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TW201316677A - Method for designing wideband low noise amplifier - Google Patents

Method for designing wideband low noise amplifier Download PDF

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TW201316677A
TW201316677A TW100136369A TW100136369A TW201316677A TW 201316677 A TW201316677 A TW 201316677A TW 100136369 A TW100136369 A TW 100136369A TW 100136369 A TW100136369 A TW 100136369A TW 201316677 A TW201316677 A TW 201316677A
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amplifying circuit
ghz
transistor
common
circuit
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TW100136369A
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TWI462470B (en
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Yu-Tsung Lo
Jean-Fu Kiang
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Univ Nat Taiwan
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Abstract

The present invention discloses a method for designing a wideband low-noise amplifier (LNA), which is processed with a simulation software. The method is mainly to design the wideband LNA constructed by cascading a common-gate amplifier and a common-source amplifier with an inter-stage matching network. According to a predetermined design frequency band to obtain a resonant frequency and choosing the transistor specifications of the common-gate amplifier and the common-source amplifier, conjugate matching at high and low bands of the common-gate amplifier and the common-source amplifier is achieved by applying the proposed matching technique and the mid-band gain is compensated for by the common-source amplifier. After combining the two amplifiers to form the wideband LNA, the wideband LNA provides enough gain in the entire band. The method of the invention quickly and efficiently enables a wideband LNA design.

Description

寬頻低雜訊放大器之設計方法Design method of broadband low noise amplifier

本發明係為一種寬頻低雜訊放大器之設計方法,其特別有關於一種應用於通訊系統的寬頻低雜訊放大器之設計方法。The invention is a design method of a broadband low noise amplifier, and particularly relates to a design method of a broadband low noise amplifier applied to a communication system.

在寬頻無線通訊系統中,設計一個寬頻低雜訊放大器時最富挑戰性的任務便是阻抗匹配和最小雜訊指數匹配。傳統電晶體的寄生效應和阻抗匹配技巧往往限制了放大器的頻寬,例如2004年「IEEE Journal of Solid-State Circuits」中發表的「An ultrawideband CMOS low noise amplifier for 3.1-10.6 GHz wireless receivers」即是利用LC ladder-filter方法作輸入匹配,此LC ladder濾波器被安置在共源極放大器的輸入端,但相對的LC ladder濾波器的插入損失會升高雜訊指數。In broadband wireless communication systems, the most challenging task in designing a wideband low noise amplifier is impedance matching and minimum noise index matching. The parasitic effects and impedance matching techniques of conventional transistors often limit the bandwidth of amplifiers. For example, "An ultrawideband CMOS low noise amplifier for 3.1-10.6 GHz wireless receivers" published in the IEEE Transactions of Solid State Circuits in 2004 is Using the LC ladder-filter method for input matching, the LC ladder filter is placed at the input of the common source amplifier, but the insertion loss of the opposite LC ladder filter increases the noise index.

又如2007年「IEEE Microwave Wireless Comp. Lett.」中發表的「A 3.1-10.6 GHz ultrawideband CMOS low noise amplifier with current-reused technique」,其中使用了另外一種中間級的電感電容電路用以增加功率增益,但是在10 GHz頻段範圍的雜訊指數卻高達了約6 dB,而此種電路架構會造成較高的雜訊指數。Another example is the "A 3.1-10.6 GHz ultrawideband CMOS low noise amplifier with current-reused technique" published in "IEEE Microwave Wireless Comp. Lett." in 2007, in which another intermediate-level inductor-capacitor circuit is used to increase the power gain. However, the noise index in the 10 GHz band is as high as about 6 dB, and this circuit architecture will result in a higher noise index.

2007年在「Springer」中由F. Ellinger發表的「Radio frequency integrated circuits and technologies」揭露了維持轉導固定時,用較高的閘極電壓加至小尺寸電晶體,以降低電容寄生效應的技術內容,因此在相同的雜訊大小,可獲得更寬的頻帶。然而,此一技術內容仍然會增加功率消耗並且頻寬仍受到限制。"Radio frequency integrated circuits and technologies" published by F. Ellinger in "Springer" in 2007 revealed a technique for reducing the parasitic effect of capacitance by using a higher gate voltage to a small-sized transistor while maintaining transduction. Content, so at the same noise size, a wider frequency band can be obtained. However, this technical content still increases power consumption and bandwidth is still limited.

在習知技術中,雖然分散式放大器可提供較大的頻寬,但是卻也會有較大的功率消耗、佔據較大的晶片面積並且有較高的雜訊指數。如2007年「IEEE Microwave Wireless Comp. Lett.」中,所發表的「A 0.6v low power UWB CMOS LNA」則是使用了較大的晶片面積,並造成晶片設計及產品應用上的困擾。In the prior art, although the distributed amplifier can provide a larger bandwidth, it also has a larger power consumption, occupies a larger wafer area, and has a higher noise index. For example, in "IEEE Microwave Wireless Comp. Lett." in 2007, the "A 0.6v low power UWB CMOS LNA" was used, which used a large wafer area and caused problems in chip design and product application.

為了具有較佳的雜訊指數與穩定度特性,習知技術中已有使用負回授技巧設計寬頻放大器,例如2008年「IEEE Trans. Microwave Theory Tech.」所發表的「Resistive-feedback low-noise amplifers for multiband applications」便是利用前述負回授技巧使放大器具有低雜訊指數和較佳的穩定度特性,又例如2010年「IEEE Trans. Microwave Theory Tech.」中,所發表的「Low-noise amplifier design with dual reactive feedback for broadband simultaneous noise and impedance matching」利用雙電抗回授的方法,使共源極放大器達到寬頻低雜訊和阻抗匹配,又或者是例如2010年「IEEE Trans. Microwave Theory Tech.」中發表的「Analysis and design of a CMOS UWB LNA with dual-RLC branch wideband input matching network」利用電阻回授和電感補償技術設計出在3.1-10.6 GHz的頻段具有3.7-4.7 dB的雜訊指數。然而,使用負回授技巧設計寬頻放大器,雖可換取寬頻增益的平坦度,但卻會劣化增益及雜訊指數。In order to have better noise index and stability characteristics, a conventional wideband amplifier has been designed using negative feedback techniques, such as "Resistive-feedback low-noise" published by IEEE Trans. Microwave Theory Tech. in 2008. "Amplifers for multiband applications" uses the aforementioned negative feedback technique to make the amplifier have a low noise index and better stability characteristics. For example, in "2010 Trans. Microwave Theory Tech.", "Low-noise" Amplifier design with dual reactive feedback for broadband simultaneous noise and impedance matching uses a dual reactance feedback method to achieve wideband low noise and impedance matching for a common source amplifier, or for example, IEEE Trans. Microwave Theory Tech. "Analysis and design of a CMOS UWB LNA with dual-RLC branch wideband input matching network" is designed to provide a noise figure of 3.7-4.7 dB in the 3.1-10.6 GHz band using resistor feedback and inductance compensation techniques. However, using a negative feedback technique to design a wideband amplifier can replace the flatness of the wideband gain, but it will degrade the gain and noise index.

共閘極架構是一種習知的寬頻特性和輸入阻抗匹配技巧,然而一級的共閘極放大器沒有足夠的增益,因此需串接多級共閘極放大器以提高增益,例如2010年「IEEE Int. Solid-State Conf.」中公開的「A wideband mm-wave CMOS receiver for Gb/s communications employing interstage coupled resonator」便是透過設計V-band串接式共源放大器並使用耦合共振作為中間級匹配電路,以得到寬頻低雜訊放大器,但由於中間級匹配電路的匹配問題,卻又會縮減頻寬。The common gate structure is a well-known broadband characteristic and input impedance matching technique. However, the common-gate amplifier of the first stage does not have enough gain, so multi-level common-gate amplifiers must be connected in series to increase the gain, for example, IEEE Int. The "A wideband mm-wave CMOS receiver for Gb/s communications employing interstage coupled resonator" disclosed in Solid-State Conf." is designed by designing a V-band series-connected common-source amplifier and using coupled resonance as an intermediate-level matching circuit. In order to obtain a wide-band low-noise amplifier, but due to the matching problem of the intermediate-level matching circuit, the bandwidth is reduced.

基於上述所提及現有技術之缺點,若能提供一種可快速設計寬頻低雜訊放大器之方法,將能縮短設計過程中嘗試錯誤的時間與減少寬頻應用產品的微型化成本,並藉由此方法設計出低雜訊指數、阻抗匹配以及寬頻增益的放大器。Based on the shortcomings of the above-mentioned prior art, if a method for rapidly designing a broadband low noise amplifier can be provided, the time for attempting errors in the design process can be shortened and the miniaturization cost of the broadband application product can be reduced, and by this method Design amplifiers with low noise index, impedance matching, and wideband gain.

本發明係為一種寬頻低雜訊放大器電路之設計方法,其係在共閘極放大電路和共源極放大電路之間串接中間匹配電路,並透過共閘極放大電路在低頻段及高頻段具有較高增益,而共源極放大電路在中頻段具有較高增益,以使得組合後的寬頻低雜訊放大器電路可在整個寬頻段皆有足夠之增益,並且藉由設計中間匹配電路中的電感以及與共閘極放大電路及共源極放大電路連接之電感,藉此延伸頻寬。The invention relates to a design method of a broadband low noise amplifier circuit, which is connected with an intermediate matching circuit between a common gate amplifying circuit and a common source amplifying circuit, and transmits a common gate amplifying circuit in a low frequency band and a high frequency band. It has a higher gain, and the common source amplifying circuit has a higher gain in the middle frequency band, so that the combined wide frequency low noise amplifier circuit can have sufficient gain over the entire wide frequency band, and by designing the intermediate matching circuit The inductor and the inductance connected to the common gate amplifying circuit and the common source amplifying circuit thereby extending the bandwidth.

本發明提供一種寬頻低雜訊放大器電路之設計方法,其係配合一模擬軟體進行之,設計方法包括下列步驟:提供一寬頻低雜訊放大器電路,其包括:一共閘極放大電路,其包括一第一輸入端及一第一輸出端,又共閘極放大電路外接有一第一電感及一第二電感;一共源極放大電路,其包括一第二輸入端及一第二輸出端,共源極放大電路外接有一第三電感;及一中間匹配電路,其包括一第四電感,第四電感串接於第一輸出端與第二輸入端間;預定一設計頻段,其係由X GHz~Y GHz,以提供至第一輸入端,又藉由設計頻段計算推導出一共振頻率;選擇電晶體,其係選擇共閘極放大電路及共源極放大電路之電晶體規格及偏壓;調整第一輸入端阻抗匹配,其係調整第一電感,使第一輸入端達共振頻率匹配;調整第一輸出端阻抗匹配,其係調整第二電感,使第一輸出端達共振頻率匹配;設計第三電感值,其係調整第三電感,使共源極放大電路之輸入阻抗達一設計電阻值;調整中間匹配電路阻抗匹配,其係調整第四電感,使中間匹配電路之輸入端與第一輸出端達共振頻率;以及調整共源極放大電路最佳增益及最佳輸入匹配,其係再次調整第三電感使共源極放大電路之增益及頻寬達最佳化。The invention provides a design method of a broadband low noise amplifier circuit, which is matched with an analog software. The design method comprises the following steps: providing a broadband low noise amplifier circuit, comprising: a common gate amplification circuit, comprising a a first input end and a first output end, the common gate amplifying circuit is externally connected with a first inductor and a second inductor; a common source amplifying circuit includes a second input end and a second output end, the common source The pole amplifier circuit is externally connected with a third inductor; and an intermediate matching circuit includes a fourth inductor, the fourth inductor is connected in series between the first output end and the second input end; and a predetermined design frequency band is determined by X GHz~ Y GHz is provided to the first input terminal, and a resonant frequency is derived by designing the frequency band calculation; selecting a transistor, which selects a transistor specification and a bias voltage of the common gate amplifying circuit and the common source amplifying circuit; The first input end is impedance matched, which adjusts the first inductance to match the first input end to the resonant frequency; adjusts the first output end impedance matching, which adjusts the second inductance to make the first input End-to-resonance frequency matching; designing a third inductance value, which adjusts the third inductance so that the input impedance of the common source amplifying circuit reaches a design resistance value; adjusting the impedance matching of the intermediate matching circuit, which adjusts the fourth inductance to make the middle The input end of the matching circuit and the first output end reach a resonance frequency; and the optimal gain and the optimal input matching of the common source amplifying circuit are adjusted, and the third inductance is adjusted again to make the gain and the bandwidth of the common source amplifying circuit reach the maximum Jiahua.

藉由本發明的實施,至少可達到下列進步功效:With the implementation of the present invention, at least the following advancements can be achieved:

一、能快速估算高頻、中頻及低頻之大略位置以達到寬頻特徵。First, it can quickly estimate the approximate position of high frequency, intermediate frequency and low frequency to achieve broadband characteristics.

二、能有效節省設計過程中嘗試錯誤的時間。Second, it can effectively save time in trying to make mistakes in the design process.

三、可用來設計不同頻段的寬頻低雜訊放大器。Third, can be used to design broadband low noise amplifiers in different frequency bands.

為了使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點,因此將在實施方式中詳細敘述本發明之詳細特徵以及優點。In order to make those skilled in the art understand the technical content of the present invention and implement it, and according to the disclosure, the patent scope and the drawings, the related objects and advantages of the present invention can be easily understood by those skilled in the art. The detailed features and advantages of the present invention will be described in detail in the embodiments.

第1圖係為本發明實施例之一種寬頻低雜訊放大器電路之設計方法流程圖。第2圖係為本發明實施例之一種寬頻低雜訊放大器之電路方塊圖。第3A圖係為本發明實施例之一種具有3.1-10.3 GHz頻段之寬頻低雜訊放大器電路之電路架構圖。第3B圖係為本發明實施例之一種具有14.3-29.3 GHz頻段之寬頻低雜訊放大器電路之電路架構圖。第4A圖及第4B圖係為本發明實施例之一種寬頻低雜訊放大器之電晶體小訊號分析電路圖。第5圖係為模擬3.1-10.3 GHz頻段中間匹配電路的輸入/輸出阻抗關係圖。第6圖係為模擬14.3-29.3 GHz頻段中間匹配電路的輸入/輸出阻抗關係圖。第7圖係為本發明實施例之一種模擬3.1-10.3 GHz頻段輸出增益特性曲線關係圖。第8圖係為本發明實施例之一種模擬14.3-29.3 GHz頻段輸出增益特性曲線關係圖。FIG. 1 is a flow chart of a method for designing a broadband low noise amplifier circuit according to an embodiment of the present invention. 2 is a circuit block diagram of a broadband low noise amplifier according to an embodiment of the present invention. FIG. 3A is a circuit diagram of a broadband low noise amplifier circuit having a frequency band of 3.1-10.3 GHz according to an embodiment of the present invention. FIG. 3B is a circuit diagram of a broadband low noise amplifier circuit having a frequency band of 14.3-29.3 GHz according to an embodiment of the present invention. 4A and 4B are diagrams showing a transistor small signal analysis circuit of a broadband low noise amplifier according to an embodiment of the present invention. Figure 5 is a plot of the input/output impedance of the intermediate matching circuit in the 3.1-10.3 GHz band. Figure 6 is a plot of the input/output impedance of the intermediate matching circuit in the analog 14.3-29.3 GHz band. Figure 7 is a diagram showing the relationship of the output gain characteristic curve of the analog 3.1-10.3 GHz band according to an embodiment of the present invention. Figure 8 is a diagram showing the relationship of the output gain characteristic curves of the analog 14.3-29.3 GHz band according to an embodiment of the present invention.

如第1圖所示,本實施例為一種寬頻低雜訊放大器電路之設計方法(步驟S100),其係配合一模擬軟體進行之。本實施例使用的元件模型為標準元件模型,並使用射頻電路模擬軟體Agilent ADS進行模擬,進而可以透過模擬軟體來調整其特性,模擬軟體可模擬微波射頻IC並設計完整的前端電路到後端電路和佈局。As shown in FIG. 1, this embodiment is a design method of a broadband low noise amplifier circuit (step S100), which is performed in conjunction with a simulation software. The component model used in this embodiment is a standard component model, and is simulated by the RF circuit simulation software Agilent ADS, and then the characteristics can be adjusted through the analog software. The simulation software can simulate the microwave RF IC and design the complete front-end circuit to the back-end circuit. And layout.

寬頻低雜訊放大器電路之設計方法(步驟S100)包括下列步驟:提供一寬頻低雜訊放大器電路(步驟S10);預定一設計頻段(步驟S20);選擇電晶體(步驟S30);調整第一輸入端阻抗匹配(步驟S40);調整第一輸出端阻抗匹配(步驟S50);設計第三電感值(步驟S60);調整中間匹配電路阻抗匹配(步驟S70);以及調整共源極放大電路最佳增益及最佳輸入匹配(步驟S80)。The design method of the broadband low noise amplifier circuit (step S100) comprises the steps of: providing a broadband low noise amplifier circuit (step S10); predetermining a design frequency band (step S20); selecting a transistor (step S30); adjusting the first Input impedance matching (step S40); adjusting first output impedance matching (step S50); designing a third inductance value (step S60); adjusting intermediate matching circuit impedance matching (step S70); and adjusting the common source amplifying circuit Good gain and optimal input matching (step S80).

如第2圖所示,提供一寬頻低雜訊放大器電路(步驟S10):本實施例使用的寬頻低雜訊放大器電路100至少包括:一共閘極放大電路200;一共源極放大電路400;以及一中間匹配電路300,其中共閘極放大電路200、中間匹配電路300及共源極放大電路400係依序串接。As shown in FIG. 2, a wideband low noise amplifier circuit is provided (step S10): the wideband low noise amplifier circuit 100 used in this embodiment includes at least: a common gate amplifying circuit 200; a common source amplifying circuit 400; An intermediate matching circuit 300 in which the common gate amplifying circuit 200, the intermediate matching circuit 300, and the common source amplifying circuit 400 are serially connected in series.

寬頻低雜訊放大器電路100具有一訊號輸入端RFin和一訊號輸出端RFout,並且訊號輸入端RFin係用以接收一射頻訊號,並經過共閘極放大電路200、中間匹配電路300及共源極放大電路400後,由訊號輸出端RFout輸出一放大後輸出訊號。於實際應用上,本實施例之寬頻低雜訊放大器電路100可整合至一無線通訊裝置或手機裝置,用以作為寬頻接收電路系統中的低雜訊放大器。The broadband low noise amplifier circuit 100 has a signal input terminal RF in and a signal output terminal RF out , and the signal input terminal RF in is used to receive an RF signal, and passes through the common gate amplifying circuit 200, the intermediate matching circuit 300 and After the common source amplifying circuit 400, an amplified output signal is outputted from the signal output terminal RF out . In practical applications, the broadband low noise amplifier circuit 100 of the present embodiment can be integrated into a wireless communication device or a mobile phone device for use as a low noise amplifier in a wideband receiving circuit system.

又如第3A圖及第3B圖所示,共閘極放大電路200包括一第一電晶體M1,其係由一第一子電晶體M1a及一第二子電晶體M1b相互並聯所構成,其閘極、源極及汲極皆相互連接以形成共閘極放大電路200。As shown in FIGS. 3A and 3B, the common gate amplifying circuit 200 includes a first transistor M 1 connected in parallel with a first sub-crystal M 1a and a second sub-crystal M 1b . The gate, the source and the drain are connected to each other to form a common gate amplifying circuit 200.

共閘極放大電路200包括有一第一輸入端IP1及一第一輸出端OP1,其中第一輸入端IP1即為第一子電晶體M1a及第二子電晶體M1b的源極,而第一輸出端OP1則為第一子電晶體M1a及第二子電晶體M1b的汲極。共閘極放大電路200之第一輸入端IP1與一接地端間連接有一第一電感L1,並且第一輸入端IP1與訊號輸入端RFin之間還串聯有一直流阻隔電容Cb1The common gate amplifying circuit 200 includes a first input terminal IP 1 and a first output terminal OP 1 , wherein the first input terminal IP 1 is the source of the first sub-transistor M 1a and the second sub-transistor M 1b The first output terminal OP 1 is the drain of the first sub-transistor M 1a and the second sub-transistor M 1b . A first inductor L 1 is connected between the first input terminal IP 1 of the common gate amplifying circuit 200 and a ground terminal, and a DC blocking capacitor C b1 is further connected in series between the first input terminal IP 1 and the signal input terminal RF in .

第一子電晶體M1a及第二子電晶體M1b的閘極還連接於一固定電壓源Vg1,以提供第一子電晶體M1a及第二子電晶體M1b的閘極偏壓電壓,而於固定電壓源Vg1及接地端間串聯有一接地電容Cbp1以隔離雜訊,並且於固定電壓源Vg1與第一子電晶體M1a及第二子電晶體M1b的汲極間串聯有一第二電感L2The gates of the first sub-transistor M 1a and the second sub-transistor M 1b are also connected to a fixed voltage source V g1 to provide gate bias of the first sub-transistor M 1a and the second sub-transistor M 1b a voltage, and a grounding capacitor C bp1 is connected in series between the fixed voltage source V g1 and the ground to isolate the noise, and the drain of the fixed voltage source V g1 and the first sub-crystal M 1a and the second sub-crystal M 1b There is a second inductance L 2 connected in series.

此外,共閘極放大電路200中之第一子電晶體M1a及第二子電晶體M1b可以是一N型金屬氧化半導體電晶體(NMOS),並可採用多指叉式閘極金屬氧化半導體電晶體(Multi-finger MOSFET)的架構,例如第一子電晶體M1a及第二子電晶體M1b可具有47個多指叉(multi-fingers)閘極結構、閘極總寬度為70.5μm、固定電壓源Vg1輸出的偏壓電壓為0.7V、轉導gm1為0.05s、每一指叉式為1.5μm寬。In addition, the first sub-transistor M 1a and the second sub-transistor M 1b in the common gate amplifying circuit 200 may be an N-type metal oxide semiconductor transistor (NMOS), and may be oxidized by a multi-finger gate gate metal. The structure of the semiconductor transistor (Multi-finger MOSFET), for example, the first sub-transistor M 1a and the second sub-crystal M 1b may have 47 multi-fingers gate structures, and the total gate width is 70.5. The bias voltage of the output of μm, the fixed voltage source V g1 is 0.7V, the transconductance g m1 is 0.05 s, and each of the interdigitated forms is 1.5 μm wide.

於本實施例中,係由固定電壓源Vg1透過第二電感L2提供第一電晶體M1汲極與閘極的偏壓電壓。於實際操作時,第一電晶體M1可對輸入訊號端RFin提供增益之訊號放大功能,並將放大後之訊號經由中間匹配電路300傳送至共源極放大電路400。由於第一電晶體M1係由第一子電晶體M1a及第二子電晶體M1b並接成一體,假如指叉式寬度小於1μm,將會減少截止頻率。因此適當降低閘極端的電阻,不僅會提升截止頻率,還可降低雜訊指數。In this embodiment, the system provides a first transistor M 2 through inductor L by a second fixed voltage source bias voltage V g1 1 drain electrode and gate electrode. In actual operation, the first transistor M 1 can provide a gain signal amplification function to the input signal terminal RF in , and transmit the amplified signal to the common source amplifying circuit 400 via the intermediate matching circuit 300 . Since the first transistor M 1 is integrally connected by the first sub-crystal M 1a and the second sub-crystal M 1b , if the inter-fork width is less than 1 μm, the cutoff frequency will be reduced. Therefore, appropriately reducing the resistance of the gate terminal not only increases the cutoff frequency, but also reduces the noise index.

如第3A圖所示,共源極放大電路400可以是一共源極疊接(Common-source cascode)放大電路或是如第3B圖所示的一共源極串接(Common-source cascade)放大電路。在第3A圖所示之電路架構中,寬頻低雜訊放大器電路100係操作在3.1 GHz~10.3 GHz之間,而在第3B圖所示之電路架構中,寬頻低雜訊放大器電路100則操作在14.3 GHz~29.3 GHz之間。As shown in FIG. 3A, the common source amplifying circuit 400 may be a common-source cascode amplifying circuit or a common-source cascade amplifying circuit as shown in FIG. 3B. . In the circuit architecture shown in FIG. 3A, the wideband low noise amplifier circuit 100 operates between 3.1 GHz and 10.3 GHz, and in the circuit architecture shown in FIG. 3B, the wide frequency low noise amplifier circuit 100 operates. Between 14.3 GHz and 29.3 GHz.

如第3A圖所示,在具有3.1-10.3 GHz頻段之寬頻低雜訊放大器電路100中,共源極放大電路400的架構包括:一第二電晶體M2及一第三電晶體M3,其中第二電晶體M2及第三電晶體M3係以共源極(common-source)及共閘極(common-gate)方式疊接(cascode),並且第二電晶體M2的汲極連接至第三電晶體M3的源極。As shown in FIG. 3A, in the broadband low noise amplifier circuit 100 having the band 3.1-10.3 GHz, the architecture of the common source amplifying circuit 400 includes: a second transistor M 2 and a third transistor M 3 , The second transistor M 2 and the third transistor M 3 are cascoded in a common-source and a common-gate manner, and the drain of the second transistor M 2 the third transistor M is connected to the source electrode 3.

共源極放大電路400包括一第二輸入端IP2及一第二輸出端OP2,第二輸入端IP2為第二電晶體M2的閘極並與中間匹配電路300的輸出端連接。此外第二輸入端IP2還先串聯一第一電阻R1後再與一固定電壓源Vg2連接,以透過固定電壓源Vg2提供第二電晶體M2的閘極偏壓電壓。其中,於第二電晶體M2的源極及接地端之間串聯有一第三電感L3The common source amplifying circuit 400 includes a second input terminal IP 2 and a second output terminal OP 2 , and the second input terminal IP 2 is a gate of the second transistor M 2 and is connected to the output terminal of the intermediate matching circuit 300. In addition, the second input terminal IP 2 is first connected in series with a first resistor R 1 and then connected to a fixed voltage source V g2 to provide a gate bias voltage of the second transistor M 2 through the fixed voltage source V g2 . The third inductor L 3 is connected in series between the source and the ground of the second transistor M 2 .

第二輸出端OP2為第三電晶體M3的汲極,第二輸出端OP2先串聯一直流阻隔電容Cb3後再與訊號輸出端RFout連接。此外,第二輸出端OP2與第三電晶體M3的閘極之間串聯有一負載電感Ld2,並且第三電晶體M3的閘極還先串聯一第二電阻R2後再與一固定電壓源Vg3電性連接,以提供第三電晶體M3的閘極偏壓電壓。此外,固定電壓源Vg3及接地端之間還串聯有一接地電容Cbp2以隔離雜訊。The second output terminal OP 2 is the drain of the third transistor M 3 , and the second output terminal OP 2 is connected in series with the DC blocking capacitor C b3 and then connected to the signal output terminal RF out . In addition, a load inductor L d2 is connected in series between the gate of the second output terminal OP 2 and the third transistor M 3 , and the gate of the third transistor M 3 is first connected in series with a second resistor R 2 and then V g3 is electrically connected to a fixed voltage source, to provide a third transistor M gate electrode 3 of a bias voltage. In addition, a grounding capacitor C bp2 is connected in series between the fixed voltage source V g3 and the ground to isolate the noise.

類似地,第二電晶體M2及第三電晶體M3係為一N型金屬氧化半導體電晶體(NMOS),固定電壓源Vg2輸出的偏壓電壓為0.7V,而固定電壓源Vg3輸出的偏壓電壓為1.5V。Similarly, the second transistor M 2 and the third transistor M 3 are an N-type metal oxide semiconductor transistor (NMOS), and the bias voltage of the fixed voltage source V g2 is 0.7 V, and the fixed voltage source V g3 The output bias voltage is 1.5V.

如第3B圖所示,在具有14.3-29.3 GHz頻段之寬頻低雜訊放大器電路100中可使用與第3A圖相同的共閘極放大電路200架構,因此在此僅針對共源極放大電路400的電路架構進行說明。其中,共閘極放大電路200的第一子電晶體M1a及第二子電晶體M1b同樣具有多指叉閘極結構,但其閘極總寬度為44μm、固定電壓源Vg1輸出的偏壓電壓為0.8V。As shown in FIG. 3B, the same common gate amplifying circuit 200 architecture as in FIG. 3A can be used in the wideband low noise amplifier circuit 100 having the frequency band 14.3-29.3 GHz, and therefore only the common source amplifying circuit 400 is used here. The circuit architecture is described. The first sub-transistor M 1a and the second sub-transistor M 1b of the common gate amplifying circuit 200 also have a multi-finger gate structure, but the total gate width is 44 μm, and the output of the fixed voltage source V g1 is biased. The voltage is 0.8V.

共源極放大電路400的架構包括:一第二電晶體M2及一第三電晶體M3,其中第二電晶體M2及第三電晶體M3係以兩級共源極(common-source)放大器電路串接以構成共源極串接(common-source cascade)放大電路,並且第二電晶體M2的汲極係透過一直流阻隔電容Cb4與第三電晶體M3的閘極連接。本實施例採用共源極串接放大電路用以補償共閘極放大電路200中頻段增益的不足。The structure of the common source amplifying circuit 400 includes: a second transistor M 2 and a third transistor M 3 , wherein the second transistor M 2 and the third transistor M 3 are two-stage common source (common- The amplifier circuit is connected in series to form a common-source cascade amplifier circuit, and the drain of the second transistor M 2 passes through the gate of the DC blocking capacitor C b4 and the third transistor M 3 . connection. In this embodiment, a common source series amplifying circuit is used to compensate for the shortage of the band gain in the common gate amplifying circuit 200.

共源極放大電路400包括一第二輸入端IP2及一第二輸出端OP2,第二輸入端IP2為第二電晶體M2的閘極並與中間匹配電路300的輸出端連接,此外第二輸入端IP2還先串聯一第一電阻R1後再與一固定電壓源Vg2連接,以透過固定電壓源Vg2提供第二電晶體M2的閘極偏壓電壓。其中,於第二電晶體M2的源極及接地端之間串聯有一第三電感L3。而第二電晶體M2的汲極與一固定電壓源Vd2之間還串聯有一負載電感Ld3,並且於固定電壓源Vd2與接地端之間串聯有一接地電容Cbp3以隔離雜訊。The common source amplifying circuit 400 includes a second input terminal IP 2 and a second output terminal OP 2 , and the second input terminal IP 2 is a gate of the second transistor M 2 and is connected to the output end of the intermediate matching circuit 300. In addition, the second input terminal IP 2 is first connected in series with a first resistor R 1 and then connected to a fixed voltage source V g2 to provide a gate bias voltage of the second transistor M 2 through the fixed voltage source V g2 . The third inductor L 3 is connected in series between the source and the ground of the second transistor M 2 . A load inductor L d3 is further connected in series between the drain of the second transistor M 2 and a fixed voltage source V d2 , and a grounding capacitor C bp3 is connected in series between the fixed voltage source V d2 and the ground to isolate the noise.

第二輸出端OP2為第三電晶體M3的汲極,並先串聯一直流阻隔電容Cb3後再與訊號輸出端RFout連接。第三電晶體M3的閘極又串聯一第三電阻R3後再與一固定電壓源Vg3連接,以透過固定電壓源Vg3提供第三電晶體M3的閘極偏壓電壓。第三電晶體M3的源極與接地端之間串聯有一接地電感Ls3,而第三電晶體M3的汲極(即第二輸出端OP2)與一固定電壓源Vd3之間則串聯一負載電感Ld2,並且固定電壓源Vd3與接地端之間又串聯有一接地電容Cbp2以隔離雜訊。The second output terminal OP 2 is a drain of the third transistor M 3 , and is connected in series with the DC blocking capacitor C b3 and then connected to the signal output terminal RF out . The gate of the third transistor M 3 is connected in series with a third resistor R 3 and then connected to a fixed voltage source V g3 to provide a gate bias voltage of the third transistor M 3 through the fixed voltage source V g3 . A grounding inductance L s3 is connected in series between the source and the ground of the third transistor M 3 , and between the drain of the third transistor M 3 (ie, the second output terminal OP 2 ) and a fixed voltage source V d3 A load inductor L d2 is connected in series, and a grounding capacitor C bp2 is connected in series between the fixed voltage source V d3 and the ground to isolate the noise.

其中,第二電晶體M2及第三電晶體M3為一N型金屬氧化半導體電晶體(NMOS),其固定電壓源Vg2、Vg3輸出的偏壓電壓為0.8V,而固定電壓源Vd2、Vd3輸出的偏壓電壓為1.2V。The second transistor M 2 and the third transistor M 3 are an N-type metal oxide semiconductor transistor (NMOS), and the bias voltages of the fixed voltage sources V g2 and V g3 are 0.8 V, and the fixed voltage source is The bias voltages of V d2 and V d3 are 1.2V.

如第3A圖及第3B圖所示,中間匹配電路300,其包括一第四電感L4,第四電感L4係串接於第一輸出端OP1與第二輸入端IP2間,並且第四電感L4之一端與第一輸出端OP1之間還可再串接一直流阻隔電容Cb2As shown in FIG. 3A and second FIG. 3B, the intermediate matching circuit 300, which comprises a L 4, L 4 fourth inductor connected in series to a first output terminal system OP 1 and the second input terminal IP 2 between the pair of the fourth inductor, and A DC blocking capacitor C b2 may be further connected in series between the one end of the fourth inductor L 4 and the first output terminal OP 1 .

預定一設計頻段(步驟S20):設計頻段係由電路設計者挑選,並且即為寬頻低雜訊放大器電路100欲進行操作的頻段。設計頻段係用以提供至第一輸入端IP1,並且介於X GHz~Y GHz之間,例如可介於3.1 GHz~10.3 GHz之間或是14.3 GHz~29.3 GHz之間。更重要的是,當設計頻段確定後,即可藉由設計頻段計算推導出一共振頻率,而共振頻率推導的方式即是將設計頻段中的最大值及最小值之和的二分之一(即為X頻率加Y頻率後之二分之一)。因此,當設計頻段為3.1 GHz~10.3 GHz時,其共振頻率為6.7 GHz,而當設計頻段為14.3 GHz~29.3 GHz時,其共振頻率為21.8 GHz。A design band is predetermined (step S20): the design band is selected by the circuit designer and is the frequency band in which the wideband low noise amplifier circuit 100 is to operate. The design band is provided to the first input IP 1 and is between X GHz and Y GHz, for example between 3.1 GHz and 10.3 GHz or between 14.3 GHz and 29.3 GHz. More importantly, when the design frequency band is determined, a resonant frequency can be derived by designing the frequency band calculation, and the resonant frequency derivation is one-half of the sum of the maximum and minimum values in the design frequency band ( That is, one-half of the X frequency plus the Y frequency). Therefore, when the design frequency band is 3.1 GHz to 10.3 GHz, the resonance frequency is 6.7 GHz, and when the design frequency band is 14.3 GHz to 29.3 GHz, the resonance frequency is 21.8 GHz.

選擇電晶體(步驟S30):當推導出共振頻率後,便可選擇共閘極放大電路200中第一電晶體M1及共源極放大電路400中第二電晶體M2及第三電晶體M3的電晶體規格及偏壓,即可決定第一電晶體M1、第二電晶體M2及第三電晶體M3的轉導、寄生電容,且應選擇共閘極放大電路200中第一電晶體M1之一轉導值參數,使轉導值參數對應之第一輸入端IP1之輸入阻抗小於或等於50歐姆,以助於減少雜訊。Selecting a transistor (step S30): when the resonant frequency is derived, the second transistor M 1 and the third transistor M 2 and the third transistor of the common transistor M 1 and the common source amplifying circuit 400 in the common gate amplifying circuit 200 can be selected. The transistor specification and bias voltage of M 3 can determine the transconductance and parasitic capacitance of the first transistor M 1 , the second transistor M 2 , and the third transistor M 3 , and should be selected in the common gate amplifying circuit 200 a first transistor M 1 transduction one parameter, so that the value of the parameter corresponding to the transduction of a first input terminal IP of an input impedance of 50 ohms or less, to help reduce noise.

在確定第一電晶體M1、第二電晶體M2及第三電晶體M3的轉導、寄生電容後,便能得知第一電晶體M1、第二電晶體M2及第三電晶體M3的各項參數。由於共閘極放大電路200及共源極放大電路400間需透過阻抗匹配技巧,並藉由設計第一電感L1、第二電感L2、第三電感L3及第四電感L4的電感值,進而透過共閘極放大電路200在低頻段及高頻段具有較高增益,而共源極放大電路400在中頻段具有較高增益,以使得組合後的寬頻低雜訊放大器電路100可在整個寬頻段皆有足夠之增益。Determining a first transistor M 1, a second transistor M 2 and the third transducing transistor M 3 and the parasitic capacitance will be able to learn the first transistor M 1, M 2 of the second transistor and the third The parameters of the transistor M 3 . The impedance matching technique is required between the common gate amplifying circuit 200 and the common source amplifying circuit 400, and the inductances of the first inductor L 1 , the second inductor L 2 , the third inductor L 3 , and the fourth inductor L 4 are designed. The value, in turn, has a higher gain in the low frequency band and the high frequency band through the common gate amplifying circuit 200, and the common source amplifying circuit 400 has a higher gain in the middle frequency band, so that the combined wide frequency low noise amplifier circuit 100 can There is sufficient gain for the entire wide frequency band.

因此,以下針對共閘極放大電路200中的第一電晶體M1、中間匹配電路300及共源極放大電路400中的第二電晶體M2進行小訊號分析。Therefore, the small signal analysis is performed below for the first transistor M 1 in the common gate amplifying circuit 200, the intermediate matching circuit 300, and the second transistor M 2 in the common source amplifying circuit 400.

如第4A圖所示,共閘極放大電路中的第一電晶體M1的轉導gm1在第一電晶體M1的汲極D1與源極S1間提供電流源,並且第一電晶體M1的閘極G1與源極S1間之寄生電容為Cgs1,閘極G1與汲極D1之寄生電容為Cgd1,汲極D1與源極S1之電阻為rds1,閘極G1及源極S1間之電壓差為Vgs1,電容Cb1、Cb2為直流阻隔電容。共源極放大電路中的第二電晶體M2轉導gm2在第二電晶體M2的汲極D2與源極S2間提供電流源,電容Cgs2為閘極G2與源極S2間之寄生電容,電阻Ro2為共源極放大電路400之輸出電阻,Vgs2為閘極G2與源極D2間之電壓差。Zin指的是從第一電晶體M1的源極S1看進去的輸入阻抗,ZL是從第一電晶體M1的汲極D1看進去的負載阻抗,Zp是共閘極放大電路200的輸出阻抗,Zs為共源極放大電路400的輸入阻抗。As shown in Figure 4A, a first common gate transistor M amplifying circuit transduction g m1 1 in the first transistor M 1 to the drain D and the source S 1 rooms offer a current source, and the first The parasitic capacitance between the gate G 1 and the source S 1 of the transistor M 1 is C gs1 , the parasitic capacitance of the gate G 1 and the drain D 1 is C gd1 , and the resistance of the drain D 1 and the source S 1 is r ds1 , the voltage difference between the gate G 1 and the source S 1 is V gs1 , and the capacitances C b1 and C b2 are DC blocking capacitors. The second transistor M 2 in the common source amplifying circuit transduces g m2 to provide a current source between the drain D 2 and the source S 2 of the second transistor M 2 , and the capacitor C gs2 is the gate G 2 and the source The parasitic capacitance between S 2 , the resistance R o2 is the output resistance of the common source amplifying circuit 400, and V gs2 is the voltage difference between the gate G 2 and the source D 2 . Z in refers to the input impedance seen from the source S 1 of the first transistor M 1 , Z L is the load impedance seen from the drain D 1 of the first transistor M 1 , and Z p is the common gate The output impedance of the amplifying circuit 200, Z s , is the input impedance of the common source amplifying circuit 400.

如第4A圖及第4B圖所示,第二電感L2連接第一電晶體M1之汲極D1端,電感L為第四電感L4與第三電感L3串接組合,又電阻Ro為並聯式電容與電感(第二電感L2、寄生電容Cgd1所構成)之等效輸出電阻,電阻RI為串聯式電容與電感(電感L、寄生電容Cgs2所構成)之等效輸入電阻。As shown in FIG. 4A and FIG. 4B, the second inductor L 2 is connected to the drain D 1 end of the first transistor M 1 , and the inductor L is connected in series with the fourth inductor L 4 and the third inductor L 3 , and the resistor is connected. R o is the equivalent output resistance of the parallel capacitor and the inductor (the second inductor L 2 and the parasitic capacitor C gd1 ), and the resistor R I is a series capacitor and an inductor (the inductor L and the parasitic capacitor C gs2 ). Effective input resistance.

藉此,可使得共閘極放大電路之輸出阻抗與共源極放大電路之輸入阻抗達成共振匹配,以降低訊號反射造成的損耗,即並聯式電容與電感至串聯式電容與電感發生相同共振頻率。並聯式電感與電容於電路連接上為第一電晶體M1的閘極G1與汲極D1間之寄生電容Cgd1並聯於第一電晶體M1之汲極端的第二電感L2而成,當達到電路共振匹配,其共振頻率為而串聯式電感與電容(L及Cgs2)係由電感L與第二電晶體M2閘極G2與源極S2間之寄生電容Cgs2串聯而成,當達到電路共振匹配,其共振頻率為 Thereby, the output impedance of the common gate amplifying circuit can be resonantly matched with the input impedance of the common source amplifying circuit to reduce the loss caused by signal reflection, that is, the parallel resonant capacitor and the inductor to the series capacitor and the inductor have the same resonant frequency. . Parallel to the inductance and capacitance circuit is connected to the gate of the first transistor M 1, a second inductor electrode G 1 and the drain of the parasitic capacitance of the drain D of the C gd1 1 Room parallel to the first transistor M 1 and L 2 extreme When the circuit resonance is reached, its resonant frequency is The series inductors and capacitors (L and C gs2 ) are formed by connecting the inductor L and the parasitic capacitance C gs2 between the gate G 2 and the source S 2 of the second transistor M 2 . When the circuit resonance is matched, the resonance Frequency is

Zin係為從第一電晶體M1源極S1看進去的輸入阻抗,輸入阻抗Zin可以如下公式所示:Z in is the input impedance seen from the source S 1 of the first transistor M 1 , and the input impedance Z in can be expressed as follows:

其中,電阻rds1為第一電晶體M1汲極D1與源極S1間之電阻,ZL為從第一電晶體M1汲極D1看進去的負載阻抗,gm1是第一電晶體M1的轉導,電容Cgs1是第一電晶體M1閘極G1與源極S1間之寄生電容,Cb1為直流阻隔電容,電感Ls1為第一電晶體M1源極S1之電感即為第一電感L1。在低頻時,Zin近似為1/gm,因此可達寬頻阻抗匹配,隨著頻率增加,第一電晶體M1寄生電容Cgs1會降低在高頻時的性能,所可以透過電感來補償電容效應,此時放大電路增益曲線較為平坦,因此可達寬頻。Wherein, the resistance r ds1 is the resistance between the drain D 1 of the first transistor M 1 and the source S 1 , and Z L is the load impedance seen from the drain D 1 of the first transistor M 1 , and g m1 is the first The transconductance of the transistor M 1 , the capacitance C gs1 is the parasitic capacitance between the gate G 1 and the source S 1 of the first transistor M 1 , C b1 is a DC blocking capacitor, and the inductance L s1 is the source of the first transistor M 1 The inductance of the pole S 1 is the first inductance L 1 . At low frequencies, Z in is approximately 1/g m , so that broadband impedance matching can be achieved. As the frequency increases, the parasitic capacitance C gs1 of the first transistor M 1 will degrade at high frequencies, which can be compensated by inductance. Capacitance effect, at this time, the gain curve of the amplifying circuit is relatively flat, so it can reach wide frequency.

在設計輸入匹配3.1-10.3 GHz的頻段時,輸入端之電感與電容共振電路架構由電容Cgs1並聯第一電感L1組成,其共振頻率為6.7 GHz且達到寬頻響應,其在2.5-10.6 GHz之插入損失小於0.9 dB。在設計輸入匹配14.3-29.3 GHz的頻段,其共振頻率為21.8 GHz且達到寬頻響應,其在13-30 GHz之插入損失小於1 dB。When designing the input to match the 3.1-10.3 GHz band, the input inductor and capacitor resonant circuit architecture consists of a capacitor C gs1 in parallel with the first inductor L 1 , which has a resonant frequency of 6.7 GHz and a broadband response at 2.5-10.6 GHz. The insertion loss is less than 0.9 dB. In the design input matched to the frequency band 14.3-29.3 GHz, the resonant frequency is 21.8 GHz and the broadband response is achieved, with an insertion loss of less than 1 dB at 13-30 GHz.

如第5圖所示,本實施例模擬3.1-10.3 GHz頻段的Zp與Zs,而共閘極放大電路200的輸出阻抗則為Zp=RP+jXp,其共振頻率為6.7 GHz。共源極放大電路400的輸入阻抗為Zs=Rs+jXs,共振頻率亦是6.7 GHz。為了讓Zp與Zs的虛部相消而形成實阻抗,在Xp=-Xs條件時,則形成共軛匹配,發生虛部相消的頻率分別為3.7 GHz和10 GHz。在6.7 GHz頻率,共閘極放大電路200之輸出電阻與共源極放大電路400之輸入電阻不匹配,其造成共閘極放大電路200之功率增益下降而出現雙頻響應。As shown in FIG. 5, for example, analog 3.1-10.3 GHz band and Z s Z p this embodiment, the common gate circuit 200 amplifying the output impedance compared with Z p = R P + jX p , whose resonance frequency is 6.7 GHz . The input impedance of the common source amplifying circuit 400 is Z s = R s + jX s , and the resonant frequency is also 6.7 GHz. In order to eliminate the imaginary part of Z p and Z s to form a real impedance, when X p =-X s condition, a conjugate matching is formed, and the frequencies at which the imaginary part is cancelled are 3.7 GHz and 10 GHz, respectively. At the 6.7 GHz frequency, the output resistance of the common gate amplifying circuit 200 does not match the input resistance of the common source amplifying circuit 400, which causes the power gain of the common gate amplifying circuit 200 to decrease and a dual frequency response occurs.

如第6圖所示,本實施例模擬14.3-29.3 GHz頻段的Zp與Zs,在高頻下電阻Rs(共源極放大電路400輸入阻抗的實部)不再是一常數,因為共源極放大電路400其源極電感值會隨頻率增加而增加,進而增加共源極放大電路400的輸入阻抗。因此在高頻下由於Zp與Zs的虛部不再相消,所以無法達成共軛匹配,其增益會下降。As shown in FIG. 6, the present embodiment the analog 14.3-29.3 GHz band and Z s Z p embodiments, at high frequencies the resistance R s (the real part of the common source electrode of the input impedance of the amplifier circuit 400) is not a constant, because The source inductance value of the common source amplifying circuit 400 increases as the frequency increases, thereby increasing the input impedance of the common source amplifying circuit 400. Thus at high frequencies due Z s Z p and imaginary part are no longer destructive, it is not possible to achieve conjugate matching, the gain decreases.

接者,解說寬頻低雜訊放大器100的雜訊因數(Noise Factor)如下公式所示:In addition, the noise factor of the broadband low noise amplifier 100 is illustrated as follows:

在雜訊因數表示式中,Lip為輸入端被動元件造成訊號的損失,Rs為訊號源的電阻,A1為共閘極放大電路200的功率增益,F2為下一級的雜訊因數,α=gm/gds0,gm為電晶體的轉導,gds0為零偏壓汲極電導係數,γ為通道熱雜訊係數,gm1為第一電晶體M1的轉導,ω T 為電晶體的截止頻率,δ為閘極雜訊係數。發現雜訊因數有兩參數影響最大,分別為gm1和A1,且增加gm1和A1就能降低雜訊,所以藉由選擇適當的gm1及考慮共閘極放大電路200的雙頻特性,將可使得整個寬頻的雜訊因數降低。In the noise factor expression, L ip is the loss of signal for the input passive component, R s is the resistance of the signal source, A 1 is the power gain of the common gate amplifying circuit 200, and F 2 is the noise factor of the next stage. , α=g m /g ds0 , g m is the transduction of the transistor, g ds0 is the zero-biased bucking conductance coefficient, γ is the channel thermal noise coefficient, and g m1 is the transduction of the first transistor M 1 , ω T is the cutoff frequency of the transistor, and δ is the gate noise coefficient. It is found that the noise factor has the greatest influence on the two parameters, g m1 and A 1 respectively , and adding g m1 and A 1 can reduce the noise, so by selecting the appropriate g m1 and considering the dual frequency of the common gate amplifying circuit 200 The feature will reduce the noise factor of the entire broadband.

因此在實際應用上,在3.1-10.3 GHz頻段的寬頻低雜訊放大器電路100中選用第一電晶體M1的通道寬度及長度尺寸為141μm及0.18μm、偏壓Vg1=Vd1=0.7V、gm1=0.05s,或者是在14.3-29.3 GHz寬頻低雜訊放大器電路100中選用第一電晶體M1的通道寬度及長度尺寸為88μm及0.18μm、偏壓Vg1=Vd1=0.8V、gm1=0.041s便能有較大的轉導以助於降低雜訊。Therefore, in practical applications, the channel width and length dimensions of the first transistor M 1 are selected to be 141 μm and 0.18 μm in the broadband low noise amplifier circuit 100 of the 3.1-10.3 GHz band, and the bias voltage V g1 = V d1 = 0.7V. , g m1 = 0.05 s, or the channel width and length dimensions of the first transistor M 1 selected in the 14.3-29.3 GHz broadband low noise amplifier circuit 100 are 88 μm and 0.18 μm, and the bias voltage V g1 = V d1 = 0.8 V, g m1 = 0.041 s can have a larger transduction to help reduce noise.

如第7圖及第8圖所示,其係為本實施例模擬寬頻輸出增益特性曲線,本實施例所揭露之寬頻低雜訊放大器電路100與習知低雜訊放大器最大之不同處在於具有寬頻增益。當單獨使用共閘極放大電路200僅具有低增益寬頻,所以藉由共閘極放大電路200放大低頻帶及高頻帶部分並藉由一中間級匹配電路串接共源極放大電路400以放大及補償中頻帶部分,最後則可得到一寬頻增益。因此,串接多個放大電路除了可以提高增益外,還可以達到寬頻的目的。As shown in FIG. 7 and FIG. 8 , which is the analog broadband output gain characteristic curve of the present embodiment, the wide difference between the wide frequency low noise amplifier circuit 100 and the conventional low noise amplifier disclosed in this embodiment is that Broadband gain. When the common gate amplifying circuit 200 alone has only a low gain wide frequency, the common and high frequency band portions are amplified by the common gate amplifying circuit 200 and the common source amplifying circuit 400 is connected in series by an intermediate matching circuit to amplify and The mid-band portion is compensated, and finally a broadband gain is obtained. Therefore, in addition to increasing the gain in series, a plurality of amplifying circuits can achieve the purpose of wide frequency.

綜上所述,為了使共閘極放大電路200及共源極放大電路400可達到阻抗匹配,可藉由以下流程調整第一電感L1、第二電感L2、第三電感L3及第四電感L4,以有效節省設計過程中嘗試錯誤的時間。In summary, in order to achieve impedance matching between the common gate amplifying circuit 200 and the common source amplifying circuit 400, the first inductor L 1 , the second inductor L 2 , the third inductor L 3 , and the third Four inductors L 4 to effectively save time in trying to make mistakes in the design process.

如第3A圖、第3B圖、第4A圖及第4B圖所示,調整第一輸入端阻抗匹配(步驟S40):藉由調整第一電感L1,使第一輸入端IP1達共振頻率匹配,即調整第一電感L1使其與共閘極放大電路200中第一電晶體M1之閘極-源極間寄生電容Cgs1達成共振頻率匹配。透過調整第一電感L1的電感值的大小,就可以控制輸入阻抗,使實數部份達到實阻抗且虛數部分為零。As FIG. 3A, FIG. 3B, FIG. 4A shown in FIG. 4 B second, adjusting the first input impedance matching (Step S40): By adjusting the first inductor L 1, the first input terminal of the resonant IP 1 The frequency matching, that is, adjusting the first inductance L 1 to achieve a resonance frequency matching with the gate-source parasitic capacitance C gs1 of the first transistor M 1 in the common gate amplifying circuit 200. By adjusting the size of the inductance of the first inductance value L 1, the input impedance can be controlled, so that the real part of the impedance to achieve real and imaginary part is zero.

調整第一輸出端阻抗匹配(步驟S50):藉由調整第二電感L2,使第一輸出端OP1達共振頻率匹配,即調整第二電感L2使其與共閘極放大電路200中第一電晶體M1之閘極-汲極間寄生電容Cgd1達成共振頻率匹配。透過調整第二電感L2的電感值的大小,就可以控制輸出阻抗,使實數部份達到實阻抗且虛數部分為零。Adjusting the impedance matching of the first output end (step S50): adjusting the second inductance L 2 to make the first output end OP 1 reach the resonance frequency matching, that is, adjusting the second inductance L 2 to be in the common gate amplification circuit 200 The gate-drain parasitic capacitance C gd1 of the first transistor M 1 achieves a resonant frequency match. By adjusting the magnitude of the inductance of the second inductor L 2 , the output impedance can be controlled such that the real part reaches the real impedance and the imaginary part is zero.

設計第三電感值(步驟S60):藉由調整第三電感L3使共源極放大電路400之輸入阻抗達一設計電阻值,其中設計電阻值是由電路設計者預先設定,例如可設定為50歐姆。第三電感L3又可稱為共源極退化電感,由共源極退化電感、閘極與源極間寄生電容Cgs2及第四電感L4在共振頻率時產生實數輸入阻抗,輸入的實阻抗是由第二電晶體M2的截止頻率、第三電感L3來決定。Design of a third inductance value (Step S60): By adjusting the third inductor L 3 so that the common-source circuit 400 amplifying the input impedance of a resistance value of a design in which the design value of the resistance is set by the circuit designer in advance, for example, may be set to 50 ohms. The third inductor L 3 can also be referred to as a common source degeneration inductor, and the real source input impedance is generated by the common source degeneration inductance, the gate-source parasitic capacitance C gs2 and the fourth inductance L 4 at the resonance frequency, and the input is real. The impedance is determined by the cutoff frequency of the second transistor M 2 and the third inductance L 3 .

調整中間匹配電路阻抗匹配(步驟S70):透過調整第四電感L4使中間匹配電路300的輸入端與第一輸出端OP1達相同共振頻率,因此透過調整第四電感L4的電感值的大小,就可以控制輸入阻抗,使實數部份達到實阻抗且虛數部分為零。Adjusting the intermediate matching circuit impedance matching (step S70): adjusting the fourth inductance L 4 to make the input end of the intermediate matching circuit 300 and the first output end OP 1 reach the same resonant frequency, and thus adjusting the inductance value of the fourth inductor L 4 The size can be used to control the input impedance so that the real part reaches the real impedance and the imaginary part is zero.

調整共源極放大電路最佳增益及最佳輸入匹配(步驟S80):再次調整第三電感L3使共源極放大電路400之增益及頻寬達最佳化。由於阻抗的實部值是經由電感的選擇而決定,因此再次調整第三電感L3後可計算出共源極放大電路400的等效輸入阻抗RI,由於此等效輸入阻抗RI較小,無法直接進行調整,所以可再將等效輸入阻抗帶入第二電感L2公式L2=RI×RO×Cgs2以計算L2電感,其中Ro為並聯式電容與電感之等效輸出電阻,此Ro由模擬軟體算出,寄生電容Cgs2由第二電晶體M2尺寸決定,再加上共振條件L2×Cgd1=L×Cgs2以重新計算第一電晶體M1寄生電容Cgd1Adjusting the common-source amplifier and the optimum gain optimal input matching (Step S80): adjusting the third inductor L 3 again so that the common-source amplifier 400 of gain and bandwidth of optimization. Since the real value of the impedance is determined by the selection of the inductance, the equivalent input impedance R I of the common source amplifying circuit 400 can be calculated after adjusting the third inductance L 3 again, since the equivalent input impedance R I is small. , can not be directly adjusted, so the equivalent input impedance can be brought into the second inductance L 2 formula L 2 = R I × R O × C gs2 to calculate the L 2 inductance, where R o is the parallel capacitance and inductance Effective output resistance, this R o is calculated by the analog software, the parasitic capacitance C gs2 is determined by the size of the second transistor M 2 , plus the resonance condition L 2 × C gd1 = L × C gs2 to recalculate the first transistor M 1 Parasitic capacitance C gd1 .

步驟S80又可再進一步包括再次選擇電晶體步驟,其係再次選擇共閘極放大電路200中第一電晶體M1之規格及調整偏壓,以使第一輸出端OP1及第二輸入端IP2間再次達相同共振頻率。Step S80 may further include the step of selecting the transistor again, which again selects the specification of the first transistor M 1 in the common gate amplifying circuit 200 and adjusts the bias voltage so that the first output terminal OP 1 and the second input terminal The IP 2 again reaches the same resonant frequency.

上述公式Ro須大於RI,其中電阻Ro包括第一電晶體M1汲極D1與源極S1間之通道電阻rds1。又因為Cgd1是第一電晶體M1之寄生電容,所以調整第一電晶體M1的電晶體大小會改變寄生電容的電容值,亦會影響轉導值gm1,因此透過調整偏壓可維持相同之轉導,並使得輸入阻抗匹配及適當的增益皆可達成。The above formula must be greater than R o R I, wherein the resistance R o M 1 comprises a first transistor drain and the source S D 1 channel resistance of r ds1 1 Room. Moreover, since C gd1 is the parasitic capacitance of the first transistor M 1 , adjusting the transistor size of the first transistor M 1 changes the capacitance value of the parasitic capacitance, and also affects the transconductance value g m1 . Maintain the same transconductance and allow input impedance matching and appropriate gain to be achieved.

以下說明本實施例之寬頻低雜訊放大器電路100於進行電路模擬與實測結果後所得之各項操作特性。本實施例3.1-10.3 GHz與14.3-29.3 GHz之寬頻低雜訊放大器電路100係透過0.18μm CMOS製程製作,所製得的晶片面積前者為0.83μm×0.82μm,後者為0.83μm×0.65μm,皆有提供測試點作為性能量測。The following describes the operational characteristics of the wideband low noise amplifier circuit 100 of the present embodiment after performing circuit simulation and actual measurement results. The wideband low noise amplifier circuit 100 of the present embodiment 3.1-10.3 GHz and 14.3-29.3 GHz is fabricated through a 0.18 μm CMOS process, and the obtained wafer area is 0.83 μm × 0.82 μm, and the latter is 0.83 μm × 0.65 μm. Test points are provided as sexual energy measurements.

對本實施例寬頻低雜訊放大器電路100之輸入端及輸出端係透過探針於測試點量測,於3.1 GHz至10.3 GHz的寬頻範圍內,訊號輸入端RFin與訊號輸出端RFout之S參數量測係透過Agilent PNA N5230向量網路分析儀測量與校正程序SOLT(Short-Open-Load-Through)作測量誤差修正,雜訊指數係透過Agilent N8975A測量;於14.3 GHz至29.3 GHz的寬頻範圍內,訊號輸入端RFin與訊號輸出端RFout之S參數量測係透過Agilent PNA E8361A向量網路分析儀測量與校正程序SOLT(Short-Open-Load-Through)作測量誤差修正,雜訊指數係透過Agilent N8975A測量。For the input and output ends of the wideband low noise amplifier circuit 100 of the present embodiment, the probe is measured at the test point. In the wide frequency range of 3.1 GHz to 10.3 GHz, the signal input terminal RF in and the signal output terminal RF out S The parameter measurement system uses the Agilent PNA N5230 vector network analyzer measurement and calibration program SOLT (Short-Open-Load-Through) for measurement error correction. The noise index is measured by the Agilent N8975A; the wide frequency range is 14.3 GHz to 29.3 GHz. The S parameter measurement system of the signal input terminal RF in and the signal output terminal RF out is measured by the Agilent PNA E8361A vector network analyzer measurement and calibration program SOLT (Short-Open-Load-Through) for measurement error correction, noise index It is measured by the Agilent N8975A.

第9圖係為本發明實施例之一種3.1-10.3 GHz頻段輸出增益S21對頻率響應特性曲線的量測結果圖。第10圖係為本發明實施例之一種14.3-29.3 GHz頻段輸出增益S21對頻率響應特性曲線的量測結果圖。如第9圖所示,於3.1 GHz至10.3 GHz的寬頻範圍內,其增益值大於9.6 dB;如第10圖所示,於14.3 GHz至29.3 GHz的寬頻範圍內,其增益值為8.25±1.65 dB。Figure 9 is a graph showing the measurement results of the frequency response characteristic curve of the output gain S 21 of the 3.1-10.3 GHz band according to an embodiment of the present invention. Figure 10 is a graph showing the measurement results of the frequency response characteristic curve of the output gain S 21 of the 14.3-29.3 GHz band according to an embodiment of the present invention. As shown in Figure 9, the gain is greater than 9.6 dB over the wide frequency range of 3.1 GHz to 10.3 GHz; as shown in Figure 10, the gain is 8.25 ± 1.65 over the wide frequency range of 14.3 GHz to 29.3 GHz. dB.

第11圖係為本發明實施例之一種3.1-10.3 GHz頻段輸入端反射係數S11對頻率響應特性曲線的量測結果圖。第12圖係為本發明實施例之一種14.3-29.3 GHz頻段輸入端反射係數S11對頻率響應特性曲線的量測結果圖。如第11圖所示,於3.1 GHz至10.3 GHz的寬頻範圍內,其輸入端之反射係數S11低於-9 dB;如第12圖所示,於14.5 GHz至29 GHz的寬頻範圍內,其輸入端之反射係數S11低於-10 dB。Figure 11 is a graph showing the measurement results of the frequency response characteristic curve of the input end reflection coefficient S 11 of the 3.1-10.3 GHz band in the embodiment of the present invention. Figure 12 is a graph showing the measurement results of the frequency response characteristic curve of the input end reflection coefficient S 11 of the 14.3-29.3 GHz band in the embodiment of the present invention. As shown in Figure 11, the reflection coefficient S 11 at the input is less than -9 dB over the wide frequency range of 3.1 GHz to 10.3 GHz; as shown in Figure 12, in the wide frequency range of 14.5 GHz to 29 GHz, The reflection coefficient S 11 at its input is below -10 dB.

第13圖係為本發明實施例之一種3.1-10.3 GHz頻段雜訊指數(Noise Figure,NF)相對於輸入訊號頻率的變化特性曲線量測結果圖。第14圖係為本發明實施例之一種14.3-29.3 GHz頻段雜訊指數相對於輸入訊號頻率的變化特性曲線量測結果圖。如第13圖所示,於3.1 GHz至10.3 GHz的寬頻範圍內,其雜訊指數低於3.9 dB,且最小之雜訊指數為2.5 dB;如第14圖所示,於14.3 GHz至29.3 GHz的寬頻範圍內,其雜訊指數低於5.8 dB,且最小之雜訊指數為4.3 dB。Figure 13 is a graph showing the measurement results of the noise characteristic curve (Noise Figure, NF) of the 3.1-10.3 GHz band with respect to the input signal frequency according to an embodiment of the present invention. Figure 14 is a graph showing measurement results of a characteristic curve of a noise index in the 14.3-29.3 GHz band with respect to an input signal frequency according to an embodiment of the present invention. As shown in Figure 13, the noise figure is less than 3.9 dB over a wide frequency range of 3.1 GHz to 10.3 GHz with a minimum noise figure of 2.5 dB; as shown in Figure 14, at 14.3 GHz to 29.3 GHz In the wide frequency range, the noise index is below 5.8 dB and the minimum noise index is 4.3 dB.

第15圖係為本發明實施例之一種3.1-10.3 GHz頻段輸出功率相對於輸入訊號功率之三階交互調變交叉點(third-order intermodulation intercept point) IIP3和1 dB增益壓縮點(1 dB compression point)P1dB的特性曲線量測結果圖。第16圖係為本發明實施例之一種14.3-29.3 GHz頻段輸出功率相對於輸入訊號功率之三階交互調變交叉點IIP3和1 dB增益壓縮點P1dB的特性曲線量測結果圖。如第15圖所示,於3.1 GHz至10.3 GHz的寬頻範圍內,其三階交互調變交叉點IIP3為1 dBm,而1 dB增益壓縮點P1dB則為-12.5 dBm;如第16圖所示,於14.3 GHz至29.3 GHz的寬頻範圍內,其三階交互調變交叉點IIP3為-2 dBm,而1 dB增益壓縮點P1dB則為-12 dBm。Figure 15 is a third-order intermodulation intercept point of the output power of the 3.1-10.3 GHz band with respect to the input signal power according to an embodiment of the present invention. IIP 3 and 1 dB gain compression point (1 dB) Compression point) P 1dB characteristic curve measurement results. Figure 16 is a graph showing the measurement results of the characteristic curve of the third-order intermodulation crossover IIP 3 and the 1 dB gain compression point P 1dB of the output power of the 14.3-29.3 GHz band with respect to the input signal power according to an embodiment of the present invention. As shown in Figure 15, the third-order intermodulation crossover IIP 3 is 1 dBm over a wide frequency range of 3.1 GHz to 10.3 GHz, while the 1 dB gain compression point P 1dB is -12.5 dBm; As shown, the third-order intermodulation crossover IIP 3 is -2 dBm over the wide frequency range of 14.3 GHz to 29.3 GHz, while the 1 dB gain compression point P 1dB is -12 dBm.

上述各實施例依據寬頻低雜訊放大器電路100之設計方法,主要設計電路之阻抗匹配,以透過調整四個電感,分別是連接於第一電晶體M1之源極S1的第一電感L1、連接於第一電晶體M1之汲極D1的第二電感L2、連接於第二電晶體M2閘極G2與第一電晶體M1汲極D1之間的第四電感L4以及連接於第二電晶體M2之源極S2的第三電感L3,並分別使其共振頻率約在6 GHz或22 GHz,進而增加其操作頻寬。In the above embodiments, according to the design method of the broadband low noise amplifier circuit 100, the impedance matching of the circuit is mainly designed to adjust the four inductors, which are respectively connected to the first inductor L of the source S 1 of the first transistor M 1 . 1, 1 is connected to the drain D of the first transistor M 1, a second inductor L 2, is connected to the second transistor M 2 between the gate G 1 of the fourth transistor M 2 and the first drain electrode D 1 The inductor L 4 and the third inductor L 3 connected to the source S 2 of the second transistor M 2 respectively have a resonance frequency of about 6 GHz or 22 GHz, thereby increasing the operating bandwidth thereof.

總而言之,由於本發明提出一種寬頻低雜訊放大器電路之設計方法,比較習知之設計方法更有系統,能快速估算高頻、中頻及低頻之大略位置以達到寬頻特徵,並可節省設計過程中嘗試錯誤的時間。In summary, since the present invention proposes a design method of a broadband low noise amplifier circuit, the conventional design method is more systematic, and can quickly estimate the approximate positions of the high frequency, the intermediate frequency, and the low frequency to achieve the broadband characteristic, and save the design process. Try the wrong time.

惟上述各實施例係用以說明本發明之特點,其目的在使熟習技術者能瞭解本發明之內容並據以實施,而非限定本發明之專利範圍,故凡其他未脫離本發明所揭示之精神而完成之等效修飾或修改,仍應包含在以下所述之申請專利範圍中。The embodiments are described to illustrate the features of the present invention, and the objects of the present invention will be understood by those skilled in the art, and are not intended to limit the scope of the present invention. Equivalent modifications or modifications made by the spirit of the invention should still be included in the scope of the patent application described below.

100...寬頻低雜訊放大器電路100. . . Broadband low noise amplifier circuit

200...共閘極放大電路200. . . Common gate amplifying circuit

300...中間匹配電路300. . . Intermediate matching circuit

400...共源極放大電路400. . . Common source amplifying circuit

RFin...訊號輸入端RF in . . . Signal input

RFout...訊號輸出端RF out . . . Signal output

IP1...第一輸入端IP 1 . . . First input

OP1...第一輸出端OP 1 . . . First output

IP2...第二輸入端IP 2 . . . Second input

OP2...第二輸出端OP 2 . . . Second output

M1...第一電晶體M 1 . . . First transistor

M1a...第一子電晶體M 1a . . . First sub-crystal

M1b...第二子電晶體M 1b . . . Second sub-crystal

M2...第二電晶體M 2 . . . Second transistor

M3...第三電晶體M 3 . . . Third transistor

L...電感L. . . inductance

L1...第一電感L 1 . . . First inductance

L2...第二電感L 2 . . . Second inductance

L3...第三電感L 3 . . . Third inductance

L4...第四電感L 4 . . . Fourth inductance

Ld2、Ld3...負載電感L d2 , L d3 . . . Load inductance

Ls3...接地電感L s3 . . . Grounding inductance

Cb1、Cb2、Cb3、Cb4...直流阻隔電容C b1 , C b2 , C b3 , C b4 . . . DC blocking capacitor

Cbp1、Cbp2、Cbp3...接地電容C bp1 , C bp2 , C bp3 . . . Grounding capacitor

Cgs1、Cgs2、Cgd1...寄生電容C gs1 , C gs2 , C gd1 . . . Parasitic capacitance

R1...第一電阻R 1 . . . First resistance

R2...第二電阻R 2 . . . Second resistance

R3...第三電阻R 3 . . . Third resistance

rds1...汲極和源極間之等效電阻r ds1 . . . Equivalent resistance between the drain and the source

Ro...並聯式電容與電感等效輸出電阻R o . . . Parallel capacitor and inductor equivalent output resistance

Ro2...共源極放大電路之輸出電阻R o2 . . . Output resistance of common source amplifier circuit

RI...串聯式電容與電感等效輸入電阻R I . . . Series capacitor and inductor equivalent input resistance

Vg1、Vg2、Vg3、Vd2、Vd3...固定電壓源V g1 , V g2 , V g3 , V d2 , V d3 . . . Fixed voltage source

Vgs1、Vgs2...閘極及源極間之電壓差V gs1 , V gs2 . . . Voltage difference between gate and source

gm1、gm2...轉導g m1 , g m2 . . . divert

Zin...輸入阻抗Z in . . . input resistance

ZL...負載阻抗Z L . . . Load impedance

Zp...輸出阻抗Z p . . . Output impedance

Zs...輸入阻抗Z s . . . input resistance

D1、D2...汲極D 1 , D 2 . . . Bungee

G1、G2...閘極G 1 , G 2 . . . Gate

S1、S2...源極S 1 , S 2 . . . Source

第1圖係為本發明實施例之一種寬頻低雜訊放大器電路之設計方法流程圖。FIG. 1 is a flow chart of a method for designing a broadband low noise amplifier circuit according to an embodiment of the present invention.

第2圖係為本發明實施例之一種寬頻低雜訊放大器之電路方塊圖。2 is a circuit block diagram of a broadband low noise amplifier according to an embodiment of the present invention.

第3A圖係為本發明實施例之一種具有3.1-10.3 GHz頻段之寬頻低雜訊放大器電路之電路架構圖。FIG. 3A is a circuit diagram of a broadband low noise amplifier circuit having a frequency band of 3.1-10.3 GHz according to an embodiment of the present invention.

第3B圖係為本發明實施例之一種具有14.3-29.3 GHz頻段之寬頻低雜訊放大器電路之電路架構圖。FIG. 3B is a circuit diagram of a broadband low noise amplifier circuit having a frequency band of 14.3-29.3 GHz according to an embodiment of the present invention.

第4A圖及第4B圖係為本發明實施例之一種寬頻低雜訊放大器之電晶體小訊號分析電路圖。4A and 4B are diagrams showing a transistor small signal analysis circuit of a broadband low noise amplifier according to an embodiment of the present invention.

第5圖係為模擬3.1-10.3 GHz頻段中間匹配電路的輸入/輸出阻抗關係圖。Figure 5 is a plot of the input/output impedance of the intermediate matching circuit in the 3.1-10.3 GHz band.

第6圖係為模擬14.3-29.3 GHz頻段中間匹配電路的輸入/輸出阻抗關係圖。Figure 6 is a plot of the input/output impedance of the intermediate matching circuit in the analog 14.3-29.3 GHz band.

第7圖係為本發明實施例之一種模擬3.1-10.3 GHz頻段輸出增益特性曲線關係圖。Figure 7 is a diagram showing the relationship of the output gain characteristic curve of the analog 3.1-10.3 GHz band according to an embodiment of the present invention.

第8圖係為本發明實施例之一種模擬14.3-29.3 GHz頻段輸出增益特性曲線關係圖。Figure 8 is a diagram showing the relationship of the output gain characteristic curves of the analog 14.3-29.3 GHz band according to an embodiment of the present invention.

第9圖係為本發明實施例之一種3.1-10.3 GHz頻段輸出增益S21對頻率響應特性曲線的量測結果圖。Figure 9 is a graph showing the measurement results of the frequency response characteristic curve of the output gain S 21 of the 3.1-10.3 GHz band according to an embodiment of the present invention.

第10圖係為本發明實施例之一種14.3-29.3 GHz頻段輸出增益S21對頻率響應特性曲線的量測結果圖。Figure 10 is a graph showing the measurement results of the frequency response characteristic curve of the output gain S 21 of the 14.3-29.3 GHz band according to an embodiment of the present invention.

第11圖係為本發明實施例之一種3.1-10.3 GHz頻段輸入端反射係數S11對頻率響應特性曲線的量測結果圖。Figure 11 is a graph showing the measurement results of the frequency response characteristic curve of the input end reflection coefficient S 11 of the 3.1-10.3 GHz band in the embodiment of the present invention.

第12圖係為本發明實施例之一種14.3-29.3 GHz頻段輸入端反射係數S11對頻率響應特性曲線的量測結果圖。Figure 12 is a graph showing the measurement results of the frequency response characteristic curve of the input end reflection coefficient S 11 of the 14.3-29.3 GHz band in the embodiment of the present invention.

第13圖係為本發明實施例之一種3.1-10.3 GHz頻段雜訊指數相對於輸入訊號頻率的變化特性曲線量測結果圖。Figure 13 is a graph showing measurement results of a variation characteristic of a noise index of a 3.1-10.3 GHz band with respect to an input signal frequency according to an embodiment of the present invention.

第14圖係為本發明實施例之一種14.3-29.3 GHz頻段雜訊指數相對於輸入訊號頻率的變化特性曲線量測結果圖。Figure 14 is a graph showing measurement results of a characteristic curve of a noise index in the 14.3-29.3 GHz band with respect to an input signal frequency according to an embodiment of the present invention.

第15圖係為本發明實施例之一種3.1-10.3 GHz頻段輸出功率相對於輸入訊號功率之三階交互調變交叉點IIP3和1 dB增益壓縮點P1dB的特性曲線量測結果圖。Figure 15 is a graph showing the measurement results of the characteristic curve of the third-order cross-modulation intersection IIP 3 and the 1 dB gain compression point P 1dB of the output power of the 3.1-10.3 GHz band with respect to the input signal power according to an embodiment of the present invention.

第16圖係為本發明實施例之一種14.3-29.3 GHz頻段輸出功率相對於輸入訊號功率之三階交互調變交叉點IIP3和1 dB增益壓縮點P1dB的特性曲線量測結果圖。Figure 16 is a graph showing the measurement results of the characteristic curve of the third-order intermodulation crossover IIP 3 and the 1 dB gain compression point P 1dB of the output power of the 14.3-29.3 GHz band with respect to the input signal power according to an embodiment of the present invention.

100...寬頻低雜訊放大器電路100. . . Broadband low noise amplifier circuit

200...共閘極放大電路200. . . Common gate amplifying circuit

300...中間匹配電路300. . . Intermediate matching circuit

400...共源極放大電路400. . . Common source amplifying circuit

RFin...訊號輸入端RF in . . . Signal input

RFout...訊號輸出端RF out . . . Signal output

L1...第一電感L 1 . . . First inductance

L2...第二電感L 2 . . . Second inductance

L3...第三電感L 3 . . . Third inductance

Claims (12)

一種寬頻低雜訊放大器電路之設計方法,其係配合一模擬軟體進行之,該設計方法包括下列步驟:提供一寬頻低雜訊放大器電路,其包括:一共閘極放大電路,其包括一第一輸入端及一第一輸出端,又該共閘極放大電路外接有一第一電感及一第二電感;一共源極放大電路,其包括一第二輸入端及一第二輸出端,該共源極放大電路外接有一第三電感;及一中間匹配電路,其包括一第四電感,該第四電感串接於該第一輸出端與該第二輸入端間;預定一設計頻段,其係由X GHz~Y GHz,以提供至該第一輸入端,又藉由該設計頻段計算推導出一共振頻率;選擇電晶體,其係選擇該共閘極放大電路及該共源極放大電路之電晶體規格及偏壓;調整該第一輸入端阻抗匹配,其係調整該第一電感,使該第一輸入端達該共振頻率匹配;調整該第一輸出端阻抗匹配,其係調整該第二電感,使該第一輸出端達該共振頻率匹配;設計該第三電感值,其係調整該第三電感,使該共源極放大電路之輸入阻抗達一設計電阻值;調整該中間匹配電路阻抗匹配,其係調整該第四電感,使該中間匹配電路之輸入端與該第一輸出端達該共振頻率;以及調整該共源極放大電路最佳增益及最佳輸入匹配,其係再次調整該第三電感使該共源極放大電路之增益及頻寬達最佳化。A design method of a broadband low noise amplifier circuit is carried out in conjunction with an analog software, the design method comprising the steps of: providing a broadband low noise amplifier circuit comprising: a common gate amplifying circuit comprising a first An input terminal and a first output terminal, the common gate amplifying circuit is externally connected with a first inductor and a second inductor; and a common source amplifying circuit includes a second input end and a second output end, the common source The pole amplifier circuit is externally connected with a third inductor; and an intermediate matching circuit includes a fourth inductor connected in series between the first output end and the second input end; X GHz~Y GHz is provided to the first input end, and a resonant frequency is derived by calculating the design frequency band; selecting a transistor, which selects the common gate amplifying circuit and the common source amplifying circuit Crystal specification and bias voltage; adjusting impedance matching of the first input end, which adjusts the first inductance, so that the first input end reaches the resonance frequency matching; adjusting the impedance matching of the first output end, and adjusting the impedance The second inductor is configured to match the first output end to the resonant frequency; the third inductance value is designed to adjust the third inductance so that the input impedance of the common source amplifying circuit reaches a design resistance value; The intermediate matching circuit impedance matching adjusts the fourth inductance such that the input end of the intermediate matching circuit reaches the resonant frequency with the first output end; and adjusts the optimal gain and the optimal input matching of the common source amplifying circuit, The third inductance is adjusted again to optimize the gain and bandwidth of the common source amplifying circuit. 如申請專利範圍第1項所述之設計方法,其中該X GHz~Y GHz係為3.1 GHz~10.3 GHz或14.3 GHz~29.3 GHz。The design method described in claim 1, wherein the X GHz to Y GHz is 3.1 GHz to 10.3 GHz or 14.3 GHz to 29.3 GHz. 如申請專利範圍第1項所述之設計方法,其中該共閘極放大電路係採用一多指叉式閘極金屬氧化半導體電晶體的架構。The design method of claim 1, wherein the common gate amplifying circuit adopts a multi-finger fork gate metal oxide semiconductor transistor structure. 如申請專利範圍第1項所述之設計方法,其中該共源極放大電路係為一共源極疊接放大電路。The design method of claim 1, wherein the common source amplifying circuit is a common source amplifying circuit. 如申請專利範圍第4項所述之設計方法,其中該共源極放大電路係操作在3.1 GHz~10.3 GHz。The design method of claim 4, wherein the common source amplifying circuit operates at 3.1 GHz to 10.3 GHz. 如申請專利範圍第1項所述之設計方法,其中該共源極放大電路係為一共源極串接放大電路。The design method of claim 1, wherein the common source amplifying circuit is a common source series amplifying circuit. 如申請專利範圍第6項所述之設計方法,其中該共源極放大電路係操作在14.3 GHz~29.3 GHz。The design method of claim 6, wherein the common source amplifying circuit operates at 14.3 GHz to 29.3 GHz. 如申請專利範圍第1項所述之設計方法,其中該共振頻率係由該X頻率加該Y頻率後之二分之一。The design method of claim 1, wherein the resonant frequency is one-half of the X frequency plus the Y frequency. 如申請專利範圍第1項所述之設計方法,其中該選擇電晶體步驟,其進一步包括選擇該共閘極放大電路其電晶體之一轉導值參數,且該轉導值參數對應之該第一輸入端之輸入阻抗係小於或等於50歐姆。The design method of claim 1, wherein the selecting a transistor step further comprises selecting a one of the transistors of the common gate amplifying circuit and transducing the parameter, and the transducing parameter corresponds to the first The input impedance of an input is less than or equal to 50 ohms. 如申請專利範圍第1項所述之設計方法,其中該調整該第一輸入端阻抗匹配步驟,其係調整該第一電感,使其與該共閘極放大電路中電晶體之閘極-源極間寄生電容,達成該共振頻率匹配。The design method of claim 1, wherein the adjusting the first input impedance matching step adjusts the first inductor to a gate-source of the transistor in the common gate amplifying circuit The parasitic capacitance between the poles achieves this resonance frequency matching. 如申請專利範圍第1項所述之設計方法,其中該調整該第一輸出端阻抗匹配步驟,其係調整該第二電感,使其與該共閘極放大電路中電晶體之閘極-汲極間寄生電容,達成該共振頻率匹配。The design method of claim 1, wherein the adjusting the first output impedance matching step adjusts the second inductance to a gate of the transistor in the common gate amplifying circuit The parasitic capacitance between the poles achieves this resonance frequency matching. 如申請專利範圍第1項所述之設計方法,其中該再次調整該第三電感後,又進一步包括一再次選擇電晶體步驟,其係再次選擇該共閘極放大電路之電晶體規格及偏壓,以使該第一輸出端及該第二輸入端間再次達該共振頻率。The design method of claim 1, wherein the adjusting the third inductor further comprises a step of selecting a transistor again, which again selects a transistor specification and a bias voltage of the common gate amplifying circuit. So that the resonant frequency is reached again between the first output end and the second input end.
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CN109474242A (en) * 2018-09-26 2019-03-15 安徽矽芯微电子科技有限公司 A kind of millimeter wave amplifier circuit in low noise
CN109905093A (en) * 2017-12-08 2019-06-18 财团法人工业技术研究院 Variable gain amplifier and its method
US10666200B2 (en) 2017-04-04 2020-05-26 Skyworks Solutions, Inc. Apparatus and methods for bias switching of power amplifiers
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US5945879A (en) * 1998-02-05 1999-08-31 The Regents Of The University Of California Series-connected microwave power amplifiers with voltage feedback and method of operation for the same
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TWI596892B (en) * 2013-10-11 2017-08-21 西凱渥資訊處理科技公司 Apparatus and methods for phase compensation in power amplifiers
US9876471B2 (en) 2013-10-11 2018-01-23 Skyworks Solutions, Inc. Apparatus and methods for power amplifiers with phase compensation
US10666200B2 (en) 2017-04-04 2020-05-26 Skyworks Solutions, Inc. Apparatus and methods for bias switching of power amplifiers
US10958218B2 (en) 2017-04-04 2021-03-23 Skyworks Solutions, Inc. Apparatus and methods for bias switching of power amplifiers
US11394347B2 (en) 2017-04-04 2022-07-19 Skyworks Solutions, Inc. Apparatus and methods for bias switching of power amplifiers
US11728773B2 (en) 2017-04-04 2023-08-15 Skyworks Solutions, Inc. Apparatus and methods for bias switching of power amplifiers
CN109905093A (en) * 2017-12-08 2019-06-18 财团法人工业技术研究院 Variable gain amplifier and its method
CN109474242A (en) * 2018-09-26 2019-03-15 安徽矽芯微电子科技有限公司 A kind of millimeter wave amplifier circuit in low noise
CN111478671A (en) * 2020-04-13 2020-07-31 电子科技大学 Novel low-noise amplifier applied to Sub-GHz frequency band
CN111478671B (en) * 2020-04-13 2023-04-14 电子科技大学 Novel low-noise amplifier applied to Sub-GHz frequency band

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