TW202000615A - Substrate positioning mechanism and substrate positioning method for substrate processing apparatus capable of automatically positioning a substrate in a short time without using a CCD camera - Google Patents
Substrate positioning mechanism and substrate positioning method for substrate processing apparatus capable of automatically positioning a substrate in a short time without using a CCD camera Download PDFInfo
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- TW202000615A TW202000615A TW108113612A TW108113612A TW202000615A TW 202000615 A TW202000615 A TW 202000615A TW 108113612 A TW108113612 A TW 108113612A TW 108113612 A TW108113612 A TW 108113612A TW 202000615 A TW202000615 A TW 202000615A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1854—Means for removing cut-out material or waste by non mechanical means by air under pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
本發明係關於一種定位機構及定位方法,其於對樹脂基板或脆性材料基板進行分斷用之劃線加工之基板加工裝置中,將載置於搬送台上之基板定位於適當位置。尤其,本發明係關於一種基板定位機構及基板定位方法,其適用於對應切出之單位基板排列成一行之長方形基板(以下將其稱為短條狀基板)進行劃線加工、或沿該劃線進行裂斷之基板加工裝置。The present invention relates to a positioning mechanism and a positioning method for positioning a substrate placed on a transfer table in an appropriate position in a substrate processing device for scribe processing for dividing a resin substrate or a brittle material substrate. In particular, the present invention relates to a substrate positioning mechanism and a substrate positioning method, which are suitable for performing scribing processing on or along a rectangular substrate (hereinafter referred to as a short strip substrate) arranged in a row corresponding to a unit substrate cut out Substrate processing device for wire breaking.
通常,自應加工之基板切出單位基板之情形,藉由以切割輪或雷射光對基板表面進行分斷用之劃線加工,接著自該劃線使基板撓曲等後加以裂斷而進行。於該劃線加工時,為了沿預定劃線正確進行劃線加工,必須將載置於成為加工載台之台上的基板定位於適當之加工位置。In general, when cutting out a unit substrate from a substrate to be processed, a scribing process for breaking the surface of the substrate with a cutting wheel or laser light, and then flexing the substrate from the scribing and breaking it . During the scribing process, in order to perform the scribing process correctly along the predetermined scribing line, it is necessary to position the substrate placed on the stage that becomes the processing stage at an appropriate processing position.
作為該定位方法,一般廣泛實施如專利文獻1所示之使用CCD(Charge Couple Device:電荷耦合裝置)相機之光學方法。根據該方法,於應加工之基板之2部位預先施加對準標記,且以設置於加工裝置上方之2台CCD相機拍攝對準標記並特定出對準標記之位置。基於特定之對準標記之位置資料,檢測基板載置時之位置偏離,並使之移動至載台上之適當位置,藉此進行修正。As this positioning method, an optical method using a CCD (Charge Couple Device) camera as shown in
又,作為簡易之定位方法,亦有藉由於載台上設置複數個定位用銷,手動使基板之一邊沿著銷而進行基板定位的方法。 [先前技術文獻] [專利文獻]In addition, as a simple positioning method, there is also a method of positioning the substrate by manually positioning one side of the substrate along the pin by providing a plurality of positioning pins on the stage. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開2011-162395號公報[Patent Document 1] Japanese Patent Laid-Open No. 2011-162395
[發明所欲解決之問題][Problems to be solved by the invention]
然而,於使用CCD相機之光學方法中,存在所謂之相機或監視器、及解析處理攝像資料之電子機器等附帶裝置較為昂貴且基於攝像資料定位基板較費時間之問題點。 此外,於利用定位用銷之方法中,因以操作員進行人工作業,故操作較為麻煩,且有無意中使基板與定位銷強烈碰撞而使基板端面損傷等之擔憂。又,於基板較薄之情形,存在所謂之碰觸定位銷時會使基板彎曲等而無法正確定位之問題點。However, in the optical method using a CCD camera, there are problems that so-called cameras or monitors, and electronic devices that analyze and process image data are expensive and it takes time to locate the substrate based on the image data. In addition, in the method of using the positioning pin, since the operator performs manual work, the operation is troublesome, and there is a concern that the substrate may collide with the positioning pin violently and damage the end surface of the substrate. In addition, in the case where the substrate is thin, there is a problem that the substrate cannot be accurately positioned due to bending of the substrate when the positioning pin is touched.
因此,本發明鑑於上述課題,其目的在於以簡單之機構提供一種不使用CCD相機即可短時間自動地進行基板定位之新穎之定位機構以及定位方法。 [解決問題之技術手段]Therefore, in view of the above-mentioned problems, the present invention aims to provide a novel positioning mechanism and positioning method that can automatically perform substrate positioning in a short time without using a CCD camera. [Technical means to solve the problem]
為了達成上述目的,本發明採用如下之技術方法。即,本發明提供一種基板定位機構,其係將載置於基板搬送用載台之基板送入劃線部,且於基板表面進行分斷用之劃線加工之基板加工裝置之基板定位機構,其構成為,上述載台形成為可經由沿上述輸送方向之旋動軸傾動,且於上述載台之傾動時,於成為傾斜下位側之載台之上表面設置有複數個止擋件,上述複數個止擋件空開間隔配置於與上述旋動軸平行之假想線上。In order to achieve the above object, the present invention adopts the following technical methods. That is, the present invention provides a substrate positioning mechanism, which is a substrate positioning mechanism of a substrate processing apparatus that feeds a substrate placed on a substrate transfer stage into a scribing portion and performs a scribing process for breaking on the surface of the substrate, It is configured that the stage is formed to be tiltable via a rotating shaft along the conveying direction, and when the stage is tilted, a plurality of stoppers are provided on the upper surface of the stage that becomes the inclined lower side, the above The plurality of stoppers are arranged on the imaginary line parallel to the rotation axis at an empty interval.
又,本發明之特徵亦在於一種基板定位方法,其係將載置於搬送至劃線部之載台上之基板定位至適當位置之定位方法,其係使上述載台經由沿基板輸送方向之旋動軸而傾動,且藉由自重使載台上之基板移動至傾斜下位側,並使基板之一側邊與待機於傾斜下位側之止擋件抵接,藉此進行基板之定位。In addition, the present invention is also characterized by a substrate positioning method, which is a positioning method for positioning a substrate placed on a stage conveyed to a scribing portion to an appropriate position, which causes the above-mentioned stage to pass along the substrate conveying direction Rotate the shaft to tilt, and move the substrate on the stage to the inclined lower side by its own weight, and make one side of the substrate contact the stopper waiting on the inclined lower side, thereby positioning the substrate.
於本發明中,亦可將上述台形成為俯視4角形,且其一側邊為上述傾斜下位側。又,上述基板搬送用載台亦可以自形成於其表面之複數個小孔噴出壓縮氣體而使基板上浮之浮台而形成。 [發明之效果]In the present invention, the table may be formed in a quadrangular shape in plan view, and one side thereof may be the inclined lower side. In addition, the above-mentioned substrate transfer stage may be formed by a floating stage that ejects compressed gas from a plurality of small holes formed on the surface thereof to float the substrate. [Effect of invention]
根據本發明,具有如下效果:僅使成為搬送載台之載台傾動,即可自動且迅速進行基板定位並能提高基板加工作業之效率,且因用以傾動之機構較為簡單故可低價提供。According to the present invention, it has the following effect: Only by tilting the stage that becomes the transfer stage, the substrate can be positioned automatically and quickly and the efficiency of the substrate processing operation can be improved, and because the mechanism for tilting is relatively simple, it can be provided at a low price. .
於本發明中,較佳將上述止擋件形成為可沿基板輸送方向移動。 藉此,藉由將止擋件抵接之位置調整為分斷時被切去之端材區域部分,而可避免成為產品之單位基板之端面損傷。In the present invention, it is preferable to form the stopper so as to be movable in the substrate conveying direction. In this way, by adjusting the position where the stopper abuts to the part of the end material region that is cut off at the time of breaking, damage to the end surface of the unit substrate that becomes the product can be avoided.
又,於本發明中,亦可以包含彈性材料之輥形成上述止擋件,且形成為以該輥之圓周面接住基板。 藉此,有如下效果:於寬度較窄之端材區域亦可以圓周之點接觸正確抵接於端材區域部分,且因原材料為彈性材料,故可柔軟地接住。In addition, in the present invention, a roller including an elastic material may form the stopper, and be formed such that the circumferential surface of the roller contacts the substrate. Thereby, there is an effect that the end material region with a narrow width can also abut on the part of the end material region correctly with point contact on the circumference, and because the raw material is an elastic material, it can be softly received.
以下,基於圖1~圖5詳細說明本發明之基板定位機構之細節。此處,如圖4所示,於對短條狀基板W進行分斷用劃線加工之基板加工裝置中,實施本發明之基板定位機構,該短條狀基板W具有由虛線顯示之劃線預定線S劃分之複數個單位基板W1以介置端材區域T之狀態排列成一行之分斷圖案。Hereinafter, the details of the substrate positioning mechanism of the present invention will be described in detail based on FIGS. 1 to 5. Here, as shown in FIG. 4, the substrate positioning mechanism of the present invention is implemented in a substrate processing apparatus that performs scribe processing on a short strip-shaped substrate W, and the short strip-shaped substrate W has a scribe line shown by a broken line The plurality of unit substrates W1 divided by the predetermined line S are arranged in a row of a split pattern with the end material region T interposed.
該基板加工裝置具備載置應加工之短條狀基板W並搬送至劃線部1之水平載台2。載台2具有將基板輸送方向設得較長之俯視長方形之形狀,且形成為能夠以經由於載台下方沿基板輸送方向配置之旋動軸3,使得沿長度方向之一邊側2a成為傾斜下位之方式傾動。又,用以使載台2自水平姿勢搖動至傾斜姿勢之流體缸4設置於載台2之下面。另,以下將基板輸送方向設為X方向,將相對於X方向而於水平面上正交之方向設為Y方向加以說明。This substrate processing apparatus includes a
載台2以於表面形成有複數個空氣噴出用之小孔(未圖示),可藉由自該小孔之噴出氣體使載置之短條狀基板以不接觸載台面之方式浮起之所謂「浮台」而形成。
又,設置有自上空以吸附墊14a吸附短條狀基板W並沿X方向搬送之搬送構件14。吸附墊14a以支持部14b保持且沿延伸於X方向之導軌14c可移動地安裝。又,吸附墊14a形成為可藉由汽缸14d升降。The
再者,載台2傾動時,於成為傾斜下位側之一側邊2a之附近,於載台上表面,設置有2個止擋件6、6。該止擋件6、6於與旋動軸3平行之假想線上空開間隔而配置,形成為於載台2傾動時,載台上之短條狀基板W因自重移動至傾斜下位側,而抵接於沿長邊方向之一側邊且使之停止。止擋件6以包含橡膠等之彈性材料之輥形成,且形成為以該輥之圓周面接住短條狀基板W。又,止擋件6由支持臂7保持,支持臂7形成為可沿驅動部8之延伸於X方向之軌道8a移動,藉此,可調整對於短條狀基板W之抵接位置。In addition, when the
劃線部1於輸送來之短條狀基板W之上方及下方位置,分別具備具有切割輪9之上下之劃線頭10。劃線頭10形成為,可上下動地安裝於以跨越輸送來之短條狀基板W之方式設置的門型框體11,且可沿設置於框體11之橫樑(樑)12的導軌13移動於Y方向。藉此,可使切割輪9壓接於基板W之表面且移動於Y方向,藉此可對短條狀基板W之表背兩面沿Y方向進行劃線加工。The scribing
其次,對組裝本定位機構之基板加工裝置之動作進行說明。 首先,如圖4所示,於載台上以長邊方向朝向X方向之姿勢載置短條狀基板W。作為應分斷之短條狀基板W,於本實施例中,以積層有複數個基板之積層基板為對象。又,短條狀基板W如先前所說明,以沿虛線顯示之劃線預定線S劃分之4個單位基板W1介置端材區域T而排列之分斷圖案而設定。Next, the operation of assembling the substrate processing device of this positioning mechanism will be described. First, as shown in FIG. 4, the short strip-shaped substrate W is placed on the stage with the longitudinal direction facing the X direction. As the short strip-shaped substrate W to be divided, in this embodiment, a laminated substrate in which a plurality of substrates are laminated is targeted. As described above, the short strip-shaped substrate W is set by a split pattern in which four unit substrates W1 divided along a predetermined scribe line S shown by broken lines are arranged via the end material region T.
於將短條狀基板W送入劃線部1前,進行載置於載台2上之短條狀基板W之定位。該定位為用以於劃線部1對短條狀基板W劃線時,使基板之Y方向之劃線預定線S正確位於沿切割輪之行進方向者。Before the short strip-shaped substrate W is fed into the
基板之定位以驅動流體缸4且載台2之側邊2a成為傾斜下位之方式使載台傾動而進行。此時,短條狀基板W之輸送方向後端面與安裝於載台2之抵接輥5接觸。
若使載台2傾動,則短條狀基板因自重而移動至傾斜下位側,且短條狀基板W之沿長邊方向之一側邊抵接於止擋件6並停止。藉由將兩個止擋件6之位置預先設定為於該停止位置,使短條狀基板之Y方向之劃線預定線S與切割輪9之行進方向一致,可正確進行基板之定位。另,藉由於載台傾動時,自設置於載台上表面之小孔噴出氣體而使基板W以無接觸狀態稍稍上浮,可順滑地沿傾斜面移動。The positioning of the substrate is performed by tilting the stage so that the
該定位時,亦可預先使止擋件6以抵接於短條狀基板W之端材區域T之部分之方式沿驅動部8之軌道8a移動而調整其位置。藉此,因止擋件6抵接分斷時被切去之端材區域部分,故可避免成為製品之單位基板W1之端面損傷。又,因止擋件6以輥形成,且以其圓周面抵接短條狀基板W,故而即便於寬度較窄之端材區域T亦可以圓周之點接觸正確抵接於端材區域部分,且因原材料為彈性材料,故可柔軟地接住。During this positioning, the
進行定位後,使載台2回到水平,且以搬送構件14之吸附墊14a吸附短條狀基板W並沿X方向搬送,於劃線預定線S來到相對於劃線部1之切割輪10之位置時停止並載置於載台上。接著,藉由使切割輪10壓接於基板表面且沿Y方向行進,可沿劃線預定線S正確地進行分斷用劃線加工。
劃線加工後之短條狀基板W進而沿X方向輸送,於下個步驟中沿劃線被分斷並取出單位基板W1。After positioning, the
如此,根據本發明之基板定位機構,僅使成為搬送載台之載台傾動,即可自動且迅速進行基板定位並能提高基板加工作業之效率,且因用以傾動之機構較為簡單故可低價提供。In this way, according to the substrate positioning mechanism of the present invention, only the tilting of the carrier, which is the transfer stage, can automatically and quickly position the substrate and improve the efficiency of the substrate processing operation, and because the mechanism for tilting is relatively simple, it can be lowered. Price offer.
以上,雖已就本發明之代表性實施例進行說明,但本發明並未限定於上述實施形態。例如,亦能夠以可傾動之輸送帶取代上述載台。又,於上述實施例中,以切割輪加工劃線,但亦可藉由雷射照射而加工。再者,於上述實施例中,將短條狀基板作為加工對象,但並未限定於短條狀基板,亦可將全部四角形基板作為加工對象。Although the representative embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, it is also possible to replace the above-mentioned stage with a tiltable conveyor belt. In addition, in the above-described embodiment, the scribing wheel is used to process the scribe line, but it can also be processed by laser irradiation. In addition, in the above-mentioned embodiment, a short strip-shaped substrate is used as a processing object, but it is not limited to a short strip-shaped substrate, and all quadrilateral substrates may be used as a processing object.
又,加工之基板可將僅1片之單板至複數基板積層後之積層基板作為對象,亦可將原材料為玻璃等之脆性材料基板或樹脂基板作為對象。另,加工之基板為單板之情形,可省略上述裂斷部之上下之切割輪之任一者。 [產業上之可利用性]In addition, the processed substrate may be a laminated substrate in which only one veneer is laminated to a plurality of substrates, or a brittle material substrate or a resin substrate whose raw material is glass or the like. In addition, in the case where the processed substrate is a single board, any one of the cutting wheels above and below the fractured portion may be omitted. [Industry availability]
本發明之基板定位機構可用於對基板進行劃線加工時之基板定位。The substrate positioning mechanism of the present invention can be used for substrate positioning when scribing the substrate.
1‧‧‧劃線部
2‧‧‧載台
2a‧‧‧側邊
3‧‧‧旋動軸
4‧‧‧流體缸
5‧‧‧抵接輥
6‧‧‧止擋件
7‧‧‧支持臂
8‧‧‧驅動部
8a‧‧‧軌道
9‧‧‧切割輪
10‧‧‧劃線頭
11‧‧‧門型框體
12‧‧‧橫樑
13‧‧‧導軌
14‧‧‧搬送構件
14a‧‧‧吸附墊
14b‧‧‧支持部
14c‧‧‧導軌
14d‧‧‧汽缸
S‧‧‧劃線預定線
T‧‧‧端材區域
W‧‧‧基板
W1‧‧‧單位基板
X‧‧‧方向
Y‧‧‧方向1‧‧‧
圖1係組裝本發明之定位機構之基板加工裝置之側視圖。 圖2係上述基板加工裝置之俯視圖。 圖3係載台部分之放大前視圖。 圖4係顯示於載台上載置短條狀基板之狀態之俯視圖。 圖5係顯示定位機構之動作之圖3同樣之放大前視圖。FIG. 1 is a side view of a substrate processing device incorporating the positioning mechanism of the present invention. FIG. 2 is a plan view of the above substrate processing apparatus. Figure 3 is an enlarged front view of the stage portion. 4 is a plan view showing a state where a short strip-shaped substrate is placed on a stage. Fig. 5 is an enlarged front view of Fig. 3 showing the operation of the positioning mechanism.
2‧‧‧載台 2‧‧‧ stage
2a‧‧‧側邊 2a‧‧‧Side
3‧‧‧旋動軸 3‧‧‧Rotating shaft
4‧‧‧流體缸 4‧‧‧ fluid cylinder
6‧‧‧止擋件 6‧‧‧stop
W‧‧‧基板 W‧‧‧Substrate
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2018123169A JP2020001965A (en) | 2018-06-28 | 2018-06-28 | Mechanism and method for positioning substrate in substrate processing apparatus |
JP2018-123169 | 2018-06-28 |
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TW202000615A true TW202000615A (en) | 2020-01-01 |
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TW108113612A TW202000615A (en) | 2018-06-28 | 2019-04-18 | Substrate positioning mechanism and substrate positioning method for substrate processing apparatus capable of automatically positioning a substrate in a short time without using a CCD camera |
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JP (1) | JP2020001965A (en) |
KR (1) | KR20200001976A (en) |
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JP2011162395A (en) | 2010-02-09 | 2011-08-25 | Mitsuboshi Diamond Industrial Co Ltd | Substrate working apparatus |
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2019
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