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TW201441051A - Gasbarrier film and producing method thereof - Google Patents

Gasbarrier film and producing method thereof Download PDF

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Publication number
TW201441051A
TW201441051A TW103110448A TW103110448A TW201441051A TW 201441051 A TW201441051 A TW 201441051A TW 103110448 A TW103110448 A TW 103110448A TW 103110448 A TW103110448 A TW 103110448A TW 201441051 A TW201441051 A TW 201441051A
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group
layer
inorganic
organic layer
gas barrier
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TW103110448A
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Chinese (zh)
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Yuka Watanabe
Yuji Nakatsugawa
Masakazu Kandori
Ai Okano
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Dainippon Printing Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00Layered products having a non-planar shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • H01L31/049Protective back sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/724Permeability to gases, adsorption
    • B32B2307/7242Non-permeable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Photovoltaic Devices (AREA)

Abstract

An object of the present invention is to provide a gasbarrier film having higher gasbarrier properties and a producing method of the gasbarrier film. The present invention attains the object by providing a gasbarrier film 10 comprising: a substrate 1, an inorganic layer 2 provided on the substrate 1, and an organic layer 3 provided on the inorganic layer 2, wherein the organic layer 3 is formed by inorganic particles having a polymerization reactive group on its surface. At that time, the polymerization reactive group preferably contains one or two or more reactive groups selected from the group consisting of an acrylic group, an epoxy group, a vinyl group, an allyl group, an isocyanate group, and a silanol group. This gasbarrier film 10 can be produced by a method comprising steps of: forming a film by a dry system in which the inorganic layer 2 is formed on the substrate 1; and curing an organic layer-forming composition, containing at least inorganic particles which has a polymerization reactive group on their surfaces, to form the organic layer 3 on the inorganic layer 2.

Description

阻氣性薄膜及其製造方法 Gas barrier film and method of producing the same

本發明係關於一種具有較高之水蒸氣阻隔性及氧氣阻隔性之阻氣性薄膜及其製造方法、以及具備該阻氣性薄膜之裝置。 The present invention relates to a gas barrier film having a high water vapor barrier property and oxygen barrier property, a method for producing the same, and a device comprising the gas barrier film.

阻氣性薄膜被較佳地應用於有機電致發光元件(有機EL元件)、液晶顯示元件、薄膜電晶體、太陽電池、觸控面板、電子紙等裝置以防止使其等之性能劣化之氧氣或水蒸氣等化學成分之穿透。作為習知之阻氣性薄膜,有於塑膠基材上設置氧化鋁或氧化矽等之無機層而成者、於塑膠基材上設置有機層之後設置無機層而成者(例如專利文獻1)、於塑膠基材上設置無機層之後設置有機層而成者(例如專利文獻2)等。 The gas barrier film is preferably applied to an organic electroluminescence device (organic EL device), a liquid crystal display device, a thin film transistor, a solar cell, a touch panel, an electronic paper, or the like to prevent deterioration of oxygen such as performance. Or the penetration of chemical components such as water vapor. As a gas barrier film of the prior art, an inorganic layer such as alumina or yttrium oxide is provided on a plastic substrate, and an inorganic layer is provided after the organic layer is provided on the plastic substrate (for example, Patent Document 1). After the inorganic layer is provided on the plastic substrate, an organic layer is provided (for example, Patent Document 2).

專利文獻1中所提出之阻氣性薄膜係設置可使密接性與平坦性提高之有機層作為阻氣性無機層之底層者,具體而言,於基材之至少一面依序積層有包含聚丙烯酸系樹脂之固定塗層、藉由紫外線或電子束進行反應使其硬化而成之包含(甲基)丙烯酸系樹脂之硬塗層、及包含無機化合物之阻隔性薄膜層。 The gas barrier film proposed in Patent Document 1 is provided with an organic layer having improved adhesion and flatness as a bottom layer of the gas barrier inorganic layer, and specifically, a layered layer is formed on at least one side of the substrate. A hard coat layer containing a (meth)acrylic resin and a barrier film layer containing an inorganic compound, which are obtained by curing a fixed coating of an acrylic resin and curing it by ultraviolet rays or electron beams.

又,專利文獻2中所提出之阻氣性薄膜係於最表面設置有機層而提高耐彎折性或耐損傷性者,具體而言為如下者:於基材上設置對包含聚矽氮烷之層進行處理而形成之至少1層之含有矽原子及氧原子之阻隔層,進而於該阻隔層上,利用溶膠凝膠法設置具有無機 奈米粒子之保護層。 Further, the gas barrier film proposed in Patent Document 2 is one in which an organic layer is provided on the outermost surface to improve bending resistance or damage resistance, and specifically, a pair of polyazulidine is provided on a substrate. a barrier layer containing at least one layer containing a ruthenium atom and an oxygen atom formed by the treatment, and further provided on the barrier layer by a sol-gel method to have an inorganic layer The protective layer of nano particles.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2010-105321號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-105321

[專利文獻2]日本專利特開2011-73417號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2011-73417

關於上述各種阻氣性薄膜,尤其是隨著近年來電子設備之高性能化與高品質化,與上述專利文獻1、2等中所提出之阻氣性薄膜相比,要求更高之阻氣性與生產性。 In the above-mentioned various gas barrier films, in particular, in recent years, higher performance and higher quality of electronic devices are required, and higher gas barrier properties are required as compared with the gas barrier films proposed in Patent Documents 1 and 2 and the like. Sex and productive.

本發明係解決上述問題者,其目的在於提供一種具有更高之阻氣性之阻氣性薄膜及其製造方法。又,本發明之另一目的在於提供一種由該阻氣性薄膜所形成之包裝容器及具備該阻氣性薄膜之裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a gas barrier film having a higher gas barrier property and a method for producing the same. Further, another object of the present invention is to provide a packaging container formed of the gas barrier film and an apparatus including the gas barrier film.

(1)用以解決上述問題之本發明之阻氣性薄膜之特徵在於:其包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 (1) The gas barrier film of the present invention for solving the above problems is characterized in that it comprises a substrate, an inorganic layer provided on the substrate, and an organic layer provided on the inorganic layer, and the organic layer It is formed of inorganic particles having a polymerizable reactive group on the surface.

於本發明之阻氣性薄膜中,較佳為上述聚合反應性基為選自丙烯醯基、環氧基、乙烯基、烯丙基、異氰酸酯基及矽烷醇基中之1種或2種以上之反應性基。 In the gas barrier film of the present invention, the polymerization reactive group is preferably one or more selected from the group consisting of an acryloyl group, an epoxy group, a vinyl group, an allyl group, an isocyanate group, and a stanol group. Reactive group.

(2)用以解決上述問題之本發明之包裝容器之特徵在於:其係由阻氣性薄膜所形成,該阻氣性薄膜包含基材、設置於該基 材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 (2) A packaging container according to the present invention for solving the above problems is characterized in that it is formed of a gas barrier film comprising a substrate and disposed on the substrate An inorganic layer on the material and an organic layer provided on the inorganic layer, and the organic layer is formed of inorganic particles having a polymerization reactive group on the surface.

(3)用以解決上述問題之本發明之顯示裝置之特徵在於:其具備阻氣性薄膜,該阻氣性薄膜包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 (3) A display device according to the present invention for solving the above problems, comprising: a gas barrier film comprising a substrate, an inorganic layer provided on the substrate, and an inorganic layer disposed on the inorganic layer The organic layer is formed, and the organic layer is formed of inorganic particles having a polymerizable reactive group on the surface.

用以解決上述問題之本發明之發電裝置之特徵在於:其具備阻氣性薄膜,該阻氣性薄膜包含基材、設置於該基材上之無機層、設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 A power generating device according to the present invention for solving the above problems is characterized in that it has a gas barrier film comprising a substrate, an inorganic layer provided on the substrate, and an organic layer provided on the inorganic layer. And the above organic layer is formed of inorganic particles having a polymerization reactive group on the surface.

(4)用以解決上述問題之本發明之阻氣性薄膜之製造方法之特徵在於:包括於基材上乾式成膜形成無機層之步驟、及於上述無機層上成膜有機層之步驟,且於上述有機層之成膜步驟中,使至少含有表面具有聚合反應性基之無機粒子之有機層形成用組成物硬化而成膜該有機層。 (4) A method for producing a gas barrier film of the present invention for solving the above problems, comprising the steps of: forming a inorganic layer by dry film formation on a substrate, and forming an organic layer on the inorganic layer; In the film formation step of the organic layer, the organic layer forming composition is cured by at least an inorganic layer-forming composition containing at least a polymerizable reactive group on the surface.

於本發明之阻氣性薄膜之製造方法中,較佳為前聚合反應性基為選自丙烯醯基、環氧基、乙烯基、烯丙基、異氰酸酯基及矽烷醇基中之1種或2種以上之反應性基。 In the method for producing a gas barrier film of the present invention, it is preferred that the prepolymerization reactive group is one selected from the group consisting of an acryloyl group, an epoxy group, a vinyl group, an allyl group, an isocyanate group, and a stanol group. Two or more reactive groups.

於本發明之阻氣性薄膜之製造方法中,較佳為上述乾式成膜為化學氣相沈積法或物理氣相沈積法。 In the method for producing a gas barrier film of the present invention, it is preferred that the dry film formation is a chemical vapor deposition method or a physical vapor deposition method.

根據本發明,可提供一種具有更高之阻氣性之阻氣性薄膜及其製造方法。 According to the present invention, it is possible to provide a gas barrier film having a higher gas barrier property and a method for producing the same.

1‧‧‧基材 1‧‧‧Substrate

2、2'、2a、2b‧‧‧無機層 2, 2', 2a, 2b‧‧‧ inorganic layer

3、3'‧‧‧有機層 3, 3'‧‧‧ organic layer

4‧‧‧底塗層 4‧‧‧Undercoat

10、10A、10B、10C、10D‧‧‧阻氣性薄膜 10, 10A, 10B, 10C, 10D‧‧‧ gas barrier film

S1‧‧‧基材之一面 One side of S1‧‧‧ substrate

S2‧‧‧基材之另一面 The other side of the S2‧‧‧ substrate

S3‧‧‧阻氣性薄膜之表面 Surface of S3‧‧‧ gas barrier film

S4‧‧‧阻氣性薄膜之另一表面 The other surface of the S4‧‧‧ gas barrier film

圖1係表示本發明之阻氣性薄膜之一例的示意性剖面圖。 Fig. 1 is a schematic cross-sectional view showing an example of a gas barrier film of the present invention.

圖2係表示本發明之阻氣性薄膜之另一例的示意性剖面圖。 Fig. 2 is a schematic cross-sectional view showing another example of the gas barrier film of the present invention.

圖3係表示本發明之阻氣性薄膜之又一例的示意性剖面圖。 Fig. 3 is a schematic cross-sectional view showing still another example of the gas barrier film of the present invention.

圖4係表示本發明之阻氣性薄膜之又一例的示意性剖面圖。 Fig. 4 is a schematic cross-sectional view showing still another example of the gas barrier film of the present invention.

以下,對本發明之實施形態進行詳細說明。本發明並不限定於以下之實施形態,可於其主旨之範圍內進行各種變形而實施。 Hereinafter, embodiments of the present invention will be described in detail. The present invention is not limited to the embodiments described below, and various modifications can be made without departing from the spirit and scope of the invention.

[阻氣性薄膜及其製造方法] [Gas barrier film and method of producing the same]

如圖1~圖4所示,本發明之阻氣性薄膜10包含基材1、設置於基材1上之無機層2、及設置於無機層2上之有機層3。並且,該有機層3係由表面具有聚合反應性基之無機粒子所形成。 As shown in FIGS. 1 to 4, the gas barrier film 10 of the present invention comprises a substrate 1, an inorganic layer 2 provided on the substrate 1, and an organic layer 3 provided on the inorganic layer 2. Further, the organic layer 3 is formed of inorganic particles having a polymerization reactive group on the surface.

此種阻氣性薄膜10係藉由如下方法製造,該方法包括以下步驟:於基材1上乾式成膜形成至少1層無機層2之步驟;及於無機層2上,使含有硬化性樹脂及表面具有聚合反應性基之無機粒子的有機層形成用組成物硬化而成膜有機層3之步驟。乾式成膜較佳為化學氣相沈積法(CVD法)或物理氣相沈積法(PVD法)。 The gas barrier film 10 is produced by a method comprising the steps of: dry forming a film on the substrate 1 to form at least one inorganic layer 2; and on the inorganic layer 2, containing a curable resin. The organic layer forming composition of the inorganic particles having a polymerization reactive group on the surface thereof is cured to form the film organic layer 3. The dry film formation is preferably a chemical vapor deposition method (CVD method) or a physical vapor deposition method (PVD method).

再者,如圖1所示,無機層2與有機層3依序設置於基材1之一面S1,亦可如圖2所示,使無機層2(2a、2b)為2層以上。又,亦可如圖3所示,分別於基材1之兩面S1、S2依序設置無機層2、2'及有機層3、3'。又,只要於一面S1設置有無機層2及有機層3,則於另一面S2可如圖1所示般既不設置無機層亦不設置有機層,又,亦可僅設置無機層2及有機層3之任一者。又,可如圖4所示,於基材1 與無機層2之間設置底塗層4,雖未圖示,但亦可於另一面S2之基材與無機層或有機層之間設置底塗層。 Further, as shown in FIG. 1, the inorganic layer 2 and the organic layer 3 are sequentially provided on one surface S1 of the substrate 1, and as shown in FIG. 2, the inorganic layer 2 (2a, 2b) may be two or more layers. Further, as shown in FIG. 3, the inorganic layers 2, 2' and the organic layers 3, 3' may be sequentially provided on both surfaces S1, S2 of the substrate 1. Further, if the inorganic layer 2 and the organic layer 3 are provided on one surface S1, the inorganic layer 2 and the organic layer may be provided on the other surface S2 as shown in Fig. 1, or only the inorganic layer 2 and the organic layer may be provided. Any of the layers 3. Also, as shown in FIG. 4, on the substrate 1 The undercoat layer 4 is provided between the inorganic layer 2 and the inorganic layer 2, although not shown, an undercoat layer may be provided between the substrate of the other surface S2 and the inorganic layer or the organic layer.

以下,對阻氣性薄膜之構成進行說明,並且一併對製造方法亦進行說明。 Hereinafter, the configuration of the gas barrier film will be described, and the manufacturing method will also be described.

<基材> <Substrate>

基材1只要為可形成無機層2之薄膜,則並無特別限定,就實際使用之觀點而言,可舉出包含聚酯系樹脂、烯烴系樹脂、聚碳酸酯樹脂及纖維素系樹脂等之基材1。作為聚酯系樹脂,例如可舉出:聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、該等之共聚合體、及聚對苯二甲酸環己二甲酯(PCT)等。於聚酯系樹脂之中,較佳為聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、及該等之共聚合體,尤佳為聚萘二甲酸乙二酯及聚對苯二甲酸乙二酯。作為烯烴系樹脂,可舉出降烯系聚合物、環戊烯系聚合物、環丁烯系聚合物等,其中,可較佳地舉出降烯系聚合物。 The base material 1 is not particularly limited as long as it is a film that can form the inorganic layer 2, and examples thereof include a polyester resin, an olefin resin, a polycarbonate resin, a cellulose resin, and the like. Substrate 1. Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), and copolymerization of the polyester resins. Fit, and poly(cyclohexanedimethylene terephthalate (PCT), etc. Among the polyester resins, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the like, and especially the polyethylene naphthalate are preferred. Ester and polyethylene terephthalate. As the olefin resin, a drop can be mentioned. An olefin polymer, a cyclopentene polymer, a cyclobutene polymer, etc., among which, a An olefinic polymer.

於應用聚酯系樹脂作為基材1之材質之情形時,可為其全部為聚酯系樹脂之基材1,亦可為於形成無機層2側之面至少形成有聚酯系樹脂層之積層型基材1。於該積層型基材1中,除形成無機層2側之聚酯系樹脂層以外之層可並非聚酯系樹脂層。作為除聚酯系樹脂層以外之層,可選擇考慮到柔軟性、強度、耐熱性、熱膨脹或光穿透性等之各種樹脂層。 When the polyester resin is used as the material of the substrate 1, the substrate 1 may be all of the polyester resin, or at least the polyester resin layer may be formed on the surface on which the inorganic layer 2 is formed. Laminated substrate 1. In the laminated substrate 1 , the layer other than the polyester resin layer on the side of the inorganic layer 2 may not be a polyester resin layer. As the layer other than the polyester resin layer, various resin layers in consideration of flexibility, strength, heat resistance, thermal expansion, light transmittance, and the like can be selected.

基材1之厚度並無特別限定,較佳為10μm以上且500μm以下之程度。基材1有時根據其厚度而被稱為基材薄膜或基材片材。又,基材1之透明性並無特別限定,可根據其用途任意選擇。於 進一步要求透明性之情形時,全光線穿透率較佳為80%以上。再者,全光線穿透率係表示一般之薄膜之透明性之數值,利用依據JIS-K-7105或JIS-K-7361之方法進行測定,具體而言係以藉由霧度計進行測定所得之全部光量所表示。基材1可視需要含有著色劑,亦可含有抗氧化劑或紫外線吸收劑等。又,經單軸延伸或雙軸延伸之薄膜由於透明性及機械強度均較高,故而較佳。其中,聚對苯二甲酸乙二酯之雙軸延伸薄膜就耐熱性、機械強度、光穿透性及成本等方面而言較佳。 The thickness of the substrate 1 is not particularly limited, but is preferably about 10 μm or more and 500 μm or less. The substrate 1 is sometimes referred to as a base film or a substrate sheet depending on its thickness. Further, the transparency of the substrate 1 is not particularly limited, and may be arbitrarily selected depending on the use thereof. to When the transparency is further required, the total light transmittance is preferably 80% or more. Further, the total light transmittance is a value indicating the transparency of a general film, and is measured by a method according to JIS-K-7105 or JIS-K-7361, specifically, by a haze meter. It is expressed by the total amount of light. The base material 1 may contain a coloring agent as needed, and may contain an antioxidant, an ultraviolet absorber, or the like. Further, a film which is uniaxially stretched or biaxially stretched is preferred because it has high transparency and mechanical strength. Among them, the biaxially stretched film of polyethylene terephthalate is preferable in terms of heat resistance, mechanical strength, light transmittance, and cost.

此種基材1可藉由購買市售品而準備,亦可藉由自行製造而準備。作為基材1之製造方法,可應用先前公知之製造方法,例如可舉出溶液流延法、熔融擠出法、壓延法等。 Such a substrate 1 can be prepared by purchasing a commercially available product, or can be prepared by itself. As a method of producing the substrate 1, a conventionally known production method can be applied, and examples thereof include a solution casting method, a melt extrusion method, and a calendering method.

為了提高與無機層2之密接性、或與視需要設置之底塗層4(參照圖4)之密接性,基材1之表面較佳為視需要進行表面處理。作為表面處理,可舉出:氧化處理、凹凸化處理(粗面化處理)、易接著塗佈處理等。作為氧化處理,例如可舉出:電暈放電處理、電漿處理、輝光放電處理、鉻酸處理(濕式)、火焰處理、熱風處理、臭氧紫外線照射處理等。作為凹凸化處理(粗面化處理),例如可舉出噴砂法、溶劑處理法等。該等表面處理係根據基材1之種類而選擇,一般而言,就效果及操作性等方面而言,最好使用電暈放電處理法。 In order to improve the adhesion to the inorganic layer 2 or the adhesion to the undercoat layer 4 (see FIG. 4) as needed, the surface of the substrate 1 is preferably subjected to surface treatment as needed. Examples of the surface treatment include oxidation treatment, unevenness treatment (roughening treatment), and easy adhesion coating treatment. Examples of the oxidation treatment include corona discharge treatment, plasma treatment, glow discharge treatment, chromic acid treatment (wet), flame treatment, hot air treatment, and ozone ultraviolet irradiation treatment. Examples of the roughening treatment (roughening treatment) include a sand blast method, a solvent treatment method, and the like. These surface treatments are selected depending on the type of the substrate 1. In general, it is preferable to use a corona discharge treatment method in terms of effects and workability.

(底塗層) (primer coating)

底塗層4為任意之層,如圖4所示,可視需要於設置無機層2側之基材1上設置。該底塗層4係以提高與無機層2之間之密接性而發揮作用。底塗層4並無特別限定,可將一般之積層薄膜中所使用之底塗層用樹脂組成物塗佈於基材1上,並使其硬化而形成。 The undercoat layer 4 is an arbitrary layer, and as shown in FIG. 4, it may be provided on the substrate 1 on the side where the inorganic layer 2 is provided as needed. The undercoat layer 4 functions to improve the adhesion to the inorganic layer 2 . The undercoat layer 4 is not particularly limited, and a resin composition for an undercoat layer used in a general laminated film can be applied onto a substrate 1 and cured.

作為構成底塗層4之樹脂材料,例如較佳可舉出:丙烯酸系樹脂、氯乙烯-乙酸乙烯酯共聚合體、聚醯胺樹脂、聚酯樹脂、氯化聚丙烯、氯化橡膠、胺基甲酸乙酯樹脂、環氧樹脂、苯乙烯樹脂等熱融黏性樹脂。底塗層4包含該等樹脂中之1種或2種以上之樹脂,就提高耐候性之方面而言,尤佳為丙烯酸系樹脂單體。可視需要使用交聯劑,例如可舉出三聚氰胺系交聯劑或環氧系交聯劑等。 Examples of the resin material constituting the undercoat layer 4 include an acrylic resin, a vinyl chloride-vinyl acetate copolymer, a polyamide resin, a polyester resin, a chlorinated polypropylene, a chlorinated rubber, and an amine group. A hot melt adhesive resin such as ethyl formate resin, epoxy resin or styrene resin. The undercoat layer 4 contains one or two or more kinds of resins of these resins, and is preferably an acrylic resin monomer in terms of improving weather resistance. A crosslinking agent can be used as needed, for example, a melamine-based crosslinking agent or an epoxy-based crosslinking agent.

底塗層4之厚度通常為1μm以上且25μm以下之範圍,較佳為3μm以上且20μm以下之範圍。若厚度為1μm以上,則可獲得充分之接著性,若厚度為25μm以下,則經濟上較佳。底塗層4亦可視需要含有各種添加劑。例如可含有光穩定劑或紫外線吸收劑之一者或兩者,亦可含有其他添加劑。 The thickness of the undercoat layer 4 is usually in the range of 1 μm or more and 25 μm or less, preferably in the range of 3 μm or more and 20 μm or less. When the thickness is 1 μm or more, sufficient adhesion can be obtained, and when the thickness is 25 μm or less, it is economically preferable. The undercoat layer 4 may also contain various additives as needed. For example, one or both of a light stabilizer or an ultraviolet absorber may be contained, and other additives may be contained.

<無機層> <Inorganic layer>

無機層2係於基材1上或視需要設置之底塗層4上,藉由乾式成膜沈積無機層用材料(無機層之形成材料)而形成。該無機層2作為將水蒸氣或氧氣等氣體阻斷之阻氣層發揮功能。因此,該無機層2可稱為具有阻氣性之「氣體屏蔽無機化合物層」,只要為具有阻氣性之各種無機化合物層,則可作為無機層2而設置。 The inorganic layer 2 is formed on the substrate 1 or, if necessary, on the undercoat layer 4, by depositing a material for forming an inorganic layer (a material for forming an inorganic layer) by dry film formation. The inorganic layer 2 functions as a gas barrier layer that blocks a gas such as water vapor or oxygen. Therefore, the inorganic layer 2 can be referred to as a "gas barrier inorganic compound layer" having gas barrier properties, and can be provided as the inorganic layer 2 as long as it is a gas barrier property of various inorganic compound layers.

無機層2只要係由可形成阻氣層之先前公知之各種無機化合物所形成即可,作為此種無機化合物,例如可舉出選自無機氧化物、無機氮氧化物、無機氮化物、無機碳氧化物、無機碳氮氧化物、及氧化矽鋅等中之1種或2種以上之無機化合物。具體而言,可舉出含有選自矽、鋁、鎂、鈦、錫、銦、鈰、及鋅中之1種或2種以上之元素之無機化合物,更具體而言,可舉出:矽氧化物、鋁氧化物、鎂 氧化物、鈦氧化物、錫氧化物、矽鋅合金氧化物及銦合金氧化物等無機氧化物;矽氮化物、鋁氮化物、及鈦氮化物等無機氮化物;氮氧化矽等無機氮矽氧化物。尤佳為無機層2為包含選自氧化矽、氮化矽、氮氧化矽、及氧化矽鋅中之1種或2種以上之層。無機層2可單獨使用上述材料,亦可於本發明主旨之範圍內將上述材料以任意比例混合而使用。 The inorganic layer 2 may be formed of various conventionally known inorganic compounds which can form a gas barrier layer, and examples of such an inorganic compound include inorganic oxides, inorganic nitrogen oxides, inorganic nitrides, and inorganic carbons. One or two or more inorganic compounds of an oxide, an inorganic oxycarbonitride, and cerium oxide oxide. Specifically, an inorganic compound containing one or two or more elements selected from the group consisting of ruthenium, aluminum, magnesium, titanium, tin, indium, antimony, and zinc may be mentioned, and more specifically, 矽Oxide, aluminum oxide, magnesium Inorganic oxides such as oxides, titanium oxides, tin oxides, antimony-zinc alloy oxides and indium alloy oxides; inorganic nitrides such as niobium nitrides, aluminum nitrides, and titanium nitrides; inorganic nitrogens such as niobium oxynitride Oxide. In particular, the inorganic layer 2 is a layer containing one or more selected from the group consisting of cerium oxide, cerium nitride, cerium oxynitride, and cerium oxide. The above-mentioned materials may be used singly in the inorganic layer 2, and the above materials may be used in an arbitrary ratio within the scope of the gist of the present invention.

無機層2係藉由乾式成膜而形成。作為乾式成膜,可舉出物理氣相沈積(Physical Vapor Deposition,PVD)法或化學氣相沈積(Chemical Vapor Deposition,CVD)法。 The inorganic layer 2 is formed by dry film formation. Examples of the dry film formation include a physical vapor deposition (PVD) method or a chemical vapor deposition (CVD) method.

PVD法係使用固體原料作為原料,並利用熱或電漿之能量使其氣化,而於被成膜基材上薄膜化之方法。例如可舉出:真空蒸鍍法、電子束蒸鍍法、反應性蒸鍍法、離子鍍著法、輝光放電濺鍍法、離子束濺鍍法、反應性濺鍍法等。又,CVD法係對原料氣體施加熱、光或電磁波等能量進行激發或分解,並經由在被成膜基材之表面之吸附、反應及解離而沈積膜之方法。例如可舉出:熱CVD法、有機金屬氣相沈積(MOCVD)法、射頻(RF,Radio Frequency)電漿CVD法、電子耦合共振(ECR,Electron Coupling Resonance)電漿CVD法、光CVD法、雷射CVD法、水銀增感法等。 The PVD method is a method in which a solid raw material is used as a raw material and is vaporized by heat of a heat or plasma to form a film on a film-forming substrate. For example, a vacuum vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a glow discharge sputtering method, an ion beam sputtering method, a reactive sputtering method, and the like can be given. Further, the CVD method is a method in which energy such as heat, light, or electromagnetic waves is excited or decomposed by a material gas, and a film is deposited by adsorption, reaction, and dissociation on the surface of a film-forming substrate. For example, a thermal CVD method, an organic metal vapor deposition (MOCVD) method, a radio frequency (RF) radio frequency plasma CVD method, an electron coupling resonance (ECR) electro-electrochemical CVD method, a photo CVD method, Laser CVD method, mercury sensitization method, and the like.

更具體而言,可利用如下方法:(1)將無機氧化物、無機氮化物、無機氮氧化物、或金屬等原料加熱蒸鍍於基材上之真空蒸鍍法;(2)向原料中導入氧氣使其氧化,蒸鍍於基材上之氧化反應性蒸鍍法;(3)藉由向靶原料中導入氬氣、氧氣進行濺鍍而沈積於基材上之濺鍍法;(4)利用由電漿槍所產生之電漿束對原料進行加熱,而蒸鍍於基材上之離子鍍著法;(5)將有機矽化合物等作為原料,於基材上蒸鍍氧 化矽膜之電漿CVD法等。於該等無機層2之形成方法中,尤其就無機層2與有機層3之密接性及蒸鍍速度之方面而言,尤佳為離子鍍著法或電漿CVD。 More specifically, the following method can be used: (1) a vacuum evaporation method in which a raw material such as an inorganic oxide, an inorganic nitride, an inorganic nitrogen oxide, or a metal is heated and vapor-deposited on a substrate; (2) in a raw material a oxidative reactive vapor deposition method in which oxygen is introduced to oxidize and vapor-deposited on a substrate; (3) a sputtering method in which argon gas and oxygen gas are introduced into the target material to deposit on the substrate; (4) An ion plating method in which a raw material is heated by a plasma beam generated by a plasma gun and evaporated on a substrate; (5) an organic germanium compound or the like is used as a raw material, and oxygen is vapor-deposited on the substrate. Plasma CVD method for ruthenium film. Among the methods for forming the inorganic layer 2, in particular, the adhesion between the inorganic layer 2 and the organic layer 3 and the vapor deposition rate are particularly preferably ion plating or plasma CVD.

無機層2之厚度亦根據所使用之無機化合物而異,通常為5nm以上且5000nm以下。就阻氣性之觀點而言,較佳為10nm以上,又,就抑制龜裂等之產生之觀點而言,較佳為500nm以下。又,無機層2可為1層,亦可為合計厚度成為上述範圍內之2層以上之無機層2(2a、2b)。於2層以上之無機層2之情形時,可將相同材料彼此組合,亦可將不同材料彼此組合。 The thickness of the inorganic layer 2 varies depending on the inorganic compound to be used, and is usually 5 nm or more and 5000 nm or less. From the viewpoint of gas barrier properties, it is preferably 10 nm or more, and from the viewpoint of suppressing generation of cracks or the like, it is preferably 500 nm or less. Further, the inorganic layer 2 may be one layer, or may be an inorganic layer 2 (2a, 2b) having a total thickness of two or more layers within the above range. In the case of the inorganic layer 2 of 2 or more layers, the same materials may be combined with each other, or different materials may be combined with each other.

<有機層> <organic layer>

有機層3係於無機層2上由表面具有聚合反應性基之無機粒子所形成之層。有機層3亦可僅由表面具有聚合反應性基之無機粒子形成,亦可由包含表面具有聚合反應性基之無機粒子及硬化性樹脂之組成物形成。 The organic layer 3 is a layer formed on the inorganic layer 2 by inorganic particles having a polymerization reactive group on the surface. The organic layer 3 may be formed only of inorganic particles having a polymerization reactive group on the surface, or may be formed of a composition containing inorganic particles having a polymerization reactive group on the surface and a curable resin.

(無機粒子) (inorganic particles)

無機粒子於表面具有聚合反應性基。作為無機粒子之構成材料,可舉出:氧化矽、氧化鋁、氧化鈦、氧化鋯、氧化鋅、氧化鎢、氧化鈮、氧化鉬、氧化鎳等。其中,就光學特性、密接性之觀點而言,較佳為氧化矽。 The inorganic particles have a polymerization reactive group on the surface. Examples of the constituent material of the inorganic particles include cerium oxide, aluminum oxide, titanium oxide, zirconium oxide, zinc oxide, tungsten oxide, cerium oxide, molybdenum oxide, and nickel oxide. Among them, from the viewpoint of optical properties and adhesion, cerium oxide is preferred.

作為聚合反應性基,較佳為構成下述熱硬化性樹脂或電離放射線硬化性樹脂之單體、低聚物或預聚物。此種於表面具有聚合反應性基之無機粒子係藉由熱或電離放射線進行聚合而硬化,從而形 成有機層3。作為聚合反應性基,可舉出丙烯醯基、環氧基、乙烯基、烯丙基、異氰酸酯基及矽烷醇基等。作為較佳之聚合反應性基,可舉出丙烯醯基或環氧基等。尤佳為表面具有利用電子束進行硬化之聚合反應性基之無機粒子,此種聚合反應性基藉由電子束照射進行反應而硬化,藉此,其有機成分成為更緻密之三維交聯構造體,而成膜無機粒子彼此緻密存在之有機層3。 The polymerization reactive group is preferably a monomer, oligomer or prepolymer which constitutes the following thermosetting resin or ionizing radiation curable resin. Such inorganic particles having a polymerizable reactive group on the surface are hardened by polymerization by heat or ionizing radiation, thereby forming Into the organic layer 3. Examples of the polymerization reactive group include an acrylonitrile group, an epoxy group, a vinyl group, an allyl group, an isocyanate group, and a stanol group. The preferred polymerization reactive group may, for example, be an acrylonitrile group or an epoxy group. In particular, inorganic particles having a polymerizable reactive group which is hardened by an electron beam are used, and such a polymerizable reactive group is hardened by reaction by electron beam irradiation, whereby the organic component becomes a dense three-dimensional crosslinked structure. The organic layer 3 in which the film-forming inorganic particles are densely adhered to each other.

表面具有聚合反應性基之無機粒子之平均粒徑較佳為10nm以上且400nm以下,更佳為10nm以上且250nm以下。就光學特性(透明性)、及填埋無機層之間隙而提高阻隔性之方面而言,該範圍內之無機粒子較有效果。若無機粒子之平均粒徑未達10nm,則存在粒子彼此凝聚而塗膜白化之情形,若超過400nm,則存在有機層3白化之情形。 The average particle diameter of the inorganic particles having a polymerization reactive group on the surface is preferably 10 nm or more and 400 nm or less, more preferably 10 nm or more and 250 nm or less. The inorganic particles in this range are more effective in terms of optical properties (transparency) and filling of the gap between the inorganic layers to improve the barrier properties. When the average particle diameter of the inorganic particles is less than 10 nm, the particles may be agglomerated and the coating film may be whitened. When the average particle diameter exceeds 400 nm, the organic layer 3 may be whitened.

可認為藉由利用此種無機粒子而於無機層2上形成有機層3,該有機層3藉由源自聚合反應性基之樹脂成分之硬化反應而收縮,無機層2亦藉由該有機層3之收縮而收縮,從而變得緻密,其結果阻氣性提高。又,可認為有機層3中所含有之無機粒子會發揮對有機層3加以強化之固定(anchor)作用、及進入無機層2之龜裂或缺陷等之作用中之任一者或兩者,認為其結果提高阻氣性。 It is considered that the organic layer 3 is formed on the inorganic layer 2 by using such inorganic particles, and the organic layer 3 is shrunk by a hardening reaction of a resin component derived from a polymerization reactive group, and the inorganic layer 2 is also passed through the organic layer. The contraction of 3 shrinks and becomes dense, and as a result, the gas barrier property is improved. In addition, it is considered that the inorganic particles contained in the organic layer 3 exhibit either an anchoring effect of strengthening the organic layer 3 or an effect of causing cracks or defects into the inorganic layer 2, or both. It is considered that the result is improved in gas barrier properties.

存在於無機粒子之表面之聚合反應性基之種類例如可藉由X射線光電子光譜法或傅立葉變換紅外光譜法而容易地進行特定。例如可特定出聚合反應性基為丙烯醯基或環氧基等。 The kind of the polymerization reactive group present on the surface of the inorganic particles can be easily specified by, for example, X-ray photoelectron spectroscopy or Fourier transform infrared spectroscopy. For example, the polymerization reactive group may be specifically an acryloyl group or an epoxy group.

表面具有聚合反應性基之無機粒子可藉由如下方式製作:利用金屬錯合物等前驅物之聚合反應,合成膠體分散狀之奈米粒子,並將表面之配位基取代為聚合反應性基。此種無機粒子一般於市 場上銷售,例如可舉出JSR股份有限公司製造之Opstar(商品名)、或日產化學工業股份有限公司製造之有機矽溶膠等。於無機粒子之表面對聚合反應性基進行化學改質,該經化學改質之聚合反應性基之厚度例如為1nm以上且10nm之範圍內。 The inorganic particles having a polymerizable reactive group on the surface can be produced by synthesizing a colloid-dispersed nanoparticle by a polymerization reaction of a precursor such as a metal complex, and substituting a ligand on the surface for a polymerization reactive group. . Such inorganic particles are generally found in the city For example, Opstar (trade name) manufactured by JSR Co., Ltd., or organic cerium sol manufactured by Nissan Chemical Industries Co., Ltd., etc., may be mentioned. The polymerization reactive group is chemically modified on the surface of the inorganic particles, and the thickness of the chemically modified polymerization reactive group is, for example, in the range of 1 nm or more and 10 nm.

(硬化性樹脂) (curable resin)

硬化性樹脂可與上述無機粒子一併構成有機層形成用組成物。即,於有機層3中,除含上述聚合反應性基以外,亦可含有硬化性樹脂。作為硬化性樹脂,可使用熱硬化性樹脂或電離放射線硬化性樹脂。所謂電離放射線,係指除了電子束及紫外線之外,為可見光線、X射線、γ射線等電磁波、α射線等帶電粒子束;所謂電離放射線硬化性樹脂,係指藉由照射電離放射線而進行交聯從而硬化之樹脂。 The curable resin can constitute a composition for forming an organic layer together with the above inorganic particles. In other words, the organic layer 3 may contain a curable resin in addition to the above-mentioned polymerization reactive group. As the curable resin, a thermosetting resin or an ionizing radiation curable resin can be used. The ionizing radiation is a charged particle beam such as an electromagnetic wave such as a visible light beam, an X-ray or a gamma ray, or an α-ray, in addition to an electron beam and an ultraviolet ray. The ionizing radiation-curable resin is obtained by irradiating an ionizing radiation. A resin that is hardened together.

作為熱硬化性樹脂,例如可舉出:環氧樹脂、酚系樹脂、脲樹脂、不飽和聚酯樹脂、三聚氰胺樹脂、醇酸樹脂、聚醯亞胺樹脂、聚矽氧樹脂、羥基官能性丙烯酸系樹脂、羧基官能性丙烯酸系樹脂、醯胺官能性共聚合體、胺基甲酸乙酯樹脂等,該等可使用1種或2種以上。作為該等樹脂之交聯硬化之態樣,例如環氧樹脂可藉由與胺、酸觸媒、羧酸、酸酐、羥基、雙氰胺或酮亞胺之反應而促進交聯硬化;酚系樹脂可藉由鹼觸媒與過量之醛之反應而促進交聯硬化;脲樹脂可藉由鹼性或酸性下之聚縮合反應而促進交聯硬化;不飽和聚酯樹脂可藉由順丁烯二酸酐與二醇之共縮合反應而促進交聯硬化;三聚氰胺樹脂可藉由羥甲基三聚氰胺之加熱聚縮合反應而促進交聯硬化;醇酸樹脂可藉由導入至側鏈等之不飽和基彼此之空氣氧化反應而促進交聯硬化;聚醯亞胺樹脂可藉由酸或弱鹼觸媒之存在下之反應、或者藉由與 異氰酸酯化合物之反應(二液型之情形)而促進交聯硬化;聚矽氧樹脂可藉由矽烷醇基於酸觸媒之存在下之縮合反應而促進交聯硬化;羥基官能性丙烯酸系樹脂可藉由羥基與本身所具有之胺基樹脂之反應(一液型之情形)而促進交聯硬化;羧基官能性丙烯酸系樹脂可藉由丙烯酸或甲基丙烯酸等羧酸與環氧化合物之反應而促進交聯硬化;醯胺官能性共聚合體可藉由與羥基之反應或自縮合反應而促進交聯硬化;胺基甲酸乙酯樹脂可藉由含有羥基之聚酯樹脂、聚醚樹脂、丙烯酸系樹脂等樹脂與異氰酸酯化合物或其改質物之反應而促進交聯硬化。通常使用利用該等反應之交聯劑或硬化劑。 Examples of the thermosetting resin include an epoxy resin, a phenol resin, a urea resin, an unsaturated polyester resin, a melamine resin, an alkyd resin, a polyimide resin, a polyoxyxylene resin, and a hydroxyl functional acrylic acid. The resin, the carboxyl functional acrylic resin, the guanamine functional copolymer, the urethane resin, and the like may be used alone or in combination of two or more. As a cross-linking hardening of the resins, for example, an epoxy resin can promote cross-linking hardening by reaction with an amine, an acid catalyst, a carboxylic acid, an acid anhydride, a hydroxyl group, a dicyandiamide or a ketimine; The resin can promote cross-linking hardening by the reaction of an alkali catalyst with an excess of aldehyde; the urea resin can promote cross-linking hardening by a polycondensation reaction under basic or acidic; the unsaturated polyester resin can be quenched by The co-condensation reaction of the dianhydride with the diol promotes cross-linking hardening; the melamine resin can promote cross-linking hardening by heating polycondensation reaction of methylol melamine; the alkyd resin can be introduced into the unsaturated group such as a side chain Promoting cross-linking hardening by mutual oxidation of air; polyimine resin can be reacted by the presence of acid or weak base catalyst, or by The reaction of the isocyanate compound (in the case of the two-liquid type) promotes cross-linking hardening; the polyoxynoxy resin can promote cross-linking hardening by the condensation reaction of stanol in the presence of an acid catalyst; the hydroxy-functional acrylic resin can be borrowed Promoting cross-linking hardening by reaction of a hydroxyl group with an amine-based resin (in the case of a one-liquid type); a carboxyl-functional acrylic resin can be promoted by a reaction of a carboxylic acid such as acrylic acid or methacrylic acid with an epoxy compound Cross-linking hardening; the guanamine functional copolymer can promote cross-linking hardening by reaction with a hydroxyl group or self-condensation reaction; the urethane resin can be obtained by a polyester resin containing a hydroxyl group, a polyether resin, an acrylic resin The reaction of the resin with an isocyanate compound or a modified substance thereof promotes crosslinking hardening. Crosslinking agents or hardeners that utilize such reactions are typically employed.

作為電離放射線硬化性樹脂,最好使用利用電子束進行硬化之電子束硬化性樹脂、或利用紫外線進行硬化之紫外線硬化性樹脂。 As the ionizing radiation curable resin, an electron beam curable resin which is cured by an electron beam or an ultraviolet curable resin which is cured by ultraviolet rays is preferably used.

作為電子束硬化性樹脂,可使用選自一般用作電子束硬化性樹脂之各種聚合性低聚物及預聚物中之1種或2種以上。作為聚合性低聚物及預聚物,可舉出分子中具有自由基聚合性不飽和基之低聚物或預聚物,例如較佳可舉出:環氧(甲基)丙烯酸酯系、(甲基)丙烯酸胺基甲酸乙酯系、(甲基)丙烯酸聚醚胺基甲酸乙酯系、(甲基)丙烯酸己內酯胺基甲酸乙酯系、聚酯(甲基)丙烯酸酯系、聚醚(甲基)丙烯酸酯系等之低聚物或預聚物等,該等可使用1種或2種以上。於該等之中,就成本或生產性之觀點而言,較佳為聚碳酸酯系丙烯酸胺基甲酸乙酯或聚酯系丙烯酸胺基甲酸乙酯等胺基甲酸乙酯-丙烯酸共聚合體樹脂。再者,此處,所謂「(甲基)丙烯酸酯」意指「丙烯酸酯或甲基丙烯酸酯」。就無需特別使用溶劑等之方面而言,較佳為電子束硬化性樹脂。 As the electron beam curable resin, one or two or more kinds selected from various polymerizable oligomers and prepolymers which are generally used as an electron beam curable resin can be used. Examples of the polymerizable oligomer and the prepolymer include an oligomer or a prepolymer having a radical polymerizable unsaturated group in the molecule, and for example, an epoxy (meth)acrylate system is preferably used. (meth)acrylic acid ethyl methacrylate, (meth)acrylic acid polyether urethane type, (meth)acrylic acid caprolactone ethyl methacrylate type, polyester (meth) acrylate type An oligomer or a prepolymer such as a polyether (meth) acrylate or the like may be used alone or in combination of two or more. Among these, from the viewpoint of cost or productivity, a urethane-acrylic acid copolymer resin such as polycarbonate urethane acrylate or polyester urethane acrylate is preferred. . Here, "(meth)acrylate" means "acrylate or methacrylate". The electron beam curable resin is preferred in that it does not require the use of a solvent or the like.

可與多官能性(甲基)丙烯酸胺基甲酸乙酯一併使用(甲 基)丙烯酸甲酯等單官能性(甲基)丙烯酸酯。單官能性(甲基)丙烯酸酯可作為調整其黏度之稀釋劑等,於無損本發明目的之範圍內併用。單官能性(甲基)丙烯酸酯可單獨使用1種,可組合使用2種以上,亦可併用低分子量之多官能性(甲基)丙烯酸酯。 Can be used together with polyfunctional ethyl (meth) acrylate (A) Monofunctional (meth) acrylate such as methyl acrylate. The monofunctional (meth) acrylate can be used as a diluent for adjusting the viscosity and the like, and can be used together without departing from the object of the present invention. The monofunctional (meth) acrylate may be used singly or in combination of two or more kinds, and a polyfunctional (meth) acrylate having a low molecular weight may be used in combination.

作為紫外線硬化性樹脂,例如可舉出藉由紫外線之照射而可交聯聚合之自由基聚合性樹脂。例如可舉出選自具有丙烯酸酯基、乙烯基、烯丙基、異丙烯基等自由基聚合性不飽和基之單體(Monomer)、低聚物及預聚物中之1種或2種以上。作為此種低聚物及預聚物,例如可舉出選自丙烯酸胺基甲酸乙酯、環氧丙烯酸酯、聚酯丙烯酸酯、聚醚丙烯酸酯、聚乙烯丙烯酸酯、聚丁二烯丙烯酸酯、聚矽氧丙烯酸酯及多元醇丙烯酸酯等中之1種或2種以上。 The ultraviolet curable resin is, for example, a radical polymerizable resin which is crosslinkable and polymerizable by irradiation of ultraviolet rays. For example, one or two kinds of monomers (oliomers), oligomers, and prepolymers selected from a radical polymerizable unsaturated group such as an acrylate group, a vinyl group, an allyl group, or an isopropenyl group may be mentioned. the above. Examples of such oligomers and prepolymers include ethyl amide acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, polyethylene acrylate, and polybutadiene acrylate. One or more of polyoxy acrylate and polyol acrylate.

作為具有自由基聚合性不飽和基之單體,可舉出單官能單體及多官能單體。作為單官能單體並無特別限定,例如可舉出:N-乙烯基吡咯啶酮、N-乙烯基己內酯、乙烯基咪唑、乙烯基吡啶、苯乙烯等乙烯系單體;丙烯酸苯氧基乙酯、丙烯酸月桂酯、丙烯酸硬脂酯、丙烯酸丁氧基乙酯、甲氧基聚乙二醇丙烯酸酯、丙烯酸四氫糠酯、丙烯酸異酯、丙烯酸異辛酯、丙烯酸環己酯、丙烯酸苄酯、N,N-二甲基丙烯醯胺、丙烯酸N,N-二甲基胺基丙酯、丙烯醯基啉等丙烯酸酯單體;及丙烯醯胺衍生物。作為多官能單體,可舉出:季戊四醇三丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、三丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、聚四亞甲基二醇二丙烯酸酯、丁二醇二丙烯酸酯、己二醇二丙烯酸酯、壬二醇二丙烯酸酯、戊二醇二丙烯酸酯、新戊二醇二丙烯酸酯、二羥甲基-三環癸烷二丙烯酸酯、二季戊四醇五丙烯酸酯、及二季 戊四醇六丙烯酸酯等、及該等之環氧乙烷改質物、環氧丙烷改質物、及己內酯改質物等。單體可使用1種,亦可混合使用2種以上。又,亦可為上述單體鍵結而生成之低聚物或預聚物。此種單體、低聚物及預聚物可根據所要求之性能或工業生產性等,單獨使用任一種,或混合使用任兩種,或者將各者之1種或2種以上加以適當組合而使用。 Examples of the monomer having a radical polymerizable unsaturated group include a monofunctional monomer and a polyfunctional monomer. The monofunctional monomer is not particularly limited, and examples thereof include a vinyl monomer such as N-vinylpyrrolidone, N-vinylcaprolactone, vinylimidazole, vinylpyridine or styrene; Ethyl ethyl ester, lauryl acrylate, stearyl acrylate, butoxyethyl acrylate, methoxy polyethylene glycol acrylate, tetrahydrofurfuryl acrylate, acrylic acid Ester, isooctyl acrylate, cyclohexyl acrylate, benzyl acrylate, N,N-dimethyl decylamine, N,N-dimethylaminopropyl acrylate, propylene fluorenyl An acrylate monomer such as a phenyl group; and a acrylamide derivative. Examples of the polyfunctional monomer include pentaerythritol triacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, and tripropylene glycol diacrylic acid. Ester, polypropylene glycol diacrylate, polytetramethylene glycol diacrylate, butanediol diacrylate, hexanediol diacrylate, decanediol diacrylate, pentanediol diacrylate, neopentyl Alcohol diacrylate, dimethylol-tricyclodecane diacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and the like, and the ethylene oxide modified product, propylene oxide modified product, and Caprolactone modification and the like. One type of the monomers may be used alone or two or more types may be used in combination. Further, it may be an oligomer or a prepolymer which is formed by bonding the above monomers. The monomer, the oligomer, and the prepolymer may be used singly or in combination according to the required performance or industrial productivity, or one or two or more of them may be appropriately combined. And use.

再者,於本發明中,為了調整其黏度等而可於無損本發明目的之範圍內與上述單體、低聚物及預聚物一併適當使用如(甲基)丙烯酸甲酯等單官能性(甲基)丙烯酸酯之稀釋劑。單官能性(甲基)丙烯酸酯可單獨使用1種,可組合使用2種以上,亦可併用低分子量之多官能性(甲基)丙烯酸酯。又,作為稀釋劑,亦可使用上述單體,而確保樹脂組成物之塗佈性。再者,所謂「(甲基)丙烯酸酯」意指「丙烯酸酯或甲基丙烯酸酯」。 Further, in the present invention, in order to adjust the viscosity and the like, a monofunctional group such as methyl (meth) acrylate may be suitably used together with the above monomers, oligomers and prepolymers within the range which does not impair the object of the present invention. A diluent for a (meth) acrylate. The monofunctional (meth) acrylate may be used singly or in combination of two or more kinds, and a polyfunctional (meth) acrylate having a low molecular weight may be used in combination. Further, as the diluent, the above monomer can also be used to ensure the coatability of the resin composition. In addition, "(meth)acrylate" means "acrylate or methacrylate."

紫外線硬化性樹脂含有光聚合起始劑。作為光聚合起始劑並無特別限定,例如可舉出苯乙酮系化合物及醯基氧化膦系化合物等。作為苯乙酮系化合物,例如可舉出:苯乙酮、羥基苯乙酮、胺基苯乙酮、1-羥基環己基苯基酮、低聚[2-羥基-2-甲基-1-{4-(1-甲基乙烯基)苯基}丙酮]、2-甲基-1-(4-甲基噻吩基)-2-啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-啉基苯基)-丁酮-1等,作為醯基氧化膦系化合物,可舉出:雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦等。光聚合起始劑可使用1種,亦可併用2種以上。又,關於光聚合起始劑之摻合量,相對於用以形成有機層3之紫外線硬化性樹脂組成物之總量,較佳為0.1質量%以上且5質量%以下。再者,作為光聚合起始劑之定量方法,例如可利用氣相層析質譜法求出。 The ultraviolet curable resin contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited, and examples thereof include an acetophenone-based compound and a mercaptophosphine oxide-based compound. Examples of the acetophenone-based compound include acetophenone, hydroxyacetophenone, aminoacetophenone, 1-hydroxycyclohexyl phenyl ketone, and oligomeric [2-hydroxy-2-methyl-1- {4-(1-methylvinyl)phenyl}acetone], 2-methyl-1-(4-methylthienyl)-2- Lolinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4- Examples of the fluorenyl phosphine oxide-based compound include bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide and the like. One type of the photopolymerization initiator may be used, or two or more types may be used in combination. In addition, the blending amount of the photopolymerization initiator is preferably 0.1% by mass or more and 5% by mass or less based on the total amount of the ultraviolet curable resin composition for forming the organic layer 3. Further, the quantitative method of the photopolymerization initiator can be determined, for example, by gas chromatography mass spectrometry.

關於有機層3中所含有之硬化性樹脂,與上述聚合反應 性基同樣,其種類例如亦可藉由X射線光電子光譜法或傅立葉變換紅外光譜法而容易地進行特定。 Regarding the curable resin contained in the organic layer 3, the above polymerization reaction Similarly, the type can be easily specified by, for example, X-ray photoelectron spectroscopy or Fourier transform infrared spectroscopy.

於有機層3含有無機粒子及硬化性樹脂之情形時,有機層3中之無機粒子較佳為13質量%以上。若有機層3中之無機粒子未達13質量%,則存在無法充分地獲得由存在該無機粒子所得之阻氣性之效果之情況。再者,於有機層3中無機粒子之上限並無特別限制,亦可為不含硬化性樹脂而僅將無機粒子之表面之聚合反應性基作為有機成分而形成之有機層3。 When the organic layer 3 contains inorganic particles and a curable resin, the inorganic particles in the organic layer 3 are preferably 13% by mass or more. When the inorganic particles in the organic layer 3 are less than 13% by mass, the effect of the gas barrier properties obtained by the presence of the inorganic particles may not be sufficiently obtained. In addition, the upper limit of the inorganic particles in the organic layer 3 is not particularly limited, and the organic layer 3 may be formed by using only a polymerizable reactive group on the surface of the inorganic particles as an organic component, which does not contain a curable resin.

(其他成分) (other ingredients)

於用以形成有機層3之熱硬化性樹脂組成物或電子束硬化性樹脂組成物中,亦可含有光穩定劑或紫外線吸收劑等耐候劑。 The thermosetting resin composition or the electron beam curable resin composition for forming the organic layer 3 may contain a weathering agent such as a light stabilizer or an ultraviolet absorber.

光穩定劑於藉由紫外線之作用而產生自由基之情形時,可捕獲該自由基而使其惰性化,可抑制有機層3之光氧化劣化之進行。光穩定劑只要為發揮此種效果者,則並無特別限定。作為光穩定劑,例如較佳為受阻胺系光穩定劑(HALS),於產生會引起氧化反應之自由基之情形時,可以觸媒形式捕捉該自由基,而使其穩定。 When the light stabilizer generates a radical by the action of ultraviolet rays, the radical can be trapped and inertized, and the progress of photooxidation deterioration of the organic layer 3 can be suppressed. The light stabilizer is not particularly limited as long as it exhibits such effects. As the light stabilizer, for example, a hindered amine light stabilizer (HALS) is preferable, and when a radical which causes an oxidation reaction is generated, the radical can be trapped in a catalyst form to be stabilized.

作為受阻胺系光穩定劑,具體而言,可舉出:2-(3,5-二-第三丁基-4-羥基苄基)-2'-正丁基丙二酸雙(1,2,2,6,6-五甲基-4-哌啶基)酯、癸二酸雙(1,2,2,6,6-五甲基-4-哌啶基)酯、癸二酸雙(1,2,2,6,6-五甲基-4-哌啶基)酯、癸二酸甲基(1,2,2,6,6-五甲基-4-哌啶基)酯、2,4-雙[N-丁基-N-(1-環己氧基-2,2,6,6-四甲基哌啶-4-基)胺基]-6-(2-羥基乙基胺)-1,3,5-三)、1,2,3,4-丁烷四羧酸肆(2,2,6,6-四甲基-4-哌啶基)酯、甲基丙烯酸(1,2,2,6,6-五甲基-4-哌啶基)酯等。又,亦可使用具有反應性官 能基之受阻胺系光穩定劑,具體而言,可舉出甲基丙烯酸(1,2,2,6,6-五甲基-4-哌啶基)酯等。 Specific examples of the hindered amine light stabilizer include 2-(3,5-di-t-butyl-4-hydroxybenzyl)-2'-n-butylmalonic acid bis (1, 2,2,6,6-pentamethyl-4-piperidinyl), bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, sebacic acid Bis(1,2,2,6,6-pentamethyl-4-piperidinyl) ester, sebacic acid methyl (1,2,2,6,6-pentamethyl-4-piperidinyl) Ester, 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-tetramethylpiperidin-4-yl)amino]-6-(2- Hydroxyethylamine)-1,3,5-three , 1,2,3,4-butane tetracarboxylic acid hydrazine (2,2,6,6-tetramethyl-4-piperidyl) ester, methacrylic acid (1,2,2,6,6 - pentamethyl-4-piperidinyl) and the like. Further, a hindered amine light stabilizer having a reactive functional group may be used, and specific examples thereof include (1,2,2,6,6-pentamethyl-4-piperidyl)methacrylate. Wait.

紫外線吸收劑於利用電子束硬化性樹脂組成物形成有機層3之情形時,可較佳地含有於該組成物中。作為紫外線吸收劑,可為無機系亦可為有機系。作為無機系紫外線吸收劑,可較佳地舉出平均粒徑約為5nm以上且120nm以下之氧化鈦、氧化鈰、氧化鋅等。作為有機系紫外線吸收劑,例如可較佳地舉出:苯并三唑系、三系、二苯甲酮系、水楊酸酯系、丙烯腈系等。其中,更佳為紫外線吸收能力較高,另外對於紫外線等之高能量亦不易劣化之三系。 When the ultraviolet absorber is used to form the organic layer 3 by the electron beam curable resin composition, it can be preferably contained in the composition. The ultraviolet absorber may be inorganic or organic. As the inorganic ultraviolet absorber, titanium oxide, cerium oxide, zinc oxide or the like having an average particle diameter of about 5 nm or more and 120 nm or less is preferably used. As the organic ultraviolet absorber, for example, a benzotriazole system or a trisole is preferably mentioned. A benzophenone type, a salicylate type, an acrylonitrile type, etc. Among them, it is more preferable that the ultraviolet absorbing ability is high, and the high energy such as ultraviolet rays is not easily deteriorated. system.

作為三系紫外線吸收劑,具體而言,可舉出:2-(4,6-二苯基-1,3,5-三-2-基)-5-[(己基)氧基]苯酚、1,3,5-三-2,4,6(1H,3H,5H)-三酮、1,3,5-三[{3,5-雙-(1,1-二甲基乙基)-4-羥基苯基}甲基]、及苯并三唑系紫外線吸收劑等。作為苯并三唑系紫外線吸收劑,具體而言,可舉出:2-(2-羥基-5-甲基苯基)苯并三唑、2-(2-羥基-3,5-二-第三戊基苯基)苯并三唑、聚乙二醇之3-[3-(苯并三唑-2-基)-5-第三丁基-4-羥基苯基]丙酸酯等。 As three It is a UV absorber, and specifically, 2-(4,6-diphenyl-1,3,5-3 -2-yl)-5-[(hexyl)oxy]phenol, 1,3,5-three -2,4,6(1H,3H,5H)-trione, 1,3,5-tri[{3,5-bis-(1,1-dimethylethyl)-4-hydroxyphenyl} Methyl], and benzotriazole-based ultraviolet absorbers. Specific examples of the benzotriazole-based ultraviolet absorber include 2-(2-hydroxy-5-methylphenyl)benzotriazole and 2-(2-hydroxy-3,5-di- 3-[3-(benzotriazol-2-yl)-5-t-butyl-4-hydroxyphenyl]propionate of the third amylphenyl)benzotriazole and polyethylene glycol .

再者,於利用紫外線硬化性樹脂組成物形成有機層3之情形時,亦可於該組成物中含有紫外線吸收劑,於該情形時,必須使紫外線吸收劑主要吸收之紫外線之波長與為了使紫外線硬化性樹脂硬化而照射之紫外線之波長錯開。藉由使兩者之紫外線波長錯開,於使用含有紫外線吸收劑之紫外線硬化性樹脂組成物之情形時,亦可藉由照射既定波長之紫外線,使紫外線硬化性樹脂硬化而形成有機層3。 Further, when the organic layer 3 is formed by using the ultraviolet curable resin composition, the composition may contain an ultraviolet absorber. In this case, it is necessary to make the wavelength of the ultraviolet light mainly absorbed by the ultraviolet absorber and The ultraviolet curable resin is cured and the wavelength of the ultraviolet ray to be irradiated is shifted. When the ultraviolet curable resin composition containing the ultraviolet absorber is used, when the ultraviolet curable resin composition containing the ultraviolet absorber is used, the ultraviolet curable resin can be cured by irradiation of ultraviolet rays having a predetermined wavelength to form the organic layer 3.

又,於電離放射線硬化性組成物中,亦可於無損本發明效果之範圍內,視需要含有其他添加劑。作為添加劑,例如可舉出: 熱穩定劑、消泡劑、勻平劑、可塑劑、界面活性劑、抗靜電劑、抗氧化劑、紅外線吸收劑、色素(著色染料、著色顏料)、體質顏料、光擴散劑、偶合劑等。 Further, in the ionizing radiation curable composition, other additives may be contained as needed within the range which does not impair the effects of the present invention. As an additive, for example, Heat stabilizers, antifoaming agents, leveling agents, plasticizers, surfactants, antistatic agents, antioxidants, infrared absorbers, pigments (staining dyes, coloring pigments), extender pigments, light diffusing agents, coupling agents, and the like.

於電離放射線硬化性組成物中,就製造時之黏度調整之觀點而言,亦可含有溶劑。作為溶劑,可舉出:異丙醇、甲醇、乙醇等醇類;甲基乙基酮、甲基異丁基酮、環己酮等酮類;乙酸乙酯、乙酸丁酯等酯類;鹵化烴;甲苯、二甲苯等芳香族烴;或該等之混合物。此種溶劑可於本發明主旨之範圍內以任意比例混合使用。 The ionizing radiation curable composition may contain a solvent in view of viscosity adjustment at the time of production. Examples of the solvent include alcohols such as isopropyl alcohol, methanol, and ethanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; esters such as ethyl acetate and butyl acetate; and halogenation. a hydrocarbon; an aromatic hydrocarbon such as toluene or xylene; or a mixture thereof. Such a solvent can be used in combination in any ratio within the scope of the gist of the present invention.

(形成方法) (formation method)

有機層3係將含有無機粒子之有機層形成用組成物塗佈於無機層2上而設置。作為有機層形成用組成物,可舉出含有上述無機粒子與黏度調整用溶劑之組成物、含有上述無機粒子及硬化性樹脂與黏度調整用溶劑之組成物等。再者,於該組成物中,亦可視需要含有各種添加劑。作為黏度調整用溶劑,可任意選擇甲基乙基酮、甲苯、其他通用溶劑,並適當摻合而使用。 The organic layer 3 is provided by applying an organic layer-forming composition containing inorganic particles to the inorganic layer 2. The composition for forming the organic layer may be a composition containing the inorganic particles and the solvent for adjusting the viscosity, a composition containing the inorganic particles, a curable resin, and a solvent for adjusting the viscosity. Further, various additives may be contained in the composition as needed. As the solvent for viscosity adjustment, methyl ethyl ketone, toluene, and other general-purpose solvents can be arbitrarily selected and used as appropriate.

作為將有機層形成用組成物塗佈於無機層2上之方法,例如可舉出:輥式塗佈法、凹版輥式塗佈法、接觸輥式塗佈法、反向輥式塗佈法、線棒塗佈法、凹版塗佈法、旋轉塗佈法、及模具塗佈法等。 Examples of the method of applying the composition for forming an organic layer to the inorganic layer 2 include a roll coating method, a gravure roll coating method, a contact roll coating method, and a reverse roll coating method. , bar coating method, gravure coating method, spin coating method, and die coating method.

於塗佈有機層形成用組成物後,賦予既定之硬化手段使其硬化。作為硬化手段,於聚合反應性基因熱進行反應而硬化之熱硬化性之情形時賦予熱,於聚合反應性基因電離放射線進行反應而硬化之電離放射線硬化性之情形時照射電離放射線(電子束或紫外線等)。 After coating the composition for forming an organic layer, it is cured by a predetermined hardening means. When the polymerization reactive gene heat is reacted and the thermosetting property is hardened, the heat is applied, and when the polymerization reactive ionizing radiation is reacted and the ionizing radiation is hardened, the ionizing radiation is irradiated (electron beam or UV, etc.).

作為電子束之電子束源,可使用柯克勞夫-沃耳吞(Cockcroft Walton)型、凡德格拉夫(Van de Graaff)型、共振變壓器型、絕緣芯變壓器型、直線型、高頻高壓加速器型、高頻型等各種電子束加速器。電子束之加速電壓例如為70kV以上且1000kV以下,較佳為90kV以上且200kV以下。電子束之照射量例如為1Mrad以上且30Mrad以下,較佳為2.5Mrad以上且25Mrad以下。 As the electron beam source of the electron beam, Cockcroft Walton type, Van de Graaff type, resonant transformer type, insulated core transformer type, linear type, high frequency high voltage can be used. Various electron beam accelerators such as accelerator type and high frequency type. The acceleration voltage of the electron beam is, for example, 70 kV or more and 1000 kV or less, preferably 90 kV or more and 200 kV or less. The irradiation amount of the electron beam is, for example, 1 Mrad or more and 30 Mrad or less, preferably 2.5 Mrad or more and 25 Mrad or less.

作為紫外線源,例如可使用超高壓水銀燈、高壓水銀燈、低壓水銀燈、碳弧燈、黑光螢光燈、金屬鹵素燈等光源。作為紫外線之波長,可使用190nm以上且380nm以下之波長區域。照射紫外線之時間只要自考慮到工業生產性並且進行有機層之確實硬化之觀點出發進行適當調整即可。又,利用加熱之硬化通常藉由在160℃以上且240℃以下之溫度範圍內保持2小時以上而進行。 As the ultraviolet source, for example, a light source such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black fluorescent lamp, or a metal halide lamp can be used. As the wavelength of the ultraviolet light, a wavelength region of 190 nm or more and 380 nm or less can be used. The time for irradiating the ultraviolet ray may be appropriately adjusted from the viewpoint of industrial productivity and the actual hardening of the organic layer. Further, curing by heating is usually carried out by maintaining the temperature in the range of 160 ° C or more and 240 ° C or less for 2 hours or more.

所形成之有機層3可為單層亦可為2層以上。關於此種有機層3之總厚度,不論單層或2層以上,均較佳為0.1μm以上且20μm以下之範圍內,進而,就表面性或生產性之觀點而言,更佳為0.5μm以上且10μm以下之範圍內。 The organic layer 3 formed may be a single layer or two or more layers. The total thickness of the organic layer 3 is preferably in the range of 0.1 μm or more and 20 μm or less in terms of the single layer or the two layers or more, and more preferably 0.5 μm from the viewpoint of surface properties or productivity. Above and within the range of 10 μm or less.

<其他層> <other layer>

亦可對本發明之阻氣性薄膜設置熱密封性樹脂層(未圖示)。該熱密封性樹脂層可設置於基材1之表面S1,可設置於有機層3側之表面S4,亦可設置於該兩者。再者,熱密封性樹脂層可將含有熱密封性之聚乙烯、聚丙烯等樹脂之組成物塗佈並乾燥而形成。 A heat-sealable resin layer (not shown) may be provided on the gas barrier film of the present invention. The heat-sealable resin layer may be provided on the surface S1 of the substrate 1, may be provided on the surface S4 on the side of the organic layer 3, or may be provided on both. Further, the heat-sealable resin layer can be formed by applying and drying a composition containing a resin such as heat-sealing polyethylene or polypropylene.

又,亦可於基材1之另一表面S2上、有機層3上、或無機層2與有機層3之間,根據功能及用途而適當設置其他功能層。 作為其他功能層,例如可舉出:消光層、保護層、抗靜電層、平滑層、密接改良層、遮光層、抗反射層、硬塗層、應力緩和層、防霧層、防污層、被印刷層、黏著層等。 Further, another functional layer may be appropriately provided on the other surface S2 of the substrate 1, on the organic layer 3, or between the inorganic layer 2 and the organic layer 3, depending on the function and use. Examples of the other functional layer include a matte layer, a protective layer, an antistatic layer, a smoothing layer, an adhesion improving layer, a light shielding layer, an antireflection layer, a hard coat layer, a stress relaxation layer, an antifogging layer, and an antifouling layer. Printed layer, adhesive layer, etc.

[包裝容器、裝置] [Packaging container, device]

本發明之包裝容器係由上述本發明之阻氣性薄膜10所形成之容器,本發明之裝置係具備上述本發明之阻氣性薄膜10之顯示裝置或發電裝置。 The packaging container of the present invention is a container formed of the gas barrier film 10 of the present invention, and the apparatus of the present invention includes the display device or the power generating device of the gas barrier film 10 of the present invention.

本發明之包裝容器具有較高之水蒸氣阻隔性及氧氣阻隔性,因此較佳可用作食品或醫療品等之包裝材料、對電子設備等之封裝材料。 Since the packaging container of the present invention has high water vapor barrier property and oxygen barrier property, it is preferably used as a packaging material for foods or medical products, and packaging materials for electronic devices and the like.

作為顯示裝置,例如可舉出:有機EL元件、液晶顯示元件、觸控面板、電子紙等。再者,該等各顯示裝置之構成並無特別限定,可分別適當採用先前公知之構成,且應用於此種各顯示裝置之阻氣性薄膜10所進行之密封手段亦無特別限定,可採用先前公知之手段。 Examples of the display device include an organic EL element, a liquid crystal display element, a touch panel, and electronic paper. In addition, the configuration of each of the display devices is not particularly limited, and a conventionally known configuration can be suitably employed, and the sealing means applied to the gas barrier film 10 of each of the display devices is not particularly limited, and may be employed. A previously known means.

具體而言,例如作為有機EL元件,可舉出於本發明之阻氣性薄膜10上具有陰極與陽極,且於兩電極之間具有包含有機發光層(亦簡稱為「發光層」)之有機層者。作為包含發光層之有機層之積層態樣,較佳為自陽極側起依序積層有電洞輸送層、發光層及電子輸送層之態樣。進而,於電洞輸送層與發光層之間、或發光層與電子輸送層之間,亦可具有電荷阻擋層等。又,可於陽極與電洞輸送層之間具有電洞注入層,亦可於陰極與電子輸送層之間具有電子注入層。又,發光層可僅為一層,又,亦可以第一發光層、第二發光層及第三發光 層等之方式分割發光層。進而,各層亦可被分為數個二次層。再者,由於有機EL元件為發光元件,故而較佳為陽極及陰極中之至少一個電極為透明。 Specifically, for example, as the organic EL element, the gas barrier film 10 of the present invention has a cathode and an anode, and has an organic light-emitting layer (also referred to simply as a "light-emitting layer") between the electrodes. Layer. As a laminated aspect of the organic layer including the light-emitting layer, it is preferable that a hole transport layer, a light-emitting layer, and an electron transport layer are sequentially laminated from the anode side. Further, a charge blocking layer or the like may be provided between the hole transport layer and the light emitting layer or between the light emitting layer and the electron transport layer. Further, a hole injection layer may be provided between the anode and the hole transport layer, or an electron injection layer may be provided between the cathode and the electron transport layer. Moreover, the luminescent layer may be only one layer, and the first luminescent layer, the second luminescent layer and the third illuminating layer may also be used. The light-emitting layer is divided by a layer or the like. Furthermore, each layer can also be divided into several secondary layers. Further, since the organic EL element is a light-emitting element, it is preferable that at least one of the anode and the cathode is transparent.

作為發電裝置,例如可舉出太陽電池元件(太陽電池模組)。發電裝置之構成並無特別限定,可適當採用先前公知之構成。進而,應用於此種發電裝置之利用阻氣性薄膜10所進行之密封手段亦無特別限定,可採用先前公知之手段。例如可使用阻氣性薄膜10作為太陽電池元件之背面保護片材或正面保護片材。 As a power generation device, a solar cell element (solar cell module) is mentioned, for example. The configuration of the power generating device is not particularly limited, and a conventionally known configuration can be suitably employed. Further, the sealing means applied to the gas barrier film 10 used in such a power generating device is not particularly limited, and a conventionally known means can be employed. For example, the gas barrier film 10 can be used as a back protective sheet or a front protective sheet of a solar cell element.

具體而言,例如作為太陽電池模組,可舉出使用本發明之阻氣性薄膜10作為太陽電池底層片材之例。此種太陽電池模組係自太陽光側起沿厚度方向依序為前面基材(玻璃或薄膜等具有高光線穿透性者)、填充材料、太陽電池元件、引線、端子、端子盒、太陽電池底層片材之構成,且其等經由密封材料而固定於兩端之包裝材料(鋁框等)。作為該太陽電池底層片材,可舉出於背面密封用薄膜與配置於外層側之薄膜之間挾持著阻氣性薄膜10而構成之例,亦可舉出使用阻氣性薄膜10作為配置於外層側之薄膜之例。又,可舉出使用阻氣性薄膜10作為前面基材之表面保護片材之例。由於此種太陽電池元件之表面保護片材或配置於外層側之薄膜要求耐候性,故而可較佳地應用具有較高之耐候性之阻氣性薄膜10。 Specifically, for example, as the solar cell module, an example in which the gas barrier film 10 of the present invention is used as a solar cell underlayer sheet can be cited. The solar cell module is sequentially oriented in the thickness direction from the sunlight side to the front substrate (such as glass or film with high light penetration), filling materials, solar cell components, leads, terminals, terminal boxes, and the sun. A structure of a battery back sheet, and a packaging material (aluminum frame or the like) fixed to both ends via a sealing material. The solar cell underlayer sheet may be configured by sandwiching the gas barrier film 10 between the film for back sealing and the film disposed on the outer layer side, and the gas barrier film 10 may be used as the separator. An example of a film on the outer side. Further, an example in which the gas barrier film 10 is used as the surface protective sheet of the front substrate can be mentioned. Since the surface protective sheet of such a solar cell element or the film disposed on the outer layer side is required to have weather resistance, the gas barrier film 10 having high weather resistance can be preferably used.

[實施例] [Examples]

藉由實施例進而具體地說明本發明,但本發明只要不超過其主旨,則不限定於以下之實施例之記載。 The present invention will be specifically described by way of examples, but the present invention is not limited to the description of the examples below as long as it does not exceed the gist of the invention.

[實施例1] [Example 1]

準備輥捲狀之雙軸延伸聚對苯二甲酸乙二酯薄膜(PET薄膜,厚度12μm,Unitika股份有限公司製造)作為基材1,並將其安裝於具備捲取機構之電漿CVD裝置之腔室內。其次,藉由油旋轉泵與油擴散泵將電漿CVD裝置之腔室內減壓至極限真空度3.0×10-5Torr(4×10-3Pa)。又,準備六甲基二矽氧烷(HMDSO)(SH200,0.65CSt,Dow Corning Toray Silicone股份有限公司製造)及氧氣作為原料氣體。其次,於腔室內之塗佈鼓輪附近,以與塗佈鼓輪相對向之方式配置電極,並於塗佈鼓輪與電極之間施加頻率40kHz之高頻電力(輸入電力12kW)。然後,自設置於腔室內之電極附近之氣體導入口,導入HMDSO氣體1200sccm、氧氣2400sccm、氦氣1200sccm,並控制存在於真空泵與腔室之間之閥之開閉,藉此使腔室內保持為5×10-2Torr(6.7Pa),而於基材1上形成包含氧化矽膜(亦稱為CVD二氧化矽膜)之無機層2。 A roll-shaped biaxially stretched polyethylene terephthalate film (PET film, thickness: 12 μm, manufactured by Unitika Co., Ltd.) was prepared as a substrate 1 and mounted on a plasma CVD apparatus equipped with a winding mechanism. Inside the chamber. Next, the chamber of the plasma CVD apparatus was decompressed to an ultimate vacuum of 3.0 × 10 -5 Torr (4 × 10 -3 Pa) by an oil rotary pump and an oil diffusion pump. Further, hexamethyldioxane (HMDSO) (SH200, 0.65 CSt, manufactured by Dow Corning Toray Silicone Co., Ltd.) and oxygen were prepared as raw material gases. Next, an electrode was placed in the vicinity of the coating drum in the chamber so as to face the coating drum, and high-frequency electric power (input electric power 12 kW) having a frequency of 40 kHz was applied between the coating drum and the electrode. Then, from the gas introduction port provided near the electrode in the chamber, 1200 sccm of HMDSO gas, 2400 sccm of oxygen gas, 1200 sccm of helium gas are introduced, and the opening and closing of the valve existing between the vacuum pump and the chamber is controlled, thereby keeping the chamber 5 ×10 -2 Torr (6.7 Pa), an inorganic layer 2 containing a hafnium oxide film (also referred to as a CVD ceria film) was formed on the substrate 1.

其次,準備表面具有聚合反應性基之平均粒徑為20nm之二氧化矽奈米粒子(氧化矽粒子,商品名:Opstar Z7537,JSR股份有限公司製造)作為無機粒子,並利用甲基乙基酮(MEK):甲苯=1:1之溶劑將該無機粒子稀釋調整為固形份18質量%,將固形份中之無機粒子之比例為100質量%之反應性二氧化矽溶液作為有機層形成用組成物而進行調整。然後,以膜厚成為1g/m2之方式將有機層形成用組成物塗佈於上述CVD二氧化矽膜上,其後,於120℃下乾燥1分鐘,並照射電壓120kV、劑量5Mrad之電子束使其硬化。如此將有機層3成膜於無機層2上,而獲得實施例1之阻氣性薄膜。 Next, as the inorganic particles, a cerium oxide nanoparticle (manganese oxide particle, trade name: Opstar Z7537, manufactured by JSR Co., Ltd.) having an average particle diameter of 20 nm on the surface of the polymerization-reactive group was prepared as an inorganic particle, and methyl ethyl ketone was used. (MEK): a solvent of toluene = 1:1, the inorganic particles are diluted to a solid content of 18% by mass, and a reactive cerium oxide solution having a ratio of inorganic particles in the solid content of 100% by mass is used as an organic layer forming composition. Adjust for things. Then, the organic layer-forming composition was applied onto the CVD cerium oxide film so that the film thickness became 1 g/m 2 , and then dried at 120 ° C for 1 minute, and irradiated with a voltage of 120 kV and a dose of 5 Mrad. The bundle hardens it. Thus, the organic layer 3 was formed on the inorganic layer 2, and the gas barrier film of Example 1 was obtained.

[實施例2] [Embodiment 2]

使用如下者作為有機層形成用組成物:將表面具有聚合反應性基 之平均粒徑為20nm之二氧化矽奈米粒子(商品名:Opstar Z7537,JSR股份有限公司製造)與丙烯酸系單體(商品名:OELV30,DNPFC股份有限公司製造)加以混合,使固形份成為18質量%、固形份中之無機粒子之比例成為66質量%。除此以外,以與實施例1同樣之方式獲得實施例2之阻氣性薄膜。 The following is used as a composition for forming an organic layer: having a polymerizable reactive group on the surface The cerium oxide nanoparticle (trade name: Opstar Z7537, manufactured by JSR Co., Ltd.) having an average particle diameter of 20 nm is mixed with an acrylic monomer (trade name: OELV30, manufactured by DNPFC Co., Ltd.) to form a solid component. The ratio of the inorganic particles in the solid content of 18% by mass was 66% by mass. A gas barrier film of Example 2 was obtained in the same manner as in Example 1 except the above.

[實施例3] [Example 3]

使用如下者作為有機層形成用組成物:將表面具有聚合反應性基之平均粒徑為20nm之二氧化矽奈米粒子(商品名:Opstar Z7537,JSR股份有限公司製造)與作為硬化性樹脂之丙烯酸系單體(商品名:OELV30,DNPFC股份有限公司製造)加以混合,使固形份成為18質量%、固形份中之無機粒子之比例成為50質量%。除此以外,以與實施例1同樣之方式獲得實施例3之阻氣性薄膜。 The composition for forming an organic layer is as follows: a cerium oxide nanoparticle having an average particle diameter of 20 nm having a polymerization reactive group on the surface (trade name: Opstar Z7537, manufactured by JSR Co., Ltd.) and a curable resin. The acrylic monomer (trade name: OELV30, manufactured by DNPFC Co., Ltd.) was mixed so that the solid content was 18% by mass, and the ratio of the inorganic particles in the solid portion was 50% by mass. A gas barrier film of Example 3 was obtained in the same manner as in Example 1 except the above.

[實施例4] [Example 4]

使用如下者作為有機層形成用組成物:將表面具有聚合反應性基之平均粒徑為20nm之二氧化矽奈米粒子(商品名:Opstar Z7537,JSR股份有限公司製造)與丙烯酸系單體(商品名:OELV30,DNPFC股份有限公司製造)加以混合,使固形份成為18質量%、固形份中之無機粒子之比例成為33質量%。除此以外,以與實施例1同樣之方式獲得實施例4之阻氣性薄膜。 The composition for forming an organic layer is as follows: cerium oxide nanoparticles (trade name: Opstar Z7537, manufactured by JSR Co., Ltd.) having an average particle diameter of 20 nm having a polymerization reactive group on the surface, and an acrylic monomer ( The product name: OELV30, manufactured by DNPFC Co., Ltd.) was mixed so that the solid content was 18% by mass, and the ratio of the inorganic particles in the solid portion was 33% by mass. A gas barrier film of Example 4 was obtained in the same manner as in Example 1 except the above.

[實施例5] [Example 5]

使用如下者作為有機層形成用組成物:將表面具有聚合反應性基 之平均粒徑為20nm之二氧化矽奈米粒子(商品名:Opstar Z7537,JSR股份有限公司製造)與丙烯酸系單體(商品名:OELV30,DNPFC股份有限公司製造)加以混合,使固形份成為18質量%、固形份中之無機粒子之比例成為13質量%。除此以外,以與實施例1同樣之方式獲得實施例5之阻氣性薄膜。 The following is used as a composition for forming an organic layer: having a polymerizable reactive group on the surface The cerium oxide nanoparticle (trade name: Opstar Z7537, manufactured by JSR Co., Ltd.) having an average particle diameter of 20 nm is mixed with an acrylic monomer (trade name: OELV30, manufactured by DNPFC Co., Ltd.) to form a solid component. The ratio of the inorganic particles in the solid content of 18% by mass was 13% by mass. A gas barrier film of Example 5 was obtained in the same manner as in Example 1 except the above.

[實施例6] [Embodiment 6]

於實施例1中,使用表面具有聚合反應性基之平均粒徑為12nm之二氧化矽奈米粒子(商品名:MIBK-SD,日產化學工業股份有限公司製造)作為無機粒子。除此以外,以與實施例1同樣之方式獲得實施例6之阻氣性薄膜。 In Example 1, as the inorganic particles, cerium oxide nanoparticles (trade name: MIBK-SD, manufactured by Nissan Chemical Industries, Ltd.) having an average particle diameter of 12 nm on the surface of the polymerization-reactive group were used. A gas barrier film of Example 6 was obtained in the same manner as in Example 1 except the above.

[實施例7] [Embodiment 7]

於實施例3中,作為硬化性樹脂,使用6官能丙烯酸系單體DPHA(商品名:KAYARAD,日本化藥股份有限公司製造)代替丙烯酸系單體。除此以外,以與實施例3同樣之方式獲得實施例7之阻氣性薄膜。 In the example 3, a 6-functional acrylic monomer DPHA (trade name: KAYARAD, manufactured by Nippon Kayaku Co., Ltd.) was used as the curable resin instead of the acrylic monomer. A gas barrier film of Example 7 was obtained in the same manner as in Example 3 except for the above.

[實施例8] [Embodiment 8]

於實施例3中,作為硬化性樹脂,使用3官能丙烯酸系單體PETA(商品名:KAYARAD,日本化藥股份有限公司製造)代替丙烯酸系單體。除此以外,以與實施例3同樣之方式獲得實施例8之阻氣性薄膜。 In the third embodiment, a trifunctional acrylic monomer PETA (trade name: KAYARAD, manufactured by Nippon Kayaku Co., Ltd.) was used as the curable resin instead of the acrylic monomer. A gas barrier film of Example 8 was obtained in the same manner as in Example 3 except the above.

[實施例9] [Embodiment 9]

於實施例1中,代替作為無機層2而成膜之氧化矽膜,利用下述方法成膜氧化鋁膜。除此以外,以與實施例1同樣之方式獲得實施例9之阻氣性薄膜。 In Example 1, instead of the ruthenium oxide film formed as the inorganic layer 2, an aluminum oxide film was formed by the following method. A gas barrier film of Example 9 was obtained in the same manner as in Example 1 except the above.

準備輥捲狀之雙軸延伸聚對苯二甲酸乙二酯薄膜(PET薄膜,厚度12μm,Unitika股份有限公司製造)作為基材1,並將其安裝於具備捲取機構之PVD裝置之腔室內。其次,藉由油旋轉泵與油擴散泵將PVD裝置之腔室內減壓至極限真空度3.0×10-5Torr(4×10-3Pa)。又,作為原料(蒸發源),將鋁(高純度化學研究所股份有限公司製造,純度99.999%,粒徑3~5μm)載置於坩堝內。其次,於腔室內之塗佈鼓輪附近,以流量12000sccm導入氧氣,並控制存在於真空泵與腔室之間之閥之開閉,藉此使成膜時之腔室內之壓力保持為3×10-4Torr(4×10-2Pa)。然後,使用皮爾斯型(Pierce type)電子槍,施加10kW之電力,使坩堝內之蒸發源蒸發,而於在塗佈鼓輪內移行之PET薄膜上形成氧化鋁薄膜,形成無機層2。 A roll-shaped biaxially stretched polyethylene terephthalate film (PET film, thickness 12 μm, manufactured by Unitika Co., Ltd.) was prepared as the substrate 1 and mounted in a chamber of a PVD device having a winding mechanism. . Next, the chamber of the PVD apparatus was decompressed to a limit vacuum of 3.0 × 10 -5 Torr (4 × 10 -3 Pa) by an oil rotary pump and an oil diffusion pump. Further, as a raw material (evaporation source), aluminum (purity: 99.999%, particle size: 3 to 5 μm, manufactured by High Purity Chemical Research Co., Ltd.) was placed in a crucible. Next, in the vicinity of the coating drum in the chamber, oxygen is introduced at a flow rate of 12,000 sccm, and the opening and closing of the valve existing between the vacuum pump and the chamber is controlled, thereby maintaining the pressure in the chamber at the time of film formation to 3 × 10 - 4 Torr (4 × 10 -2 Pa). Then, using a Pierce type electron gun, electric power of 10 kW was applied to evaporate the evaporation source in the crucible, and an aluminum oxide film was formed on the PET film which was moved in the coating drum to form the inorganic layer 2.

[實施例10] [Embodiment 10]

於實施例6中,代替作為無機層2而成膜之氧化矽膜,形成與實施例9相同之氧化鋁膜。除此以外,以與實施例6同樣之方式獲得實施例10之阻氣性薄膜。 In Example 6, an aluminum oxide film similar to that of Example 9 was formed instead of the ruthenium oxide film formed as the inorganic layer 2. A gas barrier film of Example 10 was obtained in the same manner as in Example 6 except the above.

[實施例11] [Example 11]

於實施例2中,於有機層形成用組成物中摻合聚合起始劑(商品名:Irg.184,Ciba Specialty Chemicals股份有限公司製造),作為硬化 手段,以300mJ之條件照射紫外線。除此以外,以與實施例2同樣之方式獲得實施例11之阻氣性薄膜。 In Example 2, a polymerization initiator (trade name: Irg. 184, manufactured by Ciba Specialty Chemicals Co., Ltd.) was blended as a hardening agent in the composition for forming an organic layer. Means to irradiate ultraviolet rays at a condition of 300 mJ. A gas barrier film of Example 11 was obtained in the same manner as in Example 2 except for the above.

[比較例1] [Comparative Example 1]

於實施例1中,未於無機層2上形成有機層3。除此以外,以與實施例1同樣之方式獲得比較例1之阻氣性薄膜。 In Example 1, the organic layer 3 was not formed on the inorganic layer 2. A gas barrier film of Comparative Example 1 was obtained in the same manner as in Example 1 except the above.

[比較例2] [Comparative Example 2]

於實施例9中,未於無機層2上形成有機層3。除此以外,以與實施例9同樣之方式獲得比較例2之阻氣性薄膜。 In Example 9, the organic layer 3 was not formed on the inorganic layer 2. A gas barrier film of Comparative Example 2 was obtained in the same manner as in Example 9 except the above.

[比較例3] [Comparative Example 3]

於實施例1中,不使用表面具有聚合反應性基之二氧化矽奈米粒子,而僅使用多官能丙烯酸系單體(商品名:OELV30,DNPFC股份有限公司製造),使固形份中之無機粒子之比例成為0質量%而形成有機層3。除此以外,以與實施例1同樣之方式獲得比較例1之阻氣性薄膜。 In Example 1, the cerium oxide nanoparticles having a polymerizable reactive group on the surface were not used, and only the polyfunctional acrylic monomer (trade name: OELV30, manufactured by DNPFC Co., Ltd.) was used, and the inorganic substance in the solid portion was used. The ratio of the particles was 0% by mass to form the organic layer 3. A gas barrier film of Comparative Example 1 was obtained in the same manner as in Example 1 except the above.

[比較例4] [Comparative Example 4]

於實施例1中,代替作為無機層2而成膜之氧化矽膜,成膜與實施例9相同之氧化鋁膜。又,不使用表面具有聚合反應性基之二氧化矽奈米粒子,而僅使用6官能丙烯酸系單體DPHA(商品名:KAYARAD,日本化藥股份有限公司製造),使固形份中之無機粒子之比例成為0質量%而形成有機層3。除此以外,以與實施例1同樣之方式獲得比較例4之阻氣性薄膜。 In Example 1, an aluminum oxide film similar to that of Example 9 was formed instead of the ruthenium oxide film formed as the inorganic layer 2. Further, without using a cerium oxide nanoparticle having a polymerizable reactive group on the surface, only the hexafunctional acrylic monomer DPHA (trade name: KAYARAD, manufactured by Nippon Kayaku Co., Ltd.) is used, and the inorganic particles in the solid portion are used. The ratio was 0% by mass to form the organic layer 3. A gas barrier film of Comparative Example 4 was obtained in the same manner as in Example 1 except the above.

[比較例5] [Comparative Example 5]

於實施例2中,使用不具有聚合反應性基之二氧化矽奈米粒子(非反應性二氧化矽粒子,商品名:E-65,C.I.Kasei股份有限公司製造)作為有機層3,作為有機層之硬化手段,以300mJ之條件照射紫外線。除此以外,以與實施例2同樣之方式獲得比較例5之阻氣性薄膜。 In Example 2, cerium oxide nanoparticles (non-reactive cerium oxide particles, trade name: E-65, manufactured by CIKasei Co., Ltd.) having no polymerizable group were used as the organic layer 3 as organic The layer is hardened by irradiating ultraviolet rays at a condition of 300 mJ. A gas barrier film of Comparative Example 5 was obtained in the same manner as in Example 2 except the above.

[比較例6] [Comparative Example 6]

於實施例2中,使用不具有聚合反應性基之二氧化矽奈米粒子(非反應性二氧化矽粒子,商品名:E-65,C.I.Kasei股份有限公司製造)作為有機層3,作為有機層之硬化手段,以相同之條件照射與實施例2同樣之電子束。除此以外,以與實施例2同樣之方式獲得比較例6之阻氣性薄膜。 In Example 2, cerium oxide nanoparticles (non-reactive cerium oxide particles, trade name: E-65, manufactured by CIKasei Co., Ltd.) having no polymerizable group were used as the organic layer 3 as organic The electron beam of the same layer was irradiated under the same conditions as the hardening means of the layer. A gas barrier film of Comparative Example 6 was obtained in the same manner as in Example 2 except the above.

[阻氣性之評價] [Evaluation of gas barrier properties]

針對於實施例1~11及比較例1~6之阻氣性薄膜,評價水蒸氣穿透性(WVTR)與氧氣穿透性(OTR)。水蒸氣穿透性評價係使用水蒸氣穿透率測定裝置(MOCON公司製造,PERMATRAN-W3/31),於溫度40℃、濕度100%RH下進行測定。又,氧氣穿透性評價係使用氧氣穿透率測定裝置(MOCON公司製造,OXTRAN2/20),於溫度23℃、濕度100%RH之條件下進行測定。 Water vapor permeability (WVTR) and oxygen permeability (OTR) were evaluated for the gas barrier films of Examples 1 to 11 and Comparative Examples 1 to 6. The water vapor permeability evaluation was carried out using a water vapor permeability measuring apparatus (manufactured by MOCON Corporation, PERMATRAN-W3/31) at a temperature of 40 ° C and a humidity of 100% RH. Further, the oxygen permeability evaluation was carried out under the conditions of a temperature of 23 ° C and a humidity of 100% RH using an oxygen permeability measuring device (OXTRAN 2/20, manufactured by MOCON Corporation).

如表1所示,實施例1~11之阻氣性薄膜顯示出良好之阻氣性。另一方面,比較例1~6之阻氣性薄膜之阻氣性並不充分。可認為該結果係由於有機層3由表面具有聚合反應性基之無機粒子所形成,故而有機層3藉由源自該聚合反應性基之樹脂成分之硬化反應而收縮,無機層2亦藉由該有機層3之收縮而收縮,從而變得緻密,其結果阻氣性提高。又,可認為有機層3中所含有之無機粒子會發揮對有機層3加以強化之固定作用、及進入無機層2之龜裂或缺陷等之作用中之任一者或兩者,認為其結果提高阻氣性。 As shown in Table 1, the gas barrier films of Examples 1 to 11 exhibited good gas barrier properties. On the other hand, the gas barrier properties of the gas barrier films of Comparative Examples 1 to 6 were not sufficient. This result is considered to be because the organic layer 3 is formed of inorganic particles having a polymerization reactive group on the surface, and therefore the organic layer 3 is shrunk by the hardening reaction of the resin component derived from the polymerization reactive group, and the inorganic layer 2 is also The organic layer 3 shrinks and contracts, thereby becoming dense, and as a result, gas barrier properties are improved. In addition, it is considered that the inorganic particles contained in the organic layer 3 exhibit either a fixing action for strengthening the organic layer 3 and a function of cracking or defects entering the inorganic layer 2, and the like. Improve gas barrier properties.

1‧‧‧基材 1‧‧‧Substrate

2‧‧‧無機層 2‧‧‧Inorganic layer

3‧‧‧有機層 3‧‧‧Organic layer

S1‧‧‧基材之一面 One side of S1‧‧‧ substrate

S2‧‧‧基材之另一面 The other side of the S2‧‧‧ substrate

S3‧‧‧阻氣性薄膜之表面 Surface of S3‧‧‧ gas barrier film

Claims (8)

一種阻氣性薄膜,其特徵在於:其包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層;且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 A gas barrier film comprising: a substrate, an inorganic layer disposed on the substrate, and an organic layer disposed on the inorganic layer; and the organic layer is an inorganic layer having a polymerization reactive group on the surface The particles are formed. 如申請專利範圍第1項之阻氣性薄膜,其中,上述聚合反應性基包含選自丙烯醯基、環氧基、乙烯基、烯丙基、異氰酸酯基及矽烷醇基中之1種或2種以上之反應性基。 The gas barrier film of claim 1, wherein the polymerization reactive group comprises one or two selected from the group consisting of an acryloyl group, an epoxy group, a vinyl group, an allyl group, an isocyanate group, and a stanol group. More than one reactive group. 一種包裝容器,其特徵在於由阻氣性薄膜所形成,該阻氣性薄膜包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 A packaging container characterized by comprising a gas barrier film comprising a substrate, an inorganic layer disposed on the substrate, and an organic layer disposed on the inorganic layer, wherein the organic layer is It is formed of inorganic particles having a polymerizable reactive group on the surface. 一種顯示裝置,其特徵在於具備阻氣性薄膜,該阻氣性薄膜包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 A display device comprising a gas barrier film comprising a substrate, an inorganic layer disposed on the substrate, and an organic layer disposed on the inorganic layer, wherein the organic layer is a surface It is formed of inorganic particles having a polymerization reactive group. 一種發電裝置,其特徵在於具備阻氣性薄膜,該阻氣性薄膜包含基材、設置於該基材上之無機層、及設置於該無機層上之有機層,且上述有機層係由表面具有聚合反應性基之無機粒子所形成。 A power generating device comprising a gas barrier film comprising a substrate, an inorganic layer disposed on the substrate, and an organic layer disposed on the inorganic layer, wherein the organic layer is a surface It is formed of inorganic particles having a polymerization reactive group. 一種阻氣性薄膜之製造方法,其特徵在於包括以下步驟:於基材上乾式成膜無機層之步驟、及於上述無機層上成膜有機層之步驟;且於上述有機層之成膜步驟中,使至少含有表面具有聚合反應性基之無機粒子之有機層形成用組成物硬化而成膜該有機層。 A method for producing a gas barrier film, comprising the steps of: a step of dry-forming a inorganic layer on a substrate; and a step of forming an organic layer on the inorganic layer; and a film forming step of the organic layer In the middle, the organic layer-forming composition containing at least the inorganic particles having a polymerization reactive group on the surface thereof is cured to form the organic layer. 如申請專利範圍第6項之阻氣性薄膜之製造方法,其中,前聚合反應性基係選自丙烯醯基、環氧基、乙烯基、烯丙基、異氰酸酯基及矽烷醇基中之1種或2種以上之反應性基。 The method for producing a gas barrier film according to the sixth aspect of the invention, wherein the prepolymerization group is selected from the group consisting of a propylene group, an epoxy group, a vinyl group, an allyl group, an isocyanate group and a stanol group. Kinds or more than two kinds of reactive groups. 申請專利範圍第6或7項之阻氣性薄膜之製造方法,其中,上述乾式成膜為化學氣相沈積法或物理氣相沈積法。 The method for producing a gas barrier film according to claim 6 or 7, wherein the dry film formation is a chemical vapor deposition method or a physical vapor deposition method.
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