TW201627731A - Array substrate and method for rubbing the same - Google Patents
Array substrate and method for rubbing the same Download PDFInfo
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Abstract
Description
本發明是有關於一種陣列基板。 The present invention relates to an array substrate.
隨著科技進步,液晶顯示器的使用也越來越普及。於液晶液晶顯示器的工作原理中,由於液晶具有旋光性,因此透過對液晶層施加電場,即可控制穿過液晶層的光線之極化方向。此外,液晶的排列方向需由配向膜定義,亦即配向膜提供位於邊界的液晶初始排列方向。因此,液晶顯示器的顯示品質與其配向膜具有一定的關係。 With the advancement of technology, the use of liquid crystal displays has become more and more popular. In the working principle of the liquid crystal liquid crystal display, since the liquid crystal has optical rotation, the polarization direction of the light passing through the liquid crystal layer can be controlled by applying an electric field to the liquid crystal layer. In addition, the alignment direction of the liquid crystal needs to be defined by the alignment film, that is, the alignment film provides the initial alignment direction of the liquid crystal at the boundary. Therefore, the display quality of a liquid crystal display has a certain relationship with its alignment film.
於配向膜的製程中,通常先形成聚醯亞胺(polyimide,PI)。接著,再利用配向布毛之尖端與聚醯亞胺進行配向,使得聚醯亞胺沿配向方向產生延伸排列的凹槽,其中凹槽提供位於邊界的液晶預傾角。更進一步而言,配向製程的品質與液晶顯示器的顯示品質也有一定關聯性。因此,如何能有效提升配向製程的品質,實屬當前重要研發課題之一,亦成為當前相關領域研究之方向。 In the process of the alignment film, polyimide (PI) is usually formed first. Next, the alignment of the alignment bristles with the polyimide is used to cause the polyimide to form an extended array of grooves in the alignment direction, wherein the grooves provide a liquid crystal pretilt angle at the boundary. Furthermore, the quality of the alignment process is also related to the display quality of the liquid crystal display. Therefore, how to effectively improve the quality of the alignment process is one of the current important research and development topics, and has become the research direction of relevant fields.
於配向製程中,為因應液晶顯示器所設計的視角方向,配向布毛進入配向膜的角度可能為45度、90度或135度。因此,當配向布毛與位於周邊區的配向膜接觸後,配向布毛將會受到位於周邊區的走線影響,使得配向布毛尖端發生分叉或改變方向,並造成配向不均進而影響顯示品質的問題。 In the alignment process, the angle of the alignment cloth entering the alignment film may be 45 degrees, 90 degrees or 135 degrees in response to the viewing angle direction of the liquid crystal display. Therefore, when the alignment cloth is in contact with the alignment film located in the peripheral area, the alignment cloth will be affected by the traces located in the peripheral area, causing the alignment of the tip of the distribution cloth to bifurcate or change direction, and causing uneven alignment to affect the display. Quality issues.
有鑑於此,本發明下列實施方式之陣列基板設置有平坦層,其中平坦層設置於走線上,使得走線之間的間隙被平坦層填平。因此,當透過配向布毛進行配向時,配向布毛將不會受到位於周邊區的走線影響,進而改善配向不均的問題。也因此,陣列基板的配向製程品質以及良率能受到提升,並也連帶提升後續完成之液晶顯示器的顯示品質。 In view of this, the array substrate of the following embodiment of the present invention is provided with a flat layer in which the flat layer is disposed on the trace such that the gap between the traces is filled by the flat layer. Therefore, when the alignment is performed by the alignment cloth, the alignment cloth will not be affected by the wiring located in the peripheral area, thereby improving the problem of uneven alignment. Therefore, the alignment process quality and yield of the array substrate can be improved, and the display quality of the subsequently completed liquid crystal display can be improved.
本揭示內容之一態樣提供一種陣列基板,包含基板、畫素電路、走線、配向膜以及平坦層。基板包含顯示區以及周邊區。畫素電路設置於顯示區。走線設置於周邊區,並與畫素電路連接。配向膜設置於顯示區以及周邊區。平坦層設置於周邊區,藉此平坦化周邊區。 One aspect of the present disclosure provides an array substrate comprising a substrate, a pixel circuit, traces, an alignment film, and a planarization layer. The substrate includes a display area and a peripheral area. The pixel circuit is disposed in the display area. The trace is placed in the peripheral area and connected to the pixel circuit. The alignment film is disposed in the display area and the peripheral area. A flat layer is disposed in the peripheral region, thereby flattening the peripheral region.
於部分實施方式中,平坦層位於配向膜與基板之間。 In some embodiments, the planarization layer is between the alignment film and the substrate.
於部分實施方式中,配向膜位於平坦層與基板之間。 In some embodiments, the alignment film is between the planar layer and the substrate.
於部分實施方式中,平坦層厚度介於0.5微米至5微米之間。 In some embodiments, the flat layer thickness is between 0.5 microns and 5 microns.
於部分實施方式中,配向膜厚度介於80奈米至 135奈米之間。 In some embodiments, the alignment film thickness is between 80 nm and Between 135 nm.
本揭示內容之一態樣提供一種陣列基板的配向方法,包含下列步驟。分別形成互相連接的畫素電路以及走線於基板的顯示區以及周邊區上。形成配向膜於顯示區以及周邊區上。形成平坦層於周邊區的配向膜上,藉此平坦化周邊區。透過配向布毛進行配向膜之配向。 One aspect of the present disclosure provides an alignment method of an array substrate, comprising the following steps. The interconnected pixel circuits are respectively formed and routed on the display area of the substrate and the peripheral area. An alignment film is formed on the display area and the peripheral area. A flat layer is formed on the alignment film of the peripheral region, thereby planarizing the peripheral region. The alignment of the alignment film is performed through the alignment cloth.
本揭示內容之一態樣提供一種陣列基板的配向方法,包含下列步驟。分別形成互相連接的畫素電路以及走線於基板的顯示區以及周邊區上。形成平坦層於周邊區上,藉此平坦化周邊區。形成配向膜於顯示區以及周邊區上。透過配向布毛進行配向膜之配向。 One aspect of the present disclosure provides an alignment method of an array substrate, comprising the following steps. The interconnected pixel circuits are respectively formed and routed on the display area of the substrate and the peripheral area. A flat layer is formed on the peripheral region, thereby flattening the peripheral region. An alignment film is formed on the display area and the peripheral area. The alignment of the alignment film is performed through the alignment cloth.
於部分實施方式中,平坦層厚度介於0.5微米至5微米之間,配向膜厚度介於80奈米至135奈米之間。 In some embodiments, the flat layer thickness is between 0.5 microns and 5 microns and the alignment film thickness is between 80 nm and 135 nm.
於部分實施方式中,透過配向布毛進行配向膜之配向之步驟更包含以下步驟。配向布毛自周邊區進入顯示區。 In some embodiments, the step of aligning the alignment film through the alignment cloth further comprises the following steps. The matching cloth hair enters the display area from the surrounding area.
綜上所述,本發明之陣列基板設置有平坦層,其中平坦層位於周邊區上。具體而言,平坦層設置於配向布毛進入顯示區的路徑上。因此,當透過配向布毛進行配向膜的配向時,配向布毛不會受到位於周邊區的走線影響。更進一步來說,配向布毛不會因走線間的間隙而使得其尖端產生分叉或改變方向,並進而改善配向不均的問題。也因此,藉由設置平坦層,陣列基板的配向製程品質以及良率能受到提升。 In summary, the array substrate of the present invention is provided with a flat layer in which the flat layer is located on the peripheral region. Specifically, the flat layer is disposed on the path of the alignment cloth entering the display area. Therefore, when the alignment of the alignment film is performed through the alignment cloth, the alignment cloth is not affected by the wiring located in the peripheral area. Furthermore, the alignment cloth does not cause the tip end to bifurcate or change direction due to the gap between the wires, and thus the problem of uneven alignment. Therefore, by providing a flat layer, the alignment process quality and yield of the array substrate can be improved.
100‧‧‧陣列基板 100‧‧‧Array substrate
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧顯示區 112‧‧‧ display area
113‧‧‧表面 113‧‧‧ Surface
114‧‧‧周邊區 114‧‧‧The surrounding area
116‧‧‧框膠區 116‧‧‧Blocking area
120‧‧‧畫素電路 120‧‧‧pixel circuit
122‧‧‧走線 122‧‧‧Wiring
124‧‧‧端子 124‧‧‧ terminals
130‧‧‧配向膜 130‧‧‧Alignment film
132‧‧‧表面 132‧‧‧ surface
140‧‧‧平坦層 140‧‧‧flat layer
142‧‧‧表面 142‧‧‧ surface
150‧‧‧配向布毛 150‧‧‧Alignment cloth
BB’‧‧‧線段 BB’‧‧‧ segment
S10-S40、P10-P40‧‧‧步驟 S10-S40, P10-P40‧‧‧ steps
第1A圖為根據本發明一實施方式之陣列基板的上視示意圖。 FIG. 1A is a top plan view of an array substrate according to an embodiment of the present invention.
第1B圖為沿第1A圖之線段BB’的剖面示意圖。 Fig. 1B is a schematic cross-sectional view taken along line BB' of Fig. 1A.
第1C圖為第1A圖之陣列基板的側視示意圖。 Figure 1C is a side elevational view of the array substrate of Figure 1A.
第2圖為根據本發明一實施方式之陣列基板進行配向的上視示意圖。 Fig. 2 is a top plan view showing alignment of an array substrate according to an embodiment of the present invention.
第3A圖為根據本發明另一實施方式之陣列基板的剖面示意圖。 3A is a schematic cross-sectional view of an array substrate according to another embodiment of the present invention.
第3B圖為第3A圖之陣列基板的側視示意圖。 Figure 3B is a side elevational view of the array substrate of Figure 3A.
第4圖為第1A~1C圖之陣列基板的配向方法流程圖。 Fig. 4 is a flow chart showing the alignment method of the array substrate of Figs. 1A to 1C.
第5圖為第3A~3B圖之陣列基板的配向方法流程圖。 Fig. 5 is a flow chart showing the alignment method of the array substrate of Figs. 3A to 3B.
第1A圖為根據本發明一實施方式之陣列基板100的上視示意圖。第1B圖為沿第1A圖之線段BB’的剖面示意圖。陣列基板100包含基板110、畫素電路120、走線122、端子124、配向膜130與平坦層140。基板110包含顯示區112以及周邊區114。畫素電路120設置於顯示區112。走線122設置於周邊區114,並連接畫素電路120與端子124。配向膜130設置於顯示區112與周邊區114。平坦層140設置於周邊區114,藉此平坦化周邊區114。 FIG. 1A is a top plan view of an array substrate 100 according to an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along line BB' of Fig. 1A. The array substrate 100 includes a substrate 110, a pixel circuit 120, traces 122, terminals 124, an alignment film 130, and a flat layer 140. The substrate 110 includes a display area 112 and a peripheral area 114. The pixel circuit 120 is disposed in the display area 112. The trace 122 is disposed in the peripheral region 114 and connects the pixel circuit 120 and the terminal 124. The alignment film 130 is disposed on the display area 112 and the peripheral area 114. The planarization layer 140 is disposed in the peripheral region 114, thereby planarizing the peripheral region 114.
於周邊區114內,配向膜130覆蓋基板110與走線122。平坦層140覆蓋配向膜130,使得陣列基板100對應周邊區114的表面為平坦表面142。 In the peripheral region 114, the alignment film 130 covers the substrate 110 and the traces 122. The planarization layer 140 covers the alignment film 130 such that the surface of the array substrate 100 corresponding to the peripheral region 114 is a flat surface 142.
具體而言,由於位於周邊區114的走線122之間具有間隙,因此基板110與走線122之間會存在有段差,此段差將形成具有起伏的表面113。透過平坦層140與配向膜130的配置,基板110與走線122之間的段差會被此配置所填補。 In particular, since there is a gap between the traces 122 located in the peripheral region 114, there will be a step difference between the substrate 110 and the trace 122, which will form a surface 113 having an undulation. Through the arrangement of the flat layer 140 and the alignment film 130, the step difference between the substrate 110 and the trace 122 is filled by this configuration.
請再看到第1B圖以及第1C圖,其中第1C圖為第1A圖之陣列基板100的側視示意圖。在本實施方式中,配向膜130位於平坦層140與基板110之間。此外,配向膜130自周邊區114延伸至顯示區112,並覆蓋畫素電路120,其中周邊區114與顯示區112的配向膜130為同一層配向膜130。在本實施方式中,平坦層140僅覆蓋位於周邊區114的配向膜130,因此當進行後續配向製程時,位於顯示區112的配向膜130仍然能夠被配向布毛摩擦配向。 Please refer to FIG. 1B and FIG. 1C again, wherein FIG. 1C is a side view of the array substrate 100 of FIG. 1A. In the present embodiment, the alignment film 130 is located between the flat layer 140 and the substrate 110. In addition, the alignment film 130 extends from the peripheral region 114 to the display region 112 and covers the pixel circuit 120, wherein the peripheral region 114 and the alignment film 130 of the display region 112 are the same layer alignment film 130. In the present embodiment, the planarization layer 140 covers only the alignment film 130 located in the peripheral region 114, so that when the subsequent alignment process is performed, the alignment film 130 located in the display region 112 can still be aligned by the alignment of the cloth.
第2圖為對本發明一實施方式之陣列基板100進行配向的上視示意圖。當要利用配向布毛150對陣列基板100進行配向時,配向布毛150將沿箭頭方向進入周邊區114,接著再進入顯示區112,並對顯示區112內的配向膜130進行配向。 Fig. 2 is a top plan view showing the alignment of the array substrate 100 according to the embodiment of the present invention. When the array substrate 100 is to be aligned by the alignment bristles 150, the alignment bristles 150 will enter the peripheral region 114 in the direction of the arrow, then enter the display region 112, and align the alignment film 130 in the display region 112.
在配向時,配向布毛150會先接觸周邊區114。當配向布毛150接觸周邊區114時,由於平坦層140的存在,配向布毛150所接觸的將會是平坦表面142,因此配向 布毛150的尖端將不會因為接觸到段差而有分叉或改變方向的情況發生。也因此,配向布毛150對配向膜130所進行的配向製程也將不會有顯著的不均勻現象產生。 In the alignment, the alignment bristles 150 will first contact the peripheral zone 114. When the alignment cloth 150 contacts the peripheral region 114, due to the presence of the flat layer 140, the alignment cloth 150 will contact the flat surface 142, thus the alignment The tip of the bristles 150 will not be bifurcated or redirected due to contact with the step. Therefore, the alignment process performed by the alignment cloth 150 on the alignment film 130 will also not cause significant unevenness.
也就是說,透過平坦層140與配向膜130的配置,配向布毛150對配向膜130所進行的配向將會更均勻,使得利用此陣列基板100所製造之液晶顯示器的顯示品質能夠獲得提升。 That is to say, through the arrangement of the flat layer 140 and the alignment film 130, the alignment of the alignment cloth 150 to the alignment film 130 will be more uniform, so that the display quality of the liquid crystal display manufactured by the array substrate 100 can be improved.
回到第1B圖,在本實施方式中,走線122的厚度為0.6微米,亦即走線122與基板110之間的段差深度為0.6微米。此外,在本實施方式中,配向膜130的厚度介於80奈米至135奈米之間,而平坦層140的厚度介於0.5微米至5微米之間。 Returning to FIG. 1B, in the present embodiment, the thickness of the trace 122 is 0.6 micrometers, that is, the depth of the step between the trace 122 and the substrate 110 is 0.6 micrometers. Further, in the present embodiment, the thickness of the alignment film 130 is between 80 nm and 135 nm, and the thickness of the flat layer 140 is between 0.5 μm and 5 μm.
在本實施方式中,平坦層140與配向膜130的總體厚度為1.5微米,因此能填補深度為0.6微米的段差。然而,應了解到,以上所舉之走線122的厚度,以及走線122與基板110之間的段差深度僅為例示,並非用以限制本發明。本發明所屬技術領域中具有通常知識者,可依實際需要,彈性選擇平坦層140與配向膜130的厚度,只要能填補走線122與基板110之間的段差即可。 In the present embodiment, the flat layer 140 and the alignment film 130 have an overall thickness of 1.5 μm, and thus can fill a step of a depth of 0.6 μm. However, it should be understood that the thickness of the trace 122 and the depth of the step between the trace 122 and the substrate 110 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention can flexibly select the thickness of the flat layer 140 and the alignment film 130 according to actual needs, as long as the step difference between the trace 122 and the substrate 110 can be filled.
如第1C圖所示,由於平坦層140僅覆蓋位於周邊區114的配向膜130,因此顯示區112與周邊區114之間會有一段差。然而,相較於走線122與基板110之間的段差,顯示區112與周邊區114之間的段差為單一段差,且此單一段差橫跨整個陣列基板100,因此並不會有均勻性的問題。 As shown in FIG. 1C, since the flat layer 140 covers only the alignment film 130 located in the peripheral region 114, there is a difference between the display region 112 and the peripheral region 114. However, compared to the step difference between the trace 122 and the substrate 110, the step difference between the display region 112 and the peripheral region 114 is a single step difference, and the single step difference spans the entire array substrate 100, so there is no uniformity. problem.
請再回到第1A圖。本實施方式之平坦層140可不必覆蓋端子124,以利端子124與外部電路電性連接。此外,完成配向後的配向膜130上可設置有框膠區116,此框膠區116可用來設置框膠以進行後續的貼合製程。 Please return to Figure 1A. The flat layer 140 of the present embodiment may not necessarily cover the terminal 124, so that the terminal 124 is electrically connected to an external circuit. In addition, the finished alignment film 130 may be provided with a sealant area 116, which may be used to set the sealant for subsequent bonding processes.
第3A圖為根據本發明另一實施方式之陣列基板100的剖面示意圖,其剖面位置與第1B圖相同。第3B圖為第3A圖之陣列基板100的側視示意圖。本實施方式與前一實施方式的差異在於:本實施方式的平坦層140位於配向膜130與基板110之間。 Fig. 3A is a schematic cross-sectional view showing an array substrate 100 according to another embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 1B. 3B is a side view of the array substrate 100 of FIG. 3A. The difference between this embodiment and the previous embodiment is that the flat layer 140 of the present embodiment is located between the alignment film 130 and the substrate 110.
更具體地說,於周邊區114內,平坦層140覆蓋基板110與走線122。配向膜130覆蓋平坦層140。由於平坦層140能夠平坦化周邊區114,因此當配向膜130覆蓋於平坦層140上時,配向膜130所在的位置是由平坦層140所提供的平坦表面142。因此,配向膜130的表面132也將是平坦的表面,而不會有過大的段差。 More specifically, in the peripheral region 114, the planar layer 140 covers the substrate 110 and the traces 122. The alignment film 130 covers the flat layer 140. Since the planarization layer 140 is capable of planarizing the peripheral region 114, when the alignment film 130 is overlaid on the planarization layer 140, the location where the alignment film 130 is located is the planar surface 142 provided by the planarization layer 140. Therefore, the surface 132 of the alignment film 130 will also be a flat surface without an excessive step.
同樣地,當對配向膜130進行配向製程時,由於配向布毛於周邊區114內所接觸到的將會是平坦表面。因此,配向布毛的尖端將不會因為接觸到段差而有分叉或改變方向的情況產生。也因此,配向布毛對配向膜130所進行的配向製程也不會有顯著的不均勻現象產生。 Similarly, when the alignment film 130 is subjected to the alignment process, since the alignment cloth is in contact with the peripheral region 114, it will be a flat surface. Therefore, the tip of the alignment cloth will not be bifurcated or redirected due to contact with the step. Therefore, there is no significant unevenness in the alignment process performed by the alignment cloth on the alignment film 130.
第4圖為第1A~1C圖之陣列基板100的配向方法流程圖。第1A~1C圖之陣列基板100的配向方法包含以下步驟。步驟P10,分別於基板110的顯示區112以及周邊區114上形成互相連接的畫素電路120以及走線122。步驟 P20,於顯示區112以及周邊區114上形成配向膜130。步驟P30,於周邊區114的配向膜130上形成平坦層140,藉此平坦化周邊區114。步驟P40,透過配向布毛進行配向膜130之配向。 Fig. 4 is a flow chart showing the alignment method of the array substrate 100 of Figs. 1A to 1C. The alignment method of the array substrate 100 of FIGS. 1A to 1C includes the following steps. In step P10, interconnected pixel circuits 120 and traces 122 are formed on the display area 112 and the peripheral area 114 of the substrate 110, respectively. step P20, an alignment film 130 is formed on the display area 112 and the peripheral area 114. In step P30, a flat layer 140 is formed on the alignment film 130 of the peripheral region 114, thereby planarizing the peripheral region 114. In step P40, the alignment of the alignment film 130 is performed through the alignment cloth.
第5圖為第3A~3B圖之陣列基板100的配向方法流程圖。第3A~3B圖之陣列基板100的配向方法包含以下步驟。步驟S10,分別於基板110的顯示區112以及周邊區114上形成互相連接的畫素電路120以及走線122。步驟S20,於周邊區114上形成平坦層140,藉此平坦化周邊區114。步驟S30,於顯示區112以及周邊區114上形成配向膜130。步驟S40,透過配向布毛進行配向膜130之配向。 Fig. 5 is a flow chart showing the alignment method of the array substrate 100 of Figs. 3A to 3B. The alignment method of the array substrate 100 of FIGS. 3A to 3B includes the following steps. In step S10, interconnected pixel circuits 120 and traces 122 are formed on the display area 112 of the substrate 110 and the peripheral area 114, respectively. In step S20, a flat layer 140 is formed on the peripheral region 114, thereby flattening the peripheral region 114. In step S30, an alignment film 130 is formed on the display area 112 and the peripheral area 114. In step S40, the alignment of the alignment film 130 is performed through the alignment cloth.
綜上所述,本發明上述實施方式之陣列基板設置有位於周邊區的平坦層。因此,當透過配向布毛進行陣列基板的配向時,配向布毛將不會受到位於周邊區的走線影響,使得配向布毛尖端有分叉或改變方向的情況發生。 In summary, the array substrate of the above embodiment of the present invention is provided with a flat layer located in the peripheral region. Therefore, when the alignment of the array substrate is performed through the alignment cloth, the alignment cloth will not be affected by the wiring located in the peripheral area, so that the alignment cloth tip has a bifurcation or a change of direction.
雖然本發明已以多種實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the invention has been described above in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.
100‧‧‧陣列基板 100‧‧‧Array substrate
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧顯示區 112‧‧‧ display area
114‧‧‧周邊區 114‧‧‧The surrounding area
116‧‧‧框膠區 116‧‧‧Blocking area
120‧‧‧畫素電路 120‧‧‧pixel circuit
122‧‧‧走線 122‧‧‧Wiring
124‧‧‧端子 124‧‧‧ terminals
130‧‧‧配向膜 130‧‧‧Alignment film
140‧‧‧平坦層 140‧‧‧flat layer
BB’‧‧‧線段 BB’‧‧‧ segment
Claims (10)
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