[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TW201616092A - Method for measuring three-dimensional shape of object - Google Patents

Method for measuring three-dimensional shape of object Download PDF

Info

Publication number
TW201616092A
TW201616092A TW103136416A TW103136416A TW201616092A TW 201616092 A TW201616092 A TW 201616092A TW 103136416 A TW103136416 A TW 103136416A TW 103136416 A TW103136416 A TW 103136416A TW 201616092 A TW201616092 A TW 201616092A
Authority
TW
Taiwan
Prior art keywords
image capturing
capturing unit
angle
image
dimensional shape
Prior art date
Application number
TW103136416A
Other languages
Chinese (zh)
Other versions
TWI487877B (en
Inventor
章明
陳柏呈
Original Assignee
中原大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中原大學 filed Critical 中原大學
Priority to TW103136416A priority Critical patent/TW201616092A/en
Application granted granted Critical
Publication of TWI487877B publication Critical patent/TWI487877B/zh
Publication of TW201616092A publication Critical patent/TW201616092A/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

The present invention relates to a method for measuring a three-dimensional shape of object comprising steps: disposing two linear image capturing units on a moving path of an object under test to perform scanning in order to capture an image of the object while the object moves at high speed. With the parameters computation, such as specifications of the linear image capturing unit, an image moving distance, an angle between a scanning direction of the linear image capturing unit and a normal direction of a platform where the object is located, etc., the three-dimensional coordinates of the object can be precisely captured to further establish its three-dimensional shape .

Description

物體三維形貌之量測方法Method for measuring the three-dimensional shape of an object 【0001】【0001】

本發明係關於一種物體三維形貌之量測方法,尤指一種具有高速及高解析度等優點之物體三維形貌之量測方法。



The invention relates to a method for measuring the three-dimensional shape of an object, in particular to a method for measuring the three-dimensional shape of an object having the advantages of high speed and high resolution.



【0002】【0002】

在各種自動化檢測技術中,以光學量測方式搭配高解析度的影像擷取系統,不但量測速度快,精度高,且不需與待測物直接接觸,因此在講求速度及不接觸物件的限制條件下,光學量測方式蔚為最佳之選擇。Among various automatic detection technologies, optical measurement method combined with high-resolution image capture system not only measures fast speed, high precision, but also does not need to be in direct contact with the object to be tested, so it is concerned with speed and non-contact objects. Under the limited conditions, the optical measurement method is the best choice.

【0003】[0003]

光學量測的方式相當多,主要有雷射聚焦技術、線雷射掃描法、結構光、投射條紋法、疊紋法以及干涉儀等,都可用以進行物體的三維輪廓外形檢測;然而,受限於面形影像擷取裝置的像素數目與取像原理,現有技術的解析度與量測速度均無法太高,更無法應用於製程線上檢測,而僅能應用於離線檢測。There are quite a few optical measurement methods, such as laser focusing technology, line laser scanning method, structured light, projection stripe method, embossing method and interferometer, etc., which can be used to detect the three-dimensional contour of an object; Due to the pixel number and image capturing principle of the surface image capturing device, the resolution and measurement speed of the prior art cannot be too high, and can not be applied to the process line detection, but can only be applied to offline detection.

【0004】[0004]

中華民國專利公告號I229186曾揭露一種雙視角之三維形貌影像線性掃描檢測裝置,其係包含一正視角線性掃描裝置、一斜視角線性掃描裝置以及一光源裝置。透過由正視角線性掃描裝置所感測得到的正視角截面影像加上經由斜視角線性掃描裝置所感測得到之待測物體的斜視角截面影像,即可推算得知待測物體之表面缺陷之高度分佈。The Republic of China Patent Publication No. I229186 discloses a two-view three-dimensional topographic image linear scanning detecting device comprising a positive viewing angle linear scanning device, a oblique viewing angle linear scanning device and a light source device. The height distribution of the surface defects of the object to be tested can be estimated by the cross-sectional image of the positive viewing angle sensed by the linear viewing device of the positive viewing angle plus the oblique cross-sectional image of the object to be measured sensed by the oblique-angle linear scanning device. .

【0005】[0005]

在此案的掃描檢測裝置中,使用了正視角線性掃描裝置以及斜視角線性掃描裝置之雙視角對物體進行掃描,其係使用傳統之立體視覺法,藉由不同方向之光線投影在物體表面時所產生之陰暗或光亮之狀態,判斷受測之物體的表面缺陷為凸出或是凹陷,進而利用此些暗部、亮部之分布情況估算物體之表面輪廓。另外,其表示可結合其感測得到的正視角截面加上經由感測得到之待測物體的斜視截面,經由適當之交叉運算後,估算其三維形貌之影像,進而推算出其待測物體表面外來物之大致體積、大致的截面形狀與高度。In the scanning detection device of the present case, the object is scanned using a double angle of view of the positive-angle linear scanning device and the oblique-angle linear scanning device, which is performed by conventional stereoscopic vision, when light rays of different directions are projected on the surface of the object. The dark or shiny state produced determines whether the surface defect of the object to be measured is convex or concave, and then estimates the surface contour of the object by using the distribution of the dark portion and the bright portion. In addition, it represents a cross-sectional cross section of the object to be measured obtained by sensing, and an appropriate cross-over operation to estimate the image of the three-dimensional shape, thereby deriving the object to be measured. The approximate volume, approximate cross-sectional shape and height of the surface foreign object.

【0006】[0006]

但經檢視,上述專利文獻所揭示之三維形貌影像檢測裝置並不具有高解析度之特性,更難以判斷是如何取得物體在高度上的參數,因此尚不足以應用於製程線上檢測。本技術領域仍待進一步的開發,以滿足對檢測速度、解析度都有高度需求之研究單位與相關產業。



However, it has been examined that the three-dimensional topographic image detecting device disclosed in the above patent document does not have the characteristics of high resolution, and it is more difficult to determine how to obtain the parameter of the object in height, and thus is not sufficient for application line detection. The technical field still needs further development to meet research units and related industries that have high demand for detection speed and resolution.



【0007】【0007】

本發明之主要目的,係提供一種物體三維形貌之量測方法,其可在受測物體於高速移動過程中進行掃描,並取得物體高度之座標參數,可藉此取得該物體的三維形貌。The main object of the present invention is to provide a method for measuring the three-dimensional shape of an object, which can scan the object under high-speed movement and obtain the coordinate parameter of the height of the object, thereby obtaining the three-dimensional shape of the object. .

【0008】[0008]

本發明之另一目的,係提供一種物體三維形貌之量測方法,其可利用上述取得之三維形貌檢視其外觀是否存在瑕疵、缺陷,並可與生產線之輸送系統相結合而達到高速、高解析度之目標。Another object of the present invention is to provide a method for measuring the three-dimensional shape of an object, which can detect the presence or absence of flaws and defects in the appearance of the three-dimensional shape obtained above, and can be combined with the conveying system of the production line to achieve high speed. The goal of high resolution.

【0009】【0009】

本發明之再一目的,係提供一種物體三維形貌之量測方法,其可應用於檢測各類型之造型元件、光電元件、微機電元件與半導體封裝元件。Still another object of the present invention is to provide a method for measuring a three-dimensional shape of an object, which is applicable to detecting various types of modeling elements, photovoltaic elements, microelectromechanical elements, and semiconductor package components.

【0010】[0010]

為了達到上述之目的,本發明揭示了一種物體三維形貌之量測方法,用於量測一物體之三維形貌,其包含:設置該物體於一平台上,且該物體沿一移動路徑進行移動;使用一第一影像擷取單元以及一第二影像擷取單元同步掃描該物體,該第一影像擷取單元以及該第二影像擷取單元係設置於該移動路徑之上方,且其掃描方向與該平台之法線方向分別具有一第一夾角以及一第二夾角,且該第一影像擷取單元以及該第二影像擷取單元之取像軸線之相交線之水平面係為一基準面;計算該物體表面之複數個三維座標參數,該些三維座標參數係為: (,,),其中np 為該第一影像擷取單元的第n個像素位置,Pp 為該第一影像擷取單元之像素間距,m為影像放大倍率,θ1 為該第一夾角,θ2 為該第二夾角,N1 P與N2 P分別為該物體被該第一影像擷取單元以及該第二影像擷取單元所擷取到一影像時,該些影像所移動之距離,h為該物體被該第一影像擷取單元以及該第二影像擷取單元掃描之處與該基準面之高度差;以及依據該些三維座標參數而建立該物體之三維形貌。
In order to achieve the above object, the present invention discloses a method for measuring a three-dimensional shape of an object, which is used for measuring a three-dimensional shape of an object, comprising: setting the object on a platform, and the object is along a moving path. Moving the object by using a first image capturing unit and a second image capturing unit, the first image capturing unit and the second image capturing unit are disposed above the moving path, and scanning The direction and the normal direction of the platform respectively have a first angle and a second angle, and the horizontal plane of the intersection of the image capturing axes of the first image capturing unit and the second image capturing unit is a reference plane Calculating a plurality of three-dimensional coordinate parameters of the surface of the object, the three-dimensional coordinate parameters are: , , Where n p is the nth pixel position of the first image capturing unit, P p is the pixel pitch of the first image capturing unit, m is the image magnification, θ 1 is the first angle, θ 2 For the second angle, N 1 P and N 2 P are the distances that the images are moved when the object is captured by the first image capturing unit and the second image capturing unit, respectively. And determining, by the first image capturing unit and the second image capturing unit, a height difference between the reference image and the reference surface; and establishing a three-dimensional shape of the object according to the three-dimensional coordinate parameters.

10‧‧‧平台10‧‧‧ platform

21‧‧‧第一影像擷取單元21‧‧‧First image capture unit

22‧‧‧第二影像擷取單元22‧‧‧Second image capture unit

30‧‧‧物體30‧‧‧ objects

30A‧‧‧物體30A‧‧‧ objects

W‧‧‧移動路徑W‧‧‧Moving path

θ1‧‧‧第一夾角θ 1 ‧‧‧first angle

θ2‧‧‧第二夾角θ 2 ‧‧‧second angle

h‧‧‧高度H‧‧‧height

N1‧‧‧Px座標N 1 ‧‧‧Px coordinates

N2‧‧‧Px座標N 2 ‧‧‧Px coordinates

R‧‧‧相交線R‧‧‧ intersection line

【0011】[0011]


第1圖:其係為本發明一較佳實施例於運作時之結構示意圖,用以表示第一影像擷取單元以及第二影像擷取單元皆為斜向設置而掃描平台上的物體;
第2圖:其係為本發明另一較佳實施例於運作時之結構示意圖,用以表示第一影像擷取單元以及第二影像擷取單元其中之一者係垂直設置而掃描平台上的物體;以及
第3A、3B圖:其係為本發明再一較佳實施例之於運作時之結構示意圖,用以表示僅使用第一影像擷取單元作掃描之形式。




FIG. 1 is a schematic structural view of a preferred embodiment of the present invention, in which the first image capturing unit and the second image capturing unit are disposed obliquely to scan an object on the platform;
FIG. 2 is a schematic structural view of another preferred embodiment of the present invention, in which one of the first image capturing unit and the second image capturing unit is vertically disposed on the scanning platform. FIG. 3A and FIG. 3B are schematic diagrams showing the structure of another preferred embodiment of the present invention in operation, for indicating that only the first image capturing unit is used for scanning.



【0012】[0012]

為使本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後:For a better understanding and understanding of the features and advantages of the present invention, the preferred embodiments and the detailed description are described as follows:

【0013】[0013]

請先參考第1圖,為了實現本發明所揭示之物體三維形貌之量測方法,其所使用之硬體架構係包含了一平台10、一第一影像擷取單元21以及一第二影像擷取單元22。其中,平台10係用於承載所要待測之物體30,而就實際應用之形式而言,此平台10可為輸送帶,其受馬達驅動而向一固定方向行進,其所承載之物體30也因此往該固定方向行進,使物體30本身可定義為係沿著一移動路徑W進行移動(物體30A係為物體30於移動路徑W上所經過的位置舉例)。第一影像擷取單元21以及第二影像擷取單元22則是設置於該移動路徑W之上方,以針對物體30進行掃描。Referring to FIG. 1 , in order to implement the method for measuring the three-dimensional shape of the object disclosed in the present invention, the hardware structure used includes a platform 10 , a first image capturing unit 21 and a second image. The unit 22 is captured. The platform 10 is used to carry the object 30 to be tested, and in the form of practical application, the platform 10 can be a conveyor belt that is driven by a motor to travel in a fixed direction, and the object 30 carried by the platform 30 is also Therefore, traveling in the fixed direction allows the object 30 itself to be defined as moving along a moving path W (the object 30A is exemplified by the position at which the object 30 passes over the moving path W). The first image capturing unit 21 and the second image capturing unit 22 are disposed above the moving path W to scan the object 30.

【0014】[0014]

本發明所使用之第一影像擷取單元21以及第二影像擷取單元22係為一種線型影像擷取裝置,其係包含了電荷耦合元件(Charge-Coupled Device, CCD)或互補式金屬氧化物半導體(Complementary Metal-Oxide-Semiconductor, CMOS)等感光元件,並將感光元件排列在一條直線上(此直線係與前述之移動路徑垂直),具有很高的線密度,因此有極高像素而可提供超高分辨率。The first image capturing unit 21 and the second image capturing unit 22 used in the present invention are linear image capturing devices, which comprise a charge-coupled device (CCD) or a complementary metal oxide. a photosensitive element such as a semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS), and arranging the photosensitive elements in a straight line (this straight line is perpendicular to the moving path described above), has a high linear density, and thus has extremely high pixels. Provides super high resolution.

【0015】[0015]

本發明之運作機制係利用兩組線型影像擷取單元累積待測之物體於位移時,其被線型影像擷取單元所擷取得到的各組線像素點所組成之疊合影像,然後在兩組疊合影像中找到特定點相對應的掃描移動位置,即可定量求出待測之物體表面的三維輪廓。The operating mechanism of the present invention utilizes two sets of line image capturing units to accumulate a superimposed image of each group of line pixels obtained by the line image capturing unit when the object to be measured is displaced, and then in two The three-dimensional contour of the surface of the object to be tested can be quantitatively determined by finding the scanning movement position corresponding to the specific point in the group superimposed image.

【0016】[0016]

請參考第2圖,其係為第1圖所示之較佳實施例之簡化設置方式,其差異在於第1圖所示之第一影像擷取單元21以及一第二影像擷取單元22之掃描方向與平台10之法線方向分別具有一第一夾角θ1 以及一第二夾角θ2 ,而第2圖則係將第一影像擷取單元21設置於物體30之垂直方向取像,第二影像擷取單元22則維持斜向取像,且兩者之取像軸線(意即其掃描方向之延伸線)係具有一相交線R,此相交線所在的水平面即為基準面。當設平台10未移動時,第一影像擷取單元21的第一個像素的軸向交點為座標原點,線像素方向為Y軸,平台10之移動的方向為X軸(移動之反方向為正),則可得到待測之物體30的特定點座標(x, y)及其相對於基準面高度h(x, y)為:
x = N1P
y =
h(x, y) =
其中,np 為第一影像擷取單元21的第n個像素位置,Pp 為第一影像擷取單元21之像素間距,m為影像放大倍率,h為該物體於被掃描處與該基準面之高度差,N1 P與N2 P分別為該物體被第一影像擷取單元21以及第二影像擷取單元22擷取到一影像時,該些影像所移動之距離,其中N1 P相當於該些影像原始位置與移動後位置之水平距離,也就是x軸上的座標。在這之中,P為線型影像擷取裝置(第一影像擷取單元21以及第二影像擷取單元22)每次掃描取像的間距,例如移動1微米取一條影像,或是移動2微米取一條影像等;N1 和N2 是分別指第一影像擷取單元21以及第二影像擷取單元22對同一點分別是在移動到第N1 、N2 條影像位置時看到該點,意即第一影像擷取單元21以及第二影像擷取單元22在掃描取像時,是在何處掃描到該點影像。例如對於基準面上的點,二個影像擷取單元會同時掃描到該點而取得影像,所以此時N1 =N2 ,高度視為零;而對有高度的點,N1 、N2 兩者的值就會不同。
Please refer to FIG. 2 , which is a simplified arrangement of the preferred embodiment shown in FIG. 1 , and the difference is that the first image capturing unit 21 and the second image capturing unit 22 shown in FIG. 1 The scanning direction and the normal direction of the platform 10 respectively have a first angle θ 1 and a second angle θ 2 , and the second image is to set the first image capturing unit 21 to the vertical direction of the object 30, The image capturing unit 22 maintains the oblique image capturing, and the image capturing axes of the two (that is, the extension lines of the scanning direction) have an intersecting line R, and the horizontal plane where the intersecting lines are located is the reference plane. When the platform 10 is not moved, the axial intersection of the first pixel of the first image capturing unit 21 is the coordinate origin, the line pixel direction is the Y axis, and the moving direction of the platform 10 is the X axis (the opposite direction of the movement) If it is positive, then the specific point coordinates (x, y) of the object 30 to be tested and its height h(x, y) relative to the reference plane are:
x = N1P
y =
h(x, y) =
Where n p is the nth pixel position of the first image capturing unit 21, P p is the pixel pitch of the first image capturing unit 21, m is the image magnification, and h is the object at the scanned position and the reference The height difference between the faces, N 1 P and N 2 P are the distances at which the images are moved by the first image capturing unit 21 and the second image capturing unit 22, respectively, where the images are moved, where N 1 P is equivalent to the horizontal distance between the original position of the image and the position after the movement, that is, the coordinate on the x-axis. Among them, P is a line image capturing device (the first image capturing unit 21 and the second image capturing unit 22) for scanning the image capturing interval, for example, moving 1 micrometer to take an image, or moving 2 micrometers. Taking an image or the like; N 1 and N 2 are respectively indicating that the first image capturing unit 21 and the second image capturing unit 22 see the same point when moving to the N 1 and N 2 image positions respectively. That is, the first image capturing unit 21 and the second image capturing unit 22 scan the image of the point when scanning the image. For example, for a point on the reference plane, the two image capturing units scan the point at the same time to obtain the image, so at this time N 1 =N 2 , the height is regarded as zero; and for the point with height, N 1 , N 2 The values of the two will be different.

【0017】[0017]

而若如第1圖所示,第一影像擷取單元21以及第二影像擷取單元22皆為斜向取像,且兩者之取像軸係於平台10上之交點為座標原點,此時待測之物體30的特定點座標(x, y)及其相對於基準面高度h(x, y)則修正為:
x =
y =
h(x, y) =
As shown in FIG. 1 , the first image capturing unit 21 and the second image capturing unit 22 are both obliquely imaged, and the intersection of the image capturing axes on the platform 10 is the coordinate origin. At this time, the specific point coordinates (x, y) of the object 30 to be measured and its height h(x, y) with respect to the reference plane are corrected as:
x =
y =
h(x, y) =

【0018】[0018]

由以上之公式可知,本發明若要達到高解析度,則其關鍵在於第一影像擷取單元21以及第二影像擷取單元22於掃描物體30時之影像間距P,當P值越小時,本發明能提供之解析度就能越高,因此很容易就能達到微米級之量測解析度,特別是本發明能對物體之高度進行量測,並非為平面式二維量測,此量測等級為本技術領域的一大突破,能藉此取得細微的高度差異。另外,若搭配次像素技巧設定N1 與N2 ,量測解析度更可獲得提升而達到次微米量測精度。本發明之量測速度取決於平台10的移動速度,因此可透過選用高速移動平台的方式,就可達到高速、高精度的量測目標。It can be seen from the above formula that if the present invention is to achieve high resolution, the key is the image spacing P of the first image capturing unit 21 and the second image capturing unit 22 when scanning the object 30. When the P value is small, The resolution which can be provided by the invention can be higher, so that the measurement resolution of the micrometer level can be easily achieved, in particular, the invention can measure the height of the object, not the planar two-dimensional measurement, the amount The measurement level is a major breakthrough in the technical field, and can be used to achieve subtle height differences. In addition, if N 1 and N 2 are set with the sub-pixel technique, the measurement resolution can be improved to achieve sub-micron measurement accuracy. The measuring speed of the present invention depends on the moving speed of the platform 10, so that a high-speed, high-precision measuring target can be achieved by selecting a high-speed moving platform.

【0019】[0019]

本發明所設置之兩組線型影像擷取單元在另一較佳實施例中也可整合為使用一個線型影像感測裝置,其包含兩個影像擷取單元而提供兩個鏡頭位於受測之物體的移動路徑之上,以由不同角度對物體進行掃描取像,前後兩次之取像軸線的相交線所在的水平面即為基準面。除此之外,也可將兩組線型影像擷取單元整合為單一鏡頭,以前後移動的方式在物體不同的角度掃描取像,此時作移動的並不限制為承載物體之平台,也可以在平台靜止的條件下移動前述之單一鏡頭,使鏡頭與物體之間存在相對之移動效果。請參考第3A與3B圖,其係為僅使用第一影像擷取單元21掃描物體30,並在物體30經移動而與第一影像擷取單元21之相對位置有變化時,第一影像擷取單元21的掃描方向與平台之法線方向分別具有第一夾角θ1 以及第二夾角θ2 ,再經前述之公式計算即可建立起物體30之三維形貌。The two sets of line image capturing units provided by the present invention can also be integrated in another preferred embodiment to use a line type image sensing device comprising two image capturing units to provide two lenses in the object to be tested. Above the moving path, the object is scanned and imaged by different angles, and the horizontal plane where the intersection lines of the image axes before and after the image are located is the reference plane. In addition, the two sets of line image capturing units can be integrated into a single lens, and the image is scanned at different angles of the object in the manner of moving forward and backward. At this time, the movement is not limited to the platform for carrying the object, and Moving the aforementioned single lens under the condition that the platform is stationary, there is a relative movement between the lens and the object. Please refer to FIGS. 3A and 3B , which is to scan the object 30 only by using the first image capturing unit 21 , and when the object 30 is moved and the relative position of the first image capturing unit 21 is changed, the first image 撷The scanning direction of the taking unit 21 and the normal direction of the platform respectively have a first angle θ 1 and a second angle θ 2 , and the three-dimensional shape of the object 30 can be established by the above formula.

【0020】[0020]

若要針對不同尺寸與解析度需求之量測條件,則可透過調整掃描取像時之影像間距P的方式,以適用於各種尺寸物體,進行受測之物體的三維形貌之建立,或是找出瑕疵等相關衍生應用。To measure the different size and resolution requirements, you can adjust the image spacing P when scanning the image to suit the objects of various sizes, and establish the three-dimensional shape of the object under test, or Find out related derivatives such as 瑕疵.

【0021】[0021]

本發明在上述所揭露的結構配置之下,本發明於建立物體之三維形貌之一較佳實施例中,其方法可整理為以下步驟:
步驟S1:設置該物體於一平台上,且該物體沿一移動路徑進行移動;
步驟S2:使用一第一影像擷取單元以及一第二影像擷取單元掃描該物體,該第一影像擷取單元以及該第二影像擷取單元係設置於該移動路徑之上方,且其掃描方向與該平台之法線方向分別具有一第一夾角以及一第二夾角,且該第一影像擷取單元以及該第二影像擷取單元之取像軸線之相交線之水平面係為一基準面;
步驟S3:計算該物體表面之複數個三維座標參數,該些三維座標參數係為:(,,),其中np 為該第一影像擷取單元的第n個像素位置,Pp 為該第一影像擷取單元之像素間距,m為影像放大倍率,θ1 為該第一夾角,θ2 為該第二夾角,N1 P與N2 P分別為該物體被該第一影像擷取單元以及該第二影像擷取單元所擷取到一影像時,該些影像所移動之距離,h為該物體被該第一影像擷取單元以及該第二影像擷取單元掃描之處與該基準面之高度差;以及
步驟S4:依據該些三維座標參數而建立該物體之三維形貌。
In the preferred embodiment of the present invention for establishing a three-dimensional topography of an object, the method of the present invention can be organized into the following steps:
Step S1: setting the object on a platform, and moving the object along a moving path;
Step S2: scanning the object by using a first image capturing unit and a second image capturing unit, wherein the first image capturing unit and the second image capturing unit are disposed above the moving path, and scanning the same The direction and the normal direction of the platform respectively have a first angle and a second angle, and the horizontal plane of the intersection of the image capturing axes of the first image capturing unit and the second image capturing unit is a reference plane ;
Step S3: calculating a plurality of three-dimensional coordinate parameters of the surface of the object, the three-dimensional coordinate parameters are: , , Where n p is the nth pixel position of the first image capturing unit, P p is the pixel pitch of the first image capturing unit, m is the image magnification, θ 1 is the first angle, θ 2 For the second angle, N 1 P and N 2 P are the distances that the images are moved when the object is captured by the first image capturing unit and the second image capturing unit, respectively. a height difference between the object scanned by the first image capturing unit and the second image capturing unit and the reference surface; and step S4: establishing a three-dimensional topography of the object according to the three-dimensional coordinate parameters.

【0022】[0022]

綜上所述,本發明詳細揭示了一種物體三維形貌之量測方法,其在應用上係以製程的線上量測為標準,係考量到物體是在高速移動之下進行三維形貌量測,因此在高速以及高解析度的需求之下,以高傳輸率之高像素線型影像擷取單元為架構核心,依據受測之物體的尺寸,設計光機取像系統並固定於檢測機台之上,再以移動物體之方式進行掃描取像。另外,本發明也可輕易地改變解析度,以針對不同類型之物體而設定為上百微米至次微米之級距;同時也可視物體之寬度而增加影像擷取單元的探頭數目與運算端的圖形處理器數量,再結合平行處理的技術而達到需求。In summary, the present invention discloses in detail a method for measuring the three-dimensional shape of an object, which is based on the on-line measurement of the process, and considers that the object is measured under high-speed movement. Therefore, under the demand of high speed and high resolution, the high pixel line image capturing unit with high transmission rate is the core of the architecture, and the optical image capturing system is designed and fixed on the detecting machine according to the size of the object to be tested. On the top, the image is scanned by moving objects. In addition, the present invention can also easily change the resolution to set the pitch of hundreds of micrometers to submicrometers for different types of objects; and also increase the number of probes of the image capturing unit and the graphics of the computing end depending on the width of the object. The number of processors, combined with the technology of parallel processing, meets the demand.

【0023】[0023]

惟以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.

10‧‧‧平台 10‧‧‧ platform

21‧‧‧第一影像擷取單元 21‧‧‧First image capture unit

22‧‧‧第二影像擷取單元 22‧‧‧Second image capture unit

30‧‧‧物體 30‧‧‧ objects

30A‧‧‧物體 30A‧‧‧ objects

W‧‧‧移動路徑 W‧‧‧Moving path

θ1‧‧‧第一夾角 θ 1 ‧‧‧first angle

θ2‧‧‧第二夾角 θ 2 ‧‧‧second angle

h‧‧‧高度 H‧‧‧height

N1P‧‧‧x座標 N 1 P‧‧‧x coordinates

N2P‧‧‧x座標 N 2 P‧‧‧x coordinates

R‧‧‧相交線 R‧‧‧ intersection line

Claims (5)

【第1項】[Item 1] 一種物體三維形貌之量測方法,用於量測一物體之三維形貌,其包含:
設置該物體於一平台上,且該物體沿一移動路徑進行移動;
使用一第一影像擷取單元以及一第二影像擷取單元掃描該物體,該第一影像擷取單元以及該第二影像擷取單元係設置於該移動路徑之上方,且其掃描方向與該平台之法線方向分別具有一第一夾角以及一第二夾角,且該第一影像擷取單元以及該第二影像擷取單元之取像軸線之相交線之水平面係為一基準面;
計算該物體表面之複數個三維座標參數,該些三維座標參數係為:(,,),其中np 為該第一影像擷取單元的第n個像素位置,Pp 為該第一影像擷取單元之像素間距,m為影像放大倍率,θ1 為該第一夾角,θ2 為該第二夾角,N1 P與N2 P分別為該物體被該第一影像擷取單元以及該第二影像擷取單元所擷取到一影像時,該些影像所移動之距離,h為該物體被該第一影像擷取單元以及該第二影像擷取單元掃描之處與該基準面之高度差;以及
依據該些三維座標參數而建立該物體之三維形貌。
A method for measuring a three-dimensional shape of an object for measuring a three-dimensional shape of an object, comprising:
Setting the object on a platform, and moving the object along a moving path;
The first image capturing unit and the second image capturing unit are configured to scan the object, and the first image capturing unit and the second image capturing unit are disposed above the moving path, and the scanning direction thereof is The normal direction of the platform has a first angle and a second angle, and the horizontal plane of the intersection of the image capturing axes of the first image capturing unit and the second image capturing unit is a reference plane;
Calculating a plurality of three-dimensional coordinate parameters of the surface of the object, the three-dimensional coordinate parameters are: , , ), The n-th pixel position where np is the first image capturing unit, the pixel P p for the pitch of the first image capturing unit, m is the image magnification, θ 1 is the first angle, θ 2 is The second angle, N 1 P and N 2 P are the distances that the images are moved when the object is captured by the first image capturing unit and the second image capturing unit, h is The height difference between the object and the reference surface scanned by the first image capturing unit and the second image capturing unit; and establishing a three-dimensional topography of the object according to the three-dimensional coordinate parameters.
【第2項】[Item 2] 如申請專利範圍第1項所述之物體三維形貌之量測方法,其中該第一影像擷取單元以及該第二影像擷取單元係分別包含至少一組線型感光元件。The method for measuring a three-dimensional shape of an object according to the first aspect of the invention, wherein the first image capturing unit and the second image capturing unit respectively comprise at least one set of linear photosensitive elements. 【第3項】[Item 3] 如申請專利範圍第1項所述之物體三維形貌之量測方法,其中該第一影像擷取單元以及該第二影像擷取單元係分別包含一電荷耦合元件或一互補式金屬氧化物半導體等感光元件。The method for measuring a three-dimensional shape of an object according to claim 1, wherein the first image capturing unit and the second image capturing unit respectively comprise a charge coupled device or a complementary metal oxide semiconductor Wait for the photosensitive element. 【第4項】[Item 4] 如申請專利範圍第1項所述之物體三維形貌之量測方法,其中於使用該第一影像擷取單元以及該第二影像擷取單元掃描該物體之步驟中,該第一影像擷取單元以及該第二影像擷取單元係同步掃描該物體。The method for measuring a three-dimensional shape of an object according to the first aspect of the invention, wherein the first image capturing unit and the second image capturing unit scan the object, the first image capturing The unit and the second image capturing unit simultaneously scan the object. 【第5項】[Item 5] 一種物體三維形貌之量測方法,用於量測一物體之三維形貌,其包含:
設置該物體於一平台上,且該物體沿一移動路徑進行移動;
使用一第一影像擷取單元掃描該物體,該第一影像擷取單元係設置於該移動路徑之上方,其掃描方向與該平台之法線方向具有一第一夾角以及一第二夾角,且該第一影像擷取單元以及該第二影像擷取單元之取像軸線之相交線之水平面係為一基準面;
再次使用該第一影像擷取單元掃描該物體,該物體係沿該移動路徑而移動至另一位置,此時該第一影像擷取單元之掃描方向與該平台之法線方向具有一第二夾角;
計算該物體表面之複數個三維座標參數,該些三維座標參數係為:(,,),其中np 為該第一影像擷取單元的第n個像素位置,Pp 為該第一影像擷取單元之像素間距,m為影像放大倍率,θ1 為該第一夾角,θ2 為該第二夾角,N1 P與N2 P分別為該物體被該第一影像擷取單元以及該第二影像擷取單元所擷取到一影像時,該些影像所移動之距離,h為該物體被該第一影像擷取單元以及該第二影像擷取單元掃描之處與該基準面之高度差;以及
依據該些三維座標參數而建立該物體之三維形貌。
A method for measuring a three-dimensional shape of an object for measuring a three-dimensional shape of an object, comprising:
Setting the object on a platform, and moving the object along a moving path;
Scanning the object by using a first image capturing unit, the first image capturing unit is disposed above the moving path, and the scanning direction has a first angle and a second angle with a normal direction of the platform, and The horizontal plane of the intersection line of the image capturing axes of the first image capturing unit and the second image capturing unit is a reference surface;
The first image capturing unit is used to scan the object again, and the object system moves along the moving path to another position. At this time, the scanning direction of the first image capturing unit and the normal direction of the platform have a second Angle
Calculating a plurality of three-dimensional coordinate parameters of the surface of the object, the three-dimensional coordinate parameters are: , , Where n p is the nth pixel position of the first image capturing unit, P p is the pixel pitch of the first image capturing unit, m is the image magnification, θ 1 is the first angle, θ 2 For the second angle, N 1 P and N 2 P are the distances that the images are moved when the object is captured by the first image capturing unit and the second image capturing unit, respectively. And determining, by the first image capturing unit and the second image capturing unit, a height difference between the reference image and the reference surface; and establishing a three-dimensional shape of the object according to the three-dimensional coordinate parameters.
TW103136416A 2014-10-22 2014-10-22 Method for measuring three-dimensional shape of object TW201616092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103136416A TW201616092A (en) 2014-10-22 2014-10-22 Method for measuring three-dimensional shape of object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103136416A TW201616092A (en) 2014-10-22 2014-10-22 Method for measuring three-dimensional shape of object

Publications (2)

Publication Number Publication Date
TWI487877B TWI487877B (en) 2015-06-11
TW201616092A true TW201616092A (en) 2016-05-01

Family

ID=53937859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103136416A TW201616092A (en) 2014-10-22 2014-10-22 Method for measuring three-dimensional shape of object

Country Status (1)

Country Link
TW (1) TW201616092A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6279013B2 (en) * 2016-05-26 2018-02-14 Ckd株式会社 3D measuring device
JP6513619B2 (en) * 2016-09-28 2019-05-15 Ckd株式会社 Three-dimensional measuring device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020097172A (en) * 2001-02-08 2002-12-31 닛폰 고칸 가부시키가이샤 Method for Measuring Three- dimensional Coordinate, Apparatus Thereof and Method for Building Large Construction Therewith
TWI267037B (en) * 2004-10-14 2006-11-21 Univ Nat Taipei Technology Method of three-dimensional surface shape measurement by using encoded datum points
EP1882895A4 (en) * 2005-05-12 2012-06-27 Techno Dream 21 Co Ltd 3-dimensional shape measuring method and device thereof
TWI435050B (en) * 2009-12-11 2014-04-21 Ming Hsiang Shih Device and method for non-contact measurement of space coordinates for objects

Also Published As

Publication number Publication date
TWI487877B (en) 2015-06-11

Similar Documents

Publication Publication Date Title
CN110006905B (en) Large-caliber ultra-clean smooth surface defect detection device combined with linear area array camera
US7634128B2 (en) Stereoscopic three-dimensional metrology system and method
CN101526336B (en) Calibration method of linear structured light three-dimensional visual sensor based on measuring blocks
Molleda et al. A profile measurement system for rail quality assessment during manufacturing
JP6596433B2 (en) Structured optical matching of a set of curves from two cameras
CN112629441A (en) 3D curved surface glass contour scanning detection method and system based on line structured light dynamic vision
KR20120087680A (en) The measurement method of PCB bump height by using three dimensional shape detector using optical triangulation method
TW201303260A (en) Method and device for non-contact measuring surfaces
CN109751964B (en) High-precision non-contact pipe diameter measuring method and device
TWI490481B (en) On - line Inspection Method for Panel 3D Defects
US9824452B2 (en) Topographical measurement system of specular object and topographical measurement method thereof
JP2021193400A (en) Method for measuring artefact
CN101476882B (en) Structured light three-dimensional detection method based on homography matrix
CN209992407U (en) Large-caliber ultra-clean smooth surface defect detection device combined with linear array camera
CN113884510B (en) Method for acquiring appearance image of 3D glass cover plate
TW201616092A (en) Method for measuring three-dimensional shape of object
JP5992315B2 (en) Surface defect detection device and surface defect detection method
TWI287079B (en) System and method for measuring three dimensional morphological of object surface by using white light source
CN102003941B (en) Large mooring chain five-ring length measurement method and device based on vision
Chang et al. Non-contact scanning measurement utilizing a space mapping method
Molleda et al. A profile measurement system for rail manufacturing using multiple laser range finders
CN103438803A (en) Method for performing view-field-across accurate measurement on size of rectangular part through computer vision technology
CN108180825A (en) A kind of identification of cuboid object dimensional and localization method based on line-structured light
KR20140012250A (en) Apparatus and method for measuring the defect of glass substrate
CN115289997B (en) Binocular camera three-dimensional contour scanner and application method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees