TW202239902A - Optical laminate, image display device, and adhesive composition - Google Patents
Optical laminate, image display device, and adhesive composition Download PDFInfo
- Publication number
- TW202239902A TW202239902A TW111106604A TW111106604A TW202239902A TW 202239902 A TW202239902 A TW 202239902A TW 111106604 A TW111106604 A TW 111106604A TW 111106604 A TW111106604 A TW 111106604A TW 202239902 A TW202239902 A TW 202239902A
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- adhesive layer
- acrylate
- weight
- optical
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 135
- 239000000203 mixture Substances 0.000 title claims abstract description 84
- 239000000853 adhesive Substances 0.000 title claims abstract description 81
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 81
- 239000012790 adhesive layer Substances 0.000 claims abstract description 120
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 30
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000012986 modification Methods 0.000 claims abstract description 6
- 230000004048 modification Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 70
- 229920000058 polyacrylate Polymers 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 23
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000003851 corona treatment Methods 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical group [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 95
- -1 methoxy, ethoxy Chemical group 0.000 description 53
- 239000000178 monomer Substances 0.000 description 53
- 239000010408 film Substances 0.000 description 46
- 239000003431 cross linking reagent Substances 0.000 description 32
- 239000003795 chemical substances by application Substances 0.000 description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 26
- 239000003999 initiator Substances 0.000 description 25
- 238000006116 polymerization reaction Methods 0.000 description 23
- 239000002904 solvent Substances 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 15
- 229920002799 BoPET Polymers 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 14
- 239000003505 polymerization initiator Substances 0.000 description 14
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 239000002585 base Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910020175 SiOH Inorganic materials 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000012948 isocyanate Substances 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 125000004429 atom Chemical group 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 150000002978 peroxides Chemical class 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 238000009864 tensile test Methods 0.000 description 6
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 6
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 6
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UURWKEHGDKAGGD-UHFFFAOYSA-N 2-methyl-4-sulfanylbut-2-enamide Chemical compound CC(=CCS)C(=O)N UURWKEHGDKAGGD-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- UVRCNEIYXSRHNT-UHFFFAOYSA-N 3-ethylpent-2-enamide Chemical compound CCC(CC)=CC(N)=O UVRCNEIYXSRHNT-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- BUIZICPOJVBQGZ-UHFFFAOYSA-N 5-methylhexyl prop-2-enoate Chemical compound CC(C)CCCCOC(=O)C=C BUIZICPOJVBQGZ-UHFFFAOYSA-N 0.000 description 1
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- OSJIQLQSJBXTOH-UHFFFAOYSA-N 8-tricyclo[5.2.1.02,6]decanylmethyl prop-2-enoate Chemical compound C12CCCC2C2CC(COC(=O)C=C)C1C2 OSJIQLQSJBXTOH-UHFFFAOYSA-N 0.000 description 1
- URKRQLZDVYEUSU-PLNGDYQASA-N C(\C=C/C(=O)O)(=O)OOCCCC Chemical group C(\C=C/C(=O)O)(=O)OOCCCC URKRQLZDVYEUSU-PLNGDYQASA-N 0.000 description 1
- HOMKXXLEXBYVAM-ZVVJOPMHSA-N CN1CC[C@@]23[C@H]4Oc5c2c(C[C@@H]1[C@@H]3C=C[C@@H]4O)ccc5OC(=O)C=C Chemical compound CN1CC[C@@]23[C@H]4Oc5c2c(C[C@@H]1[C@@H]3C=C[C@@H]4O)ccc5OC(=O)C=C HOMKXXLEXBYVAM-ZVVJOPMHSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N Methylcyclohexane Natural products CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- DCTLJGWMHPGCOS-UHFFFAOYSA-N Osajin Chemical compound C1=2C=CC(C)(C)OC=2C(CC=C(C)C)=C(O)C(C2=O)=C1OC=C2C1=CC=C(O)C=C1 DCTLJGWMHPGCOS-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- UIDZKLBCABAXMS-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCC(CO)CC1 UIDZKLBCABAXMS-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- WRAABIJFUKKEJQ-UHFFFAOYSA-N cyclopentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCC1 WRAABIJFUKKEJQ-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 239000002608 ionic liquid Chemical class 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 150000002596 lactones Chemical group 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000006902 nitrogenation reaction Methods 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Theoretical Computer Science (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Polarising Elements (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明涉及光學積層體、影像顯示裝置及黏著劑組成物。The invention relates to an optical laminate, an image display device and an adhesive composition.
液晶顯示器及有機EL顯示器等各種薄型影像顯示裝置通常具備有光學積層體,且該光學積層體具備光學基材與配置於光學基材之表面的黏著劑層。光學基材之例為液晶層及有機EL發光層等之影像形成層、偏光板及相位差薄膜等之光學薄膜、以及覆蓋窗。黏著劑層係使用於接合光學積層體所含之各層。又,在由複數層構成之光學基材、例如由偏光件與偏光件保護薄膜構成之偏光板等中,亦有藉由黏著劑層接合該複數層之情形。Various thin image display devices such as liquid crystal displays and organic EL displays generally include an optical layered body, and the optical layered body includes an optical base material and an adhesive layer arranged on the surface of the optical base material. Examples of optical substrates are image forming layers such as liquid crystal layers and organic EL light emitting layers, optical films such as polarizing plates and retardation films, and cover windows. The adhesive layer is used to join the layers contained in the optical laminate. In addition, in an optical substrate composed of multiple layers, for example, a polarizing plate composed of a polarizer and a polarizer protective film, the multiple layers may be bonded via an adhesive layer.
專利文獻1中揭示了一種光學積層體,其係由透光性被黏著體、包含特定矽烷耦合劑之黏著劑層及偏光板構成,且該特定矽烷耦合劑係於一末端具有環氧基者。專利文獻1中記載了藉由含有上述矽烷耦合劑可提升黏著劑層對玻璃板之接著性。 先前技術文獻 專利文獻 Patent Document 1 discloses an optical laminate consisting of a light-transmitting adherend, an adhesive layer containing a specific silane coupling agent, and a polarizing plate, and the specific silane coupling agent has an epoxy group at one end . Patent Document 1 describes that the adhesion of the adhesive layer to the glass plate can be improved by including the above-mentioned silane coupling agent. prior art literature patent documents
專利文獻1:日本專利特開平7-20314號公報Patent Document 1: Japanese Patent Laid-Open No. 7-20314
發明欲解決之課題 影像顯示裝置可能會暴露於高溫下。因此,對於光學積層體要求即使在高溫下仍不易在透過黏著劑層接合之層之間發生剝落,換言之,要求具有優異之在高溫下之耐剝落性。又,為了輕量化及高機能化等,影像顯示裝置多使用玻璃基材以外之光學基材,從而要求在玻璃基材以外之光學基材之間亦不易發生剝落。但,根據本發明人等之研討,專利文獻1之光學積層體並無法充分對應。 The problem to be solved by the invention Image display devices may be exposed to high temperatures. Therefore, the optical layered body is required to be resistant to peeling between the layers bonded through the adhesive layer even at high temperature, in other words, to have excellent peeling resistance at high temperature. In addition, image display devices often use optical substrates other than glass substrates in order to reduce weight and improve functionality. Therefore, it is required that peeling between optical substrates other than glass substrates is also difficult to occur. However, according to the study of the inventors of the present invention, the optical layered body of Patent Document 1 cannot sufficiently cope.
本發明目的在於提供一種在高溫下之耐剝落性優異之光學積層體。An object of the present invention is to provide an optical layered body excellent in peeling resistance at high temperature.
用以解決課題之手段 本發明提供一種光學積層體,具備光學基材與配置於前述光學基材之表面的黏著劑層; 前述黏著劑層包含含矽烷耦合劑之黏著劑組成物; 前述矽烷耦合劑含有異三聚氰酸環,且不含異氰酸酯基; 配置有前述黏著劑層之前述表面係經照射能量而表面改質之改質面。 means to solve problems The present invention provides an optical laminate, comprising an optical substrate and an adhesive layer disposed on the surface of the optical substrate; The aforementioned adhesive layer comprises an adhesive composition containing a silane coupling agent; The aforementioned silane coupling agent contains an isocyanuric acid ring and does not contain an isocyanate group; The above-mentioned surface on which the above-mentioned adhesive layer is disposed is a modified surface whose surface is modified by irradiating energy.
在另一面向中,本發明提供一種影像顯示裝置,具備上述本發明光學積層體及影像形成層。In another aspect, the present invention provides an image display device comprising the above-mentioned optical layered body of the present invention and an image forming layer.
在另一面向中,本發明提供一種黏著劑組成物,係配置於光學基材之表面上使用者; 該黏著劑組成物包含矽烷耦合劑; 前述矽烷耦合劑含有異三聚氰酸環,且不含異氰酸酯基; 可供配置前述黏著劑組成物之前述表面係經照射能量而表面改質的改質面。 In another aspect, the present invention provides an adhesive composition for use on the surface of an optical substrate; The adhesive composition comprises a silane coupling agent; The aforementioned silane coupling agent contains an isocyanuric acid ring and does not contain an isocyanate group; The aforementioned surface on which the aforementioned adhesive composition can be placed is a modified surface modified by irradiating energy.
發明效果 根據本發明,可提供一種在高溫下之耐剝落性優異之光學積層體。 Invention effect According to the present invention, it is possible to provide an optical laminate excellent in peeling resistance at high temperature.
以下邊參照圖式邊說明本發明實施形態。本發明不受以下實施形態所限。Embodiments of the present invention will be described below with reference to the drawings. The present invention is not limited by the following embodiments.
[光學積層體]
於圖1顯示本實施形態之光學積層體。圖1之光學積層體100具備光學基材1與黏著劑層2。黏著劑層2係配置於光學基材1之表面11。黏著劑層2及光學基材1係相互接觸。配置有黏著劑層2之表面11係經照射能量而表面改質之改質面12。黏著劑層2包含含矽烷耦合劑(以下記載為「Si劑(X)」)之黏著劑組成物,該矽烷耦合劑含有異三聚氰酸環但不含異氰酸酯基。異三聚氰酸環為以下式(1)所示之結構。式(1)中之至少1個*(鍵結部位)上鍵結有包含Si原子及水解性基之分子結構(Y)。分子結構(Y)可與2個*鍵結,亦可與3個*全部鍵結。未鍵結分子結構(Y)之*無特別限制,可鍵結氫原子、鹵素原子或有機殘基。
[Optical laminate]
The optical layered body of this embodiment is shown in FIG. 1. The
[化學式1] [chemical formula 1]
吾等認為含有Si劑(X)有助於維持黏著劑層2在高溫(例如50-100℃,典型上為80℃)下之凝集力、及提升在高溫下對光學基材1之改質面12之黏著力。維持凝集力、換言之抑制黏著劑層2之凝集破壞與提升黏著力會促使在高溫下之耐剝落性提升。吾等推測上述貢獻會發揮以下作用:(I)尤其在異三聚氰酸環之複數個*鍵結有分子結構(Y)時,黏著劑層2中可形成與改質面12之共價鍵的分子結構(Y)之分布可變得更均一;(II)可在與改質面12之間形成氫鍵之NCO結構係在異三聚氰酸環中於3個方向上均等擴展;及(III)異三聚氰酸環之NCO結構係與異氰酸酯基不同,不容易與黏著劑層2中可含之其他材料、例如聚合物或交聯劑形成鍵結,而可提升黏著劑層2之交聯結構的均一性。此外,根據本案發明人等之研討,黏著劑層2之凝集力可利用800%模數進行評估。We believe that the inclusion of Si agent (X) helps to maintain the cohesion of the
又,Si劑(X)可相對較多地存在於黏著劑層2中之與光學基材1之界面3附近的區域21。偏存於區域21可促使在高溫下對改質面12之黏著力更加提升。由上述面向來看,Si劑(X)亦可偏存於黏著劑層2中之與光學基材1之界面3附近的區域21。界面3附近之區域21係指例如從界面3往黏著劑層2之厚度方向佔該層2之厚度的20%之區域。黏著劑層2中之Si劑(X)的分布例如可藉由併用蝕刻離子之飛行時間型二次離子質譜分析(TOF-SIMS)等可對層之厚度方向進行元素分析之評估手法來確認。偏存例如可藉由TOF-SIMS所得之繪圖來確認,該繪圖係令橫軸為蝕刻時間(對應黏著劑層2之厚度方向)且令縱軸為SiOH
+(m/z=45)之強度。在Si劑(X)偏存之黏著劑層2中,區域21中之SiOH
+峰之面積和可為黏著劑層2中可測定之SiOH
+峰之面積和的50%以上,亦可為60%以上、70%以上、80%以上,更可為90%以上。此外,SiOH
+之強度亦可為在TOF-SIMS之評估時,根據從黏著劑層2大量生成且m/z不與SiOH
+重複之離子強度進行規格化後之值(規格化強度)。黏著劑層2包含丙烯酸系黏著劑組成物時,該離子例如為C
2H
3 +。
In addition, the Si agent (X) can exist in a relatively large amount in the
圖1之例中,係於光學基材1之表面11整體配置有黏著劑層2。以與表面11垂直來觀看時,光學基材1及黏著劑層2具有相同之形狀。惟,黏著劑層12若有配置於表面11之至少一部分即可。又,圖1之表面11其整體為改質面12。惟,表面11之至少一部分若為改質面12即可。In the example of FIG. 1 , the
[Si劑(X)] Si劑(X)含有異三聚氰酸環。Si劑(X)所含有之異三聚氰酸環之數量可為1或2以上,亦可為1。Si劑(X)中,每個異三聚氰酸環之Si原子之數量可為1,亦可大於1、為2以上,更可為3以上。1個分子結構(Y)中所含之Si原子之數量無限定,典型上為1。 [Si agent (X)] The Si agent (X) contains an isocyanuric acid ring. The number of isocyanuric acid rings contained in the Si agent (X) may be 1 or more, or may be 1. In the Si agent (X), the number of Si atoms per isocyanuric acid ring may be 1, may be greater than 1, may be 2 or more, and may be 3 or more. The number of Si atoms contained in one molecular structure (Y) is not limited, and is typically one.
Si劑(X)之Si原子上亦可鍵結有含水解性基之分子結構。水解性基例如為碳數1~4之烷氧基,可為甲氧基或乙氧基,亦可為甲氧基。水解性基亦可直接鍵結於Si原子上。A molecular structure containing a hydrolyzable group may also be bonded to the Si atom of the Si agent (X). The hydrolyzable group is, for example, an alkoxy group having 1 to 4 carbon atoms, which may be methoxy, ethoxy, or methoxy. The hydrolyzable group may be directly bonded to the Si atom.
Si劑(X)不含有異氰酸酯基。Si劑(X)可不含異氰酸酯基以外之反應性官能基,尤其亦可不於末端含有異氰酸酯基以外之反應性官能基。惟,反應性官能基不包含鍵結於Si原子之水解性基及異三聚氰酸環。反應性官能基之例為環氧基、胺基、乙烯基、苯乙烯基、(甲基)丙烯醯基、脲基、巰基,尤其為環氧基、胺基,且為環氧基。相較於異氰酸酯基,該等基團與黏著劑層2可含之其他材料的反應性較低。但,不含反應性官能基有助於提升黏著劑層2之交聯結構的均一性。又,胺基容易與聚合物以外之材料、例如交聯劑進行反應。The Si agent (X) does not contain an isocyanate group. The Si agent (X) may not contain a reactive functional group other than an isocyanate group, and particularly may not contain a reactive functional group other than an isocyanate group at a terminal. However, the reactive functional groups do not include hydrolyzable groups and isocyanuric acid rings bonded to Si atoms. Examples of reactive functional groups are epoxy, amine, vinyl, styryl, (meth)acryl, ureido, mercapto, especially epoxy, amine, and epoxy. Compared with isocyanate groups, these groups are less reactive with other materials that the
將Si劑(X)之例顯示於以下式(2)。式(2)之Si劑(X)為參-(三烷氧基矽基烷基)三聚異氰酸酯。式(2)之R 1、R 2及R 3彼此獨立為碳數1~6之伸烷基,可為碳數2~4之烷基,亦可為丙基。R 11、R 12、R 13、R 21、R 22、R 23、R 31、R 32及R 33彼此獨立為碳數1~4之烷氧基,可為甲氧基或乙氧基,亦可為甲氧基。 An example of the Si agent (X) is shown in the following formula (2). The Si agent (X) of the formula (2) is ginseng-(trialkoxysilyl alkyl) isocyanurate. R 1 , R 2 and R 3 in formula (2) are independently an alkylene group with 1 to 6 carbons, may be an alkyl group with 2 to 4 carbons, or may be a propyl group. R 11 , R 12 , R 13 , R 21 , R 22 , R 23 , R 31 , R 32 and R 33 are independently an alkoxy group with 1 to 4 carbons, which may be methoxy or ethoxy, or May be methoxy.
[化學式2] [chemical formula 2]
[黏著劑組成物]
黏著劑層2所含之黏著劑組成物中之Si劑(X)之含有率例如為0.01重量%以上且5.0重量%以下,可為0.01重量%以上且3.0重量%以下、0.05重量%以上且1.0重量%以下、0.1重量%以上且0.5重量%以下,更可為0.15重量%以上且0.4重量%以下。含有率之適當控制有助於更確實提升高溫下之耐剝落性。
[Adhesive composition]
The content of the Si agent (X) in the adhesive composition contained in the
黏著劑組成物例如包含(甲基)丙烯酸系聚合物。(甲基)丙烯酸系聚合物可為黏著劑組成物之主成分,換言之,黏著劑組成物亦可為丙烯酸系。丙烯酸系黏著劑組成物之透明性、加工性、耐久性及密著性等之各種特性優異。惟,黏著劑組成物不受丙烯酸系所限。本說明書中,(甲基)丙烯酸意指丙烯酸及/或甲基丙烯酸。又,主成分意指組成物中含有率最大之成分。主成分之含有率例如為50重量%以上,可為70重量%以上、80重量%以上、90重量%以上、95重量%以上、97重量%以上、98重量%以上,更可為99重量%以上。The adhesive composition includes, for example, a (meth)acrylic polymer. The (meth)acrylic polymer can be the main component of the adhesive composition, in other words, the adhesive composition can also be acrylic. The acrylic adhesive composition is excellent in various properties such as transparency, processability, durability, and adhesion. However, the adhesive composition is not limited to acrylic. In this specification, (meth)acrylic acid means acrylic acid and/or methacrylic acid. Also, the main component means the component with the largest content in the composition. The content of the main component is, for example, 50% by weight or more, may be 70% by weight or more, 80% by weight or more, 90% by weight or more, 95% by weight or more, 97% by weight or more, 98% by weight or more, and may be 99% by weight above.
黏著劑組成物亦可包含有1種或2種以上(甲基)丙烯酸系聚合物。The adhesive composition may also contain one or more than two (meth)acrylic polymers.
<(甲基)丙烯酸系聚合物> (甲基)丙烯酸系聚合物可具有源自於側鏈具有碳數1~30烷基之(甲基)丙烯酸系單體(a1)的單元(a2),亦可具有單元(a2)作為主要單元。烷基可為直鏈狀,亦可具有支鏈。(甲基)丙烯酸系聚合物亦可具有1種或2種以上單元(a2)。 <(Meth)acrylic polymer> The (meth)acrylic polymer may have a unit (a2) derived from a (meth)acrylic monomer (a1) having an alkyl group having 1 to 30 carbon atoms in the side chain, or may have the unit (a2) as the main unit. The alkyl group may be linear or branched. A (meth)acrylic polymer may have 1 type, or 2 or more types of units (a2).
單體(a1)之例為:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸異己酯、(甲基)丙烯酸異庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二酯((甲基)丙烯酸月桂酯)、(甲基)丙烯酸正十三酯及(甲基)丙烯酸正十四酯。本說明書中,「主要單元」意指在聚合物具有之總構成單元中例如佔50重量%以上之單元,宜為佔80重量%以上之單元,較宜為佔90重量%以上之單元,更宜為佔94重量%以上之單元。主要單元所佔之比率的上限例如為99.9重量%以下,亦可為99.5重量%以下。Examples of the monomer (a1) are: methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, secondary butyl (meth)acrylate, tri-butyl (meth)acrylate Grade butyl ester, isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isoamyl (meth)acrylate, n-hexyl (meth)acrylate, isohexyl (meth)acrylate, (meth) ) isoheptyl acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, (meth)acrylic acid Isononyl, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecyl (meth)acrylate (lauryl (meth)acrylate), n-tridecyl (meth)acrylate and tetradecyl (meth)acrylate. In this specification, the "main unit" means, for example, a unit accounting for more than 50% by weight, preferably more than 80% by weight, more preferably more than 90% by weight, of the total structural units of the polymer, and more preferably It is preferably a unit accounting for 94% by weight or more. The upper limit of the ratio of the main unit is, for example, 99.9% by weight or less, and may be 99.5% by weight or less.
(甲基)丙烯酸系聚合物亦可具有源自於側鏈具有長鏈烷基之單體(a1)的單元(a2)。該單體(a1)例如為(甲基)丙烯酸正十二酯。本說明書中,長鏈烷基意指碳數6~30之烷基。A (meth)acrylic polymer may have the unit (a2) derived from the monomer (a1) which has a long-chain alkyl group in a side chain. The monomer (a1) is, for example, n-dodecyl (meth)acrylate. In this specification, a long-chain alkyl group means an alkyl group having 6 to 30 carbon atoms.
(甲基)丙烯酸系聚合物採用均聚物時,亦可具有源自Tg在-70℃~-20℃之範圍內之單體(a1)的單元(a2)。該單體(a1)例如為丙烯酸2-乙基己酯。When a (meth)acrylic polymer is a homopolymer, it may have the unit (a2) derived from the monomer (a1) whose Tg exists in -70 degreeC - -20 degreeC. The monomer (a1) is, for example, 2-ethylhexyl acrylate.
(甲基)丙烯酸系聚合物亦可具有單元(a2)以外之單元。該單元例如係源自可與單體(a1)共聚之單體(b1)的單元(b2)。(甲基)丙烯酸系聚合物亦可具有1種或2種以上單元(b2)。The (meth)acrylic polymer may have units other than the unit (a2). This unit is, for example, a unit (b2) derived from a monomer (b1) copolymerizable with the monomer (a1). A (meth)acrylic polymer may have 1 type, or 2 or more types of units (b2).
單體(b1)之例為具有羥基之(甲基)丙烯酸系單體(c1)。單體(b1)亦可為含有羥基之(甲基)丙烯酸酯單體。單體(c1)之例為:(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸3-羥丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸6-羥己酯、(甲基)丙烯酸8-羥辛酯、(甲基)丙烯酸10-羥癸酯及(甲基)丙烯酸12-羥月桂酯等之(甲基)丙烯酸羥烷基酯以及(4-羥甲基環己基)-甲基丙烯酸酯。由可提升黏著劑組成物之耐久性來看,單體(c1)亦可為(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸4-羥丁酯。An example of the monomer (b1) is a (meth)acrylic monomer (c1) having a hydroxyl group. The monomer (b1) may also be a hydroxyl-containing (meth)acrylate monomer. Examples of monomers (c1) are: 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyl (meth)acrylate Hydroxyalkyl (meth)acrylates such as hexyl ester, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate and 12-hydroxylauryl (meth)acrylate, and (4- Hydroxymethylcyclohexyl)-methacrylate. In view of improving the durability of the adhesive composition, the monomer (c1) can also be 2-hydroxyethyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate.
單體(b1)亦可為含胺基單體、含醯胺基單體。含胺基單體之例為N,N-二甲基胺乙基(甲基)丙烯酸酯及N,N-二甲基胺丙基(甲基)丙烯酸酯等。含醯胺基單體之例為:(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-異丙基丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-己基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基-N-丙烷(甲基)丙烯醯胺、胺甲基(甲基)丙烯醯胺、胺乙基(甲基)丙烯醯胺、巰甲基(甲基)丙烯醯胺及巰乙基(甲基)丙烯醯胺等丙烯醯胺系單體;N-(甲基)丙烯醯基嗎福林、N-(甲基)丙烯醯基哌啶及N-(甲基)丙烯醯基吡咯啶等N-丙烯醯基雜環單體;以及N-乙烯吡咯啶酮及N-乙烯基-ε-己內醯胺等含N-乙烯基內醯胺系單體等。The monomer (b1) may also be an amino group-containing monomer or an amide group-containing monomer. Examples of amino group-containing monomers include N,N-dimethylaminoethyl (meth)acrylate and N,N-dimethylaminopropyl (meth)acrylate. Examples of amide-containing monomers are: (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N- Isopropylacrylamide, N-methyl(meth)acrylamide, N-butyl(meth)acrylamide, N-hexyl(meth)acrylamide, N-methylol(methyl)acrylamide ) acrylamide, N-methylol-N-propane(meth)acrylamide, aminomethyl(meth)acrylamide, aminoethyl(meth)acrylamide, mercaptomethyl(methyl)acrylamide ) acrylamide and mercaptoethyl (meth)acrylamide and other acrylamide-based monomers; N-acryl heterocyclic monomers such as (meth)acrylpyrrolidine; body etc.
單體(b1)亦可為含羧基單體。含羧基單體之例為(甲基)丙烯酸、(甲基)丙烯酸羧乙酯、(甲基)丙烯酸羧戊酯、伊康酸、馬來酸、延胡索酸、巴豆酸。惟,源自含羧基單體的單元其使黏著劑層2之彈性模數增加之作用強,而有包含具有該單元之(甲基)丙烯酸系聚合物的黏著劑層2之物性設計的自由度降低之傾向。又,具有該單元之(甲基)丙烯酸系聚合物可藉由光學基材所含之材料而具有對光學基材之抗腐蝕性。由該觀點來看,(甲基)丙烯酸系聚合物中源自含羧基單體的單元之含有率宜為5重量%以下,可為3重量%以下、1.5重量%以下、1重量%以下、0.5重量%以下,更可為0重量%(不包含該單元)。The monomer (b1) may also be a carboxyl group-containing monomer. Examples of carboxyl group-containing monomers are (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid. However, the unit derived from a carboxyl group-containing monomer has a strong effect of increasing the modulus of elasticity of the
單體(b1)亦可為多官能性單體。藉由使用多官能性單體,可調整黏著劑組成物之凝膠分率。多官能性單體之例為:己二醇二(甲基)丙烯酸酯(1,6-己二醇二(甲基)丙烯酸酯)、丁二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、新戊四醇二(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、三羥甲丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、環氧丙烯酸酯、聚酯丙烯酸酯及胺甲酸酯丙烯酸酯等多官能丙烯酸酯;以及二乙烯苯。多官能丙烯酸酯宜為1,6-己二醇二丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯。The monomer (b1) may also be a polyfunctional monomer. By using multifunctional monomers, the gel fraction of the adhesive composition can be adjusted. Examples of polyfunctional monomers are: hexanediol di(meth)acrylate (1,6-hexanediol di(meth)acrylate), butanediol di(meth)acrylate, (poly) Ethylene Glycol Di(meth)acrylate, (Poly)propylene Glycol Di(meth)acrylate, Neopentyl Glycol Di(meth)acrylate, Neopentyl Glycol Di(meth)acrylate, Neopentyl tetra Alcohol tri(meth)acrylate, Dineopentaerythritol hexa(meth)acrylate, Trimethylolpropane tri(meth)acrylate, Tetramethylolmethane tri(meth)acrylate, (Meth ) polyfunctional acrylates such as allyl acrylate, vinyl (meth)acrylate, epoxy acrylate, polyester acrylate and urethane acrylate; and divinylbenzene. The multifunctional acrylate is preferably 1,6-hexanediol diacrylate and dipenteoerythritol hexa(meth)acrylate.
上述以外之其他單體(b1)之例為:(甲基)丙烯酸2-甲氧乙酯、(甲基)丙烯酸2-乙氧乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧丙酯、(甲基)丙烯酸3-乙氧丙酯、(甲基)丙烯酸4-甲氧丁酯及(甲基)丙烯酸4-乙氧丁酯等(甲基)丙烯酸烷氧基烷基酯;(甲基)丙烯酸環氧丙酯及(甲基)丙烯酸甲基環氧丙酯等含環氧基單體;乙烯基磺酸鈉等含磺酸基單體;含磷酸基單體;(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯及(甲基)丙烯酸異莰酯等具有脂環式烴基之(甲基)丙烯酸酯;(甲基)丙烯酸苯酯、(甲基)丙烯酸苯氧乙酯及(甲基)丙烯酸苄酯等具有芳香族烴基之(甲基)丙烯酸酯;乙酸乙烯酯及丙酸乙烯酯等乙烯酯類;苯乙烯及乙烯基甲苯等芳香族乙烯基化合物;乙烯、丙烯、丁二烯、異戊二烯及異丁烯等烯烴類或二烯類;乙烯基烷基醚等乙烯基醚類;以及氯乙烯。Examples of other monomers (b1) other than the above are: 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate , 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate and 4-ethoxybutyl (meth)acrylate, etc. ( Alkoxyalkyl methacrylate; Epoxy-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; sodium vinylsulfonate and other sulfonic acid groups Monomers; monomers containing phosphoric acid groups; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate and isocamphoryl (meth)acrylate and other (meth)acrylates with alicyclic hydrocarbon groups; ( (meth)acrylates with aromatic hydrocarbon groups such as phenyl methacrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; Aromatic vinyl compounds such as styrene and vinyltoluene; olefins or dienes such as ethylene, propylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ethers; and vinyl chloride.
(甲基)丙烯酸系聚合物中,源自具有羥基之(甲基)丙烯酸系單體(c1)、含胺基單體、含醯胺基單體及多官能性單體的單元之含有率的合計例如為20重量%以下,可為10重量%以下、8重量%以下,更可為5重量%以下。(甲基)丙烯酸系聚合物具有該單元時,該單元之含有率的合計例如為0.01重量%以上,亦可為0.05重量%以上。Content rate of units derived from (meth)acrylic monomer (c1) having a hydroxyl group, amine group-containing monomer, amide group-containing monomer, and polyfunctional monomer in (meth)acrylic polymer The total of is, for example, 20% by weight or less, may be 10% by weight or less, 8% by weight or less, and may be 5% by weight or less. When the (meth)acrylic polymer has the unit, the total content of the unit may be, for example, 0.01% by weight or more, or may be 0.05% by weight or more.
(甲基)丙烯酸系聚合物中源自單體(b1)的單元(b2)之含有率的合計例如為30重量%以下,可為10重量%以下,亦可為0重量%(不含該單元)。The total content of the unit (b2) derived from the monomer (b1) in the (meth)acrylic polymer is, for example, 30% by weight or less, may be 10% by weight or less, or may be 0% by weight (excluding this unit).
(甲基)丙烯酸系聚合物可藉由公知之方法將包含上述單體之單體群聚合而形成。亦可將單體與單體之部分聚合物聚合。聚合例如可藉由溶液聚合、乳化聚合、塊狀聚合、熱聚合、活性能量線聚合來實施。由可形成光學透明性優異之黏著劑組成物來看,聚合宜為溶液聚合、活性能量線聚合。聚合宜避免單體及/或部分聚合物與氧接觸來實施,因此可採用例如在氮等非活性氣體環境下之聚合、或是在藉由樹脂薄膜等阻隔氧之狀態下之聚合。形成之(甲基)丙烯酸系聚合物可為無規共聚物、嵌段共聚物、接枝共聚物等之任一形態,亦可為無規共聚物。The (meth)acrylic polymer can be formed by polymerizing a monomer group including the above-mentioned monomers by a known method. It is also possible to polymerize monomers and partial polymers of monomers. Polymerization can be implemented by, for example, solution polymerization, emulsion polymerization, bulk polymerization, thermal polymerization, or active energy ray polymerization. In view of the fact that an adhesive composition with excellent optical transparency can be formed, the polymerization is preferably solution polymerization or active energy ray polymerization. Polymerization should be carried out by avoiding contact of monomer and/or part of the polymer with oxygen. Therefore, for example, polymerization in an inert gas environment such as nitrogen, or polymerization in a state where oxygen is blocked by a resin film or the like can be used. The formed (meth)acrylic polymer may be in any form of random copolymer, block copolymer, graft copolymer, etc., and may also be a random copolymer.
形成(甲基)丙烯酸系聚合物之聚合系亦可包含有1種或2種以上聚合引發劑。聚合引發劑之種類可依聚合反應來選擇,例如可為光聚合引發劑、熱聚合引發劑。The polymerization system for forming a (meth)acrylic polymer may also contain one or two or more polymerization initiators. The type of polymerization initiator can be selected according to the polymerization reaction, for example, it can be a photopolymerization initiator or a thermal polymerization initiator.
溶液聚合所用之溶劑例如為:乙酸乙酯、乙酸正丁酯等酯類;甲苯、苯等芳香族烴類;正己烷、正庚烷等脂肪族烴類;環己烷、甲基環己烷等脂環式烴類;甲基乙基酮、甲基異丁基酮等酮類。惟,溶劑不受上述例所限。溶劑亦可為2種以上溶劑之混合溶劑。Solvents used in solution polymerization are, for example: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methylcyclohexane Alicyclic hydrocarbons such as methyl ethyl ketone, methyl isobutyl ketone and other ketones. However, the solvent is not limited to the above examples. The solvent may be a mixed solvent of two or more solvents.
溶液聚合所用之聚合引發劑例如為偶氮系聚合引發劑、過氧化物系聚合引發劑、氧化還原系聚合引發劑。過氧化物系聚合引發劑例如為二苯甲醯基過氧化物、過氧化馬來酸三級丁酯。其中以日本專利特開2002-69411號公報中揭示之偶氮系聚合引發劑為佳。該偶氮系聚合引發劑例如為2,2'-偶氮雙異丁腈(AIBN)、2,2'-偶氮雙-2-甲基丁腈、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰戊酸。惟,聚合引發劑不受上述例所限。偶氮系聚合引發劑之使用量例如相對於單體之總量100重量份為0.05~0.5重量份,亦可為0.1~0.3重量份。The polymerization initiator used for the solution polymerization is, for example, an azo-type polymerization initiator, a peroxide-type polymerization initiator, or a redox-type polymerization initiator. Peroxide-based polymerization initiators are, for example, dibenzoyl peroxide and tertiary butyl peroxymaleate. Among them, the azo-based polymerization initiator disclosed in Japanese Patent Application Laid-Open No. 2002-69411 is preferred. The azo-based polymerization initiator is, for example, 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis-2-methylbutyronitrile, 2,2'-azobis(2 -dimethylpropionate), 4,4'-azobis-4-cyanovaleric acid. However, the polymerization initiator is not limited to the above examples. The usage-amount of an azo type polymerization initiator is 0.05-0.5 weight part with respect to 100 weight part of total monomers, for example, and may be 0.1-0.3 weight part.
活性能量線聚合所用之活性能量線例如為α射線、β射線、γ射線、中子射線、電子束等游離輻射線、及紫外線。活性能量線以紫外線為佳。利用紫外線照射之聚合亦稱為光聚合。活性能量線聚合之聚合系典型上包含光聚合引發劑。活性能量聚合之聚合條件只要能形成(甲基)丙烯酸系聚合物,便無限定。The active energy rays used for active energy ray polymerization are, for example, alpha rays, beta rays, gamma rays, neutron rays, ionizing radiation rays such as electron beams, and ultraviolet rays. The active energy rays are preferably ultraviolet rays. Polymerization by ultraviolet irradiation is also called photopolymerization. The polymerization system of active energy ray polymerization typically includes a photopolymerization initiator. The polymerization conditions of the active energy polymerization are not limited as long as a (meth)acrylic polymer can be formed.
光聚合引發劑例如為:苯偶姻醚系光聚合引發劑、苯乙酮系光聚合引發劑、α-酮醇系光聚合引發劑、芳香族磺醯氯系光聚合引發劑、光活性肟系光聚合引發劑、苯偶姻系光聚合引發劑、苯甲基系光聚合引發劑、二苯基酮系光聚合引發劑、縮酮系光聚合引發劑、9-氧硫𠮿系光聚合引發劑。惟,光聚合引發劑不受上述例所限。The photopolymerization initiator is, for example, a benzoin ether photopolymerization initiator, an acetophenone photopolymerization initiator, an α-ketol alcohol photopolymerization initiator, an aromatic sulfonyl chloride photopolymerization initiator, a photoactive oxime Photopolymerization initiator, benzoin photopolymerization initiator, benzyl photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator, 9-oxosulfur Department of photopolymerization initiator. However, the photopolymerization initiator is not limited to the above examples.
苯偶姻醚系光聚合引發劑例如為:苯偶姻甲醚、苯偶姻乙醚、苯偶姻丙醚、苯偶姻異丙醚、苯偶姻異丁醚、2,2-二甲氧基-1,2-二苯基乙-1-酮、苯甲醚甲醚。苯乙酮系光聚合引發劑例如為:2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥環己基苯基酮、4-苯氧基二氯苯乙酮、4-(三級丁基)二氯苯乙酮。α-酮醇系光聚合引發劑例如為:2-甲基-2-羥苯丙酮、1-[4-(2-羥乙基)苯]-2-甲基丙-1-酮。芳香族磺醯氯系光聚合引發劑例如為2-萘磺醯氯。光活性肟系光聚合引發劑例如為1-苯-1,1-丙二酮-2-(鄰乙氧羰基)-肟。苯偶姻系光聚合引發劑例如為苯偶姻。苯甲基系光聚合引發劑例如為苯甲基。二苯基酮系光聚合引發劑例如為二苯基酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯基酮、聚乙烯基二苯基酮、α-羥環己基苯基酮。縮酮系光聚合引發劑例如為苯甲基二甲基縮酮。9-氧硫𠮿系光聚合引發劑例如為:9-氧硫𠮿、2-氯9-氧硫𠮿、2-甲基9-氧硫𠮿、2,4-二甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2,4-二異丙基9-氧硫𠮿、十二烷基9-氧硫𠮿。Benzoin ether-based photopolymerization initiators are, for example: benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy Base-1,2-diphenylethan-1-one, anisole methyl ether. Acetophenone-based photopolymerization initiators are, for example: 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 4 -Phenoxydichloroacetophenone, 4-(tertiary butyl)dichloroacetophenone. The α-ketol-based photopolymerization initiators include, for example, 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)benzene]-2-methylpropan-1-one. The aromatic sulfonyl chloride photopolymerization initiator is, for example, 2-naphthalenesulfonyl chloride. The photoactive oxime-based photopolymerization initiator is, for example, 1-benzene-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. The benzoin-based photopolymerization initiator is, for example, benzoin. The benzyl group photopolymerization initiator is, for example, benzyl group. Benzophenone-based photopolymerization initiators are, for example, diphenyl ketone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxydiphenyl ketone, polyvinyl diphenyl ketone, α - Hydroxycyclohexyl phenyl ketone. The ketal photopolymerization initiator is, for example, benzyl dimethyl ketal. 9-oxosulfur A photopolymerization initiator such as: 9-oxosulfur 𠮿 , 2-Chloro9-oxosulfur 𠮿 , 2-methyl 9-oxosulfur 𠮿 , 2,4-Dimethyl 9-oxosulfur 𠮿 , Isopropyl 9-oxosulfur , 2,4-Diisopropyl 9-oxosulfur 𠮿 , dodecyl 9-oxosulfur 𠮿 .
光聚合引發劑之使用量例如相對於單體之總量100重量份為0.01~1重量份,亦可為0.05~0.5重量份。The usage-amount of a photoinitiator is 0.01-1 weight part with respect to 100 weight part of total monomers, for example, and may be 0.05-0.5 weight part.
此外,單體(b1)之多官能性單體(多官能性丙烯酸酯等)亦可使用於溶劑型及活性能量線硬化型中之任一型之黏著劑組成物。對溶劑型黏著劑組成物使用多官能性單體及光聚合引發劑兩者時,例如藉由熱乾燥去除溶劑後,藉由照射活性能量線使黏著劑組成物之硬化進行即可。In addition, the polyfunctional monomer (polyfunctional acrylate, etc.) of the monomer (b1) can also be used in any adhesive composition of a solvent type or an active energy ray hardening type. When using both a polyfunctional monomer and a photopolymerization initiator for a solvent-based adhesive composition, the adhesive composition may be cured by irradiating active energy rays after removing the solvent by, for example, thermal drying.
(甲基)丙烯酸系聚合物之重量平均分子量(Mw)例如為100萬以上,可為120萬以上、150萬以上、180萬以上,更可為200萬以上。Mw的上限例如為300萬以下。The weight average molecular weight (Mw) of a (meth)acrylic-type polymer is 1 million or more, for example, 1.2 million or more, 1.5 million or more, 1.8 million or more, and 2 million or more. The upper limit of Mw is, for example, 3 million or less.
(甲基)丙烯酸系聚合物之分子量分布(Mw/數量平均分子量(Mn))例如為2~20,亦可為4~15。此外,本說明書中之聚合物及寡聚物之Mw及Mn係根據GPC(凝膠滲透層析儀;Gel Permeation Chromatography)測定之值(換算成聚苯乙烯)。The molecular weight distribution (Mw/number average molecular weight (Mn)) of a (meth)acrylic-type polymer is 2-20, for example, and 4-15 may be sufficient. In addition, the Mw and Mn of a polymer and an oligomer in this specification are the values measured by GPC (gel permeation chromatography; Gel Permeation Chromatography) (in terms of polystyrene).
黏著劑組成物中之(甲基)丙烯酸系聚合物之含有率以固體成分比計例如為50重量%以上,可為60重量%以上,更可為70重量%以上。The content of the (meth)acrylic polymer in the adhesive composition is, for example, 50% by weight or more, 60% by weight or more, or even 70% by weight or more in terms of solid content.
<(甲基)丙烯酸系寡聚物> 黏著劑組成物亦可更包含有(甲基)丙烯酸系寡聚物。 <(Meth)acrylic oligomer> The adhesive composition may further include a (meth)acrylic oligomer.
(甲基)丙烯酸系寡聚物除了Mw不同外,其餘可具有與上述(甲基)丙烯酸系聚合物相同之組成。(甲基)丙烯酸系寡聚物之Mw例如為1000以上,亦可為2000以上、3000以上,更可為4000以上。(甲基)丙烯酸系寡聚物之Mw的上限例如為30000以下,亦可為15000以下、10000以下,更可為7000以下。The (meth)acrylic oligomer may have the same composition as the above-mentioned (meth)acrylic polymer except that Mw is different. Mw of the (meth)acrylic oligomer is, for example, 1000 or more, may be 2000 or more, 3000 or more, and may be 4000 or more. The upper limit of Mw of the (meth)acrylic oligomer is, for example, 30,000 or less, may be 15,000 or less, 10,000 or less, and may be 7,000 or less.
(甲基)丙烯酸系寡聚物例如具有1種或2種以上源自以下各單體之構成單元:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一酯及(甲基)丙烯酸十二酯等之(甲基)丙烯酸烷基酯;(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯及(甲基)丙烯酸二環戊酯等之(甲基)丙烯酸與脂環族醇之酯;(甲基)丙烯酸苯酯及(甲基)丙烯酸苄酯等之(甲基)丙烯酸芳基酯;以及由萜化合物衍生物醇所得之(甲基)丙烯酸酯。(Meth)acrylic oligomers have, for example, one or more constituent units derived from the following monomers: methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate , Isopropyl (meth)acrylate, Butyl (meth)acrylate, Isobutyl (meth)acrylate, Secondary butyl (meth)acrylate, Tertiary butyl (meth)acrylate, (Meth) ) pentyl acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, Isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate Alkyl (meth)acrylates such as lauryl (meth)acrylate and lauryl (meth)acrylate; Esters of (meth)acrylic acid and alicyclic alcohols; aryl (meth)acrylates such as phenyl (meth)acrylate and benzyl (meth)acrylate; base) acrylate.
(甲基)丙烯酸系寡聚物亦可具有源自具有較大的體積結構之丙烯酸系單體的構成單元。該丙烯酸系單體之例為:(甲基)丙烯酸異丁酯及(甲基)丙烯酸三級丁酯等具有具支鏈結構之烷基之(甲基)丙烯酸烷基酯;(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯及(甲基)丙烯酸二環戊酯等(甲基)丙烯酸與脂環式醇之酯;(甲基)丙烯酸苯酯及(甲基)丙烯酸苄酯等(甲基)丙烯酸芳基酯。該丙烯酸系單體宜具有環狀結構,較宜具有2個以上環狀結構。又,若要在(甲基)丙烯酸系寡聚物聚合時、及/或在形成黏著劑組成物時實施紫外線照射,由不易阻礙聚合及/或形成之進行的方面來看,該丙烯酸系單體宜不具不飽和鍵,例如可使用具有具支鏈結構之烷基之(甲基)丙烯酸烷基酯、(甲基)丙烯酸與脂環式醇之酯。The (meth)acrylic oligomer may have a structural unit derived from an acrylic monomer having a relatively large volume structure. Examples of the acrylic monomers are: (meth)acrylic acid alkyl esters with branched alkyl groups such as isobutyl (meth)acrylate and tertiary butyl (meth)acrylate; Esters of (meth)acrylic acid and alicyclic alcohols such as cyclohexyl acrylate, isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; phenyl (meth)acrylate and (meth)acrylic acid Aryl (meth)acrylate such as benzyl ester. The acrylic monomer preferably has a cyclic structure, and preferably has two or more cyclic structures. In addition, if the (meth)acrylic oligomer is to be irradiated with ultraviolet light when it is polymerized and/or when forming an adhesive composition, the acrylic monopolymer is less likely to hinder the polymerization and/or formation The body preferably has no unsaturated bond, for example, alkyl (meth)acrylate having an alkyl group with a branched chain structure, ester of (meth)acrylic acid and alicyclic alcohol can be used.
(甲基)丙烯酸系寡聚物之具體例為:丙烯酸丁酯與丙烯酸甲酯與丙烯酸之共聚物、甲基丙烯酸環己酯與甲基丙烯酸異丁酯之共聚物、甲基丙烯酸環己酯與甲基丙烯酸異莰酯之共聚物、甲基丙烯酸環己酯與丙烯醯嗎福林之共聚物、甲基丙烯酸環己酯與二乙基丙烯醯胺之共聚物、丙烯酸1-金剛烷基酯與甲基丙烯酸甲酯之共聚物、甲基丙烯酸二環戊酯與甲基丙烯酸異莰酯之共聚物、選自甲基丙烯酸二環戊酯、甲基丙烯酸環己酯、甲基丙烯酸異莰酯、丙烯酸異莰酯、甲基丙烯酸環戊酯中之至少1種與甲基丙烯酸甲酯之共聚物、丙烯酸二環戊酯之均聚物、甲基丙烯酸1-金剛烷基酯之均聚物、丙烯酸1-金剛烷基酯之均聚物。Specific examples of (meth)acrylic oligomers are: copolymers of butyl acrylate, methyl acrylate and acrylic acid, copolymers of cyclohexyl methacrylate and isobutyl methacrylate, cyclohexyl methacrylate Copolymer with isocamphoryl methacrylate, copolymer of cyclohexyl methacrylate and acrylmorphin, copolymer of cyclohexyl methacrylate and diethylacrylamide, 1-adamantyl acrylate Copolymer of ester and methyl methacrylate, copolymer of dicyclopentyl methacrylate and isobornyl methacrylate, selected from dicyclopentanyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate Copolymer of camphenyl, isocamphoryl acrylate, and cyclopentyl methacrylate with methyl methacrylate, homopolymer of dicyclopentyl acrylate, homopolymer of 1-adamantyl methacrylate Polymer, homopolymer of 1-adamantyl acrylate.
(甲基)丙烯酸系寡聚物之聚合方法可採用上述(甲基)丙烯酸系聚合物之聚合方法。As the polymerization method of the (meth)acrylic oligomer, the above-mentioned polymerization method of the (meth)acrylic polymer can be used.
黏著劑組成物包含(甲基)丙烯酸系寡聚物時,其摻混量相對於(甲基)丙烯酸系聚合物100重量份,例如為70重量份以下,可為50重量份以下,更可為40重量份以下。摻混量的下限相對於(甲基)丙烯酸系聚合物100重量份,例如為0.05重量份以上,可為0.1重量份以上,更可為0.2重量份以上。黏著劑組成物亦可不含(甲基)丙烯酸系寡聚物。When the adhesive composition contains a (meth)acrylic oligomer, the blending amount thereof is, for example, 70 parts by weight or less, 50 parts by weight or less, and more preferably 100 parts by weight of the (meth)acrylic polymer. 40 parts by weight or less. The lower limit of the compounding quantity is 0.05 weight part or more with respect to 100 weight part of (meth)acrylic-type polymers, for example, 0.1 weight part or more may be sufficient as 0.2 weight part or more. The adhesive composition may not contain a (meth)acrylic oligomer.
(甲基)丙烯酸系寡聚物亦可使用於溶劑型及活性能量線硬化型中之任一型之黏著劑組成物。惟,使用於活性能量線硬化型黏著劑組成物且(甲基)丙烯酸系寡聚物已溶解於溶劑中時,對混合有該(甲基)丙烯酸系寡聚物之混合物,例如藉由熱乾燥去除溶劑後,藉由照射活性能量線使硬化進行即可。The (meth)acrylic oligomer can also be used in any type of adhesive composition of solvent type and active energy ray curing type. However, when the (meth)acrylic oligomer is dissolved in a solvent when used in an active energy ray-curable adhesive composition, the mixture mixed with the (meth)acrylic oligomer is, for example, heated After drying to remove the solvent, the curing may proceed by irradiating active energy rays.
<交聯劑> 黏著劑組成物亦可更包含有交聯劑。藉由使用交聯劑,可提升黏著劑組成物之凝集力。 <Crosslinking agent> The adhesive composition may further include a crosslinking agent. By using a cross-linking agent, the cohesion of the adhesive composition can be improved.
交聯劑之例為有機系交聯劑及多官能性金屬螯合物。有機系交聯劑之例為異氰酸酯系交聯劑、過氧化物系交聯劑、環氧系交聯劑及亞胺系交聯劑。多官能性金屬螯合物具有多價金屬與有機化合物已共價鍵結或配位鍵結之結構。多價金屬例如為Al、Cr、Zr、Co、Cu、Fe、Ni、V、Zn、In、Ca、Mg、Mn、Y、Ce、Sr、Ba、Mo、La、Sn、Ti。多價金屬可進行共價鍵結或配位鍵結之有機化合物中之原子典型上為氧原子。有機化合物之例為烷基酯、醇化合物、羧酸化合物、醚化合物及酮化合物。此外,有機系交聯劑及多官能性金屬螯合物亦可對溶劑型及活性能量線硬化型中之任一型之黏著劑組成物使用。Examples of crosslinking agents are organic crosslinking agents and polyfunctional metal chelate compounds. Examples of organic crosslinking agents are isocyanate crosslinking agents, peroxide crosslinking agents, epoxy crosslinking agents and imine crosslinking agents. The polyfunctional metal chelate has a structure in which polyvalent metals and organic compounds are covalently bonded or coordinately bonded. The polyvalent metal is, for example, Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn, In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, Ti. The atom in an organic compound in which the polyvalent metal can be covalently or coordinately bonded is typically an oxygen atom. Examples of organic compounds are alkyl esters, alcohol compounds, carboxylic acid compounds, ether compounds and ketone compounds. In addition, organic cross-linking agents and polyfunctional metal chelates can also be used for any type of adhesive composition of solvent type and active energy ray curing type.
黏著劑組成物為溶劑型時,交聯劑宜為異氰酸酯系交聯劑、過氧化物系交聯劑。異氰酸酯系交聯劑可為二官能亦可為三官能。惟,為了維持在高溫下之凝集力,宜為三官能之交聯劑。根據三官能之交聯劑,會形成三維交聯結構。又,亦可併用異氰酸酯系交聯劑與過氧化物系交聯劑。藉由併用,可在維持在高溫下之凝集力的同時更提升黏著力。併用之異氰酸酯系交聯劑宜為三官能。When the adhesive composition is solvent-based, the cross-linking agent is preferably an isocyanate-based cross-linking agent or a peroxide-based cross-linking agent. The isocyanate-based crosslinking agent may be difunctional or trifunctional. However, in order to maintain the cohesive force at high temperature, it is suitable to be a trifunctional crosslinking agent. According to the trifunctional cross-linking agent, a three-dimensional cross-linking structure will be formed. Moreover, an isocyanate type crosslinking agent and a peroxide type crosslinking agent can also be used together. By using them in combination, the adhesive force can be further improved while maintaining the cohesive force at high temperature. The isocyanate-based crosslinking agent used in combination is preferably trifunctional.
黏著劑組成物包含交聯劑時,其摻混量相對於(甲基)丙烯酸系聚合物100重量份,例如為0.01~10重量份,可為0.1~5重量份,更可為0.1~3重量份。When the adhesive composition contains a cross-linking agent, its blending amount is, for example, 0.01-10 parts by weight, 0.1-5 parts by weight, or 0.1-3 parts by weight relative to 100 parts by weight of the (meth)acrylic polymer. parts by weight.
單獨使用異氰酸酯系交聯劑時,其摻混量相對於(甲基)丙烯酸系聚合物100重量份,例如為0.01~3重量份,可為0.01~1重量份、0.01~0.5重量份,更可為0.01~0.3重量份。When the isocyanate-based crosslinking agent is used alone, its blending amount is 0.01-3 parts by weight, for example, 0.01-1 part by weight, 0.01-0.5 parts by weight, or more, relative to 100 parts by weight of the (meth)acrylic polymer. It may be 0.01 to 0.3 parts by weight.
併用異氰酸酯系交聯劑與過氧化物系交聯劑時,過氧化物系交聯劑相對於異氰酸酯系交聯劑之重量比例如為1.0以上,可為1.2以上、1.5以上,更可為2以上。又,重量比的上限例如為500以下,亦可為300以下,更可為200以下。When an isocyanate-based crosslinking agent and a peroxide-based crosslinking agent are used together, the weight ratio of the peroxide-based crosslinking agent to the isocyanate-based crosslinking agent is, for example, 1.0 or more, may be 1.2 or more, 1.5 or more, and may be 2 or more. above. Moreover, the upper limit of weight ratio is 500 or less, for example, may be 300 or less, and may be 200 or less.
<添加劑> 黏著劑組成物亦可包含有其他添加劑。添加劑例如為:Si劑(X)以外之矽烷耦合劑、聚矽氧油等之聚矽氧化合物(矽烷耦合劑除外)、聚醚化合物(以聚丙二醇為首之聚伸烷基二醇等)、顏料及染料等著色劑、界面活性劑、塑化劑、賦黏劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、抗老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、抗靜電劑(離子性化合物之鹼金屬鹽、離子液體、離子固體等)、無機充填材、有機充填材、金屬粉等之粉體、粒子、箔狀物。包含Si劑(X)以外之矽烷耦合劑時,該矽烷耦合劑之含有率可為0.5重量%以下、0.1重量%以下、0.05重量%以下,更可小於0.01重量%。黏著劑組成物亦可不包含Si劑(X)以外之矽烷耦合劑。包含聚矽氧化合物時,聚矽氧化合物之含有率可為0.5重量%以下、0.1重量%以下、0.05重量%以下,更可小於0.01重量%。黏著劑組成物亦可不包含聚矽氧化合物。 <Additives> The adhesive composition may also contain other additives. Examples of additives are: silane coupling agents other than Si agent (X), polysiloxane compounds such as silicone oil (excluding silane coupling agents), polyether compounds (polyalkylene glycols such as polypropylene glycol, etc.), Colorants such as pigments and dyes, surfactants, plasticizers, tackifiers, surface lubricants, leveling agents, softeners, antioxidants, antiaging agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, anti Powders, particles, and foils of electrostatic agents (alkali metal salts of ionic compounds, ionic liquids, ionic solids, etc.), inorganic fillers, organic fillers, and metal powders. When a silane coupling agent other than the Si agent (X) is included, the content of the silane coupling agent may be 0.5% by weight or less, 0.1% by weight or less, 0.05% by weight or less, or less than 0.01% by weight. The adhesive composition may not contain silane coupling agents other than the Si agent (X). When a polysiloxane compound is included, the content of the polysiloxane compound may be 0.5% by weight or less, 0.1% by weight or less, 0.05% by weight or less, and may be less than 0.01% by weight. The adhesive composition may also not contain polysiloxane.
[黏著劑層]
黏著劑層2之厚度例如為1~200µm,可為5~150µm,更可為10~100µm。黏著劑層2可為單層亦可為包含2層以上之層的積層體。2層以上全部之層亦可包含有上述黏著劑組成物。
[adhesive layer]
The thickness of the
黏著劑層2在80℃下之800%模數例如為0.18~0.5N/mm
2,可為0.2~0.4N/mm
2,更可為0.2~0.3N/mm
2。800%模數係指藉由以下方式所得之值表示的特性:藉由往一方向之拉伸力對黏著劑層2賦予800%之伸長率,並將此時於黏著劑層2產生之應力(拉伸應力)除以黏著劑層2之初始截面積所得之值。黏著劑層2之800%模數可如下進行評估。
The 800% modulus of the
將評估對象之黏著劑層2裁切成30mm×100mm之長片狀。接著,以不使氣泡混入之方式將裁切出之黏著劑層2沿長邊方向捲繞,而獲得具有對應短邊長度之30mm高度的圓柱狀試驗片。接著,將所得試驗片裝設於TENSILON等拉伸試驗機後,對其高度方向實施單軸拉伸試驗,而獲得黏著劑層2之伸長率-應力曲線。此外,試驗片之準備及單軸拉伸試驗係在23℃下實施,且將單軸拉伸試驗中之初始治具間距離設為10mm,拉伸速度設為300mm/分鐘。從所得伸長率-應力曲線求出伸長率800%(此時之治具間距離為90mm)時的應力,將之除以試驗片之初始截面積後,作為黏著劑層2之800%模數。Cut the
黏著劑層2在80℃下對聚對苯二甲酸乙二酯(PET)薄膜之黏著力例如為1.8N/25mm以上,可為2.0N/25mm以上、2.5N/25mm以上、2.7N/25mm以上、3.0N/25mm以上、3.2N/25mm以上,更可為3.5N/25mm以上。黏著力的上限例如為10.0N/25mm以下。惟,上述黏著力係在PET薄膜之改質面上配置有黏著劑層2之狀態下進行評估。換言之,上述黏著力係對PET薄膜之改質面的黏著力。The adhesion of the
黏著劑層2在可見光波長區域中之全光線透射率(依據JIS K7136)宜為85%以上,較宜為90%以上。The total light transmittance (according to JIS K7136) of the
上述黏著劑組成物係在光學積層體100中配置於光學基材1之改質面12上使用之黏著劑組成物。由該面向來看,本發明提供一種黏著劑組成物,係配置於光學基材1之表面11上使用者;該黏著劑組成物包含矽烷耦合劑;前述矽烷耦合劑含有異三聚氰酸環,且不含異氰酸酯基;可供配置前述黏著劑組成物之前述表面係經照射能量而表面改質的改質面。The above-mentioned adhesive composition is an adhesive composition used for disposing on the modified surface 12 of the optical substrate 1 in the optical
[黏著劑層之形成]
黏著劑層2例如可藉由以下方法形成。
將-溶劑型黏著劑組成物塗佈於基底薄膜(剝離薄膜)等,並藉由乾燥去除聚合溶劑等。形成於基底薄膜上之黏著劑層2可轉印至光學基材1之表面11。
將-活性能量線硬化型黏著劑組成物塗佈於基底薄膜等,並照射活性能量線使其硬化。除了照射活性能量線外,亦可實施利用加熱進行之乾燥。又,塗佈黏著劑組成物時,亦可新添加聚合溶劑以外之一種以上溶劑於組成物中。
[Formation of Adhesive Layer]
The
基底薄膜中之黏著劑組成物的塗佈面亦可業經剝離處理。剝離處理之例為使用聚矽氧化合物之聚矽氧處理。The coated surface of the adhesive composition in the base film may also be peeled off. An example of a release treatment is a silicone treatment using a silicone compound.
乾燥溫度例如為40~200℃,可為50~180℃,更可為70~170℃。惟,可藉由黏著劑組成物之組成等來調整。The drying temperature is, for example, 40-200°C, may be 50-180°C, and may be 70-170°C. However, it can be adjusted by the composition of the adhesive composition, etc.
乾燥時間例如為5秒~20分鐘,可為5秒~10分鐘,更可為10秒~5分鐘。惟,可藉由黏著劑組成物之組成等來調整。The drying time is, for example, 5 seconds to 20 minutes, may be 5 seconds to 10 minutes, and may be 10 seconds to 5 minutes. However, it can be adjusted by the composition of the adhesive composition, etc.
黏著劑組成物可藉由例如輥塗佈、接觸輥塗佈、凹版塗佈、逆塗佈、輥刷、噴塗佈、浸漬輥塗佈、棒塗佈、刮刀塗佈(knife coat)、氣刀塗佈、簾式塗佈、唇塗佈、利用模塗機等進行之擠壓式塗佈法之手法來塗佈。The adhesive composition can be coated by, for example, roll coating, touch roll coating, gravure coating, reverse coating, roll brushing, spray coating, dip roll coating, rod coating, knife coat, air Coating by means of knife coating, curtain coating, lip coating, extrusion coating using a die coater, etc.
[光學基材] 光學基材1具有改質面12。改質面12係經照射能量而表面改質之面。在表面改質時,基材表面上會生成官能基。利用照射能量進行之表面改質係選自電暈處理、電漿處理及紫外線處理(準分子雷射照射等)中之至少1種。 [Optical substrate] The optical substrate 1 has a modified surface 12 . The modified surface 12 is a surface modified by irradiation of energy. During surface modification, functional groups are generated on the substrate surface. The surface modification by irradiation energy is at least one selected from corona treatment, plasma treatment, and ultraviolet treatment (excimer laser irradiation, etc.).
能量之照射可在例如含氮等非活性氣體之氣體環境下或空氣下實施。照射之能量例如為0.05~20J/cm 2,亦可為0.1~5J/cm 2。各處理之能量的照射可應用公知之方法。 Irradiation of energy can be carried out, for example, under a gas environment containing an inert gas such as nitrogen or under air. The energy of irradiation is, for example, 0.05-20 J/cm 2 , or 0.1-5 J/cm 2 . Irradiation of energy for each treatment can be performed by a known method.
光學基材1可藉由樹脂構成,換言之亦可為樹脂基材。又,此時,Si劑(X)亦可偏存於黏著劑層2中之與光學基材1之界面3附近的區域21。惟,光學基材1不受樹脂基材所限。構成光學基材1之樹脂之例為PET等聚酯、丙烯酸樹脂、聚烯烴、聚環烯烴、聚醯亞胺、聚胺甲酸酯及三醋酸纖維素(TAC)等改質纖維素。丙烯酸樹脂亦可具有醯胺環、醯亞胺環、酸酐環、內酯環等之環結構。惟,樹脂不受上述例所限。The optical substrate 1 can be made of resin, in other words, it can also be a resin substrate. In addition, at this time, the Si agent (X) may also be localized in the
光學基材1之例為偏光薄膜、偏光件保護薄膜、相位差薄膜、視角補償薄膜等光學補償薄膜、抗反射薄膜、抗靜電薄膜、導電薄膜、緩衝薄膜、加飾薄膜、覆蓋窗、液晶層及有機EL發光層等影像形成層、以及該等之積層體。惟,光學基材1不受上述例所限,例如可為使用於影像顯示裝置之任意光學基材。Examples of the optical substrate 1 are polarizing film, polarizer protective film, retardation film, viewing angle compensation film and other optical compensation films, antireflection film, antistatic film, conductive film, buffer film, decorative film, cover window, liquid crystal layer and image forming layers such as organic EL light-emitting layers, and their laminates. However, the optical substrate 1 is not limited to the above examples, and may be any optical substrate used in image display devices, for example.
偏光薄膜包含偏光件。亦可於偏光件之至少一面透過黏著劑層接合有偏光件保護薄膜。偏光件典型上係一藉由空中延伸(乾式延伸)或硼酸水中延伸等延伸式、及塗覆式等各種手法使碘定向之聚乙烯醇(PVA)薄膜。The polarizing film contains polarizers. A polarizer protective film may also be bonded to at least one side of the polarizer through an adhesive layer. The polarizer is typically a polyvinyl alcohol (PVA) film in which iodine is oriented by various methods such as stretching in the air (dry stretching) or boric acid underwater stretching, and coating.
相位差薄膜為於面內方向及/或於厚度方向上具有雙折射之薄膜。相位差薄膜例如為經延伸之樹脂薄膜、已使液晶材料定向及固定化之薄膜。The retardation film is a film having birefringence in the in-plane direction and/or in the thickness direction. The retardation film is, for example, a stretched resin film, or a film in which liquid crystal materials have been oriented and fixed.
相位差薄膜例如為:λ/4板、λ/2板、抗反射用相位差薄膜(例如參照日本專利特開2012-133303號公報之段落0221、0222、0228)、視角補償用相位差薄膜(例如參照日本專利特開2012-133303號公報之段落0225、0226)、視角補償用傾斜定向相位差薄膜(例如參照日本專利特開2012-13303號公報之段落0227)。惟,相位差薄膜只要於面內方向及/或於厚度方向上具有雙折射,便不受上述例所限。針對相位差薄膜之相位差值、配置角度、3維雙折射率、單層或多層等亦無限定。相位差薄膜可為公知之薄膜。Retardation films are, for example: λ/4 plates, λ/2 plates, retardation films for anti-reflection (for example, refer to paragraphs 0221, 0222, and 0228 of Japanese Patent Application Laid-Open No. 2012-133303), retardation films for viewing angle compensation ( For example, refer to paragraphs 0225 and 0226 of Japanese Patent Application Laid-Open No. 2012-133303), and oblique orientation retardation film for viewing angle compensation (for example, refer to paragraph 0227 of Japanese Patent Application Laid-Open No. 2012-13303). However, the retardation film is not limited to the above examples as long as it has birefringence in the in-plane direction and/or in the thickness direction. There are also no restrictions on the retardation value, arrangement angle, 3-dimensional birefringence, single-layer or multi-layer of the retardation film. The retardation film may be a known film.
相位差薄膜之厚度例如為50µm以下,亦可為20µm以下、10µm以下,更可為1~9µm。The thickness of the retardation film is, for example, less than 50 µm, or less than 20 µm, less than 10 µm, or even 1-9 µm.
光學基材1之厚度例如為1µm以上,可為5µm以上,更可為25µm以上。光學基材1之厚度的上限例如為200µm以下。The thickness of the optical substrate 1 is, for example, more than 1 µm, may be more than 5 µm, and may be more than 25 µm. The upper limit of the thickness of the optical substrate 1 is, for example, 200 µm or less.
光學基材1在可見光波長區域中之全光線透射率(依據JIS K7136)宜為85%以上,較宜為90%以上。The total light transmittance (according to JIS K7136) of the optical substrate 1 in the visible light wavelength region is preferably 85% or more, more preferably 90% or more.
光學積層體100在可見光波長區域中之全光線透射率(依據JIS K7136)宜為85%以上,較宜為90%以上。The total light transmittance (according to JIS K7136) of the optical
圖1之光學積層體100具備1個光學基材1與1層黏著劑層2。本發明光學積層體亦可具備有2個以上光學基材1及/或2層以上黏著劑層2。換言之,本發明光學積層體具備至少1個光學基材1與至少1層黏著劑層2。The
圖2之光學積層體110具備相位差薄膜4、偏光件保護薄膜5A、5B、偏光件6及黏著劑層7A、7B、7C。光學積層體110中,依序積層有相位差薄膜4、黏著劑層7A、偏光件保護薄膜5A、黏著劑層7B、偏光件6、黏著劑層7C及偏光件保護薄膜5B。選自3層黏著劑層7A、7B、7C中之至少一黏著劑層係上述黏著劑層2。全部黏著劑層7A、7B、7C亦可為黏著劑層2。又,與黏著劑層2相接之至少一個光學基材係上述光學基材1。與黏著劑層2相接之兩個光學基材亦可為上述光學基材1。The
光學積層體110具備2層以上黏著劑層2時,各黏著劑層2所含之黏著劑組成物之組成可相同亦可互異。When the
本發明光學積層體亦可為貼附於其他構件來使用之附黏著劑層之光學基材。The optical layered body of the present invention may also be an optical substrate with an adhesive layer attached to other members.
於圖3顯示附黏著劑層之光學基材之一例。圖3之附黏著劑層之光學基材120具備光學基材1、黏著劑層2及剝離襯墊8,該剝離襯墊8係配置於黏著劑層2之與光學基材1之接合面相反側的面。剝離襯墊8具有可於流通及保管附黏著劑層之光學基材120時保護黏著劑層2之功能,且其在附黏著劑之光學基材120使用時會被剝離。An example of an optical substrate with an adhesive layer attached is shown in FIG. 3 . The
剝離襯墊8典型上為樹脂薄膜。構成剝離襯墊8之樹脂之例為PET等聚酯、聚乙烯及聚丙烯等聚烯烴、聚碳酸酯、丙烯酸樹脂、聚苯乙烯、聚醯胺及聚醯亞胺。剝離襯墊8之與黏著劑層2相接之面亦可業經施行剝離處理。剝離處理例如係藉由聚矽氧化合物進行之聚矽氧處理。惟,剝離襯墊8不受上述例所限。The
剝離襯墊8之厚度例如為20µm~100µm。The thickness of the
附黏著劑之光學基材120亦可具備有2個以上光學基材1及/或2層以上黏著劑層2。又,在具備2層以上黏著劑層之附黏著劑之光學基材120中,至少1層黏著劑層若為上述黏著劑層2即可。The
本發明光學積層體亦可具備有上述以外之任意層。The optical layered body of the present invention may include any layer other than the above.
本發明光學積層體例如可以單片狀之形式或捲繞帶狀積層體而成之捲繞體之形式進行流通及保管。The optical layered body of the present invention can be distributed and stored, for example, in the form of a single sheet or in the form of a roll formed by winding a tape-shaped layered body.
本發明光學積層體亦可為影像顯示裝置用。The optical layered body of the present invention can also be used for image display devices.
[影像顯示裝置]
於圖4顯示影像顯示裝置之一例。圖4之影像顯示裝置200具有依序積層有基板51、黏著劑層10A、影像形成層(有機EL層)52、黏著劑層10B、光學基材1、黏著劑層2及覆蓋薄膜53之積層結構。影像顯示裝置200具備有光學積層體100。基板51、影像形成層52及覆蓋薄膜53若具有與公知之有機EL顯示器所具備之基板、影像形成層及覆蓋薄膜各自相同之構成即可。
[image display device]
An example of an image display device is shown in FIG. 4 . The
選自黏著劑層10A、10B中之至少1者亦可為上述黏著劑層2。此時,與屬黏著劑層2之黏著劑層10A、10B相接之至少1個構件為光學基材1。At least one selected from the
圖4之影像顯示裝置200為有機EL顯示器。惟,本發明影像顯示裝置200不受上述例所限。The
影像顯示裝置200只要具備本發明光學積層體,便可具有任意之構成。The
影像顯示裝置200亦可為撓性影像顯示裝置。The
實施例 以下,利用實施例更詳細說明本發明。本發明不受以下所示實施例所限。 Example Hereinafter, the present invention will be described in more detail using examples. The present invention is not limited by the Examples shown below.
以下說明所示之簡稱或名稱與化合物之對應如下。 BA:丙烯酸丁酯 HBA:丙烯酸羥丁酯 2EHA:丙烯酸2-乙基己酯 NVP:N-乙烯吡咯啶酮 D110N:三羥甲丙烷/二異氰酸伸茬酯加成物(三井化學製TAKENATE D110N,異氰酸酯系交聯劑) BPO:苯甲醯基過氧化物(過氧化物系交聯劑) KBM9659:參-(三甲氧矽基丙基)三聚異氰酸酯(信越化學製,Si劑(X)) KBM403:3-環氧丙氧丙基三甲氧基矽烷(信越化學製,於末端具有環氧基之矽烷耦合劑) KBM573:N-苯基-3-胺丙基三甲氧基矽烷(信越化學製,具有胺基之矽烷耦合劑) The correspondence between the abbreviations or names shown in the following description and the compounds is as follows. BA: butyl acrylate HBA: Hydroxybutyl Acrylate 2EHA: 2-Ethylhexyl Acrylate NVP: N-vinylpyrrolidone D110N: Trimethylolpropane/diisocyanate adduct (TAKENATE D110N manufactured by Mitsui Chemicals, isocyanate-based crosslinking agent) BPO: benzoyl peroxide (peroxide-based crosslinking agent) KBM9659: Ginseng-(trimethoxysilylpropyl)isocyanurate (manufactured by Shin-Etsu Chemical Co., Ltd., Si agent (X)) KBM403: 3-Glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., a silane coupling agent with an epoxy group at the end) KBM573: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., a silane coupling agent with amino groups)
[(甲基)丙烯酸系聚合物之製作] (合成例1) 於具備攪拌葉片、溫度計、氮氣導入管及冷卻器之四口燒瓶中,饋入BA 99重量份及HBA 1重量份,並藉由乙酸乙酯及甲苯進行溶劑稀釋成BA及HBA之混合物濃度成為50重量%。稀釋所用溶劑中之甲苯所佔之比率係設為5重量%。接著,相對於BA及HBA之混合物100重量份加入AIBN 0.1重量份作為聚合引發劑,一邊緩慢地攪拌一邊導入氮氣將燒瓶內進行氮置換後,將燒瓶內之液溫保持在55℃附近進行7小時聚合反應。接著,於所得反應液中添加乙酸乙酯而調整成固體成分濃度20重量%,藉此獲得(甲基)丙烯酸系聚合物A1之溶液。(甲基)丙烯酸系聚合物A1之Mw為180萬。此外,各合成例中製作之(甲基)丙烯酸系聚合物之Mw係藉由GPC在以下測定條件下進行測定。 ・分析裝置:Waters製,Acquity APC ・管柱:Tosoh製,G7000HXL+GMHXL+GMHXL ・管柱溫度:40℃ ・溶析液:四氫呋喃(添加酸) ・流速:0.8mL/分鐘 ・注入量:100µL ・檢測器:示差折射計(RI) ・標準試料:Agilent製,聚苯乙烯(PS) [Production of (meth)acrylic polymer] (Synthesis Example 1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet pipe and a cooler, 99 parts by weight of BA and 1 part by weight of HBA were fed into, and diluted with ethyl acetate and toluene into a mixture of BA and HBA. 50% by weight. The ratio of toluene in the solvent used for dilution was set at 5% by weight. Next, 0.1 part by weight of AIBN was added as a polymerization initiator to 100 parts by weight of the mixture of BA and HBA, and nitrogen was introduced into the flask while stirring slowly to replace nitrogen in the flask. hour polymerization. Next, ethyl acetate was added to the obtained reaction liquid, and the solution of (meth)acrylic-type polymer A1 was obtained by adjusting to solid content concentration 20 weight%. Mw of (meth)acrylic polymer A1 was 1.8 million. In addition, Mw of the (meth)acrylic-type polymer produced in each synthesis example was measured by GPC under the following measurement conditions. ・Analyzer: Acquity APC manufactured by Waters ・Column: Made by Tosoh, G7000HXL+GMHXL+GMHXL ・Column temperature: 40°C ・Eluent: Tetrahydrofuran (acid added) ・Flow rate: 0.8mL/min ・Injection volume: 100µL ・Detector: Differential refractometer (RI) ・Standard sample: Polystyrene (PS) manufactured by Agilent
(合成例2) 將2EHA 96重量份、HBA 1重量份及NVP 3重量份饋入燒瓶中,並將稀釋所用之溶劑中之甲苯所佔之比率設為30重量%,除此之外以與合成例1相同方式而獲得(甲基)丙烯酸系聚合物A2之溶液。(甲基)丙烯酸系聚合物A2之Mw為120萬。 (Synthesis Example 2) 96 parts by weight of 2EHA, 1 part by weight of HBA, and 3 parts by weight of NVP were fed into the flask, and the ratio of toluene in the solvent used for dilution was set to 30% by weight, except in the same manner as in Synthesis Example 1 Thus, a solution of (meth)acrylic polymer A2 was obtained. The Mw of the (meth)acrylic polymer A2 was 1.2 million.
(合成例3) 除了將稀釋所用之溶劑中之甲苯所佔之比率設為5重量%外,以與合成例2相同方式而獲得(甲基)丙烯酸系聚合物A3之溶液。(甲基)丙烯酸系聚合物A3之Mw為200萬。 (Synthesis Example 3) A solution of (meth)acrylic polymer A3 was obtained in the same manner as in Synthesis Example 2 except that the ratio of toluene in the solvent used for dilution was 5% by weight. The Mw of the (meth)acrylic polymer A3 was 2 million.
(合成例4) 將稀釋所用之溶劑中之甲苯所佔之比率設為0重量%、將聚合引發劑之量設為AIBN 0.05重量份、及將聚合反應之時間設為2小時,除此之外以與合成例2相同方式而獲得(甲基)丙烯酸系聚合物A4之溶液。(甲基)丙烯酸系聚合物A4之Mw為280萬。 (Synthesis Example 4) The proportion of toluene in the solvent used for dilution is set to 0% by weight, the amount of the polymerization initiator is set to 0.05 parts by weight of AIBN, and the time of the polymerization reaction is set to 2 hours. 2. Obtain the solution of (meth)acrylic polymer A4 in the same manner. Mw of (meth)acrylic polymer A4 was 2.8 million.
將各合成例中製出之(甲基)丙烯酸系聚合物彙整於以下表1。The (meth)acrylic polymers produced in each synthesis example are summarized in Table 1 below.
[表1] [Table 1]
[黏著劑組成物之製作] 以成為以下表2所示之組成之方式混合(甲基)丙烯酸系聚合物溶液、交聯劑及矽烷耦合劑,而獲得溶劑型黏著劑組成物P1~P11。此外,聚合物、交聯劑及矽烷耦合劑之含有率係以固體成分換算之值。 [Production of adhesive composition] The (meth)acrylic polymer solution, the crosslinking agent, and the silane coupling agent were mixed so as to have the composition shown in Table 2 below, to obtain solvent-based adhesive compositions P1 to P11. In addition, the content rate of a polymer, a crosslinking agent, and a silane coupling agent is the value converted into solid content.
[表2] [Table 2]
[光學積層體之製作] (實施例1) 將製出之黏著劑組成物P1以噴泉式塗佈機塗佈於剝離薄膜(三菱樹脂製,MRF#38)之剝離處理面上後,以設定成155℃之空氣循環式恆溫烘箱使其乾燥2分鐘,而形成黏著劑組成物層(厚度20µm)。另外,準備經在空氣中進行電暈處理(照射能量之量:0.3J/cm 2)之改質面的PET薄膜(厚度75µm)作為光學基材。於所準備之PET薄膜的改質面貼合上述形成之黏著劑組成物層,製作出具備黏著劑層與光學基材之光學積層體。此外,貼合係以使不與黏著劑層相接之部分以距離PET薄膜一邊50mm以上之寬度形成之方式實施。 [Production of Optical Laminate] (Example 1) The prepared adhesive composition P1 was coated on the release-treated surface of a release film (manufactured by Mitsubishi Plastics, MRF#38) with a fountain coater, and set Dry it in an air-circulating constant temperature oven at 155°C for 2 minutes to form an adhesive composition layer (thickness 20µm). In addition, a PET film (thickness: 75 µm) of a modified surface subjected to corona treatment in air (irradiation energy amount: 0.3 J/cm 2 ) was prepared as an optical base material. The adhesive composition layer formed above was bonded to the modified surface of the prepared PET film to produce an optical laminate with an adhesive layer and an optical substrate. In addition, lamination was carried out so that the portion not in contact with the adhesive layer was formed with a width of 50 mm or more from one side of the PET film.
(實施例2~9) 除了分別使用黏著劑組成物P2~P9來取代黏著劑組成物P1外,以與實施例1相同方式而獲得實施例2~9之光學積層體。 (Example 2~9) The optical laminates of Examples 2 to 9 were obtained in the same manner as in Example 1, except that the adhesive compositions P2 to P9 were used instead of the adhesive composition P1.
(比較例1) 使用黏著劑組成物P3來取代黏著劑組成物P1,且將不具改質面之PET薄膜(厚度相同)用於光學基材,除此之外以與實施例1相同方式而獲得比較例1之光學積層體。 (comparative example 1) The adhesive composition P3 was used to replace the adhesive composition P1, and a PET film (same thickness) without a modified surface was used as the optical substrate, and the comparative example 1 was obtained in the same manner as in Example 1 except that Optical laminates.
(比較例2) 使用黏著劑組成物P10來取代黏著劑組成物P1,且將不具改質面之PET薄膜(厚度相同)用於光學基材,除此之外以與實施例1相同方式而獲得比較例2之光學積層體。 (comparative example 2) The adhesive composition P10 was used to replace the adhesive composition P1, and a PET film (same thickness) without a modified surface was used as the optical substrate, and the comparative example 2 was obtained in the same manner as in the example 1. Optical laminates.
(比較例3) 除了使用黏著劑組成物P10來取代黏著劑組成物P1外,以與實施例1相同方式而獲得比較例3之光學積層體。 (comparative example 3) An optical layered body of Comparative Example 3 was obtained in the same manner as in Example 1 except that the adhesive composition P10 was used instead of the adhesive composition P1.
(比較例4) 除了使用黏著劑組成物P11來取代黏著劑組成物P1外,以與實施例1相同方式而獲得比較例4之光學積層體。 (comparative example 4) An optical layered body of Comparative Example 4 was obtained in the same manner as in Example 1 except that the adhesive composition P11 was used instead of the adhesive composition P1.
[評估] [Si劑(X)有無偏存] 針對實施例3及比較例1之光學積層體,藉由併用蝕刻離子之TOF-SIMS來評估可否觀察到Si劑(X)在黏著劑層中之偏存。在該評估法中,可對黏著劑層之厚度方向進行元素分析。TOF-SIMS之評估條件如下。 ・裝置:ULVAC-PHI製,TRIFT-V ・評估對象:對應SiOH +離子之m/z=45 ・蝕刻離子:Ar氣簇離子 ・蝕刻離子加速電壓:10kV ・所照射之一次離子:Bi 3 2+・一次離子加速電壓:30kV ・從黏著劑層之露出面往光學基材之方向蝕刻 [Assessment] [Whether the Si agent (X) is biased or not] For the optical laminates of Example 3 and Comparative Example 1, it is evaluated whether the Si agent (X) can be observed in the adhesive layer by TOF-SIMS using etching ions The partial storage. In this evaluation method, elemental analysis can be performed in the thickness direction of the adhesive layer. The evaluation conditions of TOF-SIMS are as follows.・Device: Made by ULVAC-PHI, TRIFT-V ・Evaluation object: m/z=45 corresponding to SiOH + ion ・Etching ion: Ar gas cluster ion ・Etching ion acceleration voltage: 10kV ・Irradiated primary ion: Bi 3 2 +・Primary ion acceleration voltage: 30kV ・Etching from the exposed surface of the adhesive layer to the direction of the optical substrate
將對實施例3及比較例1之各光學積層體的評估結果分別顯示於圖5A及圖5B。圖5A及圖5B之繪圖中之橫軸為蝕刻時間(單位:秒),縱軸為以C
2H
3 +離子之強度為基準進行規格化後之SiOH
+離子的規格化強度。如圖5A所示,在實施例3之光學積層體中,確認於黏著劑層中之與PET薄膜之界面附近的區域21有Si劑(X)偏存(斜線部)。圖5A之繪圖中,區域21(佔黏著劑層之厚度的20%)中之SiOH
+峰之面積和為黏著劑層中可測定之SiOH
+峰之面積和的90%以上。另一方面,如圖5B所示,在比較例1之光學積層體中未觀察到Si劑(X)之偏存。藉由Si劑(X)與光學基材之改質面的組合,確認有發生Si劑(X)之偏存。此外,在各圖之繪圖中,於PET薄膜內之區域中也有觀察到SiOH
+離子之強度較大。吾等認為其係因相較於包含(甲基)丙烯酸系聚合物之黏著劑層,成為規格化基準的C
2H
3 +離子之強度在PET薄膜中會變得非常小之故。
The evaluation results of the respective optical layered bodies of Example 3 and Comparative Example 1 are shown in FIGS. 5A and 5B , respectively. In the plots of FIGS. 5A and 5B , the horizontal axis is the etching time (unit: second), and the vertical axis is the normalized intensity of SiOH + ions after normalization based on the intensity of C 2 H 3 + ions. As shown in FIG. 5A , in the optical layered body of Example 3, it was confirmed that the Si agent (X) was segregated (hatched portion) in the
[800%模數] 黏著劑層之800%模數係如下進行評估。將形成於脫模薄膜上之黏著劑層裁切成寬度30mm及長度100mm之長方形狀,並以不使氣泡進入之方式捲成圓柱狀作為測定用試樣。使用拉伸試驗機,從在初始治具間距離10mm及拉伸速度300mm/分鐘之條件下測定之測定用試樣的伸長率-應力曲線求出伸長率800%時之應力,並從求得之應力算出800%模數(N/mm 2)。此外,伸長率800%係指治具間距離成為90mm之狀態。拉伸試驗機係使用島津製作所公司製之Autograph AG-IS。評估係在常溫(23℃)下實施。 [800% modulus] The 800% modulus of the adhesive layer was evaluated as follows. Cut the adhesive layer formed on the release film into a rectangular shape with a width of 30mm and a length of 100mm, and roll it into a cylindrical shape in such a way that air bubbles do not enter as a measurement sample. Using a tensile testing machine, obtain the stress at the elongation rate of 800% from the elongation-stress curve of the test sample measured under the conditions of the initial fixture distance of 10 mm and the tensile speed of 300 mm/min, and obtain it from Calculate the 800% modulus (N/mm 2 ) of the stress. In addition, the elongation rate of 800% means the state where the distance between jigs becomes 90 mm. As a tensile tester, Autograph AG-IS manufactured by Shimadzu Corporation was used. The evaluation was carried out at normal temperature (23°C).
[高溫黏著力] 黏著劑層對光學基材之高溫(80℃)黏著力係如下進行評估。對各實施例及比較例中製出之光學積層體貼合經進行與上述相同之電暈處理之另一PET薄膜(厚度75µm)。接著,將藉由貼合所得之積層體切斷成寬度25mm及長度150mm之長片狀,而獲得測定用試樣。貼合係藉由以下方式實施:使光學積層體之黏著劑層與另一PET薄膜之改質面相接,且切斷成長片狀時,於積層體之長邊方向一端部,使另一PET薄膜具有不與黏著劑層相接之第1自由端(長度50mm)。又,在貼合時,係在溫度25℃下使日本產業規格(舊日本工業規格;JIS)Z0237:2009中規定之質量2kg的壓接滾筒來回一次。切斷係以使製作光學積層體時設置之光學基材中之不與黏著劑層相接之部分作為第2自由端(長度50mm)位於上述長邊方向之另一端部之方式實施。其後,將靜置30分鐘後之測定用試樣裝設於附恆溫槽之拉伸試驗機。裝設係使試驗機之其中一治具把持第1自由端,並使另一治具把持第2自由端來實施。接著,將試驗機及試驗試樣之環境溫度控制成評估溫度(80℃)。環境溫度達評估溫度後靜置5分鐘後,在試驗速度300mm/分鐘下將兩自由端往相互相反之方向拉伸來實施剝除試驗。試驗開始後,無視從初始狀態之拉伸距離(治具間之擴張距離)達10mm為止所測定之初始測定值(應力值),然後將從初始狀態之拉伸距離達到80mm為止所測定之應力值的平均值作為高溫黏著力。 [High temperature adhesion] The high temperature (80° C.) adhesion of the adhesive layer to the optical substrate was evaluated as follows. Another PET film (thickness 75 µm) subjected to the same corona treatment as above was bonded to the optical layered body produced in each Example and Comparative Example. Next, the laminated body obtained by bonding was cut into the long sheet shape of width 25mm and length 150mm, and the sample for a measurement was obtained. The bonding system is carried out by the following method: when the adhesive layer of the optical laminate is brought into contact with the modified surface of another PET film, and when it is cut into a long sheet, at one end of the laminate in the longitudinal direction, the other The PET film has a first free end (50 mm in length) that is not in contact with the adhesive layer. Also, at the time of bonding, a pressure bonding roller with a mass of 2 kg specified in Japanese Industrial Standards (former Japanese Industrial Standards; JIS) Z0237:2009 was reciprocated once at a temperature of 25°C. Cutting was carried out so that the part of the optical base material provided when producing the optical laminate that was not in contact with the adhesive layer was located at the other end in the longitudinal direction as the second free end (50 mm in length). Thereafter, the measurement sample after standing still for 30 minutes was installed in a tensile testing machine with a constant temperature bath. The installation is implemented by making one of the jigs of the testing machine hold the first free end, and make the other jig hold the second free end. Next, the ambient temperature of the testing machine and the test sample was controlled to the evaluation temperature (80° C.). After the ambient temperature reaches the evaluation temperature, let it stand for 5 minutes, and then pull the two free ends in opposite directions at a test speed of 300 mm/min to perform a peel test. After the start of the test, ignore the initial measured value (stress value) measured until the stretching distance (expansion distance between fixtures) from the initial state reaches 10mm, and then use the stress measured until the stretching distance from the initial state reaches 80mm The average value of the value is taken as the high temperature adhesion.
將對實施例及比較例之各光學積層體的評估結果列於以下表3。The evaluation results of the respective optical layered bodies of Examples and Comparative Examples are shown in Table 3 below.
[表3] [table 3]
如表3所示,實施例之光學積層體可維持黏著劑層之凝集力,同時可提升高溫黏著力。此外,黏著劑組成物包含末端具有環氧基之矽烷耦合劑時,PET薄膜之表面改質所帶來之提升高溫黏著力之程度小(比較例2、3)。As shown in Table 3, the optical laminates of the examples can maintain the cohesive force of the adhesive layer while improving the high-temperature adhesive force. In addition, when the adhesive composition includes a silane coupling agent with an epoxy group at the end, the improvement of the high-temperature adhesive force brought about by the surface modification of the PET film is small (Comparative Examples 2 and 3).
產業上之可利用性 本發明光學積層體例如可使用於影像顯示裝置。 Industrial availability The optical layered body of the present invention can be used, for example, in an image display device.
1:光學基材
10A,10B,2,7A,7B,7C:黏著劑層
11:表面
12:改質面
21:區域
3:界面
4:相位差薄膜
51:基板
52:影像形成層(有機EL層)
53:覆蓋薄膜
5A,5B:偏光件保護薄膜
6:偏光件
8:剝離襯墊
100,110,120:光學積層體
200:影像顯示裝置
1:
圖1係示意顯示本發明光學積層體之一例的截面圖。 圖2係示意顯示本發明光學積層體之另一例的截面圖。 圖3係示意顯示本發明光學積層體之又另一例的截面圖。 圖4係示意顯示本發明影像顯示裝置之一例的截面圖。 圖5A係顯示實施例3製出之光學積層體之黏著劑層中之矽烷耦合劑分布的圖。 圖5B係顯示比較例1製出之光學積層體之黏著劑層中之矽烷耦合劑分布的圖。 Fig. 1 is a cross-sectional view schematically showing an example of the optical layered body of the present invention. Fig. 2 is a cross-sectional view schematically showing another example of the optical layered body of the present invention. Fig. 3 is a cross-sectional view schematically showing still another example of the optical layered body of the present invention. FIG. 4 is a cross-sectional view schematically showing an example of the image display device of the present invention. FIG. 5A is a graph showing the distribution of silane coupling agent in the adhesive layer of the optical laminate produced in Example 3. FIG. 5B is a graph showing the distribution of the silane coupling agent in the adhesive layer of the optical laminate produced in Comparative Example 1. FIG.
1:光學基材 1: Optical substrate
11:表面 11: surface
12:改質面 12: modified surface
2:黏著劑層 2: Adhesive layer
21:區域 21: area
3:界面 3: interface
100:光學積層體 100: Optical laminate
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-049598 | 2021-03-24 | ||
JP2021049598A JP2022148070A (en) | 2021-03-24 | 2021-03-24 | Optical laminate, picture display unit and adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202239902A true TW202239902A (en) | 2022-10-16 |
Family
ID=83397000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111106604A TW202239902A (en) | 2021-03-24 | 2022-02-23 | Optical laminate, image display device, and adhesive composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2022148070A (en) |
KR (1) | KR20230159542A (en) |
CN (1) | CN117120568A (en) |
TW (1) | TW202239902A (en) |
WO (1) | WO2022202028A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0720314A (en) | 1993-06-30 | 1995-01-24 | Sekisui Chem Co Ltd | Polarizing plate fixing structure |
JPH11131033A (en) * | 1997-08-28 | 1999-05-18 | Lintec Corp | Tacky agent composition and tacky sheet using the same |
JP2001131506A (en) * | 1999-11-05 | 2001-05-15 | Sekisui Chem Co Ltd | Marking film |
JP6141688B2 (en) * | 2013-05-31 | 2017-06-07 | 日本カーバイド工業株式会社 | Adhesive composition for optical member and optical film |
JP2019077781A (en) * | 2017-10-24 | 2019-05-23 | バンドー化学株式会社 | Optically clear adhesive sheet, laminate, method for producing optically clear adhesive sheet, and laminated sheet |
JP7558649B2 (en) * | 2018-07-31 | 2024-10-01 | 日東電工株式会社 | Optical pressure sensitive adhesive composition and its use |
JP2019174814A (en) * | 2019-04-26 | 2019-10-10 | 住友化学株式会社 | Optical film with adhesive and optical laminate |
-
2021
- 2021-03-24 JP JP2021049598A patent/JP2022148070A/en active Pending
-
2022
- 2022-02-18 WO PCT/JP2022/006783 patent/WO2022202028A1/en active Application Filing
- 2022-02-18 KR KR1020237035901A patent/KR20230159542A/en unknown
- 2022-02-18 CN CN202280023307.6A patent/CN117120568A/en active Pending
- 2022-02-23 TW TW111106604A patent/TW202239902A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230159542A (en) | 2023-11-21 |
WO2022202028A1 (en) | 2022-09-29 |
CN117120568A (en) | 2023-11-24 |
JP2022148070A (en) | 2022-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106987212B (en) | Optical adhesive sheet | |
KR101749758B1 (en) | Optical pressure-sensitive adhesive sheet | |
JP6152319B2 (en) | Adhesive composition, adhesive tape or sheet | |
KR102122876B1 (en) | Pressure-sensitive adhesive sheet, electric or electronic device member laminate and optical member laminate | |
JP6062759B2 (en) | Adhesive composition, optical adhesive sheet, optical film, and display device | |
JP6001316B2 (en) | Adhesive sheet | |
EP2537903A2 (en) | Optical double-sided pressure-sensitive adhesive sheet | |
TWI461499B (en) | Acrylic pressure sensitive adhesive compositions | |
WO2012108348A1 (en) | Adhesive | |
KR20140110750A (en) | Pressure-sensitive adhesive sheet | |
JP6592070B2 (en) | Adhesive sheet, electronic device member laminate, and optical member laminate | |
TWI677736B (en) | Liquid crystal panel and image display device | |
TW201809183A (en) | Double-sided adhesive sheet suitable for efficiently performing a peeling operation of a release liner and suppressing a partial breakage or defect when the release liner is peeled off, and is suitable for efficient production | |
TW202212522A (en) | Adhesive composition used in image display device, optical film with adhesive layer, and image display device | |
JP2016130294A (en) | Adhesive sheet, use method of adhesive sheet and precision electronic apparatus | |
KR20210102186A (en) | Polarizing film having an adhesive layer | |
EP3492543A1 (en) | Pressure-sensitive adhesive sheet | |
TW202239902A (en) | Optical laminate, image display device, and adhesive composition | |
JP7099206B2 (en) | Double-sided adhesive sheet and double-sided adhesive sheet with release sheet | |
TW202204551A (en) | Adhesive sheet, optical member, and touch panel | |
KR20190079542A (en) | Adhesive composition and protection film using the same | |
TW202311470A (en) | Adhesive sheet, optical layered body and image display device | |
TW202311474A (en) | Adhesive agent composition, adhesive sheet, optical laminate, and image display device | |
WO2020262340A1 (en) | Adhesive sheet and use of same | |
TW202311467A (en) | Method for producing adhesive sheet, method for producing optical multilayer body, and method for producing image display device |