TW202016181A - Porous thin film and method for fabricating the same - Google Patents

Abstract

A method for fabricating a porous film including the following steps is provided. A glue layer is provided on the carrier, wherein the material of the glue layer comprises a photocurable material or a heat curing material. The glue layer on the carrier plate is embossed with a stamper. The glue layer on the carrier is cured in a state where the stamper is in contact with the glue layer on the carrier to form a cured film having a plurality of holes. The stamper is separated from the carrier covered with the cured film. A porous film is also provided.

Description

Porous film and manufacturing method thereof

The invention relates to a film and a method for manufacturing the film, and particularly relates to a porous film and a method for manufacturing the film.

The application of porous films in daily life is quite extensive. For example, a porous film can be used to capture solid suspended particles in the air to improve air quality. For another example, the porous film can be used to make the moisture into small droplets of mist to reduce the temperature of the environment. That is to say, with such separation technology of environmental protection and energy saving made of porous film, the application in life or industry will be more and more.

In 1990, the United Nations Environment Programme (UNEP) proposed the concept of "Cleaner Production". Cleaner production includes the reduction of pollutants or wastes in the product manufacturing process, or the energy saving or material saving in the product manufacturing process in order to achieve reasonable resource utilization. In addition, the contents of the important administration of the Republic of China issued by the Ministry of Economic Affairs of the Republic of China in July 107 also pointed out that reducing business waste and improving energy use are part of the government's energy conservation and carbon reduction policies.

The invention provides a method for manufacturing a porous film, which is relatively simple.

The invention provides a porous film with better yield.

The invention provides a porous film and a manufacturing method thereof. The production process can implement the energy saving and carbon reduction policy of the Industrial Bureau of the Ministry of Economic Affairs of the Republic of China.

The manufacturing method of the porous film of the present invention includes the following steps. An adhesive layer is provided on the carrier board, wherein the material of the adhesive layer includes at least a photo-curable material and/or a thermal-curable material. Pressing the adhesive layer on the carrier board with a stamp, and curing the adhesive layer on the carrier board to form a cured film in a state where the stamp is in contact with the adhesive layer on the carrier board, and the cured film has a plurality of through holes Cured film. Separate the stamp and the carrier board covering the cured film.

In an embodiment of the invention, the material of the adhesive layer includes a photo-curable material, and the adhesive layer is cured on the carrier board by irradiating light comprehensively.

In an embodiment of the invention, the photo-curable material is ultraviolet (UV) glue, and the light includes ultraviolet light.

In an embodiment of the invention, the stamp includes a plurality of microstructures, the thickness of the microstructure is equal to or greater than the thickness of the adhesive layer on the carrier board.

The invention provides a porous film. The porous film has a plurality of through holes. The porous film includes a first surface and a second surface. The second surface is opposite to the first surface. The through holes penetrate the first surface and the second surface, and the first hole diameter of the through holes on the first surface is substantially larger than the second hole diameter on the second surface.

In an embodiment of the invention, each of these through holes has a side wall connecting the first surface and the second surface; the side wall includes at least a first inclined surface and a second inclined surface connecting the first inclined surface; and the first inclined surface and the second inclined surface The included angle is the superior angle.

In an embodiment of the invention, the side wall further includes a third slope connected to the second slope; the second slope is located between the first slope and the third slope; and the angle between the second slope and the third slope is an obtuse angle .

In an embodiment of the invention, the porous film has a film thickness; and the ratio of the first pore size to the film thickness is between 1:5 and 3:25.

In an embodiment of the invention, the porous film has a film thickness; any two adjacent through holes have a pitch on the first surface; the ratio of the pitch to the film thickness is between 1:5 and 5:1.

In an embodiment of the present invention, any two adjacent through holes have a pitch on the first surface; the pitch is between 0.01 mm and 0.25 mm.

In an embodiment of the invention, the porous film has a film thickness, and the film thickness is between 15 microns and 100 microns.

Based on the above, the manufacturing method of the porous film of the present invention can be relatively simple, and the porous film can have a better yield.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

FIG. 1 is a schematic flowchart of a method for manufacturing a porous film according to the first embodiment of the present invention. 2A to 2E are schematic cross-sectional views of a method for manufacturing a porous film according to the first embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2A at the same time. In step S1, an adhesive layer 20 is provided on the carrier board 10, wherein the material of the adhesive layer 20 includes at least a photo-curable material and/or a thermal-curable material.

In this embodiment, the carrier board 10 may be a glass substrate, a metal substrate, a silicon substrate or other suitable substrates, but the invention is not limited thereto.

In this embodiment, the material of the adhesive layer 20 is a photo-curable material. For example, the material of the adhesive layer 20 may include acrylic polymer, amide polymer and/or photoinitiator, or other suitable materials with photocuring properties, but the invention is not limited thereto.

In other feasible embodiments, the material of the adhesive layer 20 may be a thermosetting material. For example, the material of the adhesive layer 20 may include polyol resin, polyester resin, epoxy resin, acrylic resin, polyurethane resin, melamine resin, silane compound, and/or other suitable materials with thermal curing properties. However, the present invention is not limited to this.

In this embodiment, the adhesive layer 20 may be coated on the carrier board 10 by coating, but the invention is not limited thereto. In other words, before the adhesive layer 20 is subjected to a subsequent curing step, the adhesive layer 20 on the carrier board 10 does not substantially have a fixed shape. For example, before the adhesive layer 20 is subjected to a subsequent curing step, the adhesive layer 20 on the carrier board 10 may be in a liquid state or a gel state.

Please refer to Figure 1, Figure 2A and Figure 2B at the same time. As shown in FIGS. 2A to 2B, in step S2, the stamp layer 30 is used to stamp the adhesive layer 20 on the carrier board 10.

In this embodiment, imprinting is to press a stamp 30 (stamper) (sometimes referred to as a mold or template) with a plurality of raised microstructures 31 on the carrier board 10 The adhesive layer 20 to mechanically deform the adhesive layer 20 on the carrier board 10. Therefore, once the stamp 30 is completed, the same stamp 30 can be used for simple and repeated stamping, which can effectively reduce the process cost and the generation of waste in the process. In other words, the manufacturing method of the present invention is relatively simple. In addition, the manufacturing method of the present invention can reduce business waste, is more environmentally friendly and conforms to the trend of green production.

As shown in FIG. 2B, in this embodiment, in a state where the stamp 30 is in contact with the adhesive layer 20 on the carrier board 10, the thickness 34 of these microstructures 31 is substantially equal to or greater than the adhesive layer 20 on the carrier board 10 'S thickness 21. In other words, the microstructure 31 can at least contact the interface between the adhesive layer 20 on the carrier board 10 and the carrier board 10. In this way, part of the carrier board 10 and the microstructure 31 can be brought into contact, and the area where the carrier board 10 and the microstructure 31 are in contact does not have the adhesive layer 20.

In this embodiment, the raised microstructure 31 is not columnar with vertical sides. For example, the raised microstructure 31 may be a frustum where the side surface 32 is not perpendicular to the bottom surface 33 (ie, the apex angle of a cone is removed to form a top surface that is substantially parallel to the bottom surface Three-dimensional shape). In this way, in the subsequent process, it is easier to separate the stamp 30 from the adhesive layer 20 or the cured adhesive layer (eg, the cured film 40 shown in FIG. 2C), and it is easier to separate the stamp 30 from The carrier board 10 is separated.

In some embodiments, the material of the stamp 30 may be a soft material, such as a polymer. In this way, the carrier board 10 and the microstructure 31 can be brought into closer contact. Moreover, when the carrier board 10 is in contact with the microstructure 31 of the stamp 30, the scratches of the carrier board 10 and/or the microstructure 31 of the stamp 30 can be reduced, and the carrier board 10 and/or can be raised The number of times the stamp 30 is used repeatedly can effectively reduce the process cost and reduce the generation of waste in the process.

Please refer to Figure 1, Figure 2B and Figure 2C at the same time. As shown in FIGS. 2B to 2C, in step S3, in a state where the stamp 30 is in contact with the adhesive layer 20 (shown in FIG. 2B) on the carrier board 10, the adhesive layer 20 on the carrier board 10 is cured to A cured film 40 having a plurality of through holes 110 is formed (shown in FIG. 2C).

In this embodiment, the material of the adhesive layer 20 includes at least a photocurable material, and the adhesive layer 20 on the carrier board 10 can be cured by photocuring. For example, the material of the adhesive layer 20 is a photocurable material, and the material of the stamp 30 includes, for example, dimethylsiloxane (Polydimethylsiloxane, PDMS), perfluoropolyethers (PFPE), or other materials suitable for making light L A suitable material for penetration can be irradiated comprehensively by light L at least above the glue layer 20 (ie, the side relative to the carrier board 10) to cure the glue layer 20 on the carrier board 10.

In this embodiment, the photo-curable material is ultraviolet (UV) glue, and the light L for photo-curing includes ultraviolet light. In this way, during the aforementioned light curing step, it is less affected by ambient light.

In other feasible embodiments, the material of the adhesive layer 20 may be a thermosetting material. In this way, the adhesive layer 20 on the carrier board 10 can be cured by conductive heating or radiant heating. The conductive heating method is, for example, directly heating the adhesive layer 20 on the carrier board 10 with high-temperature gas, or indirectly heating the carrier board 10 by conducting heat energy to the adhesive layer 20 on the carrier board 10 by heating the carrier board 10上的胶层20。 20 on the glue layer. The radiation heating method is, for example, heating the adhesive layer 20 on the carrier board 10 by electromagnetic wave heating such as infrared light or microwave.

In some embodiments, the material of the adhesive layer 20 may include a photo-curable material and a thermal-curable material. In this way, after the aforementioned photo-curing step, a step similar to the aforementioned thermal curing step may be further performed to increase the curing degree/degree of curing of the cured film 40.

In this embodiment, the adhesive layer 20 on the carrier board 10 is cured in a state where the stamp 30 is in contact with the adhesive layer 20 on the carrier board 10. In this way, the shape of the through hole 110 of the cured film 40 can basically correspond to the shape of the microstructure 31 of the stamp 30. In other words, in the present embodiment, the shape of the through hole 110 of the cured film 40 is not substantially a columnar shape having vertical sides. For example, the three-dimensional shape corresponding to the through hole 110 may be a truncated cone.

Please refer to Figure 1, Figure 2B and Figure 2C at the same time. As shown in FIGS. 2C to 2D, in step S4, the stamp 30 (shown in FIG. 2C) is separated from the carrier board 10 covered with the cured film 40.

In this embodiment, for example, the stamp 30 can be separated from the carrier board 10 covered with the cured film 40 by mechanical force.

In this embodiment, since the raised microstructure 31 (shown in FIG. 2C) is not a column having vertical sides, during the process of separating the stamp 30 from the carrier board 10 covered with the cured film 40 , The friction force between the microstructure 31 of the stamp 30 and the cured film 40 on the carrier board 10 can be reduced, and the microstructure 31 of the stamp 30 can be separated from the cured film 40 more easily, and the stamp 30 It is easy to separate from the carrier board 10.

After the above process is completed, the fabrication of the porous film 100 of this embodiment can be substantially completed. In other words, in some embodiments, the cured film 40 (shown in FIG. 2D) is sufficient as the porous film 100. For example, as shown in FIGS. 2D to 2E, the cured film 40 (shown in FIG. 2D) can be separated from the carrier plate 10 (shown in FIG. 2D) to serve as the porous film 100 (drawn in FIG. Shown in Figure 2E).

In some embodiments, after the cured film 40 is separated from the carrier board 10, one or more porous films 100 of different sizes or shapes can be formed by cutting. For example, as shown in FIG. 2G, the side 103 of the porous film 100 can be cut into a corresponding circular shape.

In some embodiments, the material of the adhesive layer 20 (shown in FIG. 2B) includes a photo-curable material and a thermo-curable material. Then, after the foregoing photocuring step, and before or after separating the cured film 40 from the carrier board 10, a step similar to the foregoing thermal curing may be performed to improve the curing degree/degree of curing of the cured film 40 ) To form a porous film 100 having a plurality of through holes 110.

2E is a schematic partial cross-sectional view of a porous film 100 according to the first embodiment of the present invention. FIG. 2F is an enlarged schematic view of the region R1 in FIG. 2E. 2G is a schematic top view of a porous film 100 according to the first embodiment of the present invention.

Please also refer to FIGS. 2E to 2G. The porous film 100 has a plurality of through holes 110. The porous film 100 includes a first surface 101, a second surface 102, and a ring-shaped side 103. The second surface 102 is opposite to the first surface 101. The ring-shaped side 103 (because the thickness of the porous film 100 is extremely thin under the naked eye, so the three-dimensional side can be regarded as a flat side) is connected to the side edge of the first surface 101 and the side edge of the second surface 102 . The plurality of through holes 110 are connected to the first surface 101 and the second surface 102. The through hole 110 has a first opening 120 on the first surface 101. The through hole 110 has a second opening 130 on the second surface 102. The aperture 121 (ie, the first aperture) of the first opening 120 on the first surface 101 is substantially larger than the aperture 131 (ie, the second aperture) of the second opening 130 on the second surface 102. In other words, the projected area of the first opening 120 projected on the first surface 101 may be larger than the projected area of the second opening 130 projected on the second surface 102.

For example, as shown in FIG. 2G, on a plane parallel to the first surface 101 or the second surface 102 (eg, the paper surface of FIG. 2G), the range of the first opening 120 projected on the aforementioned plane is substantially greater than and Covers the range of the second opening 130 projected on the aforementioned plane.

In this embodiment, the shape of the through hole 110 is basically not a columnar shape having vertical sides. As shown in FIG. 2F, in a cross-sectional view, the through hole 110 has a side wall 140 connected to the first surface 101 and the second surface 102. The side wall 140 includes at least a first inclined surface 141 and a second inclined surface 142 connected to the first inclined surface 141. In terms of the physical structure of the porous film 100, the angle θ1 between the first surface 101 and the first inclined surface 141 of the side wall 140 is an obtuse angle (ie, greater than 90° and less than 180°). The included angle θ3 between the second inclined surface 142 and the second surface 102 is an acute angle (ie, greater than 0° and less than 90°), and the included angle θ2 formed by the first inclined surface 141 and the second inclined surface 142 is an excellent angle (reflex) angle) (ie, greater than 180° and less than 360°). In other words, in a cross-sectional view, the side wall 140 of the through hole 110 does not have any slope perpendicular to the first surface 101 or the second surface 102. In this way, during the manufacturing process of the porous film 100, the microstructure 31 (shown in FIG. 2C) of the stamp 30 (shown in FIG. 2C) can be easily separated, and it can also be used to form a porous film. The possibility that the material of 100 adheres to the microstructure 31 of the stamp 30 can increase the manufacturing yield of the porous film 100 and reduce the business waste.

In this embodiment, the first inclined surface 141 is connected to the first surface 101, and the second inclined surface 142 is connected to the second surface 102. In other words, the angle θ1 between the first inclined surface 141 and the first surface 101 is an obtuse angle, and the angle θ3 between the second inclined surface 142 and the second surface 102 is an acute angle.

In this embodiment, the film thickness 104 of the porous film 100 is between 15 microns (micrometer, μm) and 100 microns.

Generally speaking, if the mold layer formed by casting or injection molding is less than 1 millimeter (millimeter, mm), the yield is often reduced due to the unevenness of the film thickness or film quality, which will cause excessive production process. Waste. In addition, if the mold layer with through holes (such as the through hole 110 in this case) is formed by casting or injection molding, the through hole is often blocked and the yield is reduced, which will cause the production process to cause Excessive business waste. Therefore, with the manufacturing method of the porous film 100 of the present invention, the film thickness 104 can be between 15 μm and 100 μm, and still have a better yield.

In addition, compared with the laser process in which a plurality of through holes (eg, similar to the through hole 110 in this case) are formed on a mold layer, since the method for manufacturing the porous film 100 of the present invention does not use a laser machine Therefore, it is faster in the manufacturing process, and can reduce the use of high power consumption machines (such as laser machines) or high pollution machines (such as chemical etching machines), which can make the production process More energy-saving or environmentally friendly.

In this embodiment, the ratio of the first aperture 121 of the first opening 120 (that is, the maximum length of the first opening 120 projected on the first surface 101) to the film thickness 104 is between 1:50 and 3:25. In other words, the first aperture 121 of the first opening 120 may be between 1 μm and 6 μm. Generally speaking, the minimum diameter of the first opening 120 corresponds to the smallest size that the microstructure 31 of the stamp 30 can form.

In this embodiment, two adjacent through holes 110 have a pitch 150 on the first surface 101, and the ratio of the pitch 150 to the film thickness 104 is between 1:5 and 5:1. In other words, the pitch 150 may be between 10 microns and 250 microns.

3 is a schematic partial cross-sectional view of a porous film 200 according to a second embodiment of the present invention. Specifically, FIG. 3 may be a schematic cross-sectional view of one of the through holes 210 and the vicinity of the through holes 210 of the porous film 200.

2F and FIG. 3 at the same time, the porous film 200 of this embodiment is similar to the porous film 100 of the first embodiment, the difference is that in terms of the physical structure of the porous film 200, the through-hole 210 has a connection to the first A surface 101 and a side wall 240 of the second surface 102. The side wall 240 includes a first inclined surface 241, a second inclined surface 242 and a third inclined surface 243. The first inclined surface 241 is connected to the first surface 101 and the second inclined surface 242. The second inclined surface 242 is connected to the first inclined surface 241 and the third inclined surface 243. The third inclined surface 243 is connected to the second inclined surface 242 and the second surface 102. In terms of the physical structure of the porous film 200, the angle θ1 between the first inclined surface 241 and the first surface 101 of the sidewall 240 is an obtuse angle, and the angle θ2 formed by the first inclined surface 141 and the second inclined surface 142 is an excellent angle, and the second The included angle θ4 between the inclined surface 142 and the third inclined surface 143 is an obtuse angle, and the included angle θ3 between the third inclined surface 143 of the side wall 140 and the second surface 102 is an acute angle. In other words, in a cross-sectional view, the side wall 240 of the through hole 210 does not have any slope perpendicular to the first surface 101 or the second surface 102. In this way, during the manufacturing process of the porous film 200, the microstructure (eg, the microstructure 31 similar to FIG. 2C) of the stamp (eg, similar to the stamp 30 of FIG. 2C) can be easily separated, and The possibility that the material for forming the porous film 200 adheres to the microstructure of the stamp can be reduced, and the manufacturing yield of the porous film 200 can be improved and the business waste can be reduced. In addition, the obtuse angle θ4 between the second inclined surface 242 and the third inclined surface 243 can reduce the fluid flow when the fluid flows from the first surface 101 to the second surface 102 through the through-hole 210 to the second surface 102 and out of the through-hole 210 Turbulence, but can improve the flow rate or outflow efficiency of the fluid.

4 is a schematic partial cross-sectional view of a porous film 300 according to a third embodiment of the present invention. Specifically, FIG. 4 may be a schematic cross-sectional view of one of the through holes 310 and the vicinity of the through holes 310 of the porous film 300.

2F and FIG. 4 at the same time, the porous film 300 of this embodiment is similar to the porous film 100 of the first embodiment, the difference is that the inclined surface 341 of the side wall 340 of the through hole 310 may be a plane. In terms of the physical structure of the porous film 300, the angle θ1 between the inclined surface 341 of the side wall 340 and the first surface 101 is an obtuse angle, and the angle θ3 between the inclined surface 341 of the side wall 340 and the second surface 102 is an acute angle. In other words, in a cross-sectional view, the slope of the side wall 340 of the through hole 310 is not perpendicular to the first surface 101 or the second surface 102. In this way, during the manufacturing process of the porous film 300, the microstructure (eg, the microstructure 31 similar to FIG. 2C) of the stamp (eg, similar to the stamp 30 of FIG. 2C) can be easily separated, and The possibility that the material for forming the porous film 300 adheres to the microstructure of the stamp can be reduced, and the manufacturing yield of the porous film 300 can be improved and the business waste can be reduced.

In summary, the manufacturing method of the porous film of the present invention can be relatively simple, and the porous film can have a better yield.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100, 200, 00: porous film 101: first surface 102: second surface 103: side 104: film thickness 110, 210: through hole 120: first opening 121: first aperture 130: second opening 131: Second aperture 140, 240, 340: side walls 141, 241: first slope 341: slope 142, 242: second slope 243: third slope 150: pitch 10: carrier 20: adhesive layer 21: thickness 30: impression 31: Microstructure 32: Side 33: Bottom 34: Thickness 40: Cured film θ1, θ2, θ3, θ4: Included angle L: Light rays S1, S2, S3, S4: Step of manufacturing method of porous film R: Area

FIG. 1 is a schematic flowchart of a method for manufacturing a porous film according to the first embodiment of the present invention. 2A to 2D are schematic cross-sectional views of a method for manufacturing a porous film according to the first embodiment of the present invention. 2E is a schematic partial cross-sectional view of a porous film according to the first embodiment of the present invention. FIG. 2F is an enlarged schematic view of the region R in FIG. 2E. 2G is a schematic top view of a porous film according to the first embodiment of the present invention. 3 is a schematic partial cross-sectional view of a porous film according to a second embodiment of the present invention. 4 is a schematic partial cross-sectional view of a porous film according to a third embodiment of the present invention.

S1, S2, S3, S4: the steps of the method of making porous film

Claims (10)

A method for manufacturing a porous film, comprising: providing an adhesive layer on a carrier board, wherein the adhesive layer includes at least a photocurable material and/or a thermosetting material; and pressing the adhesive layer on the carrier board with a stamp, And in a state where the stamp is in contact with the adhesive layer on the carrier board, curing the adhesive layer on the carrier board to form a cured film, and the cured film has a plurality of through holes; and separating the stamp and The carrier board covering the cured film. The method for manufacturing a porous film as described in item 1 of the patent application, wherein the material of the adhesive layer includes a photo-curable material, and the adhesive layer is cured on the carrier board by irradiating light comprehensively. The method for manufacturing a porous film as described in item 2 of the patent application range, wherein the photocurable material is ultraviolet glue, and the light includes ultraviolet light. The method for manufacturing a porous film as described in item 1 of the patent application range, wherein the stamp includes a plurality of microstructures, and the thickness of the microstructures is equal to or greater than the thickness of the adhesive layer on the carrier board. A porous film having a plurality of through holes, the porous film includes: a first surface; and a second surface opposite to the first surface, and the through holes penetrate the first surface and the second surface , And a first aperture of the through holes on the first surface is substantially larger than a second aperture on the second surface. The porous film as claimed in item 5 of the patent application, wherein each of the through holes has a side wall connecting the first surface and the second surface, the side wall includes at least a first inclined surface and connecting the first inclined surface A second inclined surface, the angle between the first inclined surface and the second inclined surface is an excellent angle. The porous film according to item 6 of the patent application scope, wherein the side wall further includes a third inclined surface connected to the second inclined surface, the second inclined surface is located between the first inclined surface and the third inclined surface, and the The angle between the second slope and the third slope is an obtuse angle. The porous film as described in item 5 of the patent application range, wherein the porous film has a film thickness, and the ratio of the first pore diameter to the film thickness is between 1:5 and 3:25. The porous film as described in item 5 of the patent application range, wherein the porous film has a film thickness, any two adjacent through-holes have a spacing on the first surface, and the spacing and the film thickness The ratio is between 1:5 and 5:1, and/or the spacing is between 0.01mm and 0.25mm. The porous film as described in item 5 of the patent application range, wherein the porous film has a film thickness, and the film thickness is between 15 μm and 100 μm.

Images