TW202219621A - Shape memory alloy actuators and methods thereof - Google Patents

Abstract

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Description

Shape memory alloy actuator and method therefor

Embodiments of the present invention relate to the field of shape memory alloy systems. More particularly, embodiments of the present invention relate to the field of shape memory alloy actuators and methods related thereto.

Shape memory alloy ("SMA") systems have a moving assembly or structure that, for example, can be used in conjunction with a camera lens element as an autofocus driver. Such systems may be enclosed by a structure such as a shield. The moving assembly is supported by a bearing, such as a plurality of balls, for movement on a support assembly. A flexure element formed of metal such as phosphor bronze or stainless steel has a moving plate and flexure. A flexure extends between the moving plate and the fixed support assembly and acts as a spring to enable the moving assembly to move relative to the fixed support assembly. The balls allow the moving assembly to move with minimal resistance. The moving and support assemblies are coupled by four shape memory alloy (SMA) wires extending between the assemblies. Each of the SMA wires has one end attached to the support assembly, and an opposite end attached to the moving assembly. The suspension is actuated by applying an electrical drive signal to the SMA wire. However, these types of systems suffer from system complexity which results in bulky systems requiring a large footprint and a large height clearance. Furthermore, the system of the present invention cannot provide a high Z-stroke range with a compact low profile footprint.

SMA actuators and related methods are described. One embodiment of an actuator includes: a base; a plurality of buckle arms; and at least one first shape memory alloy wire coupled to a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator comprising a shape memory alloy material. The bimorph actuator is attached to the base.

A method of making a buckler module tilting optical image stabilization device (OIS) assembly, comprising: providing a top buckle assembly configured to provide roll axis motion to achieve dynamic tilt tuning capability; mount an autofocus assembly to the top buckle assembly; mount a sensor circuit PCB to the autofocus assembly at a side opposite to the top buckle assembly; Thereby facilitating sensor circuit connections between the sensor circuit PCB and the autofocus assembly having a sensor bracket; coupling a bottom buckle assembly to the mold opposite the autofocus assembly a set of circuit PCBs; and attaching the bottom buckle assembly to the top buckle assembly along a fixed perimeter.

The method, wherein the top buckle assembly includes a four-wire buckle actuator.

The method, wherein the bottom buckle assembly includes a four-wire buckle actuator.

The method wherein the buckle module tilt OIS assembly is operable to provide a two-axis camera module OIS tilt to move a moving mass to a large tilt angle of up to +/- 5 degrees.

The method, wherein the moving mass block includes an auto focus assembly, a sensor circuit PCB and a module circuit PCB.

The method, further comprising attaching an autofocus assembly to the top buckle assembly via adhesive.

The method, wherein the top buckle assembly includes one or more buckle arms, each buckle arm positioned to cause a tilt axis movement of the top buckle assembly.

The method, wherein the bottom buckle assembly includes one or more buckle arms, each buckle arm positioned to cause a pitch axis motion to the bottom buckle assembly.

The method, wherein the top buckle assembly and the bottom buckle assembly are operable to push away from each other to provide dynamic tilting of the buckle module tilting OIS assembly.

The method further includes providing the top buckle assembly including a housing having a top spring, a top autofocus bracket, a flex sensor circuit, and a roll tilt subassembly.

The method, wherein the roll tilt subassembly includes a tilt subassembly buckle frame, a stainless steel (SST) buckle frame, more than one sliding bearing, at least one SMA wire, and an SST sliding base.

The method further includes providing the bottom buckle assembly including a housing having a bottom spring, a bottom autofocus bracket, and a pitch tilt subassembly.

The method, wherein the pitch and tilt subassembly includes a tilt subassembly buckle frame, a stainless steel (SST) buckle frame, more than one sliding bearing, at least one SMA wire, and an SST sliding base.

Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and from the following detailed description.

Cross-references to related applications

This application claims the benefit and priority of US Patent Application No. 17,339,797, filed on June 4, 2021, and further claims the benefit of US Provisional Application No. 63/036,919, filed on June 9, 2020, Each of these applications is hereby incorporated by reference in its entirety.

Embodiments of an SMA actuator are described herein that include a compact footprint and provide a high actuation height, such as movement in the positive z-axis direction (z-direction) (referred to herein as z stroke). Embodiments of SMA actuators include an SMA buckle actuator and an SMA bimorph actuator. SMA actuators can be used in many applications, including but not limited to as an autofocus actuator, a lens assembly, a microfluidic pump, a sensor shift, optical image stabilization, optical zoom assemblies, mechanical Two surfaces are struck to create the vibratory sensation typically found in haptic feedback sensors and devices, and other systems where an actuator is used. For example, embodiments of the actuator described herein can be used as a haptic feedback actuator for use in a mobile phone or wearable device that is configured to provide a user with a Alarms, notifications, alerts, response via touch area or button press. Additionally, more than one SMA actuator can be used in a system to achieve a larger stroke.

For various embodiments, the SMA actuator has a z-stroke greater than .4 mm. Furthermore, for various embodiments, when the SMA actuator is in its initial, once deactivated position, the SMA actuator has a height in the z-direction of 2.2 millimeters or less. Various embodiments of SMA actuators configured as an autofocus actuator in a lens assembly can have a footprint as small as 3 millimeters larger than the lens inner diameter ("ID"). According to various embodiments, SMA actuators can have a footprint that is wider in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of an SMA actuator is 0.5 millimeters greater in one direction, for example, the length of an SMA actuator is 0.5 millimeters greater than its width.

1a illustrates a lens assembly including an SMA actuator configured as a buckle actuator, according to one embodiment. Figure lb illustrates an SMA actuator configured as a buckle actuator according to one embodiment. The buckle actuator 102 is coupled to a base 101 . As illustrated in Figure lb, the SMA wires 100 are attached to the buckle actuators 102 such that when the SMA wires 100 are actuated and retracted, this causes the buckle actuators 102 to buckle, which causes each buckle to actuate At least the central portion 104 of the actuator 102 moves in the z-stroke direction (eg, the positive z-direction), as indicated by arrow 108 . According to some embodiments, SMA wire 100 is actuated when current is supplied to one end of the wire through a wire retainer, such as a crimp structure 106 . Current flows through the SMA wire 100, thereby heating the SMA wire due to the resistance inherent in the SMA material from which the SMA wire 100 is made. The other side of the SMA wire 100 has a wire retainer (such as a crimp structure 106) that connects the SMA wire 100 to ground the circuit. Heating the SMA wire 100 to a sufficient temperature causes the unique material properties to change from a martensite to an austenite crystal structure, which results in a change in length of one of the wires. Changing the current changes the temperature and thus the length of the wire, which is used to activate and de-actuate the actuator to control movement of the actuator in at least the z-direction. Those skilled in the art will understand that other techniques can be used to provide current to an SMA wire.

2 illustrates an SMA actuator configured as an SMA bimorph actuator according to one embodiment. As illustrated in FIG. 2 , the SMA actuator includes a bimorph actuator 202 coupled to a base 204 . The bimorph actuator 202 includes an SMA tape 206 . The bimorph actuator 202 is configured to move at least the free end of the bimorph actuator 202 in the z-stroke direction 208 when the SMA tape 206 contracts.

3 illustrates an exploded view of an autofocus assembly including an SMA actuator, according to one embodiment. As illustrated, according to the embodiments described herein, an SMA actuator 302 is configured as a buckle actuator. The autofocus assembly also includes an optical image stabilization device ("OIS") 304, a lens holder 306 configured to hold the one or more optical lenses using techniques including techniques known in the art, a lens holder 306, a Return spring 308 , a vertical sliding bearing 310 , and a guide cover 312 . The lens holder 306 is configured to follow the SMA actuator 302 in the z-stroke direction as the SMA wire is actuated and pulled using techniques including the techniques described herein and to fasten the buckle actuator 302 (eg In other words, the positive z direction) slides against the vertical sliding bearing 310 . Return spring 308 is configured to apply a force to lens carrier 306 in a direction opposite the z-stroke direction using techniques including those known in the art. According to various embodiments, the return spring 308 is configured to move the lens carrier 306 in a direction opposite the z-stroke direction when the tension in the SMA wire decreases when the SMA wire is de-actuated. When the tension in the SMA wire is reduced to the initial value, the lens holder 306 moves to the lowest height in the z-stroke direction. FIG. 4 illustrates an autofocus assembly including an SMA wire actuator according to one embodiment illustrated in FIG. 3 .

5 illustrates an SMA wire actuator including a sensor, according to one embodiment. For various embodiments, the sensor 502 is configured to measure movement of the SMA actuator in the z-direction or movement of a component of the SMA actuator that is moving using techniques including those known in the art . The SMA actuators include one or more buckle actuators 506 configured to actuate using one or more SMA wires 508 similar to those described herein verb: move. For example, in the autofocus assembly described with reference to FIG. 4, the sensor is configured to determine the lens carrier 306 in the z-direction 504 from an initial position using techniques including those known in the art The amount of movement to move on. According to some embodiments, the sensor is a tunnel magnetoresistive ("TMR") sensor.

6 illustrates a top view and a side view of an SMA actuator 602 configured as a buckle actuator equipped with a lens holder 604, according to an embodiment. FIG. 7 illustrates a side view of a section of an SMA actuator 602 according to the embodiment illustrated in FIG. 6 . According to the embodiment illustrated in FIG. 7 , the SMA actuator 602 includes a sliding base 702 . According to one embodiment, the sliding base 702 is formed from a metal, such as stainless steel, using techniques including those known in the art. However, those skilled in the art will understand that other materials may be used to form sliding base 702 . Additionally, according to some embodiments, the slide base 702 has a spring arm 612 coupled to the SMA actuator 602 . According to various embodiments, the spring arm 612 is configured for two functions. The first function is to help push an object (eg, a lens holder 604) into the vertical sliding surface of a guide cover. For this example, the spring arm 612 preloads the lens carrier 604 up against this surface, ensuring that the lens will not tilt during actuation. For certain embodiments, the vertical sliding surface 708 is configured to mate with the guide cover. The second function of the spring arm 612 is to help pull the SMA actuator 602 down and back after the SMA wire 608 moves the SMA actuator 602 in the z-stroke direction (positive z-direction) (eg, in the negative z-direction) superior). Thus, when the SMA wire 608 is actuated, it contracts to move the SMA actuator 602 in the z-stroke direction and the spring arm 612 is configured to be in the opposite direction to the z-stroke direction when the SMA wire 608 is de-actuated Move the SMA actuator 602 up.

The SMA actuator 602 also includes a buckle actuator 710 . For various embodiments, buckle actuator 710 is formed of metal, such as stainless steel. Additionally, the buckle actuator 710 includes a buckle arm 610 and one or more wire retainers 606 . According to the embodiment illustrated in FIGS. 6 and 7 , the buckle actuator 710 includes four wire retainers 606 . The four wire retainers 606 are each configured to receive one end of an SMA wire 608 and hold the end of the SMA wire 608 such that the SMA wire 608 is attached to the buckle actuator 710 . For various embodiments, the four wire retainers 606 are crimps that are configured to snap down over a portion of the SMA wire 608 to attach the wire to the crimp. Those skilled in the art will understand that an SMA wire 608 can be attached to the wire holder 606 using techniques known in the art, including but not limited to adhesives, solder, and mechanical attachment. A smart memory alloy ("SMA") wire 608 extends between a pair of wire retainers 606 such that the buckle arm 610 of the buckle actuator 710 is configured to move when the SMA wire 608 is actuated, which This causes the pair of wire retainers 606 to be pulled closer together. According to various embodiments, when a current is applied to the SMA wire 608, the SMA wire 608 is electrically actuated to move and control the position of the buckle arm 610. When the current is removed or falls below a threshold value, actuation of the SMA wire 608 is deactivated. This moves the pair of wire holders 606 apart and the buckle arm 610 moves in the opposite direction as when the SMA wire 608 is actuated. According to various embodiments, the buckle arm 610 is configured to have an initial angle of 5 degrees relative to the slide base 702 when the SMA wire is deactivated in its initial position. Also, according to various embodiments, at full stroke or when the SMA wire is fully actuated, the buckle arm 610 is configured to have an angle of one of 10 degrees to 12 degrees relative to the slide base 702 .

According to the embodiment illustrated in FIGS. 6 and 7 , the SMA actuator 602 also includes a sliding bearing 706 configured between the sliding base 702 and the wire holder 606 . Slide bearing 706 is configured to minimize any friction between slide base 702 and buckle arm 610 and/or wire retainer 606 . For certain embodiments, a plain bearing is attached to the wire retainer 606 . According to various embodiments, the sliding bearing is formed of polyoxymethylene ("POM"). Those skilled in the art will understand that other structures may be used to reduce any friction between the buckle actuator and the base.

According to various embodiments, the slide base 702 is configured to couple with an assembly base 704 of an autofocus assembly, such as an autofocus base. According to some embodiments, the actuator base 704 includes an etched spacer. When the SMA actuator 602 is part of an assembly, such as an autofocus assembly, this etched spacer can be used to provide clearance for the wire and crimp.

8 illustrates views of one embodiment of a buckle actuator 802 relative to an x-axis, a y-axis, and a z-axis. Oriented in FIG. 8, the buckle arm 804 is configured to move in the z-axis when the SMA wire is actuated and de-actuated, as described herein. According to the embodiment illustrated in FIG. 8 , the buckle arms 804 are coupled to each other through a central portion, such as a hammock portion 806 . According to various embodiments, a hammock portion 806 is configured to support a portion of an object upon which a buckle actuator acts (eg, a buckle actuated by a buckle) using techniques including the techniques set forth herein to move one of the lens carriers). According to certain embodiments, a hammock portion 806 is configured to provide lateral stiffness to the buckle actuator during actuation. For other embodiments, the buckle actuator does not include a hammock portion 806 . According to these embodiments, the buckle arm is configured to act on an object to move the object. For example, the buckle arm is configured to act directly on a feature of a lens carrier to push the lens carrier upward.

9 illustrates an SMA actuator configured as an SMA bimorph actuator according to an embodiment. The SMA bimorph actuator includes bimorph actuator 902, including the bimorph actuators described herein. According to the embodiment illustrated in FIG. 9 , an end 906 of each of the bimorph actuators 902 is attached to a base 908 . According to some embodiments, one end 906 is welded to the base 908 . However, those skilled in the art will understand that other techniques may be used to attach the end 906 to the base 908 . 9 also illustrates a lens carrier 904 configured such that the bimorph actuator 902 is configured to curl in the z-direction and lift the carrier 904 in the z-direction when actuated. For some embodiments, a return spring is used to urge the bimorph actuator 902 back to an initial position. A return spring can be configured as described herein to help push the bimorph actuator down to its initial deactivated position. Due to the smaller footprint of bimorph actuators, SMA actuators can be fabricated with a reduced footprint compared to current actuator technology.

10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator including a position sensor, such as a TMR sensor, according to an embodiment. Autofocus assembly 1002 includes a position sensor 1004 attached to a moving spring 1006, and an autofocus assembly attached to an autofocus assembly including an SMA actuator, such as the SMA actuator described herein A lens holder 1010 a magnet 1008. The position sensor 1004 is configured to determine whether the lens holder 1010 has moved in the z-direction 1005 from an initial position based on a distance of the magnet 1008 from the position sensor 1004 using techniques including techniques known in the art. amount of movement. According to some embodiments, position sensor 1004 uses electrical traces on a spring arm of a moving spring 1006 of an optical image stabilization assembly to communicate with a controller or a processor (such as a central processing unit) ) electrically coupled.

11a-11c illustrate views of bimorph actuators according to certain embodiments. According to various embodiments, a bimorph actuator 1102a-c includes a beam 1104a, b and one or more SMA materials 1106, such as an SMA tape 1106b (eg, according to the embodiment of FIG. 11b, such as including an SMA Illustrated in a perspective view of a bimorph actuator with a ribbon) or SMA wire 1106a (eg, according to the embodiment of FIG. 11a, such as a transverse bimorph actuator comprising an SMA wire) illustrated in the section). The SMA material 1106 is attached to the beams 1104a, b using techniques including those described herein. According to certain embodiments, the SMA material 1106 is attached to a beam 1104a, b using an adhesive film material 1108, such as 1108b. For various embodiments, the ends of the SMA material 1106 are electrically and mechanically coupled to contacts 1110a-c configured to supply current to the SMA material 1106 using techniques including those known in the art . According to various embodiments, contacts 1110a-c (eg, as illustrated in Figures 11a and 11b) are gold-plated copper pads. According to an embodiment, bimorph actuators 1102a-c, having a length of about 1 millimeter, are configured to generate a larger stroke and a thrust of 50 millinewtons ("mN"), and serve as a lens total form part, for example as illustrated in Figure 11c. According to certain embodiments, using bimorph actuators 1102a-c with a length greater than 1 millimeter will result in greater stroke but produce less force. For one embodiment, a bimorph actuator 1102a-c includes a 20 micron thick SMA material 1106, a 20 micron thick insulator 1112 (such as 1112b) (such as a polyimide insulator), and a 30 micron thick stainless steel Beams 1104a, b or base metal. Various embodiments include a second insulator disposed between a contact layer including contacts 1110a-c and the SMA material 1106. According to certain embodiments, the second insulator is configured to isolate the SMA material 1106 from portions of the contact layer that are not used as contacts 1110a-c. For some embodiments, the second insulating system is a covercoat layer, such as a polyimide insulator. Those skilled in the art will understand that other dimensions and materials may be used to meet desired design characteristics.

12 illustrates a view of an embodiment of a bimorph actuator according to an embodiment. The embodiment illustrated in Figure 12 includes a central feed 1204 for applying power. Power is supplied at the center of SMA material 1202 (wire or ribbon), such as the SMA material described herein. The ends of the SMA material 1202 are grounded to the beam 1206 or base metal as a return path at the end pads 1203a, b. The end pads 1203a, b are electrically isolated from the rest of the contact layer 1214. According to an embodiment, when the current is turned off (ie, deactivation of the bimorph actuator), a beam 1206 or base metal and SMA material 1202 (such as an SMA wire) along the entire length of the SMA material 1202 Close proximity provides faster cooling of the wire. The result is a faster wire deactivation and actuator response time. The thermal profile of the SMA wire or tape is improved. For example, the thermal profile is more uniform so that a higher total current can be reliably delivered to the wire. Without a uniform heat sink, portions of the wire, such as a central region, can overheat and become damaged, thus requiring a reduced current flow and reduced motion to operate reliably. Center feed 1204 provides the benefits of faster wire start/actuation (faster heating) of SMA material 1202 and reduced power consumption (lower resistive path length) for faster response time. This allows for a faster actuator movement and the ability to operate at a higher frequency of movement.

As illustrated in FIG. 12 , the beam 1206 includes a center metal 1208 that is isolated from the rest of the beam 1206 to form the center feed 1204 . An insulator 1210 , such as the insulators described herein, is disposed over the beam 1206 . The insulator 1210 is configured to have one or more openings or vias 1212 to provide electrical access to the beam 1206, for example, to couple a ground segment 1214b of the contact layer, and to provide contact to the center metal 1208 to form Center feeder 1204. According to some embodiments, a contact layer 1214 (such as the contact layer described herein) includes a power segment 1214a and a ground segment 1214b for supplying electrical power via a power supply contact 1216 and a ground contact 1218 to Bimorph actuators provide actuation/control signals. A topcoat 1220, such as the topcoat described herein, is disposed over the contact layer 1214 to electrically isolate the contact layer, except in the portion of the contact layer 1214 where electrical coupling is desired (eg, one or more contacts) Excluded.

FIG. 13 illustrates an end pad cross section of a bimorph actuator according to one embodiment as illustrated in FIG. 12 . As explained above, the end pads 1203a, b are electrically isolated from the rest of the contact layer 1214 by a gap 1222 formed between the end pads 1203a, b and the contact layer 1214. According to some embodiments, the gap is formed using etching techniques including etching techniques known in the art. The end pads 1203a,b include a via section 1224 configured to electrically couple the end pads 1203a,b with the beam 1206. Via section 1224 is formed in a via 1212 formed in insulator 1210 . The SMA material 1202 is electrically coupled to the end pads 1203a, b. The SMA material 1202 can be electrically coupled to the terminal pads using techniques including, but not limited to, solder, resistance welding, laser welding, and direct plating.

FIG. 14 illustrates a cross-section of a center feed of a bimorph actuator according to one embodiment as illustrated in FIG. 12 . The center feed 1204 is electrically coupled to a power supply through the contact layer 1214 and is electrically and thermally coupled to the center metal 1208 through a via section 1224 in the center feed 1204 formed in the A through hole 1212 is formed in the insulator 1210 .

The actuators described herein can be used to form an actuator assembly using multiple buckles and or multiple bimorph actuators. According to an embodiment, the actuators can be stacked on top of each other in order to increase a stroke distance achievable.

15 illustrates an exploded view of an SMA actuator including one of two buckle actuators, according to one embodiment. According to the embodiments set forth herein, the two buckle actuators 1302, 1304 are configured relative to each other to use their motion to oppose each other. For various embodiments, the two buckle actuators 1302 , 1304 are configured to move in an opposite relationship to each other to position a lens carrier 1306 . For example, the first buckle actuator 1302 is configured to receive a power signal that is the opposite of the power signal sent to the second buckle actuator 1304 .

16 illustrates an SMA actuator including two buckle actuators, according to one embodiment. The buckle actuators 1302, 1304 are configured such that the buckle arms 1310a, b, 1312a, b of each buckle actuator 1302, 1304 face each other and the sliding base 1314, 1316 is attached to the outer surface of one of the two buckle actuators. According to various embodiments, a hammock portion 1308a, b of each SMA actuator 1302, 1304 is configured to be supported by one or more buckle actuators 1302, 1304 using techniques including the techniques set forth herein A portion of an object acting on it (eg, a lens holder 1306 moved by a buckle actuator).

Figure 17 illustrates a side view of an SMA actuator including one of two buckle actuators illustrating the orientation of the SMA wires 1318a, b resulting in a positive z-direction or at An object (such as a lens holder) is moved in an upward direction.

18 illustrates a side view of an SMA actuator including one of two buckle actuators illustrating the orientation of the SMA wires 1318a, b resulting in a negative z-direction or at An object (such as a lens holder) is moved in a downward direction.

19 illustrates an exploded view of an assembly including an SMA actuator including two buckle actuators, according to an embodiment. The buckle actuators 1902, 1904 are configured such that the buckle arms 1910a, b, 1912a, b of each buckle actuator 1902, 1904 are tied to the outer surface of one of the two buckle actuators and each buckle actuates The sliding bases 1914, 1916 of the devices 1902, 1904 face each other. According to various embodiments, a hammock portion 1908a, b of each SMA actuator 1902, 1904 is configured to be supported by one or more buckle actuators 1902, 1904 using techniques including the techniques set forth herein A portion of an object acting on it (eg, a lens holder 1906 moved by a buckle actuator). For certain embodiments, the SMA actuator includes a base portion 1918 configured to receive the second buckle actuator 1904. The SMA actuator may also include a cover portion 1920. 20 illustrates an SMA actuator including two buckle actuators including a base portion and a cover portion, according to one embodiment.

21 illustrates an SMA actuator including two buckle actuators, according to one embodiment. For certain embodiments, the buckle actuators 1902, 1904 are configured relative to each other such that the hammock portion 1908a, b of the first buckle actuator 1902 is rotated approximately 90 degrees from the hammock portion of the second buckle actuator 1904 . The 90 degree configuration achieves pitch and roll rotation of an object such as a lens holder 1906. This provides better control over the movement of the lens carrier 1906. For various embodiments, a differential power signal is applied to the SMA wire of each buckle actuator pair, which provides pitch and roll rotation of the lens carrier for tilt OIS motion.

Embodiments of SMA actuators that include two buckle actuators eliminate the need to have a return spring. Using two buckle actuators improves/reduces hysteresis when using SMA wire resistors for position feedback. An opposing force SMA actuator that includes two buckle actuators facilitates more accurate position control due to lower hysteresis than an SMA actuator that includes a return spring. For certain embodiments, such as the embodiment illustrated in Figure 22, an SMA actuator comprising two buckle actuators 2202, 2204 uses a left SMA wire to each buckle actuator 2202, 2204 2218a and the differential power of the right SMA wire 2218b to provide 2-axis tilt. For example, a left SMA wire 2218a is actuated with higher power than a right SMA wire 2218b. This causes the left side of the lens carrier 2206 to move down and the right side to move up (tilt). For certain embodiments, the SMA wires of the first buckle actuator 2202 are held at equal power, acting as a fulcrum to differentially push the SMA wires 2218a, 2218b to create a tilting motion. Invert the power signal applied to the SMA wire (for example, apply equal power to the SMA wire of the second buckle actuator 2204 and to the left SMA wire 2218a and the right SMA wire 2218b of the second buckle actuator 2204 Using differential power) produces a tilt of the lens holder 2206 in one of the other directions. This provides the ability to tilt an object (such as a lens carrier) in either axis of motion or to tune out any tilt between the lens and sensor for good dynamic tilt, which results in a better image across all pixels quality.

23 illustrates an SMA actuator including two buckle actuators and a coupler, according to one embodiment. The SMA actuator includes two buckle actuators (such as the buckle actuators described herein). A first buckle actuator 2302 is configured to couple with a second buckle actuator 2304 using a coupler, such as a coupler ring 2305. The buckle actuators 2302, 2304 are configured relative to each other such that the hammock portions 2308a, b of the first buckle actuator 2302 rotate approximately 90 degrees from the hammock portion 2309 of the second buckle actuator 2304. A payload for movement, such as a lens or lens assembly, is attached to a lens carrier 2306 that is configured to rest on a sliding base of the first buckle actuator 2302.

For various embodiments, equal power may be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This can result in maximizing the z-stroke of the SMA actuator in the positive z-direction. For certain embodiments, the stroke of the SMA actuator may have a z-stroke equal to or greater than twice the stroke of other SMA actuators including two buckle actuators. For certain embodiments, an additional spring may be added to urge the two buckles when the power signal is removed from the SMA actuator to help push the actuator assembly and payload back down. Equal and opposite power signals can be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This enables the SMA actuator to be moved in the positive z-direction by the buckle actuator and in the negative z-direction by the buckle actuator, which achieves accurate control of the position of the SMA actuator. Additionally, equal and opposite power signals (differential power signals) can be applied to the left and right SMA wires of the first and second buckle actuators 2302 and 2304 to cause an object, such as a The lens holder 2306) is inclined in the direction of at least one of the two axes.

Embodiments of SMA actuators including two buckle actuators and a coupler, such as the SMA actuator illustrated in Figure 23, can be actuated with one additional buckle actuator and pairs of buckles The actuators are coupled to achieve a desired stroke greater than that of a single SMA actuator.

24 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminated hammock, according to an embodiment. As set forth herein, for certain embodiments, the SMA system is configured to function as an autofocus driver in conjunction with one or more camera lens elements. As illustrated in Figure 24, the SMA system includes a return spring 2403 that, according to various embodiments, is configured to allow tension in the SMA wires 2408a, b to decrease when the SMA wires are de-actuated A lens carrier 2405 moves in a direction opposite to the z-stroke direction. For certain embodiments, the SMA system includes a housing 2409 that is configured to receive the return spring 2403 and act as a sliding bearing to guide the lens carrier in the z-stroke direction. Housing 2409 is also configured to seat on buckle actuator 2402. Buckle actuator 2402 includes a slide base 2401 similar to the slide base described herein. Buckle actuator 2402 includes buckle arms 2404a-d coupled to a hammock portion, such as a laminated hammock 2406a, b formed from a laminate. Buckle actuator 2402 also includes an SMA wire attachment structure, such as a lamination crimp connection 2412a-d.

As illustrated in FIG. 24, the sliding base 2401 rests on an optional adapter plate 2414. The adapter plate is configured to mate the SMA system or buckle actuator 2402 with another system, such as an OIS, additional SMA system, or other components. 25 illustrates an SMA system 2501 including an SMA actuator including a buckle actuator 2402 with a laminated hammock, according to one embodiment.

26 illustrates a buckle actuator including a laminate hammock according to one embodiment. Buckle actuator 2402 includes buckle arms 2404a-d. The buckle arms 2404a-d are configured to move in the z-axis when the SMA wires 2408a, b are actuated and de-actuated, as described herein. The SMA wire 2408 is attached to the buckle actuator using lamination crimp connections 2412a-d. According to the embodiment illustrated in Figure 26, the buckle arms 2404a-d are coupled to each other through a central portion, such as a laminated hammock 2406a, b. According to various embodiments, a laminated hammock 2406a,b is configured to support a portion of an object upon which a buckle actuator acts (eg, by a buckle) using techniques including those described herein The actuator moves one of the lens carriers).

27 illustrates a laminated hammock of an SMA actuator according to an embodiment. For some embodiments, the laminated hammock 2406a,b material is a low stiffness material so it does not resist actuation motion. For example, the laminated hammocks 2406a, b are formed using a copper layer disposed on a first polyimide layer and a second polyimide layer disposed on the copper. For certain embodiments, the laminated hammocks 2406a, b are formed on the buckle arms 2404a-d using deposition and etching techniques including deposition and etching techniques known in the art. For other embodiments, the laminated hammocks 2406a, b are formed separately from the buckle arms 2404a-d and attached to the buckle arms 2404a-d using techniques including welding, adhesives, and other techniques known in the art . For various embodiments, glue or other adhesive is used on the lamination hammocks 2406a, b to ensure that the buckle arms 2404a-d remain in position relative to a lens holder.

28 illustrates a lamination crimp connection of an SMA actuator according to an embodiment. The lamination crimp connectors 2412a-d are configured to attach an SMA wire 2408 to the buckle actuator and form a circuit joint with the SMA wire 2408. For various embodiments, lamination crimp connectors 2412a-d comprise a laminate consisting of one or more layers of an insulator and one or more layers of a conductive layer formed on a crimp layer formation.

For example, a polyimide layer is disposed over at least a portion of the stainless steel portion forming a crimp 2413. A conductive layer, such as copper, is then disposed over the polyimide layer, which is electrically coupled to one or more signal traces 2415 disposed on the buckle actuator. Deforming the crimp to contact the SMA wire therein also brings the SMA wire into electrical contact with the conductive layer. Accordingly, a conductive layer coupled with one or more signal traces is used to apply power signals to the SMA wires using techniques including the techniques set forth herein. For certain embodiments, a second polyimide layer is formed over the conductive layer in areas where the conductive layer will not be in contact with the SMA wires. For certain embodiments, lamination crimp connections 2412a-d are formed on a crimp 2413 using deposition and etching techniques including deposition and etching techniques known in the art. For other embodiments, the lamination crimp connections 2412a-d and one or more electrical traces are formed separately from the crimp 2413 and buckle actuator Other known techniques are used to attach to the crimp 2413 and buckle actuator.

29 illustrates an SMA actuator including a buckle actuator with a laminated hammock. As illustrated in Figure 29, when a power signal is applied, the SMA wire contracts or shortens to move the buckle arms and lamination hammock in the positive z-direction. Laminated hammocks in contact with an object in turn move that object, such as a lens holder, in the positive z-direction. When the power signal is lowered or removed, the SMA wire lengthens and moves the buckle arm and laminate hammock in a negative z-direction.

30 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator, according to an embodiment. As set forth herein, for certain embodiments, the SMA system is configured to function as an autofocus driver in conjunction with one or more camera lens elements. As illustrated in FIG. 30, the SMA system includes a return spring 3003 that, according to various embodiments, is configured to allow tension in the SMA wires 3008a, b to decrease when the SMA wires are de-actuated A lens carrier 3006 moves in a direction opposite to the z-stroke direction. For certain embodiments, the SMA system includes a stiffener 3000 disposed on return spring 3003. For certain embodiments, the SMA system includes a housing 3009a, b formed of two parts that is configured to receive a return spring 3003 and act as a sliding bearing to guide the lens carrier in the z-stroke direction . The housings 3009a, b are also configured to seat on the buckle actuator 3002. The buckle actuator 3002 includes a sliding base 3001a, b formed of two parts similar to the sliding base described herein. The sliding bases 3001a, b are split to electrically isolate 2 sides (for example, 1 side is ground, the other side is power), because according to some embodiments, current is passed through the sliding base 3001a, b portion of the flow to the line.

Buckle actuator 3002 includes buckle arms 3004a-d. Each pair of buckle actuators 3002 is formed on a separate portion of the buckle actuators 3002 . Buckle actuator 3002 also includes an SMA wire attachment structure, such as a resistance weld wire crimp 3012a-d. The SMA system optionally includes a flex circuit 3020 for electrically coupling the SMA wires 3008a, b to one or more control circuits.

As illustrated in FIG. 30, the sliding bases 3001a, b rest on an optional adapter plate 3014. The adapter plate is configured to mate the SMA system or buckle actuator 3002 with another system, such as an OIS, additional SMA system, or other components. 31 illustrates an SMA system 3101 including an SMA actuator including a buckle actuator 3002, according to one embodiment.

32 includes an SMA actuator including a buckle actuator according to an embodiment. Buckle actuator 3002 includes buckle arms 3004a-d. The buckle arms 3004a-d are configured to move in the z-axis when the SMA wires 3008a, b are actuated and de-actuated, as described herein. SMA wires 3008a, b are attached to resistance weld wire crimps 3012a-d. According to the embodiment illustrated in Figure 32, the buckle arms 3004a-d are configured to mate with an item, such as a lens holder, using a two-yoke capture joint without the need for a central portion.

33 illustrates a two-yoke capture joint of a pair of buckle arms of an SMA actuator according to an embodiment. Figure 33 also illustrates plating pads 3022a, b for attaching the optional flex circuit to the slide base. For some embodiments, the plating pads 3022a, b are formed using gold. 34 illustrates a resistance weld crimp for an SMA actuator for attaching an SMA wire to a buckle actuator, according to an embodiment. For certain embodiments, glue or adhesive may also be placed on top of the weld to aid in mechanical strength and to act as a fatigue strain relief during handling and sudden loads.

Figure 35 illustrates an SMA actuator including a buckle actuator with a two yoke capture joint. As illustrated in Figure 35, when a power signal is applied, the SMA wire contracts or shortens to move the buckle arm in the positive z-direction. The two yoke capture joints come into contact with an object, which in turn moves that object, such as a lens holder, in the positive z-direction. When the power signal is lowered or removed, the SMA wire lengthens and moves the buckle arm in a negative z-direction. The yoke capture feature ensures that the buckle arm remains in the correct position relative to the lens holder.

36 illustrates an SMA bimorph liquid lens according to an embodiment. The SMA bimorph liquid lens 3501 includes a liquid lens sub-assembly 3502, a housing 3504, and a circuit 3506 with an SMA actuator. For various embodiments, the SMA actuator includes 4 bimorph actuators 3508, such as the embodiments set forth herein. The bimorph actuator 3508 is configured to push on a forming ring 3510 on a flexible membrane 3512. The ring warps the membrane 3512/liquid 3514, thereby changing the light path through the membrane 3512/liquid 3514. A liquid containment ring 3516 is used to contain the liquid 3514 between the membrane 3512 and the lens 3518. The equal force from the bimorph actuator changes the focal point of the image in the Z direction (normal to the lens), which allows it to be used as an autofocus device. According to some embodiments, the differential force from the bimorph actuator 3508 can move the light rays in the X, Y axis directions, which allows it to function as an optical image stabilizer. With proper control of each actuator, both OIS and AF functions can be achieved simultaneously. For some embodiments, 3 actuators are used. The circuit 3506 with the SMA actuator includes one or more contacts 3520 for the control signal to actuate the SMA actuator. According to certain embodiments including 4 SMA actuators, circuit 3506 with SMA actuators includes 4 power circuit control contacts for each SMA actuator and a common return contact.

37 illustrates a see-through SMA bimorph liquid lens according to an embodiment. 38 illustrates a cross-sectional view and a bottom view of an SMA bimorph liquid lens according to an embodiment.

39 illustrates an SMA system including an SMA actuator 3902 with a bimorph actuator, according to an embodiment. SMA actuator 3902 includes 4 bimorph actuators using the techniques described herein. Two of the bimorph actuators are configured as positive z-stroke actuators 3904 and two bimorph actuators are configured as negative z-stroke actuators 3906, as in Illustrated in FIG. 40, which illustrates an SMA actuator 3902 with a bimorph actuator, according to one embodiment. Conversely the actuators 3906, 3904 are configured to control movement in both directions over the entire stroke range. This provides the ability to tune the control code to compensate for tilt. For various embodiments, two SMA wires 3908 attached to the top of the assembly achieve a positive z-stroke displacement. Two SMA wires attached to the bottom of one of the components achieve a negative z-stroke displacement. For certain embodiments, each bimorph actuator uses tabs to attach to an item, such as a lens holder 3910, to engage the item. The SMA system includes a top spring 3912 configured to provide stability of the lens holder 3910 on an axis perpendicular to the z-stroke axis (eg, in the directions of the x- and y-axes). Additionally, a top spacer 3914 is configured to be disposed between the top spring 3912 and the SMA actuator 3902. A bottom spacer 3916 is disposed between the SMA actuator 3902 and a bottom spring 3918. Bottom spring 3918 is configured to provide stability of lens holder 3910 in an axis perpendicular to the z-stroke axis (eg, in the directions of the x- and y-axes). Bottom spring 3918 is configured to rest on a base 3920 such as one of the bases described herein.

41 illustrates the length 4102 of a bimorph actuator 4103 and the location of a bond pad 4104 such that an SMA wire 4106 extends the wire length beyond the bimorph actuator. Longer wires than bimorph actuators are used to increase stroke and force. Thus, the extension 4108 of the SMA wire 4106 beyond the bimorph actuator 4103 is used to set the stroke and force of the bimorph actuator 4103 .

42 illustrates an exploded view of an SMA system including an SMA bimorph actuator 4202, according to an embodiment. According to various embodiments, the SMA system is configured to use separate metallic materials and a non-conductive adhesive to form one or more circuits to independently power the SMA wires. Certain embodiments have no AF size effect and include 4 bimorph actuators (such as the bimorph actuators described herein). Two of the bimorph actuators are configured as positive z-stroke actuators and two bimorph actuators are configured as negative z-stroke actuators. 43 illustrates an exploded view of a subsection of an SMA actuator according to an embodiment. The subsection includes a negative actuator signal connection 4302, a base 4304 with bimorph actuators 4306a,b. Negative actuator signal connection 4302 includes wire bond pads 4308 for connecting an SMA wire of a bimorph actuator 4306a,b using techniques including those described herein. The negative actuator signal connector 4302 is attached to the base 4304 using a layer of adhesive 4310. The subsection also includes a positive actuator signal connection 4314 with wire bond pads 4316 for connecting a bimorph actuator 4306a,b using techniques including those described herein One of the SMA wires 4312b. The positive actuator signal connector 4314 is attached to the base 4304 using a layer of adhesive 4318. Each of the base 4304, the negative actuator signal connection 4302, and the positive actuator signal connection 4314 are formed of metal, eg, stainless steel. Connection pads 4322 on each of base 4304, negative actuator signal connection 4302, and positive actuator signal connection 4314 are configured to electrically couple control signals and Ground for actuating the bimorph actuators 4306a, b. For some embodiments, the connection pads 4322 are gold plated. 44 illustrates a subsection of an SMA actuator according to an embodiment. For certain embodiments, gold-plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. Additionally, wire bond pads are formed for signal contacts to electrically couple the SMA wires for power signals.

45 illustrates a 5-axis sensor displacement system according to an embodiment. A 5-axis sensor shift system is configured to move an object, such as an image sensor, in 5-axis relative to one or more lenses. This includes X/Y/Z axis translation and pitch/roll tilt. Optionally, the system is configured to use only 4 axes, with X/Y axis translation and pitch/roll tilt along with a separate AF on top for Z motion. Other embodiments include 5-axis sensor shift systems configured to move one or more lenses relative to an image sensor. For some embodiments, the static lens stack is mounted on the top cover and inserted inside the ID (without touching the orange moving bracket inside).

46 illustrates an exploded view of a 5-axis sensor displacement system according to an embodiment. The 5-axis sensor displacement system includes 2 circuit components: a flex sensor circuit 4602, a bimorph actuator circuit 4604; and constructed to bimorph using techniques including those described herein 8 to 12 bimorph actuators 4606a-h on chip circuit assembly. The 5-axis sensor displacement system includes a moving bracket 4608 and an outer housing 4610 that are configured to hold one or more lenses. According to an embodiment, bimorph actuator circuit 4604 includes 8 to 12 SMA actuators (such as described herein). The SMA actuators are configured to move the moving carriage 4608 in 5 axes, such as in an x-direction, a y-direction, a z-direction, pitch and roll, similar to the other 5 described herein shaft system.

47 illustrates an SMA actuator including a bimorph actuator integrated into this circuit for all motions, according to one embodiment. Embodiments of an SMA actuator may include 8 to 12 bimorph actuators 4606a-h. However, other embodiments may include more or fewer bimorph actuators. 48 illustrates an SMA actuator 4802 including a bimorph actuator integrated into this circuit for all motion, the SMA actuator being partially formed to mate with a corresponding housing, according to one embodiment Inside body 4804. 49 illustrates a cross-section of a 5-axis sensor displacement system according to an embodiment.

50 illustrates an SMA actuator 5002 including a bimorph actuator, according to one embodiment. SMA actuator 5002 is configured to use 4 side mounted SMA bimorph actuator 5004 to move an image sensor, lens or other various payloads in the x and y directions. 51 illustrates a top view of an SMA actuator including a bimorph actuator that moves an image sensor, lens or other various payloads in different x and y positions.

52 illustrates an SMA actuator including a bimorph actuator 5202 configured as a cassette bimorph autofocus device, according to one embodiment. Four top- and bottom-mounted SMA bimorph actuators, such as the SMA bimorph actuators described herein, are configured to move together to create movement in the z-stroke direction for autofocus motion . 53 illustrates an SMA actuator including a bimorph actuator, and wherein two top-mounted bimorph actuators 5302 are configured to push down on one or more, according to an embodiment on a lens. 54 illustrates an SMA actuator including a bimorph actuator, and wherein two bottom-mounted bimorph actuators 5402 are configured to push upward on one or more bimorph actuators, according to an embodiment on the lens. 55 illustrates an SMA actuator including a bimorph actuator to show four top and bottom mounted SMA bimorph actuators 5502, such as the SMAs described herein, according to an embodiment Bimorph actuators) are used to move one or more lenses to create a tilting motion.

56 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as a two-axis lens shift OIS, according to one embodiment. For certain embodiments, the two-axis lens shift OIS is configured to move a lens in the X/Y axis. For some embodiments, the Z-axis movement is from a separate AF (such as the AF described herein). 4 bimorph actuators push on the side of the AF device to achieve OIS motion. 57 illustrates an exploded view of an SMA system including an SMA actuator 5802 including a bimorph actuator 5806a-configured as a two-axis lens shift OIS, according to an embodiment d. 58 illustrates a cross-section of an SMA system including an SMA actuator 5802 including a bimorph actuator 5806a configured as a two-axis lens shift OIS- d. FIG. 59 illustrates a cassette bimorph actuator 5802 for use in an SMA system that is shaped to fit the bimorph actuator when manufactured, according to one embodiment. The system was previously configured as a two-axis lens shift OIS. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or more). Furthermore, these embodiments are configured to have a wide range of motion and good OIS dynamic tilt using 4 sliding bearings, such as POM sliding bearings. Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

60 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as a penta-axis lens shift OIS and autofocus device, according to one embodiment. For certain embodiments, a five-axis lens shift OIS and autofocus device is configured to move a lens in the X/Y/Z axis. For certain embodiments, pitch and roll axis motions are used for dynamic pitch tuning capabilities. Eight bimorph actuators were used to provide motion for autofocus and OIS using the techniques described herein. 61 illustrates an exploded view of an SMA system including an SMA actuator 6202 that includes dual configuration as a penta-axis lens shift OIS and autofocus device according to an embodiment Piezo wafer actuators 6204a-h. 62 illustrates a cross-section of an SMA system including an SMA actuator 6202 including a bimorph actuator configured as a five-axis lens shift OIS and autofocus device, according to one embodiment Actuators 6204a-h. FIG. 63 illustrates a cassette bimorph actuator 6202 for use in an SMA system that is shaped to fit the bimorph actuator when manufactured, according to one embodiment. The system was previously configured as a five-axis lens shift OIS and auto focus device. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or greater) and a high autofocus stroke (eg, 400 um or greater). Furthermore, these embodiments enable any tilt to be tuned out and eliminate the need for a separate autofocus assembly.

64 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as an outsert box, according to one embodiment. For certain embodiments, the bimorph actuator assembly is configured to enclose an item, such as a lens holder. Since the circuit assembly moves with the lens carrier, a flexible portion is configured for low X/Y/Z stiffness. The circuit tail pads are static. The push-out box can be configured for 4 or 8 bimorph actuators. Therefore, the push-out box can be configured as a 4 bimorph actuator on the side for OIS moving in the X and Y axes. The push-out box can be configured as a 4 bimorph actuator on the top and bottom for autofocus moving in the z-axis. The push-out box can be configured as one of 8 bimorph actuators on top, bottom, and sides for movement in x, y, and z axes and capable of 3-axis tilt (pitch/roll/side tilt) of OIS and autofocus. 65 illustrates an exploded view of an SMA system including an SMA actuator 6602 including bimorph actuators 6604a-h configured as an outboard box, according to one embodiment. Accordingly, the SMA actuator is configured such that the bimorph actuator acts on the outer housing 6504 to move the lens carrier 6506 using the techniques set forth herein. FIG. 66 illustrates an SMA system including an SMA actuator 6602 including a double configured to be partially shaped to receive an outsert box of a lens holder 6604a-h, according to one embodiment Piezoelectric wafer actuator. 67 illustrates an SMA system including an SMA actuator 6602 including bimorph actuators 6604a-h that are fabricated in accordance with one embodiment is configured as an extrapolation box before it is shaped to fit in the system.

68 illustrates an SMA system including an SMA actuator 6802 including a bimorph actuator 6806 configured as a triaxial sensor displacement OIS, according to one embodiment. For some embodiments, the z-axis movement is from a separate autofocus system. Four bimorph actuators 6806a-d are configured to push on the sides of a sensor carrier 6804 to provide motion for OIS using the techniques described herein. 69 illustrates an exploded view of an SMA including an SMA actuator 6802 including a bimorph actuator 6806a configured as a triaxial sensor displacement OIS, according to one embodiment -d. 70 illustrates a cross-section of an SMA system including an SMA actuator 6802 including a bimorph actuator configured as a triaxial sensor displacement OIS, according to one embodiment 6806a-d. Figure 71 illustrates a cassette bimorph actuator 6802 assembly for use in an SMA system that is shaped to It was previously configured as a three-axis sensor displacement OIS in the system. 72 illustrates a flex sensor circuit for use in an SMA system configured as a triaxial sensor shift OIS, according to an embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or greater) and a high autofocus stroke (eg, 400 um or greater). Furthermore, these embodiments are configured to have a wide range of two-axis motion and good OIS dynamic tilt using 4 sliding bearings, such as POM sliding bearings. Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

73 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as a six-axis sensor shift OIS and autofocus device, according to one embodiment 7404. For certain embodiments, the six-axis sensor shift OIS and autofocus device are configured to move a lens in the X/Y/Z/pitch/roll/roll axis. For certain embodiments, pitch and roll axis motions are used for dynamic pitch tuning capabilities. Eight bimorph actuators were used to provide motion for autofocus and OIS using the techniques described herein. 74 illustrates an exploded view of an SMA system including an SMA actuator 7402 including a bi-piezo configured as a six-axis sensor displacement OIS and autofocus device, according to one embodiment Wafer actuators 7404a-h. 75 illustrates a cross-section of an SMA system including an SMA actuator 7402 including a bi-piezo configured as a six-axis sensor displacement OIS and autofocus device, according to one embodiment wafer actuator. Figure 76 illustrates a cassette bimorph actuator 7402 for use in an SMA system that is shaped to fit the bimorph actuator when manufactured, according to one embodiment The system was previously configured as a six-axis sensor shift OIS and auto focus device. 77 illustrates a flex sensor circuit for use in an SMA system configured as a triaxial sensor shift OIS, according to an embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 200 um or greater) and a high autofocus stroke (eg, 400 um or greater). Furthermore, these embodiments enable any tilt to be tuned out and eliminate the need for a separate autofocus assembly.

78 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as a two-axis camera tilt OIS, according to one embodiment. For certain embodiments, the three-axis camera tilt OIS is configured to move a camera on the pitch/roll axis. Four bimorph actuators were used to push on the top and bottom of the autofocus device using the techniques described herein to achieve overall camera motion for OIS pitch and roll motion. 79 illustrates an exploded view of an SMA system including an SMA actuator 7902 including bimorph actuators 7904a-d configured as a two-axis camera tilt OIS, according to one embodiment. 80 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a two-axis camera tilt OIS, according to one embodiment. 81 illustrates a cassette bimorph actuator for use in an SMA system that is shaped to fit in the system when manufactured, according to an embodiment In the previous configuration for a two-axis camera tilt OIS. 82 illustrates a flex sensor circuit configured for a two-axis camera tilt OIS for use in an SMA system, according to an embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 3 degrees or more). Embodiments are configured for easy integration with auto-focus ("AF") designs (eg, VCM or SMA).

83 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as a three-axis camera tilt OIS, according to one embodiment. For certain embodiments, the two-axis camera tilt OIS is configured to move a camera on the pitch/roll/roll axis. 4 bimorph actuators were used to push on the top and bottom of the autofocus device to achieve full camera motion for OIS pitch and roll motion using the techniques described herein, and 4 bimorph actuators were used The wafer actuator is driven on the side of the autofocus device using the techniques described herein to achieve overall camera motion for the OIS roll motion. 84 illustrates an exploded view of an SMA system including an SMA actuator 8402 including bimorph actuators 8404a-h configured as a three-axis camera tilt OIS, according to one embodiment. 85 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a three-axis camera tilt OIS, according to one embodiment. 86 illustrates a cassette bimorph actuator for use in an SMA system that is shaped to fit in the system as it is manufactured, according to an embodiment The previous configuration is a three-axis camera tilt OIS. 87 illustrates a flex sensor circuit configured for a three-axis camera tilt OIS for use in an SMA system, according to an embodiment. Such a system can be configured to have a high OIS stroke OIS (eg, +/- 3 degrees or more). Embodiments are configured for easy integration with AF designs (eg, VCM or SMA).

88 illustrates exemplary dimensions of a bimorph actuator for an SMA actuator according to an embodiment. Dimensions are the preferred embodiment but those skilled in the art will understand that other dimensions may be used based on the desired characteristics of an SMA actuator.

89 illustrates a lens system for a folded camera, according to an embodiment. The folded camera includes a folded lens 8902 configured to bend light to a lens system 8901 including one or more lenses 8903a-8903d. For certain embodiments, the folded lens is one or more of a lens and any of a lens. The lens system 8901 is configured to have a major axis 8904 at an angle to a transmission axis 8906 that is parallel to the direction of light travel before the light reaches the folded lens 8902. For example, a folded camera is used in a camera phone system to reduce the height of a lens system 8901 in the direction of a transmission axis 8906.

Embodiments of lens systems include one or more liquid lenses, such as those described herein. The embodiment illustrated in Figure 89 includes two liquid lenses 8903b, 8903d (such as the liquid lenses described herein). One or more liquid lenses 8903b, 8903d are configured to be actuated using techniques including those described herein. A liquid lens is actuated using actuators including, but not limited to, buckle actuators, bimorph actuators, and other SMA actuators. Figure 108 illustrates the use of buckle actuator 60 to actuate a liquid lens, according to one embodiment. The liquid lens includes a forming ring coupler 64, a liquid lens assembly 61, one or more buckle actuators 60 (such as those described herein), a sliding base 65, and a base 62. One or more buckle actuators 60 are configured to move the forming ring/coupler 64 to change the shape of a flexible membrane of the liquid lens assembly 61 to move or shape the light rays, such as described in this article. For some embodiments, 3 or 4 actuators are used. A liquid lens can be configured alone or in combination with other lenses to act as an autofocus device or optical image stabilizer. A liquid lens can also be configured to otherwise direct an image onto an image sensor.

90 illustrates several embodiments of a lens system 9001 including liquid lenses 9002a-9002h used to focus an image on an image sensor 9004. As illustrated, the liquid lenses 9002a-9002h can include any lens shape and be configured to be dynamically configured to adjust the light path through the lens using techniques including those set forth herein.

A lens system for a folded camera is configured to include an actuated folded lens 9100. An example of an actuated folded lens is a tilting lens, such as the tilting lens illustrated in FIG. 91 . In the example illustrated in FIG. 91 , the folded lens is disposed on an actuator 9104 on a rim 9102 . An actuator includes, but is not limited to, an SMA actuator (including the SMA actuators described herein). For certain embodiments, the tilting pole is placed on an SMA actuator that includes 4 bimorph actuators 9106, such as the bimorph actuators described herein. According to certain embodiments, the actuated folded lens 9100 is configured as an optical image stabilizer using techniques including the techniques described herein. For example, an actuated folded lens is configured to include an SMA system, such as the SMA system illustrated in FIG. 39 . Another example of an actuated folded lens may include an SMA actuator, such as the one illustrated in FIG. 21 . However, the folded lens may also include other actuators.

92 illustrates a bimorph arm with an offset, according to an embodiment. The bimorph arm 9201 includes a bimorph beam 9202 having a length 9208 and a profiled offset 9203. Molded offset 9203 adds mechanical advantage to generate a higher force than a bimorph arm without an offset. According to certain embodiments, the offset depth 9204 (also referred to herein as the bending plane z offset 9204) and the offset length 9206 (also referred to herein as the slot width 9206) are configured to define the bimorph arms characteristics, such as peak force. For example, the graph in FIG. 106 illustrates the relationship between the bending plane z-offset 9204, slot width 9206, and peak force of a bimorph beam 9202, according to an embodiment.

The bimorph arm includes one or more SMA materials such as an SMA tape or SMA wire 9210 (such as the SMA tape or SMA wire described herein). The SMA material is attached to the beam using techniques including those set forth herein. For certain embodiments, SMA material, such as an SMA wire 9210, is attached to a fixed end 9212 of the bimorph arm and a load point end 9214 of the bimorph arm such that the molding offset 9203 is between the SMA between the ends to which the material is attached. For various embodiments, the ends of the SMA material are electrically and mechanically coupled to contacts that are configured to supply current to the SMA material using techniques including those known in the art. Bimorph arms with an offset can be included in SMA actuators and systems such as those described herein.

93 illustrates a bimorph arm with an offset and a limiter, according to an embodiment. The bimorph arm 9301 includes a bimorph beam 9302 having a shaped offset 9303 and a limiter 9304 adjacent the shaped offset 9303. The offset 9303 adds mechanical advantage to generate a higher force than a bimorph arm 9301 without an offset and the limiter 9304 prevents the arm from moving away from the unfixed load point end 9306 of the bimorph actuator movement in the direction. A bimorph arm 9301 with a shaped offset 9303 and limiter 9304 can be included in SMA actuators and systems such as those described herein. Bimorph arm 9301 includes attaching to bimorph arm 9301 one or more SMA materials, such as an SMA tape or SMA wire 9308 (such as those described herein, using techniques including those described herein) SMA tape or SMA wire).

94 illustrates a bimorph arm with an offset and a limiter, according to an embodiment. The bimorph arm 9401 includes a bimorph beam 9402 having a shaped offset 9403 and a limiter 9404 adjacent the shaped offset 9403. The limiter 9404 is formed as part of a base 9406 of a bimorph arm 9401. The base 9406 is configured to receive a bimorph arm 9401 and includes a recess 9408 that is configured to receive the offset portion of the bimorph beam. The bottom of the recess is configured to be adjacent to a limiter 9404 of molding offset 9403. The base 9406 may also include one or more portions 9410 that are configured to support portions of the bimorph arm when the bimorph arm is not actuated. A bimorph arm 9401 with a shaped offset 9403 and limiter 9404 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9401 includes one or more SMA materials, such as an SMA tape or SMA wire (such as the SMA described herein, to be attached to the bimorph arm 9401 using techniques including those described herein) tape or SMA wire).

95 illustrates an embodiment including a pedestal having a bimorph arm with an offset, according to an embodiment. The bimorph arm 9501 includes a bimorph beam 9502 with a shaped offset 9504. The bimorph arm may also include a limiter using techniques including those described herein. Bimorph arm 9501 includes attaching to bimorph arm 9501 one or more SMA materials, such as an SMA tape or SMA wire 9506 (such as those described herein, using techniques including those described herein) SMA tape or SMA wire).

96 illustrates an embodiment of a pedestal 9608 including two bimorph arms with an offset, according to an embodiment. Each bimorph arm 9601a, 9601b includes a bimorph beam 9602a, 9602b with a shaped offset 9604a, 9604b. Each bimorph arm 9601a, 9601b includes one or more SMA materials, such as an SMA tape or SMA wire 9606a, 9606b ( such as SMA tape or SMA wire as described herein). Each bimorph arm 9601a, 9601b may also include a limiter using techniques including those described herein. Certain embodiments include a pedestal that includes more than two bimorph arms formed using techniques including those described herein. According to some embodiments, bimorph arm 9601 is integrally formed with base 9608. For other embodiments, one or more of the bimorph arms 9601a, 9601b are formed separately from the base 9608 and attached to the base using techniques including, but not limited to, solder, resistance welding, laser welding, and adhesives Block 9608. For certain embodiments, two or more bimorph arms 9601a, 9601b are configured to act on a single object. This achieves the ability to increase the force applied to an object. The following graphs in FIG. 107 illustrate an example of how the approximate one-box volume of one of the cassettes encompassing the entire bimorph actuator is related to the work of each bimorph assembly. A length 9612 of the bimorph actuator, a width 9610 of the bimorph actuator, and a height 9614 of the bimorph actuator are used to approximate the box volume (collectively referred to as "box volume").

97 illustrates a buckle arm including a point-of-load extension, according to one embodiment. Buckle arm 9701 includes a beam portion 9702 and one or more load point extensions 9704a, 9704b extending from beam portion 9702. Each end 9706a, 9706b of the buckle arm 9701 is configured to be attached to or integrally formed to a board or other base using techniques including those described herein. According to certain embodiments, the one or more load point extensions 9704a, 9704b are attached or integrally formed with the beam portion 9702 at an offset from one of the load points 9710a, 9710b of the beam portion 9702. Load points 9710a, 9710b are portions of beam portion 9702 that are configured to transfer the force of buckle arm 9701 to another object. For certain embodiments, the load points 9710a, 9710b are the center of the beam portion 9702. For other embodiments, the load points 9710a, 9710b are located at a location other than the center of the beam portion 9702. A point-of-load extension 9704a, 9704b is configured to extend in the direction of the longitudinal axis of the beam portion 9702 from the point at which the point-of-load extension joins the beam portion 9702 toward the load point 9710a, 9710b of the beam portion 9702. For certain embodiments, the ends of the load point extensions 9704a, 9704b extend at least to the load points 9710a, 9710b of the beam portion 9702. Buckle arm 9701 includes one or more SMA materials, such as an SMA tape or SMA wire 9712 (such as the SMA tape or SMA wire described herein). SMA material, such as an SMA wire 9712, is attached at opposite ends of the beam portion 9702. The SMA material is attached to opposite ends of the beam portion using techniques including those described herein. For certain embodiments, the length of the point-of-load extensions 9704a, 9704b can be configured to be any length contained within the longitudinal length of the associated flattened (unactuated) beam portion 9702 of the buckle arm 9701.

98 illustrates a buckle arm 9801 including a point-of-load extension 9810 in an actuated position, according to an embodiment. The SMA material attached to opposite ends of beam portion 9802 is actuated using techniques including those described herein. The load point 9804 enables the buckle arm 9801 to increase the range of stroke compared to a buckle arm without an extension. Thus, the buckle arm including the point-of-load extension achieves a greater maximum vertical stroke. Buckle arms with point-of-load extensions can be included in SMA actuators and systems such as those described herein.

99 illustrates a bimorph arm including point-of-load extensions, according to one embodiment. The bimorph arm 9901 includes a beam portion 9902 and one or more point-of-load extensions 9904a, 9904b extending from the beam portion. One end of bimorph arm 9901 is configured to be attached to or integrally formed to a board or other submount using techniques including those described herein. The end of the beam portion 9902 opposite the attached or integrally formed end is unfixed and free to move. According to certain embodiments, one or more point-of-load extensions 9904a, 9904b are attached or integrally formed with the beam portion 9902 at an offset from one of the free ends of the beam portion 9902. The point-of-load extensions 9904a, 9904b are configured to extend in a direction away from a plane containing the longitudinal axis of the beam portion 9902 from the point where the point-of-load extension joins the beam portion 9902. For example, when the beam portion is actuated, one or more point-of-load extensions 9904a, 9904b extend in the direction in which the free end of the beam portion extends. Certain embodiments of a bimorph arm 9901 include one or more point-of-load extensions 9904a, 9904b having a longitudinal axis that forms between 1 and 90 degrees from a plane containing the longitudinal axis of the beam portion one angle. For certain embodiments, the ends 9910a, 9910b of the point-of-load extensions 9904a, 9904b are configured to engage an object that is configured to be moved.

The bimorph arm 9901 includes one or more SMA materials, such as an SMA tape or SMA wire 9906 (such as the SMA tape or SMA wire described herein). SMA material, such as an SMA wire 9906, is attached at opposite ends of the beam portion 9902. The SMA material is attached to opposite ends of the beam portion 9902 using techniques including those described herein. For certain embodiments, the length of the point-of-load extensions 9904a, 9904b can be configured to be any length. According to certain embodiments, the location of the engagement point where an article is engaged by one end 9910a, 9910b of the point-of-load extension 9904a, 9904b can be configured to be located at any point along the longitudinal length of the beam portion 9902. When the beam portion is flat (unactuated), the height above the beam portion at the end of a point-of-load extension can be configured to any height. For certain embodiments, the point-of-load extension may be configured to be at least higher than the rest of the bimorph arm when the bimorph arm is actuated.

Figure 100 illustrates a bimorph arm including a point-of-load extension in an actuated position, according to an embodiment. The SMA material attached to the opposite ends of beam portion 2 is actuated using techniques including those set forth herein. The point-of-load extension 10 enables the bimorph arm 1 to increase the stroke force compared to a bimorph arm without an extension. Thus, the bimorph arm 1 including the point-of-load extension 10 achieves a larger force exerted by the bimorph arm 1 . The bimorph arm 1 with the point-of-load extension 10 can be included in SMA actuators and systems such as those described herein.

101 illustrates an SMA optical image stabilizer according to an embodiment. The SMA optical image stabilizer 20 includes a moving plate 22 and a static plate 24 . The moving plate 22 includes spring arms 26a, b integrally formed with the moving plate 22. For some embodiments, the moving plate 22 and the static plate 24 are each formed as a single one-piece plate. The moving plate 22 includes a first SMA material attachment portion 28a and a second SMA material attachment portion 28b. The static plate 24 includes a first SMA material attachment portion 30a and a second SMA material attachment portion 30b. Each SMA material attachment portion 28, 30 is configured to secure an SMA material, such as an SMA wire, to a board using a resistance welded joint. The first SMA material attachment portion 28a of the moving plate 22 includes a first SMA wire 32a disposed between the first SMA material attachment portion and a first SMA material attachment portion 30a of the static plate, and the A second SMA wire 32b between the first SMA material attachment portion and the second SMA attachment portion 30b of the static plate 24 . The second SMA material attachment portion 28b of the moving plate 22 includes a third SMA wire 32c disposed between the second SMA material attachment portion and a second SMA material attachment portion 30b of the static plate, and disposed in the A fourth SMA wire 32d between the second SMA material attachment portion and the first SMA attachment portion 30a of the static plate 24 . Actuating each SMA wire using techniques including the techniques set forth herein moves the moving plate 22 away from the static plate 24 . Figure 102 illustrates an SMA material attachment portion 40 of a moving portion according to an embodiment. The SMA material attachment portion is configured to have SMA material (such as an SMA wire 41a, b) resistance welded to the SMA material attachment portion 40 . 103 illustrates an SMA attachment portion 42 of a static plate to which resistance welded SMA wires 43a, b are attached, according to an embodiment.

Figure 104 illustrates an SMA actuator 45 including a buckle actuator, according to one embodiment. Buckle actuators 46a, b include buckle arms 47a-d, such as those described herein. The buckle arms 47a-d are configured to move in the z-axis when the SMA wires 48a, b are actuated and de-actuated using techniques including those described herein. Each SMA wire 48a,b is attached to a respective resistance weld wire crimp 49a,b using resistance welding. Each resistance weld wire crimp 49a,b includes an island 50 isolated on at least one side of the SMA wires 48a,b from the metal 51 forming the buckle arms 47a-d. Island structures can be used in other actuators, optical image stabilizers, and autofocus systems to connect at least one side of an SMA wire to an isolated island structure formed in a base metal layer, such as that shown in Figure 101 Demonstration of the OIS application.

105 illustrates a resistance weld crimp including an island for an SMA actuator for use in attaching a resistance weld crimp using techniques including the techniques described herein, according to an embodiment SMA wires 48a, b are attached to belt buckle actuators 46a, b. FIG. 105a illustrates a bottom portion of the SMA actuator 45. FIG. According to some embodiments, the SMA actuator 45 is formed from a stainless steel base layer 51 . A dielectric layer 52 (such as a polyimide layer) is disposed on the bottom portion of the stainless steel base layer 51 . According to some embodiments, a conductor layer 53 is electrically connected to the stainless steel island 50 through a via in the dielectric layer 52 so that the wire soldered to the stainless steel island 50 and the conductors attached to the stainless steel island are An electrical connection is made between the circuits. According to some embodiments, an island 50 is etched from the stainless steel base layer. The dielectric layer 52 maintains the position of the island 50 on the stainless steel base layer 51 . Island 50 is configured to attach an SMA wire thereto using techniques including those described herein, such as resistance welding. FIG. 105b illustrates a top portion of the SMA actuator 45 including an island 50. FIG. For certain embodiments, glue or adhesive may also be placed on top of the weld to aid in mechanical strength and to act as a fatigue strain relief during handling and sudden loads.

Figure 108 includes a lens system including an SMA actuator with a buckle actuator, according to an embodiment. The lens system includes a liquid lens assembly 61 disposed on a base 62 . The lens system also includes a forming ring/coupler 64 that is mechanically coupled to the buckle actuator 60 . An SMA actuator, including a buckle actuator 60 , such as the buckle actuators described herein, is seated on a sliding base 65 , which is seated on a base 62 . The SMA actuator is configured to move the forming ring/coupler 64 along the optical axis of the liquid lens assembly 61 by actuating the buckle actuator 60 using techniques including the techniques described herein. This moves the forming ring/coupler 64 to change the focus of the liquid lens in the liquid lens assembly.

109 illustrates one of the unfixed point-of-load ends of a bimorph arm according to an embodiment. The unfixed point-of-load end 70 of a bimorph arm includes a flat surface 71 for attaching SMA material, such as an SMA wire 72 . The SMA wire 72 is attached to the flat surface 71 by a resistance weld 73 . The resistance welded portion 73 is formed using techniques including techniques known in the art.

Figure 110 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment. The unfixed point-of-load end 76 of a bimorph arm includes a flat surface 77 for attaching SMA material, such as an SMA wire 78 . SMA wire 78 is attached to flat surface 77 by a resistance weld (similar to the resistance weld illustrated in Figure 109). An adhesive 79 is placed on the resistance weld. This achieves a more reliable joint between the SMA wire 78 and the unfixed load point end 76 . Adhesive 79 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

FIG. 111 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment. The unfixed point-of-load end 80 of a bimorph arm includes a flat surface 81 for attaching SMA material, such as an SMA wire 82 . An intermetallic layer 84 is disposed on the flat surface 81 . The intermetallic layer 84 includes, but is not limited to, a gold layer, a nickel layer or an alloy layer. The SMA wire 82 is attached to the intermetallic layer 84 disposed on the flat surface 81 by a resistance weld 83 . The resistance welded portion 83 is formed using techniques including techniques known in the art. The intermetallic layer 84 achieves better adhesion to the loose point-of-load terminal 80 .

112 illustrates one of the unfixed point-of-load ends of a bimorph arm according to an embodiment. The unfixed point-of-load end 88 of a bimorph arm includes a flat surface 89 for attaching SMA material, such as an SMA wire 90 . An intermetallic layer 92 is disposed on the flat surface 89 . The intermetallic layer 92 includes, but is not limited to, a gold layer, a nickel layer or an alloy layer. SMA wire 90 is attached to flat surface 89 by a resistance weld (similar to the resistance weld illustrated in Figure 111). An adhesive 91 is placed on the resistance weld. This achieves a more reliable joint between the SMA wire 90 and the unfixed load point end 88 . Adhesive 91 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

113 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 95 of a bimorph arm includes a flat surface 96 for attaching SMA material, such as an SMA wire 97 . The SMA wire 97 is attached to the flat surface 96 by a resistance weld 98 . The resistance welded portion 98 is formed using techniques including those known in the art.

114 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 120 of a bimorph arm includes a flat surface 121 for attaching SMA material, such as an SMA wire 122 . The SMA wire 122 is attached to the flat surface 121 by a resistance weld (similar to the resistance weld illustrated in Figure 113). An adhesive 123 is placed on the resistance weld. This achieves a more reliable connection between the SMA wire 122 and the fixed end 120 . The adhesive 123 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

115 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 126 of a bimorph arm includes a flat surface 127 for attaching SMA material, such as an SMA wire 128 . An intermetallic layer 130 is disposed on the flat surface 127 . The intermetallic layer 130 includes, but is not limited to, a gold layer, a nickel layer or an alloy layer. The SMA wire 128 is attached to the intermetallic layer 130 disposed on the flat surface 127 by a resistance weld 129 . The resistance welded portion 129 is formed using techniques including those known in the art. The intermetallic layer 130 achieves better adhesion with the fixed end 126 .

Figure 116 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 135 of a bimorph arm includes a flat surface 136 for attaching SMA material, such as an SMA wire 137 . An intermetallic layer 138 is disposed on the flat surface 136 . The intermetallic layer 138 includes, but is not limited to, a gold layer, a nickel layer or an alloy layer. SMA wire 137 is attached to flat surface 136 by a resistance weld (similar to the resistance weld illustrated in Figure 115). An adhesive 139 is placed on the resistance weld. This achieves a more reliable connection between the SMA wire 137 and the fixed end 135 . Adhesive 139 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

117 illustrates a rear view of a fixed end of a bimorph arm according to an embodiment. The bimorph arm 143 is configured according to the embodiments set forth herein. The fixed end 143 of a bimorph arm includes an island 144 isolated from the outer portion 145 of the fixed end 143 . This enables the islands 144 to be electrically and/or thermally isolated from the outer portion 145 . For some embodiments, the SMA material attached to the opposite side of the fixed end 143 of the bimorph arm is electrically coupled to the SMA material, such as an SMA wire, through a through hole. Island 144 is disposed on an insulator 146, such as the insulator described herein. The islands 144 may be formed using etching techniques including etching techniques known in the art.

118 illustrates an exploded view of a buckle module tilt OIS assembly 11800 according to an embodiment. Buckle module tilt OIS assembly 11800 includes two sub-assemblies: a top buckle assembly 11820 and a bottom buckle assembly 11900. The top buckle assembly 11820 is configured to provide a tilt axis movement for dynamic tilt tuning capability. Bottom buckle assembly 11900 is configured to provide a pitch axis movement for dynamic tilt tuning capability. Buckle Module Tilt OIS Assembly 11800 is configured as two separate sub-assemblies, each sub-assembly containing a two-wire buckle actuator that each moves a carriage. Two buckle assemblies are implemented for efficient manufacturing and assembly.

The buckle module tilt OIS assembly 11800 includes a four-wire buckle actuator, for example, the four-wire buckle as discussed above with reference to FIGS. 19-22, using techniques including those described herein. The buckle module tilt OIS assembly 11800 is operable to achieve a two-axis camera module OIS tilt using techniques including the techniques set forth herein, for example, such as the two-axis cameras discussed above with reference to FIGS. 78-82 The mod OIS is tilted. Thus, the buckle module tilt OIS assembly 11800 is operable to move a mass heavier than current actuators of similar size, move a mass to a tilt angle as large as ±5°, and move a mass at high speed Mass block. Thus, tilting the OIS assembly 11800 by the buckle module enables the suppression of unwanted hand-shaking movements.

Buckle Module Tilt OIS Assembly 11800 contains compact flex circuits operable to enable the camera module to move/tilt in two axes and carry electrical signals from the moving image sensor . This is discussed in more detail below with respect to FIGS. 128-131 and 133-134. Additionally, various sensors or components (including, for example, hall element sensors, TMR sensors) may be implemented herein to measure and enable feedback of tilt position for closed loop control, and Equivalent to the resistance feedback of the SMA wire of the actuator movement.

The belt buckle module tilt OIS assembly 11800 includes an AF assembly with a sensor bracket 11840, a sensor circuit PCB 11860 and a mold sandwiched between the top buckle assembly 11820 and the bottom buckle assembly 11900 Group Circuit PCB 11880. The moving mass includes an AF assembly with a sensor bracket 11840, a sensor circuit PCB 11860, and a module circuit PCB 11880. The top buckle assembly 11820 is configured to receive the AF assembly with the sensor bracket 11840 and the sensor circuit PCB 11860. This is discussed in more detail below with respect to Figures 124A and 124B. Note that the buckle module tilt OIS assembly 11800 may include more or fewer components than those shown in FIG. 118; however, the components shown are sufficient to reveal illustrative embodiments for practicing the present innovation. In some instances, the module being moved is a full camera module. Thus, the buckle module tilt OIS assembly 11800 includes an image sensor on a PCB, an auto focus (AF) module, and a camera lens. It should be understood, however, that the present disclosure and example embodiments may be implemented in different technologies.

119 illustrates an assembled view of a buckle module tilt OIS assembly 11800 according to an embodiment. Buckle Module Tilt OIS Assembly 11800 can be configured to fit in a footprint of up to 14.5 mm by 14.5 mm to 16.5 mm. For reference, the AF assembly with sensor bracket 11840 has a footprint of approximately 10 mm by 10 mm. Figure 135 illustrates a footprint of a dimension of an AF assembly with a sensor holder 11840, according to one embodiment. Thus, some embodiments of the buckle module tilt OIS assembly 11800 have a footprint that is 4.5 mm larger than the AF assembly with the sensor bracket 11840.

120 illustrates the force applied to the buckle module tilt OIS assembly 11800, according to one embodiment. The top buckle assembly 11820 includes buckle arms 11833, each of which is positioned to cause the top buckle assembly 11820 to produce a roll axis motion. Bottom buckle assembly 11900 includes buckle arms 11813, each of which is positioned such that bottom buckle assembly 11900 produces a pitch axis motion. Thus, the top buckle assembly 11820 and the bottom buckle assembly 11900 are pushed away from each other to provide dynamic tilt of the buckle module tilt OIS assembly 11800 . The top buckle assembly 11820 provides an upward force (roll) 11830, while the bottom buckle assembly 11900 provides a downward force (pitch) 11810. According to certain embodiments, the buckle module tilt OIS assembly 11800 is operable to connect to the SMA wires and Hall sensors directly via the module circuit PCB 11880 .

The thrust of some of the embodiments has 10 times or more thrust as compared to the current technology. An example of the thrust of the top buckle assembly 11820 and the bottom buckle assembly 11900 is between 20 grams and 30 grams. This achieves a higher frequency response rate of the Buckle Module Tilt OIS Assembly 11800 when used with objects having a larger mass. Thus, the disclosed embodiments have a smaller footprint than current technology and can move a larger mass.

121 illustrates a tilt produced by a force applied to the buckle module tilt OIS assembly 11800, according to one embodiment. The AF assembly with sensor bracket 11840 is shown tilted at an angle Θ. In some examples, the angle Θ may be about 5 degrees off center. According to some embodiments, the AF assembly with the sensor bracket 11840 is operable to move up and down by about 0.56 mm. Additionally, for certain embodiments, the AF assembly with the sensor bracket 11840 is operable to move laterally by about 0.155 mm. According to certain embodiments, the buckle module tilt OIS assembly 11800 provides clearance for relative movement of the AF assembly with the sensor bracket 11840.

122 illustrates an exploded view of a top buckle assembly 11820 of a buckle module tilt OIS assembly 11800 according to an embodiment. The top buckle assembly 11820 may include a housing having a top spring 11920, a top AF bracket 11940, a flex sensor circuit 11960, and a roll tilt subassembly 11980. The roll tilt subassembly 11980 includes a tilt subassembly buckle frame 11910 , a stainless steel SST buckle frame 11930 , sliding bearings 11950 , at least one SMA wire 11970 and an SST sliding base 11990 . For certain embodiments, the plain bearing 11950 is formed of polyoxymethylene ("POM bearing").

123 illustrates an exploded view of the bottom buckle assembly 11900 of the buckle module tilt OIS assembly 11800 according to one embodiment. The bottom buckle assembly 11900 may include a housing having a bottom spring 12000, a bottom AF bracket 12020, and a pitch tilt subassembly 12040. The pitch and tilt sub-assembly 12040 includes a tilt sub-assembly buckle frame 12010 , a stainless steel SST buckle frame 12030 , sliding bearings 12050 , an SMA wire 12070 and an SST sliding base 12090 .

124A illustrates an exploded view of a partially assembled buckle module tilt OIS assembly 11801 according to an embodiment. The AF assembly with a sensor bracket 11840 is inserted from below and secured to the top buckle assembly 11820. In some examples, the AF assembly with the sensor bracket 11840 is secured to the top buckle assembly 11820 via adhesive, solder joints, or other known procedures for mounting subassemblies. 124B illustrates an assembled view of a partially assembled buckle module tilt OIS assembly 11801 according to an embodiment. The AF assembly with the sensor bracket 11840 is coupled to the sensor circuit PCB 11860. Sensor circuit connections 12120 are facilitated between the sensor circuit PCB 11860 and the AF assembly with the sensor bracket 11840 immediately after coupling the two components.

125 illustrates a front view of a partially assembled buckle module tilt OIS assembly 11801 according to an embodiment. The sensor circuit PCB 11860 is connected from below to the AF assembly with the sensor bracket 11840. The sensor circuit PCB 11860 can be secured to the AF assembly with the sensor bracket 11840 via solder joints 12124 and 12122 or other known procedures for mounting sub-assemblies.

126 illustrates the assembly process of the buckle module tilt OIS assembly 11800 according to one embodiment. As discussed above, the AF assembly with the sensor bracket is inserted from below and secured to the top buckle assembly 11820, which forms part of the assembled buckle module tilt OIS assembly 11801 (moving proof mass). At this point, the electrical connections are still exposed and can be bonded together (usually with solder). The module circuit PCB 11880 is coupled from below to the partially assembled buckle module tilt OIS assembly 11801.

127 illustrates the coupling of a modular circuit PCB 11880 to a partially assembled buckle module tilt OIS assembly 11801, according to one embodiment. Additionally, the bottom buckle assembly 11900 is coupled from below to the module circuit PCB and partially assembled buckle module tilt OIS assembly to form the buckle module tilt OIS assembly 11800 . The bottom buckle assembly 11900 is then attached to the top buckle assembly 11820 along the fixed perimeter and the bottom buckle assembly 11900 bracket is attached to the bottom of the partially assembled buckle module tilt OIS assembly 11801 .

128 illustrates the flex sensor circuit 11909 of the buckle module tilt OIS assembly 11800 according to one embodiment. 129 illustrates the flex sensor circuit 11909 of the buckle module tilt OIS assembly 11800 according to one embodiment. The flex sensor circuit 11909 may have a fixed connection 11907 to the modular circuit PCB 11880 at a first end. The flex sensor circuit 11909 can include a sensor circuit connection 12120 at a second end.

Figure 130 illustrates a flex sensor circuit of a buckle module tilt OIS assembly 12500 according to an alternative embodiment. Buckle module tilt OIS assembly 12500 includes two flex sensor circuits 11908 and 11909. The two flex sensor circuits 11908 and 11909 are separated by a flex section 12501 to allow the two-axis movement of the buckle module to tilt the OIS assembly 12500. Other embodiments include buckle module tilt OIS assemblies that include more than two flex sensor circuits. 131 illustrates a flex sensor circuit of a buckle module tilt OIS assembly 12500 according to an alternative embodiment. A first end of the flex sensor circuit 11908 is mounted to a fixed module circuit PCB 12880 as illustrated herein. A second end of the flex sensor circuit 11908 is mounted to a sensor circuit PCB 11860 that is not stationary and operable to move. Likewise, a first end of the flex sensor circuit 11909 is mounted to a fixed module circuit PCB 12880. A second end of the flex sensor circuit 11909 is mounted to a sensor circuit PCB 11860 which is not stationary and operable to move. Each of the flex sensor circuits 11908 and 11909 includes one or more flex regions 12502 that enable the flex sensor circuits to move as the buckle module tilts the moving components of the OIS assembly 12500.

132 illustrates an assembled view of a buckle module tilt OIS assembly 13200 according to an alternate embodiment. Buckle Module Tilt OIS Assembly 13200 includes a top buckle assembly 13220. The top buckle assembly 13220 includes buckle arms 13233, each of which is positioned downwardly such that the top buckle assembly 13220 produces a pitch axis movement in a downward direction. Buckle module tilt OIS assembly 13200 also includes a bottom buckle assembly 13230.

The bottom buckle assembly 13230 includes buckle arms 13213, each of which is positioned to cause the bottom buckle assembly 13230 to produce a roll axis motion in an upward direction. Thus, the top buckle assembly 13220 and the bottom buckle assembly 13230 are pushed toward each other to provide dynamic tilt of the buckle module tilt OIS assembly 13200. The top buckle assembly 13220 provides a downward force (pitch), while the bottom buckle assembly 13230 provides an upward force (roll).

Figure 133 illustrates a buckle module tilt OIS assembly 13300 according to an alternative embodiment. 134 illustrates an underside of an assembled view of the buckle module tilt OIS assembly 13300. Buckle module tilt OIS assembly 13300 includes long flex circuit 13301 extending directly from sensor circuit PCB 13360. The flex circuit extends from the sensor circuit PCB 13360 to achieve two-axis motion. According to the embodiments discussed herein, the buckle module tilt OIS assembly 13300 would include a four-wire buckle system to tilt the camera of the OIS.

Figure 136 illustrates an SMA module tilt OIS assembly 13600 according to an embodiment. 137 illustrates an SMA module tilt OIS assembly 13600 under directional deformation, according to one embodiment. The SMA module tilt OIS assembly 13600 incorporates a four wire buckle tilt camera module that uses techniques including those described herein to achieve movement in the pitch and roll directions. The bottom two wires are operable to be driven differentially for pitch tilt using techniques including the techniques set forth herein. Additionally, the top two wires are operable to be driven differentially for roll lean. Movement of the sub-assemblies causes the SMA module to tilt the OIS assembly 13600 up to ±4.9° tilt, as demonstrated herein. In addition, the buckle thrust is greater than or equal to 20 grams. This configuration is ideal for moving heavy masses at higher frequencies and amplitudes.

138 illustrates a flex sensor circuit 13700 of a buckle module tilt OIS assembly 13600 according to an alternate embodiment. The flex sensor circuit 13700 is operable to carry signals from the image sensor to a PCB or other circuit external to the sensor.

139 illustrates a buckle module tilt OIS assembly 1 including a single housing, according to one embodiment. Housing 2 is configured to include a top buckle assembly (according to embodiments set forth herein) and a bottom buckle assembly (according to embodiments set forth herein) within housing 2 . The housing 2 is configured to receive a flexible printed circuit 3 on an outer surface of the housing 2 . The flexible printed circuit 3 is configured to include one or more position sensors 22 that are configured to achieve closed-loop control using techniques including the techniques set forth herein. For some embodiments, the one or more sensors are Hall element sensors. For certain embodiments, the flexible printed circuit 3 is configured to include one or more integrated circuits, such as an OIS driver.

140 illustrates an exploded view of a buckle module tilt OIS assembly 1 including a single housing, according to one embodiment. The buckle module tilt OIS assembly 1 includes a top return spring 4 configured to generate a return torque to aid tilt stroke stability. According to some embodiments, the top return spring 4 is disposed on a top autofocus bracket 5 of one of the top buckle assemblies. Top autofocus bracket 5 is configured to receive a top portion of a module. For some embodiments, the module is an autofocus and image sensor module 21 . The top buckle assembly 6 also includes a buckle actuator 7 (such as the buckle actuator described herein). The buckle actuator 7 is configured using techniques including the techniques set forth herein. According to certain embodiments, the top buckle assembly 6 includes one or more bearings 8 (such as those set forth herein). The top buckle assembly 6 includes one or more SMA wires 9 (similar to those described herein). One or more SMA wires 9 are configured to actuate the buckle actuator 7 using techniques including the techniques set forth herein.

The buckle module tilt OIS assembly also includes the bottom buckle assembly 11 . Bottom buckle assembly 11 includes a buckle actuator 12 (such as the buckle actuator described herein). The buckle actuator 12 is configured using techniques including those set forth herein. For some embodiments, the buckle actuator 12 is an SMA actuator of a different type than the buckle actuator 7 of the top buckle assembly 6 . According to certain embodiments, the bottom buckle assembly 11 includes one or more bearings 13 (such as those described herein). Bottom buckle assembly 11 includes one or more SMA wires 14 (similar to those described herein). The one or more SMA wires 14 are configured to actuate the buckle actuator 12 using techniques including the techniques set forth herein. According to some embodiments, the top buckle assembly 6 is positioned on the bottom buckle assembly 11 .

The buckle module tilt OIS assembly according to the embodiment illustrated in FIG. 140 includes a bottom autofocus bracket 16 . Bottom autofocus bracket 16 is configured to receive a bottom portion of a module, such as an autofocus and image sensor module 21 . Bottom autofocus bracket 16 is configured to receive one or more magnets 15 . One or more magnets 15 are aligned with a respective position sensor included in flexible printed circuit 3 as part of a closed loop control using techniques including those described herein. One or more magnets 15 and one or more position sensors 22 are configured to obtain information about the tilt and height or z-axis position of modules, such as an autofocus and image sensor module 21 .

The buckle module tilt OIS assembly includes a bottom spring 17 . Bottom spring 17 is configured to receive bottom autofocus bracket 16 . A sensor circuit 18 is configured to electrically couple the module to power sources and circuits external to the module. According to some embodiments, the sensor circuit 18 is also configured to electrically couple one or more position sensors with any integrated circuit, such as an OIS driver, through the flexible printed circuit 3 . For certain embodiments, sensor circuit 18 is a flexible circuit that includes conductive traces to electrically couple one or more position sensors, any integrated circuits, and/or modules. The flex circuit enables the module to be moved through the top buckle assembly 6 and bottom buckle assembly 11 without damaging the conductive traces. The sensor circuit 18 is disposed on a base cap 19 . Base cap 19 is configured to mate with housing 2 using techniques including those known in the art.

141 illustrates a buckle module tilt OIS according to an embodiment. Buckle module tilt OIS 23 includes a top buckle assembly 24 (such as the top buckle assembly described herein), and a bottom buckle assembly 25 (such as the bottom buckle assembly described herein) . The buckle module tilt OIS 23 includes a module circuit printed circuit board (PCB) 226 configured to include one or more position sensors (such as the position sensors set forth herein) . As illustrated in Figure 141, a roll tilt sub-assembly of the top buckle assembly 24, such as the roll tilt sub-assembly set forth herein, is configured to have a high force 27 on one side and There is a low force 28 on the other side to achieve a tilt of a module in a first direction. According to certain embodiments, for this example of tilting in a first direction, a pitch tilt subassembly of the bottom buckle assembly 25, such as the pitch tilt subassembly set forth herein, is configured to There is a moderate force 29 on both sides to act as one of the pivots for the tilting movement. Using similar techniques, the buckle module tilt OIS 23 is configured to move the module in a number of positions.

142 illustrates internal components of a buckle module tilt OIS 30, such as those described herein, according to an embodiment. The buckle module tilt OIS 30 includes a top spring 31 and a bottom spring 32 . Top spring 31 and bottom spring 32 are configured to have similar stiffness. For some embodiments, the stiffness of the top spring 31 and bottom spring 32 is 61 mN-mm/degree. However, those skilled in the art will understand that the stiffness can be configured to any desired stiffness by adjusting the material of the spring and/or the thickness of the material.

Figure 143 illustrates a top spring according to an embodiment. The top spring 33 includes one or more spring arms 34a to 34d. According to an embodiment, the top spring 33 is configured to generate a return torque to assist the tilt stroke stability of the belt buckle module tilt OIS. Figure 144 illustrates a bottom spring 35 according to an embodiment. Top spring 33 includes one or more spring arms 36a to 36d. According to an embodiment, the bottom spring 35 is configured to generate a return torque to assist the tilt stroke stability of the belt buckle module tilt OIS. For certain embodiments, the material of the top spring 33 and bottom spring 35 is formed from a 302/304 stainless steel having a thickness of 50 microns and a spring arm width of 120 microns.

145 illustrates a flex sensor circuit coupled to a module of a belt buckle module tilt OIS assembly, according to one embodiment. The buckle module tilt OIS is configured according to the embodiments set forth herein. The flex sensor circuit 37 is electrically coupled at a first end of the flex sensor circuit 37 with a bottom of a module 38, such as described herein. The flex sensor circuit 37 is configured to have a first set of traces 39 and a second set of traces 40 . The first set of traces 39 extend from a first pad 246 and are electrically coupled to a first portion of the module 38 through the first pad 246 of the flex sensor circuit 37 . The second set of traces 40 extend from a second pad 247 and are electrically coupled to a first portion of the module 38 through a second pad 247 of the flex sensor circuit 37 . The second ends of the first set of traces 39 are configured to terminate at a first terminal pad 44 disposed in a terminal pad portion 42 of the single housing 243 . The second ends of the second set of traces 40 are configured to terminate at a second terminal pad 45 in a terminal pad portion 42 disposed on one side of the single housing 243 . The terminal pad portion 42 of the single housing 243 is configured to couple with one or more connectors of a circuit board to electrically couple the modules and other circuits of the buckle module tilt OIS assembly to other circuits.

For some embodiments, the first terminal pad 44 and the second terminal pad 45 are formed on the same base layer. For other embodiments, the first terminal pad 44 and the second terminal pad 4555 are formed on a physically separate base layer. The configuration of the flex sensor circuit 37 enables simultaneous soldering of the connections of the first pad 246 , the second pad 247 , the first terminal pad 44 and the second terminal pad 45 . Additionally, the flex sensor circuit 37 is configured to have electrical traces of a smaller size with a low stiffness to minimize effects during movement of the module 38 .

Figure 146 illustrates a flex sensor circuit including a base cap 148, such as the base cap set forth herein, according to the embodiment illustrated in Figure 145. The base cap is configured to mate with the single housing 243 using techniques including those known in the art. The base cap 148 includes a terminal cover portion 149 that is configured to cover the first terminal pad 44 and the second terminal pad 45 .

147 illustrates a buckle module tilt OIS assembly without a housing and base cap, according to an embodiment. Buckle module tilt OIS 50 includes a flex sensor circuit 51 (such as the flex sensor circuit described herein) that includes a first set of traces and a second set of traces. The flex sensor circuit 51 is configured to minimize the deviation between pitch and roll stiffness and have a low force effect on movement of the module, such as described herein. According to some embodiments, the first terminal pad and the second terminal pad extend no more than 1 mm from the side of the module. However, those skilled in the art will understand that the terminal pads may extend beyond 1 mm if desired.

For certain embodiments, the flex sensor circuit 51 is formed from one or more stainless steel base layers. For certain embodiments, the stainless steel base layer is formed to have a thickness of 18 microns. The stainless steel base layer includes a dielectric layer, such as a polyimide layer. In addition, the traces and the plurality of contact pads of the first pad, the second pad, the first terminal pad and the second terminal pad are formed by a conductor layer disposed on the dielectric layer. For some embodiments, the conductor layer is a copper layer, however, other conductive materials may be used. For some embodiments, the flex sensor circuit includes a second dielectric layer disposed on the conductor layer. For certain embodiments, the conductor layer is formed to have a thickness of one of 12 microns or 24 microns. However, other embodiments include conductor layers having other thicknesses. For some embodiments, the second dielectric layer is a polyimide layer. For certain embodiments, the second dielectric layer is formed to have a thickness of one of 5 microns to 7 microns. However, other embodiments include a second dielectric layer having other thicknesses. According to an embodiment, the flex sensor circuit is configured to have a thickness of less than or equal to 0.05 millimeters and include electrical traces with a width of less than or equal to 0.015 millimeters. The base layer of the flex sensor circuit includes a base layer configured to form and maintain the shape of the flex sensor circuit.

148 illustrates a bottom view of a module including a flex sensor circuit, according to an embodiment. Module 52 includes a flex sensor circuit 53 configured in accordance with the embodiments set forth herein. For certain embodiments, the flex sensor circuit 53 is configured to have a pitch and roll stiffness of less than or equal to 38 mN-mm/degree. For certain embodiments, the flex sensor circuit 53 is configured to have a pitch stiffness less than or equal to 38 mN-mm/degree and a roll stiffness less than or equal to 24 mN-mm/degree.

149 illustrates a side view and a bottom view of a module including a flex sensor circuit, according to an embodiment. Module 54 includes a flex sensor circuit 55 configured in accordance with the embodiments set forth herein. The first set of traces 56 and the second set of traces 58 are configured to be disposed on the outside of the first pad 57 and the second pad 59, respectively. 150 illustrates a side view and a bottom view of a module including a flex sensor circuit, according to an embodiment. Module 61 includes a flex sensor circuit 64 configured in accordance with the embodiments set forth herein. The first set of traces 63 and the second set of traces 66 are configured to be disposed on the outside of the first pad 62 and the second pad 65 . For certain embodiments, the first set of traces 63 and the second set of traces 66 each include at least one bend, such as a first bend 68 and a second bend 69 . For some embodiments, the curved portion is equal to or greater than six degrees from the surface of the die set. However, the bend can have any other value. The first bend 68 and the second bend 69 are configured to minimize any contact with the module and or any other component of the belt buckle module tilt OIS, such as a base cap, during movement.

It will be understood that terms such as "top," "bottom," "above," "below," and the x-, y-, and z-directions are used herein to denote the spatial relationship of components relative to each other and not any particular space or gravity A convenient term for orientation. Accordingly, these terms are intended to encompass an assembly of component parts, whether oriented in the particular orientation shown in the drawings and set forth in the specification, reversed from that orientation, or any other variation of rotation.

It will be appreciated that the term "invention" as used herein should not be construed to mean presenting only a single invention having a single basic element or group of elements. Similarly, it will also be understood that the term "invention" encompasses several separate innovations that may each be considered separate inventions. Although the present invention has been described in detail with respect to the preferred embodiments and drawings thereof, it will be apparent to those skilled in the art that various changes and modifications to the embodiments of the present invention can be made without departing from the spirit and scope of the present invention . Additionally, the techniques described herein can be used to fabricate a device having two, three, four, five, six, or more generally n numbers of bimorph actuators and buckle actuators . Therefore, it will be understood that the detailed description and accompanying drawings as set forth above are not intended to limit the breadth of the invention, which should be inferred only from the scope of the appended claims and their properly interpreted legal equivalents .

1: Bimorph arm/buckle module tilt optical image stabilization assembly 2: Beam part/Shell 3: Flexible Printed Circuits 4: Top return spring 5: Top AF bracket 6: Top buckle assembly 7: Buckle Actuator 8: Bearing 9: Shape memory alloy wire 10: Load point extension 11: Bottom buckle assembly 12: Buckle Actuator 13: Bearings 14: Shape memory alloy wire 15: Magnets 16: Bottom AF bracket 17: Bottom spring 18: Sensor circuit 19: Base cap 20: Shape memory alloy optical image stabilizer 21: Auto focus and image sensor module 22: Mobile board 23: Belt Buckle Module Tilt Optical Image Stabilizer 24: Static Plate/Top Buckle Assembly 25: Bottom buckle assembly 26: Spring Arm/Module Circuit PCB 27: Gaoli 28: Attachment part of shape memory alloy material 28a: First shape memory alloy material attachment portion 28b: Second shape memory alloy material attachment portion 30: Attachment part of shape memory alloy material/buckle module tilting optical image stabilization device 30a: First shape memory alloy material attachment portion 30b: Second shape memory alloy material attachment portion 31: Top spring 32: Bottom spring 32a: first shape memory alloy wire 32b: Second shape memory alloy wire 32c: Third shape memory alloy wire 32d: Fourth shape memory alloy wire 33: Top spring 34a: spring arm 34b: spring arm 34c: Spring Arm 34d: Spring Arm 35: Bottom spring 37: Flex sensor circuit 38: Mods 39: The first set of traces 40: Shape memory alloy material attachment part/second set of traces 41: Shape memory alloy wire 41a,b: SMA wire 42: Shape memory alloy attachment part/terminal pad part 43: Resistance welded shape memory alloy wire/shell 43a,b: Resistance welded SMA wire 44: The first terminal pad 45: Shape Memory Alloy Actuator/Second Terminal Pad 46: Buckle Actuator/First Pad/First Terminal Pad 46a,b: Buckle Actuators 47: Buckle Arm/Second Pad/Second Terminal Pad 47a-d: Buckle Arm 48: Shape memory alloy wire/base cap 48a,b:SMA wire 49: Resistance welding wire crimp/terminal cover part 49a,b: Resistance welding wire crimp 50: Island / Stainless Steel Island / Buckle Module Tilt Optical Image Stabilizer 51: Metal/stainless steel base layer/flex sensor circuit 52: Dielectric Layer/Module 53: Conductor layer/flex sensor circuit 54: Mods 55: Flex sensor circuit 56: The first set of traces 57: First Pad 58: The second set of traces 59: Second Pad 60: Buckle Actuator / Buckle Actuator 61: Liquid lens assembly/module 62: Pedestal/First Pad 63: The first set of traces 64: Forming Ring Coupler / Forming Ring / Coupler / Flex Sensor Circuit 65: Sliding Base/Second Pad 66: The second set of traces 68: First bend 69: Second bend 70: Unfixed load point end 71: Flat Surface 72: Shape memory alloy wire 73: Resistance welding part 76: Unfixed load point end 77: Flat Surface 78: Shape memory alloy wire 79: Adhesive 80: Unfixed load point end 81: Flat Surface 82: Shape memory alloy wire 83: Resistance welding part 84: Intermetallic layer 88: Unfixed load point end 89: Flat Surface 90: Shape memory alloy wire 91: Adhesive 92: Intermetallic layer 95: Fixed end 96: Flat Surface 97: Shape memory alloy wire 98: Resistance welding part 100: Shape memory alloy wire 101: Pedestal 102: Buckle Actuator 104: Center Section 106: Crimp structure 108: Arrow 120: Fixed end 121: Flat Surface 122: Shape memory alloy wire 123: Adhesive 126: Fixed end 127: Flat Surface 128: Shape memory alloy wire 129: Resistance welding department 130: Intermetallic layer 135: Fixed end 136: Flat Surface 137: Shape memory alloy wire 138: Intermetallic layer 139: Adhesive 143: Bimorph Arm/Fixed End 144: Island 145: External Part 146: Insulator 202: Bimorph actuators 204: Pedestal 206: Shape memory alloy ribbon 208: z stroke direction 302: Shape Memory Alloy Actuator / Buckle Actuator 304: Optical Image Stabilizer 306: Lens Holder 308: return spring 310: Vertical sliding bearing 312: Guide cover 502: Sensor 504: z direction 506: Buckle Actuator 508: Shape memory alloy wire 602: Shape Memory Alloy Actuator 604: Lens Holder 606: Wire Holder 608: Shape memory alloy wire/smart memory alloy wire 610: Buckle Arm 612: Spring Arm 702: Sliding base 704: ASSEMBLY BASE/ACTUATOR BASE 706: Plain bearings 708: Vertical sliding surface 710: Buckle Actuator 802: Buckle Actuator 804: Buckle Arm 806: Hammock Section 902: Bimorph Actuator 904: Lens Holder/Bracket 906: End 908: Pedestal 1002: Autofocus assembly 1004: Position Sensor 1005: z direction 1006: Moving Spring 1008: Magnet 1010: Lens Holder 1102a-c: Bimorph Actuators 1104a,b: Beam 1106b: Shape Memory Alloy Ribbon 1108b: Adhesive Film Materials 1110a-c: Contacts 1112b: Insulator 1202: Shape memory alloy materials 1203a,b: End pads 1204: Central Feeder 1206: Beam 1208: Center Metal 1210: Insulator 1212: Opening/Through Hole 1214: Contact Layer 1214a: Power Section 1214b: Ground Section 1216: Power Supply Contacts 1218: Ground Contact 1220: Topcoat 1222: Clearance 1224: Through hole section 1302: Buckle Actuator/First Buckle Actuator/Shape Memory Alloy Actuator 1304: Buckle Actuator/Second Buckle Actuator/Shape Memory Alloy Actuator 1306: Lens Holder 1310a,b: Buckle Arm 1312a,b: Buckle Arm 1314: Sliding base 1316: Sliding base 1318a,b:SMA wire 1902: Buckle Actuator / Shape Memory Alloy Actuator / First Buckle Actuator 1904: Buckle Actuator/Shape Memory Alloy Actuator/Second Buckle Actuator 1906: Lens Holder 1908a,b: Hammock Section 1910a,b, 1912a,b: Buckle Arm 1914: Sliding base 1916: Sliding base 1918: Pedestal Section 1920: Cover part 2202: Buckle Actuator/First Buckle Actuator 2204: Buckle Actuator/Second Buckle Actuator 2206: Lens Holder 2218a: Left shape memory alloy wire/shape memory alloy wire 2218b: Right shape memory alloy wire/shape memory alloy wire 2302: First Buckle Actuator / Buckle Actuator 2304: Second Buckle Actuator / Buckle Actuator 2305: Coupler Ring 2306: Lens Holder 2308a,b: Hammock section 2401: Sliding base 2402: Buckle Actuator / Buckle Actuator 2403: Return spring 2404a-d: Buckle Arm 2405: Lens Holder 2406, 2406a,b: Laminated hammocks 2408a,b:SMA wire 2409: Shell 2412a-d: Laminated Crimp Connectors 2413: Crimp 2414: select adapter board 2415: Signal traces 2501: Shape Memory Alloy Systems 3000: Reinforcement 3001a,b: Sliding base 3002: Buckle Actuator / Buckle Actuator 3003: Return spring 3004a-d: Buckle Arm 3006: Lens Holder 3008a,b:SMA wire 3009a,b: Shell 3012a-d: Resistance Weld Wire Crimp Fittings 3014: select adapter board 3020: Flexible Circuits 3022a,b: Electroplating pads 3101: Shape Memory Alloy Systems 3501: Shape Memory Alloy Bimorph Liquid Lens 3502: Liquid Lens Subassembly 3504: Shell 3506: Circuits with Shape Memory Alloy Actuators 3508: Bimorph Actuator 3510: Forming Ring 3512: Flexible Film/Film 3514: Liquid 3516: Liquid Containment Ring 3518: Lens 3520: Contacts 3902: Shape Memory Alloy Actuators 3904: Positive z-stroke actuators/actuators 3906: Negative z-stroke actuator/actuator 3908: Shape Memory Alloy Wire 3910: Lens Holder 3912: Top Spring 3914: Top Spacer 3916: Bottom Spacer 3918: Bottom Spring 3920: Pedestal 4102:Length 4103: Bimorph Actuator 4104: Bond pads 4106: SMA wire 4108: Extended Length 4202: Shape Memory Alloy Bimorph Actuator 4302: Negative Actuator Signal Connector 4304: Pedestal 4306a,b: Bimorph actuators 4308: Wire bond pads 4310: Adhesive Layer 4312b: SMA wire 4314: Positive Actuator Signal Connector 4316: Wire bond pads 4318: Adhesive Layer 4322: Connection pad 4602: Flex Sensor Circuit 4604: Bimorph Actuator Circuit 4606: Bimorph Actuator 4606a-h: Bimorph Actuator 4608: Mobile Bracket 4610: Outer shell 4802: Shape Memory Alloy Actuators 4804: Outer shell 5002: Shape Memory Alloy Actuators 5004:4 Side Mounted Shape Memory Alloy Bimorph Actuator 5202: Bimorph Actuator 5402: Bottom Mount Bimorph Actuator 5502: Top and Bottom Mounted Shape Memory Alloy Bimorph Actuators 5802: Shape Memory Alloy Actuator / Cassette Bimorph Actuator 5806a-d: Bimorph Actuator 6202: Shape Memory Alloy Actuator / Cassette Bimorph Actuator 6204: Bimorph Actuator 6204a-h: Bimorph Actuator 6504: Outer shell 6506: Lens Holder 6602: Shape Memory Alloy Actuator 6604: Bimorph Actuator/Lens Holder 6604a-h: Bimorph Actuator 6802: Shape Memory Alloy Actuator / Cassette Bimorph Actuator 6804: Sensor Bracket 6806: Bimorph Actuator 6806a-d: Bimorph Actuator 7402: Shape Memory Alloy Actuator / Cassette Bimorph Actuator 7404: Bimorph Actuator 7404a-h: Bimorph Actuator 7902: Shape Memory Alloy Actuator 7904: Bimorph Actuator 7904a-d: Bimorph Actuator 8402: Shape Memory Alloy Actuators 8404: Bimorph Actuator 8901: Lens System 8902: Folding Lens 8903a: Lens 8903b: Lens/Liquid Lens 8903c: Lens 8903d: Lens/Liquid Lens 8904: Spindle 8906: Transmission shaft 9001: Lens System 9002a: Liquid Lens 9002b: Liquid Lens 9002c: Liquid Lens 9002d: Liquid Lens 9002e: Liquid Lens 9002f: Liquid Lens 9002g: Liquid Lens 9002h: Liquid Lens 9004: Image Sensor 9100: Actuated Folding Lens 9102: Jihan 9104: Actuator 9106: Bimorph Actuator 9201: Bimorph Arm 9202: Bimorph Beam 9203: Forming Offset 9204: Offset depth/bend plane z offset 9206: Offset length/slot width 9208:Length 9210: Shape memory alloy ribbon/shape memory alloy wire 9212: Fixed end 9214: Load point terminal 9301: Bimorph Arm 9302: Bimorph Beam 9303: Forming Offset/Offset 9304: Limiter 9306: Unfixed point-of-load end 9308: Shape memory alloy ribbon/shape memory alloy wire 9401: Bimorph Arm 9402: Bimorph Beam 9403: Forming Offset 9404: Limiter 9406: Pedestal 9408: Recess 9410: Parts 9501: Bimorph Arm 9502: Bimorph Beam 9504: Forming Offset 9506: Shape memory alloy ribbon/shape memory alloy wire 9601a: Bimorph Arm 9601b: Bimorph Arm 9602a: Bimorph Beam 9602b: Bimorph Beam 9604a: Forming Offset 9604b: Forming Offset 9606a: Shape memory alloy ribbon/shape memory alloy wire 9606b: Shape memory alloy ribbon/shape memory alloy wire 9608: Pedestal 9610:Width 9612:Length 9614: height 9701: Buckle Arm 9702: Beam Sections/Flat (Unactuated) Beam Sections 9704a: Point of Load Extensions 9704b: Point of Load Extension 9706a: end 9706b: end 9710a: Point of Load 9710b: point of load 9712: Shape memory alloy ribbon/shape memory alloy wire 9801: Buckle Arm 9802: Beam section 9804: Load point 9810: Point of Load Extension 9901: Bimorph Arm 9902: Beam section 9904a: Point of Load Extension 9904b: Point of Load Extension 9906: Shape memory alloy ribbon/shape memory alloy wire 9910a: end 9910b: end 11800: Belt Buckle Module Tilt Optical Image Stabilization Assembly 11801: Partially assembled buckle module tilting optical image stabilization assembly 11810: Downforce/Trim 11813: Buckle Arm 11820: Top buckle assembly 11830: Upward force/roll 11833: Buckle Arm 11840: Sensor bracket 11860: Sensor circuit printed circuit board 11880: Modular circuit printed circuit board 11900: Bottom buckle assembly 11908: Flex sensor circuit 11909: Flex sensor circuit 11910: Tilt sub-assembly buckle frame 11920: Top spring 11930: Stainless Steel Buckle Frame 11940: Top autofocus bracket 11950: Sliding bearings 11960: Flex sensor circuit 11970: Shape memory alloy wire 11980: Roll tilt sub-assembly 11990: Stainless Steel Sliding Base 12000: Bottom spring 12010: Tilt sub-assembly buckle frame 12020: Bottom AF bracket 12030: Stainless Steel Buckle Frame 12040: Trim tilt sub-assembly 12070: Shape memory alloy wire 12120: Sensor circuit connector 12122: Solder Welding Parts 12124: Solder Welding Fittings 12500: Belt Buckle Module Tilt Optical Image Stabilization Assembly 12501: Flexible Section 12502: Flexible area 12880: Fixed Modular Circuit Printed Circuit Board 13200: Belt Buckle Module Tilt Optical Image Stabilization Assembly 13213: Buckle Arm 13220: Top buckle assembly 13230: Bottom buckle assembly 13233: Buckle Arm 13300: Belt Buckle Module Tilt Optical Image Stabilization Assembly 13301: Long Flex Circuits 13360: Sensor circuit printed circuit board 13600: Shape Memory Alloy Module Tilt Optical Image Stabilization Assembly / Buckle Module Tilt Optical Image Stabilization Assembly θ: angle

Embodiments of the invention are illustrated by way of example and not limitation in the figures of the accompanying drawings, wherein like reference numerals indicate similar elements, and wherein:

1 a illustrates a lens assembly including an SMA actuator configured as a buckle actuator, according to one embodiment;

Figure lb illustrates an SMA actuator according to an embodiment;

Figure 2 illustrates an SMA actuator according to an embodiment;

3 illustrates an exploded view of an autofocus assembly including an SMA wire actuator, according to one embodiment;

4 illustrates an autofocus assembly including an SMA actuator according to one embodiment;

5 illustrates an SMA actuator including a sensor according to an embodiment;

6 illustrates a top view and a side view of an SMA actuator configured as a buckle actuator equipped with a lens carrier, according to an embodiment;

7 illustrates a side view of a segment of an SMA actuator according to an embodiment;

8 illustrates various views of one embodiment of a buckle actuator;

9 illustrates a bimorph actuator with a lens carrier according to an embodiment;

10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator, according to an embodiment;

11a -11c illustrate views of bimorph actuators according to certain embodiments;

12 illustrates a view of an embodiment of a bimorph actuator according to an embodiment;

13 illustrates an end pad cross-section of a bimorph actuator according to an embodiment;

14 illustrates a center supply pad cross-section of a bimorph actuator according to an embodiment;

15 illustrates an exploded view of an SMA actuator including one of two buckle actuators, according to an embodiment;

16 illustrates an SMA actuator including two buckle actuators, according to an embodiment;

17 illustrates a side view of an SMA actuator including one of two buckle actuators, according to an embodiment;

18 illustrates a side view of an SMA actuator including one of two buckle actuators, according to an embodiment;

19 illustrates an exploded view of an assembly including an SMA actuator including two buckle actuators, according to an embodiment;

20 illustrates an SMA actuator including two buckle actuators, according to an embodiment;

21 illustrates an SMA actuator including two buckle actuators, according to an embodiment;

22 illustrates an SMA actuator including two buckle actuators, according to an embodiment;

23 illustrates an SMA actuator including two buckle actuators and a coupler, according to an embodiment;

24 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminated hammock, according to an embodiment;

25 illustrates an SMA system including an SMA actuator including a buckle actuator 2402 with a laminated hammock, according to one embodiment;

26 illustrates a buckle actuator including a laminated hammock according to an embodiment;

27 illustrates a laminated hammock of an SMA actuator according to an embodiment;

Figure 28 illustrates a lamination crimp connection of an SMA actuator according to an embodiment;

29 illustrates an SMA actuator including a buckle actuator with a laminated hammock;

30 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator, according to an embodiment;

31 illustrates an SMA system including an SMA actuator including a buckle actuator according to an embodiment;

Figure 32 illustrates an SMA actuator including a buckle actuator according to one embodiment;

33 illustrates a two-yoke capture joint of a pair of buckle arms of an SMA actuator according to an embodiment;

34 illustrates a resistance welding crimp for an SMA actuator for attaching an SMA wire to a buckle actuator according to an embodiment;

35 illustrates an SMA actuator including a buckle actuator with a two yoke capture joint;

36 illustrates an SMA bimorph liquid lens according to an embodiment;

37 illustrates a see-through SMA bimorph liquid lens according to an embodiment;

38 illustrates a cross-sectional view and a bottom view of an SMA bimorph liquid lens according to an embodiment;

39 illustrates an SMA system including an SMA actuator with a bimorph actuator, according to an embodiment;

40 illustrates an SMA actuator with a bimorph actuator according to an embodiment;

41 illustrates the length of a bimorph actuator and the location of a bond pad such that an SMA wire extends the wire length beyond the bimorph actuator;

42 illustrates an exploded view of an SMA system including a bimorph actuator according to an embodiment;

43 illustrates an exploded view of a subsection of an SMA actuator according to an embodiment;

44 illustrates a subsection of an SMA actuator according to an embodiment;

45 illustrates a 5-axis sensor displacement system according to an embodiment;

46 illustrates an exploded view of a 5-axis sensor displacement system according to an embodiment;

47 illustrates an SMA actuator including a bimorph actuator integrated into this circuit for all motion, according to one embodiment;

48 illustrates an SMA actuator including a bimorph actuator integrated into this circuit for all motion, according to one embodiment;

49 illustrates a cross-section of a 5-axis sensor displacement system according to an embodiment;

FIG. 50 illustrates an SMA actuator including a bimorph actuator according to an embodiment;

51 illustrates a top view of an SMA actuator including bimorph actuators that move an image sensor in different x and y positions, according to an embodiment;

52 illustrates an SMA actuator including a bimorph actuator configured as a cassette bimorph autofocus device, according to one embodiment;

53 illustrates an SMA actuator including a bimorph actuator according to an embodiment;

54 illustrates an SMA actuator including a bimorph actuator according to an embodiment;

55 illustrates an SMA actuator including a bimorph actuator according to an embodiment;

56 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

57 illustrates an exploded view of an SMA system including an SMA actuator including a bimorph actuator configured as a two-axis lens shift OIS, according to an embodiment;

58 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a two-axis lens shift OIS, according to one embodiment;

Figure 59 illustrates a cassette bimorph actuator according to an embodiment;

60 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

61 illustrates an exploded view of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

62 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

63 illustrates a cassette bimorph actuator according to an embodiment;

64 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

65 illustrates an exploded view of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

66 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

67 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

68 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

69 illustrates an exploded view of an SMA including an SMA actuator including a bimorph actuator, according to an embodiment;

70 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a triaxial sensor displacement OIS, according to one embodiment;

Figure 71 illustrates a cassette bimorph actuator assembly according to an embodiment;

72 illustrates a flex sensor circuit for use in an SMA system, according to an embodiment;

73 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

74 illustrates an exploded view of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

75 illustrates a cross-section of an SMA system including an SMA actuator, according to an embodiment;

Figure 76 illustrates a cassette bimorph actuator according to an embodiment;

77 illustrates a flex sensor circuit for use in an SMA system, according to an embodiment;

78 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

79 illustrates an exploded view of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

80 illustrates a cross-section of an SMA system including an SMA actuator, according to an embodiment;

Figure 81 illustrates a cassette bimorph actuator according to an embodiment;

82 illustrates a flex sensor circuit for use in an SMA system, according to an embodiment;

83 illustrates an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

84 illustrates an exploded view of an SMA system including an SMA actuator, according to an embodiment;

85 illustrates a cross-section of an SMA system including an SMA actuator including a bimorph actuator, according to an embodiment;

86 illustrates a cassette bimorph actuator for use in an SMA system, according to an embodiment;

87 illustrates a flex sensor circuit for use in an SMA system, according to an embodiment;

88 illustrates exemplary dimensions of a bimorph actuator for an SMA actuator according to an embodiment;

89 illustrates a lens system for a folded camera, according to an embodiment;

90 illustrates several embodiments of a lens system including a liquid lens, according to an embodiment;

Figure 91 illustrates a folded lens mounted on an actuator according to an embodiment;

92 illustrates a bimorph arm with an offset, according to an embodiment;

93 illustrates a bimorph arm with an offset and a limiter, according to an embodiment;

94 illustrates a bimorph arm with an offset and a limiter, according to an embodiment;

95 illustrates an embodiment including a pedestal having a bimorph arm with an offset, according to an embodiment;

96 illustrates an embodiment of a pedestal including two bimorph arms with an offset, according to an embodiment;

97 illustrates a buckle arm including a point-of-load extension according to one embodiment;

98 illustrates a buckle arm 9801 including a point-of-load extension 9810, according to one embodiment;

99 illustrates a bimorph arm including a point-of-load extension according to an embodiment;

FIG. 100 illustrates a bimorph arm including point-of-load extensions, according to an embodiment;

Figure 101 illustrates an SMA optical image stabilizer according to an embodiment;

Figure 102 illustrates an SMA material attachment portion 40 of a moving portion according to an embodiment;

103 illustrates an SMA attachment portion of a static plate with resistance welded SMA wire attached thereto, according to an embodiment;

104 illustrates an SMA actuator 45 including a buckle actuator according to one embodiment;

Figures 105a -105b illustrate a resistance welded crimp including an island for an SMA actuator, according to one embodiment;

106 illustrates the relationship between bending plane z-offset, slot width, and peak force of a bimorph beam according to an embodiment;

107 illustrates an example of how a box volume that approximates one of a box encompassing the entire bimorph actuator is related to work per bimorph assembly, according to an embodiment;

108 illustrates actuating a liquid lens using a buckle actuator according to an embodiment;

Figure 109 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment;

Figure 110 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment;

Figure 111 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment;

Figure 112 illustrates an unfixed point-of-load end of a bimorph arm according to an embodiment;

113 illustrates a fixed end of a bimorph arm according to an embodiment;

114 illustrates a fixed end of a bimorph arm according to an embodiment;

115 illustrates a fixed end of a bimorph arm according to an embodiment;

116 illustrates a fixed end of a bimorph arm according to an embodiment;

117 illustrates a rear view of a fixed end of a bimorph arm according to an embodiment;

118 illustrates an exploded view of a buckle module tilt OIS assembly according to an embodiment;

Figure 119 illustrates an assembled view of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 120 illustrates the force applied to the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 121 illustrates a tilt result of a force applied to the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 122 illustrates an exploded view of a top buckle assembly of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 123 illustrates an exploded view of a bottom buckle assembly of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 124A illustrates an exploded view of a partially assembled buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 124B illustrates an assembled view of the partially assembled buckle module tilt OIS assembly of Figure 124A , according to one embodiment;

Figure 125 illustrates a front view of the partially assembled buckle module tilt OIS assembly of Figure 124A , according to one embodiment;

Figure 126 illustrates the assembly process of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 127 illustrates the assembly process of the buckle module tilt OIS assembly of Figure 118 according to one embodiment;

Figure 128 illustrates a flex sensor circuit of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 129 illustrates a flex sensor circuit of the buckle module tilt OIS assembly of Figure 118 , according to one embodiment;

Figure 130 illustrates a flex sensor circuit of the buckle module tilt OIS assembly of Figure 118 according to an alternative embodiment;

Figure 131 illustrates a flex sensor circuit of the buckle module tilt OIS assembly of Figure 118 according to an alternative embodiment;

132 illustrates an assembled view of a buckle module tilt OIS assembly according to an alternate embodiment;

133 illustrates an assembled view of a buckle module tilt OIS assembly according to an alternate embodiment;

Figure 134 illustrates a bottom surface of an assembled view of the buckle module tilt OIS assembly of Figure 133 according to an alternative embodiment;

135 illustrates a footprint of a dimension of an AF assembly according to an embodiment;

136 illustrates an SMA module tilt OIS assembly according to an embodiment;

Figure 137 illustrates the SMA module tilt OIS assembly of Figure 136 under directional deformation, according to one embodiment;

Figure 138 illustrates a flex sensor circuit of the buckle module tilt OIS assembly of Figure 136 according to one embodiment;

139 illustrates a buckle module tilt OIS assembly 1 comprising a single housing, according to one embodiment;

140 illustrates an exploded view of a buckle module tilt OIS assembly including a single housing, according to an embodiment;

141 illustrates a buckle module tilt OIS according to an embodiment;

142 illustrates the internal components of a buckle module tilt OIS, such as the internal components set forth herein, according to an embodiment;

Figure 143 illustrates a top spring according to an embodiment;

Figure 144 illustrates a bottom spring according to an embodiment;

145 illustrates a flex sensor circuit coupled to a module of a belt buckle module tilt OIS assembly, according to one embodiment;

Figure 146 illustrates a flex sensor circuit including a base cap according to the embodiment illustrated in Figure 145;

147 illustrates a buckle module tilt OIS assembly without a housing and base cap, according to an embodiment;

148 illustrates a bottom view of a module including a flex sensor circuit according to an embodiment;

149 illustrates a side view and a bottom view of a module including a flex sensor circuit, according to an embodiment; and

150 illustrates a side view and a bottom view of a module including a flex sensor circuit, according to an embodiment.

11800: Belt Buckle Module Tilt Optical Image Stabilization Assembly

11820: Top buckle assembly

11840: Sensor bracket

11860: Sensor circuit printed circuit board

11880: Modular circuit printed circuit board

11900: Bottom buckle assembly

Claims (30)

A belt buckle module tilting optical image stabilization device (OIS) assembly, comprising: a top buckle assembly configured to provide tilt axis motion for dynamic tilt tuning capability; and A bottom buckle assembly configured to provide a pitch axis movement for dynamic tilt tuning capability. The buckle module tilt OIS assembly of claim 1, wherein the top buckle assembly includes a two-wire buckle actuator. The buckle module tilt OIS assembly of claim 1, wherein the bottom buckle assembly includes a two-wire buckle actuator. The buckle module tilt OIS assembly of claim 1, wherein the buckle module tilt OIS assembly is operable to provide a two-axis camera module OIS tilt to move a moving mass up to ±5° large inclination angle. The belt buckle module tilt OIS assembly of claim 4, wherein the moving mass comprises an auto focus assembly, a sensor circuit PCB and a module circuit PCB. The buckle module tilt OIS assembly of claim 4, wherein the autofocus assembly is secured to the top buckle assembly via an adhesive. The buckle module tilt OIS assembly of claim 1, further comprising an autofocus AF assembly positioned between the top buckle assembly and the bottom buckle assembly, a sensor circuit PCB, and a Module circuit PCB. The buckle module tilt OIS assembly of claim 7, wherein the top buckle assembly is configured to receive the AF assembly and the sensor circuit PCB. The buckle module tilt OIS assembly of claim 1, wherein the buckle module tilt OIS assembly is configured to fit in a footprint of up to 14.5 mm in length by up to 14.5 mm in width. The buckle module tilt OIS assembly of claim 1, wherein the top buckle assembly includes one or more buckle arms, each buckle arm positioned to cause a tilt axis motion of the top buckle assembly . The buckle module tilt OIS assembly of claim 10, wherein the bottom buckle assembly includes one or more buckle arms, each buckle arm positioned to cause a pitch axis motion to the bottom buckle assembly . The buckle module tilt OIS assembly of claim 11, wherein the top buckle assembly and the bottom buckle assembly are operable to push away from each other to provide dynamic tilting of the buckle module tilt OIS assembly. The belt buckle module of claim 1 tilts the OIS assembly, wherein the thrust force of the top buckle assembly and the bottom buckle assembly is between 20 grams and 30 grams. The buckle module tilt OIS assembly of claim 1, wherein the top buckle assembly includes a shell having a top spring, a top AF bracket, a flex sensor circuit, and a side tilt subassembly body. The buckle module tilt OIS assembly of claim 14, wherein the roll tilt subassembly comprises a tilt subassembly buckle frame, a stainless steel (SST) buckle frame, more than one sliding bearing, at least one SMA line and an SST sliding base. The buckle module tilt OIS assembly of claim 1, wherein the bottom buckle assembly includes a housing having a bottom spring, a bottom AF bracket and a pitch tilt sub-assembly. The buckle module tilt OIS assembly of claim 16, wherein the pitch tilt subassembly comprises a tilt subassembly buckle frame, a stainless steel (SST) buckle frame, more than one sliding bearing, at least one SMA line and an SST sliding base. The buckle module tilt OIS assembly of claim 1, comprising a single housing and a base cap configured to mate with the single housing. The buckle module tilt OIS assembly of claim 18, which includes a flexible printed circuit configured to be disposed on the outer surface of the single housing. The buckle module tilt OIS assembly of claim 19, wherein the flexible printed circuit is configured to include one or more position sensors. The buckle module tilt OIS assembly of claim 19, comprising a module and a flex sensor circuit electrically coupled to the module. The buckle module tilt OIS assembly of claim 21, wherein the flex sensor circuit includes a first set of traces configured to extend from a first pad and a first set of traces configured to extend from a second pad One of the second set of traces. The buckle module tilt OIS assembly of claim 21, wherein the flex sensor circuit includes a first set of traces configured to be disposed on the outer sides of the first and second pads, respectively. The buckle module tilt OIS assembly of claim 21, wherein the flex sensor circuit includes a first set of traces configured to be disposed on the inner sides of the first and second pads, respectively. The buckle module tilt OIS assembly of claim 19, wherein the flex sensor circuit electrically includes one or more bends. A method of manufacturing a belt buckle module inclined OIS assembly, comprising: providing a top buckle assembly configured to provide tilt axis motion for dynamic tilt tuning capability; install an autofocus assembly to the top buckle assembly; Mount a sensor circuit PCB to the autofocus assembly at a side opposite the top buckle assembly; thereby facilitating the sensor circuit PCB and the autofocus assembly with a sensor bracket sensor circuit connections between; coupling a bottom buckle assembly to the modular circuit PCB opposite the autofocus assembly; and Attach the bottom buckle assembly to the top buckle assembly along the fixed perimeter. The method of claim 26, wherein the top buckle assembly includes a four-wire buckle actuator. The method of claim 26, wherein the bottom buckle assembly includes a four-wire buckle actuator. A belt buckle module inclined OIS assembly, comprising: a top buckle assembly configured to provide a pitch axis movement for dynamic tilt tuning capability; and A bottom buckle assembly configured to provide tilt axis motion for dynamic tilt tuning capability. A belt buckle module inclined OIS assembly, comprising: a four-wire buckle configured to provide roll axis motion for dynamic tilt tuning capability and a pitch axis motion for dynamic tilt tuning capability; and A flex sensor circuit.

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