TW201501253A - Method and apparatus for joining sealing sheet - Google Patents

Abstract

A sealing sheet that has been cut to a size less than or equal to that of the shape of a semiconductor substrate (W) is transported by a pick-up plate provided in a first transport mechanism to a first retaining table, and the sealing sheet is overlaid on the semiconductor substrate on the first retaining table. The outer periphery of the sealing sheet is tentatively pressure-bonded to the semiconductor substrate by an annular plate, which is a component of the pick-up plate, while a sealing layer of the sealing sheet is put in a semi-cured state at a predetermined viscosity by a built-in heater. When the tentative pressure-bonding at the outer periphery is completed, the sealing layer at the inner basin area of the sealing sheet is heated and tentatively pressure-bonded to the semiconductor substrate in a semi-cured state.

Description

Sealing sheet attaching method and sealing sheet attaching device

The present invention relates to a sealing sheet attaching method and a sealing sheet attaching apparatus in which a plurality of semiconductor elements formed by attaching a sealing sheet formed of a sealing layer composed of a resin composition to a semiconductor substrate and sealed.

After the periphery of one semiconductor wafer is surrounded by the frame, the first sealing resin sheet and the second sealing resin sheet which are formed of the prepreg impregnated with the resin are sandwiched between the respective surfaces of the semiconductor wafer. The semiconductor wafer is sealed to manufacture a semiconductor device (see Patent Document 1).

Patent Document 1 Japanese Patent Laid-Open No. Hei 5-291319

However, the above conventional methods cause the following problems.

In other words, in recent years, there has been a trend toward miniaturization of semiconductor devices due to the high-density mounting required for rapid advancement of applications. Therefore, since the semiconductor wafer is individually sealed with a resin after the semiconductor wafer is separated into semiconductor elements by the dicing process, there is a possibility that the throughput is lowered and the production efficiency is lowered.

The present invention has been made in view of such circumstances, and a main object thereof is to provide a sealing sheet attaching method and a sealing sheet attaching device which can attach a sealing sheet to a semiconductor substrate with good precision.

Then, in order to solve the problem, the inventors of the present invention repeated experiments, simulations, and efforts to investigate the results of the research, and obtained the following findings.

A single-piece sealing sheet in which a sealing layer made of a resin composition is formed is attached to the entire surface of a semiconductor substrate and cured, and then the semiconductor device is divided. Then, when the sealing sheet is attached, in order to improve the adhesion to the semiconductor element, the sealing layer is heated to soften it.

However, in the process of heating the crimping sealing sheet, the resin composition forming the sealing layer is softened by heating. In other words, since the sealing sheet is pressure-bonded to the semiconductor substrate in a state where the viscosity is lowered, the resin composition is extruded from the semiconductor substrate, and a problem such as contamination of the holding stage occurs.

In order to achieve such a purpose, the present invention adopts the following constitution.

In other words, a sealing sheet attaching method is characterized in that a sealing sheet formed by forming a sealing layer composed of a thermoplastic resin composition is attached to a semiconductor substrate, and the sealing sheet attaching method is characterized in that: a process of transferring a sealing sheet cut into a shape below the shape of the semiconductor substrate and superimposing on the semiconductor substrate; In the first attaching process, the sealing layer in the outer peripheral region of the sealing sheet is attached while being heated; and in the second attaching process, the sealing layer on the inner side of the outer peripheral region of the sealing sheet is heated while being attached.

(Action and Effect) According to this method, the sealing layer attached to the outer peripheral region of the sealing sheet of the semiconductor substrate is hardened and reacted in a semi-hardened state. Therefore, even if the resin composition of the sealing layer in which the inner region is formed by softening by heating is pressed, the outer side of the semiconductor substrate can be prevented from being extruded by the resin composition which has been semi-hardened in the outer peripheral region. Therefore, it is possible to suppress the contamination of the resin composition by the holding stage or the like. Here, depending on the characteristics of the resin composition forming the sealing layer, the heating temperature, and the like, the sealing sheet in the heated state can be brought into contact with the semiconductor substrate to enter the gap between the semiconductor elements formed on the semiconductor substrate. seal. Alternatively, the sealing sheet may be attached to the semiconductor substrate while being pressurized and heated.

Further, the heating system of the sealing layer in the outer peripheral region in the first attaching process can be carried out as follows.

For example, in one embodiment, the sealing layer in the outer peripheral region is pressurized and heated by coating a plate in which the heater is embedded in the outer peripheral region. In another embodiment, the roller in which the heater is embedded is rotated in the outer peripheral region. Further, in another embodiment, the insulating layer is irradiated with infrared rays in the outer peripheral region to heat the sealing layer. Further, in each of the above embodiments, the sealing sheet may be heated only or heated while being pressurized depending on the characteristics of the resin composition forming the sealing layer or the setting conditions of the heating temperature.

In each of the embodiments, the second attaching process heats the sealing layer in the inner region by, for example, a plate in which the heater is buried in the inner region. Also in this embodiment, as in the above embodiment, the sealing sheet may be heated only or heated while being pressurized.

In any of the above embodiments, the above method can also be suitably carried out.

Further, in the above method, it is preferred that the sealing layer of the sealing sheet is preheated to a predetermined temperature maintained in an uncured state during the process of transporting the sealing sheet in each attaching process.

According to this method, after the sealing sheet is attached to the semiconductor substrate, it can be semi-hardened in a short time.

Moreover, in order to achieve such an object, the present invention adopts the following constitution.

In other words, a sealing sheet attaching device is obtained by attaching a sealing sheet formed of a sealing layer composed of a thermoplastic resin composition to a semiconductor substrate, and the sealing sheet attaching device is characterized in that it has a holding table. Holding the semiconductor substrate; the transfer mechanism holds the sealing sheet having the shape of the semiconductor substrate or less and is held by the holding member and overlaps with the semiconductor substrate on the holding stage; and the first attaching member overlaps the semiconductor substrate The outer peripheral region of the sealing sheet is heated and attached; and the second attaching member is heated and attached to a region inside the outer peripheral region of the sealing sheet.

According to this configuration, only the sealing layer in the outer peripheral region of the sealing sheet on the semiconductor substrate is heated by the first bonding member to be in a semi-hardened state in which the curing reaction has proceeded. The inner region of the sealing sheet is heated by the second attachment member to be hardened. Therefore, the above method can be suitably carried out.

In this configuration, the first attaching member is a plate in which the heater is embedded in the outer peripheral region of the sealing sheet, and the second attaching member is a plate in which the heater is embedded in the inner region of the sealing sheet.

More preferably, the plate constituting the first attachment member is formed of an annular plate in which a heater is embedded, and the heater is lifted and lowered on the outer periphery of the holding member smaller than the outer shape of the semiconductor substrate provided in the transfer mechanism. The second attaching member is configured by embedding a heater in the holding member.

According to this configuration, since the sealing sheet can be attached to the semiconductor substrate by the transport mechanism, it is possible to save the dedicated device for the attaching process. That is, the device can be miniaturized.

According to the sealing sheet attaching method and the sealing sheet attaching device of the present invention, since the sealing layer attached to the outer peripheral region of the sealing sheet of the semiconductor substrate can be hardened by the first hardening state, the sealing can be suppressed. The resin composition of the softened sealing layer is formed in the inner region of the sheet, and is extruded from the semiconductor substrate by pressing. Therefore, it is possible to suppress the contamination of the holding substrate or the like by the resin composition.

1‧‧‧ Piece Supply Department

3‧‧‧ storage container

21‧‧‧1st transport agency

22‧‧‧Disbonding agency

23‧‧‧1st holding station

24‧‧‧2nd transport agency

26‧‧‧Adsorption plate

26a‧‧‧round plate

26b‧‧‧ring plate

25‧‧‧ Attachment

29a‧‧‧heater

29b‧‧‧heater

100‧‧‧Control Department

T‧‧‧ Sealing film

C‧‧‧Semiconductor components

M‧‧‧ sealing layer

S1, S2‧‧‧1st and 2nd release liners

W‧‧‧Semiconductor substrate

Fig. 1 is a perspective view showing a raw material roll of a sealing sheet.

Figure 2 is a longitudinal sectional view of the sealing sheet.

Fig. 3 is a front view showing the overall configuration of the sealing sheet attaching device.

Fig. 4 is a plan view showing the overall configuration of a sealing sheet attaching device.

Fig. 5 is a plan view showing the main part of the adsorption plate.

Fig. 6 is a longitudinal sectional view showing the main part of the adsorption plate.

Fig. 7 is a front view showing a schematic configuration of a liner peeling mechanism.

Fig. 8 is a partial cross-sectional view showing a decompression chamber constituting an attaching mechanism.

Fig. 9 is a view showing an operation of temporarily pressing a sealing sheet against a semiconductor substrate.

Fig. 10 is a view showing an operation of temporarily pressing a sealing sheet against a semiconductor substrate.

Fig. 11 is a view showing an operation of temporarily crimping a sealing sheet to a semiconductor substrate.

Fig. 12 is a view showing an operation of fixing and sealing a sealing sheet to a semiconductor substrate.

Fig. 13 is a view showing an operation of fixing and sealing a sealing sheet to a semiconductor substrate.

Fig. 14 is a plan view showing the configuration of a main part of an adsorption plate according to a modification.

Fig. 15 is a front elevational view showing the configuration of a main part of an adsorption plate according to a modification.

[Best form for implementing the invention]

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. A case where a sealing sheet in which a sealing layer composed of a resin composition is formed is attached to a semiconductor substrate having a plurality of semiconductor elements formed on its surface will be described as an example.

<sealing sheet>

For example, as shown in FIG. 1 and FIG. 2, the sealing sheet T is supplied by a raw material roll around which the long sealing sheet T is wound, or a sheet-like body cut into a predetermined shape from the raw material roll. Further, in the sealing sheet T, the first release liner S1 for protection and the second release liner S2 are attached to both surfaces of the sealing layer M.

The sealing layer M is formed into a sheet shape from a sealing material. Examples of the sealing material include thermosetting resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester. A thermosetting resin such as a resin, a diallyl phthalate resin, or a thermosetting urethane resin. Moreover, the thermosetting resin and the thermosetting resin composition containing an additive in an appropriate ratio are also mentioned as a sealing material.

Examples of the additive include a filler, a phosphor, and the like. Examples of the filler include inorganic fine particles such as silica, titanium oxide, talc, aluminum oxide, aluminum nitride, and tantalum nitride, and organic fine particles such as silicon oxide particles. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor that converts blue light into yellow light, a red phosphor that converts blue light into red light, and the like. Examples of the yellow phosphor include a garnet-type phosphor such as Y ₃ Al ₅ O ₁₂ :Ce (YAG (yttrium aluminum garnet): Ce). Examples of the red phosphor include a nitride phosphor such as CaAlSiN ₃ :Eu or CaSiN ₂ :Eu.

The sealing layer M is adjusted to be semi-solid before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, it can be, for example, completely cured (C-staged), that is, in a semi-hardened state. Adjust in the (B phase) state.

The size of the sealing layer M can be appropriately set depending on the size of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long piece, the length of the sealing layer in the left-right direction, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm or less, preferably 700 mm or less. Further, the thickness of the sealing layer can be appropriately set in accordance with the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and for example, 3000 μm or less, preferably 1,000 μm or less.

Examples of the first release liner S1 and the second release liner S2 include a polymer sheet such as a polyethylene sheet, a polyester sheet (PET or the like), a polystyrene sheet, a polycarbonate sheet, and a polyimide sheet. For example, a ceramic sheet, such as a metal foil or the like. A release treatment such as fluorine treatment may be performed on the contact surface of the release liner which is in contact with the sealing layer. The size of the first release liner and the second release liner can be appropriately set depending on the peeling conditions, and the thickness is, for example, 15 μm or more, preferably 25 μm or more, and is, for example, 125 μm or less, or preferably 75 μm or less.

<Sealing sheet attachment device>

Fig. 3 is a front view of the sealing sheet attaching device, and Fig. 4 is a plan view of the sealing sheet attaching device.

The sealing sheet attaching device is composed of a sheet supply unit 1, a first transfer mechanism 21, a spacer peeling mechanism 22, a first holding stage 23, a second transfer mechanism 24, and an attaching mechanism 25.

The sheet supply unit 1 has a mounting table 2 . The storage container 3 is placed on the mounting table 2. The storage container 3 is housed with a single piece of sealing sheet T that is cut into a shape of the semiconductor substrate W, for example.

The first transfer mechanism 21 is provided with a suction plate 26 at a lower end of the adsorption unit that can horizontally move and move up and down. That is, the first movable table 28 is provided to move along the guide rail R1 extending along the frame 27 extending in the lateral direction of the apparatus body. A guide rail R2 that is horizontally positioned toward the front and rear of the apparatus main body is attached to a lower portion of the first movable table 28. There is provided an adsorption plate 26 that can be raised and lowered along the vertical frame, and the vertical frame is suspended and supported by the second movable table 30 that can move back and forth along the guide rail R2.

The adsorption plate 26 is composed of a circular plate 26a and an annular plate 26b as shown in Figs. 5 and 6 .

The circular plate 26a is smaller than the outer shape of the semiconductor substrate W. Further, a heater 29a is embedded in the circular plate 26a.

The annular plate 26b is larger than the outer shape of the semiconductor substrate W, and is configured to move up and down with respect to the circular plate 26a on the outer side of the circular plate 26a. For example, the hub portion 66 that moves up and down around the support shaft of the first conveying mechanism 21 via the bearing 65 is provided, and is provided in the hub portion 66. Three support arms 67 extend radially to the center. An annular plate 26b is attached to the lower end of each of the support arms 67.

Therefore, the suction plate 26 sucks and holds the outer peripheral region AR1 of the sealing sheet T by the annular plate 26b during the conveyance, and the inner region AR2 of the sealing sheet T is suction-held by the circular plate 26a. At this time, the sealing sheet T can be held in a flat state by the two adsorption plates 26a, 26b.

The heater 29a and the heater 29b are configured such that the temperature can be individually adjusted by the control unit 100.

The circular plate 26a and the annular plate 26b may have a configuration in which a suction hole is formed in the metal plate, or may be porous.

Further, the first conveying mechanism 21 corresponds to the conveying mechanism of the present invention, the suction plate 26 corresponds to the holding member, the circular plate 26a corresponds to the first attachment member, and the annular plate 26b corresponds to the second attachment member.

As shown in FIG. 7, the spacer peeling mechanism 22 is composed of a peeling tape supply unit 31, a peeling unit 32, a tape collecting unit 33, and a camera 34.

The peeling tape supply unit 31 supplies the long peeling tape TS having a width narrower than the sealing sheet T to the peeling unit 32.

The peeling unit 32 is provided with a peeling roller 35 that winds the peeling tape TS. The peeling roller 35 can be raised and lowered, and can be raised to a position higher than the storage container 3. In other words, during the process in which the sealing sheet T is suctioned and held by the first conveying mechanism 21, the peeling roller 35 presses the peeling tape TS and attaches it to the release liner S2 on the back surface of the sealing sheet T.

The tape collecting portion 33 winds up the release tape TS in a state where the release sheet S2 is attached to the release liner S2 on the back side of the sealing sheet T, whereby the release tape TS is peeled off together with the release liner from the sealing sheet T. The S2 is rolled up together and recycled to the recovery bobbin.

The camera 34 captures the sealing sheet T from which the second release liner S2 has been peeled off from the back side, and transmits the image data to the control unit 100.

As shown in FIGS. 3 and 4, the first holding stage 23 is constituted by a chuck table having a shape larger than that of the semiconductor substrate W. Further, the first holding stage 23 is configured to rotate about the vertical axis and to align the semiconductor substrate W. Further, the first holding stage 23 is configured to reciprocate along the guide rail 38 at an alignment position covering the semiconductor substrate W at the placement position on the inside of the device.

Two cameras 39 are provided above the alignment position, and the semiconductor substrate W is imaged, and the two image data are transmitted to the control unit 100.

The second transport mechanism 24 includes a movable table 42 that moves the device on the guide rail R3, and the guide rail R3 reaches the side of the attaching mechanism 25 along the frame 41 extending in the lateral direction of the device body. An adsorption plate 44 is provided at a lower end of the adsorption unit that can be lifted and lowered along a vertical frame that is suspended and supported by the movable table 42. The adsorption plate 44 has a size equal to or larger than the shape of the semiconductor substrate W. In other words, the substrate transfer mechanism 24 is configured to reciprocate between the first holding stage 23 and the second holding stage 45, which will be described later.

The attaching mechanism 25 is constituted by the second holding base 45, the decompression chamber 46, and the like.

As shown in FIG. 8, the second holding base 45 is housed in a lower casing 46B that constitutes a pair of upper casing 46A and lower casing 46B above and below the decompression chamber 46.

Further, the lower case 46B is configured to reciprocate along the guide rail 48 between the receiving position of the semiconductor substrate W on the front side of the apparatus body and the lower side of the upper casing 46A.

The upper casing 46A constituting the decompression chamber 46 is provided in the elevation drive mechanism 50. The lifting drive mechanism 50 is provided with a movable table 53 that can be raised and lowered along a rail 52 disposed longitudinally on the back of the vertical wall 51; a movable frame 54 supported by the movable table 53 in an adjustable height; and an arm 55 It extends forward from the movable frame 54. An upper casing 46A is attached to a support shaft 56 that extends downward from the front end portion of the arm 55.

The movable table 53 performs screw feed up and down by rotating the screw shaft 57 forward and backward by the motor 58. Further, a pressing plate 59 that can be raised and lowered is attached to the inside of the upper casing 46A. A heater 60 is embedded in the pressing plate 59.

<Sealing sheet attachment treatment>

Next, an operation of attaching the sealing sheet to one of the semiconductor substrates by the above-described sealing sheet attaching device will be described in detail.

The storage container 3 in which the sealing sheet T is housed is placed on the mounting table 2. The suction plate 26 of the first conveying mechanism 21 suctions the sealing sheet T and carries it out of the storage container 3 in a flat state. The first conveying mechanism 21 conveys the sealing sheet T to the liner peeling mechanism 22 .

During this transfer, the sealing sheet T is first transported to the top of the camera 34. At this time, as shown in FIG. 7, during the horizontal conveyance, the peeling roller 35 gradually rises to the front position shifted from the storage container 3 in the conveyance direction. The peeling tape TS wound around the peeling roller 35 is pressed to the second release liner S2 on the back side of the sealing sheet T as indicated by a chain line. Thereafter, the second release liner S2 is peeled off from the sealing sheet T while the release tape TS is wound up at a speed synchronized with the conveyance speed of the first conveyance mechanism 21. The peeled second release liner S2 is wound up together with the release tape TS and recovered into a recovery bobbin 19.

When the sealing sheet T reaches above the camera 34, the sealing sheet T is photographed. The acquired image data is transmitted to the control unit 100. When the photographing process is completed, the first transport mechanism 21 moves to the first holding stage 23 while sucking and holding the sealing sheet T.

The semiconductor substrate W is placed on the first holding stage 23 while the sealing sheet T is being carried out from the storage container 3 at substantially the same time. The first holding stage 23 that adsorbs and holds the semiconductor substrate W is moved to the aligned position, and the surface is photographed by the camera 39. The captured image data is transmitted to the control unit 100.

When the photographing processing is completed, the first holding stage 23 returns to the placement position. Here, the alignment of the semiconductor substrate W is performed so that the outline of the sealing sheet T obtained by the image analysis processing of the control unit 100 matches the contour of the semiconductor substrate W. The first holding stage 23 is rotated about the longitudinal axis for alignment.

When the alignment of the semiconductor substrate W is completed, the sealing sheet T conveyed by the first conveying mechanism 21 is disposed opposite to the semiconductor substrate W as shown in FIG. 9 . Then, the circular plate 26a and the annular plate 26b are lowered to a predetermined height while the sealing sheet T is kept flat. At this time, the bottom surface of the sealing sheet T is lowered to the height in contact with the surface of the semiconductor element.

Next, the heater 29b is actuated, and as shown in Fig. 10, the annular plate 26b is slightly lowered. In other words, the sealing layer M is heated for a predetermined period of time while applying a predetermined load to the outer peripheral region of the sealing sheet T by the annular plate 26b. Further, conditions such as load, heating temperature, and heating time depend on the characteristics of the thermoplastic resin composition forming the sealing layer M. The resin composition is set to be in the following state. The resin composition of the inner region AR2 which is softened by heating is prevented from being extruded from the outer side of the semiconductor substrate W, and the resin composition of the outer peripheral region AR1 is semi-hardened in an uncured state until the adhesiveness is maintained.

By the annular plate 26a, the resin composition forming the sealing layer M is softened and enters while excluding air between the semiconductor elements in the outer peripheral region to seal the semiconductor element. When the predetermined time elapses, the resin composition is semi-hardened and temporarily pressed against the semiconductor substrate W.

As shown in Fig. 11, the circular plate 26a is slightly lowered to heat the inner region AR2 of the sealing layer M to soften the resin composition and gradually enter between the semiconductor elements. At this time, the surface of the sealing sheet T is corrected to be flat by the annular plate 26b and the circular plate 26a. When the predetermined time passes and the resin composition is semi-hardened, the annular plate 26b and the circular plate 26a are raised to release the pressurization and heating.

Further, at this point, the sealing layer M is in a temporarily crimped state which is not completely hardened. When the temporary pressure bonding of the sealing sheet T is completed, the first conveying mechanism 21 returns to the standby position on the mounting table 2 side.

The semiconductor substrate W to which the sealing sheet T is temporarily pressure-bonded is sucked and held by the second transfer mechanism 24, and is transported to the second holding stage 45.

When the semiconductor substrate W is placed on the second holding stage 45, the second transfer mechanism 24 rises and returns to the first holding stage 23 side. The second holding stage 45 moves to the lower side of the upper casing 46A in a state in which the semiconductor substrate W is adsorbed and held.

As shown in FIG. 12, the lower end of the upper casing 46A is lowered to a position abutting against the lower casing 46B. That is, the decompression chamber 46 is formed. then, The pressure inside the decompression chamber 46 was reduced. Next, as shown in FIG. 13, the pressing plate 59 is lowered to press and heat the sealing sheet T, and is fixedly pressed against the semiconductor substrate W. At this point, the sealing layer M is in a state in which it has not been completely hardened.

When the fixed crimping is completed, the inside of the decompression chamber 46 is returned to the atmospheric pressure to open the upper casing 46A. The lower casing 46B, together with the second holding stage 45, returns to the delivery position of the substrate. The semiconductor substrate W to which the sealing sheet T is fixedly pressed is peeled off from the first release liner S1. In the above manner, the operation of attaching the sealing sheet T to one of the semiconductor substrates W is completed.

According to the apparatus of the above-described embodiment, since only the sealing layer M of the outer peripheral region AR1 of the sealing sheet T is semi-cured in the semiconductor substrate W, even if the sealing layer M of the inner region AR2 is heated to be softened and pressed, it is not pressed. Since the resin composition forming the sealing layer M is extruded from the semiconductor substrate W, contamination of the first holding stage 23 or the like holding the semiconductor substrate W can be suppressed.

Further, the present invention can also be implemented in the following aspects.

(1) In the above embodiment, instead of the annular plate 26b provided in the first conveying mechanism 21, the roller in which the heater is placed may be rotated along the outer peripheral region AR1 of the sealing sheet T.

For example, as shown in FIG. 14 and FIG. 15, a boss portion 66 that moves up and down around a support shaft of the first transport mechanism 21 via a bearing 65 is provided, and the hub portion 55 is provided to extend radially toward the center. 3 support arms 67. The roller 68 is attached to the lower end of each of the support arms 67 so as to be movable up and down via the swing arm 69. In addition, the roller 68 is biased downward by the spring.

In this configuration, the heated roller 68 is rotated on the outer peripheral region AR1 of the sealing sheet T overlapping the semiconductor substrate W to pressurize and heat the resin composition and semi-harden it, and then the circular plate 26a The resin composition of the inner region AR2 is pressurized and heated to be semi-hardened.

(2) In the apparatus of each of the above embodiments, the annular plate 26b may be formed by attaching a diffusion sheet to a member having transparency, and an infrared LED may be provided inside.

In other words, while the sealing sheet T is pressed by the annular plate 26b, infrared rays are irradiated to the sealing layer M by the internal infrared LED to be heated.

(3) In the devices of the above embodiments, the shape of the semiconductor substrate W is not limited to a circular shape. Therefore, the semiconductor substrate W may have a square shape such as a square or a rectangle.

In the case where the semiconductor substrate W has a square shape, as in the above-described respective embodiments, the outer peripheral region and the inner region may be respectively pressurized and heated by a quadrangular annular plate and a rectangular plate on the inner side thereof.

Further, a plate having a heater therein may be configured to sequentially cover the side edges of the square to pressurize and heat.

(4) In the apparatus of each of the above embodiments, the sealing sheet T may be heated and softened to be attached to the semiconductor substrate W. In other words, depending on the characteristics of the characteristics of the resin composition constituting the sealing layer M, the heating temperature, and the like, it is also possible to introduce the resin composition into the semiconductor element by merely heating by heating to seal the layer M. C is attached to each other.

(5) In the apparatus of each of the above embodiments, before the sealing sheet T is transported to the first holding stage 23 via the spacer peeling mechanism 22, the sealing sheet T may be embedded in the circular plate 26a and the annular plate, respectively. The heaters 29a, 29b of 26b are actuated to be preheated to a predetermined temperature.

In this case, the waiting time for each of the plates 26a and 26b to reach the set temperature can be shortened. In other words, the heating time of the heater on the first holding stage 23 can be saved to a stable waiting time.

(6) In the above embodiments, the first transfer mechanism pressurizes and heats the outer peripheral region AR1 and the inner region AR2 of the sealing sheet T, but the configuration is not limited thereto. Therefore, after the sealing sheet T and the semiconductor substrate W on the first holding stage 23 are overlapped by the first conveying mechanism 21, the first conveying mechanism 21 can be retracted, and the apparatus including only the circular plate 26a and only the device can be used. The apparatus having the annular plate 26b semi-hardens the resin composition in which the sealing layer M is sequentially formed in the outer peripheral region AR1 and the inner region AR2 of the sealing sheet T.

[Possibility of industrial use]

As described above, the present invention is suitable for attaching a sealing sheet to a semiconductor substrate with good precision.

21‧‧‧1st transport agency

23‧‧‧1st holding station

26a‧‧‧round plate

26b‧‧‧ring plate

29a‧‧‧heater

29b‧‧‧heater

T‧‧‧ Sealing film

W‧‧‧Semiconductor substrate

Claims (10)

A sealing sheet attaching method in which a sealing sheet formed of a sealing layer composed of a thermoplastic resin composition is attached to a semiconductor substrate, and the sealing sheet attaching method is characterized in that: a conveying process is to be cut The sealing sheet which is cut into the shape of the semiconductor substrate is conveyed and superimposed on the semiconductor substrate; in the first attaching process, the sealing layer in the outer peripheral region of the sealing sheet is attached while being heated; and the second attaching process is to be compared The outer peripheral region of the sealing sheet is attached to the sealing layer in the inner region while being heated. The sealing sheet attaching method according to claim 1, wherein the first attaching process pressurizes and heats the sealing layer in the outer peripheral region by coating a plate in which the heater is embedded in the outer peripheral region, and the second attaching process The sealing layer of the inner region is pressurized and heated by covering a plate in which the heater is embedded in the inner region. The sealing sheet attaching method of claim 1, wherein the first attaching process rotates a roller in which a heater is embedded in a peripheral region to pressurize and heat the sealing layer, and the second attaching process is performed by coating the inner side A plate in which a heater is embedded in the region pressurizes and heats the sealing layer in the inner region. The sealing sheet attaching method according to claim 1, wherein the first attaching process irradiates infrared rays in a state where the transparent plate is pressed to the outer peripheral region to heat the sealing layer, and the second attaching process is The sealing layer of the inner region is heated by covering a plate in which the heater is buried in the inner region. The sealing sheet attaching method of claim 1, wherein the sealing layer of the sealing sheet is preheated to a predetermined temperature maintained in an uncured state during the conveying process of the sealing sheet in each of the attaching processes. A sealing sheet attaching device for attaching a sealing sheet formed of a sealing layer composed of a thermoplastic resin composition to a semiconductor substrate, the sealing sheet attaching device characterized by comprising: a holding stage for holding the semiconductor a substrate; a transfer mechanism in which a sealing sheet having a shape smaller than the shape of the semiconductor substrate is held by a holding member and overlaps with a semiconductor substrate on a holding stage; and the first attaching member is a sealing sheet overlapping the semiconductor substrate The outer peripheral region is heated and attached; and the second attaching member is heated and attached to a region inside the outer peripheral region of the sealing sheet. The sealing sheet attaching device according to claim 6, wherein the first attaching member is a plate in which a heater is embedded in an outer peripheral region of the sealing sheet, and the second attaching member is covered with heating in an inner region of the covering sealing sheet. Board. The sealing sheet attaching device according to claim 7, wherein the plate constituting the first attaching member is constituted by an annular plate in which a heater is embedded, and the heater is smaller than a shape of a semiconductor substrate provided in the conveying mechanism. The outer periphery of the holding member is raised and lowered, The second attaching member is configured by embedding a heater in the holding member. The sealing sheet attaching device of claim 6, wherein the first attaching member is configured by embedding a heater in a roller that rotates in an outer peripheral region. The sealing sheet attaching device according to claim 6, wherein the first attaching member includes a plate that covers the outer peripheral region and has transparency, and a light projector that irradiates the outer peripheral region with infrared rays via the plate.