TW201736934A - Split array camera module and its assembly and application method wherein the split array camera module comprises a plurality of sub-modules and an assembly bracket - Google Patents

Abstract

A split array camera module and a method of assembling the same are disclosed. The module comprises a plurality of sub-modules and an assembly bracket. One of the plurality of sub-modules is a reference module, and the remaining sub-modules are calibration modules. The reference module and each calibration module are respectively assembled in the assembly bracket. The reference module and each calibration module are each an independent and qualified single camera module.

Description

Split array camera module and assembly and application method thereof

The invention relates to a camera module, in particular to a split array camera module, which is suitable for a mobile terminal, so as to improve production efficiency and yield, and particularly improve resource utilization.

With the development of technology, smart portable devices can be said to be an indispensable tool for people in modern times. Among them, a mobile phone or a tablet computer is a very common situation.

In particular, due to advances in technology, the quality of the camera functions in the smart portable device has been continuously improved, so people gradually use the camera in the smart portable device to replace the traditional camera to record the habit of life. In particular, under the constant evolution of various hardware specifications, mobile phone cameras have replaced most of the camera market, but professional cameras with large lenses can collect more light information than small-lens mobile phone cameras, so professional cameras The quality of the captured image is in principle superior to that of a small-lens mobile phone camera, but it is also very difficult to apply the lens of a professional camera to a mobile phone that is carried around because of the size, weight and price of the professional camera.

Especially in 2014, with Yulong releasing a smart phone with dual cameras, the camera module entered the era of dual cameras. Therefore, an array camera module can be constructed using a plurality of small lenses to replace the lens of a single cumbersome and expensive professional camera for a smart portable device.

With the development of dual-camera and multi-camera application technology, its advantages are increasingly valued by mobile phone terminal manufacturers or consumer electronics manufacturers, especially for electronic products that can be carried around with mobile phones and digital cameras, and in terms of weight and price. It is also very competitive.

It is worth mentioning that optical zoom has always been the exclusive function of SLR cameras. The mobile phone camera industry has been hoping to transplant the optical zoom function into mobile phones, narrowing the gap between SLR cameras and truly replacing its photo position.

In the process of development of mobile phone camera technology, there have also been cameras with optical zoom function. Most of these cameras use the distance between the lenses to realize the zoom function. The fatal flaw of such cameras is the poor resistance to mechanical stress, which can not be used by the terminal mobile phone manufacturer or Accepted by consumer electronics manufacturers.

However, the zoom function is achieved by the freely switching between different focal length cameras to avoid this biggest problem. The camera lens and lens structure of this type of design is completely different from the ordinary mobile phone camera, so that the function of optical zoom is realized on the mobile phone.

However, the array camera module currently on the market has a problem of low yield during manufacturing, which undoubtedly increases the manufacturing cost of the product, because usually one camera (or lens) in the array camera module is defective. This will result in the scrapping of the entire array camera module, and the technical tolerance and material level of the process completely determine the optical axis angle of multiple cameras.

Because the concept of the array camera module is to use multiple lenses to collect image information, and to process a large amount of information, one of the lenses has optical differences, mechanical positioning errors or Problems such as electronic noise will cause the entire array of camera modules to produce complete and clear images, thus causing waste of process time and cost.

In addition, there are also related products for applying prisms to camera modules. For example, in Chinese patent CN201480051999.0, the mirror tilting actuation is disclosed, in which a plurality of lens groups and mirrors and a base supporting the mirror are provided. .

According to this patent, different pivot-supporting mirrors are used, and the mirrors are controlled by elements such as magnets, FP coils, Hall sensors, and springs to avoid jitter that occurs during use. However, the tilting actuation of such a mirror is complicated, the number of parts is numerous, and the manufacturing and maintenance are complicated.

An object of the present invention is to provide a split-type array camera module and an assembly application method thereof, wherein the single-camera module in the split-type array camera module separately completes the manufacturing, assembly, and testing processes, and does not occupy assembly and testing time. That is to say, the manufacturing, assembly and testing of the single camera module need not be distinguished from the conventional module production form, and no special special process stations are needed to improve production efficiency and make high use of production resources.

Another object of the present invention is to provide a split-type array camera module and an assembly application method thereof, wherein the assembly of the split-type array camera module is further improved after the performance verification of the single camera module is completed. The yield of the finished product of the split array camera module.

Another object of the present invention is to provide a split-type array camera module and an assembly and application method thereof, wherein the method of automatically adjusting the optical axis can solve the problem that the optical axis is not parallel due to the tilt of the optical axis of the process, and is reduced to some extent. The poor proportion in the double-camera and multi-camera depth calibration, and the practical application effect of the common substrate dual-camera and multi-camera modules.

Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein the single camera module uses a conventional lens, and the optical zoom design principle of the single zoom lens is undoubtedly simpler than the optical zoom design principle of the single lens lens. Many, no complicated light path design is required.

Another object of the present invention is to provide a split-type array camera module and a method for assembling the same, wherein a single camera module with different FOVs is used, so that compared with the manufacturing process of the single-lens lens, a single camera module of different FOVs is used. It is relatively simple to group arrays, so the challenge to the manufacturing capabilities of mobile phone camera manufacturers is minimal. Further, the combination of the individual camera modules of different FOVs is the key to realize optical zoom, and the smooth switching between the individual camera modules of different focal lengths realizes the experience of zooming.

Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein a plurality of single camera modules are combined by assembling brackets to improve yield and reliability. In addition, the assembly bracket is made of high hardness and high strength material to ensure that the positional relationship between the individual camera modules is not affected by external forces. In other words, the general dual-camera module is susceptible to changes in parallax caused by external forces during transportation and installation, and most of the optical zoom algorithms developed for dual-camera have strict requirements on the parallax of the dual-camera module. Therefore, the assembly is performed. The bracket can effectively ensure the parallax capability of the split array camera module.

Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein the gyroscope can be placed according to the spatial structure of the actual terminal product. In other words, according to the spatial difference of the installed structure of the mobile phone, the placement position of the gyroscope can be flexibly adjusted.

In order to achieve the above at least one object, the present invention provides a split array camera module, comprising: a plurality of sub-modules, wherein at least one sub-module is a reference module, and the remaining sub-modules are calibration modules; and an assembly The bracket, wherein the reference module and each of the calibration modules are respectively assembled to the assembly bracket, wherein the reference module and each calibration module are respectively independent and qualified single camera modules.

According to an embodiment of the invention, the reference module is a focus adjustable camera module or a fixed focus camera module.

According to an embodiment of the invention, the calibration module is a focus adjustable camera module or a fixed focus camera module.

According to an embodiment of the invention, the assembly bracket has at least one reference unit and at least one calibration unit, wherein the reference module and the calibration module are respectively assembled to the reference unit and the assembly of the assembly bracket The calibration unit.

According to an embodiment of the invention, the module center distance between the calibration module and the reference module is 1-100 mm.

According to an embodiment of the invention, the assembly gap between the reference module and the reference unit is 0.01-1 mm, and the assembly gap between the calibration module and the calibration unit is 0.03-3 mm.

According to an embodiment of the present invention, the reference module further includes at least one reference lens, at least one reference driver and at least one reference photosensitive chip, wherein the reference lens is located in a photosensitive path of the reference photosensitive wafer, the reference A lens is mounted to the reference driver.

According to an embodiment of the invention, the calibration module further includes at least one calibration lens and an at least calibration photosensitive wafer, wherein the calibration lens is located in a photosensitive path of the calibration photosensitive wafer.

According to an embodiment of the invention, the reference module further includes at least one reference base and at least one reference substrate, wherein the reference photosensitive wafer is electrically connected to the reference substrate, and the reference base is disposed on the reference On the substrate, the reference driver is mounted to the reference base.

According to an embodiment of the invention, the calibration module further includes at least one calibration base and at least one calibration substrate, wherein the calibration photosensitive wafer is electrically connected to the calibration substrate. The calibration base is disposed on the calibration substrate.

According to an embodiment of the present invention, the split array camera module includes at least one common base, the reference module further includes at least one reference substrate, and the calibration module further includes at least one calibration substrate, wherein the The reference photosensitive wafer is electrically connected to the reference substrate, and the calibration photosensitive wafer is electrically connected to the calibration substrate, and the common base is disposed on the reference substrate and/or the calibration substrate.

According to an embodiment of the invention, there is included at least one common base and at least one common substrate, wherein the reference photosensitive wafer and the calibration photosensitive wafer are electrically connected to the common substrate, and the common base is disposed on the common On the substrate, the reference driver and the calibration lens are both mounted to the common base.

According to an embodiment of the invention, a gyroscope is disposed in the reference substrate of the reference module.

According to an embodiment of the invention, a gyroscope is included, which is disposed on the calibration substrate of the calibration module.

According to an embodiment of the invention, a gyroscope is included, which is electrically connected to the reference module and disposed on the common substrate.

According to an embodiment of the invention, a gyroscope is disposed on the common substrate electrically connected to the calibration module.

According to an embodiment of the invention, wherein the reference driver is selected from the group consisting of a motor, a thermal drive or a microactuator.

According to an embodiment of the invention, the calibration module may further include a calibration driver, wherein the calibration lens is supported above the calibration driver.

According to an embodiment of the invention, wherein the reference module is implemented as a large angle of view lens, the FOV is generally between 60° and 220°, and the calibration module is implemented as a small angle of view lens, and the FOV is generally Between 10 ° ~ 90 °. In order to achieve the above at least one object, the present invention provides a remote array camera module, comprising: at least one first camera module, at least one prism module, at least one second camera module, and at least one circuit board, wherein The first camera module and the prism module are disposed in a plane, the prism module is disposed concentrically with the optical axis of the second camera module, and the circuit board is connected to the second camera module.

According to an embodiment of the invention, the prism module comprises a prism unit and a prism base, and the prism unit is rotatably supported in the prism base.

According to an embodiment of the invention, the second camera module includes at least one second lens, at least one second photosensitive wafer, and at least one second substrate, wherein the second lens is located at the second photosensitive a photosensitive path of the wafer, the second photosensitive wafer being electrically connected to the second substrate.

According to an embodiment of the invention, the second camera module includes at least one second driver, wherein the second lens is mounted to the second driver.

According to an embodiment of the invention, the second camera module includes an imaging housing, an anti-shake unit and a support housing, wherein the imaging housing, the second driver, the anti-shake unit, and the The support shells are arranged coaxially to each other.

According to an embodiment of the present invention, the first camera module includes at least one first lens, at least one first photosensitive wafer, and at least one first substrate, wherein the lens is located in a photosensitive path of the photosensitive wafer, The photosensitive wafer is electrically connected to the substrate.

According to an embodiment of the invention, the first camera module includes at least one first driver, wherein the first lens is mounted to the first driver.

According to an embodiment of the invention, the prism unit mainly comprises a prism housing, a prism, a prism holder, a support sleeve and a support shaft, and the prism is fixedly disposed in the prism holder, the support A sleeve is fixedly mounted on a lower portion of the prism holder, and the support shaft is rotatably mounted in the support sleeve, and the prism holder is disposed in the prism housing.

According to an embodiment of the invention, glue is applied between the prism holder and the prism to bond to each other.

According to an embodiment of the present invention, the prism housing has a rectangular frame and has a bottom frame and two side frames. One end of each of the two side frames is fixedly connected to the bottom frame, and the other end is outward. An extended free end is provided with a connecting beam between the two free ends.

According to an embodiment of the invention, the prism base has a first camera module receiving cavity and a prism module receiving cavity, wherein the first camera module is received in the first camera module receiving cavity. The prism unit is housed in a prism module receiving cavity.

According to an embodiment of the invention, wherein the prism base comprises an intermediate reinforcing plate extending through the prism base along a length perpendicular to the prism base and over the entire width thereof.

According to an embodiment of the present invention, a sidewall of the first camera module accommodating cavity has a first opening for applying a power/signal line of the first camera module, wherein the prism module The side wall of the receiving chamber has a second opening for applying an opening for controlling the power/control signal line of the prism.

According to an embodiment of the invention, one side of the prism module receiving cavity is provided with a connecting wall, and at least one positioning post or positioning hole is disposed on the surface for precise positioning with the second camera module. Connection.

According to an embodiment of the present invention, the image pickup casing has a casing portion surrounding a hollow rectangular column, a front panel fixedly coupled to one end of the casing portion, and two recesses formed on a side surface of the casing portion Two connections.

According to an embodiment of the invention, the imaging housing includes an optical axis opening and at least one positioning hole or positioning post, wherein the optical axis opening is disposed at a center of the front panel, the positioning hole or the positioning post It is disposed on the front panel.

According to an embodiment of the invention, the positioning post is located in the positioning hole, and the free end and the connecting portion cooperate with each other and are fixedly connected to each other.

According to an embodiment of the invention, the first camera module is a wide-angle camera module, the second camera module is a zoom camera module, and the optical axis of the first camera module is opposite to the second The optical axes of the camera modules are perpendicular to each other.

In order to achieve the above at least one object, the present invention provides a method for assembling a split-type array camera module, which includes the following steps: (S11) at least one reference module of a split-type array camera module is assembled and fixed, that is, the reference mode The assembly is assembled and fixed in a reference unit of an assembly bracket; (S12) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled to a calibration unit of the assembly bracket (S13) module height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module; (S14) module offset Calibrating, measuring the level position offset of each calibration module and the reference module, and performing corresponding level offset position calibration on the calibration module; (S15) module rotation calibration, setting a light source and a standard a board, illuminating the split array camera module, capturing and capturing an image of the target board, calculating the image according to the reference module and the image collected by each calibration module, using the software to calculate the Rotating the calibration amount of the calibration module, and performing rotational position calibration on each of the calibration modules; (S16) module offset inspection/calibration, determining the level of each calibration module and the reference module Whether the position offset is within the tolerance range, if it is not calibrated within the tolerance range, if it is not within the tolerance range, returning to the step (S13), the height calibration, offset calibration and rotation calibration of each calibration module are performed again until The level position offset of each calibration module and the reference module is within the tolerance range; and (S17) the fixed module fixes the entire split array camera module to complete assembly.

According to an embodiment of the present invention, the split-type array camera module includes one or more sub-modules, wherein at least one sub-module is the reference module, and the remaining sub-modules are the calibration module. The sub-modules are independent of each other and assembled to the assembly bracket.

According to an embodiment of the invention, the reference module selects a sub-module with the highest picture element in the split-type array camera module.

According to an embodiment of the invention, the reference module and the calibration module are both single-camera modules that have been manufactured, assembled, and tested for performance.

According to an embodiment of the invention, the assembly gap between the reference module and the reference unit is 0.01-1 mm, and the assembly gap between the calibration module and the calibration unit is 0.01-3 mm.

According to an embodiment of the present invention, in the step (S11), the step of assembling and fixing the reference module further includes: 1) performing a limit element on the reference module and the reference unit by using a limit fixture Assembly; and 2) drawing glue between the reference module and the reference unit to cure the glue. According to an embodiment of the invention, wherein the glue is a UV thermoset, the glue is cured by ultraviolet exposure.

According to an embodiment of the invention, in the step (S13), the module height calibration specifically includes: 1) measuring a height of a point on the lens end surface of the reference module and each calibration module, Calculating a difference between a height of a lens end face of each of the calibration modules and the reference module; and 2) adjusting a Z-axis displacement of each of the calibration modules.

According to an embodiment of the invention, in the step (S14), the module offset calibration specifically includes: 1) photographing the reference module and the lens end surface of each calibration module, and capturing the lens The end face image is used to calculate the level position offset of each calibration module and the reference module by using software; and 2) adjusting the X and Y axis displacements of each calibration module.

According to an embodiment of the invention, in the step (S15), the center of the target is an MTF test target, and the four corners of the target contain four Mark points.

According to an embodiment of the invention, in step (S15), the rotation calibration of each calibration module is implemented by three spatial dimensions of U, V, W, in order to make each calibration The module is parallel to the optical axis of the reference module.

According to an embodiment of the present invention, in the step (S12), the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module and the assembly bracket to a module calibration platform. In a fixture, the reference module is placed in a reference unit of the assembly bracket; 2) the calibration module is mounted and fixed to a calibration fixture, and the calibration fixture is disposed on a six-axis platform The calibration module is placed in the calibration unit of the assembly bracket, and the calibration module can perform six spatial dimensions of X, Y, Z, U, V, and W along the six-axis platform; And 3) drawing glue between the calibration module and the calibration unit, the glue being a UV thermosetting glue.

According to an embodiment of the present invention, in the step (S17), the step of fixing the split-type array camera module specifically includes: 1) performing ultraviolet exposure on the glue between the calibration module and the calibration unit The glue is semi-cured; and 2) baking the split array camera module, the glue is completely cured, and the entire split array camera module is fixed.

According to an embodiment of the present invention, in the step (S12), the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module and the assembly bracket to a module calibration platform. The reference module is placed in the reference unit of the assembly bracket; and 2) the calibration module is mounted and fixed to the calibration fixture, and the calibration fixture is disposed on the six-axis platform The calibration module is placed in a calibration unit of the assembly bracket, and the calibration module can perform movements of six spatial dimensions of X, Y, Z, U, V, and W along the six-axis platform.

According to an embodiment of the invention, the step of fixing the split array camera module in the step (S17) specifically includes: 1) drawing glue between the calibration module and the calibration unit, the glue a UV thermosetting glue; 2) UV exposure of the glue between the calibration module and the calibration unit, the glue is semi-cured; and 3) baking the split array camera module, The glue is completely cured to fix the entire split array camera module.

According to an embodiment of the invention, the baking array camera module has a baking temperature of 50 ° C to 200 ° C in the oven and a baking time of 5 min to 600 min.

In order to achieve the above at least one object, the present invention provides a method for assembling a split array camera module, which includes the following steps: (S11A) A reference module of a split array camera module is assembled and fixed, that is, the reference module Assembled and fixed in a reference unit of an assembly bracket; (S12A) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket (S13A) module height/offset calibration, measuring the lens end height difference and the level position offset of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module And corresponding level offset position calibration; (S14A) module rotation calibration, setting a light source and a target board, illuminating the split array camera module, and capturing and capturing images on the target board, according to the The reference module and the image acquired by each calibration module are used to calculate a rotation calibration amount of each calibration module by using a software, and perform rotational position calibration on each calibration module; And (S15A) fixed module, fixing the split entire array camera module, complete the assembly.

In order to achieve the above at least one object, the present invention provides a method for assembling a split array camera module, which includes the following steps: (S11B) A reference module of a split array camera module is assembled and fixed, that is, the reference module Assembly and fixing in a reference unit of an assembly bracket; (S12B) pre-assembling at least one calibration module of a split-type array camera module, that is, pre-assembling the calibration module into a calibration unit of the assembly bracket (S13B) module offset calibration, measuring the level position offset of each calibration module and the reference module, and performing corresponding level offset position calibration on the calibration module; (S14B) module height Calibrating, measuring the height difference between the lens end face of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module; (S15B) module rotation calibration, setting a light source and a target plate Illuminating the split-type array camera module, capturing and capturing an image of the target board, calculating the image according to the reference module and the image acquired by each calibration module, using the software to calculate the The calibration calibration amount of the calibration module is performed, and the rotation position calibration is performed on each calibration module; and (S16B) the fixed module fixes the entire split array camera module to complete the assembly.

In order to achieve the above at least one object, the present invention provides a method for assembling a split-type array camera module, which includes the following steps: (S21) A reference module of a split-type array camera module is assembled and fixed, that is, the reference module Assembly and fixing in a reference unit of an assembly bracket; (S22) pre-assembling at least one calibration module of a split-type array camera module, that is, pre-assembling the calibration module into a calibration unit of the assembly bracket (S23) module height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module; (S24) module offset calibration Measuring a level position offset of each calibration module and the reference module, and performing corresponding level offset position calibration on the calibration module; (S25) module rotation calibration, setting a light source and a target board Illuminating the split-type array camera module, capturing and capturing an image of the target board, calculating the image according to the reference module and the image acquired by each calibration module, using the software to calculate the One Rotating the calibration amount of the quasi-module, and performing rotational position calibration on each of the calibration modules; (S26) module offset calibration, measuring the level position offset of each calibration module and the reference module, Performing a corresponding level offset position calibration on the calibration module; and (S27) fixing the module to fix the entire split array camera module to complete assembly.

According to an embodiment of the present invention, the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module, and the remaining sub-modules are the calibration module. The sub-modules are independent of each other and assembled to the assembly bracket.

According to an embodiment of the invention, the reference module and the calibration module are both single-camera modules that have been manufactured, assembled, and tested for performance.

According to an embodiment of the invention, the reference module and the calibration module are respectively a focus adjustable camera module or a fixed focus camera module.

According to an embodiment of the invention, the reference module is a focus adjustable camera module, and the calibration module is a fixed focus camera module.

According to an embodiment of the invention, the assembly gap between the reference module and the reference unit is 0.01-1 mm, and the assembly gap between the calibration module and the calibration unit is 0.01-3 mm.

According to an embodiment of the invention, the step of assembling and fixing the reference module further comprises: 1) performing a limit unit assembly on the reference module and the reference unit by using a limit fixture; and 2) Glue is drawn between the reference module and the reference unit to cure the glue.

According to an embodiment of the invention, wherein the glue is a UV thermoset, the glue is cured by ultraviolet exposure.

According to an embodiment of the invention, the module height calibration specifically includes: 1) measuring, by a laser ranging method, the height of a point on the lens end surface of the reference module and each calibration module Calculating a difference in height of a lens end face of each of the calibration module and the reference module; and 2) adjusting a Z-axis displacement of each of the calibration modules by the six-axis platform.

According to an embodiment of the invention, the module offset calibration specifically includes: 1) performing CCD shooting on the lens end surface of the reference module and each calibration module, and capturing an image of the lens end face, The software respectively calculates the level position offset of each of the calibration modules and the reference module; and 2) adjusts the X and Y axis displacements of each of the calibration modules by the six-axis platform.

According to an embodiment of the invention, wherein the target center is an MTF test target, the target contains 2-20 Mark points.

According to an embodiment of the invention, the rotation calibration of each calibration module is implemented by the movement of the six-axis platform in three spatial dimensions of U, V, and W, in order to make each calibration mode The group is parallel to the optical axis of the reference module.

According to an embodiment of the present invention, the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module and the assembly bracket to a fixed fixture of a module calibration platform, The reference module is placed in a reference unit of the assembly bracket; 2) the calibration module is mounted and fixed to a calibration fixture, and the calibration fixture is disposed on a six-axis platform, the calibration mold The group is placed in a calibration unit of the assembly bracket, and the calibration module can perform movements of six spatial dimensions of X, Y, Z, U, V, W with the six-axis platform; and 3) A glue is drawn between the calibration module and the calibration unit, and the glue is a UV thermosetting glue.

According to an embodiment of the invention, the step of fixing the split array camera module specifically includes: 1) performing ultraviolet exposure on the glue between the calibration module and the calibration unit, the glue being semi-cured And 2) baking the split array camera module, the glue is completely cured, and the entire split array camera module is fixed.

According to an embodiment of the present invention, the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module and the assembly bracket to a fixed fixture of a module calibration platform, The reference module is placed in a reference unit of the assembly bracket; and 2) the calibration module is mounted and fixed to a calibration fixture, the calibration fixture is disposed on a six-axis platform, the calibration The module is placed in a calibration unit of the assembly bracket, and the calibration module can perform movements of six spatial dimensions of X, Y, Z, U, V, and W along the six-axis platform.

According to an embodiment of the present invention, the step of fixing the split-type array camera module specifically includes: 1) drawing glue between the calibration module and the calibration unit, the glue being a UV thermosetting glue; 2) performing ultraviolet exposure on the glue between the calibration module and the calibration unit, the glue is semi-cured; and 3) baking the split array camera module, the glue is completely cured and fixed The entire split array camera module.

According to an embodiment of the invention, the baking array camera module has a baking temperature of 50 ° C to 200 ° C in the oven and a baking time of 5 min to 600 min.

The following description is presented to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.

It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "level", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is merely for the convenience of describing the present invention and The above description of the invention is not to be construed as a limitation of the invention.

It will be understood that the term "a" is understood to mean "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term "a" cannot be construed as limiting the quantity.

As shown in FIG. 1 to FIG. 3, a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module is qualified after being assembled and assembled independently. The camera module finished assembly is integrated on the same bracket to form a new array camera module. Thus, the split array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.

According to the preferred embodiment of the present invention, the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The reference module 1 is implemented as a focus adjustable camera module such as a 13M adjustable focus camera module. The calibration module 2 is implemented as a fixed focus camera module such as a 2M fixed focus camera module. The reference module 1 and the calibration module 2 are respectively a single camera module that has completed manufacturing, assembly, and performance testing. It can be understood that the single camera module can also be a focus adjustable camera module, or both can be fixed focus camera modules, or one is a focus camera module, and the other is a fixed focus camera module. In this embodiment, the split array camera module includes a 13M adjustable focus camera module as the reference module 1 and a 2M fixed focus camera module as the calibration module 2, The reference module 1 and the calibration module 2 are independent of the single camera module.

As shown in FIG. 1 and FIG. 2, the split array camera module further includes an assembly bracket 10 having a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively. In other words, the reference module 1 is assembled to the reference bracket unit 101 of the assembly bracket 10, and the calibration module 2 is assembled to the calibration bracket unit 102 of the same assembly bracket 10. That is to say, the reference module 1 and the calibration module 2 are assembled in the same assembly bracket. In addition, in order to ensure the imaging quality of the dual camera module, it is necessary to strictly ensure the height, the optical axis spacing, and the optical axis parallelism of the reference module 1 and the calibration module 2, and thus the reference module 1 and The calibration module 2 has strict requirements on the assembly position of the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10. In addition, the assembly bracket 10 is made of high-hardness metal and non-metal materials, wherein the material of the assembly bracket 10 is required to be deformed by temperature and humidity changes for fixing the reference module 1 and the The spatial position between the calibration modules 2 is described.

In this embodiment, the module center distance between the calibration module 2 and the reference module 1 is 10.5 mm. The assembly gap between the reference module 1 and the reference bracket unit 101 is 0.1 mm, and the assembly gap between the calibration module 2 and the calibration bracket unit 102 is 0.3 mm.

As shown in FIG. 3, the reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, a reference base 14 and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the reference substrate 15. The reference base 14 is disposed on the reference substrate 15 . The reference driver 12 is mounted to the reference chassis 14, and the reference lens 11 is mounted to the reference driver 12 such that the reference lens 11 is supported above the reference substrate 15. The reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

In addition, it is worth mentioning that the reference base 14 may be separately disposed on the reference substrate 15 or may be formed on the reference substrate 15 via a molding process, wherein the connection is integrally packaged by a molding process. In the reference substrate 15, wherein the molding process may be a process such as injection molding or molding. In addition, the reference base 14 surrounds the outside of the reference photosensitive wafer 13 and forms a through hole to provide a light path of the reference lens 11 and the reference photosensitive wafer 13. In addition, the reference photosensitive wafer 13 may be mounted to the reference substrate 15 in a forward or reversed manner, which is not a limitation of the present invention.

The calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration base 24 is disposed on the calibration substrate 25. The calibration lens 21 is supported above the calibration base 24. The calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can further include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, the calibration lens 21 is mounted to the calibration base 24 such that the calibration lens 21 is supported above the calibration substrate 25. It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like. In addition, the resolutions of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 are close to each other to ensure image image quality.

In addition, it is worth mentioning that the calibration base 24 may be separately disposed on the calibration substrate 25 or may be formed on the calibration substrate 25 via a molding process, wherein the connection is integrally packaged by a molding process. In the calibration substrate 25, wherein the molding process may be a process such as injection molding or molding. In addition, the calibration base 24 surrounds the outside of the calibration photosensitive wafer 23 and forms a through hole to provide a light path for the calibration lens 21 and the calibration photosensitive wafer 23. In addition, the calibration photosensitive wafer 23 may be mounted on the calibration substrate 25 in a positive or flip-chip manner, which is not a limitation of the present invention.

In addition, the reference module 1 and the calibration module 2 adopt different FOV lens designs. In other words, the reference module 1 is implemented as a large field of view lens, and its FOV is generally between 75° and 120°. The calibration module 2 is implemented as a small angle of view lens, and its FOV is generally between 20° and 50 degrees. ° between. In particular, the reference module 1 and the calibration module 2 are both implemented as zoom camera modules, and the zooming capability ranges from 2 times to 6 times. That is to say, the image magnification is not reduced by the algorithm synthesis, and the magnification is different from 2 to 6 times according to the matching. In addition, according to actual needs, an OIS or AF focus motor can be used for the small angle of view lens and the large angle of view lens, respectively, which is not a limitation of the present invention. It can be understood that an OIS or AF focusing function is additionally added to the single camera module to increase the quality of the optical zoom image. In other words, the OIS or AF focus function can be selectively used in the small angle of view lens and the large angle of view lens to enhance the optical zoom photographing effect.

In addition, those skilled in the art should understand that the split-type array camera module can be implemented as more than one dual camera module, that is, a combination of multiple cameras can be performed as needed, and the focus is on the respective qualified ones. The single camera module is assembled to the assembly bracket 10. In other words, the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, and the sub-module They are independent of each other and assembled to the assembly bracket 10.

As shown in FIG. 4, it is a first modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.

The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.

The reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted to the reference driver 12. The reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21, a calibration photosensitive wafer 23, and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed In the case of the focus camera module, the reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner. The calibration photosensitive wafer 23 may be mounted on the calibration substrate 25 in a front or a flip-chip manner. This is a limitation of the invention.

As shown in FIG. 5, it is a second modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20 and a common substrate 30. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.

The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.

The reference module 1 further includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted to the reference driver 12. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the common substrate 30. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the common substrate 30 or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process. The common substrate 30, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the common substrate 30 in a positive or negative manner. The calibration photosensitive wafer 23 may be mounted on the common substrate 30 in a front or a flip-chip manner. This is a limitation of the invention.

As shown in FIG. 6 , a third modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40 disposed on The reference module 1. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.

The reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, a reference base 14 and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the reference substrate 15. The reference base 14 is disposed on the reference substrate 15 . The reference driver 12 is mounted to the reference chassis 14, and the reference lens 11 is mounted to the reference driver 12 such that the reference lens 11 is supported above the reference substrate 15. The reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15 . The reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.

In addition, it is worth mentioning that the reference base 14 may be separately disposed on the reference substrate 15 or may be formed on the reference substrate 15 via a molding process, wherein the connection is integrally packaged by a molding process. In the reference substrate 15, wherein the molding process may be a process such as injection molding or molding. In addition, the reference base 14 surrounds the outside of the reference photosensitive wafer 13 and forms a through hole to provide a light path of the reference lens 11 and the reference photosensitive wafer 13. In addition, the reference photosensitive wafer 13 may be mounted to the reference substrate 15 in a forward or reversed manner, which is not a limitation of the present invention.

As shown in FIG. 7 , a fourth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40 disposed on The calibration module 2. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.

The calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration base 24 is disposed on the calibration substrate 25. The calibration lens 21 is supported above the calibration base 24. The calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can further include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, the calibration lens 21 is mounted to the calibration base 24 such that the calibration lens 21 is supported above the calibration substrate 25. It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25. The calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

In addition, it is worth mentioning that the calibration base 24 may be separately disposed on the calibration substrate 25 or may be formed on the calibration substrate 25 via a molding process, wherein the connection is integrally packaged by a molding process. In the calibration substrate 25, wherein the molding process may be a process such as injection molding or molding. In addition, the calibration base 24 surrounds the outside of the calibration photosensitive wafer 23 and forms a through hole to provide a light path for the calibration lens 21 and the calibration photosensitive wafer 23. In addition, the calibration photosensitive wafer 23 may be mounted on the calibration substrate 25 in a positive or flip-chip manner, which is not a limitation of the present invention.

As shown in FIG. 8, a fifth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40. The split array camera module includes an assembly bracket 10 and a common base 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The gyroscope 40 is disposed on the reference module 1 .

The reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted to the reference driver 12. The reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15 . The reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21, a calibration photosensitive wafer 23, and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed In the case of the focus camera module, the reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner. The calibration photosensitive wafer 23 may be mounted on the calibration substrate 25 in a front or a flip-chip manner. This is a limitation of the invention.

As shown in FIG. 9, a sixth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40. The split array camera module includes an assembly bracket 10 and a common base 20. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The gyroscope 40 is disposed on the calibration module 2 .

The reference module 1 further includes a reference lens 11, a reference driver 12, a reference photosensitive chip 13, and a reference substrate 15. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the reference substrate 15. The reference lens 11 is mounted to the reference driver 12. The reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21, a calibration photosensitive wafer 23, and a calibration substrate 25. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the calibration substrate 25. The calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25. The calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed In the case of the focus camera module, the reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner. The calibration photosensitive wafer 23 may be mounted on the calibration substrate 25 in a front or a flip-chip manner. This is a limitation of the invention.

As shown in FIG. 10, it is a seventh modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20, a common substrate 30 and a gyroscope 40. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively. The gyroscope 40 is disposed on the common substrate 30.

The reference module 1 further includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted to the reference driver 12. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is electrically connected to the reference module 1 and disposed on the common substrate 30. The reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the common substrate 30. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the common substrate 30, or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process. Connected to the common substrate 30, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the common substrate 30 in a positive or negative manner. The calibration photosensitive wafer 23 may be mounted on the common substrate 30 in a front or a flip-chip manner. This is a limitation of the invention.

As shown in FIG. 11 , it is an eighth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20, a common substrate 30 and a gyroscope 40. The split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2. The assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively. The gyroscope 40 is electrically connected to the calibration module 2 and disposed on the common substrate 30.

The reference module 1 further includes a reference lens 11, a reference driver 12 and a reference photosensitive chip 13. The reference lens 11 is located on the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive wafer 13 to be suitable for photoelectric conversion. The reference photosensitive wafer 13 is electrically connected to the common substrate 30. The reference lens 11 is mounted to the reference driver 12. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

The calibration module 2 further includes a calibration lens 21 and a calibration photosensitive chip 23. The calibration lens 21 is located on the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibrated photosensitive wafer 23 to be suitable for photoelectric conversion. The calibration photosensitive wafer 23 is electrically connected to the common substrate 30. The common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module. Therefore, the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the gyroscope 40 is electrically connected to the calibration module 2 and disposed on the common substrate 30. The calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

It is to be noted that the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.

In addition, it is worth mentioning that the common base 20 may be separately disposed on the common substrate 30 or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process. The common substrate 30, wherein the molding process may be a process such as injection molding or molding. In addition, the common base 20 surrounds the outside of the reference photosensitive wafer 13 and the calibration photosensitive wafer 23 and respectively form a through hole to provide a light path of the reference photosensitive wafer 13 and the alignment photosensitive wafer 23. In addition, the reference photosensitive wafer 13 may be mounted on the common substrate 30 in a positive or negative manner. The calibration photosensitive wafer 23 may be mounted on the common substrate 30 in a front or a flip-chip manner. This is a limitation of the invention.

In this preferred embodiment of the present invention, as shown in FIG. 12, a method for assembling a first split-type array camera module according to a first preferred embodiment of the present invention includes the following steps: (S11) A split array camera module A reference module 1 of the group is assembled and fixed, that is, the reference module 1 is assembled and fixed in a reference unit 101 of the assembly bracket 10; (S12) at least one calibration module 2 of a split array camera module is pre- Assembly, that is, pre-assembling the calibration module 2 into a calibration unit 102 of the assembly bracket 10; (S13) module height calibration, measuring the lens of each calibration module 2 and the reference module 1 Corresponding height difference, corresponding height position calibration for each calibration module 2; (S14) module offset calibration, measuring the horizontal position offset of each calibration module 2 and the reference module 1 a quantity level calibration for each calibration module 2; (S15) module rotation calibration, setting a light source and a target plate, illuminating the split array camera module, The target image is captured and captured, according to the reference module 1 and the Calculating the image acquired by each calibration module 2, calculating the rotation calibration amount of each calibration module 2 by using software, and performing rotational position calibration on the calibration module 2; (S16) module offset Checking/calibrating, determining whether the level position offset of each calibration module 2 and the reference module 1 is within a tolerance tolerance range, if not within the tolerance range, if not within the tolerance range, returning to the step (S13) Re-balancing, offset calibration, and rotational calibration of each calibration module 2 until the level position offset of each calibration module 2 and the reference module 1 is within the tolerance range And (S17) a fixed module that fixes the entire split array camera module to complete assembly.

It is worth mentioning that the order between the step (S13) and the step (S14) is not fixed and can be interchanged. That is to say, if necessary, the step (S13) may be performed first (S14), or the step (S4) may be performed first (S13), wherein the assembly method of the bulk array camera module is not affected. It is worth mentioning that the step (S13) and the step (S14) can be directly combined into one step, that is, the module level calibration, that is, the X, Y, and Z axes are calibrated, and the order is not limited.

In addition, the step (S16) does not have to exist. In other words, the verification of the module calibration can be performed at the same time as the calibration in the step (S13), the step (S14), and the step (S15) to simplify the assembly process.

In addition, the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, and the sub-modules are mutually They are independent of each other and assembled to the assembly bracket 10. In particular, the reference module 1 selects a sub-module with the highest picture element in the split-type array camera module.

In the preferred embodiment of the present invention, according to the step (S11), as shown in FIG. 14, the reference module 1 and the reference unit 101 of the assembly bracket 10 are limited by a limit fixture 30. The unit assembly is configured to fix the reference module 1 and the bracket frame of the reference unit 101 with glue. Preferably, the glue adopts a UV thermosetting glue, and the glue area is located at an upper edge of the frame of the frame of the reference unit 101, and the UV thermosetting glue is pre-cured by ultraviolet exposure after the glue is finished. It is worth mentioning that the assembly gap between the reference module 1 and the reference unit 101 is 0.1 mm.

In other words, in the step (S11), the step of assembling and fixing the reference module further includes: 1) performing limit component assembly on the reference module 1 and the reference unit 101 by using the limit fixture 30; And 2) drawing glue between the reference module 1 and the reference unit 101 to cure the glue.

According to the step (S12), as shown in FIG. 13, the reference module 1 and the assembly bracket 10 are mounted and fixed to a fixed fixture 401 of a module calibration platform 403, and the calibration module 2 is Mounted and fixed to a calibration fixture 402, which is disposed on a six-axis platform, and the calibration module 2 is placed in the calibration unit 102 of the assembly bracket 10, thus The calibration module 2 can perform six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform. It is worth mentioning that the assembly gap between the calibration module 2 and the calibration unit 102 is 0.3 mm.

According to the step (S13), the heights of a point on the lens end surface of the reference module 1 and the calibration module 2 are measured by a laser ranging method, and then the calibration module 2 is respectively calculated. The Z-axis displacement of the calibration module 2 is adjusted by the six-axis platform by a height difference from the lens end face of the reference module 1.

In other words, in the step (S13), the module height calibration specifically includes: 1) measuring each of the reference module 1 and the lens end surface of each of the calibration modules 2 by the laser ranging method. Height of a point, respectively calculating a lens end height difference between each calibration module 2 and the reference module 1; and 2) adjusting a Z axis of each of the calibration modules 2 through the six-axis platform Displacement.

According to the step (S14), the reference lens module 1 and the lens end surface of each of the calibration modules 2 are subjected to CCD imaging, the lens end face image is captured, and the calibration module is calculated by using software. 2, the level position offset of the reference module 1 is adjusted according to the level position offset, and the X and Y axis displacements of the calibration module 2 are adjusted by the six-axis platform.

In other words, in the step (S14), the module offset calibration specifically includes: 1) performing CCD shooting on the lens end faces of the reference module 1 and each of the calibration modules 2, and capturing an image of the lens end face. Calculating the level position offset of each of the calibration module 1 and the reference module 1 by using a software; and 2) adjusting the X and Y of each calibration module 2 through the six-axis platform. Axis displacement. According to the step (S15), the rotation angle of the U, V, W rotation axes of the six-axis platform is adjusted according to the rotation calibration amount of the calibration module 2, and the rotation calibration of the calibration module 2 is realized.

According to the step (S16), the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 is [10.4, 10.6] mm, and the tolerance of the Y-axis position offset is [-0.1, 0.1 ] mm.

According to the step (S17), glue is drawn between the calibration module 2 and the calibration unit 102, the glue is a UV thermosetting glue, and the calibration module 2 and the calibration unit 102 are The UV thermosetting glue is pre-cured in an ultraviolet exposure, and then the split array camera module is baked in an oven to cure all the UV thermosetting glue, fixing the entire split array camera module and finally Complete the assembly.

In one embodiment of the present invention, the limit fixture 30 includes a first recess 301 and a second recess 302 extending inwardly from the surface of the limit fixture 30 to form a recess. The first groove 301 is used to place the reference module 1 , and the second groove 302 is used to place the assembly bracket 10 .

In addition, as shown in FIG. 14, the assembling step of the reference module 1 and the limit fixture 30 in the step (S11) further includes: 1) placing the reference module 1 to the limit The first groove 301 of the jig 30; 2) placing the assembly bracket 10 to the second groove 302 of the limit fixture 30; 3) passing through the limit fixture 30 The assembly limit of the first groove 301 and the second groove 302 is used to control the assembly position error of the reference module 1 and the assembly bracket 10.

It is worth mentioning that the steps (S11A) and (S11B) have no order of assembly, that is, the order of assembly can be adjusted according to the assembly requirements.

In an embodiment of the present invention, in step (S13), the laser altimetry of the reference module 1 is located above the lens end surface of the reference module 1, and the laser altimetry of the calibration module 2 The distance between the point and the laser altimetry of the reference module 1 is fixed, which is the module center distance between the calibration module 2 and the reference module 1. In this embodiment, the distance It is 10.5 mm. Optionally, there are three laser altimetry points of the reference module 1 and the calibration module 2, and an average value is obtained respectively, thereby obtaining a more accurate reference module 1 and the calibration module. The height difference of 2, however, the altimetry efficiency of this method is much lower than that of a altimetry.

In an embodiment of the present invention, a schematic diagram of the target in the step (S15), as shown in FIG. 15, the center of the target is an MTF test pattern M1 composed of a plurality of sets of horizontal and vertical stripes, used for The reference module 1 performs focusing, and the four corners of the target are four circular Mark points M2 for calculating the rotational calibration amount of the calibration module 2. Further, since the reference module 1 is a focus adjustment module, the reference module 1 needs to be focused before the target image is collected, and the MTF test pattern M1 is used for the reference module. 1 Perform focus adjustment, adjust the focal length until the MTF test pattern is imaged the clearest in the reference module 1, and then calculate the rotational calibration amount of the calibration module 2. Further, according to the position coordinates of the four Mark points M2 captured by the reference module 1 and the calibration module 2, the light of the reference module 1 and the calibration module 2 can be separately calculated. The axis is tilted, whereby the amount of rotational calibration of the calibration module 2 can be calculated.

In addition, if the alignment direction of the reference module 1 and the calibration module 2 is defined as the X axis and the vertical direction is the Y axis, in the embodiment, the calibration module 2 and the reference module 1 The distance between the center of the module is 10.5 mm. It is worth mentioning that the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 in the step (S16) is [10.4, 10.6] mm, and the tolerance of the Y-axis position offset is [-0.1, 0.1] mm, as long as any one of the X, Y axis position offsets of the calibration module 2 and the reference module 1 is not within the corresponding tolerance range, it is necessary to perform the step (S13). The height calibration, offset calibration, and rotation calibration of the calibration module 2 are performed in sequence, until the X and Y axis position offsets of the calibration module 2 and the reference module 1 fall within corresponding tolerances. Within the scope.

In this embodiment, the glue is not drawn between the calibration module 2 and the calibration unit 102 in step (S12) until all calibration processes are completed in step (S17) and then in the calibration module. 2, the glue is drawn between the calibration unit 102, and the present invention can also put the glue drawing process between the calibration module 2 and the calibration unit 102 in the step (S17) to the end of the step (S12). That is, the glue between the calibration module 2 and the calibration unit 102 is first performed, and then the assembly position of the calibration module 2 is calibrated. After the calibration is completed, the step (S17) is performed. The glue is UV-cured and semi-cured, and then the entire module is baked to complete the assembly.

Preferably, in the step (S17), the baking array camera module has a baking temperature of 80 ° C to 90 ° C in the oven and a baking time of 50 min to 60 min.

Further, the simplified assembly process mentioned in the present embodiment integrates or interchanges the steps (S13) and (S14), and simplifies the step (S16). In other words, the method for assembling a split-type array camera module of the first simplified alternative mode of the first preferred embodiment of the present invention comprises the following steps: (S11A) A reference module 1 of a split-type array camera module is assembled and fixed, The reference module 1 is assembled and fixed in a reference unit 101 of the assembly bracket 10; (S12A) at least one calibration module 2 of a split array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled Assembly into a calibration unit 102 of the assembly bracket 10; (S13A) module height/offset calibration, measuring the height difference and level deviation of the lens end face of each calibration module 2 and the reference module 1 Transmitting, corresponding height position calibration and corresponding level offset position calibration for each calibration module 2; (S14A) module rotation calibration, setting a light source and a target plate to illuminate the split array a camera module, the image is captured by the target image, and the image obtained by the reference module 1 and each calibration module 2 is used to calculate the calibration module 2 by using the software. Rotating the calibration amount and Quasi rotational position of alignment module 2; and (S15A) fixed module, fixing the split entire array camera module, complete the assembly.

In this embodiment, the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, The sub-modules are independent of one another and assembled to the assembly bracket 10. The reference module 1 and the calibration module 2 are both single-camera modules that have been manufactured, assembled, and tested for performance. The reference module 1 can be implemented as a 13M adjustable focus camera module. The calibration module 2 can be implemented as a 2M fixed focus camera module. In addition, an assembly gap of the reference module and the reference unit is 0.1 mm, and an assembly gap of the calibration module and the calibration unit is 0.3 mm.

A method for assembling a split-type array camera module according to a second simplified alternative mode of the first preferred embodiment of the present invention includes the following steps: (S11B) A reference module 1 of a split-type array camera module is assembled and fixed, that is, The reference module 1 is assembled and fixed in a reference unit 101 of the assembly bracket 10; (S12B) at least one calibration module 2 of a split array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled into a calibration unit 102 of the assembly bracket 10; (S13B) module offset calibration, measuring a level position offset of each calibration module 2 and the reference module 1, for each calibration Module 2 performs corresponding level offset position calibration; (S14B) module height calibration, measuring the height difference between the lens end face of each calibration module 2 and the reference module 1, for each calibration module 2 for the corresponding height position calibration; (S15B) module rotation calibration, set a light source and a target board, illuminate the split array camera module, and capture the image by the target, according to the reference Module 1 and each of the calibration modules 2 are collected The image obtained, the rotation calibration amount of each calibration module 2 is calculated by the software, and the rotation position calibration is performed on the calibration module 2; and (S16B) the fixed module is fixed to fix the entire split array The camera module is assembled.

FIG. 16 is a schematic diagram of a method for assembling a second one-piece array camera module according to a first preferred embodiment of the present invention, which is different from the first embodiment in that the calibration is not performed in step (S26). The level position offset of the module 2 and the reference module 1 is set to a tolerance range, regardless of the level position offset of the calibration module 2 and the reference module 1, directly based on the measured two The level position offset is adjusted by the six-axis platform to adjust the X and Y axis displacements of the calibration module, that is, the step (S26) repeats the step (S24). The assembly method of the second embodiment is more efficient than the assembly method of the first embodiment, but the calibration quality is relatively low. In the specific implementation, the above-mentioned features of the split-type array camera module need to be Choose between two options.

In other words, a method for assembling a split-type array camera module according to a second preferred embodiment of the present invention includes the following steps: (S21) A reference module 1 of a split-type array camera module is assembled and fixed, that is, the reference is The module 1 is assembled and fixed in a reference unit 101 of the assembly bracket 10; (S22) at least one calibration module 2 of a split array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled into the The calibration unit 102 of the assembly bracket 10 is assembled; (S23) the module height is calibrated, and the height difference between the lens end faces of each calibration module 2 and the reference module 1 is measured, and the calibration module 2 is Corresponding height position calibration; (S24) module offset calibration, measuring the level position offset of each calibration module 2 and the reference module 1, and correspondingly for each calibration module 2 Level offset position calibration; (S25) module rotation calibration, setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module 1 and the image acquired by each of the calibration modules 2 Calculating the rotation calibration amount of each calibration module 2 by using software, and performing rotational position calibration on the calibration module 2; (S26) module offset calibration, measuring each calibration module 2 and Referring to the level position offset of the reference module 1, the corresponding level offset position calibration is performed for each calibration module 2; and (S27) the fixed module is fixed to fix the entire split array camera module. Assembly.

In the first simplified alternative mode and the second simplified alternative mode and the second preferred embodiment of the first preferred embodiment of the present invention, the following is included: Preferably, the step of assembling the reference module is further: 1) Performing limit assembly of the reference module 1 and the reference unit 101 by using a limit fixture 30; and 2) drawing glue between the reference module 1 and the reference unit 101 to cure the glue. In particular, the glue is a UV thermoset glue which is cured by UV exposure. Preferably, the module height calibration specifically includes: 1) measuring, by a laser ranging method, the heights of a point on the lens end surface of the reference module 1 and each of the calibration modules 2, respectively, a height difference between the lens end faces of each of the calibration modules 2 and the reference module 1; and 2) adjusting a Z-axis displacement of each of the calibration modules 2 by the six-axis platform. Preferably, the module offset calibration specifically includes: 1) performing CCD shooting on the lens end faces of the reference module 1 and each calibration module 2, capturing image of the lens end face, and calculating respectively by using software The level position offset of each calibration module 2 and the reference module 1; and 2) adjusting the X, Y axis displacement of each calibration module by the six-axis platform.

In this embodiment, the center of the target is an MTF test target, and the four corners of the target include four circular Mark points.

Preferably, the rotation calibration of each calibration module is implemented by the movement of the six-axis platform in three spatial dimensions of U, V, and W, in order to make each calibration module and the reference module The optical axes of the groups are parallel.

Preferably, the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module and the assembly bracket to a fixed fixture 401 of a module calibration platform 403, the reference module The set is placed in the reference unit of the assembly bracket; 2) the calibration module is mounted and fixed to a calibration fixture 402, and the calibration fixture 402 is disposed on a six-axis platform, the calibration module 2 Placed in the calibration unit 102 of the assembly bracket 10, the calibration module can be moved in six spatial dimensions of X, Y, Z, U, V, W with the six-axis platform; and 3) A glue is drawn between the calibration module and the calibration unit, and the glue is a UV thermosetting glue.

In conjunction with the pre-assembly step of the calibration module, the step of fixing the split-type array camera module specifically includes: 1) performing ultraviolet light on the glue between the calibration module 2 and the calibration unit 102. Exposing, the glue is semi-cured; and 2) baking the split array camera module, the glue is completely cured, and the entire split array camera module is fixed. Preferably, the pre-assembly step of the calibration module specifically includes: 1) mounting and fixing the reference module 1 and the assembly bracket 10 to the fixing fixture 401 of the module calibration platform 403, The reference module 1 is placed in the reference unit 101 of the assembly bracket; and 2) the calibration module is mounted and fixed to a calibration fixture 402, and the calibration fixture 402 is disposed on a six-axis platform. The calibration module is placed in the calibration unit 102 of the assembly bracket 10, and the calibration module can perform movements of six spatial dimensions of X, Y, Z, U, V, and W along the six-axis platform. .

In conjunction with the pre-assembly step of the calibration module, the step of fixing the split-type array camera module specifically includes: 1) drawing glue between the calibration module 2 and the calibration unit 102, the glue a UV thermosetting glue; 2) UV exposure of the glue between the calibration module 2 and the calibration unit 102, the glue is semi-cured; and 3) baking the split array camera module The glue is completely cured to fix the entire split array camera module.

In particular, the split-type array camera module has a baking temperature of 80 ° C to 90 ° C in the oven and a baking time of 50 min to 60 min.

The invention provides a method for assembling the split-type array camera module, wherein the split-type array camera module refers to an integrated assembly of more than one camera module that is completely independent and inspected by each other through a common assembly bracket. Array camera module. In the assembly process of the array module, not only the module height between each sub-module is strictly controlled, but also the optical axis spacing and the optical axis parallelism between each sub-module are strictly controlled. In order to solve the above technical problem, The technical solution of the assembly method of the patented split-type array camera module is as follows: one sub-module of the split-type array camera module is used as the reference module 1, and the other sub-modules are used as the calibration module 2, first described The reference module 1 is assembled and fixed on the assembly bracket 10, and the height (Z-axis) and level deviation (X, Y-axis) of the calibration module 2 are sequentially sequentially used with the reference module 1 as a reference standard. And rotating (U, V, W axis) a total of six axes of assembly position calibration, after the calibration is completed, the calibration of the calibration module 2 and the assembly bracket 10 is fixed, complete the split array camera module Assembly process. The assembly method of the above-mentioned split-type array camera module not only improves the module production efficiency, yield and module quality, but also realizes high utilization of production resources.

As shown in FIG. 17-24, a split-type array camera module according to a second preferred embodiment of the present invention, wherein the split-type array camera module is a plurality of products that have been independently manufactured and assembled. The camera module or the prism module is assembled and integrated into a new array camera module. Thus, the split array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.

According to the preferred embodiment of the present invention, the split-type array camera module is implemented as a dual-camera zoom module, which includes a first camera module 1, a prism module 2, a second camera module 3, and A circuit board 4. As shown in the figure, the first camera module 1 is detachably coupled to the prism module 2, and the second camera module 3 is disposed on the prism module 2 and the circuit board 4. between. Further, the first camera module 1 is disposed at the leftmost side of the entire zoom lens module, and the prism module 2 is disposed behind. As shown in FIGS. 17 and 18, according to an embodiment of the present invention, the first camera module 1 and the prism module 2 are assembled to each other, and are fixedly connected to the second camera module 3. When the connection is implemented, the two are required to be strictly positioned and aligned with each other, so as to ensure that the light refracted in the prism module 2 is concentric or coaxial with the optical axis of the camera lens in the second camera module 3. . The structure of this positioning will be described in further detail later in connection with the related drawings. In the present embodiment, the prism module 2 and the second camera module 3 to which the first camera module 1 is fixed are positioned to each other, and then the two are fixedly connected to each other by laser welding or bonding. The circuit board 4 can be pre-assembled on the second camera module 3, and then the prism module 2 and the second camera module 3 of the first camera module 1 are fixedly connected to each other. The prism module 2 and the second camera module 3 of the first camera module 1 may be fixedly connected to each other, and then the circuit board 4 is fixedly connected to the second camera module. 3 on. So far, the dual-camera zoom module according to the present invention has been assembled to form a complete dual-camera zoom module as shown in FIG.

According to the embodiment, as shown in FIG. 24, the first camera module 1 includes a first lens 100A, a first driver 300A, a first photosensitive wafer 200A, and a first substrate 400A. The first lens 100A is located in the photosensitive path of the first photosensitive wafer 200A, so that when the first camera module 1 is used to capture an image of an object, the light reflected by the object can be used by the first lens The processing of 100A is further accepted by the first photosensitive wafer 200A to be suitable for photoelectric conversion. The first photosensitive wafer 200A is electrically connected to the first substrate 400A. The first lens 100A is mounted to the first of the drivers 300A. The first substrate 400A may be first coupled to the electronic device for use with the electronic device. It is worth mentioning that the first driver 300A can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

According to the embodiment, the prism module 2 includes a prism unit 201 and a prism base 202. The prism base 202 has a rectangular shape and is provided with two positions, one of which is for accommodating the prism unit 201 and the other is for accommodating the first camera module 1. The arrangement is such that the first camera module 1 and the prism unit 201 are mounted on a bottom plate or a plane, or the first camera module 1 and the prism unit 201 are coplanar. This eliminates the positional error between the first camera module 1 and the prism unit 201 disposed on different pedestals. This arrangement ensures the parallelism of the light entering the first camera module 1 and the prism unit 201 with a simple structure, that is, the image quality is ensured.

Figure 19 shows, in an exploded schematic view, the prism unit 201 in the prism module 2 of the dual zoom module according to the present invention.

As shown in FIG. 19, the prism unit 201 mainly includes a prism housing 2011, a prism 2012, a prism holder 2013, a support sleeve 2014, a support shaft 2015, and a support card holder 2016. The prism housing 2011 is a rectangular frame surrounded by three side walls or a frame. The three side walls or the frame are respectively a bottom frame 2011a and two side frames 2011b. Two of the side frames 2011b have the same structure and shape and are arranged opposite to each other. The bottom frame 2011a is provided at one end of the two side frames 2011b. This forms an approximately U-shaped frame. This frame is a rectangular frame that is open or open on one side. It can be understood that the side openings of the U-shaped frame are disposed on opposite sides of the bottom frame 2011a. The two side frames 2011b are respectively fixedly connected to the bottom frame 2011a at one end, and the other end is an outwardly extending free end 2011c, that is, the side opening is formed at the free end 2011c. In the present embodiment, the two free ends 2011c are used to interconnect with the second camera module 3 that is sequentially disposed. A connecting beam 2011d is further disposed between the two free ends 2011c. On the one hand, the connecting beam 2011d is used to fix the distance between the two free ends 2011c, so that the second camera module 3 can be more accurately connected to the rear and fixedly connected to each other; The connecting beam 2011d also serves to block light that may leak into the space between the prism 2012 and the second camera module 3 at the connection gap. This helps to improve the image quality. The connecting beam 2011d increases the overall rigidity of the prism housing 2011 and effectively prevents unwanted light from entering the dual zoom module according to the present invention. It should be noted that the connecting beam 2011d can be implemented as a long strip or a rectangular frame. It can be understood that the connecting beam 2011d is disposed on the two side frames 2011b if the strip is the strip, and is between the two free ends 2011c. If the connecting beam 2011d is the rectangular frame, it is located at the upper part of the bottom frame 2011a and the two side frames 2011b, and one side of the rectangular frame is located between the two free ends 2011c.

As shown in FIG. 19, the prism unit 201 further includes the prism 2012, the prism holder 2013, the support bushing 2014, and the support shaft 2015. The prism 2012 is fixedly disposed in the prism holder 2013, and it can be clearly seen from the figure that the upper surface of the prism 2012 protrudes from the prism holder 2013 in an assembled state. The support bushing 2014 is fixedly mounted on the lower portion of the prism holder 2013, that is, the other side of the prism holder 2013 opposite to the position at which the prism 2012 is mounted. The support shaft 2015 is rotatably mounted in the support bushing 2014.

As shown in Fig. 19, the cross section of the prism 2012 is substantially a right triangle, and the prism 2012 shown in the figure is in a state of being horizontal. As shown, the plane of a right-angled side of a right-angled triangle is set upwards. Thus, the plane of the oblique side of the right triangle of the mirror 2012 faces the prism holder 2013 and is supported therein.

As shown in FIG. 19, in an embodiment according to the present invention, the support bushing 2014 and the support shaft 2015 are cooperatively used to support the entire prism holder 2013 and the prism 2012 so as to be able to surround The support shaft 2015 rotates.

In an embodiment according to the present invention as shown in FIG. 19, a glue for bonding is first applied in the prism holder 2013, and then the prism 2012 is placed in the prism holder 2013 and the glue is solidified, thereby The prism 2012 and the prism holder 2013 are firmly bonded to each other. The support bushing 2014 is placed in the through hole 2013a on the prism holder 2013 and fixed. The prism holder 2013 on which the prism 2012 has been assembled is rotatably supported by the prism base 202 via the support shaft 2015, and the prism housing 2011 is mounted on the prism holder 2013.

In the embodiment according to the present invention, a magnet for driving the movement of the prism holder 2013 is further provided on the prism holder 2013, and the prism base 202 is provided with a movement for driving the prism holder 2013 as described above. The magnets cooperate with the coils and the circuit. Thereby a drive device that drives the movement of the prism 2012 is formed. Under the driving of the driving device, the prism 2012 rotates or moves relative to the support shaft 2015, thereby realizing the adjustment movement of the prisms 2012 in different degrees of freedom.

Figure 20 shows the specific shape and configuration of the prism base 202 in a perspective view. As shown, the prism base 202 has a rectangular shape with a bottom plate 2025 as a rectangular flat plate. On one surface of the bottom plate 2025, a positioning frame wall 2026 extending along the side length thereof is provided. As shown, in such an embodiment in accordance with the present invention, the locating frame wall 2026 does not extend continuously around the entire side length of the bottom plate 2025, but rather extends discontinuously. In particular, when the positioning frame wall 2026 surrounds the bottom plate 2025, a first opening 2028 is formed therein.

The prism base 202 shown in FIG. 20 is divided into two different chambers by a middle partition wall 2027, and one of the prism units 201 for accommodating or arranging the prism unit 201 is a prism module accommodating chamber 2022. Another one for accommodating the first camera module 1 is a first camera module housing cavity 2021. It is worth mentioning that the first opening 2028 is formed on a sidewall of the first camera module accommodating cavity 2021. In addition, a second opening 2029 is formed in the sidewall of the prism module receiving cavity 2022. As shown in the figure, the first opening 2028 is used to apply the power/signal line of the first camera module 1. Similarly, the second opening 2029 is also an opening for applying a power/control signal line for controlling the prism 2012.

A connecting wall 2023 is disposed on a side of the prism module accommodating cavity 2022, and the connecting wall 2023 is connected to the second camera module 3, and also plays on the second camera module 3 When connected to each other, the two are precisely positioned to each other. Further, the connecting wall 2023 is disposed on the opposite side of the middle partition wall 2027. In the prism module accommodating chamber 2022, a support seat for supporting the support shaft 2015 is further provided. The support shaft 2015 is fixedly supported on the support base so that the prism 2012 can be moved by the drive mechanism.

According to the present invention, the first camera module 1 and the prism module 2 are respectively disposed on the prism base 202. One of the purposes of such an arrangement is to align the effective optical regions formed by the prism unit 201 and the lens in the first camera module 1 with each other. This is very important for imaging quality. However, when two components or units are simultaneously disposed on the prism base 202, the prism base 202 is caused to bear two parts having a certain weight. Thus, the intermediate portion of the prism base 202 becomes a relatively weak portion of the entire base. When the dual-lens zoom module according to the present invention is subjected to relatively strong impact or vibration during use, the prism base 202 may break at an intermediate portion.

In order to avoid breakage of the intermediate portion of the prism base 202, an intermediate reinforcing plate 2024 is provided at its intermediate portion in accordance with the present invention. As can be seen from FIG. 20, the intermediate reinforcing plate 2024 extends through the prism base 202 across its entire width along a length direction perpendicular to the prism base 202. The intermediate reinforcing plate 2024 has a certain thickness to enhance the strength of the intermediate portion of the prism base 202. The intermediate reinforcing plate 2024 is effectively prevented from being broken or damaged. In addition, the intermediate reinforcing plate 2024 improves the overall rigidity of the prism base 202, so that the installation foundation of the first camera module 1 and the prism unit 201 is more secure, and the positional relationship between the two is ensured. .

As can be seen from FIG. 21, at least one positioning protrusion 2030 is disposed on the other surface of the connecting wall 2023 at the end of the prism base 202. In this embodiment according to the invention, four of said positioning projections 2030 are provided. The four positioning projections 2030 are distributed at the four corners of the surface of the connecting wall 2023. The positioning protrusions 2030 are configured to cooperate with the positioning holes 301c on the imaging housing 301 on the second camera module 3 to determine the prism base 202 and the second The connection position between the camera modules 3 ensures that the optical axis of the prism 2012 and the optical axis of the lens in the second camera module 3 are coaxial with each other. At the same time, a through hole for passing light is further disposed at a central portion of the connecting wall 2023. Light refracted by the prism 2012 will pass through the through hole and enter the second camera module 3, through which the lens reaches the photosensitive wafer.

The free end 2011c of the prism housing 2011 is also clearly shown in FIG. According to this embodiment of the invention, the two free ends 2011c are used for fixed connection with the second camera module 3 behind. This will be described in further detail later.

According to the embodiment, as shown in FIG. 24, the second camera module 3 includes a second lens 102A, a second driver 302A, a second photosensitive wafer 202A, and a second substrate 402A. The second lens 102A is located in the photosensitive path of the second photosensitive wafer 202A, so that when the first two camera module 3 is used to collect an image of an object, the light reflected by the object can be by the second The processing of lens 102A is then further accepted by said second photosensitive wafer 202A to be suitable for photoelectric conversion. The second photosensitive wafer 202A is electrically connected to the second substrate 402A. The second lens 102A is mounted to the second of the drivers 302A. The second substrate 402A may be first coupled to the electronic device for use with the electronic device. It is worth mentioning that the second driver 302A can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.

In addition, FIG. 22 shows a partial structure of the second camera module 3 according to the present invention.

In an embodiment of the invention, the second camera module 3 includes an imaging housing 301A. As shown in Fig. 22, the image pickup casing 301A has a hollow rectangular column shape, has a casing portion 301a surrounding a hollow rectangular column, and a front plate 301e fixedly coupled to one end of the casing portion 301a. As shown in FIG. 22, the length of the front panel 301e is smaller than the width of the image pickup casing 301A, because two connection portions 301b are respectively provided at both ends in the width direction of the image pickup casing 301A. The two connecting portions 301b are two recesses on the side of the imaging housing 301A. As can be seen in conjunction with the prism housing 2011 shown in FIG. 5, in the assembled state, the free end 2011c of the prism housing 2011 is attached to the two recessed sides on both sides of the end of the imaging housing 301A. At the joint portion 301b, the two are then fixedly joined together by laser welding or bonding.

As shown in FIG. 22, at least one positioning hole 301c is provided in the front panel 301e. In this embodiment according to the present invention, four of the positioning holes 301c are provided at the four corners of the front panel 301e. When the second camera module 3 and the prism base 202 on which the prism unit 201 and the first camera module 1 are mounted are combined and fixed to each other, the positioning holes 301c are positioned, and The optical axis of the prism 2012 is coaxial with the optical axis of the lens in the first camera module 1 and the optical axis of the lens in the second camera module 3.

Also shown in Fig. 22 is a second driver 302A, an anti-shake unit 303 and a support housing 304 in this embodiment in accordance with the present invention. These components are disposed coaxially with each other, and the second driver 302A is mounted in the anti-vibration unit 303, and is movable in the anti-vibration unit 303 by the driving mechanism to cancel the deviation caused by the shake. The anti-shake unit 303 is integrally mounted in the support shell 304 and movable in the support shell 304 to drive the lens in the camera module to focus.

Only the components of the second camera module 3 according to the present invention are schematically shown in Fig. 22, and the driving magnets, the corresponding Hall sensors, and the like are not specifically shown in detail.

FIG. 23 is a view schematically showing an interconnection state of the prism module 2 and the second camera module 3 in an embodiment according to the present invention.

After the prism unit 201 is integrally mounted on the prism base 202, a combination of the prism unit 201 and the prism base 202 as shown in FIG. 21 is obtained. Applying adhesive glue to the end surface of the prism base 202 facing the second camera module 3, and the front panel of the image capturing housing 301 at the corresponding end surface of the second camera module 3 Adhesive glue is also applied to the 301e.

Then, the four positioning protrusions 2030 on the prism base 202 and the four positioning holes 301c on the imaging housing 301 of the second camera module 3 are aligned with each other, and then inserted into the Positioning hole 301c. In this way, it can be ensured that the second camera module 3 and the prism unit 201 are strictly aligned with each other.

After the above alignment is achieved, the free end 2011c of the prism housing 2011 is fitted at the two recessed connecting portions 301b on both sides of the end portion of the image pickup housing 301. The free end 2011c is laser welded to the connecting portion 301b or bonded by applying glue, and the two are fixedly connected. After the connection, a combination as shown in FIG. 23 is obtained, but the first camera module 1 and the corresponding circuit board 4 located at the rightmost side are omitted in FIG. The circuit board 4 can be connected to the rear of the second camera module 3 by bonding or the like. In addition, the circuit board 4 can also be connected to the rear of the second camera module 3 by a matching structure, such as a screw or a hook. This is not a limitation of the invention.

Those skilled in the art should understand that the embodiments of the present invention described in the above description and the accompanying drawings are only by way of illustration and not limitation. The object of the invention has been achieved completely and efficiently. The present invention has been shown and described with respect to the embodiments of the present invention, and the embodiments of the present invention may be modified or modified without departing from the principles.

1‧‧‧ reference module, first camera module
2‧‧‧ Calibration Module, Prism Module
3‧‧‧Second camera module
4‧‧‧ boards
M1‧‧‧MTF test graphics
2M‧‧‧Focus camera module
13M‧‧‧ adjustable focus camera module
10‧‧‧Assemble bracket
11‧‧‧Reference lens
12‧‧‧Reference drive
13‧‧‧Reference Photosensitive Wafer
14‧‧‧Reference base
15‧‧‧Reference substrate
20‧‧‧Common base
21‧‧‧ Calibration lens
22‧‧‧Calibration drive
23‧‧‧ Calibration Photosensitive Wafer
24‧‧‧ Calibration base
25‧‧‧ Calibration substrate
30‧‧‧Common substrate, limit fixture
40‧‧‧Gyro
100A‧‧‧ first shot
101‧‧‧ reference bracket unit
102‧‧‧Calibration bracket unit
201‧‧‧prism unit
200A‧‧‧Photosensitive wafer
300A‧‧‧First Drive
301‧‧‧First groove
302‧‧‧second groove
400A‧‧‧first substrate
401‧‧‧fixed fixture
402‧‧‧ calibration fixture
403‧‧‧Module Calibration Platform
S11‧‧‧ reference module assembly and fixing
S12‧‧‧ Calibration module pre-assembly
S13‧‧‧Module height calibration
S14‧‧‧Module Offset Calibration
S15‧‧‧Module Rotation Calibration
S16‧‧‧Module Offset Test
S17‧‧‧Fixed module
S11A‧‧‧Reference module 1 assembled and fixed
S12A‧‧‧ at least one calibration module 2 pre-assembled
S13A‧‧‧Module Height/Offset Calibration
S14A‧‧‧Module Rotation Calibration
S15A‧‧‧ fixed module
S11B‧‧‧Reference module 1 assembled and fixed
S12B‧‧‧ at least one calibration module 2 pre-assembled
S13B‧‧‧Module Offset Calibration
S14B‧‧‧ module height calibration
S15B‧‧‧Module Rotation Calibration
S16B‧‧‧Fixed module
S24‧‧‧ Repeat steps
S26‧‧‧Steps
S21‧‧‧Reference module 1 assembled and fixed
S22‧‧‧ at least one calibration module 2 pre-assembled
S23‧‧‧Module height calibration
S24‧‧‧Module Offset Calibration
S25‧‧‧Module Rotation Calibration
S26‧‧‧Module Offset Calibration
S27‧‧‧Fixed module
Z axis ‧ ‧ height
X, Y axis ‧ ‧ level shift
U, V, W axis ‧ ‧ rotation
2011‧‧‧ prism housing
2012‧‧ ‧ Prism
2013‧‧ ‧prism seat
2014‧‧‧Support bushing
2015‧‧‧Support shaft
2016‧‧‧Support card holder

1 is a top plan view of a split array camera module in accordance with a first preferred embodiment of the present invention. 2 is a front elevational view of a split array camera module in accordance with a first preferred embodiment of the present invention. 3 is a front elevational view of a split array camera module in accordance with a first preferred embodiment of the present invention. Further explain the relative relationship of the parts. 4 is a front elevational view of a first modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention. 5 is a front elevational view of a second modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention. 6 is a front elevational view of a third modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention. FIG. 7 is a front elevational view showing a fourth modified embodiment of a split type array camera module according to a first preferred embodiment of the present invention. FIG. 8 is a front elevational view showing a fifth modified embodiment of a split type array camera module according to a first preferred embodiment of the present invention. 9 is a front elevational view of a sixth modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention. Figure 10 is a front elevational view showing a seventh modified embodiment of a split type array camera module in accordance with a first preferred embodiment of the present invention. Figure 11 is a front elevational view showing an eighth modified embodiment of a split type array camera module in accordance with a first preferred embodiment of the present invention. 12 is a flow chart of a method of assembling a split array camera module in accordance with a first preferred embodiment of the present invention. FIG. 13 is a schematic diagram of a split-type array camera module with a jig assembled during assembly according to a first preferred embodiment of the present invention. FIG. 14 is a schematic diagram of a split-type array camera module with a jig assembled during assembly according to a first preferred embodiment of the present invention. Explain the corresponding relationship between a reference module and a limit fixture. 15 is a schematic diagram of a target board of a split-type array camera module in performing calibration in accordance with a first preferred embodiment of the present invention. 16 is a flow chart of a method of assembling another split array camera module in accordance with a first preferred embodiment of the present invention. 17 is a perspective view of a split-type array camera module assembled in accordance with a second preferred embodiment of the present invention. Figure 18 is an exploded perspective view of a split array camera module in accordance with a second preferred embodiment of the present invention. 19 is an exploded perspective view of a prism unit of a split type array camera module according to a second preferred embodiment of the present invention. 20 is a perspective view of a prism base of a split type array camera module in accordance with a second preferred embodiment of the present invention. 21 is a schematic diagram of a prism unit of a split type array camera module assembled to a prism base according to a second preferred embodiment of the present invention. 22 is an exploded perspective view of a second camera module of a split array camera module in accordance with a second preferred embodiment of the present invention. 23 is a schematic diagram showing the state of interconnection between a prism module and a second camera module of a split-type array camera module according to a second preferred embodiment of the present invention. Figure 24 is a logic diagram of a split array camera module in accordance with a second preferred embodiment of the present invention.

S11‧‧‧ reference module assembly and fixing

S12‧‧‧ Calibration module pre-assembly

S13‧‧‧Module height calibration

S14‧‧‧Module Offset Calibration

S15‧‧‧Module Rotation Calibration

S16‧‧‧Module Offset Test

S17‧‧‧Fixed module

Claims (74)

A split-type array camera module, comprising: a plurality of sub-modules, wherein at least one sub-module is a reference module, the remaining sub-modules are calibration modules; and an assembly bracket, wherein the reference The module and each of the calibration modules are respectively assembled to the assembly bracket, wherein the reference module and each calibration module are respectively independent and qualified single camera modules. The split-type array camera module according to the first aspect of the invention, wherein the reference module is a focus adjustable camera module or a fixed focus camera module. The split-type array camera module according to claim 2, wherein the calibration module is a focus adjustable camera module or a fixed focus camera module. The split-type array camera module of claim 3, wherein the assembly bracket has at least one reference unit and at least one calibration unit, wherein the reference module and the calibration module are respectively assembled in the The reference unit of the stent is assembled with the calibration unit. The split-type array camera module of claim 4, wherein the module center distance between the calibration module and the reference module is 1-100 mm. The split-type array camera module of claim 5, wherein an assembly gap of the reference module and the reference unit is 0.01-1 mm, and the calibration module and the calibration unit are surrounded by the calibration unit. The assembly gap is 0.03-3 mm. The split-type array camera module of claim 1, wherein the reference module further comprises at least one reference lens, at least one reference driver and at least one reference light-sensitive chip, wherein the reference lens is located at the reference A photosensitive path of the photosensitive wafer, the reference lens being mounted to the reference driver. The split-type array camera module of claim 7, wherein the calibration module further comprises at least one calibration lens and an at least calibration photosensitive wafer, wherein the calibration lens is located in the photosensitive path of the calibration photosensitive wafer . The split-type array camera module of claim 8, wherein the reference module further includes at least one reference base and at least one reference substrate, wherein the reference photosensitive wafer is electrically connected to the reference substrate, The reference base is disposed on the reference substrate, and the reference driver is mounted to the reference base. The split-type array camera module of claim 9, wherein the calibration module further comprises at least one calibration base and at least one calibration substrate, wherein the calibration photosensitive wafer is electrically connected to the calibration substrate. The calibration base is disposed on the calibration substrate. The split-type array camera module of claim 8, wherein the split-type array camera module comprises at least one common base, the reference module further comprises at least one reference substrate, and the calibration module further Included in at least one calibration substrate, wherein the reference photosensitive wafer is electrically connected to the reference substrate, the calibration photosensitive wafer is electrically connected to the calibration substrate, the common base is disposed on the reference substrate and/or the Calibrate the substrate. The split-type array camera module of claim 8, comprising at least one common base and at least one common substrate, wherein the reference photosensitive wafer and the calibration photosensitive wafer are electrically connected to the common substrate, The common base is disposed on the common substrate, and the reference driver and the calibration lens are both mounted to the common base. The split-type array camera module of claim 9, comprising a gyroscope disposed on the reference substrate of the reference module. The split-type array camera module of claim 10, comprising a gyroscope disposed on the calibration substrate of the calibration module. The split-type array camera module according to claim 11, comprising a gyroscope disposed on the reference substrate of the reference module. The split-type array camera module according to claim 11, comprising a gyroscope disposed on the calibration substrate of the calibration module. The split-type array camera module of claim 12, comprising a gyroscope electrically connected to the reference module and disposed on the common substrate. The split-type array camera module according to claim 12, comprising a gyroscope electrically connected to the calibration module and disposed on the common substrate. The split-type array camera module of claim 17, wherein the reference driver is selected from the group consisting of a motor, a thermal driver, or a microactuator. The split-type array camera module of claim 8, wherein the calibration module further comprises a calibration driver, wherein the calibration lens is supported above the calibration driver. The split-type array camera module according to claim 1, wherein the reference module is implemented as a large field of view lens, and the FOV is generally between 60° and 220°, and the calibration module is implemented as Small field of view lens, its FOV is generally between 10 ° ~ 90 °. A split-type array camera module, comprising: at least a first camera module, at least one prism module, at least one second camera module, and at least one circuit board, wherein the first camera module The prism module is disposed concentrically with the prism module, and the prism module is disposed concentrically with the optical axis of the second camera module, and the circuit board is connected to the second camera module. The split-type array camera module of claim 22, wherein the prism module comprises a prism unit and a prism base, and the prism unit is rotatably supported in the prism base. The split-type array camera module of claim 23, wherein the second camera module comprises at least one second lens, at least one second photosensitive wafer, and at least one second substrate, wherein the The second lens is located on the photosensitive path of the second photosensitive wafer, and the second photosensitive wafer is electrically connected to the second substrate. The split-type array camera module of claim 24, wherein the second camera module comprises at least one second driver, wherein the second lens is mounted to the second driver. The split-type array camera module of claim 25, wherein the second camera module comprises an image capture housing, an anti-shake unit and a support shell, wherein the camera housing and the second driver The anti-shake unit and the support shell are coaxially disposed with each other. The split-type array camera module according to any one of claims 23 to 26, wherein the first camera module comprises at least one first lens, at least one first photosensitive wafer, and at least one first a substrate, wherein the lens is located in a photosensitive path of the photosensitive wafer, and the photosensitive wafer is electrically connected to the substrate. The split-type array camera module of claim 27, wherein the first camera module comprises at least one first driver, wherein the first lens is mounted to the first driver. The split-type array camera module according to claim 28, wherein the prism unit mainly comprises a prism housing, a prism, a prism holder, a support sleeve and a support shaft, and the prism is fixedly disposed at In the prism holder, the support sleeve is fixedly mounted on a lower portion of the prism holder, and the support shaft is rotatably mounted in the support sleeve, and the prism holder is disposed in the prism housing. The split-type array camera module according to claim 29, wherein glue is applied between the prism holder and the prism to adhere to each other. The split-type array camera module according to claim 29, wherein the prism housing has a rectangular frame, and has a bottom frame and two side frames, and the two side frames respectively have one end and the bottom frame respectively. The fixed connection has a free end extending outwardly, and a connecting beam is disposed between the two free ends. The split-type array camera module according to claim 31, wherein the prism base has a first camera module receiving cavity and a prism module receiving cavity, wherein the first camera module is accommodated The prism unit is accommodated in the prism module receiving cavity. The split-type array camera module of claim 32, wherein the prism base comprises an intermediate reinforcing plate that extends through the prism base along a length perpendicular to the prism base and across its entire width. The seat extends. The split-type array camera module of claim 32, wherein the sidewall of the first camera module housing cavity has a first opening for applying power to the first camera module/ a signal line, wherein a sidewall of the prism module receiving cavity has a second opening for applying an opening for controlling a power/control signal line of the prism. The split-type array camera module of claim 34, wherein one side of the prism module accommodating cavity is provided with a connecting wall, and at least one positioning post or positioning hole is provided on the surface thereof for The second camera module is precisely positioned for connection. The split-type array camera module according to claim 35, wherein the image pickup casing has a casing portion surrounding a hollow rectangular column, a front panel fixedly coupled to one end of the casing portion, and Two recessed two connecting portions are formed on the side of the outer casing portion. The split-type array camera module of claim 36, wherein the image pickup housing includes an optical axis opening and at least one positioning hole or positioning post, wherein the optical axis opening is disposed on the front panel Centrally, the positioning hole or the positioning post is disposed on the front panel. The split-type array camera module according to claim 37, wherein the positioning post is located in the positioning hole, and the free end and the connecting portion cooperate with each other and are fixedly connected to each other. The split-type array camera module according to claim 22, wherein the first camera module is a wide-angle camera module, the second camera module is a zoom camera module, and the first camera module The optical axes of the groups are perpendicular to the optical axes of the second camera module. The method for assembling a split-type array camera module includes the following steps: (S11) at least one reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in an assembly. (S12) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13) module Height calibration, measuring the height difference between the lens end face of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module; (S14) module offset calibration, measuring each calibration mode Setting a level position offset between the group and the reference module, and performing corresponding level offset position calibration on the calibration module; (S15) module rotation calibration, setting a light source and a target board to illuminate the points a body array camera module, capturing and capturing images of the target board, calculating the rotation of each calibration module by using the software according to the image captured by the reference module and each calibration module Calibration amount And performing rotational position calibration on each of the calibration modules; (S16) module offset verification/calibration, determining whether the level position offset of each of the calibration modules and the reference module is within a tolerance tolerance range If there is no calibration within the tolerance range, if not returning to the tolerance range (S13), the height calibration, offset calibration and rotation calibration of each calibration module are performed again until the calibration module and the calibration module are The level position offset of the reference module is within the tolerance range; and (S17) the fixed module fixes the entire split array camera module to complete assembly. The method for assembling a split-type array camera module according to claim 40, wherein the split-type array camera module comprises one or more sub-modules, wherein at least one sub-module is the reference module. The remaining sub-modules are the calibration modules, and the sub-modules are independent of each other and assembled to the assembly bracket. The method for assembling a split-type array camera module according to claim 41, wherein the reference module selects a sub-module having the highest picture element in the split-type array camera module. The method for assembling a split-type array camera module according to any one of claims 40 to 42 wherein the reference module and the calibration module are both manufactured, assembled, and qualified for performance testing. Body camera module. The method for assembling a split-type array camera module according to claim 40, wherein an assembly gap of the reference module and the reference unit is 0.01-1 mm, and the calibration module and the calibration unit The assembly clearance around is 0.01-3 mm. According to the method for assembling a split-type array camera module according to claim 40, in the step (S11), the step of assembling and fixing the reference module further comprises: 1) using a limit fixture to the reference Performing a limit element assembly with the reference unit; and 2) drawing glue between the reference module and the reference unit to cure the glue. The method for assembling a split-type array camera module according to claim 45, wherein the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure. According to the method for assembling a split-type array camera module according to claim 40, in the step (S13), the module height calibration specifically includes: 1) measuring the reference module and each calibration mode The height of a point on the lens end face of the group respectively calculates a difference in height of the lens end faces of each of the calibration modules and the reference module; and adjusts a Z-axis displacement of each of the calibration modules. According to the assembly method of the split-type array camera module according to claim 40, in the step (S14), the module offset calibration specifically includes: 1) calibrating the reference module and each of the modules Shooting the lens end face of the module, capturing the image of the end face of the lens, calculating the level position offset of each calibration module and the reference module by using software; and 2) adjusting each calibration mode The X and Y axis displacements of the group. According to the assembling method of the split-type array camera module according to claim 40, in the step (S15), the center of the target is an MTF test target, and the four corners of the target include four Mark points. According to the assembling method of the split-type array camera module according to claim 40, in the step (S15), the rotation calibration of each calibration module is performed by three spatial dimensions of U, V, and W. The purpose is to make each of the calibration modules parallel to the optical axis of the reference module. According to the method for assembling a split-type array camera module according to claim 40, in the step (S12), the pre-assembly step of the calibration module specifically includes: 1) assembling the reference module with the assembly The bracket is mounted and fixed to a fixture of a module calibration platform, the reference module is placed in a reference unit of the assembly bracket; 2) the calibration module is mounted and fixed to a calibration fixture The calibration fixture is disposed on a six-axis platform, and the calibration module is placed in a calibration unit of the assembly bracket, and the calibration module can be X, Y, Z, and U along the six-axis platform. , V, W movements of six spatial dimensions; and 3) drawing glue between the calibration module and the calibration unit, the glue being a UV thermosetting glue. According to the method for assembling the split-type array camera module according to the claim 51, in the step (S17), the step of fixing the split-type array camera module specifically includes: 1) the calibration module and the The glue between the calibration units is subjected to ultraviolet exposure, the glue is semi-cured; and 2) the split array camera module is baked, the glue is completely cured, and the entire split array camera module is fixed. According to the method for assembling a split-type array camera module according to claim 40, in the step (S12), the pre-assembly step of the calibration module specifically includes: 1) assembling the reference module with the assembly The bracket is mounted and fixed to a fixture of a module calibration platform, the reference module is placed in a reference unit of the assembly bracket; and 2) the calibration module is mounted and fixed to the calibration fixture, The calibration fixture is disposed on a six-axis platform, and the calibration module is placed in a calibration unit of the assembly bracket, and the calibration module can be X, Y, Z, U, along with the six-axis platform. The movement of six spatial dimensions of V and W. According to the method for assembling a split-type array camera module according to claim 53, wherein in the step (S17), the step of fixing the split-type array camera module comprises: 1) the calibration module and the The glue is drawn between the calibration units, the glue is a UV thermosetting glue; 2) the glue between the calibration module and the calibration unit is exposed to ultraviolet light, the glue is semi-cured; and 3) The split array camera module is baked, the glue is completely cured, and the entire split array camera module is fixed. The method for assembling a split-type array camera module according to claim 52 or 55, wherein the split-type array camera module has a baking temperature of 50 ° C to 200 ° C in the oven and a baking time of 5 min. 600min. A method for assembling a split-type array camera module includes the following steps: (S11A) A reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in an assembly bracket (S12A) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13A) module height / offset calibration, measuring the lens end height difference and the level position offset of each calibration module and the reference module, and performing corresponding height position calibration and corresponding level offset position on the calibration module (S14A) module rotation calibration, setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module and each Acquiring the acquired images of the calibration module, calculating the rotational calibration amount of each calibration module by using the software, and performing rotational position calibration on each of the calibration modules; and (S15A) fixing the module, fixing The imaging array of a split module assembly is completed. A method for assembling a split-type array camera module includes the following steps: (S11B) A reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in an assembly bracket (S12B) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S13B) Shift calibration, measuring the level position offset of each calibration module and the reference module, and performing corresponding level offset position calibration on the calibration module; (S14B) module height calibration, measuring each Aligning the height of the lens end face of the calibration module with the reference module, and performing corresponding height position calibration on the calibration module; (S15B) module rotation calibration, setting a light source and a target plate to illuminate the split type Array camera module, capturing and capturing images of the target board, calculating rotation calibration of each calibration module by using software according to the reference module and the image acquired by each calibration module the amount, And performing rotational position calibration on each of the calibration modules; and (S16B) fixing the module to fix the entire split array camera module to complete assembly. A method for assembling a split-type array camera module includes the following steps: (S21) A reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in an assembly bracket (S22) at least one calibration module of a split array camera module is pre-assembled, that is, the calibration module is pre-assembled into a calibration unit of the assembly bracket; (S23) module height Calibrating, measuring the height difference between the lens end face of each calibration module and the reference module, and performing corresponding height position calibration on the calibration module; (S24) module offset calibration, measuring each calibration module Performing a corresponding level offset position calibration on the calibration module with the level position offset of the reference module; (S25) module rotation calibration, setting a light source and a target to illuminate the split type Array camera module, capturing and capturing images of the target board, calculating rotation calibration of each calibration module by using software according to the reference module and the image acquired by each calibration module Quantity and Each calibration module performs rotational position calibration; (S26) module offset calibration, measuring a level position offset of each calibration module and the reference module, and correspondingly leveling the calibration module Offset position calibration; and (S27) fixed module to fix the entire split array camera module to complete assembly. The method for assembling a split-type array camera module according to any one of claims 56 to 58, wherein the split-type array camera module comprises one or more sub-modules, wherein one sub-module is Referring to the reference module, the remaining sub-modules are the calibration modules, and the sub-modules are independent of each other and assembled to the assembly bracket. The method for assembling a split-type array camera module according to any one of claims 56 to 58, wherein the reference module and the calibration module are both manufactured, assembled, and qualified for performance testing. Body camera module. The split-type array camera module according to any one of claims 56 to 58, wherein the reference module and the calibration module are respectively a focus adjustable camera module or a fixed focus camera module . The split-type array camera module according to any one of claims 56 to 58 wherein the reference module is a focus-adjustable camera module, and the calibration module is a fixed-focus camera module. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the reference module and the reference unit have an assembly gap of 0.01-1 mm, the calibration mode The assembly gap between the group and the calibration unit is 0.01-3 mm. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the step of assembling and fixing the reference module further comprises: 1) using a limit fixture to the reference Performing a limit element assembly with the reference unit; and 2) drawing glue between the reference module and the reference unit to cure the glue. The method of assembling a split-type array camera module according to claim 64, wherein the glue is a UV thermosetting glue, and the glue is cured by ultraviolet exposure. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the module height calibration specifically comprises: 1) measuring the reference module by a laser ranging method And a height of a point on a lens end surface of each of the calibration modules, respectively calculating a lens end height difference between each of the calibration modules and the reference module; and 2) passing the six-axis platform Adjust the Z-axis displacement of each of the calibration modules. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the module offset calibration specifically comprises: 1) calibrating the reference module with each of the modules CCD shooting of the lens end surface of the module, capturing the image of the end surface of the lens, calculating the level position offset of each calibration module and the reference module by using software; and 2) passing the six-axis platform Adjust the X and Y axis displacement of each calibration module. The method for assembling a split-type array camera module according to any one of claims 56 to 58, wherein the target center is an MTF test target, and the target has 2-20 Mark points. The method for assembling a split-type array camera module according to any one of claims 56 to 58, wherein the calibration of each of the calibration modules is performed by the six-axis platform in U, V, and W. The motion of the spatial dimension is implemented in order to make each of the calibration modules parallel to the optical axis of the reference module. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the pre-assembly step of the calibration module comprises: 1) assembling the reference module with the assembly The bracket is mounted and fixed to a fixture of a module calibration platform, the reference module is placed in a reference unit of the assembly bracket; 2) the calibration module is mounted and fixed to a calibration fixture The calibration fixture is disposed on a six-axis platform, and the calibration module is placed in a calibration unit of the assembly bracket, and the calibration module can be X, Y, Z, and U along the six-axis platform. , V, W movements of six spatial dimensions; and 3) drawing glue between the calibration module and the calibration unit, the glue being a UV thermosetting glue. The method for assembling a split-type array camera module according to claim 70, wherein the step of fixing the split-type array camera module comprises: 1) between the calibration module and the calibration unit The glue is subjected to ultraviolet exposure, the glue is semi-cured; and 2) the split array camera module is baked, the glue is completely cured, and the entire split array camera module is fixed. The method for assembling a split-type array camera module according to any one of claims 56 to 58 wherein the pre-assembly step of the calibration module comprises: 1) assembling the reference module with the assembly The bracket is mounted and fixed to a fixture of a module calibration platform, the reference module is placed in a reference unit of the assembly bracket; and 2) the calibration module is mounted and fixed to a calibration fixture The calibration fixture is disposed on a six-axis platform, and the calibration module is placed in a calibration unit of the assembly bracket, and the calibration module can be X, Y, Z along with the six-axis platform. Movement of six spatial dimensions of U, V, and W. The method for assembling a split-type array camera module according to claim 72, wherein the step of fixing the split-type array camera module comprises: 1) drawing glue between the calibration module and the calibration unit The glue is a UV thermosetting glue; 2) ultraviolet exposure of the glue between the calibration module and the calibration unit, the glue is semi-cured; and 3) baking the split array In the camera module, the glue is completely cured, and the entire split array camera module is fixed. The method for assembling a split-type array camera module according to claim 70, wherein the split-type array camera module has a baking temperature of 50 ° C to 200 ° C in the oven and a baking time of 5 min. ~600 min.