TW201939644A - Aligning apparatus and aligning method - Google Patents

Abstract

An aligning apparatus (10) comprises: a supporting means (20) for supporting a plurality of sheets (CP) by the supporting surface (21A); a partitioning means (30) for inserting the partitioning member (35) among the plurality of sheets (CP) supported by the supporting surface (21A); and an aligning means (40) for tilting at least one of the supporting surface (21A) and the partitioning means (35), and aligning each of the sheets (CP) at the predetermined positions on the supporting surface (21A) along the predetermined direction.

Description

   Alignment device and method   

The present invention relates to an alignment device and an alignment method.

Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter, referred to as a wafer only) is cut into a predetermined shape, a predetermined size, and singulated into a plurality of semiconductor wafers (hereinafter, referred to as a wafer only). In the case of), the distance between the individual wafers is increased, and the wafers are mounted on an object such as a lead frame or a substrate.

As a separation method for increasing the distance between wafers (sheet-like bodies), a frame supporting means (support means) for supporting a wafer (plate-like member) integrated with a frame through a thin film (adhesive sheet) and a thin film are known. The surface support mechanism (separate mounting table) moves relatively (for example, reference 1: Japanese Patent Application Publication No. 2012-204747). In the method of increasing the distance between such wafers, for example, a four-direction tension is applied to the adhesive sheet in the + X-axis direction, the -X-axis direction, the + Y-axis direction, and the -Y-axis direction. The wafer located at the outermost periphery is detected to reach a predetermined position to complete the interval widening operation.

However, in the conventional method of reference 1, in addition to the above 4 directions in the adhesive sheet, those combined directions are the combined direction of the + X-axis direction and the + Y-axis direction, the + X-axis direction, and the -Y-axis direction. Tension is given by the combined direction of the -X axis direction and the combined direction of the + Y axis direction, and the combined direction of the -X axis direction and the -Y axis direction. As a result, the interval between the inner wafer and the interval between the outer wafers are different. However, since the difference in this interval is very small, it is considered that the interval is equally enlarged for each wafer, and the position derived from calculation (hereinafter, referred to as a theoretical position) is used as a reference. A conveyance means such as a conveyance device or a pick-up device is conveyed, and is mounted on an object to form a manufactured object. As a result, the relative positional relationship between the wafer and the mounted object in the manufactured product may be slightly deviated, the connection position of the wire bonding may be shifted, and the positions of the terminals of the wafer and the mounted object may be shifted. There is a problem that the conduction cannot be conducted and the yield of the manufactured product is reduced. In addition, such a problem is not limited to the manufacture of semiconductor devices. For example, compact mechanical parts and fine ornaments also occur.

An object of the present invention is to provide a aligning device and a aligning method capable of accurately increasing the interval between each sheet-like body.

An array device according to the present invention includes support means capable of supporting a plurality of sheet-like bodies on a support surface, and a partition means capable of inserting a partition member between the plurality of sheet-like bodies supported by the support surface, and the support surface. And at least one of the partition members is an alignment means for aligning each sheet-like body at a predetermined position on the support surface from a predetermined direction.

It is preferable that the in-line device of the present invention includes a movement promotion means for promoting the movement of the plurality of sheet-like bodies.

In the array device of the present invention, it is preferable that the plurality of sheet-like bodies are attached to an adhesive sheet, and the transfer means is capable of transferring the plurality of sheet-like bodies to the support surface from the adhesive sheet.

The aligning method of the present invention includes a process of supporting a plurality of sheet-like bodies on a support surface, a process of inserting a partition member between the plurality of sheet-like bodies supported by the support surface, and separating the support surface and the partition. A process in which at least one of the members is inclined and each sheet-shaped body is aligned at a predetermined position on the support surface from a predetermined direction.

According to the present invention, since a partition member is inserted between a plurality of sheet-like bodies, and at least one of the support surface and the partition member is tilted, the sheet-like bodies can be aligned. Therefore, the tension is not in a direction other than the direction in which tension is given by the adhesive sheet. Since they are given in the direction of combining them, the interval between the sheet-like bodies can be accurately enlarged.

In addition, if a movement promoting means is provided, it is easy to induce the sheet-like body toward a predetermined position of the partition member.

Furthermore, when a transfer means is provided, since a plurality of sheet-like bodies can be transferred from an adhesive sheet to a support surface, the space | interval of each sheet-like body can be enlarged correctly.

AS‧‧‧ Adhesive sheet

CP‧‧‧Chip

WF‧‧‧ Wafer

WK‧‧‧One

10‧‧‧ entire train

20‧‧‧Support

21‧‧‧mounting table

21A‧‧‧Support surface

21B‧‧‧ Corner

30‧‧‧ Separation Means

31‧‧‧ Door Frame

32, 33‧‧‧ Linear Motor

32A, 33A‧‧‧Slider

34, 41‧‧‧ Linear Motor

34A, 41A‧‧‧ output shaft

35‧‧‧ divider

35A‧‧‧Base pallet

35B‧‧‧ Below

35C‧‧‧Grid Department

40‧‧‧ whole set of means

42‧‧‧ Ball Joint

50‧‧‧ mobile promotion tools

60‧‧‧ Means of transfer

61, 64‧‧‧ Linear Motor

61A‧‧‧Slider

61B‧‧‧ Bracket

62, 65‧‧‧ Linear Motor

62A‧‧‧Output shaft

63‧‧‧Sucker

64A‧‧‧Slider

65A‧‧‧Output shaft

66‧‧‧ peeling plate

Fig. 1 is a side view of an alignment device according to a first embodiment of the present invention.

FIG. 2A is an operation explanatory diagram of the alignment device of FIG. 1.

FIG. 2B is an operation explanatory diagram of the alignment device of FIG. 1.

FIG. 2C is an operation explanatory diagram of the alignment device of FIG. 1.

FIG. 2D is an operation explanatory diagram of the alignment device of FIG. 1.

FIG. 2E is an operation explanatory diagram of the alignment device of FIG. 1.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The X-axis, Y-axis, and Z-axis in this embodiment are in a relationship that intersects vertically. The X-axis and Y-axis are axes in a predetermined plane. The Z-axis is an axis that intersects the predetermined plane. . Further, in each of the embodiments, the case of viewing from the front side in the first figure parallel to the Y axis is used as the reference display direction, "up" is the direction of the Z axis arrow, and "down" is the opposite direction, " "Left" is the direction of the arrow on the X axis, "Right" is the direction of the arrow, "Front" is the direction of the arrow on the Y axis, and "Back" is the direction of the opposite.

In FIG. 1, the entire line device 10 includes a support means 20 capable of supporting a plurality of wafers CP as a support surface 21A, and a partition member 35 capable of inserting a plurality of wafers CP supported by the support surface 21A. Between the support means 21A and the partition member 35, and the alignment means 40 for aligning the wafers CP at a predetermined position on the support face 21A in a predetermined direction, and a means for promoting the movement of the plurality of wafers CP Movement promoting means 50, transfer means 60 capable of transferring a plurality of wafers CP from the adhesive sheet AS to the support surface 21A, and unillustrated detection means such as an optical sensor or an imaging means capable of identifying the position of each wafer CP . In addition, the wafer CP is formed by cutting the wafer WF into a lattice shape, and becomes the integrated body WK in a state of being attached to the adhesive sheet AS.

The supporting means 20 is provided with a mounting table 21 having a rectangular shape as described above, and each wafer CP can be adsorbed by a plurality of suction holes (not shown) by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector. Holding the support surface 21A.

The partitioning means 30 is provided with a linear motor 32 as a driving device supported by the door frame 31 standing up from the front and rear of the mounting table 21 and a driving device as a slider 32A supported by the linear motor 32. The linear motor 33 and a linear motor 34 as a driving device of the slider 33A supported by the linear motor 33 and a partition member 35 supported by the output shaft 34A of the linear motor 34. The partition member 35 includes a susceptor plate 35A and a lattice portion 35C formed in a lattice shape on the lower surface 35B of the susceptor plate 35A. The lattice portion 35C can be inserted into all of the plurality of wafers CP at one time. The lower end portion of the grid portion 35C is formed to have a thinner tip and a shape that can be easily inserted between the wafers CP.

The aligning means 40 includes four linear motors 41 as driving devices arranged below 4 隅 of the mounting table 21, and output shafts 41A supported by the linear motors 41. For example, the support surface 21A can be adjusted by X The ball joint 42 which supports the mounting table 21 so that the predetermined plane formed by the axis and the Y axis may be inclined.

The movement promoting means 50 is an ultrasonic vibration device provided inside the mounting table 21.

The transfer means 60 includes a linear motor 61 as a driving device, a linear motor 62 as a driving device supported by a slider 61A of the linear motor 61 through a bracket 61B, and an output shaft 62A supported by the linear motor 62. By means of pressure reduction means (not shown) such as a pressure reduction pump or vacuum ejector, a suction pad 63 that is supported by the adhesive sheet AS can be sucked and supported, a linear motor 64 as a driving device, and a slider supported by the linear motor 64. A linear motor 65 of a 64A driving device and a peeling plate 66 supported by the output shaft 65A of the linear motor 65.

A procedure for aligning the wafers CP in the aligning device 10 described above will be described.

First, an unillustrated conveyance means such as an operator or a belt conveyor is an integrated device WK with the adhesive sheet AS as an upper side of the entire device 10 in a state shown in FIG. 1 in which each member is arranged at an initial position. When placed on a predetermined position of the support surface 21A, the support means 20 drives a pressure reducing means (not shown) to suck and hold the integrated body WK from the wafer CP side.

Next, the transfer means 60 drives the linear motors 61 and 64 and the linear motors 62 and 65, and moves the suction cup 63 and the peeling plate 66 to the position shown by the solid line in FIG. 2A. In addition, the transfer means 60 is driven by a pressure reducing means (not shown), and the right end portion of the adhesive sheet AS is sucked and held by the suction cup 63. Next, the transfer means 60 drives the linear motors 61 and 64 and the linear motor 62 to raise the suction cup 63, and then moves the suction cup 63 and the release plate 66 to the left as indicated by the two-point lock line in FIG. 2A. Thereby, the adhesive sheet AS is peeled from the wafer CP, and this wafer CP is transferred to the support surface 21A. When the adhesive sheet AS is peeled from the wafer CP, the transfer means 60 stops driving of a pressure reducing means (not shown), and drops the adhesive sheet AS so as to be stored in a box, a bag, or the like located below the suction cup 63. The flake recycling means shown below. Thereafter, the transfer means 60 drives the linear motors 61 and 64 and the linear motors 62 and 65 to return the suction cup 63 and the peeling plate 66 to the initial positions.

Next, after the support means 20 stops driving of the pressure reducing means (not shown), based on the detection result of the detection means (not shown), the separation means 30 drives the linear motors 32, 33 and the linear motor 34, as in the second example. As shown in FIG. B, the grid portion 35C is inserted into all of the plurality of wafers CP. At this time, as shown in FIG. 2C, the positions and directions of the wafer CP in the front-back, left-right direction, and direction of a part of the grid portion 35C may be scattered. Here, the aligning means 40 drives the linear motors 41, and as shown in FIG. 2D, one corner of the quadrangular space surrounded by the grid portion 35C is the lowest among the other three corners. The placement method 21 tilts the mounting table 21 (for example, the angle indicated by the symbol 21B in the mounting table 21 is a tilt method in which the other three corners become the lowest positions). As a result, the wafer CP is moved by gravity, and as shown in FIG. 2E, one corner (the corner on the side of the symbol 21B of the mounting table 21) in the wafer CP is moved back to the grid portion 35C. One corner (the corner on the side of the symbol 21B of the mounting table 21) is such that each wafer CP is aligned at a predetermined position on a support surface 21A in a predetermined direction at a predetermined interval. At this time, the movement promoting means 50 may drive the ultrasonic vibration device so that one corner of each wafer CP can be easily moved back to one corner of the grid portion 35C. In addition, each wafer CP aligned by the partition member 35 is arranged at a predetermined position on the support surface 21A. The partition means 30 drives the linear motors 32 and 33 and moves the partition member 35 along the support surface 21A to move each wafer. CP movement is also possible.

Next, the support means 20 drives a pressure reduction means (not shown), and each wafer CP is sucked and held by the support surface 21A. Next, the aligning means 40 drives each linear motor 41 to return the mounting table 21 to the initial position, and the partition means 30 drives the linear motors 32 and 33 and the linear motor 34 to return the partition member 35 to the initial position. In addition, after the support means 20 stops driving of the pressure reducing means (not shown), the operator or the conveying means (not shown) mounts each chip CP on the object. When all the wafers CP are mounted on the object, the same operations as described above are repeated. After returning the partition member 35 to the initial position, a sheet attaching means for attaching an adhesive sheet (not shown) to each wafer CP is provided, or a stacking means for depositing a resin (not shown) on each wafer CP is provided. Yes.

According to the above embodiment, since the grid-like partition member 35 is inserted between the plurality of wafers CP, both the support surface 21A and the partition member 35 can be tilted to align the wafer CP, so in addition to the adhesive sheet AS that imparts tension In addition to the directions, tension is not applied in the combined direction of those, so that the interval between the wafers CP can be accurately enlarged.

As described above, although the best structure and method for implementing the present invention are disclosed as described above, the present invention is not limited to this. That is, the present invention mainly specifically illustrates and explains specific embodiments. However, those skilled in the art can make use of the shapes, materials, quantities, and sizes of the above and embodiments without departing from the technical idea and purpose of the present invention. Other detailed structures, plus various deformations. In addition, the limited descriptions of the shapes, materials, and the like disclosed above are merely exemplified for easy understanding of the present invention, and are not the limitations of the present invention. Therefore, some or all of the restrictions of the shapes, materials, and the like are removed. The description of the names of the members is also included in the present invention.

For example, the support means 20 may be a structure that holds the wafer CP by a cymbal means such as a mechanical chuck or a holding cylinder, a Coulomb force, an adhesive, a magnetic force, or the like, or a configuration that does not hold the wafer CP.

The supporting means 20 is a wafer WF capable of forming a fragile layer by singulating into a plurality of wafers CP by laser light or the like, or a crystal formed with a groove (a groove that does not penetrate vertically) that can be singulated into a plurality of wafers CP. Round WF supports are also available. In this case, the partition member may be provided with a cutting blade capable of cutting the wafer WF.

The supporting means 20 may cut the wafer WF in any direction such as 1 degree, 30 degrees, 45 degrees, and 60 degrees, and may support the wafer CP singulated.

The supporting means 20 is for easily inserting the grid portion 35C between the wafers CP, and the adhesive sheet AS is stretched (expanded) by an expansion device (not shown) to support the integrated body WK which is enlarged between the wafers CP.

The support means 20 may be formed with a grid portion on the support surface 21A.

Instead of the partitioning member 35, a net-like structure in which linear members are arranged in a grid shape may be used.

The partition member 35 may be a single unit without the grid portion 35C having the base pallet 35A.

The lower end portion of the grid portion 35C may not be formed into a thinner tip.

The grid portion 35C is not required to surround the entire wafer CP, and may have a configuration corresponding to one corner of one wafer CP. In this case, the aligning means 40 is to retreat one corner of the wafer CP. The stage 21 may be tilted so as to move to one corner of the grid portion 35C corresponding to one corner.

The aligning means 40 does not have to tilt the partitioning means 30, but may tilt the mounting table 21.

The aligning means 40 does not have to tilt the mounting table 21, but it is also possible to tilt the partitioning means 30. In this case, it is possible to adopt a configuration in which the supporting means 20 and the partitioning means 30 of the entire line device 10 shown in FIG. 1 are inverted upside down, or a configuration provided with a reversing means that reverses the supporting means 20 and the partitioning means 30 up and down. Or a configuration in which the wafers CP are aligned on the partition member 35.

The aligning means 40 is such that one of the three corners other than the corner indicated by the symbol 21B on the mounting table 21 becomes the lowest position. The mounting table 21 may be tilted to make one corner of the wafer CP. It is sufficient to tilt the mounting table 21 so as to be moved back to one corner of the grid portion 35C.

The aligning means 40 is only required to incline the mounting table 21, and the linear motor 41 may be three or less, and may be five or more.

The movement promotion means 50 may be constituted by an eccentric motor, a pneumatic cylinder, a vibrator, or the like.

The movement promoting means 50 may be provided on the side of the partition member 35, and the output shafts 34A, 41A of at least one of the linear motors 34, 41 may be moved in and out at a small amount, or the sliders 32A, of at least one of the linear motors 32, 33, A configuration in which 33A moves a small amount to promote the movement of the wafer CP may be used.

The movement promoting means 50 may have a configuration in which a gas such as air or a monomer gas is blown out from a plurality of suction holes provided in the support surface 21A to promote the movement of the wafer CP.

The movement promotion means 50 may be configured to promote the movement of the wafer CP by sucking in air from the susceptor 35A side to float the wafer CP or to reduce the static friction between the wafer CP and the support surface 21A without floating the wafer CP.

The transfer means 60 is, for example, holding the adhesive sheet AS by a holding means such as a clamping cylinder or a multi-joint robotic arm, and stretching the adhesive sheet AS by the holding means to peel the adhesive sheet AS from each wafer CP. For example, The peeling adhesive sheet may be adhered to the adhesive sheet AS, and the peeling adhesive sheet may be stretched to peel the adhesive sheet AS from each wafer CP. The adhesive sheet AS may be peeled from each wafer CP without any limitation.

The transfer means 60 may be a round bar or a roller instead of the peeling plate 66, and the peeling plate 66 and a driving device for moving the peeling plate 66 may not be provided.

The transfer means 60 is not required.

The sheet-like body may be, for example, a triangle or a polygon having a pentagon or more. In this case, a partition member having a wall surface in which the corners of the sheet-like body can be fitted is used, and the alignment means 40 is a method in which one corner of the sheet-like body is moved back to one corner of the wall surface in the partition member. It is sufficient to tilt the mounting table 21.

The sheet-like body may have a geometric shape such as a circle or an ellipse. In this case, the partitioning member is provided with a wall part into which a predetermined portion of the sheet-like body can be fitted, and the arranging means 40 is to tilt the mounting table 21 so that a predetermined portion of the sheet-like body is moved back to the wall surface. can.

In addition, the materials, types, shapes, and the like of the adhesive sheet AS and the sheet-like body in the present invention are not particularly limited. For example, the adhesive sheet AS may be a polygon such as a circle, an ellipse, a triangle, or a quadrangle, and other shapes may also be used. Adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness may also be used. The adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the substrate sheet and the adhesive layer, and three or more layers including a cover layer on the substrate sheet. Furthermore, the double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer can also be used. The double-sided adhesive sheet is a middle layer with a single layer or a multi-layer, or a single layer or a multi-layer without the middle layer. The layer person can also. The sheet-like body is, for example, a semiconductor wafer such as a food, a resin container, a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, a pottery, a wooden board, or a resin plate. A member, an article, etc. of arbitrary form can also be made into an object. In addition, the functionality of the adhesive sheet AS is changed to a reading method for use, such as information recording labels, decorative labels, protective sheets, dicing tapes, wafer fixing sheets, sticky crystal tapes, recording layer forming resin sheets, and the like. Arbitrary sheets, films, tapes, and the like of arbitrary shapes are attached to any of the adherends as described above.

The means and processes in the present invention only describe those means and process actions, as long as they can achieve the function or process, there is no limitation, let alone, it is not limited to the structure of the embodiment shown in the foregoing embodiment. And process. For example, if the supporting means is capable of supporting a plurality of sheet-like bodies on a supporting surface, the technical common sense at the time of application is compared with the supporting means, as long as it is within the technical scope (the explanation of other means and processes is omitted).

In addition, as the driving machine in the foregoing embodiments, electric motors such as rotary motors, linear motors, linear motors, single-axis robot arms, multi-joint robot arms, pneumatic cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders can be used. Actuators and the like may also be used in combination with those directly or indirectly (there is also a duplication with those exemplified in the embodiment).

Claims (4)

    An entire line device, comprising: a supporting means capable of supporting a plurality of sheet-like bodies on a supporting surface; and a partition member having a lattice portion formed in a lattice shape is inserted into the plurality of sheet-like bodies supported by the supporting surface. Means for separating between the plurality of sheet-like bodies supported by the support surface and at least tilting the support surface while arranging the grid portion between the plurality of sheet-shaped bodies supported by the support surface and aligning the sheet-like bodies on the support surface in a predetermined direction. Means a whole column of prescribed positions.         For example, the columnar device according to the first patent application range includes a movement promotion means for promoting the movement of the plurality of sheet-like bodies.         For example, the entire row device of the first or second patent application range, wherein the plurality of sheet-like bodies are attached to an adhesive sheet and provided with a transfer means capable of transferring the plurality of sheet-like bodies to the support surface from the adhesive sheet.         An alignment method comprising a process of supporting a plurality of sheet-like bodies on a support surface, and a process of inserting a partition member having a lattice portion formed in a lattice shape between the plurality of sheet-like bodies supported by the support surface. And a predetermined condition in which at least the support surface is tilted and the sheet bodies are aligned in a predetermined direction on the support surface in a state where the lattice portion is inserted between the plurality of sheet bodies supported by the support surface. Location process.