TW201929082A - Cutting apparatus capable of simply measuring an inclination or an irregularity of end surface being in contact with the mounting member bump of the cutting blade - Google Patents

Abstract

To provide a cutting apparatus capable of simply measuring an inclination or an irregularity of end surface being in contact with the mounting member flange of the cutting blade. The cutting apparatus comprises: a cutter table for holding a workpiece; a cutting unit for cutting the workpiece through the cutting blade fixed to the front end portion of the spindle via the mounting member flange; a measuring unit for measuring the inclination or the irregularity of the annular end surface, the annular end surface being in contact with the cutting blade disposed on the blade mounting member of the spindle; and a reporting unit for reporting a measured result of the measuring unit.

Description

Cutting device

The present invention is a cutting device that measures the inclination or unevenness of an end face of a flange of a mounting member that contacts a cutting blade.

A cutting device that performs a cutting process (hereinafter referred to as cutting) of a plate-shaped workpiece represented by a semiconductor wafer or a package substrate, for example, a mounting blade that passes through a so-called mounting flange, is provided with a cutting blade at a tip end portion of a main shaft that is a rotating shaft. The mount flange has an end face that is perpendicular and flat with respect to the axis of the main shaft, the end face being held by the cutting blade to hold the cutting blade.

Therefore, when the end surface of the flange of the mount is inclined from the direction perpendicular to the axis of the main shaft, or when the end surface is formed with irregularities, the cutting blade cannot be properly held to cause the cutting blade to vibrate when the main shaft is rotated. Therefore, in order to make the end surface perpendicular and flat with respect to the axial center of the main shaft, a process of correcting the end face of the shape of the end face is performed (see, for example, Patent Documents 1 and 2). [Practical Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-H08-339977 [Patent Document 2] JP-A-2017-13154

[Problems to be Solved by the Invention] Incidentally, the inclination or unevenness of the end surface of the flange of the mounting member is generally measured by the method of measuring the contact end surface of the gauge. However, this method tends to increase the load on the operator because it is required to start the troublesome work of adjusting the position of the gauge relative to the flange of the mount.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a cutting device which can easily measure the inclination or unevenness of an end face of a flange of a mounting member contacting a cutting blade.

[Technical means for solving the problem] According to an aspect of the invention, there is provided a cutting apparatus comprising: a chuck table for holding a workpiece; and a cutting unit for cutting the workpiece by a cutting blade fixed at a front end portion of the spindle through a blade mount a measuring unit that measures the inclination or unevenness of the end face of the ring, the end face of the ring contacting the cutting blade of the blade mounting member mounted on the spindle; and the notifying unit notifying the measurement result of the measuring unit.

According to an aspect of the invention, the measuring unit may comprise a laser displacement gauge that measures the inclination or irregularity of the end face by a laser beam.

Further, according to an aspect of the present invention, an end surface correcting unit may be further provided to clean or grind the end surface corresponding to the measurement result.

Further, according to an aspect of the present invention, there is further provided: a cartridge that accommodates the cutting blade; and a blade exchange unit that exchanges the cutting blade provided at the cutting unit with the cutting blade housed in the cartridge; The measuring unit is mounted on the blade exchange unit, and the cutting blade attached to the cutting unit is taken out from the blade mounting member by the blade exchange unit, and the inclination or unevenness of the end surface is measured.

[Effect of the Invention] The cutting device according to an aspect of the present invention has a measuring unit that measures the inclination or unevenness of the end surface of the blade mounting member, so that it is not necessary to use an old measuring amount that requires complicated work for measuring the inclination or unevenness of the end surface. regulation. Therefore, according to the cutting device, the inclination or unevenness of the end face of the flange of the mounting member contacting the cutting blade can be simply measured.

Referring to the drawings, an embodiment of the invention will be described. FIG. 1 is a perspective view schematically showing a configuration example of the grinding device 2 of the present embodiment. As shown in Fig. 1, the cutting device 2 is provided with a base 4 that supports each component.

An opening 4a is formed in a corner portion in front of the base 4, and a cassette supporting table 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 8 accommodating a plurality of workpieces 11 is carried on the upper surface of the cassette support table 6. Furthermore, in FIG. 1, only the outline of the cassette 8 is shown for convenience of explanation.

The workpiece 11 is a disk-shaped wafer formed of a semiconductor material such as germanium. The front side of the workpiece 11 is divided into a plurality of domains by a plurality of intersecting dividing lines (cutting streets), and elements 13 such as ICs (integrated circuits) are formed in the respective regions.

A dicing film 15 having a larger diameter than the workpiece 11 is attached to the back side of the workpiece 11. The outer peripheral portion of the dicing film 15 is fixed to the annular frame 17. That is, the frame unit is formed by an annular frame 17 having an opening, a dicing film 15 attached to the frame 17 by closing the opening, and a workpiece 11 attached to the dicing film 15 inside the opening.

Further, in the present embodiment, a disk-shaped wafer is formed as the workpiece 11 by using a semiconductor material such as tantalum, and the material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, a substrate formed of other materials such as semiconductor, ceramic, resin, or metal may be used as the workpiece 11.

In addition, the type, number, shape, configuration, size, configuration, and the like of the element 13 are also not limited. The element 13 may also not be formed on the workpiece 11. Further, the dicing film 15 can be attached to the side of the front surface 11a of the workpiece 11. As a substitute for the dicing tape 15, a protective plate or the like formed of any material can be attached to the workpiece 11.

As shown in Fig. 1, on the side surface of the cassette supporting table 6, a long opening 4b is formed in the X-axis direction (front-rear direction, processing feed direction). A ball screw type X-axis moving mechanism 10, a moving table cover 12 covering the upper portion of the X-axis moving mechanism 10, and a dustproof drip-proof table 14 are disposed in the opening 4b. The X-axis moving mechanism 10 includes an X-axis moving table 16 (see FIG. 3 and the like) covered by the moving table cover 12, and moves the X-axis moving table 16 in the X-axis direction.

A chuck table 18 that sucks and holds the workpiece 11 is provided on the upper surface of the X-axis moving table 16 so as to be exposed from the moving table cover 12. The chuck table 18 is coupled to a rotational drive source (not shown) such as a motor, and is rotated about a substantially parallel rotation axis in the Z-axis direction (vertical direction). Further, the chuck table 18 simultaneously moves the X-axis moving table 16 and the moving table cover 12 (machining feed) in the X-axis direction by the X-axis moving mechanism 10.

The upper surface of the chuck table 18 is a holding surface 18a that attracts and holds the workpiece 11. The holding surface 18a is formed substantially in parallel with respect to the X-axis direction and the Y-axis direction (left-right direction, indexing feed direction), and is connected through a suction path 18b (see FIG. 3, etc.) provided inside the chuck table 18. A suction source (not shown) such as an injector.

Four jigs 20 are provided around the chuck table 18 for fixing the annular frame 17 of the workpiece 11 from four sides. A polishing unit (end surface correction unit) 22 having a polishing pad on the side portion is disposed adjacent to the chuck table 18 of the X-axis moving table 16. Further, like the chuck table 18, the polishing unit 22 is also exposed from the moving table cover 12.

A transport unit (not shown) is disposed in a region of the adjacent opening 4b, and the transport unit transports the workpiece 11 to the chuck table 18 or the like. The workpiece 11 carried out from the cassette 8 by the transport unit is carried on the chuck table 18, for example, in a state in which the front side is exposed upward.

A gate-shaped support structure 26 for supporting the two sets of cutting units 24 is disposed across the opening 4b on the upper surface of the base 4. Two sets of cutting unit moving mechanisms 28 are provided on the upper front portion of the support structure 26, and the respective cutting units 24 are moved in the Y-axis direction and the Z-axis direction.

Each of the cutting unit moving mechanisms 28 has a pair of long Y-axis guide rails 30 in common in the Y-axis direction disposed in front of the support structure 26 . That is, the Y-axis guide rail 30 is disposed such that the longitudinal direction is parallel with respect to the Y-axis direction. Further, the Y-axis moving plate 32 constituting each of the cutting unit moving mechanisms 28 is slidably attached to the Y-axis guide rail 30.

A nut portion (not shown) is provided on the back side (rear side) of each of the Y-axis moving plates 32, and the nut portions are respectively screwed with the Y-axis ball screw 34 that is substantially parallel to the Y-axis guide rail 30. A Y-axis pulse motor 36 is coupled to one end portion of each of the Y-axis ball screws 34. When the Y-axis pulse motor 34 rotates the Y-axis ball screw 34, the Y-axis moving plate 32 moves in the Y-axis direction along the Y-axis guide rail 30.

A pair of Z-axis guide rails 38 that are long in the Z-axis direction are provided on the front surface (front surface) of each of the Y-axis moving plates 32. That is, the Z-axis guide rails 38 are disposed such that the longitudinal direction is parallel with respect to the Z-axis direction. Further, the Z-axis moving plate 40 is slidably attached to the Z-axis guide 38. .

A nut portion (not shown) is provided on the back side (rear side) of each of the Z-axis moving plates 40, and the nut portions are respectively screwed to the Z-axis ball screw 42 that is substantially parallel to the Z-axis guide 38. A Z-axis pulse motor 44 is coupled to one end portion of each of the Z-axis ball screws 42. When the Z-axis ball screw 42 is rotated by the Z-axis pulse motor 44, the Z-axis moving plate 40 moves in the Z-axis direction along the Z-axis guide 38.

A cutting unit 24 is provided at a lower portion of each of the Z-axis moving plates 40. A camera (image pickup unit) 46 for imaging the workpiece 11 and the like held by the chuck table 18 is provided at a position adjacent to each of the cutting units 24. Further, a laser displacement gauge (measuring unit) 48 is provided above the cutting unit 24, which measures the distance from the measuring object existing on the side.

When the Y-axis moving plate 32 is moved in the Y-axis direction by each of the cutting unit moving mechanisms 28, the cutting unit 24, the camera 46, and the laser displacement gauge 48 are moved in the Y-axis direction (index feeding). When the Z-axis moving plate 40 is moved in the Z-axis direction by each of the cutting unit moving mechanisms 28, the cutting unit 24, the camera 46, and the laser displacement gauge 48 are moved in the Z-axis direction (cut feed).

An opening 4c is formed at a position on the opposite side of the opening 4b from the opening 4b. A cleaning unit 50 is disposed in the opening 4c for cleaning the workpiece 11 and the like which are cut (cut) by the cutting unit 24. Further, the elevating mechanism, the X-axis moving mechanism 10, the chuck table 18, the transport unit, the cutting unit 24, the cutting unit moving mechanism 28, the camera 46, the laser displacement gauge 48, and the cleaning unit that elevate and lower the cassette support table 6 The components such as 50 are connected to a control unit (measurement unit) (not shown). Each component is controlled by the control unit.

Each of the above-described constituent elements is covered by a cover (not shown) constituting the outer appearance of the cutting device 2. A panel-type display (notification means) 52 serving as a user interface is provided outside the outer cover (not shown). Further, an indicator light (notification unit) 54 is disposed on the upper portion of the outer cover. Display 52 or indicator light 54 is controlled by the control unit described above.

FIG. 2 is a perspective view schematically showing a configuration example of the cutting unit 24. The cutting unit 24 includes a cylindrical main shaft casing 56 that is fixed to a lower portion of the Z-axis moving plate 40. A main shaft 58 that is a rotating shaft that is parallel in the Y-axis direction is housed inside the main shaft housing 56.

The front end portion (one end portion) of the main shaft 58 is exposed to the outside from one end side of the main shaft casing 56, and a mount flange 60 is attached to the front end portion of the main shaft 58. Further, a rotary drive source (not shown) including a motor is coupled to the base end portion (the other end portion) of the main shaft 58.

The mount flange 60 includes a disk-shaped flange portion 62 and a first boss portion 64 and a second boss portion 66 that protrude from the center of the front and back surfaces of the flange portion 62, respectively. An opening 60a penetrating the first boss portion 64, the flange portion 62, and the second boss portion 66 is formed at the center of the mount flange 60.

The front end portion of the main shaft 58 is fitted into the opening 60a of the mount flange 60 from the back side (the main shaft housing 56 side). In this state, the washer 68 is disposed in the opening 60a, and when the fixing bolt 70 is locked to the bolt hole 58a of the main shaft 58 through the washer 68, the mount flange 60 is fixed to the main shaft 58.

The front surface on the outer peripheral side of the flange portion 62 is an end surface (contact surface) 62a that contacts the back surface of the dicing blade 72. The end surface 62a is formed in an annular shape as viewed in the Y-axis direction (the axial direction of the main shaft 58), and is vertically and flat with respect to the axial center of the main shaft 58 in an appropriately adjusted state.

The first boss portion 64 is formed in a cylindrical shape, and a screw is provided on the outer peripheral surface 64a of the tip end portion. A circular opening 72a is formed in the center of the cutting blade 72. The cutting blade 72 is attached to the mount flange 60 by passing the first boss 64 through the opening 72a.

The cutting blade 72 is a so-called hub type blade, and an annular cutting blade 76 for cutting the workpiece 11 is fixed to the outer peripheral portion of the disk-shaped support base 74. For example, the cutting edge 76 disperses abrasive grains such as diamond or CBN (Cubic Boron Nitide) in a bonding material such as metal or resin to form a predetermined thickness. Further, as the cutting blade 72, a washer type blade or the like which is formed only by a cutting blade may be used.

In a state where the cutting blade 72 is attached to the mount flange 60, an annular fixing plate 78 is disposed on the front side of the cutting blade 72. A circular opening 78a is formed in a central portion of the fixing plate 78, and a screw groove is formed in the inner wall surface of the opening 78a with respect to the screw on the outer circumferential surface 64a of the first boss portion 64.

The back surface of the fixing plate 78 is a contact surface (not shown) that contacts the front surface of the cutting blade 72 (the front surface of the support base 74). The front end of the first boss portion 64 is locked at the opening 78a of the fixing plate 78. As long as the fixing plate 78 is attached to the mounting flange 60, the cutting blade can be held by the mounting flange 60 and the fixing plate 78. 72.

Fig. 3 is a partial cross-sectional front view schematically showing a state in which the workpiece 11 is cut. For the sake of convenience of explanation, the polishing unit 22, the cutting unit 24, and the like disposed on one of the chuck tables 18 are omitted in FIG.

When the workpiece 11 is cut by the cutting device 2, first, the dicing film 15 attached to the back side of the workpiece 11 is brought into contact with the holding surface 18a of the chuck table 18 to cause a negative pressure of the suction source. In addition, the frame 17 is fixed by the jig 20. Thereby, the workpiece 11 is held in a state where the front side is exposed upward.

Then, for example, the chuck table 18 is rotated, and the target dividing line (the longitudinal direction of the dividing line) is superposed on the X-axis direction of the cutting device 2. Further, the chuck table 18 and the cutting unit 24 are relatively moved, and the position of the cutting blade 72 is aligned above the extension line of the target dividing line.

Further, the lower end of the cutting blade 72 (that is, the lower end of the cutting edge 76) is moved to a position lower than the front surface (upper surface) of the workpiece 11. Further, in the present embodiment, the workpiece 11 can be cut by moving the lower end of the dicing blade 72 to a position lower than the back surface (lower surface) of the workpiece 11. Thereafter, the cutting blade 72 is rotated while the chuck table 18 is moved in the X-axis direction.

Thereby, as shown in FIG. 3, the cutting blade 72 is cut along the planned dividing line of the object, and the workpiece 11 can be cut. Further, when the workpiece 11 is cut by the cutting blade 72, the polishing pad of the above-described polishing unit 22 can also be positioned at a pad evacuation position that does not interfere with the cutting blade 72.

Next, a flow for measuring the inclination or unevenness of the end surface 62a of the above-described mount flange 60 will be described. 4(A) is a partial cross-sectional front view schematically showing the positional relationship and the like of the cutting unit 24 and the laser displacement gauge 48, and FIG. 4(B) is a schematic view showing the inclination of the end surface 62a of the mounting mount flange 60 or A partial section front view of the bump.

As shown in FIG. 4(A), the laser displacement gauge 48 of the present embodiment is disposed above the spindle housing 56 of each of the cutting units 24, and illuminates the laser beam L for measurement toward the face-to-face cutting unit 24.

When the inclination or unevenness of the end surface 62a of the mount flange 60 is measured by the laser displacement gauge 48, first, the mount flange 60 fixed from the cutting unit 24 as one of the measurement targets (hereinafter referred to as The fixing plate 78 and the cutting blade 72 are taken out for the mounting flange 60 of one of the sides. Further, the laser displacement gauge 48 (hereinafter referred to as the other laser displacement gauge 48) disposed above the other cutting unit 24 faces the end surface 62a of one of the attachment flanges 60.

For the control unit of the cutting device 2, the positional relationship between the end face 62a of one of the mount flanges 60 and the other of the laser displacement gauges 48 is known. Therefore, even if the operator does not input the change information, the control unit of the cutting device 2 can control the cutting unit moving mechanism 28 with the other laser displacement gauge 48 facing the end face 62a of the one of the mount flanges 60.

As shown in FIG. 4(B), after adjusting the positional relationship between the end surface 62a of one of the attachment flanges 60 and the other of the laser displacement gauges 48, the main shaft 58 of one of the cutting units 24 is rotated. In other words, the mount flange 60 of one of the sides is rotated. Further, one of the mount flanges 60 may be rotated before adjusting the positional relationship between the end surface 62a of one of the mount flanges 60 and the other of the laser displacement gauges 48.

Next, the laser beam L is irradiated from the other laser displacement gauge 48 toward the end surface 62a of one of the mount flanges 60. Thereby, based on the reflected light of the laser beam L reflected by the end surface 62a of one of the mount flanges 60, the other laser displacement gauge 48 measures the laser displacement gauge 48 from the other side to one of the laser beams. The distance of the end face 62a of the mounting member flange 60.

As described above, in the present embodiment, one of the mount flanges 60 is rotated. Therefore, the distance from the other laser displacement gauge 48 to the end surface 62a of the one of the mount flanges 60 can be measured as a whole in the circumferential direction of the mount flange 60. The control unit of the cutting device 2 calculates the inclination or unevenness of the end surface 62a of one of the mount flanges 60 based on the result measured by the laser displacement gauge 48. The calculated result (measurement result) is reported to the operator by the display 52 or the indicator light 54.

After the inclination or unevenness of the end surface 62a of the mount flange 60 is measured in this flow, the end surface 62a of the mount flange 60 can be adjusted as needed. For example, in the case where the inclination or unevenness of the end surface 62a of the mount flange 60 exceeds an arbitrary reference value (threshold value), the end surface 62a of the mount flange 60 may be corrected in the next flow.

Fig. 5(A) is a partial cross-sectional front view schematically showing a state in which the end surface 62a of the mount flange 60 is corrected, and Fig. 5(B) is a plan view schematically showing a state in which the end surface 62a of the mount flange 60 is corrected. . For the sake of convenience of explanation, the polishing unit 22, the cutting unit 24, and the like disposed on one side of the chuck table 18 are omitted in FIGS. 5(A) and 5(B).

When the end surface 62a of the mount flange 60 is corrected, the polishing pad of the polishing unit 22 is positioned at the appropriate correction position of the correction of the end surface 62a. Specifically, as shown in FIG. 5(A), for example, the polishing pad is raised to a correction position higher than the pad evacuation position. Further, as shown in FIGS. 5(A) and 5(B), the mount flange 60 is rotated while the end surface 62a is brought into contact with the polishing pad. Thereby, the end surface 62a of the mount flange 60 can be polished and the inclination or unevenness can be corrected.

As described above, the cutting device 2 of the present embodiment is provided with a laser displacement damper (measuring unit) 48 and a control unit (measuring unit) for measuring the inclination or unevenness of the end surface 62a of the mounting member flange 60, so that it is not necessary to measure the end surface. The old type measuring gauge that requires complicated work is used for the inclination or unevenness of 62a. Therefore, according to the cutting device 2, the inclination or unevenness of the end surface 62a of the mount flange 60 contacting the cutting blade 72 can be simply measured.

In addition, the present invention is not limited to the description of the above-described embodiment and the like, and various modifications may be made. For example, in the above-described embodiment, the cutting device 2 in which the laser displacement meter (measuring unit) 48 is disposed above the cutting unit 24 is taken as an example, and the configuration of the laser displacement meter (measuring unit) 48 of the present invention is shown. There are no specific restrictions.

Fig. 6 is a perspective view schematically showing a configuration example of a grinding device 102 according to a modification. In addition, many components of the cutting device 102 of the modification are common to the components of the cutting device 2 of the above-described embodiment. Therefore, the same components are denoted by the same reference numerals, and the detailed description is omitted.

As shown in FIG. 6, an automatic tool changer (blade exchange unit) 80 that can automatically exchange the cutting blades 72 is disposed behind the support structure 26. The automatic tool changer 80 includes a fixed plate attaching and detaching unit 82 that attaches and detaches the fixing plate 78 to the cutting unit 24 (mounting member flange 60), and a blade attaching and detaching unit 84 that detaches and cuts with respect to the cutting unit 24 (mounting member flange 60). Blade 72.

The automatic tool changer 80 is supported by an automatic tool changer moving mechanism (not shown) to move between the rear exchanger evacuation position and the front loading and unloading position. A cartridge 86 is disposed adjacent the exchanger evacuation position, the cartridge 86 housing a cutting blade 72 that is detachable relative to the cutting unit 24.

When the cutting blade 72 mounted on the cutting unit 24 is taken out from the automatic tool changer 80, the automatic tool changer 80 is first moved to the loading and unloading position. Next, the fixing plate 78 is taken out from the cutting unit 24 by the fixing plate handling unit 82.

Further, the cutting blade 72 is taken out from the cutting unit 24 by the blade handling unit 84. Thereafter, the automatic tool changer 80 is moved to the exchanger evacuation position. And, the cutting blade 72 taken out from the cutting unit 24 is accommodated to the cartridge 86.

On the other hand, when the cutting blade 72 accommodated in the cartridge 86 is attached to the cutting unit 24, the cutting blade 72 is first taken out from the cartridge 86 by the blade handling unit 84. Next, the automatic tool changer 80 is moved to the loading and unloading position. Further, the cutting blade 72 is attached to the cutting unit 24 by the blade handling unit 84. Further, a fixing plate 78 is attached to the cutting unit 24 by the fixed plate handling unit 82.

The automatic tool changer 80 is provided with the above-described laser displacement meter (measuring unit) 48. Therefore, for example, after the cutting blade 72 attached to the cutting unit 24 is taken out from the mounting flange 60 by the automatic tool changer 80, the inclination or unevenness of the end surface 62a can be measured by the laser displacement gauge 48.

Further, the cutting device 2 of the above-described embodiment and the cutting device 102 of the modified example are provided with a polishing unit (end surface correction unit) 22 including a polishing pad, and other components that correct the end surface 62a may be provided. Fig. 7 is a partial cross-sectional front view schematically showing a state in which the end surface 62a of the mount flange 60 is corrected by using a washing nozzle (end surface correcting unit) 88; Fig. 8(A) is a schematic front view showing the vicinity of the washing nozzle 88. Fig. 8(B) is a plan view showing a state in the vicinity of the cleaning nozzle 88.

As shown in Fig. 7, in the above-described embodiment and modification, the cleaning nozzle 88 for correcting the end surface 62a can be disposed at a position where the polishing unit (end surface correction unit) 22 is disposed. In this case, for example, as shown in FIG. 8(A) and FIG. 8(B), by rotating the attachment flange 60 and simultaneously ejecting the fluid F from the cleaning nozzle 88 to the end surface 62a, it is possible to remove foreign matter causing unevenness and the like. Correct the end face 62a. Of course, the grinding unit 22 and the cleaning nozzle 88 may be provided together.

Other configurations, methods, and the like of the above-described embodiments, modifications, and the like can be appropriately changed without departing from the scope of the invention.

2, 102‧‧‧ cutting device

4‧‧‧Abutment

4a, 4b, 4c‧‧

6‧‧‧Carson support

8‧‧‧Carmen

10‧‧‧X-axis moving mechanism

12‧‧‧Mobile cover

14‧‧‧Dust-proof drip cover

16‧‧‧X-axis mobile station

18‧‧‧ chuck table

18a‧‧‧ Keep face

18b‧‧‧Attraction path

20‧‧‧ fixture

22‧‧‧ Grinding unit (end face correction unit)

24‧‧‧Cutting unit

26‧‧‧Support structure

28‧‧‧Cutting unit moving mechanism

30‧‧‧Y-axis guide

32‧‧‧Y-axis moving board

34‧‧‧Y-axis ball screw

36‧‧‧Y-axis pulse motor

38‧‧‧Z-axis guide

40‧‧‧Z-axis moving board

42‧‧‧Z-axis ball screw

44‧‧‧Z-axis pulse motor

46‧‧‧ Camera (camera unit)

48‧‧‧Laser Displacement Meter (Measurement Unit)

50‧‧‧cleaning unit

52‧‧‧Display (notification unit)

54‧‧‧ indicator light (notification unit)

56‧‧‧Spindle housing

58‧‧‧ Spindle

58a‧‧‧Bolt hole

60‧‧‧Fitting flange

60a‧‧‧ openings

62‧‧‧Flange

62a‧‧‧End face (contact surface)

64‧‧‧1st raised part

64a‧‧‧ outer perimeter

66‧‧‧2nd raised part

68‧‧‧Washers

70‧‧‧ bolt

72‧‧‧Cutting blades

72a‧‧‧ openings

74‧‧‧Support abutment

76‧‧‧ cutting edge

78‧‧‧Fixed plate

78a‧‧‧ openings

80‧‧‧Automatic tool changer (blade exchange unit)

82‧‧‧Fixed plate handling unit

84‧‧‧Blade handling unit

86‧‧‧Bob

88‧‧‧Washing nozzle (end face correction unit)

11‧‧‧Workpiece

13‧‧‧ components

15‧‧‧Cutting film

17‧‧‧Frame

L‧‧‧Laser beam

F‧‧‧ fluid

Fig. 1 is a perspective view schematically showing a configuration example of a grinding device. Fig. 2 is a perspective view schematically showing a configuration example of a grinding unit. Fig. 3 is a partial cross-sectional front view schematically showing a state in which a workpiece is cut. 4(A) is a partial cross-sectional front view schematically showing a positional relationship between a cutting unit and a laser displacement gauge, and the like, and FIG. 4(B) is a schematic view showing a state in which the inclination or the unevenness of the end surface of the flange of the mounting member is measured. Partial profile front view. Fig. 5(A) is a partial cross-sectional front view schematically showing a state in which the end surface of the flange of the mount is corrected, and Fig. 5(B) is a plan view schematically showing a state in which the end surface of the flange of the mount is corrected. Fig. 6 is a perspective view schematically showing a configuration example of a grinding device according to a modification. Fig. 7 is a partial cross-sectional front view schematically showing a state in which an end surface of a flange of a mount is corrected using a washing nozzle. Fig. 8(A) is a front view schematically showing a state in the vicinity of the washing nozzle, and Fig. 8(B) is a plan view showing a state in the vicinity of the washing nozzle.

Claims (4)

A cutting device characterized by comprising: a chuck table for holding a workpiece; a cutting unit for cutting the workpiece by a cutting blade fixed at a front end portion of the spindle through a blade mounting member; and a measuring unit for measuring the inclination or unevenness of the annular end surface The annular end surface contacts the cutting blade of the blade mounting member mounted on the spindle; and the notification unit notifies the measurement result of the measuring unit. The cutting device of claim 1, wherein the measuring unit comprises a laser displacement meter that measures the inclination or unevenness of the end face by a laser beam. The cutting device according to claim 1 or 2, further comprising an end surface correcting unit that cleans or grinds the end surface corresponding to the measurement result. The cutting device of claim 1 or 2, further comprising: a cartridge accommodating the cutting blade; and a blade exchange unit for arranging the cutting blade mounted on the cutting unit The cutting blade of the cartridge is exchanged; the measuring unit is mounted on the blade exchange unit, and the cutting blade attached to the cutting unit is taken out from the blade mounting member by the blade exchange unit, and the inclination of the end surface is measured or Bump.