TW201538638A - Addition-cured silicone composition - Google Patents
Addition-cured silicone composition Download PDFInfo
- Publication number
- TW201538638A TW201538638A TW104103435A TW104103435A TW201538638A TW 201538638 A TW201538638 A TW 201538638A TW 104103435 A TW104103435 A TW 104103435A TW 104103435 A TW104103435 A TW 104103435A TW 201538638 A TW201538638 A TW 201538638A
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- TW
- Taiwan
- Prior art keywords
- group
- component
- addition
- mass
- polyorganosiloxane
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 107
- 229920001296 polysiloxane Polymers 0.000 title claims abstract 5
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 55
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- -1 decane compound Chemical class 0.000 claims description 57
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 39
- 150000002430 hydrocarbons Chemical group 0.000 claims description 32
- 229920002098 polyfluorene Polymers 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229910052902 vermiculite Inorganic materials 0.000 claims description 28
- 235000019354 vermiculite Nutrition 0.000 claims description 28
- 239000010455 vermiculite Substances 0.000 claims description 28
- 239000001301 oxygen Substances 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 229910052799 carbon Inorganic materials 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 20
- 125000003700 epoxy group Chemical group 0.000 claims description 18
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 17
- 229910052707 ruthenium Inorganic materials 0.000 claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims description 14
- 125000003545 alkoxy group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 125000004429 atom Chemical group 0.000 claims description 13
- 150000001721 carbon Chemical group 0.000 claims description 12
- 238000007259 addition reaction Methods 0.000 claims description 11
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 150000007973 cyanuric acids Chemical class 0.000 claims description 8
- 238000005984 hydrogenation reaction Methods 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 7
- 239000002683 reaction inhibitor Substances 0.000 claims description 7
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 6
- 229910052779 Neodymium Inorganic materials 0.000 claims description 5
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 5
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052746 lanthanum Inorganic materials 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 2
- 238000006467 substitution reaction Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 46
- 230000008859 change Effects 0.000 abstract description 22
- 150000003254 radicals Chemical class 0.000 abstract description 11
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract description 7
- 125000004430 oxygen atom Chemical group O* 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000003197 catalytic effect Effects 0.000 abstract description 2
- 230000008602 contraction Effects 0.000 abstract description 2
- 238000006459 hydrosilylation reaction Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 49
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 19
- 150000007942 carboxylates Chemical class 0.000 description 17
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 16
- 239000000758 substrate Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 9
- 125000001424 substituent group Chemical group 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000004954 Polyphthalamide Substances 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920006375 polyphtalamide Polymers 0.000 description 7
- 229910052761 rare earth metal Inorganic materials 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- GGVUYAXGAOIFIC-UHFFFAOYSA-K cerium(3+);2-ethylhexanoate Chemical compound [Ce+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O GGVUYAXGAOIFIC-UHFFFAOYSA-K 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- IUHFWCGCSVTMPG-UHFFFAOYSA-N [C].[C] Chemical group [C].[C] IUHFWCGCSVTMPG-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000006165 cyclic alkyl group Chemical group 0.000 description 3
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 150000001975 deuterium Chemical group 0.000 description 3
- 229910052805 deuterium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 125000005647 linker group Chemical group 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
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- 239000002904 solvent Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- YTPFRRRNIYVFFE-UHFFFAOYSA-N 2,2,3,3,5,5-hexamethyl-1,4-dioxane Chemical compound CC1(C)COC(C)(C)C(C)(C)O1 YTPFRRRNIYVFFE-UHFFFAOYSA-N 0.000 description 2
- SMSVUYQRWYTTLI-UHFFFAOYSA-L 2-ethylhexanoate;iron(2+) Chemical compound [Fe+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O SMSVUYQRWYTTLI-UHFFFAOYSA-L 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- XUXUHDYTLNCYQQ-UHFFFAOYSA-N 4-amino-TEMPO Chemical compound CC1(C)CC(N)CC(C)(C)N1[O] XUXUHDYTLNCYQQ-UHFFFAOYSA-N 0.000 description 2
- CYQGCJQJIOARKD-UHFFFAOYSA-N 4-carboxy-TEMPO Chemical compound CC1(C)CC(C(O)=O)CC(C)(C)N1[O] CYQGCJQJIOARKD-UHFFFAOYSA-N 0.000 description 2
- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical compound CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- WBKDDMYJLXVBNI-UHFFFAOYSA-K chromium(3+);2-ethylhexanoate Chemical compound [Cr+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O WBKDDMYJLXVBNI-UHFFFAOYSA-K 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000004983 dialkoxyalkyl group Chemical group 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
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- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
- 238000006277 sulfonation reaction Methods 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
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- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- VJNSCINLGYURMF-UHFFFAOYSA-N 1,1,1-trichloro-2-methyldecane Chemical compound CCCCCCCCC(C)C(Cl)(Cl)Cl VJNSCINLGYURMF-UHFFFAOYSA-N 0.000 description 1
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 1
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- NCRNCSZWOOYBQF-UHFFFAOYSA-N 1,1-Dimethoxydecane Chemical compound CCCCCCCCCC(OC)OC NCRNCSZWOOYBQF-UHFFFAOYSA-N 0.000 description 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- SMLNDVNTPWRZJH-UHFFFAOYSA-N 1-chloro-4-(trimethoxymethyl)dodecane Chemical compound ClCCCC(C(OC)(OC)OC)CCCCCCCC SMLNDVNTPWRZJH-UHFFFAOYSA-N 0.000 description 1
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- HGRVTNYKVLTPAB-UHFFFAOYSA-N 2,2-dimethyl-1,4-dioxane Chemical compound CC1(C)COCCO1 HGRVTNYKVLTPAB-UHFFFAOYSA-N 0.000 description 1
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- LBIHNTAFJVHBLJ-UHFFFAOYSA-N 3-(triethoxymethyl)undec-1-ene Chemical compound C(=C)C(C(OCC)(OCC)OCC)CCCCCCCC LBIHNTAFJVHBLJ-UHFFFAOYSA-N 0.000 description 1
- IIEWMRPKJCXTAD-UHFFFAOYSA-N 3-(trimethoxymethyl)undecane Chemical compound C(C)C(C(OC)(OC)OC)CCCCCCCC IIEWMRPKJCXTAD-UHFFFAOYSA-N 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
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- 125000006043 5-hexenyl group Chemical group 0.000 description 1
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Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明係有關加成硬化型聚矽氧組成物,特別是關於所得之硬化物具有優異的黏著性、外觀,同時受熱之收縮及硬度之變化為少的加成硬化型聚矽氧組成物。 The present invention relates to an addition-curable polyfluorene-oxygen composition, and particularly relates to an addition-curable polyfluorene-oxygen composition which has excellent adhesion and appearance with respect to the obtained cured product, and which has little change in heat shrinkage and hardness.
如聚矽氧橡膠、聚矽氧凝膠之類的聚矽氧(聚有機矽氧烷)組成物,係由於形成耐候性、耐熱性、硬度、伸長等之諸多特性為優異的硬化物,故被使用於各種的用途中。 A polyfluorene oxide (polyorganotoxime) composition such as a polyoxyxene rubber or a polyoxymethylene gel is an excellent cured product because of various properties such as weather resistance, heat resistance, hardness, and elongation. Used in a variety of uses.
例如具備發光二極體(LED:Light Emitting Diode)等之發光元件的光學半導體裝置中,作為密封發光元件之材料,係使用耐熱性及耐紫外線特性為優越的聚矽氧組成物。特別是利用氫化矽烷化(hydrosilylation)使其硬化之加成硬化型聚矽氧組成物,能藉由加熱以短時間來硬化,且由於硬化時未產生副產物,故被廣泛使用。 For example, in an optical semiconductor device including a light-emitting element such as a light-emitting diode (LED), a material of a sealed light-emitting device is a polymerized polyoxygen composition having excellent heat resistance and ultraviolet resistance. In particular, the addition-hardening polyoxonium composition which is hardened by hydrosilylation can be hardened by heating for a short period of time, and is not widely used as a by-product at the time of hardening, and is widely used.
又,相較於環氧樹脂,由於加成硬化型聚矽氧組成物之黏著性為低,就使黏著性提昇為目的,已提案著於上述組成物中調配烷氧基矽烷基及/或環氧基、與具 有交聯性乙烯基及/或氫化矽烷基的異三聚氰酸衍生物(例如參考專利文獻1)。 Further, compared with the epoxy resin, since the adhesion of the addition-curable polyfluorene-oxygen composition is low, the adhesion is improved, and it has been proposed to formulate an alkoxyalkyl group and/or in the above composition. Epoxy group, with An isomeric cyanuric acid derivative having a crosslinkable vinyl group and/or a hydrogenated alkylene group (for example, refer to Patent Document 1).
然而,在加成硬化型聚矽氧組成物中,若調配此等之黏著性提昇成分時,對於所得之硬化物將有起因於該成分而於加熱時產生裂紋、或伴隨於此而產生自被黏著物剝離之情形。此係認為,由於同時進行受熱之硬化物之收縮與硬度之變化而相乘所產生。因此期望一種可賦予下述般硬化物的加成硬化型聚矽氧組成物之開發,該硬化物係藉由含有黏著性提昇成分而能充分確保黏著性之提昇,同時可抑制起因於該成分的硬化物之受熱之收縮與硬度之變化。 However, when the adhesion-improving component is blended in the addition-curable polyfluorene-oxygen composition, the obtained cured product may be caused by cracking during heating due to the component, or may be generated therefrom. The case where the adhesive is peeled off. This is believed to be caused by the simultaneous multiplication of the shrinkage of the heated cured product and the change in hardness. Therefore, development of an addition-curable polyfluorene-oxygen composition capable of imparting an adhesion-promoting component capable of sufficiently ensuring an improvement in adhesion while suppressing the cause of the composition is desired. The shrinkage of the cured product and the change in hardness.
另一方面,就抑制受熱之硬度之變化為目的,提案著在不含有如上述般的黏著性提昇成分的加成硬化型聚矽氧組成物中調配羧酸之稀土類鹽之技術(例如參考專利文獻2)。然而至今為止尚未有下述般之嘗試:在調配有黏著性提昇成分的加成硬化型聚矽氧組成物中,以抑制起因於該黏著性提昇成分之加成硬化型聚矽氧組成物硬化物之熱收縮。 On the other hand, in order to suppress the change in the hardness of the heat, a technique of formulating a rare earth salt of a carboxylic acid in an addition-curable polyfluorene-oxygen composition which does not contain the above-mentioned adhesion-promoting component is proposed (for example, reference) Patent Document 2). However, the following attempts have not been made: in the addition-hardening polyoxon composition in which the adhesion-promoting component is formulated, the addition-hardening polyoxon composition hardening due to the adhesion-improving component is suppressed. The heat of the object shrinks.
[專利文獻1]日本特開2010-065161號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-065161
[專利文獻2]國際公開2013/084699號 [Patent Document 2] International Publication No. 2013/084699
本發明為能夠解決如此般問題之發明,以提供所得之聚矽氧硬化物具有優異的黏著性、外觀,同時受熱之收縮及硬度之變化為少的加成硬化型聚矽氧組成物為目的。 The present invention is an invention capable of solving such a problem, and is intended to provide an additive-hardening polyfluorene-oxygen composition having excellent adhesion and appearance while being subjected to heat shrinkage and hardness change. .
本發明之加成硬化型聚矽氧組成物,其特徵係含有:(A)1分子中具有至少1個鍵結於矽原子之烯基之聚有機矽氧烷:100質量份;(B)1分子中具有至少2個鍵結於矽原子之氫原子之聚有機氫矽氧烷:對於前述(A)成分所具有之烯基之合計量1莫耳而言,使鍵結於矽原子之氫原子成為0.9~3.0莫耳之量;(C)氫化矽烷化反應觸媒:觸媒量;(D)作為黏著性賦予劑之選自下述(D1)及(D2)之至少1種:0.01~10質量份,(D1)具有選自環氧基及烷氧基矽烷基之至少1種、與選自氫化矽烷基及交聯性乙烯基之至少1種之異三聚氰酸衍生物,(D2)具有選自環氧基及烷氧基之至少1種,但不具有異三聚氰酸環之矽烷或矽氧烷化合物;及
(E)以下述一般式(3)所表示之有機自由基:0.001~0.05質量份,
(式(3)中,R5分別獨立表示氫原子或碳數1~3之烴基;R6分別獨立表示氫原子、碳數1~3之烴基、羧基或羥基,或是以鍵結於相同碳原子之2個R6來表示=O,但是,R6之中至少1個為羧基或羥基,或式(3)具有至少1個以鍵結於相同碳原子之2個R6來表示=O)。 (In the formula (3), R 5 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms; and R 6 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 3 carbon atoms, a carboxyl group or a hydroxyl group, or is bonded to the same Two R 6 of carbon atoms represent =0, but at least one of R 6 is a carboxyl group or a hydroxyl group, or formula (3) has at least one of two R 6 bonded to the same carbon atom. O).
藉由本發明可提供一種加成硬化型聚矽氧組成物,其係使用此者所得之聚矽氧硬化物為具有優異的黏著性、外觀,同時可抑制熱收縮及受熱之硬度之變化。 According to the present invention, it is possible to provide an addition-hardening polyfluorene-oxygen composition which has excellent adhesion and appearance while suppressing changes in hardness such as heat shrinkage and heat.
以下,對於本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described.
本發明之加成硬化型聚矽氧組成物為含有下述(A)~(E)成分。 The addition-hardening polyfluorene composition of the present invention contains the following components (A) to (E).
(A)1分子中具有至少1個鍵結於矽原子之烯基之聚有機矽氧烷:100質量份;(B)1分子中具有至少2個鍵結於矽原子之氫原子之聚有機氫矽氧烷:對於前述(A)成分所具有之烯基之合計量1莫耳而言,使鍵結於矽原子之氫原子成為0.9~3.0莫耳之量;(C)氫化矽烷化反應觸媒:觸媒量;(D)作為黏著性賦予劑之選自下述(D1)及(D2)之至少1種:0.01~10質量份,(D1)具有選自環氧基及烷氧基矽烷基之至少1種、與選自氫化矽烷基及交聯性乙烯基之至少1種之異三聚氰酸衍生物,(D2)具有選自環氧基及烷氧基之至少1種,但不具有異三聚氰酸環之矽烷或矽氧烷化合物;及(E)以上述一般式(3)所表示之有機自由基:0.001~0.05質量份。 (A) a polyorganosiloxane having at least one alkenyl group bonded to a ruthenium atom in one molecule: 100 parts by mass; (B) a polyorganic having at least two hydrogen atoms bonded to a ruthenium atom in one molecule Hydroquinone: for the total amount of alkenyl groups of the above-mentioned (A) component, the hydrogen atom bonded to the deuterium atom is 0.9 to 3.0 mol; (C) the hydronization reaction Catalyst: amount of catalyst; (D) at least one selected from the group consisting of (D1) and (D2) as an adhesion-imparting agent: 0.01 to 10 parts by mass, (D1) having an epoxy group and an alkoxy group selected from the group consisting of At least one of a group consisting of an alkyl group and at least one selected from the group consisting of a hydrogenated alkyl group and a crosslinkable vinyl group, and (D2) having at least one selected from the group consisting of an epoxy group and an alkoxy group. However, the decane or decane compound having no isocylate ring; and (E) the organic radical represented by the above general formula (3): 0.001 to 0.05 parts by mass.
以下,對於各成分進行說明。 Hereinafter, each component will be described.
(A)成分係與下列所說明的(B)成分共同成為本發明之組成物的基質聚合物之含有烯基之聚有機矽氧烷。 The component (A) is an alkenyl group-containing polyorganosiloxane having a matrix polymer which is a composition of the present invention together with the component (B) described below.
(A)成分只要是1分子中具有至少1個鍵結於矽原子之烯基之聚有機矽氧烷即可,無特別限制。 The component (A) is not particularly limited as long as it is a polyorganosiloxane having at least one alkenyl group bonded to a ruthenium atom in one molecule.
(A)成分之聚有機矽氧烷分子之構造並無特別限定,可為直鏈狀、支鏈狀、環狀及網目狀之任何構造,或亦可為此等之組合之構造。支鏈狀構造及網目狀構造皆可為二次元構造或三次元構造。尚,本說明書中特別是對於由支鏈狀構造所構成之分子、由網目狀構造所構成之分子、及由支鏈狀構造與網目狀構造之兩構造所構成之分子,係將此等總稱為「支鏈狀‧網目狀構造」之分子。 The structure of the polyorganosiloxane molecule of the component (A) is not particularly limited, and may be any structure of a linear chain, a branched chain, a ring shape, and a mesh shape, or a combination of these. Both the branched structure and the mesh-like structure may be a two-dimensional structure or a three-dimensional structure. In the present specification, in particular, a molecule composed of a branched structure, a molecule composed of a mesh structure, and a molecule composed of a branched structure and a mesh structure are collectively referred to. It is a molecule of "chain-shaped ‧ mesh-like structure".
又,(A)成分之聚有機矽氧烷,可為1種類之分子構造之聚有機矽氧烷之1種或由2種以上之混合物所構成,亦可由2種類以上之分子構造之聚有機矽氧烷之各1種以上之混合物所構成。(A)成分為混合物時,1分子中之鍵結於矽原子之烯基之數,只要是作為(A)成分整體之平均而言為1個以上即可。 In addition, the polyorganosiloxane of the component (A) may be one type of a polyorganosiloxane having a molecular structure of one type or a mixture of two or more types, or a polyorganism having two or more types of molecules. A mixture of one or more of each of oxoxanes. When the component (A) is a mixture, the number of the alkenyl groups bonded to the ruthenium atom in one molecule may be one or more as an average of the entire component (A).
作為(A)成分,以分別於1分子中具有至少1個鍵結於矽原子之烯基之直鏈狀之聚有機矽氧烷及支鏈狀‧網目狀構造之聚有機矽氧烷之組合為較佳。尚,本說明書中,「直鏈狀之聚有機矽氧烷」之用語,係包含在矽氧烷骨架中存在若干的支鏈之聚有機矽氧烷。 As the component (A), a combination of a linear polyorganosiloxane having at least one alkenyl group bonded to a fluorene atom in one molecule and a polyorganosiloxane having a branched ‧ mesh structure It is better. In the present specification, the term "linear polyorganosiloxane" is a polyorganosiloxane containing a plurality of branched chains in a siloxane skeleton.
雖依用途而異,但若基質聚合物僅使用直鏈狀之聚有機矽氧烷所構成時,有硬度不充分之情形。對於要求硬度之用途中,特別是以組合直鏈狀之聚有機矽氧烷與支鏈狀‧網目狀構造之聚有機矽氧烷來使用為較佳。 尚,僅使用直鏈狀之聚有機矽氧烷來作為(A)成分,藉由組合後述之(F)矽石粉末,可將硬度調整至一定程度。又,(F)矽石粉末亦可使用於(A)成分為含有直鏈狀之聚有機矽氧烷作為主體之情形。所謂(A)成分為含有直鏈狀之聚有機矽氧烷作為主體,係指對於(A)成分總量而言,直鏈狀之聚有機矽氧烷之含有量為超過50質量%時之意。 Although it differs depending on the use, when the matrix polymer is composed only of a linear polyorganosiloxane, the hardness is insufficient. Among the applications requiring hardness, it is particularly preferred to use a polyorganosiloxane having a linear polyorganosiloxane and a branched ‧ mesh structure. Further, only the linear polyorganosiloxane is used as the component (A), and the hardness can be adjusted to a certain extent by combining the (F) vermiculite powder described later. Further, the (F) vermiculite powder may be used in the case where the component (A) is a linear polyorganosiloxane. The component (A) is a linear polyorganosiloxane having a linear content, and the content of the linear polyorganosiloxane is more than 50% by mass based on the total amount of the component (A). meaning.
作為直鏈狀之聚有機矽氧烷,可列舉例如以下述一般式(1)所表示之聚有機矽氧烷(A1)。 The polyorganosiloxane (A1) represented by the following general formula (1) is exemplified as the linear polyorganosiloxane.
(R1 3SiO1/2)(R1 2SiO2/2)n(R1 3SiO1/2)…(1) (R 1 3 SiO 1/2 )(R 1 2 SiO 2/2 ) n (R 1 3 SiO 1/2 ) (1)
(但是,式(1)中,R1分別獨立表示烯基、或不包含脂肪族不飽和基之1價之非取代或取代烴基,R1之至少2個為烯基;以n+2所表示之平均聚合度為50~2,500)。 (However, in the formula (1), R 1 each independently represents an alkenyl group or a monovalent unsubstituted or substituted hydrocarbon group which does not contain an aliphatic unsaturated group, and at least two of R 1 are an alkenyl group; The average degree of polymerization is expressed as 50~2,500).
又,作為支鏈狀‧網目狀構造之聚有機矽氧烷,可列舉例如以下述平均單位式(2)所表示之聚有機矽氧烷(A2)。 In addition, the polyorganosiloxane (A2) represented by the following average unit formula (2) is exemplified as the polyorganosiloxane.
(R2 3SiO1/2)a(R2 2SiO2/2)b(R2SiO3/2)c(SiO4/2)d…(2) (R 2 3 SiO 1/2 ) a (R 2 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (2)
(但是,式(2)中,R2分別獨立表示烯基、或不包含脂肪族不飽和基之1價之非取代或取代烴基,R2之至少1個為烯基;a及d為正數,b及c為0或正數)。 (However, in the formula (2), R 2 each independently represents an alkenyl group or a monovalent unsubstituted or substituted hydrocarbon group which does not contain an aliphatic unsaturated group, and at least one of R 2 is an alkenyl group; a and d are positive numbers , b and c are 0 or a positive number).
就能良好地控制如以下所示般的高聚合度之聚合物之合成而言,以上述一般式(1)所表示之聚有機矽氧烷 (A1)之矽氧烷骨架為直鏈狀。但是,若干之支鏈,例如亦可在分子中存在複數個支鏈。 The polyorganooxynonane represented by the above general formula (1) can be well controlled in the synthesis of a polymer having a high degree of polymerization as shown below. The azide skeleton of (A1) is linear. However, a number of branches, for example, may also have a plurality of branches in the molecule.
聚有機矽氧烷(A1)之平均聚合度(即,矽氧烷單位之數),於一般式(1)中,在n中加入末端基之數之2,而以n+2所示,係50~2,500之範圍內。平均聚合度較佳為100~1,500。聚有機矽氧烷(A1)之平均聚合度只要在上述範圍內,不但無合成(聚合)上之問題,且作業性亦為良好。 The average degree of polymerization of polyorganosiloxane (A1) (ie, the number of units of decane), in the general formula (1), the number of terminal groups is added to n, and is represented by n+2. It is within the range of 50~2,500. The average degree of polymerization is preferably from 100 to 1,500. When the average degree of polymerization of the polyorganosiloxane (A1) is within the above range, there is no problem in synthesis (polymerization), and workability is also good.
聚有機矽氧烷(A1)之黏度(25℃),較佳為100~150,000mPa‧s,特別是以200~20,000mPa‧s之範圍為較佳。若聚有機矽氧烷(A1)之黏度在該範圍內時,不但所得之組成物之作業性為良好,另外由該組成物所得之聚矽氧硬化物之物理特性亦為良好。 The viscosity of the polyorganosiloxane (A1) (25 ° C) is preferably from 100 to 150,000 mPa ‧ , particularly preferably in the range of from 200 to 20,000 mPa ‧ s. When the viscosity of the polyorganosiloxane (A1) is within this range, not only the workability of the obtained composition is good, but also the physical properties of the polyoxysulfide cured product obtained from the composition are good.
尚,本說明書中除非另有規定,黏度係指藉由旋轉黏度計在25℃下所測定之黏度。又,測定時之旋轉數等之條件,可因應檢體之黏度或所使用之測定裝置來適當調整。 Further, unless otherwise specified in the specification, the viscosity refers to the viscosity measured by a rotary viscometer at 25 ° C. Further, the conditions such as the number of rotations at the time of measurement can be appropriately adjusted depending on the viscosity of the sample or the measuring device to be used.
聚有機矽氧烷(A1)係1分子中具有2個以上鍵結於矽原子之烯基。又,該烯基之個數較佳為250個以下,又較佳為50個以下。烯基之個數若每1分子中超過250個時,硬化物會變得脆弱且有無法展現出充分強度之虞。尚,於此所謂烯基之個數,係在聚有機矽氧烷(A1)中的每1分子之平均個數。 The polyorganosiloxane (A1) has two or more alkenyl groups bonded to a ruthenium atom in one molecule. Further, the number of the alkenyl groups is preferably 250 or less, and more preferably 50 or less. When the number of alkenyl groups exceeds 250 per molecule, the cured product becomes weak and does not exhibit sufficient strength. Further, the number of the alkenyl groups herein is the average number per molecule of the polyorganosiloxane (A1).
上述一般式(1)中的R1係分別獨立為烯基 或、不包含脂肪族不飽和基之1價之非取代或取代烴基。一般式(1)中,使每1分子之烯基數以成為上述範圍之方式,可適當調整該式(1)中R1之作為烯基之個數(比例)。 The R 1 in the above general formula (1) is independently an alkenyl group or a monovalent unsubstituted or substituted hydrocarbon group which does not contain an aliphatic unsaturated group. In the general formula (1), the number of alkenyl groups (ratio) of R 1 in the formula (1) can be appropriately adjusted so that the number of alkenyl groups per molecule is within the above range.
若R1為不包含脂肪族不飽和基之1價之非取代或取代烴基時,作為該R1具體而言可列舉如:甲基、乙基、丙基、丁基、戊基、己基等之烷基;苯基、甲苯基、二甲苯基等之芳基;苄基、苯乙基等之芳烷基;氯甲基、3-氯丙基、3,3,3-三氟丙基、3-氰丙基、3-甲氧基丙基等之取代烴基。 When R 1 is a monovalent unsubstituted or substituted hydrocarbon group which does not contain an aliphatic unsaturated group, examples of the R 1 include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group and the like. An alkyl group; an aryl group such as a phenyl group, a tolyl group or a xylyl group; an aralkyl group such as a benzyl group or a phenethyl group; a chloromethyl group, a 3-chloropropyl group, and a 3,3,3-trifluoropropyl group; a substituted hydrocarbon group such as 3-cyanopropyl or 3-methoxypropyl.
若R1為烯基時,作為該R1具體而言可列舉如:乙烯基、烯丙基、3-丁烯基、4-戊烯基、5-己烯基等。因為聚有機矽氧烷(A1)之合成或操作為容易,且加成反應亦容易地進行,故烯基較佳為乙烯基。烯基亦可鍵結於分子中之任何矽原子,但因為顯示優異的反應性,故該一部分以鍵結於分子末端之矽原子為較佳。一般式(1)中,複數個烯基可相同或不同,但就合成容易之點而言,較佳為相同。 When R 1 is an alkenyl group, specific examples of the R 1 include a vinyl group, an allyl group, a 3-butenyl group, a 4-pentenyl group, and a 5-hexenyl group. Since the synthesis or operation of the polyorganosiloxane (A1) is easy and the addition reaction proceeds easily, the alkenyl group is preferably a vinyl group. The alkenyl group may also be bonded to any deuterium atom in the molecule, but since it exhibits excellent reactivity, it is preferred that the moiety be a deuterium atom bonded to the end of the molecule. In the general formula (1), the plurality of alkenyl groups may be the same or different, but are preferably the same in terms of ease of synthesis.
作為烯基以外的R1,聚有機矽氧烷(A1),係具有表示1價之非取代或取代烴基之R1(以下,將烯基以外的R1以「R11」表示)複數個(由全部的R1之個數中扣除上述烯基之個數後的個數)。聚有機矽氧烷(A1)中,複數個R11可相同或不同。就合成容易之點而言,此等之R11較佳為相同。但是,因應所得之聚矽氧硬化物所 要求之物性,亦可於該一部分導入不同之基。 R 1 other than the alkenyl group, the polyorganosiloxane (A1) has a plurality of R 1 (hereinafter, R 1 other than an alkenyl group) represented by a monovalent unsubstituted or substituted hydrocarbon group (hereinafter referred to as "R 11 ") (The number of the number of the above alkenes is subtracted from the number of all R 1 ). In the polyorganosiloxane (A1), a plurality of R 11 's may be the same or different. R 11 is preferably the same in terms of ease of synthesis. However, depending on the physical properties required for the obtained polyoxysulfide cured product, a different base may be introduced into the portion.
就聚有機矽氧烷(A1)之合成或操作為容易,且可得到優異的耐熱性,較佳以聚有機矽氧烷(A1)所具有之R11之50%以上為甲基,特佳以R11之全部為甲基。 It is easy to synthesize or operate the polyorganosiloxane (A1), and excellent heat resistance can be obtained. It is preferable to use a polyorganosiloxane (A1) which is 50% or more of R 11 as a methyl group. All of R 11 is a methyl group.
又,就調整所得之聚矽氧硬化物之硬度或彈性率為目的,可使用將聚有機矽氧烷(A1)所具有之R11之一部分作為苯基,並將剩餘的R11之全部作為甲基之組合。該情形時,以式(1)中的n所包圍的單位的R1之部分為苯基,剩餘的R1之中烯基以外的R1之全部為甲基之組合為較佳。 Further, for the purpose of adjusting the hardness or the modulus of elasticity of the obtained polyoxysulfuric cured product, a part of R 11 which the polyorganosiloxane (A1) has may be used as a phenyl group, and all of the remaining R 11 may be used. A combination of methyl groups. In this case, a part of R 1 in the unit surrounded by n in the formula (1) is a phenyl group, and a combination of all of R 1 other than the alkenyl group other than the alkenyl group in the remaining R 1 is preferably a methyl group.
進而,就賦予耐油性及/或耐溶劑性為目的,在所得之聚矽氧硬化物中,可使用將聚有機矽氧烷(A1)所具有之R11之一部分作為3,3,3-三氟丙基,並將剩餘的R11之全部作為甲基之組合。該情形時,以式(1)中的n所包圍的單位的R1之部分為3,3,3-三氟丙基,剩餘的R1之中烯基以外的R1之全部為甲基之組合為較佳。 Further, for the purpose of imparting oil resistance and/or solvent resistance, a part of R 11 which the polyorganosiloxane (A1) has may be used as 3,3,3- in the obtained polyoxysulfide cured product. Trifluoropropyl, and all of the remaining R 11 are taken as a combination of methyl groups. When this case, the formula n (1) is surrounded by a unit of the R 1 moiety is 3,3,3-trifluoropropyl, R 1 other than the alkenyl group among the remaining R 1 are all methyl The combination is preferred.
本發明之實施形態之加成硬化型聚矽氧組成物中,若使用直鏈狀之聚有機矽氧烷作為(A)成分時,可使用1種、或可併用2種以上。又,關於聚有機矽氧烷(A1),亦可使用1種、或亦可併用2種以上。 When the linear polyorganosiloxane is used as the component (A) in the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention, one type may be used or two or more types may be used in combination. Further, the polyorganosiloxane (A1) may be used alone or in combination of two or more.
若使用2種以上之聚有機矽氧烷(A1)時,聚有機矽氧烷(A1)可為混合平均聚合度為不同的2種以上的聚有機矽氧烷(A1),來調整混合物之黏度。藉由組 合2種以上平均聚合度為不同的聚有機矽氧烷來使用,將有對於期望的黏度之調整為容易,且可使用的聚有機矽氧烷之範圍變大之優點。 When two or more kinds of polyorganosiloxanes (A1) are used, the polyorganosiloxane (A1) may be a mixture of two or more kinds of polyorganosiloxanes (A1) having different average polymerization degrees to adjust the mixture. Viscosity. By group When two or more kinds of polyorganosiloxanes having different average polymerization degrees are used, it is easy to adjust the desired viscosity, and the range of the polyorganosiloxane which can be used becomes large.
以上述平均單位式(2)所表示之聚有機矽氧烷(A2),係具有以a:b:c:d之比例含有(R2 3SiO1/2)單位(以下亦稱為「M單位」)、(R2 2SiO2/2)單位(以下亦稱為「D單位」)、(R2SiO3/2)單位(以下亦稱為「T單位」)、及(SiO4/2)單位(以下亦稱為「Q單位」)之支鏈狀‧網目狀構造之聚有機矽氧烷。 The polyorganosiloxane (A2) represented by the above average unit formula (2) has a unit of (R 2 3 SiO 1/2 ) in a ratio of a:b:c:d (hereinafter also referred to as "M" Unit "), (R 2 2 SiO 2/2 ) units (hereinafter also referred to as "D units"), (R 2 SiO 3/2 ) units (hereinafter also referred to as "T units"), and (SiO 4/ 2 ) A polyorganosiloxane having a branched or reticular structure of a unit (hereinafter also referred to as "Q unit").
作為聚有機矽氧烷(A2)之各單位之構成,a及d為正數,b及c為0或正數。即,M單位及Q單位為必須構造單位,D單位與T單位為任意構造單位。 As a constitution of each unit of the polyorganosiloxane (A2), a and d are positive numbers, and b and c are 0 or a positive number. That is, the M unit and the Q unit are necessary structural units, and the D unit and the T unit are arbitrary structural units.
尚,平均單位式(2)中的a、b、c、d之關係,係以滿足0<a/(c+d)<3且0≦b/(c+d)<2為較佳。 Further, the relationship of a, b, c, and d in the averaging unit formula (2) is preferably such that 0 < a / (c + d) < 3 and 0 ≦ b / (c + d) < 2 is satisfied.
聚有機矽氧烷(A2)之用凝膠滲透層析法所測定之質量平均分子量,較佳為在1,000~100,000之範圍內,又較佳為3,000~30,000。聚有機矽氧烷(2)之質量平均分子量只要在上述範圍內,未有因組成物之顯著高黏度化而造成作業上之問題,且硬化後之機械性強度亦為良好。 The mass average molecular weight of the polyorganosiloxane (A2) as measured by gel permeation chromatography is preferably in the range of 1,000 to 100,000, and more preferably 3,000 to 30,000. When the mass average molecular weight of the polyorganosiloxane (2) is within the above range, there is no problem in work due to remarkably high viscosity of the composition, and the mechanical strength after hardening is also good.
尚,聚有機矽氧烷(A2),只要矽氧烷單位 之組成在上述範圍內,則不限其性狀,可為在常溫(25℃)下為固體狀,亦可為黏度較高的例如200Pa‧s以上之液狀。 Still, polyorganosiloxane (A2), as long as the oxirane unit The composition is not limited to the properties in the above range, and may be a solid at normal temperature (25 ° C) or a liquid having a high viscosity of, for example, 200 Pa ‧ s or more.
聚有機矽氧烷(A2)所含有之各矽氧烷單位中的R2,在各單位為獨立表示取代或非取代的1價之烴基、或烯基;進而在同一單位內具有複數個R2時,在單位內為獨立表示取代或非取代的1價之烴基、或烯基。作為R2,具體而言可列舉與上述聚有機矽氧烷(A1)中的R1所表示之取代或非取代的1價之烴基、或烯基為相同之基。又,關於R2的較佳樣態,亦可列舉與R1所表示為相同之基。 R 2 in each of the oxoxane units contained in the polyorganosiloxane (A2) is a monovalent hydrocarbon group or an alkenyl group which is independently substituted or unsubstituted in each unit; and further has a plurality of R in the same unit. At 2 o'clock, a substituted or unsubstituted monovalent hydrocarbon group or alkenyl group is independently represented in the unit. Specific examples of R 2 include the substituted or unsubstituted monovalent hydrocarbon group or alkenyl group represented by R 1 in the above polyorganosiloxane (A1). And, R 2 is preferably about like state, and may also be represented by R 1 include the same as the group.
聚有機矽氧烷(A2),係1分子中具有至少1個鍵結於矽原子之烯基。聚有機矽氧烷(A2),較佳為1分子中具有2個以上鍵結於矽原子之烯基。又,聚有機矽氧烷(A2)中的該烯基之含有數較佳為50個以下。聚有機矽氧烷(2)之1分子中具有1個以上之烯基,亦可為上述M~T單位中任一之單位。 The polyorganosiloxane (A2) has at least one alkenyl group bonded to a ruthenium atom in one molecule. The polyorganosiloxane (A2) preferably has two or more alkenyl groups bonded to a ruthenium atom in one molecule. Further, the number of the alkenyl groups in the polyorganosiloxane (A2) is preferably 50 or less. The polyorganosiloxane (2) has one or more alkenyl groups in one molecule, and may be any of the above M to T units.
本發明之實施形態之加成硬化型聚矽氧組成物中,若使用支鏈狀‧網目狀構造之聚有機矽氧烷來作為(A)成分時,可使用1種、或可併用2種以上。又,關於聚有機矽氧烷(A2),亦可使用1種、或可併用2種以上。 In the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention, when a polyorganosiloxane having a branched ‧ mesh structure is used as the component (A), one type or two types may be used in combination. the above. Further, the polyorganosiloxane (A2) may be used alone or in combination of two or more.
本發明之實施形態之加成硬化型聚矽氧組成物中,(A)成分係成為基質聚合物之含有烯基之聚有機 矽氧烷。作為(A)成分若組合直鏈狀之聚有機矽氧烷與支鏈狀‧網目狀構造之聚有機矽氧烷來使用時,因應用途其比例係可任意地設定。 In the addition-hardening polyfluorene composition of the embodiment of the present invention, the component (A) is an alkenyl group-containing polyorganism of a matrix polymer. Oxane. When a linear polyorganosiloxane is used as the component (A) and a polyorganosiloxane having a branched ‧ mesh structure is used, the ratio can be arbitrarily set depending on the application.
例如,使用含有組合聚有機矽氧烷(A1)與聚有機矽氧烷(A2)之加成硬化型聚矽氧組成物於光學半導體元件用構件時,對於聚有機矽氧烷(A1)與聚有機矽氧烷(A2)之合計量100質量份而言,聚有機矽氧烷(A2)之比例較佳為5~60質量份,又較佳為10~30質量份。若聚有機矽氧烷(A1)與聚有機矽氧烷(A2)之含有量之比例為上述範圍內時,於上述用途中,將可賦予硬化物最適當的硬度與充分機械性強度。 For example, when a member comprising an addition-type polyorganosiloxane (A1) and a polyorganosiloxane (A2) is added to a member for an optical semiconductor element, the polyorganosiloxane (A1) is used. The proportion of the polyorganosiloxane (A2) is preferably from 5 to 60 parts by mass, more preferably from 10 to 30 parts by mass, per 100 parts by mass of the polyorganosiloxane (A2). When the ratio of the content of the polyorganosiloxane (A1) to the polyorganosiloxane (A2) is within the above range, the most suitable hardness and sufficient mechanical strength of the cured product can be imparted to the above application.
(B)成分之1分子中具有至少2個鍵結於矽原子之氫原子之聚有機氫矽氧烷,係作為與上述(A)成分反應之交聯成分來作用。對於(B)成分之分子構造並無特別限制,可使用例如直鏈狀、支鏈狀、環狀及網目狀之任意構造、或組合該等構造之各種的聚有機氫矽氧烷。 The polyorganohydroquinone having at least two hydrogen atoms bonded to a halogen atom in one molecule of the component (B) acts as a crosslinking component which reacts with the component (A). The molecular structure of the component (B) is not particularly limited, and any of a structure such as a linear chain, a branched chain, a ring, and a mesh may be used, or a polyorganohydrohalosiloxane having various structures may be used.
(B)成分之聚有機氫矽氧烷,係1分子中具有2個以上,較佳為3個以上「鍵結於矽原子之氫原子」(即,氫化矽烷基(Si-H基))。若(B)成分之聚有機氫矽氧烷為直鏈狀時,此等之Si-H基可僅位於分子鏈之末端及中間部分中之任一者、或可位於該兩者。尚,於此所謂Si-H基的個數,係聚有機氫矽氧烷中的每1分子之 平均個數。 The polyorganohydroquinone of the component (B) has two or more, preferably three or more "hydrogen atoms bonded to a halogen atom" in one molecule (that is, a hydrogenated alkylene group (Si-H group)). . When the polyorganohydrohalosiloxane of the component (B) is linear, these Si-H groups may be located only at either the end and the intermediate portion of the molecular chain, or may be located therebetween. Further, the number of Si-H groups in this is one molecule per molecule of polyorganohydroquinone. The average number.
(B)成分之1分子中的矽原子之平均數(平均聚合度)較佳為2~1,000,又較佳為3~100。(B)成分之黏度(25℃)較佳為500mPa‧s以下,特別是以10~100mPa‧s的範圍為較佳。若(B)成分之黏度在該範圍內時,不但所得之組成物之作業性為良好,另外由該組成物所得之聚矽氧硬化物之物理特性亦為良好。 The average number of ruthenium atoms (average degree of polymerization) in one molecule of the component (B) is preferably from 2 to 1,000, and more preferably from 3 to 100. The viscosity (25 ° C) of the component (B) is preferably 500 mPa ‧ or less, particularly preferably in the range of 10 to 100 mPa ‧ s. When the viscosity of the component (B) is within this range, not only the workability of the obtained composition is good, but also the physical properties of the polycarbonate cured product obtained from the composition are good.
如此般之(B)成分之聚有機氫矽氧烷,作為分子內所具有之Si-H基之量較佳為0.3~15mmol/g,又較佳為1~10mmol/g。 The polyorganohydrohalosiloxane of the component (B) is preferably used in an amount of from 0.3 to 15 mmol/g, more preferably from 1 to 10 mmol/g, as the Si-H group in the molecule.
作為(B)成分,係可使用例如以下述平均組成式(4)所表示之聚有機氫矽氧烷。 As the component (B), for example, a polyorganohydrohalosiloxane represented by the following average composition formula (4) can be used.
R4 pHqSiO(4-p-q)/2…(4) R 4 p H q SiO (4-pq)/2 (4)
(式(4)中,R4為不具有脂肪族不飽和基之非取代或取代的1價之烴基;p及q為滿足0.7≦p≦2.1、0.001≦q≦1.0、(p+q)≦3.0之正數)。 (In the formula (4), R 4 is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturation; p and q satisfy 0.7≦p≦2.1, 0.001≦q≦1.0, (p+q) ≦3.0 is a positive number).
作為上述R4例如:甲基、乙基、丙基、異丙基、丁基、異丁基、t-丁基、戊基、新戊基、己基、環己基、辛基、壬基、癸基等之烷基;苯基、甲苯基、二甲苯基、萘基等之芳基;苄基、苯乙基、苯丙基等之芳烷基;以鹵原子來取代此等烴基中的氫原子之一部分或全部之基,可列舉例如:氯甲基、3-氯丙基、溴乙基、3,3,3-三氟丙基等。R4較佳為烷基或芳基,又較佳為甲基或苯基,特佳為甲基。 As the above R 4 , for example, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, decyl, fluorene An alkyl group such as a phenyl group, a tolyl group, a xylyl group or a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group or a phenylpropyl group; and a hydrogen atom in the hydrogen group; Examples of a part or all of the atom include a chloromethyl group, a 3-chloropropyl group, a bromoethyl group, a 3,3,3-trifluoropropyl group and the like. R 4 is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group, and particularly preferably a methyl group.
作為(B)成分之具體例,可列舉如:分子鏈兩末端被三甲基矽氧烷基封端的甲基氫聚矽氧烷、分子鏈兩末端被三甲基矽氧烷基封端的二甲基矽氧烷‧甲基氫矽氧烷共聚物、分子鏈兩末端被三甲基矽氧烷基封端的二甲基矽氧烷‧甲基氫矽氧烷‧二苯基矽氧烷共聚物、分子鏈兩末端被二甲基含氫矽氧烷封端的二甲基聚矽氧烷、分子鏈兩末端被二甲基含氫矽氧烷封端的二甲基聚矽氧烷‧甲基氫矽氧烷共聚物、分子鏈兩末端被二甲基含氫矽氧烷封端的二甲基矽氧烷‧二苯基矽氧烷共聚物、分子鏈兩末端被二甲基含氫矽氧烷基封端的二苯基聚矽氧烷、由R4 3SiO1/2(R4如同上述般,以下的R4亦為相同)單位、R4 2HSiO1/2單位、與SiO4/2單位所組成的聚有機矽氧烷共聚物、由R4 2HSiO1/2單位、與SiO4/2單位所組成的聚有機矽氧烷共聚物、由R4HSiO2/2單位、與R4SiO3/2單位或HSiO3/2單位所組成的聚有機矽氧烷共聚物等之聚有機氫矽氧烷。可單獨使用此等之1種,或組合2種以上來使用。 Specific examples of the component (B) include methyl hydropolysiloxanes in which both ends of the molecular chain are blocked by a trimethylphosphonyl group, and two ends of the molecular chain terminated by a trimethylphosphonyl group. Methyl decane ‧ methylhydroquinoxane copolymer, dimethyl oxoxane ‧ methylhydroquinone ‧ diphenyl fluorene copolymer copolymerized at both ends of the molecular chain by trimethyl decyloxyalkyl a dimethylpolyoxane terminated by a dimethylhydrogen oxane at both ends of the molecule and the molecular chain, and a dimethylpolyoxane ‧methyl group terminated at the two ends of the molecular chain by a dimethylhydrogen oxane a hydroquinone copolymer, a dimethyl oxane ‧ diphenyl decane copolymer terminated at both ends of the molecular chain by a dimethyl hydroxy siloxane, and a dimethyl hydrogen-containing oxime at both ends of the molecular chain Alkyl-terminated diphenyl polyoxane, a unit of R 4 3 SiO 1/2 (R 4 is as described above, the same R 4 is also the same), R 4 2 HSiO 1/2 unit, and SiO 4/ a polyorganosiloxane copolymer composed of 2 units, a polyorganosiloxane copolymer composed of R 4 2 HSiO 1/2 units and SiO 4/2 units, and a unit of R 4 HSiO 2/2 R 4 SiO 3/2 units Silicon alumoxane polyorganosiloxane copolymer consisting of HSiO 3/2 units polyorganohydrogen silicon oxide. These may be used alone or in combination of two or more.
作為(B)成分,上述聚有機氫矽氧烷之中,特別以聚甲基氫矽氧烷(其係作為鍵結於矽原子之有機基為僅具有甲基者)為較佳,具體而言,上述平均組成式(4)的R4之全部為甲基之聚甲基氫矽氧烷。 As the component (B), among the above polyorganohydroquinones, polymethylhydroquinone (especially, the organic group bonded to the ruthenium atom has only a methyl group) is preferable, and specifically words, R in the average composition formula (4) all 4 of the polymethyl hydrogen methyl silicon oxide.
本發明之實施形態之加成硬化型聚矽氧組成物中,(B)成分之聚有機氫矽氧烷之含有量,對於(A)成分所具有之烯基(例如乙烯基)之合計量1莫耳 而言,使(B)成分所具有的Si-H基成為0.9~3.0莫耳之量。該(B)成分之含有量,係對於上述(A)成分之(B)成分之硬化有效量,且對於(A)成分所具有之烯基之合計量1莫耳而言,(B)成分之Si-H基之量較佳為1.0~2.8莫耳,又較佳為1.1~2.5莫耳。藉由以上述含有量來含有(B)成分,本發明之實施形態之加成硬化型聚矽氧組成物之硬化反應為充分進行之同時,由於在聚矽氧硬化物中亦未殘留有大量的未反應的Si-H基,故所得之聚矽氧硬化物之物性幾乎未有經時性變化。 In the addition-curable polyfluorene oxide composition according to the embodiment of the present invention, the content of the polyorganohydrohalosiloxane of the component (B) and the total amount of the alkenyl group (for example, vinyl) of the component (A) 1 mole The Si-H group of the component (B) is in an amount of 0.9 to 3.0 moles. The content of the component (B) is an effective amount of the component (B) of the component (A), and the total amount of the alkenyl group of the component (A) is 1 mol, and the component (B) The amount of Si-H groups is preferably from 1.0 to 2.8 moles, and more preferably from 1.1 to 2.5 moles. When the component (B) is contained in the above-mentioned content, the hardening reaction of the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention is sufficiently performed, and a large amount remains in the polyoxysulfide cured product. Since the unreacted Si-H group is present, the physical properties of the obtained polyoxysulfuric cured product hardly change with time.
(C)成分之氫化矽烷化反應觸媒,係促進(A)成分中所含之烯基與(B)成分中之Si-H基之加成反應(氫化矽烷化反應)之觸媒。作為(C)成分可列舉如:鉑系觸媒、鈀系觸媒、銠系觸媒等,但就經濟性之點而言較佳為鉑系觸媒。作為鉑系觸媒,係可使用例如:氯鉑酸、醇變性氯鉑酸、氯鉑酸與烯烴類、乙烯基矽氧烷或乙炔化合物之配位化合物等。此等係可使用單獨1種,亦可組合2種以上。 The hydrogenation sulfonation reaction catalyst of the component (C) is a catalyst for promoting an addition reaction (hydrogenation reaction) of an alkenyl group contained in the component (A) and a Si-H group in the component (B). Examples of the component (C) include a platinum-based catalyst, a palladium-based catalyst, and a ruthenium-based catalyst. However, a platinum-based catalyst is preferred from the viewpoint of economy. As the platinum-based catalyst, for example, chloroplatinic acid, alcohol-modified chloroplatinic acid, chloroplatinic acid and an olefin, a coordination compound of a vinyl siloxane or an acetylene compound, or the like can be used. These may be used alone or in combination of two or more.
(C)成分之含有量,作為氫化矽烷化反應之觸媒,只要是有效量即可,並無特別限定,例如對於(A)成分及(B)成分之合計量(質量),可設為換算成鉑原子為0.1~100ppm,又較佳為1~20ppm,更佳為1~10ppm之範圍。若含有量在該範圍內時,可充分地促進 加成反應,其結果可得到充分硬化,且經濟上為有利。 The content of the component (C) is not particularly limited as long as it is an effective amount as a catalyst for the hydrogenation reaction, and for example, the total amount (mass) of the component (A) and the component (B) can be set. The conversion to platinum atom is 0.1 to 100 ppm, preferably 1 to 20 ppm, more preferably 1 to 10 ppm. If the content is within this range, it can be fully promoted The addition reaction results in sufficient hardening and is economically advantageous.
本發明之實施形態之加成硬化型聚矽氧組成物中,藉由將指定量之上述(A)成分及(B)成分之聚有機矽氧烷、與觸媒量之(C)氫化矽烷化反應觸媒組合使用,可得到作為硬化物之透明性為高的聚矽氧硬化物。 In the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention, a predetermined amount of the (A) component and the (B) component polyorganosiloxane and the catalyst amount (C) hydrogenated decane are used. When the catalytic reaction catalyst is used in combination, a polyfluorene cured product having high transparency as a cured product can be obtained.
本發明之實施形態之加成硬化型聚矽氧組成物,作為(D)黏著性賦予劑係含有選自下述(D1)及(D2)之至少1種,(D1)具有選自環氧基及烷氧基矽烷基之至少1種、與選自氫化矽烷基及交聯性乙烯基之至少1種之異三聚氰酸衍生物;(D2)具有選自環氧基及烷氧基之至少1種,但不具有異三聚氰酸環之矽烷或矽氧烷化合物。 The addition-curable polyfluorene-oxygen composition of the embodiment of the present invention contains at least one selected from the group consisting of the following (D1) and (D2), and (D1) having an epoxy group selected from the group consisting of the following (D) and (D2). At least one of a group and an alkoxyalkyl group, and at least one isocyanuric acid derivative selected from the group consisting of a hydrogenated alkyl group and a crosslinkable vinyl group; (D2) having an epoxy group and an alkoxy group selected from the group consisting of At least one of them, but does not have a decane or a decane compound of an isocyanocyanate ring.
對於上述(A)成分100質量份,加成硬化型聚矽氧組成物中的(D)黏著性賦予劑之含有量為0.01~10質量份,較佳為1~5質量份。上述構成之(D)黏著性賦予劑,特別是所得之聚矽氧硬化物之對於塑膠,具體而言為對於PPA(聚鄰苯二甲醯胺樹脂)等之黏著性之提昇具有貢獻之功用。 The content of the (D) adhesiveness imparting agent in the addition-curable polyfluorene composition is 0.01 to 10 parts by mass, preferably 1 to 5 parts by mass, per 100 parts by mass of the component (A). In the above-mentioned (D) adhesiveness-imparting agent, in particular, the obtained polyoxysulfuric acid hardener contributes to the plastic, specifically, the adhesion of PPA (polyphthalamide) or the like. .
作為(D1)成分之具有選自環氧基及烷氧基矽烷基之至少1種、與選自氫化矽烷基及交聯性乙烯基之至少1種之異三聚氰酸衍生物,較佳以下述式(D11)所表示之化 合物。以下,將以式(D11)所表示之化合物亦稱為化合物(D11)。又,對於以其他式所表示之化合物亦為相同。 The at least one selected from the group consisting of an epoxy group and an alkoxyalkyl group as the component (D1) and at least one selected from the group consisting of a hydrogenated alkyl group and a crosslinkable vinyl group are preferably an isocyanuric acid derivative. Expressed by the following formula (D11) Compound. Hereinafter, the compound represented by the formula (D11) is also referred to as a compound (D11). Further, the compounds represented by other formulae are also the same.
式(D11)中,Y1~Y3分別獨立為乙烯基、甲基丙烯醯氧基、丙烯醯氧基、以下述式(T1)所表示之基、烷氧基矽烷基、或環氧基;Y1~Y3的1或2為乙烯基、甲基丙烯醯氧基、丙烯醯氧基或以下述式(T1)所表示之基,剩餘為烷氧基矽烷基或環氧基。 In the formula (D11), Y 1 to Y 3 are each independently a vinyl group, a methacryloxy group, an acryloxy group, a group represented by the following formula (T1), an alkoxyalkyl group, or an epoxy group. 1 or 2 of Y 1 to Y 3 is a vinyl group, a methacryloxy group, an acryloxy group or a group represented by the following formula (T1), and the remainder is an alkoxyalkyl group or an epoxy group.
烷氧基矽烷基可任意為:烷氧基1個與1價之烴基2個鍵結於矽原子而成的烷氧基二烷基矽烷基;烷氧基2個與1價之烴基1個鍵結於矽原子而成的二烷氧基烷基矽烷基;烷氧基3個鍵結於矽原子而成的三烷氧基矽烷基。以二烷氧基烷基矽烷基、三烷氧基矽烷基為較佳。 The alkoxyalkylene group may be any of alkoxydialkylalkyl groups in which one alkoxy group and one monovalent hydrocarbon group are bonded to a halogen atom; one alkoxy group and one monovalent hydrocarbon group; a dialkoxyalkyl fluorenyl group bonded to a ruthenium atom; and a dialkoxy fluorenyl group in which three alkoxy groups are bonded to a ruthenium atom. A dialkoxyalkyl fluorenyl group or a trialkoxy fluorenyl group is preferred.
作為烷氧基矽烷基所具有之烷氧基,可列舉亦可具有碳數1~4的支鏈構造之烷氧基,以甲氧基、乙氧基、丙氧基為較佳,甲氧基、乙氧基為特佳。作為烴基,可列舉可具有碳數1~4的支鏈構造之烴基,以甲基、乙 基、丙基為較佳,甲基、乙基為特佳。 The alkoxy group of the alkoxyalkylene group may, for example, be an alkoxy group having a branched structure having a carbon number of 1 to 4, preferably a methoxy group, an ethoxy group or a propoxy group, and a methoxy group. The base and ethoxy group are particularly preferred. Examples of the hydrocarbon group include a hydrocarbon group which may have a branched structure of 1 to 4 carbon atoms, and a methyl group and a The base and the propyl group are preferred, and the methyl group and the ethyl group are particularly preferred.
作為烷氧基矽烷基,具體而言,可列舉如:二甲氧基甲基矽烷基、二乙氧基甲基矽烷基、三甲氧基矽烷基、三乙氧基矽烷基等。 Specific examples of the alkoxyalkyl group include a dimethoxymethyl fluorenyl group, a diethoxymethyl fluorenyl group, a trimethoxy decyl group, and a triethoxy fluorenyl group.
Q1~Q3係分別獨立於碳-碳原子間可具有以下述式(L1)所表示之連結基及醚性氧原子之碳數1~7之2價之烴基。尚,若Q1~Q3具有下述式(L1)之連結基時,前述碳數係不包含連結基的碳數之數。 Each of Q 1 to Q 3 is a hydrocarbon group having a valence of 1 to 7 carbon atoms of a linking group represented by the following formula (L1) and an etheric oxygen atom, independently of a carbon-carbon atom. When Q 1 to Q 3 have a linking group of the following formula (L1), the carbon number does not include the number of carbon atoms of the linking group.
式(T1)中,s為1~10,以1~4為較佳。式(L1)中,t為1~10,以1~4為較佳。 In the formula (T1), s is 1 to 10, and preferably 1 to 4. In the formula (L1), t is 1 to 10, and preferably 1 to 4.
作為(D11)中的-Q1-Y1、-Q2-Y2、-Q3-Y3,較佳分別獨立為以下所表示之基之任一者。 It is preferable that -Q 1 -Y 1 , -Q 2 -Y 2 and -Q 3 -Y 3 in (D11) are each independently a group represented by the following.
-(CH2)n1-乙烯基(但是,n1為1~4之整數,較佳為1) -(CH 2 ) n1 -vinyl group (however, n1 is an integer of 1 to 4, preferably 1)
-(CH2)n2-環氧基(但是,n2為1~4之整數,較佳為1) -(CH 2 ) n2 - epoxy group (however, n2 is an integer of 1 to 4, preferably 1)
-(CH2)n3-烷氧基矽烷基(但是,n3為1~5之整數,較佳為3) -(CH 2 ) n3 -alkoxyalkylene (however, n3 is an integer of 1 to 5, preferably 3)
-(CH2)n4-(T1)(但是,n4為1~5之整數,較佳為3) -(CH 2 ) n4 -(T1) (however, n4 is an integer of 1 to 5, preferably 3)
-(CH2)n5-(L1)-(CH2)n6-環氧丙氧基(但是,n5、n6為1~5之整數,較佳為3) -(CH 2 ) n5 -(L1)-(CH 2 ) n6 -epoxypropoxy (however, n5 and n6 are integers of 1 to 5, preferably 3)
-(CH2)n7-(L1)-(CH2)n8-烷氧基矽烷基(但是,n7、n8為1~5之整數,n7較佳為3,n8較佳為2) -(CH 2 ) n7 -(L1)-(CH 2 ) n8 -alkoxyalkylene (however, n7, n8 are integers from 1 to 5, n7 is preferably 3, and n8 is preferably 2)
作為以(D11)所表示之化合物,更具體而言,可列舉以下述式(D11-1)~(D11-7)所分別表示之化合物。 Specific examples of the compound represented by the formula (D11) include compounds represented by the following formulas (D11-1) to (D11-7).
(D1)成分係可單獨使用1種、亦可併用2種以上。例如化合物(D11)中,以化合物(D11-1)與化合物(D11-2)、化合物(D11-4)與化合物(D11-5)、化合物(D11-6)與化合物(D11-7)之組合為較佳,以分別莫耳比1:1的混合物為特佳。 The component (D1) may be used alone or in combination of two or more. For example, in the compound (D11), the compound (D11-1) and the compound (D11-2), the compound (D11-4) and the compound (D11-5), the compound (D11-6) and the compound (D11-7) are used. Combinations are preferred, with mixtures of molar ratios of 1:1 being particularly preferred.
作為具有選自環氧基及烷氧基之至少1種,但不具有 異三聚氰酸環之矽烷或矽氧烷化合物之(D2)成分,較佳為選自以下述式(D21)所表示之化合物、以式(D22)所表示之化合物、以式(D23)所表示之化合物之至少1種。 As having at least one selected from the group consisting of an epoxy group and an alkoxy group, but having no The component (D2) of the isodecane cyanide or a decane compound is preferably a compound selected from the group consisting of the following formula (D21), a compound represented by the formula (D22), and a formula (D23). At least one of the compounds indicated.
式(D21)中及式(D22)中,Y4、Y5、Y6分別獨立表示環氧基、包含環氧基之環狀烷基、或烷氧基矽烷基;Q4、Q5、Q6分別獨立表示於碳-碳原子間可具有醚性氧原子、酯鍵結之碳數1~10之2價之烴基;u表示為3~5;x1、x2分別獨立表示1~10;R10分別獨立表示可以氫原子、或氯原子所取代之碳數1~5之烷基。但是,式(D21)中及式(D22)中,若存在Si-H基時,R10係烯基以外的基。 In the formula (D21), in the formula (D22), Y 4 , Y 5 and Y 6 each independently represent an epoxy group, a cyclic alkyl group containing an epoxy group, or an alkoxyalkyl group; Q 4 , Q 5 , Q 6 independently represents a hydrocarbon group having an etheric oxygen atom and an ester-bonded carbon number of 1 to 10 between carbon-carbon atoms; u is represented by 3 to 5; x1 and x2 are independently represented by 1 to 10; R 10 each independently represents an alkyl group having 1 to 5 carbon atoms which may be substituted by a hydrogen atom or a chlorine atom. However, in the formula (D21), when the Si-H group is present in the formula (D22), R 10 is a group other than the alkenyl group.
(Y7-Q7-)v-SiR11 wX(4-v-w) (D23) (Y 7 -Q 7 -) v -SiR 11 w X (4-vw) (D23)
式(D23)中,Y7表示為環氧基或包含環氧基之環狀烷基;Q7表示為於碳-碳原子間可具有醚性氧原子之碳數1~10之2價之烴基;v為1或2;w為0或1。X表示選 自烷氧基及氯原子之水解性基;R11表示為可以氯原子所取代之碳數1~4之烷基;若X及(Y7-Q7-)為複數存在時,此等可相同亦可不同。 In the formula (D23), Y 7 represents an epoxy group or a cyclic alkyl group containing an epoxy group; and Q 7 represents a carbon number of 1 to 10 which may have an etheric oxygen atom between carbon-carbon atoms. Hydrocarbyl; v is 1 or 2; w is 0 or 1. X represents a hydrolyzable group selected from an alkoxy group and a chlorine atom; R 11 represents an alkyl group having 1 to 4 carbon atoms which may be substituted by a chlorine atom; and if X and (Y 7 -Q 7 -) are plural, These may or may not be the same.
上述式(D21)~(D23)中,作為Y4~Y7所表示之包含環氧基之環狀烷基,具體而言,可列舉3,4-環氧環己基等。式(D21)、(D22)中,作為Y4~Y6所表示之烷氧基矽烷基及(D23)中若X為烷氧基時之-SiR11 wX(4-v-w),係可列舉與當上述(D11)中的Y1~Y3為烷氧基矽烷基時所示例之烷氧基矽烷基為相同之基。 In the above formula (D21) to (D23), examples of the cyclic alkyl group containing an epoxy group represented by Y 4 to Y 7 include a 3,4-epoxycyclohexyl group. In the formulae (D21) and (D22), as alkoxyalkylene group represented by Y 4 to Y 6 and -SiR 11 w X (4-vw) in the case where X is an alkoxy group in (D23), The alkoxyalkylene group exemplified when the Y 1 to Y 3 in the above (D11) is an alkoxyalkyl group is the same.
作為(D21)、(D22)中的-Q4-Y4、-Q5-Y5、-Q6-Y6,較佳分別獨立為以下之(i)~(iv)所表示之基之任一者。 Preferably, -Q 4 -Y 4 , -Q 5 -Y 5 , and -Q 6 -Y 6 in (D21) and (D22) are each independently represented by the following (i) to (iv). Either.
(i)-(CH2CHCH3-C(=O)-O-)n11-(CH2)n12-烷氧基矽烷基(但是,n11為1或0;n12為1~5之整數;較佳為2或3) (i)-(CH 2 CHCH 3 -C(=O)-O-) n11 -(CH 2 ) n12 -alkoxyalkylene (however, n11 is 1 or 0; n12 is an integer from 1 to 5; Good for 2 or 3)
(ii)-(CH2)n13-環氧基(但是,n13為1~5之整數,較佳為3) (ii) -(CH 2 ) n13 - epoxy group (however, n13 is an integer of 1 to 5, preferably 3)
(iii)-(CH2)n14-環氧丙氧基(但是,n14為1~5之整數,較佳為3) (iii) -(CH 2 ) n14 -epoxypropoxy (however, n14 is an integer of 1 to 5, preferably 3)
(iv)-(CH2)n15-(3,4-環氧環己基)(但是,n15為1~5之整數,較佳為2) (iv) -(CH 2 ) n15 -(3,4-epoxycyclohexyl) (however, n15 is an integer of 1 to 5, preferably 2)
作為以式(D21)所表示之化合物,具體而言,可列舉以下述式(D21-1)所表示之化合物。 Specific examples of the compound represented by the formula (D21) include compounds represented by the following formula (D21-1).
又,作為以上述式(D23)所表示之化合物,具體而言,可列舉以下述式(D23-1)所表示之化合物。 In addition, specific examples of the compound represented by the above formula (D23) include compounds represented by the following formula (D23-1).
(D2)成分係可單獨使用1種、或可併用2種以上。就維持高黏著性與優異的外觀之觀點而言,以組合化合物(D21)之至少1種與化合物(D23)之至少1種為較佳。 The component (D2) may be used alone or in combination of two or more. From the viewpoint of maintaining high adhesion and excellent appearance, at least one of the compound (D21) and at least one compound (D23) are preferred.
本發明之實施形態之加成硬化型聚矽氧組成物中,(D)黏著性賦予劑係可使用1種、或可併用2種以上。較佳之組合為上述(D1)異三聚氰酸衍生物之至少1種、與上述(D2)矽烷或矽氧烷化合物之至少1種之組合。上述(D1)異三聚氰酸衍生物之至少1種、與上述(D2)矽烷或矽氧烷化合物之至少1種之含有比例,作為以(D1)/(D2)所表示之質量比,較佳為0.1~3.0,又較 佳為0.25~1.5。加成硬化型聚矽氧組成物為藉由以如此般的比例來含有(D1)成分與(D2)成分,對所得之聚矽氧硬化物而言為特別高的黏著性,例如除了黏著力之提昇外,亦可對應於多樣的被黏著物等,與可賦予優異的外觀。 In the addition-curable polyfluorene composition of the embodiment of the present invention, (D) the adhesion-imparting agent may be used alone or in combination of two or more. A preferred combination is at least one of the above (D1) isomeric cyanuric acid derivative and at least one of the above (D2) decane or a decane compound. The content ratio of at least one of the above (D1) isomeric cyanuric acid derivative and at least one of the above (D2) decane or a decane compound is a mass ratio represented by (D1)/(D2). Preferably 0.1 to 3.0, and Good is 0.25~1.5. The addition-hardening polyfluorene composition is characterized in that the (D1) component and the (D2) component are contained in such a ratio, and the obtained polyoxysulfide cured product has particularly high adhesiveness, for example, in addition to adhesion. In addition to the improvement, it can also correspond to various adhesives and the like, and can give an excellent appearance.
尚,作為上述(D)成分,若使用具有氫化矽烷基或交聯性乙烯基之化合物時,將所得之加成硬化型聚矽氧組成物整體之氫化矽烷基與烯基之比例(即,(A)成分、(B)成分、及(D)成分中的氫化矽烷基之總量、與烯基之總量之比例),例如對於烯基之1莫耳而言,較佳為將氫化矽烷基調整成為0.9~3.0莫耳之量。該比例係較佳為1.0~2.8莫耳,又較佳為1.1~2.5莫耳。 When the compound having a hydrogenated alkylene group or a crosslinkable vinyl group is used as the component (D), the ratio of the hydrogenated decyl group to the alkenyl group of the entire addition-hardening polyfluorene-oxygen composition is obtained (that is, The (A) component, the component (B), and the ratio of the total amount of the alkylene group in the component (D) to the total amount of the alkenyl group), for example, 1 mol of the alkenyl group, preferably hydrogenated The decyl group is adjusted to be 0.9 to 3.0 moles. The ratio is preferably from 1.0 to 2.8 moles, and more preferably from 1.1 to 2.5 moles.
(E)成分為以下述一般式(3)所表示之有機自由基。化合物(3),係具有氮原子數1之5員或6員之含氮雜環骨架,該氮為與氧基自由基鍵結之構造之有機自由基,作為鍵結於與雜環之氮原子為對向之碳原子之原子或基,係具有至少1個電子吸引性之原子或基。 The component (E) is an organic radical represented by the following general formula (3). The compound (3) is a nitrogen-containing heterocyclic skeleton having a nitrogen atom number of 5 or 6 members, and the nitrogen is an organic radical bonded to an oxy radical as a nitrogen bonded to the heterocyclic ring. An atom or a group of atoms that are opposite carbon atoms, having at least one electron attracting atom or group.
式(3)中,R5分別獨立表示氫原子或碳數1~3之烴基;R6分別獨立表示氫原子、碳數1~3之烴基、羧基或羥基,或是以鍵結於相同碳原子之2個R6來表示=O,但是,R6之中至少1個為羧基或羥基,或式(3)具有至少1個以鍵結於相同碳原子之2個R6來表示=O。 In the formula (3), R 5 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms; and R 6 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 3 carbon atoms, a carboxyl group or a hydroxyl group, or is bonded to the same carbon. Two R 6 atoms represent =0, but at least one of R 6 is a carboxyl group or a hydroxyl group, or formula (3) has at least one R 6 bonded to the same carbon atom to represent =0. .
本發明之實施形態之加成硬化型聚矽氧組成物中,藉由含有(E)成分之有機自由基之化合物(3),可抑制起因於(D)成分之黏著性賦予劑造成的所得之聚矽氧硬化物之受熱之收縮或硬度之變化。 In the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention, the compound (3) containing the organic radical of the component (E) can suppress the result of the adhesion-imparting agent derived from the component (D). The shrinkage or hardness change of the polyoxygenated hardened material.
作為化合物(3),具體而言可舉例如下述式(31)所表示之5員之含氮雜環骨架之有機自由基、下述式(32)所表示之6員之含氮雜環骨架之有機自由基。式(31)及式(32)中的R5及R6,係與式(3)中的R5及R6為相同意思。 Specific examples of the compound (3) include an organic radical of a nitrogen-containing heterocyclic skeleton of five members represented by the following formula (31), and a nitrogen-containing heterocyclic skeleton of six members represented by the following formula (32). Organic free radicals. R 5 and R 6 in the formula (31) and the formula (32) have the same meanings as R 5 and R 6 in the formula (3).
式(31)、式(32)中的R5之原子或基,係鍵結於雜環之氮原子所相鄰之碳原子上,分別獨立為氫原子或碳數1~3之烴基。R5較佳分別獨立為碳數1~3之直鏈烴基,即,甲基、乙基、丙基;又較佳為碳數1或2之直鏈烷基,即,甲基、乙基。4個R5可為相同或相異。 The atom or group of R 5 in the formula (31) or the formula (32) is bonded to a carbon atom adjacent to the nitrogen atom of the hetero ring, and each independently represents a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms. R 5 is preferably independently a linear hydrocarbon group having 1 to 3 carbon atoms, that is, a methyl group, an ethyl group, a propyl group; and preferably a linear alkyl group having 1 or 2 carbon atoms, that is, a methyl group or an ethyl group. . The four R 5 's may be the same or different.
式(31)、式(32)中的R6之原子或基,係鍵結於與雜環之氮原子為對向之碳原子(具體而言,係氮原子所相鄰之碳原子以外之碳原子)上。R6分別獨立表示氫原子、碳數1~3之烴基、羧基或羥基,或是以鍵結於相同碳原子之2個R6來表示=O。式(3)的R6之中至少1個為羧基或羥基,或式(3)中具有至少1個以鍵結於相同碳原子之2個R6來表示=O。以下將羧基、羥基、=O總稱為取代基(I)。 The atom or group of R 6 in the formula (31) or the formula (32) is bonded to a carbon atom which is opposite to the nitrogen atom of the hetero ring (specifically, a carbon atom adjacent to the nitrogen atom) On the carbon atom). R 6 independently represents a hydrogen atom, a hydrocarbon group having 1 to 3 carbon atoms, a carboxyl group or a hydroxyl group, or 2 R 6 bonded to the same carbon atom to represent =0. At least one of R 6 of the formula (3) is a carboxyl group or a hydroxyl group, or at least one of the formulas (3) having two R 6 bonded to the same carbon atom represents =0. Hereinafter, a carboxyl group, a hydroxyl group, and =0 are collectively referred to as a substituent (I).
式(3)中的取代基(I)之數,較佳為1~3個,又較佳為1或2個,最佳為1個。又,式(32)中較佳為:對於1號位的氮原子而言,以在4號位的碳原子為具有取代基(I)。取代基(I)為電子吸引性之基或原子,藉由於與雜環之氮原子為對向之位置上具有取代基 (I),可抑制所得之聚矽氧硬化物之受熱之收縮或硬度之變化。 The number of the substituents (I) in the formula (3) is preferably from 1 to 3, more preferably from 1 or 2, most preferably one. Further, in the formula (32), it is preferred that the nitrogen atom at the 1 position has a substituent (I) at a carbon atom at the 4 position. The substituent (I) is an electron attracting group or atom, and has a substituent at a position opposite to the nitrogen atom of the hetero ring. (I), the change in shrinkage or hardness of the obtained polyoxysulfide cured product can be suppressed.
取代基(I)以外的R6為氫原子或碳數1~3之烴基。作為取代基(I)以外的R6,較佳為氫原子或碳數1~3之直鏈烷基,又較佳為氫原子。作為化合物(3),具體而言可舉例分類為化合物(31)之以下述式(31-1)所表示之化合物、分類為化合物(32)之以下述式(32-1)、(32-2)、或(32-3)所表示之化合物等。尚,式(31-1)、(32-1)~(32-3)中,當R6為氫原子時,省略「H」之記載。 R 6 other than the substituent (I) is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms. R 6 other than the substituent (I) is preferably a hydrogen atom or a linear alkyl group having 1 to 3 carbon atoms, and is preferably a hydrogen atom. Specific examples of the compound (3) which can be exemplified as the compound (31) represented by the following formula (31-1), and the compound (32) are classified into the following formulas (32-1) and (32-). 2), or a compound represented by (32-3). In the formulae (31-1) and (32-1) to (32-3), when R 6 is a hydrogen atom, the description of "H" is omitted.
可以周知方法來製造化合物(3)。又,本發明中,作為化合物(3)亦可使用市售品。本發明之實施形態之加成硬化型聚矽氧組成物中,(E)成分之化合物 (3)可使用單獨1種,亦可併用2種以上。實施形態之加成硬化型聚矽氧組成物中,對於(A)成分之100質量份而言,(E)成分之化合物(3)之含有量,係以成為0.001~0.05質量份之量,較佳為0.002~0.03質量份。對於(A)成分之(E)成分之含有量之比例若為上述範圍內時,所得之聚矽氧硬化物,可良好地保持外觀,同時可抑制起因於(D)成分造成的受熱之收縮及硬度之變化。又,藉此所得之聚矽氧硬化物,可充分地發揮藉由(D)成分之作用,而可保持優異的黏著性。 Compound (3) can be produced by a known method. Further, in the present invention, a commercially available product can also be used as the compound (3). In the addition-hardening polyfluorene composition of the embodiment of the present invention, the compound of the component (E) (3) One type may be used alone or two or more types may be used in combination. In the addition-hardening type polyoxo composition of the embodiment, the content of the compound (3) of the component (E) is 0.001 to 0.05 parts by mass based on 100 parts by mass of the component (A). It is preferably 0.002 to 0.03 parts by mass. When the ratio of the content of the component (E) of the component (A) is within the above range, the obtained polyoxysulfide cured product can maintain the appearance well and suppress the shrinkage of heat caused by the component (D). And changes in hardness. Further, the obtained polyoxysulfide cured product can sufficiently exhibit the action of the component (D) to maintain excellent adhesion.
本發明之實施形態之加成硬化型聚矽氧組成物,亦可含有(F)成分之矽石粉末來作為任意成分。(F)成分之矽石粉末係可為通常調配於聚矽氧硬化物中的周知種類。(F)成分係具有對交聯前之組成物提供適度的流動性、觸變性,且對交聯後所得之聚有機矽氧烷之交聯體,賦予因應該用途所要求之高的機械性強度之作用。特別是(A)成分為直鏈狀之聚有機矽氧烷,例如若僅以聚有機矽氧烷(A1)所構成時,以含有(F)成分之矽石粉末為較佳。 The addition-hardening polyfluorene composition of the embodiment of the present invention may contain the vermiculite powder of the component (F) as an optional component. The vermiculite powder of the component (F) may be a well-known type which is usually formulated in a polyoxyl cured product. The component (F) has a moderate fluidity and thixotropy to the composition before crosslinking, and a crosslinked body of a polyorganosiloxane obtained by crosslinking, imparting high mechanical properties required for the intended use. The role of strength. In particular, the component (A) is a linear polyorganosiloxane, and for example, when it is composed only of polyorganosiloxane (A1), a vermiculite powder containing the component (F) is preferred.
(F)成分之矽石粉末,為了發揮上述機能,依BET法之比表面積(以下稱為BET比表面積),以50m2/g以上者為較佳,50~600m2/g為又較佳,100~400m2/g為特佳。矽石之種類並無特別限定,但可適 合使用沈澱矽石、煙霧質矽石(熱解矽石)、燒成矽石等。就補強性、觸變性賦予之點,以煙霧質矽石為較佳。 In order to exhibit the above functions, the vermiculite powder of the component (F) preferably has a specific surface area (hereinafter referred to as BET specific surface area) of BET method of 50 m 2 /g or more, and preferably 50 to 600 m 2 /g. , 100~400m 2 /g is especially good. The type of the vermiculite is not particularly limited, but it may be suitable for use of precipitated vermiculite, smoky vermiculite (pyrolysis vermiculite), and calcined vermiculite. For the point of reinforcement and thixotropy, it is preferable to use a smoky vermiculite.
如此般的矽石粉末之表面上,存在多數的矽烷醇基(Si-OH基)。據此,若將該矽石粉末直接添加在組成物中時,則容易產生增黏、明顯的增塑復原等之問題。因此,以將矽石粉末之表面做疏水化處理為較佳。表面處理量係將矽石表面之碳量設為2.0質量%以上,又較佳為3.0質量%以上之量為宜。若未滿2.0質量%時,對組成物之增黏、可操作期之提昇效果較少。尚,碳量之上限並無特別限制,但一般為20質量%以下,較佳為12質量%以下,特別是8質量%以下。作為(F)成分之矽石粉末,可使用預先以粉體之狀態經表面處理者,亦可於混練製程中進行表面處理。 On the surface of such a vermiculite powder, a large number of stanol groups (Si-OH groups) exist. Accordingly, when the vermiculite powder is directly added to the composition, problems such as thickening and significant plastic recovery are likely to occur. Therefore, it is preferred to hydrophobize the surface of the vermiculite powder. The surface treatment amount is preferably such that the amount of carbon on the surface of the vermiculite is 2.0% by mass or more, and more preferably 3.0% by mass or more. If it is less than 2.0% by mass, the effect of increasing the viscosity and the operable period of the composition is less. In addition, the upper limit of the amount of carbon is not particularly limited, but is generally 20% by mass or less, preferably 12% by mass or less, and particularly preferably 8% by mass or less. The vermiculite powder as the component (F) may be subjected to surface treatment in the form of a powder in advance, or may be subjected to surface treatment in a kneading process.
作為矽石粉末之表面處理方法,係可採用一般所周知的表面處理技術。作為表面處理劑所使用的有機矽化合物方面,舉例如有機矽氮烷類、矽烷偶合劑、二甲基聚矽氧烷(包含環狀構造)、有機氫聚矽氧烷等,亦可為此等之部分水解反應物。 As the surface treatment method of the vermiculite powder, a generally known surface treatment technique can be employed. Examples of the organic ruthenium compound used as the surface treatment agent include an organic sulfonium alkane, a decane coupling agent, a dimethyl polyoxyalkylene (including a cyclic structure), an organic hydrogen polyoxyalkylene, and the like. Part of the hydrolysis of the reactants.
作為上述有機矽氮烷類,可列舉如:1,3-二乙烯基四甲基二矽氮烷、1,3-二甲基四乙烯基二矽氮烷、六甲基二矽氮烷等之六有機二矽氮烷;八甲基三矽氮烷、1,5-二乙烯基六甲基三矽氮烷等之八有機三矽氮烷等。 Examples of the organic sulfonium alkane include 1,3-divinyltetramethyldiazane, 1,3-dimethyltetravinyldiazide, hexamethyldioxane, and the like. Six organic diazane alkane; octamethyl triazane alkane; octahydrotriazane such as 1,5-divinylhexamethyltriazane or the like.
作為上述矽烷偶合劑,可列舉如:甲基三甲氧基矽烷、乙基三甲氧基矽烷、丙基三甲氧基矽烷、丁基 三甲氧基矽烷等之烷基三烷氧基矽烷、二甲基二甲氧基矽烷、二乙基二甲氧基矽烷、二甲基二乙氧基矽烷、二乙基二乙氧基矽烷等之二烷基二烷氧基矽烷;乙烯基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基參(甲氧基乙氧基)矽烷等之烯基三烷氧基矽烷、二乙烯基二甲氧基矽烷、二乙烯基二乙氧基矽烷等之二烯基二烷氧基矽烷;三甲基甲氧基矽烷、三乙基甲氧基矽烷等之三烷基烷氧基矽烷、三乙烯基甲氧基矽烷、三乙烯基乙氧基矽烷等之三烯基烷氧基矽烷;三甲基氯矽烷、二甲基二氯矽烷、甲基三氯矽烷、乙烯基三氯矽烷、二乙烯基二氯矽烷、三乙烯基氯矽烷等之有機氯矽烷;及氯丙基三甲氧基矽烷等。 Examples of the above decane coupling agent include methyltrimethoxydecane, ethyltrimethoxydecane, propyltrimethoxydecane, and butyl. An alkyltrialkoxy decane such as trimethoxy decane, dimethyl dimethoxy decane, diethyl dimethoxy decane, dimethyl diethoxy decane, diethyl diethoxy decane, etc. Dialkyl dialkoxy decane; vinyl triethoxy decane, vinyl trimethoxy decane, vinyl methoxy methoxy decane, etc. alkenyl trialkoxy decane, divinyl a dialkyl dialkoxy decane such as dimethoxy decane or divinyl diethoxy decane; a trialkyl alkoxy decane such as trimethyl methoxy decane or triethyl methoxy decane; a trialkenyl alkoxy decane such as trivinyl methoxy decane or trivinyl ethoxy decane; trimethyl chlorodecane, dimethyl dichloro decane, methyl trichloro decane, vinyl trichloro decane, An organochlorodecane such as divinyldichloromethane or trivinylchlorosilane; and chloropropyltrimethoxydecane.
尚,此等之中,較佳為鍵結於水解性基以外之矽原子之取代基為甲基之矽烷系偶合劑、環狀二甲基聚矽氧烷及有機矽氮烷類。 Further, among these, a substituent in which a substituent of a halogen atom other than a hydrolyzable group is a methyl group is a decane coupling agent, a cyclic dimethyl polysiloxane, and an organic decane.
作為(F)成分之矽石粉末係可使用市售品。作為市售品可列舉如:作為表面未處理之煙霧質矽石之aerosil 200(商品名,EVONIC製,BET比表面積:200m2/g)、aerosil 300(商品名,EVONIC製,BET比表面積:300m2/g)等。進而,本發明中以使用環狀二甲基聚矽氧烷之八甲基環四矽氧烷或六甲基二矽氮烷等將如此般的市售品做表面處理之矽石粉末為較佳。(F)成分係可使用1種、或併用2種以上。 A commercially available product can be used as the vermiculite powder of the component (F). As a commercial item, for example, aerosil 200 (trade name, manufactured by EVONIC, BET specific surface area: 200 m 2 /g), aerosil 300 (trade name, manufactured by EVONIC, BET specific surface area: 300m 2 /g) and so on. Further, in the present invention, a vermiculite powder obtained by subjecting such a commercially available product to a surface treatment using octamethylcyclotetraoxane or hexamethyldioxane such as a cyclic dimethyl polyoxyalkylene is used. good. The component (F) may be used alone or in combination of two or more.
本發明之組成物中的(F)成分之含有量,就可適當地控制組成物之黏度之點而言,對於(A)成分之 100質量份而言,以10質量份以下為較佳。如上述般,若(A)成分僅以聚有機矽氧烷(A1)所構成時,以含有(F)成分為較佳,該含有量對於(A)成分之100質量份而言,以0.1~10質量份為較佳,1~4質量份為又較佳。只要(F)成分之矽石粉末之含有量為上述範圍內時,組成物之黏度將成為適度且能良好地保持成形時之作業性,進而亦可充分地保持所得之聚矽氧硬化物之機械性強度或硬度等之特性。 The content of the component (F) in the composition of the present invention can be appropriately controlled for the viscosity of the composition, and for the component (A) In the case of 100 parts by mass, it is preferably 10 parts by mass or less. As described above, when the component (A) is composed only of polyorganosiloxane (A1), it is preferred to contain the component (F), and the content is 0.1 for 100 parts by mass of the component (A). It is preferably 10 parts by mass, and more preferably 1 to 4 parts by mass. When the content of the vermiculite powder of the component (F) is within the above range, the viscosity of the composition is moderate and the workability at the time of molding can be maintained satisfactorily, and the obtained polyoxysulfide cured product can be sufficiently retained. Characteristics such as mechanical strength or hardness.
本發明之實施形態之加成硬化型聚矽氧組成物,作為任意成分,亦可進行含有作為(G)成分之加成反應抑制劑。(G)成分之加成反應抑制劑不會使(C)成分之氫化矽烷化反應觸媒於保存中之觸媒活性降低,且具有抑制(A)成分之烯基與(B)成分之Si-H基之加成反應,並提高加成硬化型聚矽氧組成物之保存安定性之功用。 The addition-curable polyfluorene-oxygen composition of the embodiment of the present invention may contain an addition reaction inhibitor as the component (G) as an optional component. The addition reaction inhibitor of the component (G) does not reduce the catalytic activity of the hydrogenation sulfonation reaction catalyst of the component (C) during storage, and has an inhibitor of the alkenyl group of the component (A) and the component (B). The addition reaction of the -H group and the function of preserving stability of the addition-hardening polyfluorene composition.
作為(G)加成反應抑制劑,係可使用周知種類。可列舉例如:1-乙炔基環己烷-1-醇、3-甲基-1-丁炔-3-醇、3,5-二甲基-1-己炔-3-醇、3-甲基-1-戊烯-3-醇、苯基丁炔醇等之乙炔系醇;3-甲基-3-戊烯-1-烯、3,5-二甲基-1-己炔-3-烯等之乙炔系化合物;此等之乙炔系化合物與烷氧基矽烷、烷氧基矽氧烷、氫矽烷或氫矽氧烷之反應物;四甲基乙烯基矽氧烷環狀體等之乙烯基矽氧烷;苯并三唑等之有機氮化合物及其他的有機磷化合物;肟化合 物、有機鉻化合物、馬來酸二烯丙酯等。 As the (G) addition reaction inhibitor, a known type can be used. For example, 1-ethynylcyclohexane-1-ol, 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl Acetylene-based alcohol such as -1-penten-3-ol, phenylbutynol, etc.; 3-methyl-3-penten-1-ene, 3,5-dimethyl-1-hexyne-3 - an acetylene compound such as an alkene; a reaction product of such an acetylene compound with an alkoxy decane, an alkoxy decane, a hydrooxane or a hydroquinone; a tetramethylvinyl fluorene ring; Vinyl oxoxane; organic nitrogen compounds such as benzotriazole and other organophosphorus compounds; , organic chromium compounds, diallyl maleate, and the like.
(G)成分之加成反應抑制劑之含有量,只要是能得到加成硬化型聚矽氧組成物之安定性之量即可,無特別限定,但對於(A)成分100質量份而言,以0.001~0.1質量份為較佳,又較佳為0.01~0.05質量份。 The content of the addition reaction inhibitor of the component (G) is not particularly limited as long as it can provide the stability of the addition-curable polyfluorene composition, but it is 100 parts by mass of the component (A). It is preferably 0.001 to 0.1 parts by mass, more preferably 0.01 to 0.05 parts by mass.
本實施形態之加成硬化型聚矽氧組成物,就所得之聚矽氧硬化物可良好地保持外觀之同時可抑制受熱之收縮或硬度之變化,並以保持優異的黏著性之目的下,除了(E)成分以外,亦可進而含有作為(H)成分之以下述一般式(5)所表示之羧酸金屬鹽(以下亦稱為羧酸金屬鹽(5)):以金屬原子換算為0.001~0.015質量份。(H)成分之又較佳之含有量,對於(A)成分之100質量份而言,以金屬原子換算為0.002~0.010質量份。更,加成硬化型聚矽氧組成物藉由含有羧酸金屬鹽(5)來作為(H)成分,利用所得之聚矽氧硬化物來將金屬構件(例如銀電極等)被覆、密封等時,將可保護此等不受腐蝕。 The addition-curable polyfluorene-oxygen composition of the present embodiment can maintain the appearance while suppressing the change in shrinkage or hardness of heat, and maintaining excellent adhesion. In addition to the component (E), a metal carboxylate (hereinafter also referred to as a metal carboxylate (5)) represented by the following general formula (5) as the component (H) may be further contained: 0.001 to 0.015 parts by mass. The content of the component (H) is preferably 0.002 to 0.010 parts by mass in terms of metal atom, based on 100 parts by mass of the component (A). Further, the addition-hardening polyfluorene oxide composition contains the carboxylic acid metal salt (5) as the component (H), and the obtained polysulfide cured product is used to coat, seal, or the like a metal member (for example, a silver electrode). This will protect against such corrosion.
(R3COO)kM…(5) (R 3 COO) k M...(5)
(M表示選自Ce、Fe、Cr、La、Nd、Pr、Sm之金屬原子;k表示2~4之正數;R3表示取代或非取代的碳數4~17之烴基)。 (M represents a metal atom selected from the group consisting of Ce, Fe, Cr, La, Nd, Pr, Sm; k represents a positive number of 2 to 4; and R 3 represents a substituted or unsubstituted hydrocarbon group having 4 to 17 carbon atoms).
一般式(5)中,M表示選自Ce、Fe、Cr、La、Nd、Pr、Sm之金屬原子。M係可選自上述Ce、Fe、Cr、La、Nd、Pr、Sm之1種來構成、亦可以2種以上之混合物來構成。作為混合物,具體而言,可列舉Ce、La、Nd、Pr、Sm之稀土類元素混合物,以鈰(Ce)作為主成分之混合物為較佳。尚,所謂以鈰作為主成分之混合物,係指對於混合物總量而言,使鈰之含有量超過50質量%之混合物。 In the general formula (5), M represents a metal atom selected from the group consisting of Ce, Fe, Cr, La, Nd, Pr, and Sm. The M system may be selected from one of the above-mentioned Ce, Fe, Cr, La, Nd, Pr, and Sm, or may be composed of a mixture of two or more kinds. Specific examples of the mixture include a mixture of rare earth elements of Ce, La, Nd, Pr, and Sm, and a mixture of cerium (Ce) as a main component is preferred. Further, the mixture containing ruthenium as a main component means a mixture in which the content of ruthenium exceeds 50% by mass based on the total amount of the mixture.
作為使用於(H)成分之羧酸金屬鹽(5),較佳為式(5)中的M為單獨鈰(Ce)、單獨鐵(Fe)、或單獨鉻(Cr)之羧酸金屬鹽,特佳為單獨鈰之羧酸金屬鹽。k係依據所使用金屬之價數可作為2~4。 As the carboxylic acid metal salt (5) used in the component (H), it is preferred that M in the formula (5) is a carboxylic acid metal salt of cerium (Ce) alone, iron (Fe) alone or chromium (Cr) alone. Particularly preferred is a metal salt of a carboxylic acid which is a separate oxime. k is based on the price of the metal used, which can be 2~4.
R3係同種或不同種之取代或非取代的碳數4~17之一價烴基,且作為提供如此般的羧酸金屬鹽之羧酸,可示例如:2-乙基己酸、辛酸、癸酸、油酸、月桂酸、硬脂酸等。又,亦可為環烷酸等之羧酸混合物。 R 3 is a substituted or unsubstituted carbon number 4 to 17 one-valent hydrocarbon group of the same kind or different kinds, and as a carboxylic acid which provides such a metal salt of a carboxylic acid, for example, 2-ethylhexanoic acid, octanoic acid, Tannic acid, oleic acid, lauric acid, stearic acid, and the like. Further, it may be a mixture of carboxylic acids such as naphthenic acid.
作為羧酸金屬鹽(5),具體而言,可列舉如:辛酸鈰(III)、2-乙基己酸鈰(III)、2-乙基己酸鐵(II)、2-乙基己酸鐵(III)、2-乙基己酸鉻(III)、癸酸鈰(IV)、癸酸鈰(III)等,以辛酸鈰(III)、2-乙基己酸鈰(UI)為特佳。又,亦可較佳使用以鈰作為主成分之稀土類元素混合物之辛酸鹽、2-乙基己酸鹽。若使用以鈰作為主成分之稀土類元素混合物時,就經濟性之點為有利。該混合物中之鈰含有量越高(即,鈰純度越高),就 效果之點而言為較佳。 Specific examples of the metal carboxylate (5) include ruthenium (III) octoate, ruthenium (III) 2-ethylhexanoate, iron (II) 2-ethylhexanoate, and 2-ethylhexylate. Iron (III) acid, chromium (III) 2-ethylhexanoate, cerium (IV) citrate, cerium (III) citrate, etc., with cerium (III) octoate and cerium 2-ethylhexanoate (UI) Very good. Further, an octoate or 2-ethylhexanoate salt of a rare earth element mixture containing ruthenium as a main component can also be preferably used. When a mixture of rare earth elements containing cerium as a main component is used, it is advantageous in terms of economy. The higher the content of rhodium in the mixture (ie, the higher the purity of rhodium), It is preferred in terms of effects.
作為(H)成分亦可使用市售品。作為市售品,可列舉例如:rare earth-OCTOATE 6%(商品名,DIC公司製,2-乙基己酸稀土類元素鹽(稀土類元素含有量係6質量%,Ce:3.1質量%;Nd:0.95質量%;Pr:0.31質量%;Sm:0.01質量%;La:1.59質量%)、NIKKA OCTHIX Fe(商品名,日本化學產業公司製,2-乙基己酸鐵(III)(金屬含有量係Fe:6質量%))、8%鉻Hex-Cem(商品名,OMG Americas Inc公司製,2-乙基己酸鉻(III)(金屬含有量係Cr:8質量%))等。 Commercially available products can also be used as the component (H). For example, rare earth-OCTOATE 6% (trade name, DIC company, 2-ethylhexanoic acid rare earth element salt (rare earth element content: 6% by mass, Ce: 3.1% by mass; Nd: 0.95 mass%; Pr: 0.31 mass%; Sm: 0.01 mass%; La: 1.59 mass%), NIKKA OCTHIX Fe (trade name, manufactured by Nippon Chemical Industry Co., Ltd., iron (III) 2-ethylhexanoate (metal) Content: Fe: 6 mass%)), 8% chromium Hex-Cem (trade name, OMG Americas Inc., 2-ethylhexanoic acid chromium (III) (metal content: Cr: 8 mass%)), etc. .
尚,羧酸金屬鹽(5),例如辛酸鈰(III)、2-乙基己酸鈰(III)、2-乙基己酸稀土類元素鹽、2-乙基己酸鐵(II)、(III)、2-乙基己酸鉻(III)等,就其操作之容易度或與組成物中之其他成分之相溶性觀點而言,以作為有機溶劑溶液使用為佳。作為如此般的有機溶劑,可示例如:標準溶劑、礦油精、輕油、石油醚等之石油系溶劑、甲苯、二甲苯等之芳香族系溶劑。 Further, a metal carboxylate (5) such as cerium (III) octoate, cerium (III) 2-ethylhexanoate, a rare earth element salt of 2-ethylhexanoic acid, iron (II) 2-ethylhexanoate, (III), chromium (III) 2-ethylhexanoate or the like is preferably used as an organic solvent solution from the viewpoint of easiness of handling or compatibility with other components in the composition. As such an organic solvent, for example, a petroleum solvent such as a standard solvent, mineral spirits, gas oil or petroleum ether, or an aromatic solvent such as toluene or xylene may be mentioned.
本發明之實施形態之加成硬化型聚矽氧組成物,係以上述之含有量含有上述(A)~(E)之各成分來作為必須成分,且此等中因應所需以上述之含有量含有上述(F)成分、(G)成分、(H)成分來作為任意成分。 The addition-curable polyfluorene-oxygen composition of the embodiment of the present invention contains the components (A) to (E) as essential components in the above-mentioned content, and these are required to be contained in the above-mentioned requirements. The component (F), the component (G), and the component (H) are contained in an amount as an optional component.
本實施形態之加成硬化型聚矽氧組成物,在 不損及本發明之效果的範圍內,作為(F)~(H)成分以外之任意成分可進而添加:上述以外之聚有機矽氧烷、粉碎矽石(石英微粉末)、氧化鋁等之上述(F)成分之矽石粉末以外之無機填充劑、銀粉等之導電性填充劑、例如若使用於光學半導體裝置時為了得到目的之發光色之螢光體、甲苯、二甲苯、己烷、庚烷、乙醇、異丙基醇、丙酮、甲基乙基酮等之有機溶劑、染料、顏料、難燃性賦予劑、耐熱性提昇劑、耐氧化劣化劑、波長調整劑等。 The addition-curable polyfluorene composition of the present embodiment is In the range which does not impair the effect of the present invention, any component other than the components (F) to (H) may be further added: polyorganosiloxane, pulverized vermiculite (quartz fine powder), alumina, or the like other than the above. A conductive filler such as an inorganic filler or a silver powder other than the vermiculite powder of the component (F), for example, a phosphor for obtaining a desired luminescent color when used in an optical semiconductor device, toluene, xylene, hexane, An organic solvent such as heptane, ethanol, isopropyl alcohol, acetone or methyl ethyl ketone, a dye, a pigment, a flame retardancy imparting agent, a heat resistance improving agent, an oxidation resistant deterioration agent, a wavelength adjusting agent, and the like.
作為本發明之實施形態之加成硬化型聚矽氧組成物之製造方法,各成分之添加順序並無特別限定,可列舉利用周知的混練機來混練(A)~(E)的必須成分、與作為可較佳添加之任意成分的(F)成分、(G)成分、(H)成分及上述之其他任意成分之方法等。 In the method for producing the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention, the order of addition of each component is not particularly limited, and the necessary components of (A) to (E) are kneaded by a well-known kneader. And a method of the (F) component, the (G) component, the (H) component, and the other arbitrary components which are optional components which can be preferably added.
尚,若將作為(H)成分之羧酸金屬鹽(5)以有機溶劑溶液之形態來使用時,亦可預先將(A)成分與羧酸金屬鹽(5)之有機溶劑溶液混合後,再進行從混合物中除去有機溶劑之操作。該情形時,對於有機溶劑除去後的混合物添加殘餘成分並進行混練。尚,即使是將(H)成分之羧酸金屬鹽(5)以作為有機溶劑溶液使用時,依據有機溶劑之量,亦可採用將構成包含(H)成分之加成硬化型聚矽氧組成物之全部成分以混練機同時進行混練之方法。 When the metal carboxylate (5) as the component (H) is used in the form of an organic solvent solution, the component (A) and the organic solvent solution of the metal carboxylate (5) may be mixed in advance. The operation of removing the organic solvent from the mixture is carried out. In this case, the residual component is added to the mixture after the organic solvent removal and kneaded. Further, even when the carboxylic acid metal salt (5) of the component (H) is used as an organic solvent solution, depending on the amount of the organic solvent, an addition hardening type polyoxane composition constituting the component (H) may be used. All the components of the material are mixed by a kneading machine at the same time.
因應所需,作為混練機為具備加熱方式及冷卻方式,可列舉例如:行星式混合機、三輥混合機、揉合 機、品川攪拌機等,可單獨使用或組合此等來使用。 According to the need, the kneading machine is provided with a heating method and a cooling method, and examples thereof include a planetary mixer, a three-roll mixer, and a kneading machine. Machines, Shinagawa mixers, etc. can be used alone or in combination.
本發明之實施形態之加成硬化型聚矽氧組成物的硬化,主要為在(C)成分之存在下,藉由使(A)成分及(B)成分之氫化矽烷化反應來進行。此時,硬化反應可因應上述加成反應抑制劑之種類或該添加量而適當調整。作為較佳的硬化之條件,可列舉在50~200℃下加熱60~300分鐘之條件等。以如此方式所得之聚矽氧硬化物,具有硬質的橡膠狀或可撓性之樹脂狀,且具有優異的黏著性、外觀,同時可抑制熱收縮及受熱之硬度之變化。 The hardening of the addition-curable polyfluorene-oxygen composition of the embodiment of the present invention is mainly carried out by hydrogenation of the component (A) and the component (B) in the presence of the component (C). At this time, the hardening reaction can be appropriately adjusted depending on the kind of the above-mentioned addition reaction inhibitor or the amount of addition. Examples of preferable curing conditions include heating at 50 to 200 ° C for 60 to 300 minutes. The polyoxygenated hardened material obtained in this manner has a hard rubbery or flexible resinous shape, and has excellent adhesion and appearance, and at the same time, can suppress changes in heat shrinkage and heat hardness.
本發明之加成硬化型聚矽氧組成物,係於將LED等之光學半導體晶片安裝在基板後密封之際所使用,例如以作為COB(晶片直接封裝)用之密封劑或晶粒黏著劑為優異。又,可廣泛地使用於光二極體、CCD、CMOS等之泛用的光學半導體封裝體(optical semiconductor package)中。 The addition-hardening polyfluorene composition of the present invention is used when an optical semiconductor wafer such as an LED is mounted on a substrate and sealed, for example, as a sealing agent or a die attaching agent for COB (direct wafer packaging). Excellent. Moreover, it can be widely used in a general-purpose optical semiconductor package such as a photodiode, a CCD, or a CMOS.
將本發明之加成硬化型聚矽氧組成物,例如使用作為密封劑或晶粒黏著劑,在密封光學半導體晶片的光學半導體裝置中,光學半導體晶片所安裝的支撐構造體並無特別限定而可封裝,且亦可為免封裝(packageless)的支撐基板,例如:陶瓷基板、矽基板、玻璃環氧基板、酚醛塑膠(環氧樹脂)基板、金屬基板、塑膠(具體而言為PPA(聚鄰苯二甲醯胺樹脂)基板等)。尚,若使用本發明之加成硬化型聚矽氧組成物時,特別是對於PPA基板而言,可得到高黏著性的聚矽氧硬化物。進而,因應規 格所得之聚矽氧硬化物,亦可作成與金屬之黏著性為優異的加成硬化型聚矽氧組成物。進而,亦可使因應規格所得之聚矽氧硬化物與金屬(例如,銀)之黏著性成為優異之加成硬化型聚矽氧組成物。 In the optical semiconductor device in which the optical semiconductor wafer is sealed, the additive structure to which the optical semiconductor wafer is mounted is not particularly limited, for example, a sealing agent or a die attaching agent of the present invention is used as a sealing agent or a die attaching agent. It can be packaged, and can also be a packageless support substrate, such as ceramic substrate, germanium substrate, glass epoxy substrate, phenolic plastic (epoxy) substrate, metal substrate, plastic (specifically PPA (poly O-phthalamide resin) substrate, etc.). Further, when the addition-curable polyfluorene-oxygen composition of the present invention is used, in particular, for a PPA substrate, a highly adhesive polysulfonated cured product can be obtained. Further, in response to regulations The polyoxygenated hardened material obtained by the lattice can also be used as an addition-curable polyfluorene-oxygen composition excellent in adhesion to metals. Further, it is also possible to form an addition-curable polyfluorene-oxygen composition which is excellent in adhesion between a polycarbonate hardened material obtained by a specification and a metal (for example, silver).
以下為記載關於本發明之實施例,但本發明並非限定於此等之實施例。尚,於下述例中,黏度係25℃中的測定值。 The following are examples of the invention, but the invention is not limited to the examples. Further, in the following examples, the viscosity is a measured value at 25 °C.
於以下之實施例及比較例中,作為(A)~(H)成分為使用以下的化合物等。尚,以下之說明中係分別表示Vi為乙烯基、Me為甲基。 In the following examples and comparative examples, the following compounds and the like were used as the components (A) to (H). In the following description, Vi is a vinyl group and Me is a methyl group, respectively.
以平均組成式(ViMe2SiO1/2)(Me2SiO2/2)m1(ViMeSiO2/2)m2(ViMe2SiO1/2)所表示,平均聚合度為450(m1=448、m2=0),黏度為5000mPa‧s,每1分子的乙烯基量平均為2個的直鏈狀甲基乙烯基聚矽氧烷(A11)。 It is represented by the average composition formula (ViMe 2 SiO 1/2 ) (Me 2 SiO 2/2 ) m1 (ViMeSiO 2/2 ) m2 (ViMe 2 SiO 1/2 ), and the average degree of polymerization is 450 (m1 = 448, m2). =0), a linear methylvinyl polyoxyalkylene (A11) having a viscosity of 5000 mPa·s and an average of two vinyl groups per molecule.
以平均組成式(ViMe2SiO1/2)(Me2SiO2/2)m3(ViMeSiO2/2)m4(ViMe2SiO1/2)所表示,平均聚合度為89(m3=75、m4=12),黏度為200mPa‧s,每1分子的乙烯基量平均為12個的直鏈狀甲基乙烯基聚矽氧烷(A12)。 It is represented by the average composition formula (ViMe 2 SiO 1/2 ) (Me 2 SiO 2/2 ) m3 (ViMeSiO 2/2 ) m4 (ViMe 2 SiO 1/2 ), and the average degree of polymerization is 89 (m3 = 75, m4). = 12), a linear methyl vinyl polyoxyalkylene (A12) having a viscosity of 200 mPa ‧ and an average of 12 vinyl groups per molecule.
由Me3SiO1/2單位、ViMeSiO2/2單位、及SiO4/2單位所組成,質量平均分子量為12,000,每1分子的乙烯基量平均為12個的支鏈狀‧網目狀甲基乙烯基聚矽氧烷(A21)。 It is composed of Me 3 SiO 1/2 unit, ViMeSiO 2/2 unit, and SiO 4/2 unit, and has a mass average molecular weight of 12,000, and an average of 12 vinyl groups per molecule. Vinyl polyoxane (A21).
以平均組成式(Me3SiO1/2)(HMeSiO2/2)m5(Me2SiO2/2)m6(Me3SiO1/2)所表示,平均聚合度為41(m5=23、m6=16),黏度為20mPa‧s,每1分子的Si-H基量平均為24個(8.8mmol/g)的直鏈狀甲基氫聚矽氧烷(B1)。 It is represented by the average composition formula (Me 3 SiO 1/2 )(HMeSiO 2/2 ) m5 (Me 2 SiO 2/2 ) m6 (Me 3 SiO 1/2 ), and the average degree of polymerization is 41 (m5=23, m6). =16), the viscosity is 20 mPa‧s, and the average amount of Si-H per molecule is 24 (8.8 mmol/g) of linear methylhydropolysiloxane (B1).
氯鉑酸與二乙烯基四甲基二矽氧烷之錯合物(有時僅稱為「鉑觸媒」)。 A complex of chloroplatinic acid with divinyltetramethyldioxane (sometimes referred to simply as "platinum catalyst").
使用上述化合物(D11-1)、(D11-2)作為黏著性賦予劑(D1)。具體而言,使用(D11-1)與(D11-2)為1:1(莫耳比)之混合物。 The above compounds (D11-1) and (D11-2) were used as the adhesion imparting agent (D1). Specifically, a mixture of (D11-1) and (D11-2) of 1:1 (mole ratio) was used.
使用上述化合物(D21-1)、(D23-1)作為黏著性賦予劑(D2)。 The above compounds (D21-1) and (D23-1) were used as the tackifier (D2).
化合物(31-1):3-羧基-PROXYL(東京化成工業公司製,製品編號:C1406) Compound (31-1): 3-carboxy-PROXYL (manufactured by Tokyo Chemical Industry Co., Ltd., product number: C1406)
化合物(32-1):4-羥基-TEMPO(東京化成工業公司製,製品編號:H0865) Compound (32-1): 4-hydroxy-TEMPO (manufactured by Tokyo Chemical Industry Co., Ltd., product number: H0865)
化合物(32-2):4-側氧基-TEMPO(東京化成工業公司製,製品編號:O0266) Compound (32-2): 4-sided oxy-TEMPO (manufactured by Tokyo Chemical Industry Co., Ltd., product number: O0266)
化合物(32-3):4-羧基-TEMPO(東京化成工業公司製,製品編號:C1428) Compound (32-3): 4-carboxy-TEMPO (manufactured by Tokyo Chemical Industry Co., Ltd., product number: C1428)
(E)’成分:比較例使用的化合物(3)範圍以外的構造類似的有機自由基 (E)' component: a structurally similar organic radical other than the compound (3) used in the comparative example
以下述式(3cf-1)所表示之化合物(TEMPO(東京化成工業公司製,製品編號:T1560))、以下述式(3cf-2)所表示之化合物(4-胺基-TEMPO(東京化成工業公司製,製品編號:A1343)) A compound represented by the following formula (3cf-1) (TEMPO (manufactured by Tokyo Chemical Industry Co., Ltd., product number: T1560)), a compound represented by the following formula (3cf-2) (4-amino-TEMPO (Tokyo Chemical Co., Ltd.) Industrial company system, product number: A1343))
矽石粉末(F1):使用六甲基二矽氮烷來做處理表面的比表面積約200m2/g的煙霧質矽石。矽石表面之碳量為2.5質量%。 Vermiculite powder (F1): Hexamethyldiazane was used to treat a fumed vermiculite having a specific surface area of about 200 m 2 /g. The amount of carbon on the surface of the vermiculite was 2.5% by mass.
馬來酸二烯丙酯(東京化成工業公司製,純度:97質量%以上) Diallyl maleate (manufactured by Tokyo Chemical Industry Co., Ltd., purity: 97% by mass or more)
2-乙基己酸鈰(III)(使用12%鈰Hex-Cem(商品名,OMG Americas Inc.公司製,金屬含有量係Ce:12質量%,組成係2-乙基己酸鈰(III):49質量%、2-乙基己酸:48質量%、二丙二醇單甲基醚:3質量%)) Cerium (III) 2-ethylhexanoate (using 12% hydrazine Hex-Cem (trade name, manufactured by OMG Americas Inc., metal content: Ce: 12% by mass, composition of bismuth 2-ethylhexanoate (III) ): 49% by mass, 2-ethylhexanoic acid: 48% by mass, dipropylene glycol monomethyl ether: 3% by mass)
將表1~3中所表示的全部成分混練並進行脫氣,分別製造實施例1~15及比較例1~5的加成硬化型聚矽氧組成物。 All the components shown in Tables 1 to 3 were kneaded and degassed, and the addition-curable polyfluorene oxide compositions of Examples 1 to 15 and Comparative Examples 1 to 5 were produced, respectively.
尚,表1~3中(C)成分之含有量,係相對於(A)成分及(B)成分之合計質量之鉑原子換算之含有量(ppm)。又,關於(H)成分之羧酸金屬鹽(5)之質量份,係羧酸金屬鹽(5)之金屬原子換算之質量份。表1~3中,係表示(B)成分之Si-H基/(A)成分之合計之Vi基(莫耳比)、及組成物整體,即(A)成分、(B)成分、(D)成分之Si-H基/Vi基(莫耳比)。 In addition, the content of the component (C) in Tables 1 to 3 is the content (ppm) in terms of platinum atom based on the total mass of the components (A) and (B). In addition, the mass part of the carboxylic acid metal salt (5) of the (H) component is a mass part in terms of a metal atom of the carboxylic acid metal salt (5). In Tables 1 to 3, the total of the Si-H group/(A) component of the component (B), the Vi group (the molar ratio), and the entire composition, that is, the component (A) and the component (B), D) Si-H group/Vi group (Morby ratio) of the component.
接著,將以實施例1~15及比較例1~5所得之加成硬化型聚矽氧組成物以下述方法硬化來製作聚矽氧硬化物試片,對於所得之試片利用以下方法來測定初期的硬度(TYPE A)、質量,並評估外觀。接著,在高溫氛圍下,放置該聚矽氧硬化物試片後,以相同之方式來測定硬度(TYPE A)及質量,並評估硬度(TYPE A)變化、質量變化。又,利用以下方法,使用以各例所得之加成硬化型聚矽氧組成物在PPA基板上形成聚矽氧硬化物,並評估黏著性。將結果表示於表1~表3的下方欄位中。 Next, the addition-curable polyfluorene oxide compositions obtained in Examples 1 to 15 and Comparative Examples 1 to 5 were cured by the following method to prepare a polyfluorene cured product test piece, and the obtained test piece was measured by the following method. Initial hardness (TYPE A), quality, and appearance. Next, after the polyfluorene cured product test piece was placed in a high temperature atmosphere, the hardness (TYPE A) and the mass were measured in the same manner, and the hardness (TYPE A) change and the mass change were evaluated. Further, a polyfluorene cured product was formed on the PPA substrate by using the addition-hardening polyfluorene composition obtained in each of the examples by the following method, and the adhesion was evaluated. The results are shown in the lower fields of Tables 1 to 3.
以150℃、60分鐘之條件下,將以上述所得之各組成 物予以硬化,得到評估用之60×25×6mm的塊狀試片。對於所得之試片來測定硬度(TYPE A)與質量、並評估外觀。 At 150 ° C for 60 minutes, the composition obtained above will be The material was hardened to obtain a 60 x 25 x 6 mm block test piece for evaluation. For the obtained test piece, the hardness (TYPE A) and the mass were measured, and the appearance was evaluated.
依據JIS K6249對於所得之硬化物之試片,利用類型A硬度計來測定25℃中的硬度(TYPE A)。尚,所得之硬度(TYPE A)之誤差範圍為±1。 The hardness (TYPE A) at 25 ° C was measured using a Type A durometer in accordance with JIS K6249 for the obtained test piece of the cured product. Also, the obtained hardness (TYPE A) has an error range of ±1.
使用電子分析天秤(製品名:AEU-210、島津製作所公司製),對於所得之硬化物之試片來測定質量。所得之質量之誤差範圍為±0.001g,質量變化率(%)之誤差範圍為±0.01%。 The mass was measured for the obtained test piece of the cured product using an electronic analysis scale (product name: AEU-210, manufactured by Shimadzu Corporation). The obtained mass has an error range of ±0.001 g, and the mass change rate (%) has an error range of ±0.01%.
利用以下基準,對於所得之硬化物之試片來評估外觀。 The appearance of the obtained cured test piece was evaluated using the following criteria.
○:呈現透明。 ○: Rendered transparently.
△:僅有些許混濁。 △: Only a little turbid.
×:有混濁。 ×: There is turbidity.
將已測定上述初期硬度、質量後的聚矽氧硬化物試片 放置在200℃的高溫氛圍下10天後,利用以上述相同之方式來測定硬度(TYPE A)與質量。 A polythene oxide hardened test piece after the initial hardness and quality have been measured After being placed in a high temperature atmosphere at 200 ° C for 10 days, the hardness (TYPE A) and the mass were measured in the same manner as above.
將從高溫試驗後的硬度(Hh)減去初期硬度(Hi)的值作為硬度變化。又,求出(初期硬度-高溫試驗後之硬度)/初期硬度×100作為硬度變化率(%)。進而,求出(初期質量-高溫試驗後之質量)/初期質量×100作為質量變化率(%)。尚,質量變化率係測量受熱之收縮之指標,質量變化率越小表示熱收縮越小。 The value of the initial hardness (Hi) was subtracted from the hardness (Hh) after the high temperature test as the hardness change. Further, (hardness after initial hardness-high temperature test) / initial hardness × 100 was determined as hardness change rate (%). Further, (the mass after the initial mass-high temperature test) / the initial mass × 100 were determined as the mass change rate (%). Still, the rate of change in mass is an indicator of the contraction of heat, and the smaller the rate of change in mass, the smaller the heat shrinkage.
在PPA製的基板表面上,以長度50mm、寬度10mm、厚度1mm之方式塗布上述各例所得之加成硬化型聚矽氧組成物,並以150℃、60分鐘的條件下使其硬化。之後,用金屬刮勺由基板表面來刮除聚矽氧硬化物,並調查此時之硬化物之剝離狀態。又,利用以下基準來評估黏著性。 The addition-curable polyfluorene oxide composition obtained in each of the above examples was applied to the surface of the substrate made of PPA so as to have a length of 50 mm, a width of 10 mm, and a thickness of 1 mm, and was cured at 150 ° C for 60 minutes. Thereafter, the polysulfonated cured product was scraped off from the surface of the substrate with a metal spatula, and the peeled state of the cured product at this time was investigated. Moreover, the adhesion was evaluated using the following criteria.
○:無法由基材之界面(表面)來剝離硬化物,且破壞硬化物。 ○: The cured product could not be peeled off from the interface (surface) of the substrate, and the cured product was destroyed.
△:部分的硬化物由基材之界面(表面)剝離,且破壞一部分的硬化物。 △: Part of the cured product was peeled off from the interface (surface) of the substrate, and a part of the cured product was broken.
×:硬化物可由基材之界面(表面)剝離。 ×: The cured product may be peeled off from the interface (surface) of the substrate.
由表1、2可得知,將實施例之加成硬化型聚矽氧組成物硬化後所得之聚矽氧硬化物,係具有優異的黏著性、外觀,同時受熱之收縮及硬度之變化很少。相較於此,將表3所表示的比較例之加成硬化型聚矽氧組成物硬 化後所得之聚矽氧硬化物,將有黏著性、外觀、硬度變化、熱收縮之至少一種為不充分之情形。 It can be seen from Tables 1 and 2 that the polyoxysulfuric cured product obtained by curing the addition-curable polyfluorene-oxygen composition of the examples has excellent adhesion and appearance, and is subject to heat shrinkage and hardness change. less. In contrast, the addition-hardening polyfluorene composition of the comparative example shown in Table 3 was hard. The polyfluorene cured product obtained after the chemicalization may have insufficient adhesion, appearance, hardness, and heat shrinkage.
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