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TW202000830A - Reinforcing film - Google Patents

Reinforcing film Download PDF

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Publication number
TW202000830A
TW202000830A TW108122529A TW108122529A TW202000830A TW 202000830 A TW202000830 A TW 202000830A TW 108122529 A TW108122529 A TW 108122529A TW 108122529 A TW108122529 A TW 108122529A TW 202000830 A TW202000830 A TW 202000830A
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adhesive layer
light
photo
weight
adhesive
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TW108122529A
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Chinese (zh)
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TWI847986B (en
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仲野武史
片岡賢一
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/06Printing inks based on fatty oils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

A reinforcing film (10) which comprises a film base (1) and a pressure-sensitive adhesive layer (2) tenaciously bonded to one main surface of the film base (1). The pressure-sensitive adhesive layer has been formed from a photocurable composition comprising a base polymer, a photocuring agent, a photo-radical initiator, and an antioxidant, the amounts of the photocuring agent, photo-radical initiator, and antioxidant being 10-50 parts by weight, 0.01-1 part by weight, and 0.01-2 parts by weight, respectively, per 100 parts by weight of the base polymer. In the reinforcing film of the present invention, the period from application to an adherend to an improvement in adhesive force can be set at will.

Description

補強膜Reinforcement membrane

本發明係關於一種黏貼設置於裝置表面之補強膜。The invention relates to a reinforcing film pasted on the surface of a device.

於顯示器等光學裝置或電子裝置之表面,存在為了表面保護或耐衝擊性賦予等而貼合黏著性膜之情況。此種黏著性膜通常係於膜基材之主面固著積層黏著劑層,且經由該黏著劑層貼合於裝置表面。On the surface of an optical device such as a display or an electronic device, an adhesive film may be attached for surface protection or impact resistance. Such an adhesive film is usually fixed on the main surface of the film substrate with a build-up adhesive layer, and is adhered to the surface of the device through the adhesive layer.

於裝置之組裝、加工、輸送等使用前之狀態下,可藉由於裝置或裝置構成零件之表面暫黏黏著性膜而抑制被黏著體之損傷或破損。如此為了暫時性地保護表面而暫黏之黏著性膜可容易地自被黏著體剝離,且不產生向被黏著體之糊劑殘留。In the state before assembly, processing, transportation, etc. of the device, it is possible to suppress the damage or damage of the adherend by temporarily sticking the adhesive film on the surface of the device or the component parts of the device. In this way, the temporarily adhered adhesive film can be easily peeled off from the adherend to temporarily protect the surface, and no paste remains on the adherend.

於專利文獻1中揭示有一種黏著性膜,其除裝置之組裝、加工、輸送等以外,於裝置之使用時亦於貼合於裝置表面不變之狀態下使用。此種黏著性膜由於表面保護、以及對裝置之衝擊之分散、對撓性裝置之剛性賦予等而具有對裝置進行補強之功能。Patent Document 1 discloses an adhesive film which, in addition to device assembly, processing, transportation, etc., is used while the device is attached to the device surface without changing. Such an adhesive film has a function of reinforcing the device due to surface protection, dispersion of impact on the device, imparting rigidity to the flexible device, etc.

於將黏著性膜貼合於被黏著體時,存在產生氣泡之混入或黏貼位置之偏移等貼合不良之情況。於產生貼合不良之情形時,進行如下作業(二次加工):自被黏著體將黏著性膜剝離並貼合另一黏著性膜。用作工程材料之黏著性膜由於係以自被黏著體之剝離為前提進行設計,因此容易二次加工。另一方面,以永久接著為前提之補強膜一般而言不假定自裝置剝離而是牢固地接著於裝置之表面,因此難以二次加工。When attaching the adhesive film to the adherend, there may be a poor bonding such as the mixing of bubbles or the deviation of the sticking position. When a poor bonding occurs, the following operation (secondary processing) is carried out: the adhesive film is peeled off from the adherend and another adhesive film is bonded. Adhesive films used as engineering materials are designed on the premise of peeling from the adherend, so they are easy to reprocess. On the other hand, a reinforcing film that is premised on permanent adhesion generally does not assume peeling from the device but is firmly adhered to the surface of the device, so it is difficult to perform secondary processing.

專利文獻2中揭示有一種以剛與被黏著體貼合後為低黏著性且接著力經時性地上升之方式而設計的黏著片(黏著劑層)。於膜基材上固著積層有此種黏著劑層之黏著性膜由於剛與被黏著體貼合後容易自被黏著體剝離且於經過特定時間後牢固地接著於被黏著體,因此可作為具有二次加工性之補強膜而利用。 [先前技術文獻] [專利文獻]Patent Document 2 discloses an adhesive sheet (adhesive layer) designed in such a manner that it has low adhesiveness immediately after being bonded to the adherend and then the force rises with time. The adhesive film with such an adhesive layer fixed on the film substrate is easily peeled off from the adhesive body immediately after being bonded to the adherend and firmly adheres to the adherend after a certain period of time, so it can be regarded as having It is used to reinforce the secondary processability. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開2017-132977號公報 [專利文獻2]WO2015/163115號說明書[Patent Document 1] Japanese Patent Laid-Open No. 2017-132977 [Patent Literature 2] WO2015/163115 Specification

[發明所欲解決之問題][Problems to be solved by the invention]

關於與被黏著體之接著力經時性地變化之補強膜,很難說對步驟之準備時間(lead time)之靈活性是充分的。例如,接著力經時性地上升之具備黏著劑層之補強膜必須於與被黏著體之貼合後至接著力上升之前之特定時間內實施貼合狀態之檢查及二次加工。又,於在裝置或裝置零件之整個面貼合補強膜之後進行自一部分區域將補強膜去除等加工之情形時,必須於接著力上升之前之期間進行加工。Regarding the reinforcing film whose adhesive force with the adherend changes with time, it is difficult to say that the flexibility of the lead time of the step is sufficient. For example, a reinforcing film with an adhesive layer whose adhesive force rises with time must be inspected for a bonded state and a secondary process within a specific time after bonding with the adherend to before the adhesive force increases. In addition, when processing such as removing the reinforcing film from a part of the area after attaching the reinforcing film to the entire surface of the device or device parts, it is necessary to perform processing before the adhesive force rises.

鑒於上述情況,本發明之目的在於提供一種剛與被黏著體貼合後容易二次加工、可任意地設定與被黏著體之貼合後至接著力提昇前之時間、且藉由接著力提昇可與被黏著體牢固地接著的補強膜。 [解決問題之技術手段]In view of the above circumstances, the object of the present invention is to provide an easy secondary processing immediately after being bonded to the adherend, the time after the bonding with the adherend can be set arbitrarily until the adhesion force is improved, and the adhesion force can be improved by Reinforcement membrane firmly adhered to the adherend. [Technical means to solve the problem]

本發明之補強膜具備固著積層於膜基材之一主面上之黏著劑層。黏著劑層包含含有基礎聚合物、光硬化劑、光自由基起始劑及抗氧化劑之光硬化性組合物。構成黏著劑層之光硬化性組合物較佳為相對於基礎聚合物100重量份包含光硬化劑10~50重量份、光自由基起始劑0.01~1重量份、抗氧化劑0.01~2重量份。光硬化性組合物中之抗氧化劑之含量較佳為光自由基起始劑之含量之0.2~5倍。The reinforcing film of the present invention includes an adhesive layer fixedly deposited on one main surface of the film substrate. The adhesive layer includes a photo-curable composition containing a base polymer, a photo-hardener, a photo-radical initiator, and an antioxidant. The photocurable composition constituting the adhesive layer preferably contains 10 to 50 parts by weight of a photohardener, 0.01 to 1 part by weight of a photoradical initiator, and 0.01 to 2 parts by weight of an antioxidant with respect to 100 parts by weight of the base polymer. . The content of the antioxidant in the photocurable composition is preferably 0.2 to 5 times the content of the photo radical initiator.

就抑制由螢光燈等之光引起自光自由基起始劑生成自由基之觀點而言,作為光自由基起始劑,可較佳地使用於波長310 nm~355 nm之範圍具有吸收極大且於長於360 nm之波長不顯示吸收極大者。From the viewpoint of suppressing the generation of free radicals from light radical initiators caused by light from fluorescent lamps, etc., as light radical initiators, it can be preferably used in the wavelength range of 310 nm to 355 nm, And the wavelengths longer than 360 nm do not show maximum absorption.

作為黏著劑層之基礎聚合物,例如可使用丙烯酸系聚合物。丙烯酸系聚合物較佳為含有均聚物之玻璃轉移溫度為40℃以上之單體成分5~50重量%。As the base polymer of the adhesive layer, for example, an acrylic polymer can be used. The acrylic polymer is preferably 5 to 50% by weight of a monomer component containing a homopolymer and having a glass transition temperature of 40° C. or higher.

黏著劑層之基礎聚合物中較佳為導入有交聯結構。例如,基礎聚合物含有含羥基單體及/或含羧基單體作為單體單元,且藉由多官能異氰酸酯化合物或多官能環氧化合物等交聯劑與該等之官能基鍵結而被導入交聯結構。The base polymer of the adhesive layer is preferably introduced with a cross-linked structure. For example, the base polymer contains a hydroxyl group-containing monomer and/or a carboxyl group-containing monomer as a monomer unit, and is introduced by bonding such functional groups with a cross-linking agent such as a polyfunctional isocyanate compound or a polyfunctional epoxy compound Cross-linked structure.

黏著劑層之光硬化劑例如為多官能(甲基)丙烯酸酯。光硬化劑之官能基當量較佳為100~500 g/eq左右。The light hardener of the adhesive layer is, for example, multifunctional (meth)acrylate. The functional group equivalent of the light hardener is preferably about 100 to 500 g/eq.

補強膜較佳為與聚醯亞胺膜之接著力為0.005~5 N/25 mm。於使黏著劑層光硬化後,較佳為補強膜與聚醯亞胺膜之接著力為6 N/25 mm以上。 [發明之效果]The reinforcing film preferably has an adhesive force with the polyimide film of 0.005 to 5 N/25 mm. After photocuring the adhesive layer, it is preferable that the adhesive force between the reinforcing film and the polyimide film is 6 N/25 mm or more. [Effect of invention]

本發明之補強膜係藉由使黏著劑層包含光硬化性組合物且於與被黏著體之接著後使黏著劑層進行光硬化,而使與被黏著體之接著力上升。由於光硬化前與被黏著體之接著力較小,因此容易二次加工,且由於光硬化後會表現出較高之接著力,因此有助於裝置之補強及可靠性之提昇。光硬化性之黏著劑可任意地設定與被黏著體貼合後之硬化之時點。又,黏著劑組合物藉由除了基礎聚合物、光硬化劑及光自由基起始劑以外含有抗氧化劑,從而抑制保管環境下之起因於螢光燈等之光之光硬化反應。因此,於與被黏著體貼合前、及與被黏著體貼合後且光硬化前之狀態下,補強膜能夠長時間保管。因此,本發明之補強膜具有可靈活地應對步驟之準備時間之優勢。The reinforcing film of the present invention includes the photocurable composition in the adhesive layer and photocuring the adhesive layer after being adhered to the adherend, thereby increasing the adhesion to the adherend. Since the adhesive force between the light-hardened body and the adherend is small, it is easy to perform secondary processing, and since the light-hardened material will show a higher adhesive force, it will help to reinforce the device and improve the reliability. The photohardenable adhesive can be arbitrarily set at the time of hardening after being attached to the adherend. In addition, the adhesive composition contains an antioxidant in addition to the base polymer, the light hardener, and the light radical initiator, thereby suppressing the light hardening reaction caused by light such as a fluorescent lamp in a storage environment. Therefore, the reinforcing film can be stored for a long time in a state before being bonded to the adherend, and after being bonded to the adherend and before photocuring. Therefore, the reinforcing film of the present invention has the advantage that it can flexibly cope with the preparation time of the steps.

圖1係表示補強膜之一實施形態之剖視圖。補強膜10於膜基材1之一主面上具備黏著劑層2。黏著劑層2固著積層於基材膜1之一主面上。黏著劑層2係包含光硬化性組合物之光硬化性黏著劑,且藉由紫外線等活性光線之照射進行硬化,從而與被黏著體之接著力上升。Fig. 1 is a cross-sectional view showing an embodiment of a reinforcing film. The reinforcing film 10 includes an adhesive layer 2 on one main surface of the film base 1. The adhesive layer 2 is fixedly laminated on one main surface of the base film 1. The adhesive layer 2 is a photo-curable adhesive containing a photo-curable composition, and is cured by irradiation with active light such as ultraviolet rays, so that the adhesive force with the adherend increases.

圖2係於黏著劑層2之主面上暫黏有隔離件5之補強膜之剖視圖。圖3係表示於裝置20之表面黏貼設置有補強膜10之狀態之剖視圖。FIG. 2 is a cross-sectional view of a reinforcing film with a spacer 5 temporarily adhered to the main surface of the adhesive layer 2. FIG. 3 is a cross-sectional view showing a state where the reinforcing film 10 is attached to the surface of the device 20.

自黏著劑層2之表面將隔離件5剝離去除,將黏著劑層2之露出面貼合於裝置20之表面,藉此於裝置20之表面黏貼設置補強膜10。該狀態係黏著劑層2為光硬化前且於裝置20上暫黏有補強膜10(黏著劑層2)之狀態。藉由使黏著劑層2進行光硬化,而使於裝置20與黏著劑層2之界面之接著力上升,使裝置20與補強膜10固著。The separator 5 is peeled off from the surface of the adhesive layer 2, and the exposed surface of the adhesive layer 2 is attached to the surface of the device 20, whereby the reinforcing film 10 is attached to the surface of the device 20. In this state, the adhesive layer 2 is in a state where the reinforcing film 10 (adhesive layer 2) is temporarily adhered to the device 20 before photocuring. By photohardening the adhesive layer 2, the adhesive force at the interface between the device 20 and the adhesive layer 2 increases, and the device 20 and the reinforcing film 10 are fixed.

所謂「固著」,係指所積層之2層牢固地接著、不可能或難以於兩者之界面剝離之狀態。所謂「暫黏」,係指所積層之2層間之接著力較小、可容易地於兩者之界面剝離之狀態。The so-called "fixation" refers to a state where the two stacked layers are firmly adhered, impossible or difficult to peel at the interface between the two. The so-called "temporary adhesion" refers to a state where the adhesion between the two layers deposited is small and can be easily peeled off at the interface between the two.

圖2所示之補強膜中,膜基材1與黏著劑層2固著,且隔離件5暫黏於黏著劑層2。若將膜基材1與隔離件5進行剝離,則於黏著劑層2與隔離件5之界面產生剝離,維持膜基材1上固著有黏著劑層2之狀態。於剝離後之隔離件5上不會殘存黏著劑。In the reinforcing film shown in FIG. 2, the film substrate 1 is fixed to the adhesive layer 2, and the separator 5 is temporarily adhered to the adhesive layer 2. When the film substrate 1 and the separator 5 are peeled off, peeling occurs at the interface between the adhesive layer 2 and the separator 5, and the state where the adhesive layer 2 is fixed on the film substrate 1 is maintained. No adhesive remains on the separator 5 after peeling.

圖3所示之黏貼設置有補強膜10之裝置於黏著劑層2之光硬化前,裝置20與黏著劑層2為暫黏狀態。若對膜基材1與裝置20進行剝離,則於黏著劑層2與裝置20之界面產生剝離,維持膜基材1上固著有黏著劑層2之狀態。由於在裝置20上不會殘存黏著劑,故而容易二次加工。於使黏著劑層2光硬化後,由於黏著劑層2與裝置20之接著力上升,故而難以自裝置20剝離膜1,若將兩者剝離,則存在產生黏著劑層2之凝集破壞之情況。In the device shown in FIG. 3 where the reinforcing film 10 is attached, before the photocuring of the adhesive layer 2, the device 20 and the adhesive layer 2 are temporarily bonded. When the film substrate 1 and the device 20 are peeled off, peeling occurs at the interface between the adhesive layer 2 and the device 20, and the state where the adhesive layer 2 is fixed on the film substrate 1 is maintained. Since no adhesive remains on the device 20, secondary processing is easy. After the adhesive layer 2 is photohardened, the adhesion between the adhesive layer 2 and the device 20 increases, so it is difficult to peel off the film 1 from the device 20. If the two are peeled off, there may be agglomeration failure of the adhesive layer 2 .

[膜基材] 作為膜基材1,使用塑膠膜。為了使膜基材1及黏著劑層2固著,較佳為膜基材1之附設黏著劑層2之面未實施過脫模處理。[Film substrate] As the film base 1, a plastic film is used. In order to fix the film substrate 1 and the adhesive layer 2, it is preferable that the surface of the film substrate 1 on which the adhesive layer 2 is attached has not been subjected to release treatment.

膜基材之厚度例如為4~500 μm左右。就藉由剛性賦予或衝擊緩和等對裝置進行補強之觀點而言,膜基材1之厚度較佳為20 μm以上,更佳為30 μm以上,進而較佳為45 μm以上。就使補強膜具有可撓性從而提高操作性之觀點而言,膜基材1之厚度較佳為300 μm以下,更佳為200 μm以下。就兼顧機械強度及可撓性之觀點而言,膜基材1之壓縮強度較佳為100~3000 kg/cm2 ,更佳為200~2900 kg/cm2 ,進而較佳為300~2800 kg/cm2 ,尤佳為400~2700 kg/cm2The thickness of the film substrate is, for example, about 4 to 500 μm. From the viewpoint of reinforcing the device by imparting rigidity or impact relaxation, the thickness of the film substrate 1 is preferably 20 μm or more, more preferably 30 μm or more, and still more preferably 45 μm or more. From the viewpoint of making the reinforcing film flexible and improving operability, the thickness of the film substrate 1 is preferably 300 μm or less, and more preferably 200 μm or less. From the viewpoint of both mechanical strength and flexibility, the compressive strength of the film substrate 1 is preferably 100 to 3000 kg/cm 2 , more preferably 200 to 2900 kg/cm 2 , and further preferably 300 to 2800 kg /cm 2 , particularly preferably 400-2700 kg/cm 2 .

作為構成膜基材1之塑膠材料,可列舉聚酯系樹脂、聚烯烴系樹脂、環狀聚烯烴系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂等。於顯示器等光學裝置用之補強膜中,膜基材1較佳為透明膜。又,於自膜基材1側照射活性光線進行黏著劑層2之光硬化之情形時,膜基材1較佳為具有對黏著劑層之硬化所使用之活性光線之透明性。就兼備機械強度及透明性而言,可良好地使用聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯系樹脂。於自被黏著體側照射活性光線之情形時,被黏著體具有對活性光線之透明性即可,膜基材1對活性光線可不透明。Examples of the plastic material constituting the film substrate 1 include polyester-based resins, polyolefin-based resins, cyclic polyolefin-based resins, polyamide-based resins, and polyimide-based resins. In the reinforcing film for optical devices such as displays, the film substrate 1 is preferably a transparent film. In addition, when the active light is irradiated from the film substrate 1 side to perform photo-curing of the adhesive layer 2, the film substrate 1 preferably has transparency to the active light used for curing the adhesive layer. In terms of having both mechanical strength and transparency, polyester-based resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate can be used favorably. When the active light is irradiated from the side of the adherend, the adherend only needs to have transparency to the active light, and the film substrate 1 may be opaque to the active light.

於膜基材1之表面亦可設置易接著層、易滑層、脫模層、抗靜電層、硬塗層、抗反射層等功能性塗層。再者,如上所述,為了使膜基材1及黏著劑層2固著,於膜基材1之附設黏著劑層2之面較佳為未設置脫模層。On the surface of the film substrate 1, functional coatings such as an easy adhesion layer, an easy sliding layer, a release layer, an antistatic layer, a hard coating layer, and an antireflection layer can also be provided. In addition, as described above, in order to fix the film substrate 1 and the adhesive layer 2, it is preferable that no release layer is provided on the surface of the film substrate 1 where the adhesive layer 2 is attached.

[黏著劑層] 固著積層於膜基材1上之黏著劑層2係包含基礎聚合物、光硬化劑及光自由基起始劑之光硬化性組合物。於補強膜用於顯示器等光學裝置之情形時,黏著劑層2之全光線透過率較佳為80%以上,更佳為85%以上,進而較佳為90%以上。黏著劑層2之霧度較佳為2%以下,更佳為1%以下,進而較佳為0.7%以下,尤佳為0.5%以下。[Adhesive layer] The adhesive layer 2 fixedly laminated on the film substrate 1 is a photo-curable composition containing a base polymer, a photo-hardener and a photo-radical initiator. When the reinforcing film is used in an optical device such as a display, the total light transmittance of the adhesive layer 2 is preferably 80% or more, more preferably 85% or more, and still more preferably 90% or more. The haze of the adhesive layer 2 is preferably 2% or less, more preferably 1% or less, and further preferably 0.7% or less, particularly preferably 0.5% or less.

黏著劑層2由於光硬化前與被黏著體之接著力較小,故而容易二次加工。若對黏著劑層2照射紫外線等活性光線,則自光自由基起始劑生成自由基,藉由光硬化劑之自由基聚合反應(光硬化)而提昇與被黏著體之接著力。因此,於使用裝置時,補強膜不易自裝置表面剝離,接著可靠性優異。The adhesive layer 2 has a low adhesive force with the adherend before photo-hardening, so it is easy to perform secondary processing. When the adhesive layer 2 is irradiated with active light such as ultraviolet rays, free radicals are generated from the light radical initiator, and the adhesion with the adherend is improved by the radical polymerization reaction (photohardening) of the light hardener. Therefore, when the device is used, the reinforcing film is not easily peeled off from the device surface, and the reliability is excellent.

光硬化性之黏著劑藉由紫外線等之照射進行硬化。因此,包含光硬化性之黏著劑組合物之黏著劑層2具有可任意地設定硬化之時點、可靈活地應對步驟之準備時間等之優勢。另一方面,於補強膜之使用前、或將補強膜與被黏著體貼合後進行光硬化前之狀態下,存在因保管環境中之來自螢光燈等之光而自光自由基起始劑生成自由基之情況。The light-curing adhesive is cured by irradiation with ultraviolet rays or the like. Therefore, the adhesive layer 2 containing the photo-curable adhesive composition has advantages such that the time of curing can be set arbitrarily, and the preparation time for the steps can be flexibly handled. On the other hand, before the use of the reinforcing film or the state where the reinforcing film is adhered to the adherend before photocuring, there is a free radical initiator due to light from a fluorescent lamp or the like in the storage environment The generation of free radicals.

由於由螢光燈等之光引起之自由基之生成量充分地小於由光硬化時之紫外線照射引起之自由基生成量,因此即便於螢光燈下短時間放置,亦幾乎不會進行光硬化反應。然而,若將補強膜於螢光燈下長時間保管,則存在因螢光燈之光而自光自由基起始劑生成之自由基之累計量變大,其影響不可忽視之情況。具體而言,存在因自光自由基起始劑生成之自由基而進行光硬化劑之聚合,黏著劑之接著力上升,補強膜難以自被黏著體剝離之情況。又,存在起因於因長時間之保管引起之光自由基起始劑之失活,即便照射紫外線亦不會進行光硬化,接著力不會上升之情況。Since the amount of free radicals generated by light such as fluorescent lamps is sufficiently smaller than the amount of free radicals generated by ultraviolet irradiation during light curing, even if placed under a fluorescent lamp for a short time, it will hardly undergo photohardening reaction. However, if the reinforcing film is stored under a fluorescent lamp for a long period of time, the cumulative amount of free radicals generated from the light radical initiator due to the light of the fluorescent lamp becomes large, and its influence cannot be ignored. Specifically, there is a case where the polymerization of the photo hardener is performed due to the free radicals generated from the photo radical initiator, and the adhesion of the adhesive increases, making it difficult for the reinforcing film to peel from the adherend. In addition, there may be a case where the photoradical initiator is deactivated due to long-term storage, and the photo hardening will not be performed even if it is irradiated with ultraviolet rays, and the adhesive force may not increase.

關於本發明之補強膜,構成黏著劑層2之光硬化性組合物除基礎聚合物、光硬化劑及光自由基起始劑以外,包含抗氧化劑。藉由將光自由基起始劑與抗氧化劑並用,即便於將補強膜於螢光燈下長時間保管之情形時,接著力之變化亦較小,且於光照射時能夠適當地使接著力上升。Regarding the reinforcing film of the present invention, the photocurable composition constituting the adhesive layer 2 contains an antioxidant in addition to the base polymer, the photohardener and the photoradical initiator. By using a photo radical initiator and an antioxidant together, even when the reinforcing film is stored under a fluorescent lamp for a long time, the change in the adhesive force is also small, and the adhesive force can be appropriately made during light irradiation rise.

<黏著劑之組成> 以下,針對構成光硬化性組合物之基礎聚合物、光硬化劑、光自由基起始劑及抗氧化劑之各者,依序說明較佳之形態。<Composition of adhesive> Hereinafter, the preferred form will be described in order for each of the base polymer, the photo hardener, the photo radical initiator and the antioxidant constituting the photo hardenable composition.

(基礎聚合物) 基礎聚合物係黏著劑組合物之主構成成分。基礎聚合物之種類並無特別限定,適當地選擇丙烯酸系聚合物、聚矽氧系聚合物、胺基甲酸酯系聚合物、橡膠系聚合物等即可。尤其是就光學透明性及接著性優異、且接著性之控制容易之方面而言,黏著劑組合物較佳為含有丙烯酸系聚合物作為基礎聚合物,且較佳為黏著劑組合物之50重量%以上為丙烯酸系聚合物。(Base polymer) The base polymer is the main component of the adhesive composition. The type of base polymer is not particularly limited, and an acrylic polymer, a polysiloxane polymer, a urethane polymer, a rubber polymer, etc. may be appropriately selected. In particular, in terms of excellent optical transparency and adhesion, and easy control of adhesion, the adhesive composition preferably contains an acrylic polymer as a base polymer, and preferably 50 weight of the adhesive composition % Or more is acrylic polymer.

作為丙烯酸系聚合物,可較佳地使用包含(甲基)丙烯酸烷基酯作為主要單體成分者。再者,於本說明書中,「(甲基)丙烯酸」意指丙烯酸及/或甲基丙烯酸。As the acrylic polymer, those containing alkyl (meth)acrylate as the main monomer component can be preferably used. In addition, in this specification, "(meth)acrylic acid" means acrylic acid and/or methacrylic acid.

作為(甲基)丙烯酸烷基酯,可良好地使用烷基之碳數為1~20之(甲基)丙烯酸烷基酯。(甲基)丙烯酸烷基酯之烷基可為直鏈亦可具有支鏈。作為(甲基)丙烯酸烷基酯之例,可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異三(十二烷基)酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸芳烷基酯等。As the (meth)acrylic acid alkyl ester, an alkyl (meth)acrylate having 1 to 20 carbon atoms of the alkyl group can be suitably used. The alkyl group of the (meth)acrylic acid alkyl ester may be straight chain or may have branched chain. Examples of alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, (meth ) Second butyl acrylate, third butyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, neopentyl (meth) acrylate, hexyl (meth) acrylate , Heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, (meth) Isononyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, iso(meth)acrylate Tri (dodecyl) ester, myristyl (meth) acrylate, isotetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate Alkyl, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, isooctadecyl (meth)acrylate, nonadecyl (meth)acrylate, (A Group) aralkyl acrylate, etc.

關於(甲基)丙烯酸烷基酯之含量,相對於構成基礎聚合物之單體成分總量較佳為40重量%以上,更佳為50重量%以上,進而較佳為55重量%以上。The content of the alkyl (meth)acrylate is preferably 40% by weight or more, more preferably 50% by weight or more, and further preferably 55% by weight or more with respect to the total amount of monomer components constituting the base polymer.

丙烯酸系基礎聚合物較佳為含有具有可交聯之官能基之單體成分作為共聚成分。作為具有可交聯之官能基之單體,可列舉含羥基單體、或含羧基單體。基礎聚合物之羥基或羧基成為與後述交聯劑之反應點。例如,於使用異氰酸酯系交聯劑之情形時,較佳為含有含羥基單體作為基礎聚合物之共聚成分。於使用環氧系交聯劑之情形時,較佳為含有含羧基單體作為基礎聚合物之共聚成分。藉由於基礎聚合物中導入交聯結構,存在凝集力提昇,黏著劑層2之接著力提昇,並且二次加工時之於被黏著體之糊劑殘留減少的傾向。The acrylic base polymer preferably contains a monomer component having a crosslinkable functional group as a copolymerization component. Examples of the monomer having a crosslinkable functional group include a hydroxyl group-containing monomer or a carboxyl group-containing monomer. The hydroxyl group or carboxyl group of the base polymer becomes a reaction point with the crosslinking agent described later. For example, when an isocyanate-based crosslinking agent is used, it is preferably a copolymerization component containing a hydroxyl group-containing monomer as a base polymer. When an epoxy-based crosslinking agent is used, it is preferably a copolymerization component containing a carboxyl group-containing monomer as a base polymer. Due to the introduction of the cross-linked structure in the base polymer, there is a tendency for the cohesive force to increase, the adhesive force of the adhesive layer 2 to increase, and the paste residue on the adherend during secondary processing to decrease.

作為含羥基單體,可列舉(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸4-(羥甲基)環己基甲酯等。作為含羧基單體,可列舉(甲基)丙烯酸、(甲基)丙烯酸2-羧基乙酯、(甲基)丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等。Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 6-hydroxyhexyl (meth)acrylate. Ester, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)cyclohexylmethyl (meth)acrylate Ester etc. Examples of carboxyl group-containing monomers include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, Butenoic acid and so on.

關於丙烯酸系基礎聚合物,含羥基單體與含羧基單體之合計量相對於構成單體成分總量較佳為1~30重量%,更佳為3~25重量%,進而較佳為5~20重量%。尤佳為包含羥基之(甲基)丙烯酸酯之含量為上述範圍。Regarding the acrylic base polymer, the total amount of the hydroxyl group-containing monomer and the carboxyl group-containing monomer is preferably 1 to 30% by weight, more preferably 3 to 25% by weight, and further preferably 5 ~20% by weight. It is particularly preferable that the content of the (meth)acrylate containing hydroxyl groups falls within the above range.

丙烯酸系基礎聚合物較佳為含有N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-丙烯醯基𠰌啉、N-乙烯基羧酸醯胺類、N-乙烯基己內醯胺等含氮單體作為構成單體成分。含有含氮單體成分之丙烯酸系基礎聚合物由於在濕熱環境下表現出適度之吸水性且可抑制黏著劑之局部性吸水,因此有助於防止黏著劑層之局部性變白、局部膨潤、剝離等。The acrylic base polymer preferably contains N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidine, vinylpyrrolidone, vinyl Nitrogen-containing monomers such as pyrrole, vinylimidazole, vinyl oxazole, vinyl 𠰌olin, N-propenyl amide, N-vinyl carboxylic acid amides, N-vinyl caprolactam Monomer composition. The acrylic base polymer containing the nitrogen-containing monomer component exhibits moderate water absorption in a hot and humid environment and can suppress the localized water absorption of the adhesive. Therefore, it helps prevent localized whitening and local swelling of the adhesive layer. Stripping etc.

關於丙烯酸系基礎聚合物,含氮單體之含量相對於構成單體成分總量較佳為1~30重量%,更佳為3~25重量%,進而較佳為5~20重量%。丙烯酸系基礎聚合物較佳為於上述範圍內含有N-乙烯基吡咯啶酮作為含氮單體。Regarding the acrylic base polymer, the content of the nitrogen-containing monomer relative to the total amount of constituent monomer components is preferably 1 to 30% by weight, more preferably 3 to 25% by weight, and still more preferably 5 to 20% by weight. The acrylic base polymer preferably contains N-vinylpyrrolidone as a nitrogen-containing monomer within the above range.

於丙烯酸系基礎聚合物包含含羥基單體及含氮單體之兩者作為單體成分之情形時,存在可提高黏著劑之凝集力及透明性之傾向。關於丙烯酸系基礎聚合物,含羥基單體與含氮單體之合計量相對於構成單體成分總量較佳為5~50重量%,更佳為10~40重量%,進而較佳為15~35重量%。When the acrylic base polymer contains both a hydroxyl group-containing monomer and a nitrogen-containing monomer as monomer components, there is a tendency to improve the cohesive force and transparency of the adhesive. Regarding the acrylic base polymer, the total amount of the hydroxyl group-containing monomer and the nitrogen-containing monomer is preferably 5 to 50% by weight, more preferably 10 to 40% by weight, and further preferably 15 ~35 wt%.

丙烯酸系基礎聚合物亦可包含除上述以外之單體成分。丙烯酸系基礎聚合物例如亦可包含含氰基單體、乙烯酯單體、芳香族乙烯基單體、含環氧基單體、乙烯醚單體、含磺基單體、含磷酸基單體、含酸酐基單體等作為單體成分。The acrylic base polymer may contain monomer components other than the above. The acrylic base polymer may also include, for example, cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers, epoxy group-containing monomers, vinyl ether monomers, sulfo group-containing monomers, phosphoric acid group-containing monomers , Monomers containing acid anhydride groups, etc. as monomer components.

光硬化前之黏著劑之接著特性容易受基礎聚合物之構成成分及分子量影響。有基礎聚合物之分子量越大則黏著劑變得越硬之傾向。丙烯酸系基礎聚合物之重量平均分子量較佳為10萬~500萬,更佳為30萬~300萬,進而較佳為50萬~200萬。再者,於向基礎聚合物中導入交聯結構之情形時,所謂基礎聚合物之分子量,係指交聯結構導入前之分子量。The adhesive properties of the adhesive before photohardening are easily affected by the composition and molecular weight of the base polymer. The larger the molecular weight of the base polymer, the harder the adhesive becomes. The weight average molecular weight of the acrylic base polymer is preferably 100,000 to 5 million, more preferably 300,000 to 3 million, and still more preferably 500,000 to 2 million. In addition, when a cross-linked structure is introduced into the base polymer, the molecular weight of the base polymer refers to the molecular weight before introduction of the cross-linked structure.

有基礎聚合物之構成成分中之高Tg單體成分之含量越多則黏著劑變得越硬之傾向。再者,所謂高Tg單體,意指均聚物之玻璃轉移溫度(Tg)較高之單體。作為均聚物之Tg為40℃以上之單體,可列舉:甲基丙烯酸雙環戊酯(Tg:175℃)、丙烯酸雙環戊酯(Tg:120℃)、甲基丙烯酸異𦯉酯(Tg:173℃)、丙烯酸異𦯉酯(Tg:97℃)、甲基丙烯酸甲酯(Tg:105℃)、甲基丙烯酸1-金剛烷基酯(Tg:250℃)、丙烯酸1-金剛烷基酯(Tg:153℃)等(甲基)丙烯酸系單體;丙烯醯基𠰌啉(Tg:145℃)、二甲基丙烯醯胺(Tg:119℃)、二乙基丙烯醯胺(Tg:81℃)、二甲胺基丙基丙烯醯胺(Tg:134℃)、異丙基丙烯醯胺(Tg:134℃)、羥乙基丙烯醯胺(Tg:98℃)等含有醯胺基之乙烯基單體;N-乙烯基吡咯啶酮(Tg:54℃)等。The higher the content of the high-Tg monomer component in the constituent components of the base polymer, the more the adhesive tends to become harder. In addition, the so-called high Tg monomer means a monomer having a high glass transition temperature (Tg) of the homopolymer. Examples of monomers having a homopolymer Tg of 40°C or higher include dicyclopentyl methacrylate (Tg: 175°C), dicyclopentyl acrylate (Tg: 120°C), and isomethacrylate (Tg: 173℃), isoacrylate (Tg: 97℃), methyl methacrylate (Tg: 105℃), 1-adamantyl methacrylate (Tg: 250℃), 1-adamantyl acrylate (Tg: 153°C) and other (meth)acrylic monomers; acrylamide (Tg: 145°C), dimethylacrylamide (Tg: 119°C), diethylacrylamide (Tg: 81°C), dimethylaminopropyl propyl acrylamide (Tg: 134° C), isopropyl acrylamide (Tg: 134° C), hydroxyethyl acrylamide (Tg: 98° C), etc. Vinyl monomer; N-vinylpyrrolidone (Tg: 54°C), etc.

關於丙烯酸系基礎聚合物,均聚物之Tg為40℃以上之單體之含量相對於構成單體成分總量較佳為5~50重量%,更佳為10~40重量%。為了形成具有適度之硬度且二次加工性優異之黏著劑層,作為基礎聚合物之單體成分,較佳為包含均聚物之Tg為80℃以上之單體成分,更佳為包含均聚物之Tg為100℃以上之單體成分。關於丙烯酸系基礎聚合物,均聚物之Tg為100℃以上之單體之含量相對於構成單體成分總量較佳為0.1重量%以上,更佳為0.5重量%以上,進而較佳為1重量%以上,尤佳為3重量%以上。尤佳為甲基丙烯酸甲酯之含量為上述範圍。Regarding the acrylic base polymer, the content of the monomer having a Tg of 40° C. or higher relative to the total amount of constituent monomer components is preferably 5 to 50% by weight, and more preferably 10 to 40% by weight. In order to form an adhesive layer with moderate hardness and excellent secondary processability, the monomer component of the base polymer is preferably a monomer component containing a homopolymer with a Tg of 80° C. or higher, and more preferably a homopolymer The Tg of the substance is a monomer component above 100°C. Regarding the acrylic base polymer, the content of the monomer having a Tg of 100° C. or higher relative to the total amount of constituent monomer components is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and further preferably 1 More than 3% by weight, particularly preferably more than 3% by weight. It is particularly preferable that the content of methyl methacrylate is in the above range.

藉由將上述單體成分利用溶液聚合、乳化聚合、塊狀聚合等各種公知之方法進行聚合可獲得作為基礎聚合物之丙烯酸系聚合物。就黏著劑之接著力、保持力等特性之平衡、或成本等觀點而言,較佳為溶液聚合法。作為溶液聚合之溶劑,使用乙酸乙酯、甲苯等。溶液濃度通常為20~80重量%左右。作為溶液聚合中所使用之聚合起始劑,可使用偶氮系、過氧化物系等各種公知者。為了對分子量進行調整,可使用鏈轉移劑。反應溫度通常為50~80℃左右,反應時間通常為1~8小時左右。The acrylic polymer as a base polymer can be obtained by polymerizing the above monomer components by various well-known methods such as solution polymerization, emulsion polymerization, and bulk polymerization. From the viewpoint of the balance of characteristics such as adhesive force and holding force of the adhesive, or cost, the solution polymerization method is preferred. As a solvent for solution polymerization, ethyl acetate, toluene, etc. are used. The concentration of the solution is usually about 20 to 80% by weight. As the polymerization initiator used in the solution polymerization, various known ones such as azo-based and peroxide-based can be used. In order to adjust the molecular weight, a chain transfer agent can be used. The reaction temperature is usually about 50 to 80°C, and the reaction time is usually about 1 to 8 hours.

(交聯劑) 就使黏著劑具有適度之凝聚力之觀點而言,基礎聚合物中較佳為導入交聯結構。例如,藉由於將基礎聚合物進行聚合後之溶液中添加交聯劑並視需要進行加熱,而導入交聯結構。作為交聯劑,可列舉異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等。該等交聯劑與導入至基礎聚合物中之羥基或羧基等官能基反應而形成交聯結構。就與基礎聚合物之羥基或羧基之反應性較高、交聯結構之導入容易之方面而言,較佳為異氰酸酯系交聯劑及環氧系交聯劑。(Crosslinking agent) From the viewpoint of making the adhesive have moderate cohesion, it is preferable to introduce a cross-linked structure into the base polymer. For example, a cross-linking structure is introduced by adding a cross-linking agent to the solution after polymerizing the base polymer and heating as necessary. Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, carbodiimide-based crosslinking agents, and metal chelates. Department of cross-linking agent. These crosslinking agents react with functional groups such as hydroxyl or carboxyl groups introduced into the base polymer to form a crosslinked structure. In terms of high reactivity with the hydroxyl group or carboxyl group of the base polymer and easy introduction of the cross-linked structure, isocyanate-based cross-linking agents and epoxy-based cross-linking agents are preferred.

作為異氰酸酯系交聯劑,使用1分子中具有2個以上異氰酸酯基之聚異氰酸酯。作為異氰酸酯系交聯劑,例如可列舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(例如,Tosoh製造之「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(例如,Tosoh製造之「Coronate HL」)、苯二甲基二異氰酸酯之三羥甲基丙烷加成物(例如,三井化學製造之「Takenate D110N」、六亞甲基二異氰酸酯之三聚異氰酸酯物(例如,Tosoh製造之「Coronate HX」)等異氰酸酯加成物等。As the isocyanate-based crosslinking agent, polyisocyanate having two or more isocyanate groups in one molecule is used. Examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylated diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate. Alicyclic isocyanates; 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic isocyanates; trimethylolpropane/toluene diisocyanate terpolymer plus Products (for example, "Coronate L" manufactured by Tosoh), trimethylolpropane/hexamethylene diisocyanate terpolymer adducts (for example, "Coronate HL" manufactured by Tosoh), xylylene diisocyanate Isocyanate adducts such as trimethylolpropane adducts (for example, "Takenate D110N" manufactured by Mitsui Chemicals, trimeric isocyanates for hexamethylene diisocyanate (for example, "Coronate HX" manufactured by Tosoh), etc.

作為環氧系交聯劑,可使用1分子中具有2個以上環氧基之多官能環氧化合物。環氧系交聯劑之環氧基可為縮水甘油基。作為環氧系交聯劑,例如可列舉:N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨糖醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)三聚異氰酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚等。作為環氧系交聯劑,亦可使用Nagase chemteX製造之「DENACOL」、Mitsubishi Gas Chemical製造之「Tetrad X」「Tetrad C」等市售品。As the epoxy-based crosslinking agent, a multifunctional epoxy compound having two or more epoxy groups in one molecule can be used. The epoxy group of the epoxy-based crosslinking agent may be a glycidyl group. Examples of the epoxy-based cross-linking agent include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, and 1,3-bis(N,N-di Glycidylaminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol Alcohol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, tri Hydroxymethylpropane polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, tris (2-hydroxyethyl) tripolyisocyanate triglycidyl ester, resorcinol diglycidyl Glycerin, bisphenol-S-diglycidyl ether, etc. As the epoxy-based crosslinking agent, commercially available products such as "DENACOL" manufactured by Nagase ChemteX and "Tetrad X" and "Tetrad C" manufactured by Mitsubishi Gas Chemical can also be used.

交聯劑之使用量根據基礎聚合物之組成或分子量等適當地調整即可。交聯劑之使用量相對於基礎聚合物100重量份為0.1~10重量份左右,較佳為0.3~7重量份,更佳為0.5~5重量份,進而較佳為1~4重量份。又,交聯劑相對於基礎聚合物100重量份之使用量(重量份)除以交聯劑之官能基當量(g/eq)所得之值較佳為0.00015~0.11,更佳為0.001~0.077,進而較佳為0.003~0.055,尤佳為0.0045~0.044。藉由使交聯劑之使用量大於普通之丙烯酸系之光學用透明黏著劑使黏著劑具有適度之硬度,存在二次加工時之於被黏著體之糊劑殘留減少、二次加工性提昇之傾向。The amount of the cross-linking agent used may be appropriately adjusted according to the composition or molecular weight of the base polymer. The amount of the crosslinking agent used is about 0.1 to 10 parts by weight relative to 100 parts by weight of the base polymer, preferably 0.3 to 7 parts by weight, more preferably 0.5 to 5 parts by weight, and still more preferably 1 to 4 parts by weight. In addition, the amount of the cross-linking agent relative to 100 parts by weight of the base polymer (parts by weight) divided by the functional group equivalent (g/eq) of the cross-linking agent is preferably 0.00015 to 0.11, more preferably 0.001 to 0.077 It is further preferably 0.003 to 0.055, and particularly preferably 0.0045 to 0.044. By making the amount of cross-linking agent greater than that of ordinary acrylic optical transparent adhesives, the adhesive has a moderate hardness, and there is a reduction in paste residue on the adherend during secondary processing, and an improvement in secondary processing. tendency.

為了促進交聯結構之形成,亦可使用交聯觸媒。例如,作為異氰酸酯系交聯劑之交聯觸媒,可列舉鈦酸四正丁酯、鈦酸四異丙酯、乙醯丙酮鐵(III)、氧化丁基錫、二月桂酸二辛基錫等金屬系交聯觸媒(尤其是錫系交聯觸媒)等。交聯觸媒之使用量一般相對於基礎聚合物100重量份為0.05重量份以下。In order to promote the formation of cross-linked structures, cross-linked catalysts can also be used. For example, examples of the crosslinking catalyst of the isocyanate-based crosslinking agent include metals such as tetra-n-butyl titanate, tetraisopropyl titanate, iron(III) acetone, butyl tin oxide, and dioctyl tin dilaurate. System crosslinking catalyst (especially tin system crosslinking catalyst) and so on. The amount of crosslinking catalyst used is generally 0.05 parts by weight or less relative to 100 parts by weight of the base polymer.

(光硬化劑) 構成黏著劑層2之黏著劑組合物除基礎聚合物以外含有光硬化劑。包含光硬化性之黏著劑組合物之黏著劑層2若於與被黏著體貼合後進行光硬化,則與被黏著體之接著力提昇。(Photohardener) The adhesive composition constituting the adhesive layer 2 contains a light hardener in addition to the base polymer. If the adhesive layer 2 containing the photocurable adhesive composition is photohardened after being attached to the adherend, the adhesion with the adherend is increased.

作為光硬化劑,較佳為1分子中具有2個以上乙烯性不飽和鍵之化合物。又,光硬化劑較佳為表現出與基礎聚合物之相溶性之化合物。就表現出與基礎聚合物之適度之相溶性之方面而言,光硬化劑較佳為於常溫下為液體。藉由使光硬化劑與基礎聚合物相溶且於組合物中均勻地分散,能夠確保與被黏著體之接觸面積,且能夠形成透明性較高之黏著劑層2。又,藉由使基礎聚合物與光硬化劑表現出適度之相溶性,存在於光硬化後之黏著劑層2內容易均勻地導入交聯結構,與被黏著體之接著力適當地上升的傾向。As the light hardener, a compound having two or more ethylenically unsaturated bonds in one molecule is preferable. In addition, the light hardener is preferably a compound that exhibits compatibility with the base polymer. In terms of exhibiting moderate compatibility with the base polymer, the light hardener is preferably liquid at ordinary temperature. By making the photo hardener compatible with the base polymer and dispersing it uniformly in the composition, the contact area with the adherend can be ensured, and the adhesive layer 2 with high transparency can be formed. In addition, by showing a moderate compatibility between the base polymer and the light curing agent, the cross-linked structure is easily uniformly introduced into the adhesive layer 2 after the light curing, and the adhesion force with the adherend tends to rise appropriately .

基礎聚合物與光硬化劑之相溶性主要受化合物之結構之影響。化合物之結構與相溶性例如可藉由Hansen溶解度參數進行評價,存在基礎聚合物與光硬化劑之溶解度參數之差越小,相溶性變得越高之傾向。The compatibility of the base polymer and the light hardener is mainly affected by the structure of the compound. The structure and compatibility of the compound can be evaluated by, for example, the Hansen solubility parameter. The smaller the difference between the solubility parameters of the base polymer and the light hardener, the higher the compatibility.

就與丙烯酸系基礎聚合物之相溶性較高之方面而言,較佳為使用多官能(甲基)丙烯酸酯作為光硬化劑。作為多官能(甲基)丙烯酸酯,可列舉:聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、雙酚A環氧乙烷改性二(甲基)丙烯酸酯、雙酚A環氧丙烷改性二(甲基)丙烯酸酯、烷二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、乙氧化異三聚氰酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇聚(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、環氧(甲基)丙烯酸酯、丁二烯(甲基)丙烯酸酯、異戊二烯(甲基)丙烯酸酯等。該等之中,就與丙烯酸系基礎聚合物之相溶性優異之方面而言,較佳為聚乙二醇二(甲基)丙烯酸酯或聚丙二醇二(甲基)丙烯酸酯,尤佳為聚乙二醇二(甲基)丙烯酸酯。In terms of high compatibility with the acrylic base polymer, it is preferable to use a polyfunctional (meth)acrylate as a light hardener. Examples of polyfunctional (meth)acrylates include polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, Bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkanediol di(meth)acrylate, tricyclodecane dimethanol Di(meth)acrylate, ethoxylated isocyanurate tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(methyl) ) Acrylate, di-trimethylolpropane tetra (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol poly (meth) acrylate, di Pentaerythritol hexa(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerol di(meth)acrylate, (meth)acrylate carbamate, epoxy (meth)acrylate, Butadiene (meth)acrylate, isoprene (meth)acrylate, etc. Among these, in terms of excellent compatibility with the acrylic base polymer, polyethylene glycol di(meth)acrylate or polypropylene glycol di(meth)acrylate is preferred, and polyglycol is particularly preferred. Ethylene glycol di(meth)acrylate.

基礎聚合物與光硬化劑之相溶性亦受化合物之分子量影響。存在光硬化性化合物之分子量越小,與基礎聚合物之相溶性變得越高之傾向。就與基礎聚合物之相溶性之觀點而言,光硬化劑之分子量較佳為1500以下,更佳為1000以下,進而較佳為500以下,尤佳為400以下。The compatibility of the base polymer and the light hardener is also affected by the molecular weight of the compound. There is a tendency that the smaller the molecular weight of the photocurable compound, the higher the compatibility with the base polymer. From the viewpoint of compatibility with the base polymer, the molecular weight of the light hardener is preferably 1500 or less, more preferably 1000 or less, further preferably 500 or less, and particularly preferably 400 or less.

於光硬化前之黏著劑層2中,基礎聚合物之特性為接著性之主要支配因素。因此,只要黏著劑組合物之基礎聚合物相同,則即便光硬化劑之種類不同,光硬化前之黏著劑層之接著特性之差異亦較小。光硬化劑之種類或含量主要對光硬化後之黏著劑層之接著力產生影響。官能基當量越小(即,每單位分子量之官能基數越大)且光硬化劑之含量越大,則越能夠於光硬化之前後對接著力設置差。In the adhesive layer 2 before photohardening, the characteristics of the base polymer are the main dominating factors for adhesion. Therefore, as long as the base polymer of the adhesive composition is the same, even if the types of the light hardeners are different, the difference in the adhesive properties of the adhesive layer before the light hardening is also small. The type or content of the light hardener mainly affects the adhesion of the adhesive layer after light hardening. The smaller the functional group equivalent (ie, the greater the number of functional groups per unit molecular weight) and the greater the content of the light hardener, the more able to set the difference in adhesion force before and after light hardening.

就與基礎聚合物之相溶性較高、且提昇光硬化後之接著力之觀點而言,光硬化劑之官能基當量(g/eq)較佳為500以下,更佳為400以下,進而較佳為300以下,尤佳為200以下。另一方面,若光硬化劑之官能基當量過小,則存在光硬化後之黏著劑層之交聯點密度變高、接著性降低之情況。因此,光硬化劑之官能基當量較佳為80以上,更佳為100以上,進而較佳為130以上。From the viewpoint of having high compatibility with the base polymer and enhancing the adhesive strength after light curing, the functional group equivalent (g/eq) of the light hardener is preferably 500 or less, more preferably 400 or less, and further It is preferably 300 or less, and particularly preferably 200 or less. On the other hand, if the functional group equivalent of the light hardener is too small, there may be a case where the density of the crosslinking point of the adhesive layer after photohardening becomes high and the adhesiveness decreases. Therefore, the functional group equivalent of the light hardener is preferably 80 or more, more preferably 100 or more, and still more preferably 130 or more.

於丙烯酸系基礎聚合物與多官能丙烯酸酯光硬化劑之組合中,於光硬化劑之官能基當量較小之情形時,存在如下傾向:基礎聚合物與光硬化劑之相互作用較強,初期接著力上升。於本發明之用途中,存在初期接著力之過度之上升引起二次加工性之降低之情況。就使光硬化前之黏著劑層2與被黏著體之接著力保持適當之範圍之觀點而言,亦較佳為光硬化劑之官能基當量為上述範圍內。In the combination of the acrylic base polymer and the multifunctional acrylate light hardener, when the functional group equivalent of the light hardener is small, there is a tendency that the interaction between the base polymer and the light hardener is strong, and the initial stage Then the force rises. In the use of the present invention, there is a case where the excessive increase in the initial adhesive force causes a decrease in secondary processability. From the viewpoint of maintaining an appropriate range of the adhesive force between the adhesive layer 2 and the adherend before photohardening, it is also preferable that the functional group equivalent of the photohardener is within the above range.

黏著劑組合物中之光硬化劑之含量相對於基礎聚合物100重量份,較佳為10~50重量份。藉由將光硬化劑之調配量設為上述範圍,能夠將光硬化後之黏著劑層與被黏著體之接著性調整至適當之範圍。光硬化劑之含量相對於基礎聚合物100重量份,更佳為15~45重量份,進而較佳為20~40重量份。The content of the light hardener in the adhesive composition is preferably 10-50 parts by weight relative to 100 parts by weight of the base polymer. By setting the formulation amount of the photo hardener to the above range, the adhesiveness between the adhesive layer and the adherend after photo hardening can be adjusted to an appropriate range. The content of the light hardener is more preferably 15 to 45 parts by weight relative to 100 parts by weight of the base polymer, and further preferably 20 to 40 parts by weight.

(光自由基起始劑) 光自由基起始劑係藉由活性光線之照射而生成自由基,並藉由自光自由基起始劑向光硬化劑之自由基轉移而促進光硬化劑之自由基聚合反應。作為光自由基起始劑(光自由基產生劑),較佳為藉由波長短於450 nm之可見光或紫外線之照射而生成自由基者,可列舉羥基酮類、苯偶醯二甲基縮酮類、胺基酮類、醯基氧化膦類、二苯甲酮類、含三氯甲基之三𠯤衍生物等。光自由基起始劑可單獨使用,亦可將2種以上混合使用。(Photo radical initiator) The photo radical initiator generates free radicals by the irradiation of active light, and promotes the radical polymerization reaction of the photo hardener by the radical transfer from the photo radical initiator to the photo hardener. As the photo radical initiator (photo radical generator), those that generate radicals by irradiation with visible light or ultraviolet rays with a wavelength shorter than 450 nm are preferred, and examples include hydroxyketones and benzoyl dimethyl acetal. Ketones, amino ketones, acyl phosphine oxides, benzophenones, trichloromethyl-containing derivatives, etc. The photo radical initiator may be used alone, or two or more kinds may be used in combination.

於對黏著劑層2要求透明性之情形時,光自由基起始劑較佳為對波長長於400 nm之光(可見光)之感度較小,例如可較佳地使用波長405 nm下之吸光係數為1×102 [mLg-1 cm-1 ]以下之光自由基起始劑。又,若使用可見光之感度較小之光自由基起始劑,則起因於保管環境中之外界光之光自由基之生成量較小,因此能夠提昇補強膜之保管穩定性。When transparency is required for the adhesive layer 2, the photo radical initiator is preferably less sensitive to light (visible light) with a wavelength longer than 400 nm. For example, the absorption coefficient at a wavelength of 405 nm can be preferably used It is a light radical initiator below 1×10 2 [mLg -1 cm -1 ]. In addition, if a light radical initiator with a small sensitivity to visible light is used, the amount of light radicals generated from the outer light in the storage environment is small, so the storage stability of the reinforcing film can be improved.

就提高補強膜之保管穩定性之觀點而言,較佳為使用於長於360 nm之波長不顯示吸收極大之光自由基起始劑。於長於360 nm之波長顯示吸收極大之光自由基起始劑容易吸收來自螢光燈之紫外線(主要為365 nm及405 nm之水銀明線),生成光自由基。若光自由基起始劑之光吸收之極大波長為360 nm以下,則起因於螢光燈等保管環境中之光之自由基之生成量較少。因此,即便於將補強膜長時間暴露於螢光燈下之情形時,亦能夠使光自由基起始劑之實效濃度維持得較高。又,起因於螢光燈等保管環境中之光所生成之少量之自由基由於會被抗氧化劑捕獲,因此可抑制保管環境下之光聚合。From the viewpoint of improving the storage stability of the reinforcing film, it is preferable to use a light radical initiator that does not show a large absorption at a wavelength longer than 360 nm. At wavelengths longer than 360 nm, it is shown that light-absorbing free radical initiators easily absorb ultraviolet light from fluorescent lamps (mainly mercury bright lines at 365 nm and 405 nm) to generate light radicals. If the maximum wavelength of light absorption of the light radical initiator is 360 nm or less, the amount of generated light radicals in the storage environment such as fluorescent lamps is small. Therefore, even when the reinforcing film is exposed to a fluorescent lamp for a long time, the effective concentration of the photo radical initiator can be maintained high. In addition, a small amount of free radicals generated by light in a storage environment such as a fluorescent lamp is trapped by an antioxidant, so that photopolymerization in the storage environment can be suppressed.

為了使保管穩定性較高、且即便長期保管後亦能夠藉由光照射提昇與被黏著體之接著力,黏著劑層所包含之光自由基起始劑較佳為光吸收之極大波長為355 nm以下。另一方面,為了提高藉由紫外線照射之光硬化效率,光自由基起始劑較佳為於長於310 nm之波長具有光吸收極大。根據以上情況,為了提昇補強膜之保管穩定性,黏著劑層2所包含之光自由基起始劑較佳為於長於360 nm之波長不具有吸收極大、且於波長310~355 nm之範圍具有吸收極大者。光自由基起始劑之吸收極大波長更佳為315~350 nm,進而較佳為320~340 nm。In order to improve the storage stability and enhance the adhesion to the adherend by light irradiation even after long-term storage, the light radical initiator included in the adhesive layer is preferably a maximum wavelength of light absorption of 355 Below nm. On the other hand, in order to improve the light curing efficiency by ultraviolet irradiation, the photo radical initiator preferably has a light absorption maximum at a wavelength longer than 310 nm. According to the above circumstances, in order to improve the storage stability of the reinforcing film, the light radical initiator included in the adhesive layer 2 preferably has no absorption maximum at a wavelength longer than 360 nm, and has a wavelength in the range of 310 to 355 nm Absorb the greatest. The absorption maximum wavelength of the optical radical initiator is more preferably 315 to 350 nm, and further preferably 320 to 340 nm.

黏著劑層2中之光自由基起始劑之含量相對於基礎聚合物100重量份,較佳為0.01~1重量份,更佳為0.02~0.7重量份,進而較佳為0.03~0.5重量份。黏著劑層2中之光自由基起始劑之含量相對於光硬化劑100重量份,較佳為0.005~0.5重量份,更佳為0.01~0.4重量份,進而較佳為0.02~0.3重量份。若黏著劑層中之光自由基起始劑之含量過小,則存在即便照射紫外線亦不會充分地進行光硬化反應之情況。若光自由基起始劑之含量過大,則存在即便於併用抗氧化劑之情形時,亦會進行保管環境下之光硬化反應,與被黏著體之接著力上升,補強膜之二次加工變得困難的情況。The content of the photo radical initiator in the adhesive layer 2 is preferably 0.01 to 1 part by weight, more preferably 0.02 to 0.7 part by weight, and still more preferably 0.03 to 0.5 part by weight relative to 100 parts by weight of the base polymer. . The content of the photo radical initiator in the adhesive layer 2 is preferably 0.005 to 0.5 parts by weight, more preferably 0.01 to 0.4 parts by weight, and still more preferably 0.02 to 0.3 parts by weight relative to 100 parts by weight of the light hardener. . If the content of the photo radical initiator in the adhesive layer is too small, there may be cases where the photo hardening reaction does not sufficiently proceed even when irradiated with ultraviolet rays. If the content of the photo-radical initiator is too large, even if antioxidants are used in combination, the photo-hardening reaction will proceed in the storage environment, the adhesion with the adherend will increase, and the secondary processing of the reinforcing film will become Difficult situation.

(抗氧化劑) 抗氧化劑具有抑制補強膜於保管環境中之光硬化反應之作用。除光自由基起始劑以外包含抗氧化劑之組合物即便於因來自螢光燈等之光而自光自由基起始劑生成少量之光自由基之情形時,抗氧化劑亦會捕獲自由基而生成穩定自由基,因此可抑制自由基向光硬化劑轉移。因此,可抑制因來自螢光燈等之光引起之光硬化(光硬化劑之自由基聚合反應)。(Antioxidants) Antioxidants have the effect of inhibiting the photohardening reaction of the reinforcing film in the storage environment. In addition to the photo-radical initiator, the composition containing an antioxidant may capture free radicals even when a small amount of photo-radicals are generated from the photo-radical initiator due to light from a fluorescent lamp or the like. Stable free radicals are generated, so the transfer of free radicals to the light hardener can be suppressed. Therefore, it is possible to suppress the light curing (radical polymerization reaction of the light hardener) caused by light from fluorescent lamps or the like.

作為抗氧化劑,可列舉胺系抗氧化劑、硫系抗氧化劑、磷系抗氧化劑、酚系抗氧化劑等。Examples of antioxidants include amine antioxidants, sulfur antioxidants, phosphorus antioxidants, and phenol antioxidants.

作為硫系抗氧化劑,可列舉:3,3'-硫代二丙酸二月桂酯、3,3'-硫代二丙酸二肉豆蔻酯、3,3'-硫代二丙酸二硬脂酯等。作為磷系抗氧化劑,可列舉亞磷酸三苯酯、亞磷酸二苯酯異癸酯、亞磷酸苯酯二異癸酯等。Examples of sulfur-based antioxidants include: 3,3'-dilauric thiodipropionate, 3,3'-dimyristyl thiodipropionate, and 3,3'-thiodipropionate dihard Fatty esters, etc. Examples of the phosphorus-based antioxidant include triphenyl phosphite, diphenyl phosphite isodecyl, phenyl phosphite diisodecyl, and the like.

作為胺系抗氧化劑,可列舉:單辛基二苯基胺、單壬基二苯基胺等單烷基二苯基胺類;4,4'-二丁基二苯基胺、4,4'-二戊基二苯基胺、4,4'-二己基二苯基胺、4,4'-二庚基二苯基胺、4,4'-二辛基二苯基胺、4,4'-二壬基二苯基胺等二烷基二苯基胺類;四丁基二苯基胺、四己基二苯基胺、四辛基二苯基胺、四壬基二苯基胺等多烷基二苯基胺類;α-萘胺、苯基-α-萘胺、丁基苯基-α-萘胺、戊基苯基-α-萘胺、己基苯基-α-萘胺、庚基苯基-α-萘胺、辛基苯基-α-萘胺、壬基苯基-α-萘胺等萘胺類等。Examples of the amine-based antioxidants include monoalkyldiphenylamines such as monooctyldiphenylamine and monononyldiphenylamine; 4,4′-dibutyldiphenylamine and 4,4 '-Dipentyldiphenylamine, 4,4'-dihexyldiphenylamine, 4,4'-diheptyldiphenylamine, 4,4'-dioctyldiphenylamine, 4, Dialkyldiphenylamines such as 4'-dinonyldiphenylamine; tetrabutyldiphenylamine, tetrahexyldiphenylamine, tetraoctyldiphenylamine, tetranonyldiphenylamine Polyalkyl diphenylamines; α-naphthylamine, phenyl-α-naphthylamine, butylphenyl-α-naphthylamine, pentylphenyl-α-naphthylamine, hexylphenyl-α-naphthalene Naphthylamines such as amine, heptylphenyl-α-naphthylamine, octylphenyl-α-naphthylamine, nonylphenyl-α-naphthylamine, etc.

作為酚系抗氧化劑,可列舉:2,6-二第三丁基對甲酚(二丁基羥基甲苯;BHT)、丁基化羥基苯甲醚、2,6-二第三丁基-4-乙基苯酚、β-(3,5-二第三丁基-4-羥基苯基)丙酸硬脂酯等單酚系抗氧化劑;2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-第三丁基苯酚)、4,4'-硫代雙(3-甲基-6-第三丁基苯酚)、4,4'-亞丁基雙(3-甲基-6-第三丁基苯酚)、3,9-雙[1,1-二甲基-2-[β-(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基]乙基]2,4,8,10-四氧雜螺[5,5]十一烷等雙酚系抗氧化劑;1,1,3-三(2-甲基-4-羥基-5-第三丁基苯基)丁烷、1,3,5-三甲基-2,4,6-三(3,5-二第三丁基-4-羥基苄基)苯、四-[亞甲基-3-(3',5'-二第三丁基-4'-羥基苯基)丙酸酯]甲烷、雙[3,3'-雙-(4'-羥基-3'-第三丁基苯基)丁酸]二醇酯、1,3,5-三(3',5'-二第三丁基-4'-羥基苄基)-S-三𠯤-2,4,6-(1H,3H,5H)三酮、生育酚等高分子型酚系抗氧化劑等。Examples of phenolic antioxidants include 2,6-di-tert-butyl-p-cresol (dibutylhydroxytoluene; BHT), butylated hydroxyanisole, and 2,6-di-tert-butyl-4 -Monophenolic antioxidants such as ethylphenol, β-(3,5-di-tert-butyl-4-hydroxyphenyl) stearyl propionate; 2,2'-methylenebis(4-methyl -6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6- Third butyl phenol), 4,4'-butylene bis(3-methyl-6-third butyl phenol), 3,9-bis[1,1-dimethyl-2-[β-( 3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]ethyl] 2,4,8,10-tetraoxaspiro[5,5]undecane and other bisphenols Antioxidant; 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tri( 3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tetra-(methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl) propionate ] Methane, bis[3,3'-bis-(4'-hydroxy-3'-third butylphenyl) butyric acid] glycol ester, 1,3,5-tris(3',5'-di Third butyl-4'-hydroxybenzyl)-S-tris-2,4,6-(1H,3H,5H) triketone, tocopherol and other polymer phenolic antioxidants.

就抑制由因螢光燈等之光而自光自由基起始劑生成之自由基引起的光硬化之觀點而言,抗氧化劑之中,較佳為胺系抗氧化劑及酚系抗氧化劑等發揮作為自由基鏈抑制劑之作用者,尤佳為具有受阻酚結構之酚系抗氧化劑。From the viewpoint of suppressing photohardening caused by radicals generated from light radical initiators due to the light of fluorescent lamps and the like, among the antioxidants, amine-based antioxidants and phenol-based antioxidants are preferred As the role of free radical chain inhibitors, phenolic antioxidants having a hindered phenol structure are particularly preferred.

具有受阻酚結構之抗氧化劑係於苯酚之與鍵結有OH基之芳香族環上之碳原子鄰接之碳原子之至少一者鍵結有第三丁基等位阻較大之基者。作為具有受阻酚結構之抗氧化劑,可列舉:二丁基羥基甲苯(BHT)、季戊四醇四[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯](BASF製造之「Irganox 1010」)、3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯(BASF製造之「Irganox 1076」)、3,3',3'',5,5',5''-六第三丁基-a,a',a''-(1,3,5-三甲苯-2,4,6-三基)三對甲酚(BASF製造之「Irganox 1330」)、1,3,5-三(3,5-二第三丁基-4-羥基苄基)-1,3,5-三𠯤-2,4,6(1H,3H,5H)-三酮(BASF製造之「Irganox 3114」)、異三聚氰酸三[3-(3,5-二第三丁基-4-羥基苯基)丙醯氧基乙基]酯(BASF製造之「Irganox 3125」)、季戊四醇四[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯](ADEKA製造之「Adekastab AO-60」)、3,9-雙{2-[3-(3-第三丁基-4-羥基-5-甲基苯基)丙醯氧基]-1,1-二甲基乙基}-2,4,8,10-四氧雜螺[5.5]十一烷(ADEKA製造之「Adekastab AO-80」)、丙烯酸2-[1-(2-羥基-3,5-二第三戊基苯基)乙基]-4,6-二第三戊基苯基酯(住友化學製造之「Sumilizer GS」)、丙烯酸2-第三丁基-4-甲基-6-(2-羥基-3-第三丁基-5-甲基苄基)苯基酯(住友化學製造之「Sumilizer GM」)、2,2'-二甲基-2,2'-(2,4,8,10-四氧雜螺[5.5]十一烷-3,9-二基)二丙烷-1,1'-二基=雙[3-(3-第三丁基-4-羥基-5-甲基苯基)丙酸酯](住友化學製造之「Sumilizer GA-80」)、1,3,5-三(3-羥基-4-第三丁基-2,6-二甲基苄基)-1,3,5-三𠯤-2,4,6(1H,3H,5H)-三酮(Cytec製造之「Cyanox 1790」)等。An antioxidant having a hindered phenol structure is one in which at least one of the carbon atoms adjacent to the carbon atom on the aromatic ring to which the OH group is bonded of phenol is bonded with a third butyl group having a larger steric hindrance. Examples of the antioxidant having a hindered phenol structure include dibutylhydroxytoluene (BHT) and pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (manufactured by BASF "Irganox 1010"), octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate ("Irganox 1076" manufactured by BASF), 3,3',3' ',5,5',5''-hexatert-butyl-a,a',a''-(1,3,5-trimethylbenzene-2,4,6-triyl) tri-p-cresol ( "Irganox 1330" manufactured by BASF), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-tris-2,4,6(1H ,3H,5H)-trione ("Irganox 3114" manufactured by BASF), isocyanuric tris[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxyethyl ] Ester ("Irganox 3125" manufactured by BASF), pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] ("Adekastab AO-60" manufactured by ADEKA), 3,9-bis{2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl}-2,4 ,8,10-tetraoxaspiro[5.5]undecane ("Adekastab AO-80" manufactured by ADEKA), acrylic acid 2-[1-(2-hydroxy-3,5-di-third-pentylphenyl) Ethyl]-4,6-di-tert-amylphenyl ("Sumilizer GS" manufactured by Sumitomo Chemical), 2-tert-butyl-4-methyl-6-(2-hydroxy-3- Tributyl-5-methylbenzyl)phenyl ester ("Sumilizer GM" manufactured by Sumitomo Chemical), 2,2'-dimethyl-2,2'-(2,4,8,10-tetraoxy Heterospiro[5.5]undecane-3,9-diyl)dipropane-1,1'-diyl=bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl) Propionate] ("Sumilizer GA-80" manufactured by Sumitomo Chemical), 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3 ,5-三𠯤-2,4,6(1H,3H,5H)-trione ("Cyanox 1790" manufactured by Cytec), etc.

黏著劑層2中之抗氧化劑之含量相對於基礎聚合物100重量份,較佳為0.01~2重量份,更佳為0.03~1重量份,進而較佳為0.04~0.7重量份,尤佳為0.05~0.5重量份。抗氧化劑之含量較佳為光自由基起始劑之含量之0.2~5倍,更佳為0.3~3倍,進而較佳為0.5~2倍。The content of the antioxidant in the adhesive layer 2 is preferably 0.01 to 2 parts by weight, more preferably 0.03 to 1 part by weight, further preferably 0.04 to 0.7 parts by weight, and particularly preferably 100 parts by weight of the base polymer. 0.05 to 0.5 parts by weight. The content of the antioxidant is preferably 0.2 to 5 times the content of the photo radical initiator, more preferably 0.3 to 3 times, and still more preferably 0.5 to 2 times.

(光自由基起始劑與抗氧化劑之併用效果) 於除光自由基起始劑以外包含抗氧化劑之組合物中,即便於因來自螢光燈等之光而自光自由基起始劑生成少量之光自由基之情形時,抗氧化劑亦會捕獲自由基而生成穩定自由基。因此,可抑制由來自螢光燈等之光引起之自由基聚合反應。就抑制補強膜之保管狀態下之聚合反應之觀點而言,較佳為抗氧化劑之含量較多。另一方面,若抗氧化劑之含量過大,則即便為了光硬化而進行紫外線照射,抗氧化劑亦會捕獲光生成自由基之大部分,因此會妨礙自由基自光自由基起始劑向光硬化劑轉移,存在光硬化不充分之情況。因此,為了抑制保管環境中之光聚合而防止接著力之上升,並於光照射時適當地進行光硬化反應使接著力上升,較佳為抗氧化劑之含量為上述範圍。(Combined effect of photo radical initiator and antioxidant) In a composition containing an antioxidant other than a photo radical initiator, even when a small amount of photo radicals are generated from the photo radical initiator due to light from a fluorescent lamp or the like, the antioxidant will be captured Free radicals generate stable free radicals. Therefore, the radical polymerization reaction caused by light from fluorescent lamps or the like can be suppressed. From the viewpoint of suppressing the polymerization reaction in the storage state of the reinforcing film, it is preferable that the content of the antioxidant is large. On the other hand, if the content of the antioxidant is too large, even if ultraviolet light is irradiated for photohardening, the antioxidant will capture most of the free radicals generated by the light, thus preventing the free radicals from the photo radical initiator to the photo hardener There is a case where the photo hardening is insufficient. Therefore, in order to suppress the photopolymerization in the storage environment and prevent the increase of the adhesive force, the photohardening reaction is appropriately performed during the light irradiation to increase the adhesive force, and the content of the antioxidant is preferably within the above range.

藉由將光自由基起始劑與抗氧化劑併用,抗氧化劑會捕獲因來自螢光燈等之光所生成之自由基,因此能夠抑制由保管環境下之光硬化反應引起之接著力之上升。因此,不論光自由基起始劑之種類如何,均能夠藉由抗氧化劑之作用抑制保管環境中之黏著劑層之光硬化。By using a photo radical initiator in combination with an antioxidant, the antioxidant captures free radicals generated by light from fluorescent lamps and the like, so it is possible to suppress the increase in adhesion caused by the photo-hardening reaction in the storage environment. Therefore, regardless of the type of photo radical initiator, the photohardening of the adhesive layer in the storage environment can be suppressed by the action of the antioxidant.

另一方面,若將具備包含光自由基起始劑及抗氧化劑之黏著劑層之補強膜長時間暴露於螢光燈下,則由於光自由基起始劑之失活,光自由基起始劑之實效濃度(能夠生成光自由基之光自由基起始劑之濃度)減小。因此,存在即便為了光硬化而進行紫外線照射,光自由基之生成量亦較少,光硬化反應未充分地進行之情況。On the other hand, if a reinforcing film with an adhesive layer containing a photo radical initiator and an antioxidant is exposed to a fluorescent lamp for a long time, the photo radical initiator will be inactivated due to the inactivation of the photo radical initiator The effective concentration of the agent (the concentration of photo radical initiator capable of generating photo radicals) decreases. Therefore, even if ultraviolet irradiation is performed for photohardening, the amount of generated photo radicals is small, and the photohardening reaction may not proceed sufficiently.

補強膜較佳為即便於長時間保管後,黏著劑亦不易因保管環境中之螢光燈等之光而產生光硬化,且於光照射時會生成充分量之自由基,藉由光硬化劑之自由基聚合反應,與被黏著體之接著力上升。為了於長時間保管後亦充分地進行光硬化反應,較佳為使用保管環境下之自由基生成量較小之光自由基起始劑。具體而言,較佳為使用如下光自由基起始劑:其如上所述,於360 nm以下具有吸收極大波長,且由螢光燈之水銀明線(尤其是波長365 nm)引起之光自由基生成量較小。The reinforcing film is preferably such that even after long-term storage, the adhesive is less likely to be photo-hardened by the light of a fluorescent lamp or the like in the storage environment, and a sufficient amount of free radicals are generated when light is irradiated. The free radical polymerization reaction with the adherend increases the adhesion. In order to sufficiently carry out the photo hardening reaction even after long-term storage, it is preferable to use a photo radical initiator with a small amount of free radical generation under a storage environment. Specifically, it is preferable to use a photo radical initiator as described above, which has an absorption maximum wavelength below 360 nm and is free of light caused by the mercury bright line of fluorescent lamps (especially at a wavelength of 365 nm). The amount of basis generation is small.

由螢光燈之光引起之來自光自由基起始劑之自由基生成量例如可藉由如後述之實施例所示於極低溫下照射波長365 nm之光並利用電子自旋共振(ESR)法對自由基量進行定量而進行評價。源自光自由基起始劑之自由基由於在常溫下之壽命極短,故而於自由基生成量之評價時適合極低溫。The amount of free radicals generated from the light radical initiator caused by the light of the fluorescent lamp can be irradiated with light at a wavelength of 365 nm at extremely low temperature as shown in the embodiment described later and use electron spin resonance (ESR) The method quantifies and evaluates the amount of free radicals. Since the radical derived from the photo-radical initiator has a very short life at normal temperature, it is suitable for extremely low temperature when evaluating the amount of radical generation.

(其他添加劑) 除上述例示之各成分以外,黏著劑層中亦可於無損本發明之特性之範圍內含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑、紫外線吸收劑、界面活性劑、抗靜電劑等添加劑。(Other additives) In addition to the components exemplified above, the adhesive layer may also contain a silane coupling agent, an adhesion-imparting agent, a plasticizer, a softening agent, an anti-deterioration agent, a filler, a coloring agent, within a range that does not impair the characteristics of the present invention Additives such as ultraviolet absorbers, surfactants, antistatic agents.

[補強膜之製作] 藉由於膜基材1上積層光硬化性之黏著劑層2,而獲得補強膜。黏著劑層2可於膜基材1上直接形成,亦可將於其他基材上片狀地形成之黏著劑層轉印至膜基材1上。[Production of Reinforcement Membrane] By stacking the photocurable adhesive layer 2 on the film substrate 1, a reinforcing film is obtained. The adhesive layer 2 may be formed directly on the film substrate 1, or the adhesive layer formed in a sheet shape on other substrates may be transferred to the film substrate 1.

藉由將上述黏著劑組合物利用輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥塗佈、棒式塗佈、刮塗、氣刀刮塗、淋幕式塗佈、唇板塗佈、模嘴塗佈等塗佈於基材上,並視需要將溶劑進行乾燥去除,而形成黏著劑層。作為乾燥方法,可酌情採用適當之方法。加熱乾燥溫度較佳為40℃~200℃,更佳為50℃~180℃,進而較佳為70℃~170℃。乾燥時間較佳為5秒~20分鐘,更佳為5秒~15分鐘,進而較佳為10秒~10分鐘。By applying the above-mentioned adhesive composition by roll coating, contact roll coating, gravure coating, reverse coating, roll brush coating, spray coating, dip roll coating, bar coating, blade coating, air Knife coating, curtain coating, lip coating, die coating, etc. are applied to the substrate, and the solvent is dried and removed as necessary to form an adhesive layer. As a drying method, an appropriate method may be adopted as appropriate. The heating and drying temperature is preferably 40°C to 200°C, more preferably 50°C to 180°C, and still more preferably 70°C to 170°C. The drying time is preferably 5 seconds to 20 minutes, more preferably 5 seconds to 15 minutes, and still more preferably 10 seconds to 10 minutes.

黏著劑層2之厚度例如為1~300 μm左右。存在如下傾向:黏著劑層2之厚度越大,與被黏著體之接著性越會提昇。另一方面,於黏著劑層2之厚度過大之情形時,存在光硬化前之流動性較高、操作變得困難之情況。因此,黏著劑層2之厚度較佳為5~100 μm,更佳為8~50 μm,進而較佳為10~40 μm,尤佳為13~30 μm。The thickness of the adhesive layer 2 is, for example, about 1 to 300 μm. There is a tendency that the greater the thickness of the adhesive layer 2 is, the more the adhesion with the adherend will be improved. On the other hand, when the thickness of the adhesive layer 2 is too large, there are cases where the fluidity before photo-curing is high and the operation becomes difficult. Therefore, the thickness of the adhesive layer 2 is preferably 5 to 100 μm, more preferably 8 to 50 μm, still more preferably 10 to 40 μm, and particularly preferably 13 to 30 μm.

於黏著劑組合物含有交聯劑之情形時,較佳為與溶劑之乾燥同時、或於溶劑之乾燥後藉由加熱或老化使交聯進行。加熱溫度或加熱時間係根據使用之交聯劑之種類適當地設定,通常於20℃~160℃之範圍藉由1分鐘至7天左右之加熱進行交聯。用以將溶劑進行乾燥去除之加熱亦可兼作用於交聯之加熱。When the adhesive composition contains a crosslinking agent, it is preferable to perform crosslinking by heating or aging at the same time as the drying of the solvent or after the drying of the solvent. The heating temperature or heating time is appropriately set according to the type of crosslinking agent used, and is usually crosslinked by heating in the range of 20°C to 160°C by about 1 minute to 7 days. The heating used for drying and removing the solvent can also serve as the heating for crosslinking.

藉由於基礎聚合物中導入交聯結構,凝膠分率上升。存在凝膠分率越高,黏著劑越硬,於因二次加工等而自被黏著體剝離補強膜時,可抑制向被黏著體之糊劑殘留的傾向。光硬化前之黏著劑層2之凝膠分率較佳為30%以上,更佳為50%以上,進而較佳為60%以上,尤佳為65%以上。黏著劑層2之光硬化前之凝膠分率亦可為70%以上或75%以上。The introduction of a cross-linked structure into the base polymer increases the gel fraction. The higher the gel fraction, the harder the adhesive. When the reinforcement film is peeled off from the adherend due to secondary processing, etc., the tendency to remain in the paste of the adherend can be suppressed. The gel fraction of the adhesive layer 2 before photohardening is preferably 30% or more, more preferably 50% or more, and further preferably 60% or more, particularly preferably 65% or more. The gel fraction of the adhesive layer 2 before light curing can also be more than 70% or more than 75%.

由於黏著劑含有未反應之光硬化劑,故而光硬化前之黏著劑層2之凝膠分率一般為90%以下。若光硬化前之黏著劑層2之凝膠分率過大,則存在對被黏著體之抓固力降低、初期接著力變得不充分之情況。因此,光硬化前之黏著劑層2之凝膠分率較佳為85%以下,更佳為80%以下。Since the adhesive contains an unreacted photo hardener, the gel fraction of the adhesive layer 2 before photo hardening is generally 90% or less. If the gel fraction of the adhesive layer 2 before photohardening is too large, there may be a case where the holding power to the adherend decreases and the initial adhesive force becomes insufficient. Therefore, the gel fraction of the adhesive layer 2 before photohardening is preferably 85% or less, and more preferably 80% or less.

凝膠分率可以對乙酸乙酯等溶劑之不溶物之形式而求出,具體而言,以將黏著劑層於乙酸乙酯中於23℃下浸漬7天之後之不溶成分相對於浸漬前之試樣之重量分率(單位:重量%)之方式而求出。一般而言,聚合物之凝膠分率與交聯度相同,聚合物中之交聯之部分越多,凝膠分率變得越大。又,光硬化劑之量越多,凝膠分率變得越小。The gel fraction can be obtained in the form of insoluble matter in solvents such as ethyl acetate. Specifically, the insoluble content of the adhesive layer after immersing the adhesive layer in ethyl acetate at 23°C for 7 days relative to that before immersion The weight fraction of the sample (unit: weight %) is obtained by the method. Generally speaking, the gel fraction of the polymer is the same as the degree of crosslinking. The more crosslinked parts in the polymer, the greater the gel fraction becomes. In addition, the greater the amount of photohardener, the lower the gel fraction.

藉由交聯劑於聚合物中導入交聯結構後,光硬化劑亦維持未反應之狀態。因此,形成包含基礎聚合物及光硬化劑之光硬化性之黏著劑層2。於在膜基材1上形成黏著劑層2之情形時,較佳為以黏著劑層2之保護等為目的於黏著劑層2上附設隔離件5。亦可於黏著劑層2上附設隔離件5後進行交聯。After the cross-linking structure is introduced into the polymer by the cross-linking agent, the light hardener also remains unreacted. Thus, a photo-curable adhesive layer 2 containing a base polymer and a photo-hardener is formed. In the case where the adhesive layer 2 is formed on the film substrate 1, it is preferable to attach a spacer 5 to the adhesive layer 2 for the purpose of protection of the adhesive layer 2 or the like. It is also possible to perform crosslinking after attaching the spacer 5 on the adhesive layer 2.

於在其他基材上形成黏著劑層2之情形時,藉由於使溶劑乾燥後將黏著劑層2轉印至膜基材1上而獲得補強膜。亦可將黏著劑層之形成所使用之基材直接作為隔離件5。In the case where the adhesive layer 2 is formed on another substrate, the reinforcing film is obtained by transferring the adhesive layer 2 onto the film substrate 1 after drying the solvent. The substrate used for the formation of the adhesive layer can also be used as the spacer 5 directly.

作為隔離件5,可良好地使用聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜。隔離件之厚度通常為3~200 μm,較佳為10~100 μm左右。較佳為對隔離件5之與黏著劑層2之接觸面實施藉由聚矽氧系、氟系、長鏈烷基系、或者脂肪醯胺系等脫模劑、或二氧化矽粉等進行之脫模處理。藉由對隔離件5之表面進行脫模處理,於將膜基材1與隔離件5剝離時,可維持於黏著劑層2與隔離件5之界面產生剝離、於膜基材1上固著黏著劑層2之狀態。As the separator 5, plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films can be used favorably. The thickness of the separator is usually 3 to 200 μm, preferably about 10 to 100 μm. Preferably, the contact surface of the separator 5 and the adhesive layer 2 is implemented with a mold release agent such as polysilicon-based, fluorine-based, long-chain alkyl-based, or fatty amide-based, or silica powder. The demoulding process. By releasing the surface of the separator 5, when the film substrate 1 and the separator 5 are peeled off, they can be maintained at the interface between the adhesive layer 2 and the separator 5 to be peeled off and fixed on the film substrate 1 The state of the adhesive layer 2.

[補強膜之使用] 本發明之補強膜係貼合於裝置或裝置構成零件而使用。補強膜10係黏著劑層2與膜基材1固著,於與被黏著體貼合後且光硬化前,對被黏著體之接著力較小。因此,光硬化前,補強膜自被黏著體之剝離較容易,且二次加工性優異。又,光硬化前,將補強膜切斷並將被黏著體表面之一部分之區域之補強膜去除等加工亦可容易地進行。[Use of Reinforcement Membrane] The reinforcing film of the present invention is used by being attached to a device or device component. The reinforcing film 10 is fixed by the adhesive layer 2 and the film substrate 1, and after being attached to the adherend and before being hardened by light, the adhesion force to the adherend is small. Therefore, before photocuring, the reinforcing film is easily peeled off from the adherend, and the secondary processability is excellent. In addition, before photocuring, processing such as cutting the reinforcing film and removing the reinforcing film in a part of the surface of the adherend can also be easily performed.

供補強膜貼合之被黏著體並無特別限定,可列舉各種電子裝置、光學裝置及其構成零件等。補強膜可貼合於被黏著體之整個面,亦可選擇性地僅貼合於需要補強之部分。又,亦可將補強膜貼合於被黏著體之整個面之後,將無需補強之部位之補強膜切斷,並將補強膜剝離去除。若為光硬化前,則補強膜係暫黏於被黏著體表面之狀態,因此能夠自被黏著體之表面容易地將補強膜剝離去除。The adherend for bonding the reinforcing film is not particularly limited, and various electronic devices, optical devices, and their constituent parts can be cited. The reinforcing film can be attached to the entire surface of the adherend, or it can be selectively attached only to the part that needs reinforcement. In addition, after the reinforcing film is attached to the entire surface of the adherend, the reinforcing film at a portion that does not need to be reinforced may be cut, and the reinforcing film may be peeled off and removed. If it is before photocuring, the reinforcing film is temporarily adhered to the surface of the adherend, so the reinforcing film can be easily peeled off from the surface of the adherend.

<光硬化前之黏著劑層之特性> (接著力) 就使自被黏著體之剝離容易、防止補強膜於剝離後之被黏著體中之糊劑殘留之觀點而言,光硬化前之黏著劑層2與被黏著體之接著力較佳為5 N/25 mm以下,更佳為2 N/25 mm以下,進而較佳為1.3 N/25 mm以下。就防止保管或操作時之補強片材之剝離之觀點而言,光硬化前之黏著劑層2與被黏著體之接著力較佳為0.005 N/25 mm以上,更佳為0.01 N/25 mm以上,進而較佳為0.1 N/25 mm以上,尤佳為0.3 N/25 mm以上。<Characteristics of the adhesive layer before light curing> (Adhesion) From the viewpoint of facilitating the peeling from the adherend and preventing the residual of the reinforcing film in the adherend after peeling, the adhesive force between the adhesive layer 2 and the adherend before photocuring is preferably 5 N /25 mm or less, more preferably 2 N/25 mm or less, and further preferably 1.3 N/25 mm or less. From the viewpoint of preventing the peeling of the reinforcing sheet during storage or handling, the adhesive force between the adhesive layer 2 and the adherend before photocuring is preferably 0.005 N/25 mm or more, more preferably 0.01 N/25 mm The above is more preferably 0.1 N/25 mm or more, and particularly preferably 0.3 N/25 mm or more.

補強膜較佳為於使黏著劑層光硬化前之狀態下對聚醯亞胺膜之接著力為上述範圍內。於撓性顯示面板、撓性印刷配線板(FPC)、將顯示面板與配線板一體化而成之裝置等中,使用可撓性之基板材料,就耐熱性或尺寸穩定性之觀點而言,一般使用聚醯亞胺膜。黏著劑層對作為基板之聚醯亞胺膜具有上述接著力之補強膜於黏著劑之光硬化前容易剝離,光硬化後接著可靠性優異。The reinforcing film preferably has an adhesive force to the polyimide film in a state before photocuring the adhesive layer within the above range. For flexible display panels, flexible printed wiring boards (FPCs), devices integrating display panels and wiring boards, etc., flexible substrate materials are used, from the viewpoint of heat resistance or dimensional stability, Polyimide membranes are generally used. The adhesive layer has the above-mentioned adhesive force to the polyimide film as the substrate. The reinforcing film is easily peeled off before the photocuring of the adhesive, and the reliability after photocuring is excellent.

(儲存模數) 黏著劑層2較佳為光硬化前之25℃下之剪切儲存模數G'i 為1×104 ~1.2×105 Pa。剪切儲存模數(以下,僅記載為「儲存模數」)係藉由讀取依據JIS K7244-1「塑膠-動態機械特性之試驗方法」所記載之方法於頻率1 Hz之條件下於-50~150℃之範圍以升溫速度5℃/min進行測定時的特定溫度下之值而求出。(Storage Modulus) The adhesive layer 2 preferably has a shear storage modulus G′ i at 25° C. before light curing of 1×10 4 to 1.2×10 5 Pa. Shear storage modulus (hereinafter, only referred to as "storage modulus") is obtained by reading the method described in JIS K7244-1 "Plastics-Dynamic Mechanical Properties Test Method" at a frequency of 1 Hz under- The range of 50 to 150° C. is obtained as a value at a specific temperature when the temperature rise rate is 5° C./min.

於如黏著劑般表現出黏彈性之物質中,儲存模數G'用作表示硬度之程度之指標。黏著劑層之儲存模數與凝集力具有較高之關聯,存在如下傾向:黏著劑之凝集力越高,於被黏著體之抓固力變得越大。光硬化前之黏著劑層2之儲存模數只要為1×104 Pa以上,則黏著劑具有充分之硬度及凝集力,因此於自被黏著體將補強膜剝離時不易產生於被黏著體之糊劑殘留。又,於黏著劑層2之儲存模數較大之情形時,可抑制黏著劑自補強膜之端面溢出。光硬化前之黏著劑層2之儲存模數只要為1.2×105 Pa以下,則於黏著劑層2與被黏著體之界面之剝離容易,於進行二次加工之情形時,亦不易產生黏著劑層之凝集破壞或於被黏著體表面之糊劑殘留。In a substance that exhibits viscoelasticity like an adhesive, the storage modulus G'is used as an indicator of the degree of hardness. The storage modulus of the adhesive layer has a high correlation with the cohesive force, and there is a tendency that the higher the cohesive force of the adhesive, the greater the holding power of the adherend becomes. As long as the storage modulus of the adhesive layer 2 before photohardening is 1×10 4 Pa or more, the adhesive has sufficient hardness and cohesive force, so when the reinforcing film is peeled from the adherend, it is not likely to be generated from the adherend Paste remains. In addition, when the storage modulus of the adhesive layer 2 is large, the adhesive can be prevented from overflowing from the end surface of the reinforcing film. As long as the storage modulus of the adhesive layer 2 before photohardening is 1.2×10 5 Pa or less, it is easy to peel off at the interface between the adhesive layer 2 and the adherend, and it is not easy to cause adhesion when performing secondary processing The aggregation of the adhesive layer is destroyed or the paste remains on the surface of the adherend.

就提高補強片材之二次加工性從而抑制二次加工時之於被黏著體之糊劑殘留之觀點而言,黏著劑層2之光硬化前之25℃下之儲存模數G'i 更佳為3×104 ~1×105 Pa,進而較佳為4×104 ~9.5×104 Pa。From the viewpoint of improving the secondary processability of the reinforcing sheet and suppressing the paste residue on the adherend during secondary processing, the storage modulus G′ i of the adhesive layer 2 at 25° C. before light curing It is preferably 3×10 4 to 1×10 5 Pa, and more preferably 4×10 4 to 9.5×10 4 Pa.

<黏著劑層之光硬化> 藉由將補強膜貼合於被黏著體之後對黏著劑層2照射活性光線,而使黏著劑層光硬化。作為活性光線,可列舉紫外線、可見光、紅外線、X射線、α射線、β射線、及γ射線等。就能夠抑制保管狀態下之黏著劑層之硬化且容易硬化之方面而言,作為活性光線,較佳為紫外線。活性光線之照射強度或照射時間根據黏著劑層之組成或厚度等適當設定即可。對黏著劑層2之活性光線之照射可自膜基材1側及被黏著體側之任一面實施,亦可自兩面進行活性光線之照射。<Light curing of adhesive layer> After the reinforcing film is attached to the adherend, the adhesive layer 2 is irradiated with active light to harden the adhesive layer. Examples of the active rays include ultraviolet rays, visible rays, infrared rays, X rays, α rays, β rays, and γ rays. In terms of suppressing the hardening of the adhesive layer in the storage state and easily curing, the active light is preferably ultraviolet light. The irradiation intensity or irradiation time of the active light may be appropriately set according to the composition or thickness of the adhesive layer. The irradiation of the active light on the adhesive layer 2 can be performed from either side of the film substrate 1 side and the side of the adherend, or the irradiation of the active light can be performed from both sides.

<光硬化後之黏著劑層之特性> (接著力) 就裝置之實用時之接著可靠性之觀點而言,光硬化後之黏著劑層2與被黏著體之接著力較佳為6 N/25 mm以上,更佳為10 N/25 mm以上,進而較佳為12 N/25 mm以上,尤佳為14 N/25 mm以上。補強膜較佳為光硬化後之黏著劑層對聚醯亞胺膜具有上述範圍之接著力。光硬化後之黏著劑層2與被黏著體之接著力較佳為光硬化前之黏著劑層2與被黏著體之接著力之4倍以上,更佳為8倍以上,進而較佳為10倍以上。<Characteristics of the adhesive layer after light curing> (Adhesion) From the viewpoint of practical reliability of the device, the adhesive force between the adhesive layer 2 and the adherend after photohardening is preferably 6 N/25 mm or more, more preferably 10 N/25 mm or more, and It is preferably 12 N/25 mm or more, and particularly preferably 14 N/25 mm or more. The reinforcing film is preferably an adhesive layer after photo-hardening that has an adhesion to the polyimide film in the above range. The adhesive force between the adhesive layer 2 and the adherend after photohardening is preferably more than 4 times the adhesive force between the adhesive layer 2 and the adherend before photohardening, more preferably 8 times and more preferably 10 More than times.

黏著劑層2較佳為光硬化後之25℃下之儲存模數G'f 為1.5×105 Pa以上。若光硬化後之黏著劑層2之儲存模數為1.5×105 Pa以上,則隨著凝聚力之增大,與被黏著體之接著力提昇,可獲得較高之接著可靠性。另一方面,於儲存模數過大之情形時,黏著劑難以潤濕擴展,與被黏著體之接觸面積變小。又,黏著劑之應力分散性降低,因此存在剝離力容易傳播至接著界面,與被黏著體之接著力降低之傾向。因此,黏著劑層2之光硬化後之25℃下之儲存模數G'f 較佳為2×106 Pa以下。就提高使黏著劑層光硬化後之補強片材之接著可靠性之觀點而言,G'f 更佳為1.8×105 ~1.2×106 Pa,進而較佳為2×105 ~1×106 Pa。The adhesive layer 2 preferably has a storage modulus G′ f at 25° C. after photocuring of 1.5×10 5 Pa or more. If the storage modulus of the adhesive layer 2 after photohardening is 1.5×10 5 Pa or more, as the cohesion increases, the adhesion with the adherend increases, and a higher adhesion reliability can be obtained. On the other hand, when the storage modulus is too large, the adhesive is difficult to wet and expand, and the contact area with the adherend becomes smaller. In addition, the stress dispersibility of the adhesive decreases, so there is a tendency that the peeling force easily propagates to the adhesive interface and the adhesive force with the adherend decreases. Therefore, the storage modulus G′ f at 25° C. after photo-curing of the adhesive layer 2 is preferably 2×10 6 Pa or less. To improve the adhesive layer so that the reinforcing sheet of the photohardenable Next viewpoint of reliability purposes, G 'f is more preferably 1.8 × 10 5 ~ 1.2 × 10 6 Pa, and further preferably 2 × 10 5 ~ 1 × 10 6 Pa.

黏著劑層2之光硬化前後之25℃下之儲存模數之比G'f /G'i 較佳為2以上。若G'f 為G'i 之2倍以上,則藉由光硬化而引起之G'之增加較大,可兼顧光硬化前之二次加工性及光硬化後之接著可靠性。G'f /G'i 更佳為4以上,進而較佳為8以上,尤佳為10以上。G'f /G'i 之上限並無特別限定,於G'f /G'i 過大之情形時,容易導致因光硬化前之G'較小而引起之初期接著不良、或因光硬化後之G'過大而引起之接著可靠性之降低。因此,G'f /G'i 較佳為100以下,更佳為40以下,進而較佳為30以下,尤佳為25以下。The ratio G′ f /G′ i of the storage modulus at 25° C. before and after the light curing of the adhesive layer 2 is preferably 2 or more. If G 'is F G' i of 2 times or more, the hardening caused by the light of the G 'of the increase is large, secondary processability can be both before and after photohardening of the photohardenable Next reliability. G'f /G' i is more preferably 4 or more, further preferably 8 or more, and particularly preferably 10 or more. G 'f / G' of the upper limit of i is not particularly limited, to G 'f / G' of the case when i is too large, easily lead to the front of the photo-curing by G 'is small and the initial cause of the failure and then, after the photohardening or because The G'is too large and the subsequent reliability decreases. Therefore, G'f /G' i is preferably 100 or less, more preferably 40 or less, and further preferably 30 or less, particularly preferably 25 or less.

附設補強膜後之被黏著體存在進行以複數個積層構件之積層界面之親和性提昇等為目的之高壓釜處理處理、或為了電路構件接合之熱壓著等加熱處理的情況。於進行此種加熱處理時,較佳為補強膜與被黏著體之間之黏著劑不自端面流動。The adherend after the reinforcement film is provided may be subjected to autoclave treatment for the purpose of improving the affinity of the lamination interface of a plurality of lamination members, or heat treatment such as thermocompression for circuit member joining. When performing such heat treatment, it is preferable that the adhesive between the reinforcing film and the adherend does not flow from the end surface.

就抑制高溫加熱時之黏著劑之溢出之觀點而言,光硬化後之黏著劑層2之100℃下之儲存模數較佳為5×104 Pa以上,更佳為8×104 Pa以上,進而較佳為1×105 Pa以上。就防止加熱時之黏著劑之溢出、以及防止加熱時之接著力降低之觀點而言,光硬化後之黏著劑層2之100℃下之儲存模數較佳為50℃下之儲存模數之60%以上,更佳為65%以上,進而較佳為70%以上,尤佳為75%以上。From the viewpoint of suppressing the overflow of the adhesive during high-temperature heating, the storage modulus of the adhesive layer 2 after photocuring at 100°C is preferably 5×10 4 Pa or more, more preferably 8×10 4 Pa or more It is more preferably 1×10 5 Pa or more. From the viewpoint of preventing the overflow of the adhesive during heating and preventing the reduction of the adhesive force during heating, the storage modulus of the adhesive layer 2 after light curing at 100°C is preferably the storage modulus at 50°C 60% or more, more preferably 65% or more, further preferably 70% or more, particularly preferably 75% or more.

[補強膜之使用形態] 本發明之補強膜係貼合於各種裝置之構成構件(半成品)、或完成後之裝置而使用。由於藉由貼合補強膜可賦予適度之剛性,因此可期待操作性提昇或破損防止效果。於裝置之製造步驟中,於對半成品貼合補強膜之情形時,可對切斷成製品尺寸之前之大的半成品貼合補強膜。亦可將補強膜以卷對卷貼合於藉由卷對卷處理(role to role process)而製造之裝置之母輥。[Use Form of Reinforcement Membrane] The reinforcing film of the present invention is used by being attached to the constituent members (semi-finished products) of various devices or completed devices. Since appropriate rigidity can be imparted by bonding the reinforcing film, it is expected to improve operability or prevent damage. In the manufacturing process of the device, when the reinforcement film is bonded to the semi-finished product, the reinforcement film may be bonded to the large semi-finished product before cutting to the size of the product. It is also possible to apply the reinforcing film on a roll-to-roll basis to the mother roll of a device manufactured by a roll-to-roll process.

隨著裝置之高度積體化、小型輕量化及薄型化,存在構成裝置之構件之厚度變小之傾向。由於構成構件之薄型化,容易產生起因於積層界面之應力等而引起之彎曲或捲曲。又,由於薄型化,容易產生由自重引起之撓曲。由於藉由貼合補強膜能夠對被黏著體賦予剛性,因此可抑制由應力或自重等而引起之彎曲、捲曲、撓曲等,且操作性提昇。因此,可藉由於裝置之製造步驟中對半成品貼合補強膜而防止由自動化之裝置而引起之搬送或加工時之不良或不良情況。As the device is highly integrated, compact, lightweight, and thin, the thickness of the components constituting the device tends to become smaller. Due to the thinning of the constituent members, it is easy to cause bending or curling due to stress or the like at the lamination interface. In addition, due to the reduction in thickness, it is easy to cause deflection due to its own weight. By attaching the reinforcing film, rigidity can be imparted to the adherend, so that bending, curling, and deflection caused by stress, dead weight, etc. can be suppressed, and operability is improved. Therefore, by attaching a reinforcement film to the semi-finished product in the manufacturing process of the device, it is possible to prevent defects or defects in the transportation or processing caused by the automated device.

於自動搬送中,作為搬送對象之半成品與搬送臂或銷等之接觸不可避免。又,存在為了形狀之調整或去除無用部分而進行半成品之切斷加工之情況。經高度積體化、小型輕量化及薄型化之裝置於與搬送裝置等之接觸或切斷加工時,容易產生因局部之應力之集中而引起之破損。於積層複數個構件而成之裝置之製造步驟中,不僅存在將構件依序積層之情況,而且存在自半成品將構件之一部分或工程材料等剝離去除之情況。於構件進行過薄型化之情形時,存在應力局部地集中於剝離部位及其附近而產生破損或尺寸變化之情況。由於補強膜具有藉由黏著劑層而得之應力分散性,因此可藉由對搬送對象物及加工對象物貼合補強膜,而賦予適度之剛性,並且使應力得到緩和、分散從而抑制龜裂、破裂、剝落、尺寸變化等不良情況。In automatic conveyance, the contact between the semi-finished product to be conveyed and the conveying arm or pin is inevitable. In addition, there is a case where a semi-finished product is cut for adjustment of shape or removal of unnecessary parts. When the highly integrated, compact, lightweight and thin device comes into contact with the conveying device or is cut, it is easy to cause damage due to the local concentration of stress. In the manufacturing process of a device in which a plurality of components are laminated, not only the components are sequentially stacked, but also a part of the components or engineering materials are peeled off and removed from the semi-finished product. When the member is excessively thinned, stress may be locally concentrated at the peeling site and its vicinity to cause damage or dimensional change. Since the reinforcing film has the stress dispersibility obtained by the adhesive layer, it can be given appropriate rigidity by attaching the reinforcing film to the object to be transported and the object to be processed, and the stress can be relaxed and dispersed to suppress cracking. , Cracks, flaking, dimensional changes and other adverse conditions.

如此,由於藉由貼合本發明之補強膜,可對作為被黏著體之半成品賦予適度之剛性,並且使應力得到緩和、分散,因此能夠抑制於製造步驟中有可能產生之各種不良情況,使生產效率提昇,改善良率。又,補強膜由於在使黏著劑層光硬化之前,自被黏著體之剝離較容易,因此於積層或產生貼合不良之情形時亦容易二次加工。In this way, by attaching the reinforcing film of the present invention, moderate rigidity can be imparted to the semi-finished product as the adherend, and the stress can be relaxed and dispersed. Therefore, it is possible to suppress various defects that may occur in the manufacturing process. Increased production efficiency and improved yield. In addition, the reinforcement film is easier to peel from the adherend before photocuring the adhesive layer, so it is also easy to perform secondary processing in the case of lamination or occurrence of poor bonding.

本發明之補強膜其黏著劑層2為光硬化性,可任意地設定硬化之時點。二次加工或補強膜之加工等處理由於可於將被黏著體黏貼設置於補強膜之後至使黏著劑光硬化前之間之任意時點實施,因此可靈活地應對裝置之製造步驟之準備時間。如上所述,由於黏著劑層除光硬化劑及光自由基起始劑以外含有抗氧化劑,故而不易進行由螢光燈等之光而引起之光硬化。因此,即便於以將補強膜黏貼設置於被黏著體之狀態長時間保管之情形時,只要為光硬化之前,補強膜亦容易自被黏著體剝離。In the reinforcing film of the present invention, the adhesive layer 2 is photocurable, and the time of curing can be set arbitrarily. The secondary processing or the processing of the reinforcing film can be performed at any time between after the adherend is placed on the reinforcing film and before the adhesive is photocured, so it can flexibly respond to the preparation time of the manufacturing steps of the device. As described above, since the adhesive layer contains antioxidants in addition to the light hardener and the light radical initiator, it is not easy to perform light hardening caused by light such as fluorescent lamps. Therefore, even in the case where the reinforcing film is attached to the adherend and stored for a long time, as long as it is before photocuring, the reinforcing film is easily peeled off from the adherend.

於完成後之裝置之使用中,於因裝置之掉落、重貨於裝置上之載置、飛來物對裝置之碰撞等而意外地負擔外力之情形時,亦可藉由貼合補強膜而防止裝置之破損。又,使黏著劑光硬化後之補強膜由於牢固地接著於裝置,因此於長期使用中,補強膜亦不易剝落,且可靠性優異。 [實施例]In the use of the completed device, when the external force is accidentally burdened due to the drop of the device, the placement of heavy goods on the device, the collision of flying objects on the device, etc., the reinforcement film can also be attached by And prevent the damage of the device. In addition, since the reinforcing film after photocuring the adhesive is firmly attached to the device, the reinforcing film is not likely to peel off during long-term use, and is excellent in reliability. [Example]

以下列舉實施例進一步進行說明,但本發明並不限定於該等實施例。The following examples are further described, but the present invention is not limited to these examples.

[補強膜之製作] <基礎聚合物之聚合> 於具備溫度計、攪拌機、回流冷凝管及氮氣導入管之反應容器中投入作為單體之丙烯酸2-乙基己酯(2EHA)63重量份、N-乙烯基吡咯啶酮(NVP)15重量份、甲基丙烯酸甲酯(MMA)9重量份、及丙烯酸羥基乙酯(HEA)13重量份、作為熱聚合起始劑之偶氮雙異丁腈0.2重量份、以及作為溶劑之乙酸乙酯233重量份,並流入氮氣,一面攪拌一面進行約1小時氮氣置換。其後,加熱至60℃,使之反應7小時,獲得重量平均分子量(Mw)為120萬之丙烯酸系聚合物之溶液。[Production of Reinforcement Membrane] <polymerization of base polymer> 63 parts by weight of 2-ethylhexyl acrylate (2EHA) as monomers and 15 parts by weight of N-vinylpyrrolidone (NVP) were put into a reaction vessel equipped with a thermometer, a stirrer, a reflux condenser and a nitrogen introduction tube. 9 parts by weight of methyl methacrylate (MMA), 13 parts by weight of hydroxyethyl acrylate (HEA), 0.2 parts by weight of azobisisobutyronitrile as a thermal polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent Nitrogen was added, and nitrogen was introduced, and nitrogen substitution was performed for about 1 hour while stirring. Thereafter, it was heated to 60°C and allowed to react for 7 hours to obtain a solution of an acrylic polymer having a weight average molecular weight (Mw) of 1.2 million.

<黏著劑組合物之製備> 於丙烯酸系聚合物溶液中添加作為交聯劑之三井化學製造之「Takenate D110N」(苯二甲基二異氰酸酯之三羥甲基丙烷加成物之75%乙酸乙酯溶液)、作為多官能丙烯酸系單體之新中村化學工業製造之「A-200」(聚乙二醇#200(n=4)二丙烯酸酯;分子量308,官能基當量154 g/eq)、光自由基起始劑、及抗氧化劑並均勻地混合,製備黏著劑組合物。交聯劑之調配量(固形物成分)設為相對於基礎聚合物100重量份為2.5重量份,多官能丙烯酸系單體之調配量設為相對於基礎聚合物100重量份為30重量份。作為抗氧化劑,以表1所示之量調配季戊四醇四[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯](BASF製造之「Irganox 1010」)。作為光自由基起始劑,以表1所示之量調配以下所示者。<Preparation of adhesive composition> "Takenate D110N" (75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate) manufactured by Mitsui Chemicals as a crosslinking agent is added to the acrylic polymer solution as multifunctional acrylic acid "A-200" (polyethylene glycol #200 (n=4) diacrylate; molecular weight 308, functional group equivalent 154 g/eq) manufactured by Shin Nakamura Chemical Industry, a monomer, photo radical initiator, And antioxidant and mixed uniformly to prepare an adhesive composition. The compounding amount (solid content) of the crosslinking agent was 2.5 parts by weight with respect to 100 parts by weight of the base polymer, and the compounding amount of the polyfunctional acrylic monomer was 30 parts by weight with respect to 100 parts by weight of the base polymer. As an antioxidant, pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] ("Irganox 1010" manufactured by BASF) was prepared in the amounts shown in Table 1. As photo radical initiators, the followings were prepared in the amounts shown in Table 1.

(光自由基起始劑) IRG184:1-羥基環己基苯基酮(BASF製造之「Irgacure 184」,吸收極大波長:246 nm、280 nm、333 nm) IRG651:2,2-二甲氧基-1,2-二苯基乙烷-1-酮(BASF製造之「Irgacure 651」,吸收極大波長:250 nm、340 nm) IRG819:雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(BASF製造之「Irgacure 819」,吸收極大波長:295 nm、370 nm)(Photo radical initiator) IRG184: 1-hydroxycyclohexyl phenyl ketone ("Irgacure 184" manufactured by BASF, absorption maximum wavelength: 246 nm, 280 nm, 333 nm) IRG651: 2,2-dimethoxy-1,2-diphenylethane-1-one ("Irgacure 651" manufactured by BASF, absorption maximum wavelength: 250 nm, 340 nm) IRG819: Bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide ("Irgacure 819" manufactured by BASF, absorption maximum wavelength: 295 nm, 370 nm)

<黏著劑溶液之塗佈及交聯> 於未經表面處理之厚度75 μm之聚對苯二甲酸乙二酯膜(Toray製造之「Lumirror S10」)上以乾燥後之厚度成為25 μm之方式使用槽輥塗佈上述黏著劑組合物。於130℃下乾燥1分鐘將溶劑去除,其後,於黏著劑之塗佈面貼合隔離件(表面進行過聚矽氧脫模處理之厚度25 μm之聚對苯二甲酸乙二酯膜)之脫模處理面。其後,於25℃之環境下進行4天之老化處理,使交聯進行,而獲得於膜基材上固著積層有光硬化性黏著片且於其上暫黏有隔離件之補強膜。<Coating and crosslinking of adhesive solution> The above adhesive composition was applied to a 75 μm thick polyethylene terephthalate film (“Lumirror S10” manufactured by Toray) without surface treatment so that the thickness after drying became 25 μm using a grooved roller. Dry at 130°C for 1 minute to remove the solvent. Then, attach the separator to the coated surface of the adhesive (polyethylene terephthalate film with a thickness of 25 μm subjected to silicone release on the surface) The demolding surface. After that, aging treatment was carried out in an environment of 25°C for 4 days to allow crosslinking to proceed, and a reinforced film with a light-curing adhesive sheet laminated on the film substrate and a separator temporarily adhered thereto was obtained.

[接著力之測定] 將厚度12.5 μm之聚醯亞胺膜(DU PONT-TORAY製造之「Kapton 50EN」)經由雙面膠帶(日東電工製造之「No.531」)貼附於玻璃板,獲得測定用聚醯亞胺膜基板。自切取為寬度25 mm×長度100 mm之補強膜之表面將隔離件剝離去除,並使用手壓輥貼合於測定用聚醯亞胺膜基板,作為光硬化前之試驗樣品。自光硬化前之試驗樣品之補強膜側(PET膜側)使用波長365 nm之LED光源照射累計光量400 mJ/cm2 之紫外線使黏著劑層光硬化,將所得者作為光硬化後之試驗樣品。使用該等試驗樣品,利用夾頭保持作為補強膜之聚對苯二甲酸乙二酯膜之端部,以拉伸速度300 mm/min進行補強膜之180°剝離,並測定剝離強度。[Measurement of adhesive force] A polyimide film (“Kapton 50EN” manufactured by DU PONT-TORAY) with a thickness of 12.5 μm was attached to the glass plate via a double-sided tape (“No. 531” manufactured by Nitto Denko) to obtain Polyimide film substrate for measurement. The surface of the reinforcing film with a width of 25 mm×100 mm in length was cut off and the separator was peeled off and removed, and attached to the polyimide film substrate for measurement using a hand pressure roller as a test sample before light curing. Reinforce the film side (PET film side) of the test sample before photo-curing using an LED light source with a wavelength of 365 nm to irradiate ultraviolet light with a cumulative light amount of 400 mJ/cm 2 to photo-harden the adhesive layer, and use the obtained as the test sample after photo-hardening . Using these test samples, the end of the polyethylene terephthalate film used as the reinforcing film was held by a chuck, the reinforcing film was peeled at 180° at a tensile speed of 300 mm/min, and the peel strength was measured.

<一定時間保管後之補強膜之接著力之評價> 將補強片材於常溫之明室下靜置,於1週後及4週後,與測定用聚醯亞胺膜基板貼合,針對光硬化前及光硬化後之試驗樣品,與上述相同地測定180°剝離強度。<Evaluation of the adhesion of the reinforcing film after storage for a certain period of time> The reinforcing sheet was allowed to stand under a bright room at room temperature, and after 1 and 4 weeks, it was bonded to the polyimide film substrate for measurement. The test samples before and after photocuring were the same as above. The 180° peel strength was measured.

將各補強膜之黏著劑之組成、及光硬化前後之接著力之測定結果示於表1。Table 1 shows the measurement results of the adhesive composition of each reinforcing film and the adhesion before and after light curing.

[表1]

Figure 108122529-A0304-0001
[Table 1]
Figure 108122529-A0304-0001

任一試樣均於剛製作後,光硬化前之接著力為0.2~0.4 N/25 mm之範圍而容易自被黏著體剝離,光硬化後,接著力上升至15 N/25 mm以上,與被黏著體牢固地接著。Immediately after fabrication, the adhesion force of any sample was 0.2 to 0.4 N/25 mm before light hardening and could be easily peeled off from the adhesive body. After light hardening, the adhesion force rose to more than 15 N/25 mm, and The adherend adheres firmly.

使用不含抗氧化劑之接著劑之試樣10於保管4週後之試樣中,光硬化前之接著力大幅上升,難以自被黏著體剝離。另一方面,添加0.1重量份之抗氧化劑之試樣11於保管4週後之試樣中,光硬化前之接著力稍有上升,但充分可自被黏著體剝離。又,試樣11保管4週後之試樣之光硬化後之接著力與剛製作後之試樣同等。In the sample 10 using an antioxidant-free adhesive, the adhesive force before photo-curing greatly increased in the sample after 4 weeks of storage, and it was difficult to peel from the adherend. On the other hand, in the sample 11 to which 0.1 parts by weight of antioxidant was added, the adhesion force before light curing slightly increased in the sample after 4 weeks of storage, but it was sufficiently peelable from the adherend. In addition, the adhesion force of the sample 11 after being stored for 4 weeks after photocuring was the same as that of the sample immediately after preparation.

使用不含抗氧化劑之接著劑之試樣20及試樣30與試樣10同樣地,於保管4週後之試樣中,可觀察到光硬化前之接著力大幅上升。試樣20及試樣30於保管1週後之試樣中,光硬化前之接著力亦上升至10 N/25 mm以上。添加0.1重量份之抗氧化劑之試樣21及試樣31於保管1週後之試樣中,亦光硬化前接著力較低,且光硬化後表現出較高之接著力。In the samples 20 and 30 using the antioxidant-free adhesive, as in the sample 10, in the samples after 4 weeks of storage, a large increase in the adhesive force before photocuring was observed. In the samples 20 and 30 stored for 1 week, the adhesion force before light curing also increased to 10 N/25 mm or more. Samples 21 and 31 to which 0.1 parts by weight of antioxidants were added also had a lower adhesion before photo-curing in samples after storage for 1 week, and showed a higher adhesion after photo-curing.

根據以上結果之對比,可知:藉由將光自由基起始劑與抗氧化劑併用,可獲得如下補強膜,其即便於在螢光燈下長時間保管之情形時,光硬化前自被黏著體剝離之二次加工性亦優異,且藉由光硬化對被黏著體表現出較高之接著力。From the comparison of the above results, it can be seen that by using a photo radical initiator and an antioxidant together, the following reinforcing film can be obtained, which even when stored under a fluorescent lamp for a long time, before being hardened by the adherend The secondary workability of peeling is also excellent, and exhibits high adhesion to the adherend by light curing.

添加抗氧化劑0.5重量份之試樣12保管1週後,藉由光硬化而得之接著力之上升率降低,保管4週後,即便照射紫外線,接著力亦幾乎未上升。添加抗氧化劑1重量份之試樣13於保管1週後,藉由紫外線照射而得之接著力之上升亦不充分。於試樣21~23之對比、及試樣31~33之對比中,亦可見隨著抗氧化劑之添加量之增加,即便進行紫外線照射,接著力亦不會上升之傾向。After the sample 12 containing 0.5 parts by weight of the antioxidant was stored for 1 week, the rate of increase in the adhesive strength obtained by photocuring was reduced. After 4 weeks of storage, the adhesive strength hardly increased even after ultraviolet irradiation. The sample 13 to which 1 part by weight of the antioxidant was added was stored for 1 week, and the increase in adhesive force by ultraviolet irradiation was also insufficient. In the comparison of samples 21 to 23 and the comparison of samples 31 to 33, it can also be seen that as the amount of antioxidant added increases, even if ultraviolet irradiation is performed, the adhesive force tends not to increase.

根據該等結果,可謂於抗氧化劑之添加量較大之情形時,存在隨著距製備試樣之保管時間變長而難以進行光硬化之傾向。認為其原因在於:隨著距製備試樣之螢光燈下之保管時間變長,光自由基起始劑失活,即便進行紫外線照射,自由基生成量亦較小。From these results, it can be said that when the amount of the antioxidant added is large, it tends to be difficult to perform photo-curing as the storage time from the preparation sample becomes longer. It is considered that the reason is that as the storage time under the fluorescent lamp for preparing the sample becomes longer, the photo radical initiator is deactivated, and even if ultraviolet irradiation is performed, the amount of radical generation is also small.

若於螢光燈下之保管時間變長,光自由基起始劑之實效濃度降低,則於紫外線照射時生成之自由基量減少。抗氧化劑具有捕獲因保管環境之螢光燈等之光而自光自由基起始劑生成之自由基,阻礙不期望之光自由基聚合的作用,但於為了光硬化而照射紫外線之情形時,亦具有捕獲自由基之作用。因此,於在螢光燈下之保管時間變長,光自由基起始劑之實效濃度較低之情形時,自光自由基起始劑生成之光自由基中被抗氧化劑捕獲之自由基之比率變高,有助於光自由基聚合之自由基之比率變低。由於抗氧化劑之含量越大,聚合抑制效果(聚合阻礙)越大,故而認為:即便照射紫外線亦不易進行光硬化劑之光自由基反應,接著力不會充分地上升。If the storage time under a fluorescent lamp becomes longer and the effective concentration of the photo radical initiator decreases, the amount of free radicals generated during ultraviolet irradiation decreases. Antioxidants have the effect of trapping the free radicals generated from light radical initiators due to the light of fluorescent lamps and the like in the storage environment, and inhibiting the undesired light radical polymerization, but in the case of ultraviolet irradiation for photohardening, It also has the effect of capturing free radicals. Therefore, when the storage time under the fluorescent lamp becomes longer and the effective concentration of the photo radical initiator is lower, the free radicals captured by the antioxidants among the photo radicals generated from the photo radical initiator The higher the ratio, the lower the ratio of free radicals that contribute to photo radical polymerization. Since the greater the content of the antioxidant, the greater the polymerization inhibition effect (polymerization inhibition), it is considered that the photo-radical reaction of the photo-hardener is not easy to proceed even when irradiated with ultraviolet rays, and the adhesive force does not sufficiently increase.

根據以上結果,可知:藉由適當地調整與光自由基起始劑併用之抗氧化劑之量,可獲得如下補強膜:其即便於在螢光燈下之保管時間較長之情形時,光硬化前自被黏著體剝離之二次加工性亦優異,且藉由紫外線照射適當地進行光硬化,能夠實現較高之接著力。From the above results, it can be seen that by appropriately adjusting the amount of antioxidants used in combination with the photo radical initiator, the following reinforcing film can be obtained: even when the storage time under a fluorescent lamp is long, the light is hardened The secondary workability before peeling off from the adherend is also excellent, and proper light curing by ultraviolet irradiation can achieve a high adhesion.

[藉由電子自旋共振而進行之自由基濃度之測定及探討] 為了驗證上述實施例中所使用之光自由基起始劑之自由基生成量及抗氧化劑之效果,以極低溫照射光,並藉由ESR評價自由基生成量。[Measurement and discussion of free radical concentration by electron spin resonance] In order to verify the radical generation amount of the photo radical initiator used in the above examples and the effect of the antioxidant, light was irradiated at an extremely low temperature, and the radical generation amount was evaluated by ESR.

針對單獨使用光自由基起始劑(IRG184、IRG651或IRG819)、單獨使用抗氧化劑(Irganox 1010)、及光自由基起始劑(Irg651或Irg819)與抗氧化劑之併用體系之各者,製備濃度0.2莫耳/L之乙酸乙酯溶液(併用體系中係將各者之濃度設為0.2莫耳/L)。將試樣溶液0.1 mL裝填於ESR試樣管(約3.5 mmϕ之石英管),並設置於ESR之腔內,以溫度40 K實施光照射ESR測定。光照射之燈使用超高壓水銀燈(Ushio製造),藉由玻璃濾波器截斷波長290 nm以下之短波長光,並藉由水濾波器截斷熱線。於腔之正面所測得之照度(波長365 nm)為18 mW/cm2 。將裝置及主要測定條件示於以下。The concentration is prepared for each of the systems using photo radical initiator alone (IRG184, IRG651 or IRG819), antioxidant alone (Irganox 1010), and photo radical initiator (Irg651 or Irg819) combined with antioxidant 0.2 mol/L ethyl acetate solution (the concentration of each is set to 0.2 mol/L in the combined system). Load 0.1 mL of the sample solution in an ESR sample tube (about 3.5 mmϕ quartz tube) and set it in the ESR cavity, and perform ESR measurement with light irradiation at a temperature of 40 K. The light irradiation lamp uses an ultra-high pressure mercury lamp (manufactured by Ushio), which cuts off short-wavelength light below 290 nm with a glass filter, and cuts off the hot wire with a water filter. The illuminance (wavelength 365 nm) measured on the front of the cavity was 18 mW/cm 2 . The device and main measurement conditions are shown below.

裝置:ESP350E(BRUKER製造) 附屬裝置:HP5351B微波頻率計數器(HEWLETT PACKARD製造) ER035M高斯計(BRUKER製造) ESR910低溫恆溫器(BRUKER製造) 腔:TM110,圓筒型 測定溫度:40 K 中心磁場:3385 G 磁場掃描寬度:400 G 調變:100 kHz,10 G 微波:9.49 GHz,0.16 mW 掃描時間:83.89秒×2次 時間常數:327.68毫秒 資料點數:1024Device: ESP350E (made by BRUKER) Attachment: HP5351B microwave frequency counter (manufactured by HEWLETT PACKARD) ER035M Gauss meter (made by BRUKER) ESR910 cryostat (made by BRUKER) Cavity: TM110, cylindrical Measuring temperature: 40 K Central magnetic field: 3385 G Magnetic field scanning width: 400 G Modulation: 100 kHz, 10 G Microwave: 9.49 GHz, 0.16 mW Scanning time: 83.89 seconds × 2 times Time constant: 327.68 milliseconds Data points: 1024

根據距光照射開始5分鐘後、10分鐘後、20分鐘後、30分鐘後、40分鐘後、50分鐘後及60分鐘後之ESR光譜,藉由校準曲線法對自由基量進行定量。針對各試樣,將對光照射時間及自由基濃度進行繪製而得之曲線圖示於圖4。Based on the ESR spectra after 5 minutes, 10 minutes, 20 minutes, 30 minutes, 40 minutes, 50 minutes, and 60 minutes after the start of light irradiation, the amount of free radicals was quantified by a calibration curve method. For each sample, a graph obtained by plotting light irradiation time and radical concentration is shown in FIG. 4.

針對3種光自由基起始劑進行觀察,Irgacure 819(IRG819)顯示出最高之自由基生成量。認為其原因在於:IRG819於波長370 nm顯示吸收極大,對照射光(波長365 nm)之感度較高。Irgacure 184(IRG184)及Irgacure 651(IRG651)中,Irgacure 651顯示較大之自由基生成量。Observed on three kinds of photo radical initiators, Irgacure 819 (IRG819) showed the highest amount of free radicals. The reason is believed to be that: IRG819 shows a maximum absorption at a wavelength of 370 nm, and a high sensitivity to the irradiated light (wavelength 365 nm). Among Irgacure 184 (IRG184) and Irgacure 651 (IRG651), Irgacure 651 shows a larger amount of free radical generation.

可見該等之自由基生成量與試樣10、試樣20及試樣30於螢光燈下保管時之光硬化前之接著力之變化之間存在關聯。即,認為:Irgacure 184由於由來自螢光燈之光引起之自由基之生成量較小,故而試樣10於保管1週後未見到光硬化前之接著力之上升,相對於此,使用Irgacure 651之試樣20及使用Irgacure 819之試樣30由於由來自螢光燈之光引起之光自由基生成量相對較大,故而於保管1週後之試樣中,光硬化前之接著力上升。It can be seen that there is a correlation between the amount of these free radicals generated and the change in the adhesive force before light curing when the sample 10, the sample 20, and the sample 30 are stored under fluorescent lamps. That is, Irgacure 184 is believed to have a relatively small amount of free radicals generated by light from fluorescent lamps. Therefore, sample 10 did not see an increase in adhesion before photohardening after being stored for 1 week. The sample 20 of Irgacure 651 and the sample 30 of Irgacure 819 have a relatively large amount of light radical generation caused by the light from the fluorescent lamp, so in the sample after 1 week of storage, the adhesion before light curing rise.

抗氧化劑(Irganox 1010)顯示出高於3種光自由基起始劑之自由基濃度。認為其原因在於自抗氧化劑生成之自由基之穩定性較高,與光自由基起始劑相比,自由基消失量較小,因此隨著光照射時間之增加,體系中累積之自由基量較多。The antioxidant (Irganox 1010) showed a higher free radical concentration than the three photo-radical initiators. It is believed that the reason is that the stability of the free radicals generated from the antioxidant is higher, and the amount of free radicals disappears is smaller than that of the light radical initiator. Therefore, as the light irradiation time increases, the amount of free radicals accumulated in the system More.

於光自由基起始劑(IRG651或IRG819)與抗氧化劑之併用體系中,顯示出低於抗氧化劑單獨使用之情形時之自由基濃度。由於併用體系之自由基濃度小於單獨使用光自由基起始劑之情形及單獨使用抗氧化劑之情形之合計,故而認為自光自由基起始劑生成之自由基被抗氧化劑捕獲。The combined system of a photo radical initiator (IRG651 or IRG819) and an antioxidant shows a lower free radical concentration than when the antioxidant is used alone. Since the free radical concentration of the combined system is less than the sum of the case of using the photo radical initiator alone and the case of using the antioxidant alone, it is considered that the radical generated from the photo radical initiator is trapped by the antioxidant.

1‧‧‧膜基材 2‧‧‧黏著劑層 5‧‧‧隔離件 10‧‧‧補強膜 20‧‧‧裝置1‧‧‧membrane substrate 2‧‧‧Adhesive layer 5‧‧‧Parts 10‧‧‧Reinforcement membrane 20‧‧‧ Installation

圖1係表示補強膜之積層構成之剖視圖。 圖2係表示補強膜之積層構成之剖視圖。 圖3係表示黏貼設置有補強膜之裝置之剖視圖。 圖4係表示由極低溫下之光照射引起之自由基生成量之測定結果的曲線圖。FIG. 1 is a cross-sectional view showing the laminated structure of the reinforcing film. Fig. 2 is a cross-sectional view showing the laminated structure of the reinforcing film. FIG. 3 is a cross-sectional view showing a device provided with a reinforcement film. 4 is a graph showing the measurement results of the amount of free radicals generated by light irradiation at an extremely low temperature.

Claims (9)

一種補強膜,其具備膜基材、及固著積層於上述膜基材之一主面上之黏著劑層;且 上述黏著劑層包含含有基礎聚合物、光硬化劑、光自由基起始劑、及抗氧化劑之光硬化性組合物,且相對於上述基礎聚合物100重量份包含上述光硬化劑10~50重量份、上述光自由基起始劑0.01~1重量份、及上述抗氧化劑0.01~2重量份。A reinforcing film comprising a film substrate and an adhesive layer fixedly deposited on one of the main surfaces of the film substrate; and The adhesive layer includes a photo-curable composition containing a base polymer, a photo hardener, a photo radical initiator, and an antioxidant, and contains 10 to 50 parts by weight of the photo hardener with respect to 100 parts by weight of the base polymer. Parts, 0.01 to 1 part by weight of the photo radical initiator, and 0.01 to 2 parts by weight of the antioxidant. 如請求項1之補強膜,其中上述抗氧化劑之含量為上述光自由基起始劑之含量之0.2~5倍。The reinforcing film according to claim 1, wherein the content of the antioxidant is 0.2 to 5 times the content of the photo radical initiator. 如請求項1或2之補強膜,其中上述光自由基起始劑於波長310 nm~355 nm之範圍具有吸收極大,且於長於360 nm之波長不顯示吸收極大。The reinforced film according to claim 1 or 2, wherein the above-mentioned photo radical initiator has an absorption maximum in the range of wavelengths from 310 nm to 355 nm, and does not show an absorption maximum at wavelengths longer than 360 nm. 如請求項1至3中任一項之補強膜,其中上述基礎聚合物含有選自由含羥基單體及含羧基單體所組成之群中之1種以上作為單體單元,且藉由與羥基或羧基鍵結之交聯劑導入有交聯結構。The reinforcing membrane according to any one of claims 1 to 3, wherein the above-mentioned base polymer contains at least one kind selected from the group consisting of a hydroxyl group-containing monomer and a carboxyl group-containing monomer as a monomer unit, and Or a carboxyl-bonded cross-linking agent is introduced with a cross-linked structure. 如請求項1至4中任一項之補強膜,其含有丙烯酸系聚合物作為上述基礎聚合物。The reinforcing film according to any one of claims 1 to 4, which contains an acrylic polymer as the above-mentioned base polymer. 如請求項5之補強膜,其中上述丙烯酸系聚合物含有均聚物之玻璃轉移溫度為40℃以上之單體成分5~50重量%。The reinforcing film according to claim 5, wherein the acrylic polymer contains a homopolymer having a glass transition temperature of 40 to 50° C. or more and 5 to 50% by weight of the monomer component. 如請求項1至6中任一項之補強膜,其中上述光硬化劑為多官能(甲基)丙烯酸酯。The reinforcing film according to any one of claims 1 to 6, wherein the light hardener is a multifunctional (meth)acrylate. 如請求項1至7中任一項之補強膜,其中上述光硬化劑之官能基當量為100~500 g/eq。The reinforcing film according to any one of claims 1 to 7, wherein the functional group equivalent of the light hardener is 100 to 500 g/eq. 如請求項1至8中任一項之補強膜,其中上述黏著劑層與聚醯亞胺膜之接著力為0.005~5 N/25 mm,且上述接著劑層光硬化後與聚醯亞胺膜之接著力為6 N/25 mm以上。The reinforcing film according to any one of claims 1 to 8, wherein the adhesive force between the adhesive layer and the polyimide film is 0.005 to 5 N/25 mm, and the adhesive layer is hardened with polyimide after photohardening The adhesion of the film is more than 6 N/25 mm.
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