TW202032240A - Manufacturing method of a display panel - Google Patents

Abstract

A manufacturing method of a display panel includes the following steps. Providing an array substrate. Forming an active device layer on the array substrate. Forming a pixel defining layer on the active device layer, and the pixel defining layer has an opening. Forming a first electrode on the active device layer and overlaps with the opening. Forming a light emitting layer on the first electrode and in the opening. Forming a second electrode on the pixel defining layer and overlaps with the light-emitting layer. Forming a capping layer on the second electrode, and the capping layer has a first part overlapping with the pixel defining layer and a second part overlapping with the opening. Conducting an exposing process on the first part of the capping layer to modify the first part into a light shielding layer. Disposing a color filter substrate opposite to the array substrate. The light shielding layer overlaps with the pixel defining layer.

Description

Manufacturing method of display panel

The present invention relates to a manufacturing method of a display panel, and particularly relates to a display panel with a light-shielding layer formed on a pixel definition layer.

In recent years, compared with the current mainstream liquid crystal display panels, organic light-emitting diode (OLED) display panels have gradually attracted various technologies due to their high color saturation, fast response speed and high contrast performance. Dachang's investment vision.

Generally speaking, in order to prevent the wires in the display panel from reflecting light from the outside, a light shielding layer (Black Matrix, BM) is arranged on the color light substrate opposite to the array substrate to shield the wires and reduce the reflectivity. However, under the condition of a large viewing angle in an oblique direction, the light of the organic light emitting diode is easily shielded by the light shielding layer, resulting in a significant decrease in brightness. Therefore, the image observed by the user when obliquely looking will be darker than the image observed when looking at it directly, which reduces the image quality and reduces the user's visual experience.

The manufacturing method of the display panel of the present invention includes the following steps. Provide array substrate. An active device layer is formed on the array substrate. A pixel definition layer is formed on the active device layer, and the pixel definition layer has openings. A first electrode is formed on the active device layer and overlaps the opening. A light emitting layer is formed on the first electrode and located in the opening. A second electrode is formed on the pixel definition layer and overlaps the light-emitting layer. A covering layer is formed on the second electrode, and the covering layer has a first part overlapping the pixel definition layer and a second part overlapping the opening. An exposure process is performed on the first part of the cover layer to modify the first part into a light-shielding layer. And, setting the color light substrate opposite to the array substrate. The shading layer overlaps the pixel definition layer.

The manufacturing method of the display panel of the present invention includes the following steps. Provide array substrate. An active device layer is formed on the array substrate. A pixel definition layer is formed on the active device layer, and the pixel definition layer has openings. A light emitting layer is formed on the first electrode and located in the opening. A second electrode is formed on the pixel definition layer and overlaps the light-emitting layer. A covering layer is formed on the second electrode, and the covering layer has a first part overlapping the pixel definition layer and a second part overlapping the opening. A light shielding layer is formed on the first part of the covering layer. And, setting the color light substrate opposite to the array substrate. The shading layer overlaps the pixel definition layer.

Based on the foregoing, in the manufacturing method of the display panel of an embodiment of the present invention, since the light shielding layer of the display panel can be overlapped on the pixel definition layer on the array substrate correspondingly, it is possible to reduce the large angle of the light emitting layer emitted from the oblique direction The probability of light being absorbed. In this way, the brightness of the display panel under a large viewing angle can be improved. In addition, since the light emitting layer at a large angle can be increased, the light emitting angle of the light emitting layer can be increased to increase the aperture ratio of the display panel. In addition, since there is no need to provide a light shielding layer on one side of the color light substrate, the aperture ratio of the display panel can be further improved. Furthermore, the light shielding layer completely overlaps the pixel definition layer and directly covers the second electrode, so the light shielding layer can significantly reduce the reflectivity of the display panel. In addition, the light-shielding layer can also absorb light leakage from the light-emitting layer in the lateral direction, reducing the probability of light mixing and color mixing. In this way, the manufacturing method of the display panel can improve the display quality of the display panel. In addition, the cover layer and/or the light-transmitting layer provided on the light-emitting layer can also provide protection for the light-emitting layer.

One of the objectives of the present invention is to reduce the light shielded by the light shielding layer in the display panel.

One of the objectives of the present invention is to improve the brightness of the display panel at a large viewing angle.

One of the objectives of the present invention is to increase the aperture ratio of the display panel.

One of the objectives of the present invention is to reduce the reflectivity of the display panel.

One of the objectives of the present invention is to improve the display quality of the display panel.

One of the objectives of the present invention is to simplify the manufacturing method of the display panel.

One of the objectives of the present invention is to reduce the manufacturing cost of the display panel.

One of the objectives of the present invention is to provide protection for the light-emitting layer.

One of the objectives of the present invention is to reduce damage to the light-emitting layer during the manufacturing process.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

In the drawings, the thickness of each element and the like are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on”, or “connected to,” or “overlapped with, another element,” it may be directly on another element. On or connected to another element, or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connections.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or Or part should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the “first element,” “component,” “region,” “layer,” or “portion” discussed below may be referred to as a second element, component, region, layer or portion without departing from the teachings herein.

The terminology used here is only for the purpose of describing specific embodiments and is not limiting. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one." "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the related listed items. It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device other than those shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "beneath" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "about", "substantially", "substantially", or "approximately" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account all The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

The exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the diagram as a result of, for example, manufacturing technology and/or tolerance can be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shape of the area as shown herein, but include, for example, shape deviations caused by manufacturing. For example, areas shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shape of the regions, and are not intended to limit the scope of the claims.

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. Please refer to FIG. 1, in this embodiment, the display panel 10 includes an array substrate 100, an active device layer 110 is disposed on the array substrate 100, a pixel definition layer 120 is disposed on the active device layer 110, and a pixel definition layer 120 has an opening 122, a first electrode 130 is disposed on the active device layer 110 and overlaps the opening 122 in a direction perpendicular to the array substrate 100, the light emitting layer 140 is disposed on the first electrode 130 and is located in the opening 122, and the second electrode 150 The light-emitting layer 140 and the light shielding layer 162 are arranged on the pixel definition layer 120 and overlap the second electrode 150 and the pixel definition layer 120 and the color light substrate 200 are arranged opposite to the array substrate 100. The display panel 10 further includes an encapsulation layer 170 disposed on the light shielding layer 162 and an insulating layer 180 disposed on the encapsulation layer 170, and the encapsulation layer 170 is located between the light shielding layer 162 and the color light substrate 200. In this embodiment, the display panel 10 is, for example, applied to a flexible or non-flexible display panel. In the following, a flexible display panel is taken as an example to briefly describe the manufacturing method of the display panel 10.

2A to 2E are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention. Please refer to FIG. 2A. First, an array substrate 100 is provided. The array substrate 100 is, for example, a flexible substrate, the material of which can be selected from organic polymers, such as polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate Polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES) or polyarylate (polyarylate), or other suitable materials, or a combination of at least two of the foregoing . However, the present invention is not limited to this. In some embodiments, when the display panel does not need to have a flexible function, the material of the array substrate 100 may include glass, quartz, plastic, opaque/reflective material (for example: conductive material, metal, wafer, ceramic , Or other applicable materials) or other applicable materials.

Next, an active device layer 110 is formed on the array substrate 100. For example, the active device layer 110 may be a pixel array disposed on the array substrate 100 so that the array substrate 100 can be used as the pixel array substrate of the display panel 10. The active device layer 110 may have a single-layer or multi-layer structure, including multiple thin film transistors (not shown), multiple insulating layers (not shown), and multiple signal lines (not shown). For clarity of illustration and convenience of description, FIG. 2A schematically shows only one film layer. The thin film transistor is, for example, a low temperature poly-Si thin film transistor (LTPS) or an amorphous silicon thin film transistor (a-Si), but the present invention is not limited thereto. The thin film transistor includes a gate electrode, a semiconductor channel layer, and a source electrode and a drain electrode (not shown) electrically connected to the semiconductor channel layer. In this embodiment, the semiconductor channel layer includes amorphous silicon, polycrystalline silicon, microcrystalline silicon, single crystal silicon, organic semiconductor materials, oxide semiconductor materials (for example: indium zinc oxide, indium germanium zinc oxide, or other suitable (Or a combination of the above), or other suitable materials, or containing dopants in the above materials, or a combination of the above, but the present invention is not limited thereto. The gate electrode can be made of metal materials, but the present invention is not limited thereto. According to other embodiments, the gate electrode, the source electrode and the drain electrode can also be made of other suitable conductive materials. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials. The thin film transistor can be a top gate or a bottom gate, but the invention is not limited thereto. The signal line is, for example, a scan line, a data line, a common electrode line, a power line or other suitable lines, and the present invention is not limited thereto. Generally speaking, based on the consideration of conductivity, the signal line is made of metal materials, but other suitable conductive materials can also be used. For example: alloys, nitrides of metallic materials, oxides of metallic materials, oxynitrides of metallic materials, or stacked layers of metallic materials and other conductive materials.

Next, a pixel definition layer 120 is formed on the active device layer 110. The pixel definition layer 120 has an opening 122, and the opening 122 penetrates the pixel definition layer 120 to expose the active device layer 110. In this embodiment, the opening 122 can be used as a space for accommodating the organic light-emitting layer, which will be described later. The material of the pixel definition layer 120 may include photosensitive polyimide materials, acrylic-based materials, silicone materials, phenolic resin materials, oxides, nitrides or oxynitrides, but the invention is not limited thereto. It should be noted here that although FIG. 2A only shows one opening 122, those skilled in the art should know that the number of openings 122 is determined by the needs of the user. Therefore, the number of openings 122 may be one, two, three or more, and is not limited by the illustration. In addition, the plurality of openings 122 of the pixel definition layer 120 can also be aligned with each other to form a matrix, but the invention is not limited thereto.

Then, the first electrode 130 is formed on the active device layer 110. Wherein, in the direction perpendicular to the array substrate 100, the first electrode 130 overlaps the opening 122. In other words, the first electrode 130 is located in the placement space of the opening 122. In this embodiment, the first electrode 130 is electrically connected to the active device 110. The material of the first electrode 130 is a conductive material, such as aluminum (Al), silver (Ag), chromium (Cr), copper (Cu), nickel (Ni), titanium (Ti), molybdenum (Mo), magnesium (Mg) , Platinum (Pt), gold (Au) or a combination thereof. The first electrode 130 may have a single-layer, double-layer or multilayer structure. For example, in some embodiments, the first electrode 130 may be a three-layer structure composed of ITO/Ag/ITO, but the invention is not limited thereto. In other embodiments, the first electrode 130 may also be a three-layer structure composed of Ti/Al/Ti or Mo/Al/Mo. The formation method of the first electrode 130 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT), or a combination thereof. In some embodiments, the first electrode 130 can be used as an anode of the light-emitting layer 140, but the invention is not limited thereto.

Next, a light-emitting layer 140 is formed on the first electrode 130. The light emitting layer 140 is disposed in the placement space in the opening 122. The material of the light emitting layer 140 is, for example, an organic light emitting material. In other words, the light-emitting layer 140 is, for example, an organic light-emitting diode (OLED) light-emitting layer. In FIG. 2A, for convenience of description and clarity, the light-emitting layer 140 is only schematically shown in a one-layer structure. However, in some embodiments, the light-emitting layer 140 may have a multilayer structure, including a hole injection layer (HIL), a hole transfer layer (HTL), a light-emitting layer (emission layer, EL), and a hole injection layer (HIL). Electron transfer layer (ETL).

In some embodiments, the material of the hole injection layer is, for example, xylylene blue copper, star aromatic amines, polyaniline, polyethylene dioxythiophene, or other suitable materials. The material of the hole transport layer is, for example, triaromatic amines, cross-structured diamine diphenyl, diamine diphenyl derivatives or other suitable materials. The light-emitting layer 140 may be a red organic light-emitting layer, a green organic light-emitting layer, a blue organic light-emitting layer, or a light-emitting layer of different colors (such as white, orange, yellow, etc.) generated by mixing light of various spectrums. The material of the electron transport layer may be an oxazole derivative and its dendrimer, a metal chelate compound (for example, Alq3), an azole compound, a diazaanthracene derivative, a silicon-containing heterocyclic compound or other suitable materials.

Then, a second electrode 150 is formed on the pixel definition layer 120. In this embodiment, the second electrode 150 covers the entire surface of the pixel definition layer 120 and overlaps the opening 122 and the light-emitting layer 140. However, the present invention is not limited to this. In other embodiments, the display panel may also have a plurality of second electrodes formed through a patterning process. The second electrode 150 directly contacts the light emitting layer 140. The material of the second electrode 150 may be a transparent conductive material, such as metal oxides such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or indium germanium zinc oxide. In some embodiments, the method for forming the second electrode 150 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT) or Its combination. In some embodiments, the second electrode 150 may serve as a cathode of the light-emitting layer 140.

Next, a covering layer 160 is formed on the second electrode 150. The covering layer 160 covers the entire surface and overlaps the second electrode 150 and the pixel definition layer 120. In this embodiment, the cover layer 160 can also overlap the opening 122 and the light emitting layer 140. The cover layer 160 has a first portion 160A overlapping the pixel definition layer 120 and a second portion 160B overlapping the opening 122. The material of the covering layer 160 is, for example, a photosensitive color-changing material, including spiropyrans, spirooxazines, diarylethenes or azibenzenes or other suitable materials. The present invention does not Limit this.

Please refer to FIG. 2B and FIG. 2C. Then, an exposure process is performed on the first portion 160A of the cover layer 160. For example, the step of performing the exposure procedure includes firstly disposing a patterned mask PM on the cover layer 160. Then, the light beam L is passed through the patterned mask PM to expose the first portion 160A of the cover layer 160. The patterned mask PM does not allow the light beam L to pass through the portion corresponding to the second portion 160B of the cover layer 160, so the second portion 160B is not exposed to the light beam L. In this embodiment, the light beam L includes far-ultraviolet light, near-ultraviolet light, visible light beams, infrared light, and electron beams or other suitable light beams, and the present invention is not limited thereto.

It is worth noting that the cover layer 160 may be transparent and colorless before the exposure process. However, the first portion 160A of the cover layer 160 exposed by the light beam L is modified to form the light shielding layer 162. This is because the photosensitive color-changing material can form a conjugated system in its structure to absorb visible light when exposed to, for example, ultraviolet light. Therefore, the light-shielding layer 162 formed by the modified cover layer 160 produces colors, and the light transmittance of the light-shielding layer 162 is reduced. In addition, the second portion 160B of the cover layer 160 that has not been exposed to the light beam L will not be modified and maintain the original light transmission characteristics. In other words, the second portion 160B of the cover layer 160 may form the light-transmitting layer 164. Compared with the light-shielding layer 162, the light transmittance of the light-transmitting layer 164 is greater than that of the light-shielding layer 162.

In this embodiment, the light shielding layer 162 overlaps the pixel definition layer 120. The light-shielding layer 162 can be applied as a black matrix (BM). In addition to shielding the second electrode 150 and reducing the reflectivity of the display panel 10, it can also reduce light leakage from the light-emitting layer 140 in the lateral direction, and further reduce light mixing and color mixing. Probability to increase the display quality of the display panel 10. In addition, the light-transmitting layer 164 overlaps the light-emitting layer 140 in the opening 122. In this way, the light-transmitting layer 164 with high light transmittance will not affect the light emission of the light-emitting layer 140. In addition, the light-transmitting layer 164 can also provide protection for the light-emitting layer 140.

2D, the manufacturing method of the display panel 10 of this embodiment further includes forming an encapsulation layer 170 on the light-shielding layer 162 and the light-transmitting layer 164 to isolate moisture, impurities, etc. In some embodiments, the encapsulation layer 170 may be a single-layer or multi-layer structure, and the invention is not limited thereto. The material of the encapsulation layer 170 may include inorganic material or organic material. The inorganic material includes silicon nitride or alumina, but the invention is not limited to this. The organic material includes acrylic resin, epoxy resin or silicon oxycarbide, but the invention is not limited to this.

Next, an insulating layer 180 is formed on the packaging layer 170. The material of the insulating layer 180 includes a filler, such as a transparent plastic material. For example, the filling material may be polyalkyl acrylic resin or polyalkyl epoxy resin, but the invention is not limited thereto. In this embodiment, the insulating layer 180 can cover the array substrate 100 in a large area, reduce the risk of damage to the light-emitting layer 140, and maintain a better surface uniformity.

Please refer to FIG. 2E. Next, the color light substrate 200 is positioned opposite to the array substrate 100. In this embodiment, the color light substrate 200 is, for example, a cover plate, and its material can be selected from organic polymers, such as polyimide (PI), polyethylene naphthalate (PEN), and polymer Polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES) or polyarylate (polyarylate), or other suitable materials, or at least the foregoing A combination of two materials. However, the present invention is not limited to this. In some embodiments, when the display panel does not need to have a flexible function, the material of the color light substrate 200 may include glass, quartz, plastic, opaque/reflective materials (such as conductive materials, metals, wafers, Ceramics, or other applicable materials) or other applicable materials.

In this embodiment, a color filter layer 220 can be selectively provided on the color light substrate 200. In this way, the color light substrate 200 can be used as a color filter substrate of the display panel 10. In this embodiment, the color filter layer 220 includes a first color light pattern 222, a second color light pattern 224, and a third color light pattern 226. The first color light pattern 222, the second color light pattern 224, and the third color light pattern 226 may be any color light patterns used in OLED display panels that are well known to those skilled in the art. The colors of the first color light pattern 222, the second color light pattern 224, and the third color light pattern 226 may be red, green, or blue, but are not limited thereto. In addition, the colors of the first color light pattern 222, the second color light pattern 224, and the third color light pattern 226 may also be the same, partially the same, or completely different. In other words, the color of the first color light pattern 222 may be red, the color of the second color light pattern 224 may also be red, and the color of the third color light pattern 226 may be blue. Alternatively, the color of the first color light pattern 222 may be red, the color of the second color light pattern 224 may be green, and the color of the third color light pattern 226 may be red, or any other possible combination. The present invention does not This is limited.

In this embodiment, in the direction perpendicular to the array substrate 100, the second color light pattern 224 corresponds to the overlapping light emitting layer 140. In this way, the light emitted by the light-emitting layer 140 passes through the second color light pattern 224. For example, when the light emitting layer 140 includes a white organic light emitting material, the color of the second color light pattern 224 may be green. In other words, the white light emitted by the light-emitting layer 140 will be converted into green light after passing through the second color light pattern 224. For another example, when the light-emitting layer 140 includes a green organic light-emitting material, the color of the second color light pattern 224 may be green, that is, the color of the second color light pattern 224 is the same as the color of the light-emitting layer 140, so The green light emitted by the light-emitting layer 140 is still green light after passing through the second color light pattern 224.

As shown in FIG. 2E, when the color light substrate 200 is paired to the array substrate 100, the color filter layer 220 is located between the array substrate 100 and the color light substrate 200. In addition, the light shielding layer 162 is located between the pixel definition layer 120 and the encapsulation layer 170. The encapsulation layer 170 is located between the light shielding layer 162 and the color filter layer 220 on the color light substrate 200. The insulating layer 180 is located between the encapsulation layer 170 and the color filter layer 220.

It is worth noting that in the conventional design, the light emitted by the organic light emitting diode on the pixel array substrate at a large angle in the oblique direction will be shielded and absorbed by the light shielding layer provided on the side of the color light substrate. In this embodiment, since the light shielding layer 162 may be disposed in the display panel 10, it is located on one side of the array substrate 100. Therefore, it is possible to reduce the probability that the light emitted by the light emitting layer 140 at a large angle in an oblique direction is absorbed. In this way, the light shielded by the light shielding layer 162 in the display panel 10 can be reduced, and the brightness of the display panel 10 at a large viewing angle can be improved. Therefore, the display quality of the display panel 10 can be improved.

In some embodiments, the display panel 10 may further include a touch layer (not shown) disposed between the insulating layer 180 and the color filter layer 220 to provide the touch function of the display panel 10, but the present invention does not use this Is limited.

In short, since the light-shielding layer 162 of the display panel 10 of the present embodiment overlaps the pixel definition layer 120 on the array substrate 100 and is not located on the color light substrate 200, the oblique direction of the light-emitting layer 140 can be reduced. The probability that light emitted from a large angle will be absorbed. Thereby, the brightness of the display panel 10 under a large viewing angle can be improved. In addition, since the light emission angle of the light emitting layer 140 can be increased at a large angle, the light emission angle of the light emitting layer 140 can be increased to increase the aperture ratio of the display panel 10. In addition, the light shielding layer 162 does not need to be provided on one side of the color light substrate 200, so that the aperture ratio of the display panel 10 can be further improved. In addition, the light shielding layer 162 completely overlaps the pixel definition layer 120 and directly covers the second electrode 150, so the light shielding layer 162 can significantly reduce the reflectivity of the display panel 10. In addition, the light-shielding layer 162 can also absorb the light leakage of the light-emitting layer 140 in the lateral direction, reducing the probability of light mixing and color mixing. In this way, the manufacturing method of this embodiment can improve the display quality of the display panel 10. In addition, the cover layer 160 and/or the light-transmitting layer 164 disposed on the light-emitting layer 140 can also provide protection for the light-emitting layer 140.

The following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar components. For the omission of the same technical content, please refer to the aforementioned embodiments. The following embodiments will not Repeat it.

3A to 3D are schematic cross-sectional views of a manufacturing process of a display panel according to another embodiment of the invention. 2B and 3A, in the manufacturing method of the display panel 10A (shown in FIG. 3D) of this embodiment, from the step of providing the array substrate 100 to the step of forming the cover layer 160, they are all the same as the above-mentioned display panel 10 The production method is the same, so I won’t repeat it. In this embodiment, the cover layer 160 may be a photosensitive color-changing material or a transparent plastic material or other suitable materials, and the invention is not limited thereto.

Please refer to FIGS. 3A and 3B. Then, a light shielding layer 162A is formed on the first portion 160A of the cover layer 160. In this embodiment, the step of forming the light shielding layer 162A includes first performing an inkjet printing (IJP) process. For example, the method of the aforementioned inkjet printing process includes simply spraying the light shielding layer material 162' on the first portion 160A of the cover layer 160 through the printing nozzle PH. The material of the light-shielding layer 162' includes resins selected from acrylic, rubber, and silicone resins or any combination of the foregoing resins, and the present invention is not limited thereto. Next, a curing process (not shown) is performed to cure the light-shielding layer material 162' into the light-shielding layer 162. The above-mentioned curing method includes thermal curing or light curing, and the present invention is not limited thereto. Under the above arrangement, the light shielding layer 162A overlaps the pixel definition layer 120 in the direction perpendicular to the array substrate 100. In addition, the cover layer 160 is located between the light shielding layer 162A and the second electrode 150. In this way, the light-shielding layer 162A can be simply printed by inkjet and disposed on one side of the array substrate 100, which simplifies the manufacturing method of the display panel 10A and reduces the manufacturing cost of the display panel 10A. In addition, the light-shielding layer 162A of the display panel 10A can also achieve similar technical effects as the light-shielding layer 162 of the above-mentioned display panel 10.

Please refer to FIG. 3C. Next, an encapsulation layer 170 is formed on the light shielding layer 162A and an insulating layer 180 is formed on the encapsulation layer 170. The materials and forming methods of the encapsulation layer 170 and the insulating layer 180 of this embodiment are similar to the materials and the forming methods of the encapsulation layer 170 and the insulating layer 180 of the display panel 10 described above, so they will not be described again. In addition to covering the light-shielding layer 162A, the encapsulation layer 170 of this embodiment can also contact the area where the covering layer 160 overlaps the opening 122. In other words, the light shielding layer 162A can be encapsulated between the cover layer 160 and the encapsulation layer 170.

Please refer to FIG. 3D, and then, set the color light substrate 200 opposite to the array substrate 100. The color light substrate 200 of the display panel 10A of the present embodiment is similar to the color light substrate 200 of the above-mentioned display panel 10, so it will not be repeated. A color filter layer 220 is formed on the color light substrate 200. The color filter layer 220 includes a first color light pattern 222, a second color light pattern 224, and a third color light pattern 226. The encapsulation layer 170 is located between the cover layer 160 and the color filter layer 220 on the color light substrate 200. In this way, the display panel 10A can achieve similar technical effects to the above-mentioned embodiments.

4A to 4B are schematic cross-sectional views of the formation process of the light shielding layer according to still another embodiment of the present invention. Please refer to FIGS. 3A to 3B and FIGS. 4A to 4B. The light-shielding layer 162B of this embodiment is similar to the light-shielding layer 162A of FIG. 3B. The main difference is that the step of forming the light-shielding layer 162B includes first setting a patterned fine metal The fine metal mask (FMM) is on the cover layer 160. Then, through the vapor deposition process VD, the light-shielding layer material (not shown) is passed through the patterned fine metal mask FM to plate the light-shielding layer material on the first portion 160A of the cover layer 160. Then, the above-mentioned light-shielding layer material is cured to form the light-shielding layer 162B. In this embodiment, the light-shielding layer material includes a small molecule material with visible light waveband absorption, and its composition includes a composition selected from elements containing carbon, hydrogen, oxygen, nitrogen, and sulfur, or any combination of the foregoing elements, but the present invention Not limited to this. In this way, the light-shielding layer 162B can be simply disposed on the cover layer 160, and the technical effect similar to the above-mentioned embodiment can be obtained.

5A to 5E are schematic cross-sectional views of the formation process of the light shielding layer according to another embodiment of the present invention. Please refer to FIGS. 3A to 3B and FIGS. 5A to 5E. The light-shielding layer 162C of this embodiment is similar to the light-shielding layer 162A of FIG. 3B. The main difference is that the step of forming the light-shielding layer 162C includes the application of orthogonal light development technology photolithography) patterning method. The above-mentioned orthogonal light development technique includes forming a protective layer 310 on the cover layer 160 first. Then a photoresist layer 320 is formed on the protective layer 310. The photoresist layer 320 may define a first region 320A overlapping the first portion 160A of the cover layer 160. The photoresist layer 320 may also define a second region 320B overlapping the second portion 160B of the cover layer 160. In this embodiment, the protective layer 310 is, for example, a fluorinated photoresist (fluorinated photoresist). It is worth mentioning that the fluorinated photoresist material does not interact with organic materials. Therefore, the above-mentioned orthogonal light development technology will not affect the organic light-emitting material of the light-emitting layer 140, but can also provide protection for the light-emitting layer 140, or The damage to the light-emitting layer 140 is reduced during the manufacturing process. The photoresist layer 320 includes a positive photoresist and a negative photoresist, and its material includes phenolic resin, epoxy resin, polyisoprene rubber or other suitable materials, and the present invention is not limited thereto. The following embodiments are described by taking the photoresist layer 320 as a positive photoresist, but it is not limited thereto.

Next, a patterned mask PM is disposed on the photoresist layer 320. Then, an exposure process is performed, and the light beam L passes through the patterned mask PM to expose the photoresist layer 320 in the first region 320A. The light beam L includes far-ultraviolet light, near-ultraviolet light, visible light beams, infrared light, electron beams or other suitable light beams, and the present invention is not limited thereto. This embodiment uses ultraviolet light as an example, but is not limited to this.

Please refer to FIG. 5A and FIG. 5B, and then proceed to the development process (not shown). The development process includes using a solvent to remove the exposed photoresist layer 320 in the first region 320A to form a patterned photoresist layer 320'.

Please refer to FIG. 5B and FIG. 5C, and then proceed to the etching process. The above-mentioned etching process includes, using the patterned photoresist layer 320' as a mask, and patterning the protective layer 310 to form a patterned protective layer 310' having an accommodating space 312 overlapping the first region 320A. The above method of patterning the protective layer 310 includes etching the protective layer 310 using a fluoro solvent containing fluorine atoms. The above-mentioned fluorinated solvent has the characteristics of not interacting with polar or non-polar materials, and has the advantages of environmental friendliness and low toxicity. In this embodiment, in the direction perpendicular to the array substrate 100, the accommodating space 312 exposes the covering layer 160 and overlaps the first portion 160A of the covering layer 160 and the pixel definition layer 120.

Referring to FIG. 5D, next, a light shielding layer material 162C' is formed on the patterned photoresist layer 320'. The light shielding layer material 162C' is formed on the patterned photoresist layer 320' by, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), sputtering, or printing coating. In addition, since the accommodating space 312 exposes the covering layer 160, part of the light shielding layer material 162C' may also be formed in the accommodating space 312 and disposed on the covering layer 160. The light-shielding layer material 162C' formed in the accommodating space 312 overlaps the pixel definition layer 120. On the other hand, the light shielding layer material 162C' formed in the accommodating space 312 does not overlap the opening 122 and the light emitting layer 140.

Please refer to Figure 5D and Figure 5E, and then proceed to the peeling procedure. The above stripping procedure includes washing the patterned protective layer 310 ′ and the covering layer 160 with a fluorinated solvent in a nitrogen (N ₂ ) environment. Therefore, the patterned protective layer 310' can be dissolved in a fluorinated solvent and removed. In this way, the patterned photoresist layer 320' and the light shielding layer material 162C' formed on the patterned protective layer 310' can be removed at the same time.

Finally, the light-shielding layer material 162C' is cured to form the light-shielding layer 162C. In this embodiment, in the direction perpendicular to the array substrate 100, the light shielding layer 162C overlaps the pixel definition layer 120 to shield the second electrode 150. In this way, the light-shielding layer 162C can reduce the reflectivity, and can also achieve technical effects similar to the light-shielding layer 162 of the display panel 10 described above. In addition, the manufacturing method of the light shielding layer 162C of this embodiment can also protect the organic light emitting material of the light emitting layer 140 through the cover layer 160. In addition, the orthogonal light development technique used in the above-mentioned manufacturing method further uses a fluorinated photoresist material and a fluorinated solvent. Therefore, it can provide protection for the light-emitting layer 140 and reduce damage to the light-emitting layer 140 during the manufacturing process, and also has the advantages of environmental friendliness, low toxicity, and other green energy.

In summary, in the manufacturing method of the display panel according to an embodiment of the present invention, the light-shielding layer of the display panel can be manufactured on one side of the array substrate, and the light-shielding layer correspondingly overlaps the pixel definition layer on the array substrate. Therefore, it is possible to reduce the probability that the light emitted by the light-emitting layer at a large angle in the oblique direction is absorbed. In this way, the brightness of the display panel under a large viewing angle can be improved. In addition, since the light emitting layer at a large angle can be increased, the light emitting angle of the light emitting layer can be increased to increase the aperture ratio of the display panel. In addition, since there is no need to provide a light shielding layer on one side of the color light substrate, the aperture ratio of the display panel can be further improved. Furthermore, the light shielding layer completely overlaps the pixel definition layer and directly covers the second electrode, so the light shielding layer can significantly reduce the reflectivity of the display panel. In addition, the light-shielding layer can also absorb light leakage from the light-emitting layer in the lateral direction, reducing the probability of light mixing and color mixing. In this way, the manufacturing method of the display panel can improve the display quality of the display panel. In addition, the cover layer and/or the light-transmitting layer provided on the light-emitting layer can also provide protection for the light-emitting layer.

In addition, the production method of the present invention also provides a light-shielding layer formed by exposure modification, inkjet printing or vapor deposition. In this way, the light shielding layer can be simply formed to simplify the manufacturing method of the display panel and reduce the manufacturing cost of the display panel. In addition, the manufacturing method of the present invention further provides the use of orthogonal light development technology to provide protection to the light-emitting layer and reduce damage to the light-emitting layer during the manufacturing process. It also has the advantages of environmental friendliness, low toxicity and other green energy.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

10.10A: Display panel 100: Array substrate 110: Active component layer 120: Pixel definition layer 122: open 130: first electrode 140: luminescent layer 150: second electrode 160: cover layer 160A: Part One 160B: Part Two 162, 162A, 162B, 162C: shading layer 162’, 162C’: shading layer material 164: light transmitting layer 170: encapsulation layer 180: insulating layer 200: IPL substrate 220: Color filter layer 222: The first IPL pattern 224: The second color light pattern 226: The third color light pattern 310: protective layer 310’: Patterned protective layer 312: accommodation space 320: photoresist layer 320’: Patterned photoresist layer 320A: Zone 1 320B: District 2 FM: Fine Metal Screen L: beam PH: Printing nozzle PM: Screen VD: Evaporation program

FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention. 2A to 2E are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention. 3A to 3D are schematic cross-sectional views of a manufacturing process of a display panel according to another embodiment of the invention. 4A to 4B are schematic cross-sectional views of the formation process of the light shielding layer according to still another embodiment of the present invention. 5A to 5E are schematic cross-sectional views of the formation process of the light shielding layer according to another embodiment of the present invention.

10: Display panel

100: Array substrate

110: Active component layer

120: Pixel definition layer

122: open

130: first electrode

140: luminescent layer

150: second electrode

162: shading layer

164: light transmitting layer

170: encapsulation layer

180: insulating layer

200: IPL substrate

220: Color filter layer

222: The first IPL pattern

224: The second color light pattern

226: The third color light pattern

Claims (10)

A manufacturing method of a display panel includes: Provide an array substrate; Forming an active device layer on the array substrate; Forming a pixel definition layer on the active device layer, the pixel definition layer having an opening; Forming a first electrode on the active device layer and overlapping the opening; Forming a light-emitting layer on the first electrode and located in the opening; Forming a second electrode on the pixel defining layer and overlapping the light emitting layer; Forming a covering layer on the second electrode, the covering layer having a first part overlapping the pixel definition layer and a second part overlapping the opening; Performing an exposure procedure on the first part of the cover layer to modify the first part into a light-shielding layer; and Disposing a color light substrate opposite to the array substrate, The shading layer overlaps the pixel definition layer. The manufacturing method of the display panel described in item 1 of the scope of patent application further includes: Forming an encapsulation layer on the shading layer; and Forming an insulating layer on the packaging layer, The light shielding layer is located between the pixel definition layer and the packaging layer, and the packaging layer is located between the light shielding layer and the color light substrate. According to the manufacturing method of the display panel described in item 1 of the scope of patent application, the exposure procedure includes: Setting a patterned mask on the covering layer; and Passing a light beam through the patterned mask to expose the first part to form the light-shielding layer, and the second part not exposed by the light beam forms a light-transmitting layer, The light-transmitting layer overlaps the light-emitting layer. According to the manufacturing method of the display panel described in item 1 of the scope of patent application, the material of the cover layer is a photosensitive color-changing material. A manufacturing method of a display panel includes: Provide an array substrate; Forming an active device layer on the array substrate; Forming a pixel definition layer on the active device layer, the pixel definition layer having an opening; Forming a first electrode on the active device layer and overlapping the opening; Forming a light-emitting layer on the first electrode and located in the opening; Forming a second electrode on the pixel defining layer and overlapping the light emitting layer; Forming a covering layer on the second electrode, the covering layer having a first part overlapping the pixel definition layer and a second part overlapping the opening; Forming a light shielding layer on the first part of the covering layer; and Disposing a color light substrate opposite to the array substrate, The shading layer overlaps the pixel definition layer. The manufacturing method of the display panel as described in item 5 of the scope of patent application further includes: Forming an encapsulation layer on the shading layer; and Forming an insulating layer on the packaging layer, The light-shielding layer is located between the covering layer and the packaging layer, and the packaging layer is located between the covering layer and the color light substrate. According to the manufacturing method of the display panel described in item 5 of the scope of patent application, the step of forming the light shielding layer includes: An inkjet printing process to spray a light-shielding layer material on the first part of the cover layer; and A curing process to cure the light-shielding layer material into the light-shielding layer. According to the manufacturing method of the display panel described in item 5 of the scope of patent application, the step of forming the light shielding layer includes: Setting a patterned fine metal mask on the covering layer; A light-shielding layer material is vapor-deposited on the first part through the patterned fine metal mask; and The light-shielding layer material is cured to form the light-shielding layer. According to the manufacturing method of the display panel described in item 5 of the scope of patent application, the step of forming the light shielding layer includes: Forming a protective layer on the covering layer; Forming a photoresist layer on the protective layer, the photoresist layer defines a first area overlapping the first portion and a second area overlapping the second portion; Performing an exposure procedure to make a light beam pass through the patterned mask to expose the photoresist layer in the first region; Performing a development process to remove the photoresist layer in the first area to form a patterned photoresist layer; Performing an etching process, using the patterned photoresist layer as a mask, and patterning the protective layer to form a patterned protective layer having an accommodating space overlapping the first region; Forming a light shielding layer material on the patterned photoresist layer and in the containing space; Performing a stripping process to remove the patterned protective layer; and The light-shielding layer material is cured to form the light-shielding layer. According to the manufacturing method of the display panel described in item 9 of the scope of patent application, the protective layer is a fluorinated photoresist material, and the stripping process includes dissolving the protective layer in a fluorinated solvent.

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