TW201715338A - Memory device and control method therefor - Google Patents
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Abstract
Description
本發明係有關於一種記憶體裝置,特別是有關於一種靜態隨機存取記憶體裝置,其能藉由對在一條字元線上的記憶胞連續執行多次讀出/寫入操作,以減少執行預充電的次數,藉以降低功率消耗。 The present invention relates to a memory device, and more particularly to a static random access memory device capable of reducing execution by continuously performing a plurality of read/write operations on a memory cell on a word line. The number of pre-charges to reduce power consumption.
一般而言,靜態隨機存取記憶體裝置的控制電路依據單一時脈信號來控制解碼器,以選擇對應的記憶胞。每當時脈信號發生正緣觸發時,控制電路則鎖定一次位址以選擇對應的字元線與位元線(即選擇對應的記憶胞)。此時,記憶體裝置先對對應的位元線執行一次預充電操作,再對記憶胞執行一個位元的讀取/寫入操作。因此可得知,每當時脈信號發生正緣觸發時,記憶體裝置則執行一次預充電操作。然而,預充電操作會導致在字元線與位元線上發生突波電流。參閱第1圖,每當時脈信號CLK發生正緣觸發時,伴隨發生的突波電流會將電源電流IVDD瞬間被下拉,進而增加了記憶體裝置運作時的功率消耗。 In general, the control circuit of the SRAM device controls the decoder based on a single clock signal to select a corresponding memory cell. Whenever the clock signal is positively triggered, the control circuit locks the address once to select the corresponding word line and bit line (ie, select the corresponding memory cell). At this time, the memory device performs a precharge operation on the corresponding bit line first, and then performs a bit read/write operation on the memory cell. Therefore, it can be known that the memory device performs a precharge operation every time the pulse signal is positively triggered. However, the precharge operation causes a glitch current to occur on the word line and the bit line. Referring to FIG. 1 , when the positive pulse signal CLK is triggered by a positive edge, the accompanying surge current instantaneously pulls down the power supply current I VDD , thereby increasing the power consumption of the memory device during operation.
本發明之一實施例提供一種記憶體裝置,包括記憶體陣列、複數字元線、複數位元線、第一解碼器、第二解碼器、以及控制電路。記憶體陣列包括配置成複數記憶胞列與複 數記憶胞行的複數記憶胞。每一字元線耦接一記憶胞列上的記憶胞。每一位元線耦接一記憶胞行上的記憶胞。第一解碼器接收位址信號以及第一控制信號,且根據位址信號以及第一控制信號來選擇一字元線。第二解碼器接收位址信號以及第二控制信號。控制電路接收第一時脈信號以及第二時脈信號。控制電路根據第一時脈信號來產生第一控制信號,且根據第二時脈信號來產生第二控制信號。在第一解碼器根據位址信號以及第一控制信號來選擇該字元線的期間,第二解碼器根據位址信號以及第二控制信號來選擇至少兩位元線,且記憶體裝置對此至少兩位元線各自執行一讀取/寫入操作。 An embodiment of the present invention provides a memory device including a memory array, a complex digital element line, a complex bit line, a first decoder, a second decoder, and a control circuit. The memory array includes a plurality of memory cells and a complex The number of memory cells is a complex memory cell. Each word line is coupled to a memory cell on a memory cell. Each bit line is coupled to a memory cell on a memory cell line. The first decoder receives the address signal and the first control signal, and selects a word line according to the address signal and the first control signal. The second decoder receives the address signal and the second control signal. The control circuit receives the first clock signal and the second clock signal. The control circuit generates a first control signal according to the first clock signal, and generates a second control signal according to the second clock signal. During a period in which the first decoder selects the word line according to the address signal and the first control signal, the second decoder selects at least two bit lines according to the address signal and the second control signal, and the memory device At least two bit lines each perform a read/write operation.
本發明之一實施例提供一種控制方法,用於一記憶體裝置。此記憶體裝置包括記憶體陣列、耦接記憶體陣列的複數字元線、以及耦接記憶體陣列的複數位元線。此控制方法包括以下步驟:接收第一時脈信號以及第二時脈信號;根據第一時脈信號來產生第一控制信號;根據第二時脈信號來產生第二控制信號;根據位址信號以及第一控制信號的致能狀態來選擇該些字元線之一者;在根據位址信號以及第一控制信號來選擇該些字元線之一者的期間,根據位址信號以及第二控制信號的致能狀態來選擇該些位元線中至少兩者;以及對被選擇的位元線各自執行一讀取/寫入操作。 An embodiment of the present invention provides a control method for a memory device. The memory device includes a memory array, complex digital lines coupled to the memory array, and complex bit lines coupled to the memory array. The control method includes the steps of: receiving a first clock signal and a second clock signal; generating a first control signal according to the first clock signal; generating a second control signal according to the second clock signal; And an enable state of the first control signal to select one of the word lines; during the selection of one of the word lines according to the address signal and the first control signal, according to the address signal and the second Controlling an enable state of the signal to select at least two of the bit lines; and performing a read/write operation on each of the selected bit lines.
1‧‧‧記憶體裝置 1‧‧‧ memory device
10‧‧‧記憶體陣列 10‧‧‧ memory array
11、12‧‧‧解碼器 11, 12‧‧‧ decoder
13‧‧‧控制電路 13‧‧‧Control circuit
142‧‧‧寫入-讀取電路 142‧‧‧Write-read circuit
15‧‧‧預充電電路 15‧‧‧Precharge circuit
100‧‧‧記憶胞 100‧‧‧ memory cells
ADD‧‧‧位址信號 ADD‧‧‧ address signal
BL0...BLY‧‧‧位元線 BL0...BLY‧‧‧ bit line
CCLK、RCLK‧‧‧時脈信號 CCLK, RCLK‧‧‧ clock signal
CEB、WEB‧‧‧致能信號 CEB, WEB‧‧‧ enable signal
DIN、DOUT‧‧‧資料 DIN, DOUT‧‧‧ data
S13R、S13C、S14‧‧‧控制信號 S13R, S13C, S14‧‧‧ control signals
S40...S46‧‧‧方法步驟 S40...S46‧‧‧ method steps
WL0...WLX‧‧‧字元線 WL0...WLX‧‧‧ character line
第1圖表示習知記憶體裝置的時脈信號與電源電流的示意圖。 Figure 1 is a schematic diagram showing the clock signal and power supply current of a conventional memory device.
第2圖表示根據本發明一實施例的記憶體裝置。 Fig. 2 shows a memory device in accordance with an embodiment of the present invention.
第3圖表示根據本發明一實施例,記憶體裝置的時脈信號與電源電流。 Figure 3 is a diagram showing the clock signal and power supply current of the memory device in accordance with an embodiment of the present invention.
第4圖表示根據本發明一實施例,用於記憶體裝置的控制方法。 Figure 4 is a diagram showing a control method for a memory device in accordance with an embodiment of the present invention.
為使本發明之上述目的、特徵和優點能更明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細說明如下。 The above described objects, features and advantages of the present invention will become more apparent from the description of the appended claims.
第2圖係表示根據本發明一實施例的記憶體裝置。參閱第1圖,記憶體裝置1包括記憶體陣列10、列解碼器11、行解碼器12、控制電路13、讀取-寫入電路14、以及預充電電路15。在一實施例中,記憶體裝置1為一靜態隨機存取記憶體。記憶體陣列10包括配置成複數列以及複數行的多個記憶胞100。列解碼器11透過字元線WL1-WLX連接記憶體陣列10,且每一字元線連接配置在同一列的記憶胞100。行列解碼器12透過位元線BL1-BLY連接記憶體陣列10,且每一位元線連接配置在同一行的記憶胞100。根據字元線WL1-WLX、位元線BL1-BLY、以及記憶胞100的配置可得知,每一記憶胞100對應一組字元線與位元線。 Figure 2 is a diagram showing a memory device in accordance with an embodiment of the present invention. Referring to FIG. 1, the memory device 1 includes a memory array 10, a column decoder 11, a row decoder 12, a control circuit 13, a read-write circuit 14, and a precharge circuit 15. In one embodiment, the memory device 1 is a static random access memory. The memory array 10 includes a plurality of memory cells 100 configured in a plurality of columns and a plurality of rows. The column decoder 11 is connected to the memory array 10 via word lines WL1-WLX, and each word line is connected to the memory cells 100 arranged in the same column. The row and column decoder 12 is connected to the memory array 10 through the bit lines BL1-BLY, and each bit line is connected to the memory cell 100 disposed in the same row. According to the configuration of the word line WL1-WLX, the bit line BL1-BLY, and the memory cell 100, each memory cell 100 corresponds to a set of word lines and bit lines.
控制電路13接收兩個不同的時脈信號RCLK與CCLK。控制電路13根據時脈信號RCLK來產生控制信號S13R給列解碼器11,且根據時脈信號CCLK來產生控制信號S13C給行解碼器12。參閱第3圖,時脈信號RCLK的頻率不同於時脈信 號CCLK的頻率。詳細來說,時脈信號RCLK包括多個脈波PLSR而時脈信號CCLK包括多個脈波PLSC,在時脈信號RCLK的每一個脈波PLSR的持續期間,發生了多個時脈信號CCLK的脈波PLSC。舉例來說,在時脈信號RCLK的每一個脈波PLSR的持續期間,發生了(N+1)個脈波PLSC,其中,N≧1。控制電路13還接收致能信號WEB與CEB,以分別用於記憶體裝置1的寫入致能以及晶片致能。控制電路13另外產生控制信號S14至讀取-寫入電路14,以控制讀取-寫入電路14執行讀取或寫入操作。以下將參考第2與3圖來說明記憶體裝置1的操作。 Control circuit 13 receives two different clock signals RCLK and CCLK. The control circuit 13 generates a control signal S13R to the column decoder 11 based on the clock signal RCLK, and generates a control signal S13C to the row decoder 12 based on the clock signal CCLK. Referring to Figure 3, the frequency of the clock signal RCLK is different from the clock signal. No. CCLK frequency. In detail, the clock signal RCLK includes a plurality of pulse waves PLSR and the clock signal CCLK includes a plurality of pulse waves PLSC. During the duration of each pulse wave PLSR of the clock signal RCLK, a plurality of clock signals CCLK occur. Pulse wave PLSC. For example, during the duration of each pulse wave PLSR of the clock signal RCLK, (N+1) pulse waves PLSC occur, where N≧1. The control circuit 13 also receives the enable signals WEB and CEB for write enable and wafer enable for the memory device 1, respectively. The control circuit 13 additionally generates a control signal S14 to the read-write circuit 14 to control the read-write circuit 14 to perform a read or write operation. The operation of the memory device 1 will be described below with reference to FIGS. 2 and 3.
每當時脈信號RCLK發生正緣觸發時,控制電路13產生處於致能狀態的控制信號S13R來致能解碼器11,使其根據接收到的位址信號ADD來鎖定一位址且根據鎖定的位址來選擇一條字元線例如字元線WL1。每當時脈信號CCLK發生正緣觸發時,控制電路13產生處於致能狀態的控制信號S13C來致能解碼器12,使其根據接收到的位址信號ADD來鎖定一位址且根據鎖定的位址來選擇一條位元線。參閱第3圖,在時脈信號RCLK的連續兩次正緣觸發之間的期間,時脈信號CCLK多次發生正緣觸發。因此可得知,在一條字元線被選擇的期間,多條(至少兩條)位元線被選擇,且讀取-寫入電路14根據來自控制電路13的控制信號S14對被選擇的位元線各自執行讀取/寫入操作,以自對應的記憶胞讀取資料DOUT或將資料DIN寫入至對應的記憶胞。在一實施例中,資料DOUT與資料DIN為串列資料。當讀取-寫入電路14執行讀取/寫入操作時,是以框頁(frame-page)模式、封包模式、或者序列模式來將資料DOUT讀 出或寫入資料DIN。在此情況下,記憶體裝置1可作為緩衝器裝置。 Whenever the clock signal RCLK is positively triggered, the control circuit 13 generates a control signal S13R in an enabled state to enable the decoder 11 to lock the address according to the received address signal ADD and according to the locked bit. The address is used to select a word line such as the word line WL1. Whenever the clock signal CCLK is positively triggered, the control circuit 13 generates a control signal S13C in an enabled state to enable the decoder 12 to lock the address according to the received address signal ADD and according to the locked bit. Address to select a bit line. Referring to FIG. 3, during the period between two consecutive positive edge triggers of the clock signal RCLK, the clock signal CCLK is triggered multiple times by the positive edge. Therefore, it can be known that during the period in which one word line is selected, a plurality of (at least two) bit lines are selected, and the read-write circuit 14 pairs the selected bits in accordance with the control signal S14 from the control circuit 13. The element lines each perform a read/write operation to read the material DOUT from the corresponding memory cell or write the data DIN to the corresponding memory cell. In one embodiment, the data DOUT and the data DIN are serial data. When the read-write circuit 14 performs a read/write operation, the material DOUT is read in a frame-page mode, a packet mode, or a sequence mode. Output or write data DIN. In this case, the memory device 1 can function as a buffer device.
根據上述,控制電路13是根據不同的時脈信號來控制解碼器11與13,使得對同一記憶胞列上的至少兩個記憶胞進行讀取/寫入時,解碼器11不須執行兩次對於同一條字元線的位址鎖定。詳細來說,當一字元線被選擇時,可對耦接該字元線的一記憶胞列上的至少兩個記憶胞進行讀取/寫入,直到對於記憶胞列的讀取/寫入完成。接著,可選擇另一字元線以進行後續的讀取/寫入操作。換句話說,一記憶胞列上的記憶胞讀取或寫入完成後,才進行下一記憶胞列的讀取/寫入。因此,對於一記憶胞列的讀取/寫入,解碼器11僅需鎖定一次位址。 According to the above, the control circuit 13 controls the decoders 11 and 13 according to different clock signals so that when at least two memory cells on the same memory cell are read/written, the decoder 11 does not need to be executed twice. Address lock for the same character line. In detail, when a word line is selected, at least two memory cells on a memory cell coupled to the word line can be read/written until read/write to the memory cell column. Into the completion. Next, another word line can be selected for subsequent read/write operations. In other words, reading/writing of the next memory cell row is performed after the memory cell reading or writing on a memory cell column is completed. Therefore, for a read/write of a memory cell, the decoder 11 only needs to lock the address once.
此外,由於上述實施例所揭露的字元線與位元線選擇以及資料讀取/寫入模式,在解碼器11鎖定一位址以選擇一對應字元線的期間中,在對多個位元線執行讀取/寫入操作之前,預充電電路15僅需對位元線BL1-BLY執行一次預充電操作。參閱第3圖,在解碼器11選擇一字元線的期間時,僅伴隨著一次的預充電操作,使得伴隨發生的突波電流僅會將電源電流IVDD瞬間被下拉一次。如此一來可減少記憶體裝置1運作時的功率消耗。 In addition, due to the word line and bit line selection and the data read/write mode disclosed in the above embodiments, in the period in which the decoder 11 locks the address to select a corresponding word line, the plurality of bits are Before the source line performs the read/write operation, the precharge circuit 15 only needs to perform a precharge operation on the bit line BL1-BLY. Referring to Fig. 3, when the decoder 11 selects a word line period, only the one-time precharge operation causes the accompanying surge current to instantaneously pull down the power supply current I VDD once. In this way, the power consumption of the memory device 1 during operation can be reduced.
在上述實施例中,在一字元線被選擇的期間(即在時脈信號RCLK的一脈波PLSR的持續期間),讀取-寫入電路14可對被選擇的位元線全部執行讀取操作、可對被選擇的位元線全部執行寫入操作、或者可被選擇的位元線的一部分執行讀取 操作而另一部分執行寫入操作。 In the above embodiment, during a period in which a word line is selected (i.e., during the duration of a pulse PLSR of the clock signal RCLK), the read-write circuit 14 can perform a read on all of the selected bit lines. Take operation, perform a write operation on all selected bit lines, or perform a read on a part of the selected bit line The operation is performed while the other part performs the write operation.
第4圖係表示根據本發明實施例,用於記憶體裝置的控制方法流程圖。此控制方法將參閱第2-4圖來說明。首先,接收不同的兩個時脈信號RCLK與CCLK(步驟S40)。根據時脈信號RCLK來產生控制信號S13R(步驟S41)。在一實施例中,當時脈信號RCLK發生一正緣觸發時,控制信號S13R被致能。根據時脈信號CCLK來產生控制信號S13C(步驟S42)。在一實施例中,當時脈信號CCLK發生一正緣觸發時,控制信號S13C被致能。根據位址信號ADD以及控制信號S13R的致能狀態來鎖定一位址以選擇一字元線(步驟S43)。在選擇該字元線(步驟S43)的期間,對位元線BL1-BLY執行一次預充電操作(步驟S44)。在選擇該字元線(步驟S43)的期間,於預充電操作執行完成後,根據該位址信號ADD以及控制信號S13C的致能狀態來鎖定一位址以選擇至少兩條位元線(步驟S45),並對被選擇的位元線各自執行讀取/寫入操作(步驟S46)。當步驟S46的讀取/寫入完成後,方法回到步驟S43,以選擇另一條字元線。 Figure 4 is a flow chart showing a control method for a memory device in accordance with an embodiment of the present invention. This control method will be explained with reference to Figure 2-4. First, two different clock signals RCLK and CCLK are received (step S40). The control signal S13R is generated based on the clock signal RCLK (step S41). In an embodiment, when a positive edge trigger occurs on the pulse signal RCLK, the control signal S13R is enabled. The control signal S13C is generated based on the clock signal CCLK (step S42). In an embodiment, when a positive edge trigger occurs on the pulse signal CCLK, the control signal S13C is enabled. The address is locked in accordance with the enable state of the address signal ADD and the control signal S13R to select a word line (step S43). During the selection of the word line (step S43), a precharge operation is performed on the bit line BL1-BLY once (step S44). During the selection of the word line (step S43), after the precharge operation is completed, the address is locked according to the enable state of the address signal ADD and the control signal S13C to select at least two bit lines (steps) S45), and a read/write operation is performed on each of the selected bit lines (step S46). When the reading/writing of step S46 is completed, the method returns to step S43 to select another character line.
根據上述,用於字元線選擇的時脈信號RCLK不同於用於位元線選擇的時脈信號CCLK,使得對同一記憶胞列上的至少兩個記憶胞進行讀取/寫入時,不須執行兩次對於同一條字元線的位址鎖定。此外,在選擇一字元線的期間時,即使是對多個位元線執行讀取/寫入操作,僅伴隨著一次的預充電操作,使得伴隨發生的突波電流僅會將電源電流IVDD瞬間被下拉一次。如此一來可減少記憶體裝置1運作時的功率消耗。 According to the above, the clock signal RCLK for word line selection is different from the clock signal CCLK for bit line selection, so that when at least two memory cells on the same memory cell are read/written, The address lock for the same character line must be performed twice. In addition, when a period of one word line is selected, even if a read/write operation is performed on a plurality of bit lines, only one precharge operation is accompanied, so that the accompanying surge current only causes the power source current I. VDD is pulled down once. In this way, the power consumption of the memory device 1 during operation can be reduced.
本發明雖以較佳實施例揭露如上,然其並非用以 限定本發明的範圍,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed above in the preferred embodiment, it is not The scope of the present invention is defined by those skilled in the art, and the scope of the invention is intended to be modified and modified. The definition is final.
1‧‧‧記憶體裝置 1‧‧‧ memory device
10‧‧‧記憶體陣列 10‧‧‧ memory array
11、12‧‧‧解碼器 11, 12‧‧‧ decoder
13‧‧‧控制電路 13‧‧‧Control circuit
14‧‧‧寫入-讀取電路 14‧‧‧Write-read circuit
15‧‧‧預充電電路 15‧‧‧Precharge circuit
100‧‧‧記憶胞 100‧‧‧ memory cells
ADD‧‧‧位址信號 ADD‧‧‧ address signal
BL0...BLY‧‧‧位元線 BL0...BLY‧‧‧ bit line
CCLK、RCLK‧‧‧時脈信號 CCLK, RCLK‧‧‧ clock signal
CEB、WEB‧‧‧致能信號 CEB, WEB‧‧‧ enable signal
DIN、DOUT‧‧‧資料 DIN, DOUT‧‧‧ data
S13R、S13C、S14‧‧‧控制信號 S13R, S13C, S14‧‧‧ control signals
WL0...WLX‧‧‧字元線 WL0...WLX‧‧‧ character line
Claims (14)
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TWI309774B (en) * | 2006-02-20 | 2009-05-11 | Magima Digital Information Co Ltd | Method and system for accessing memory data |
US7881147B2 (en) * | 2007-05-31 | 2011-02-01 | Qualcomm Incorporated | Clock and control signal generation for high performance memory devices |
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