TW202027236A - Packaging structure for reducing residual air and method thereof capable of effectively preventing the chip module package from electrical connection failure - Google Patents

Abstract

The present invention describes a packaging structure for reducing residual air and a method thereof, which are applied to chip module packaging and can be implemented in various embodiments. In one embodiment, a spacer is fixed to an active surface of a substrate by an adhesive material, and a chip module is disposed on one side of the spacer. The chip module has a plurality of conductive balls combined with a plurality of conductive points of the active surface. A plurality of solder balls are implanted on a plurality of pre-implantation points on the back of the substrate. An insulating package covers the chip module, the spacer and the active surface. In another embodiment, a spacer is fixed on the conductive surface of a chip module by an adhesive material. The spacer is disposed on one side of the active surface of a substrate. The chip module has a plurality of conductive balls combined with a plurality of conductive points of the active surface. A plurality of solder balls are implanted on a plurality of pre-implantation points on the back of the substrate. An insulating package covers the chip module, the spacer and the active surface. According to the above examples, the chip module package can be effectively improved, which often causes electrical connection failure due to excess amount of residual air.

Description

Packaging structure and method for reducing air residue

The present invention relates to a chip module package, in particular to reduce the popcorn phenomenon caused by gas intruding into the package body after the chip module is packaged, which in turn leads to unstable electrical connections of the solder balls drawn from the chip module, so that the final product is reliable Degree drops.

Semiconductor package (semiconductor package) refers to a carrier/housing used to contain and wrap more than one semiconductor element or integrated circuit. The semiconductor package provides a certain degree of protection for the chip, and provides pins or contacts for the chip to connect to the external circuit. , When the wafer is working, it helps to take away the heat generated by the die work.

In the packaging process, generally as for processing in an environment with a low pollution level, the pollution sources referred to here include dust, airborne microorganisms and chemical volatile gases, etc., especially in the semiconductor industry for indoor temperature, humidity, and cleanliness. The requirements are particularly strict, so it must be controlled within a certain range of requirements so that it will not affect the manufacturing process.

However, in a strictly required environment, there are still many factors that cause the package to be damaged.

Regarding the packaging literature, several patents are as follows:

TW I441296 discloses a package structure and its manufacturing method. The package structure includes chip placement pads, traces, electrical contacts, a first electroplating layer, a second electroplating layer, a third electroplating layer, a semiconductor chip, packaging materials, and solder resist Layer, the thickness of the trace is smaller than the thickness of the electrical contact, The first electroplating layer is formed on one surface of the trace and the electrical contact, the second electroplating layer is formed on the other surface of the electrical contact and the chip placement pad, and the third electroplating The layer is formed on the other surface of the trace, the semiconductor chip is set on the wafer placement pad, and the packaging material covers the semiconductor chip, the first electroplating layer, part of the side surface of the trace, and is electrically connected Part of the side surface of the point, the solder mask covers the third electroplating layer, the packaging material, part of the side surface of the trace, and part of the side surface of the electrical contact. In addition to avoiding solder bridging between the trace and the electrical contact, the present invention can also make the solder resist layer less likely to generate bubbles that can cause popcorn effect.

TW I635595 discloses a chip package, including a circuit board, a package glue, a plurality of conductive structures, and an electromagnetic interference protection layer. The circuit board includes a plurality of ground conductive pads, which are arranged on the lower surface. The packaging glue is arranged on the upper surface of the circuit board. The conductive structure is arranged in the packaging glue and is electrically connected to the ground conductive pad, wherein the end of each conductive structure is exposed from the sidewall of the packaging glue. The electromagnetic interference protection layer is arranged on the packaging gel and is electrically connected to the ground conductive pad through the end of the conductive structure.

TW I623068 discloses a resin packaging device that can balance the suppression of substrate bending and the molding of both sides of the substrate. The resin encapsulation device of the present invention is a device that performs resin encapsulation on both sides of a substrate by compression molding, wherein one of the upper mold and the lower mold includes a rigid member and a first elastic member, and the other includes a The second elastic member with a larger spring constant; the movement of one of the upper mold frame member and the lower mold frame member in the direction of opening and closing the upper mold and the lower mold is stopped by the rigid member; the substrate pin is in the lower mold cavity The outer side is provided so as to protrude upward, and the substrate pin is placed on the substrate in a state detached from the upper surface of the lower mold, or includes an external gas blocking member and a substrate support element, and supports the substrate by reducing the pressure in the mold cavity The state of the side that is not encapsulated by resin, and the other side is compressed and molded to resin Package.

However, the polymer materials used in packaging have the characteristics of easy moisture absorption, and the residual moisture will popcorn during the reflow process, which will damage the structure; therefore, reducing the residual gas in the package will be an important issue.

In view of the above problems, the present invention provides a packaging structure and method for reducing air residues, which mainly use gaskets between the substrate and the chip module to reduce the possibility that the gas occupying the space between the substrate and the chip module is too high.

Another object of the present invention is to provide a packaging structure and method for reducing air residue, which can effectively improve the electrical connection failure of chip module packaging caused by popcorn phenomenon.

Another object of the present invention is to provide a package structure and a method for reducing air residue, improve the stacking yield of chip modules, and increase the stacking height in the package.

In order to achieve the above objective, the main technical means used in the present invention are achieved by the following technical solutions. The present invention is a packaging structure for reducing air residue, which is applied to chip module packaging, and includes: a gasket, a substrate, a chip module, an insulating package and a plurality of solder balls; the gasket is characterized in that Fixed on an active surface of the substrate by an adhesive material, the chip module is located on the side of the gasket, the plurality of conductive balls of the chip module are combined with the plurality of conductive points of the active surface, and the plurality of solder balls are implanted on the A plurality of pre-planted points on the back of a substrate, the insulating package covers the chip module, the gasket and the active surface.

Furthermore, another package structure of the present invention is a package structure for reducing air residue, which is applied to chip module packaging, and includes: a gasket, a substrate, a chip module, an insulating package and a plurality of solder balls; It is characterized in that the gasket is fixed to the chip by an adhesive material A conductive surface of the module, the gasket is located on the side of an active surface of the substrate, a plurality of conductive balls of the chip module and a plurality of conductive points of the active surface are combined, and a plurality of solder balls are implanted on the back of the substrate A plurality of pre-planted points, the insulating package body covers the chip module, the gasket and the active surface.

In addition, another package structure of the present invention is a package structure for reducing air residue, which is applied to chip module packaging, and includes: a substrate, a chip module, an insulating package, and a plurality of solder balls; characterized in that, An adhesive material is fixed to an active surface of the substrate, the chip module is located on the side of the adhesive material, the plurality of conductive balls of the chip module are combined with the plurality of conductive points of the active surface, and the plurality of solder balls are planted on A plurality of pre-planted points on the back of a substrate, the insulating package covers the chip module and the active surface.

The purpose of the present invention and the solution of its technical problems can be further achieved by the following technical measures.

In the aforementioned packaging structure, the gasket may be conductive, non-conductive or semiconductor material.

In the aforementioned packaging structure, the adhesive material can be a conductive adhesive or a non-conductive adhesive.

In the aforementioned packaging structure, the chip module is a packaged chip.

In the aforementioned packaging structure, the other side of the gasket is fixed to a conducting surface of the chip module by a reinforced adhesive material.

In the aforementioned packaging structure, the other side of the gasket is fixed to the active surface of the substrate by a reinforced adhesive material.

In order to achieve the above objective, the main technical means used in the present invention are realized by the following technical solutions. The present invention is a packaging method for reducing residual air, which should be For chip module packaging, it includes: Step 1: Bonding a pad to an active surface of a substrate by an adhesive material; Step 2: Using a plurality of conductive balls of a chip module and a plurality of the active surface The conductive points are attached to each other; Step 3: An insulating package is formed to cover the chip module, the gasket and the substrate, and the insulating package does not cover a back surface of the substrate.

Furthermore, another packaging method of the present invention is a packaging method for reducing air residue, which is applied to chip module packaging, which includes: Step 1a: bonding a gasket to one of the chip modules by an adhesive material Conduction surface; Step 2: Attach a plurality of conductive balls of the chip module to a plurality of conductive points of an active surface of a substrate; Step 3: Form an insulating package covering the chip module, the gasket and The substrate, the insulating package body does not cover a back surface of the substrate.

In addition, one of the packaging methods of the present invention is a packaging method for reducing air residue, which is applied to chip module packaging, which includes: Step 1c: bonding an adhesive material to an active surface of a substrate; Step 2: A plurality of conductive balls of a chip module are attached to a plurality of conductive points of the active surface; step 3a: forming an insulating package covering the chip module and the substrate, the insulating package not covering the One of the back of the substrate.

The purpose of the present invention and the solution of its technical problems can be further achieved by the following technical measures.

In the aforementioned packaging method, before step 2, a reinforced adhesive material is applied to one side of the gasket.

In the aforementioned packaging method, after following the steps described above, a plurality of solder balls are planted on the back surface, and then the packaged chip module is separated by a dividing process.

Compared with the conventional technology, the present invention has the following effects: (1) Using gaskets to reduce Less gas interference; (2) Reduce packaging costs by improving electrical connection failure; (3) By improving the stacking yield of chip modules, the stack height in the package can be increased.

10‧‧‧Gasket

20‧‧‧Substrate

21‧‧‧Active surface

211‧‧‧on point

22‧‧‧Back

221‧‧‧Pre-planting point

30‧‧‧Chip Module

31‧‧‧Complex ball

32‧‧‧Through surface

40‧‧‧Insulation package

50‧‧‧Tin ball

60‧‧‧Viscose material

61‧‧‧Reinforced viscose material

71‧‧‧Step 1

71a‧‧‧Step 1a

71b‧‧‧Step 1b

71c‧‧‧Step 1c

72‧‧‧Step 2

73‧‧‧Step 3

73a‧‧‧Step 3a

74‧‧‧Step 4

X‧‧‧Bottom gap

Figure 1a is a first schematic diagram of the first embodiment of the present invention; Figure 1b is a second schematic diagram of the first embodiment of the present invention; Figure 1c is a third schematic diagram of the first embodiment of the present invention; Figure is the fourth schematic diagram of the first embodiment of the present invention; Figure 1e is the fifth schematic diagram of the first embodiment of the present invention; Figure 2a is the first schematic diagram of the second embodiment of the present invention; Figure 2b is The second schematic diagram of the second embodiment of the present invention; Figure 2c is the third schematic diagram of the second embodiment of the present invention; Figure 2d is the fourth schematic diagram of the second embodiment of the present invention; Figure 2e is the present invention The fifth schematic diagram of the second embodiment; Figure 3a is the first schematic diagram of the third embodiment of the present invention; Figure 3b is the second schematic diagram of the third embodiment of the present invention; Figure 3c is the third schematic diagram of the third embodiment of the present invention The third schematic diagram of the embodiment; Figure 3d is the fourth schematic diagram of the third embodiment of the invention; Figure 3e is the fifth schematic diagram of the third embodiment of the invention; Figure 4a is the best embodiment of the invention Fig. 4b is a schematic diagram of the chip module and spacers of the best embodiment of the present invention; Fig. 5a is a flowchart of the first embodiment of the present invention; Figure 5b is a flowchart of the second embodiment of the present invention; Figure 5c is a flowchart of the third embodiment of the present invention; Figure 5d is a flowchart of the fourth embodiment of the present invention; Figure 6a is a flowchart of the fourth embodiment of the present invention The first schematic diagram of the fourth embodiment of the present invention; Figure 6b is the second schematic diagram of the fourth embodiment of the present invention; Figure 6c is the third schematic diagram of the fourth embodiment of the present invention; Figure 6d is the third schematic diagram of the fourth embodiment of the present invention. The fourth schematic diagram of the fourth embodiment; Figure 6e is the fifth schematic diagram of the fourth embodiment of the present invention.

In order to make the purpose, features and effects of the present invention more comprehensible, the following specifically enumerates the preferred embodiments of the present invention:

As shown in Figures 1a, 1b, 1c, 1d, 1e, and 5a, this is the first embodiment of a package structure and method for reducing air residue in the present invention; please refer to Figure 1e first, which has a gasket (10) A substrate (20), a chip module (30), an insulating package (40), a plurality of solder balls (50) and an adhesive material (60).

Specifically, the gasket (10) can be conductive, non-conductive or semiconductor material, and its function is to fill the gap between the substrate and the chip module to reduce the possibility of the gas occupying an excessively high ratio of the distance between the substrate and the chip module; wherein, the substrate (20) Usually a high-density double-sided conduction multilayer printed circuit board with circuits (not shown in the drawings) formed inside which can be used as an electrical transmission interface; the chip module (30) is a packaged chip; In addition, the insulating package (40) is a polymer material for semiconductor packaging, which provides a certain degree of protection for the content; and the plural solder balls (50) provide the chip with contacts for connecting with the external circuit; the adhesive material (60) Can be conductive adhesive Material or non-conductive adhesive material, its function is to fix the gasket (10) at a predetermined position.

Wherein, the substrate (20) is shown in Figure 1a, which includes an active surface (21) and a back surface (22). The active surface (21) has a plurality of conduction points (211), and the back surface (22) has a plurality of presets. Planting point (221); wherein, the active surface (21) as shown in Figure 1b shows the function of carrying the chip module (30); in addition, the back surface (22) is the surface for mounting the solder balls and the outside; and, the The conduction points (211) are connected with the plurality of conduction balls (31) of the chip module (30) as described in Figure 1b, and their function is to electrically conduct the conduction balls (31) to the pre-planting point (221). ); Furthermore, the pre-planting points (221) function as shown in Figure 1d to electrically conduct to the solder balls (50).

Among them, the chip module (30) is a packaged chip. As shown in Figure 4a, a plurality of conductive balls (31) are located on the lower side, and the packaged chip is electrically connected by the conductive balls (31), and The chip module (30) is provided with a conducting surface (32) on the inside, and the conducting surface (32) carries the conducting balls (31).

Please refer to Figure 5a again, in which step 1 (71) is to bond a gasket (10) to an active surface (21) of a substrate (20) by an adhesive material (60); this step 1 (71) Refer to Figure 1a.

Then, refer to Figure 5a again, where step 2 (72) is to attach the plurality of conductive balls (31) of a chip module (30) to the plurality of conductive points (211) of the active surface (21); Refer to Figure 1b for this step 2 (72).

Finally, referring to Figure 5a, where step 3 (73) is to form an insulating package (40) covering the chip module (30), the gasket (10) and the substrate (20), the The insulating package (40) does not cover a back surface (22) of the substrate (20); the step 3 (73) can refer to Figure 1c.

It can be continued, as shown in Figure 5a, in which step 4 (74) is to plant a plurality of solder balls (50) on the back surface (22), and then separate the packaged chip module (30) by a dividing process; This step 4 (74) can first refer to Figure 1d, and then refer to Figure 1e.

Please refer to Figures 2a, 2b, 2c, 2d, 2e, and 5b, which are the second embodiment of a package structure and method for reducing air residue according to the present invention; the second embodiment and the first embodiment The main difference lies in the fixed position of the gasket (10).

Please refer to Figure 2e, which has a gasket (10), a substrate (20), a chip module (30), an insulating package (40), a plurality of solder balls (50) and adhesive materials ( 60); The above is the same as the introduction of the first implementation type.

Please refer to Figure 5b again, in which step 1a (71a) is to bond a gasket (10) to a conducting surface (32) of a chip module (30) through an adhesive material (60); Step 1a (71a) can refer to Figure 2a. As shown in Figures 4a and 4b, the spacer (10) is attached to the bottom gap (X) of the chip module (30).

Then, refer to Fig. 5b again, where step 2 (72) is to attach the plurality of conductive balls (31) of a chip module (30) to the plurality of conductive points (211) of the active surface (21); Refer to Figure 2b for this step 2 (72).

Finally, referring to Figure 5b, where step 3 (73) is to form an insulating package (40) covering the chip module (30), the spacer (10) and the substrate (20), the The insulating package (40) does not cover a back surface (22) of the substrate (20); this step 3 (73) can refer to Figure 2c.

It can be continued, please refer to Figure 5b, where step 4 (74) is to plant a plurality of solder balls (50) on the back surface (22), and then divide the packaged chip module (30) Separation; this step 4 (74) can first refer to Figure 2d, and then refer to Figure 2e.

Please refer to Figures 3a, 3b, 3c, 3d, 3e, and 5c, which are the third embodiment of a package structure and method for reducing air residue according to the present invention; the third embodiment and the first embodiment The main difference lies in adding a reinforced adhesive material (61) on one side of the gasket (10).

Please refer to Figure 3e, which has a gasket (10), a substrate (20), a chip module (30), an insulating package (40), a plurality of solder balls (50) and adhesive materials ( 60); The above description is the same as the first embodiment, and it also contains a reinforced adhesive material (61), which can be a conductive adhesive or a non-conductive adhesive, and its function is to fix the gasket (10) in a predetermined position.

Please refer to Figure 5c again, where step 1 (71) is to bond a gasket (10) to an active surface (21) of a substrate (20) by an adhesive material (60); this step 1 (71) Refer to Figure 3a.

Again, refer to Figure 5c, where step 1b (71b) is to coat one side of the gasket (10) with a reinforced adhesive material (61); this step 1b (71b) can refer to Figure 3a.

Then, refer to Figure 5c again, where step 2 (72) is to attach the plurality of conductive balls (31) of a chip module (30) to the plurality of conductive points (211) of the active surface (21); Refer to Figure 3b for this step 2 (72).

Finally, referring to Figure 5c, where step 3 (73) is to form an insulating package (40) covering the chip module (30), the gasket (10) and the substrate (20), the The insulating package (40) does not cover a back surface (22) of the substrate (20); this step 3 (73) can refer to FIG. 3c.

Can be continued, refer to Figure 5c, where step 4 (74) is to put the plural solder balls (50) Plant on the back surface (22), and then separate the packaged chip module (30) by a dicing process; for step 4 (74), please refer to Figure 3d first, and then Figure 3e.

Please refer to Figures 6a, 6b, 6c, 6d, 6e, and 5d, which are the fourth embodiment of a package structure and method for reducing air residue according to the present invention; the fourth embodiment and the first embodiment The main difference is the removal of the gasket (10).

Please refer to Figure 6e, which has a substrate (20), a chip module (30), an insulating package (40), a plurality of solder balls (50) and adhesive materials (60); the above is the same as the first The description of the implementation type is the same, except that the gasket (10) is removed, and the adhesive material (60) completely replaces the effect of the gasket (10).

Please refer to Figure 5d again, where step 1c (71c) is to bond an adhesive material (60) to an active surface (21) of a substrate (20); this step 1c (71c) can refer to Figure 6a .

Then, refer to Fig. 5d again, in which step 2 (72) is to attach the plural conductive balls (31) of a chip module (30) to the plural conductive points (211) of the active surface (21); Refer to Figure 6b for this step 2 (72).

Finally, referring to Figure 5d, where step 3a (73a) is to form an insulating package (40) covering the chip module (30) and the substrate (20), the insulating package (40) One of the back sides (22) of the substrate (20) is not covered; this step 3a (73a) can refer to Figure 6c.

It can be continued, as shown in Fig. 5d, in which step 4 (74) is to plant a plurality of solder balls (50) on the back surface (22), and then separate the packaged chip module (30) by a dividing process; This step 4 (74) can first refer to Figure 6d and then Figure 6e.

Therefore, the effect of the present invention is different from the general semiconductor packaging structure. It is the first in semiconductor packaging and meets the requirements of an invention patent. The application is filed in accordance with the law.

However, it needs to be reiterated that the above are only the preferred implementation forms of the present invention. Any equivalent changes made by applying the specification, scope of patent application, or drawings of the present invention still belong to the technical scope protected by the present invention. Therefore, The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10‧‧‧Gasket

20‧‧‧Substrate

30‧‧‧Chip Module

40‧‧‧Insulation package

50‧‧‧Tin ball

60‧‧‧Viscose material

Claims (13)

A packaging structure for reducing air residue, which is applied to chip module packaging, which comprises: a gasket, a substrate, a chip module, an insulating package and a plurality of solder balls; characterized in that the gasket is made of an adhesive The glue material is fixed on an active surface of the substrate, the chip module is located on the side of the gasket, the plurality of conductive balls of the chip module are combined with the plurality of conductive points of the active surface, and the plurality of solder balls are implanted on one of the substrates For a plurality of pre-planted points on the back, the insulating package covers the chip module, the gasket and the active surface. A packaging structure for reducing air residue, which is applied to chip module packaging, which comprises: a gasket, a substrate, a chip module, an insulating package and a plurality of solder balls; characterized in that the gasket is made of an adhesive The glue material is fixed on a conductive surface of the chip module, the gasket is located on the side of an active surface of the substrate, the plurality of conductive balls of the chip module are combined with the plurality of conductive points of the active surface, and the plurality of solder balls are planted on A plurality of pre-planted points on the back of the substrate, the insulating package covers the chip module, the gasket and the active surface. A packaging structure for reducing air residue, which is applied to chip module packaging, comprising: a substrate, a chip module, an insulating package, and a plurality of solder balls; and it is characterized in that an adhesive material is fixed on the substrate An active surface, the chip module is located on the side of the adhesive material, the plurality of conductive balls of the chip module are combined with the plurality of conductive points of the active surface, and the plurality of solder balls are implanted on the plurality of pre-planted points on the back of the substrate , The insulating package covers the chip module and the active surface. According to the package structure described in item 1 or 2 of the scope of patent application, the gasket can be conductive, non-conductive or semiconductor material. Such as the package structure described in item 1, 2 or 3 of the scope of patent application, wherein the adhesive material can be conductive Electric plastic or non-conductive plastic. For the package structure described in item 1, 2 or 3 of the scope of patent application, the chip module is a packaged chip. According to the package structure described in claim 1, wherein the other side of the gasket is fixed to a conducting surface of the chip module by a reinforced adhesive material. According to the package structure described in item 2 of the scope of patent application, the other side of the gasket is fixed to the active surface of the substrate by a reinforced adhesive material. A packaging method for reducing air residue, which is applied to chip module packaging, includes: step 1: bonding a gasket to an active surface of a substrate by an adhesive material; step 2: using a chip module The plurality of conductive balls are attached to the plurality of conductive points of the active surface; Step 3: An insulating package is formed to cover the chip module, the gasket and the substrate, and the insulating package does not cover the The back of one of the substrates. A packaging method for reducing air residue, which is applied to chip module packaging, includes: Step 1a: bonding a gasket to a conductive surface of a chip module by an adhesive material; Step 2: using the chip mold The plurality of conductive balls of the set are attached to the plurality of conductive points of an active surface of a substrate; Step 3: An insulating package is formed to cover the chip module, the gasket and the substrate, and the insulating package is not Covering the back of the substrate. A packaging method for reducing air residue, which is applied to chip module packaging, comprises: Step 1c: bonding an adhesive material to an active surface of a substrate; Step 2: Using a plurality of conductive balls of a chip module to connect the The complex conduction points of the active surface are close to each other 合; Step 3a: forming an insulating package covering the chip module and the substrate, and the insulating package does not cover a back surface of the substrate. For the packaging method described in item 9 or 10 of the scope of patent application, before step 2, a reinforced adhesive material is coated on one side of the gasket. For the packaging method described in item 9, 10 or 11 of the scope of patent application, after the above steps, a plurality of solder balls are planted on the back surface, and then the packaged chip module is separated by a dividing process.

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