TW201742799A - Substrate container with window retention spring - Google Patents
Substrate container with window retention spring Download PDFInfo
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- TW201742799A TW201742799A TW106111525A TW106111525A TW201742799A TW 201742799 A TW201742799 A TW 201742799A TW 106111525 A TW106111525 A TW 106111525A TW 106111525 A TW106111525 A TW 106111525A TW 201742799 A TW201742799 A TW 201742799A
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- end portion
- transparent substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
本發明一般而言係關於一種用於諸如光罩、倍縮光罩、印刷電路板及基板等易碎裝置之儲存、運輸、船運及處理之容器。The present invention relates generally to a container for storage, transportation, shipping, and handling of frangible devices such as reticle, reticle, printed circuit board, and substrate.
積體電路及其他半導體裝置之製作中通常所遇到之程序步驟中之一者係光微影。廣泛而言，光微影涉及使用一經圖案化模板來選擇性地將一經特別製備之晶圓表面曝露至一輻射源以形成一經蝕刻表面層。通常，該經圖案化模板係一倍縮光罩，其係容置待再現於晶圓上之圖案之一極平坦之玻璃板。舉例而言，可藉由以下各項來製備晶圓表面：首先將氮化矽沈積於該晶圓表面上；後續接著塗佈一光敏液體聚合物或光阻劑。接下來，使紫外線(UV)光照射穿過一遮罩或倍縮光罩之一表面或自該表面反射以將所要圖案投影至覆蓋光阻劑之晶圓上。曝露至光的光阻劑之部分經化學改質且在晶圓隨後經受一化學介質時保持不受影響，該化學介質移除未經曝露之光阻劑從而使經改質光阻劑按遮罩上之圖案之確切形狀留於該晶圓上。然後使該晶圓經受一蝕刻程序，該蝕刻程序移除氮化物層之經曝露部分從而使一氮化物圖案按遮罩之確切設計留於該晶圓上。此經蝕刻層單個地或與其他經類似形成之層組合地表示表徵一特定積體電路或半導體晶片之「電路」之裝置及裝置之間的互連件。 在極紫外線(EUV)光微影之情況下，與透過深紫外線光光微影之倍縮光罩特性之透射相反，使用自經圖案化表面之反射。因此，與在習用光微影中所使用之倍縮光罩相比，在EUV光微影中採用之反射性光罩(倍縮光罩)易於污染及損壞達一更大程度。倍縮光罩之表面之顆粒污染可使該倍縮光罩折衷至足以嚴重影響因在處理期間使用此一倍縮光罩而獲得之任一最終產品之一程度。可在處理、運輸及船運期間於容置倍縮光罩之受控環境內產生粒子。倍縮光罩與容器之間以及容器之組件之間的滑動摩擦亦係污染顆粒之來源。而且，現在已知，氣體及微量之濕氣可自倍縮光罩容器中所使用之聚合物材料逸出，此可在倍縮光罩上引起霧態及晶體生長而將倍縮光罩損壞。One of the program steps commonly encountered in the fabrication of integrated circuits and other semiconductor devices is photolithography. Broadly, photolithography involves the use of a patterned template to selectively expose a specially prepared wafer surface to a source of radiation to form an etched surface layer. Typically, the patterned template is a double reticle that houses a very flat glass sheet to be rendered on the wafer. For example, the wafer surface can be prepared by first depositing tantalum nitride on the surface of the wafer; followed by coating a photosensitive liquid polymer or photoresist. Next, ultraviolet (UV) light is irradiated through or reflected from one of the surfaces of a mask or reticle to project the desired pattern onto the wafer overlying the photoresist. The portion of the photoresist exposed to light is chemically modified and remains unaffected when the wafer is subsequently subjected to a chemical medium that removes the unexposed photoresist to shield the modified photoresist The exact shape of the pattern on the cover remains on the wafer. The wafer is then subjected to an etch process that removes the exposed portions of the nitride layer to leave a nitride pattern on the wafer in the exact design of the mask. This etched layer, in combination with or in combination with other similarly formed layers, represents an interconnection between devices and devices that characterize a "circuit" of a particular integrated circuit or semiconductor wafer. In the case of extreme ultraviolet (EUV) photolithography, the reflection from the patterned surface is used as opposed to the transmission of the refracting properties of the deep ultraviolet light lithography. Therefore, the reflective mask (double reticle) used in EUV light lithography is more susceptible to contamination and damage to a greater extent than the reticle used in conventional light lithography. Particle contamination of the surface of the reticle can compromise the reticle to a degree sufficient to severely affect one of the final products obtained by using the double reticle during processing. Particles can be generated in a controlled environment in which the reticle is housed during handling, transportation, and shipping. Sliding friction between the reticle and the container and between the components of the container is also a source of contaminating particles. Moreover, it is now known that gases and traces of moisture can escape from the polymeric material used in the reticle container, which can cause fogging and crystal growth on the reticle to damage the reticle. .
本發明一般而言係關於一種用於諸如光罩、倍縮光罩、印刷電路板及基板等易碎裝置之儲存、運輸、船運及處理之容器。 在一項說明性實施例中，一種基板容器可包含一基底板及一蓋。該蓋可經調適以嚙合該基底板以界定一殼體，且該基底板可包含至少一個窗口。該至少一個窗口可包含：一安裝凹部，其包含一凹部側壁、一底部側壁及在該凹部側壁中界定之至少一個底切部，其中該凹部側壁與該底部側壁一起界定一唇緣；一透明基板，其安置於該安裝凹部中；及一保持部件，其具有在一第一端部分與一第二端部分之間延伸之一拱形部分，其中該第一端部分定位於在該凹部側壁中界定之該底切部中，且其中該保持部件之該拱形部分接觸該透明基板以將該透明基板保持於該安裝凹部中。 在另一說明性實施例中，一基板容器可包含一外罩艙總成及容置於該外罩艙總成內之一內罩艙總成。該內罩艙總成可包含一基底板及一蓋。該基底板具有一面向上之表面及一面向下之表面且可包含複數個窗口。該等窗口中之每一者皆可包含：一安裝凹部，其具有一第一凹部側壁及一第二凹部側壁、一第一底部側壁及一第二底部側壁、在第一側壁及第二側壁中之每一者中界定之第一底切部及第二底切部，其中該第一凹部側壁及該第二凹部側壁與第一底部側壁及第二底部側壁一起界定一唇緣；一孔口，其由該安裝凹部之該底部側壁界定；一透明基板，其安置於該安裝凹部中且由該唇緣支撐；及一保持部件，其具有自一第一端部分延伸至一第二端部分之一對拱形部分，其中該第一端部分定位於在該第一凹部側壁中界定之該第一底切部中，該第二端部分定位於在該第二凹部側壁中界定之該第二底切部中，且其中該保持部件之該對拱形部分接觸該透明基板以將該透明基板保持於該安裝凹部中。在一特定實施例中，該保持部件係由彈簧鋼製作而成。 在再一說明性實施例中，一種方法包含：將一透明基板放置至在一基板容器之一基底板中界定之安裝凹部中。該安裝凹部可包含第一凹部側壁及第二凹部側壁、第一底部側壁及第二底部側壁，在該第一凹部側壁及該第二凹部側壁中之每一者中界定之底切部，其中該第一凹部側壁及該第二凹部側壁與該第一底部側壁及該第二底部側壁一起界定在上面支撐該透明基板之一唇緣。接下來，該方法可包含將一保持部件之一第一端部分插入至在該第一凹部側壁中界定之一第一底切部中，該保持部件包含自該第一端部分延伸至一第二端部分之一拱形部分。此可後續接著：沿朝向該保持部件之一中心線之一方向壓縮該保持部件之該第二端部分；將該第二端部分插入至在該第二凹部側壁中界定之一第二底切部中；及釋放該經壓縮之第二端部分，其中該拱形部分接觸該透明基板以將該透明基板保持於該安裝凹部內。 提供前述發明內容以促進對專屬於本發明之發明性特徵中之某些發明性特徵之一理解且並不意欲為一完整說明。可藉由將整個說明書、申請專利範圍、圖式、及摘要看作一整體而獲得對本發明之一完整瞭解。The present invention relates generally to a container for storage, transportation, shipping, and handling of frangible devices such as reticle, reticle, printed circuit board, and substrate. In an illustrative embodiment, a substrate container can include a substrate panel and a cover. The cover can be adapted to engage the base panel to define a housing, and the base panel can include at least one window. The at least one window may include: a mounting recess including a recess sidewall, a bottom sidewall, and at least one undercut defined in the sidewall of the recess, wherein the recess sidewall defines a lip together with the bottom sidewall; a transparent a substrate disposed in the mounting recess; and a retaining member having an arcuate portion extending between the first end portion and a second end portion, wherein the first end portion is positioned at the sidewall of the recess The undercut portion defined therein, and wherein the arcuate portion of the retaining member contacts the transparent substrate to retain the transparent substrate in the mounting recess. In another illustrative embodiment, a substrate container can include an outer shroud assembly and an inner shroud assembly housed within the outer shroud assembly. The inner shroud assembly can include a base panel and a cover. The base plate has an upwardly facing surface and a downwardly facing surface and may comprise a plurality of windows. Each of the windows may include: a mounting recess having a first recess sidewall and a second recess sidewall, a first bottom sidewall and a second bottom sidewall, the first sidewall and the second sidewall a first undercut portion and a second undercut portion defined in each of the first recessed sidewalls and the second recessed sidewall and the first bottom sidewall and the second bottom sidewall define a lip; a hole a port defined by the bottom side wall of the mounting recess; a transparent substrate disposed in the support recess and supported by the lip; and a retaining member having a first end portion extending to a second end a pair of portions of the arcuate portion, wherein the first end portion is positioned in the first undercut defined in the sidewall of the first recess, the second end portion being positioned in the sidewall defined in the second recess The second undercut portion, and wherein the pair of arcuate portions of the retaining member contact the transparent substrate to retain the transparent substrate in the mounting recess. In a particular embodiment, the retaining member is fabricated from spring steel. In still another illustrative embodiment, a method includes placing a transparent substrate into a mounting recess defined in a substrate panel of a substrate container. The mounting recess may include a first recess sidewall and a second recess sidewall, a first bottom sidewall and a second bottom sidewall, and an undercut defined in each of the first recess sidewall and the second recess sidewall, wherein The first recess sidewall and the second recess sidewall together with the first bottom sidewall and the second bottom sidewall define a lip that supports one of the transparent substrates. Next, the method can include inserting a first end portion of a retaining member into a first undercut defined in the first recess sidewall, the retaining member including extending from the first end portion to a first One of the two end portions is an arched portion. This may be followed by compressing the second end portion of the retaining member in a direction toward one of the centerlines of the retaining member; inserting the second end portion into a second undercut defined in the sidewall of the second recess And releasing the compressed second end portion, wherein the arcuate portion contacts the transparent substrate to retain the transparent substrate within the mounting recess. The previous summary is provided to facilitate an understanding of one of the inventive features of the present invention and is not intended to be a complete description. A full understanding of the present invention can be obtained by considering the entire specification, the scope of the claims, the drawings, and the abstract as a whole.
本申請案主張於2016年4月6日提出申請且標題為「具有窗口保持彈簧之基板容器」之美國臨時申請案第62/319,120號之權益，該美國臨時申請案之全部內容出於所有目的而以引用方式併入本文中。 除非內容另外明確指明，否則如本說明書及隨附申請專利範圍中所使用，單數形式「一(a)」、「一(an)」及「該」包含複數個指示物。除非內容另外明確指明，否則如本說明書及隨附申請專利範圍中所使用，術語「或」通常在其包含「及/或」之意義上採用。 應參考圖式來閱讀以下詳細說明，在該等圖式中，不同圖式中之類似元件編號相同。詳細說明及圖式(未必按比例繪製)繪示了說明性實施例且並不意欲限制本發明之範疇。所繪示之說明性實施例意欲僅作為例示性。除非明確陳述為相反的，否則任一說明性實施例之選定特徵可併入至一額外實施例中。 圖1繪示先前技術之一倍縮光罩容器100。倍縮光罩容器100包含與一中心軸112對準之一外罩艙總成104及一內罩艙總成108，內罩艙總成108容置一倍縮光罩116。如本文中所使用，術語倍縮光罩116係指一薄的平坦基板、倍縮光罩或印刷電路板。外罩艙總成104包含協作以界定一殼體之一上部部分120及一下部部分124。內罩艙總成108包含一蓋128及一基底132且可安置於外罩艙總成104內。蓋128及基底132可藉由自蓋128延伸之對準銷136而對準。每一對準銷136可定位於形成於基底132之一邊緣144上之一各別導引凹部140內。雖然本文中所繪示之倍縮光罩罩艙具有一大體正方形輪廓，但應理解，其他罩艙可具有其他形狀，諸如例如，一多邊形、圓形或其他適合形狀。 內罩艙總成蓋128可具有由一單個塊(例如，一金屬，諸如不銹鋼)機械加工而成之單件式構造。蓋128界定一頂部表面148，該頂部表面與跟頂部表面148間隔開之一底部或面向內部之表面相對，其中一側向表面152實質上沿著一平面延伸。在一項實施例中，蓋128可具備至少一個突出部156，突出部156自側向表面152向外延伸且自頂部表面148延伸至底部表面。一通孔160形成於用於接納對準銷136之突出部156中之一位置處。通孔160之一軸實質上垂直於頂部表面148。進一步預期，蓋128可在不具有突出部156之情況下提供且通孔160係實質上毗鄰側向表面152而鑽孔。對準銷136可經定尺寸以用於與孔160之一干涉配合。 內罩艙總成基底132亦可具有單件式金屬構造且包含一面向上或面向內部之表面164，該面向上或面向內部之表面與一面向下或底部表面相對，其中一側向表面168在該面向上或面向內部之表面與該面向下或底部表面之間延伸，側向表面168實質上沿著一平面而平放。基底132包含複數個倍縮光罩支撐部件170，該等倍縮光罩支撐部件自面向內部之表面164延伸以用於在內罩艙總成108內於靠近該內罩艙總成之拐角中之每一者處支撐倍縮光罩116。基底132可具備至少一個導引凹部140，導引凹部140自側向表面168之平面向內縮退且延伸穿過頂部表面164及底部表面。在一項實施例中，導引凹部140定位於基底132上使得當蓋128與基底132嚙合時，對準銷136位於導引凹部140內之一精確位置處，從而導致對準銷136與導引凹部140之間的一緊密配合嚙合。基底132另外包含複數個窗口172，該等窗口各自包含安置於基底132中以用於經由窗口172自內罩艙總成108之外側監視倍縮光罩之一透明基板。 在功能上，蓋128與基底132彼此配合以界定在該蓋與該基底之間具有非實質軸向移動之一密封殼體。在蓋128與基底132之間界定之密封件係穩健的以便防止非所要污染物及其他污染物質進入至由經密封殼體界定之微環境中。用於蓋128及基底132之單件式結構之形成消除或減少帶來夾持接觸之表面之存在，藉此減少或消除此等夾持表面之間的粒子截留及可隨時間發生之隨附粒子脫落。單件式構造亦消除製造步驟並減少與蓋128及基底132相關聯之公差累積。 參考圖2至圖4，繪示根據本發明之一或多項實施例之用於一倍縮光罩容器之一內罩艙總成之一基底204。在一或多項實施例中，基底204具有一單件式金屬構造且包含一面向上之表面165，該面向上之表面與一面向下之表面208相對，其中一側向表面168在該面向上之表面與該面向下之表面之間延伸。基底204另外包含複數個倍縮光罩支撐部件170，該等倍縮光罩支撐部件自面向上之表面165延伸以用於支撐一倍縮光罩116。在某些實施例中，基底204包含自側向表面168向內縮退以用於基底204與一蓋之對準之一或多個導引凹部140，諸如例如，圖1中所展示之蓋128。 在一或多項實施例中，基底204包含在面向上之表面165中界定之一薄膜安裝凹部216。薄膜安裝凹部216包含一凹部側壁220及一底部側壁224，該底部側壁界定用於將一薄膜至少部分地接納並支撐於凹部216內之一形狀。在一或多項實施例中，基底204另外在圍繞薄膜安裝凹部216之周邊之各種點處包含握持區域226以用於促進一薄膜之插入及/或自凹部216之移除。在各種實施例中，凹部側壁220及底部側壁224界定符合用於將薄膜定位於凹部216中的一薄膜之形狀之一形狀。 圖3係根據一或多項實施例之基底板204、一薄膜225及一倍縮光罩116之一分解視圖。薄膜225定位於倍縮光罩116下方且可向下降低以平放於薄膜安裝凹部216內。在各種實施例中，凹部216之深度實質上與薄膜225之高度相同，使得該薄膜在降低至凹部216中時實質上與面向上之表面165齊平，且倍縮光罩116接觸支撐部件170以在恰好位於基底板204與薄膜225之組合上方之適當位置中支撐該倍縮光罩。在某些實施例中，凹部216之深度可變化，使得凹部216之深度大於或小於薄膜225之高度。 現在參考圖4至圖6，在各種實施例中，基底板204另外包含複數個窗口228、229。窗口228、229中之每一者皆包含界定延伸穿過基底板204及一透明基板236之一孔口232、233之一窗口安裝凹部240。在各種實施例中，複數個孔口232、233中之每一者皆自面向下之表面208延伸穿過基底板204到達面向上之表面165。在各種實施例中，透明基板236中之每一者皆安置於在基底板204中界定之一對應窗口安裝凹部240中。在各種實施例中，一彈簧狀保持部件284將透明基板236保持於窗口安裝凹部240中。在一或多項實施例中，透明基板236係由透明玻璃、塑膠或用於在一受高度控制之處理環境(諸如，用於EUV光微影所需要之環境)中處理之其他適合材料製成。 在某些實施例中，諸如圖5及圖6中所繪示，窗口安裝凹部240各自包含一第一凹部244，該第一凹部由具有一對橫向邊緣252及一對縱向邊緣256之一第一凹部側壁248及一第一底部側壁260界定。在某些實施例中，橫向邊緣252中之一或多者包含由界定一懸伸部268之第一凹部側壁248內之一側向凹部形成之一底切部分264。 在某些實施例中，窗口安裝凹部240各自在第一底部側壁260中包含一第二凹部272。第二凹部272由一第二凹部側壁276及一第二底部側壁280界定。在一或多項實施例中，第二凹部側壁276及第二底部側壁280界定用於將透明基板236至少部分地緊密接納於第二凹部272內之一形狀。 在一或多項實施例中，孔口232、233可形成為取決於窗口228、229之大小/類型而具有各種大小。舉例而言，在圖4至圖6中所繪示，窗口228係用於處理期間之倍縮光罩定位檢查之對準窗口。因此，孔口232相對於孔口233而係較大的以用於過基底板204至內罩艙總成中之經改良觀看。然而，孔口232、233中之每一者之面積之大小至少被設定成小於第二底部側壁280之面積，使得孔口232、233及第二底部側壁280在窗口安裝凹部240中界定一唇緣241、242，該唇緣足以支撐透明基板236。舉例而言，圖5至圖6中所繪示，窗口安裝凹部240中之每一者中之透明基板236由具有支撐透明基板236之對應邊緣之一邊緣之一唇緣支撐。 在一或多項實施例中，基底204包含複數個窗口保持部件284。在圖9及圖10中展示一例示性窗口保持部件之不同視圖。窗口保持部件284具有用以搭扣配合、彈簧配合、螺絲配合或以其他方式定位並固定於第一凹部244內以將透明基板236保持於第二凹部272中之適當位置中之適合形狀及大小。在某些實施例中，窗口保持部件284經構形以便使用彈簧力將透明基板236保持於窗口安裝凹部240內。舉例而言，參考圖5至圖6及圖9至圖10，窗口保持部件284中之每一者皆具有自一第一端部分292延伸至一第二端部分294之一對縱向拱形部分288。如在圖9中可見，第一端部分292具有一閉合遠端295且第二端部分包含將拱形部分288之遠端299分離之一間隙297。間隙297提供於該等拱形部分之遠端299之間使得可在安裝期間沿朝向該保持部件之一中心線l 之一方向壓縮保持部件284，如將在本文中較詳細地闡述。第一端部分292及第二端部分294中之每一者皆可定位於窗口安裝凹部240中之每一者之底切部分264中，藉此經由懸伸部268而將窗口保持部件284固定於適當位置中。一旦保持部件284處於適當位置中，縱向拱形部分288便彎曲以接觸透明基板236以將該透明基板保持於第二凹部272中之適當位置中。 在一或多項實施例中，可藉由將保持部件284之第一端部分292及第二端部分294中之一或多者適當地彎曲至底切部分264中而將窗口保持部件284安裝至第一凹部中。在一或多項實施例中，使用具有彈簧之性質之材料來構造窗口保持部件284，使得一旦將部件284自彎曲至底切部分264中釋放，該等部件便彈回至其原始形狀，藉此使縱向拱形部分288與透明基板236接觸。更特定而言，在某些實施例中，窗口保持部件284可由具有約15 psi × 103 至約30 psi × 103 之一彈性模數(E)之一彈性材料製作而成。因此，在各種實施例中，窗口保持部件284可由包含但不限於彈簧鋼、中碳鋼、高碳鋼、不銹鋼、非鐵合金及高溫合金之一材料構造而成。在其他實施例中，具有足以彎曲並維持一所要形式之一適合彈性模數之某些聚合物可用以製作窗口保持部件284。適合聚合材料包含但不限於全氟烷氧基烷烴、聚四氟乙烯、聚醚醯亞胺及聚二甲基矽氧烷。在一項實施例中，窗口保持部件284係由彈簧鋼製作而成。 窗口保持部件可構造為具有各種形狀或設計。舉例而言，參考圖7繪示一窗口保持部件304之一剖面圖。窗口保持部件304係由具有約15 psi × 103 至約30 psi × 103 之一彈性模數(E)之一金屬或聚合材料之一彈性線構造。在一項實施例中，窗口保持部件304係由彈簧鋼製作而成。參考圖8，繪示一窗口保持部件404。在一或多項實施例中，部分地以螺絲方式保持窗口保持部件404，從而使橫向邊緣中之一者定位於第一凹部244之一底切部分264中且使橫向邊緣中之另一者在適當位置處經由一螺絲408而固定至基底板204中。 在一或多項實施例中，由於薄膜安裝凹部216，因此將窗口安裝凹部240定位為使一部分定位於基底板204之一相對較薄區域412上方且使另一部分定位於基底板204之一相對較厚區域416上方。由於缺少基底板材料，因此較薄區域412防止使用習用保持方法，諸如螺絲408。因此，在各種實施例中，底切部分264定位於對應於較薄區域412之凹部側壁中。在某些實施例中，窗口保持部件404具有定位於對應於較薄區域412之底切部分264中之一第一橫向邊緣，且具有在適當位置處經由定位於基底板204之較厚區域416中之一螺絲408而固定至基底板204之一第二橫向邊緣。 窗口保持部件284、304、404中之每一者皆至少部分地依靠壓縮彈簧力將透明基板保持於窗口安裝凹部內。在基底板之構造期間，可將一透明基板放置於在該基底板中界定之安裝凹部中之一者中。接下來，可將一保持部件之第一端部分插入至在窗口安裝凹部之第一凹部側壁中界定之一第一底切部中。沿朝向保持部件之一中心線之一方向壓縮或擠壓第二端部分且將該第二端部分插入至在安裝凹部之一第二凹部側壁中界定之一第二底切部中。一旦定位於該底切部中，便釋放保持部件之第二端部分，從而致使該保持部件彈回至其原始形狀，藉此致使一或多個拱形部件接觸透明基板並將一壓縮力置於該透明基板上，從而將該透明基板保持於該安裝凹部內。可視需要針對基底板中之每一窗口重複此程序。依靠壓縮力將透明部件保持於窗口安裝凹部內減少或在某些實施例中消除通常用以將基板保持於窗口安裝凹部內之其他緊固構件，諸如例如，螺絲。螺絲之數目之減少或者螺絲或其他緊固件之消除可幫助減少敏感性微環境內之粒子。 因此，在闡述本發明之數個說明性實施例後，熟習此項技術者將容易地瞭解，可在本文之隨附申請專利範圍之範疇內做出並使用又一些實施例。已在前述說明中陳述了此文件所涵蓋之揭示內容之眾多優點。然而，將理解，本發明在諸多方面中僅為說明性的。可在不超出本發明之範疇之情況下在細節方面(尤其在零件之形狀、大小及配置之事項上)做出改變。當然，本發明之範疇係用其中表達隨附申請專利範圍之語言界定。The present application claims the benefit of U.S. Provisional Application Serial No. 62/319,120, filed on Apr. It is incorporated herein by reference. The singular forms "a", "an" and "the" are used in the s The term "or" is used in the sense that it includes "and/or" as used in the specification and the appended claims. The following detailed description is read with reference to the drawings in which like elements are The detailed description and drawings are not intended to be in The illustrative embodiments shown are intended to be illustrative only. Selected features of any of the illustrative embodiments can be incorporated into an additional embodiment unless explicitly stated to the contrary. 1 illustrates a prior art reticle container 100. The reticle container 100 includes an outer shroud assembly 104 and an inner shroud assembly 108 aligned with a central shaft 112 that houses a double reticle 116. As used herein, the term reticle 116 refers to a thin flat substrate, reticle or printed circuit board. The outer shroud assembly 104 includes a plurality of upper portions 120 and a lower portion 124 that cooperate to define a housing. The inner shroud assembly 108 includes a cover 128 and a base 132 and can be disposed within the outer shroud assembly 104. Cover 128 and base 132 may be aligned by alignment pins 136 extending from cover 128. Each of the alignment pins 136 can be positioned within one of the respective guide recesses 140 formed on one of the edges 144 of the substrate 132. While the reticle housing described herein has a generally square outline, it should be understood that other hoods may have other shapes such as, for example, a polygonal, circular, or other suitable shape. The inner shroud assembly cover 128 can have a one-piece construction machined from a single piece (eg, a metal such as stainless steel). The cover 128 defines a top surface 148 that is opposite a bottom or inner facing surface that is spaced from the top surface 148, wherein the lateral surface 152 extends substantially along a plane. In an embodiment, the cover 128 can be provided with at least one protrusion 156 that extends outwardly from the lateral surface 152 and extends from the top surface 148 to the bottom surface. A through hole 160 is formed at one of the projections 156 for receiving the alignment pin 136. One of the axes of the through holes 160 is substantially perpendicular to the top surface 148. It is further contemplated that the cover 128 can be provided without the protrusion 156 and that the through hole 160 is drilled substantially adjacent to the lateral surface 152. The alignment pin 136 can be sized for interference fit with one of the apertures 160. The inner shroud assembly base 132 can also have a one-piece metal construction and include an upwardly or inwardly facing surface 164 that opposes a downward or bottom surface with a side facing surface 168 at The upwardly or inwardly facing surface extends between the downwardly facing or bottom surface, and the lateral surface 168 lies substantially parallel to a plane. The base 132 includes a plurality of reticle support members 170 that extend from the inwardly facing surface 164 for use in the inner hood assembly 108 adjacent the corner of the inner hood assembly Each of them supports the reticle 116. The base 132 can be provided with at least one guiding recess 140 that retracts inwardly from the plane of the lateral surface 168 and extends through the top surface 164 and the bottom surface. In one embodiment, the guide recess 140 is positioned on the base 132 such that when the cover 128 is engaged with the base 132, the alignment pin 136 is located at a precise location within the guide recess 140, resulting in the alignment pin 136 and the guide. A tight fit between the recesses 140. The substrate 132 additionally includes a plurality of windows 172, each of which includes a planar substrate 132 for monitoring a transparent substrate of the reticle from the outer side of the inner hood assembly 108 via the window 172. Functionally, the cover 128 and the base 132 cooperate to define a sealed housing having a non-substantial axial movement between the cover and the base. The seal defined between the cover 128 and the base 132 is robust to prevent unwanted contaminants and other contaminants from entering the microenvironment defined by the sealed housing. The formation of a one-piece structure for the cover 128 and the substrate 132 eliminates or reduces the presence of a surface that brings the gripping contact, thereby reducing or eliminating particle entrapment between the gripping surfaces and may accompany the occurrence of time. The particles fall off. The one-piece construction also eliminates manufacturing steps and reduces tolerance buildup associated with cover 128 and substrate 132. Referring to Figures 2 through 4, a substrate 204 for a hood assembly in one of the double refractory containers is illustrated in accordance with one or more embodiments of the present invention. In one or more embodiments, the substrate 204 has a one-piece metal construction and includes an upwardly facing surface 165 that opposes a downwardly facing surface 208 with a lateral surface 168 on the facing surface. The surface extends between the surface facing downward. The substrate 204 additionally includes a plurality of reticle support members 170 that extend from the upwardly facing surface 165 for supporting the double reticle 116. In certain embodiments, the substrate 204 includes one or more guiding recesses 140 that are retracted inwardly from the lateral surface 168 for alignment of the substrate 204 with a cover, such as, for example, the cover 128 shown in FIG. . In one or more embodiments, the substrate 204 includes a film mounting recess 216 defined in the upwardly facing surface 165. The film mounting recess 216 includes a recess sidewall 220 and a bottom sidewall 224 that define a shape for at least partially receiving and supporting a film within the recess 216. In one or more embodiments, the substrate 204 additionally includes a grip area 226 at various points around the perimeter of the film mounting recess 216 for facilitating insertion of a film and/or removal from the recess 216. In various embodiments, the recess sidewalls 220 and the bottom sidewalls 224 define one shape that conforms to the shape of a film used to position the film in the recess 216. 3 is an exploded view of a substrate panel 204, a film 225, and a reticle 116 in accordance with one or more embodiments. The film 225 is positioned below the reticle 116 and can be lowered downwardly to lie flat within the film mounting recess 216. In various embodiments, the depth of the recess 216 is substantially the same as the height of the film 225 such that the film is substantially flush with the upwardly facing surface 165 when lowered into the recess 216, and the reticle 116 contacts the support member 170 The reticle is supported in position just above the combination of the base plate 204 and the film 225. In some embodiments, the depth of the recess 216 can be varied such that the depth of the recess 216 is greater or less than the height of the film 225. Referring now to FIGS. 4-6, in various embodiments, the base plate 204 additionally includes a plurality of windows 228, 229. Each of the windows 228, 229 includes a window mounting recess 240 that defines one of the apertures 232, 233 extending through the base plate 204 and a transparent substrate 236. In various embodiments, each of the plurality of apertures 232, 233 extends from the downwardly facing surface 208 through the base plate 204 to the upwardly facing surface 165. In various embodiments, each of the transparent substrates 236 is disposed in one of the corresponding window mounting recesses 240 defined in the base plate 204. In various embodiments, a spring-like retaining member 284 retains the transparent substrate 236 in the window mounting recess 240. In one or more embodiments, the transparent substrate 236 is made of clear glass, plastic, or other suitable material for processing in a highly controlled processing environment such as that required for EUV photolithography. . In some embodiments, such as illustrated in Figures 5 and 6, the window mounting recesses 240 each include a first recess 244 having a pair of lateral edges 252 and a pair of longitudinal edges 256. A recess sidewall 248 and a first bottom sidewall 260 are defined. In some embodiments, one or more of the lateral edges 252 includes an undercut portion 264 formed by a lateral recess in the first recess sidewall 248 that defines an overhang 268. In some embodiments, the window mounting recesses 240 each include a second recess 272 in the first bottom sidewall 260. The second recess 272 is defined by a second recess sidewall 276 and a second bottom sidewall 280. In one or more embodiments, the second recess sidewall 276 and the second bottom sidewall 280 define a shape for at least partially receiving the transparent substrate 236 in the second recess 272. In one or more embodiments, the apertures 232, 233 can be formed to have various sizes depending on the size/type of the windows 228, 229. For example, as depicted in Figures 4-6, window 228 is used for the alignment window of the reticle locating inspection during processing. Thus, the aperture 232 is relatively large relative to the aperture 233 for improved viewing through the base panel 204 to the inner shroud assembly. However, the area of each of the apertures 232, 233 is at least set to be smaller than the area of the second bottom side wall 280 such that the apertures 232, 233 and the second bottom side wall 280 define a lip in the window mounting recess 240. The edges 241, 242 are sufficient to support the transparent substrate 236. For example, as illustrated in FIGS. 5-6, the transparent substrate 236 in each of the window mounting recesses 240 is supported by a lip having one of the edges of a corresponding edge supporting the transparent substrate 236. In one or more embodiments, the substrate 204 includes a plurality of window holding members 284. Different views of an exemplary window holding member are shown in FIGS. 9 and 10. The window retaining member 284 has a suitable shape and size for snap fit, spring fit, screw fit or otherwise positioned and secured within the first recess 244 to retain the transparent substrate 236 in position in the second recess 272 . In some embodiments, the window retaining member 284 is configured to retain the transparent substrate 236 within the window mounting recess 240 using a spring force. For example, referring to FIGS. 5-6 and 9-10, each of the window holding members 284 has a longitudinal arcuate portion extending from a first end portion 292 to a second end portion 294. 288. As seen in Figure 9, the first end portion 292 has a closed distal end 295 and the second end portion includes a gap 297 separating the distal end 299 of the arcuate portion 288. A gap 297 is provided between the distal ends 299 of the arcuate portions such that the retaining member 284 can be compressed in one direction toward the centerline 1 of the retaining member during installation, as will be explained in greater detail herein. Each of the first end portion 292 and the second end portion 294 can be positioned in the undercut portion 264 of each of the window mounting recesses 240, thereby securing the window holding member 284 via the overhang 268 In the right place. Once the retaining member 284 is in place, the longitudinal arcuate portion 288 flexes to contact the transparent substrate 236 to retain the transparent substrate in place in the second recess 272. In one or more embodiments, the window holding member 284 can be mounted to the undercut portion 264 by appropriately bending one or more of the first end portion 292 and the second end portion 294 of the retaining member 284 into the undercut portion 264 In the first recess. In one or more embodiments, the window retaining member 284 is constructed using a material having the properties of a spring such that once the member 284 is released from bending to the undercut portion 264, the members spring back to their original shape, thereby The longitudinal arcuate portion 288 is brought into contact with the transparent substrate 236. More specifically, in certain embodiments, the window retaining member 284 can be fabricated from an elastomeric material having an elastic modulus (E) of from about 15 psi by 10 3 to about 30 psi by 10 3 . Thus, in various embodiments, the window retaining member 284 can be constructed from materials including, but not limited to, spring steel, medium carbon steel, high carbon steel, stainless steel, non-ferrous alloys, and high temperature alloys. In other embodiments, certain polymers having sufficient elastic modulus to bend and maintain one of the desired forms can be used to make the window retaining member 284. Suitable polymeric materials include, but are not limited to, perfluoroalkoxyalkanes, polytetrafluoroethylene, polyetherimine, and polydimethyloxane. In one embodiment, the window retaining member 284 is fabricated from spring steel. The window holding member can be constructed to have various shapes or designs. For example, a cross-sectional view of a window holding member 304 is illustrated with reference to FIG. The window retaining member 304 is constructed of an elastic wire having one of a metal or a polymeric material having an elastic modulus (E) of about 15 psi x 10 3 to about 30 psi x 10 3 . In one embodiment, the window retaining member 304 is fabricated from spring steel. Referring to Figure 8, a window holding member 404 is illustrated. In one or more embodiments, the window retaining member 404 is partially retained in a screwed manner such that one of the lateral edges is positioned in one of the undercut portions 264 of the first recess 244 and the other of the lateral edges is The appropriate position is fixed to the base plate 204 via a screw 408. In one or more embodiments, the window mounting recess 240 is positioned such that a portion is positioned over a relatively thinner region 412 of the base panel 204 and another portion is positioned relative to one of the base panels 204 due to the film mounting recess 216. Above the thick area 416. The thinner region 412 prevents the use of conventional retention methods, such as the screw 408, due to the lack of substrate material. Thus, in various embodiments, the undercut portion 264 is positioned in the sidewall of the recess corresponding to the thinner region 412. In certain embodiments, the window retaining member 404 has a first lateral edge positioned in the undercut portion 264 that corresponds to the thinner region 412 and has a thicker region 416 that is positioned over the base plate 204 at a suitable location. One of the screws 408 is fixed to the second lateral edge of one of the base plates 204. Each of the window holding members 284, 304, 404 at least partially relies on a compression spring force to retain the transparent substrate within the window mounting recess. During construction of the substrate panel, a transparent substrate can be placed in one of the mounting recesses defined in the substrate panel. Next, a first end portion of a retaining member can be inserted into one of the first undercuts defined in the sidewall of the first recess of the window mounting recess. The second end portion is compressed or pressed in a direction toward one of the centerlines of the retaining member and the second end portion is inserted into one of the second undercuts defined in the second recess sidewall of the mounting recess. Once positioned in the undercut, the second end portion of the retaining member is released, thereby causing the retaining member to spring back to its original shape, thereby causing one or more of the arched members to contact the transparent substrate and place a compressive force The transparent substrate is held in the mounting recess. Repeat this procedure for each window in the base plate as needed. Retaining the transparent member within the window mounting recess by compressing forces reduces or in some embodiments eliminates other fastening members typically used to retain the substrate within the window mounting recess, such as, for example, a screw. The reduction in the number of screws or the elimination of screws or other fasteners can help reduce particles in the sensitive microenvironment. Therefore, it will be apparent to those skilled in the <RTIgt;</RTI><RTIgt;</RTI><RTIgt;</RTI><RTIgt;</RTI><RTIgt;</RTI><RTIgt; The numerous advantages of the disclosure covered by this document have been set forth in the foregoing description. However, it will be understood that the invention is to be construed as illustrative only. Changes may be made in the details (especially in the shape, size and configuration of the parts) without departing from the scope of the invention. Of course, the scope of the invention is defined by the language in which the scope of the appended claims is expressed.
100‧‧‧倍縮光罩容器
104‧‧‧外罩艙總成
108‧‧‧內罩艙總成
112‧‧‧中心軸
116‧‧‧倍縮光罩
120‧‧‧上部部分
124‧‧‧下部部分
128‧‧‧蓋/內罩艙總成蓋
132‧‧‧基底
136‧‧‧對準銷
140‧‧‧導引凹部
144‧‧‧邊緣
148‧‧‧頂部表面
152‧‧‧側向表面
156‧‧‧突出部
160‧‧‧通孔/孔
164‧‧‧面向上之表面/面向內部之表面/頂部表面
165‧‧‧面向上之表面
168‧‧‧側向表面
170‧‧‧倍縮光罩支撐部件/支撐部件
172‧‧‧窗口
204‧‧‧基底/基底板
208‧‧‧面向下之表面
216‧‧‧薄膜安裝凹部/凹部
220‧‧‧凹部側壁
224‧‧‧底部側壁
225‧‧‧薄膜
226‧‧‧握持區域
228‧‧‧窗口
229‧‧‧窗口
232‧‧‧孔口
233‧‧‧孔口
236‧‧‧透明基板
240‧‧‧窗口安裝凹部/對應窗口安裝凹部
241‧‧‧唇緣
242‧‧‧唇緣
244‧‧‧第一凹部
248‧‧‧第一凹部側壁
252‧‧‧橫向邊緣
256‧‧‧縱向邊緣
260‧‧‧第一底部側壁
264‧‧‧底切部分
268‧‧‧懸伸部
272‧‧‧第二凹部
276‧‧‧第二凹部側壁
280‧‧‧第二底部側壁
284‧‧‧彈簧狀保持部件/窗口保持部件/保持部件/部件
288‧‧‧縱向拱形部分/拱形部分
292‧‧‧第一端部分
294‧‧‧第二端部分
295‧‧‧閉合遠端
297‧‧‧間隙
299‧‧‧遠端
304‧‧‧窗口保持部件
404‧‧‧窗口保持部件
408‧‧‧螺絲
412‧‧‧相對較薄區域/較薄區域
416‧‧‧相對較厚區域/較厚區域
l‧‧‧中心線
100‧‧‧ times refractory container
104‧‧‧Outer hood assembly
108‧‧‧ inner hood assembly
112‧‧‧ center axis
116‧‧‧ doubling mask
120‧‧‧ upper part
124‧‧‧ lower part
128‧‧‧Cover/inner hood assembly cover
132‧‧‧Base
136‧‧‧ alignment pin
140‧‧‧ guiding recess
144‧‧‧ edge
148‧‧‧ top surface
152‧‧‧ lateral surface
156‧‧‧ highlights
160‧‧‧through hole/hole
164‧‧‧Face-facing surface/inward facing surface/top surface
165‧‧‧ face up surface
168‧‧‧ lateral surface
170‧‧‧ times reticle support member / support member
172‧‧‧ window
204‧‧‧Base/Base Plate
208‧‧‧ facing surface
216‧‧‧Film mounting recess/recess
220‧‧‧ recessed side wall
224‧‧‧ bottom side wall
225‧‧‧film
226‧‧‧ Holding area
228‧‧‧ window
229‧‧‧ window
232‧‧‧孔口
233‧‧ ‧ orifice
236‧‧‧Transparent substrate
240‧‧‧Window mounting recess/corresponding window mounting recess
241‧‧‧ lip
242‧‧‧ lips
244‧‧‧ first recess
248‧‧‧First recess side wall
252‧‧‧ lateral edges
256‧‧‧ longitudinal edges
260‧‧‧First bottom side wall
264‧‧‧ undercut
268‧‧‧Overhanging
272‧‧‧Second recess
276‧‧‧Second recess side wall
280‧‧‧Second bottom side wall
284‧‧■Spring-like holding parts/window holding parts/holding parts/parts
288‧‧‧Longitudinal arched/arched section
292‧‧‧ first end
294‧‧‧ second end
295‧‧‧Closed distal end
297‧‧‧ gap
299‧‧‧Remote
304‧‧‧Window holding parts
404‧‧‧Window holding parts
408‧‧‧ screws
412‧‧‧ relatively thin areas/thin areas
416‧‧‧ relatively thick area/thicker area
L‧‧‧ center line
可考量各種說明性實施例之以下說明結合附圖來更完全地理解本發明。 圖1繪示先前技術之一倍縮光罩容器。 圖2繪示根據本發明之一或多項實施例之用於一倍縮光罩容器之一內罩艙總成之一基底之一頂部透視圖。 圖3繪示根據本發明之一或多項實施例之用於包含一薄膜及一倍縮光罩之一內罩艙總成之一基底之一分解透視圖。 圖4繪示根據本發明之一或多項實施例之用於一倍縮光罩容器之一內罩艙總成之一基底之一底部透視圖。 圖5繪示根據本發明之一或多項實施例之包含一透明基板及一窗口保持部件之一窗口安裝凹部之一剖面圖。 圖6繪示根據本發明之一或多項實施例之包含一透明基板及一窗口保持部件之一窗口安裝凹部之一剖面圖。 圖7繪示根據本發明之一或多項實施例之包含一透明基板及一窗口保持部件之一窗口安裝凹部之一剖面圖。 圖8繪示根據本發明之一或多項實施例之包含一透明基板及一窗口保持部件之一窗口安裝凹部之一剖面圖。 圖9繪示根據本發明之一或多項實施例之一保持部件之一分離圖。 圖10繪示圖9之保持部件之一側視圖。 雖然本發明之實施例服從各種修改及替代形式，但已在圖式中以實例方式展示本發明之細節且將詳細闡述該等細節。然而，應理解，本發明並不將揭示內容限於所闡述之特定實施例。相反，本發明將涵蓋歸屬於本發明之精神及範疇內之所有修改、等效形式及替代方案。The invention will be more fully understood from the following description of exemplary embodiments. 1 illustrates a reticle container of the prior art. 2 illustrates a top perspective view of one of the substrates of one of the inner shroud assemblies for a double-folding hood container in accordance with one or more embodiments of the present invention. 3 is an exploded perspective view of a substrate for an inner hood assembly including a film and a double refractory cover in accordance with one or more embodiments of the present invention. 4 is a bottom perspective view of one of the bases of one of the inner shroud assemblies for a double refractory container in accordance with one or more embodiments of the present invention. 5 is a cross-sectional view of a window mounting recess including a transparent substrate and a window holding member in accordance with one or more embodiments of the present invention. 6 is a cross-sectional view of a window mounting recess including a transparent substrate and a window holding member in accordance with one or more embodiments of the present invention. 7 is a cross-sectional view of a window mounting recess including a transparent substrate and a window holding member in accordance with one or more embodiments of the present invention. 8 is a cross-sectional view of a window mounting recess including a transparent substrate and a window holding member in accordance with one or more embodiments of the present invention. Figure 9 illustrates a separation diagram of one of the retaining members in accordance with one or more embodiments of the present invention. Figure 10 is a side elevational view of the retaining member of Figure 9. The details of the present invention are shown by way of example, and the details However, it is understood that the invention is not to be limited to the particular embodiments disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives.
140‧‧‧導引凹部 140‧‧‧ guiding recess
165‧‧‧面向上之表面 165‧‧‧ face up surface
168‧‧‧側向表面 168‧‧‧ lateral surface
170‧‧‧倍縮光罩支撐部件/支撐部件 170‧‧‧ times reticle support member / support member
204‧‧‧基底/基底板 204‧‧‧Base/Base Plate
216‧‧‧薄膜安裝凹部/凹部 216‧‧‧Film mounting recess/recess
220‧‧‧凹部側壁 220‧‧‧ recessed side wall
224‧‧‧底部側壁 224‧‧‧ bottom side wall
226‧‧‧握持區域 226‧‧‧ Holding area
228‧‧‧窗口 228‧‧‧ window
229‧‧‧窗口 229‧‧‧ window
232‧‧‧孔口 232‧‧‧孔口
233‧‧‧孔口 233‧‧ ‧ orifice
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662319120P | 2016-04-06 | 2016-04-06 | |
| US62/319,120 | 2016-04-06 |
Publications (2)
| Publication Number | Publication Date |
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| TW201742799A true TW201742799A (en) | 2017-12-16 |
| TWI742065B TWI742065B (en) | 2021-10-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106111525A TWI742065B (en) | 2016-04-06 | 2017-04-06 | Substrate container with window retention spring and method for placing transparent substrate into substrate container |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10593577B2 (en) |
| KR (1) | KR102164153B1 (en) |
| TW (1) | TWI742065B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730423B (en) * | 2019-09-24 | 2021-06-11 | 美商微相科技股份有限公司 | Mask box structure |
| TWI781703B (en) * | 2018-10-29 | 2022-10-21 | 家登精密工業股份有限公司 | Reticle accommodating system and method of reticle observation provided in the reticle accommodating system |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI666510B (en) * | 2017-01-25 | 2019-07-21 | 家登精密工業股份有限公司 | Euv reticle pod |
| KR102398973B1 (en) * | 2017-07-21 | 2022-05-17 | 엔테그리스, 아이엔씨. | Container for holding and transporting a reticle having a transparent window assembly |
| TWI690771B (en) * | 2018-01-11 | 2020-04-11 | 家登精密工業股份有限公司 | Reticle pressing unit and euv reticle pod using same |
| EP4042242A4 (en) * | 2019-10-10 | 2023-11-08 | Entegris, Inc. | Reticle pod with window |
| US20210300635A1 (en) * | 2020-03-24 | 2021-09-30 | Gudeng Precision Industrial Co., Ltd | Container system |
| WO2021211955A1 (en) * | 2020-04-17 | 2021-10-21 | Entegris, Inc. | Reticle pod having coated sensor zones |
| US12087605B2 (en) * | 2020-09-30 | 2024-09-10 | Gudeng Precision Industrial Co., Ltd. | Reticle pod with antistatic capability |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US648523A (en) * | 1899-12-26 | 1900-05-01 | Norman E Pierce | Picture-frame clamp. |
| DE7736004U1 (en) * | 1977-11-24 | 1978-02-23 | Becker & Hach, 3440 Eschwege | Frameless holder for pictures |
| IT1106659B (en) * | 1978-05-23 | 1985-11-18 | Pico Glass Snc Di Beatrice | COMPLEX OF TWO ELEMENTS FOR THE CONSTRUCTION OF FRAMES |
| IT8822176A0 (en) * | 1988-10-04 | 1988-10-04 | Pico Glass Spa | PANEL SUITABLE TO BE APPLIED TO THE REAR OF A FRAME FOR LOCKING THE IMAGE AND ITS PROTECTION PLANE |
| US5590787A (en) * | 1995-01-04 | 1997-01-07 | Micron Technology, Inc. | UV light sensitive die-pac for securing semiconductor dies during transport |
| US5659990A (en) * | 1995-03-17 | 1997-08-26 | Henneman; Barbara | Retainer for art frame |
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
| EP1625083A4 (en) * | 2003-05-22 | 2007-04-25 | Physical Systems | Cable tie |
| US7607543B2 (en) | 2005-02-27 | 2009-10-27 | Entegris, Inc. | Reticle pod with isolation system |
| JP2006303246A (en) * | 2005-04-21 | 2006-11-02 | Miraial Kk | Sheet storing container |
| KR101442451B1 (en) * | 2005-09-27 | 2014-09-22 | 엔테그리스, 아이엔씨. | Reticle Pod |
| TWI414464B (en) * | 2011-01-11 | 2013-11-11 | Gudeng Prec Ind Co Ltd | Euv pod with fixed apparatus |
| WO2014062956A1 (en) * | 2012-10-19 | 2014-04-24 | Entegris, Inc. | Reticle pod with cover to baseplate alignment system |
| TWM469290U (en) * | 2013-06-24 | 2014-01-01 | Coretec Materials Company Ltd | Structure of photomask storage box |
| WO2015066484A1 (en) | 2013-10-31 | 2015-05-07 | Entegris, Inc. | A modular reticle pod system |
-
2017
- 2017-04-06 KR KR1020170044685A patent/KR102164153B1/en active IP Right Grant
- 2017-04-06 TW TW106111525A patent/TWI742065B/en active
- 2017-04-06 US US15/480,736 patent/US10593577B2/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI781703B (en) * | 2018-10-29 | 2022-10-21 | 家登精密工業股份有限公司 | Reticle accommodating system and method of reticle observation provided in the reticle accommodating system |
| TWI730423B (en) * | 2019-09-24 | 2021-06-11 | 美商微相科技股份有限公司 | Mask box structure |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170294326A1 (en) | 2017-10-12 |
| US10593577B2 (en) | 2020-03-17 |
| KR20170114995A (en) | 2017-10-16 |
| TWI742065B (en) | 2021-10-11 |
| KR102164153B1 (en) | 2020-10-12 |
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