TW202004201A - Electronic element inspection equipment - Google Patents

Abstract

An electronic element inspection equipment is provided, which is adapted to detect an electronic element. The electronic element inspection equipment includes a first track, a first rotational unit, a first image capturing device, a second image capturing device, a third image capturing device, a second rotational unit and a fourth image capturing device. The first rotational unit rotates around a first axis. When the first rotational unit transmits the electronic element, the first, second and the third image capturing devices capture the image of the electronic element. The second rotational unit rotates around a second axis perpendicular to the first axis. When the second rotational unit transmits the electronic element, the fourth image capturing device captures the image of the electronic element.

Description

Electronic component testing equipment

The present invention relates to an electronic component inspection device, and in particular to an electronic component inspection device for photographic inspection of wafers.

In the conventional technology, when the wafer is photographed and inspected, the wafer is held by a vacuum suction nozzle, and the wafer is placed in a mirror unit to capture images of the five sides of the wafer by a single lens , And judge whether the quality of the chip is up to standard according to the image. However, putting the wafer into the mirror unit with a vacuum suction nozzle and then lifting the wafer into the mirror unit requires additional time and reduces the production efficiency of the wafer. In addition, because the image presented by the mirror unit is incomplete, small-sized defects cannot be detected.

The present invention is an electronic component inspection device provided for solving the problems of the conventional technology, suitable for inspecting an electronic component, including a first conveying track, a first turntable, a first image capturing device, a The second image capturing device, a third image capturing device, a second turntable, a fourth image capturing device and a second conveying track. The first turntable rotates about a first axis, and the first turntable is suitable for taking out the electronic component from the first conveying track. When the first turntable conveys the electronic component, the first image capturing device captures an image of a first side of the electronic component, and the second image capturing device captures an image of a second side of the electronic component , The third image capturing device captures an image of a third surface of the electronic component, the second surface is opposite to the third surface, the first surface is perpendicular to the second surface and the third surface. The second turntable rotates about a second axis, the second axis is perpendicular to the first axis, and the second turntable is adapted to take out the electronic component from the first turntable. When the second turntable conveys the electronic component, the fourth image capturing device captures an image of a fourth surface of the electronic component, the fourth surface being opposite to the first surface. The second turntable is suitable for placing the electronic component on the second conveying track.

The invention also provides a wafer inspection method, which is suitable for inspecting an electronic component and includes the following steps. First, provide a first conveying track, a first turntable, a first image capture device, a second image capture device, a third image capture device, a second turntable, and a fourth image capture device And a second conveying track, and then, taking out the electronic component from the first conveying track with the first turntable. Furthermore, when the first turntable conveys the electronic component, the first image capturing device captures the image of the first side of the electronic component, and the second image capturing device captures the first part of the electronic component. The image of the second surface is captured by the third image capturing device to capture an image of a third surface of the electronic component, the second surface is opposite to the third surface, the first surface is perpendicular to the second surface and the first Three sides. Then, the second turntable is used to take out the electronic component from the first turntable. Furthermore, when the second turntable transports the electronic component, the fourth image capturing device captures an image of a fourth surface of the electronic component, the fourth surface being opposite to the first surface. Next, the electronic component is placed on the second conveying track with the second turntable, wherein the first turntable rotates around a first axis, the second turntable rotates around a second axis, and the second axis is perpendicular to the The first axis.

With the electronic component inspection equipment implemented by the present invention, since the first turntable and the second turntable transfer the wafers, the wafers can be directly photographed and monitored, so the production efficiency of the wafers can be improved. In addition, since the images of the six sides of the chip are completely acquired by the six image capturing devices, defects of small size can be reliably detected.

D‧‧‧Electronic component testing equipment

E‧‧‧Electronic components

E11‧‧‧The first side

E12‧‧‧Second side

E13‧‧‧The third side

E14‧‧‧Fourth

E15‧‧‧ fifth

E16‧‧‧Sixth side

E2‧‧‧pin

11‧‧‧ First conveyor track

12‧‧‧Second conveyor track

21‧‧‧ First turntable

211‧‧‧First nozzle

212‧‧‧Side wall

22‧‧‧Second turntable

221‧‧‧Second nozzle

222‧‧‧Bottom

31‧‧‧First image capture device

32‧‧‧Second image capture device

33‧‧‧ Third image capture device

34‧‧‧ Fourth image capture device

35‧‧‧Fifth image capture device

36‧‧‧Sixth image capture device

41‧‧‧Electrical Testing Station

42‧‧‧Bearing plate set

421‧‧‧The first carrier plate

422‧‧‧Second carrier plate

X‧‧‧ first axis

Z‧‧‧Second axis

P1‧‧‧The first plane

P2‧‧‧Second plane

S01, S02, S03, S11, S12, S13, S14, S15, S16

I1‧‧‧First drawing direction

I2‧‧‧Second suction direction

Fig. 1 shows an electronic component testing device according to an embodiment of the invention.

FIG. 2A is a top view of an electronic component according to an embodiment of the invention.

FIG. 2B is a side view showing the electronic component of the embodiment of the invention.

FIG. 3 shows the arrangement of the first turntable and the second turntable in the first embodiment of the invention.

FIG. 4 shows the arrangement of the first turntable and the second turntable in the second embodiment of the invention.

FIG. 5A shows an electrical detection station and a carrier plate group according to an embodiment of the invention.

FIG. 5B shows the situation of turning over the electronic components of the carrier disk group according to the embodiment of the invention.

Figures 6A and 6B show a wafer inspection method according to an embodiment of the invention.

In the drawings of the present invention, each element has been presented in a schematic manner, and the above disclosure does not limit the present invention.

Fig. 1 shows an electronic component testing device according to an embodiment of the invention. Referring to FIG. 1, an electronic component inspection device D according to an embodiment of the present invention is suitable for inspecting electronic components E, and includes a first conveying track 11, a first turntable 21, a first image capturing device 31, and a first Two image capturing devices 32, a third image capturing device 33, a second turntable 22, a fourth image capturing device 34 and a second conveying track 12. The first turntable 21 rotates about a first axis X. The first turntable 21 is adapted to take out the electronic component E from the first conveying track 11. When the first turntable 21 conveys the electronic component E, the first image capturing device 31 captures the image of the first side of the electronic component E, and the second image capturing device 32 captures the second of the electronic component E The third image capturing device 33 captures the image of the third surface of the electronic component E. In this embodiment, the electronic component E is, for example, a chip.

Referring again to FIG. 1, the second turntable 22 rotates about a second axis Z, the second axis Z is perpendicular to the first axis X, and the second turntable 22 is adapted to take out the electronic component E from the first turntable 21. When the second turntable 22 conveys the electronic component E, the fourth image capturing device 34 captures the image of the fourth side of the electronic component E. The second turntable 22 is also suitable for placing the electronic component E on the second conveying track 12.

FIG. 2A is a plan view showing an electronic component E according to an embodiment of the invention. FIG. 2B is a side view showing the electronic component E according to the embodiment of the invention. 2A and 2B, the second surface E12 of the electronic component E is opposite to the third surface E13, and the first surface E11 is perpendicular to the second surface E12 and the third surface E13. The fourth surface E14 is opposite to the first surface E11.

Referring to FIG. 1, in one embodiment, the first turntable 21 rotates on a first plane P1, the second turntable 22 rotates on a second plane P2, and the first plane P1 is perpendicular to the second plane P2. With reference to FIG. 3, in the first embodiment, the first turntable 21 is arranged along the radial direction of the second turntable 22 in the projection on the second plane P2.

Referring to FIG. 1, in an embodiment, the electronic component inspection device D further includes a fifth image capturing device 35 and a sixth image capturing device 36. When the second turntable 22 conveys the electronic component E, the fifth The image capturing device 35 captures the image of the fifth surface E15 of one of the electronic components E, and the sixth image capturing device 36 captures the image of the sixth surface E16 of one of the electronic components E, the fifth surface E15 is opposite to the sixth surface E16 The fifth surface E15 is perpendicular to the first surface E11 and the second surface E12.

In the first embodiment, in the projection on the second plane P2, the first turntable 21 is arranged along the radial direction of the second turntable 22. Under this configuration, the fifth image capturing device 35 and the sixth image capturing device 36 can be appropriately configured without interfering with the first turntable 21, the second turntable 22, or the electronic component E, and can smoothly To obtain images of the fifth surface E15 and the sixth surface E16. For example, the fifth image capturing device 35 and the sixth image capturing device 36 can be appropriately arranged in the radial direction of the second turntable 22 to obtain images of the fifth surface E15 and the sixth surface E16.

FIG. 4 shows the arrangement of the first turntable and the second turntable in the second embodiment of the invention. Referring to FIG. 4, in the second embodiment, the first turntable 21 rotates on the first plane P1, the second turntable 22 rotates on the second plane P2, the first plane P1 is perpendicular to the second plane P2, and the second In the projection on the plane P2, the first turntable 21 is arranged along the tangent of the second turntable 22. Under this configuration, the fifth image capturing device 35 and the sixth image capturing device 36 are omitted, and the images of the first, second, third, and fourth sides of the electronic device are simply captured.

Referring to FIG. 1, in an embodiment, the first turntable 21 includes a plurality of first suction nozzles 211, the first suction nozzles 211 are arranged on a side wall 212 of the first turntable 21 along the circumferential direction of the first turntable 21, The electronic component E is sucked along a first sucking direction I1, and the first sucking direction I1 extends along the radial direction of the first turntable 21.

Referring to FIG. 1, in an embodiment, the second turntable 22 includes a plurality of second suction nozzles 221, and the second suction nozzles 221 are arranged on a bottom surface 222 of the second turntable 22 along the circumferential direction of the second turntable 22, And suck the electronic component E along a second sucking direction I2, the second sucking direction I2 is parallel to the second axis Z.

Referring to FIG. 1, in an embodiment, each first suction nozzle 211 suctions the fourth surface E14 of the electronic component E, and each second suction nozzle 221 suctions the first surface E11 of the electronic component E.

Referring to FIGS. 2A and 2B, in one embodiment, the electronic component E includes a plurality of pins E2, and the equal pins E2 are formed on the second surface E12 and the third surface E13.

Referring to FIG. 5A, in one embodiment, the electronic component testing device D further includes an electrical testing station 41 and a carrier plate group 42. After the electrical component E is inspected by the electrical testing station 41, it is placed on the carrier plate group 42 and transferred from the carrier tray 42 to the first conveying track 11.

5A and 5B, the carrier plate group 42 includes a first carrier plate 421 and a second carrier plate 422. In an embodiment, the electronic component E is placed on the first carrier plate 421 of the carrier plate group 42 after being inspected by the electrical inspection station 41. Next, the carrier plate group 42 is turned 180 degrees as a whole to turn over the electronic component E. Then, the electronic component E is transferred from the second carrier plate 422 of the carrier plate group 42 to the first conveying track 11. At this time, the electronic component E can be directly picked up by the first turntable 21 for inspection.

Referring to FIG. 6A, in another embodiment, the present invention further provides a wafer inspection method, which is suitable for inspecting an electronic component and includes the following steps. First, provide a first conveying track, a first turntable, a first image capture device, a second image capture device, a third image capture device, a second turntable, and a fourth image capture device And a second conveyor track (S11). Next, the electronic component is taken out from the first conveying track with the first turntable (S12). Furthermore, when the first turntable conveys the electronic component, the first image capturing device captures the image of the first side of the electronic component, and the second image capturing device captures the first part of the electronic component. The image of the second surface is captured by the third image capturing device to capture an image of a third surface of the electronic component, the second surface is opposite to the third surface, the first surface is perpendicular to the second surface and the first Three sides (S13). Next, the electronic component is taken out from the first turntable with the second turntable (S14). Furthermore, when the second turntable conveys the electronic component, the fourth image capturing device captures an image of a fourth surface of the electronic component, the fourth surface being opposite to the first surface (S15). Next, the electronic component is placed on the second conveying track with the second turntable, wherein the first turntable rotates around a first axis, the second turntable rotates around a second axis, and the second axis is perpendicular to the The first axis (S16).

Referring to FIG. 6B, in an embodiment, the wafer inspection method of the present invention further includes the following steps. First, an electrical testing station and a carrier disk set are provided, and the electronic component is placed on the carrier disk set after being tested by the electrical testing station (S01). Next, the carrier plate group is turned 180 degrees to turn the electronic component (S02). Then, the electronic component is transferred from the carrier tray to the first conveying track (S03).

With the electronic component inspection equipment implemented by the present invention, since the first turntable and the second turntable transfer the wafers, the wafers can be directly photographed and monitored, so the production efficiency of the wafers can be improved. In addition, since the images of the six sides of the chip are completely acquired by the six image capturing devices, defects of small size can be reliably detected.

Although the present invention has been disclosed as above with specific preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with this technology can still make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application.

D‧‧‧Electronic component testing equipment

E‧‧‧Electronic components

11‧‧‧ First conveyor track

12‧‧‧Second conveyor track

21‧‧‧ First turntable

211‧‧‧First nozzle

212‧‧‧Side wall

22‧‧‧Second turntable

221‧‧‧Second nozzle

222‧‧‧Bottom

31‧‧‧First image capture device

32‧‧‧Second image capture device

33‧‧‧ Third image capture device

34‧‧‧ Fourth image capture device

35‧‧‧Fifth image capture device

36‧‧‧Sixth image capture device

X‧‧‧ first axis

Z‧‧‧Second axis

P1‧‧‧The first plane

P2‧‧‧Second plane

I1‧‧‧First drawing direction

I2‧‧‧Second suction direction

Claims (10)

An electronic component testing device suitable for testing an electronic component, including: a first conveying track; a first turntable rotating around a first axis, the first turntable being suitable for taking out the electrons from the first conveying track Component; a first image capturing device, when the first turntable conveys the electronic component, the first image capturing device captures an image of a first side of the electronic component; a second image capturing device, when When the first turntable transports the electronic component, the second image capturing device captures an image of a second side of the electronic component; a third image capturing device, when the first turntable transports the electronic component, the The third image capturing device captures an image of a third surface of the electronic component, the second surface is opposite to the third surface, the first surface is perpendicular to the second surface and the third surface; a second turntable , Rotating around a second axis, the second axis is perpendicular to the first axis, the second turntable is suitable for taking out the electronic component from the first turntable; a fourth image capture device, when the second turntable transports the For electronic components, the fourth image capturing device captures an image of a fourth surface of the electronic component, the fourth surface is opposite to the first surface; and a second conveying track, the second turntable is suitable for the Electronic components are placed on the second conveyor track. The electronic component testing device as described in item 1 of the patent application scope, wherein the first turntable rotates on a first plane, the second turntable rotates on a second plane, and the first plane is perpendicular to the second In the plane, in the projection on the second plane, the first turntable is arranged along the radial direction of the second turntable. The electronic component inspection device as described in item 2 of the patent application scope further includes a fifth image capture device and a sixth image capture device, when the second turntable conveys the electronic component, the fifth image capture device The image capturing device captures an image of a fifth side of the electronic component, the sixth image capturing device captures an image of a sixth side of the electronic component, the fifth side is opposite to the sixth side, the fifth side It is perpendicular to the first surface and the second surface. The electronic component inspection device as described in item 1 of the patent application scope, wherein the first turntable rotates on a first plane, the second turntable rotates on a second plane, and the first plane is perpendicular to the second The plane, in the projection on the second plane, the first turntable is arranged along the tangent of the second turntable. The electronic component testing device as described in item 1 of the patent application range, wherein the first turntable includes a plurality of first suction nozzles, and the first suction nozzles are arranged on the first turntable along the circumferential direction of the first turntable A side wall, and the electronic component is sucked along a first suction direction, and the first suction direction extends along the radial direction of the first turntable. The electronic component testing device as described in item 5 of the patent application scope, wherein the second turntable includes a plurality of second suction nozzles, the second suction nozzles are arranged on the second turntable along the circumferential direction of the second turntable A bottom surface, and the electronic component is sucked along a second suction direction, the second suction direction is parallel to the second axis. The electronic component inspection device as described in item 6 of the patent application range, wherein each first suction nozzle adsorbs the fourth surface of the electronic component, and each second suction nozzle adsorbs the first surface of the electronic component. An electronic component testing device as described in item 7 of the patent application range, wherein the electronic component includes a plurality of pins, and the pins are formed on the second surface and the third surface. As described in item 7 of the scope of the patent application, the electronic component testing equipment further includes an electrical testing station and a carrier plate group. After the electrical component is tested by the electrical testing station, the electronic component is placed on the carrier plate group, And transferred from the carrier disk group to the first conveyor track. The electronic component testing equipment as described in item 9 of the patent application scope, wherein the electronic component is placed on the carrier tray after being tested by the electrical testing station, and the carrier tray assembly is turned 180 degrees to turn the electronic component Then, the electronic component is transferred from the carrier tray to the first conveying track.

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