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TW201614532A - Apparatus for and method of generating wiring data, and imaging system - Google Patents

Apparatus for and method of generating wiring data, and imaging system

Info

Publication number
TW201614532A
TW201614532A TW104130662A TW104130662A TW201614532A TW 201614532 A TW201614532 A TW 201614532A TW 104130662 A TW104130662 A TW 104130662A TW 104130662 A TW104130662 A TW 104130662A TW 201614532 A TW201614532 A TW 201614532A
Authority
TW
Taiwan
Prior art keywords
wiring
wiring data
fan
semiconductor chip
data generating
Prior art date
Application number
TW104130662A
Other languages
Chinese (zh)
Other versions
TWI617932B (en
Inventor
Kiyoshi Kitamura
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of TW201614532A publication Critical patent/TW201614532A/en
Application granted granted Critical
Publication of TWI617932B publication Critical patent/TWI617932B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Processing (AREA)

Abstract

This invention prevents wiring omission and controls processing time while generating wiring data. A wiring data generating device of this invention includes a reference wiring data acquiring part that acquires reference wiring data representing reference wiring patterns; a local information acquiring part that acquires local information specifying a reference chip area and a rewiring area; a network table generating part that generates a network table based on an object wiring pattern surrounded by the re-wiring area; and an error acquiring part that acquires configuration error of a semiconductor chip. The wiring data generating device of this invention further includes a first wiring data generating part that generates fan-out wiring data representing the fan-out wiring of the semiconductor chip; and a second wiring data generating part that rewires according to the configuration error in a method of connecting the object wiring pattern to the fan-out wiring of the semiconductor chip to generate wiring data representing a new wiring pattern. The second wiring data generating part generates the wiring data that represents the new wiring pattern based on the network table.
TW104130662A 2014-09-29 2015-09-16 Apparatus for and method of generating wiring data, and imaging system TWI617932B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-198098 2014-09-29
JP2014198098A JP6321512B2 (en) 2014-09-29 2014-09-29 Wiring data generation device, generation method, and drawing system

Publications (2)

Publication Number Publication Date
TW201614532A true TW201614532A (en) 2016-04-16
TWI617932B TWI617932B (en) 2018-03-11

Family

ID=55790681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130662A TWI617932B (en) 2014-09-29 2015-09-16 Apparatus for and method of generating wiring data, and imaging system

Country Status (3)

Country Link
JP (1) JP6321512B2 (en)
KR (1) KR102339904B1 (en)
TW (1) TWI617932B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6295355B1 (en) * 2017-03-31 2018-03-14 株式会社ピーエムティー Exposure apparatus, exposure method, semiconductor module manufacturing method, pattern forming apparatus, and pattern forming method
TWI809201B (en) * 2018-10-23 2023-07-21 以色列商奧寶科技有限公司 Adaptive routing for correcting die placement errors
US10678150B1 (en) 2018-11-15 2020-06-09 Applied Materials, Inc. Dynamic generation of layout adaptive packaging
JP7437282B2 (en) 2020-10-01 2024-02-22 株式会社Ｓｃｒｅｅｎホールディングス Wiring data generation device, drawing system, and wiring data generation method
WO2022215385A1 (en) * 2021-04-09 2022-10-13 株式会社ニコン Exposure device and wiring pattern formation method
KR20240019296A (en) * 2021-07-12 2024-02-14 가부시키가이샤 니콘 Exposure device and wiring pattern formation method

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US4835704A (en) * 1986-12-29 1989-05-30 General Electric Company Adaptive lithography system to provide high density interconnect
JPH0831404B2 (en) 1988-02-24 1996-03-27 三菱電機株式会社 Method for manufacturing semiconductor device
JP3664392B2 (en) * 2001-04-20 2005-06-22 株式会社Ｎｅｃ情報システムズ Circuit board component arrangement design support device, support method, and program
JP2003197850A (en) 2001-12-26 2003-07-11 Sony Corp Semiconductor device and method of manufacturing the same
JP4245418B2 (en) * 2003-06-25 2009-03-25 富士通マイクロエレクトロニクス株式会社 Semiconductor integrated circuit device having diagonal wiring and layout method thereof
JP4275032B2 (en) * 2004-08-18 2009-06-10 富士通マイクロエレクトロニクス株式会社 Circuit board design method
CN101273397A (en) * 2005-09-27 2008-09-24 罗姆股份有限公司 D/A conversion circuit, organic EL drive circuit, and organic EL display device
JP4768500B2 (en) * 2006-04-17 2011-09-07 株式会社東芝 Semiconductor integrated circuit wiring layout apparatus, wiring layout method, and wiring layout program
US8130420B2 (en) * 2006-10-26 2012-03-06 Xerox Corporation System for programming a plurality of chips, such as photosensor chips or ink-jet chips, with operating parameters
US7957150B2 (en) * 2008-02-21 2011-06-07 Hitachi, Ltd. Support method and apparatus for printed circuit board
WO2009153912A1 (en) * 2008-06-17 2009-12-23 日本電気株式会社 Semiconductor device and method for manufacturing semiconductor device
JP2010219489A (en) 2009-02-20 2010-09-30 Toshiba Corp Semiconductor device and manufacturing method thereof
JP5637771B2 (en) * 2010-08-17 2014-12-10 株式会社Ｓｃｒｅｅｎホールディングス Direct drawing method and direct drawing apparatus
US8981511B2 (en) * 2012-02-29 2015-03-17 Semiconductor Components Industries, Llc Multi-chip package for imaging systems
JP5779145B2 (en) * 2012-06-28 2015-09-16 株式会社Ｓｃｒｅｅｎホールディングス Wiring data generation device, generation method, program thereof, and drawing device
JP2014135035A (en) * 2013-01-11 2014-07-24 Fujitsu Ltd Design support device, design support method, and design support program

Also Published As

Publication number Publication date
TWI617932B (en) 2018-03-11
KR20160037801A (en) 2016-04-06
JP6321512B2 (en) 2018-05-09
JP2016071022A (en) 2016-05-09
KR102339904B1 (en) 2021-12-15

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