TW201802595A - Black photosensitive resin composition - Google Patents

Abstract

A black photosensitive resin composition which contains: a photopolymerization initiator composition (A) that contains 1-99 parts by mass of the component (A-1) described below and 1-99 parts by mass of the component (A-2) described below (provided that the total of the component (A-1) and the component (A-2) is 100 parts by mass); an alkali developable cardo resin (B); a black pigment (C); and a solvent (D). (See the description for details of general formulae.) Component (A-1): a photopolymerization initiator which contains one or more oxime ester compounds represented by general formula (1), said compounds being characterized by having a nitrocarbazole skeleton Component (A-2): a photopolymerization initiator which contains one or more ketoxime ester compounds represented by general formula (2), said compounds being characterized by having a ketoxime ester structure.

Description

Black photosensitive resin composition

The present invention relates to a black photosensitive resin composition, and more particularly, to a black photosensitive resin composition useful for forming a black matrix of a color filter.

Color filters are indispensable parts for the colorization of liquid crystal display devices that have been continuously promoted in various fields in recent years. This color filter is provided on a transparent substrate such as glass with colored pixels such as red, green, and blue. Between the colored pixels, in order to improve the contrast, and to prevent the TFT (Thin Film Transistor, thin film transistor) element on the opposing substrate in the liquid crystal display device from malfunctioning due to light, a black matrix is usually set as Shading section. As a method for forming colored pixels and a black matrix, various methods such as a printing method, an electroplating method, and an inkjet method are conceived in the industry, and a photolithography method which is superior in quality is widely used. Generally, the production of color filters by photolithography is performed in the following order. A black photosensitive resin composition is coated on a substrate, and exposed and developed through a mask having a specific pattern to form a black matrix. As the exposure method, a proximity exposure (proximity exposure) method in which the interval (exposure gap) between the substrate and the photomask is maintained at the μm level and the exposure light is irradiated is generally used. Then, for example, a photosensitive resin composition in which a red pigment is dispersed is applied and exposed and developed through a photomask corresponding to a black matrix opening in a display area to form a red pixel. By performing the same operation using a photosensitive resin composition in which green and blue pigments are dispersed, a color filter having red, green, and blue colored pixels can be manufactured. In recent years, with regard to liquid crystal display devices used in mobile devices such as mobile phone terminals, high definition has been strongly demanded as display contents become more advanced. The high definition of liquid crystal display devices requires high definition of both TFT elements and color filters. If the pixel size of the color filter is made small for high definition, the transmittance will decrease and the brightness of the liquid crystal display device will decrease. In order to achieve both high definition and high transmittance, the black matrix of the color filter must be thinned. In particular, the line width of the black matrix of color filters for mobile devices and the like is required to be thinned. In order to make the black matrix thinner, the exposure amount must be kept low and the development time must be extended. However, when the exposure amount is kept low, the black photosensitive resin composition is insufficiently hardened, so the development resistance of the exposed portion is insufficient, the line width unevenness in the substrate is increased, and patterns are liable to occur. Defect. In addition, when the development time is prolonged, a pattern shape defect or a pattern defect is likely to occur. In order to solve these problems, the industry seeks a black photosensitive resin composition which has sufficient light-shielding properties, has a high resolution and a high sensitivity, and can form a high-resolution fine-line black matrix. On the other hand, the industry has proposed using an oxime ester compound as a photopolymerization initiator used in a photosensitive resin composition (Patent Documents 1 to 5). However, these black photosensitive resin compositions each using the previous photopolymerization initiator alone are insufficient in terms of light-shielding properties, sensitivity, and resolution, and are not sufficiently satisfactory for obtaining a high-definition black matrix. [Prior Art Literature] [Patent Literature] Patent Literature 1: Japanese Patent Laid-Open No. 2013-114249 Patent Literature 2: Japanese Patent Laid-Open No. 2010-15025 Patent Literature 3: US Patent Application Publication No. 2011/0129778 Specification Patent Document 4: US Patent Application Publication No. 2009/0292039 Specification Patent Document 5: US Patent Application Publication No. 2016/0332960 Specification

通式(1)中，R¹ 表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、碳原子數2～20之雜環基或CN，烷基、烷氧基、芳基、芳氧基、芳烷基及雜環基之氫原子存在進而被取代為OR²¹ 、COR²¹ 、SR²¹ 、NR²² R²³ 、-NCOR²² -OCOR²³ 、CN、鹵素原子、-CR²¹ =CR²² R²³ 或-CO-CR²¹ =CR²² R²³ 之情形，R²¹ 、R²² 及R²³ 分別獨立地表示氫原子、碳原子數1～20之烷基、碳原子數6～30之芳基、碳原子數7～30之芳烷基或碳原子數2～20之雜環基， R² 表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、碳原子數2～20之雜環基或CN，烷基、烷氧基、芳基、芳氧基及芳烷基之氫原子存在進而被取代為鹵素原子之情形， R³ 表示碳原子數1～20之烷基、碳原子數6～30之芳基或碳原子數7～30之芳烷基， 上述R¹ 、R² 、R³ 、R²¹ 、R²² 及R²³ 所表示之取代基之伸烷基部分存在被不飽和鍵、醚鍵、硫醚鍵、酯鍵、硫酯鍵、醯胺鍵或胺基甲酸酯鍵中斷1～5次之情形，上述取代基之烷基部分存在具有分支側鏈之情形，且存在為環狀烷基之情形，上述取代基之烷基末端存在為不飽和鍵之情形，R³ 存在與鄰接之苯環一併形成環之情形， R⁴ 及R⁵ 分別獨立地表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、CN或鹵素原子，a及b分別獨立為0～3。 (A-2)成分：含有以具有酮肟酯結構為特徵之下述通式(2)所表示之酮肟酯化合物之一種以上的光聚合起始劑。 [化2]

通式(2)中，X¹ 表示硫原子、氧原子、NR³⁰ 、CO或直接鍵，R³⁰ 表示氫原子、碳原子數1～20之烷基、碳原子數6～30之芳基或碳原子數7～30之芳烷基， R⁶ 表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、碳原子數2～20之雜環基或CN，烷基、烷氧基、芳基、芳氧基、芳烷基及雜環基之氫原子存在進而被取代為OR³¹ 、COR³¹ 、SR³¹ 、NR³² R³³ 、-NCOR³² -OCOR³³ 、CN、鹵素原子、-CR³¹ =CR³² R³³ 或-CO-CR³¹ =CR³² R³³ 之情形，R³¹ 、R³² 及R³³ 分別獨立地表示氫原子、碳原子數1～20之烷基、碳原子數6～30之芳基、碳原子數7～30之芳烷基或碳原子數2～20之雜環基， R⁷ 表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、碳原子數2～20之雜環基或CN，烷基、烷氧基、芳基、芳氧基及芳烷基之氫原子存在進而被取代為鹵素原子之情形， 上述R⁶ 、R⁷ 、R³⁰ 、R³¹ 、R³² 及R³³ 所表示之取代基之伸烷基部分存在被不飽和鍵、醚鍵、硫醚鍵、酯鍵、硫酯鍵、醯胺鍵或胺基甲酸酯鍵中斷1～5次之情形，上述取代基之烷基部分存在具有分支側鏈之情形，且存在為環狀烷基之情形，上述取代基之烷基末端存在為不飽和鍵之情形， R⁹ 及R¹⁰ 分別獨立地表示碳原子數1～20之烷基、碳原子數1～20之烷氧基、碳原子數6～30之芳基、碳原子數6～30之芳氧基、碳原子數7～30之芳烷基、CN或鹵素原子，又，R⁹ 與R¹⁰ 存在一併形成環之情形，R⁹ 及R¹⁰ 所表示之取代基之伸烷基部分存在被不飽和鍵、醚鍵、硫醚鍵、酯鍵、硫酯鍵、醯胺鍵或胺基甲酸酯鍵中斷1～5次之情形，取代基之烷基部分存在具有分支側鏈之情形，且存在為環狀烷基之情形，取代基之烷基末端存在為不飽和鍵之情形。t及u分別獨立為0～4。 R⁸ 表示氫原子、苯甲醯基、OH、COOH或下述通式(3)所表示之基， [化3]

通式(3)中，Z¹ 為鍵結鍵，表示-O-、-S-、-OCO-或-COO-，(R¹¹ )_v -Z² -部分表示經v個R¹¹ 取代之碳原子數1～20之烷基、碳原子數6～30之芳基或碳原子數7～30之芳基烷基，Z² 所表示之基之伸烷基部分存在被-O-、-S-、-COO-或-OCO-中斷1～5次之情形，Z² 所表示之基之伸烷基部分存在具有分支側鏈之情形，且存在為伸環烷基之情形，R¹¹ 表示OH或COOH，v表示1～3之整數。 又，本發明提供一種黑色感光性樹脂組合物，其進而含有乙烯性不飽和化合物(其中，鹼性顯影性卡多(Cardo)樹脂(B)除外)(E)。 又，本發明提供一種黑色感光性樹脂組合物，其進而含有矽烷偶合劑(F)。 又，本發明提供一種黑矩陣，其係使用上述黑色感光性樹脂組合物而形成。 又，本發明提供一種彩色濾光片，其具備上述黑矩陣。 又，本發明提供一種液晶顯示裝置，其係使用上述彩色濾光片而形成。Therefore, an object of the present invention is to provide a black photosensitive resin composition which has sufficient light-shielding properties, has high sensitivity and high resolution, and is useful for forming a black matrix. The present inventors made diligent research in order to solve the above-mentioned problems, and as a result, found that the black photosensitivity of an oxime ester compound and a ketoxime ester compound having a nitrocarbazole skeleton is used in an alkaline developable Cardo resin The resin composition has sufficient light-shielding properties, is highly sensitive, and obtains a high-definition black matrix, thereby completing the present invention. That is, the present invention provides a black photosensitive resin composition containing the following components: 1 to 99 parts by mass of the following (A-1) component, and 1 to 99 parts by mass of the following (A-2) component (wherein, ( A-1) A total of 100 parts by mass of components and (A-2) components) Photopolymerization initiator composition (A), alkaline developable Cardo resin (B), black pigment (C) And solvent (D). (A-1) Component: One or more photopolymerization initiators containing an oxime ester compound represented by the following general formula (1) characterized by having a nitrocarbazole skeleton. [Chemical 1]

In the general formula (1), R ¹ represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an aryloxy group having 6 to 30 carbon atoms. Group, aralkyl group having 7 to 30 carbon atoms, heterocyclic group having 2 to 20 carbon atoms or CN, hydrogen atom of alkyl group, alkoxy group, aryl group, aryloxy group, aralkyl group and heterocyclic group Existence is replaced by OR ²¹ , COR ²¹ , SR ²¹ , NR ²² R ²³ , -NCOR ²² -OCOR ²³ , CN, halogen atom, -CR ²¹ = CR ²² R ²³ or -CO-CR ²¹ = CR ²² R ²³ In this case, R ²¹ , R ²² and R ²³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or carbon A heterocyclic group having 2 to 20 atoms, R ² represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and 6 to 30 carbon atoms Aryloxy group, aralkyl group with 7 to 30 carbon atoms, heterocyclic group with 2 to 20 carbon atoms or CN, alkyl, alkoxy, aryl, aryloxy and arylalkyl hydrogen atoms exist further substituted with a halogen atom as the case where, R ³ represents an alkyl group of 1 to 20 carbon atoms, carbon atoms, Or an aryl group having 6 to 30 carbon atoms of the aralkyl group having 7 to 30, the above-described ^{R 1, R 2, R 3} , R 21, R 22 and R ²³ represented by the substituent of the alkylene group portion is not present When a saturated bond, an ether bond, a thioether bond, an ester bond, a thioester bond, a amine bond, or a urethane bond is interrupted 1 to 5 times, the alkyl portion of the substituent may have a branched side chain. When there is a cyclic alkyl group, when the alkyl terminal of the above-mentioned substituent is an unsaturated bond, when R ³ is combined with an adjacent benzene ring to form a ring, R ⁴ and R ⁵ each independently represent a carbon Alkyl group having 1 to 20 carbon atoms, alkoxy group having 1 to 20 carbon atoms, aryl group having 6 to 30 carbon atoms, aryloxy group having 6 to 30 carbon atoms, and arane having 7 to 30 carbon atoms Group, CN or halogen atom, a and b are each independently 0 to 3. (A-2) Component: One or more photopolymerization initiators containing a ketoxime ester compound represented by the following general formula (2) having a ketoxime ester structure. [Chemical 2]

In the general formula (2), X ¹ represents a sulfur atom, an oxygen atom, NR ³⁰ , CO, or a direct bond, and R ³⁰ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or Aralkyl groups having 7 to 30 carbon atoms, R ⁶ represents alkyl groups having 1 to 20 carbon atoms, alkoxy groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, and 6 to 30 carbon atoms Aryloxy group 30, aralkyl group with 7 to 30 carbon atoms, heterocyclic group with 2 to 20 carbon atoms or CN, alkyl group, alkoxy group, aryl group, aryloxy group, aralkyl group and heterocyclic ring The hydrogen atom of the radical is further substituted by OR ³¹ , COR ³¹ , SR ³¹ , NR ³² R ³³ , -NCOR ³² -OCOR ³³ , CN, halogen atom, -CR ³¹ = CR ³² R ³³ or -CO-CR ³¹ = In the case of CR ³² R ³³ , R ³¹ , R ³² and R ³³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an aromatic group having 7 to 30 carbon atoms. Alkyl or heterocyclic group having 2 to 20 carbon atoms, R ⁷ represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and a carbon atom Aryloxy group having 6 to 30 carbon atoms, Aralkyl group having 7 to 30 carbon atoms, and 2 to 20 carbon atoms Heterocyclyl or CN, when hydrogen atoms of alkyl, alkoxy, aryl, aryloxy and aralkyl are present and are substituted with halogen atoms, R ⁶ , R ⁷ , R ³⁰ , R ³¹ , R ^The alkylene moiety of the substituents represented by ³² and R ³³ is interrupted 1 to 5 times by unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amido bonds, or carbamate bonds. In some cases, there may be a case where the alkyl portion of the substituent has a branched side chain, and a case where the alkyl portion is a cyclic alkyl group, and a case where an unsaturated bond exists at the alkyl end of the substituent, and R ⁹ and R ¹⁰ are each independently Alkyl group having 1 to 20 carbon atoms, alkoxy group having 1 to 20 carbon atoms, aryl group having 6 to 30 carbon atoms, aryloxy group having 6 to 30 carbon atoms, and 7 to 30 carbon atoms Aralkyl, CN, or halogen atom, and when R ⁹ and R ¹⁰ form a ring together, the alkylene part of the substituent represented by R ⁹ and R ¹⁰ may be unsaturated, ether, or thioether When the bond, ester bond, thioester bond, amido bond, or urethane bond is interrupted 1 to 5 times, the alkyl part of the substituent may have a branched side chain, and the Alkyl-terminated case of cyclic alkyl, the substituent group is a case where the presence of an unsaturated bond. t and u are independently 0 to 4. R ⁸ represents a hydrogen atom, a benzamidine group, OH, COOH, or a group represented by the following general formula (3), [Chem. 3]

In the general formula (3), Z ¹ is a bonding bond, which represents -O-, -S-, -OCO-, or -COO-, and (R ¹¹ ) _v -Z ² -partly represents a carbon substituted by v R ¹¹ The alkyl group having 1 to 20 atoms, the aryl group having 6 to 30 carbon atoms, or the aryl alkyl group having 7 to 30 carbon atoms, and the alkylene part of the group represented by Z ² is represented by -O-, -S -When -COO- or -OCO- is interrupted 1 to 5 times, there is a case where the alkylene part of the group represented by Z ² has a branched side chain and a case where it is a cycloalkylene group, and R ¹¹ represents OH Or COOH, v represents an integer of 1 to 3. The present invention also provides a black photosensitive resin composition, which further contains an ethylenically unsaturated compound (except for the alkali developable Cardo resin (B)) (E). The present invention also provides a black photosensitive resin composition further containing a silane coupling agent (F). Moreover, this invention provides the black matrix formed using the said black photosensitive resin composition. The present invention also provides a color filter including the black matrix. Moreover, this invention provides the liquid crystal display device formed using the said color filter.

其次，對(A-2)成分進行說明。於光聚合起始劑組合物(A)中用作(A-2)成分之酮肟酯化合物之特徵在於：其係以上述通式(2)表示，且具有酮肟酯結構。 於通式(2)中，酮肟酯結構係指下述通式(4)所表示之部分。 [化5]

用作(A-2)成分之酮肟酯化合物存在基於肟之雙鍵的幾何異構物，但並非對該等進行區分，上述通式(2)及下述例示化合物表示兩者之混合物或任一者，並不限定於顯示出異構物之結構。 又，本發明之(A-2)成分係含有上述通式(2)所表示之酮肟酯化合物之一種以上者，較佳為僅包含該肟酯化合物之一種以上。 作為上述通式(2)中之R⁶ 、R⁷ 、R⁹ 、R¹⁰ 、R³⁰ 、R³¹ 、R³² 及R³³ 所表示之碳原子數1～20之烷基，例如可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、異戊基、第三戊基、己基、庚基、辛基、異辛基、2-乙基己基、第三辛基、壬基、異壬基、癸基、異癸基、十一烷基、十二烷基、十四烷基、十六烷基、十八烷基、二十烷基、環戊基、環己基、環己基甲基等。 作為上述通式(2)中之R⁶ 、R⁷ 、R⁹ 及R¹⁰ 所表示之碳原子數1～20之烷氧基，可列舉與上述烷基對應者。 作為上述通式(2)中之R⁶ 、R⁷ 、R⁹ 、R¹⁰ 、R³⁰ 、R³¹ 、R³² 及R³³ 所表示之碳原子數6～30之芳基，可列舉：苯基、甲苯基、二甲苯基、乙基苯基、氯苯基、聯苯基、萘基、蒽基、菲基、以及經1個以上之上述烷基取代之苯基、聯苯基、萘基及蒽基等。 作為上述通式(2)中之R⁶ 、R⁷ 、R⁹ 及R¹⁰ 所表示之碳原子數6～30之芳氧基，可列舉與上述芳基對應者。 作為上述通式(2)中之R⁶ 、R⁷ 、R⁹ 、R¹⁰ 、R³⁰ 、R³¹ 、R³² 及R³³ 所表示之碳原子數7～30之芳烷基，例如可列舉：苄基、氯苄基、α-甲基苄基、α,α-二甲基苄基、苯基乙基等。 作為上述通式(2)中之R⁶ 、R⁷ 、R³¹ 、R³² 及R³³ 所表示之碳原子數2～20之雜環基，例如可列舉：吡啶基、嘧啶基、呋喃基、噻吩基、四氫呋喃基、二氧雜環戊基、苯并㗁唑-2-基、四氫吡喃基、吡咯啶基、咪唑啶基、吡唑啶基、噻唑啶基、異噻唑啶基、㗁唑啶基、異㗁唑啶基、哌啶基、哌𠯤基、嗎啉基等5～7員雜環等。 作為上述通式(2)中之R⁹ 與R¹⁰ 可一併形成之環之例，可列舉：茀、9,9-二甲基茀、9,9-二乙基茀、9,9-二丙基茀、9,9-二丁基茀等。 於(A-2)成分之酮肟酯化合物之中，於上述通式(2)中，就感度與解像度之觀點而言，較佳為R⁶ 為碳原子數1～20之烷基者，更佳為R⁶ 為碳原子數1～8之烷基者。 又，於(A-2)成分之酮肟酯化合物之中，於上述通式(2)中，就感度與解像度之觀點而言，較佳為R⁷ 為碳原子數1～20之烷基或碳原子數6～30之芳基者，更佳為R⁷ 為碳原子數1～8之烷基或碳原子數6～12之芳基者。 又，於(A-2)成分之酮肟酯化合物之中，於上述通式(2)之(R⁹ )_t 中，就感度與解像度之觀點而言，t較佳為0或1。於t為1～3之情形時，R⁹ 較佳為碳原子數1～20之烷基，更佳為碳原子數1～6之烷基。 又，於(A-2)成分之酮肟酯化合物之中，於上述通式(2)之(R¹⁰ )_u 中，就感度與解像度之觀點而言，u較佳為0或1。於u為1～3之情形時，R¹⁰ 較佳為碳原子數1～20之烷基，更佳為碳原子數1～4之烷基。 又，於(A-2)成分之酮肟酯化合物之中，於上述通式(2)中，就感度與解像度之觀點而言，X¹ 較佳為硫原子，又，亦較佳為X¹ 為直接鍵，進而R⁹ 與R¹⁰ 一併形成茀環者。 又，於(A-2)成分之酮肟酯化合物之中，於上述通式(2)中，就感度與解像度之觀點而言，R⁸ 較佳為氫原子或通式(3)所表示之基，更佳為通式(3)所表示之基。 又，於通式(3)中，就感度與解像度之觀點而言，Z¹ 較佳為-O-，Z² 較佳為經1個羥基取代之碳原子數1～20、尤其是碳原子數1～10之烷基。 作為(A-2)成分之上述通式(2)所表示之肟酯化合物之較佳之具體例，可列舉以下之化合物No.10～No.25。 [化6]

[化7]

於本發明中，(A)成分之光聚合起始劑組合物中，將(A-1)成分與(A-2)成分之合計之含量設為100質量份，(A-1)成分之含量為1質量份～99質量份，(A-2)成分之含量為1～99質量份。就感度與解像度之觀點而言，(A-1)成分之含量較佳為20～80質量份，更佳為40～60質量份，(A-2)成分之含量較佳為20～80質量份，更佳為40～60質量份。 於本發明之黑色感光性樹脂組合物中，(A)成分之光聚合起始劑組合物於將黑色感光性樹脂組合物之固形物成分設為100質量份之情形時，較佳為0.1～30質量份，更佳為0.5～10質量份。若小於0.1質量份，則存在因曝光引起硬化不充分之情形，若大於30質量份，則存在於黑色感光性樹脂組合物中析出光聚合起始劑之情形。所謂本發明之黑色感光性樹脂組合物之固形物成分係指溶劑以外之成分。 於製備本發明之黑色感光性樹脂組合物時，關於(A-1)成分與(A-2)成分，可調配預先將兩者混合而製成光聚合起始劑組合物(A)者，於製備時，亦可分別單獨地調配至樹脂組合物中。又，於預先製成光聚合起始劑組合物(A)之情形時，視需要亦可使下述本發明之黑色感光性樹脂組合物之任意成分、例如其他光聚合起始劑等預先與(A-1)成分及(A-2)成分一併含有於光聚合起始劑組合物(A)中。 其次，對本發明之黑色感光性樹脂組合物之(B)成分進行說明。作為本發明之(B)成分之鹼性顯影性卡多(Cardo)樹脂(B)，可列舉：對雙酚化合物進行二縮水甘油基化而成者、使對上述雙酚化合物進行二縮水甘油基化而成者與不飽和一元酸進行反應而成者、於對雙酚化合物進行環氧烷改性後使之與不飽和一元酸進行反應而成者等。 其中，就分散性之觀點而言，較佳為如下之乙烯性不飽和化合物，其係藉由具有對下述通式(5)所表示之環氧化合物加成有不飽和一元酸之結構的環氧加成化合物、與多元酸酐之酯化反應而獲得之反應產物。 [化8]

通式(5)中，M表示直接鍵、亞甲基、碳原子數1～4之亞烷基、脂環式烴基、O、S、SO₂ 、SS、SO、CO、OCO、或選自下述式(甲)、(乙)或(丙)所表示之群中之取代基，R⁴¹ 、R⁴² 、R⁴³ 、R⁴⁴ 、R⁴⁵ 、R⁴⁶ 、R⁴⁷ 及R⁴⁸ 分別獨立地表示氫原子、碳原子數1～20之烷基、碳原子數1～10之烷氧基、或鹵素原子，m為0～10之數。 [化9]

式(甲)、(乙)、(丙)中，R⁴⁹ 、R⁵⁰ 、R⁵¹ 、R⁵² 、R⁵³ 、R⁵⁴ 、R⁵⁵ 、R⁵⁶ 、R⁵⁷ 、R⁵⁸ 、R⁵⁹ 、R⁶⁰ 、R⁶¹ 、R⁶² 、R⁶³ 、R⁶⁴ 、R⁶⁵ 、R⁶⁶ 、R⁶⁷ 、R⁶⁸ 、R⁶⁹ 、R⁷⁰ 、R⁷¹ 及R⁷² 分別獨立地表示氫原子、碳原子數1～20之烷基、碳原子數1～10之烷氧基、碳原子數6～20之芳基、碳原子數7～20之芳基烷基、碳原子數2～20之雜環基、或鹵素原子，上述烷基及芳基烷基中之伸烷基部分存在被不飽和鍵、-O-或-S-中斷之情形，R⁴⁹ 、R⁵⁰ 、R⁵¹ 、R⁵² 、R⁵⁷ 、R⁵⁸ 、R⁵⁹ 、R⁶⁰ 、R⁶⁵ 、R⁶⁶ 、R⁶⁷ 、R⁶⁸ 、R⁶⁹ 、R⁷⁰ 、R⁷¹ 及R⁷² 存在鄰接之R⁴⁹ 、R⁵⁰ 、R⁵¹ 、R⁵² 、R⁵⁷ 、R⁵⁸ 、R⁵⁹ 、R⁶⁰ 、R⁶⁵ 、R⁶⁶ 、R⁶⁷ 、R⁶⁸ 、R⁶⁹ 、R⁷⁰ 、R⁷¹ 及R⁷² 彼此形成環之情形。 上述通式(5)中，作為R⁴¹ ～R⁴⁸ 所表示之碳原子數1～20之烷基，可列舉：甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、庚基、異庚基、第三庚基、正辛基、異辛基、第三辛基、2-乙基己基、正壬基、正癸基、十一烷基、十二烷基、十三烷基、異十三烷基、肉豆蔻基、棕櫚基、硬脂基、三氟甲基、二氟甲基、單氟甲基、五氟乙基、四氟乙基、三氟乙基、二氟乙基、七氟丙基、六氟丙基、五氟丙基、四氟丙基、三氟丙基、全氟丁基、環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基等， 作為R⁴¹ ～R⁴⁸ 所表示之碳原子數1～10之烷氧基，可列舉：甲氧基、乙氧基、異丙氧基、丙氧基、丁氧基、戊氧基、異戊氧基、己氧基、庚氧基、辛氧基、2-乙基己氧基等， 作為R⁴¹ ～R⁴⁸ 所表示之鹵素原子，可列舉：氟原子、氯原子、溴原子、碘原子。 於上述通式(5)中之M所表示之選自式(甲)、(乙)及(丙)所表示之群中之取代基中，作為R⁴⁹ ～R⁷² 所表示之碳原子數1～20之烷基、碳原子數1～10之烷氧基及鹵素原子，可列舉上述R⁴¹ ～R⁴⁸ 中所例示者， 作為R⁴⁹ ～R⁷² 所表示之碳原子數6～20之芳基，可列舉：苯基、萘基、蒽-1-基、菲-1-基、鄰甲苯基、間甲苯基、對甲苯基、4-乙烯基苯基、3-異丙基苯基、4-異丙基苯基、4-丁基苯基、4-異丁基苯基、4-第三丁基苯基、4-己基苯基、4-環己基苯基、4-辛基苯基、4-(2-乙基己基)苯基、2,3-二甲基苯基、2,4-二甲基苯基、2,5-二甲基苯基、2,6-二甲基苯基、3,4-二甲基苯基、3,5-二甲基苯基、2,4-二第三丁基苯基、2,5-二第三丁基苯基、2,6-二第三丁基苯基、2,4-二第三戊基苯基、2,5-二第三戊基苯基、環己基苯基、聯苯基、2,4,5-三甲基苯基、4-氯苯基、3,4-二氯苯基、4-三氯苯基、4-三氟苯基、全氟苯基等， 作為R⁴⁹ ～R⁷² 所表示之碳原子數7～20之芳基烷基，可列舉：苄基、苯乙基、2-苯基丙基、二苯基甲基、三苯基甲基、苯乙烯基、苯烯丙基、4-氯苯基甲基等， 作為R⁴⁹ ～R⁷² 所表示之雜環基，可列舉：吡咯基、吡啶基、嘧啶基、嗒𠯤基、哌𠯤基、哌啶基、吡喃基、吡唑基、三𠯤基、吡咯啶基、喹啉基、異喹啉基、咪唑基、苯并咪唑基、三唑基、呋喃基(furyl)、呋喃基(furanyl)、苯并呋喃基、噻吩基(thienyl)、噻吩基(thiophenyl)、苯并噻吩基、噻二唑基、噻唑基、苯并噻唑基、㗁唑基、苯并㗁唑基、異噻唑基、異㗁唑基、吲哚基、𠮻咯啶基、嗎啉基、硫代嗎啉基、2-吡咯啶酮-1-基、2-哌啶酮-1-基、2,4-二氧雜咪唑啶-3-基、2,4-二氧雜㗁唑啶-3-基等， 作為存在由鄰接之R⁴⁹ 、R⁵⁰ 、R⁵¹ 、R⁵² 、R⁵⁷ 、R⁵⁸ 、R⁵⁹ 、R⁶⁰ 、R⁶⁵ 、R⁶⁶ 、R⁶⁷ 、R⁶⁸ 、R⁶⁹ 、R⁷⁰ 、R⁷¹ 及R⁷² 彼此所形成之情形的環，例如可列舉：哌啶環、哌𠯤環、嗎啉環、內醯胺環、吡啶環、嘧啶環、喹啉環、咪唑環、㗁唑環、咪唑啶環、吡唑啶環等雜環、或環戊烷環、環己烷環等環狀烷烴、苯環、萘環、菲環等芳香環等，該等環存在與其他環進行縮合或經取代之情形。 上述所謂不飽和一元酸表示結構中具有不飽和鍵，每1分子具有1個可電離而成為氫離子之氫原子的酸。 作為上述不飽和一元酸，例如可列舉：丙烯酸、甲基丙烯酸、丁烯酸、桂皮酸、山梨酸、甲基丙烯酸羥基乙酯-順丁烯二酸酯等。可列舉：丙烯酸羥基乙酯-順丁烯二酸酯、甲基丙烯酸羥基丙酯-順丁烯二酸酯、丙烯酸羥基丙酯-順丁烯二酸酯、雙環戊二烯-順丁烯二酸酯等。 上述所謂多元酸酐表示每1分子具有複數個可電離而成為氫離子之氫原子的多元酸之酸酐。 作為上述多元酸酐，例如可列舉：聯苯四羧酸二酐、四氫鄰苯二甲酸酐、琥珀酸酐、順丁烯二酸酐、偏苯三甲酸酐、均苯四甲酸酐、2,2',3,3'-二苯甲酮四羧酸二酐、乙二醇雙偏苯三酸酐、甘油三偏苯三酸酐、六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、耐地酸酐、甲基耐地酸酐、三烷基四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、5-(2,5-二側氧基四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-順丁烯二酸酐加成物、十二碳烯基琥珀酸酐、甲基雙環庚烯二甲酸酐等。 上述環氧化合物、上述不飽和一元酸及上述多元酸酐之反應莫耳比較佳為設為如下。 即，於具有相對於上述環氧化合物之1個環氧基，加成有0.1～1.0個上述不飽和一元酸之羧基之結構之環氧加成物中，較佳為設為相對於該環氧加成物之1個羥基，上述多元酸酐之多元酸酐結構成為0.1～1.0個之比率。 將上述環氧化合物、上述不飽和一元酸及上述多元酸酐之反應例示於以下，但本發明並不限定於下述反應例1。 [化10]

作為上述(B)成分之鹼性顯影性之卡多(Cardo)樹脂，就更進一步提高易取得性或本發明之效果之觀點而言，較佳為使用上述通式(5)所表示之環氧化合物中，R⁴¹ ～R⁴⁸ 為氫原子者；M為(甲)所表示之基且R⁴⁹ ～R⁵⁶ 為氫原子者；M為(乙)所表示之基且R⁵⁷ ～R⁶⁴ 為氫原子者。 又，作為上述不飽和酸，較佳為使用碳原子數5以下者，進而較佳為使用丙烯酸、甲基丙烯酸等者。又，作為多元酸酐，較佳為具有苯環或飽和脂肪環者，進而較佳為使用聯苯四羧酸二酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、聯苯四甲酸二酐等者。 於本發明之黑色感光性樹脂組合物中，(B)成分之鹼性顯影性卡多(Cardo)樹脂係作為聚合性化合物(G)而發揮功能。於本發明之黑色感光性樹脂組合物中，作為聚合性化合物(G)，除(B)成分之鹼性顯影性卡多(Cardo)樹脂以外，亦可併用下述乙烯性不飽和化合物(其中，(B)成分之鹼性顯影性卡多(Cardo)樹脂除外)(E)。 於本發明之黑色感光性樹脂組合物中，關於聚合性化合物(G)之含量，於將黑色感光性樹脂組合物之固形物成分設為100質量份之情形時，較佳為5～70質量份，更佳為20～60質量份。若小於5質量份，則光硬化性較差，若大於70質量份，則存在無法進行鹼性顯影之情形。關於聚合性化合物(G)之含量，於不含(E)成分之情形時僅為(B)成分之固形物成分量，於含有(E)成分之情形時為(B)成分與(E)之合計之固形物成分量。 於本發明之黑色感光性樹脂組合物中，作為聚合性化合物(G)，於含有(E)成分之乙烯性不飽和化合物(其中，(B)成分之鹼性顯影性卡多(Cardo)樹脂除外)之情形時，(E)成分相對於(B)成分之鹼性顯影性卡多(Cardo)樹脂100質量份，較佳為3～40質量份。 其次，對本發明之(C)成分之黑色顏料進行說明。 作為黑色顏料(C)，例如可使用藉由爐法(furnace method)、導槽法、熱法而獲得之碳黑、或乙炔黑、科琴黑或燈黑等碳黑；利用環氧樹脂調整並被覆上述碳黑而成者、將上述碳黑預先於溶劑中利用樹脂進行分散處理並使之吸附20～200 mg/g之樹脂而成者、對上述碳黑進行酸性或鹼性表面處理而成者、對上述碳黑進行氧化處理而成者、平均粒徑為8 nm以上且DBP(Dibutyl phthalate，鄰苯二甲酸二丁酯)吸油量為90 ml/100 g以下者、根據950℃下之揮發分中之CO、CO₂ 算出之總氧量相對於碳黑之表面積100 m² 而為9 mg以上者；石墨、石墨化碳黑、活性碳、碳纖維、奈米碳管、螺旋碳纖維、碳奈米角、碳氣凝膠、富勒烯、苯胺黑、苝黑、內醯胺黑、顏料黑7；鈦黑、藉由視需要使釩化合物附著於例如二氧化鈦或氫氧化鈦後，於氨氣、胺氣等含氮還原劑之存在下，藉由電爐法、熱電漿法等氣相反應法進行高溫焙燒而獲得者、或作為鈦黑而市售者等，該等可單獨使用一種，亦可將兩種以上併用。該等之中，較佳為碳黑或鈦黑。 作為黑色顏料(C)之含量，於將黑色感光性樹脂組合物之全部固形物成分設為100質量份之情形時，較佳為0.1～90質量份，更佳為0.1～70質量份。若超過90質量份，則容易凝聚，保存穩定性變差。 又，黑色顏料亦可與鹼性顯影性卡多(Cardo)樹脂(B)或溶劑(D)等其他成分、或分散劑等一併製備為黑色顏料組合物而使用。 其次，對本發明之(D)成分之溶劑進行說明。 作為溶劑(D)，只要為可溶解或分散上述各成分及下述各成分(光聚合起始劑組合物(A)、鹼性顯影性卡多(Cardo)樹脂(B)、黑色顏料(C)、乙烯性不飽和化合物(E)、矽烷偶合劑(F)以外之任意成分等)之溶劑即可，例如可列舉：甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等酮類；乙醚、二㗁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、二丙二醇二甲醚等醚系溶劑；乙酸甲酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、TEXANOL等酯系溶劑；乙二醇單甲醚、乙二醇單乙醚等溶纖劑系溶劑；甲醇、乙醇、異丙醇或正丙醇、異丁醇或正丁醇、戊醇等醇系溶劑；乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯、3-乙氧基丙酸乙酯(EEP)等醚酯系溶劑；苯、甲苯、二甲苯等BTX(Benzene-Toluene-Xylene，苯-甲苯-二甲苯)系溶劑；己烷、庚烷、辛烷、環己烷等脂肪族烴系溶劑；松節油、D-檸檬烯、蒎烯等萜烯系烴油；礦物油精、Swazol＃310(Cosmo Matsuyama Oil股份有限公司)、Solvesso＃100(Exxon Chemical股份有限公司)等烷烴系溶劑；四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等鹵化脂肪族烴系溶劑；氯苯等鹵化芳香族烴系溶劑；卡必醇系溶劑、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、水等，該等溶劑可以1種或2種以上之混合溶劑之形式使用。該等之中，酮類、醚酯系溶劑等、尤其是丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、3-乙氧基丙酸乙酯(EEP)、環己酮等由於阻劑與光聚合起始劑之相溶性良好，故而較佳。 於本發明之黑色感光性樹脂組合物中，作為溶劑(D)之使用量，較佳為固形物成分(溶劑以外之成分)之濃度成為5～30質量%之量，於固形物成分濃度小於5質量%之情形時，不易增厚膜厚，無法充分地吸收所需之波長光，故而欠佳，於超過30質量%之情形時，因組合物之析出，而組合物之保存性降低，或黏度提高而處理性降低，故而欠佳。 其次，對本發明之(E)成分之乙烯性不飽和化合物(其中，鹼性顯影性卡多(Cardo)樹脂(B)除外)進行說明。乙烯性不飽和化合物(E)與鹼性顯影性卡多(Cardo)樹脂(B)一併用作聚合性化合物(G)。 作為乙烯性不飽和化合物(其中，鹼性顯影性卡多(Cardo)樹脂(B)除外)(E)，只要為於化合物中具有碳-碳雙鍵者，則無特別限定，可使用先前黑色感光性樹脂組合物中所使用者，例如可列舉：乙烯、丙烯、丁烯、異丁烯、氯乙烯、偏二氯乙烯、偏二氟乙烯、四氟乙烯等不飽和脂肪族烴；(甲基)丙烯酸、α-氯丙烯酸、伊康酸、順丁烯二酸、琥珀酸、檸康酸、反丁烯二酸、雙環庚烯二甲酸、丁烯酸、異丁烯酸、乙烯基乙酸、烯丙基乙酸、桂皮酸、山梨酸、甲基反丁烯二酸、琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、鄰苯二甲酸單[2-(甲基)丙烯醯氧基乙基]酯、(甲基)丙烯酸羥基乙酯-順丁烯二酸酯、(甲基)丙烯酸羥基丙酯-順丁烯二酸酯、雙環戊二烯-順丁烯二酸酯或具有1個羧基與2個以上之(甲基)丙烯醯基之多官能(甲基)丙烯酸酯等不飽和酸；ω-羧基聚己內酯單(甲基)丙烯酸酯等於兩末端具有羧基與羥基之聚合物之單(甲基)丙烯酸酯；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸縮水甘油酯、下述化合物No.A1～No.A4、(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸二甲基胺基甲酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸二甲基胺基丙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸聚(乙氧基)乙酯、(甲基)丙烯酸丁氧基乙氧基乙酯、(甲基)丙烯酸乙基己酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸四氫呋喃酯、(甲基)丙烯酸乙烯酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸苄酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、異氰尿酸三[(甲基)丙烯醯基乙基]酯、聚酯(甲基)丙烯酸酯低聚物等不飽和一元酸及多元醇或多元酚之酯；(甲基)丙烯酸鋅、(甲基)丙烯酸鎂等不飽和多元酸之金屬鹽；順丁烯二酸酐、伊康酸酐、檸康酸酐、甲基四氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、三烷基四氫鄰苯二甲酸酐、5-(2,5-二側氧基四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-順丁烯二酸酐加成物、十二碳烯基琥珀酸酐、甲基雙環庚烯二甲酸酐等不飽和多元酸之酸酐；(甲基)丙烯醯胺、亞甲基雙(甲基)丙烯醯胺、二乙三胺三(甲基)丙烯醯胺、苯二甲基雙(甲基)丙烯醯胺、α-氯丙烯醯胺、N-2-羥基乙基(甲基)丙烯醯胺等不飽和一元酸及多元胺之醯胺；丙烯醛等不飽和醛；(甲基)丙烯腈、α-氯丙烯腈、二氰亞乙烯、烯丙基氰等不飽和腈；苯乙烯、4-甲基苯乙烯、4-乙基苯乙烯、4-甲氧基苯乙烯、4-羥基苯乙烯、4-氯苯乙烯、二乙烯基苯、乙烯基甲苯、乙烯基苯甲酸、乙烯基苯酚、乙烯基磺酸、4-乙烯基苯磺酸、乙烯基苄基甲醚、乙烯基苄基縮水甘油醚等不飽和芳香族化合物；甲基乙烯基酮等不飽和酮；乙烯胺、烯丙胺、N-乙烯基吡咯啶酮、乙烯基哌啶等不飽和胺化合物；烯丙醇、巴豆醇等乙烯醇；乙烯基甲醚、乙烯基乙醚、正丁基乙烯醚、異丁基乙烯醚、烯丙基縮水甘油醚等乙烯醚；順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺等不飽和醯亞胺類；茚、1-甲基茚等茚類；1,3-丁二烯、異戊二烯、氯丁二烯等脂肪族共軛二烯類；聚苯乙烯、聚(甲基)丙烯酸甲酯、聚(甲基)丙烯酸正丁酯、聚矽氧烷等於聚合物分子鏈之末端具有單(甲基)丙烯醯基之巨單體類；氯乙烯、偏二氯乙烯、琥珀酸二乙烯酯、鄰苯二甲酸二烯丙酯、磷酸三烯丙酯、異氰尿酸三烯丙酯、乙烯基硫醚、乙烯基咪唑、乙烯基㗁唑啉、乙烯基咔唑、乙烯基吡咯啶酮、乙烯基吡啶、使含羥基之乙烯基單體及多異氰酸酯化合物進行反應而獲得之乙烯基胺基甲酸酯化合物；使含羥基之乙烯基單體及聚環氧化合物進行反應而獲得之乙烯基環氧化合物等。 [化11]

又，作為上述乙烯性不飽和化合物(E)，亦可使用丙烯酸酯之共聚物、或使苯酚及/或甲酚酚醛清漆環氧樹脂與不飽和一元酸進行反應而成者、使具有多官能環氧基之聚苯基甲烷型環氧樹脂與不飽和一元酸進行反應而成者。 上述乙烯性不飽和化合物(E)之中，於使用具有酸值之化合物之情形時，就可賦予鹼性顯影性之方面而言較佳。於使用上述具有酸值之化合物之情形時，其使用量較佳為設為成為上述乙烯性不飽和化合物整體之50～99質量%。 又，上述具有酸值之化合物亦可藉由進而使單官能或多官能環氧化合物進行反應而調整酸值後使用。藉由調整上述具有酸值之化合物之酸值，可改良鹼性顯影性。上述具有酸值之化合物(即賦予鹼性顯影性之乙烯性不飽和化合物)較佳為固形物成分之酸值為5～120 mgKOH/g之範圍，單官能或多官能環氧化合物之使用量較佳為以滿足上述酸值之方式加以選擇。 作為上述單官能環氧化合物，可列舉：甲基丙烯酸縮水甘油酯、甲基縮水甘油醚、乙基縮水甘油醚、丙基縮水甘油醚、異丙基縮水甘油醚、丁基縮水甘油醚、異丁基縮水甘油醚、第三丁基縮水甘油醚、戊基縮水甘油醚、己基縮水甘油醚、庚基縮水甘油醚、辛基縮水甘油醚、壬基縮水甘油醚、癸基縮水甘油醚、十一烷基縮水甘油醚、十二烷基縮水甘油醚、十三烷基縮水甘油醚、十四烷基縮水甘油醚、十五烷基縮水甘油醚、十六烷基縮水甘油醚、2-乙基己基縮水甘油醚、烯丙基縮水甘油醚、炔丙基縮水甘油醚、對甲氧基乙基縮水甘油醚、苯基縮水甘油醚、對甲氧基縮水甘油醚、對丁基苯酚縮水甘油醚、甲苯基縮水甘油醚、2-甲基甲苯基縮水甘油醚、4-壬基苯基縮水甘油醚、苄基縮水甘油醚、對異丙苯基苯基縮水甘油醚、三苯甲基縮水甘油醚、甲基丙烯酸2,3-環氧丙酯、環氧化大豆油、環氧化亞麻仁油、丁酸縮水甘油酯、一氧化乙烯基環己烷、1,2-環氧-4-乙烯基環己烷、環氧乙基苯、氧化蒎烯、甲基環氧乙基苯、環氧環己烷、環氧丙烷、上述化合物No.A2、No.A3等。 若使用選自由雙酚型環氧化合物及縮水甘油醚類所組成之群中之一種以上之化合物作為上述多官能環氧化合物，則可獲得特性更良好之黑色感光性樹脂組合物，故而較佳。 作為上述雙酚型環氧化合物，除可使用上述通式(5)所表示之環氧化合物以外，例如亦可使用氫化雙酚型環氧化合物等雙酚型環氧化合物。 又，作為上述縮水甘油醚類，可使用乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、1,8-辛二醇二縮水甘油醚、1,10-癸二醇二縮水甘油醚、2,2-二甲基-1,3-丙二醇二縮水甘油醚、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、四乙二醇二縮水甘油醚、六乙二醇二縮水甘油醚、1,4-環己烷二甲醇二縮水甘油醚、1,1,1-三(縮水甘油氧基甲基)丙烷、1,1,1-三(縮水甘油氧基甲基)乙烷、1,1,1-三(縮水甘油氧基甲基)甲烷、1,1,1,1-四(縮水甘油氧基甲基)甲烷等。 除此以外，亦可使用酚系酚醛清漆型環氧化合物、聯苯酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、雙環戊二烯酚醛清漆型環氧化合物等酚醛清漆型環氧化合物；3,4-環氧-6-甲基環己烷羧酸3,4-環氧-6-甲基環己基甲酯、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、1-環氧乙基-3,4-環氧環己烷等脂環式環氧化合物；鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯、二聚酸縮水甘油酯等縮水甘油酯類；四縮水甘油基二胺基二苯基甲烷、三縮水甘油基對胺基苯酚、N,N-二縮水甘油基苯胺等縮水甘油基胺類；1,3-二縮水甘油基-5,5-二甲基乙內醯脲、異氰尿酸三縮水甘油酯等雜環式環氧化合物；二氧化二環戊二烯等二氧化物化合物；萘型環氧化合物；三苯基甲烷型環氧化合物；二環戊二烯型環氧化合物等。 又，本發明之黑色感光性樹脂組合物可含有不具有乙烯性不飽和鍵且賦予鹼性顯影性之化合物，作為此種化合物，只要為由於具有酸值故而可溶於鹼性水溶液之化合物，則無特別限定，作為代表性者可列舉鹼溶性酚醛清漆樹脂(以下，簡稱為「酚醛清漆樹脂」)。酚醛清漆樹脂可使酚類與醛類於酸觸媒之存在下進行縮聚合而獲得。 作為上述酚類，例如可使用苯酚、鄰甲酚、間甲酚、對甲酚、鄰乙基苯酚、間乙基苯酚、對乙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、2,3-二甲基苯酚、2,4-二甲基苯酚、2,5-二甲基苯酚、3,4-二甲基苯酚、3,5-二甲基苯酚、2,3,5-三甲基苯酚、對苯基苯酚、對苯二酚、鄰苯二酚、間苯二酚、2-甲基間苯二酚、鄰苯三酚、α-萘酚、雙酚A、二羥基苯甲酸酯、沒食子酸酯等，該等酚類之中，較佳為苯酚、鄰甲酚、間甲酚、對甲酚、2,5-二甲基苯酚、3,5-二甲基苯酚、2,3,5-三甲基苯酚、間苯二酚、2-甲基間苯二酚及雙酚A。該等酚類可單獨使用或混合兩種以上而使用。 作為上述醛類，例如可使用甲醛、多聚甲醛、乙醛、丙醛、苯甲醛、苯乙醛、α-苯基丙醛、β-苯基丙醛、鄰羥基苯甲醛、間羥基苯甲醛、對羥基苯甲醛、鄰氯苯甲醛、間氯苯甲醛、對氯苯甲醛、鄰硝基苯甲醛、間硝基苯甲醛、對硝基苯甲醛、鄰甲基苯甲醛、間甲基苯甲醛、對甲基苯甲醛、對乙基苯甲醛、對正丁基苯甲醛等，該等化合物之中，較佳為甲醛、乙醛及苯甲醛。該等醛類可單獨使用或混合兩種以上而使用。醛類係以相對於酚類1莫耳而較佳為0.7～3莫耳、尤佳為0.7～2莫耳之比率使用。 作為上述酸觸媒，例如可使用鹽酸、硝酸、硫酸等無機酸、或甲酸、草酸、乙酸等有機酸。該等酸觸媒之使用量相對於酚類1莫耳，較佳為1×10^-4 ～5×10^-1 莫耳。於縮合反應中，通常使用水作為反應介質，但於縮合反應中所使用之酚類不溶解於醛類之水溶液中，自反應初期起成為不均一系之情形時，亦可使用親水性溶劑作為反應介質。作為該等親水性溶劑，例如可列舉：甲醇、乙醇、丙醇、丁醇等醇類、或四氫呋喃、二㗁烷等環狀醚類。關於該等反應介質之使用量，通常相對於反應原料100質量份而為20～1000質量份。縮合反應之反應溫度可根據反應原料之反應性而適當加以調整，通常為10～200℃，較佳為70～150℃。縮合反應結束後，為了去除存在於系內之未反應原料、酸觸媒及反應介質，通常使內溫上升至130～230℃，於減壓下將揮發分蒸餾去除，繼而使熔融之酚醛清漆樹脂流延至鋼製帶等上而加以回收。 又，於縮合反應結束後，使反應混合物溶解於上述親水性溶劑中，並添加至水、正己烷、正庚烷等沈澱劑中，藉此使酚醛清漆樹脂析出，分離析出物，並進行加熱乾燥，藉此進行回收。 作為上述酚醛清漆樹脂以外之例，可列舉：聚羥基苯乙烯或其衍生物、苯乙烯-順丁烯二酸酐共聚物、聚羥基苯甲酸乙烯酯等。 本發明之黑色感光性樹脂組合物較佳為進而使用矽烷偶合劑(F)。 作為矽烷偶合劑(F)，例如作為具有烯基之矽烷偶合劑，可列舉：乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷、乙烯基甲基二甲氧基矽烷、辛烯基三甲氧基矽烷、烯丙基三甲氧基矽烷、對苯乙烯基三甲氧基矽烷等，作為具有丙烯醯基之矽烷偶合劑，可列舉3-丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三乙氧基矽烷等，作為具有甲基丙烯醯基之矽烷偶合劑，可列舉：3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、甲基丙烯醯氧基辛基三甲氧基矽烷等，作為具有環氧基之矽烷偶合劑，可列舉：2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、縮水甘油氧基辛基三甲氧基矽烷等，作為具有胺基之矽烷偶合劑，可列舉：N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷、N,N'-雙[3-(三甲氧基矽烷基)丙基]乙二胺、N-(乙烯基苄基)-2-胺基乙基-3-胺基丙基三甲氧基矽烷之鹽酸鹽等，作為具有異氰尿酸酯基之矽烷偶合劑，可列舉異氰尿酸三(三甲氧基矽烷基丙基)酯，作為具有巰基之矽烷偶合劑，可列舉：3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷等，作為具有脲基之矽烷偶合劑，可列舉：3-脲基丙基三甲氧基矽烷、3-脲基丙基三乙氧基矽烷等，作為具有硫醚基之矽烷偶合劑，可列舉雙(三乙氧基矽烷基丙基)四硫醚，作為具有硫酯基之矽烷偶合劑，可列舉3-辛醯基硫基-1-丙基三乙氧基矽烷，作為具有異氰酸基之矽烷偶合劑，可列舉3-異氰酸基丙基三乙氧基矽烷、3-異氰酸基丙基三甲氧基矽烷等。 作為上述矽烷偶合劑，可使用市售品，若列舉其例，則作為乙烯基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-1003、Momentive Performance Materials Japan LLC製造之A-171、Dow Corning Toray股份有限公司製造之Z-6300、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL XL10、日美商事股份有限公司製造之Sila-Ace S210等，作為乙烯基三乙氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBE-1003、Momentive Performance Materials Japan LLC製造之A-151、Dow Corning Toray股份有限公司製造之Z-6519、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF56、日美商事股份有限公司製造之Sila-Ace S220等，作為乙烯基三乙醯氧基矽烷，可列舉：Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF62，作為乙烯基三(2-甲氧基乙氧基)矽烷，可列舉Momentive Performance Materials Japan LLC製造之A-172，作為乙烯基甲基二甲氧基矽烷，可列舉：Momentive Performance Materials Japan LLC製造之A-2171、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL XL12等，作為辛烯基三甲氧基矽烷，可列舉信越化學工業股份有限公司製造之KBM-1083，作為烯丙基三甲氧基矽烷，可列舉Dow Corning Toray股份有限公司製造之Z-6825，作為對苯乙烯基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-1403，作為3-丙烯醯氧基丙基三甲氧基矽烷，可列舉KBM-5103，作為3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-502、Dow Corning Toray股份有限公司製造之Z-6033等，作為3-甲基丙烯醯氧基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-503、Momentive Performance Materials Japan LLC製造之A-174、Dow Corning Toray股份有限公司製造之Z-6030、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF31、日美商事股份有限公司製造之Sila-Ace S710等，作為3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷，可列舉信越化學工業股份有限公司製造之KBE-502，作為3-甲基丙烯醯氧基丙基三乙氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBE-503、Momentive Performance Materials Japan LLC製造之Y-9936，作為甲基丙烯醯氧基辛基三甲氧基矽烷，可列舉信越化學工業股份有限公司製造之KBM-5803，作為2-(3,4-環氧環己基)乙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-303、Momentive Performance Materials Japan LLC製造之A-186、Dow Corning Toray股份有限公司製造之Z-6043、日美商事股份有限公司製造之Sila-Ace S530等，作為3-縮水甘油氧基丙基甲基二甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-402、Dow Corning Toray股份有限公司製造之Z-6044、日美商事股份有限公司製造之Sila-Ace S520等，作為3-縮水甘油氧基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-403、Momentive Performance Materials Japan LLC製造之A-187、Dow Corning Toray股份有限公司製造之Z-6040、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF80、日美商事股份有限公司製造之Sila-Ace S510等，作為3-縮水甘油氧基丙基甲基二乙氧基矽烷，可列舉信越化學工業股份有限公司製造之KBE-402，作為3-縮水甘油氧基丙基三乙氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBE-403、Momentive Performance Materials Japan LLC製造之A-1871、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF82等，作為縮水甘油氧基辛基三甲氧基矽烷，可列舉信越化學工業股份有限公司製造之KBM-4803，作為N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-602、Momentive Performance Materials Japan LLC製造之A-2120、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF-95、日美商事股份有限公司製造之Sila-Ace S310等，作為N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-603、Momentive Performance Materials Japan LLC製造之A-1120、Momentive Performance Materials Japan LLC製造之A-1122、Dow Corning Toray股份有限公司製造之Z-6020、Dow Corning Toray股份有限公司製造之Z-6094、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF-91、日美商事股份有限公司製造之Sila-Ace S320等，作為3-胺基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-903、Momentive Performance Materials Japan LLC製造之A-1110、Dow Corning Toray股份有限公司製造之Z-6610、日美商事股份有限公司製造之Sila-Ace S360等，作為3-胺基丙基三乙氧基矽烷，可列舉：KBE-903、Momentive Performance Materials Japan LLC製造之A-1100、Dow Corning Toray股份有限公司製造之Z-6011、日美商事股份有限公司製造之Sila-Ace S330等，作為3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺，可列舉：KBE-9103、日美商事股份有限公司製造之Sila-Ace S340等，作為N-苯基-3-胺基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-573、Momentive Performance Materials Japan LLC製造之Y-9669、Dow Corning Toray股份有限公司製造之Z-6883等，作為N,N'-雙[3-(三甲氧基矽烷基)丙基]乙二胺，可列舉日美商事股份有限公司製造之Sila-Ace XS1003，作為N-(乙烯基苄基)-2-胺基乙基-3-胺基丙基三甲氧基矽烷之鹽酸鹽，可列舉：信越化學工業股份有限公司製造之KBM-575、Dow Corning Toray股份有限公司製造之Z-6032、日美商事股份有限公司製造之Sila-Ace S350等，作為異氰尿酸三(三甲氧基矽烷基丙基)酯，可列舉信越化學工業股份有限公司製造之KBM-9659，作為3-巰基丙基甲基二甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-802、Dow Corning Toray股份有限公司製造之Z-6852，作為3-巰基丙基三甲氧基矽烷，可列舉：信越化學工業股份有限公司製造之KBM-803、Momentive Performance Materials Japan LLC製造之A-189、Dow Corning Toray股份有限公司製造之Z-6062、日美商事股份有限公司製造之Sila-Ace S810等，作為3-巰基丙基三乙氧基矽烷，可列舉：Momentive Performance Materials Japan LLC製造之A-1891、Dow Corning Toray股份有限公司製造之Z-6911，作為3-脲基丙基三乙氧基矽烷，可列舉Momentive Performance Materials Japan LLC製造之A-1160，作為3-脲基丙基三烷氧基矽烷，可列舉信越化學工業股份有限公司製造之KBE-585，作為雙(三乙氧基矽烷基丙基)四硫醚，可列舉信越化學工業股份有限公司製造之KBE-846，作為3-辛醯基硫基-1-丙基三乙氧基矽烷，可列舉：Momentive Performance Materials Japan LLC製造之A-LINK599，作為3-異氰酸基丙基三乙氧基矽烷，可列舉信越化學工業股份有限公司製造之KBE-9007、Momentive Performance Materials Japan LLC製造之A-1310等，作為3-異氰酸基丙基三甲氧基矽烷，可列舉：Momentive Performance Materials Japan LLC製造之Y-5187、Wacker Asahikasei Silicone股份有限公司製造之GENIOSIL GF40等。 該等矽烷偶合劑之中，具有甲基丙烯醯基、環氧基或異氰酸基之矽烷偶合劑即便暴露於高溫高濕下之後，密接性亦較高，因此可較佳地使用，例如可使用信越化學工業股份有限公司製造之KBM-502、KBM-403、KBE-403、KBE-9007等。 該等矽烷偶合劑可單獨使用一種，亦可將兩種以上併用。 作為矽烷偶合劑(F)之含量，於將黑色感光性樹脂組合物之全部固形物成分設為100質量份之情形時，較佳為0.1～20質量份，更佳為0.5～5質量份。若少於0.1質量份，則存在耐濕熱試驗後之密接性較差之情形，若超過20質量份，則存在無法獲得可耐受顯影之硬化物之情形。 於本發明之黑色感光性樹脂組合物中，可進而含有無機化合物。作為該無機化合物，例如可列舉：氧化鎳、氧化鐵、氧化銥、氧化鈦、氧化鋅、氧化鎂、氧化鈣、氧化鉀、二氧化矽、氧化鋁等金屬氧化物；層狀黏土礦物、米洛麗藍、碳酸鈣、碳酸鎂、鈷系、錳系、玻璃粉末(尤其是玻璃料)、雲母、滑石、高嶺土、亞鐵氰化物、各種金屬硫酸鹽、硫化物、硒化物、矽酸鋁、矽酸鈣、氫氧化鋁、鉑、金、銀、銅等。該等無機化合物可使用1種或2種以上。 於本發明之黑色感光性樹脂組合物中，可添加供於使黑色顏料及/或無機化合物分散之分散劑。作為該分散劑，只要為可使黑色顏料或無機化合物分散、穩定化者，則不受限制，可使用市售之分散劑、例如BYK-Chemie公司製造之BYK系列等。可尤其適宜地使用包含具有鹼性官能基之聚酯、聚醚或聚胺基甲酸酯的高分子分散劑，具有氮原子作為鹼性官能基、具有氮原子之官能基為胺及/或其四級鹽、且胺值為1～100 mgKOH/g者。 於本發明之黑色感光性組合物中，可與(A-1)成分之肟酯化合物及(A-2)成分之酮肟酯化合物一同併用其他光聚合起始劑。作為可併用之其他光聚合起始劑，可使用先前已知之化合物，例如可列舉：二苯甲酮、苯基聯苯基酮、1-羥基-1-苯甲醯基環己烷、安息香、苯偶醯二甲基縮酮、1-苄基-1-二甲基胺基-1-(4';-嗎啉基苯甲醯基)丙烷、2-嗎啉基-2-(4';-甲基硫基)苯甲醯基丙烷、9-氧硫

、1-氯-4-丙氧基-9-氧硫

、異丙基-9-氧硫

、二乙基-9-氧硫

、乙基蒽醌、4-苯甲醯基-4'-甲基二苯硫醚、安息香丁醚、2-羥基-2-苯甲醯基丙烷、2-羥基-2-(4'-異丙基)苯甲醯基丙烷、4-丁基苯甲醯基三氯甲烷、4-苯氧基苯甲醯基二氯甲烷、苯甲醯基甲酸甲酯、1,7-雙(9'-吖啶基)庚烷、9-正丁基-3,6-雙(2'-嗎啉基異丁醯基)咔唑、2-甲基-4,6-雙(三氯甲基)均三𠯤、2-苯基-4,6-雙(三氯甲基)均三𠯤、2-萘基-4,6-雙(三氯甲基)均三𠯤、2,2-雙(2-氯苯基)-4,5,4',5'-四苯基-1-2'-聯咪唑、4,4-偶氮雙異丁腈、三苯基膦、樟腦醌、N-1414、N-1717(ADEKA(股份)製造)、IRGACURE 369、IRGACURE 907、IRGACURE OXE 02、IRGACURE OXE 03(BASF Japan(股份)製造)、過氧化苯甲醯、下述通式(6)所表示之化合物等，該等光聚合起始劑可使用1種，或將2種以上組合而使用。 [化12]

通式(6)中，R¹ 、R² 及R³ 與上述通式(1)相同，R⁷³ 表示鹵素原子或烷基，e為0～5之整數。 於本發明之黑色感光性樹脂組合物中，可進而併用鏈轉移劑、增感劑、界面活性劑、三聚氰胺化合物等。 作為上述鏈轉移劑、增感劑，通常可使用含硫原子之化合物。例如可列舉：硫代乙醇酸、硫代蘋果酸、硫代水楊酸、2-巰基丙酸、3-巰基丙酸、3-巰基丁酸、N-(2-巰基丙醯基)甘胺酸、2-巰基菸鹼酸、3-[N-(2-巰基乙基)胺甲醯基]丙酸、3-[N-(2-巰基乙基)胺基]丙酸、N-(3-巰基丙醯基)丙胺酸、2-巰基乙磺酸、3-巰基丙磺酸、4-巰基丁磺酸、十二烷基(4-甲硫基)苯醚、2-巰基乙醇、3-巰基-1,2-丙二醇、1-巰基-2-丙醇、3-巰基-2-丁醇、巰基苯酚、2-巰基乙基胺、2-巰基咪唑、2-巰基苯并咪唑、2-巰基-3-吡啶醇、2-巰基苯并噻唑、巰基乙酸、三羥甲基丙烷三(3-巰基丙酸酯)、季戊四醇四(3-巰基丙酸酯)等巰基化合物、將該巰基化合物氧化而獲得之二硫醚化合物、碘乙酸、碘丙酸、2-碘乙醇、2-碘乙磺酸、3-碘丙磺酸等碘化烷基化合物、三羥甲基丙烷三(3-巰基異丁酸酯)、丁二醇雙(3-巰基異丁酸酯)、己二硫醇、癸二硫醇、1,4-二甲基硫基苯、丁二醇雙硫代丙酸酯、丁二醇雙硫代乙醇酸酯、乙二醇雙硫代乙醇酸酯、三羥甲基丙烷三硫代乙醇酸酯、丁二醇雙硫代丙酸酯、三羥甲基丙烷三硫代丙酸酯、三羥甲基丙烷三硫代乙醇酸酯、季戊四醇四硫代丙酸酯、季戊四醇四硫代乙醇酸酯、三羥基乙基三硫代丙酸酯、下述化合物No.C1、昭和電工公司製造之Karenz MT BD1、PE1、NR1等。 [化13]

作為上述界面活性劑，可使用：磷酸全氟烷基酯、全氟烷基羧酸鹽等氟界面活性劑，高級脂肪酸鹼金屬鹽、烷基磺酸鹽、烷基硫酸鹽等陰離子系界面活性劑，高級胺氫鹵酸鹽、四級銨鹽等陽離子系界面活性劑，聚乙二醇烷基醚、聚乙二醇脂肪酸酯、山梨糖醇酐脂肪酸酯、脂肪酸單甘油酯等非離子界面活性劑，兩性界面活性劑，聚矽氧系界面活性劑等界面活性劑，該等亦可加以組合而使用。 作為上述三聚氰胺化合物，可列舉：(多)羥甲基三聚氰胺、(多)羥甲基甘脲、(多)羥甲基苯并胍胺、(多)羥甲基脲等氮化合物中之活性羥甲基(CH₂ OH基)之全部或一部分(至少2個)經烷基醚化而成之化合物。此處，作為構成烷基醚之烷基，可列舉：甲基、乙基或丁基，有相互相同之情形，亦有不同之情形。又，未經烷基醚化之羥甲基有於一分子內進行自縮合之情形，亦有於二分子間進行縮合，結果形成低聚物成分之情形。具體而言，可使用六甲氧基甲基三聚氰胺、六丁氧基甲基三聚氰胺、四甲氧基甲基甘脲、四丁氧基甲基甘脲等。該等之中，較佳為六甲氧基甲基三聚氰胺、六丁氧基甲基三聚氰胺等經烷基醚化而成之三聚氰胺。 又，於本發明之黑色感光性樹脂組合物中，視需要可添加對苯甲醚、對苯二酚、兒茶酚、第三丁基鄰苯二酚、啡噻𠯤等熱聚合抑制劑；塑化劑；接著促進劑；填充劑；消泡劑；調平劑；表面調整劑；抗氧化劑；紫外線吸收劑；分散助劑；防凝聚劑；觸媒；效果促進劑；交聯劑；增黏劑等慣用之添加物。 於本發明之黑色感光性樹脂組合物中，乙烯性不飽和化合物(其中，鹼性顯影性卡多(Cardo)樹脂(B)除外)(E)、矽烷偶合劑(F)以外之任意成分之含量係根據其使用目的而適當加以選擇，並無特別限制，較佳為於將黑色感光性樹脂組合物之固形物成分設為100質量份之情形時，合計設為20質量份以下。 本發明之黑色感光性樹脂組合物及硬化物可用於硬化性塗料、清漆、硬化性接著劑、印刷基板、顯示器顯示裝置(彩色電視、PC(Personal Computer，個人電腦)顯示器、攜帶型資訊終端及數位相機等之彩色顯示之液晶顯示面板中之彩色濾光片、攜帶型資訊終端及數位相機等之彩色顯示之液晶顯示面板中之黑管柱狀間隔件、各種顯示用途用之彩色濾光片、各種顯示用途用之黑管柱狀間隔件、CCD(Charge Coupled Device，電荷耦合元件)影像感測器之彩色濾光片、觸控面板、電發光顯示裝置、電漿顯示面板、有機EL(Electroluminescence，電致發光)之黑色間隔壁)、粉末塗層、印刷油墨、印刷版、接著劑、凝膠塗層、電子工程用之光阻劑、電鍍阻劑、蝕刻阻劑、阻焊劑、絕緣膜、黑矩陣、及用以於LCD之製造步驟中形成構造之阻劑、用以封入電氣及電子零件之組合物、阻焊劑、磁記錄材料、微小機械零件、波導、光開關、鍍覆用遮罩、蝕刻遮罩、彩色試驗系統、玻璃纖維纜線塗層、網版印刷用模板、用以藉由立體光刻製造三維物體之材料、全像術記錄用材料、圖像記錄材料、微細電子電路、脫色材料、用於圖像記錄材料之脫色材料、使用微膠囊之圖像記錄材料用之脫色材料、印刷配線板用光阻材料、UV(Ultra Violet，紫外線)及可見光雷射直接圖像系統用之光阻材料、印刷電路基板之逐次積層中之介電體層形成中所使用之光阻材料及保護膜等各種用途，其用途並無特別限制，上述用途之中，可尤其適宜地用於顯示器顯示裝置中。 本發明之黑色感光性樹脂組合物可藉由旋轉塗佈機、輥式塗佈機、棒式塗佈機、模嘴塗佈機、簾幕式塗佈機、各種印刷、浸漬等公知之方法，而應用於鈉玻璃、石英玻璃、半導體基板、金屬、紙、塑膠等支持基體上。又，亦可於暫時施加至膜等支持基體上之後，轉印至其他支持基體上，其應用方法並無限制。 又，作為使本發明之黑色感光性樹脂組合物硬化時所使用之活性光之光源，可使用發出波長300～450 nm之光者，例如可使用超高壓水銀、水銀蒸氣電弧、碳弧、氙弧等。 進而，藉由將雷射光用於曝光光源，且不使用遮罩，根據電腦等之數位資訊而直接形成圖像之雷射直接繪圖法由於不僅可實現生產性之提高，亦可實現解像性或位置精度等之提高，故而有用，作為其雷射光，適宜為使用340～430 nm之波長之光，亦可使用氬離子雷射、氦氖雷射、YAG(Yttrium Aluminum Garnet，釔鋁石榴石)雷射、及半導體雷射等發出自可見光區域至紅外線區域之光者。於使用該等雷射之情形時，可加入吸收可見光至紅外線之該區域的增感色素。 本發明之黑色感光性樹脂組合物係為了形成黑矩陣而使用，該黑矩陣尤其對於液晶顯示面板等圖像顯示裝置用之顯示器件用彩色濾光片有用。 上述黑矩陣係藉由如下步驟而較佳地形成：(1)於基板上形成本發明之黑色感光性樹脂組合物之塗膜之步驟、(2)對該塗膜介隔具有圖案形狀之遮罩而照射活性光之步驟、(3)利用顯影液(尤其是鹼性顯影液)使硬化後之覆膜顯影之步驟、(4)對顯影後之該覆膜進行加熱之步驟。又，本發明之黑色感光性樹脂組合物亦作為無顯影步驟之噴墨方式組合物有用。 液晶顯示面板等中所使用之彩色濾光片可使用本發明之黑色感光性樹脂組合物或其以外之著色組合物，反覆進行上述(1)～(4)之步驟，將2色以上之圖案加以組合而製作。 [實施例] 以下，列舉實施例等更詳細地說明本發明，但本發明並不限定於該等實施例。 [實施例1～5、比較例1～5] 以下述表1中所中所記載之調配組成(質量份)，製備本發明之黑色感光性樹脂組合物。黑色顏料(C)係製備為黑色顏料組合物C-1而使用。即，以經氧化處理之碳黑MA-100(三菱化學公司製造)20質量%、鹼性顯影性卡多(Cardo)樹脂WR-301(ADEKA公司製造)2質量%、分散劑BYK-164(BYK-Chemie公司製造)2.5質量%、溶劑丙二醇-1-單甲醚-2-乙酸酯(PGMEA)75.5質量%之調配比製備黑色顏料組合物C-1，並於以下之實施例及比較例中使用。 使用所獲得之黑色感光性樹脂組合物，藉由下述評價方法，對OD(Optical Density，光學密度)值、圖案直線性、錐角、最小密接線寬進行評價。將結果示於表1。 同樣地以表2中所中所記載之調配組成(質量份)，製備比較例之黑色感光性樹脂組合物，並對OD值、圖案直線性、錐角、最小密接線寬進行評價。將結果示於表2。 ＜OD值評價方法＞ 使用旋轉塗佈機，將黑色感光性樹脂組合物塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下加熱100秒鐘，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用MICROTEK公司製造之近接式曝光機，以曝光量40 mJ/cm² 進行曝光後，於230℃下進行焙燒處理30分鐘，而獲得硬化膜。使用Macbeth透過密度計對所獲得之硬化膜之OD值進行測定，將該OD值除以後烘烤後之膜厚，而算出平均膜厚之OD值(/μm)。一般而言，OD值越高，遮光性越優異。 ＜圖案直線性評價方法＞ 使用旋轉塗佈機將黑色感光性樹脂組合物塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下進行預烘烤100秒鐘，而形成膜厚1.0 μm之塗膜。繼而，使用MICROTEK公司製造之近接式曝光機，將曝光間隙設為100 μm，介隔形成有1～20 μm之線圖案之負型遮罩，向塗膜照射紫外線40 mJ。於利用23℃之0.04質量%KOH水溶液使曝光後之塗膜顯影40秒鐘後，於230℃下進行後烘烤30分鐘，藉此形成線圖案。利用光學顯微鏡對6 μm線之圖案進行觀察，並評價圖案直線性。圖案直線性係將於線之邊緣無晃動者評價為「良好」，將存在晃動者評價為「不良」。 ＜錐角評價方法＞ 使用旋轉塗佈機將黑色感光性樹脂組合物塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下加熱100秒鐘，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用MICROTEK公司製造之近接式曝光機，介隔形成有6 μm之圖案之負型遮罩，以曝光量40 mJ/cm² (Gap 100 μm)進行曝光。於利用23℃之0.04質量%KOH水溶液將曝光後之膜顯影40秒鐘後，於230℃下進行焙燒處理30分鐘，並利用掃描式電子顯微鏡對圖案與基板之間之接合角度(錐角)進行測定。該錐角係與圖1(a)及(b)中之角θ對應。將所測得之錐角示於表。若錐角為銳角，則意味著圖案中不存在底切，若錐角為鈍角，則意味著圖案中存在底切。若於圖案中存在底切，則對比度降低，故而變得不良。 ＜最小密接線寬評價方法＞ 使用旋轉塗佈機將黑色感光性樹脂組合物塗佈於玻璃基板(10 cm×10 cm)上，並於100℃下加熱100秒鐘，藉此於玻璃基板之表面形成1.0 μm之塗佈膜。其後，使用MICROTEK公司製造之近接式曝光機，介隔形成有1～20 μm之圖案之負型遮罩，以曝光量40 mJ/cm² (間隙(Gap)100 μm)進行曝光。於利用23℃之0.04質量%KOH水溶液將曝光後之膜顯影40秒鐘後，於230℃下進行焙燒處理30分鐘。對光學顯微鏡進行觀察，將數字最小之光罩圖案設為最小密接線寬。 [表1]

光聚合起始劑 A-1：化合物No.1 A-2-1：化合物No.10 A-2-2：化合物No.14 A-2-3：化合物No.16 A-2-4：化合物No.22 鹼性顯影性卡多(Cardo)樹脂 B-1：WR-301(ADEKA公司製造) B-2：V-259ME(新日鐵住金化學公司製造) 黑色顏料組合物 C-1：如上所述 乙烯性不飽和化合物 E-1：Kayarad DPHA((Dipentaerythritol Hexaacrylate，二季戊四醇六丙烯酸酯)(日本化藥製造)) 矽烷偶合劑 F-1：KBM-403(信越化學公司製造) 溶劑 D-1：丙二醇-1-單甲醚-2-乙酸酯(PGMEA) D-2：3-乙氧基丙酸乙酯(EEP) [化14]

[表2]

光聚合起始劑 A-1：化合物No.1 A-2-1：化合物No.10 A-2-2：化合物No.14 A-2-3：化合物No.16 A-2-4：化合物No.21 鹼性顯影性卡多(Cardo)樹脂 B-1：WR-301(ADEKA公司製造) B-2：V-259ME(新日鐵住金化學公司製造) 黑色顏料組合物 C-1：如上所述 乙烯性不飽和化合物 E-1：Kayarad DPHA(二季戊四醇六丙烯酸酯(日本化藥製造)) 矽烷偶合劑 F-1：KBM-403(信越化學公司製造) 溶劑 D-1：丙二醇-1-單甲醚-2-乙酸酯(PGMEA) D-2：3-乙氧基丙酸乙酯(EEP) 根據以上之結果得知，本發明之黑色感光性樹脂組合物與現有之黑色感光性樹脂組合物相比，於圖案直線性、錐角、最小密接線寬方面顯示出良好之結果。又，關於OD值，顯示出同等之結果。因此得知，本發明之黑色感光性樹脂組合物具有充分之遮光性，為高感度及高解像度，對黑矩陣之形成有用。 根據以上之結果得知，本發明之黑色感光性樹脂組合物與現有之黑色感光性樹脂組合物相比，於圖案直線性、錐角、最小密接線寬方面顯示出良好之結果。又，關於OD值，顯示出同等之結果。因此得知，本發明之黑色感光性樹脂組合物具有充分之遮光性，為高感度及高解像度，對黑矩陣之形成有用。 [產業上之可利用性] 根據本發明，可提供一種具有充分之遮光性，為高感度及高解像度，對於黑矩陣之形成有用之黑色感光性樹脂組合物。First, a photopolymerization initiator composition as the component (A) in the present invention will be described. The oxime ester compound of the component (A-1) used in the photopolymerization initiator composition (A) is characterized in that it is represented by the general formula (1) and has a nitrocarbazole skeleton. The oxime ester compound used as the component (A-1) has geometric isomers based on the double bond of the oxime, but does not distinguish them. The above-mentioned general formula (1) and the following exemplified compounds represent a mixture or any of the two. One is not limited to a structure showing an isomer. The component (A-1) of the present invention contains one or more of the oxime ester compounds represented by the general formula (1), and preferably contains only one or more of the oxime ester compounds. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ^{twenty one} , R ^{twenty two} And R ^{twenty three} Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, second butyl, third butyl, pentyl, Isopentyl, third pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, third octyl, nonyl, isononyl, decyl, isodecyl, undecyl , Dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, and the like. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ And R ⁵ Examples of the alkoxy group having 1 to 20 carbon atoms include those corresponding to the above-mentioned alkyl group. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ^{twenty one} , R ^{twenty two} And R ^{twenty three} Examples of the aryl group having 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, chlorophenyl, biphenyl, naphthyl, anthracenyl, phenanthryl and One or more of the alkyl-substituted phenyl, biphenyl, naphthyl, and anthracenyl groups. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ And R ⁵ Examples of the aryloxy group having 6 to 30 carbon atoms include those corresponding to the aryl group. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ^{twenty one} , R ^{twenty two} And R ^{twenty three} Examples of the aralkyl group having 7 to 30 carbon atoms include benzyl, chlorobenzyl, α-methylbenzyl, α, α-dimethylbenzyl, and phenylethyl. As R in the general formula (1) ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ^{twenty one} , R ^{twenty two} And R ^{twenty three} Examples of the heterocyclic group having 2 to 20 carbon atoms include pyridyl, pyrimidinyl, furyl, thienyl, tetrahydrofuryl, dioxolyl, benzoxazol-2-yl, and Hydropyranyl, pyrrolidinyl, imidazolyl, pyrazolidyl, thiazolidyl, isothiazolyl, oxazolidyl, isoxazolyl, piperidinyl, piperidinyl,? 5- to 7-membered heterocyclic groups such as phosphono. Among the oxime ester compounds of the component (A-1), in the above general formula (1), from the viewpoint of sensitivity and resolution, R is preferred ¹ Those having an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, more preferably R ¹ It is an aryl group having 6 to 30 carbon atoms. Among the oxime ester compounds of the component (A-1), in the general formula (1), R is preferably R from the viewpoint of sensitivity and resolution. ² Alkyl group having 1 to 20 carbon atoms, more preferably R ² Those having 1 to 4 carbon atoms, more preferably R ² Those who are methyl. Among the oxime ester compounds of the component (A-1), in the general formula (1), R is preferably R from the viewpoint of sensitivity and resolution. ³ Alkyl group having 1 to 20 carbon atoms, more preferably R ³ Those having 1 to 8 carbon atoms, more preferably R ³ Those who are ethyl. Also, among the oxime ester compounds of the component (A-1), (R in the general formula (1)) ⁴ ) _a In terms of sensitivity and resolution, a is preferably 0 or 1, and more preferably 0. When a is 1 to 3, R ⁴ An alkyl group having 1 to 20 carbon atoms is preferred, and an alkyl group having 1 to 4 carbon atoms is more preferred. Also, among the oxime ester compounds of the component (A-1), (R in the general formula (1)) ⁵ ) _b In terms of sensitivity and resolution, b is preferably 0 or 1, and more preferably 0. When b is 1 to 3, R ⁵ An alkyl group having 1 to 20 carbon atoms is preferred, and an alkyl group having 1 to 4 carbon atoms is more preferred. Preferred specific examples of the oxime ester compound represented by the general formula (1) as the component (A-1) include the following compounds No. 1 to No. 9. [Chemical 4]

Next, (A-2) component is demonstrated. The ketoxime ester compound used as the component (A-2) in the photopolymerization initiator composition (A) is characterized in that it is represented by the general formula (2) and has a ketoxime ester structure. In the general formula (2), the ketoxime ester structure means a part represented by the following general formula (4). [Chemical 5]

The ketoxime ester compound used as the component (A-2) has geometric isomers based on the double bond of the oxime, but does not distinguish them. The general formula (2) and the following exemplary compounds represent a mixture of the two or Either is not limited to a structure showing an isomer. The component (A-2) of the present invention contains one or more of the ketoxime ester compounds represented by the general formula (2), and preferably contains only one or more of the oxime ester compounds. As R in the general formula (2) ⁶ , R ⁷ , R ⁹ , R ¹⁰ , R ³⁰ , R ³¹ , R ³² And R ³³ Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, second butyl, third butyl, pentyl, Isopentyl, third pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, third octyl, nonyl, isononyl, decyl, isodecyl, undecyl , Dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, and the like. As R in the general formula (2) ⁶ , R ⁷ , R ⁹ And R ¹⁰ Examples of the alkoxy group having 1 to 20 carbon atoms include those corresponding to the above-mentioned alkyl group. As R in the general formula (2) ⁶ , R ⁷ , R ⁹ , R ¹⁰ , R ³⁰ , R ³¹ , R ³² And R ³³ Examples of the aryl group having 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, chlorophenyl, biphenyl, naphthyl, anthracenyl, phenanthryl and One or more of the alkyl-substituted phenyl, biphenyl, naphthyl, and anthracenyl groups. As R in the general formula (2) ⁶ , R ⁷ , R ⁹ And R ¹⁰ Examples of the aryloxy group having 6 to 30 carbon atoms include those corresponding to the aryl group. As R in the general formula (2) ⁶ , R ⁷ , R ⁹ , R ¹⁰ , R ³⁰ , R ³¹ , R ³² And R ³³ Examples of the aralkyl group having 7 to 30 carbon atoms include benzyl, chlorobenzyl, α-methylbenzyl, α, α-dimethylbenzyl, and phenylethyl. As R in the general formula (2) ⁶ , R ⁷ , R ³¹ , R ³² And R ³³ Examples of the heterocyclic group having 2 to 20 carbon atoms include pyridyl, pyrimidinyl, furyl, thienyl, tetrahydrofuryl, dioxolyl, benzoxazol-2-yl, and Hydropyranyl, pyrrolidinyl, imidazolyl, pyrazolidyl, thiazolidyl, isothiazolyl, oxazolidyl, isoxazolyl, piperidinyl, piperidinyl,? 5- to 7-membered heterocyclic groups such as phosphono. As R in the general formula (2) ⁹ With R ¹⁰ Examples of rings that can be formed together include fluorene, 9,9-dimethylfluorene, 9,9-diethylfluorene, 9,9-dipropylfluorene, 9,9-dibutylfluorene, and the like. . Among the ketoxime ester compounds of the component (A-2), in the general formula (2) above, from the viewpoint of sensitivity and resolution, R is preferred. ⁶ Alkyl group having 1 to 20 carbon atoms, more preferably R ⁶ It is an alkyl group having 1 to 8 carbon atoms. Among the ketoxime ester compounds of the component (A-2), in the general formula (2), R is preferably R from the viewpoint of sensitivity and resolution. ⁷ For alkyl groups having 1 to 20 carbon atoms or aryl groups having 6 to 30 carbon atoms, R is more preferred ⁷ It is an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 12 carbon atoms. Also, among the ketoxime ester compounds of the component (A-2), (R in the general formula (2)) ⁹ ) _t In terms of sensitivity and resolution, t is preferably 0 or 1. When t is 1 to 3, R ⁹ An alkyl group having 1 to 20 carbon atoms is preferred, and an alkyl group having 1 to 6 carbon atoms is more preferred. Also, among the ketoxime ester compounds of the component (A-2), (R in the general formula (2)) ¹⁰ ) _u In terms of sensitivity and resolution, u is preferably 0 or 1. When u is 1 to 3, R ¹⁰ An alkyl group having 1 to 20 carbon atoms is preferred, and an alkyl group having 1 to 4 carbon atoms is more preferred. In the ketoxime ester compound of the component (A-2), in the general formula (2), from the viewpoint of sensitivity and resolution, X ¹ A sulfur atom is preferable, and X is also preferable ¹ Is a direct bond, and then R ⁹ With R ¹⁰ Those who form a ring together. In the ketoxime ester compound of the component (A-2), in the general formula (2), from the viewpoint of sensitivity and resolution, R ⁸ A hydrogen atom or a group represented by the general formula (3) is preferable, and a group represented by the general formula (3) is more preferable. Moreover, in the general formula (3), from the viewpoint of sensitivity and resolution, Z ¹ Preferably -O-, Z ² An alkyl group having 1 to 20 carbon atoms, particularly 1 to 10 carbon atoms substituted with one hydroxyl group is preferred. Preferred specific examples of the oxime ester compound represented by the general formula (2) as the component (A-2) include the following compounds No. 10 to No. 25. [Chemical 6]

[Chemical 7]

In the present invention, in the photopolymerization initiator composition of the component (A), the total content of the component (A-1) and the component (A-2) is 100 parts by mass, and the content of the component (A-1) The content is 1 to 99 parts by mass, and the content of the component (A-2) is 1 to 99 parts by mass. From the viewpoint of sensitivity and resolution, the content of the (A-1) component is preferably 20 to 80 parts by mass, more preferably 40 to 60 parts by mass, and the content of the (A-2) component is preferably 20 to 80 parts by mass. Parts, more preferably 40 to 60 parts by mass. In the black photosensitive resin composition of the present invention, when the photopolymerization initiator composition of the component (A) is 100 parts by mass of the solid content of the black photosensitive resin composition, it is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 10 parts by mass. If it is less than 0.1 parts by mass, curing may be insufficient due to exposure, and if it is more than 30 parts by mass, a photopolymerization initiator may be precipitated in the black photosensitive resin composition. The solid component of the black photosensitive resin composition of the present invention refers to a component other than a solvent. When preparing the black photosensitive resin composition of the present invention, regarding the component (A-1) and the component (A-2), a person who mixes the two in advance to prepare a photopolymerization initiator composition (A) may be prepared. At the time of preparation, they can also be separately formulated into the resin composition. When the photopolymerization initiator composition (A) is prepared in advance, if necessary, any of the components of the black photosensitive resin composition of the present invention described below, such as other photopolymerization initiators, may be used in advance. The component (A-1) and the component (A-2) are both contained in the photopolymerization initiator composition (A). Next, the (B) component of the black photosensitive resin composition of this invention is demonstrated. Examples of the basic developable Cardo resin (B) as the (B) component of the present invention include those obtained by diglycidizing a bisphenol compound and diglycidizing the bisphenol compound. Those formed by reaction with unsaturated monobasic acid, those formed by reaction with unsaturated monobasic acid after the bisphenol compound is modified with alkylene oxide, and the like. Among these, from the viewpoint of dispersibility, the following ethylenically unsaturated compounds are preferred, which have a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the following general formula (5): A reaction product obtained by an epoxy addition compound and an esterification reaction with a polybasic acid anhydride. [Chemical 8]

In the general formula (5), M represents a direct bond, a methylene group, an alkylene group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group, O, S, SO ₂ , SS, SO, CO, OCO, or a substituent selected from the group represented by the following formula (A), (B), or (C), R ⁴¹ , R ⁴² , R ⁴³ , R ⁴⁴ , R ⁴⁵ , R ⁴⁶ , R ⁴⁷ And R ⁴⁸ Each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom, and m is a number of 0 to 10. [Chemical 9]

In formulae (A), (B), (C), R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵³ , R ⁵⁴ , R ⁵⁵ , R ⁵⁶ , R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶¹ , R ⁶² , R ⁶³ , R ⁶⁴ , R ⁶⁵ , R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ And R ⁷² Each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, A heterocyclic group having 2 to 20 carbon atoms or a halogen atom, and the alkylene part of the above alkyl and arylalkyl groups may be interrupted by an unsaturated bond, -O- or -S-, R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶⁵ , R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ And R ⁷² There is an adjacent R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶⁵ , R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ And R ⁷² When they form a ring with each other. In the general formula (5), as R ⁴¹ ~ R ⁴⁸ Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, second butyl, third butyl, isobutyl, pentyl, and iso. Amyl, third pentyl, hexyl, heptyl, isoheptyl, third heptyl, n-octyl, isooctyl, third octyl, 2-ethylhexyl, n-nonyl, n-decyl, ten Monoalkyl, dodecyl, tridecyl, isotridecyl, myristyl, palmityl, stearyl, trifluoromethyl, difluoromethyl, monofluoromethyl, pentafluoroethyl , Tetrafluoroethyl, trifluoroethyl, difluoroethyl, heptafluoropropyl, hexafluoropropyl, pentafluoropropyl, tetrafluoropropyl, trifluoropropyl, perfluorobutyl, cyclopropyl, Cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, etc., as R ⁴¹ ~ R ⁴⁸ Examples of the alkoxy group having 1 to 10 carbon atoms include methoxy, ethoxy, isopropoxy, propoxy, butoxy, pentoxy, isopentyloxy, and hexyloxy. , Heptyloxy, octyloxy, 2-ethylhexyloxy, etc., as R ⁴¹ ~ R ⁴⁸ Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. In the general formula (5), M is selected from among the substituents in the group represented by the formulae (A), (B), and (C) as R ⁴⁹ ~ R ⁷² Examples of the alkyl group having 1 to 20 carbon atoms, the alkoxy group having 1 to 10 carbon atoms, and a halogen atom include the aforementioned R ⁴¹ ~ R ⁴⁸ Illustrated in, as R ⁴⁹ ~ R ⁷² Examples of the aryl group having 6 to 20 carbon atoms include phenyl, naphthyl, anthracen-1-yl, phenanthrene-1-yl, o-tolyl, m-tolyl, p-tolyl, 4-vinyl Phenyl, 3-isopropylphenyl, 4-isopropylphenyl, 4-butylphenyl, 4-isobutylphenyl, 4-thirdbutylphenyl, 4-hexylphenyl, 4 -Cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-di Methylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, 2,4-di-tert-butylphenyl, 2,5 -Tertiary butylphenyl, 2,6-tertiary butylphenyl, 2,4-tertiary pentylphenyl, 2,5-tertiary pentylphenyl, cyclohexylphenyl, Biphenyl, 2,4,5-trimethylphenyl, 4-chlorophenyl, 3,4-dichlorophenyl, 4-trichlorophenyl, 4-trifluorophenyl, perfluorophenyl, etc. As R ⁴⁹ ~ R ⁷² Examples of the arylalkyl group having 7 to 20 carbon atoms include benzyl, phenethyl, 2-phenylpropyl, diphenylmethyl, triphenylmethyl, styryl, and phenene. Propyl, 4-chlorophenylmethyl, etc., as R ⁴⁹ ~ R ⁷² Examples of the heterocyclic group include: pyrrolyl, pyridyl, pyrimidinyl, da 𠯤 yl, piperidinyl, piperidinyl, pyranyl, pyrazolyl, tri 𠯤 , Pyrrolidinyl, quinolinyl, isoquinolinyl, imidazolyl, benzimidazolyl, triazolyl, furyl, furanyl, benzofuranyl, thienyl, Thiophenyl, benzothienyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl, 𠮻 Pyridinyl, morpholinyl, thiomorpholinyl, 2-pyrrolidinone-1-yl, 2-piperidone-1-yl, 2,4-dioximidazol-3-yl, 2 , 4-dioxazosin-3-yl, etc., as existing by adjacent R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶⁵ , R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ And R ⁷² Examples of the rings formed by each other include a piperidine ring, a piperidine ring, a morpholine ring, a pyrimidine ring, a pyridine ring, a pyrimidine ring, a quinoline ring, an imidazole ring, an imidazole ring, and an imidazole. Heterocyclic rings such as pyrimidine ring and pyrazidine ring, or cyclic alkanes such as cyclopentane ring and cyclohexane ring, aromatic rings such as benzene ring, naphthalene ring and phenanthrene ring, etc. These rings exist to condense with other rings or undergo Replacement situation. The so-called unsaturated monobasic acid means an acid having an unsaturated bond in the structure and having one hydrogen atom that can be ionized to become a hydrogen ion per molecule. Examples of the unsaturated monobasic acid include acrylic acid, methacrylic acid, butenoic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate-maleate, and the like. Examples include: hydroxyethyl acrylate-maleate, hydroxypropyl methacrylate-maleate, hydroxypropyl acrylate-maleate, dicyclopentadiene-maleate Esters and so on. The so-called polybasic acid anhydride refers to an acid anhydride of a polybasic acid having a plurality of hydrogen atoms that can be ionized to become hydrogen ions per molecule. Examples of the polybasic acid anhydride include biphenyltetracarboxylic dianhydride, tetrahydrophthalic anhydride, succinic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, 2,2 ', 3,3'-benzophenonetetracarboxylic dianhydride, ethylene glycol bistrimellitic anhydride, glycerol tritrimellitic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, geo-anhydride, methyl-resistant Geoic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1, 2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecenylsuccinic anhydride, methylbicycloheptenedicarboxylic anhydride, etc. The reaction of the epoxy compound, the unsaturated monobasic acid, and the polybasic acid anhydride is preferably as follows. That is, in an epoxy adduct having a structure in which 0.1 to 1.0 of the carboxyl group of the above-mentioned unsaturated monoacid is added to one epoxy group of the epoxy compound, it is preferably set to the ring. One hydroxyl group of the oxygen adduct, and the polybasic acid anhydride structure of the polybasic acid anhydride is a ratio of 0.1 to 1.0. The reaction examples of the epoxy compound, the unsaturated monobasic acid, and the polybasic acid anhydride are shown below, but the present invention is not limited to the following reaction example 1. [Chemical 10]

It is preferable to use the ring represented by the said General formula (5) as a cardo resin of the alkaline developability of the said (B) component from a viewpoint of improving the availability further and the effect of this invention. Of oxygen compounds, R ⁴¹ ~ R ⁴⁸ Is a hydrogen atom; M is a base represented by (A) and R ⁴⁹ ~ R ⁵⁶ Is a hydrogen atom; M is a base represented by (B) and R ⁵⁷ ~ R ⁶⁴ Those who are hydrogen atoms. In addition, as the unsaturated acid, those having 5 or less carbon atoms are preferably used, and those using acrylic acid, methacrylic acid, and the like are more preferable. Moreover, as the polybasic acid anhydride, those having a benzene ring or a saturated aliphatic ring are preferred, and biphenyltetracarboxylic dianhydride, phthalic anhydride, tetrahydrophthalic anhydride, and biphenyltetracarboxylic acid dihydrate are more preferably used. Anhydride and others. In the black photosensitive resin composition of the present invention, the basic developable Cardo resin of the component (B) functions as a polymerizable compound (G). In the black photosensitive resin composition of the present invention, as the polymerizable compound (G), in addition to the alkaline developable Cardo resin of the component (B), the following ethylenically unsaturated compounds (wherein (Except for Cardo resin (B)) (E). In the black photosensitive resin composition of the present invention, the content of the polymerizable compound (G) is preferably 5 to 70 mass when the solid content of the black photosensitive resin composition is 100 parts by mass. Parts, more preferably 20 to 60 parts by mass. If it is less than 5 parts by mass, the photocurability is poor, and if it is more than 70 parts by mass, there is a case where alkaline development cannot be performed. Regarding the content of the polymerizable compound (G), when the component (E) is not included, only the solid content of the component (B) is contained, and when the component (E) is contained, the component (B) and (E) are contained. The total solid content. In the black photosensitive resin composition of the present invention, as the polymerizable compound (G), an ethylenically unsaturated compound containing the (E) component (wherein, the basic developing cardo resin of the (B) component) In the case of excluding), the component (E) is preferably 3 to 40 parts by mass with respect to 100 parts by mass of the alkaline developable Cardo resin of the component (B). Next, the black pigment of the (C) component of this invention is demonstrated. As the black pigment (C), for example, carbon black obtained by a furnace method, a channel method, or a thermal method, or carbon black such as acetylene black, Ketjen black, or lamp black can be used; A product obtained by coating the carbon black, a product obtained by dispersing the carbon black in a solvent with a resin in advance and adsorbing 20 to 200 mg / g of the resin, and an acid or alkaline surface treatment of the carbon black For those who have undergone oxidation treatment of the above carbon black, the average particle diameter is 8 nm or more, and the oil absorption of DBP (Dibutyl phthalate) is 90 ml / 100 g or less. CO, CO in volatile matter ₂ Calculated total oxygen content relative to carbon black surface area 100 m ² Those above 9 mg; graphite, graphitized carbon black, activated carbon, carbon fiber, nano carbon tube, spiral carbon fiber, carbon nano horn, carbon aerogel, fullerene, nigrosine, perylene black, linacline Black, pigment black 7; titanium black, by attaching vanadium compounds to, for example, titanium dioxide or titanium hydroxide, if necessary, in the presence of nitrogen-containing reducing agents such as ammonia gas, amine gas, etc. by electric furnace method, thermoelectric plasma method, etc. Those obtained by a high-temperature firing by a gas phase reaction method, or those commercially available as titanium black, may be used alone or in combination of two or more. Among these, carbon black or titanium black is preferred. The content of the black pigment (C) is preferably from 0.1 to 90 parts by mass, and more preferably from 0.1 to 70 parts by mass when the total solid content of the black photosensitive resin composition is 100 parts by mass. If it exceeds 90 parts by mass, aggregation is likely to occur and storage stability is deteriorated. The black pigment may be used as a black pigment composition together with other components such as an alkaline developable Cardo resin (B), a solvent (D), or a dispersant. Next, the solvent of (D) component of this invention is demonstrated. As the solvent (D), as long as it can dissolve or disperse the above-mentioned components and the following components (photopolymerization initiator composition (A), basic developable Cardo resin (B), and black pigment (C) ), Ethylenically unsaturated compounds (E), optional components other than the silane coupling agent (F), etc.), and examples thereof include methyl ethyl ketone, methyl amyl ketone, diethyl ketone, and acetone. , Ketones such as methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone; ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2- Ether solvents such as diethoxyethane, dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, amber Ester solvents such as dimethyl acid and TEXANOL; Cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, isopropanol or n-propanol, isobutanol or n-butanol, Alcohol solvents such as amyl alcohol; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol-1-monomethylether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate Esters, acetic acid 3 -Ether solvents such as methoxybutyl ester and ethyl 3-ethoxypropionate (EEP); BTX (Benzene-Toluene-Xylene) solvents such as benzene, toluene, and xylene; Hexane, heptane, octane, cyclohexane and other aliphatic hydrocarbon solvents; terpinene hydrocarbon oils such as turpentine, D-limonene, pinene; mineral spirits, Swazol # 310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso # 100 (Exxon Chemical Co., Ltd.) and other alkane-based solvents; carbon tetrachloride, chloroform, trichloroethylene, dichloromethane, 1,2-dichloroethane and other halogenated aliphatic hydrocarbon-based solvents; chlorobenzene and other halogenated solvents Aromatic hydrocarbon solvents; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N -Methylpyrrolidone, dimethylsulfinium, water, etc. These solvents can be used in the form of one or more mixed solvents. Among them, ketones, ether ester solvents, etc., especially propylene glycol-1-monomethyl ether-2-acetate (PGMEA), ethyl 3-ethoxypropionate (EEP), cyclohexanone, etc. Since the compatibility between the inhibitor and the photopolymerization initiator is good, it is preferable. In the black photosensitive resin composition of the present invention, the use amount of the solvent (D) is preferably such that the concentration of the solid component (component other than the solvent) becomes 5 to 30% by mass, and the concentration of the solid component is less than In the case of 5 mass%, it is not easy to increase the film thickness, and the required wavelength light cannot be sufficiently absorbed, so it is not good. In the case of more than 30 mass%, due to the precipitation of the composition, the preservation of the composition is reduced. Or the viscosity is increased and the handling is reduced, so it is not good. Next, the ethylenically unsaturated compound (except the alkaline developable Cardo resin (B)) of the component (E) of the present invention will be described. The ethylenically unsaturated compound (E) is used as the polymerizable compound (G) together with the alkaline developable Cardo resin (B). As the ethylenically unsaturated compound (except for the alkali developable Cardo resin (B)) (E), as long as it has a carbon-carbon double bond in the compound, it is not particularly limited, and the previous black color can be used. Examples of users of the photosensitive resin composition include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; (methyl) Acrylic acid, alpha-chloroacrylic acid, itaconic acid, maleic acid, succinic acid, citraconic acid, fumaric acid, dicycloheptenedioic acid, butenoic acid, methacrylic acid, vinylacetic acid, allyl Acetic acid, cinnamic acid, sorbic acid, methyl fumaric acid, succinic acid mono [2- (meth) acryloxyethyl] ester, phthalic acid mono [2- (meth) acrylic acid] Ethyl] ester, hydroxyethyl (meth) acrylate-maleate, hydroxypropyl (meth) acrylate-maleate, dicyclopentadiene-maleate or Unsaturated acids such as polyfunctional (meth) acrylates having one carboxyl group and two or more (meth) acrylfluorenyl groups; ω-carboxy polycaprolactone mono (meth) propane Ester is the mono (meth) acrylate of a polymer having a carboxyl group and a hydroxyl group at both ends; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate Esters, the following compounds No. A1 to No. A4, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, (formaldehyde) (Cyclo) hexyl acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate , Methoxyethyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, aminopropyl (meth) acrylate, (methyl Dimethylaminopropyl acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, Ethylhexyl (meth) acrylate, phenoxyethyl (meth) acrylate, tetrahydrofuran (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, (meth) Benzyl acrylate Ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di ( (Meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolethane tri (meth) acrylate, Trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate Unsaturated monobasic acids and polyvalents such as tricyclodecane dimethanol di (meth) acrylate, tris [(meth) propenylethyl] isocyanurate, polyester (meth) acrylate oligomers, etc. Esters of alcohols or polyphenols; metal salts of unsaturated polyacids such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyltetrahydrophthalic acid Formic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuranyl) -3-methyl-3-cyclohexene-1, 2-dicarboxylic anhydride, tris Tetrahydrophthalic anhydride-maleic anhydride adduct, dodecenylsuccinic anhydride, methylbicycloheptenedicarboxylic anhydride and other unsaturated polybasic acid anhydrides; (meth) acrylamide, Methylenebis (meth) acrylamide, diethylenetriamine tri (meth) acrylamide, xylylenebis (meth) acrylamide, α-chloroacrylamide, N-2-hydroxy Unsaturated monoacids such as ethyl (meth) acrylamide and polyamines; unsaturated aldehydes such as acrolein; (meth) acrylonitrile, α-chloroacrylonitrile, dicyanethylene, allyl cyanide And other unsaturated nitriles; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene , Unsaturated aromatic compounds such as vinyl benzoic acid, vinyl phenol, vinyl sulfonic acid, 4-vinyl benzene sulfonic acid, vinyl benzyl methyl ether, vinyl benzyl glycidyl ether; methyl vinyl ketone, etc. Unsaturated ketones; unsaturated amine compounds such as vinylamine, allylamine, N-vinylpyrrolidone, vinylpiperidine; vinyl alcohols such as allyl alcohol, crotyl alcohol; vinyl methyl ether, Vinyl ethers such as alkenyl ether, n-butyl vinyl ether, isobutyl vinyl ether, allyl glycidyl ether; cis-butylene diimide, N-phenyl-cis butylene diimide, N-cyclohexyl Unsaturated fluorene imines such as maleimide diimide; indines such as indene, 1-methylindene; aliphatic conjugated diene such as 1,3-butadiene, isoprene, chloroprene Polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate, and polysiloxane are equivalent to macromonomers with a mono (meth) acryl group at the end of the molecular chain of the polymer ; Vinyl chloride, vinylidene chloride, divinyl succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl sulfide, vinyl imidazole, vinyl fluorene Oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, a vinyl carbamate compound obtained by reacting a hydroxyl-containing vinyl monomer and a polyisocyanate compound; a hydroxyl-containing vinyl group A vinyl epoxy compound and the like obtained by reacting a monomer and a polyepoxy compound. [Chemical 11]

Moreover, as said ethylenically unsaturated compound (E), you may use the copolymer of an acrylate, or the thing which made phenol and / or cresol novolak epoxy resin and unsaturated monoacid react, and make it polyfunctional. Epoxy-based polyphenylmethane epoxy resin reacts with unsaturated monobasic acid. Among the aforementioned ethylenically unsaturated compounds (E), when a compound having an acid value is used, it is preferable in terms of imparting alkaline developability. When using the said compound which has an acid value, it is preferable that the usage-amount is 50-99 mass% of the said ethylenically unsaturated compound as a whole. The compound having an acid value may be used after further adjusting the acid value by reacting a monofunctional or polyfunctional epoxy compound. By adjusting the acid value of the compound having an acid value, the alkali developability can be improved. The compound having an acid value (that is, an ethylenically unsaturated compound imparting alkaline developability) is preferably in the range of 5 to 120 mgKOH / g of the solid content, and the amount of the monofunctional or polyfunctional epoxy compound is used. It is preferable to select a method to satisfy the above-mentioned acid value. Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, and isopropyl ether. Butyl glycidyl ether, third butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, ten Monoalkyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, cetyl glycidyl ether, 2-ethyl Hexyl glycidyl ether, allyl glycidyl ether, propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxy glycidyl ether, p-butylphenol glycidyl ether Ether, tolyl glycidyl ether, 2-methyltolyl glycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether Glyceryl ether, methacrylic acid 2 , 3-epoxypropyl ester, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinyl cyclohexane monoxide, 1,2-epoxy-4-vinyl cyclohexane, epoxy Ethylbenzene, limonene oxide, methyl epoxyethylbenzene, epoxycyclohexane, propylene oxide, the aforementioned compounds No. A2, No. A3, and the like. If one or more compounds selected from the group consisting of bisphenol-type epoxy compounds and glycidyl ethers are used as the above-mentioned polyfunctional epoxy compound, a black photosensitive resin composition with better characteristics can be obtained, which is preferable. . As the bisphenol-type epoxy compound, in addition to the epoxy compound represented by the general formula (5), for example, a bisphenol-type epoxy compound such as a hydrogenated bisphenol-type epoxy compound can be used. As the glycidyl ethers, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1 , 8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, Triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri (glycidyl Glyceryloxymethyl) propane, 1,1,1-tris (glycidyloxymethyl) ethane, 1,1,1-tris (glycidyloxymethyl) methane, 1,1,1,1 -Tetrakis (glycidyloxymethyl) methane and the like. In addition, phenolic novolac epoxy compounds, biphenol novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, and dicyclopentadiene novolacs can also be used. Type epoxy compounds and other novolac type epoxy compounds; 3,4-epoxy-6-methylcyclohexanecarboxylic acid 3,4-epoxy-6-methylcyclohexyl methyl ester, 3,4-epoxy Cyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester, 1-epoxyethyl-3,4-epoxy cyclohexane and other alicyclic epoxy compounds; diglycidyl phthalate, tetra Glycidyl esters such as diglycidyl hydrophthalate and glycidyl dimer; tetraglycidyl diamino diphenylmethane, triglycidyl p-aminophenol, N, N-diglycidyl Glycidylamines such as aniline; Heterocyclic epoxy compounds such as 1,3-diglycidyl-5,5-dimethylhydantoin, triglycidyl isocyanurate; dicyclopentyl dioxide Dioxide compounds such as diene; naphthalene type epoxy compounds; triphenylmethane type epoxy compounds; dicyclopentadiene type epoxy compounds and the like. The black photosensitive resin composition of the present invention may contain a compound that does not have an ethylenically unsaturated bond and imparts alkali developability. As such a compound, as long as it is a compound that is soluble in an alkaline aqueous solution because it has an acid value, It is not particularly limited, and a representative example thereof is an alkali-soluble novolak resin (hereinafter, simply referred to as "novolak resin"). Novolac resin can be obtained by condensation polymerization of phenols and aldehydes in the presence of an acid catalyst. Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, and p-butylphenol. Phenol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,3 , 5-trimethylphenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2-methylresorcinol, catechol, α-naphthol, bisphenol A , Dihydroxybenzoate, gallate, etc. Among these phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5-dimethylphenol, 3, 5-dimethylphenol, 2,3,5-trimethylphenol, resorcinol, 2-methylresorcinol and bisphenol A. These phenols can be used individually or in mixture of 2 or more types. Examples of the aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropanal, β-phenylpropanal, o-hydroxybenzaldehyde, and m-hydroxybenzaldehyde , P-hydroxybenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde , P-methylbenzaldehyde, p-ethylbenzaldehyde, p-n-butylbenzaldehyde, etc. Among these compounds, formaldehyde, acetaldehyde and benzaldehyde are preferred. These aldehydes can be used alone or in combination of two or more. The aldehydes are used at a ratio of preferably 0.7 to 3 moles, more preferably 0.7 to 2 moles, with respect to 1 mole of phenols. Examples of the acid catalyst include inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, and organic acids such as formic acid, oxalic acid, and acetic acid. The amount of these acid catalysts used is 1 mole per phenol, preferably 1 × 10 ^-4 ～ 5 × 10 ^-1 Mor. In the condensation reaction, water is generally used as the reaction medium. However, when the phenols used in the condensation reaction are not dissolved in the aqueous solution of aldehydes and become heterogeneous from the beginning of the reaction, a hydrophilic solvent may also be used as the reaction medium. Reaction medium. Examples of such hydrophilic solvents include alcohols such as methanol, ethanol, propanol, and butanol, and cyclic ethers such as tetrahydrofuran and dioxane. About the usage-amount of these reaction media, it is 20-1000 mass parts normally with respect to 100 mass parts of reaction raw materials. The reaction temperature of the condensation reaction can be appropriately adjusted according to the reactivity of the reaction raw materials, and is usually 10 to 200 ° C, preferably 70 to 150 ° C. After the condensation reaction is completed, in order to remove unreacted raw materials, acid catalysts, and reaction media present in the system, the internal temperature is usually raised to 130-230 ° C, the volatiles are distilled off under reduced pressure, and the molten novolac is then removed. The resin is cast onto a steel belt or the like and recovered. After the condensation reaction is completed, the reaction mixture is dissolved in the above-mentioned hydrophilic solvent and added to a precipitant such as water, n-hexane, and n-heptane to precipitate the novolak resin, isolate the precipitate, and heat By drying, it is recovered. Examples other than the above-mentioned novolac resin include polyhydroxystyrene or a derivative thereof, a styrene-maleic anhydride copolymer, and a polyhydroxybenzoate. The black photosensitive resin composition of the present invention preferably further uses a silane coupling agent (F). As the silane coupling agent (F), for example, as the silane coupling agent having an alkenyl group, vinyl trimethoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, vinyltri (2) -Methoxyethoxy) silane, vinylmethyldimethoxysilane, octenyltrimethoxysilane, allyltrimethoxysilane, p-styryltrimethoxysilane, etc. Examples of the silane-based coupling agent include 3-propenyloxypropyltrimethoxysilane, 3-propenyloxypropyltriethoxysilane, and the like. Examples of the silane-based coupling agent having a methacrylfluorene group include : 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxy Silane, 3-methacryloxypropyltriethoxysilane, methacryloxyoctyltrimethoxysilane, etc. As the silane coupling agent having an epoxy group, 2- (3, (4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidyloxy Propyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, glycidyloxyoctyltrimethoxysilane, etc. Examples of the silane coupling agent having an amino group include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, and N-2- (aminoethyl) -3- Aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilane-N- (1,3-dimethyl -Butylene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N, N'-bis [3- (trimethoxysilyl) propyl] ethylenediamine, N- (Vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride and the like. Examples of the silane coupling agent having an isocyanurate group include isocyanurate tris ( Trimethoxysilylpropyl) esters, as the silane coupling agent having a mercapto group, include 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane. Examples of the silane coupling agent having a ureido group include ethoxysilane and the like: 3-ureidopropyl group Examples of the silane coupling agent having a thioether group include methoxysilane, 3-ureidopropyltriethoxysilane, and the like. Examples of the silane coupling agent include 3-octylsulfanyl-1-propyltriethoxysilane, and examples of the silane coupling agent having an isocyanate group include 3-isocyanatopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane and the like. As the silane coupling agent, a commercially available product can be used. As an example, as a vinyltrimethoxysilane, KBM-1003 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and A- manufactured by Momentive Performance Materials Japan LLC can be used. 171, Z-6300 manufactured by Dow Corning Toray Co., Ltd., GENIOSIL XL10 manufactured by Wacker Asahikasei Silicone Co., Ltd., and Sila-Ace S210 manufactured by Japan-US Commercial Corporation, etc., as the vinyl triethoxy silane, for example, : KBE-1003 manufactured by Shin-Etsu Chemical Industry Co., Ltd., A-151 manufactured by Momentive Performance Materials Japan LLC, Z-6519 manufactured by Dow Corning Toray Co., Ltd., GENIOSIL GF56 manufactured by Wacker Asahikasei Silicone Co., Ltd., Japan-US Business Corporation Sila-Ace S220 manufactured by Co., Ltd. and the like, as vinyl triethoxysilane, and GENIOSIL GF62 manufactured by Wacker Asahikasei Silicone Co., Ltd. as vinyl tri (2-methoxyethoxy) silane , A-172 manufactured by Momentive Performance Materials Japan LLC can be cited as Examples of alkenylmethyldimethoxysilane include A-2171 manufactured by Momentive Performance Materials Japan LLC, and GENIOSIL XL12 manufactured by Wacker Asahikasei Silicone Co., Ltd. and the like. As the octenyltrimethoxysilane, Shin-Etsu Chemical Industries is mentioned. KBM-1083 manufactured by Co., Ltd., as allyltrimethoxysilane, Z-6825 manufactured by Dow Corning Toray Co., Ltd., and p-styryltrimethoxysilane, as listed: Shin-Etsu Chemical Industry Co., Ltd. KBM-1403 manufactured by the company includes KBM-5103 as 3-propenyloxypropyltrimethoxysilane, and Shin-Etsu as 3-methacryloxypropylmethyldimethoxysilane. KBM-502 manufactured by Chemical Industry Co., Ltd., Z-6033 manufactured by Dow Corning Toray Co., Ltd., etc., as 3-methacryloxypropyltrimethoxysilane, can be listed: manufactured by Shin-Etsu Chemical Industry Co., Ltd. KBM-503, A-174 manufactured by Momentive Performance Materials Japan LLC, Z-6030 manufactured by Dow Corning Toray Co., Ltd., Wacker Asahikasei Silicon GENIOSIL GF31 manufactured by e Co., Ltd., and Sila-Ace S710 manufactured by Japan-US Commercial Corporation, etc. As the 3-methacryloxypropylmethyldiethoxysilane, Shin-Etsu Chemical Industry Co., Ltd. KBE-502 manufactured by the company, as 3-methacryloxypropyltriethoxysilane, include: KBE-503 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and Y-9936 manufactured by Momentive Performance Materials Japan LLC as Examples of methacryloxyoctyltrimethoxysilane include KBM-5803 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and as 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, examples include: KBM-303 manufactured by Shin-Etsu Chemical Industry Co., Ltd., A-186 manufactured by Momentive Performance Materials Japan LLC, Z-6043 manufactured by Dow Corning Toray Co., Ltd., and Sila-Ace S530 manufactured by Japan-US Commercial Corporation, etc., as Examples of 3-glycidoxypropylmethyldimethoxysilane include: KBM-402 manufactured by Shin-Etsu Chemical Industry Co., Ltd., Z-6044 manufactured by Dow Corning Toray Co., Ltd., Sila-Ace S520 manufactured by Japan-US Commercial Corporation, etc., as 3-glycidoxypropyltrimethoxysilane, can be listed: KBM-403 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and manufactured by Momentive Performance Materials Japan LLC A-187, Z-6040 manufactured by Dow Corning Toray Co., Ltd., GENIOSIL GF80 manufactured by Wacker Asahikasei Silicone Co., Ltd., Sila-Ace S510 manufactured by Japan-US Commercial Corporation, etc., as 3-glycidoxypropyl Examples of methyl diethoxysilanes include KBE-402 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and 3-glycidoxypropyltriethoxysilanes are listed: KBE- manufactured by Shin-Etsu Chemical Industry Co., Ltd. 403, A-1871 manufactured by Momentive Performance Materials Japan LLC, GENIOSIL GF82 manufactured by Wacker Asahikasei Silicone Co., Ltd., etc., as glycidyloxyoctyltrimethoxysilane, KBM-4803 manufactured by Shin-Etsu Chemical Industry Co., Ltd. Examples of N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane include: Shin-Etsu Chemical Co., Ltd. KBM-602 manufactured by Co., Ltd., A-2120 manufactured by Momentive Performance Materials Japan LLC, GENIOSIL GF-95 manufactured by Wacker Asahikasei Silicone Co., Ltd., and Sila-Ace S310 manufactured by Japan-US Commercial Corporation, etc., as N- Examples of 2- (aminoethyl) -3-aminopropyltrimethoxysilane: KBM-603 manufactured by Shin-Etsu Chemical Industry Co., Ltd., A-1120 manufactured by Momentive Performance Materials Japan LLC, Momentive Performance Materials Japan A-1122 manufactured by LLC, Z-6020 manufactured by Dow Corning Toray Co., Ltd., Z-6094 manufactured by Dow Corning Toray Co., Ltd., GENIOSIL GF-91 manufactured by Wacker Asahikasei Silicone Co., Ltd., Japan-US Commercial Corporation Sila-Ace S320, etc. manufactured by the company, as 3-aminopropyltrimethoxysilane, include: KBM-903 manufactured by Shin-Etsu Chemical Industry Co., Ltd., A-1110 manufactured by Momentive Performance Materials Japan LLC, and Dow Corning Toray Z-6610 manufactured by Japan Co., Ltd., Sila-Ace S360 manufactured by Japan-US Commercial Corporation, etc., as 3-aminopropyl Triethoxysilanes include: KBE-903, A-1100 manufactured by Momentive Performance Materials Japan LLC, Z-6011 manufactured by Dow Corning Toray Co., Ltd., and Sila-Ace S330 manufactured by Japan-US Commercial Corporation, etc. Examples of 3-triethoxysilyl-N- (1,3-dimethyl-butylene) propylamine include KBE-9103, Sila-Ace S340 manufactured by Japan-US Commercial Corporation, etc., Examples of N-phenyl-3-aminopropyltrimethoxysilane include KBM-573 manufactured by Shin-Etsu Chemical Industry Co., Ltd., Y-9669 manufactured by Momentive Performance Materials Japan LLC, and manufactured by Dow Corning Toray Co., Ltd. Z-6883, etc. As N, N'-bis [3- (trimethoxysilyl) propyl] ethylenediamine, Sila-Ace XS1003 manufactured by Japan-US Commercial Corporation can be cited as N- (ethylene Benzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, including: KBM-575 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and manufactured by Dow Corning Toray Co., Ltd. Z-6032, Sila-Ace S350 manufactured by Japan-US Commercial Corporation, etc. Examples of tris (trimethoxysilylpropyl) urate include KBM-9659 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and 3-mercaptopropylmethyldimethoxysilane, which can be cited: Shin-Etsu Chemical Industry Co., Ltd. KBM-802 manufactured by Dow Corning Toray Co., Ltd., and Z-6852 manufactured by Dow Corning Toray Co., Ltd., as 3-mercaptopropyltrimethoxysilane, can be listed: KBM-803 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and manufactured by Momentive Performance Materials Japan LLC A-189, Z-6062 manufactured by Dow Corning Toray Co., Ltd., and Sila-Ace S810 manufactured by Japan American Business Corporation, etc. As 3-mercaptopropyltriethoxysilane, examples include: Momentive Performance Materials Japan A-1891 manufactured by LLC, Z-6911 manufactured by Dow Corning Toray Co., Ltd., and 3-ureidopropyltriethoxysilane can be exemplified by A-1160 manufactured by Momentive Performance Materials Japan LLC as 3-ureido Examples of propyltrialkoxysilane include KBE-585 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and Shin-Etsu as the bis (triethoxysilylpropyl) tetrasulfide. As KBE-846 manufactured by Gakko Industry Co., Ltd., as 3-octylthio-1-propyltriethoxysilane, A-LINK599 manufactured by Momentive Performance Materials Japan LLC can be cited as 3-isocyanatopropyl Examples of triethoxysilane include KBE-9007 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and A-1310 manufactured by Momentive Performance Materials Japan LLC. Examples of 3-isocyanatopropyltrimethoxysilane include: Y-5187 manufactured by Momentive Performance Materials Japan LLC, GENIOSIL GF40 manufactured by Wacker Asahikasei Silicone Co., Ltd., etc. Among these silane coupling agents, silane coupling agents having a methacryl group, an epoxy group, or an isocyanate group have high adhesion even after being exposed to high temperature and high humidity, so they can be preferably used, for example, KBM-502, KBM-403, KBE-403, KBE-9007, etc. manufactured by Shin-Etsu Chemical Industry Co., Ltd. can be used. These silane coupling agents may be used alone or in combination of two or more. When the content of the silane coupling agent (F) is 100 parts by mass of the entire solid content of the black photosensitive resin composition, it is preferably 0.1 to 20 parts by mass, and more preferably 0.5 to 5 parts by mass. If it is less than 0.1 parts by mass, the adhesion after the moist heat resistance test may be poor, and if it exceeds 20 parts by mass, a cured product that is resistant to development may not be obtained. The black photosensitive resin composition of the present invention may further contain an inorganic compound. Examples of the inorganic compound include metal oxides such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silicon dioxide, and aluminum oxide; layered clay minerals, and rice Lolita blue, calcium carbonate, magnesium carbonate, cobalt-based, manganese-based, glass powder (especially glass frit), mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenides, aluminum silicates , Calcium silicate, aluminum hydroxide, platinum, gold, silver, copper, etc. These inorganic compounds can be used alone or in combination of two or more. A dispersant for dispersing a black pigment and / or an inorganic compound may be added to the black photosensitive resin composition of the present invention. The dispersant is not limited as long as it disperses and stabilizes a black pigment or an inorganic compound, and a commercially available dispersant such as BYK series manufactured by BYK-Chemie can be used. A polymer dispersant comprising a polyester, a polyether or a polyurethane having a basic functional group can be particularly suitably used, the functional group having a nitrogen atom as a basic functional group, the functional group having a nitrogen atom as an amine, and / or Those with a quaternary salt and an amine value of 1 to 100 mgKOH / g. In the black photosensitive composition of the present invention, other photopolymerization initiators can be used together with the oxime ester compound of the component (A-1) and the ketoxime ester compound of the (A-2) component. As other photopolymerization initiators that can be used in combination, previously known compounds can be used, and examples include benzophenone, phenylbiphenyl ketone, 1-hydroxy-1-benzylcyclohexane, benzoin, Benzophenone dimethyl ketal, 1-benzyl-1-dimethylamino-1- (4 ';-morpholinylbenzyl) propane, 2-morpholinyl-2- (4'; -Methylthio) benzamidinepropane, 9-oxosulfan

, 1-chloro-4-propoxy-9-oxysulfur

Isopropyl-9-oxysulfur

Diethyl-9-oxysulfur

, Ethyl anthraquinone, 4-benzylidene-4'-methyldiphenyl sulfide, benzoin butyl ether, 2-hydroxy-2-benzylidenepropane, 2-hydroxy-2- (4'-iso (Propyl) benzamylpropane, 4-butyl benzamyl chloroform, 4-phenoxy benzamyl dichloromethane, methyl benzamyl formate, 1,7-bis (9 ' -Acridineyl) heptane, 9-n-butyl-3,6-bis (2'-morpholinylisobutylamidino) carbazole, 2-methyl-4,6-bis (trichloromethyl) 𠯤, 2-phenyl-4,6-bis (trichloromethyl) trimes 𠯤, 2-naphthyl-4,6-bis (trichloromethyl) trimes 𠯤 , 2,2-bis (2-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1-2'-biimidazole, 4,4-azobisisobutyronitrile, triphenyl Phosphine, camphorquinone, N-1414, N-1717 (manufactured by ADEKA), IRGACURE 369, IRGACURE 907, IRGACURE OXE 02, IRGACURE OXE 03 (manufactured by BASF Japan (stock)), benzamidine peroxide, the following As the compound represented by the general formula (6), the photopolymerization initiator may be used alone or in combination of two or more kinds. [Chemical 12]

In the general formula (6), R ¹ , R ² And R ³ Same as the general formula (1) above, R ⁷³ Represents a halogen atom or an alkyl group, and e is an integer of 0 to 5. In the black photosensitive resin composition of the present invention, a chain transfer agent, a sensitizer, a surfactant, a melamine compound, and the like may be further used in combination. As said chain transfer agent and sensitizer, the compound containing a sulfur atom can be used normally. Examples include: thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine Acid, 2-mercaptonicotinic acid, 3- [N- (2-mercaptoethyl) aminomethane] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- ( 3-mercaptopropionyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol, 2-mercaptoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, Thiol compounds such as 2-mercapto-3-pyridinol, 2-mercaptobenzothiazole, thioglycolic acid, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), etc. Disulfide compounds obtained by oxidation of mercapto compounds, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid, 3-iodopropanesulfonic acid and other iodinated alkyl compounds, trimethylolpropane tri ( (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, sebacylthiol, 1,4-dimethylthiobenzene, succinic acid Dithiopropionate, butanediol dithioglycolate, ethylene glycol dithioglycolate, trimethylolpropane trithioglycolate, butanediol dithiopropionate, tris Methylolpropane trithiopropionate, trimethylolpropane trithiopropionate, pentaerythritol tetrathiopropionate, pentaerythritol tetrathioglycolate, trihydroxyethyl trithiopropionate, The following compound No. C1, Karenz MT BD1, PE1, NR1, etc. manufactured by Showa Denko Corporation. [Chemical 13]

As the surfactant, fluorine surfactants such as perfluoroalkyl phosphate and perfluoroalkyl carboxylate, and anionic interfaces such as higher fatty acid alkali metal salts, alkyl sulfonates, and alkyl sulfates can be used. Surfactants, cationic surfactants such as higher amine hydrohalide, quaternary ammonium salt, polyethylene glycol alkyl ether, polyethylene glycol fatty acid ester, sorbitan fatty acid ester, fatty acid monoglyceride Nonionic surfactants, amphoteric surfactants, polysiloxane surfactants and other surfactants can also be used in combination. Examples of the melamine compound include active hydroxyl groups in nitrogen compounds such as (poly) methylolmelamine, (poly) methylolglycol, (poly) methylolbenzoguanamine, and (poly) methylolurea. Methyl (CH ₂ OH group) A compound in which all or a part (at least 2) is alkyl-etherified. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group. The alkyl group may be the same as or different from each other. In addition, the methylol group which has not been alkyl etherified may be self-condensed in one molecule, or may be condensed between two molecules, resulting in the formation of an oligomer component. Specifically, hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycol urea, tetrabutoxymethylglycol urea, and the like can be used. Among these, melamine obtained by alkyl etherification of hexamethoxymethylmelamine, hexabutoxymethylmelamine, or the like is preferred. In addition, to the black photosensitive resin composition of the present invention, if necessary, thermal polymerization such as p-anisole, hydroquinone, catechol, third butylcatechol, phenanthrene &#134116; can be added. Inhibitors; plasticizers; accelerators; fillers; defoamers; leveling agents; surface modifiers; antioxidants; ultraviolet absorbers; dispersing aids; anticoagulants; catalysts; effect promoters; crosslinking Additives; conventional additives such as tackifiers. In the black photosensitive resin composition of the present invention, any of the components other than the ethylenically unsaturated compound (except for the alkali developable Cardo resin (B)) (E) and the silane coupling agent (F) The content is appropriately selected according to the purpose of use, and is not particularly limited. When the solid content of the black photosensitive resin composition is 100 parts by mass, the total content is preferably 20 parts by mass or less. The black photosensitive resin composition and hardened material of the present invention can be used for hardening paints, varnishes, hardening adhesives, printed substrates, display devices (color televisions, personal computer (PC) displays, portable information terminals, and Color filters in liquid crystal display panels for color display of digital cameras, black columnar spacers in liquid crystal display panels for color display of portable information terminals and digital cameras, and color filters for various display applications 、 Black tube column spacers for various display applications, color filters for CCD (Charge Coupled Device) image sensors, touch panels, electroluminescent display devices, plasma display panels, organic EL ( Electroluminescence, black partition wall), powder coating, printing ink, printing plate, adhesive, gel coating, photoresist for electrical engineering, plating resist, etching resist, solder resist, insulation Film, black matrix, and resist for forming structures in the manufacturing steps of LCD, composition for sealing electrical and electronic parts, solder resist, magnetic Recording materials, micro mechanical parts, waveguides, optical switches, masks for plating, etching masks, color test systems, fiberglass cable coatings, stencils for screen printing, for manufacturing three-dimensional objects by stereolithography Materials, holographic recording materials, image recording materials, fine electronic circuits, decoloring materials, decoloring materials for image recording materials, decoloring materials for image recording materials using microcapsules, photoresist for printed wiring boards Materials, UV (Ultra Violet, Ultraviolet) and visible light laser direct image systems, photoresist materials, photoresist materials used in the formation of dielectric layers in successive layers of printed circuit boards and protective films, etc. The use is not particularly limited, and among the above uses, it can be particularly suitably used in a display device. The black photosensitive resin composition of the present invention can be obtained by a known method such as a spin coater, a roll coater, a bar coater, a die coater, a curtain coater, various printing, and dipping. , And used in soda glass, quartz glass, semiconductor substrates, metal, paper, plastic and other supporting substrates. In addition, after being temporarily applied to a supporting substrate such as a film, it may be transferred to another supporting substrate, and the application method is not limited. In addition, as the light source of the active light used when curing the black photosensitive resin composition of the present invention, one that emits light with a wavelength of 300 to 450 nm can be used, and for example, ultra-high pressure mercury, mercury vapor arc, carbon arc, and xenon can be used. Arc, etc. Furthermore, by using laser light as an exposure light source and without using a mask, a laser direct drawing method that directly forms an image based on digital information of a computer or the like can not only improve productivity, but also achieve resolvability. It is useful to improve the position accuracy, etc. As the laser light, light with a wavelength of 340 to 430 nm is suitable. Argon ion laser, helium neon laser, YAG (Yttrium Aluminum Garnet, Yttrium Aluminum Garnet, YAG ) Lasers and semiconductor lasers emit light from the visible region to the infrared region. In the case of using such lasers, a sensitizing pigment that absorbs visible light to infrared rays may be added. The black photosensitive resin composition of the present invention is used for forming a black matrix, and the black matrix is particularly useful for a color filter for a display device for an image display device such as a liquid crystal display panel. The black matrix is preferably formed by the following steps: (1) a step of forming a coating film of the black photosensitive resin composition of the present invention on a substrate, and (2) a mask having a pattern shape on the coating film. A step of irradiating the active light with a cover, (3) a step of developing a cured film using a developer (especially an alkaline developer), and (4) a step of heating the film after development. The black photosensitive resin composition of the present invention is also useful as an inkjet system composition without a development step. The color filter used in a liquid crystal display panel or the like may use the black photosensitive resin composition of the present invention or a coloring composition other than the color filter composition, and repeat the steps (1) to (4) described above to pattern more than two colors. Combined to make. [Examples] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples. [Examples 1 to 5, Comparative Examples 1 to 5] The black photosensitive resin composition of the present invention was prepared with the blending composition (parts by mass) described in Table 1 below. The black pigment (C) is used as a black pigment composition C-1. That is, 20% by mass of carbon black MA-100 (manufactured by Mitsubishi Chemical Corporation), 2% by mass of alkali-developing Cardo resin WR-301 (manufactured by ADEKA), and dispersant BYK-164 ( (Made by BYK-Chemie). A black pigment composition C-1 was prepared at a blending ratio of 2.5% by mass and a solvent of propylene glycol-1-monomethylether-2-acetate (PGMEA) at 75.5% by mass. The following examples and comparisons were prepared. Used in the example. Using the obtained black photosensitive resin composition, the OD (Optical Density, optical density) value, pattern linearity, taper angle, and minimum dense wiring width were evaluated by the following evaluation methods. The results are shown in Table 1. Similarly, the black photosensitive resin composition of the comparative example was prepared with the formulation composition (mass part) shown in Table 2, and the OD value, pattern linearity, taper angle, and minimum dense wiring width were evaluated. The results are shown in Table 2. <OD value evaluation method> Using a spin coater, a black photosensitive resin composition was coated on a glass substrate (10 cm × 10 cm), and heated at 100 ° C. for 100 seconds to thereby cover the surface of the glass substrate. A 1.0 μm coating film was formed. Thereafter, a proximity exposure machine manufactured by MICROTEK was used at an exposure of 40 mJ / cm ² After exposure, baking treatment was performed at 230 ° C for 30 minutes to obtain a cured film. The OD value of the obtained cured film was measured using a Macbeth transmission density meter, and the OD value was divided by the film thickness after baking to calculate the OD value (/ μm) of the average film thickness. Generally, the higher the OD value, the better the light-shielding property. <Pattern linearity evaluation method> A black photosensitive resin composition was coated on a glass substrate (10 cm × 10 cm) using a spin coater, and pre-baked at 100 ° C for 100 seconds to form a film thickness. Coating film of 1.0 μm. Next, a proximity exposure machine manufactured by MICROTEK was used, the exposure gap was set to 100 μm, a negative mask formed with a line pattern of 1 to 20 μm was interposed, and the coating film was irradiated with ultraviolet light of 40 mJ. After the exposed coating film was developed with a 0.04 mass% KOH aqueous solution at 23 ° C for 40 seconds, post-baking was performed at 230 ° C for 30 minutes, thereby forming a line pattern. The pattern of the 6 μm line was observed with an optical microscope, and the linearity of the pattern was evaluated. The linearity of the pattern is evaluated as "good" for those who have no sway at the edge of the line, and "bad" for those who have sway. <Cone angle evaluation method> A black photosensitive resin composition was coated on a glass substrate (10 cm × 10 cm) using a spin coater, and heated at 100 ° C. for 100 seconds to form a glass substrate surface. 1.0 μm coated film. Thereafter, a close-type exposure machine manufactured by MICROTEK was used to form a negative mask with a pattern of 6 μm formed thereon, with an exposure of 40 mJ / cm ² (Gap 100 μm). After developing the exposed film by using a 0.04% by mass KOH aqueous solution at 23 ° C for 40 seconds, baking treatment was performed at 230 ° C for 30 minutes, and the bonding angle (taper angle) between the pattern and the substrate was measured using a scanning electron microscope. Perform the measurement. This taper angle system corresponds to the angle θ in FIGS. 1 (a) and (b). The measured cone angle is shown in the table. If the taper angle is an acute angle, it means that there is no undercut in the pattern, and if the taper angle is an obtuse angle, it means that there is an undercut in the pattern. If there is an undercut in the pattern, the contrast is lowered and it becomes defective. <Minimum dense line width evaluation method> A black photosensitive resin composition was coated on a glass substrate (10 cm × 10 cm) using a spin coater, and heated at 100 ° C. for 100 seconds to thereby apply the glass substrate to the glass substrate. A 1.0 μm coating film was formed on the surface. Thereafter, a proximity exposure machine manufactured by MICROTEK was used to isolate a negative mask having a pattern of 1 to 20 μm, and the exposure was 40 mJ / cm. ² (Gap 100 μm). After the exposed film was developed with a 0.04 mass% KOH aqueous solution at 23 ° C for 40 seconds, a baking treatment was performed at 230 ° C for 30 minutes. Observe the optical microscope, and set the smallest mask pattern to the smallest dense wiring width. [Table 1]

Photopolymerization initiator A-1: Compound No. 1 A-2-1: Compound No. 10 A-2-2: Compound No. 14 A-2-3: Compound No. 16 A-2-4: Compound No.22 Basic developable Cardo resin B-1: WR-301 (manufactured by ADEKA) B-2: V-259ME (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.) Black pigment composition C-1: as above The ethylenically unsaturated compound E-1: Kayarad DPHA ((Dipentaerythritol Hexaacrylate, dipentaerythritol hexaacrylate) (manufactured by Nippon Kayaku)) Silane coupling agent F-1: KBM-403 (manufactured by Shin-Etsu Chemical Co., Ltd.) Solvent D- 1: Propylene glycol-1-monomethyl ether-2-acetate (PGMEA) D-2: Ethyl 3-ethoxypropionate (EEP) [Chem. 14]

[Table 2]

Photopolymerization initiator A-1: Compound No. 1 A-2-1: Compound No. 10 A-2-2: Compound No. 14 A-2-3: Compound No. 16 A-2-4: Compound No.21 Basic developable Cardo resin B-1: WR-301 (manufactured by ADEKA) B-2: V-259ME (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.) Black pigment composition C-1: as above The ethylenically unsaturated compound E-1: Kayarad DPHA (dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku)) Silane coupling agent F-1: KBM-403 (manufactured by Shin-Etsu Chemical Co., Ltd.) Solvent D-1: Propylene glycol-1 -Monomethyl ether-2-acetate (PGMEA) D-2: Ethyl 3-ethoxypropionate (EEP) According to the above results, it is known that the black photosensitive resin composition of the present invention and the conventional black photosensitive Compared with the conventional resin composition, it showed good results in terms of pattern linearity, taper angle, and minimum dense wiring width. The OD value showed the same result. Therefore, it was found that the black photosensitive resin composition of the present invention has sufficient light-shielding properties, has high sensitivity and high resolution, and is useful for forming a black matrix. From the above results, it is understood that the black photosensitive resin composition of the present invention shows good results in terms of pattern linearity, taper angle, and minimum dense wiring width compared with the conventional black photosensitive resin composition. The OD value showed the same result. Therefore, it was found that the black photosensitive resin composition of the present invention has sufficient light-shielding properties, has high sensitivity and high resolution, and is useful for forming a black matrix. [Industrial Applicability] According to the present invention, it is possible to provide a black photosensitive resin composition having sufficient light-shielding properties, high sensitivity and high resolution, and useful for forming a black matrix.

Figures 1 (a) and (b) show the joint angle between the pattern and the substrate.

Claims (6)

A black photosensitive resin composition containing the following components: 1 to 99 parts by mass of the following (A-1) component, and 1 to 99 parts by mass of the following (A-2) component (wherein (A-1) component (A total of 100 parts by mass with the component (A-2)) a photopolymerization initiator composition (A), an alkali developable Cardo resin (B), a black pigment (C), and a solvent (D) (A-1) component: one or more photopolymerization initiators containing an oxime ester compound represented by the following general formula (1) characterized by having a nitrocarbazole skeleton,

In the general formula (1), R ¹ represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an aryloxy group having 6 to 30 carbon atoms. Group, aralkyl group having 7 to 30 carbon atoms, heterocyclic group having 2 to 20 carbon atoms or CN, hydrogen atom of alkyl group, alkoxy group, aryl group, aryloxy group, aralkyl group and heterocyclic group Existence is replaced by OR ²¹ , COR ²¹ , SR ²¹ , NR ²² R ²³ , -NCOR ²² -OCOR ²³ , CN, halogen atom, -CR ²¹ = CR ²² R ²³ or -CO-CR ²¹ = CR ²² R ²³ In this case, R ²¹ , R ²² and R ²³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or carbon A heterocyclic group having 2 to 20 atoms, R ² represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and 6 to 30 carbon atoms Aryloxy group, aralkyl group with 7 to 30 carbon atoms, heterocyclic group with 2 to 20 carbon atoms or CN, alkyl, alkoxy, aryl, aryloxy and arylalkyl hydrogen atoms exist further substituted with a halogen atom as the case where, R ³ represents an alkyl group of 1 to 20 carbon atoms, carbon atoms, Or an aryl group having 6 to 30 carbon atoms of the aralkyl group having 7 to 30, the above-described ^{R 1, R 2, R 3} , R 21, R 22 and R ²³ represented by the substituent of the alkylene group portion is not present When a saturated bond, an ether bond, a thioether bond, an ester bond, a thioester bond, a amine bond, or a urethane bond is interrupted 1 to 5 times, the alkyl portion of the substituent may have a branched side chain When there is a cyclic alkyl group, when the alkyl terminal of the above-mentioned substituent is an unsaturated bond, when R ³ is combined with an adjacent benzene ring to form a ring, R ⁴ and R ⁵ each independently represent a carbon Alkyl group having 1 to 20 carbon atoms, alkoxy group having 1 to 20 carbon atoms, aryl group having 6 to 30 carbon atoms, aryloxy group having 6 to 30 carbon atoms, and arane having 7 to 30 carbon atoms Group, CN or halogen atom, a and b are independently 0 to 3, (A-2) component: one of the ketoxime ester compounds represented by the following general formula (2) characterized by having a ketoxime ester structure The above photopolymerization initiator,

In the general formula (2), X ¹ represents a sulfur atom, an oxygen atom, NR ³⁰ , CO, or a direct bond, and R ³⁰ represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or Aralkyl groups having 7 to 30 carbon atoms, R ⁶ represents alkyl groups having 1 to 20 carbon atoms, alkoxy groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, and 6 to 30 carbon atoms Aryloxy group 30, aralkyl group with 7 to 30 carbon atoms, heterocyclic group with 2 to 20 carbon atoms or CN, alkyl group, alkoxy group, aryl group, aryloxy group, aralkyl group and heterocyclic ring The hydrogen atom of the radical is further substituted by OR ³¹ , COR ³¹ , SR ³¹ , NR ³² R ³³ , -NCOR ³² -OCOR ³³ , CN, halogen atom, -CR ³¹ = CR ³² R ³³ or -CO-CR ³¹ = In the case of CR ³² R ³³ , R ³¹ , R ³² and R ³³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an aromatic group having 7 to 30 carbon atoms. Alkyl or heterocyclic group having 2 to 20 carbon atoms, R ⁷ represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and a carbon atom Aryloxy group having 6 to 30 carbon atoms, Aralkyl group having 7 to 30 carbon atoms, and 2 to 20 carbon atoms Heterocyclyl or CN, when hydrogen atoms of alkyl, alkoxy, aryl, aryloxy and aralkyl are present and are substituted with halogen atoms, R ⁶ , R ⁷ , R ³⁰ , R ³¹ , R ^The alkylene moiety of the substituents represented by ³² and R ³³ is interrupted 1 to 5 times by unsaturated bonds, ether bonds, thioether bonds, ester bonds, thioester bonds, amido bonds, or carbamate bonds. In some cases, there may be a case where the alkyl portion of the substituent has a branched side chain, and a case where the alkyl portion is a cyclic alkyl group, and a case where an unsaturated bond exists at the alkyl end of the substituent, and R ⁹ and R ¹⁰ are each independently Alkyl group having 1 to 20 carbon atoms, alkoxy group having 1 to 20 carbon atoms, aryl group having 6 to 30 carbon atoms, aryloxy group having 6 to 30 carbon atoms, and 7 to 30 carbon atoms Aralkyl, CN, or halogen atom, and when R ⁹ and R ¹⁰ form a ring together, the alkylene part of the substituent represented by R ⁹ and R ¹⁰ may be unsaturated, ether, or thioether When the bond, ester bond, thioester bond, amido bond, or urethane bond is interrupted 1 to 5 times, the alkyl part of the substituent may have a branched side chain, and the For the case of cyclic alkyl, substituted alkyl terminal group is a case where the presence of an unsaturated bond, t and u each independently is 0 ~ 4, R ⁸ represents a hydrogen atom, a benzoyl group, OH, COOH, or the following general The base represented by formula (3),

In the general formula (3), Z ¹ is a bonding bond, which represents -O-, -S-, -OCO-, or -COO-, and (R ¹¹ ) _v -Z ² -partly represents a carbon substituted by v R ¹¹ The alkyl group having 1 to 20 atoms, the aryl group having 6 to 30 carbon atoms, or the aryl alkyl group having 7 to 30 carbon atoms, and the alkylene part of the group represented by Z ² is represented by -O-, -S -When -COO- or -OCO- is interrupted 1 to 5 times, there is a case where the alkylene part of the group represented by Z ² has a branched side chain and a case where it is a cycloalkylene group, and R ¹¹ represents OH Or COOH, v represents an integer of 1 to 3. The black photosensitive resin composition according to claim 1, further comprising an ethylenically unsaturated compound (except for the alkaline developable Cardo resin (B)) (E). The black photosensitive resin composition according to claim 1 or 2, further comprising a silane coupling agent (F). A black matrix is formed using the black photosensitive resin composition as described in claim 1 or 2. A color filter having a black matrix as claimed in claim 4. A liquid crystal display device is formed using a color filter as claimed in claim 5.