TW201608668A - Carrying device - Google Patents

Abstract

Disclosed is a carrying device suitable for carrying a processing workpiece. The carrying device comprises a carrying plate and a lifting mechanism. The carrying plate includes a carrying top surface and a bottom surface. The carrying plate defines multiple vias and a first intake channel. Each via comprises a lower opening, an accommodation hole, and a lower shoulder. The lower shoulder is defined between the accommodation hole and the lower opening. The lifting mechanism includes a plurality of pin rod components. Each pin rod component extends into the accommodation hole through the lower opening of the corresponding via. Each pin rod component can move between an air-tight position and a receiving position. When each pin rod component is located at the air-tight position, each pin rod component abuts against the lower shoulder and closes lower opening. When each pin rod component is located at the receiving position, each pin rod component extends out of the carrying top surface and can carry processing workpiece.

Description

Carrying device

The invention relates to a carrying device, in particular to a carrying device for carrying and positioning a workpiece to be processed in a manufacturing process.

Existing carrier devices for use in, for example, semiconductor exposure processes typically include a carrier disk for carrying and positioning the wafer, and a lifting mechanism. The carrier tray has a loading top surface, a bottom surface, a plurality of perforations extending through the top surface and the bottom surface of the bearing, and a plurality of adsorption grooves formed on the top surface of the bearing. The lifting mechanism includes a plurality of pins that are respectively threaded through the perforations and movable up and down relative to the carrier. When the pin of the lifting mechanism is in a receiving position, the pin protrudes from the carrying top surface, and at this time, the transfer device transfers the wafer and places it on the pin. Subsequently, the pin will move the wafer down, placing the wafer on the top surface of the carrier. The suction force generated by the suction of the adsorption groove enables the wafer to be adsorbed on the top surface of the carrier.

Since the wafer undergoes a plurality of processes, the wafer is warped, and a gap is formed between the outer circumference of each pin and the inner hole surface of the corresponding perforation. Therefore, when the adsorption groove is in the process of inhaling, The gas outside the carrier disk continuously flows into the adsorption trench through the gap, resulting in the adsorption trench not being able to draw a vacuum between the carrier top surface and the wafer. Therefore, the existing carrier device The wafer cannot be stably and surely positioned on the top surface of the carrier, so that the carrier device drives the wafer to move toward the reticle, which may cause the wafer to fall off the top surface of the carrier and fall. Moreover, the existing carrier device is even more incapable of leveling the wafer, and the wafer cannot be accurately aligned with the mask.

Therefore, the main object of the present invention is to provide a carrying device that absorbs a workpiece to be processed by suction generated by an air suction passage of a carrier, so that the workpiece to be processed can be stably and surely positioned on the top surface of the carrier. . Furthermore, the workpiece to be processed is adsorbed by vacuuming the airflow path, and the strong suction force generated by vacuum adsorption can completely adsorb the workpiece to be processed and flatten it on the flat top surface of the bearing, thereby enabling Effectively flatten the warped workpiece to be machined.

Therefore, the carrying device of the present invention is adapted to carry a workpiece to be processed, and the carrying device comprises a carrying tray and a lifting mechanism.

The carrier tray includes a carrier top surface that can carry the workpiece to be processed, and a bottom surface. The carrier tray defines a plurality of through holes extending through the top surface of the carrier and the bottom surface, and a through-top surface and the bottom surface are The first air suction channel for inhaling the workpiece to be processed, each of the through holes includes a lower opening formed on the bottom surface, a receiving hole portion connected to the lower opening, and a lower shoulder portion, the diameter of the receiving hole portion Larger than the lower opening diameter, the lower shoulder is defined between the receiving hole portion and the lower opening, the lifting mechanism includes a plurality of pin assemblies, each of the pin assemblies extending through the corresponding lower opening of the through hole to In the receiving hole portion, each of the pin assemblies can be in an airtight position and a receiving position Moving between, when each of the pin assemblies is in the airtight position, each of the pin assemblies abuts against the lower shoulder and closes the lower opening, and when the pin assemblies are in the receiving position, each of the pins The component portion extends through the top surface of the carrier and can receive the workpiece to be processed.

The carrying tray further includes an outer peripheral surface, and the carrying device further comprises a set of elastic rings connected to the outer peripheral surface, the elastic ring includes an upper end edge, the upper end edge height is higher than the height of the carrying top surface and is used for the processing The workpiece abuts.

The outer peripheral surface includes a vertical surface connected to the top surface of the carrying surface, and a flat portion connected to the bottom end of the vertical surface, the elastic ring further includes a positioning ring portion abutting against the flat portion, and a a bending ring portion extending outwardly from an outer edge of the ring portion, the bending ring portion having the upper end edge and spaced apart from the vertical surface portion, the carrier plate further defining a second suction penetrating the vertical surface portion and the bottom surface The air flow path corresponding to the position of the bending ring portion.

The vertical recess is formed with an annular card slot adjacent to the planar portion, and the inner edge of the positioning ring is engaged in the annular card slot, and the bent ring portion has an outer edge of the positioning ring portion facing upwards and facing the stand a first inclined section extending obliquely in the direction of the face, and a second inclined section extending upward from the top end of the first inclined section and obliquely extending away from the direction of the standing face.

Each of the pin assemblies includes an upper pin disposed in the corresponding receiving hole of the through hole and a biasing spring, each of the upper pins including a pair for abutting the lower shoulder to close the lower opening The bottom end, and a top end for receiving the workpiece to be processed, the biasing spring is used to bias the upper pin downward so that the bottom end is in tight contact with the lower shoulder.

Each of the upper pins is made of an elastic material, and each of the upper pins further includes a bottom wall having the bottom end, and a rod body protruding upward from the bottom wall and having the top end, the bottom wall diameter The diameter of the lower opening and the diameter of the rod are respectively greater.

Each of the upper pins further includes a peripheral wall extending upward from the outer peripheral edge of the bottom wall and spaced apart from the rod body, each of the through holes further including an inner hole surface portion connected to the lower shoulder portion, and each of the upper pins The peripheral wall is slidably contacted to the inner bore portion.

Each of the through holes further includes an upper opening formed on the top surface of the carrier and communicating with the receiving hole portion, and an upper shoulder portion having a diameter larger than the diameter of the upper opening, the upper shoulder portion being defined by the upper opening The accommodating hole portion and the upper opening are connected to the inner hole surface portion, and the rod body can extend through the upper opening, and the upper and lower ends of the biasing spring abut against the upper shoulder portion and the bottom wall respectively.

The carrier tray further includes a disk body and a plurality of connecting rings, the disk body defines the bearing top surface and the first air suction channel, and the connecting ring is configured to carry the corresponding upper pin, the connection A ring is secured to the disk and defines the perforations and the bottom surface together with the disk.

Each of the pin assemblies further includes a lower pin disposed through the corresponding lower opening, the top end of the lower pin abutting against the bottom end of the corresponding upper pin, the lifting mechanism further comprising a connection An actuating assembly at the bottom end of the pin, the actuating assembly for moving the pin assembly between the airtight position and the receiving position.

The effect of the invention is that the first suction air channel and the second suction of the carrier disk are designed by the design of each pin assembly and the elastic ring of the lifting mechanism The airflow path can evacuate the chamber and suck the workpiece to be processed by vacuuming, thereby enabling the workpiece to be processed to be stably and surely positioned on the top surface of the carrier. Moreover, the strong suction force generated by vacuum adsorption can completely adsorb the workpiece to be processed to be flat on the flat bearing top surface, thereby effectively flattening the warped workpiece to be processed.

1‧‧‧Workpieces to be machined

231‧‧‧ Lower annulus

11‧‧‧ bottom

232‧‧‧Under hole

12‧‧‧ outer periphery

24‧‧‧ screws

200‧‧‧ Carrying device

25‧‧‧Perforation

2‧‧‧ Carrying tray

251‧‧‧ opening

21‧‧‧ dish

252‧‧‧Opening

211‧‧‧bearing top surface

253‧‧‧ accommodating holes

212‧‧‧ lower surface

254‧‧‧lower shoulder

213‧‧‧ Groove

255‧‧‧Upper shoulder

214‧‧‧ bottom

256‧‧‧ hole face

215‧‧‧through hole

3‧‧‧ Lifting mechanism

216‧‧‧First suction channel

31‧‧‧ cylinder

217‧‧‧ first trench

32‧‧‧lifting frame

218‧‧‧Second trench

33‧‧‧ pin assembly

219‧‧‧ stomata

331‧‧‧Upper pole

220‧‧‧ outer perimeter

332‧‧‧Under the pin

221‧‧‧Upstanding face

333‧‧‧ bottom wall

222‧‧‧Lower face

334‧‧‧ rod body

223‧‧‧Flat Department

335‧‧‧Wall

224‧‧‧Ring card slot

336‧‧‧ bottom

225‧‧‧Second suction channel

337‧‧‧bias spring

23‧‧‧Connecting ring

338‧‧‧Top

4‧‧‧Flexible ring

432‧‧‧Second inclined section

41‧‧‧Upper edge

51‧‧‧ first gas nozzle

42‧‧‧ positioning ring

52‧‧‧second gas nozzle

43‧‧‧Bend ring

6‧‧‧ chamber

431‧‧‧First inclined section

I, II‧‧‧ arrows

Other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a perspective view of an embodiment of the carrying device of the present invention. FIG. 2 is an embodiment of the carrying device of the present invention. 3 is an exploded perspective view illustrating an assembly relationship between a carrier disk, a lifting mechanism, and an elastic ring; FIG. 3 is an exploded perspective view of an embodiment of the carrier device of the present invention viewed from another viewing angle, illustrating a carrier disk, a lifting mechanism, and an elastic ring. FIG. 4 is a plan view showing an embodiment of the carrier device of the present invention, illustrating that the top surface of the carrier is recessed with a first trench and a second trench; FIG. 5 is a cross section taken along the line VV of FIG. Referring to the schematic view, the pin assembly is in an airtight position, the bottom end of the upper pin abuts against the lower shoulder and closes the lower opening; FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. The disk body of the carrier disk is formed with a first air suction channel and a second air intake channel, and an assembly relationship between the elastic ring and the disk body; FIG. 7 is a cross-sectional view of an embodiment of the carrier device of the present invention, illustrating The cylinder drives the pin through the lifting frame Receiving member moves to a position on the pin Figure 8 is a schematic cross-sectional view of an embodiment of the carrying device of the present invention, illustrating the transfer device placing the workpiece to be processed on the top end of the upper pin; Figure 9 is the carrying device of the present invention A schematic cross-sectional view of one embodiment illustrates that the cylinder moves the lower pin down through the lifting frame, and the biasing spring drives the upper pin to be reset by the accumulated reset elastic force, so that the bottom end of the upper pin is tightly contacted with the lower shoulder. Figure 10 is a cross-sectional view showing an embodiment of the carrying device of the present invention, illustrating that the bottom surface of the workpiece to be processed abuts against the load bearing top surface of the carrier, and the upper end edge of the elastic ring abuts against the bottom surface of the workpiece to be processed adjacent to the outer circumference And FIG. 11 is a schematic cross-sectional view showing an embodiment of the carrying device of the present invention, illustrating that the first air suction channel and the second air suction channel are inhaled, and the chamber is evacuated to be stably processed. The workpiece is adsorbed and positioned on the top surface of the load, and the warped workpiece to be processed is leveled.

1 is an embodiment of a carrier device of the present invention. The carrier device 200 is applied to a semiconductor semiconductor exposure process and is adapted to carry a workpiece 1 to be processed (as shown in FIG. 8). In this embodiment, The workpiece to be processed 1 is illustrated by taking a wafer as an example.

2, 3, 4 and 5, the carrying device 200 comprises a carrying tray 2, a lifting mechanism 3, and an elastic ring 4. The carrier tray 2 includes a disk body 21 and a plurality of connection rings 23. The disk body 21 includes a carrier top surface 211 that can carry the workpiece 1 to be processed (as shown in FIG. 8), and a lower surface 212 that is opposite to the carrier top surface 211. The carrying top surface 211 is flat. lower surface A plurality of recesses 213 are formed in the recesses 212, and the connecting loops 23 are disposed in the corresponding recesses 213. The connecting loops 23 are locked to the disc body 21 through a plurality of screws 24, so that the connecting loops 23 can be stably positioned correspondingly. Inside the groove 213. Each of the connecting rings 23 includes a lower toroidal surface 231, and the lower surface 212 of the disk body 21 and the lower annular surface 231 of each of the connecting rings 23 together define a bottom surface 214 of the carrier disk 2. In addition, the disk body 21 is formed with a plurality of upper through holes 215 extending to the carrying top surface 211 and communicating with the grooves 213 respectively, and each connecting ring 23 is formed with a lower through hole communicating with the corresponding upper through hole 215. 232. The upper through holes 215 of the disk body 21 respectively define a plurality of through holes 25 penetrating the bearing top surface 211 and the bottom surface 214 together with the lower through holes 232 of the connecting rings 23.

Each of the through holes 25 includes a lower opening 251 formed in the bottom surface 214, an upper opening 252 formed in the carrying top surface 211, and a receiving hole portion 253 communicating between the lower opening 251 and the upper opening 252. The diameter of the hole portion 253 is larger than the diameter of the lower opening 251 and the diameter of the upper opening 252, respectively. Each of the through holes 25 further includes a lower shoulder 254 defined between the lower opening 251 and the receiving hole 253, an upper shoulder 255 defined between the upper opening 252 and the receiving hole 253, and a lower joint 255. An inner bore portion 256 between the shoulder 254 and the upper shoulder 255.

The lifting mechanism 3 includes an actuating assembly and a plurality of pin assemblies 33 coupled to the actuating assembly. The actuating assembly includes a cylinder 31 and a lifting frame 32 coupled to the bottom end of the cylinder 31. The pin assembly 33 is coupled to the lifting frame On the shelf 32. The cylinder 31 is locked to the lower surface 212 of the disk body 21 by, for example, a screw lock, and the cylinder 31 can move the crane frame 32 upward or downward. Each pin assembly 33 extends through the lower opening 251 of the corresponding through hole 25 to the receiving hole portion In 253, the cylinder 31 can move the pin assemblies 33 between the airtight position (as shown in FIG. 5) and a receiving position (shown in FIG. 7) through the lifting frame 32. When the pin assemblies 33 are in the airtight position, the pin assemblies 33 abut against the lower shoulders 254 and close the lower opening 251. When the pin assemblies 33 are in the receiving position, the pin assemblies 33 are partially extended. The top surface 211 is carried and can receive the workpiece 1 .

Each of the pin assemblies 33 includes an upper pin 331 disposed in the receiving hole portion 253 of the corresponding through hole 25 of the carrier disk 2, and a lower pin 332 disposed at the top end of the lifting frame 32. Each of the upper pins 331 is made of a material such as silicone, and each of the upper pins 331 includes a bottom wall 333, a rod 334 protruding upward from the top end of the bottom wall 333, and an outer periphery of the bottom wall 333. A peripheral wall 335 that projects upward and is spaced from the rod 334. The bottom wall 333 is circular and has a diameter larger than the diameter of the lower opening 251 and the diameter of the rod 334, respectively. The bottom wall 333 has a bottom end 336 for abutting the lower shoulder 254 to close the lower opening 251, thereby making the bottom The wall 333 and the lower opening 251 can be kept in an airtight state. The rod body 334 has a smaller diameter than the upper opening 252, and the rod body 334 can extend through the upper opening 252 to receive the workpiece 1. The peripheral wall 335 slidably contacts the inner bore portion 256. The bottom end of each lower pin 332 is locked to the top end of the lifting frame 32 by, for example, a screw lock. The top end of each lower pin 332 is disposed through the lower opening 251 of the corresponding through hole 25 and abuts against the bottom end 336 of the corresponding upper pin 331.

In this embodiment, each of the pin assemblies 33 further includes a biasing spring 337 disposed in the receiving hole portion 253 of the corresponding through hole 25. The biasing spring 337 is a set of compression springs disposed on the rod body 334 and the upper and lower ends respectively abut against the upper shoulder portion 255 and the bottom wall 333. The biasing spring 337 is used for the upper pin rod. The bottom wall 333 of the 331 is biased downwardly, whereby the bottom end 336 of the bottom wall 333 can be brought into tight contact with the lower shoulder 254 to ensure good retention between the bottom end 336 of the bottom wall 333 and the lower shoulder 254. The state of airtight contact.

When the upper pin 331 and the biasing spring 337 are to be assembled in the through hole 25 of the carrier disk 2, first, the upper pin 331 is first placed in the lower through hole 232 of the corresponding connecting ring 23, so that the connecting ring 23 is carried. Pin 331. Then, the biasing springs 337 are sleeved on the rod body 334 corresponding to the upper pin 331 such that the lower end of the biasing spring 337 abuts against the bottom wall 333. Then, the connecting ring 23 is placed in the corresponding groove 213, the rod body 334 of the upper pin 331 is penetrated into the upper through hole 215 of the disk body 21, and the upper end of the biasing spring 337 abuts against the upper shoulder portion. 255. Finally, the connecting ring 23 is locked to the disk body 21 by the screws 24, that is, the assembly operation is completed. By the design of the connection ring 23 that can be locked to the disk body 21 by locking, the convenience of assembling the upper pin 331 and the biasing spring 337 can be improved.

Specifically, in the design, the connection relationship between each of the lower pins 332 and the corresponding upper pin 331 may also have the following changes: the top end of each lower pin 332 and the bottom wall 333 of the corresponding upper pin 331 The two can be fixedly coupled together by, for example, a snap-on method, a screwing method, or an integral molding method, whereby the arrangement of the biasing springs 337 can be omitted, so that the lower pin 332 and the upper pin 331 of each pin assembly 33 are the same. It can move up and down between the airtight position and the receiving position.

Referring to FIG. 4, FIG. 5 and FIG. 6, the disk body 21 of the carrier tray 2 defines a first air intake channel 216 extending through the top surface 211 and the bottom surface 214. The first air suction channel 216 includes three top surfaces 211. Shrinking downward The first trench 217, a plurality of second trenches 218 recessed downwardly from the carrying top surface 211, and a vent 219 extending through the top surface 211 and the bottom surface 214. Each of the first trenches 217 has a long shape, and each of the first trenches 217 extends outward from the center of the carrying top surface 211, and the inner ends of the three first trenches 217 communicate with each other. The second trenches 218 are concentrically arranged with each other and have different diameters, and the second trenches 218 are in communication with the first trenches 217. The top end of the air hole 219 is located at the center of the disk body 21 and communicates with the inner end of the first groove 217. The bottom end of the air hole 219 is for inserting a first air nozzle 51, and the first air nozzle 51 and a pumping mechanism (not shown) Connected. When the air suction mechanism is in operation, the first air nozzle 51 can pump the first trench 217 and the second trench 218 through the air hole 219, whereby the suction energy generated by the first trench 217 and the second trench 218 can be generated. The workpiece 1 to be processed is firmly adsorbed on the carrier top surface 211.

Since the workpiece 1 to be processed is processed by a plurality of semiconductor processes, the workpiece 1 to be processed may be slightly warped rather than completely flat. Therefore, in order to avoid the first trench 217 and the second of the first air intake path 216 During the pumping process, the external gas continuously flows through the gap between the bottom surface 11 of the workpiece 1 to be processed (as shown in FIG. 8) and the load bearing top surface 211. The carrier device 200 of the embodiment transmits The design of the elastic ring 4 overcomes the aforementioned problems. In this embodiment, the disk body 21 of the carrier tray 2 further includes an outer peripheral surface 220 connected between the bearing top surface 211 and the lower surface 212. The elastic ring 4 is made of an elastic material such as silicone rubber or rubber. The elastic ring 4 is sleeved on the outer peripheral surface 220 and includes an upper end edge 41. The upper end edge 41 has a height higher than the height of the load bearing top surface 211. The upper end edge 41 is for abutting against the bottom surface 11 of the workpiece 1 to be processed and adjacent to the workpiece to be processed. An outer circumference 12 of 1 (as shown in Figure 8 It is shown that the upper end edge 41 of the elastic ring 4 is in airtight contact with the bottom surface 11 of the workpiece 1 to be processed.

When the upper end edge 41 of the elastic ring 4 abuts against the bottom surface 11 of the workpiece 1 to be processed, the elastic ring 4, the workpiece 1 to be processed, and the disk body 21 of the carrier disk 2 jointly define a chamber 6 in an airtight state ( As shown in Figure 9). During the process of inhaling, the first groove 217 and the second groove 218 cannot be sucked into the chamber 6 due to the air located in the external environment of the elastic ring 4, so the first groove 217 and the second groove 218 can The chamber 6 is evacuated and the workpiece 1 to be processed is adsorbed by vacuum adsorption. Due to the strong suction generated during vacuum adsorption, the workpiece 1 to be processed can be completely adsorbed to be flat on the flat bearing top surface 211, whereby the workpiece 1 to be processed can be stably adsorbed and positioned on the bearing top surface 211. In addition, it is also possible to effectively flatten the warped workpiece 1 to be processed.

More specifically, the outer peripheral surface 220 of the disk body 21 includes an upper surface portion 221 connected to the carrier top surface 211, a lower surface portion 222 connected to the lower surface 212, and a upper surface portion 221 connected thereto. A flat portion 223 between the bottom end and the top end of the lower standing portion 222, wherein the upper standing portion 221 is recessed to form an annular card slot 224 adjacent to the flat portion 223. The elastic ring 4 includes a positioning ring portion 42 and a bending ring portion 43 extending upward from the outer edge of the positioning ring portion 42 and spaced apart from the upper surface portion 221. The inner edge of the positioning ring portion 42 is engaged with the annular card slot. Within 224, the positioning ring portion 42 is allowed to abut and be positioned on the planar portion 223. The bending ring portion 43 has a first inclined portion 431 extending obliquely upward from the outer edge of the positioning ring portion 42 and facing the upper façade 221, and a top end of the first inclined portion 431 facing upward and away from the upper façade The second portion of the portion 221 is obliquely extended The inclined section 432 has an upper end edge 41 for receiving the bottom surface 11 of the workpiece 1 .

The disk body 21 of the carrier disk 2 further defines a second air intake channel 225 extending through the upper surface portion 221 and the bottom surface 214. The second air intake channel 225 is formed at one end of the upper surface portion 221 corresponding to the elastic ring 4. The second ring nozzle 52 is connected to a suction mechanism (not shown). When the pumping mechanism is in operation, the second air nozzle 52 can inhale the chamber 6 through the second air intake passage 225, whereby the speed at which the chamber 6 is evacuated can be accelerated. In addition, by the design of the first inclined section 431 and the second inclined section 432 of the bending ring portion 43, the second air suction passage 225 is relatively easy to face in the process of suction and vacuuming. The façade 221 is concavely deformed. It should be noted that the bending ring portion 43 of the elastic ring 4 may also be designed in an arc shape that is recessed toward the upper surface portion 221, and the opening of the arc-shaped bending ring portion 43 faces outward, and the bending portion is bent. The shape of 43 is not limited to the one disclosed in the embodiment.

Referring to FIG. 7 , FIG. 8 and FIG. 9 , the workpiece 1 to be processed in the embodiment is described by taking a wafer which is warped after being processed by a plurality of semiconductor processes as an example, wherein the workpiece to be processed is drawn by the drawing. 1 is an example in which the intermediate portion is flat, and the region adjacent to the outer peripheral edge 12 is slightly warped upward.

When the workpiece 1 to be processed is carried by the carrying device 200 to perform the exposure operation, first, the cylinder 31 of the lifting mechanism 3 drives the lower ejector pins 332 to move upward in the direction of the arrow I through the lifting frame 32, and the lower ejector pins 332 will The lower pin 251 is inserted into the accommodating hole portion 253 and the corresponding pin 331 is pushed up, so that the upper pin 331 is moved to the receiving position shown in FIG. At this time, a portion of the rod body 334 of each of the upper pins 331 extends through the upper opening 252 and the bearing top surface 211. A top end 338 of the rod body 334 is spaced apart above the bearing top surface 211, and the height of the top end 338 is higher than the elasticity. The upper end edge 41 of the ring 4 is raised in height. The bottom wall 333 of each of the upper pins 331 compresses the biasing spring 337 to compressively deform and accumulate the return spring force.

Next, the transfer device (not shown) transfers the workpiece 1 to be processed and places it on the top end 338 of the rod 334, so that the bottom surface 11 of the workpiece 1 to be processed abuts against the top end 338. Subsequently, the cylinder 31 drives the lower ejector pins 332 to move downward in the direction of the arrow II through the lifting frame 32. At the same time, the reset spring force accumulated by the biasing springs 337 drives the corresponding upper pin 331 to be driven in the direction of the arrow II. The workpiece 1 is moved down. When the bottom surface 11 of the workpiece 1 to be processed abuts against the bearing top surface 211 of the carrier 2, the lower end edge 41 of the elastic ring 4 abuts against the outer periphery of the bottom surface 11 of the workpiece 1 to be processed. At the position of 12, and the elastic ring 4, the workpiece 1 to be processed, and the disk 21 of the carrier 2 together define a chamber 6 in an airtight state. On the other hand, each of the upper pins 331 continues to move downward, separating the top end 338 of the rod 334 from the bottom surface 11 of the workpiece 1 to be processed. When the bottom end 336 of each upper pin 331 is in tight contact with the lower shoulder 254, the upper pin 331 is positioned in the airtight position shown in FIG. 9, at which time the bottom end 336 of each upper pin 331 is closed. Lower opening 251.

Referring to FIG. 4, FIG. 9, FIG. 10 and FIG. 11, when the air suction mechanism is operated, the first air nozzle 51 inhales the first groove 217 and the second groove 218 through the air hole 219, so that the workpiece 1 to be processed is in the middle. The area is adsorbed on the carrying top surface 211. The bottom wall 333 is caused by the elastic force of the biasing spring 337 The bottom end 336 is in tight contact with the lower shoulder 254 to ensure a good airtight contact between the bottom end 336 of the bottom wall 333 and the lower shoulder 254. Further, by the design of the peripheral wall 335 of each of the upper pins 331 contacting the inner hole surface portion 256 of the corresponding through hole 25, each of the upper pins 331 is in a state of closing the inner hole surface portion 256. The suction force generated when the first groove 217 and the second groove 218 are inhaled causes the gas in the accommodating hole portion 253 of each of the through holes 25 to be drawn upward through the upper opening 252, and the sucking force is applied by the upward pumping. The peripheral wall 335 of each of the upper pins 331 is brought into tight contact with the inner hole surface portion 256 of each of the through holes 25, and the peripheral wall 335 and the inner hole surface portion 256 are kept in an airtight contact state. By the airtight contact state between the bottom end 336 of the bottom wall 333 and the lower shoulder portion 254, and the airtight contact state between the peripheral wall 335 and the inner hole surface portion 256, the external gas can be effectively prevented and blocked. The opening 251 flows into the accommodating hole portion 253.

On the other hand, the second air nozzle 52 inhales the chamber 6 through the second air suction passage 225, and the upper pin 331 can prevent and block the external air from flowing into the accommodating hole portion 253 via the lower opening 251. Therefore, the first groove 217, the second groove 218, and the second suction passage 225 can surely evacuate the chamber 6. When the chamber 6 is in a vacuum state, the strong suction force generated by vacuum adsorption can completely adsorb the workpiece 1 to be processed, and the area of the workpiece 1 to be processed adjacent to the outer circumference 12 is slightly bent and deformed, so that the workpiece 1 to be processed can be flattened. It is attached to the flat carrying top surface 211. Thereby, in addition to stably and surely adsorbing and positioning the workpiece 1 to be processed on the bearing top surface 211, the warped workpiece 1 to be processed can be effectively leveled, and the workpiece 1 to be processed is flat. At the same time, the strong suction force generated during vacuum adsorption causes the bending ring portion 43 to be recessed toward the upper standing portion 221, so that the first inclined portion 431 is opposed to The positioning ring portion 42 is bent and deformed, and the second inclined portion 432 is bent and deformed with respect to the first inclined portion 431, whereby the upper end edge 41 of the bending ring portion 43 can be adjacent to the outer peripheral edge 12 of the workpiece 1 to be processed. The area is bent downward to reduce the height. After the carrying device 200 adsorbs the workpiece 1 to be processed and leveled, the carrying device 200 can move the workpiece 1 to be processed toward the reticle, so that the workpiece 1 to be processed can accurately align with the reticle, Perform subsequent exposure jobs.

In summary, the carrier device 200 of the embodiment has the design of each pin assembly 33 and the elastic ring 4 of the lifting mechanism 3, so that the first air suction channel 216 and the second air suction channel of the carrier 2 are The chamber 225 can evacuate the chamber 6, whereby the workpiece 1 to be processed can be stably and surely positioned on the load bearing top surface 211 of the carrier tray 2. Moreover, the workpiece 1 to be processed can be completely adsorbed by the strong suction force generated by vacuum adsorption to be flatly attached to the flat bearing top surface 211, thereby effectively flattening the warped workpiece 1 to be processed. Therefore, the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

200‧‧‧ Carrying device

256‧‧‧ hole face

2‧‧‧ Carrying tray

3‧‧‧ Lifting mechanism

21‧‧‧ dish

31‧‧‧ cylinder

211‧‧‧bearing top surface

32‧‧‧lifting frame

212‧‧‧ lower surface

33‧‧‧ pin assembly

213‧‧‧ Groove

331‧‧‧Upper pole

214‧‧‧ bottom

332‧‧‧Under the pin

215‧‧‧through hole

333‧‧‧ bottom wall

219‧‧‧ stomata

334‧‧‧ rod body

23‧‧‧Connecting ring

335‧‧‧Wall

231‧‧‧ Lower annulus

336‧‧‧ bottom

232‧‧‧Under hole

337‧‧‧bias spring

25‧‧‧Perforation

338‧‧‧Top

251‧‧‧ opening

4‧‧‧Flexible ring

252‧‧‧Opening

41‧‧‧Upper edge

253‧‧‧ accommodating holes

42‧‧‧ positioning ring

254‧‧‧lower shoulder

43‧‧‧Bend ring

255‧‧‧Upper shoulder

Claims (12)

A carrying device is adapted to carry a workpiece to be processed. The carrying device comprises: a carrying tray comprising a carrying top surface capable of carrying the workpiece to be processed, and a bottom surface defining a plurality of top surfaces of the carrying surface a perforation with the bottom surface, and a first airflow passage extending through the top surface and the bottom surface of the load and capable of inhaling the workpiece to be processed, each of the through holes includes a lower opening formed in the bottom surface, and a communication a accommodating hole portion of the lower opening, and a lower shoulder portion, the accommodating hole portion having a diameter larger than the diameter of the lower opening, the lower shoulder portion being defined between the accommodating hole portion and the lower opening, and a lifting mechanism including plural a pin assembly, each of the pin assemblies extending into the receiving hole through the corresponding lower opening of the through hole, each of the pin assemblies being movable between an airtight position and a receiving position, wherein each pin When the rod assembly is in the airtight position, each of the pin assemblies abuts against the lower shoulder and closes the lower opening. When each of the pin assemblies is in the receiving position, each of the pin assemblies partially protrudes from the bearing The top surface can receive the workpiece to be processed. The carrying device of claim 1, wherein the carrying tray further comprises an outer peripheral surface, the carrying device further comprises a set of elastic rings connected to the outer peripheral surface, the elastic ring comprising an upper end edge, the upper end edge having a high height The top surface of the load bearing height is used for abutting the workpiece to be processed. The carrying device of claim 2, wherein the outer peripheral surface comprises a vertical surface connected to the top surface of the carrying surface, and a flat portion connected to the bottom end of the vertical surface, the elastic ring further comprising abutting Positioning ring of the plane portion And a bending ring portion extending upward from an outer edge of the positioning ring portion, the bending ring portion having the upper end edge and spaced apart from the vertical surface, the carrier plate further defining a penetrating through the façade a second air suction channel of the bottom surface, the second air suction channel corresponding to the position of the bending ring portion. The loading device of claim 1, wherein each of the pin assemblies includes an upper pin disposed in the corresponding receiving hole of the through hole and a biasing spring, each of the upper pins includes a Abutting against the lower shoulder to close the bottom end of the lower opening, and a top end for receiving the workpiece to be processed, the biasing spring is used to bias the upper pin downward to make the bottom end tightly contact On the lower shoulder. The carrier device of claim 4, wherein each of the upper pins is made of an elastic material, each of the upper pins further includes a bottom wall having the bottom end, and a bottom wall protruding upwardly from the bottom wall And having a rod body of the top end, the bottom wall diameter is greater than the diameter of the lower opening and the diameter of the rod body, respectively. The carrier device of claim 5, wherein each of the upper pins further comprises a peripheral wall extending upward from the outer peripheral edge of the bottom wall and spaced apart from the rod body, each of the perforations further comprising a connection The inner hole surface portion of the shoulder portion, the peripheral wall of each of the upper pin rods slidably contacts the inner hole surface portion. The carrying device of claim 6, wherein each of the through holes further comprises an upper opening formed on the top surface of the bearing and communicating with the receiving hole, and an upper shoulder, the diameter of the receiving hole is larger than The upper opening is defined between the accommodating hole portion and the upper opening and is connected to the inner hole surface portion, and the rod body can extend through the upper opening, and the bias springs respectively Abutting the upper shoulder and the bottom wall. The carrying device of claim 7, wherein the carrying tray further comprises a disk body and a plurality of connecting rings, the disk body defining the carrying top surface and the first air suction channel, and each connecting ring is used To support the corresponding upper pin, the connecting ring is locked to the disk body and together with the disk body defines the perforations and the bottom surface. The carrier device of claim 4, wherein each of the pin assemblies further includes a lower pin disposed through the corresponding lower opening, the top end of the lower pin abutting against the bottom of the corresponding upper pin The lifting mechanism further includes an actuating assembly coupled to the bottom end of the lower pin, the actuating assembly for moving the pin assembly between the airtight position and the receiving position. The carrier device of any one of claims 4 to 9, wherein the carrier tray further comprises an outer peripheral surface, the carrier device further comprising a set of elastic rings connected to the outer peripheral surface, the elastic ring comprising an upper edge The upper end edge height is higher than the height of the load bearing top surface and is used for abutting the workpiece to be processed. The carrying device of claim 10, wherein the outer peripheral surface comprises a vertical surface connected to the top surface of the carrying surface, and a flat portion connected to the bottom end of the vertical surface, the elastic ring further comprising abutting a positioning ring portion of the plane portion, and a bending ring portion extending upward from an outer edge of the positioning ring portion, the bending ring portion having the upper end edge and spaced apart from the vertical surface portion, the carrier tray further comprising a The second air suction passage passes through the second air intake passage passing through the vertical surface and the bottom surface, and the second air suction passage corresponds to the position of the bending ring portion. The carrying device of claim 11, wherein the vertical surface is recessed to form an annular card slot adjacent to the planar portion, the inner edge of the positioning ring portion is engaged in the annular card slot, and the bending ring portion has a The outer edge of the positioning ring faces a first inclined section extending upward and obliquely toward the vertical face direction, and a second inclined section extending upward from the top end of the first inclined section and obliquely extending away from the vertical face direction.