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TW201445404A - Transparent conductive film structure and touch panel thereof - Google Patents

Transparent conductive film structure and touch panel thereof Download PDF

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Publication number
TW201445404A
TW201445404A TW102117841A TW102117841A TW201445404A TW 201445404 A TW201445404 A TW 201445404A TW 102117841 A TW102117841 A TW 102117841A TW 102117841 A TW102117841 A TW 102117841A TW 201445404 A TW201445404 A TW 201445404A
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Taiwan
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transparent conductive
conductive film
film
substrate
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TW102117841A
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Chinese (zh)
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Chun-Kuang Lai
Tien-Yuan Hsieh
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Ushine Photonics Corp
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Priority to TW102117841A priority Critical patent/TW201445404A/en
Priority to CN201310404091.0A priority patent/CN104183302A/en
Publication of TW201445404A publication Critical patent/TW201445404A/en

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Abstract

A transparent conductive film structure at least comprises a substrate and two and more transparent conductive layers. These transparent conductive layers are at least composed of SnO2 and In2O3 with different weight percentage. By using specific composition percentage, process temperature and time of film deposition can be reduced. As a result, energy consumption and costs can be reduced; transparent conductive films with low impedance are obtained. A touch panel structure is also disclosed here, which can be applied to capacitive touch panels.

Description

透明導電積層膜結構及其觸控面板 Transparent conductive laminated film structure and touch panel thereof

本發明是關於一種透明導電積層膜結構及其觸控面板,特別是一種可降低製程溫度及時間並具有低阻抗性質的透明導電積層膜結構及其觸控面板。 The present invention relates to a transparent conductive laminated film structure and a touch panel thereof, and more particularly to a transparent conductive laminated film structure and a touch panel thereof which can reduce process temperature and time and have low impedance properties.

目前,透明導電性膜具有很廣泛的應用,除了用於液晶顯示器、電致發光顯示器、觸控面板中之透明電極以外,亦用於防止透明物品帶電、阻斷電磁波等。對於觸控面板而言,則可應用於電容式觸控面板。 At present, transparent conductive films have a wide range of applications, and are used for preventing transparent articles from being charged, blocking electromagnetic waves, and the like in addition to transparent electrodes used in liquid crystal displays, electroluminescent displays, and touch panels. For touch panels, it can be applied to capacitive touch panels.

關於透明導電性膜,一般係利用金屬氧化物沉積在玻璃基材上形成透明導電層,但由於基材為玻璃,故撓曲性及加工性較差,應用範圍也受到了限制。 In the transparent conductive film, a transparent conductive layer is generally formed on a glass substrate by metal oxide deposition. However, since the substrate is glass, flexibility and workability are poor, and the application range is also limited.

因此,近年來,為了滿足可撓性、易加工性、耐衝擊性、輕量化等性質,基板改採用了不同種類的高分子材料,例如聚對苯二甲酸乙二醇酯膜等等。 Therefore, in recent years, in order to satisfy properties such as flexibility, workability, impact resistance, and weight reduction, the substrate has been modified into various types of polymer materials such as polyethylene terephthalate film.

然而,採取高分子基板在製程中會碰到兩個問題。其一,由於基板為高分子材料所組成,在沉積透明導電層的時候,容易發生熱變形的情形。第二,完成沉積製程後,為了進一步改善透明導電膜的性質,需要實施退火製程,消除透明導電層的內應力及缺陷,並使其再結晶及晶粒成長,以獲得低電阻、高透射率、高耐久性等特性。然而,受到高分子基板的限制,無法使用200℃上的高溫退火,只好以較低溫並且延長退火時間,導致製程時間及能源的浪費。再者,退火處理之烘室內部溫度分佈之均勻性,往往影響最終之良率,因此期望能夠獲得在相對短時間內, 較低溫度下即可形成結晶的鍍膜品質。 However, taking a polymer substrate will encounter two problems in the process. First, since the substrate is composed of a polymer material, when the transparent conductive layer is deposited, thermal deformation is likely to occur. Second, after the deposition process is completed, in order to further improve the properties of the transparent conductive film, an annealing process is required to eliminate the internal stress and defects of the transparent conductive layer, and recrystallize and crystal grain growth to obtain low resistance and high transmittance. High durability and other characteristics. However, due to the limitation of the polymer substrate, high temperature annealing at 200 ° C cannot be used, and the annealing time is prolonged at a lower temperature, resulting in a waste of process time and energy. Furthermore, the uniformity of the temperature distribution inside the annealing chamber tends to affect the final yield, so it is desirable to be able to obtain in a relatively short period of time, The coating quality of the crystal can be formed at a lower temperature.

另外,就電容式觸控面板而言,尤其是投射式電容觸控面板,期望提升其靈敏度及分辨率,因此低阻抗(表面電阻或比電阻)的透明導電層也是關鍵的因素。 In addition, in the case of capacitive touch panels, especially projected capacitive touch panels, it is desirable to increase their sensitivity and resolution, so a low-impedance (surface resistance or specific resistance) transparent conductive layer is also a key factor.

有鑑於此,應當發展一種能降低製程溫度及時間並具有低阻抗性質的透明導電積層膜結構,以解決上述問題。 In view of this, a transparent conductive laminated film structure capable of reducing process temperature and time and having low impedance properties should be developed to solve the above problems.

本發明提供了一種透明導電積層膜結構,包含了一基板以及二層以上透明導電膜,其中透明導電膜至少由SnO2以及In2O3所組成,並分別具有不同之重量百分比。藉由採用特定之成分比例,得以降低透明導電積層膜結構的製程溫度,並減少製程時間。如此,不但節省能源,也避免了基板的熱變形問題。此處同時揭露了一種觸控面板結構,可應用於電容式觸控面板,例如投射式電容觸控面板。 The present invention provides a transparent conductive laminated film structure comprising a substrate and two or more transparent conductive films, wherein the transparent conductive film is composed of at least SnO 2 and In 2 O 3 and has different weight percentages. By using a specific composition ratio, the process temperature of the transparent conductive laminated film structure can be reduced, and the process time can be reduced. In this way, not only energy is saved, but also the problem of thermal deformation of the substrate is avoided. At the same time, a touch panel structure is disclosed, which can be applied to a capacitive touch panel, such as a projected capacitive touch panel.

為了解決先前技術之問題,本發明之一實施例提供了一種透明導電積層膜結構,該透明導電積層膜結構由底部向上依序包含:一基板以及二層以上透明導電膜。這些透明導電膜至少包含一第一透明導電膜以及一第二透明導電膜。第一透明導電膜設置於基板上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。第二透明導電膜設置於第一透明導電膜上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為9%至15%。 In order to solve the problems of the prior art, an embodiment of the present invention provides a transparent conductive laminated film structure comprising, in order from the bottom up, a substrate and two or more transparent conductive films. The transparent conductive film includes at least a first transparent conductive film and a second transparent conductive film. The first transparent conductive film is disposed on the substrate and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 6% to 7.5%. The second transparent conductive film is disposed on the first transparent conductive film and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 9% to 15%.

又根據本發明之另一實施例,一種觸控面板結構,包含至少二個透明導電積層膜結構上下堆疊,並於二個透明導電積層膜結構之間設置一介電層,其中任一透明導電積層膜結構由其底部向上依序包含一基板以及二層以上透明導電膜。這些透明導電膜至少包含一第一透明導電膜以及一第二透明導電膜。第一透明導電膜設置於基板上,並至少由SnO2以及In2O3所組成,其 中SnO2的重量百分比為9%至15%。第二透明導電膜設置於第一透明導電膜上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。 According to another embodiment of the present invention, a touch panel structure includes at least two transparent conductive laminated film structures stacked on top of each other, and a dielectric layer is disposed between two transparent conductive laminated film structures, wherein any transparent conductive The laminated film structure includes a substrate and two or more transparent conductive films in this order from the bottom to the bottom. The transparent conductive film includes at least a first transparent conductive film and a second transparent conductive film. The first transparent conductive film is disposed on the substrate and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 9% to 15%. The second transparent conductive film is disposed on the first transparent conductive film and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 6% to 7.5%.

以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。 The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.

1‧‧‧透明導電積層膜結構 1‧‧‧Transparent conductive laminated film structure

10‧‧‧基板 10‧‧‧Substrate

20‧‧‧第一透明導電膜 20‧‧‧First transparent conductive film

30‧‧‧第二透明導電膜 30‧‧‧Second transparent conductive film

40‧‧‧填補層 40‧‧‧ Filling layer

50‧‧‧透明保護膜 50‧‧‧Transparent protective film

60‧‧‧硬化層 60‧‧‧ hardened layer

100‧‧‧觸控面板結構 100‧‧‧Touch panel structure

110‧‧‧第一透明導電積層膜結構 110‧‧‧First transparent conductive laminated film structure

111‧‧‧第一基板 111‧‧‧First substrate

112‧‧‧第一透明導電膜 112‧‧‧First transparent conductive film

113‧‧‧第二透明導電膜 113‧‧‧Second transparent conductive film

120‧‧‧第二透明導電積層膜結構 120‧‧‧Second transparent conductive laminated film structure

121‧‧‧第二基板 121‧‧‧second substrate

122‧‧‧第三透明導電膜 122‧‧‧ Third transparent conductive film

123‧‧‧第四透明導電膜 123‧‧‧fourth transparent conductive film

130‧‧‧光學膠層 130‧‧‧Optical adhesive layer

圖1A及1B為本發明一實施例之透明導電基層膜結構之局部剖視示意圖。 1A and 1B are partial cross-sectional views showing a structure of a transparent conductive base film according to an embodiment of the present invention.

圖2為本發明一實施例之觸控面板結構局部剖視示意圖。 2 is a partial cross-sectional view showing the structure of a touch panel according to an embodiment of the invention.

圖3為本發明另一實施例之觸控面板結構局部剖視示意圖。 3 is a partial cross-sectional view showing the structure of a touch panel according to another embodiment of the present invention.

請參考圖1A,圖1A所示為本發明一實施例之透明導電積層膜結構局部剖視示意圖。透明導電積層膜結構1,由底部向上依序包含:一基板10以及二層以上透明導電膜。這些透明導電膜至少包含一第一透明導電膜20以及一第二透明導電膜30。第一透明導電膜20設置於基板10上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。第二透明導電膜30設置於第一透明導電膜20上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為9%至15%。 Please refer to FIG. 1A. FIG. 1A is a partial cross-sectional view showing the structure of a transparent conductive laminated film according to an embodiment of the present invention. The transparent conductive laminated film structure 1 comprises, in order from the bottom up, a substrate 10 and two or more transparent conductive films. The transparent conductive film includes at least a first transparent conductive film 20 and a second transparent conductive film 30. The first transparent conductive film 20 is disposed on the substrate 10 and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 6% to 7.5%. The second transparent conductive film 30 is disposed on the first transparent conductive film 20 and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 9% to 15%.

沉積透明導電膜的方式可利用物理氣相沉積法,例如使用DC(直流,Direct current)電源之標準之磁控濺鍍法、RF(Radio Frequency,射頻)濺鍍法、RF+DC濺鍍法、脈衝濺鍍法、雙靶磁控濺鍍法或其他濺鍍法。 The method of depositing the transparent conductive film can be performed by physical vapor deposition, for example, a standard magnetron sputtering method using a DC (Direct Current) power source, RF (Radio Frequency) sputtering, and RF+DC sputtering. , pulse sputtering, dual-target magnetron sputtering or other sputtering methods.

於一實施例中,請參考圖1A,其中第一透明導電膜20的厚度占第一透明導電膜20及該第二透明導電膜30的總厚度的40%至60%,且第一透明導電膜20的厚度以及第二透明導電膜的厚度皆為9nm至20nm。又於一實施例中,第一透明導電膜20以及第二透明導電膜30的總厚度小於35nm。 In an embodiment, please refer to FIG. 1A, wherein the thickness of the first transparent conductive film 20 accounts for 40% to 60% of the total thickness of the first transparent conductive film 20 and the second transparent conductive film 30, and the first transparent conductive The thickness of the film 20 and the thickness of the second transparent conductive film are both 9 nm to 20 nm. In still another embodiment, the total thickness of the first transparent conductive film 20 and the second transparent conductive film 30 is less than 35 nm.

於一實施例中,請參考圖1A,透明導電積層膜結構1更包含一層以上的填補層40設置於第一透明導電膜20與基板10之間。當基板10由高分子材料所構成,容易因為高分子顆粒使基板表面粗糙。填補層40可以填補基板表面,降低粗糙度以得到良好的光學性質。填補層40,或由濕式塗佈而形成,或由乾式濺鍍而形成。 In one embodiment, referring to FIG. 1A , the transparent conductive laminated film structure 1 further includes one or more filling layers 40 disposed between the first transparent conductive film 20 and the substrate 10 . When the substrate 10 is composed of a polymer material, it is easy to roughen the surface of the substrate due to the polymer particles. The fill layer 40 can fill the surface of the substrate and reduce the roughness to obtain good optical properties. The fill layer 40 is either formed by wet coating or by dry sputtering.

又於另一實施例中,請參考圖1B,透明導電積層膜結構1更包含一透明保護膜50設置於第二透明導電膜30之上,用於保護第二透明導電膜30,提升觸控面板成品的耐用度,並且減輕或免於外界的撞擊、尖銳物的刮刺、水分或化學物的侵入等等物理化學傷害。另外,透明導電積層膜結構1亦可包含一硬化層60(如圖1B所示),設置於基板10之下方,具有保護基板10的作用。 In another embodiment, referring to FIG. 1B, the transparent conductive laminated film structure 1 further includes a transparent protective film 50 disposed on the second transparent conductive film 30 for protecting the second transparent conductive film 30 and improving the touch. The durability of the finished panel, and to reduce or avoid external physical impact, sharp object scratching, moisture or chemical intrusion and other physical and chemical damage. In addition, the transparent conductive laminated film structure 1 may further include a hardened layer 60 (shown in FIG. 1B) disposed under the substrate 10 to protect the substrate 10.

於一實施例中,請參考圖1A及1B,基板10由聚酯系樹脂、聚碳酸酯系樹脂或聚烯烴系樹脂等高分子材料所組成,並為一透明基板。 In one embodiment, referring to FIGS. 1A and 1B, the substrate 10 is composed of a polymer material such as a polyester resin, a polycarbonate resin, or a polyolefin resin, and is a transparent substrate.

本發明的透明導電積層膜結構採用了特定範圍的組成比例,改變了透明導電膜沉積與結晶的性質,因此可降低製程溫度及時間。於先前技術中,以物理濺鍍為例,在基板鍍上透明導電膜時,需要將基材升溫到140℃。鍍膜完成後,需要在140℃下進行數小時的退火處理以得到良好的結晶性質。反觀本發明,在沉積透明薄電膜時可採用較低溫(低於100℃)之製程。基板僅需加熱至至80℃以下,較佳者,為40℃至50℃,即可完成鍍膜,避免了高分子基板的熱變形。此外,當鍍膜完成後,尚需經過一退火製程。依據本發明的透明導電積層膜結構,僅需要退火30分鐘至40分鐘,即可完成消除缺陷及內應力、再結晶及晶粒成長等過程,大幅節省了製程時間及能源、降低成本。結晶化以後的透明導電層,具備了低阻抗、高透射率、高耐久性等特性,其中阻抗值(表面電阻)分布在85至170 Ω/□(歐姆/平方)之間,較佳者, 為150 Ω/□,適合應用在電容式觸控面板上,尤其是投影型靜電容量方式觸控面板。 The transparent conductive laminated film structure of the present invention adopts a specific range of composition ratio, and changes the properties of deposition and crystallization of the transparent conductive film, thereby reducing the process temperature and time. In the prior art, in the case of physical sputtering, when the substrate is plated with a transparent conductive film, the substrate needs to be heated to 140 ° C. After the coating is completed, annealing treatment at 140 ° C for several hours is required to obtain good crystal properties. In contrast, the present invention can employ a lower temperature (less than 100 ° C) process when depositing a transparent thin film. The substrate only needs to be heated to below 80 ° C, preferably 40 ° C to 50 ° C, to complete the coating, avoiding thermal deformation of the polymer substrate. In addition, after the coating is completed, an annealing process is required. According to the transparent conductive laminated film structure of the present invention, only annealing for 30 minutes to 40 minutes is required, and processes such as eliminating defects and internal stress, recrystallization, and grain growth can be completed, which greatly saves process time, energy, and cost. The transparent conductive layer after crystallization has low impedance, high transmittance, high durability, and the like, wherein the impedance value (surface resistance) is distributed between 85 and 170 Ω/□ (ohm/square), preferably, It is suitable for capacitive touch panels with 150 Ω/□, especially for projected electrostatic capacitance touch panels.

另外,此處亦揭露了一種觸控面板結構,其應用了先前所述的透明導電積層膜結構1。亦即,一種觸控面板結構,包含至少二個透明導電積層膜結構上下堆疊,其中任一透明導電積層膜結構由其底部向上依序包含一基板以及二層以上透明導電膜。這些透明導電膜至少包含一第一透明導電膜以及一第二透明導電膜。第一透明導電膜設置於基板上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為9%至15%。第二透明導電膜設置於第一導電膜上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。 In addition, a touch panel structure is also disclosed herein, which uses the transparent conductive laminated film structure 1 previously described. That is, a touch panel structure comprising at least two transparent conductive laminated film structures stacked one on top of the other, wherein any of the transparent conductive laminated film structures sequentially comprises a substrate and two or more transparent conductive films from the bottom thereof. The transparent conductive film includes at least a first transparent conductive film and a second transparent conductive film. The first transparent conductive film is disposed on the substrate and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 9% to 15%. The second transparent conductive film is disposed on the first conductive film and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 6% to 7.5%.

承上所述,於一實施例中,請參考圖2,圖2所示為根據本發明一實施例之觸控面板結構局部剖面示意圖。觸控面板結構100至少包含了一第一透明導電積層膜結構110、一第二透明導電積層膜結構120上下堆疊,以及一光學膠層130用以黏著第一透明導電積層膜結構110及第二透明導電積層膜結構。第一透明導電積層膜結構110由其底部向上依序包含一第一基板111;一第一透明導電膜112設置於第一基板111上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比例為9%至15%;以及一第二透明導電膜113設置於第一透明導電膜112上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比例為6%至7.5%。第二透明導電積層膜結構120,設置於第一透明導電積層膜結構110之上方,其中第二透明導電積層膜結構120由其底部向上依序包含一第二基板121;一第三透明導電膜122設置於第二基板121上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比例為9%至15%;以及一第四透明導電膜123設置於第三透明導電膜122上,並至少由SnO2以及In2O3所組成,其中SnO2的重量百分比例為6%至7.5%。圖2所示,係為兩個透明導電積層膜110及120同向上下堆疊。另外,亦可如圖3所示,於另一實施例中,兩 個透明導電積層膜110及120對向(以光學膠層130為中心相互對稱)上下堆疊,圖3所示之數字符號如同上述圖2之說明,於此並不贅言。 In one embodiment, please refer to FIG. 2. FIG. 2 is a partial cross-sectional view showing the structure of a touch panel according to an embodiment of the invention. The touch panel structure 100 includes at least a first transparent conductive laminated film structure 110, a second transparent conductive laminated film structure 120 stacked on top of each other, and an optical adhesive layer 130 for adhering the first transparent conductive laminated film structure 110 and the second Transparent conductive laminated film structure. The first transparent conductive laminated film structure 110 includes a first substrate 111 sequentially from the bottom thereof; a first transparent conductive film 112 is disposed on the first substrate 111 and is composed of at least SnO 2 and In 2 O 3 , wherein The weight percentage of SnO 2 is 9% to 15%; and a second transparent conductive film 113 is disposed on the first transparent conductive film 112 and composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 For example, 6% to 7.5%. The second transparent conductive laminated film structure 120 is disposed above the first transparent conductive laminated film structure 110, wherein the second transparent conductive laminated film structure 120 sequentially includes a second substrate 121 from the bottom thereof; a third transparent conductive film 122 is disposed on the second substrate 121 and is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 is 9% to 15%; and a fourth transparent conductive film 123 is disposed on the third transparent conductive The film 122 is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 is 6% to 7.5%. As shown in FIG. 2, the two transparent conductive laminated films 110 and 120 are stacked up and down. In addition, as shown in FIG. 3, in another embodiment, the two transparent conductive laminated films 110 and 120 are vertically stacked on the opposite side (symmetrically centered on the optical adhesive layer 130), and the digital symbols shown in FIG. The description of Figure 2 above is not to be said.

觸控面板結構100(如圖2所示)的運作方式主要是當對於透明導電層施以一壓力(例如手指按壓)後,藉由測量上方與下方透明導電積層膜結構的電容值變化,以得到on或off的結果。 The touch panel structure 100 (shown in FIG. 2) is mainly operated by measuring a change in the capacitance value of the upper and lower transparent conductive laminated film structures after applying a pressure (for example, a finger press) to the transparent conductive layer. Get the result of on or off.

於一實施例中,請參考圖2,其中第一透明導電膜112的厚度占第一透明導電膜112及第二導電膜113的總厚度的40%~60%,且第一透明導電膜20的厚度以及該第二透明導電膜的厚度皆為9~20nm。又於一實施例中,第一透明導電膜112以及第二導電膜113的總厚度小於35nm。又於一實施例中,第一透明導電膜112及第二透明導電膜113之表面電阻為85至170 Ω/□(歐姆/平方)。較佳者,為150 Ω/□。上述內容,同樣適用於第三透明導電膜122及第四透明導電膜123。由於觸控面板結構100採用了低阻抗值的透明導電積層膜結構,因此可應用在電容式觸控面板,例如投射式電容觸控面板。 In an embodiment, please refer to FIG. 2 , wherein the thickness of the first transparent conductive film 112 accounts for 40% to 60% of the total thickness of the first transparent conductive film 112 and the second conductive film 113, and the first transparent conductive film 20 The thickness and the thickness of the second transparent conductive film are both 9 to 20 nm. In still another embodiment, the total thickness of the first transparent conductive film 112 and the second conductive film 113 is less than 35 nm. In still another embodiment, the first transparent conductive film 112 and the second transparent conductive film 113 have a surface resistance of 85 to 170 Ω/□ (ohm/square). Preferably, it is 150 Ω/□. The above applies equally to the third transparent conductive film 122 and the fourth transparent conductive film 123. Since the touch panel structure 100 adopts a transparent conductive laminated film structure with a low impedance value, it can be applied to a capacitive touch panel such as a projected capacitive touch panel.

此處提供實驗數據表格,以說明本發明之功效。請參考表一,表一所示為本發明之實施例與先前技術之比較例的比較結果。 Experimental data tables are provided herein to illustrate the efficacy of the present invention. Please refer to Table 1. Table 1 shows the comparison results between the embodiment of the present invention and the comparative example of the prior art.

根據表一,實施例1至4採用了本發明的特定成分比例,並且可以在低鍍膜溫度下(40℃至50℃)、低退火烘烤時間下(例如30min或50min),使第一透明導電膜及第二透明導電膜獲得較低的表面電阻(Ω/□)及比電阻Ω-cm。因此,本發明之透明導電積層膜結構的確可獲得更佳之性質。 According to Table 1, Examples 1 to 4 employ the specific composition ratio of the present invention, and can be made transparent at a low coating temperature (40 ° C to 50 ° C) and a low annealing baking time (for example, 30 min or 50 min). The conductive film and the second transparent conductive film obtain a lower surface resistance (Ω/□) and a specific resistance Ω-cm. Therefore, the transparent conductive laminated film structure of the present invention can indeed obtain better properties.

綜合上述,藉由本發明所提供的一種透明導電積層膜結構,至少包含了一基板以及二層以上透明導電膜,其中透明導電膜至少由SnO2以及In2O3所組成,並分別具有不同之重量百分比。藉由採用特定之成分比例,得以降低透明導電積層膜結構的製程溫度,並減少製程時間。如此,不但節省能源,也避免了基板的熱變形問題,並得到低阻抗的透明導電積層膜,並可應用於電容式觸控面板結構。 In summary, the transparent conductive laminated film structure provided by the present invention comprises at least one substrate and two or more transparent conductive films, wherein the transparent conductive film is composed of at least SnO 2 and In 2 O 3 and has different Weight percentage. By using a specific composition ratio, the process temperature of the transparent conductive laminated film structure can be reduced, and the process time can be reduced. In this way, not only energy is saved, but also the thermal deformation problem of the substrate is avoided, and a low-conductivity transparent conductive laminated film is obtained, which can be applied to a capacitive touch panel structure.

以上所述之實施例及圖式僅是為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之 內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。 The embodiments and the drawings described above are only for explaining the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the present invention. It is intended that the scope of the invention is not limited thereto, that is, the equivalents and modifications of the invention may be included in the scope of the invention.

1‧‧‧透明導電積層膜結構 1‧‧‧Transparent conductive laminated film structure

10‧‧‧基板 10‧‧‧Substrate

20‧‧‧第一透明導電膜 20‧‧‧First transparent conductive film

30‧‧‧第二透明導電膜 30‧‧‧Second transparent conductive film

40‧‧‧填補層 40‧‧‧ Filling layer

Claims (10)

一種透明導電積層膜結構,該透明導電積層膜結構由其底部向上依序包含:一基板;以及二層以上透明導電膜,其至少包含:一第一透明導電膜,設置於該基板上,該第一透明導電膜至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為9%至15%;以及一第二透明導電膜,設置於該第一透明導電膜上,該第二透明導電膜至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。 A transparent conductive laminated film structure comprising: a substrate from the bottom up; and a transparent conductive film of at least two layers, comprising: a first transparent conductive film disposed on the substrate, the transparent conductive laminated film structure The first transparent conductive film is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 is 9% to 15%; and a second transparent conductive film is disposed on the first transparent conductive film, the first The two transparent conductive films are composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 is 6% to 7.5%. 如請求項1所述之透明導電積層膜結構,其中該第一透明導電膜的厚度占該第一透明導電膜及該第二導電膜的總厚度的40%至60%,且該第一導電透明膜的厚度以及該第二透明導電膜的厚度皆為9nm至20nm。 The transparent conductive laminated film structure of claim 1, wherein the first transparent conductive film has a thickness of 40% to 60% of a total thickness of the first transparent conductive film and the second conductive film, and the first conductive The thickness of the transparent film and the thickness of the second transparent conductive film are both 9 nm to 20 nm. 如請求項1所述之透明導電積層膜結構,其中該第一透明導電膜及該第二導電膜的總厚度小於35nm。 The transparent conductive laminated film structure according to claim 1, wherein the first transparent conductive film and the second conductive film have a total thickness of less than 35 nm. 如請求項1所述之透明導電積層膜結構,更包含一填補層設置於該第一透明導電膜與該基板之間。 The transparent conductive laminated film structure according to claim 1, further comprising a filling layer disposed between the first transparent conductive film and the substrate. 如請求項1所述之透明導電積層膜結構,其中該基板由聚酯系樹脂、聚碳酸酯系樹脂或聚烯烴系樹脂所組成。 The transparent conductive laminated film structure according to claim 1, wherein the substrate is composed of a polyester resin, a polycarbonate resin or a polyolefin resin. 如請求項1所述之透明導電積層膜結構,其中該第一透明導電膜及該第二透明導電膜之表面電阻為85至170 Ω/□(歐姆/平方)。 The transparent conductive laminated film structure according to claim 1, wherein the first transparent conductive film and the second transparent conductive film have a surface resistance of 85 to 170 Ω/□ (ohm/square). 一種觸控面板結構,包含至少二個透明導電積層膜結構上下堆疊,其中任一該透明導電積層膜結構由其底部向上依序包含:一基板;以及 二層以上透明導電膜,其至少包含:一第一透明導電膜,設置於該基板上,該第一透明導電膜至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為9%至15%;以及一第二透明導電膜,設置於該第一透明導電膜上,該第二透明導電膜至少由SnO2以及In2O3所組成,其中SnO2的重量百分比為6%至7.5%。 A touch panel structure comprising at least two transparent conductive laminated film structures stacked on top of each other, wherein any one of the transparent conductive laminated film structures comprises: a substrate upwardly from the bottom thereof; and two or more transparent conductive films, the at least comprising: a first transparent conductive film disposed on the substrate, the first transparent conductive film being composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of SnO 2 is 9% to 15%; and a second transparent conductive The film is disposed on the first transparent conductive film, and the second transparent conductive film is composed of at least SnO 2 and In 2 O 3 , wherein the weight percentage of the SnO 2 is 6% to 7.5%. 如請求項7所述之觸控面板結構,其中該第一透明導電膜的厚度占該第一透明導電膜及該第二導電膜的總厚度的40%至60%,且該第一透明導電膜的厚度以及該第二透明導電膜的厚度皆為9nm至20nm。 The touch panel structure of claim 7, wherein the first transparent conductive film has a thickness of 40% to 60% of a total thickness of the first transparent conductive film and the second conductive film, and the first transparent conductive The thickness of the film and the thickness of the second transparent conductive film are both 9 nm to 20 nm. 如請求項7所述之觸控面板結構,其中該第一透明導電膜及該第二透明導電膜之表面電阻為85至170 Ω/□(歐姆/平方)。 The touch panel structure of claim 7, wherein the first transparent conductive film and the second transparent conductive film have a surface resistance of 85 to 170 Ω/□ (ohm/square). 如請求項7所述之觸控面板結構,其中該觸控面板結構為一投射式電容觸控面板。 The touch panel structure of claim 7, wherein the touch panel structure is a projected capacitive touch panel.
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