TW202139274A - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TW202139274A TW202139274A TW110113096A TW110113096A TW202139274A TW 202139274 A TW202139274 A TW 202139274A TW 110113096 A TW110113096 A TW 110113096A TW 110113096 A TW110113096 A TW 110113096A TW 202139274 A TW202139274 A TW 202139274A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser beam
- output
- unit
- laser
- chuck table
- Prior art date
Links
- 230000000149 penetrating effect Effects 0.000 title abstract description 10
- 238000005259 measurement Methods 0.000 claims abstract description 47
- 230000008859 change Effects 0.000 claims abstract description 14
- 239000000470 constituent Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020072506A JP7450447B2 (ja) | 2020-04-14 | 2020-04-14 | レーザー加工装置 |
| JP2020-072506 | 2020-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202139274A true TW202139274A (zh) | 2021-10-16 |
Family
ID=78124298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110113096A TW202139274A (zh) | 2020-04-14 | 2021-04-12 | 雷射加工裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7450447B2 (ja) |
| KR (1) | KR20210127610A (ja) |
| CN (1) | CN113523588A (ja) |
| TW (1) | TW202139274A (ja) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119128A (ja) * | 1988-10-28 | 1990-05-07 | Nec Corp | レーザアニーリング装置 |
| JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
| JP2003320466A (ja) | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
| GB0328370D0 (en) * | 2003-12-05 | 2004-01-14 | Southampton Photonics Ltd | Apparatus for providing optical radiation |
| JP2006187798A (ja) | 2005-01-07 | 2006-07-20 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工方法 |
| JP4356817B2 (ja) | 2005-03-16 | 2009-11-04 | 住友重機械工業株式会社 | レーザ照射装置及びレーザ照射方法 |
| JP2009006369A (ja) | 2007-06-28 | 2009-01-15 | Sumitomo Heavy Ind Ltd | レーザ加工装置、及び、レーザ加工方法 |
| JP2009291818A (ja) | 2008-06-06 | 2009-12-17 | Disco Abrasive Syst Ltd | レーザ加工装置及びレーザ加工方法 |
| JP5570323B2 (ja) | 2010-07-02 | 2014-08-13 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP2015233064A (ja) * | 2014-06-09 | 2015-12-24 | 東京エレクトロン株式会社 | エッチング処理方法及びベベルエッチング装置 |
| JP6906837B2 (ja) * | 2017-02-13 | 2021-07-21 | 株式会社ディスコ | レーザー加工装置 |
| JP6998149B2 (ja) | 2017-08-08 | 2022-01-18 | 株式会社ディスコ | レーザー加工方法 |
| KR102144930B1 (ko) | 2018-03-09 | 2020-08-14 | (주)라메디텍 | 레이저 채혈기 |
| TWI778205B (zh) | 2018-03-13 | 2022-09-21 | 日商住友重機械工業股份有限公司 | 雷射功率控制裝置、雷射加工裝置及雷射功率控制方法 |
| JP2020046390A (ja) * | 2018-09-21 | 2020-03-26 | 株式会社アマダホールディングス | パワーモニタリング装置及びレーザ加工機 |
-
2020
- 2020-04-14 JP JP2020072506A patent/JP7450447B2/ja active Active
-
2021
- 2021-03-17 KR KR1020210034346A patent/KR20210127610A/ko active Pending
- 2021-04-12 CN CN202110387848.4A patent/CN113523588A/zh active Pending
- 2021-04-12 TW TW110113096A patent/TW202139274A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN113523588A (zh) | 2021-10-22 |
| KR20210127610A (ko) | 2021-10-22 |
| JP7450447B2 (ja) | 2024-03-15 |
| JP2021169107A (ja) | 2021-10-28 |
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