an active component, a passive component or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a is disposed on the circuit layer of the carrier 20 in a flip-chip manner through a plurality of conductive bumps 210 such as solder materials, metal pillars or other materials and electrically connected to the circuit layer 201, and the conductive bumps 210 are coated with a primer 211; alternatively, the electronic component 21 can be electrically connected to the circuit layer 201 of the carrier 20 in a wire bonding manner through a plurality of welding wires (not shown); or, the electronic component 21 can directly contact the circuit layer 201 of the carrier 20. Therefore, the required type and quantity of electronic components 21 can be placed on the carrier 20 to enhance its electrical performance, and there are many ways to electrically connect the electronic components 21 to the carrier structure 20, which are not limited to the above.

Furthermore, the insulating material heat dissipation structure 2a is bonded to the carrier 20 by the supporting foot 400 of the second heat dissipation component 40 through the adhesive layer 24, so that the electronic component 21 is located in the accommodation space S, and the second heat dissipation component 40 covers the electronic component 21. For example, the shielding layer 23 is located between the second heat dissipation component 40 (the phase-changing material object 22) and the electronic component 21 to cover the electronic component 21, so that the shielding layer 23 can prevent the electronic component 21 from being subjected to external electromagnetic interference (Electromagnetic Interference, referred to as EMI).

In addition, the insulating material heat dissipation structure 2a contacts the inactive surface 21b of the electronic component 21 with the sheet 40a of the second heat dissipation member 40 (or the shielding layer 23). It should be understood that the insulating material heat dissipation structure 2a may not contact the electronic component 21, that is, the insulating material heat dissipation structure 2a is separated from the inactive surface 21b of the electronic component 21.

As shown in FIG2H, a singulation process is performed along the cutting path L shown in FIG2G (i.e., the boundary between each carrier 20) to obtain the electronic package 2.

In this embodiment, the heat dissipation path of the heat energy generated by the electronic component 21 is from the second heat sink 40 through the phase change material 22, and then dissipates the heat energy to the external environment through the opening 300. When the phase change material 22 absorbs the heat energy from the electronic component 21, the phase change material 22 will change from solid to liquid, and when the phase change material 22 dissipates the heat energy through the opening 300, the phase change material 22 will change from liquid to solid.

Therefore, the manufacturing method of the present invention mainly manufactures the first heat sink 30 and the second heat sink 40 by injection molding of insulating materials to simplify the manufacturing process. Therefore, compared with the conventional metal heat sink, the manufacturing method of the present invention can not only significantly reduce the manufacturing cost of the insulating material heat sink structure, but also reduce the weight of the insulating material heat sink structure 2a, so that the electronic package 2 meets the requirement of being lightweight.

Furthermore, the electronic package 2 is designed with the phase change material object 22 so that when the phase change material object 22 absorbs the heat energy from the electronic component 21, the temperature of the electronic component 21 will remain stable (i.e. maintained at the required temperature). At this time, the opening 300 of the first heat sink 30 serves as the flow path and pressure release space for the liquid diffusion of the phase change material object 22 to reduce the pressure applied by the phase change material object 22 on the second heat sink 40 (or the electronic component 21), thereby helping to improve the reliability of the electronic package 2.

In addition, the shielding layer 23 can not only prevent the electronic component 21 from being disturbed by external electromagnetic interference, but also serve as a heat-conducting structure to transfer the heat energy of the electronic component 21 to the phase change material 22, causing the phase change material 22 to undergo a phase transformation, that is, the phase change material 22 changes from a solid state to a liquid state.

The present invention provides an electronic package 2 comprising: a carrier 20 having at least one circuit layer 201, at least one electronic component 21 disposed on the carrier 20 and electrically connected to the circuit layer 201, and an insulating material heat dissipation structure 2a disposed on the carrier 20 to cover the electronic component 21.

The insulating material heat dissipation structure 2a is embedded with a phase change material object 22 and has at least one opening 300 exposing the phase change material object 22.

In one embodiment, the insulating material heat dissipation structure 2a contacts the electronic component 21.

In one embodiment, the insulating material heat dissipation structure 2a has a shielding layer 23, and the shielding layer 23 is located between the phase-changing material object 22 and the electronic component 21.

In one embodiment, the insulating material heat dissipation structure 2a includes a first heat dissipation member 30 and a second heat dissipation member 40 connected to each other, so that the phase-changing material object 22 is sandwiched between the first heat dissipation member 30 and the second heat dissipation member 40, and the opening 300 is formed on the first heat dissipation member 30, and the second heat dissipation member 40 is disposed on the carrier 20 to cover the electronic component 21.

In one embodiment, the phase change material 22 includes wax, organic acid, inorganic salt or saline compound.

In summary, the electronic package and its manufacturing method of the present invention mainly manufacture the insulating material heat dissipation structure by injection molding the insulating material, so as to reduce the manufacturing cost of the insulating material heat dissipation structure and reduce the weight of the insulating material heat dissipation structure, so that the electronic package can meet the demand of being lightweight.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described below.

2: Electronic packaging components

2a: Insulation material heat dissipation structure

20: Carrier board

201: Circuit layer

21: Electronic components

210: Conductive bump

211: Base glue

22: Phase change material

23: Shielding layer

24: Adhesive layer

30: First heat sink

300: Opening

40: Second heat sink

Claims (10)

An electronic package includes: The carrier board has at least one circuit layer; The electronic component is disposed on the carrier and electrically connected to the circuit layer; and The insulating material heat dissipation structure is disposed on the carrier and covers the electronic component, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object. An electronic package as described in claim 1, wherein the insulating material heat dissipation structure is in contact with the electronic component. The electronic package as described in claim 1, wherein the insulating material heat dissipation structure has a shielding layer, and the shielding layer is located between the phase-changing material object and the electronic component. The electronic package as described in claim 1, wherein the insulating material heat dissipation structure comprises a first heat dissipation member and a second heat dissipation member connected to each other, so that the phase-changing material object is sandwiched between the first heat dissipation member and the second heat dissipation member, and the opening is formed on the first heat dissipation member, and the second heat dissipation member is disposed on the carrier to cover the electronic component. An electronic package as described in claim 1, wherein the phase change material comprises wax, an organic acid, an inorganic salt or a saline compound. A method for manufacturing an electronic package includes: An insulating material heat dissipation structure is manufactured by injection molding an insulating material, wherein the insulating material heat dissipation structure is embedded with a phase change material object and has at least one opening exposing the phase change material object; and The insulating material heat dissipation structure is disposed on a carrier having at least one circuit layer, wherein the carrier is provided with at least one electronic component electrically connected to the circuit layer, so that the insulating material heat dissipation structure covers the electronic component. A method for manufacturing an electronic package as described in claim 6, wherein the insulating material heat dissipation structure is in contact with the electronic component. The method for manufacturing an electronic package as described in claim 6, wherein the insulating material heat dissipation structure has a shielding layer, so that after the insulating material heat dissipation structure is arranged on the carrier, the shielding layer is located between the phase-changing material object and the electronic component. The method for manufacturing an electronic package as described in claim 6, wherein the manufacturing of the insulating material heat dissipation structure includes: manufacturing a first heat dissipation member and a second heat dissipation member respectively by injection molding an insulating material; forming the opening on the first heat dissipation member; and joining the first heat dissipation member and the second heat dissipation member so that the phase-changing material object is sandwiched between the first heat dissipation member and the second heat dissipation member, wherein the insulating material heat dissipation structure is provided on the carrier with the second heat dissipation member so that the second heat dissipation member covers the electronic component. A method for manufacturing an electronic package as described in claim 6, wherein the phase change material comprises wax, an organic acid, an inorganic salt or a saline compound.

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