TW201441648A - Display device substrate, method for manufacturing display device substrate, and display device - Google Patents

Abstract

A display device substrate of the invention includes: a transparent substrate; and a black matrix formed of a reflectance reduction layer and a light shielding layer which are stacked in layers in this order on the transparent substrate. The reflectance reduction layer has a film thickness in a range of approximately 0.1 to 0.7 μ m. The light shielding layer contains carbon as a chief material of light shielding color materials. The effective optical density of the reflectance reduction layer, which is obtained by multiplying the film thickness by an optical density per unit film thickness, is in a range of approximately 0 to 0.4. The reflectance of the black matrix measured through the transparent substrate is in a range of approximately 0.05 to 0.3% with reference to the reflectance of an aluminum film.

Description

Display device substrate, display device substrate manufacturing method, and display device

The present invention relates to a substrate for a display device, a method for producing a substrate for a display device, and a display device.

In recent years, liquid crystal display devices have been used in various fields. The color filter is an indispensable accessory for a liquid crystal display device that realizes color display. The color filter is provided with, for example, colored pixels such as a red filter, a green filter, and a blue filter on a transparent substrate such as glass. In order to improve the contrast between the respective colored pixels, or in the liquid crystal display device, a black matrix (light blocking portion) is provided to prevent malfunction of light passing through the TFT (thin film transistor) element provided on the counter substrate.

The method of forming the black matrix can be a method of etching a metal chromium film. However, in terms of cost and environmental burden, there is also a case where a photolithography method using a black photosensitive resin composition containing a light-shielding material is applied.

The formation of a black matrix by photolithography using a black photosensitive resin composition is carried out as follows.

First, for example, by spin coating or slit coating, etc. A coating film of a black photosensitive resin composition is formed on the transparent substrate. The target substrate to be formed is dried and heated as necessary. Then, exposure processing is performed on the formed target substrate via a photomask having a predetermined pattern. Next, the unexposed portion of the target substrate formed by the exposure treatment is removed, and a black matrix is formed on the transparent substrate via the heating hard film treatment.

The properties required for the black matrix include, for example, light blocking properties, resolution, and insulation properties.

When the liquid crystal display device having the color filter is viewed from the transparent substrate side, external light is reflected at the interface between the transparent substrate and the black matrix. At this time, the screen of the liquid crystal display device may reflect the object, change the hue, or deteriorate the display quality. Therefore, in recent years, reduction in reflectance and control of hue (reflected chromaticity) of reflected light are desired.

When using a product of a liquid crystal display device, design is becoming more and more important, and the hue at the time of no lighting is also emphasized. The hue at the time of no lighting is affected by the reflection chromaticity of each member such as a TFT element, a liquid crystal molecule, a polarizing plate, and a color filter constituting the liquid crystal display device. Even in these members, the black matrix of the color filter greatly affects the reflection chromaticity because the reflectance is high and the area ratio in the display screen is high. Therefore, the reflectance of the black matrix is high, and when the reflected color of the black matrix is not neutral black, especially when the mobile device is assembled with a black matrix, the frame portion and the black matrix called the blackout screen may be damaged. The overall sense of the problem.

The liquid crystal display device can be improved by adjusting the reflection chromaticity of the colored pixels of the TFT element itself, the polarizing plate or the color filter. The hue when lighting. However, in this case, the situation of changing the transparent chromaticity will be changed when there is a little light. In this regard, since the black matrix of the color filter does not transmit light, the transparent chromaticity at the time of lighting is not affected, and only the reflected chromaticity at the time of no lighting can be adjusted. Here, the black matrix system can be expected to have low reflectance of the conventional characteristics of the black matrix, and the reflected color is neutral black, that is, the planar characteristics in the visible light region can be obtained in the reflected splitting of the black matrix.

However, the reflectance of the conventional black matrix formed by using the black photosensitive resin in which the black pigment is dispersed in the photosensitive resin composition strongly depends on the pigment concentration which determines the light blocking property. In order to reduce the reflectance, it is necessary to reduce the pigment concentration. When reducing the pigment concentration, it is necessary to thicken the thickness of the black matrix for maintaining the light blocking property. When the thickness of the black matrix is increased, the flatness of the color filter is impaired, and the liquid crystal molecules are liable to cause poor alignment. On the contrary, in order to obtain sufficient light shielding properties in the black matrix of the film, it is necessary to increase the pigment concentration. When the pigment concentration is increased, the reflectance of the black matrix is increased. That is, there is a problem that the light-shielding property and the low-reflection become a trade-off relationship.

In order to solve the trade-off relationship between the light-shielding property and the anti-reflection property, for example, Patent Document 1 (Japanese Laid-Open Patent Publication No. 2006-154849). Patent Document 1 discloses that a black photosensitive resin composition and a metal film using a pigment dispersion liquid in which carbon black and an organic pigment are uniformly dispersed at the same time can be used together to have both light blocking property and low reflectance.

However, the selection of a dispersant which can uniformly disperse both carbon black and organic pigment is extremely difficult. Moreover, in order to increase the optical density, a step of laminating a metal film is required, and as the number of steps increases, productivity is lowered. situation. Moreover, there is a case where the cost is increased when a metal film is used.

A method of solving the trade-off relationship between the light-shielding property and the anti-reflection property without using a metal film is, for example, Patent Document 2 (International Publication WO2010/070929 booklet). Patent Document 2 discloses a black matrix in which a low optical density layer and a high optical density layer are laminated. The low optical density layer is formed, for example, by using a colored photosensitive resin composition containing a pigment, for example, having a thickness of 2 μm. The high optical density layer is formed using a black photosensitive resin composition containing carbon black (hereinafter abbreviated as carbon) or titanium black. The materials of the low optical density layer described in paragraphs [0100] and [0102] of Patent Document 2 are expected to contain a pigment and a resin. The types of pigments are exemplified in paragraphs [0103] to [0105] of Patent Document 2. When the low optical density layer contains a pigment, the color phase is contained by the organic pigment contained in the low optical density layer. Therefore, in Patent Document 2, it is difficult to form a black matrix in which the reflected light becomes neutral black. Patent Document 2 does not disclose a neutral matrix having a light wavelength of 430 nm, 540 nm, and 620 nm in a range of 0.05 to 0.3% and a low reflection black matrix. In the low optical density layer having an optical density of 0.5 or more in the second application of Patent Document 2, the reflectance is high. Patent Document 2 does not disclose a specific technique of using a low optical density layer having a light shielding layer having a low carbon content. Patent Document 2 also does not disclose an optimum film thickness for obtaining a low-density optical layer having a neutral property and a low reflectance. Patent Document 2 does not disclose optical constants and reflectances of wavelengths of 430 nm in the blue region, 540 nm in the green region, and 620 nm in the red region, and does not disclose the wavelength range in the visible light region. What kind of reflexivity is produced inside.

On the other hand, Patent Document 3 (Japanese Patent No. 2861391) discloses that, in addition to the opacifier and the resin, blue is added by using A pigment such as purple is used as a black matrix of complementary color pigments to obtain neutral black.

Further, Patent Document 4 (JP-A-2005-75965) discloses that neutral black can be obtained by using carbon black and titanium oxynitride in combination.

Further, Patent Document 5 (Japanese Laid-Open Patent Publication No. 2011-227467) discloses a combination of titanium nitride and a red pigment selected from at least one of CI Pigment Red 254, CI Pigment Red 177, and CI Pigment Red 179. , can get neutral black.

However, the reflection chromaticity of the black matrix cells of the patent documents 3 to 5 is effective in the vicinity of neutral black, but is not a reflection reduction effect, and the reflectance of the black matrix measured by the transparent substrate is any method. Become 1.0% or more.

In the case of a metal oxynitride such as chromium or a metal film, a low reflectance is formed, as disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. The technology of the black matrix. However, the techniques disclosed in Patent Documents 6 and 7 are, for example, paragraphs [0004] of Patent Document 6 and FIG. 8 or FIG. 9 of Patent Document 7, and the reflectance is as low as 5% or so. The optical interference film system can realize low reflection in a specific wavelength range, for example, by forming a multilayer film of two or more layers and adjusting the film thickness, but in this case, it is difficult to achieve low reflection in the entire range of visible light. Further, the cost of a single layer and a two-layer metal oxide, a metal oxynitride, and a metal film not only in vacuum film formation, but also in the step of patterning by etching, there is a problem that environmental pollution is caused by metal ions such as chromium ions. .

The present invention has been made in view of the above circumstances, and an object of the invention is to provide a substrate for a display device, a method for producing a substrate for a display device, and a display device which can eliminate reflection on a screen and which can be displayed without coloring and neutral display.

A substrate for a display device according to a first aspect of the present invention includes a transparent substrate, and a light-shielding layer including a reflectance-reducing layer and carbon as a main material of the light-shielding color material is sequentially laminated on the transparent substrate. In the black matrix, the film thickness of the reflectance reducing layer is approximately in the range of 0.1 μm or more and 0.7 μm or less. The effective optical density of the reflectance reducing layer obtained by multiplying the film thickness by the optical density per unit film thickness is approximately in the range of 0 or more and 0.4 or less. The reflectance of the black matrix measured by the transparent substrate is approximately 0.05% or more and 0.3% or less based on the reflectance of the aluminum film.

In the substrate for a display device according to the first aspect of the present invention, the reflectance of the black matrix measured by the transparent substrate is about 0.05% or more and 0.3% or less when the light wavelength is about 430 nm, 540 nm, and 620 nm, respectively. The range is good.

In the substrate for a display device according to the first aspect of the present invention, it is preferable that the reflectance reducing layer is a transparent resin layer.

In the substrate for a display device according to the first aspect of the present invention, it is preferable that the reflectance reducing layer is a semi-transparent resin layer containing at least carbon.

In the substrate for a display device according to the first aspect of the present invention, it is preferable that the reflectance reducing layer is a translucent resin layer containing an organic pigment having at least two kinds of subtractive color mixing relationships.

In the substrate for a display device according to a first aspect of the present invention, the black matrix has a plurality of pixel openings, and a blue filter, a green filter, and a red filter are respectively disposed in the pixel opening. The pixel pattern of the film is better.

A method for producing a substrate for a display device according to a second aspect of the present invention, which is characterized in that a first layer of a reflectance-reducing layer is applied onto a transparent substrate, and the first layer is semi-cured, and then coated on the first layer. a second layer of the light shielding layer, wherein the first layer and the second layer are exposed at a time by using a photomask, and the first layer and the second layer formed on the transparent substrate are formed by one development A black matrix in which the above-described light shielding layer is laminated is formed on the reflectance reducing layer.

In the method for producing a substrate for a display device according to a second aspect of the present invention, it is preferable that the reflectance reducing layer is the transparent resin layer or the translucent resin layer.

In the method for producing a substrate for a display device according to a second aspect of the present invention, it is preferable that the translucent resin layer contains carbon.

In the method for producing a substrate for a display device according to a second aspect of the present invention, the reflectance reducing layer is preferably a third embodiment of the present invention in which a translucent resin layer of an organic pigment containing at least two kinds of color reduction mixing relationships is used. The display device of the present invention includes the substrate for a display device according to the first aspect described above.

In the aspect of the invention, it is possible to provide a substrate for a display device, a method for producing a substrate for a display device, and a display device which can eliminate reflection of a screen and which can be displayed without coloring and neutral display.

1, 6‧‧‧ Display device substrate

2, 12‧‧‧ transparent substrate

3‧‧‧ coating

4‧‧‧Reflectance reduction layer

5‧‧‧Lighting layer

7‧‧‧Liquid crystal display device

8‧‧‧LCD panel

9‧‧‧Array substrate

10‧‧‧Liquid layer

11, 17‧‧‧ oriented film

13a~13c‧‧‧Insulation film

14‧‧‧Metal wiring

15‧‧‧Common electrode

16‧‧‧pixel electrode

BM‧‧‧ Black Matrix

CF‧‧‧ color filters

RF‧‧‧ red filter

GF‧‧‧Green Filter

BF‧‧ blue filter

Fig. 1 is a cross-sectional view showing a first example of a substrate for a display device of the embodiment.

Fig. 2 is a cross-sectional view showing a second example of the substrate for a display device of the embodiment.

3 is a plan view showing an example of a pixel pattern formed of a red color filter, a green color filter, and a blue color filter formed in a pixel opening portion of a black matrix.

FIG. 4 is a cross-sectional view showing an example of a liquid crystal display device including the substrate for a display device of the embodiment.

Fig. 5 is a flow chart showing an example of a method of manufacturing the black matrix of the embodiment.

Fig. 6 is a view showing an example of a defective appearance of the surface of a black matrix.

Fig. 7 is a graph showing the relationship between the amount of pre-exposure under the coating conditions of Example 1, Example 3, and Example 5 and the reflectance of the black matrix.

Fig. 8 is a data diagram showing the extinction coefficients of the blue filter BF, the green filter GF, and the red filter RF constituting the color filter.

[Better Embodiment]

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings used in the following description, in order to identify the size of each member, the reduction ratio of each member is appropriately changed. Moreover, the same symbols are used for the same or substantially the same functions and constituent elements. And the description is omitted or only when necessary.

In the present embodiment, only the characteristic portions will be described, and the description of the components of the general display device and the parts that are not different will be omitted.

This embodiment is described by taking a liquid crystal display device as an example, and is applicable to the present invention in the same manner as other display devices such as an organic EL display device.

In the present embodiment, a substrate for a display device including a two-layer black matrix including a reflectance reducing layer and a light shielding layer will be described.

Fig. 1 is a cross-sectional view showing a first example of a substrate for a display device of the embodiment.

The display device substrate 1 includes a transparent substrate 2, a black matrix BM, and a coating layer (transparent resin layer) 3.

The transparent substrate 2 is, for example, glass.

A black matrix BM is formed on the first plane of the transparent substrate 2. The black matrix BM is formed in a plan view to form a plurality of pixel openings arranged in a matrix.

A coating layer 3 is formed on the transparent substrate 2 on which the black matrix BM is formed.

The black matrix BM system includes a reflectance reducing layer 4 and a light shielding layer 5. The black matrix BM sequentially forms the reflectance reducing layer 4 and the light shielding layer 5 on the transparent substrate 2.

When the display device 1 is provided with the display device substrate 1, the second plane (the surface on the opposite side to the first plane) of the transparent substrate 2 faces the viewer, and the coating layer 3 faces the liquid crystal layer.

Therefore, when the display device is provided with the display device substrate 1, the black matrix BM is provided with the light shielding layer 5 on the liquid crystal layer side (close to the liquid crystal layer), and the reflectance reduction layer is disposed on the viewing side (close to the viewer). 4.

In the present embodiment, the light shielding layer 5 is made of, for example, a main material (main body, main component or main component) of the light-shielding color material. Here, the main material of the light-shielding color material means a material having a mass exceeding 50% with respect to the mass of all the materials of the light-shielding color material in the mass ratio.

The film thickness of the reflectance reducing layer 4 is, for example, in the range of about 0.1 μm or more and 0.7 μm or less, and the optical density of the reflectance reducing layer 4 is set to be in the range of about 0 or more and 0.4 or less.

As the material of the reflectance reducing layer 4, a translucent resin which is an organic pigment containing at least two kinds of color-reducing and mixing relationships as a light-shielding color material can be used. The organic pigment having two or more kinds of subtractive color mixing relationships means that a black-based organic pigment is produced by color mixing. Further, in the organic pigment of two or more kinds of color reduction mixing relationships of the present invention, by mixing two or more kinds of pigments, it is possible to reduce the organic pigment having a wide range of light transmittance in the visible light region. For example, a subtractive color mixture can be produced by mixing a blue pigment with a red pigment. Further, color reduction mixing can also be produced by mixing a purple pigment with a yellow pigment. Other combinations of conventional pigments may also be mentioned. Since the color of the reflectance reducing layer 4 is close to black or gray, an organic pigment reflecting color adjustment can be further added to the above pigment. The organic pigments usable in the present invention are as follows. Among the two or more types of organic pigments, carbon may be further added as a main material of the light-shielding color material.

Also, the reflectance reducing layer may be a transparent resin layer.

The reflectance reducing layer can be composed of at least a translucent resin containing carbon. The translucent resin constituting the reflectance reducing layer may be a resin having a translucency of a concentration of 0.4 or less.

Further, the optical density of the reflectance reducing layer 4 of the present embodiment is not the optical density per unit thickness (1 μm) of the general title. The reflectance reducing layer 4 of the present embodiment is formed to have a film thickness in a range of about 0.1 μm or more and 0.7 μm or less. The optical density film thickness of the reflectance reducing layer 4 of the present embodiment is multiplied by the effective optical density obtained by the optical density per unit film thickness.

The reflectance of the black matrix BM measured by the transparent substrate 2 is, for example, in the range of about 0.05 or more and 0.3% or less based on the reflectance of the aluminum film. For example, the reflectance of the black matrix BM is measured by using a C light source and a microspectrophotometer (for example, LCF-1100 manufactured by Otsuka Electronics Co., Ltd.), and measuring a vapor deposited film of aluminum (hereinafter referred to as an aluminum film) as a measurement standard of 100%. . The reflectance of the black matrix BM measured by the transparent substrate 2 is such that light is incident on the surface of the transparent substrate 2 on which the black matrix BM is not formed, and the light transmitted through the transparent substrate 2 is irradiated onto the black matrix BM by measurement from the black matrix BM. The light is reflected.

When the reflectance of the black matrix BM measured by the transparent substrate 2 is, for example, about 430 nm, 540 nm, or 620 nm, the reflectance of the black matrix BM is small, and is approximately in the range of 0.05% or more and 0.3% or less. For example, the measurement wavelength can be a representative value of a wavelength of light of about 550 nm, and can be measured by a reflectance at a measurement wavelength of 430 nm, 540 nm, and 620 nm. The measurement precision of the reflectance (%) is set, for example, at about ±0.04 points.

Optical density OD uses a densitometer (for example: Gretag Measured by Macbeth Corporation D200-II).

Specifically, carbon is used as the main material of the light-shielding material, and specifically, the base material of the transparent resin contains carbon having a solid form ratio of 50% by mass or more as a color material.

2 is a cross-sectional view showing a second example of the substrate for a display device of the present embodiment, and the substrate 6 for a display device is a color filter substrate.

A color filter CF is formed on the transparent substrate 2 on which the black matrix BM is formed. A coating layer 3 is formed on the color filter CF.

3 is a plan view showing an example of a pixel pattern in which the black matrix BM has a plurality of pixel openings and the red color filter RF, the green color filter GF, and the blue color filter BF formed by the pixel opening portion are formed. .

In the display device substrate 6, any one of the red filter RF, the green filter GF, and the blue filter BF is disposed in each pixel.

The shape of the pixel opening portion is not limited as long as it is a rectangle as shown in FIG. 3. For example, a polygon having at least two faces facing each other, such as a parallelogram and a shape in which a doglegged shape is connected in one direction, may be parallel.

The substrate 6 for a display device having a pixel pattern of a plurality of colors can be applied to a white light-emitting liquid crystal display device and an organic EL display device.

On the coating layer 3 of the substrate 6 for a display device of FIGS. 2 and 3 described above, a layer or pattern of a transparent conductive oxide such as a transparent conductive film (ITO) can be formed.

Fig. 4 is a view showing a display device according to the embodiment; A cross-sectional view of an example of a liquid crystal display device of the board 6.

The liquid crystal display device 7 includes a liquid crystal panel 8. The liquid crystal panel 8 includes an array substrate 9 , a liquid crystal layer 10 , and a substrate 6 for a display device. The array substrate 9 and the display device substrate 6 are faced to each other via the liquid crystal layer 10.

In Fig. 4, an alignment film 11 is formed on the coating layer 3 of the substrate 6 for a display device. The observer observes the pixels displayed on the liquid crystal display device 7 via the transparent substrate 6. The alignment film 11 is disposed so as to be in contact with the liquid crystal layer 10 such that the alignment film 11 and the alignment film 17 (described below) are caught by the liquid crystal layer 10.

The array substrate 9 includes a transparent substrate 12, insulating layers (transparent resins) 13a to 13c, a metal wiring 14, a common electrode 15, a pixel electrode 16, and an alignment film 17.

The transparent substrate 12 is, for example, a glass plate.

An insulating layer 13a is formed on the first plane of the transparent substrate 12. Metal wirings 14 are formed on the insulating layer 13a.

The metal wiring 14 is formed in a plan view, that is, in a position overlapping the black matrix BM in the vertical direction. In other words, when the display surface of the transparent substrate 12 (the surface on which the black matrix BM is not formed) is viewed by the observer side, the metal wiring 14 is positioned below the black matrix BM.

An insulating layer 13b is formed over the insulating layer 13a on which the metal wiring 14 is formed. A plate-shaped common electrode 15 is formed on the insulating layer 13b. An insulating layer 13c is formed over the insulating layer 13b on which the common electrode 15 is formed. A pixel electrode 16 is formed over the insulating layer 13e.

The pixel electrode 16 is formed in a comb shape, for example, in plan view. Also, the pixel electrode 16 may have a vertical length to the cross section of FIG. The stripe pattern to the direction.

An alignment film 17 is formed over the insulating layer 13c on which the pixel electrode 16 is formed.

The array substrate 9 of FIG. 4 is also provided with an active element such as a thin film transistor (TFT).

The alignment film 17 of the array substrate 9 is placed in contact with the liquid crystal layer 10 such that the alignment film 11 and the alignment film 17 sandwich the liquid crystal layer 10. The second plane of the transparent substrate 12 of the array substrate 9 is located on the inner side of the liquid crystal display device 7.

The liquid crystal layer 10 may include liquid crystal molecules having negative dielectric anisotropy, and may also contain liquid crystal molecules having positive dielectric anisotropy.

In FIG. 4, the polarizing film, the retardation film, the backlight unit, and the like of the liquid crystal display device 7 may be omitted.

The liquid crystal display device 7 employs a liquid crystal driving method called IPS (In-Plane-Switching) or FFS (Fringe Field Switching), but can be applied, for example, to VA (Virtical Alignment), ECB (for example). Electrically Controlled Birefringence, OCB (Optically Compensated Bend), or TN (Twisted Nematic) and other modes and orientation modes.

The electrode structure of the display device substrate 6 and the array substrate 9 can be appropriately changed.

Here, a case where the display device substrate 1 is provided in place of the display device substrate 6 in the display device will be described.

The field sequential driving liquid crystal display device is provided, for example, to be provided The array substrate 9 in which the active elements are arranged and the liquid crystal panel in which the display device substrate 1 is bonded via the liquid crystal layer 10 are used. Further, the field sequential driving liquid crystal display device includes a backlight unit using LED elements of blue light emission, green light emission, and red light emission. Thereby, when the liquid crystal display device is provided with the display device substrate 1, it can be displayed in color.

The organic EL display device having the display device substrate 1 can be color-displayed, for example, when the array substrate 9 having the organic EL elements of the arrangement of the active elements and the blue, green, and red light-emitting elements and the display device substrate 1 are provided. .

The method of manufacturing the black matrix BM will be described below.

Fig. 5 is a flow chart showing an example of a method of manufacturing the black matrix BM of the embodiment. The exposure step included in the method of manufacturing the black matrix BM of the present embodiment is performed by using a mask having a negative pattern of one black matrix BM (the portion in which the black matrix is formed is transparent). The method of manufacturing the black matrix BM of the present embodiment includes a step of semi-curing the reflectance reducing layer by pre-exposure or preheating, as shown in FIG. 5 before the exposure step.

Specifically, the method for producing the black matrix BM according to the present embodiment includes the steps of applying the reflectance reducing layer 4 (first layer) (step ST1) and semi-hardening the reflectance reducing layer 4. (Step ST2), a step of applying the light shielding layer 5 (second layer) (step ST3), a step of drying the reflectance reducing layer 4 and the light shielding layer 5 (step ST4), and using a single mask to reflect The rate reduction layer 4 and the light shielding layer 5 are exposed (step ST5), and the reflectance reducing layer 4 and the light shielding layer 5 are developed once to form a black matrix BM on which the light shielding layer 5 is laminated on the reflectance reducing layer 4. The step of patterning (step ST6), the step of curing the reflectance reducing layer 4 and the light shielding layer 5, and forming a black matrix BM (step ST7).

Further, "semi-hardening the reflectance reducing layer 4" means that the reflectance reducing layer 4 and the light-shielding layer 5 can be developed once in the developing step of step ST6, and the degree of shape defects and residue can be prevented after development. The heat ray or light is irradiated on the reflectance reducing layer 4. For example, when the pre-exposure is not performed, the reflectance-reducing layer 4 formed by coating the interface between the transparent substrate 2 and the light-shielding layer 5 may be dissolved and absorbed in the layer of the light-shielding layer 5 in the coating step of the light-shielding layer 5. In this way, when the reflectance reducing layer 4 disappears, the reflectance of the surface of the black matrix BM is increased. However, when the reflectance reducing layer 4 is "semi-hardened" before application of the light shielding layer 5, the function of reducing the reflectance of the black matrix BM does not disappear. When the reflectance reducing layer 4 is "semi-hardened", it can be realized by applying a technique of applying the reflectance reducing layer 4 after heat application by heat such as heat rays, ultraviolet rays, electromagnetic waves, or heat conduction. If an excessive amount of heat rays, ultraviolet rays, electromagnetic waves, or heat is added, a residue may be generated in a subsequent development step or a pattern shape may be unsatisfactory. On the other hand, when the semi-hardening treatment is insufficient, as described above, the reflectance reducing layer 4 is dissolved and absorbed by the light shielding layer 5 when the light shielding layer 5 is applied, thereby increasing the reflectance of the black matrix BM.

For example, when the film thickness of the reflectance reducing layer 4 is about 0.9 μm or more, residue is likely to be generated in the developing step of the light shielding layer 5. Further, when the reflectance reducing layer 4 is thick, as shown in FIG. 6, the surface of the black matrix BM is likely to have a defective appearance such as a crepe which is not satisfactory.

6 is a production process in which the film thickness of the reflectance reducing layer 4 is on the surface of the black matrix BM of about 0.9 μm in the manufacturing step of the black matrix BM. An example of a photo taken with an optical microscope.

By using the display device substrates 1 and 6 of the present embodiment described above, the film has excellent light-shielding properties, and the reflectance measured by the transparent substrate 2 can be reduced, and the black matrix measured by the transparent substrate 2 can be used. The reflected color of the BM becomes neutral black.

The display device including the display device substrates 1 and 6 of the present embodiment can reduce the reflection of the screen, and can form an overall viscous plate and a black matrix BM, and can realize an uncolored intermediate display, and can obtain excellent display characteristics. And design.

The black matrix BM film of the present embodiment has a film thickness of about 1.5 μm or less, and can simultaneously achieve a high optical density of about 4.0 or more and a low reflectance of about 0.3% or less.

Further, the carbon concentration of the reflectance reducing layer in the interface between the glass and the reflectance reducing layer is low, and the film thickness of the reflectance reducing layer is also thin, so that the following effects can be obtained.

(1) The residue of the color material such as carbon on the transparent substrate can be reduced.

(2) The reproducibility of the formation of a black matrix having a finer pattern can be improved.

(3) The pattern shape of the desired black matrix can be obtained, and peeling can be suppressed.

In the following description, the effective optical density of the reflectance reducing layer 4 is described as, for example, OD0 (=effective optical density 0), ODa 0.35 (=effective optical density 0.35), and the like. The optical density OD per unit film thickness is attached as a unit of [/μm] (optical density per μm). Further, the effective optical density can be calculated by multiplying the optical density per unit film thickness by the film thickness of the reflectance reducing layer 4. Shading The effective optical density of layer 5 is described as ODb.

[Adjustment of Reflectance Reduction Member A] (Transparent Resin OD0/μm)

For about 20.35 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., 56.1% solid content), about 0.24 g of dipentaerythritol penta/hexaacrylate mixture was added (Japan) "KAYARAD DPHA" manufactured by Chemicals Co., Ltd., about 0.24 g of a photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about 77.07 g of propylene glycol monomethyl ether acetate, and sufficiently stirred to prepare a reflection of about 100 g. The rate reducing member (solid content is about 14.0%, optical density is about 0.0/μm).

[Adjustment of Reflectance Reduction Member B] (OD0.5/μm)

For about 18.42 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., 56.1% solid content), about 2.18 g of dipentaerythritol penta/hexaacrylate mixture was added (Japan) "KAYARAD DPHA" manufactured by Chemicals Co., Ltd., about 0.23 g of photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about 4.85 g of carbon black propylene glycol monomethyl ether acetate dispersion (solid content is about 26.0%, the pigment concentration in the solid content is about 75.0% by mass), about 74.33 g of propylene glycol monomethyl ether acetate, and after sufficiently stirring, about 100 g of the reflectance reducing member B (solid content of about 14.0%, carbon) is produced. The black pigment has a concentration of about 6.75 mass% and an optical density of about 0.5/μm).

[Adjustment of Reflectance Reduction Member C] (OD1.0/μm)

For about 16.48 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., the solid content is about 56.1%), about 2.02 g of dipentaerythritol penta/hexaacrylate mixture is added ( "KAYARAD DPHA" manufactured by Nippon Kayaku Co., Ltd., about 0.21g of photopolymerization initiator (ADEKA Manufactured "NCI-831"), about 9.69g of carbon black propylene glycol monomethyl ether acetate dispersion (solid content is about 26.0%, pigment concentration in solid content is about 75.0% by mass) and about 71.59g After propylene glycol monomethyl ether acetate was sufficiently stirred, about 100 g of a reflectance reducing member C (solid content of about 14.0%, carbon black pigment concentration of about 13.5 mass%, and optical density of about 1.0 / μm) was produced.

[Adjustment of Reflectance Reduction Member D] (OD1.7/μm)

For about 11.55 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., solid content is 56.1%), about 2.38 g of dipentaerythritol penta/hexaacrylate mixture is added (Japan) "KAYARAD DPHA" manufactured by Chemicals Co., Ltd., about 0.84 g of photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about 16.51 g of carbon black propylene glycol monomethyl ether acetate dispersion (solid content is about 26.0%, the pigment concentration in the solid portion is about 75.0% by mass) and about 68.71 g of propylene glycol monomethyl ether acetate, and after sufficiently stirring, about 100 g of the reflectance reducing member D (solid content of about 14.0%, carbon) is produced. The black pigment concentration was about 23% by mass and the optical density was about 1.7/μm).

[Adjustment of Reflectance Reduction Member H] (OD1.0/μm)

For about 14.49 g of an acrylic resin propylene glycol monomethyl ether acetate solution (solid content: about 20.0%), about 3.48 g of dipentaerythritol penta/hexaacrylate mixture ("M402" manufactured by Toagosei Co., Ltd.) was added. About 1.74 g of a photopolymerization initiator ("IRGACURE 379" manufactured by BASF Japan Co., Ltd.) and about 21.61 g of a propylene glycol monomethyl ether acetate dispersion of CI Pigment Red 254 (solid content is about 20.0%, in solid content) a pigment concentration of about 70.0% by weight), about 21.61 g of CI Pigment Blue 15:6 propylene glycol monomethyl ether acetate dispersion (solid content is about 20.0%, and the pigment concentration in the solid fraction is about 70.0% by weight), and about 37.07 g of propylene glycol monomethyl ether acetate. After the mixture was thoroughly stirred, about 100 g of the reflectance reducing member H was produced (solid content of about 22.0%, red pigment concentration of about 13.75 mass%, blue pigment concentration of about 13.75 mass%, and optical density of about 1.0/μm). ).

[Adjustment of shading member E] (OD3.8/μm)

For about 4.07 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., the solid content is about 56.1%), about 1.49 g of dipentaerythritol penta/hexaacrylate mixture is added ( "KAYARAD DPHA" manufactured by Nippon Kayaku Co., Ltd., about 0.53 g of photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about propylene glycol monomethyl ether acetate dispersion of about 37.33 g of carbon black (solid content) 26.0%, the pigment concentration in the solid portion was about 75.0% by mass) and about 56.59 g of propylene glycol monomethyl ether acetate, and after sufficiently stirring, about 100 g of the light-shielding member E (solid content of about 14.0%, carbon black) was produced. The pigment concentration was about 52% by mass and the optical density was about 3.8/μm).

[Adjustment of shading member F] (OD4.0/μm)

For about 3.55 g of bisphenolphthalein type epoxy resin ("V259-ME" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., the solid content is about 56.1%), about 1.42 g of dipentaerythritol penta/hexaacrylate mixture is added ( "KAYARAD DPHA" manufactured by Nippon Kayaku Co., Ltd., about 0.50 g of photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about 38.77 g of propylene glycol monomethyl ether acetate dispersion of carbon black (solid content) It is 26.0%, the pigment concentration in the solid content is about 75.0% by mass), and about 56.59 g of propylene glycol monomethyl ether acetate is sufficiently stirred to prepare about 100 g of the light-shielding member F (solid content is about 14.0%, carbon black). The pigment concentration was about 54% by mass and the optical density was about 4.0/μm).

[Adjustment of shading member G] (OD4.2/μm)

For about 2.90 g of bisphenolphthalein type epoxy resin ("V259-ME" solid fraction manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. is about 56.1%), about 1.35 g of dipentaerythritol penta/hexaacrylate mixture is added ( "KAYARAD DPHA" manufactured by Nippon Kayaku Co., Ltd., about 0.48 g of photopolymerization initiator ("NCI-831" manufactured by Adeka Co., Ltd.), and about 40.56 g of propylene glycol monomethyl ether acetate dispersion of carbon black (solid content) It is 26.0%, the pigment concentration in the solid content is about 75.0% by mass), and about 54.71 g of propylene glycol monomethyl ether acetate is sufficiently stirred to prepare about 100 g of the light-shielding member G (solid content is about 14.0%, carbon black). The pigment concentration was about 56.5 mass% and the optical density was about 4.2/μm).

[Example 1]

The reflectance reducing member B was formed by spin coating on a glass substrate ("EAGLE XG" manufactured by Corning Co., Ltd.). After drying, the substrate to be produced was pre-baked for about 1 minute on a hot plate at about 90 °C. At this time, the film thickness after pre-baking of the reflectance reducing member B was set to about 0.5 μm, and the number of rotations during coating was adjusted. Next, the entire coating film of the reflectance reducing layer 4 was irradiated with an ultraviolet light of about 40 mJ/cm ² using an ultrahigh pressure mercury lamp (illuminance of 26 mW/cm ² ) to pre-exposure. The pre-exposure system corresponds to a technique of "semi-hardening" the reflectance reducing layer 4. Next, a coating film of the light shielding member E is formed on the reflectance reducing layer 4 by a spin coating method. At this time, the film thickness was adjusted so that the optical density of the black matrix BM obtained after the hard film became about 4.5. Further, an imaging substrate was prepared and preheated by a hot plate at about 90 ° C for 30 seconds. Next, a two-layer film including the reflectance reducing layer 4 and the light shielding layer 5 was irradiated with an ultraviolet light of about 100 mJ/cm ² using an ultrahigh pressure mercury lamp (illuminance of about 26 mW/cm ² ) through a photomask having a pattern of a black matrix. Next, an imaging substrate was prepared and developed with an aqueous solution of sodium carbonate of about 2.5% by mass, and baked in a clean oven at about 230 ° C for 20 minutes to harden the film to form a film thickness of the reflectance reducing layer 4 and the light shielding layer 5. A black matrix BM of approximately 1.1 μm.

As shown in FIG. 1 described above, the acrylic resin film was cured by applying a thermosetting acrylic resin to a thickness of 1 μm to form a coating layer 3, and a substrate 1 for a display device was produced. The reflectance of the black matrix BM measured by the transparent substrate 2 of the glass was about 0.15% with a light wavelength of about 550 nm using a microscopic spectrometer. The film thickness of the coating layer 3 can be changed.

[Embodiment 2]

In the second embodiment, the reflectance reducing member 4 was applied by using the reflectance reducing member A so as to have a film thickness of about 0.3 μm. In the same manner as in the above-described first embodiment, the entire coating film of the reflectance reducing layer 4 was irradiated with ultraviolet light at about 40 mJ/cm ² to be pre-exposed. Next, the light shielding member E is coated on the reflectance reducing layer 4 via a spin coating method to form the light shielding layer 5. Hereinafter, in the same manner as in the above-described first embodiment, exposure, development, and curing of the film using a photomask were performed to form a black matrix BM. In the manner of coating the pattern of the black matrix BM, the film is cured by applying a thickness of 1 μm to the thermosetting acrylic resin to form the coating layer 3, and the substrate 1 for a display device is produced.

The reflectance of the black matrix BM measured by the transparent substrate 2 of the glass was about 0.22% at a light wavelength of about 550 nm using a microscopic spectrometer.

[Example 3]

In the third embodiment, the reflectance reducing member 4 was applied to form the reflectance reducing layer 4 so as to have a film thickness of about 0.3 μm. In the same manner as in the above-described first embodiment, the entire coating film of the reflectance reducing layer 4 was irradiated with ultraviolet light at about 40 mJ/cm ² to be pre-exposed. Next, the light shielding member E is coated on the reflectance reducing layer 4 by a spin coating method, and after the cured film is formed, the light shielding layer 5 is formed so as to have a film thickness of about 1.1 μm. Hereinafter, in the same manner as in the above-described first embodiment, exposure, development, and curing of the film using a photomask were performed to form a black matrix BM. In the manner of coating the pattern of the black matrix BM, the film is cured by applying a thickness of 1 μm to the thermosetting acrylic resin to form the coating layer 3, and the substrate 1 for a display device is produced.

The reflectance of the black matrix BM measured by the transparent substrate 2 of the glass was about 0.29% with a light wavelength of about 550 nm using a microscopic spectrometer.

[Examples 4 to 7]

In Examples 4 to 7, as shown in Table 1 below, the reflectance reducing members 4 were applied by using the reflectance reducing members A, B, C, and H at a film thickness of about 0.7 μm or a film thickness of about 0.4 μm. In the same manner as in the above-described first embodiment, the entire coating film of the reflectance reducing layer 4 was irradiated with ultraviolet light at about 40 mJ/cm ² to be pre-exposed. Next, the light shielding member E is coated on the reflectance reducing layer 4 by a spin coating method, and after the cured film is formed, the light shielding layer 5 is formed so as to have a film thickness of about 1.1 μm. Hereinafter, in the same manner as in the above-described first embodiment, exposure, development, and film hardening using a photomask were performed to form a black matrix BM. In the manner of coating the pattern of the black matrix BM, the film is cured by applying a thickness of 1 μm to the thermosetting acrylic resin to form the coating layer 3, and the substrate 1 for a display device is produced.

The reflectance of the black matrix BM measured by the transparent substrate 2 of the glass is a measuring apparatus using a microspectrophotometer, and the light wavelength is about 550 nm, which is about 0.18% in the fourth embodiment, and becomes the same in the fifth embodiment. It was about 0.14%, and it was about 0.30% in Example 6.

[Explanation of Examples 1 to 7 and Comparative Examples 1 to 6]

Tables 1 and 2 show a comparison between Examples 1 to 7 of the display device substrate 1 of the above-described embodiment and Comparative Examples 1 to 6 of the other display device substrates.

Table 3 shows the values of the chromaticities a* and b* of the CIE Lab color space display system measured by the transparent substrate 2 of the black matrix BM of the above-described Embodiments 1 to 3.

The chromaticity system of the two-layer black matrix BM, the value of a* and b* is about a small range of ±1.0, and it can be proved that there is no coloring neutral color.

Table 4 shows the reflectances measured for the transparent substrates 2 of the black matrix BM with light wavelengths of about 430 nm, 540 nm, and 620 nm for Examples 1 to 7, respectively.

In the measurement points of the above-mentioned light wavelengths of Examples 1 to 6, the reflectance is included in the range of about 0.05 or more and 0.3% or less. Therefore, it can be confirmed that the black matrix BM of the substrate 1 for a display device has a near-neutral reflection characteristic.

The description of Comparative Examples 1 to 6 is performed below.

In the comparative examples 1 to 4, as shown in the above Table 2, the reflectance reducing member C or the reflectance reducing member D having a relatively high carbon concentration was used. Further, the light shielding layer of Comparative Example 1 was formed using the light shielding member F. The forming step is the same as in the above-described Embodiment 1, and pre-exposure is performed after the coating step of the reflectance reducing layer.

In Comparative Examples 1 to 4, the carbon concentration contained in the reflectance reducing layer was high, and the effective optical density ODa was as high as about 0.5 or more, so that the reflectance of the black matrix became high. As shown in the above Table 2, in Comparative Examples 1 to 4, the reflectance of the black matrix exceeded about 0.4%, and the visibility of the display device was lowered.

[Comparative Example 5]

Comparative Example 5 was different from the curing conditions of the reflectance reducing layers of the above Examples 1 to 6 and Comparative Examples 1 to 4.

The reflectance-reducing layer of Comparative Example 5 was subjected to a hard coat treatment at 230 ° C to form a single layer.

In Comparative Example 5, a reflectance reducing member C was applied to the transparent substrate 2 so that the film thickness was about 0.5 μm. The reflectance reducing film has a calculation of optical density ODa of about 0.5. Further, after the reflectance-reducing film was dried, it was subjected to a hard coat treatment at 230 ° C to form a reflectance-reducing layer. On the reflectance-reducing layer, a light-shielding layer having an optical density ODb of 4.18 was laminated with a light-shielding member E, dried, exposed, and developed to perform a hard coat treatment to form a pattern of a black matrix.

The reflectance of the black matrix of Comparative Example 5 was as high as 0.58 at a wavelength of 540 nm when measured by the transparent substrate 2. Further, when the black matrix was visually observed on the display surface of the transparent substrate 2, significant color unevenness which was considered to be an interference color was observed, and good results could not be obtained.

[Comparative Example 6]

In Comparative Example 6, unlike the above-described Examples 1 to 6 and Comparative Examples 1 to 5, the semi-hardening treatment of the reflectance-reducing layer was omitted, and the reflectance-reducing layer was dried only after application, and laminated directly on the reflectance-reducing layer. A method of manufacturing a light shielding layer.

In Comparative Example 6, the reflectance reducing member C was applied onto the transparent substrate 2 so that the film thickness became about 0.4 μm. The optical density ODa is calculated to be about 0.4. The reflectance reducing layer is shielded after being coated and dried The light-shielding member E is applied so that the optical density ODb of the member E is about 4.18. Further drying, exposure, development, and hard coat treatment are performed to pattern the black matrix.

When the black matrix was measured for reflectance by a microspectrophotometer, it had an extremely high reflectance of about 2.0% at a light wavelength of about 550 nm. When the black moment was observed by the naked eye on the display surface of the transparent substrate 2, the color unevenness observed in Comparative Example 5 was not produced.

As a result of the comparative example 6, when the semi-hardening treatment of the reflectance-reducing layer is omitted, the reflectance-reducing layer is dissolved and absorbed by the light-shielding layer, and the reflectance of the black matrix is the reflectance of the light-shielding layer having a high carbon concentration.

[Conditions for semi-hardening treatment]

The semi-hardening treatment of the reflectance reducing layer 4 can be achieved by heat treatment such as a hot plate or an infrared drying device as described above. However, in the case of using electromagnetic waves such as ultraviolet rays, the semi-hardening treatment can be performed in a short time. The semi-hardening treatment (pre-exposure) using a light source is as follows.

For example, a coating method such as load coating, spin coating, slit coating, or roll coating is applied to the transparent substrate 2 to form a coating film of the reflectance reducing layer 4.

The coating film of the reflectance reducing layer 4 is subjected to, for example, drying under reduced pressure or pre-baking treatment, and the solvent remaining in the coating film is removed, and then the coating film is uniformly exposed uniformly. As the exposure light source, for example, a conventionally known light source such as an ultrahigh pressure mercury lamp, a xenon lamp, or a carbon arc lamp is used. The exposure amount at this time is, for example, an exposure amount of about 15 to 40% when the exposure amount (hereinafter referred to as "saturated exposure amount") which does not reduce the film thickness by the development processing is 100%.

In the exposure amount of about 15% or less of the saturated exposure amount In the case of the exposure by the light-shielding member, the coating film of the reflectance-reducing layer is eluted and mixed with the solvent contained in the light-shielding member, and the carbon concentration in the portion where the interface with the transparent substrate is formed is increased, and as a result, the reflectance of the black matrix is obtained. Becomes high. When the exposure is performed at an exposure amount of about 40% or more of the saturated exposure amount, the reflectance-reducing film is excessively cured, and the reflectance-reducing film is not sufficiently dissolved and remains on the transparent substrate during the development treatment, and as a result, residue is generated. The situation.

Fig. 7 is a graph showing the relationship between the amount of pre-exposure of the coating conditions in Example 1, Example 3, and Example 5 and the reflectance of the black matrix BM.

When the pre-exposure amount is about 20 mJ/cm ² or less, the reflectance tends to be high, and when the pre-exposure amount is about 80 mJ/cm ² or more, a residue tends to occur, which is not preferable. However, the amount of pre-exposure system, for example, about ² or more nearby 60mJ / cm ² or less 40mJ / cm, can be stable, the black matrix BM is formed of a low reflectance.

Further, the present invention is not limited to the semi-hardening treatment conditions and the exposure method of Fig. 7, and it is understood that the semi-hardening treatment conditions exist in an appropriate range.

Fig. 8 shows the measurement results of the data of the extinction coefficients of the blue filter BF, the green filter GF, and the red filter RF constituting the color filter. The measurement of Fig. 8 uses an elliptical spectral polarimeter to measure the extinction coefficient of the filter at each wavelength. The colors of the blue filter BF, the green filter GF, and the red filter RF have different values of the extinction coefficient depending on the wavelength of the light. For example, it can be understood that at the interface between the glass and the black matrix, the blue filter BF, the green filter GF, and the red filter are inserted. The configuration of any of the RFs, as shown in Fig. 8, is colored by reflected light.

[Materials that can be used in the substrates 1 and 6 for display devices]

(Photosensitive resin composition)

The black matrix BM is formed using two kinds of photosensitive resin compositions having different optical densities. As described above, the photosensitive resin composition having a low optical density is used as a "light-reflecting member" as a "reflectance reducing member" and a photosensitive resin composition having a high optical density. The reflectance reducing member and the light blocking member are each a photosensitive resin composition containing at least a resin, a polymerizable monomer, a photopolymerization initiator, and a solvent, and the film thickness of the black matrix in the light shielding member is about 1 μm. A black pigment is added in an optical density of about 2.5 or more.

(resin)

The resin is an alkyl acrylate or an alkyl methacrylate such as acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate or butyl methacrylate. A resin having a molecular weight of from 5,000 to 100,000 which is synthesized by using three to five kinds of monomers in the form of acrylic acid or cyclohexyl methacrylate, acrylic acid or hydroxyethyl methacrylate, styrene or the like is suitable.

Further, a part of the acrylic resin is added with a resin having an unsaturated double bond, and the acrylic resin, a compound having an isocyanate group and at least one vinyl isocyanate ethyl acrylate or methacryl oxime isocyanate is reacted. A photosensitive copolymer having an acid value of 50 to 150 is suitable from the viewpoints of heat resistance and developability.

Moreover, bisphenol A type epoxy resin and bisphenol F type can also be used. Epoxy resin, novolak type epoxy resin, polyglycidyl carboxylic acid glycidyl ester, polyglycidyl ester of polyhydric alcohol, aliphatic or alicyclic epoxy resin, amine epoxy resin, trisphenol methane epoxy resin, A general photopolymerizable resin such as a (meth)acrylic acid epoxy ester obtained by reacting an epoxy resin such as a benzenediol-type epoxy resin with (meth)acrylic acid, or a cardo resin.

(polymerizable monomer)

As the photopolymerizable single system, for example, ethylene glycol (meth) acrylate, diethylene glycol di(meth) acrylate, propylene glycol di(meth) acrylate, dipropylene glycol di(meth) acrylate can be used. , polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, hexane di(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerol di(methyl) Acrylate, tris(meth)acrylate, glycerol tetra(meth)acrylate, tetrakis-trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, new Pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc., these components may be used singly or as a mixture. Further, as the photopolymerizable monomer, various modified (meth) acrylates, amine esters (meth) acrylates, and the like can be used. For example, as a photopolymerizable monomer, neopentyltetrakis(meth)acrylate, dipentaerythritol penta(meth)acrylate, dioxonane, which has a small double bond equivalent and can achieve high sensitivity, can also be used. Tetraol hexa(meth) acrylate.

The content of the photopolymerizable monomer is preferably from about 5 to 20% by weight, more preferably from 10 to 15% by weight, based on the solid content of the photosensitive resin composition. When the content of the photopolymerizable monomer is within this range, the sensitivity and development speed of the photosensitive resin composition can be adjusted to an appropriate production. level. When the content of the photopolymerizable monomer is about 5% by weight or less, the sensitivity of the black photosensitive resin composition will be insufficient.

(photopolymerization initiator)

As the photopolymerization initiator, a conventionally known compound can be suitably used, and when it is used in a black photosensitive resin composition which is opaque to light, it is preferred to use an oxime ester compound which can attain high sensitivity.

Specific examples of the oxime ester compound can be, for example, 2-(O-benzylidene fluorenyl)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-( O-Ethyl hydrazide)-1-[9-ethyl-6-(2-methylbenzylidene)-9H-indazol-3-yl]ethanone (all manufactured by BASF Japan Co., Ltd.) and the like.

The content of the photopolymerization initiator is preferably from about 0.5 to 10.0% by weight, more preferably from about 1.0 to 5.0% by weight, based on the solid content of the photosensitive resin composition. When the content of the photopolymerization initiator is 1% by weight or less, the sensitivity of the photosensitive resin composition will be insufficient. On the other hand, when the content of the photopolymerization initiator is about 10% by weight or more, the pattern line width of the black matrix is too wide.

In the photosensitive resin composition used in the embodiment of the present invention, in addition to the above photopolymerization initiator, other photopolymerization initiators may be used in combination. Other photopolymerization initiators can be used, for example, 4-phenoxydichloroacetophenone, 4-tert-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-iso Propyl phenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl benzophenone, 2-methyl-[4-(methylthio)phenyl]-2- Lolinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4- An acetophenone compound such as phenylphenyl)-butane-1-; a benzoin compound such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl dimethyl ketal; benzophenone, Benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, benzoated benzophenone, 4-benzylidene-4'-methyldiphenyl a benzophenone compound such as thioether or 3,3',4,4'-tetrakis(t-butylperoxycarbonyl)benzophenone; thioxanthone, 2-chlorothiazepinone, 2- a thioxanthone compound such as methyl thioxanthone, isopropyl thioxanthone, 2,4-diisopropyl thioxanthone or 2,4-diethyl thioxanthone; 2, 4 ,6-trichloro-s-three 2-phenyl-4,6-bis(trichloromethyl)-s-three , 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-three , 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-three , 2-piperidin-4,6-bis(trichloromethyl)-s-three 2,4-bis(trichloromethyl)-6-styryl-s-three , 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-three , 2-(4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)-s-three 2,4-trichloromethyl-(piperidinyl)-6-three 2,4-trichloromethyl (4'-methoxystyryl)-6-three Wait three a compound; a bisphosphonium compound such as bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide or 2,4,6-trimethylbenzhydryldiphenylphosphine oxide; An anthraquinone compound such as 10-phenanthrenequinone, camphorquinone or ethylhydrazine; a borate compound; an oxazole compound; an imidazole compound; a titanocene compound. These photopolymerization initiators can be used singly or in combination of two or more kinds at any ratio as needed. The content of the other photopolymerization initiator is preferably from 0.1 to 1% by weight, more preferably from 0.2 to 0.5% by weight, based on the solid content of the photosensitive resin composition.

(solvent)

The solvent can be used, for example, methanol, ethanol, ceceux, beta succinate, diglyme, cyclohexanone, ethylbenzene, xylene, isoamyl acetate, amyl acetate, propylene glycol. Monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, diethylene glycol Alcohol, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol Monobutyl ether acetate, triethylene glycol, triethylene glycol monomethyl ether, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether, triethylene glycol monoethyl ether acetate, liquid polymerization Ethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monoethyl ether acetate, lactate, ethyl ethoxy propionate and the like.

(black color material)

The black color material used in the embodiment of the present invention is preferably, for example, carbon black (also referred to as carbon in the embodiment of the present invention). As the carbon black system, for example, soot, acetylene black, hot carbon black, channel black, furnace black, or the like can be used.

(organic pigment)

Red pigments used in the formation of red pixels can be used, for example, CI Pigment Red 7, 9, 14, 41, 48:1, 48:2, 48:3, 48:4, 81:1, 81:2, 81 :3,97,122,123,146,149,168,177,178,179,180,184,185,187,192,200,202,208,210,215,216,217,220,223,224 , 226, 227, 228, 240, 246, 254, 255, 264, 272, 279, and the like. Further, in order to adjust the hue of the red pixel, a yellow pigment or an orange pigment may be used in combination.

For the yellow pigment, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119 , 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166 , 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, and the like.

As the orange pigment, for example, C.I. Pigment Orange 36, 43, 51, 55, 59, 61, 71, 73 and the like can be used.

As the green pigment for forming green pixels, for example, C.I. Pigment Green 7, 10, 36, 37, 58, and the like can be used. In order to adjust the hue of the green pixel, a yellow pigment can also be used. As the yellow pigment, a pigment exemplified as a yellow pigment which can be used in combination to adjust the hue of the red pixel can be suitably used.

For the blue pigment forming blue pixel, for example, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 60, 64 and the like can be used. In order to adjust the hue of the blue pixel, a purple pigment can also be used. Specific examples of the purple pigment may be C.I. Pigment Violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50 and the like.

The above embodiments and examples are applicable to various modifications without departing from the spirit and scope of the invention. The above embodiments and the respective embodiments can be used in combination.

1‧‧‧Display device substrate

2‧‧‧Transparent substrate

3‧‧‧ coating

4‧‧‧Reflectance reduction layer

5‧‧‧Lighting layer

BM‧‧‧ Black Matrix

Claims (11)

A substrate for a display device comprising: a transparent substrate; and a layer of a reflective layer having a film thickness of about 0.1 μm or more and 0.7 μm or less and a carbon material as a main material of the light-shielding color material; a black matrix formed by the light shielding layer, wherein the film thickness is multiplied by an optical density per unit film thickness to obtain an effective optical density of the reflectance reducing layer in a range of about 0 or more and 0.4 or less, and the black color measured by the transparent substrate The reflectance of the matrix is in the range of about 0.05% or more and 0.3% or less based on the reflectance of the aluminum film. The substrate for a display device according to the first aspect of the invention, wherein the reflectance of the black matrix measured by the transparent substrate is about 0.05% or more and 0.3% or less when the light wavelength is about 430 nm, 540 nm, or 620 nm, respectively. The scope. The substrate for a display device according to claim 1 or 2, wherein the reflectance reducing layer is a transparent resin layer. The substrate for a display device according to claim 1 or 2, wherein the reflectance reducing layer contains at least a carbon translucent resin layer. The substrate for a display device according to the first or second aspect of the invention, wherein the reflectance reducing layer is a translucent resin layer of an organic pigment having at least two types of subtractive color mixing. The substrate for a display device according to claim 1 or 2, wherein the black matrix has a plurality of pixel openings, and a blue filter, a green filter, and a red filter are respectively disposed in the pixel opening. The pixel pattern of the light sheet. A method for manufacturing a substrate for a display device, which is on a transparent substrate Coating the first layer of the reflectance reducing layer, and semi-curing the first layer, and coating the second layer as the light shielding layer on the first layer, and using the photomask to make the first layer and the second layer In one exposure, a black matrix in which the light shielding layer is laminated is formed on the reflectance reducing layer by the first layer and the second layer formed on the transparent substrate by one development. The method for producing a substrate for a display device according to claim 7, wherein the reflectance reducing layer is the transparent resin layer or the translucent resin layer. The method for producing a substrate for a display device according to claim 8, wherein the translucent resin layer contains carbon. The method for producing a substrate for a display device according to claim 7, wherein the reflectance reducing layer is a translucent resin layer containing at least two types of organic pigments having a subtractive color mixing relationship. A display device is provided with a substrate for a display device according to any one of claims 1 to 6.