TW202436443A - Improvements relating to the extrusion of polymeric material - Google Patents
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- UAUDZVJPLUQNMU-UHFFFAOYSA-N Erucasaeureamid Natural products CCCCCCCCC=CCCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-UHFFFAOYSA-N 0.000 description 1
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- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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Abstract
Description
本發明係關於一種擠出產物、產生擠出產物之方法及聚合物材料之用途。具體言之,本發明係關於擠出絕緣導體總成。The present invention relates to an extruded product, a method for producing an extruded product and a use of a polymer material. Specifically, the present invention relates to an extruded insulating conductor assembly.
具有特定橫截面輪廓的細長產物(在本文中稱為擠出產物),例如絕緣導體、膜或管,可使用擠出製程形成。典型擠出製程涉及迫使一或多種可流動聚合物材料通過擠出模具。此類模具包含用於聚合物材料之出口,其經塑形以賦予產物所需橫截面輪廓。Elongated products (referred to herein as extruded products) having a specific cross-sectional profile, such as insulating conductors, films or tubes, can be formed using an extrusion process. A typical extrusion process involves forcing one or more flowable polymer materials through an extrusion die. Such a die includes an outlet for the polymer material, which is shaped to give the product the desired cross-sectional profile.
一些聚合物材料有黏附模具出口之邊緣的傾向,且逐漸在模具出口處形成大量沉積物。此等沉積物可稱為「模垢(die drool)」(亦稱作「模具積堆(die build-up)」、「模具滴液(die drip)」、「模具脫皮(die peel)」、「模具外溢(die bleed)」或「模具積垢(plate out)」),且例如藉由在擠出產物之表面上留下痕跡,或藉由以隨機間隔斷裂及污染產物而不利地影響產物品質及製程。Some polymer materials have a tendency to adhere to the edges of the die exit and gradually form a large deposit at the die exit. Such deposits may be referred to as "die drool" (also known as "die build-up", "die drip", "die peel", "die bleed" or "plate out") and can adversely affect product quality and processing, for example by leaving marks on the surface of the extruded product or by cracking and contaminating the product at random intervals.
在製程期間,在不影響所形成之擠出產物的情況下,手動地自模具移除模垢常常係困難的或不可能的。當此類模垢形成且開始不利地影響產物之品質時,可能必須停止該製程且清潔擠出設備,尤其是模具。此典型地涉及拆卸擠出設備,給生產製程造成大量停工時間。出於此等原因,具有相對較高的形成模垢之傾向之聚合物材料可僅用於在相對較短的生產週期中生產擠出產物;此效率低下,且在經濟上係不利的。It is often difficult or impossible to manually remove mold deposits from the mold during the process without affecting the extruded product being formed. When such mold deposits form and begin to adversely affect the quality of the product, it may be necessary to stop the process and clean the extrusion equipment, especially the mold. This typically involves disassembling the extrusion equipment, causing significant downtime to the production process. For these reasons, polymer materials with a relatively high tendency to form mold deposits can only be used to produce extruded products in relatively short production cycles; this is inefficient and economically disadvantageous.
在聚合物材料包含填充物材料,例如顆粒填充物,諸如滑石時,模垢通常會增加。如WO2022/175515中所描述,已知滑石對於絕緣導體尤其有利,因為其有助於改善聚合物對導體電線之黏著力。因此,在製造此類導體時減少模垢會是合乎需要的,從而使得製程之效率及擠出產物之品質可得以改善。Mold deposits generally increase when the polymer material includes filler materials, such as particulate fillers, such as talc. As described in WO2022/175515, talc is known to be particularly beneficial for insulating conductors because it helps to improve the adhesion of the polymer to the conductor wires. Therefore, it would be desirable to reduce mold deposits when manufacturing such conductors, so that the efficiency of the process and the quality of the extruded product can be improved.
亦可能在擠出設備以增加之線速度運行時加劇模垢。典型地當線速度增加時,模具中之壓力由於加快的擠出螺桿速度而增加。此可能引起熔體在離開模具時更多地膨脹,由此增加模垢。因此,在擠出產物生產中減少模垢以允許較快的線速度會是合乎需要的。Mold deposits may also be exacerbated when the extrusion equipment is run at increased line speeds. Typically when line speeds are increased, the pressure in the mold increases due to the faster extrusion screw speed. This may cause the melt to expand more when leaving the mold, thereby increasing mold deposits. Therefore, it would be desirable to reduce mold deposits to allow faster line speeds in the production of extruded products.
本發明的目標之一為提供一種解決先前技術之至少一個缺點(無論是在本文中或在別處確定的)的絕緣導體總成以及方法或用途,或提供現有擠出產物、方法及用途之替代方案。舉例而言,本發明之目標可為提供一種擠出絕緣導體,其在擠出期間具有比可比擠出產物更低的產生模垢之傾向。One of the objects of the present invention is to provide an insulated conductor assembly and method or use that solves at least one disadvantage of the prior art (whether identified herein or elsewhere), or provides an alternative to existing extruded products, methods and uses. For example, an object of the present invention may be to provide an extruded insulated conductor that has a lower tendency to generate mold deposits during extrusion than comparable extruded products.
根據本發明之第一態樣,提供一種包含導體電線、第一擠出層及第二擠出層之絕緣導體總成;該第一層包含聚合物材料(A),該聚合物材料(A)具有下式之重複單元 (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2; 且該第二層包含:具有式I之重複單元的聚合物材料(B) (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2;以及填充物材料,其中該第二層位於該電線與該第一層之間。 According to a first aspect of the present invention, an insulating conductor assembly is provided, comprising a conductive wire, a first extruded layer and a second extruded layer; the first layer comprises a polymer material (A), the polymer material (A) having a repeating unit of the following formula: (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and the second layer comprises: a polymer material (B) having repeating units of Formula I (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and a filler material, wherein the second layer is located between the wire and the first layer.
較佳地,第一層包含至少50 wt%,更佳至少75 wt%,更佳至少85 wt%,最佳大於95 wt%,例如99 wt%之聚合物材料(A)。最佳地,第一層基本上由聚合物材料(A)組成或由其組成。Preferably, the first layer comprises at least 50 wt%, more preferably at least 75 wt%, more preferably at least 85 wt%, most preferably more than 95 wt%, such as 99 wt% of the polymer material (A). Most preferably, the first layer consists essentially of or consists of the polymer material (A).
較佳地,聚合物材料(A)包含至少40 wt%,較佳至少70 wt%,較佳至少80 wt%之PAEK聚合物。在一較佳具體實例中,聚合物材料(A)實質上為至少99 wt% PAEK。Preferably, the polymer material (A) comprises at least 40 wt%, preferably at least 70 wt%, preferably at least 80 wt% of PAEK polymer. In a preferred embodiment, the polymer material (A) is substantially at least 99 wt% PAEK.
較佳地,第二層包含至少50 wt%,更佳至少75 wt%,更佳至少85 wt%,最佳大於95 wt%,例如99 wt%之聚合物材料(B)。最佳地,第二層基本上由聚合物材料(B)組成或由其組成。Preferably, the second layer comprises at least 50 wt%, more preferably at least 75 wt%, more preferably at least 85 wt%, most preferably more than 95 wt%, such as 99 wt% of the polymer material (B). Most preferably, the second layer consists essentially of or consists of the polymer material (B).
較佳聚合物材料(A)及/或(B)為聚醚醚酮(PEEK),其中重複單元為t1=1,v1=0,且w1=0。The preferred polymer material (A) and/or (B) is polyetheretherketone (PEEK), wherein the repeating unit is t1=1, v1=0, and w1=0.
替代地,聚合物材料可為PAES聚合物,例如聚苯碸(PPSU)或聚碸(PSU)。Alternatively, the polymer material may be a PAES polymer, such as polyphenylene sulfone (PPSU) or polysulfone sulfone (PSU).
在一最佳具體實例中,第一層基本上由PAEK,較佳PEEK組成,且第二層基本上由作為PAEK之聚合物材料(B)及填充物材料,較佳PEEK及填充物材料組成。In a preferred embodiment, the first layer consists essentially of PAEK, preferably PEEK, and the second layer consists essentially of a polymer material (B) being PAEK and a filler material, preferably PEEK and a filler material.
不同於許多習知聚合物,PAEK聚合物或共聚物可作為經處理聚合物之直接結果以非晶形或結晶形態獲得。玻璃態或非晶形狀態藉由自熔體快速淬火聚合物至低於Tg而實現,而自熔體緩慢冷卻聚合物將使得在樣品中發展結晶度(熔體結晶)。聚合物之結晶形態亦可自其非晶狀態下之聚合物獲得,例如在室溫下藉由在冷卻回至室溫之前將其加熱至高於Tg但小於Tm之溫度(冷結晶),或藉由在Tg與Tm之間之恆定溫度下在冷卻回至室溫之前固持聚合物至一定時長(等溫結晶)。Unlike many known polymers, PAEK polymers or copolymers can be obtained in an amorphous or crystalline form as a direct result of the treated polymer. The glassy or amorphous state is achieved by rapidly quenching the polymer from the melt to below Tg, while slowly cooling the polymer from the melt will allow crystallinity to develop in the sample (melt crystallization). The crystalline form of a polymer can also be obtained from the polymer in its amorphous state, for example at room temperature by heating it to a temperature above Tg but below Tm before cooling back to room temperature (cold crystallization), or by holding the polymer at a constant temperature between Tg and Tm for a certain period of time before cooling back to room temperature (isothermal crystallization).
PAEK,尤其包括PEEK,可由在存在鹼金屬碳酸鹽及/或碳酸氫鹽或鹼土金屬碳酸鹽及/或碳酸氫鹽之情況下在適合之溶劑中具有有機二鹵化物化合物之雙酚之親核聚縮合來製造。此類製程陳述於例如EP0001879A、EP0182648A、EP0244167A及EP3049457A中。可根據以引用的方式併入本文中之WO2018055384製造PAEK。在本發明之一具體實例中,聚合物材料(A)及/或聚合物材料(B)可為根據EP3049457製造之PAEK。PAEK, including PEEK in particular, can be produced by nucleophilic polymerization of bisphenols with organic dihalide compounds in a suitable solvent in the presence of alkali metal carbonates and/or bicarbonates or alkali earth metal carbonates and/or bicarbonates. Such processes are described in, for example, EP0001879A, EP0182648A, EP0244167A and EP3049457A. PAEK can be produced according to WO2018055384, which is incorporated herein by reference. In one specific embodiment of the present invention, polymer material (A) and/or polymer material (B) can be PAEK produced according to EP3049457.
該或各聚合物材料(A)及/或聚合物材料(B)之結晶度較佳為至少10%,更佳至少20%,例如大於25%。然而,對於一些應用,較低結晶度(諸如小於25%或小於22%)可為有利的。The or each polymer material (A) and/or polymer material (B) preferably has a degree of crystallinity of at least 10%, more preferably at least 20%, for example greater than 25%. However, for some applications, a lower degree of crystallinity (e.g. less than 25% or less than 22%) may be advantageous.
結晶度藉由DSC來量測,以藉由沿預轉變基線繪製之線與沿轉變期間所獲得之最大斜率繪製的線之相交確定Tg之開始。Tn在冷結晶放熱之主峰值達到最大值之溫度時量測。Tm為熔融吸熱之主峰值到達最大值時之溫度。藉由連接熔融吸熱偏離相對較直基線時的兩個點,獲得熔融時之熔解熱(ΔHm)。在吸熱值隨時間而變化之函數下之積分面積得出熔融轉變之焓(mJ):藉由焓除以樣品質量計算質量標準熔解熱(J/g)。結晶程度(X%)藉由樣品之熔解熱除以完全結晶聚合物之熔解熱來測定,就聚醚醚酮而言,結晶程度為130 J/g。ISO 11357-1至ISO 11357-4描述用於確定該等量測值之測試方法學。The degree of crystallinity is measured by DSC, with the onset of Tg being determined by the intersection of a line drawn along the pre-transition baseline with a line drawn along the maximum slope obtained during the transition. Tn is measured at the temperature at which the main peak of the cold crystallization exotherm reaches a maximum. Tm is the temperature at which the main peak of the melting endotherm reaches a maximum. The heat of fusion (ΔHm) during melting is obtained by connecting the two points at which the melting endotherm deviates from a relatively straight baseline. The integral area under the function of the endotherm value varying with time gives the enthalpy of the melting transition (mJ): the mass standard heat of fusion (J/g) is calculated by dividing the enthalpy by the mass of the sample. The degree of crystallinity (X%) is determined by dividing the heat of fusion of the sample by the heat of fusion of a completely crystalline polymer, which for polyetheretherketone is 130 J/g. ISO 11357-1 to ISO 11357-4 describe the test methodologies used to determine these measurements.
填充物材料可為纖維填充物材料或顆粒填充物材料。纖維填充物材料適當地具有300 µm或更小之最長尺寸。適合的纖維填充物材料可選自無機纖維材料、有機纖維材料(諸如聚芳醯胺纖維及碳纖維)。較佳地,纖維填充物之熔融溫度應為至少450℃。適合的纖維填充物材料可選自玻璃纖維、碳纖維、石棉纖維、二氧化矽纖維、氧化鋁纖維、氧化鋯纖維、氮化硼纖維、氮化矽纖維、硼纖維、氟碳樹脂纖維及鈦酸鉀纖維或其混合物。較佳纖維填充物為玻璃纖維及碳纖維。The filler material may be a fiber filler material or a particulate filler material. The fiber filler material suitably has a longest dimension of 300 μm or less. Suitable fiber filler materials may be selected from inorganic fiber materials, organic fiber materials (such as polyarylamide fibers and carbon fibers). Preferably, the melting temperature of the fiber filler should be at least 450°C. Suitable fiber filler materials may be selected from glass fibers, carbon fibers, asbestos fibers, silica fibers, alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, boron fibers, fluorocarbon fibers, and potassium titanium fibers or mixtures thereof. The preferred fiber fillers are glass fiber and carbon fiber.
在一較佳具體實例中,填充物材料為填充物材料。適合的顆粒(或非纖維)填充物材料可選自硫酸鈣、氧化鉻、玻璃纖維、氧化鐵、碳酸鎂、氧化鎂、雲母、二氧化矽、碳化矽、二氧化矽(石英)、氮化矽、矽酸鈉、二氧化鈦、滑石(例如Jetfine TM,包括Jetfine 3CA)、氧化鋅、氧化鋯、硫酸鋇及氮化硼。 In a preferred embodiment, the filler material is a filler material. Suitable particulate (or non-fibrous) filler materials can be selected from calcium sulfate, chromium oxide, glass fiber, iron oxide, magnesium carbonate, magnesium oxide, mica, silicon dioxide, silicon carbide, silicon dioxide (quartz), silicon nitride, sodium silicate, titanium dioxide, talc (e.g., Jetfine ™ , including Jetfine 3CA), zinc oxide, zirconium oxide, barium sulfate and boron nitride.
填充物材料可佔聚合物材料(B)材料之至少5 wt%,適當地其之至少10 wt%或至少15 wt%。填充物材料可提供聚合物材料(B)之至多50 wt%、至多40 wt%或至多30 wt%。適當地,填充物材料提供聚合物材料(B)之5至50 wt%、聚合物材料(B)之總組成物的10至40 wt%或15至35 wt%。舉例而言,15 wt%、或20 wt%、或25 wt%、或30 wt%之填充物材料,例如滑石或氧化鋅,可存在於聚合物材料(B)中。最佳地,聚合物材料(B)包含PEEK及滑石或氧化鋅作為較佳視情況選用之填充物材料。The filler material may constitute at least 5 wt %, suitably at least 10 wt % or at least 15 wt % of the polymer material (B). The filler material may provide up to 50 wt %, up to 40 wt % or up to 30 wt % of the polymer material (B). Suitably, the filler material provides 5 to 50 wt % of the polymer material (B), 10 to 40 wt % or 15 to 35 wt % of the total composition of the polymer material (B). For example, 15 wt %, or 20 wt %, or 25 wt %, or 30 wt % of filler material, such as talc or zinc oxide, may be present in the polymer material (B). Optimally, the polymer material (B) comprises PEEK and talc or zinc oxide as the filler material preferably selected as appropriate.
較佳地,填充物材料之D50在0.001至50 µm之間,更佳在0.005至15 µm之間。較佳填充物材料具有小於10 µm之D50。較佳地,填充物材料之D50在1與5 µm之間,例如在3與5 µm之間。D50藉由雷射粒度分析儀(laser Mastersizer)、雷射繞射、米氏理論(Mie theory)(ISO 13320-1)量測。Preferably, the filler material has a D50 between 0.001 and 50 µm, more preferably between 0.005 and 15 µm. Preferably, the filler material has a D50 of less than 10 µm. Preferably, the filler material has a D50 between 1 and 5 µm, for example between 3 and 5 µm. D50 is measured by laser Mastersizer, laser diffraction, Mie theory (ISO 13320-1).
包含填充物材料之聚合物材料(B)可藉由所屬技術領域中已知之任何適合方法製備。舉例而言,該材料可藉由單螺桿或雙螺桿擠出混配,較佳藉由雙螺桿擠出混配來製備。The polymer material (B) containing the filler material can be prepared by any suitable method known in the art. For example, the material can be prepared by single-screw or twin-screw extrusion compounding, preferably by twin-screw extrusion compounding.
適當地,填充物材料提供改善之特性,諸如改善之強度、延展性、耐熱性、耐化學性。然而,對於絕緣導體,填充物材料為總成提供改善之電阻。舉例而言,填充物材料可提供改善之介電特性及/或電擊穿效能。 Suitably, the filler material provides improved properties, such as improved strength, ductility, heat resistance, chemical resistance. However, for insulating conductors, the filler material provides improved electrical resistance to the assembly. For example, the filler material may provide improved dielectric properties and/or electrical breakdown performance.
在最佳佈置中,第一擠出層鄰近擠出機總成之模具而定位。有利地,提供實質上不含填充物材料之第一擠出層使在模具出口處形成模垢之風險降至最低。因而,第一層用以提供第二層覆蓋層或遮罩。第二層因此受保護以在離開擠出設備時避開模具。因此,此第一態樣之絕緣導體適當地具有較少的由模垢引起之缺陷。另外,擠出製程不容易堵塞,且因此不太需要停止製程進行清潔。此適當地提供更高效的整體製程。該製程同樣適用於生產其他擠出產物,諸如膜、電纜外皮、長絲及管。In the best arrangement, the first extrusion layer is positioned adjacent to the die of the extruder assembly. Advantageously, providing a first extrusion layer substantially free of filler material minimizes the risk of mold deposit formation at the die outlet. Thus, the first layer is used to provide a second layer cover or shield. The second layer is thus protected from the die when leaving the extrusion apparatus. Therefore, the insulating conductor of this first aspect suitably has fewer defects caused by mold deposits. In addition, the extrusion process is less prone to clogging and therefore less likely to require stopping the process for cleaning. This suitably provides a more efficient overall process. The process is equally applicable to the production of other extruded products, such as films, cable sheaths, filaments and tubes.
較佳地,第二層鄰近電線。較佳地,第二層直接沉積於電線上。Preferably, the second layer is adjacent to the wire. Preferably, the second layer is deposited directly on the wire.
較佳地,第一層為外層。較佳地,第二層為最接近電線之內層。較佳地,第一擠出層鄰近第二層而定位。Preferably, the first layer is an outer layer. Preferably, the second layer is an inner layer closest to the wire. Preferably, the first extruded layer is positioned adjacent to the second layer.
此外,本發明提供較高線速度用於生產擠出產物。增加線速度會導致模垢,此使得增加線速度至某一限值以上為不切實際的。然而,由於本發明減少模垢,因此有可能實現較快線速度,增加製造產量及效率。典型地,絕緣電線塗佈機總成以每分鐘大致10公尺運行。有利地,本發明提供每分鐘大致50公尺之線速度。線速度可大於每分鐘50公尺,例如至多每分鐘100公尺,較佳地介於每分鐘30與80公尺之間,較佳地介於每分鐘40與60公尺之間。In addition, the present invention provides for higher line speeds for producing extruded products. Increasing line speeds results in mold deposits, which makes increasing line speeds above a certain limit impractical. However, because the present invention reduces mold deposits, it is possible to achieve faster line speeds, increasing manufacturing throughput and efficiency. Typically, the insulation wire coating machine assembly operates at approximately 10 meters per minute. Advantageously, the present invention provides a line speed of approximately 50 meters per minute. The line speed may be greater than 50 meters per minute, such as up to 100 meters per minute, preferably between 30 and 80 meters per minute, and preferably between 40 and 60 meters per minute.
相比於原本在無填充物的情況下會不利地影響擠出製程,本發明亦可允許較高含量之填充物,例如大於20 wt%,較佳25 wt%或30 wt%或40 wt%包括於擠出產物之內層的聚合物材料中。此類較高含量之填充物對於改善擠出產物之特性,例如耐電暈放電性,可為合乎需要的。The present invention also allows a higher content of filler, such as greater than 20 wt%, preferably 25 wt%, 30 wt%, or 40 wt%, to be included in the polymer material of the inner layer of the extruded product, compared to the original situation where no filler would adversely affect the extrusion process. Such a higher content of filler may be desirable for improving the properties of the extruded product, such as resistance to corona discharge.
此類在未經填充之PAEK材料鄰近經填充之PAEK材料的情況下之共擠出允許使用較高重量含量之填充物,且添加了以較高線速度運行共擠出生產線的可能,由此實現較高生產率。Such co-extrusion of unfilled PAEK material adjacent to filled PAEK material allows for the use of higher weight contents of filler and adds the possibility of running the co-extrusion line at higher line speeds, thereby achieving higher production rates.
若經高度填充之化合物可塗佈於電線上(不具有上文所指示之製程問題),咸信具有較高含量之填充物的較薄塗層可實現與較厚塗層(其中先前僅低含量之填充物材料有可能實現)相同的電氣效能。If highly filled compounds can be coated on traces (without the process issues indicated above), it is believed that thinner coatings with higher levels of filler can achieve the same electrical performance as thicker coatings (where only lower levels of filler material were previously possible).
減小導體周圍之絕緣層之總厚度(同時維持電氣及機械效能)將允許設計工程師節省電動機之定子內的空間及/或增加導體之量。減小之塗層厚度亦可有助於電動機之熱耗散。Reducing the overall thickness of the insulation around the conductors (while maintaining electrical and mechanical performance) will allow the design engineer to save space within the stator of the motor and/or increase the amount of conductors. Reduced coating thickness can also help dissipate heat from the motor.
聚合物材料(A)在作為擠出產物中之外層的第一層中亦可在減少其他表面缺陷或應變相關現象(其可在擠出一些聚合物材料時出現,例如擠出材料表面龜裂)方面提供其他優勢。聚合物材料(A)適當地具有低得多的產生此類缺陷之傾向。The polymer material (A) in the first layer as an outer layer in the extruded product may also provide other advantages in terms of reducing other surface defects or strain related phenomena (which may occur when extruding some polymer materials, such as cracking of the surface of the extruded material). The polymer material (A) suitably has a much lower tendency to produce such defects.
術語「外層(outer layer)」在本文中用以表示擠出產物接觸模具之一或多個層,該模具用以在產物離開模具時形成產物。在一些具體實例中,擠出產物藉由涉及產物之僅一個表面在離開時接觸模具之製程形成。在此類具體實例中,第一層適當地為擠出產物之唯一外層,典型地為擠出產物之最外層或表面。第二層典型地為擠出產物之內層。在一些具體實例中,擠出產物藉由產物之兩個表面在離開時接觸模具之製程形成。在此類具體實例中,擠出產物包含第三層,較佳地,第二層佈置於第一層與第三層之間。可在多共擠出製程中提供複數個材料層。The term "outer layer" is used herein to refer to one or more layers of the extruded product contacting the mold used to form the product when it leaves the mold. In some embodiments, the extruded product is formed by a process involving only one surface of the product contacting the mold when leaving. In such embodiments, the first layer is suitably the only outer layer of the extruded product, typically the outermost layer or surface of the extruded product. The second layer is typically an inner layer of the extruded product. In some embodiments, the extruded product is formed by a process in which two surfaces of the product contact the mold when leaving. In such embodiments, the extrusion product comprises a third layer, preferably the second layer is disposed between the first layer and the third layer. A plurality of material layers may be provided in a multi-coextrusion process.
擠出產物之第一層及第二層可具有至少100 µm,例如150與190 µm之間的合併厚度。合併厚度可為至多300 µm。The first and second layers of the extrudate may have a combined thickness of at least 100 μm, for example between 150 and 190 μm. The combined thickness may be up to 300 μm.
第一層之厚度適當地小於第二層之厚度。第二層可提供第一層及第二層之合併厚度的50%至95%。第一層適當地提供第一層及第二層之合併厚度的5%至50%。The thickness of the first layer is suitably less than the thickness of the second layer. The second layer may provide 50% to 95% of the combined thickness of the first layer and the second layer. The first layer suitably provides 5% to 50% of the combined thickness of the first layer and the second layer.
適當地,可提供至少一個額外擠出層。此類層可包含釉質材料或可選自金屬硬脂酸鹽、芥酸醯胺(erucamide)、油酸醯胺或氟聚合物之脫模劑。Suitably, at least one additional extrusion layer may be provided. Such a layer may comprise an enamel material or a release agent selected from metal stearates, erucamide, oleamide or a fluoropolymer.
較佳地,該或各額外層可位於第二層與電線之間。較佳地,該或各額外層可包含添加劑以提高對電線之黏著力。添加劑可例如為PAEK之共聚物,例如EP 3013888中所描述之PEEK/PEDEK。有利地,提供此類額外層抵消了對電線預處理的需要。舉例而言,電線將典型地需要電漿預處理。Preferably, the or each additional layer may be located between the second layer and the wire. Preferably, the or each additional layer may comprise an additive to improve adhesion to the wire. The additive may for example be a copolymer of PAEK, such as PEEK/PEDEK as described in EP 3013888. Advantageously, providing such an additional layer offsets the need for pre-treatment of the wire. For example, the wire would typically require plasma pre-treatment.
在一替代具體實例中,絕緣電導體包含聚合物材料(A)之第一外層、作為第二層之部聚合物材料(B)之內層及作為第三層之部聚合物材料(A)之另一外層,其中第二層佈置於第一層與第三層之間(以A-B-A佈置)。適當地,聚合物材料(A)之第一層、聚合物材料(A)之第三層及聚合物材料(B)之第二層經同軸佈置以形成電線護套。可將電線護套直接擠出至電線上以形成絕緣導體總成。有利地,歸因於包含填充物材料之第二層,實現了對第二層之增加的電絕緣,且因此實現了對整個總成之增加的電絕緣。聚合物材料(A)之兩個外層適當地減少或防止模垢自聚合物材料(B)之第二(內)層之上表面及下表面形成,若聚合物材料(A)之兩個外層不存在,則原本會在聚合物材料(B)離開擠出機時形成模垢。In an alternative embodiment, the insulating conductor comprises a first outer layer of polymer material (A), an inner layer of part polymer material (B) as a second layer and another outer layer of part polymer material (A) as a third layer, wherein the second layer is arranged between the first layer and the third layer (in an A-B-A arrangement). Suitably, the first layer of polymer material (A), the third layer of polymer material (A) and the second layer of polymer material (B) are coaxially arranged to form a wire sheath. The wire sheath can be extruded directly onto the wire to form the insulating conductor assembly. Advantageously, due to the second layer comprising filler material, increased electrical insulation of the second layer and therefore of the entire assembly is achieved. The two outer layers of polymer material (A) suitably reduce or prevent mold deposits from forming on the upper and lower surfaces of the second (inner) layer of polymer material (B), which would otherwise form when the polymer material (B) leaves the extruder if the two outer layers of polymer material (A) were not present.
電導體較佳基本上為銅或鋁,但本發明適用於廣泛範圍之電導體材料。當導體為銅時,其較佳地為氧含量小於30 ppm、更佳地小於20 ppm之低氧銅。The conductor is preferably substantially copper or aluminum, but the present invention is applicable to a wide range of conductor materials. When the conductor is copper, it is preferably low-oxygen copper having an oxygen content of less than 30 ppm, more preferably less than 20 ppm.
根據本發明之另一態樣,提供一種擠出產物總成,其包含芯、第一擠出層及第二擠出層;該第一層包含:具有式I之重複單元的聚合物材料(A) (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2; 且該第二層包含:具有式I之重複單元的聚合物材料(B) (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2;以及填充物材料,其中該第二層位於該芯與該第一層之間。 According to another aspect of the present invention, an extrusion product assembly is provided, which comprises a core, a first extrusion layer and a second extrusion layer; the first layer comprises: a polymer material (A) having repeating units of formula I (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and the second layer comprises: a polymer material (B) having repeating units of Formula I (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and a filler material, wherein the second layer is located between the core and the first layer.
根據本發明之另一態樣,提供一種產生包含第一層及第二層之擠出產物總成的方法,該方法包含以下步驟: a)提供具有式I之重複單元之聚合物材料(A)的來源: (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2; b)提供具有式I之重複單元之第二聚合物材料(B)的來源; (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2;以及填充物材料; c)將該聚合物材料(A)及該第二聚合物材料(B)遞送至包含模具之擠出台; d)經由該模具擠出該聚合物材料(A)及該第二聚合物材料(B),使得該聚合物材料(A)在擠出期間接觸該模具之出口且該第二聚合物材料(B)在擠出期間不接觸該模具,以形成該擠出產物總成。 According to another aspect of the present invention, a method for producing an extrusion product assembly comprising a first layer and a second layer is provided, the method comprising the following steps: a) providing a source of a polymer material (A) having repeating units of formula I: (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; b) providing a source of a second polymer material (B) having repeating units of Formula I; (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and a filler material; c) delivering the polymer material (A) and the second polymer material (B) to an extrusion table comprising a mold; d) extruding the polymer material (A) and the second polymer material (B) through the mold so that the polymer material (A) contacts the outlet of the mold during extrusion and the second polymer material (B) does not contact the mold during extrusion to form the extruded product assembly.
最佳地,擠出產物總成為絕緣導體總成。Optimally, the extruded product assembly is an insulating conductor assembly.
該方法之步驟適當地以步驟a)及b)(適當地,同時),隨後步驟c),隨後步驟d)之次序進行。The steps of the method are suitably carried out in the order of steps a) and b) (suitably, simultaneously), followed by step c), followed by step d).
適當地,聚合物材料(A)及第二聚合物材料(B)之輸入及擠出經佈置以使得在模具之出口處第二聚合物材料(B)由聚合物材料(A)覆蓋,使得第二聚合物材料不接觸模具之出口。適當地,聚合物材料(A)形成包圍第二聚合物材料之外層,該第二聚合物材料在模具之出口處或恰好在離開模具之前形成擠出產物之內層。因此,聚合物材料(A)避免第二聚合物材料在模具之出口處或附近接觸模具之表面,以便提供如本文中所描述之模垢之減少。Suitably, the input and extrusion of the polymer material (A) and the second polymer material (B) are arranged so that at the outlet of the mould the second polymer material (B) is covered by the polymer material (A) so that the second polymer material does not contact the outlet of the mould. Suitably, the polymer material (A) forms an outer layer surrounding the second polymer material which forms an inner layer of the extruded product at the outlet of the mould or just before leaving the mould. Thus, the polymer material (A) prevents the second polymer material from contacting the surface of the mould at or near the outlet of the mould so as to provide a reduction in mould deposit as described herein.
聚合物材料(A)可具有上文關於前述態樣中之任一者所描述之適合的任何特徵及優點。The polymer material (A) may have any of the features and advantages described above with respect to any of the aforementioned aspects.
此態樣之方法與可比製程相比適當地引起模垢量減少,在可比製程中,第二聚合物材料(B)在無聚合物材料(A)的情況下擠出通過模具,且因此其中第二聚合物材料在擠出期間接觸模具,尤其是模具出口。This aspect of the method suitably results in a reduction in the amount of mold deposit compared to comparable processes in which the second polymer material (B) is extruded through a mold in the absence of polymer material (A) and therefore in which the second polymer material contacts the mold, particularly the mold exit, during extrusion.
此態樣之方法可在適合之擠出設備上進行,該擠出設備包含用於將呈熔融形式之聚合物材料(A)饋送至擠出模具之第一供應裝置及用於將呈熔融形式之第二聚合物材料(B)饋送至擠出模具之第二供應裝置,該等供應裝置使得產物中第二聚合物材料(B)作為內層擠出且聚合物材料(A)作為外層擠出(亦即本文所述之第一層及第二層)。This method can be carried out on a suitable extrusion device, which includes a first supply device for feeding the polymer material (A) in a molten form to an extrusion die and a second supply device for feeding the second polymer material (B) in a molten form to the extrusion die, wherein the supply devices allow the second polymer material (B) to be extruded as an inner layer and the polymer material (A) to be extruded as an outer layer in the product (i.e., the first layer and the second layer described herein).
該方法之步驟c)適當地涉及將聚合物材料(A)遞送至包含模具之擠出台,以提供產物之第一外層及產物之第二外層,第二聚合物材料(B)形成佈置於第一外層與第二外層之間的內層(亦即如本文所描述之第一層、第二層及第三層)。此適當地涉及包含第三供應裝置之擠出設備,該第三供應裝置用於將呈熔融形式之聚合物材料(A)之第二流饋送至擠出模具以提供產物之第二外層。Step c) of the method suitably involves delivering the polymer material (A) to an extrusion stage comprising a die to provide a first outer layer of the product and a second outer layer of the product, the second polymer material (B) forming an inner layer disposed between the first outer layer and the second outer layer (i.e. the first layer, the second layer and the third layer as described herein). This suitably involves an extrusion apparatus comprising a third supply device for feeding a second stream of the polymer material (A) in molten form to the extrusion die to provide the second outer layer of the product.
較佳地,將第一層引入模具總成中之第一位置處,較佳地,該第一位置遠離模具之出口端。較佳地,將第二層引入第二位置處。較佳地,第二位置位於第一位置下游。較佳地,將第三層引入模具總成中之第三位置處。較佳地,第三位置不同於第一位置或第二位置。較佳地,第三位置在第二位置下游。較佳地,第三位置朝向模具之出口端定位。較佳地,將各後續層以等距間隔開之位置引入模具總成上。Preferably, the first layer is introduced into the mold assembly at a first position, preferably, the first position is remote from the exit end of the mold. Preferably, the second layer is introduced into the mold assembly at a second position. Preferably, the second position is downstream of the first position. Preferably, the third layer is introduced into the mold assembly at a third position. Preferably, the third position is different from the first position or the second position. Preferably, the third position is downstream of the second position. Preferably, the third position is positioned toward the exit end of the mold. Preferably, each subsequent layer is introduced into the mold assembly at equally spaced positions.
適當地,該方法連續進行至少1小時、至少5小時、至少10小時、至少15小時或至少24小時。相比於其中聚合物材料(A)不用作接觸模具出口之層的類似方法,藉由使用聚合物材料(A)提供之模垢減少適當地允許藉由擠出產生產物之方法的運行時間增加。Suitably, the process is carried out continuously for at least 1 hour, at least 5 hours, at least 10 hours, at least 15 hours or at least 24 hours. The reduction in mould deposit provided by the use of polymeric material (A) suitably allows the run time of the process for producing a product by extrusion to be increased compared to a similar process in which the polymeric material (A) is not used as a layer contacting the mould outlet.
根據本發明之其他態樣,提供一種聚合物材料(A)的用途,其用於減少在擠出至少第二聚合物材料(B)期間在擠出設備之模具上形成沉積物;其中該聚合物材料(A)具有下式之重複單元: 其中t1及w1獨立地表示0或1,且v1表示0、1或2(式I); 且該第二聚合物材料(B)具有式1之重複單元: 其中t1及w1獨立地表示0或1,且v1表示0、1或2;以及填充物材料。 According to another aspect of the present invention, there is provided a use of a polymer material (A) for reducing the formation of deposits on a die of an extrusion device during extrusion of at least a second polymer material (B); wherein the polymer material (A) has repeating units of the following formula: wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2 (Formula I); and the second polymer material (B) has repeating units of Formula 1: wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and filler material.
根據本發明之另一態樣,提供一種絕緣導體總成,其包含:導體電線;第一擠出層及第二擠出層;該第一層包含聚合物材料(D),該聚合物材料(D)具有下式之重複單元: -O-Ph-O-Ph-CO-Ph- I 及下式之重複單元: -O-Ph-Ph-O-Ph-CO-Ph- II 其中Ph表示伸苯基部分; 且該第二層包含:具有式I之重複單元的聚合物材料(B) (式I) 其中t1及w1獨立地表示0或1,且v1表示0、1或2;以及填充物材料,其中該第二層位於該電線與該第一層之間。 According to another aspect of the present invention, an insulating conductor assembly is provided, which comprises: a conductive wire; a first extruded layer and a second extruded layer; the first layer comprises a polymer material (D), the polymer material (D) having repeating units of the following formula: -O-Ph-O-Ph-CO-Ph- I and repeating units of the following formula: -O-Ph-Ph-O-Ph-CO-Ph- II wherein Ph represents a phenyl group; and the second layer comprises: a polymer material (B) having repeating units of formula I (Formula I) wherein t1 and w1 independently represent 0 or 1, and v1 represents 0, 1 or 2; and a filler material, wherein the second layer is located between the wire and the first layer.
擠出層意謂具有橫截面之層,該橫截面已藉由擠出製程,適當地藉由擠出通過模具而形成,該模具賦予產物特定的,較佳一致的橫截面輪廓。Extruded layer means a layer having a cross-section which has been formed by an extrusion process, suitably by extrusion through a die which imparts a specific, preferably consistent, cross-sectional profile to the product.
聚合物材料(D)為聚芳基醚酮(PAEK)聚合物。更特定言之,聚合物材料(D)為聚(醚醚酮)(PEEK)及聚(醚二苯醚酮)(PEDEK)之共聚物,式I之重複單元(其可稱為EEK)提供PEEK聚合物組分,且式II之重複單元(其可稱為EDEK)提供PEDEK。因此,式(D)之聚合物材料可稱為PEEK/PEDEK共聚物。適合之式(D)之聚合物材料(PEEK/PEDEK共聚物)如US4717761、WO2014/207458A1及WO2015/124903A1中所述,其內容以引用的方式併入本文中。The polymer material (D) is a polyaryletherketone (PAEK) polymer. More specifically, the polymer material (D) is a copolymer of poly(etheretherketone) (PEEK) and poly(etherdiphenyletherketone) (PEDEK), the repeating units of formula I (which may be referred to as EEK) providing the PEEK polymer component, and the repeating units of formula II (which may be referred to as EDEK) providing PEDEK. Therefore, the polymer material of formula (D) may be referred to as a PEEK/PEDEK copolymer. Suitable polymer materials of formula (D) (PEEK/PEDEK copolymers) are described in US4717761, WO2014/207458A1 and WO2015/124903A1, the contents of which are incorporated herein by reference.
WO 2014/207458A1揭示PEEK/PEDEK共聚物,其具有莫耳比為55:45至95:5的式I及II之重複單元,且其熔融黏度(melt viscosity,MV)在340℃及1000 s -1剪切速率下量測為至少0.25且小於1.2 kNsm -2。 WO 2014/207458 A1 discloses a PEEK/PEDEK copolymer having repeating units of formula I and II in a molar ratio of 55:45 to 95:5 and having a melt viscosity (MV) of at least 0.25 and less than 1.2 kNsm -2 measured at 340°C and a shear rate of 1000 s -1 .
WO 2015/124903 A1揭示PEEK/PEDEK共聚物,其具有莫耳比為55:45至95:5之式I及II之重複單元,以及在340℃及1000 s -1剪切速率下量測為至少0.25且小於1.2之MV。 WO 2015/124903 A1 discloses PEEK/PEDEK copolymers having repeating units of formula I and II in a molar ratio of 55:45 to 95:5 and a MV of at least 0.25 and less than 1.2 measured at 340° C. and a shear rate of 1000 s −1 .
圖1a展示用於在「施壓(pressure on)」擠出製程中產生擠出絕緣導體總成120的壓力擠出模具100。擠出模具100包含模具體1及模具心軸2。FIG. 1 a shows a pressure extrusion die 100 for producing an extruded insulating conductor assembly 120 in a “pressure on” extrusion process. The extrusion die 100 includes a die body 1 and a die mandrel 2.
模具100包含用於遞送第一擠出層之第一通道101、用於遞送第二擠出層之第二通道102、電線103、模具出口110及模具入口111。第一通道101位於模具入口111下游之第一位置122處。第一通道101經組態以將呈熔融形式之第一聚合物材料(A)遞送至模具100中,使得聚合物材料(A)在實質上平行於電線103之方向的方向上流過模具,以提供PAEK材料之擠出的第一護套126。第二通道102位於第一位置122上游且最接近模具入口111之第二位置124處。第二通道102經組態以將熔融的第二聚合物材料(B)遞送至模具100中,使得聚合物材料(B)在實質上平行於電線103之方向的方向上流過模具。在使用中,第二聚合物(B)進入模具且塗佈電線103,形成PAEK加上填充物材料之擠出的第二護套128。如在圖1b中最清楚地展示,擠出的第一護套126於該第二護套128上共擠出。The die 100 includes a first channel 101 for delivering a first extrusion layer, a second channel 102 for delivering a second extrusion layer, a wire 103, a die outlet 110, and a die inlet 111. The first channel 101 is located at a first position 122 downstream of the die inlet 111. The first channel 101 is configured to deliver a first polymer material (A) in a molten form into the die 100 such that the polymer material (A) flows through the die in a direction substantially parallel to the direction of the wire 103 to provide an extruded first sheath 126 of the PAEK material. The second channel 102 is located at a second position 124 upstream of the first position 122 and closest to the die inlet 111. The second channel 102 is configured to deliver a molten second polymer material (B) into the die 100 such that the polymer material (B) flows through the die in a direction substantially parallel to the direction of the wire 103. In use, the second polymer (B) enters the mold and coats the wire 103, forming an extruded second sheath 128 of PAEK plus filler material. As best shown in FIG. 1 b , the extruded first sheath 126 is co-extruded over the second sheath 128 .
由於聚合物材料A實質上不含填充物材料,因此聚合物材料A比第二聚合物材料B具有更低的形成此類沉積物之傾向,因此,此擠出絕緣導體總成120的形成係在模具出口110處形成之模具沉積物(模垢)之量減少的情況下進行。第一護套126有效使聚合物材料B與模具100之熱暴露表面絕緣,尤其在模具出口110處絕緣,否則該等熱暴露表面將導致聚合物材料B產生模垢。因此,相較於類似製程及產物,在此佈置中,擠出方法及擠出產物適當地提供模垢之有效減少。Since polymer material A is substantially free of filler material, polymer material A has a lower tendency to form such deposits than second polymer material B, and thus, the extruded insulated conductor assembly 120 is formed with a reduced amount of mold deposits (mold deposits) formed at the mold outlet 110. The first jacket 126 effectively insulates polymer material B from heat-exposed surfaces of the mold 100, particularly at the mold outlet 110, which would otherwise cause mold deposits to form on polymer material B. Thus, in this arrangement, the extrusion method and extruded product suitably provide an effective reduction in mold deposits compared to similar processes and products.
圖2a展示包含模具體1及模具心軸2之擠出模具200。模具200具有第一通道201、第二通道202、第三通道233及模具出口210。電線203被饋送通過模具200以形成絕緣導體總成之芯。在此具體實例中,第三通道233位於第一通道201與第二通道202之間。第三通道233經組態以將一另外材料遞送至模具總成中。第三材料較佳地為熔融聚合物材料。特定言之,第一、第二及第三通道用於分別供應熔融聚合物材料A、B及C。此等聚合物材料在壓力下被饋送通過模具200至模具出口210,以連續地產生擠出產物,該擠出產物包含圍繞電線3同軸佈置之三個擠出護套228、236、226,如圖2b中所示。FIG. 2a shows an extrusion die 200 including a die body 1 and a die mandrel 2. The die 200 has a first channel 201, a second channel 202, a third channel 233 and a die outlet 210. The wire 203 is fed through the die 200 to form the core of the insulated conductor assembly. In this specific example, the third channel 233 is located between the first channel 201 and the second channel 202. The third channel 233 is configured to deliver an additional material into the die assembly. The third material is preferably a molten polymer material. Specifically, the first, second and third channels are used to supply molten polymer materials A, B and C, respectively. These polymer materials are fed under pressure through the die 200 to the die outlet 210 to continuously produce an extruded product comprising three extruded sheaths 228, 236, 226 coaxially arranged around the wire 3, as shown in FIG. 2b.
熔融聚合物材料A形成擠出產物之外層,且具有上文針對聚合物材料(A),亦即如本文所描述之第一層所描述之組成物。熔融聚合物材料B形成擠出產物之內層,且適當地為如上文針對第二層所描述之聚合物材料(B)。熔融聚合物材料C形成擠出產物之第二內層,且可為如上文所描述之聚合物材料(B)。聚合物材料C適當地含有改善聚合物材料C之電擊穿抗性且因此改善電線或電纜護套之電擊穿抗性的填充物。適當地,相較於原本在聚合物材料C直接接觸電線203之情況下將獲得的黏合,聚合物材料B提供聚合物材料C與電線203之間改善的黏合。Molten polymer material A forms the outer layer of the extruded product and has the composition described above for polymer material (A), i.e. the first layer as described herein. Molten polymer material B forms the inner layer of the extruded product and is suitably polymer material (B) as described above for the second layer. Molten polymer material C forms the second inner layer of the extruded product and may be polymer material (B) as described above. Polymer material C suitably contains a filler that improves the electrical breakdown resistance of polymer material C and thus improves the electrical breakdown resistance of the wire or cable sheath. Suitably, polymer material B provides improved bonding between polymer material C and wire 203 compared to the bonding that would otherwise be obtained if polymer material C directly contacted wire 203.
替代地,通道202可遞送具有黏著特徵的材料,該等特徵抵消了對電線進行預處理之需要。舉例而言,通道202可遞送PAEK之共聚物。Alternatively, channel 202 may deliver a material having adhesive properties that negate the need for pre-treating the wire. For example, channel 202 may deliver a copolymer of PAEK.
如上文關於圖1a所描述,A之外層有效使聚合物材料B及C與模具200之熱暴露表面絕緣,尤其在模具出口210處絕緣,否則該等熱暴露表面將導致聚合物材料B或C產生模垢。因此,相較於類似製程及產物,在此佈置中,擠出方法及擠出產物適當地提供模垢之有利減少。As described above with respect to FIG. 1a, the outer layer of A effectively insulates polymer materials B and C from heat-exposed surfaces of mold 200, particularly at mold outlet 210, which would otherwise cause mold deposits of polymer materials B or C. Thus, in this arrangement, the extrusion method and extruded product suitably provide an advantageous reduction in mold deposits compared to similar processes and products.
圖3a展示由模具體1及模具心軸2形成之模具300。模具300具有與模具200類似的輸入佈置,但設置為「管上(tube-on)」模具以塗佈例如電線303。聚合物材料A之第一外層被引入通過第一通道301(亦即第一層),聚合物材料B被引入通過第二通道302(亦即第二層),且包含聚合物材料A之另一外層被引入通過另一通道313(亦即第三層)。以護套塗佈電線或電纜303係在該護套已通過模具出口310離開模具之後,發生在模具體300外。因此,在製程中的此類管中,護套之最外部及最內部表面在模具出口310處接觸模具300之熱暴露表面,且因此可能具有產生模垢之風險。以此方式產生之電線或電纜包含如圖3b中所展示的圍繞電線3同軸佈置之三個層311、312及313,該等層對應於分別供應至通道301、302及303之聚合物材料。如所展示,自聚合物材料A及B形成護套發生在模具體內,以使得A之第一外層及第二外層有效使聚合物材料B與模具300之熱暴露表面絕緣,如上文所論述,以在護套離開模具時減少或消除模垢。如同關於圖1及圖2所描述之具體實例,熔融聚合物材料A具有上文針對聚合物材料(A)所描述之組成物。熔融聚合物材料B形成擠出產物之內層且適當地為如上文所描述之聚合物材料(B)。聚合物材料B適當地含有賦予聚合物材料(B)電擊穿抗性之填充物。FIG. 3a shows a mold 300 formed by a mold body 1 and a mold mandrel 2. The mold 300 has a similar input arrangement to the mold 200, but is configured as a "tube-on" mold for coating, for example, wires 303. A first outer layer of polymer material A is introduced through a first channel 301 (i.e., the first layer), polymer material B is introduced through a second channel 302 (i.e., the second layer), and another outer layer comprising polymer material A is introduced through another channel 313 (i.e., the third layer). Coating the wire or cable 303 with a sheath occurs outside the mold body 300 after the sheath has left the mold through a mold outlet 310. Thus, in such a tube in process, the outermost and innermost surfaces of the jacket contact the heat-exposed surfaces of the mold 300 at the mold exit 310, and thus may present a risk of mold deposits. The wire or cable produced in this manner comprises three layers 311, 312 and 313 arranged coaxially around the wire 3 as shown in FIG. 3b, which layers correspond to the polymer materials supplied to the channels 301, 302 and 303, respectively. As shown, the formation of the jacket from polymer materials A and B occurs within the mold body, so that the first and second outer layers of A effectively insulate the polymer material B from the heat-exposed surfaces of the mold 300, as discussed above, to reduce or eliminate mold deposits when the jacket leaves the mold. As in the specific example described with respect to Figures 1 and 2, the molten polymer material A has the composition described above for polymer material (A). The molten polymer material B forms the inner layer of the extruded product and is suitably the polymer material (B) as described above. The polymer material B suitably contains a filler that imparts electrical breakdown resistance to the polymer material (B).
圖4a展示用於形成管之擠出模具400,該模具由模具體1及模具心軸2形成。模具400包含第一通道401、第二通道402、第三通道403、第四通道404及模具出口410。第一通道、第二通道及第三通道用於在壓力下供應熔融聚合物材料,該等熔融聚合物材料被饋送通過模具400至模具出口410,以連續地產生擠出管產物,該擠出管產物包含如圖4b中所示之三層411、412及413,該等層對應於分別供應至通道401、402及403之聚合物材料。第四通道404包含銷釘3以產生管之中空中心414。供應至第一通道401之熔融聚合物材料為如上文所描述之聚合物材料(A)。供應至第二通道402之熔融聚合物材料為如上文所描述之第二聚合物材料,例如如上文所描述之聚合物材料(B)。供應至第三通道403之熔融聚合物材料為如上文所描述之聚合物材料(A)。因此,模具400用於產生包含佈置於聚合物材料(A)之兩個外層(亦即第一層及第三層)之間的第二聚合物材料之內層(亦即第二層)的擠出產物。此擠出產物之形成係在模具沉積物(模垢)在模具出口410之形成量減少的情況下進行,此係由於聚合物材料(A)相較於第二聚合物材料(其可含有填充物材料)具有較低的形成此類沉積物之傾向。聚合物材料(A)之兩個外層有效使第二聚合物材料與模具400之熱暴露表面絕緣,尤其在模具出口410處絕緣,否則該等熱暴露表面將導致第二聚合物材料產生模垢。因此,相較於類似方法及產物,在此佈置中,擠出方法及擠出產物適當地提供模垢之有利減少。FIG. 4a shows an extrusion die 400 for forming a tube, the die being formed by a die body 1 and a die mandrel 2. The die 400 comprises a first channel 401, a second channel 402, a third channel 403, a fourth channel 404 and a die outlet 410. The first channel, the second channel and the third channel are used to supply molten polymer material under pressure, which is fed through the die 400 to the die outlet 410 to continuously produce an extruded tube product, which comprises three layers 411, 412 and 413 as shown in FIG. 4b, which correspond to the polymer materials supplied to the channels 401, 402 and 403, respectively. The fourth channel 404 comprises a pin 3 to produce a hollow center 414 of the tube. The molten polymer material supplied to the first channel 401 is the polymer material (A) as described above. The molten polymer material supplied to the second channel 402 is the second polymer material as described above, for example, the polymer material (B) as described above. The molten polymer material supplied to the third channel 403 is the polymer material (A) as described above. Thus, the mold 400 is used to produce an extruded product comprising an inner layer (i.e., the second layer) of the second polymer material disposed between two outer layers (i.e., the first layer and the third layer) of the polymer material (A). The formation of this extruded product is carried out with a reduced amount of mold deposits (mold fouling) formed at the mold outlet 410, because the polymer material (A) has a lower tendency to form such deposits than the second polymer material (which may contain filler material). The two outer layers of polymer material (A) effectively insulate the second polymer material from heat-exposed surfaces of the mold 400, particularly at the mold outlet 410, which would otherwise cause mold deposits of the second polymer material. Thus, in this arrangement, the extrusion method and extruded product suitably provide an advantageous reduction in mold deposits compared to similar methods and products.
圖5a展示用於產生擠出膜之擠出設備500。設備包含模具體1及共擠出饋送區塊2。共擠出饋送區塊2具備第一通道501、第二通道502及第三通道503。在壓力下,第一及第二通道用於供應熔融聚合物材料A且第三通道供應聚合物材料B。此等聚合物材料經共擠出通過共擠出饋送區塊,且隨後被遞送至模具1以用於塑形成具有所需厚度之膜。來自通道501之熔融聚合物材料A形成膜之第一外層511,來自通道502之熔融聚合物材料A形成第二外層512且來自通道503之熔融聚合物材料B形成內層513,如圖5b中所示。FIG. 5a shows an extrusion apparatus 500 for producing an extruded film. The apparatus comprises a die body 1 and a co-extrusion feed block 2. The co-extrusion feed block 2 has a first channel 501, a second channel 502 and a third channel 503. The first and second channels are used to supply molten polymer material A and the third channel supplies polymer material B under pressure. These polymer materials are co-extruded through the co-extrusion feed block and are then delivered to the die 1 for molding into a film having a desired thickness. The molten polymer material A from channel 501 forms a first outer layer 511 of the film, the molten polymer material A from channel 502 forms a second outer layer 512 and the molten polymer material B from channel 503 forms an inner layer 513, as shown in FIG. 5b.
如同上文所述之具體實例,僅膜之聚合物材料A之外層接觸共擠出饋送區塊1及模具2,且因此,由於聚合物材料(A)產生模垢之傾向降低,使得模垢形成減少。As in the specific example described above, only the outer layer of the polymer material A of the film contacts the co-extrusion feed block 1 and the mold 2, and therefore, mold deposit formation is reduced due to the reduced tendency of the polymer material (A) to generate mold deposits.
圖6a展示用於產生長絲擠出產物之模具600。模具600由模具體1及模具心軸2形成。模具600包含第一通道601、第二通道602及模具出口610。第一及第二通道用於在壓力下供應熔融聚合物材料A及B。熔融聚合物材料A形成具有上文針對聚合物材料(A)所描述之組成物的長絲之外層611,且熔融聚合物材料B形成長絲之內層或芯612,如圖6b中所示。熔融聚合物材料B適當地為如上文所描述之聚合物材料(B),且適當地包含填充物材料。FIG6a shows a die 600 for producing a filament extrusion product. The die 600 is formed by a die body 1 and a die mandrel 2. The die 600 comprises a first channel 601, a second channel 602 and a die outlet 610. The first and second channels are used to supply molten polymer materials A and B under pressure. The molten polymer material A forms an outer layer 611 of a filament having a composition as described above for polymer material (A), and the molten polymer material B forms an inner layer or core 612 of the filament, as shown in FIG6b. The molten polymer material B is suitably a polymer material (B) as described above, and suitably comprises a filler material.
如同上文所描述之具體實例,僅長絲之聚合物材料A的外層接觸模具600之熱暴露表面,且因此,由於聚合物材料(A)比包含填充物材料的組成物之聚合物材料(B)低的產生模垢之傾向,使得模垢形成減少。以此方式產生之長絲可適用作積層製造中之原料材料。 實施例 As in the specific example described above, only the outer layer of the polymer material A of the filament contacts the heat-exposed surface of the mold 600, and therefore, mold deposit formation is reduced due to the lower tendency of the polymer material (A ) to produce mold deposits than the polymer material (B) of the composition containing the filler material. The filament produced in this way can be suitable for use as a raw material material in multi-layer manufacturing.
產生以下擠出產物以證明可根據本發明實現模垢減少。The following extrudates were produced to demonstrate the mold deposit reduction that can be achieved according to the present invention.
該等方法涉及聚合物乾燥,隨後擠出成固體形式之製程步驟,在擠出期間,針對各種聚合物及組態比較模垢產生。固體形式實例包括聚合物長絲、具有聚合物塗層之扁平電線及具有多層聚合物塗層之共擠出圓形電線。 聚合物乾燥 The methods involve a process step of drying the polymer followed by extrusion into a solid form during which mold deposit generation is compared for various polymers and configurations. Examples of solid forms include polymer filaments, flat wires with polymer coatings, and coextruded round wires with multiple layers of polymer coatings. Polymer Drying
擠出之前,下文所述且用於以下方法中之各聚合物材料的粉末/團粒藉由將材料置放於空氣循環烘箱中在150℃下最少3小時或在160℃下2小時來乾燥至低於0.05% w/w水分(露點為-40℃)。對於PEEK/PEDEK共聚物材料(本文中根據商標稱為LMPAEK™材料)而言,較佳乾燥時間在120℃下為2-3小時。為確保材料足夠乾燥,可根據ISO 15512方法(B),根據ISO 1133,量測水分含量。此乾燥係防止水分在擠出之後由於呈粉末或團粒形式之聚合物材料的吸濕性而在擠出物中造成空隙。Prior to extrusion, the powder/pellets of each polymer material described below and used in the following methods are dried to less than 0.05% w/w moisture (dew point of -40°C) by placing the material in an air circulating oven at 150°C for a minimum of 3 hours or at 160°C for 2 hours. For PEEK/PEDEK copolymer materials (referred to herein as LMPAEK™ materials under the trademark), the optimal drying time is 2-3 hours at 120°C. To ensure that the material is sufficiently dry, the moisture content can be measured according to ISO 15512 method (B) according to ISO 1133. This drying is to prevent moisture from causing voids in the extrudate after extrusion due to the hygroscopicity of the polymer material in powder or pellet form.
應理解,在以下實施例中之任一者中對未經填充之PEEK(Victrex 381G)之提及包括但不限於根據WO2018055384製造之PEEK。 實施例1-長絲 It should be understood that references to unfilled PEEK (Victrex 381G) in any of the following embodiments include but are not limited to PEEK manufactured in accordance with WO2018055384. Example 1 - Filament
由聚合物材料形成之長絲藉由連續擠出熔融聚合物材料來產生,以便評定此等聚合物材料形成模垢的相對速率。Filaments formed from polymeric materials are produced by continuously extruding molten polymeric materials in order to assess the relative rates at which these polymeric materials form mold deposits.
實施例1.1-由Victrex Manufacturing有限公司製造、名稱為381TL30之PEEK聚合物材料,如本文所定義,包含30 wt%之經滑石(JETFINE™ 3CA)填充之材料。Example 1.1 - A PEEK polymer material designated 381TL30 manufactured by Victrex Manufacturing, Inc., as defined herein, comprising 30 wt% talc (JETFINE™ 3CA) filled material.
實施例1.2-由Victrex Manufacturing有限公司製造、名稱為381G之未經填充之PEEK材料。Example 1.2 - Unfilled PEEK material designated 381G manufactured by Victrex Manufacturing Co., Ltd.
實施例1.3-藉由Victrex Manufacturing有限公司根據EP3013888製造的、作為LMPAEK™材料的PEEK/PEDEK共聚物。 產生長絲之方法 Example 1.3 - PEEK/PEDEK copolymer as LMPAEK™ material manufactured by Victrex Manufacturing Co., Ltd. according to EP3013888. Method of producing filaments
藉由將預乾燥聚合物材料引入典型單螺桿擠出管線中產生長絲,該管線由具有螺桿的加熱擠出機筒及以下之多個區組成:饋送區、壓縮區、計量區及模具區,各自具有介於300℃與390℃之間的溫度(參見表1)。經由該等區饋送聚合物材料以在模具區出口處產生熔融長絲。將熔融長絲自模具抽出且冷卻至低於聚合物材料之熔點以將長絲凍結成其最終形式。
擠出機筒內徑在15 mm與50 mm之間,其中螺桿之長度與直徑比(L/D)在16:1與28:1之間,且較佳在18:1與24:1之間。線速度設定為8至8.5 m/min。The inner diameter of the extruder barrel is between 15 mm and 50 mm, with the length to diameter ratio (L/D) of the screw being between 16:1 and 28:1, and preferably between 18:1 and 24:1. The line speed is set at 8 to 8.5 m/min.
典型地,螺桿速度設定在15至25 rpm之間。螺桿速度可在3至50 rpm、較佳4至30 rpm且最佳5至30 rpm範圍內變化。線速度可在1至30 m/min、較佳3至25 m/min且最佳4至20 m/min間變化。Typically, the screw speed is set between 15 and 25 rpm. The screw speed can vary from 3 to 50 rpm, preferably 4 to 30 rpm and optimally 5 to 30 rpm. The line speed can vary from 1 to 30 m/min, preferably 3 to 25 m/min and optimally 4 to 20 m/min.
擠出期間之熔融壓力用壓力轉換器量測,該壓力轉換器可置放於螺桿末端或模具內。熔融壓力可根據材料類型及速度而變化,但典型地在2巴至500巴之範圍內。The melt pressure during extrusion is measured with a pressure transducer, which can be placed at the end of the screw or in the die. The melt pressure can vary depending on the material type and speed, but is typically in the range of 2 bar to 500 bar.
熔融聚合物材料通過擠出管線流過模具,該模具具有直徑為大致4 mm之圓形開口。將熔融材料自模具抽出,在環境溫度下於空氣中冷卻直至低於該材料之熔點。使用履帶型牽引機(haul-off)將冷凍長絲抽出至所需厚度。藉由此製程製造大致1.5至2 mm,典型地1.7 mm的長絲。The molten polymer material flows through an extrusion line through a die having a circular opening of approximately 4 mm in diameter. The molten material is drawn from the die and cooled in air at ambient temperature until it is below the melting point of the material. A haul-off is used to draw the frozen filaments to the desired thickness. Filaments of approximately 1.5 to 2 mm, typically 1.7 mm, are produced by this process.
模具開口之尺寸及形狀可不同,例如開口之直徑可為0.2 mm至8 mm且可視所擠出產物之所需橫截面形狀而具有方形、矩形或葉形輪廓。模具開口之長度適當地在擠出長絲之直徑的0.1至6倍範圍內,其中引入區段較佳為平滑的,其直徑變化一致,但階形直徑變化亦為可能的。The size and shape of the die opening can vary, for example the opening can be 0.2 mm to 8 mm in diameter and can have a square, rectangular or leaf-shaped profile depending on the desired cross-sectional shape of the extruded product. The length of the die opening is suitably in the range of 0.1 to 6 times the diameter of the extruded filament, with the lead-in section preferably being smooth with a uniform diameter change, although stepped diameter changes are also possible.
將長絲擠出通過擠出管線直至在模具開口周圍可見模垢,且該模垢開始不利地影響擠出產物之品質。擠出產物之品質的此等不利影響包括擠出產物之表面中的可見痕跡及缺陷。擠出物材料之直徑之薄化及典型地大於15%之直徑或厚度之減小對產物品質不利。小於15%之量應理解為所屬技術領域中具有通常知識者可接受的。另外,自模具分離且附接至擠出物之含碳模垢可能對最終產物之品質具有不利影響。對於不同聚合物材料而言,自擠出開始直至不利的模垢形成之時刻所經過之時間詳述於表2中。
表2中之結果展示經填充之PEEK(實施例1.1)與未經填充之PEEK或PEEK/PEDEK材料之間模垢之產生的顯著差異。相較於使用未經填充之PEEK材料,存在在模垢形成之前所經過之時間方面的顯著改善,該模垢形成會導致沿擠出物之長度的可見缺陷。由此,本發明之擠出製程可在必須停止製程且清潔擠出裝備之前長時間運行。有利地,該製程產生更高效之生產製程且隨後產生更長的產物長度。 實施例2-單層絕緣電線 The results in Table 2 show a significant difference in the generation of mold deposits between filled PEEK (Example 1.1) and unfilled PEEK or PEEK/PEDEK materials. Compared to using unfilled PEEK materials, there is a significant improvement in the time that elapses before mold deposits form, which can result in visible defects along the length of the extrudate. As a result, the extrusion process of the present invention can be run for a long time before the process must be stopped and the extrusion equipment cleaned. Advantageously, the process results in a more efficient production process and subsequently longer product lengths. Example 2 - Single-layer insulated wire
適用作絕緣導體電線的經塗佈之電線藉由將上表2中所描述之聚合物材料作為單層擠出於銅線上來形成。此外,該製程使用熔融聚合物材料至電線上之連續擠出,以評定聚合物材料之模垢形成之相對速率。Coated wires suitable for use as insulated conductor wires were formed by extruding the polymer materials described in Table 2 above as a single layer onto copper wire. In addition, the process used continuous extrusion of molten polymer material onto the wire to evaluate the relative rate of mold deposit formation of the polymer material.
使經塗佈之電線擠出通過潔淨的擠出模具,直至在模具開口周圍可見顯著的模垢,且該模垢開始不利地影響擠出產物之品質。擠出產物之品質的此等不利影響包括擠出產物之表面中的可見痕跡及缺陷。記錄自擠出開始直至模垢形成之時刻所經過之時間,且於表3中針對用於不同聚合物材料提供該等時間。使用下文所描述之方法及裝備產生經塗佈之電線。 方法-絕緣導體總成電線 The coated wire was extruded through a clean extrusion die until significant mold deposits were visible around the die opening and the mold deposits began to adversely affect the quality of the extruded product. Such adverse effects on the quality of the extruded product included visible marks and defects in the surface of the extruded product. The time elapsed from the start of extrusion until the time of mold deposit formation was recorded and is provided in Table 3 for different polymer materials. The coated wire was produced using the method and apparatus described below. Method - Insulated Conductor Assembly Wire
使用具有如上文針對實施例1所述的筒直徑比率及線速度之擠出管線產生適用作絕緣導體電線的經塗佈之電線。典型地,螺桿速度設定在2與10 rpm之間。為產生經塗佈之電線,擠出管線經組態有十字頭模具,在該模具中,熔融聚合物材料自管線一側進入。此類組態允許聚合物材料在模具內接觸電線且在其上形成護套。此類型之擠出製程可稱為「施壓」或「壓力模具」系統。在此實施例中,電線為具有矩形橫截面之銅線。電線不斷地被饋送通過擠出管線,且聚合物材料在連續製程中被擠出至電線上。線速度設定為8至8.5 m/min。Coated wire suitable for use as an insulated conductor wire is produced using an extrusion line having a barrel diameter ratio and line speed as described above for Example 1. Typically, the screw speed is set between 2 and 10 rpm. To produce the coated wire, the extrusion line is configured with a crosshead die into which molten polymer material enters from one side of the line. This type of configuration allows the polymer material to contact the wire within the die and form a sheath thereon. This type of extrusion process may be referred to as a "pressing" or "pressure die" system. In this embodiment, the wire is a copper wire having a rectangular cross-section. The wire is continuously fed through the extrusion line and the polymer material is extruded onto the wire in a continuous process. The line speed was set at 8 to 8.5 m/min.
電線之橫截面形狀可變化,例如,正方形或矩形形狀。矩形電線可具有至多4:1之縱橫比。The cross-sectional shape of the wire can vary, for example, square or rectangular. Rectangular wires can have an aspect ratio of up to 4:1.
未經塗佈之電線與模具開口之間的空隙典型地在50微米與300微米之間。最終經塗佈之電線具有在100至200微米之間的厚度。
下表3展示至模垢形成之時間的結果。
表3中的結果展示,與經填充之PEEK相比,電線上未經填充之PEEK更容易防止模垢形成。作為電線上之單一聚合物層,在擠出製程期間與擠出模具接觸的PEEK/PEDEK材料延長直至產生顯著模垢且開始不利地影響擠出產物之品質的時間。相比之下,經填充之PEEK材料展示更快地模垢形成。因此,未經填充之PEEK或PEEK/PEDEK之使用使得擠出製程能夠在需要停止且清潔擠出裝備之前持續較長一段時間。此可提供更高效的生產製程及更長的擠出產物。The results in Table 3 show that unfilled PEEK on the wire is more resistant to mold deposit formation than filled PEEK. As a single polymer layer on the wire, the PEEK/PEDEK material in contact with the extrusion die during the extrusion process extends the time until significant mold deposits occur and begin to adversely affect the quality of the extruded product. In contrast, filled PEEK materials exhibit faster mold deposit formation. Therefore, the use of unfilled PEEK or PEEK/PEDEK allows the extrusion process to continue for a longer period of time before the extrusion equipment needs to be stopped and cleaned. This can provide a more efficient production process and longer extruded products.
在絕緣導體領域存在使用經填充(例如經滑石填充)之PAEK溶液的動力,以便實現例如所需擊穿電壓。因此,以下實施例展現在高電壓電線應用領域中解決模垢的同時亦考慮到對經填充之PAEK材料的需要的本發明之一具體實例。 實施例3-絕緣電線多層 There is a drive to use filled (e.g. talc filled) PAEK solutions in the field of insulating conductors in order to achieve, for example, a desired breakdown voltage. Therefore, the following example shows a specific example of the present invention that addresses mold deposits in the field of high voltage wire applications while also taking into account the need for filled PAEK materials. Example 3 - Insulating Wire Multilayer
實施例3為適用作根據本發明之絕緣導體總成的擠出電線之一實例。具體言之,此類電線在高壓應用中尤其有利。此類電線在電動機類型的應用中尤其有利。Example 3 is an example of an extruded wire suitable for use as an insulated conductor assembly according to the present invention. Specifically, such wire is particularly advantageous in high voltage applications. Such wire is particularly advantageous in motor type applications.
具有如圖1a及圖1b中所繪示之聚合物材料之內層及外層塗層的電線係藉由將在下表4中所指出之聚合物材料作為外層及內層擠出至銅線上而形成。該製程使用熔融聚合物材料至電線上之連續擠出,以評定此等聚合物材料之模垢形成之相對速率。
如上文關於圖1a及圖1b所描述,使經塗佈之電線擠出通過清潔擠出模具,直至在模具開口周圍可見模垢,且該模垢開始不利地影響擠出產物之品質。擠出產物之品質的此等不利影響包括擠出產物之表面中的可見痕跡及缺陷。記錄自擠出開始直至形成導致如上文所描述之品質缺陷的模垢之時刻所經過之時間,且針對不同聚合物材料,將該等時間提供於表5中。使用下文所描述之方法及裝備產生經塗佈之電線。As described above with respect to Figures 1a and 1b, the coated wire was extruded through a clean extrusion die until mold deposits were visible around the die opening and began to adversely affect the quality of the extruded product. Such adverse effects on the quality of the extruded product included visible marks and defects in the surface of the extruded product. The time elapsed from the start of extrusion until the moment when mold deposits formed that caused quality defects as described above was recorded and provided in Table 5 for different polymer materials. The coated wire was produced using the method and apparatus described below.
使用如上文所描述之擠出管線,用針對第二聚合物材料之第二加熱擠出機筒產生經塗佈之電線。所使用之擠出模具屬於圖1a中所示之類型,經組態用於「施壓」擠出製程,其中外層及內層之聚合物材料在模具內在電線上形成護套,其中外層在產物離開時接觸模具且內層接觸產物中之電線。使表4中指出之聚合物材料擠出通過如先前所描述且如圖式中所示之第一通道101及第二通道102,以分別在電線上形成該等外層及內層。
具有與模具接觸之未經填充之PEEK的外層及經PEEK加滑石填充之內層之實施例5.2,在與具有PEEK加填充物之兩層之實施例5.1相比時,展示出模垢之顯著改善。Example 5.2, which has an outer layer of unfilled PEEK in contact with the mold and an inner layer of PEEK plus talc filled, shows a significant improvement in mold deposits when compared to Example 5.1, which has two layers of PEEK plus filler.
相較於類似的經填充之PEEK材料,具有在離開擠出模具時接觸該模具之表面的PEEK/PEDEK共聚物之外層的實施例5.3可顯著增加直至產生模垢且開始不利地影響擠出產物之品質的時間。相較於使用經填充之PEEK材料作為外層,使用PEEK/PEDEK材料作為外層在顯著的模垢形成之前所經過之時間方面提供大致12倍的改善。Compared to similar filled PEEK materials, Example 5.3 having an outer layer of PEEK/PEDEK copolymer that contacts the surface of the extrusion die upon exiting the extrusion die can significantly increase the time until mold deposits form and begin to adversely affect the quality of the extruded product. Compared to using a filled PEEK material as the outer layer, using a PEEK/PEDEK material as the outer layer provides approximately a 12-fold improvement in the time that elapses before significant mold deposits form.
有利地,用於形成包含未經填充之PAEK或替代地PEEK/PEDEK之外層的產物的擠出製程可在需要停止製程且清潔擠出裝備之前持續更長的一段時間,此可提供更高效的生產製程。另外,該製程可在通常會加劇模垢的較高輸出或線速度下運行。因此,除了產物品質以外,生產率亦得以改善。因此可形成此類具有包含PEEK聚合物及填充物材料之內層的擠出產物,而該聚合物及填充物材料不會形成過多模垢而不利地影響製程及產物。Advantageously, an extrusion process for forming a product comprising an outer layer of unfilled PAEK or alternatively PEEK/PEDEK can be continued for a longer period of time before the process needs to be stopped and the extrusion equipment cleaned, which can provide a more efficient production process. In addition, the process can be run at higher outputs or line speeds that would normally exacerbate mold deposits. Thus, in addition to product quality, productivity is also improved. Such extruded products having an inner layer comprising a PEEK polymer and a filler material can thus be formed without the polymer and filler material forming excessive mold deposits that would adversely affect the process and product.
儘管已展示及描述幾個較佳具體實例,但所屬技術領域中具有通常知識者應瞭解,可在不脫離本發明之範圍的情況下進行各種改變及修改,如所附申請專利範圍中所定義。While several preferred embodiments have been shown and described, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention, as defined in the appended claims.
貫穿本說明書,術語「包含(comprising)」或「包含(comprises)」意謂包括所指定之組分,但不應排除其他組分之存在。術語「基本上由……組成(consisting essentially of)」或「基本上由……組成(consists essentially of)」意謂包括所指定之組分,但排除其他組分,惟表現為雜質之材料、由於用以提供該等組分之製程而存在之不可避免的材料及為了除實現本發明之技術效果以外之目的而添加之組分除外。典型地,當提及組成物時,基本上由一組組分組成之組成物將包含小於5重量%,典型地小於3重量%,更典型地小於1重量%之非指定組分。術語「由……組成(consisting of)」或「由……組成(consists of)」意謂包括所指定之組分,但排除其他組分之添加。在適當情況下,視情形而定,使用術語「包含(comprises)」或「包含(comprising)」亦可視為涵蓋或包括含義「基本上由……組成(consists essentially of)」或「基本上由……組成(consisting essentially of)」,且亦可視為包括含義「由……組成(consists of)」或「由……組成(consisting of)」。為避免疑問,其中組成物中之組分的量以wt%描述,此意謂指定組分相對於所提及之整個組成物的重量百分比。舉例而言,「聚合物材料(A)提供外層之70至100 wt%」意謂70至100 wt%之外層由聚合物材料(A)提供。本文所闡述之視情況選用之特徵可個別地使用或在適當時彼此組合使用,且尤其以隨附申請專利範圍中所闡述之組合使用。如本文所闡述之本發明之各態樣或例示性具體實例的視情況選用之特徵亦應理解為在適當時適用於本發明之任何其他態樣或例示性具體實例。換言之,閱讀本說明書之所屬技術領域中具有通常知識者應將本發明之各例示性具體實例的視情況選用之特徵視為在不同例示性具體實例之間為可互換及可組合的。Throughout this specification, the term "comprising" or "comprises" means including the specified components, but should not exclude the presence of other components. The term "consisting essentially of" or "consists essentially of" means including the specified components, but excluding other components, except for materials that appear as impurities, unavoidable materials that exist due to the process used to provide the components, and components added for purposes other than achieving the technical effects of the present invention. Typically, when referring to a composition, a composition consisting essentially of a group of components will contain less than 5% by weight, typically less than 3% by weight, and more typically less than 1% by weight of non-specified components. The term "consisting of" or "consists of" means including the specified components, but excluding the addition of other components. Where appropriate, the use of the term "comprises" or "comprising" may also be regarded as covering or including the meaning "consists essentially of" or "consisting essentially of", and may also be regarded as including the meaning "consists of" or "consisting of", as the case may be. For the avoidance of doubt, where the amount of a component in a composition is described in wt%, this means the weight percentage of the specified component relative to the entire composition referred to. For example, "polymer material (A) provides 70 to 100 wt% of the outer layer" means that 70 to 100 wt% of the outer layer is provided by polymer material (A). The optional features described herein may be used individually or in combination with each other when appropriate, and in particular in the combinations described in the accompanying claims. The optional features of each aspect or exemplary embodiment of the invention as described herein should also be understood to be applicable to any other aspect or exemplary embodiment of the invention when appropriate. In other words, a person with ordinary knowledge in the art to which this specification belongs should regard the optional features of each exemplary embodiment of the invention as interchangeable and combinable between different exemplary embodiments.
應注意,與本申請案有關之本說明書同時或在此之前申請且以本說明書對公眾檢閱開放之所有文本及文獻,以及所有此類文本及文獻之內容均以引用之方式併入本文中。It should be noted that all texts and documents related to this application that were filed simultaneously with or before this specification and that are open to public inspection with this specification, and the contents of all such texts and documents are incorporated herein by reference.
本說明書(包括任何隨附申請專利範圍及圖式)中所揭示之所有特徵及/或如此揭示之任何方法或製程之所有步驟可以任何組合形式組合,惟此類特徵及/或步驟中之至少一些相互排斥之組合除外。All features disclosed in this specification (including any accompanying claims and drawings) and/or all steps of any method or process so disclosed may be combined in any combination, except combinations of at least some of such features and/or steps that are mutually exclusive.
除非另外明確說明,否則本說明書(包括任何隨附申請專利範圍及圖式)中所揭示之各特徵可經實現相同、等效或類似目的之替代特徵替換。因此,除非另外明確說明,否則所揭示各特徵僅為一系列通用等效或類似特徵之一個實例。Unless expressly stated otherwise, each feature disclosed in this specification (including any accompanying claims and drawings) may be replaced by alternative features that achieve the same, equivalent or similar purpose. Therefore, unless expressly stated otherwise, each feature disclosed is only one example of a generic series of equivalent or similar features.
本發明不限於前述具體實例之細節。本發明延伸至本說明書(包括任何隨附申請專利範圍及圖式)中所揭示之特徵之任何新穎特徵或任何新穎組合,或延伸至如此揭示之任何方法或製程之步驟的任何新穎步驟或任何新穎組合。The present invention is not limited to the details of the foregoing specific examples. The present invention extends to any novel feature or any novel combination of features disclosed in this specification (including any accompanying patent application scope and drawings), or to any novel step or any novel combination of steps of any method or process so disclosed.
1:模具體 2:模具心軸 3:電線/銷釘 100:壓力擠出模具 101:第一通道 102:第二通道 103:電線 110:模具出口 111:模具入口 120:擠出絕緣導體總成 122:第一位置 124:第二位置 126:擠出的第一護套 128:擠出的第二護套 200:擠出模具 201:第一通道 202:第二通道 203:電線 210:模具出口 226:擠出護套 228:擠出護套 233:第三通道 236:擠出護套 300:模具/模具體 301:第一通道/第一層 302:第二通道/第二層 303:電線/電纜/通道 304:通道 310:模具出口 311:第一外層 312:內層 313:通道/第三層/第二外層 400:擠出模具 401:第一通道 402:第二通道 403:第三通道 404:第四通道 410:模具出口 411:第一外層 412:內層 413:第二外層 414:中空中心/中空內層 500:擠出設備 501:第一通道 502:第二通道 503:第三通道 510:模具出口 511:第一外層 512:第二外層 513:內層 600:模具 601:第一通道 602:第二通道 610:模具出口 611:外層 612:內層/芯 A:聚合物材料/第一外層/第二外層/第1外層/第2外層/外層 B:聚合物材料/內層 C:聚合物材料 1: Mold body 2: Mold mandrel 3: Wire/pin 100: Pressure extrusion mold 101: First channel 102: Second channel 103: Wire 110: Mold outlet 111: Mold inlet 120: Extruded insulating conductor assembly 122: First position 124: Second position 126: Extruded first sheath 128: Extruded second sheath 200: Extrusion mold 201: First channel 202: Second channel 203: Wire 210: Mold outlet 226: Extruded sheath 228: Extruded sheath 233: Third channel 236: Extruded sheath 300: Mold/mold body 301: First channel/first layer 302: Second channel/second layer 303: Wire/cable/channel 304: Channel 310: Mold outlet 311: First outer layer 312: Inner layer 313: Channel/third layer/second outer layer 400: Extrusion mold 401: First channel 402: Second channel 403: Third channel 404: Fourth channel 410: Mold outlet 411: First outer layer 412: Inner layer 413: Second outer layer 414: Hollow center/hollow inner layer 500: Extrusion equipment 501: First channel 502: Second channel 503: Third channel 510: Mold outlet 511: First outer layer 512: Second outer layer 513: Inner layer 600: Mold 601: First channel 602: Second channel 610: Mold outlet 611: Outer layer 612: Inner layer/core A: Polymer material/First outer layer/Second outer layer/First outer layer/Second outer layer/Outer layer B: Polymer material/Inner layer C: Polymer material
為了更好地理解本發明,且為了展示如何實施例示性具體實例,現將參考隨附圖式,其中: [圖1a]為擠出模具之示意圖,該模具用於製造本發明之絕緣導體總成; [圖1b]為藉由圖1a之擠出製程產生的絕緣導體總成的示意性橫截面; [圖2a]為替代性擠出模具之示意圖,該模具用於製造本發明之絕緣導體總成; [圖2b]為藉由圖2a的擠出製程產生的絕緣導體總成之替代具體實例的示意性橫截面; [圖3a]為擠出模具之示意圖,該模具用於製造本發明之絕緣導體總成; [圖3b]為藉由圖3a之擠出製程產生的絕緣導體總成的示意性橫截面; [圖4a]為擠出模具之示意圖,該模具用於使用根據本發明之第二態樣之方法產生呈管形式的本發明之一具體實例之擠出產物; [圖4b]為藉由圖4a之擠出製程產生之擠出管的橫截面; [圖5a]為擠出模具之示意圖,該模具用於使用根據本發明之一態樣的方法產生呈膜形式的本發明之一替代態樣之擠出產物; [圖5b]為藉由圖5a之擠出製程產生的擠出膜之橫截面; [圖6a]為擠出模具之示意圖,該模具用於使用根據本發明之一態樣之方法產生呈長絲形式的根據本發明之一態樣之擠出產物;及 [圖6b]為藉由圖6a之擠出製程產生之擠出長絲的橫截面。 In order to better understand the present invention and to show how to implement the exemplary specific examples, reference will now be made to the accompanying drawings, in which: [Figure 1a] is a schematic diagram of an extrusion die, which is used to manufacture the insulating conductor assembly of the present invention; [Figure 1b] is a schematic cross-section of the insulating conductor assembly produced by the extrusion process of Figure 1a; [Figure 2a] is a schematic diagram of an alternative extrusion die, which is used to manufacture the insulating conductor assembly of the present invention; [Figure 2b] is a schematic cross-section of an alternative specific example of the insulating conductor assembly produced by the extrusion process of Figure 2a; [Figure 3a] is a schematic diagram of an extrusion die, which is used to manufacture the insulating conductor assembly of the present invention; [Figure 3b] is a schematic cross-section of an insulating conductor assembly produced by the extrusion process of Figure 3a; [Figure 4a] is a schematic diagram of an extrusion die, which is used to produce an extruded product of a specific embodiment of the present invention in the form of a tube using a method according to the second aspect of the present invention; [Figure 4b] is a cross-section of an extruded tube produced by the extrusion process of Figure 4a; [Figure 5a] is a schematic diagram of an extrusion die, which is used to produce an extruded product of an alternative aspect of the present invention in the form of a film using a method according to one aspect of the present invention; [Figure 5b] is a cross-section of an extruded film produced by the extrusion process of Figure 5a; [Figure 6a] is a schematic diagram of an extrusion die for producing an extruded product in the form of a filament according to one aspect of the present invention using a method according to one aspect of the present invention; and [Figure 6b] is a cross-section of an extruded filament produced by the extrusion process of Figure 6a.
1:模具體 1: Mold body
2:模具心軸 2: Mold spindle
100:壓力擠出模具 100: Pressure extrusion mold
101:第一通道 101: First channel
102:第二通道 102: Second channel
103:電線 103: Wires
110:模具出口 110: Mould export
111:模具入口 111: Mold entrance
122:第一位置 122: First position
124:第二位置 124: Second position
126:擠出的第一護套 126: Extruded first sheath
128:擠出的第二護套 128: Extruded second sheath
A:聚合物材料 A:Polymer materials
B:聚合物材料 B: Polymer materials
Claims (26)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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GBGB2216867.8 | 2022-11-11 |
Publications (1)
Publication Number | Publication Date |
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TW202436443A true TW202436443A (en) | 2024-09-16 |
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