TW201410780A - Epoxy resin composition and prepreg and copper clad laminate manufactured by using same - Google Patents

Abstract

The invention relates to an epoxy resin composition and a prepreg and a copper clad laminate manufactured by using the same. The resin composition comprises the following components: epoxy resin with a molecular chain containing three or more epoxy groups and nitrogen, a phosphorus-containing halogen-free flame retardant compound and an active ester curing agent, wherein the amount of the epoxy resin with the molecular chain containing three or more epoxy groups and the nitrogen is 100 parts by weight; the amount of the phosphorus-containing halogen-free flame retardant compound is 10-150 parts by weight; and the equivalence ratio of the amount of the active ester curing agent is calculated to be 0.85-1.2 according to epoxide equivalent and the equivalence ratio of active ester. The prepreg and the copper clad laminate manufactured by using the epoxy resin composition have excellent dielectric property and humidity resistance, higher glass-transition temperature, and lower water absorption simultaneously; and can realize halogen-free flame retardant simultaneously and achieve UL 94V-0.

Description

Epoxy resin composition and prepreg and copper clad laminate prepared using same

The present invention relates to the field of printed circuit boards, and more particularly to a halogen-free epoxy resin composition and a prepreg and a copper-clad laminate produced using the same.

With the high speed and multi-function of electronic product information processing, the application frequency is increasing, 3-6GHz will become the mainstream, in addition to maintaining higher requirements on the heat resistance of laminate materials, its dielectric constant and dielectric loss. Value requirements will be lower and lower. The existing conventional epoxy fiberglass cloth laminate (FR-4) is difficult to meet the high frequency and high speed development requirements of electronic products, and the substrate material is no longer a mechanical support role in the traditional sense, but will be with electronic components. Together, it is an important way for printed circuit board (PCB) and terminal manufacturer designers to improve product performance. Because the high dielectric constant (DK) slows the signal transmission rate, the high dielectric loss value (Df) causes the signal portion to be converted into thermal energy loss in the substrate material, thus reducing the dielectric constant and dielectric loss value has become a substrate manufacturer. Chasing hot spots. Conventional epoxy fiberglass cloth laminate materials mostly use dicyandiamide as a curing agent. This kind of curing agent has good process operability due to its tertiary reaction amine, but it is easy to be high temperature due to its weak carbon-nitrogen bond. Cracking, resulting in a low temperature decomposition resistance of the cured product, can not meet the heat resistance requirements of the lead-free process. In this context, with the wide-scale implementation of the lead-free process in 2006, phenolic resins have been used as curing agents for epoxy resins in the industry. Phenolic resins have a high-density benzene ring heat-resistant structure, so the heat-resistant system after epoxy curing The properties are very excellent, but at the same time there is a tendency that the dielectric properties of the cured product are deteriorated.

Japanese Patent Laid-Open Publication No. 2002-012650, No. 2003-082063 proposes the synthesis of a series of active ester curing agents containing a benzene ring, a naphthalene ring or a biphenyl structure as curing agents for epoxy resins, such as IAAN, IABN, TriABN and TAAN. The cured product can significantly reduce its dielectric constant and dielectric loss value compared to conventional phenolic resins.

Japanese Patent Laid-Open No. 2003-252958 proposes to use a biphenyl type epoxy resin and an active ester as a curing agent to obtain a cured product having a reduced dielectric constant and dielectric loss value, but the epoxy resin used is a bifunctional and active ester. The curing crosslink density is low, the heat resistance of the cured product is low, and the glass transition temperature is low.

Japanese Patent Laid-Open No. 2004-155990, which uses an aromatic carboxylic acid to react with an aromatic phenol to obtain a polyfunctional active ester curing agent. The active ester curing agent can be used to cure a phenolic epoxy to obtain higher heat resistance and lower dielectric properties. A cured product of constant and dielectric loss values.

Japanese Patent Laid-Open No. 2009-235165 proposes a novel polyfunctional active ester curing agent which cures an epoxy resin containing an aliphatic structure and can simultaneously have a high glass transition temperature and a low dielectric constant and dielectric loss. The cured product of the value.

Japanese Laid-Open Patent Publication No. 2009-040919 proposes a thermosetting resin composition having a stable dielectric constant and excellent electrical conductivity, and the main components include an epoxy resin, an active ester hardener, a hardening accelerator, and an organic solvent. The obtained cured product has good copper foil adhesion, low dielectric constant and dielectric loss value, and the amount of epoxy resin and active ester is studied for the relationship between epoxy resin and active ester structure and properties. No research has been done.

In addition, Japanese Patent Laid-Open No. 2009-242559, JP-A-2009-242560, JP-A-2010-077344, and JP-A-2010-077343 respectively propose the use of alkylated phenol or alkylated naphthol novolac type epoxy resin, biphenyl type. A phenolic epoxy resin, which uses an active ester as a curing agent, can obtain a cured product having low hygroscopicity, low dielectric constant, and dielectric loss tangent.

In the above prior patents, although it is proposed that the use of an active ester as an epoxy resin can improve the moisture resistance of the cured product, reduce the water absorption rate, and lower the dielectric constant and dielectric loss value of the cured product, but the disadvantage is that it is difficult to be heat resistant. A good balance between the properties and dielectric properties allows the cured product to have both a high glass transition temperature and a low dielectric loss tangent, and its dielectric properties are relatively stable with frequency and water absorption is lower. . At the same time, no research has been done on how to achieve the halogen-free flame retardancy of the cured product.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an epoxy resin composition which is capable of providing excellent dielectric properties, moisture and heat resistance required for a copper clad laminate, and achieving halogen-free flame retardancy to UL 94 V-0.

Another object of the present invention is to provide a prepreg and a copper-clad laminate which are prepared by using the above epoxy resin composition, which have excellent dielectric properties, heat and humidity resistance, and high glass transition temperature and lower. The water absorption rate, while achieving halogen-free flame retardant, reaches UL 94 V-0.

In order to achieve the above object, the present invention provides an epoxy resin composition comprising the following components: an epoxy resin having 3 or more epoxy groups in a molecular chain and containing a nitrogen element, and a phosphorus-free halogen-free flame retardant a compound and an active ester curing agent; the epoxy resin containing 3 or more epoxy groups in the molecular chain and containing a nitrogen element is used in an amount of 100 parts by weight, and the phosphorus-containing halogen-free flame retardant compound is used. The amount of the equivalent ratio of the active ester curing agent is from 10 to 150 parts by weight, based on the epoxy equivalent and the active ester equivalent ratio, and is from 0.85 to 1.2.

The epoxy resin containing three or more epoxy groups in the molecular chain and containing a nitrogen element is at least one of epoxy resins having the following structural formula:

Where n is an integer value from 1 to 3; Ar is:

The active ester curing agent is obtained by reacting a phenolic compound linked by an aliphatic cyclic hydrocarbon structure, a difunctional carboxylic acid aromatic compound or an acid halide, and a monohydroxy compound.

The amount of the difunctional carboxylic acid aromatic compound or acid halide is 1 mol, and the amount of the phenolic compound linked by the aliphatic cyclic hydrocarbon structure is 0.05 to 0.75 mol, and the amount of the monohydroxy compound is 0.25 to 0.95 mol.

The structural formula of the active ester curing agent is as follows:

Wherein X is a benzene or naphthalene ring, j is 0 or 1, k is 0 or 1, and n is 0.25-2.5.

The phosphorus-containing halogen-free flame retardant compound is one or more of a phosphate compound, a phosphate compound, a phosphazene compound, a phosphophenanthrene compound and a derivative thereof, a phosphorus-containing phenol resin, and a phosphated polycarbonate. a mixture; the phosphorus-containing halogen-free flame retardant compound has a phosphorus content of 5 to 30% by weight.

Further, the epoxy resin composition further contains a curing accelerator which is one or a mixture of an imidazole and a derivative compound thereof, an acridine compound, a Lewis acid, and a triphenylphosphine.

Still further, the epoxy resin composition further includes an organic filler, an inorganic filler, or a mixture of an organic filler and an inorganic filler, the filler being used in an amount relative to the epoxy resin, the active ester curing agent, and the The total amount of the phosphorus halogen-free flame retardant compound is from 5 to 500 parts by weight based on 100 parts by weight.

The inorganic filler is selected from the group consisting of crystalline cerium oxide, molten cerium oxide, spherical cerium oxide, hollow cerium oxide, glass powder, aluminum nitride, boron nitride, cerium carbide, aluminum hydroxide, titanium dioxide, barium titanate. One or more of barium titanate, alumina, barium sulfate, talc, calcium silicate, calcium carbonate, and mica; the organic filler is selected from the group consisting of polytetrafluoroethylene powder, polyphenylene sulfide, and polyether oxime One or more of the powders.

Meanwhile, the present invention also provides a prepreg prepared by using the above epoxy resin composition, comprising a reinforcing material and an epoxy resin composition adhered thereto by impregnation and drying.

Further, the present invention also provides a copper-clad laminate produced using the above prepreg, comprising a plurality of laminated prepregs, and a copper foil laminated on one or both sides of the laminated prepreg. Advantageous Effects of Invention: First, the epoxy resin composition of the present invention employs an epoxy resin containing a nitrogen element in a molecular chain, which has a high functionality, and may contain an active ester curing agent due to the presence of nitrogen. The phosphorus element exerts a synergistic flame retardant effect, and while providing high heat resistance, the flame retardant requirement can be achieved with as little phosphorus flame retardant as possible; secondly, the epoxy resin composition of the present invention is treated with an active ester The curing agent fully exerts the advantage that the active ester and the epoxy react without generating a polar group, thereby having excellent dielectric properties and good moist heat resistance, and the phosphorus-containing flame retardant having a specific structure does not sacrifice the heat resistance of the original cured product, Low-water absorption and excellent dielectric properties, halogen-free flame retardant is achieved, and the flame retardancy of the cured product reaches the flame-resistant grade UL94 V-0; finally, the prepreg prepared by using the above epoxy resin composition of the present invention and the coating thereof Copper foil laminate with excellent dielectric properties, moisture and heat resistance, and flame retardancy up to UL94 V-0.

The structure, features, and other objects of the present invention will be described in detail in the preferred embodiments of the invention. The invention and the preferred embodiments are illustrated for illustrative purposes and are not intended to be limiting.

The invention provides an epoxy resin composition comprising the following components: an epoxy resin containing 3 or more epoxy groups in a molecular chain and containing a nitrogen element, a phosphorus-containing halogen-free flame retardant compound and an active ester curing Agent.

The epoxy resin containing three or more epoxy groups in the molecular chain and containing a nitrogen element is at least one of epoxy resins having the following structural formula:

Formula I

Where n is an integer value from 1 to 3; Ar can be:

The structural formula of the nitrogen-containing epoxy resin described in the present invention is specifically as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

The structural formula of the nitrogen-containing epoxy resin described in the present invention may specifically be as follows:

In the epoxy resin composition of the present invention, the active ester curing agent is reacted by a phenolic compound, a difunctional carboxylic acid aromatic compound or an acid halide and a monohydroxy compound linked by an aliphatic cyclic hydrocarbon structure. And got it. The active ester mainly functions to cure the epoxy resin. Since it does not have secondary hydroxyl groups after curing, the epoxy resin has no hydroxyl group in the cured product, and has good dielectric properties and low water absorption. Rate, good resistance to heat and humidity.

The amount of the difunctional carboxylic acid aromatic compound or acid halide is 1 mol, and the amount of the phenolic compound linked by the aliphatic cyclic hydrocarbon structure is 0.05 to 0.75 mol, and the amount of the monohydroxy compound is 0.25 to 0.95 mol.

The difunctional hydroxycarboxy compound may be a compound having the following structural formula:

The structure of the phenolic compound linked by an aliphatic cyclic hydrocarbon structure is as follows:

The active ester curing agent is an active ester of the following structural formula:

Wherein X is a benzene or naphthalene ring, j is 0 or 1, k is 0 or 1, and n is 0.25-2.5.

The active ester curing agent is used in an amount of 100 parts by weight of the epoxy resin containing 3 or more epoxy groups and containing a nitrogen element, and is calculated according to the epoxy equivalent and the active ester equivalent ratio. The amount ratio is 0.85 to 1.2, preferably 0.9 to 1.1, and most preferably 0.95 to 1.05.

In the epoxy resin composition of the present invention, the phosphorus-containing halogen-free flame retardant compound is a phosphate compound, a phosphate compound, a phosphazene compound, a phosphorus phenanthrene compound and a derivative thereof, a phosphorus-containing phenol resin, and a mixture of one or more of the phosphatized polycarbonates; the phosphorus-containing halogen-free flame retardant compound has a phosphorus content of 5 to 30% by weight.

The phosphate compound may be selected from an aromatic phosphate compound, specifically resorcinol-bis(diphenyl phosphate), bisphenol A-bis(diphenyl phosphate), resorcinol-bis(phosphoric acid- 2,6-Dimethylphenyl ester), or biphenyldiol-bis(phosphoric acid-2,6-dimethylphenyl ester). Commercially available products such as CR-741, PX-200, PX-202, etc.; the phosphazene compound may be selected from tripolyphosphazene or tetraphosphazene, and the commercially available product may be SPB-100; The phenanthrene compound and its derivative may be 9,10-dihydro-9-oxa-10-phosphinophen-10-oxide, tris(2,6-dimethylphenyl)phosphine, 10-(2,5) -dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphinophen-10-oxide, 2,6-bis(2,6-dimethylphenyl)phosphinobenzene or 10 -Phenyl-9,10-dihydro-9-oxa-10-phosphinophen-10-oxide; the phosphorus-containing phenolic resin may be 9,10-dihydro-9-oxa-10-phosphine -10-Oxide (DOPO) modified phenolic, which may be selected from the group consisting of novolacs, cresol novolacs, bisphenol A novolacs, biphenol aldehydes, aralkyl phenols or polyfunctional phenolics. The optional commercial product is XZ92741.

The phosphorus-containing halogen-free flame retardant compound described in the present invention is intended to be flame-retardant, and to ensure better comprehensive properties of the cured product, such as heat resistance and hydrolysis resistance, the phosphorus-containing halogen-free flame retardant compound The amount of addition is 10 to 150 parts by weight, and more preferably 20 to 120, based on 100 parts by weight of the total of the epoxy resin, the active ester curing agent, and the phosphorus-containing halogen-free flame retardant compound. Parts by weight.

The curing accelerator is not particularly limited as long as it can catalyze the reaction of the epoxy functional group and lower the reaction temperature of the curing system, and is preferably an imidazole compound and a derivative thereof, an acridine compound, a Lewis acid, and a triphenyl group. One or more mixtures of phosphines. The imidazole compound may, for example, be 2-methylimidazole, 2-phenylimidazole or 2-ethyl-4-methylimidazole, and the acridine compound may be exemplified by 2,3-diaminoacridine. 2,5-diaminoacridine 2,6-diaminoacridine, 2,5-diamino, 2-amino-3-methylacridine, 2-amino-4-4methylacridine, 2-amino 3-nitroacridine, 2-amino-5-nitroacridine, 4-dimethylaminoacridine. The amount of the accelerator is 0.05 to 1.0 part by weight based on 100 parts by weight of the total of the epoxy resin, the active ester curing agent, and the phosphorus-containing halogen-free flame retardant compound.

The present invention may further contain an organic filler, an inorganic filler, or a mixture of an organic filler and an inorganic filler, if necessary. The filler to be added as needed is not particularly limited, and the inorganic filler may be selected from the group consisting of crystalline cerium oxide, molten cerium oxide, spherical cerium oxide, hollow cerium oxide, glass powder, aluminum nitride, boron nitride, and carbonization. One or more of cerium, aluminum hydroxide, titanium dioxide, barium titanate, barium titanate, aluminum oxide, barium sulfate, talc, calcium silicate, calcium carbonate, and mica; the organic filler may be selected from polytetrafluoroethylene powder One or more of polyphenylene sulfide, and polyether enamel powder. Further, the shape, particle diameter, and the like of the inorganic filler are not particularly limited, and usually have a particle diameter of 0.01 to 50 μm, preferably 0.01 to 20 μm, particularly preferably 0.1 to 10 μm, and the inorganic filler having such a particle size range is more easily dispersed in the resin liquid. . Further, the amount of the filler is not particularly limited, and is 5-500 based on 100 parts by weight of the total of the epoxy resin, the active ester curing agent, and the phosphorus-containing halogen-free flame retardant compound. The parts by weight are preferably 5 to 300 parts by weight, more preferably 5 to 200 parts by weight, particularly preferably 15 to 100 parts by weight.

The prepreg prepared using the above epoxy resin composition includes a reinforcing material and an epoxy resin composition adhered thereto by impregnation and drying, and the reinforcing material is a prior art reinforcing material such as a glass cloth or the like.

A copper-clad laminate produced using the above epoxy resin composition comprises a plurality of laminated prepregs, and a copper foil laminated on one or both sides of the laminated prepreg.

The epoxy resin composition of the present invention is made into a certain concentration of a glue, and the prepreg is obtained by impregnating the reinforcing material, then drying at a certain temperature, volatilizing the solvent, and semi-curing the resin composition. Then, one or more of the prepregs described above are stacked in a certain order, and the copper foil is respectively pressed on both sides of the prepreg which are superposed on each other, and cured in a hot press to obtain a copper-clad laminate. The curing temperature is 150-250 ° C and the curing pressure is 25-60 Kg/cm ² .

The dielectric constant and dielectric loss factor, glass transition temperature and moisture heat resistance of the copper-clad laminate produced above were measured and described and described in detail in the following examples.

Example 1:

Take a container and add 100 parts by weight of 4'4-diaminodiphenylmethanetetraglycidylamine resin KES-224 (Kolon, Korea, EEW is 125g/mol, then add 178.4 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, active ester equivalent is 223g / mol), stirring evenly, then add flame retardant aluminum phosphate OP935 (Clariant, phosphorus content of 23%) 30 parts by weight and then add appropriate amount of DMAP, and solvent toluene, continue Stir well to form a glue. Dip the above glue with a glass fiber cloth (model 2116, thickness 0.08 mm), and control to a suitable thickness, then dry and remove the solvent to obtain a prepreg. Use several prepregs obtained from each other. Lamination, pressing a copper foil on each side thereof, and curing in a hot press to form the copper clad laminate. Curing in a hot press to obtain a copper clad laminate, the curing temperature thereof The temperature was 200 ° C, the curing pressure was 30 Kg/cm ² , and the curing time was 90 min.

Example 2:

Take a container and add 100 parts by weight of p-aminotrifluoroglycidylamine resin MY0500 (Hunstman, EEW is 110g/mol, then add 192.6 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, the active ester equivalent is 223g / mol), stirring evenly, and then added flame retardant DOPO modified phenolic resin XZ92741 (DOW company, phosphorus content of 9%) 87.5 parts by weight, after stirring evenly, then add appropriate amount of DMAP, and solvent toluene, continue to stir evenly Gluing liquid. The above glue is impregnated with a glass fiber cloth (model 2116, thickness 0.08 mm), and controlled to a suitable thickness, and then the solvent is removed by drying to obtain a prepreg. The prepregs obtained by using several sheets are superposed on each other. A copper foil is laminated on each of the two sides and cured in a hot press to form the copper-clad laminate. The copper-clad laminate is cured in a hot press and has a curing temperature of 200 ° C. The curing pressure was 30 Kg/cm ² and the curing time was 90 min.

Example 3:

Take a container and add 100 parts by weight of 4'4-diaminodiphenylmethanetetraglycidylamine resin KES-224 (Kolon, Korea, EEW is 125g/mol, then add 178.4 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, active ester equivalent is 223g / mol), stirring evenly, and then added flame retardant phenoxyphosphazene compound SPB-100 (Japan Otsuka company, phosphorus content of 12%) 69.6 parts by weight, after stirring evenly, and then Add appropriate amount of DMAP, and solvent toluene, continue to stir and form a glue. Dip the above glue with glass fiber cloth (model 2116, thickness 0.08 mm), control to a suitable thickness, and then dry to remove the solvent to obtain a prepreg. The prepregs obtained by using a plurality of sheets are laminated on each other, and a copper foil is pressed on both sides thereof, and placed in a hot press to be cured to form the copper-clad laminate. The curing is carried out in a hot press. A copper clad laminate having a curing temperature of 200 ° C, a curing pressure of 30 Kg/cm ² and a curing time of 90 min.

Example 4:

Take a container and add 100 parts by weight of 4'4-diaminodiphenylmethanetetraglycidylamine resin KES-224 (Kolon, Korea, EEW is 125g/mol, then add 178.4 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, the active ester equivalent is 223g / mol), stirring evenly, and then add the phosphate ester flame retardant compound PX-202 (Japan DAIHACHI, phosphorus content of 8%) 119.3 parts by weight, after stirring evenly, add appropriate amount of DMAP And solvent toluene, continue to stir and form a glue. Dip the above glue with glass fiber cloth (model 2116, thickness 0.08mm), and control to a suitable thickness, then dry to remove the solvent to obtain a prepreg. The prepared prepregs are superposed on each other, and a copper foil is pressed on both sides thereof and placed in a hot press to be cured to form the copper clad laminate. The copper foil is cured in a hot press. The laminate had a curing temperature of 200 ° C, a curing pressure of 30 Kg/cm ² and a curing time of 90 min.

Comparative Example 1:

Take a container, add 100 parts by weight of cresol novolac epoxy resin N690 (Japan DIC company, EEW is 205g / mol, then add 108.8 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, the active ester equivalent is 223g / mol), stir evenly, then add flame retardant aluminum phosphate OP930 (Clariant, phosphorus content of 23%) 32.5 parts by weight, stir evenly, then add appropriate amount of DMAP, and solvent toluene, continue to stir evenly Glue. The above glue is impregnated with a glass fiber cloth (model 2116, thickness 0.08 mm), and controlled to a suitable thickness, and then the solvent is removed by drying to obtain a prepreg. The prepregs obtained by using several sheets are superposed on each other. A copper foil is pressed on both sides thereof and cured in a hot press to form the copper-clad laminate. The copper-clad laminate is cured in a hot press, and the curing temperature is 200 ° C. The curing pressure was 30 Kg/cm ² and the curing time was 90 min.

Comparative Example 2:

Take a container and add 100 parts by weight of 4'4-diaminodiphenylmethanetetraglycidylamine resin KES-224 (Kolon, Korea, EEW is 125g/mol, then add 178.4 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, the active ester equivalent is 223g / mol), stir evenly, then add ethylene bis-tetrabromophthalimide BT-93W (Yabao Chemical, bromine content: 67.2%) 69.6 parts by weight and then add Appropriate amount of DMAP, and solvent toluene, continue to stir and form a glue. Dip the above glue with glass fiber cloth (model 2116, thickness 0.08mm), control to a suitable thickness, and then dry to remove the solvent to obtain a prepreg. A plurality of prepared prepregs are superposed on each other, and a copper foil is pressed on both sides thereof and placed in a heat press to form the copper-clad laminate. The composite is cured in a hot press. A copper foil laminate having a curing temperature of 200 ° C, a curing pressure of 30 Kg/cm 2 and a curing time of 90 min.

The various physical properties of the copper clad laminates prepared in the above examples and comparative examples are shown in Table 1.

The test methods for the above characteristics are as follows:

(1) Glass transition temperature (Tg): Measured according to the DMA test method specified in IPC-TM-650 2.4.24 using a DMA test.

(2) Dielectric constant and dielectric loss factor: tested according to the SPDR method.

(3) Evaluation of moisture and heat resistance: After etching the copper foil on the surface of the copper clad laminate, the substrate was evaluated; the substrate was placed in a pressure cooker, treated at 120 ° C, 105 KPa for 2 h; and then immersed in a tin furnace at 288 ° C, when the substrate was divided The corresponding time is recorded when the layer is blasted; the evaluation can be ended when the substrate has not appeared bubbles or delamination in the tin furnace for more than 5 minutes (min).

(4) Flame retardancy: It was carried out in accordance with the UL 94 standard method.

Physical analysis

From the physical property data of Table 1, it is known that Examples 1-4, compared with the curing of the novolac epoxy resin and the active ester in Comparative Example 1, are co-cured by using a nitrogen-containing polyfunctional epoxy resin active ester, nitrogen element The present invention can synergistically flame retardant with the phosphorus flame retardant, and has good flame retardancy, and at the same time, the obtained laminate material has low water absorption, excellent dielectric properties and moist heat resistance, and high glass transition temperature.

In summary, the epoxy resin composition of the present invention comprises a nitrogen-containing epoxy resin in a molecular chain, an active ester curing agent, and a phosphorus-containing halogen-free flame retardant compound; compared with a general copper foil substrate, The copper-clad laminate obtained by using the epoxy resin composition of the invention has more excellent dielectric properties, high glass transition temperature, and good heat and humidity resistance, and realizes a halogen-free flame retardant V-0 grade. Suitable for halogen-free high frequency applications.

The above examples are not intended to limit the content of the composition of the present invention, and any minor modifications, equivalent changes and modifications made to the above examples in accordance with the technical spirit or composition or content of the composition of the present invention still belong to the present technology. Within the scope of the program. In summary, the present invention can achieve the above functions and purposes, so the present invention should meet the requirements of the patent application, and apply in accordance with the law.

Claims (10)

An epoxy resin composition comprising the following components: an epoxy resin containing 3 or more epoxy groups in a molecular chain and containing a nitrogen element, a phosphorus-containing halogen-free flame retardant compound and an active ester curing agent; The epoxy resin containing 3 or more epoxy groups and containing a nitrogen element is used in an amount of 100 parts by weight, and the phosphorus-containing halogen-free flame retardant compound is used in an amount of 10 to 150 parts by weight. The equivalent ratio of the active ester curing agent is 0.85 to 1.2 based on the epoxy equivalent and the active ester equivalent ratio. The epoxy resin composition according to claim 1, wherein the epoxy resin containing three or more epoxy groups in the molecular chain and containing a nitrogen element is a ring having the following structural formula; At least one of oxygen resins: Where n is an integer value from 1 to 3; Ar is: The epoxy resin composition according to claim 1, wherein the phosphorus-containing halogen-free flame retardant compound is a phosphate compound, a phosphate compound, a phosphazene compound, a phosphophenanthrene compound and a derivative thereof, a mixture of one or more of a phosphorus-containing phenolic resin and a phosphatized polycarbonate; the phosphorus-containing halogen-free flame retardant compound has a phosphorus content of 5 to 30% by weight. The epoxy resin composition according to claim 1, wherein the active ester curing agent is a phenolic compound, a difunctional carboxylic acid aromatic compound or an acid halide which is linked by an aliphatic cyclic hydrocarbon structure. And a monohydroxy compound is reacted to obtain. The epoxy resin composition according to claim 4, wherein the difunctional carboxylic acid aromatic compound or acid halide is used in an amount of 1 mol, and the amount of the phenolic compound linked by the aliphatic cyclic hydrocarbon structure is 0.05~0.75mol, the amount of the monohydroxy compound is 0.25~0.95mol. The epoxy resin composition according to claim 1, wherein the active ester curing agent has the following structural formula: Wherein X is a benzene or naphthalene ring, j is 0 or 1, k is 0 or 1, and n is 0.25-2.5. The epoxy resin composition according to claim 1, further comprising a curing accelerator, wherein the curing accelerator is an imidazole compound and a derivative thereof, an acridine compound, a Lewis acid, and a triphenylphosphine. One or more mixtures. The epoxy resin composition according to claim 1, further comprising an organic filler, an inorganic filler or a mixture of an organic filler and an inorganic filler, the filler being used in an amount relative to the epoxy resin, the active ester The inorganic filler is selected from the group consisting of crystalline cerium oxide, molten cerium oxide, spherical cerium oxide, and the total amount of the curing agent and the phosphorus-containing halogen-free flame retardant compound is from 5 to 500 parts by weight. Hollow ceria, glass powder, aluminum nitride, boron nitride, tantalum carbide, aluminum hydroxide, titanium dioxide, barium titanate, barium titanate, aluminum oxide, barium sulfate, talc, calcium citrate, calcium carbonate, and One or more of mica; the organic filler is selected from one or more of polytetrafluoroethylene powder, polyphenylene sulfide, and polyether strontium powder. The prepreg prepared by the epoxy resin composition of claim 1 includes a reinforcing material and an epoxy resin composition adhered thereto by impregnation and drying. A copper-clad laminate produced by using a prepreg prepared by the epoxy resin composition according to claim 9 includes a plurality of laminated prepregs and a copper foil laminated on one side or both sides of the laminated prepreg .