TW201825204A - A method for cleaning, drying and storaging cassettes in unity and an equipment thereof - Google Patents

Abstract

This invention provides a method for cleaning, drying and storaging cassettes in unity and an equipment thereof. The equipment comprises a control module, a loading unit, a cleaning unit, a vacuum drying unit, a storaging unit, an unloading unit, a carrying unit, and a transporting device for the carrying unit. The method comprising: carrying cassettes via the carrying unit; cleaning the cassettes and carrying unit via ultrasonic or megasonic waves; drying the cassettes and the carrying unit in vacuum; storaging the cassettes and carrying unit; taking the carrying unit and cassettes and unloading the cassettes from the carrying unit. With this method, the cassettes can be cleaned, dried, and storage in unity, the efficiency and quality for cleaning and drying the cassettes may be enhanced to save time.

Description

   Integrated method and equipment for cleaning, storing and storing semiconductor crystal box   

The invention relates to the technical field of semiconductor manufacturing, in particular to an integrated method and equipment for cleaning, storage and storage of semiconductor crystal boxes.

In the semiconductor manufacturing process, traditional silicon wafer box cleaning is performed by immersion manual cleaning or single-hung spray shower cleaning. The manual cleaning method is to immerse the crystal box in the water tank and scrub it with nylon or sponge. The single-hung spray spray cleaning method requires special cleaning equipment. A main shaft is provided in the middle of the cleaning equipment, and several insert cages are set around the main shaft. Each insert cage can place several sets of crystal boxes. Generally, the removed crystal box and the crystal box cover are vertically inserted into the insert cage of the cleaning device, wherein the open level of the crystal box is outward, and the crystal box cover is placed on the side of the crystal box, and then spray-washed. Drying after manual cleaning is generally natural drying. Spray cleaning equipment uses gas drying, spin drying, and the like.

The main problem of traditional silicon wafer crystal box cleaning and drying is that it is easy to remove the crystal box pollutants by manual cleaning technology, but the consistency of the cleaning quality cannot be guaranteed by relying on manual labor. And for important crystal boxes, such as those shipped to customers, customers generally do not allow manual cleaning. Spray cleaning uses nozzle spray for cleaning, and can not perform targeted cleaning for the dead corner of the crystal box. Technically, the effect of removing pollutants from the crystal box is average. Gas drying will re-introduce pollutants; spin drying may cause a certain degree of wear on the crystal box; natural drying takes a long time, generally 8 hours or more, and natural drying requires the operator's non-stop operation, the personnel themselves are Pollution source.

Therefore, it is really necessary to improve the existing method of cleaning and drying semiconductor wafer cassettes to solve the above problems.

In view of the foregoing prior art, an object of the present invention is to provide an integrated method and equipment for cleaning, drying, and storing semiconductor wafer cassettes, which are used to solve various problems in the prior art.

In order to achieve the above object and other related objects, the present invention provides an integrated method for cleaning, drying, and storage of a semiconductor crystal box, comprising the steps of: loading a crystal box with a crystal box carrier; and performing ultrasonic or megasonic cleaning together with the crystal box carrier ; Vacuum-clean the crystal box and the crystal carrier together; store the vacuum-dried crystal box together with the crystal carrier; remove the stored crystal box together with the crystal carrier, and remove the crystal box from The wafer carrier is unloaded.

In order to achieve the above object and other related objects, the present invention also provides an integrated device for cleaning, drying and storing semiconductor crystal boxes, including: a control module, a crystal box loading unit, a crystal box cleaning unit, a crystal box vacuum drying unit, and a crystal box storage unit. , Crystal box unloading unit, crystal box carrier, and transporting the crystal box carrier between the crystal box loading unit, crystal box cleaning unit, crystal box pre-drying unit, crystal box drying storage unit, and crystal box unloading unit Transport device; wherein the control module is connected to the crystal box loading unit, crystal box cleaning unit, crystal box pre-drying unit, crystal box drying storage unit, crystal box unloading unit and transport device; the crystal box The loading unit provides an empty cassette carrier, and the cassette is loaded into the cassette carrier in the cassette loading unit; the cassette cleaning unit includes a washing tank configured with an ultrasonic or megasonic generator, and the control unit The module controls the transport device to take out the crystal box carrier with the crystal box loaded from the crystal box loading unit and put it into the cleaning tank for cleaning; the vacuum drying unit of the crystal box is provided with a vacuum The drying module, the control module controls the transport device to remove the crystal box carrier loaded with the crystal box from the crystal box cleaning unit, and put the crystal box carrier into the vacuum drying chamber for drying; The storage unit includes a storage table, and the control module controls the transport device to take out the dried crystal box carrier loaded with the crystal box from the vacuum drying unit and place it on the storage table for storage; The control module controls the transport device to take out the crystal box carrier loaded with the crystal box from the storage table in the crystal box storage unit, and put it into the crystal box unloading unit. The wafer cassette unloading unit is unloaded from the wafer cassette carrier.

As described above, the integrated method for cleaning and drying storage of a semiconductor crystal box of the present invention has the following beneficial effects: The present invention uses a crystal box carrier to load the crystal box, and replaces traditional methods such as manual brushing and nozzle spraying with sonic cleaning. Vacuum drying replaces traditional methods such as spin drying and wind blowing, which can realize the integration of cleaning, drying, and storage of semiconductor crystal boxes, improve the efficiency and quality of crystal box cleaning and drying, and save time and cost.

100‧‧‧control module

101‧‧‧ Crystal Box Loading Unit

102‧‧‧ crystal box cleaning unit

103‧‧‧ crystal box vacuum drying unit

104‧‧‧ Crystal Box Storage Unit

105‧‧‧ Crystal Box Unloading Unit

106‧‧‧ Crystal Box Carrier Recycling Unit

107‧‧‧fan filter unit

200‧‧‧ crystal box carrier

201‧‧‧Box card slot

202‧‧‧Box cover card slot

203‧‧‧handle

300‧‧‧ transport device

FIG. 1 is a schematic diagram of an integrated device for cleaning, drying, and storing a semiconductor wafer box according to an embodiment of the present invention.

FIG. 2 is a schematic top view of a wafer carrier according to an embodiment of the present invention.

FIG. 3 is a schematic side view of a wafer carrier in an embodiment of the present invention.

FIG. 4 is a schematic diagram of a crystal box storage unit according to an embodiment of the present invention.

The following describes the embodiments of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

It should be noted that the illustrations provided in the following embodiments are only a schematic illustration of the basic idea of the present invention, and the drawings only show the components related to the present invention and not the number, shape and For size drawing, the type, quantity, and proportion of each component can be changed at will in actual implementation, and the component layout type may be more complicated.

In order to solve the problems of traditional silicon wafer box cleaning and drying methods, which are time-consuming, low efficiency, and easy to introduce pollution due to manual operations, the present invention provides a semiconductor wafer box cleaning, drying, and storage integration method, including steps: S1: using a crystal box Carrier loading crystal box; S2: Ultrasonic or megasonic cleaning of crystal box and crystal box carrier; S3: Vacuum drying of cleaned crystal box and crystal box carrier; S4: Vacuum drying of crystal The cassette is stored together with the cassette carrier; S5: Take out the stored cassette with the cassette carrier, and unload the cassette from the cassette carrier.

Specifically, the crystal box and the crystal box carrier are vacuum-dried until the drying standard is reached. Alternatively, the crystal box and the crystal box carrier are vacuum-dried as pre-drying to remove the washed water droplets, and then stored and dried naturally to a dry standard.

Please refer to FIG. 1. This embodiment provides an integrated semiconductor wafer box cleaning, drying and storage integrated device, which can implement the above method, including: a control module 100, a wafer box loading unit 101, a wafer box cleaning unit 102, and a wafer box vacuum drying unit 103. , The crystal case storage unit 104, the crystal case unloading unit 105, the crystal case carrier 200, and the crystal case loading unit 101, the crystal case cleaning unit 102, the crystal case pre-drying unit 103, the crystal case drying storage unit 104, and the crystal case The unloading unit 105 transports the transport device 300 of the crystal box carrier 200; the control module 100 and the crystal box loading unit 101, the crystal box cleaning unit 102, the crystal box pre-drying unit 103, and the crystal box The drying storage unit 104, the crystal box unloading unit 105, and the transport device 300 are connected and realize the crystal box loading unit 101, the crystal box cleaning unit 102, the crystal box pre-drying unit 103, the crystal box drying storage unit 104, and the crystal box Control of the unloading unit 105 and the transport device 300.

The crystal cassette loading unit 101 provides an empty crystal cassette carrier 200, and the crystal cassette is loaded into the crystal cassette carrier 200 in the crystal cassette loading unit 101.

The crystal cassette cleaning unit 102 includes a cleaning tank configured with an ultrasonic or megasonic generator. The control module 100 controls the transport device 300 to load the crystal cassette loaded with the crystal cassette from the crystal cassette loading unit 101. The carrier 200 is taken out and put into the cleaning tank for cleaning.

The crystal box vacuum drying unit 103 is provided with a vacuum drying chamber, and the control module 100 controls the transport device 300 to remove the crystal box carrier 200 loaded with the crystal box from the crystal box cleaning unit 102 after cleaning. And put into the vacuum drying chamber for drying; the crystal box storage unit 104 includes a storage table, and the control module 100 controls the transport device 300 to take out the loaded dry crystal from the vacuum drying unit 103 The cassette carrier 200 of the cassette is placed on the storage table for storage.

The control module 100 controls the transport device 300 to take out the crystal box carrier 200 loaded with the crystal box from the storage table in the crystal box storage unit 104 to a dry standard, and put it into the crystal box for unloading. Unit 105. The crystal cassette is unloaded from the crystal cassette carrier 200 in the crystal cassette unloading unit 105.

Specifically, the crystal box includes a box body and a box cover. The crystal box carrier 200 includes a box body card slot 201 and a corresponding box cover card slot 202, and the box body and the box cover of the crystal box can be respectively embedded in the box body card slot 201 and the corresponding box cover card slot. In 202, the box body is opposite to the back of the corresponding box cover, as shown in FIG. 2. The back of the box body is 1-20 cm away from the back of the corresponding lid, and in this embodiment, it is preferably 10 cm. The box body card slot 201 and the corresponding box cover card slot 202 are a group for loading the same crystal box. The crystal box carrier 200 may include a plurality of sets of box body card slots 201 and corresponding box cover card slots 202 for loading a plurality of crystal boxes. For example, the crystal box carrier 200 may include 2 to 10 sets of box body slots and corresponding lid cover slots, and the preferred number is 5 groups. Each group is placed adjacent to each other, and a plurality of sets of box body card slots 201 and corresponding box cover card slots 202 are arranged in a row. The adjacent two sets of box body slot 201 and the corresponding box cover slot 202 are 1 to 20 cm apart, and in this embodiment, it is preferably 10 cm. A convex ridge or groove is provided between the adjacent two sets of box body slot 201 and the corresponding box cover slot 202. The arrangement of annular ridges or grooves between the groups is advantageous for supporting the wafer carrier 200 during cleaning, drying and storage. The specific design of the crystal case carrier 200 is that after all the crystal case body and the cover are embedded in the crystal case carrier 200, the crystal case carrier 200 is tilted 30 degrees in all directions, and the crystal case body and the lid will not slide out as good. Where the cover is embedded in the crystal box carrier 200, a support structure for the back of the cover can be designed. The crystal box carrier 200 (including the card slot part) can adopt a hollow design to eliminate dead corners for cleaning and drying and reduce the total weight.

Specifically, handles 203 may be provided at both ends of the crystal box carrier 200, as shown in FIG. 3. The handle 203 may be a semi-circular arc-shaped protrusion extending along two ends of the crystal box carrier 200. The thickness of the semi-circular arc-shaped protrusion is 2 to 5 cm, preferably 4 cm. The handle 203 is designed to facilitate the transportation of the transport device. For example, it is convenient for the robot to grasp and slide on the round pole.

Specifically, the crystal carrier 200 is made of a material that is resistant to cleaning, high temperature, high strength, high cleanliness, and smooth plastic. In some embodiments, it needs to be resistant to infrared or microwave radiation. In this embodiment, the material of the crystal box carrier 200 is preferably Teflon.

Specifically, the control module 100 may be provided with a console to control the crystal box loading unit 101, the crystal box cleaning unit 102, the crystal box pre-drying unit 103, the crystal box drying storage unit 104, and the crystal box unloading unit 105. And the transport device 300 performs corresponding operations.

Specifically, the transport device 300 includes a robot arm, and the crystal box carrier 200 is grasped and transported by the robot arm.

Specifically, when the crystal cassette is loaded, the crystal cassette loading unit 101 tilts the empty crystal cassette carrier 200 toward the outside of the crystal cassette loading unit 101 by a certain angle to facilitate the loading of the crystal cassette. Loading the crystal box can be performed by robotic arm or manual operation. For example, the operator can select "Load" on the console of the integrated device. The control module 100 controls the crystal box loading unit 101 to open the outer door, and the empty crystal box carrier 200 is tilted outside the device. The preferred tilt angle is At 15 degrees, the operator manually separates the crystal box to be cleaned into the crystal box body and the box cover, and then manually inserts the box body and the box cover into the card slot of the crystal box carrier 200.

After the crystal box loading is completed, the crystal box loading unit tilts the crystal box carrier on which the crystal box is loaded toward the inside of the crystal box loading unit by a certain angle. For example, after the card slot is full, press "OK", the control module 100 controls the crystal box loading unit 101 to close the outer door, and the fully loaded crystal box carrier 200 tilts into the device. The preferred inclination angle is 15 degrees, and it can be maintained at the same angle during subsequent cleaning, vacuum drying, storage, and unloading processes. Preferably, when the crystal cassette carrier 200 is transported between the crystal cassette loading unit 101, the crystal cassette cleaning unit 102, the crystal cassette pre-drying unit 103, the crystal cassette drying storage unit 104, and the crystal cassette unloading unit 105, Maintain the tilt angle.

Specifically, the crystal box cleaning unit 102 can be cleaned by using a deionized water cleaning overflow method, or by changing the water after cleaning a fixed number of batches. In this embodiment, preferably, the crystal box cleaning unit 102 uses 950 KHz megasonic waves for cleaning. For example, an ultrasonic generator larger than 20KHZ, preferably a 950KHz megasonic wave generator is arranged in the cleaning tank, and the megasonic wave cleaning is performed for the opening direction of the crystal box body and the direction of the inner wall of the cover. The cleaning tank can be made of quartz.

Specifically, the crystal box vacuum drying unit 103 may further be provided with an infrared drying device and / or a microwave drying device to assist vacuum drying.

Vacuum drying can be used as pre-drying. It is mainly used to remove water droplets after cleaning the crystal box. To dry the crystal box completely to the drying standard, natural drying is preferred. The crystal box storage unit 104 can be used for natural drying of the crystal box. As shown in FIG. 4, the crystal box storage unit 104 may include a multi-layer storage table, and a plurality of crystal box carriers 200 can be placed on each storage table. In this embodiment, it is preferably a four-layer storage table, and each layer can store five storage tables. Each crystal box carrier 200 can dry 100 crystal boxes in total. The storage table is preferably inclined downward at an angle, and a baffle is provided at one end of the storage table inclined downward. The inclination angle of the storage table is consistent with the inclination angle maintained when the crystal box carrier 200 is transported.

In this embodiment, after the pre-drying by vacuum drying is completed, the robotic arm grabs the crystal box carrier 200 into the crystal box storage unit 104, and starts to input from the bottom layer. After the input, due to the gravity, the crystal box carrier 200 Slide to the oblique direction until it is blocked. As shown in FIG. 4, there is a baffle plate on the far right to block the first cassette carrier 200, and the subsequent cassette carrier 200 is blocked by the previous cassette carrier 200. After one layer is filled, the next crystal carrier 200 will be placed in the previous layer, and so on. After the cassette carrier 200 is placed, the cassette is left to stand for natural drying.

During the implementation process, the pre-drying time can be increased as needed to reduce the natural drying time. The capacity of the device of the present invention can be increased, but the energy consumption is also increased accordingly. If the capacity of the device of the present invention is sufficient, the pre-drying time can be reduced as required to save energy consumption. During the implementation process, the pre-drying and natural drying time of each layer of crystal box carrier can be set to be different according to needs. Due to the long natural drying time, the drying degree may not reach the drying standard when the crystal box needs to be unloaded. In response to this situation, another batch of crystal cassettes can be put in and set to perform a long-term vacuum drying to the drying standard. The natural drying step is skipped and placed in a specific location of the crystal cassette storage unit 104. The robotic arm directly takes them out and unloads them. use.

The crystal box can be unloaded by robotic arm operation or manual operation. For example, the operator may select "unload" on the integrated device console, and the control module 100 controls the robotic arm to enter the crystal box storage unit 104 to take out the crystal box carrier 200 that was dried first. In this embodiment, if the control module 100 determines that the non-crystal box carrier 200 has been dried, an alarm prompt is issued. If it is determined that the drying has been completed, the control module 100 controls the robotic arm to put the taken out crystal box carrier 200 into the crystal box. The unloading unit 105 controls the outer door of the crystal box unloading unit 105 to open. The operator manually removes the crystal box body and the corresponding box cover from the crystal box carrier 200 and presses "OK", and the unloading is completed.

As shown in FIG. 1, in this embodiment, preferably, the integrated semiconductor wafer box cleaning, drying and storage integrated device further includes a wafer box carrier recovery unit 106, and the wafer box carrier recovery unit 106 is located in the wafer box unloading unit 105. Between the wafer cassette loading unit 101 and the wafer cassette loading unit 101, the wafer cassette carrier 200 unloaded from the wafer cassette unloading unit 105 is transported to the wafer cassette loading unit 101. Specifically, the crystal box carrier recovery unit may include an unloading end and a loading end having a lower level than the unloading end, and a structure such as a slide rail or a slide bar is provided between the unloading end and the loading end. The recovered cassette carrier 200 is slid back from the unloading end of the cassette unloading unit 105 to the loading end near the cassette loading unit 101. Each time the loading is performed, the retrieved and standby wafer cassette carrier 200 can be held by a robotic arm. The wafer cassette loading unit 101 is loaded.

As shown in FIG. 1, in this embodiment, preferably, the integrated semiconductor crystal box cleaning, drying and storage integrated device further includes a fan filter unit 107 located above each unit, so that the semiconductor crystal box cleaning, drying, and storage integrated device is clean. Dust-free environment.

To sum up, the present invention uses a crystal carrier to load a crystal box, replaces traditional methods such as manual brushing and nozzle spraying with sonic cleaning, and replaces traditional methods such as spin-drying and air blowing with vacuum drying. The integration of drying and storage improves the efficiency and quality of crystal box cleaning and drying, and saves time and cost. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

The above-mentioned embodiments merely illustrate the principle of the present invention and its effects, but are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field to which they belong without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the scope of patent application of the present invention.

Claims (26)

    An integrated method for cleaning, drying and storing a semiconductor crystal box, comprising the steps of: loading a crystal box with a crystal box carrier; performing ultrasonic or megasonic cleaning with the crystal box carrier and the crystal box carrier; and cleaning the crystal box after cleaning Vacuum drying together with the crystal cassette carrier; storing the vacuum dried crystal cassette together with the crystal cassette carrier; and taking out the stored crystal cassette together with the crystal cassette carrier, and removing the crystal cassette from the The crystal box carrier is unloaded.         The integrated method for cleaning, drying, and storing a semiconductor wafer box according to claim 1, wherein the wafer box and the wafer carrier are vacuum-dried to a drying standard.         The integrated cleaning and drying storage method for a semiconductor wafer box according to claim 1, wherein the wafer box is stored together with the wafer carrier and dried naturally to a dry standard.         An integrated device for cleaning, drying and storing semiconductor crystal boxes, comprising: a control module; a crystal box loading unit; a crystal box cleaning unit; a crystal box vacuum drying unit; a crystal box storage unit; a crystal box unloading unit; Crystal box carrier; and a transport of the crystal box carrier between the crystal box loading unit, the crystal box cleaning unit, the crystal box pre-drying unit, the crystal box drying storage unit, and the crystal box unloading unit. Transport device; the control module is connected to the crystal box loading unit, the crystal box cleaning unit, the crystal box pre-drying unit, the crystal box drying storage unit, the crystal box unloading unit and the transport device; the crystal box is loaded The unit provides an empty crystal box carrier, and the crystal box is loaded into the crystal box carrier in the crystal box loading unit; the crystal box cleaning unit includes a cleaning tank configured with an ultrasonic or megasonic generator, and the control module The group controls the transport device to take out the crystal carrier carrying the crystal box from the crystal box loading unit and put it into the cleaning tank for cleaning; the vacuum drying unit of the crystal box is provided with a vacuum drying cavity, and the control mold Group control The transport device is used to remove the crystal box carrier loaded with the crystal box from the crystal box cleaning unit and put it into the vacuum drying chamber for drying; the crystal box storage unit includes a storage table, and the control mold The group controls the transport device to take out the dry-loaded tire crystal box carrier loaded with the crystal box from the vacuum drying unit and place it on the storage table for storage; the control module controls the transport device from the crystal box The crystal cassette carrying the crystal cassette which has reached the drying standard is taken out from the storage table in the storage unit and put into the crystal cassette unloading unit, and the crystal cassette is unloaded from the crystal cassette in the crystal cassette unloading unit. .         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the wafer box includes a box body and a box cover, and the wafer box carrier includes a box body slot and a corresponding box cover slot. The box body and the box cover are respectively embedded in the box body slot and the corresponding box cover slot, so that the box body is opposite to the corresponding box cover back.         The integrated cleaning and drying storage device for a semiconductor crystal box according to claim 5, wherein the back of the box body is 1 to 20 cm away from the back of the corresponding lid.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 5, wherein the wafer box carrier includes a plurality of sets of cassette slots and a plurality of sets of corresponding cassette cover slots, the cassette slots and the corresponding packages. The lid slots are arranged in a row.         The integrated cleaning and drying storage device for a semiconductor wafer box as described in claim 7, wherein the wafer box carrier includes 2 to 10 sets of cassette slots and corresponding cassette cover slots, two adjacent sets of cassette slots and corresponding The slots of the lids are 1 ~ 20 cm apart.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 7, wherein a convex ridge or a groove is provided between the adjacent two sets of box body card slots and corresponding box cover card slots.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the wafer box carrier is provided with a handle at each end.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 10, wherein the two handles are semi-circular arc-shaped protrusions extending along both ends of the wafer box carrier.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 11, wherein the thickness of the semicircular arc-shaped protrusion is 2 to 5 cm.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the material of the wafer box carrier is Teflon.         The integrated cleaning and drying storage device for a semiconductor wafer cassette according to claim 4, wherein when the wafer cassette is loaded, the wafer cassette loading unit tilts the empty wafer cassette carrier toward the outside of the wafer cassette loading unit by a certain angle.         The integrated semiconductor wafer box cleaning, drying and storage integrated device as described in claim 4, wherein after the wafer box loading is completed, the wafer box loading unit tilts the wafer box carrier loaded with the wafer box to a certain angle inside the wafer box loading unit .         The integrated semiconductor wafer box cleaning, drying, and storage device according to claim 15, wherein the wafer box loading unit, the wafer box cleaning unit, the wafer box pre-drying unit, the wafer box drying storage unit, and the wafer box unloading unit When the crystal box carrier is transported between them, the crystal box carrier is kept inclined at a certain angle.         The integrated cleaning and drying storage device for a semiconductor wafer box according to any one of claim 15 or 16, wherein the wafer box carrier has an inclination angle of 15 degrees.         The semiconductor wafer box cleaning, drying, and storage integrated device according to claim 4, wherein the wafer box cleaning unit adopts a deionized water cleaning overflow method or a fixed batch number of water replacement method for cleaning.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the wafer box cleaning unit is cleaned with a megasonic wave of 950KHZ.         The integrated cleaning and drying storage device for a semiconductor crystal box according to claim 4, wherein the vacuum drying unit of the crystal box is further provided with an infrared drying device and / or a microwave drying device.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the wafer box storage unit comprises a multi-layer storage table, and each layer of the storage table can place multiple wafer box carriers.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the storage table is inclined downward at an angle, and a baffle is provided at one end of the storage table inclined downward.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 16, wherein the tilt angle of the storage table is consistent with the tilt angle maintained when the wafer box carrier is transported.         The integrated cleaning and drying storage device for a semiconductor wafer box according to claim 4, wherein the transport device includes a robot arm.         The integrated semiconductor wafer box cleaning, drying, storage and storage device according to claim 4, wherein the semiconductor wafer box cleaning, drying, storage and storage integration device further includes a crystal box carrier recovery unit, and the crystal box carrier recovery unit is located in the crystal box unloading Between the unit and the cassette loading unit, the cassette carrier unloaded from the cassette unloading unit is transported to the cassette loading unit.         The semiconductor crystal box cleaning, drying, and storage integrated equipment according to claim 4, wherein the semiconductor crystal box cleaning, drying, and storage integrated equipment further includes a fan filter unit.