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TW202426903A - Apparatus and method for inspecting surface defect - Google Patents

Apparatus and method for inspecting surface defect Download PDF

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TW202426903A
TW202426903A TW112147261A TW112147261A TW202426903A TW 202426903 A TW202426903 A TW 202426903A TW 112147261 A TW112147261 A TW 112147261A TW 112147261 A TW112147261 A TW 112147261A TW 202426903 A TW202426903 A TW 202426903A
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detection
laser
detection object
control device
conveyor
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趙光熙
黃來虎
金學術
尹元錫
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南韓商日進製鋼股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8812Diffuse illumination, e.g. "sky"
    • G01N2021/8816Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8841Illumination and detection on two sides of object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/888Marking defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/061Sources
    • G01N2201/06113Coherent sources; lasers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/10Scanning
    • G01N2201/104Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1042X, Y scan, i.e. object moving in X, beam in Y

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  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The present disclosure relates to an apparatus and method for inspecting a surface defect. The apparatus for inspecting a surface defect on an inspection object while the inspection object is being conveyed may include: a conveyor configured to provide an inspection object to a conveyor roller; a laser inspection section configured to generate an electrical signal indicating a surface condition of the inspection object by emitting a laser to at least one surface of the inspection object and receiving reflected waves while the inspection object is conveyed in a longitudinal direction on the conveyor roller and passes through an inspection region; and a control device configured to analyze the electrical signal indicating the surface condition of the inspection object and determine whether the inspection object is suitable or unsuitable.

Description

用於檢測表面缺陷之設備及方法Apparatus and method for detecting surface defects

[相關申請案之交互參照][Cross-reference to related applications]

本申請基於2022年12月22日向韓國智慧財產局提交的韓國專利申請No.10-2022-0181926,其公開內容透過引用整體併入本文。This application is based on Korean Patent Application No.10-2022-0181926 filed with the Korean Intellectual Property Office on December 22, 2022, the disclosure of which is incorporated herein by reference in its entirety.

本發明係關於一種用於檢測表面缺陷之設備及方法。具體而言,本揭露係關於一種用於自動地檢測待檢測物體的表面缺陷的設備及方法,諸如線性運動導軌的抽製材料(drawn material)。The present invention relates to an apparatus and method for detecting surface defects. Specifically, the present invention relates to an apparatus and method for automatically detecting surface defects of an object to be detected, such as a drawn material of a linear motion guide.

利用習知表面缺陷檢測方法,可能透過渦電流檢測、超音波檢測、及類似者自具有簡單截面形狀(諸如管或圓桿)的物體偵測表面缺陷。在渦電流檢測中,當待檢測物體具有形狀時,必須製造渦電流檢測線圈以適用於各桿之形狀,且甚至在線圈自檢測表面偏離某一距離時的此一情況下,頻道之數目增加且諸如隅角的部分無法被檢測。在超音波檢測的情況下,探針必須取決於待檢測形狀桿的形狀而製造且置換,且因為必須存在介質(諸如水),故僅在介質與待檢測形狀桿的整個形狀接觸時達成檢測的可靠性。因此,存在施用並執行超音波檢測十分昂貴且困難的問題。With known surface defect detection methods, it is possible to detect surface defects from an object having a simple cross-sectional shape such as a tube or a round rod by eddy current detection, ultrasonic detection, and the like. In eddy current detection, when the object to be detected has a shape, the eddy current detection coil must be manufactured to be suitable for the shape of each rod, and even in this case when the coil is offset from the detection surface by a certain distance, the number of channels increases and portions such as corners cannot be detected. In the case of ultrasonic detection, the probe must be manufactured and replaced depending on the shape of the rod of the shape to be detected, and because a medium such as water must be present, detection reliability is achieved only when the medium is in contact with the entire shape of the rod of the shape to be detected. Therefore, there is a problem that it is very expensive and difficult to administer and perform ultrasound testing.

在待檢測物體具有形狀的情況下,可施用習知磁性粒子檢測方法。然而,即使在磁性粒子檢測的情況下,必須藉由將介質與待檢測物體接觸且使電流流過物體而偵測缺陷,且需要額外程序(諸如使用肉眼或視覺攝影機的檢測)。In the case where the object to be inspected has a shape, a known magnetic particle inspection method can be applied. However, even in the case of magnetic particle inspection, defects must be detected by bringing a medium into contact with the object to be inspected and passing a current through the object, and an additional process (such as inspection using the naked eye or a visual camera) is required.

用於檢測形狀桿之表面缺陷的另一習知方法係將視覺攝影機配置為具有多個頻道,且在具有連續且恆定圖案的表面上發生缺陷(諸如刮痕)時自動地偵測。然而,在此方法中,取決於照射待檢測物體之光的距離或角度的表面亮度差可能被辨識為缺陷,或表面上的污漬或外來物質可能被辨識為缺陷。此外,由於需要額外地提供針對各種類型的缺陷組態之程式的學習函數,因此在程式中未辨識的缺陷類型可能無法被準確地辨識。另外,不同於如在渦電流檢測或超音波檢測中限制缺陷之大小並當待檢測物體中的缺陷超過某一限制時被排除為不合適之該待檢測物體的系統,在使用視覺攝影機之情況下,由於無法自動地測量缺陷之大小或測量受到限制,因此存在必須額外檢查缺陷之大小的不便性。Another learning method for detecting surface defects of shape bars is to configure a visual camera to have multiple channels and automatically detect when a defect (such as a scratch) occurs on a surface having a continuous and constant pattern. However, in this method, a surface brightness difference depending on the distance or angle of light irradiating the object to be inspected may be identified as a defect, or stains or foreign matter on the surface may be identified as a defect. In addition, since a learning function for a program configured for various types of defects needs to be additionally provided, a defect type not identified in the program may not be accurately identified. In addition, unlike a system in which the size of a defect is limited as in eddy current testing or ultrasonic testing and a defect in an object to be tested that exceeds a certain limit is excluded as an unsuitable object to be tested, in the case of using a visual camera, since the size of a defect cannot be automatically measured or the measurement is limited, there is the inconvenience of having to additionally check the size of the defect.

此外,當執行待檢測物體之目視檢測時,多個檢測操作員手動地旋轉作為待檢測物體的形狀材料,且藉由使用光及放大鏡來檢測形狀材料之表面或邊緣。在此情況下,缺陷偵測能力及檢測時間取決於操作員之條件及技術程度而變化,且存在缺陷將被忽視而未被準確地辨識的高度可能性。Furthermore, when performing visual inspection of an object to be inspected, multiple inspection operators manually rotate a shape material as the object to be inspected, and inspect the surface or edge of the shape material by using light and a magnifying glass. In this case, the defect detection capability and inspection time vary depending on the condition and skill level of the operator, and there is a high possibility that defects will be overlooked and not accurately identified.

線性運動導軌(其用作為用於在半導體、顯示器、及智慧型手機製造過程中之自動化產線及自動機器工具之工具輸送的導軌)應以高精確度導引待輸送之組件及儀器。因此,在線性運動導軌中,尺寸準確度係重要的,且不允許表面缺陷,因為缺陷會干擾所輸送之組件或儀器的精確輸送。Linear motion guides, which are used as guides for tool transport in automated production lines and automatic machine tools in the semiconductor, display, and smartphone manufacturing processes, should guide the components and instruments to be transported with high precision. Therefore, in linear motion guides, dimensional accuracy is important, and surface defects are not allowed because they interfere with the precise transport of the components or instruments being transported.

本發明揭露提供一種用於自動地且準確地檢測待檢測物體(其可稱為「檢測物體(inspection object)」)的表面缺陷的設備及方法,諸如線性運動導軌的抽製材料。The present invention discloses an apparatus and method for automatically and accurately inspecting surface defects of an object to be inspected (which may be referred to as an "inspection object"), such as a drawing material of a linear motion guide.

首先,本發明揭露之特徵可概述如下。鑒於前文,根據本發明揭露之一態樣,一種用於在一檢測物體正被輸送的同時檢測該檢測物體之一表面缺陷的表面缺陷檢測設備可包括:一輸送器,其被配置為將一檢測物體提供至一輸送器輥;一雷射檢測區段,其被配置為藉由以下方式產生指示該檢測物體之一表面狀況的一電信號:在該檢測物體係在一縱向方向上於該輸送器輥上輸送並通過一檢測區域的同時,將一雷射發射至該檢測物體之至少一個表面並接收反射波;及一控制裝置,其被配置為分析指示該檢測物體之該表面狀況的該電信號,並判定該檢測物體為合適或不合適。First, the features disclosed in the present invention can be summarized as follows. In view of the foregoing, according to one aspect disclosed in the present invention, a surface defect detection device for detecting a surface defect of a detection object while the detection object is being transported may include: a conveyor, which is configured to provide a detection object to a conveyor roller; a laser detection section, which is configured to generate an electrical signal indicating a surface condition of the detection object by: while the detection object is being transported on the conveyor roller in a longitudinal direction and passing through a detection area, a laser is emitted to at least one surface of the detection object and a reflected wave is received; and a control device, which is configured to analyze the electrical signal indicating the surface condition of the detection object and determine whether the detection object is suitable or unsuitable.

該檢測區域之該檢測的該輸送器輥可包括:一垂直導輥,其被配置為在該控制裝置的該控制下執行該檢測物體之垂直對準導引的垂直移動;及一水平導輥,其被配置為在該控制裝置的該控制下執行該檢測物體之水平對準導引的水平移動。The conveyor roller for the detection of the detection area may include: a vertical guide roller, which is configured to perform vertical movement of the vertical alignment guide of the detection object under the control of the control device; and a horizontal guide roller, which is configured to perform horizontal movement of the horizontal alignment guide of the detection object under the control of the control device.

至少一對垂直導輥及至少一對水平導輥可在該檢測區域之該定位之前及之後配置。At least one pair of vertical guide rollers and at least one pair of horizontal guide rollers may be arranged before and after the positioning of the detection area.

該表面缺陷檢測設備可包括一刷及一鼓風機,其在一輸送方向上依序配置在該雷射檢測區段之該前端處,以在該控制裝置的該控制下自該檢測物體之該表面移除外來物質。The surface defect inspection apparatus may include a brush and a blower, which are sequentially arranged at the front end of the laser inspection section in a conveying direction to remove foreign matter from the surface of the inspection object under the control of the control device.

該表面缺陷檢測設備可包括一第一標示器,其被配置為在該檢測物體藉由該輸送器放置於該輸送器輥上時,在該控制裝置的該控制下將一檢測識別符號標記在該檢測物體上。The surface defect inspection apparatus may include a first marker configured to mark an inspection identification symbol on the inspection object under the control of the control device when the inspection object is placed on the conveyor roller by the conveyor.

該表面缺陷檢測設備可包括一第二標示器,其配置在該雷射檢測區段之該後端處,且被配置為在該控制裝置的該控制下將一缺陷位置標記在該檢測物體上。The surface defect inspection apparatus may include a second marker disposed at the rear end of the laser inspection section and configured to mark a defect position on the inspection object under the control of the control device.

該控制裝置可被配置為計算該檢測物體之該表面狀況中之一缺陷的一大小,並將所計算的該大小提供至一顯示裝置。The control device may be configured to calculate a size of a defect in the surface condition of the inspection object and provide the calculated size to a display device.

該表面缺陷檢測設備可進一步包括一物體裝載器,其被配置為裝載複數個檢測物體,其中該控制裝置被配置為控制該物體裝載器以將該複數個檢測物體一個接著一個提供至該輸送器,且控制該輸送器以將由該輸送器接收的該等檢測物體放置於該輸送器輥上。The surface defect detection equipment may further include an object carrier, which is configured to load a plurality of detection objects, wherein the control device is configured to control the object carrier to provide the plurality of detection objects one by one to the conveyor, and control the conveyor to place the detection objects received by the conveyor on the conveyor roller.

該表面缺陷檢測設備可包括:一合適物體裝載器,其被配置為裝載經判定為合適的檢測物體;及一不合適物體裝載器,其被配置為裝載經判定為不合適的檢測物體,其中該控制裝置被配置為:控制該第二輸送器以輸送並將經判定為合適的該等檢測物體一個接著一個裝載至該合適物體裝載器上;且控制該第二輸送器以輸送並將經判定為不合適的該等檢測物體一個接著一個裝載至該不合適物體裝載器上。The surface defect detection equipment may include: a suitable object carrier, which is configured to load the detection objects determined to be suitable; and an unsuitable object carrier, which is configured to load the detection objects determined to be unsuitable, wherein the control device is configured to: control the second conveyor to transport and load the detection objects determined to be suitable one by one onto the suitable object carrier; and control the second conveyor to transport and load the detection objects determined to be unsuitable one by one onto the unsuitable object carrier.

該雷射檢測區段可包括複數個雷射感測器,其之各者包括一雷射發射器及一雷射接收器且被配置為產生該電信號,其中該等雷射感測器可包括:上雷射感測器及下雷射感測器,其被配置為以分別偵測該檢測物體之頂部表面及底部表面的表面狀況;及一或多個側表面雷射感測器,其被配置為偵測一或多個倒角表面、平坦表面、或在兩個平坦表面之間的一傾斜表面的一表面狀況,其中該等倒角表面、該等平坦表面、及該傾斜表面係形成在該檢測物體之該頂部表面與該底部表面之間。The laser detection section may include a plurality of laser sensors, each of which includes a laser transmitter and a laser receiver and is configured to generate the electrical signal, wherein the laser sensors may include: an upper laser sensor and a lower laser sensor, which are configured to respectively detect the surface conditions of the top surface and the bottom surface of the detection object; and one or more side surface laser sensors, which are configured to detect a surface condition of one or more chamfered surfaces, flat surfaces, or an inclined surface between two flat surfaces, wherein the chamfered surfaces, the flat surfaces, and the inclined surface are formed between the top surface and the bottom surface of the detection object.

該等側雷射感測器中之至少一者係相對於該檢測物體之該縱向方向設置在該左側及該右側之各者上。At least one of the side laser sensors is disposed on each of the left side and the right side relative to the longitudinal direction of the detection object.

該等側雷射感測器可包括:一第一雷射感測器,其被配置為偵測包括該檢測物體之一上倒角表面的一區域的一表面狀況;一第二雷射感測器,其被配置為偵測包括該檢測物體之一下倒角表面的一區域的一表面狀況;及一第三雷射感測器,其被配置為偵測在該上倒角表面與該下倒角表面之間存在之延伸平坦表面、凹平坦表面、及傾斜表面的一表面狀況,其中該等延伸平坦表面自該等倒角表面分別延伸,且該等傾斜表面係提供在該等延伸表面與該等凹平坦表面之間。The side laser sensors may include: a first laser sensor configured to detect a surface condition of a region including an upper chamfered surface of the detection object; a second laser sensor configured to detect a surface condition of a region including a lower chamfered surface of the detection object; and a third laser sensor configured to detect a surface condition of an extended flat surface, a concave flat surface, and an inclined surface existing between the upper chamfered surface and the lower chamfered surface, wherein the extended flat surfaces extend from the chamfered surfaces respectively, and the inclined surfaces are provided between the extended surfaces and the concave flat surfaces.

根據本發明揭露之另一態樣,一種用於藉由一控制裝置檢測一表面缺陷的表面缺陷檢測方法,該控制裝置在該檢測物體正被輸送的同時控制檢測一檢測物體的一表面缺陷檢測設備,該表面缺陷檢測方法可包括以下步驟:在該控制裝置的該控制下,將該檢測物體在一縱向方向上於一輸送器輥上輸送;在該控制裝置的該控制下,透過在該檢測物體正通過一檢測區域的同時將一雷射發射至該檢測物體之至少一個表面並接收反射波,而產生指示該檢測物體之一表面狀況的一電信號;且在該控制裝置之該控制下,藉由分析指示該檢測物體之該表面狀態的該電信號而判定該檢測物體為合適或不合適。According to another aspect disclosed in the present invention, a surface defect detection method for detecting a surface defect by a control device, wherein the control device controls a surface defect detection equipment for detecting a detection object while the detection object is being transported. The surface defect detection method may include the following steps: under the control of the control device, the detection object is transported on a conveyor roller in a longitudinal direction; under the control of the control device, an electrical signal indicating a surface condition of the detection object is generated by emitting a laser to at least one surface of the detection object and receiving a reflected wave while the detection object is passing through a detection area; and under the control of the control device, the detection object is determined to be suitable or unsuitable by analyzing the electrical signal indicating the surface condition of the detection object.

在產生該電信號之該步驟中,使用複數個雷射感測器,其之各者包括一雷射發射器及一雷射接收器以產生該電信號,其中該複數個雷射感測器可包括:上雷射感測器及下雷射感測器,其被配置為分別偵測該檢測物體之頂部表面及底部表面的表面狀況;及一或多個側表面雷射感測器,其被配置為偵測一或多個倒角表面、平坦表面、或在兩個平坦表面之間的一傾斜表面的一表面狀況,其中該等倒角表面、該等平坦表面、及該傾斜表面係形成在該檢測物體之該頂部表面與該底部表面之間。In the step of generating the electrical signal, a plurality of laser sensors are used, each of which includes a laser transmitter and a laser receiver to generate the electrical signal, wherein the plurality of laser sensors may include: an upper laser sensor and a lower laser sensor, which are configured to detect the surface conditions of the top surface and the bottom surface of the detection object, respectively; and one or more side surface laser sensors, which are configured to detect a surface condition of one or more chamfered surfaces, flat surfaces, or an inclined surface between two flat surfaces, wherein the chamfered surfaces, the flat surfaces, and the inclined surface are formed between the top surface and the bottom surface of the detection object.

利用根據本揭露之表面缺陷檢測設備及方法,該設備係組態成多個頻道以包括對應於各別成形表面的雷射測量感測器,以檢測該檢測物體之表面上的缺陷,且能夠在將該檢測物體輸送至如上文所述地組態的雷射測量感測器的同時自動地檢測該等表面缺陷並測量該等缺陷的大小。具體而言,本揭露之表面缺陷檢測方法可輕易地偵測表面缺陷,即便在截面上不具有簡單形狀的抽製材料或類似者上亦然,諸如在一設施(諸如自動化產線或機器工具)中促進線性往復運動的線性運動導軌。By using the surface defect detection apparatus and method according to the present disclosure, the apparatus is configured into multiple channels to include laser measurement sensors corresponding to respective formed surfaces to detect defects on the surface of the detection object, and is capable of automatically detecting the surface defects and measuring the size of the defects while the detection object is transported to the laser measurement sensors configured as described above. Specifically, the surface defect detection method of the present disclosure can easily detect surface defects even on drawn materials or the like that do not have a simple shape in cross section, such as a linear motion guide that promotes linear reciprocating motion in a facility such as an automated production line or a machine tool.

亦即,例如,當在抽製、熱處理、及校正程序之後在一線性運動導軌之一抽製形狀材料(drawn shape material)的最終表面上檢測缺陷時,取代操作員對各成形表面的視覺檢測,而施用一雷射測量方法以偵測表面缺陷,使得不論表面之形狀或狀況如何皆可自動地測量該等缺陷之位置及大小、可作出關於該抽製形狀材料為合適或不合適的決策、且可將該抽製形狀材料分離並排出。That is, for example, when defects are detected on the final surface of a drawn shape material on a linear motion guide after drawing, heat treatment, and calibration procedures, a laser measurement method is used to detect surface defects instead of an operator's visual inspection of each formed surface, so that the location and size of the defects can be automatically measured regardless of the shape or condition of the surface, a decision can be made as to whether the drawn shape material is suitable or unsuitable, and the drawn shape material can be separated and discharged.

利用根據本揭露之表面缺陷檢測設備及方法,可行的是藉由施用使用雷射測量之自動檢測方法而防止操作員錯誤,以藉由連接在該抽製形狀材料的該抽製之前及之後的程序而在抽製之後實現中間測量,且實現用於遠端控制及檢測的線上控制,從而促進改良生產率。Utilizing the surface defect detection apparatus and method according to the present disclosure, it is possible to prevent operator errors by applying an automatic detection method using laser measurement, to achieve intermediate measurement after drawing by connecting to the processes before and after the drawing of the drawn shaped material, and to achieve online control for remote control and detection, thereby promoting improved productivity.

在下文中,將參照隨附圖式詳細描述本揭露。在本文中,若可能,各圖式中之類似組件係由類似元件符號所表示。此外,將省略已知之功能及/或組態之詳細描述。在下列描述中,將主要描述理解根據各種實施例之操作的必要組件,並將省略可能混淆本說明書要義的元件描述。此外,圖式中之一些元件可經誇大、省略、或示意地繪示。各組件的大小並未完全反映實際大小,且因此本文所提供之描述不受圖式各者中所繪製之組件的相對大小或間距所限。Hereinafter, the disclosure will be described in detail with reference to the accompanying drawings. In this article, similar components in each figure are represented by similar element symbols, if possible. In addition, the detailed description of known functions and/or configurations will be omitted. In the following description, the necessary components for understanding the operation according to various embodiments will be mainly described, and the description of components that may confuse the essence of this specification will be omitted. In addition, some components in the drawings may be exaggerated, omitted, or schematically drawn. The size of each component does not fully reflect the actual size, and therefore the description provided herein is not limited by the relative size or spacing of the components drawn in each of the drawings.

當描述本揭露的實施例時,當判定與本揭露有關之已知技術的詳細描述可能不必要地使本揭露之標的隱晦不明時,將省略該詳細描述。此外,稍後描述之用語係在考量本發明中之功能的情況下定義,且可根據使用者或操作員之意圖、習慣、或類似者而變化。因此,應基於本說明書通篇的描述作出用語之定義。在詳細描述中所使用的用語僅用於描述本發明之實施例,且不應視為限制性的。除非另外明確使用,否則表述之單數形式包括表述之複數形式的含義。在此說明書中,諸如「包括(including)」或「包含(comprising)」之表述係意欲指示任何特徵、數字、步驟、操作、元件、或其等之一些或組合,且不應解釋為排除一或多個其他特徵、數字、步驟、操作、元件、或其等之一些或組合的存在或可能性。When describing the embodiments of the present disclosure, when it is determined that a detailed description of known technologies related to the present disclosure may unnecessarily obscure the subject matter of the present disclosure, the detailed description will be omitted. In addition, the terms described later are defined in consideration of the functions in the present invention and may vary according to the intention, habit, or the like of the user or operator. Therefore, the definition of the terms should be made based on the description throughout this specification. The terms used in the detailed description are only used to describe the embodiments of the present invention and should not be regarded as limiting. Unless otherwise expressly used, the singular form of the expression includes the meaning of the plural form of the expression. In this specification, expressions such as “including” or “comprising” are intended to indicate any features, numbers, steps, operations, elements, or some or combinations thereof, and should not be interpreted as excluding the existence or possibility of one or more other features, numbers, steps, operations, elements, or some or combinations thereof.

此外,諸如「第一(first)」及「第二(second)」之用語可用以描述各種組件,但組件不受用語限制,且此等用語僅用於區分一個組件與另一組件之目的。In addition, terms such as “first” and “second” may be used to describe various components, but the components are not limited by the terms and these terms are used only for the purpose of distinguishing one component from another.

圖1係根據本發明之一實施例的表面缺陷檢測裝置100的示意平面圖。FIG. 1 is a schematic plan view of a surface defect detection device 100 according to an embodiment of the present invention.

參照圖1,根據本發明之一實施例,用於在輸送期間檢測檢測物體1的表面缺陷檢測裝置100包括:物體裝載器3、3-1、31、32、33;輸送器4;刷7;鼓風機8;雷射檢測區段12;第一標示器6;第二標示器13;輸送器14;合適物體裝載器15、15-1;不合適物體裝載器16、16-1;及控制裝置50。1 , according to one embodiment of the present invention, a surface defect detection device 100 for detecting a detection object 1 during transportation includes: object carriers 3, 3-1, 31, 32, 33; a conveyor 4; a brush 7; a blower 8; a laser detection section 12; a first marker 6; a second marker 13; a conveyor 14; suitable object carriers 15, 15-1; unsuitable object carriers 16, 16-1; and a control device 50.

控制裝置50作為硬體(諸如半導體處理器)來操作、作為軟體(諸如應用程式)來操作、或其組合,以執行上述組件的整體控制。控制裝置50可包括一顯示裝置(未繪示),其用於在表面缺陷檢測裝置100在檢測物體1上執行表面缺陷檢測的同時顯示上述組件的整體操作程序;且可包括記憶體(未繪示),其用於在執行表面缺陷檢測的同時儲存關於檢測進程的資訊、及檢測物體1的結果,並在稍後時間回應於使用者之查詢請求而提供對應資料。控制裝置50可係電腦裝置或個人電腦(personal computer, PC)。The control device 50 may be operated as hardware (such as a semiconductor processor), software (such as an application), or a combination thereof to perform overall control of the above components. The control device 50 may include a display device (not shown) for displaying the overall operation procedure of the above components while the surface defect detection device 100 performs surface defect detection on the detection object 1; and may include a memory (not shown) for storing information about the detection process and the results of the detection object 1 while performing surface defect detection, and providing corresponding data in response to a user's query request at a later time. The control device 50 may be a computer device or a personal computer (PC).

圖2繪示圖1中之檢測物體1之透視圖的實例。FIG. 2 shows an example of a perspective view of the detection object 1 in FIG. 1 .

參考圖2,待在根據本揭露之一實施例的表面缺陷檢測裝置100中經受表面缺陷檢測的檢測物體1可包括不具有簡單截面形狀的變體抽製材料(variant drawn material)、抽製材料、或類似者,諸如在一設施(諸如自動化產線或機床(machine tool))中促進筆直往復運動的線性運動導軌。檢測物體1可由鐵或非鐵金屬(包括合金鋼)製成,且可由可取決於目的而視為變體抽製材料或抽製材料的各種材料製成。2 , the inspection object 1 to be subjected to surface defect inspection in the surface defect inspection device 100 according to one embodiment of the present disclosure may include a variant drawn material, a drawn material, or the like that does not have a simple cross-sectional shape, such as a linear motion guide that promotes straight reciprocating motion in a facility such as an automated production line or a machine tool. The inspection object 1 may be made of iron or non-iron metal (including alloy steel), and may be made of various materials that may be considered as a variant drawn material or a drawn material depending on the purpose.

例如,如下文將參照圖4所述,檢測物體1可包括頂部表面d1、底部表面d2、及頂部表面d1與底部表面d2之間的側表面,且該等側表面可包括:一或多個倒角表面f1、g1、f2、及g2;平坦表面61、63、65、71、73、及75;或各自形成在兩個相鄰平坦表面之間的傾斜表面62、64、72、及74。在各別左側表面及右側表面中的平坦表面61、63、65、71、73、及75由於一或多個凹凸形狀而可包括一或多個平坦表面63及73;及自上倒角表面及下倒角表面f1、g1、f2、及g2在上倒角表面及下倒角表面f1、g1、f2、及g2之間延伸的一或多個平坦表面61、65、71、及75。在圖式中,頂部表面d1與底部表面d2之間的左側表面f1、e1、g1及右側表面f2、e2、g2彼此對稱,但不限於此。左側表面f1、e1、g1及右側表面f2、e2、g2可不對稱,且各側表面可包括諸如傾斜表面、平坦表面、及彎曲表面的形狀。For example, as will be described below with reference to FIG. 4 , the detection object 1 may include a top surface d1, a bottom surface d2, and side surfaces between the top surface d1 and the bottom surface d2, and the side surfaces may include: one or more chamfered surfaces f1, g1, f2, and g2; flat surfaces 61, 63, 65, 71, 73, and 75; or inclined surfaces 62, 64, 72, and 74 each formed between two adjacent flat surfaces. The flat surfaces 61, 63, 65, 71, 73, and 75 in the respective left and right side surfaces may include one or more flat surfaces 63 and 73 due to one or more concave-convex shapes; and one or more flat surfaces 61, 65, 71, and 75 extending between the upper chamfered surfaces f1, g1, f2, and g2 from the upper chamfered surfaces f1, g1, f2, and g2. In the drawings, the left side surfaces f1, e1, g1 and the right side surfaces f2, e2, and g2 between the top surface d1 and the bottom surface d2 are symmetrical to each other, but are not limited thereto. The left side surfaces f1, e1, g1 and the right side surfaces f2, e2, and g2 may be asymmetrical, and each side surface may include shapes such as an inclined surface, a flat surface, and a curved surface.

在根據本揭露之一實施例的表面缺陷檢測裝置100中,雷射檢測區段12包括雷射感測器,該等雷射感測器係組態成多個頻道以對應於各別成形表面以檢測檢測物體1的表面缺陷。以此方式組態的雷射感測器能夠在連續地輸送檢測物體1的同時,自動地檢測表面缺陷以及測量該等表面缺陷的大小。In the surface defect detection device 100 according to one embodiment of the present disclosure, the laser detection section 12 includes laser sensors configured into multiple channels corresponding to respective formed surfaces to detect surface defects of the detection object 1. The laser sensors configured in this way can automatically detect surface defects and measure the sizes of the surface defects while continuously transporting the detection object 1.

對於此目的,輸送器4可被配置為將檢測物體1提供至輸送器輥5。雷射檢測區段12可被配置為透過以下方式產生指示檢測物體1之表面狀況的電信號:在檢測物體1係在縱向方向上於輸送器輥5上輸送並通過檢測區域9的同時,將雷射發射至檢測物體1之至少一個表面並接收反射波。控制裝置50可被配置為藉由分析指示檢測物體1之表面狀況的電信號而判定檢測物體1為合適或不合適。輸送器輥5可包括以預定距離間隔配置在輸送路徑上的輥以在筆直方向上輸送檢測物體1。For this purpose, the conveyor 4 may be configured to provide the detection object 1 to the conveyor roller 5. The laser detection section 12 may be configured to generate an electrical signal indicating the surface condition of the detection object 1 by emitting a laser to at least one surface of the detection object 1 and receiving a reflected wave while the detection object 1 is being transported on the conveyor roller 5 in the longitudinal direction and passing through the detection area 9. The control device 50 may be configured to determine whether the detection object 1 is suitable or unsuitable by analyzing the electrical signal indicating the surface condition of the detection object 1. The conveyor roller 5 may include rollers arranged on a conveying path at predetermined distance intervals to transport the detection object 1 in a vertical direction.

首先,將描述經由輸送器4將檢測物體1從物體裝載器3、3-1、31、32、33放置至輸送器輥5上以便藉由根據本發明之一實施例的表面缺陷檢測裝置100檢測檢測物體1的程序。First, a procedure for placing the test object 1 from the object carrier 3, 3-1, 31, 32, 33 onto the conveyor roller 5 via the conveyor 4 so as to inspect the test object 1 by the surface defect inspection device 100 according to one embodiment of the present invention will be described.

圖3A至圖3D係繪示經由輸送器4將檢測物體1從圖1之物體裝載器3、3-1、31、32、33放置至輸送器輥5上的程序的視圖。3A to 3D are views showing a process of placing the test object 1 from the object carrier 3 , 3 - 1 , 31 , 32 , 33 of FIG. 1 onto the conveyor roller 5 via the conveyor 4 .

首先,參照圖3A,物體裝載器3、3-1、31、32、33包括第一支撐件3、第二支撐件3-1、設置在第一支撐件3與第二支撐件3-1之間的裝載台33、執行活塞移動以將裝載台33向上及向下移動的致動器31、及推動器32。物體裝載器3、3-1、31、32、33可配置在垂直於輸送器輥5上之檢測物體1輸送方向的左側及右側的任一者上,且可被配置為相對於更多裝載台33上的檢測物體1自動地執行表面缺陷檢測。控制裝置50可控制物體裝載器3、3-1、31、32、33,以將裝載在裝載台33上之複數個檢測物體1一個接著一個提供至輸送器4,且可控制輸送器4以將提供至輸送器4的檢測物體1放置於輸送器輥5上。First, referring to FIG3A , the object carrier 3, 3-1, 31, 32, 33 includes a first support member 3, a second support member 3-1, a loading platform 33 disposed between the first support member 3 and the second support member 3-1, an actuator 31 that performs piston movement to move the loading platform 33 upward and downward, and a pusher 32. The object carrier 3, 3-1, 31, 32, 33 can be arranged on either the left side or the right side perpendicular to the conveying direction of the inspection object 1 on the conveyor roller 5, and can be arranged to automatically perform surface defect inspection with respect to more inspection objects 1 on the loading platform 33. The control device 50 can control the object loaders 3, 3-1, 31, 32, 33 to provide the plurality of test objects 1 loaded on the loading platform 33 to the conveyor 4 one by one, and can control the conveyor 4 to place the test objects 1 provided to the conveyor 4 on the conveyor roller 5.

首先,檢測物體1(諸如,變體抽製材料或抽製材料)以一捆2之單位(例如,16塊)預裝載在裝載台33上。為了將檢測物體1提供至輸送器4,首先在控制裝置50的控制下藉由致動器31將裝載台33向上及向下移動以調整捆2之最上面檢測物體1的高度,使得一個檢測物體1可藉由推動器推動該捆之最上面檢測物體1之一個側的力而橫向地移動。在此情況下,檢測物體1可經由第二支撐件3-1之頂部表面而提供至輸送器4之頂部表面。如圖1所繪示,檢測物體1可藉由設置在複數個定位處的第二支撐件3-1及複數個輸送器4經由在複數個定位處之第二支撐件3-1的頂部表面而提供,以橫跨在輸送器4之頂部表面上方。First, the test object 1 (e.g., a variant drawn material or drawn material) is pre-loaded on the loading platform 33 in a unit of a bundle 2 (e.g., 16 pieces). In order to provide the test object 1 to the conveyor 4, the loading platform 33 is first moved upward and downward by the actuator 31 under the control of the control device 50 to adjust the height of the top test object 1 of the bundle 2, so that one test object 1 can be moved laterally by the force of the pusher pushing one side of the top test object 1 of the bundle. In this case, the test object 1 can be provided to the top surface of the conveyor 4 via the top surface of the second support member 3-1. As shown in FIG. 1 , the detection object 1 can be provided by the second support member 3 - 1 disposed at a plurality of locations and a plurality of conveyors 4 through the top surface of the second support member 3 - 1 at the plurality of locations so as to span over the top surface of the conveyor 4 .

接下來,如圖3B所繪示,在控制裝置50的控制下,設置在輸送器輥5之輥之間的輸送器4可沿著輸送導件34在橫向方向上移動,且在此時,輸送器4之頂部表面上的檢測物體1可定位在輸送器輥5之輥的正上方。Next, as shown in FIG. 3B , under the control of the control device 50 , the conveyor 4 disposed between the rollers of the conveyor roller 5 can move in the lateral direction along the conveying guide 34 , and at this time, the detection object 1 on the top surface of the conveyor 4 can be positioned directly above the rollers of the conveyor roller 5 .

接下來,如圖3C所繪示,在控制裝置50的控制下,輸送器4之頂部表面可藉由致動器下降,且因此檢測物體1可放置於輸送器輥5之輥上。Next, as shown in FIG. 3C , under the control of the control device 50 , the top surface of the conveyor 4 can be lowered by the actuator, and thus the test object 1 can be placed on the roller of the conveyor roller 5 .

接下來,如圖3D所繪示,在控制裝置50的控制下,輸送器輥5上的檢測物體1係沿著輸送路徑在直線方向上輸送以經歷表面缺陷檢測,且輸送器4沿著輸送導件34移動朝向第二支撐件3-1,以再次接收次下一個檢測物體1。之後,輸送器4之頂部表面可藉由致動器升高,使得輸送器4之頂部表面變得接近第二支撐件3-1之頂部表面或較佳地與第二支撐件3-1之頂部表面對準。Next, as shown in FIG3D , under the control of the control device 50, the inspection object 1 on the conveyor roller 5 is transported in a straight line along the conveying path to undergo surface defect inspection, and the conveyor 4 moves along the conveying guide 34 toward the second support member 3-1 to receive the next inspection object 1 again. Thereafter, the top surface of the conveyor 4 can be raised by the actuator so that the top surface of the conveyor 4 becomes close to the top surface of the second support member 3-1 or is preferably aligned with the top surface of the second support member 3-1.

同時,如圖1所繪示,當輸送器4將檢測物體1提供至輸送器輥5時,雷射檢測區段12可被配置為透過以下方式產生指示檢測物體1之表面狀況的電信號:在檢測物體1係在縱向方向上於輸送器輥5上輸送並通過檢測區域9的同時,將雷射發射至檢測物體1之至少一個表面並接收反射波。At the same time, as shown in Figure 1, when the conveyor 4 provides the detection object 1 to the conveyor roller 5, the laser detection section 12 can be configured to generate an electrical signal indicating the surface condition of the detection object 1 in the following manner: while the detection object 1 is being transported on the conveyor roller 5 in the longitudinal direction and passing through the detection area 9, the laser is emitted to at least one surface of the detection object 1 and the reflected wave is received.

對於此目的,在控制裝置50的控制下,當檢測物體1首先藉由輸送器4放置於輸送器輥上時,第一標示器6可使用檢測物體1上的預定檢測識別符號來標記檢測物體1。在此時,在檢測物體1經輸送使得檢測物體1在第一標示器6之側上的端經輸送以接近第一標示器6之後,第一標示器6可標記檢測物體1之端表面(或其周邊表面)上的預定檢測識別符號(例如,QR碼或條碼識別符號)。標記可以各種方式進行,包括標籤、印刷、及雷射標記。For this purpose, under the control of the control device 50, when the detection object 1 is first placed on the conveyor roller by the conveyor 4, the first marker 6 can mark the detection object 1 with a predetermined detection identification symbol on the detection object 1. At this time, after the detection object 1 is conveyed so that the end of the detection object 1 on the side of the first marker 6 is conveyed to approach the first marker 6, the first marker 6 can mark the predetermined detection identification symbol (for example, a QR code or barcode identification symbol) on the end surface (or its peripheral surface) of the detection object 1. Marking can be performed in various ways, including labeling, printing, and laser marking.

當標記以此方式完成時,輸送器輥5在控制裝置50的控制下操作,且輸送器輥5上的檢測物體1沿著輸送路徑移動,且外來物質係藉由刷7及鼓風機8從檢測物體1之一端移除至另一端。例如,在通過在輸送方向上依序配置在雷射檢測區段12之前端處的刷7及鼓風機8的同時,藉由刷7拂刷並藉由來自鼓風機8的風吹離檢測物體1之整個前、左、右、及後表面,使得外來物質。在經拂刷之後,藉由鼓風機8吹拂風,其可移除可能附接至檢測物體1。When the marking is completed in this way, the conveyor roller 5 is operated under the control of the control device 50, and the detection object 1 on the conveyor roller 5 moves along the conveying path, and foreign matter is removed from one end of the detection object 1 to the other end by the brush 7 and the blower 8. For example, while passing through the brush 7 and the blower 8 sequentially arranged at the front end of the laser detection section 12 in the conveying direction, the entire front, left, right, and rear surfaces of the detection object 1 are brushed by the brush 7 and blown away by the wind from the blower 8, so that the foreign matter. After being brushed, it can be removed by blowing wind by the blower 8.

在如上文所述移除外來物質之後,雷射檢測區段12可被配置為透過以下方式產生指示檢測物體1之表面狀況的電信號:在檢測物體1係在縱向方向上於輸送器輥5上輸送並通過檢測區域9的同時,將雷射發射至檢測物體1之至少一個表面並接收反射波。控制裝置50可被配置為藉由分析指示檢測物體1之表面狀況的電信號而判定檢測物體1為合適或不合適。After the foreign matter is removed as described above, the laser detection section 12 may be configured to generate an electrical signal indicating the surface condition of the detection object 1 by emitting laser light to at least one surface of the detection object 1 and receiving reflected waves while the detection object 1 is transported in the longitudinal direction on the conveyor roller 5 and passes through the detection area 9. The control device 50 may be configured to determine whether the detection object 1 is suitable or unsuitable by analyzing the electrical signal indicating the surface condition of the detection object 1.

垂直導輥10及10-1及水平導輥11及11-1可在檢測區域9之位置之前及之後配置成對。垂直導輥10及10-1、及水平導輥11及11-1經提供以在藉由雷射檢測區段12檢測之前於垂直及水平方向上準確地對準。較佳地,垂直導輥10及10-1及水平導輥11及11-1在檢測區域9之位置之前及之後配置成對,且可在一些情況下僅在檢測區域9之一個側上配置。用於導引檢測物體1之垂直對準的垂直導輥10及10-1的垂直移動可在控制裝置50的控制下控制,且用於導引檢測物體1之水平對準的水平導輥11及11-1的水平移動可在控制裝置50的控制下控制。The vertical guide rollers 10 and 10-1 and the horizontal guide rollers 11 and 11-1 may be arranged in pairs before and after the position of the detection area 9. The vertical guide rollers 10 and 10-1 and the horizontal guide rollers 11 and 11-1 are provided to be accurately aligned in the vertical and horizontal directions before detection by the laser detection section 12. Preferably, the vertical guide rollers 10 and 10-1 and the horizontal guide rollers 11 and 11-1 are arranged in pairs before and after the position of the detection area 9, and may be arranged only on one side of the detection area 9 in some cases. The vertical movement of the vertical guide rollers 10 and 10 - 1 for guiding the vertical alignment of the inspection object 1 can be controlled under the control of the control device 50 , and the horizontal movement of the horizontal guide rollers 11 and 11 - 1 for guiding the horizontal alignment of the inspection object 1 can be controlled under the control of the control device 50 .

圖4係繪示圖1之雷射檢測區段12之雷射感測器的視圖。在圖4中,為了方便起見,複數個雷射感測器121-1、121-2、122-1、122-2、123-1、123-2、124-1、及124-2經繪示為放置於自檢測物體1之截面延伸的各別平面上。當雷射感測器以此方式放置時,雷射信號之間的干擾可導致不準確的缺陷分析。因此,較佳地,複數個雷射感測器121-1、121-2、122-1、122-2、123-1、123-2、124-1、及124-2可分別放置於檢測物體1輸送路徑上的不同定位處(亦即,輸送器輥5之輥的左側及右側上),且甚至可放置於相同側上的不同定位處。Fig. 4 is a view showing the laser sensors of the laser inspection section 12 of Fig. 1. In Fig. 4, for convenience, a plurality of laser sensors 121-1, 121-2, 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 are shown as being placed on respective planes extending from the cross section of the inspection object 1. When the laser sensors are placed in this manner, interference between laser signals may result in inaccurate defect analysis. Therefore, preferably, multiple laser sensors 121-1, 121-2, 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 can be placed at different positions on the conveying path of the detection object 1 (i.e., on the left and right sides of the conveyor roller 5), and can even be placed at different positions on the same side.

參考圖4,雷射檢測區段12可包括複數個雷射感測器121-1、121-2、122-1、122-2、123-1、123-2、124-1、及124-2。雷射感測器121-1、121-2、122-1、122-2、123-1、123-2、124-1、及124-2之各者可包括雷射發射器及雷射接收器,其等透過在一預安裝位置處發射雷射並接收反射波來產生電信號。亦即,雷射發射器能夠以預定功率發射雷射,且雷射接收器能夠接收自檢測物體1之對應位置反射的波,且產生指示檢測物體1之表面狀況的電信號。控制裝置50可被配置為藉由分析指示檢測物體1之表面狀況的電信號而判定檢測物體1為合適或不合適。例如,當檢測物體1經判定具有缺陷(諸如破裂、凹坑、深刮痕、凹陷(凹口)、表層重疊、及金屬或非金屬外來物質撞擊(impaction))時,檢測物體可經判定為不合適。更具體而言,當控制裝置50比較自雷射感測器接收的電信號與用作檢測物體1之對應表面的預定參考的信號時,且具有大於臨限值之差異的不合適部分可經判定具有缺陷(諸如破裂、凹坑、深刮痕、凹陷(凹口)、表層重疊、及金屬或非金屬外來物質撞擊)。若檢測物體1之至少一部分具有指示大於臨限之差的缺陷,則控制裝置50可將檢測物體1判定為不合適。若否,則控制裝置50可將檢測物體1判定為合適。4, the laser detection section 12 may include a plurality of laser sensors 121-1, 121-2, 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2. Each of the laser sensors 121-1, 121-2, 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 may include a laser transmitter and a laser receiver, which generate an electrical signal by emitting a laser at a pre-installed position and receiving a reflected wave. That is, the laser transmitter is capable of emitting a laser at a predetermined power, and the laser receiver is capable of receiving a wave reflected from a corresponding position of the detection object 1, and generating an electrical signal indicating the surface condition of the detection object 1. The control device 50 may be configured to determine whether the detection object 1 is suitable or unsuitable by analyzing an electrical signal indicating the surface condition of the detection object 1. For example, when the detection object 1 is determined to have defects (such as cracks, pits, deep scratches, depressions (notches), surface overlap, and metal or non-metal foreign matter impact), the detection object may be determined to be unsuitable. More specifically, when the control device 50 compares the electrical signal received from the laser sensor with a signal used as a predetermined reference for the corresponding surface of the detection object 1, and the unsuitable portion having a difference greater than a threshold value may be determined to have defects (such as cracks, pits, deep scratches, depressions (notches), surface overlap, and metal or non-metal foreign matter impact). If at least a portion of the test object 1 has a defect indicating a difference greater than a threshold, the control device 50 may determine that the test object 1 is unsuitable. Otherwise, the control device 50 may determine that the test object 1 is suitable.

雷射檢測區段12可包括:頂部雷射感測器121-1及底部雷射感測器121-2,其等分別用於偵測檢測物體1之頂部表面d1及底部表面d2的表面狀況;及一或多個側雷射感測器122-1、122-2、123-1、123-2、124-1、及124-2,其等分別用於偵測在檢測物體1之頂部表面與底部表面之間的側表面中之一或多個倒角表面f1、g1、f2、及g2、平坦表面61、63、65、71、73、及75、及其之各者形成在兩個相鄰平坦表面之間的傾斜表面62、64、72、及74的表面狀況。The laser detection section 12 may include: a top laser sensor 121-1 and a bottom laser sensor 121-2, which are respectively used to detect the surface conditions of the top surface d1 and the bottom surface d2 of the detection object 1; and one or more side laser sensors 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2, which are respectively used to detect the surface conditions of one or more chamfered surfaces f1, g1, f2, and g2, flat surfaces 61, 63, 65, 71, 73, and 75, and inclined surfaces 62, 64, 72, and 74 formed between two adjacent flat surfaces in the side surfaces between the top surface and the bottom surface of the detection object 1.

側雷射感測器122-1、122-2、123-1、123-2、124-1、及124-2中之至少一者可配置在檢測物體1之縱向方向的左側及右側的各者上。At least one of the side laser sensors 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 may be disposed on each of the left and right sides of the detection object 1 in the longitudinal direction.

例如,如圖4所繪示,檢測物體1可包括頂部表面d1、底部表面d2、及頂部表面d1與底部表面d2之間的側表面,且該等側表面可包括:一或多個倒角表面f1、g1、f2、及g2;平坦表面61、63、65、71、73、及75;或各自形成在兩個相鄰平坦表面之間的傾斜表面62、64、72、及74。亦即,在各別左側表面及右側表面中的平坦表面61、63、65、71、73、及75由於一或多個凹凸形狀而可包括一或多個平坦表面63及73;及自上倒角表面及下倒角表面f1、g1、f2、及g2在上倒角表面及下倒角表面f1、g1、f2、及g2之間延伸的一或多個平坦表面61、65、71、及75。在圖式中,頂部表面d1與底部表面d2之間的左側表面f1、e1、g1及右側表面f2、e2、g2彼此對稱,但不限於此。左側表面f1、e1、g1及右側表面f2、e2、g2可不對稱,且各側表面可包括諸如傾斜表面、平坦表面、及彎曲表面的形狀。For example, as shown in Figure 4, the detection object 1 may include a top surface d1, a bottom surface d2, and side surfaces between the top surface d1 and the bottom surface d2, and the side surfaces may include: one or more chamfered surfaces f1, g1, f2, and g2; flat surfaces 61, 63, 65, 71, 73, and 75; or inclined surfaces 62, 64, 72, and 74 each formed between two adjacent flat surfaces. That is, the flat surfaces 61, 63, 65, 71, 73, and 75 in the respective left and right surfaces may include one or more flat surfaces 63 and 73 due to one or more concave-convex shapes; and one or more flat surfaces 61, 65, 71, and 75 extending between the upper chamfered surfaces f1, g1, f2, and g2 from the upper chamfered surfaces f1, g1, f2, and g2. In the drawings, the left surfaces f1, e1, g1 and the right surfaces f2, e2, g2 between the top surface d1 and the bottom surface d2 are symmetrical to each other, but are not limited thereto. The left side surfaces f1, e1, g1 and the right side surfaces f2, e2, g2 may be asymmetrical, and each side surface may include shapes such as an inclined surface, a flat surface, and a curved surface.

因此,側雷射感測器122-1、122-2、123-1、123-2、124-1、及124-2之所有者不總是需要被提供,且取決於左側表面及右側表面之各者的形狀,側雷射可僅放置於檢測物體1之縱向方向的左側上。然而,即使一個側表面僅包括一平坦表面,則用於該平坦表面的雷射感測器較佳地放置於該側上。Therefore, the owners of the side laser sensors 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 do not always need to be provided, and depending on the shape of each of the left and right surfaces, the side laser may be placed only on the left side in the longitudinal direction of the detection object 1. However, even if one side surface includes only a flat surface, the laser sensor for the flat surface is preferably placed on the side.

為了促進在變體抽製材料(諸如在設施(諸如自動化產線或機器工具)中促進筆直往復運動的線性運動導軌)上之表面缺陷的偵測,檢測物體1可具有例如圖4所繪示的形狀。In order to facilitate the detection of surface defects on a deformed drawn material, such as a linear motion guide that facilitates straight reciprocating motion in a facility such as an automated production line or a machine tool, the test object 1 may have a shape such as that shown in FIG. 4 .

對於此目的,側雷射感測器122-1、122-2、123-1、123-2、124-1、及124-2可在左側及右側中之至少一者上包括:第一雷射感測器123-1或123-2,其等用於偵測包括檢測物體1之上倒角表面f1或f2的區域的表面狀況;及第二雷射感測器124-1或124-2,其等用於偵測包括檢測物體1之下倒角表面g1或g2的區域的表面狀況。此外,側雷射感測器122-1、122-2、123-1、123-2、124-1、及124-2可在左側及右側中之至少一者上包括第三雷射感測器122-1或122-2,其等用於偵測以下的表面狀況:存在於檢測物體1之上倒角表面f1或f2與下倒角表面g1或g2之間且自各別邊緣延伸的延伸平坦表面61及65或71及75;凹平坦表面63或73;及在延伸平坦表面61及65或71及75與凹平坦表面63或73之間的傾斜表面62及64或72及74。For this purpose, the side laser sensors 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 may include on at least one of the left and right sides: a first laser sensor 123-1 or 123-2, which is used to detect the surface condition of an area including the chamfered surface f1 or f2 on the detection object 1; and a second laser sensor 124-1 or 124-2, which is used to detect the surface condition of an area including the chamfered surface g1 or g2 below the detection object 1. In addition, the side laser sensors 122-1, 122-2, 123-1, 123-2, 124-1, and 124-2 may include a third laser sensor 122-1 or 122-2 on at least one of the left and right sides, which are used to detect the following surface conditions: extended flat surfaces 61 and 65 or 71 and 75 existing between the chamfered surface f1 or f2 and the lower chamfered surface g1 or g2 on the detection object 1 and extending from the respective edges; concave flat surface 63 or 73; and inclined surfaces 62 and 64 or 72 and 74 between the extended flat surfaces 61 and 65 or 71 and 75 and the concave flat surface 63 or 73.

控制裝置50可被配置為藉由分析指示檢測物體1之表面狀況且自雷射檢測區段12之雷射感測器接收的電信號而判定檢測物體1為合適或不合適。例如,當控制裝置50比較自雷射感測器接收的電信號與用作檢測物體1之對應表面的預定參考的信號時,且具有大於臨限值之差異的不合適部分可經判定具有缺陷(諸如破裂、凹坑、凹陷(凹口)、表層重疊、及金屬或非金屬外來物質撞擊)。可使用預定應用程式以藉由控制裝置50作出此一決策,且若有必要,可使用藉由學習操作評估缺陷之深度學習模型的系統(軟體)而學習的深度學習模型。The control device 50 may be configured to determine whether the detection object 1 is suitable or unsuitable by analyzing an electrical signal indicating the surface condition of the detection object 1 and received from the laser sensor of the laser detection section 12. For example, when the control device 50 compares the electrical signal received from the laser sensor with a signal used as a predetermined reference of the corresponding surface of the detection object 1, and an unsuitable portion having a difference greater than a threshold value may be determined to have a defect (such as a crack, a pit, a depression (notch), a surface layer overlap, and a metallic or non-metallic foreign matter impact). A predetermined application may be used to make such a decision by the control device 50, and if necessary, a deep learning model learned by a system (software) that learns a deep learning model for operating and evaluating defects may be used.

圖6A至圖6C繪示關於圖1之檢測物體1之表面缺陷狀況的段差或類似者之實際測量的實例。圖6A及圖6B例示藉由凹陷(凹口)或類似者產生之在寬度及深度上為1 mm或更小的凹槽,且圖6C例示由於刮痕、表層重疊、外來物質撞擊、或類似者而在表面上產生之在寬度及深度上為1 mm或更小的段差。6A to 6C show examples of actual measurement of step or similar surface defect conditions of the test object 1 of FIG1. FIG6A and FIG6B illustrate a groove with a width and depth of 1 mm or less produced by a depression (notch) or the like, and FIG6C illustrates a step with a width and depth of 1 mm or less produced on the surface due to a scratch, a surface layer overlap, a foreign body impact, or the like.

當存在缺陷(諸如上述刮痕、壓痕(凹口)、表層重疊、或金屬或非金屬外來物質撞擊)時,控制裝置50可計算如圖6A及圖6C所繪示的缺陷之大小(諸如寬度、深度、或高度),並將所計算之大小提供至顯示裝置(諸如LCD或LED)。控制裝置50可在記憶體中儲存關於在上述檢測程序期間檢測物體1為合適或不合適的統計資料、關於設備是否正常操作的資訊、或結果(諸如缺陷大小),且可在未來於使用者的查詢請求下將對應資料提供至顯示裝置。When there is a defect (such as the above-mentioned scratch, indentation (notch), overlapping of the surface layer, or impact of metallic or non-metallic foreign matter), the control device 50 can calculate the size of the defect (such as width, depth, or height) as shown in Figures 6A and 6C, and provide the calculated size to a display device (such as an LCD or LED). The control device 50 can store in a memory statistical data about whether the object 1 is suitable or unsuitable during the above-mentioned detection process, information about whether the equipment is operating normally, or results (such as defect size), and can provide the corresponding data to the display device at the user's query request in the future.

在圖1中,控制裝置50可判定已通過檢測區域中之雷射檢測區段12的檢測物體1為合適或不合適,且使檢測物體1通過第二標示器13。In FIG. 1 , the control device 50 can determine whether the detection object 1 that has passed through the laser detection section 12 in the detection area is suitable or unsuitable, and make the detection object 1 pass through the second marker 13 .

第二標示器13設置在雷射檢測區段12之後端處,且當在檢測物體1由於缺陷存在而不合適時,第二標示器13在控制裝置50的控制下製作檢測物體1之缺陷定位。如圖5所繪示,第二標示器13可在存在缺陷(破裂、凹坑、深刮痕、凹陷(凹口)、表層重疊、或金屬或非金屬外來物質撞擊)處標記識別符號(例如,諸如91、92、93、94、95、96及97……等元件標號)。標記可以各種方式執行,包括標籤、印刷(例如,塗料印刷等)、雷射標記、及類似者。The second marker 13 is disposed at the rear end of the laser detection section 12, and when the detection object 1 is inappropriate due to the presence of a defect, the second marker 13 makes a defect location of the detection object 1 under the control of the control device 50. As shown in FIG5, the second marker 13 can mark an identification symbol (for example, component numbers such as 91, 92, 93, 94, 95, 96 and 97...) at the location where a defect (crack, pit, deep scratch, depression (notch), surface overlap, or metal or non-metal foreign matter impact) exists. Marking can be performed in various ways, including labeling, printing (for example, paint printing, etc.), laser marking, and the like.

如圖1所繪示,根據本揭露之一實施例的表面缺陷檢測裝置100可包括:檢測合適物體裝載器15、15-1,其用於裝載藉由控制裝置50判定為合適的檢測物體1;及檢測不合適物體裝載器16、16-1,其用於裝載藉由控制裝置50判定為不合適的檢測物體1。As shown in Figure 1, a surface defect detection device 100 according to one embodiment of the present disclosure may include: a detection suitable object carrier 15, 15-1, which is used to load the detection object 1 determined as suitable by the control device 50; and a detection unsuitable object carrier 16, 16-1, which is used to load the detection object 1 determined as unsuitable by the control device 50.

例如,控制裝置50可控制(多個)第二輸送器14,以輸送並將經判定為合適的檢測物體1一個接著一個裝載至檢測合適物體裝載器15、15-1上,且可控制(多個)第二輸送器14以輸送並將經判定為不合適的檢測物體1一個接著一個裝載至檢測不合適物體裝載器16、16-1上。(多個)第二輸送器14、及檢測合適物體裝載器15、15-1、及檢測不合適物體裝載器16、16-1的裝載操作可以與圖3A至圖3D所繪示之(多個)輸送器4及物體裝載器3、3-1之操作相反的順序執行。For example, the control device 50 can control the (multiple) second conveyor 14 to convey and load the detection objects 1 determined to be suitable one by one onto the detection suitable object carriers 15, 15-1, and can control the (multiple) second conveyor 14 to convey and load the detection objects 1 determined to be unsuitable one by one onto the detection unsuitable object carriers 16, 16-1. The loading operations of the (multiple) second conveyor 14, the detection suitable object carriers 15, 15-1, and the detection unsuitable object carriers 16, 16-1 can be performed in the opposite order to the operations of the (multiple) conveyor 4 and the object carriers 3, 3-1 shown in Figures 3A to 3D.

如上文所述,根據本揭露之表面缺陷檢測裝置100係組態成多個頻道以包括對應於各別成形表面的雷射測量感測器,以檢測檢測物體1之表面上的缺陷,且能夠在將檢測物體1輸送至如上文所述地組態的雷射測量感測器的同時自動地檢測該等表面缺陷並測量該等缺陷的大小。具體而言,本揭露之表面缺陷檢測方法可輕易地偵測表面缺陷,即便在截面上不具有簡單形狀的抽製材料或類似者上亦然,諸如在一設施(諸如自動化產線或機器工具)中促進線性往復運動的線性運動導軌。亦即,例如,當在抽製、熱處理、及校正程序之後在一線性運動導軌之一抽製形狀材料的最終表面上檢測缺陷時,取代操作員對各成形表面的視覺檢測,而施用一雷射測量方法以偵測表面缺陷,使得不論表面之形狀或狀況如何皆可自動地測量該等缺陷之位置及大小、可作出關於該抽製形狀材料為合適或不合適的決策、且可將該抽製形狀材料分離並排出。As described above, the surface defect detection device 100 according to the present disclosure is configured into multiple channels to include laser measurement sensors corresponding to respective formed surfaces to detect defects on the surface of the detection object 1, and is capable of automatically detecting the surface defects and measuring the size of the defects while conveying the detection object 1 to the laser measurement sensors configured as described above. Specifically, the surface defect detection method of the present disclosure can easily detect surface defects even on a drawn material or the like that does not have a simple shape in cross section, such as a linear motion guide that promotes linear reciprocating motion in a facility (such as an automated production line or a machine tool). That is, for example, when defects are detected on the final surface of a drawn shape material on a linear motion guide after drawing, heat treatment, and calibration procedures, a laser measurement method is used to detect surface defects instead of the operator's visual inspection of each formed surface, so that the position and size of the defects can be automatically measured regardless of the shape or condition of the surface, a decision can be made as to whether the drawn shape material is suitable or unsuitable, and the drawn shape material can be separated and discharged.

根據本揭露之表面缺陷檢測裝置100能夠藉由施用使用雷射測量之自動檢測方法而防止操作員錯誤,藉由連接在抽製形狀材料的抽製之前及之後的程序而在抽製之後實現中間測量,且實現用於遠端控制及檢測的線上控制,從而促進改良生產率。The surface defect inspection device 100 according to the present disclosure can prevent operator errors by applying an automatic inspection method using laser measurement, realize intermediate measurement after drawing by connecting to the processes before and after drawing of a shaped material, and realize online control for remote control and inspection, thereby promoting improved productivity.

如上文所述,本揭露已基於特定細節(諸如特定組件、有限實施例、及圖式)描述,但提供此等僅係為了幫助更大致上地理解本揭露,且本揭露不限於上述實施例。本揭露所屬之所屬技術領域中具有通常知識者可在不脫離本揭露之必要特性的情況下作出各種修改及改變。因此,本揭露之精神不應限於所述實施例,且不僅隨附申請專利範圍,等效於申請專利範圍或對申請專利範圍之等效修改的所有技術概念亦應解讀為被包括在本揭露之範疇中。As described above, the present disclosure has been described based on specific details (such as specific components, limited embodiments, and drawings), but these are provided only to help understand the present disclosure more generally, and the present disclosure is not limited to the above-mentioned embodiments. A person with ordinary knowledge in the technical field to which the present disclosure belongs can make various modifications and changes without departing from the essential characteristics of the present disclosure. Therefore, the spirit of the present disclosure should not be limited to the embodiments, and not only the scope of the attached patent application, but all technical concepts that are equivalent to the scope of the patent application or equivalent modifications to the scope of the patent application should also be interpreted as being included in the scope of the present disclosure.

1:檢測物體 2:捆 3:物體裝載器;第一支撐件 3-1:物體裝載器;第二支撐件 4:輸送器 5:輸送器輥 6:第一標示器 7:刷 8:鼓風機 9:檢測區域 10:垂直導輥 10-1:垂直導輥 11:水平導輥 11-1:水平導輥 12:雷射檢測區段 13:第二標示器 14:輸送器;第二輸送器 15:合適物體裝載器 15-1:合適物體裝載器 16:不合適物體裝載器 16-1:不合適物體裝載器 31:物體裝載器;致動器 32:物體裝載器;推動器 33:物體裝載器;裝載台 34:輸送導件 50:控制裝置 61:平坦表面 62:傾斜表面 63:平坦表面;凹平坦表面 64:傾斜表面 65:平坦表面 71:平坦表面 72:傾斜表面 73:平坦表面;凹平坦表面 74:傾斜表面 75:平坦表面 100:表面缺陷檢測裝置 121-1:雷射感測器;頂部雷射感測器 121-2:雷射感測器;底部雷射感測器 122-1:雷射感測器;側雷射感測器 122-2:雷射感測器;側雷射感測器 123-1:雷射感測器;側雷射感測器 123-2:雷射感測器;側雷射感測器 124-1:雷射感測器;側雷射感測器 124-2:雷射感測器;側雷射感測器 d1:頂部表面 d2:底部表面 e1:左側表面 e2:右側表面 f1:倒角表面;左側表面 f2:倒角表面;右側表面 g1:倒角表面;左側表面 g2:倒角表面;右側表面 1: Detection object 2: Bundle 3: Object carrier; first support 3-1: Object carrier; second support 4: Conveyor 5: Conveyor roller 6: First marker 7: Brush 8: Blower 9: Detection area 10: Vertical guide roller 10-1: Vertical guide roller 11: Horizontal guide roller 11-1: Horizontal guide roller 12: Laser detection section 13: Second marker 14: Conveyor; second conveyor 15: Suitable object carrier 15-1: Suitable object carrier 16: Unsuitable object carrier 16-1: Unsuitable object carrier 31: Object carrier; actuator 32: Object carrier; pusher 33: Object carrier; loading platform 34: Conveyor guide 50: Control device 61: Flat surface 62: Inclined surface 63: Flat surface; Concave flat surface 64: Inclined surface 65: Flat surface 71: Flat surface 72: Inclined surface 73: Flat surface; Concave flat surface 74: Inclined surface 75: Flat surface 100: Surface defect detection device 121-1: Laser sensor; Top laser sensor 121-2: Laser sensor; Bottom laser sensor 122-1: Laser sensor; Side laser sensor 122-2: Laser sensor; Side laser sensor 123-1: laser sensor; side laser sensor 123-2: laser sensor; side laser sensor 124-1: laser sensor; side laser sensor 124-2: laser sensor; side laser sensor d1: top surface d2: bottom surface e1: left surface e2: right surface f1: chamfered surface; left surface f2: chamfered surface; right surface g1: chamfered surface; left surface g2: chamfered surface; right surface

隨附圖式係包括作為實施方式之部分以幫助理解本發明揭露,提供本發明之實施例,且與實施方式一起說明本發明之技術精神,其中: [圖1]係根據本發明之一實施例的表面缺陷檢測裝置的示意平面圖; [圖2]繪示圖1之檢測物體之透視圖的實例; [圖3A]至[圖3D]係繪示經由圖1之輸送器將檢測物體從圖1之物體裝載器放置於輸送器輥上的程序的視圖; [圖4]係繪示圖1之雷射檢測區段中之雷射感測器的視圖; [圖5]繪示標記諸如圖1之檢測物體1中發生的刮痕之表面缺陷的實例;及 [圖6A]至[圖6C]繪示關於圖1之檢測物體1之表面缺陷狀況的段差(step)或類似者之實際測量的實例。 The accompanying drawings are included as part of the implementation method to help understand the disclosure of the present invention, provide an embodiment of the present invention, and together with the implementation method illustrate the technical spirit of the present invention, wherein: [Figure 1] is a schematic plan view of a surface defect detection device according to an embodiment of the present invention; [Figure 2] shows an example of a perspective view of the detection object of Figure 1; [Figure 3A] to [Figure 3D] are views showing the process of placing the detection object from the object carrier of Figure 1 on the conveyor roller via the conveyor of Figure 1; [Figure 4] is a view showing a laser sensor in the laser detection section of Figure 1; [Figure 5] shows an example of marking surface defects such as scratches occurring in the detection object 1 of Figure 1; and [Figure 6A] to [Figure 6C] show examples of actual measurement of the step or similar surface defect conditions of the test object 1 in Figure 1.

100:表面缺陷檢測裝置 100: Surface defect detection device

1:檢測物體 1: Detection object

2:捆 2: Bundle

3:物體裝載器;第一支撐件 3: Object loader; first support

3-1:物體裝載器;第二支撐件 3-1: Object carrier; second support

4:輸送器 4:Conveyor

5:輸送器輥 5: Conveyor roller

6:第一標示器 6: First marker

7:刷 7: Brush

8:鼓風機 8: Blower

9:檢測區域 9: Detection area

10-1:垂直導輥 10-1: Vertical guide roller

11-1:水平導輥 11-1: Horizontal guide roller

12:雷射檢測區段 12: Laser detection section

13:第二標示器 13: Second marker

14:輸送器;第二輸送器 14: conveyor; second conveyor

15:合適物體裝載器 15: Suitable object carrier

16:不合適物體裝載器 16: Inappropriate object carrier

16-1:不合適物體裝載器 16-1: Inappropriate object carrier

50:控制裝置 50: Control device

Claims (14)

一種用於在一檢測物體正被輸送的同時檢測該檢測物體上之一表面缺陷的設備,該設備包含: 一輸送器,其被配置為將一檢測物體提供至一輸送器輥; 一雷射檢測區段,其被配置為藉由以下方式產生指示該檢測物體之一表面狀況的一電信號:在該檢測物體係在一縱向方向上於該輸送器輥上輸送並通過一檢測區域的同時,將一雷射發射至該檢測物體之至少一個表面並接收反射波;及 一控制裝置,其被配置為分析指示該檢測物體之該表面狀況的該電信號,並判定該檢測物體為合適或不合適。 A device for detecting a surface defect on a test object while the test object is being transported, the device comprising: a conveyor configured to provide a test object to a conveyor roller; a laser detection section configured to generate an electrical signal indicating a surface condition of the test object by: emitting a laser to at least one surface of the test object and receiving a reflected wave while the test object is being transported on the conveyor roller in a longitudinal direction and passing through a detection area; and a control device configured to analyze the electrical signal indicating the surface condition of the test object and determine whether the test object is suitable or unsuitable. 如請求項1之設備,其中該檢測區域中之該輸送器輥包含: 一垂直導輥,其被配置為在該控制裝置的控制下執行該檢測物體之垂直對準導引的垂直移動;及 一水平導輥,其被配置為在該控制裝置的控制下執行該檢測物體之水平對準導引的水平移動。 The device of claim 1, wherein the conveyor roller in the detection area comprises: a vertical guide roller configured to perform vertical movement of the detection object for vertical alignment guidance under the control of the control device; and a horizontal guide roller configured to perform horizontal movement of the detection object for horizontal alignment guidance under the control of the control device. 如請求項2之設備,其中至少一對垂直導輥及至少一對水平導輥在該檢測區域之一定位之前及之後配置。As in the apparatus of claim 2, at least one pair of vertical guide rollers and at least one pair of horizontal guide rollers are arranged before and after one of the positioning areas of the detection area. 如請求項1之設備,其進一步包含: 一刷及一鼓風機,其等在一輸送方向上依序配置在該雷射檢測區段之該前端處,以在該控制裝置的控制下自該檢測物體之該表面移除外來物質。 The device of claim 1 further comprises: A brush and a blower, which are sequentially arranged at the front end of the laser detection section in a conveying direction to remove foreign matter from the surface of the detection object under the control of the control device. 如請求項1之設備,其進一步包含: 一第一標示器,其經組態以在該檢測物體藉由該輸送器放置於該輸送器輥上時,在該控制裝置的控制下將一檢測識別符號標記在該檢測物體上。 The device of claim 1 further comprises: A first marker configured to mark a detection identification symbol on the detection object under the control of the control device when the detection object is placed on the conveyor roller by the conveyor. 如請求項1之設備,其進一步包含: 一第二標示器,其配置在該雷射檢測區段之該後端處,且經組態以在該控制裝置的控制下將一缺陷位置標記在該檢測物體上。 The device of claim 1 further comprises: A second marker, which is arranged at the rear end of the laser detection section and is configured to mark a defect position on the detection object under the control of the control device. 如請求項1之設備,其中該控制裝置經組態以計算該檢測物體之該表面狀況中之一缺陷的一大小,並將所計算的該大小提供至一顯示裝置。An apparatus as claimed in claim 1, wherein the control device is configured to calculate a size of a defect in the surface condition of the inspection object and provide the calculated size to a display device. 如請求項1之設備,其進一步包含: 一物體裝載器,其被配置為裝載複數個檢測物體, 其中該控制裝置被配置為控制該物體裝載器以將該複數個檢測物體一個接著一個提供至該輸送器,且控制該輸送器以將由該輸送器接收的該等檢測物體放置於該輸送器輥上。 The device of claim 1 further comprises: an object loader configured to load a plurality of test objects, wherein the control device is configured to control the object loader to provide the plurality of test objects to the conveyor one by one, and control the conveyor to place the test objects received by the conveyor on the conveyor roller. 如請求項1之設備,其進一步包含: 一合適物體裝載器,其被配置為裝載經判定為合適的檢測物體;及 一不合適物體裝載器,其被配置為裝載經判定為不合適的檢測物體, 其中該控制裝置被配置為: 控制一第二輸送器以輸送並將經判定為合適的該等檢測物體一個接著一個裝載至該合適物體裝載器上;及 控制該第二輸送器以輸送並將經判定為不合適的該等檢測物體一個接著一個裝載至該不合適物體裝載器上。 The device of claim 1 further comprises: a suitable object carrier configured to load the test objects determined to be suitable; and an unsuitable object carrier configured to load the test objects determined to be unsuitable, wherein the control device is configured to: control a second conveyor to transport and load the test objects determined to be suitable one by one onto the suitable object carrier; and control the second conveyor to transport and load the test objects determined to be unsuitable one by one onto the unsuitable object carrier. 如請求項1之設備,其中該雷射檢測區段包含複數個雷射感測器,其等之各者包含一雷射發射器及一雷射接收器且經組態以產生該電信號,且 其中該等雷射感測器包含: 上雷射感測器及下雷射感測器,其等被配置為分別偵測該檢測物體之頂部表面及底部表面的表面狀況;及 一或多個側表面雷射感測器,其被配置為偵測一或多個倒角表面、平坦表面、或在兩個平坦表面之間的一傾斜表面的一表面狀況,其中該等倒角表面、該等平坦表面、及該傾斜表面係形成在該檢測物體之該頂部表面與該底部表面之間。 The device of claim 1, wherein the laser detection section includes a plurality of laser sensors, each of which includes a laser transmitter and a laser receiver and is configured to generate the electrical signal, and wherein the laser sensors include: an upper laser sensor and a lower laser sensor, which are configured to detect the surface conditions of the top surface and the bottom surface of the detection object, respectively; and one or more side surface laser sensors, which are configured to detect a surface condition of one or more chamfered surfaces, flat surfaces, or an inclined surface between two flat surfaces, wherein the chamfered surfaces, the flat surfaces, and the inclined surface are formed between the top surface and the bottom surface of the detection object. 如請求項10之設備,其中該等側雷射感測器中之至少一者係相對於該檢測物體之該縱向方向設置在該左側及該右側之各者上。As in the apparatus of claim 10, at least one of the side laser sensors is disposed on each of the left side and the right side relative to the longitudinal direction of the detection object. 如請求項10之設備,其中該等側雷射感測器包含: 一第一雷射感測器,其被配置為偵測包含該檢測物體之一上倒角表面的一區域的一表面狀況; 一第二雷射感測器,其被配置為偵測包含該檢測物體之一下倒角表面的一區域的一表面狀況;及 一第三雷射感測器,其被配置為偵測在該上倒角表面與該下倒角表面之間存在之延伸平坦表面、凹平坦表面、及傾斜表面的一表面狀況,其中該等延伸平坦表面自該等倒角表面分別延伸,且該等傾斜表面係提供在該等延伸平坦表面與該等凹平坦表面之間。 The device of claim 10, wherein the side laser sensors include: a first laser sensor configured to detect a surface condition of a region including an upper chamfered surface of the detection object; a second laser sensor configured to detect a surface condition of a region including a lower chamfered surface of the detection object; and a third laser sensor configured to detect a surface condition of an extended flat surface, a concave flat surface, and an inclined surface existing between the upper chamfered surface and the lower chamfered surface, wherein the extended flat surfaces extend from the chamfered surfaces respectively, and the inclined surfaces are provided between the extended flat surfaces and the concave flat surfaces. 一種藉由一控制裝置檢測一表面缺陷的方法,該控制裝置在一檢測物體正被輸送的同時控制檢測該檢測物體的一表面缺陷檢測設備,該方法包含: 在該控制裝置的該控制下,將該檢測物體在一縱向方向上於一輸送器輥上輸送; 在該控制裝置的該控制下,透過在該檢測物體正通過一檢測區域的同時將一雷射發射至該檢測物體之至少一個表面並接收經反射波,而產生指示該檢測物體之一表面狀況的一電信號;及 在該控制裝置之該控制下,藉由分析指示該檢測物體之該表面狀態的該電信號而判定該檢測物體為合適或不合適。 A method for detecting a surface defect by a control device, wherein the control device controls a surface defect detection device for detecting a detection object while the detection object is being transported, the method comprising: Under the control of the control device, the detection object is transported on a conveyor roller in a longitudinal direction; Under the control of the control device, an electrical signal indicating a surface condition of the detection object is generated by emitting a laser to at least one surface of the detection object and receiving a reflected wave while the detection object is passing through a detection area; and Under the control of the control device, the detection object is determined to be suitable or unsuitable by analyzing the electrical signal indicating the surface condition of the detection object. 如請求項13之方法,其中在該電信號的該產生中,使用複數個雷射感測器,其等之各者包括一雷射發射器及一雷射接收器以產生該電信號, 其中該複數個雷射感測器包含: 上雷射感測器及下雷射感測器,其等被配置為分別偵測該檢測物體之頂部表面及底部表面的表面狀況;及 一或多個側表面雷射感測器,其被配置為偵測一或多個倒角表面、平坦表面、或在兩個平坦表面之間的一傾斜表面的一表面狀況,其中該等倒角表面、該等平坦表面、及該傾斜表面係形成在該檢測物體之該頂部表面與該底部表面之間。 The method of claim 13, wherein in the generation of the electrical signal, a plurality of laser sensors are used, each of which includes a laser transmitter and a laser receiver to generate the electrical signal, wherein the plurality of laser sensors include: an upper laser sensor and a lower laser sensor, which are configured to detect the surface conditions of the top surface and the bottom surface of the detection object, respectively; and one or more side surface laser sensors, which are configured to detect a surface condition of one or more chamfered surfaces, flat surfaces, or an inclined surface between two flat surfaces, wherein the chamfered surfaces, the flat surfaces, and the inclined surface are formed between the top surface and the bottom surface of the detection object.
TW112147261A 2022-12-22 2023-12-05 Apparatus and method for inspecting surface defect TW202426903A (en)

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