TW201307000A - Method for peeling glass substrate, and apparatus for peeling glass substrate - Google Patents
Method for peeling glass substrate, and apparatus for peeling glass substrate Download PDFInfo
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- TW201307000A TW201307000A TW101124071A TW101124071A TW201307000A TW 201307000 A TW201307000 A TW 201307000A TW 101124071 A TW101124071 A TW 101124071A TW 101124071 A TW101124071 A TW 101124071A TW 201307000 A TW201307000 A TW 201307000A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
本發明係關於一種玻璃基板之剝離方法及玻璃基板剝離裝置。 The present invention relates to a method for peeling a glass substrate and a glass substrate peeling device.
於研磨玻璃基板時，存在如下情形：玻璃基板吸附保持於接著於玻璃基板保持平台之吸附片而於研磨生產線上搬送。於該情形時，必需將研磨加工結束之玻璃基板自吸附片剝離而進行下一步驟，例如移載至清洗裝置之載置台上。 When the glass substrate is polished, there is a case where the glass substrate is adsorbed and held on the polishing line following the adsorption sheet of the glass substrate holding platform. In this case, it is necessary to peel the glass substrate which has been subjected to the polishing process from the adsorption sheet, and perform the next step, for example, transfer to the mounting table of the cleaning device.
先前，於將玻璃基板自吸附片剝離時，如例如專利文獻1所記載，向玻璃基板與吸附片之邊界部噴出壓縮空氣，藉此使玻璃基板之緣部之至少一部分自吸附片分離，並且向已分離之玻璃基板與吸附片之間之間隙供給水而解除玻璃基板相對於吸附片之吸附，從而藉由複數個吸附墊吸附保持玻璃基板之與吸附片相反之面而使玻璃基板自吸附片剝離。 When the glass substrate is peeled off from the adsorption sheet, as described in, for example, Patent Document 1, at least a part of the edge portion of the glass substrate is separated from the adsorption sheet by discharging compressed air to a boundary portion between the glass substrate and the adsorption sheet. Water is supplied to the gap between the separated glass substrate and the adsorption sheet to release the adsorption of the glass substrate relative to the adsorption sheet, and the glass substrate is self-adsorbed by adsorbing and holding the opposite surface of the glass substrate opposite to the adsorption sheet by a plurality of adsorption pads. The piece is peeled off.
專利文獻1日本專利特開2007-185725號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2007-185725
然而，先前，於在研磨結束後，自保持有玻璃基板之保持吸附構件卸除玻璃基板時，存在如下等問題：於玻璃基 板上產生龜裂或劃痕等、或為了剝離需要時間而生產性降低。特別是，先前，於在將玻璃基板貼附至玻璃基板保持平台之吸附片時，不介隔液體而貼附之情形時，存在如下情形：研磨後之玻璃基板之吸附力變得非常大，從而變得難以剝離。 However, in the past, after the completion of the polishing, when the glass substrate was removed from the holding member holding the glass substrate, there were the following problems: Cracks, scratches, and the like are generated on the board, or productivity is lowered for the time required for peeling. In particular, in the case where the glass substrate is attached to the adsorption sheet of the glass substrate holding platform, when it is attached without being separated by a liquid, there is a case where the adsorption force of the glass substrate after polishing becomes very large. Thereby it becomes difficult to peel off.
本發明係鑒於此種情況而完成者，其目的在於提供一種於將玻璃基板自其保持構件剝離時，不會產生龜裂或劃痕而可穩定地於短時間內剝離之玻璃基板之剝離方法、及玻璃基板剝離裝置。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for peeling off a glass substrate which can be stably peeled off in a short time without causing cracks or scratches when the glass substrate is peeled off from the holding member. And a glass substrate peeling device.
為了達成上述目的，本發明之玻璃基板剝離裝置之特徵在於包括：剝離機構，其將介隔液體而被吸附保持於吸附片之玻璃基板自該吸附片剝離。 In order to achieve the above object, a glass substrate peeling apparatus according to the present invention includes a peeling mechanism that peels a glass substrate that is adsorbed and held by a liquid to an adsorption sheet from the adsorption sheet.
如上所述，將玻璃基板介隔液體而貼附於吸附片，藉此於研磨後，玻璃基板之吸附力亦不會變得那麼大，而可容易地將玻璃基板自吸附片剝離。 As described above, by attaching the glass substrate to the adsorption sheet via a liquid, the adsorption force of the glass substrate does not become so large after polishing, and the glass substrate can be easily peeled off from the adsorption sheet.
又，作為一個實施態樣，較佳為上述剝離機構包括：複數個吸附墊，該等保持介隔上述液體而吸附保持於上述吸附片之上述玻璃基板之與上述吸附片相反之面；升降機構，其以進行相對於上述玻璃基板接近及分離中之一者之動作之方式，分別使上述複數個吸附墊獨立地進行升降動作；控制機構，其於將上述玻璃基板自上述吸附片剝離時，以如下方式對上述升降機構進行控制，即，自吸附上述玻璃基板之端部之上述吸附墊，逐漸地向自上述吸附片 退避之方向舉升，而使上述玻璃基板整體自上述吸附片剝離；及吸附墊移動機構，其使上述複數個吸附墊整體相對於上述玻璃基板接近或分離而於上述玻璃基板之面內方向上平行移動。 Moreover, as one embodiment, it is preferable that the peeling mechanism includes a plurality of adsorption pads that are held by the liquid to adsorb and hold the glass substrate of the adsorption sheet opposite to the adsorption sheet; The plurality of adsorption pads are independently lifted and lowered in a manner of performing one of the approach and separation of the glass substrate, and the control mechanism is configured to peel the glass substrate from the adsorption sheet. Controlling the lifting mechanism in such a manner that the adsorption pad from the end portion of the glass substrate is gradually adsorbed from the adsorption sheet Lifting in the direction of retraction, the entire glass substrate is peeled off from the adsorption sheet; and the adsorption pad moving mechanism is configured such that the plurality of adsorption pads are close to or separated from the glass substrate in the in-plane direction of the glass substrate parallel movement.
如上所述，將玻璃基板介隔液體而貼附至吸附片，故於研磨後，玻璃基板之吸附力亦不會變得那麼大而不會產生龜裂或劃痕，從而可穩定地於短時間內剝離。 As described above, since the glass substrate is attached to the adsorption sheet via a liquid, the adsorption force of the glass substrate does not become so large after grinding, and cracks or scratches are not generated, so that it can be stably short. Stripped in time.
又，作為一個實施態樣，較佳為上述剝離機構包括：吸附片，其介隔上述液體而吸附保持上述玻璃基板，且於吸附保持該玻璃基板之區域設置有複數個貫通孔；玻璃基板保持平台，其載置上述吸附片，且於載置上述吸附片之區域以與上述複數個貫通孔之開口面一致之方式而設置有複數個孔；銷，其配置於上述複數個孔內，以自上述吸附片之貫通孔突出之方式進行升降動作；升降機構，其使上述銷以自上述吸附片突出之方式進行升降動作；及控制機構，其以使上述銷進行升降動作而將上述玻璃基板自上述吸附片剝離之方式，對上述升降機構進行控制。 Moreover, as one embodiment, it is preferable that the peeling mechanism includes an adsorption sheet that adsorbs and holds the glass substrate via the liquid, and a plurality of through holes are provided in a region where the glass substrate is adsorbed and held; the glass substrate is held a platform on which the adsorption sheet is placed, and a plurality of holes are provided in a region where the adsorption sheet is placed so as to match an opening surface of the plurality of through holes; and a pin is disposed in the plurality of holes to Lifting and lowering operation is performed to protrude from the through hole of the adsorption sheet; the lifting mechanism is configured to elevate and lower the pin so as to protrude from the adsorption sheet; and a control mechanism for moving the pin to raise and lower the glass substrate The lifting mechanism is controlled in such a manner that the adsorption sheet is peeled off.
如上所述，使玻璃基板介隔液體而貼附至吸附片，並且藉由銷將研磨後之玻璃基板自非研磨面推頂剝離，故不會產生龜裂或劃痕而可穩定地於短時間內剝離。 As described above, the glass substrate is attached to the adsorption sheet via a liquid, and the polished glass substrate is peeled off from the non-polishing surface by the pin, so that cracks or scratches are not generated and can be stably short. Stripped in time.
又，作為一個實施態樣，較佳為上述複數個貫通孔及上述複數個孔係於吸附保持上述玻璃基板之區域之端部，以自該端部朝向上述玻璃基板之中央部之方式，相對於上述玻璃基板保持平台之吸附片設置面之正交方向傾斜地形 成，並且於吸附保持上述玻璃基板之區域之中央部，與上述玻璃基板保持平台之吸附片設置面之正交方向平行地形成。 Further, as one embodiment, it is preferable that the plurality of through holes and the plurality of holes are attached to an end portion of a region where the glass substrate is adsorbed and held, and the end portion faces the central portion of the glass substrate. Inclining the topography of the adsorption sheet setting surface of the glass substrate holding platform The central portion of the region where the glass substrate is adsorbed and held is formed in parallel with the direction orthogonal to the adsorption sheet installation surface of the glass substrate holding stage.
藉此，可更容易地將玻璃基板自吸附片剝離。 Thereby, the glass substrate can be more easily peeled off from the adsorption sheet.
又，作為一個實施態樣，較佳為上述剝離機構包括：吸附片，其介隔上述液體而吸附保持上述玻璃基板，且於吸附保持該玻璃基板之區域設置有複數個貫通孔；玻璃基板保持平台，其載置上述吸附片，且於載置上述吸附片之區域以與上述複數個貫通孔之開口面一致之方式而設置有複數個孔；及空氣供給機構，其向上述複數個孔內供給空氣，向上述玻璃基板之藉由上述吸附片所吸附保持之面噴吹上述空氣。 Moreover, as one embodiment, it is preferable that the peeling mechanism includes an adsorption sheet that adsorbs and holds the glass substrate via the liquid, and a plurality of through holes are provided in a region where the glass substrate is adsorbed and held; the glass substrate is held The platform is provided with the adsorption sheet, and a plurality of holes are provided in a region where the adsorption sheet is placed so as to coincide with an opening surface of the plurality of through holes, and an air supply mechanism is provided in the plurality of holes Air is supplied, and the air is blown onto the surface of the glass substrate which is adsorbed and held by the adsorption sheet.
如上所述，使玻璃基板介隔液體而貼附至吸附片，並且藉由空氣將研磨後之玻璃基板自非研磨面推頂剝離，故不會產生龜裂或劃痕而可穩定地於短時間內剝離。 As described above, the glass substrate is adhered to the adsorption sheet by interposing a liquid, and the polished glass substrate is peeled off from the non-polishing surface by air, so that cracks or scratches are not generated and can be stably shortened. Stripped in time.
又，作為一個實施態樣，較佳為上述複數個貫通孔及上述複數個孔係於吸附保持上述玻璃基板之區域之端部，以自該端部朝向上述玻璃基板之中央部之方式，相對於上述玻璃基板保持平台之吸附片設置面之正交方向傾斜地形成，並且於吸附保持上述玻璃基板之區域之中央部，與上述玻璃基板保持平台之吸附片設置面之正交方向平行地形成。 Further, as one embodiment, it is preferable that the plurality of through holes and the plurality of holes are attached to an end portion of a region where the glass substrate is adsorbed and held, and the end portion faces the central portion of the glass substrate. The center of the region where the glass substrate is adsorbed and held is obliquely formed in the direction orthogonal to the direction in which the adsorption sheet is placed on the glass substrate holding stage, and is formed in parallel with the direction orthogonal to the surface of the adsorption sheet of the glass substrate holding stage.
藉此，可更容易地將玻璃基板自吸附片剝離。 Thereby, the glass substrate can be more easily peeled off from the adsorption sheet.
又，作為一個實施態樣，較佳為上述剝離機構包括：玻 璃基板保持平台，其於上述吸附片之上表面，介隔上述液體而吸附保持經研磨之玻璃基板；及將上述玻璃基板保持平台之上下相反地反轉之機構；且將研磨後之玻璃基板及上述玻璃基板保持平台之上下相反地反轉，使得上述吸附片位於重力方向上方、上述玻璃基板位於下方，使上述玻璃基板因自身重量而自上述吸附片剝離。 Moreover, as an implementation aspect, preferably, the peeling mechanism comprises: glass a glass substrate holding platform on the upper surface of the adsorption sheet, adsorbing and holding the polished glass substrate through the liquid; and a mechanism for reversing the glass substrate to be reversed above and below the substrate; and the polished glass substrate And the glass substrate holding platform is reversed in the opposite direction so that the adsorption sheet is positioned above the gravity direction and the glass substrate is positioned below, and the glass substrate is peeled off from the adsorption sheet by its own weight.
如上所述，將上下顛倒而藉由玻璃基板之自身重量剝離，故不會產生龜裂或劃痕而可穩定地剝離。 As described above, since the glass substrate is peeled off by being upside down, the glass substrate can be peeled off stably without causing cracks or scratches.
又，相同地，為了達成上述目的，本發明之玻璃基板之剝離方法之特徵在於包括如下步驟：藉由複數個吸附墊吸附將玻璃基板介隔液體吸附保持於吸附片而研磨後之玻璃基板之與上述吸附片相反之面；自上述複數個吸附墊中之吸附上述玻璃基板之端部之上述吸附墊，逐漸向自上述吸附片退避之方向舉升，而使上述玻璃基板整體自上述吸附片剝離；及使上述玻璃基板自上述吸附片分離並於上述玻璃基板之面內方向上平行移動，將上述玻璃基板移載至下一作業步驟。 Further, in the same manner, in order to achieve the above object, the method for peeling off a glass substrate of the present invention is characterized in that the method comprises the steps of: adsorbing a glass substrate by a plurality of adsorption pads, adsorbing and holding the glass substrate through the adsorption sheet; a surface opposite to the adsorption sheet; the adsorption pad that adsorbs the end portion of the glass substrate from the plurality of adsorption pads is gradually lifted in a direction retracted from the adsorption sheet, and the glass substrate is entirely from the adsorption sheet Stripping; and separating the glass substrate from the adsorption sheet and moving in parallel in the in-plane direction of the glass substrate, and transferring the glass substrate to the next working step.
如上所述，由於將玻璃基板介隔液體而貼附於吸附片，故於研磨後，玻璃基板之吸附力亦不會變得那麼大，故不會產生龜裂或劃痕，從而可穩定地於短時間內剝離。 As described above, since the glass substrate is attached to the adsorption sheet via a liquid, the adsorption force of the glass substrate does not become so large after polishing, so that cracks or scratches do not occur, and the sheet can be stably formed. Stripped in a short time.
又，為了達成上述目的，本發明之玻璃基板之剝離方法之特徵在於包括如下步驟：於載置於設置有複數個孔之玻璃基板保持平台上之、以與上述複數個孔之開口面一致的方式設置有複數個貫通孔之吸附片上，介隔液體而吸附保 持經研磨之玻璃基板；及使配置於上述複數個孔內且以自上述吸附片之貫通孔突出之方式進行升降動作之銷進行升降動作，藉由上述銷推頂上述玻璃基板之由上述吸附片所吸附保持之面，而將上述玻璃基板自上述吸附片剝離。 Moreover, in order to achieve the above object, the method for peeling a glass substrate of the present invention is characterized by comprising the steps of: placing on a glass substrate holding platform provided with a plurality of holes to conform to an opening surface of the plurality of holes; The method is provided with a plurality of through-hole adsorption sheets, which are separated by a liquid and are adsorbed Holding the polished glass substrate; and lifting and lowering the pin disposed in the plurality of holes and protruding from the through hole of the adsorption sheet, and pushing the glass substrate by the pin The glass substrate is peeled off from the adsorption sheet by the surface on which the sheet is adsorbed and held.
藉此，使玻璃基板介隔液體而貼附至吸附片，並且藉由銷而將研磨後之玻璃基板自非研磨面推頂剝離，故不會產生龜裂或劃痕而可穩定地於短時間內剝離。 Thereby, the glass substrate is attached to the adsorption sheet via a liquid, and the polished glass substrate is peeled off from the non-polishing surface by the pin, so that cracks or scratches are not generated and can be stably shortened. Stripped in time.
又，作為一個實施態樣，較佳為上述複數個貫通孔及上述複數個孔係於吸附保持上述玻璃基板之區域之端部中，以自該端部朝向上述玻璃基板之中央部之方式，相對於上述玻璃基板保持平台之吸附片設置面之正交方向傾斜地形成，並且於吸附保持上述玻璃基板之區域之中央部，與上述玻璃基板保持平台之吸附片設置面之正交方向平行地形成，於吸附保持上述玻璃基板之區域之端部，使上述銷沿上述貫通孔及上述孔向上述玻璃基板之中央部傾斜地上升，並且於吸附保持上述玻璃基板之區域之中央部，使上述銷沿上述貫通孔及上述孔朝正上方上升。 Moreover, as one embodiment, it is preferable that the plurality of through holes and the plurality of holes are in an end portion of a region where the glass substrate is adsorbed and held, and the end portion faces the central portion of the glass substrate. It is formed obliquely with respect to the orthogonal direction of the adsorption sheet installation surface of the glass substrate holding stage, and is formed in parallel with the orthogonal direction of the adsorption sheet installation surface of the glass substrate holding stage in the central portion of the region where the glass substrate is adsorbed and held. Adhering to the end portion of the region where the glass substrate is held and held, the pin is inclined to the central portion of the glass substrate along the through hole and the hole, and the pin portion is formed at a central portion of a region where the glass substrate is adsorbed and held. The through hole and the hole rise upward.
藉此，可更容易地將玻璃基板自吸附片剝離。 Thereby, the glass substrate can be more easily peeled off from the adsorption sheet.
又，相同地，為了達成上述目的，本發明之玻璃基板之剝離方法之特徵在於包括如下步驟：於載置於設置有複數個孔之玻璃基板保持平台上之、以與上述複數個孔之開口面一致的方式設置有複數個貫通孔之吸附片上，介隔液體而吸附保持經研磨之玻璃基板；及經由上述複數個孔向上述玻璃基板之由上述吸附片所吸附保持之面噴吹空氣，從 而推頂上述玻璃基板而將上述玻璃基板自上述吸附片剝離。 Further, in the same manner, in order to achieve the above object, the peeling method of the glass substrate of the present invention is characterized by comprising the steps of: placing on the glass substrate holding platform provided with a plurality of holes, and opening the plurality of holes a glass sheet having a plurality of through holes arranged in a uniform manner, adsorbing and holding the polished glass substrate with a liquid, and blowing air through the plurality of holes to the surface of the glass substrate adsorbed and held by the adsorption sheet. From The glass substrate is pushed out to peel the glass substrate from the adsorption sheet.
如上所述，將玻璃基板介隔液體而貼附至吸附片，並且藉由空氣而將研磨後之玻璃基板自非研磨面推頂剝離，故不會產生龜裂或劃痕而可穩定地於短時間內剝離。 As described above, the glass substrate is attached to the adsorption sheet via a liquid, and the polished glass substrate is peeled off from the non-polishing surface by air, so that cracks or scratches are not generated and stable. Stripped in a short time.
又，作為一個實施態樣，較佳為上述複數個貫通孔及上述複數個孔係於吸附保持上述玻璃基板之區域之端部中，以自該端部朝向上述玻璃基板之中央部之方式，相對於上述玻璃基板保持平台之吸附片設置面之正交方向傾斜地形成，並且於吸附保持上述玻璃基板之區域之中央部，與上述玻璃基板保持平台之吸附片設置面之正交方向平行地形成，於吸附保持上述玻璃基板之區域之端部，使上述空氣沿上述貫通孔及上述孔而朝向上述玻璃基板之中央部傾斜地噴吹，並且於吸附保持上述玻璃基板之區域之中央部，使上述空氣沿上述貫通孔及上述孔而朝正上方噴吹。 Moreover, as one embodiment, it is preferable that the plurality of through holes and the plurality of holes are in an end portion of a region where the glass substrate is adsorbed and held, and the end portion faces the central portion of the glass substrate. It is formed obliquely with respect to the orthogonal direction of the adsorption sheet installation surface of the glass substrate holding stage, and is formed in parallel with the orthogonal direction of the adsorption sheet installation surface of the glass substrate holding stage in the central portion of the region where the glass substrate is adsorbed and held. And the end portion of the region where the glass substrate is adsorbed and held, and the air is sprayed obliquely toward the central portion of the glass substrate along the through hole and the hole, and the central portion of the region where the glass substrate is adsorbed and held The air is blown directly upward along the through hole and the hole.
藉此，可更容易地將玻璃基板自吸附片剝離。 Thereby, the glass substrate can be more easily peeled off from the adsorption sheet.
又，相同地，為了達成上述目的，本發明之玻璃基板之剝離方法之特徵在於包括如下步驟：於載置於玻璃基板保持平台上之吸附片之上表面，介隔液體而吸附保持經研磨之玻璃基板；及藉由將上述玻璃基板保持平台之上下相反地反轉，而將上述吸附片及上述玻璃基板之上下相反地反轉；且將上述玻璃基板與上述吸附片之上下相反地反轉，使得上述吸附片位於重力方向上方、上述玻璃基板位於下方，使上述玻璃基板因自身重量而自上述吸附片剝離。 Further, in the same manner, in order to achieve the above object, the peeling method of the glass substrate of the present invention is characterized by comprising the steps of: adhering to the upper surface of the adsorption sheet placed on the glass substrate holding platform, adsorbing and maintaining the ground by interposing the liquid a glass substrate; and the glass substrate holding plate is reversed in the opposite direction, and the adsorption sheet and the glass substrate are reversed in reverse; and the glass substrate is reversed opposite to the adsorption sheet The adsorption sheet is positioned above the gravity direction, and the glass substrate is positioned below, so that the glass substrate is peeled off from the adsorption sheet by its own weight.
如上所述，將上下倒轉而藉由玻璃基板之自身重量剝離，故不會產生龜裂或劃痕而可穩定地剝離。 As described above, the glass substrate is peeled upside down and peeled off by the weight of the glass substrate, so that it can be stably peeled off without causing cracks or scratches.
如以上說明，根據本發明，將玻璃基板介隔液體而貼附至吸附片，故於研磨後，玻璃基板之吸附力亦不會變得那麼大而不會產生龜裂或劃痕，從而可穩定地於短時間內剝離。又，藉由銷自玻璃基板之非研磨面側推頂、或向玻璃基板之非研磨面噴吹空氣，藉此進一步促進玻璃基板之剝離，從而可穩定地於短時間內剝離。 As described above, according to the present invention, since the glass substrate is attached to the adsorption sheet via a liquid, the adsorption force of the glass substrate does not become so large after grinding, and cracks or scratches are not generated. Peel off stably in a short time. Further, by pushing the pin from the non-polishing surface side of the glass substrate or blowing air to the non-polishing surface of the glass substrate, the peeling of the glass substrate is further promoted, and the peeling can be stably performed in a short time.
以下，參照隨附圖式，詳細地對本發明之玻璃基板之剝離方法及玻璃基板剝離裝置進行說明。 Hereinafter, the peeling method of the glass substrate of the present invention and the glass substrate peeling apparatus will be described in detail with reference to the accompanying drawings.
圖1係表示本發明之玻璃基板剝離裝置之第1實施形態之概略構成的立體圖。 Fig. 1 is a perspective view showing a schematic configuration of a first embodiment of a glass substrate peeling apparatus of the present invention.
如圖1所示，本實施形態之玻璃基板剝離裝置10係如下之裝置：用以將玻璃基板G自玻璃基板保持平台12上之吸附片14剝離而移載至下一步驟之裝置例如清洗裝置之載置台，該玻璃基板G係以吸附保持於玻璃基板保持平台12上之吸附片(例如，多孔質胺基甲酸乙酯片)14上之狀態，藉由連續式研磨裝置研磨而向箭頭X之方向搬送而來之研磨結束者。 As shown in Fig. 1, the glass substrate peeling apparatus 10 of the present embodiment is a device for removing the glass substrate G from the adsorption sheet 14 on the glass substrate holding stage 12 and transferring it to the next step, for example, a cleaning device. In the mounting table, the glass substrate G is adhered to the adsorption sheet (for example, a porous urethane sheet) 14 held on the glass substrate holding stage 12, and is polished by a continuous polishing apparatus to an arrow X. In the direction of the transfer, the end of the polishing.
再者，於包含本實施形態之所有實施形態中，亦將玻璃基板G之吸附保持於吸附片之側之面稱為非研磨面。 In addition, in all the embodiments including the present embodiment, the surface on which the adsorption of the glass substrate G is held on the side of the adsorption sheet is also referred to as a non-polishing surface.
本實施形態之玻璃基板剝離裝置10係將使用於液晶顯示 器用等之FPD(Flat Panel Display，平板顯示器)用玻璃基板且厚度約為0.1~1.1 mm之薄板作為對象，其尺寸係例如730 mm×920 mm，但並不限定於此，亦可使用尺寸大於此者。 The glass substrate peeling device 10 of the present embodiment is used for liquid crystal display For the FPD (Flat Panel Display, flat panel display), a thin plate having a thickness of about 0.1 to 1.1 mm is used as the object, and the size thereof is, for example, 730 mm × 920 mm, but is not limited thereto, and the size may be larger than This one.
玻璃基板剝離裝置10包括玻璃基板剝離移載裝置18(剝離機構)，該玻璃基板剝離移載裝置18(剝離機構)係用以自玻璃基板保持平台12上之吸附片14剝離玻璃基板G而向下一步驟移載。玻璃基板剝離移載裝置18包括：支持板22，其具有吸附玻璃基板G之多個吸附墊20；及導件(吸附墊移動機構)24，其用以使支持板22相對於玻璃基板接近及分離(升降)，並且向下一步驟移動。 The glass substrate peeling device 10 includes a glass substrate peeling transfer device 18 (peeling mechanism) for peeling off the glass substrate G from the adsorption sheet 14 on the glass substrate holding stage 12 The next step is to transfer. The glass substrate peeling transfer device 18 includes a support plate 22 having a plurality of adsorption pads 20 for adsorbing the glass substrate G, and a guide member (adsorption pad moving mechanism) 24 for bringing the support plate 22 into proximity with respect to the glass substrate. Separate (lift) and move to the next step.
於圖1所示之支持板22上設置有12個吸附墊20，但設置於支持板22之吸附墊20之個數並不限定於此。 Although 12 adsorption pads 20 are provided in the support plate 22 shown in FIG. 1, the number of the adsorption pads 20 provided in the support plate 22 is not limited to this.
吸附墊20可藉由獨立之氣缸26而各自獨立地升降移動。各氣缸26係藉由未圖示之控制機構而控制其升降動作。藉由吸附墊20之下降動作，使吸附墊20推壓抵接於玻璃基板G之研磨面而將玻璃基板G吸附於吸附墊20，從而藉由吸附墊20之上升動作而玻璃基板G自吸附片14剝離。 The adsorption pads 20 can be independently moved up and down by separate cylinders 26. Each of the cylinders 26 is controlled to be lifted and lowered by a control mechanism (not shown). By the lowering operation of the adsorption pad 20, the adsorption pad 20 is pressed against the polishing surface of the glass substrate G to adsorb the glass substrate G to the adsorption pad 20, whereby the glass substrate G is self-adsorbed by the rising action of the adsorption pad 20. The sheet 14 was peeled off.
使用圖2，對本實施形態之玻璃基板剝離裝置10自吸附片14剝離玻璃基板G之方法進行說明。 A method of peeling off the glass substrate G from the adsorption sheet 14 of the glass substrate peeling apparatus 10 of the present embodiment will be described with reference to Fig. 2 .
於藉由連續式研磨裝置(省略圖示)研磨玻璃基板G前，在向玻璃基板保持平台12上之吸附片14貼附玻璃基板G時，使液體介於玻璃基板G與吸附片14之間。作為該液體，通常使用水，但亦可為水以外之液體。 Before the glass substrate G is attached to the adsorption sheet 14 on the glass substrate holding stage 12, the liquid is interposed between the glass substrate G and the adsorption sheet 14 before the glass substrate G is polished by a continuous polishing apparatus (not shown). . As the liquid, water is usually used, but it may be a liquid other than water.
作為水以外之液體，可列舉多元醇。若為多元醇，則不僅可將玻璃基板G容易地自吸附片14剝離，而且變得較水更難以乾燥。多元醇之種類並無特別限定，具體而言，可例示丙三醇、聚乙二醇、乙二醇、丙二醇、二乙二醇等。又，可包含2種以上之多元醇，亦可混合多元醇與水而成為多元醇水溶液。 As a liquid other than water, a polyhydric alcohol is mentioned. In the case of a polyhydric alcohol, not only the glass substrate G can be easily peeled off from the adsorption sheet 14, but also becomes more difficult to dry than water. The type of the polyol is not particularly limited, and specific examples thereof include glycerin, polyethylene glycol, ethylene glycol, propylene glycol, and diethylene glycol. Further, two or more kinds of polyols may be contained, and a polyol and water may be mixed to form a polyhydric alcohol aqueous solution.
先前，由於不介隔水等液體而將玻璃基板G直接貼附於吸附片14，因此貼附初始之吸附力並不強，但藉由玻璃基板G之研磨時之來自研磨墊之推壓，該吸附力於研磨後變得非常大，因此於研磨後，難以將玻璃基板G自吸附片14剝離。因此，使液體介於玻璃基板G與吸附片14之間而提高貼附初始之吸附力，並且可不那麼增強研磨後之吸附力而容易地進行研磨後之玻璃基板G自吸附片14之剝離。 In the past, since the glass substrate G was directly attached to the adsorption sheet 14 without interposing a liquid such as water, the initial adsorption force was not strong, but the pressing from the polishing pad during polishing of the glass substrate G was Since this adsorption force becomes very large after polishing, it is difficult to peel the glass substrate G from the adsorption sheet 14 after polishing. Therefore, the liquid is interposed between the glass substrate G and the adsorption sheet 14 to increase the initial adsorption force, and the glass substrate G can be easily peeled off from the adsorption sheet 14 by polishing the adsorption force after polishing.
介於玻璃基板G與吸附片14之間之液體之量較佳為0.01 μl/cm2~0.001 ml/cm2。若液體之量超過0.001 ml/cm2，則玻璃基板G偏移，從而存在於研磨過程中玻璃基板G損壞之虞。又，相反地，若液體之量小於0.01 μl/cm2，則與未塗佈液體之情形相同而初始之吸附力降低，故存在於研磨過程中玻璃基板G損壞之虞。因此，於吸附片14表面上，塗佈適當之量之液體。 The amount of the liquid between the glass substrate G and the adsorption sheet 14 is preferably from 0.01 μl/cm 2 to 0.001 ml/cm 2 . If the amount of the liquid exceeds 0.001 ml/cm 2 , the glass substrate G is displaced, so that the glass substrate G is damaged during the grinding process. On the other hand, if the amount of the liquid is less than 0.01 μl/cm 2 , the initial adsorption force is lowered as in the case of the uncoated liquid, so that the glass substrate G is damaged during the polishing. Therefore, a suitable amount of liquid is applied to the surface of the adsorption sheet 14.
使液體介於玻璃基板G與吸附片14之間之方法並無特別限定。例如，於向玻璃基板G及吸附片中之一構件之與另一構件相接觸之面(塗佈面)塗佈液體時，可藉由噴嘴向塗佈面噴淋液體，亦可使吸收有液體之輥抵接至塗佈面而塗 佈液體，即可使用適當之塗佈機構。於向玻璃基板G及吸附片中之任一者塗佈液體後，在吸附片14上載置玻璃基板G。 The method of interposing the liquid between the glass substrate G and the adsorption sheet 14 is not particularly limited. For example, when a liquid is applied to a surface (coated surface) of one of the glass substrate G and the adsorption sheet which is in contact with the other member, the liquid can be sprayed onto the coated surface by the nozzle, and the absorption can be performed. The liquid roller is applied to the coated surface The cloth is liquid and the appropriate coating mechanism can be used. After applying a liquid to any of the glass substrate G and the adsorption sheet, the glass substrate G is placed on the adsorption sheet 14.
若如上所述般使液體介於玻璃基板G與吸附片14之間，則初始之吸附力亦按照某種程度增強，又，研磨後之吸附力亦不會如未塗佈液體之情形般變大，從而變得易於剝離。 If the liquid is interposed between the glass substrate G and the adsorption sheet 14 as described above, the initial adsorption force is also increased to some extent, and the adsorption force after the polishing is not changed as in the case of the uncoated liquid. Large and thus easy to peel off.
載置且吸附保持於玻璃基板保持平台12上之吸附片14上之玻璃基板G係於藉由連續式研磨裝置(省略圖示)研磨後，搬送至玻璃基板剝離裝置10之特定之位置為止。 The glass substrate G placed on the adsorption sheet 14 that is adsorbed and held on the glass substrate holding stage 12 is polished by a continuous polishing apparatus (not shown), and then transported to a specific position of the glass substrate peeling apparatus 10.
若玻璃基板G搬送至玻璃基板剝離裝置10之特定之位置為止，則藉由導件24而玻璃基板剝離移載裝置18之支持板22移動至玻璃基板G上方為止，並降至特定之高度為止。 When the glass substrate G is transported to a specific position of the glass substrate peeling device 10, the support plate 22 of the glass substrate peeling transfer device 18 is moved to the upper side of the glass substrate G by the guide 24, and is lowered to a specific height. .
於是，藉由利用未圖示之控制機構進行動作之各氣缸26之動作，吸附墊20朝向玻璃基板G下降而抵接至玻璃基板G之研磨面。接著，藉由控制機構，使位於玻璃基板G之端部之吸附墊20以自玻璃基板G分離之方式上升，從而如於圖2中以箭頭Y所示般將玻璃基板G逐漸自端部剝離。 Then, the adsorption pad 20 is lowered toward the glass substrate G and abuts against the polishing surface of the glass substrate G by the operation of each of the cylinders 26 that are operated by a control unit (not shown). Then, the adsorption pad 20 located at the end of the glass substrate G is lifted by the control means so as to be separated from the glass substrate G, and the glass substrate G is gradually peeled off from the end as indicated by an arrow Y in FIG. .
再者，此處係吸附墊20朝向玻璃基板G下降，但相反地，亦可設為玻璃基板G朝向吸附墊20移動而玻璃基板G抵接至吸附墊20。 Here, the adsorption pad 20 is lowered toward the glass substrate G. Conversely, the glass substrate G may be moved toward the adsorption pad 20 and the glass substrate G may be brought into contact with the adsorption pad 20.
此時，由於使液體介於玻璃基板G與吸附片14之間，故玻璃基板G與吸附片14之吸附力並不那麼強，從而可將玻璃基板G之端部容易地自吸附片14剝離。 At this time, since the liquid is interposed between the glass substrate G and the adsorption sheet 14, the adsorption force of the glass substrate G and the adsorption sheet 14 is not so strong, and the end portion of the glass substrate G can be easily peeled off from the adsorption sheet 14. .
而且，若將玻璃基板G之端部自吸附片14剝離結束，則使中央部之吸附墊20與端部之吸附墊相同地，以自玻璃基板G分離之方式上升而將玻璃基板G整體自吸附片14剝離。 When the end portion of the glass substrate G is peeled off from the adsorption sheet 14, the adsorption pad 20 at the center portion is lifted from the glass substrate G in the same manner as the adsorption pad at the end portion, and the entire glass substrate G is self-contained. The adsorption sheet 14 is peeled off.
若將玻璃基板G整體自吸附片14剝離，則藉由導件24而使支持板22以進一步自玻璃基板G分離之方式上升，從而以藉由吸附墊20保持玻璃基板G之狀態移載至下一步驟之裝置。 When the entire glass substrate G is peeled off from the adsorption sheet 14, the support plate 22 is lifted by the guide 24 so as to be further separated from the glass substrate G, and the glass substrate G is held by the adsorption pad 20 to be transferred to the state. The device for the next step.
如此，包括複數個吸附墊之玻璃基板剝離移載裝置18係藉由未圖示之控制機構而相對於玻璃基板G接近或分離，並且於玻璃基板G之面內方向上平行移動，從而將玻璃基板G自吸附片14剝離而搬送至下一步驟。 In this manner, the glass substrate peeling transfer device 18 including a plurality of adsorption pads is moved or moved in parallel with the glass substrate G by a control mechanism (not shown), and moves in parallel in the in-plane direction of the glass substrate G. The substrate G is peeled off from the adsorption sheet 14 and transported to the next step.
再者，以上說明之內容係於將藉由連續式研磨裝置研磨後之玻璃基板自連續式研磨裝置搬送後，藉由玻璃基板剝離裝置10而將玻璃基板G自吸附片14剝離，但研磨裝置並不限定於連續式。 In the above description, after the glass substrate polished by the continuous polishing apparatus is transferred from the continuous polishing apparatus, the glass substrate G is peeled off from the adsorption sheet 14 by the glass substrate peeling apparatus 10, but the polishing apparatus is removed. It is not limited to continuous.
於圖3中，表示逐一地研磨玻璃基板G之方式即批量式(單片式)之研磨裝置之一例。 FIG. 3 shows an example of a batch type (monolithic type) polishing apparatus which is a method of polishing the glass substrate G one by one.
圖3所示之單片式研磨裝置30係逐一地研磨玻璃基板G之裝置之一例。單片式研磨裝置30具有：玻璃基板保持平台32，其包括吸附保持玻璃基板G之吸附片34；研磨平台35，其配置於玻璃基板保持平台32之上方；振盪機構38，其使設置於研磨平台35之下表面之研磨墊36及研磨平台35升降及振盪；及未圖示之旋轉機構，其使玻璃基板保持平 台32旋轉。 The one-piece polishing apparatus 30 shown in Fig. 3 is an example of a device for polishing the glass substrate G one by one. The monolithic polishing apparatus 30 has a glass substrate holding platform 32 including an adsorption sheet 34 that adsorbs and holds the glass substrate G, a polishing table 35 disposed above the glass substrate holding platform 32, and an oscillating mechanism 38 that is disposed on the polishing The polishing pad 36 and the polishing table 35 on the lower surface of the platform 35 are lifted and oscillated; and a rotating mechanism (not shown) keeps the glass substrate flat The table 32 rotates.
於研磨玻璃基板G時，向玻璃基板保持平台32上之吸附片34之玻璃基板G之吸附面、或玻璃基板G之非研磨面塗佈特定量之液體，從而向吸附片34貼附玻璃基板G。接著，使玻璃基板保持平台32旋轉而使研磨平台35下降，將研磨墊36推壓至玻璃基板G之研磨面，從而一面使玻璃基板保持平台32旋轉一面使研磨墊36振盪而進行玻璃基板G之研磨。 When the glass substrate G is polished, a specific amount of liquid is applied to the adsorption surface of the glass substrate G of the adsorption sheet 34 on the glass substrate holding stage 32 or the non-polishing surface of the glass substrate G, thereby attaching the glass substrate to the adsorption sheet 34. G. Then, the glass substrate holding stage 32 is rotated to lower the polishing table 35, and the polishing pad 36 is pressed against the polishing surface of the glass substrate G, and the polishing pad 36 is oscillated while the glass substrate holding stage 32 is rotated to perform the glass substrate G. Grinding.
再者，於進行振盪之情形時，既可不使研磨墊36振盪而使玻璃基板保持平台32相對於研磨墊36振盪，亦可使玻璃基板保持平台32及研磨墊36之兩者振盪。 Further, in the case of oscillating, the glass substrate holding stage 32 may be oscillated with respect to the polishing pad 36 without oscillating the polishing pad 36, and both of the glass substrate holding stage 32 and the polishing pad 36 may be oscillated.
於圖4中，表示其他單片式研磨裝置之例。 In Fig. 4, an example of another single-piece polishing apparatus is shown.
圖4所示之單片式研磨裝置70係研磨1片玻璃基板G之裝置。 The one-piece polishing apparatus 70 shown in Fig. 4 is a device for polishing one glass substrate G.
該單片式研磨裝置70係於圓柱狀之研磨平台72上，以研磨墊74之中心為旋轉中心而旋轉自如地配置有圓形之研磨墊74，研磨墊74係藉由設置於研磨平台72之未圖示之馬達而向圖中箭頭A方向旋轉。研磨墊74係構成為大於玻璃基板G之尺寸。 The one-piece polishing apparatus 70 is attached to a cylindrical polishing table 72, and a circular polishing pad 74 is rotatably disposed with the center of the polishing pad 74 as a center of rotation. The polishing pad 74 is provided on the polishing table 72. The motor (not shown) rotates in the direction of the arrow A in the figure. The polishing pad 74 is configured to be larger than the size of the glass substrate G.
又，於研磨平台72，圓盤狀之玻璃基板保持平台78經由鉸鏈76而相對於研磨墊74起伏自如地構成，並且藉由未圖示之振盪驅動部而向圖中箭頭B方向振盪。 Further, in the polishing table 72, the disk-shaped glass substrate holding platform 78 is configured to be undulating with respect to the polishing pad 74 via the hinge 76, and is oscillated in the direction of the arrow B in the drawing by an oscillation driving portion (not shown).
於玻璃基板保持平台78之下表面，固著有吸附片80。又，於吸附片80之中央部，吸附保持有矩形狀之玻璃基板 G。 On the lower surface of the glass substrate holding platform 78, an adsorption sheet 80 is fixed. Further, in the central portion of the adsorption sheet 80, a rectangular glass substrate is adsorbed and held. G.
於單片式研磨裝置70中，若玻璃基板G如圖4般吸附保持於吸附片80，則使玻璃基板保持平台78倒伏而使玻璃基板G推壓抵接至研磨墊74之表面。接著，使研磨墊74向圖中箭頭A方向旋轉，並且使玻璃基板保持平台78向圖中箭頭B方向振盪而開始玻璃基板G之研磨。 In the monolithic polishing apparatus 70, when the glass substrate G is adsorbed and held by the adsorption sheet 80 as shown in FIG. 4, the glass substrate holding stage 78 is laid down, and the glass substrate G is pressed against the surface of the polishing pad 74. Next, the polishing pad 74 is rotated in the direction of the arrow A in the drawing, and the glass substrate holding stage 78 is oscillated in the direction of the arrow B in the drawing to start polishing of the glass substrate G.
其次，對剝離如圖3所示之單片式研磨裝置30之研磨後之玻璃基板G的方法進行說明。 Next, a method of peeling off the polished glass substrate G of the one-piece polishing apparatus 30 shown in FIG. 3 will be described.
圖5表示將藉由單片式研磨裝置30而研磨後之玻璃基板G自吸附片34剝離之狀況。 FIG. 5 shows a state in which the glass substrate G polished by the single-plate polishing apparatus 30 is peeled off from the adsorption sheet 34.
於藉由單片式研磨裝置30研磨玻璃基板G後，使研磨平台35退避至特定之退避位置上，取而代之將與圖1之玻璃基板剝離移載裝置18相同之玻璃基板剝離移載裝置40移動至吸附保持於玻璃基板保持平台32上的吸附片34之玻璃基板G上。 After polishing the glass substrate G by the monolithic polishing apparatus 30, the polishing table 35 is retracted to a specific retracted position, and the glass substrate peeling transfer device 40 similar to the glass substrate peeling transfer device 18 of FIG. 1 is moved instead. It is adsorbed and held on the glass substrate G of the adsorption sheet 34 on the glass substrate holding stage 32.
玻璃基板剝離移載裝置40係與玻璃基板剝離移載裝置18相同地，包括：支持板42，其具有吸附玻璃基板G之多個吸附墊44；及導件48，其用以使支持板42升降而向下一步驟移動。 The glass substrate peeling transfer device 40 is similar to the glass substrate peeling transfer device 18, and includes a support plate 42 having a plurality of adsorption pads 44 for adsorbing the glass substrate G, and a guide member 48 for supporting the support plate 42. Lift and move to the next step.
又，吸附墊44係與第1實施形態相同地，可藉由各獨立之氣缸46而各自獨立升降移動。 Further, the adsorption pad 44 can be independently moved up and down by the respective independent cylinders 46 in the same manner as in the first embodiment.
於藉由此種玻璃基板剝離移載裝置40而自吸附片34上剝離玻璃基板G之情形時，與圖2所示者相同地，於使所有吸附墊44吸附於玻璃基板G之研磨面後，首先使玻璃基板G 之端部之吸附墊44上升而逐漸自玻璃基板G之端部進行剝離。 When the glass substrate G is peeled off from the adsorption sheet 34 by the glass substrate peeling transfer device 40, as in the case shown in FIG. 2, after all the adsorption pads 44 are adsorbed on the polishing surface of the glass substrate G, First, make the glass substrate G The adsorption pad 44 at the end portion rises and gradually peels off from the end portion of the glass substrate G.
於該情形時，亦使液體介於玻璃基板G與吸附片34之間，因此研磨後之玻璃基板G與吸附片34之吸附力不會變得那麼強，因此可容易地剝離。 In this case as well, since the liquid is interposed between the glass substrate G and the adsorption sheet 34, the adsorption force of the glass substrate G and the adsorption sheet 34 after polishing does not become so strong, so that it can be easily peeled off.
而且，若將玻璃基板G之端部自吸附片34剝離結束，則使中央部之吸附墊44與端部之吸附墊相同地，以自玻璃基板G分離之方式上升而將玻璃基板G整體自吸附片34剝離。 When the end portion of the glass substrate G is peeled off from the adsorption sheet 34, the adsorption pad 44 at the center portion is lifted from the glass substrate G in the same manner as the adsorption pad at the end portion, and the entire glass substrate G is self-contained. The adsorption sheet 34 is peeled off.
其次，對本發明之玻璃基板剝離裝置之第2實施形態進行說明。 Next, a second embodiment of the glass substrate peeling apparatus of the present invention will be described.
圖6表示第2實施形態之玻璃基板剝離裝置50之主要部分之剖面圖。 Fig. 6 is a cross-sectional view showing a main portion of a glass substrate peeling device 50 according to a second embodiment.
如圖6所示，於玻璃基板剝離裝置50之玻璃基板保持平台52上，設置有用以吸附保持玻璃基板G之吸附片54。 As shown in FIG. 6, an adsorption sheet 54 for adsorbing and holding the glass substrate G is provided on the glass substrate holding stage 52 of the glass substrate peeling apparatus 50.
於本實施形態中，在吸附片54上，設置有特定之孔(貫通孔)56，又，於玻璃基板保持平台52上，以與吸附片54成為相同之配置之方式設置有相同之直徑的孔58。 In the present embodiment, the adsorption sheet 54 is provided with a specific hole (through hole) 56, and the glass substrate holding platform 52 is provided with the same diameter so as to be disposed in the same manner as the adsorption sheet 54. Hole 58.
該吸附片54之孔56之非研磨面側之開口面、與玻璃基板保持平台52的孔58之吸附片54側之開口面係相同地以成為相同之配置的方式而形成，將吸附片54位置對準至玻璃基板保持平台52上，從而孔56與孔58連通而成為一個孔。而且，於玻璃基板保持平台52之孔58內，配置有可藉由未圖示之升降機構升降之銷60。 The opening surface on the non-polishing surface side of the hole 56 of the adsorption sheet 54 is formed in the same manner as the opening surface on the side of the adsorption sheet 54 of the hole 58 of the glass substrate holding stage 52, and the adsorption sheet 54 is formed. The position is aligned to the glass substrate holding platform 52 such that the aperture 56 communicates with the aperture 58 to form a hole. Further, a pin 60 that can be lifted and lowered by a lifting mechanism (not shown) is disposed in the hole 58 of the glass substrate holding stage 52.
再者，銷60之升降機構係與上述實施形態相同地藉由未圖示之控制機構而控制。作為銷60之升降機構，例如可採用如下等公知之機構：熟知之藉由齒輪齒條等機械機構而升降之機構；利用空氣等氣體或者水或油等流體之壓力而升降之機構；或利用因磁氣產生之斥力/引力而升降之機構。 Further, the lifting mechanism of the pin 60 is controlled by a control mechanism (not shown) as in the above embodiment. As the elevating mechanism of the pin 60, for example, a well-known mechanism such as a mechanism that is lifted and lowered by a mechanical mechanism such as a rack and pinion, or a mechanism that elevates and lowers by using a gas such as air or a fluid such as water or oil; A mechanism that rises and falls due to the repulsive force/gravitation generated by magnetic gas.
該銷60係如下者：用以上升而自玻璃基板G之非研磨面側將玻璃基板G向上方推頂，從而將玻璃基板G自吸附片54剝離。因此，銷60之前端係為了防止玻璃基板G之損傷而形成有圓弧。 The pin 60 is used to lift the glass substrate G upward from the non-polishing surface side of the glass substrate G to lift the glass substrate G from the adsorption sheet 54. Therefore, the front end of the pin 60 is formed with an arc to prevent damage of the glass substrate G.
又，較佳為，該孔56、58及銷60之位置如圖6所示般配置於與玻璃基板G之端部對應之部位，而自玻璃基板G之端部進行剝離。然而，孔及銷之數量並不限定於圖6所示者，例如亦可根據玻璃基板G之尺寸等而進一步增加數量。 Moreover, it is preferable that the positions of the holes 56, 58 and the pin 60 are disposed at positions corresponding to the end portions of the glass substrate G as shown in FIG. 6, and are peeled off from the end portions of the glass substrate G. However, the number of the holes and the pins is not limited to those shown in FIG. 6, and may be further increased depending on, for example, the size of the glass substrate G or the like.
圖7表示本實施形態之作用。 Fig. 7 shows the action of this embodiment.
如圖7所示，藉由未圖示之升降機構使銷60向圖中箭頭C之方向上升，藉由銷60推壓研磨結束之玻璃基板G之非研磨面，將玻璃基板G自吸附片54舉升而自吸附片54剝離。 As shown in FIG. 7, the pin 60 is raised in the direction of the arrow C in the figure by the elevating mechanism (not shown), and the non-polishing surface of the glass substrate G after polishing is pressed by the pin 60, and the glass substrate G is self-adsorbed. 54 lifted and peeled off from the adsorption sheet 54.
此時，如上所述由於玻璃基板G係非常薄者，因此使銷60上升之速度較佳為按照不會損傷玻璃基板G之程度緩慢地上升，較佳為以30 mm/秒以下之速度上升。 At this time, since the glass substrate G is extremely thin as described above, the speed at which the pin 60 is raised is preferably gradually increased so as not to damage the glass substrate G, and preferably is increased at a speed of 30 mm/sec or less. .
再者，如上所述般藉由銷推壓玻璃基板G之非研磨面而將玻璃基板G自吸附片舉升，從而將玻璃基板G自吸附片 剝離之方法，亦可對圖1所示之玻璃基板剝離裝置10應用。 Further, as described above, the glass substrate G is lifted from the adsorption sheet by pushing the non-polishing surface of the glass substrate G by the pin, thereby the glass substrate G is self-adsorbed. The method of peeling can also be applied to the glass substrate peeling device 10 shown in Fig. 1.
再者，銷60亦可設置於與玻璃基板G之非研磨面之中央部對應之部位，而並非僅設置於與玻璃基板G的非研磨面之端部對應之部位。於在與中央部對應之部位亦設置有銷60之情形時，首先使與端部對應之銷60上升，先使玻璃基板G之端部自吸附片54剝離，其後使與玻璃基板G之中央部對應之銷60上升，而使玻璃基板G之中央部自吸附片54剝離即可。 Further, the pin 60 may be provided at a portion corresponding to the central portion of the non-polishing surface of the glass substrate G, and is not provided only at a portion corresponding to the end portion of the non-polishing surface of the glass substrate G. When the pin 60 is also provided in the portion corresponding to the central portion, first, the pin 60 corresponding to the end portion is raised, and the end portion of the glass substrate G is first peeled off from the adsorption sheet 54 and then the glass substrate G is placed. The pin 60 corresponding to the center portion rises, and the central portion of the glass substrate G may be peeled off from the adsorption sheet 54.
其次，對剝離如圖4所示之單片式研磨裝置70之研磨後之玻璃基板G的方法進行說明。 Next, a method of peeling off the polished glass substrate G of the one-piece polishing apparatus 70 shown in Fig. 4 will be described.
圖8表示本發明之第3實施形態。 Fig. 8 shows a third embodiment of the present invention.
第3實施形態係玻璃基板剝離裝置71，其係如圖4所示之單片式研磨裝置70般，在下側有研磨墊74、且在上側之玻璃基板保持平台78之吸附片80上吸附保持有玻璃基板G之情形時，應用如圖6所示之第2實施形態之銷而將玻璃基板G自吸附片80剝離。 The third embodiment is a glass substrate peeling device 71 which, like the one-piece polishing apparatus 70 shown in Fig. 4, has a polishing pad 74 on the lower side and is adsorbed and held on the adsorption sheet 80 of the upper glass substrate holding stage 78. In the case of the glass substrate G, the glass substrate G is peeled off from the adsorption sheet 80 by applying the pin of the second embodiment as shown in Fig. 6 .
如圖8所示，於玻璃基板保持平台78之下表面之吸附片80上吸附保持有玻璃基板G。此時，於玻璃基板保持平台78及吸附片80上形成有複數個特定之孔82。而且，於孔82內，配置有可藉由未圖示之升降機構進行升降動作之銷84。 As shown in FIG. 8, the glass substrate G is adsorbed and held on the adsorption sheet 80 on the lower surface of the glass substrate holding stage 78. At this time, a plurality of specific holes 82 are formed in the glass substrate holding stage 78 and the adsorption sheet 80. Further, a pin 84 that can be lifted and lowered by a lifting mechanism (not shown) is disposed in the hole 82.
藉由該銷84而推頂玻璃基板G之非研磨面，從而將玻璃基板G自吸附片80剝離。 The glass substrate G is peeled off from the adsorption sheet 80 by pushing the non-polishing surface of the glass substrate G by the pin 84.
圖9表示本實施形態之作用。 Fig. 9 shows the action of this embodiment.
如圖9所示，藉由未圖示之升降機構而使銷84向圖中箭頭D之方向下降，藉由銷84推壓研磨結束之玻璃基板G之非研磨面，從而將玻璃基板G之非研磨面逐漸自吸附片80剝離。此時，如圖9所示，銷84以與玻璃基板G之端部碰觸之方式配置，因此玻璃基板G係自其端部剝離。 As shown in FIG. 9, the pin 84 is lowered in the direction of the arrow D in the figure by a lifting mechanism (not shown), and the non-polishing surface of the glass substrate G after the polishing is pressed by the pin 84, thereby the glass substrate G. The non-polishing surface is gradually peeled off from the adsorption sheet 80. At this time, as shown in FIG. 9, since the pin 84 is arrange|positioned in contact with the edge part of the glass substrate G, the glass substrate G is peeled from the edge part.
若藉由銷84推頂玻璃基板G之非研磨面，則以此為槽口而玻璃基板G之端部藉由銷84剝離，從而藉由玻璃基板G之自身重量而自端部向中央部促進剝離。其結果，玻璃基板G整體自吸附片80剝離而玻璃基板G落下。 When the non-polishing surface of the glass substrate G is pushed by the pin 84, the end portion of the glass substrate G is peeled off by the pin 84 as a notch, and the end portion is directed to the center portion by the weight of the glass substrate G. Promote stripping. As a result, the entire glass substrate G is peeled off from the adsorption sheet 80, and the glass substrate G is dropped.
此時，使銷84下降之速度係按照不會損傷較薄之玻璃基板G之程度緩慢地下降，較佳為以30 mm/秒以下之速度下降。又，亦可藉由銷84推頂玻璃基板G之非研磨面，並且向該面噴吹空氣而促進剝離。又，較佳為，將接收剝離落下而來之玻璃基板G之機構配置於玻璃基板G之落下方向，接收玻璃基板G而向下一步驟移載。 At this time, the speed at which the pin 84 is lowered is gradually lowered so as not to damage the thin glass substrate G, and is preferably lowered at a speed of 30 mm/sec or less. Further, the non-polishing surface of the glass substrate G can be pushed up by the pin 84, and air can be blown to the surface to promote peeling. Further, it is preferable that the mechanism for receiving the peeled glass substrate G is placed in the falling direction of the glass substrate G, and the glass substrate G is received and transferred to the next step.
再者，銷84亦可設置於與玻璃基板G之非研磨面之中央部對應之部位，而並非僅設置於與玻璃基板G之非研磨面之端部對應之部位。於在與中央部對應之部位亦設置有銷84之情形時，首先使與端部對應之部位之銷84下降而首先將玻璃基板G之端部自吸附片80剝離，此後使與中央部對應之部位之銷84下降而將玻璃基板G之中央部自吸附片80剝離即可。 Further, the pin 84 may be provided at a portion corresponding to the central portion of the non-polishing surface of the glass substrate G, and is not provided only at a portion corresponding to the end portion of the non-polishing surface of the glass substrate G. When the pin 84 is also provided in the portion corresponding to the central portion, first, the pin 84 at the portion corresponding to the end portion is lowered, and the end portion of the glass substrate G is first peeled off from the adsorption sheet 80, and thereafter, the portion corresponding to the central portion is correspondingly removed. The pin 84 of the portion is lowered, and the central portion of the glass substrate G may be peeled off from the adsorption sheet 80.
其次，對本發明之玻璃基板剝離裝置之第4實施形態進 行說明。 Next, the fourth embodiment of the glass substrate peeling apparatus of the present invention is further Line description.
圖10表示第4實施形態之玻璃基板剝離裝置90之主要部分之剖面圖。 Fig. 10 is a cross-sectional view showing the main part of the glass substrate peeling device 90 of the fourth embodiment.
如圖10所示，於玻璃基板剝離裝置90之玻璃基板保持平台52上設置有用以吸附保持玻璃基板G之吸附片54。 As shown in FIG. 10, an adsorption sheet 54 for adsorbing and holding the glass substrate G is provided on the glass substrate holding stage 52 of the glass substrate peeling device 90.
與上述第2實施形態相同地，於本實施形態之吸附片54，設置有孔(貫通孔)56，又，於玻璃基板保持平台52，設置有與孔56相同之直徑之孔58。該吸附片54之孔56之非研磨面側之開口面、與玻璃基板保持平台52的孔58之吸附片54側之開口面係與第2實施形態相同地，以成為相同之配置之方式而形成，將吸附片54位置對準至玻璃基板保持平台52上，從而孔56與孔58連通而成為一個孔。 Similarly to the second embodiment, the adsorption sheet 54 of the present embodiment is provided with a hole (through hole) 56, and the glass substrate holding platform 52 is provided with a hole 58 having the same diameter as the hole 56. The opening surface on the non-polishing surface side of the hole 56 of the adsorption sheet 54 and the opening surface on the side of the adsorption sheet 54 of the hole 58 of the glass substrate holding stage 52 are the same as in the second embodiment, and are arranged in the same manner. Forming, the adsorption sheet 54 is aligned to the glass substrate holding platform 52 such that the aperture 56 communicates with the aperture 58 to form a hole.
於本實施形態中，在形成於作為玻璃基板保持平台52之吸附片54設置面之對向面之底面的孔58之開口面，連接有管62之一端，管62之另一端連接於未圖示之空氣泵(空氣供給機構)。空氣泵連接有未圖示之空氣泵控制機構，從而藉由空氣泵控制機構而壓力受到控制之空氣自空氣泵供給至孔56、58。 In the present embodiment, one end of the tube 62 is connected to the opening surface of the hole 58 formed in the bottom surface of the opposing surface of the surface on which the adsorption sheet 54 of the glass substrate holding stage 52 is disposed, and the other end of the tube 62 is connected to the other end. Air pump (air supply mechanism) shown. An air pump control mechanism (not shown) is connected to the air pump, so that the pressure-controlled air is supplied from the air pump to the holes 56, 58 by the air pump control mechanism.
本實施形態係將空氣自該孔56、58噴吹至玻璃基板G之非研磨面而將玻璃基板G自吸附片54剝離者。 In the present embodiment, air is blown from the holes 56 and 58 to the non-polishing surface of the glass substrate G, and the glass substrate G is peeled off from the adsorption sheet 54.
圖11表示將玻璃基板G自吸附片54剝離之狀況。 FIG. 11 shows a state in which the glass substrate G is peeled off from the adsorption sheet 54.
如圖11所示，於將研磨結束之玻璃基板G自吸附片54剝離時，自管62通過玻璃基板保持平台52之孔58、及吸附片54之孔56而對玻璃基板G之非研磨面噴吹空氣。藉由該空 氣之壓力，而玻璃基板G自吸附片54剝離。 As shown in FIG. 11, when the glass substrate G after the polishing is peeled off from the adsorption sheet 54, the non-polishing surface of the glass substrate G is passed through the hole 58 of the glass substrate holding platform 52 and the hole 56 of the adsorption sheet 54 from the tube 62. Blow air. With the void The pressure of the gas is peeled off from the adsorption sheet 54 by the glass substrate G.
再者，較佳為，如圖10及11所示，設置於玻璃基板保持平台52之噴吹空氣之孔係設置於與玻璃基板G之端部對應之部位，而將玻璃基板G自端部剝離。然而，孔之位置或個數並不限定於此。例如，亦可根據玻璃基板G之尺寸等而進一步增加數量。又，孔56、58亦可設置於中央部，而並非如圖10及圖11所示般僅設置於與玻璃基板G之端部對應之部位。於在中央部亦設置有孔之情形時，首先自端部之孔對玻璃基板G噴吹空氣而首先使玻璃基板G之端部剝離，此後自中央部之孔噴出空氣而剝離中央部即可。 Further, as shown in FIGS. 10 and 11, it is preferable that the hole for blowing air provided in the glass substrate holding stage 52 is provided at a portion corresponding to the end portion of the glass substrate G, and the glass substrate G is from the end portion. Stripped. However, the position or number of holes is not limited to this. For example, the number may be further increased depending on the size of the glass substrate G or the like. Further, the holes 56 and 58 may be provided at the center portion, and are not provided only at portions corresponding to the end portions of the glass substrate G as shown in FIGS. 10 and 11 . When a hole is provided in the center portion, first, the end of the glass substrate G is peeled off by blowing air from the hole at the end portion, and then the air is ejected from the hole in the center portion to peel off the center portion. .
進而，如圖12所示，亦可向玻璃基板G之非研磨面噴吹空氣，並且結合使用如設置於上述第1實施形態之玻璃基板剝離移載裝置18之吸附墊。即，經由玻璃基板保持平台52之孔58、及吸附片54之孔56，向玻璃基板G之非研磨面噴吹自管62供給之空氣而使玻璃基板G之端部自吸附片54浮升，並且藉由吸附保持於玻璃基板G之研磨面之玻璃基板剝離移載裝置18之吸附墊20而舉升玻璃基板G，藉此可將玻璃基板G更簡單且迅速地自吸附片54剝離。 Further, as shown in FIG. 12, air may be blown onto the non-polishing surface of the glass substrate G, and the adsorption pad provided in the glass substrate peeling transfer device 18 of the above-described first embodiment may be used in combination. In other words, the air supplied from the tube 62 is blown onto the non-polishing surface of the glass substrate G through the hole 58 of the glass substrate holding stage 52 and the hole 56 of the adsorption sheet 54, and the end portion of the glass substrate G is lifted from the adsorption sheet 54. Further, the glass substrate G is lifted by adsorbing the adsorption pad 20 of the transfer device 18 on the glass substrate held by the polishing surface of the glass substrate G, whereby the glass substrate G can be more easily and quickly peeled off from the adsorption sheet 54.
再者，當然亦可相對於圖7所示之第2實施形態組合第1實施形態之玻璃基板剝離移載裝置18。即，藉由銷60推頂玻璃基板G之非研磨面，並且藉由吸附保持於玻璃基板G之研磨面之玻璃基板剝離移載裝置18之吸附墊20而舉升玻璃基板G，藉此可將玻璃基板G更簡單且迅速地自吸附片54剝離。 Further, of course, the glass substrate peeling transfer device 18 of the first embodiment may be combined with the second embodiment shown in FIG. In other words, the non-polishing surface of the glass substrate G is pushed up by the pin 60, and the glass substrate G is lifted by adsorbing the adsorption pad 20 of the transfer device 18 by the glass substrate held by the polishing surface of the glass substrate G. The glass substrate G is peeled off from the adsorption sheet 54 more simply and quickly.
又，亦可組合所有該等實施形態而藉由銷推頂玻璃基板G之非研磨面，並且自玻璃基板G之非研磨面噴吹空氣而使玻璃基板G自吸附片浮升，進而，於吸附保持於玻璃基板G之研磨面後，藉由玻璃基板剝離移載裝置18之吸附墊20而舉升玻璃基板G。 Further, in combination with all of the embodiments, the non-polishing surface of the top glass substrate G can be pushed by the pin, and the glass substrate G can be floated from the adsorption sheet by blowing air from the non-polishing surface of the glass substrate G, and further, After the adsorption is held on the polishing surface of the glass substrate G, the glass substrate G is lifted by peeling off the adsorption pad 20 of the transfer device 18 by the glass substrate.
於該情形時，噴出空氣之孔可利用銷之孔，亦可與銷之孔單獨地設置孔。 In this case, the hole for ejecting air may utilize the hole of the pin or may be separately provided with the hole of the pin.
再者，此處，於組合上述各實施形態時，在將玻璃基板G吸附保持至吸附片時，使水或者多元醇等液體介於玻璃基板G與吸附片之間而貼附即可。如此，藉由使液體介於玻璃基板G與吸附片之間，而增強最初之吸附力，並且變得易於將研磨後之玻璃基板自吸附片剝離。 Here, in the case where the glass substrate G is adsorbed and held to the adsorption sheet, the liquid such as water or a polyol may be attached between the glass substrate G and the adsorption sheet and attached. Thus, by allowing the liquid to be interposed between the glass substrate G and the adsorption sheet, the initial adsorption force is enhanced, and it becomes easy to peel the polished glass substrate from the adsorption sheet.
再者，銷之孔之直徑及噴出空氣之孔的直徑並無特別限定，但孔之直徑較佳為10 mm以下，更佳為5 mm以下，進而較佳為1 mm以下，最佳為0.1 mm以下。 Further, the diameter of the hole of the pin and the diameter of the hole for ejecting air are not particularly limited, but the diameter of the hole is preferably 10 mm or less, more preferably 5 mm or less, further preferably 1 mm or less, and most preferably 0.1 or less. Below mm.
若銷之孔之直徑及噴出空氣之孔的直徑為10 mm以下，則於銷之孔及噴出空氣之孔中，不存在薄板之玻璃基板因自身重量變形為凹形而損壞之虞。又，若噴出空氣之孔之直徑為10 mm以下，則可增強噴出空氣之壓力，因此變得易於剝離玻璃基板G。再者，於玻璃基板之厚度為0.7 mm以下、較佳為0.5 mm以下、進而較佳為0.3 mm以下、最佳為0.1 mm以下時，發揮防止凹形之變形、提高空氣之噴出壓力之效果。 If the diameter of the hole of the pin and the diameter of the hole for ejecting air are 10 mm or less, in the hole of the pin and the hole for ejecting air, there is no flaw in the glass substrate of the thin plate being deformed into a concave shape due to its own weight. Further, when the diameter of the hole for ejecting air is 10 mm or less, the pressure of the ejected air can be increased, so that the glass substrate G can be easily peeled off. In addition, when the thickness of the glass substrate is 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less, and most preferably 0.1 mm or less, the effect of preventing deformation of the concave shape and increasing the discharge pressure of the air is exhibited. .
其次，對本發明之第5實施形態進行說明。 Next, a fifth embodiment of the present invention will be described.
圖13表示本實施形態之玻璃基板剝離機構。 Fig. 13 shows a glass substrate peeling mechanism of this embodiment.
如圖13所示，於玻璃基板剝離裝置98之玻璃基板保持平台92上，設置有用以吸附保持玻璃基板G之吸附片94，介隔水等液體而玻璃基板G貼附於吸附片94。而且，於玻璃基板保持平台92，設置有將玻璃基板保持平台92旋轉之旋轉機構96。 As shown in FIG. 13, on the glass substrate holding stage 92 of the glass substrate peeling apparatus 98, the adsorption|suction sheet 94 which adsorbs and hold|maintains the glass substrate G is provided, and liquid, such as water, is isolate|separated, and the glass substrate G is attached to the adsorption|suction sheet 94. Further, a rotation mechanism 96 for rotating the glass substrate holding stage 92 is provided on the glass substrate holding stage 92.
於將玻璃基板G自吸附片94剝離時，如圖14所示，藉由設置於玻璃基板保持平台92之旋轉機構96而使玻璃基板保持平台92向箭頭E之方向旋轉，從而使玻璃基板保持平台92上下反轉而使玻璃基板G變為玻璃基板保持平台92之下側。藉此，使玻璃基板G藉由自身重量向箭頭F之方向落下而自吸附片94剝離。 When the glass substrate G is peeled off from the adsorption sheet 94, as shown in FIG. 14, the glass substrate holding stage 92 is rotated in the direction of the arrow E by the rotation mechanism 96 provided on the glass substrate holding stage 92, thereby keeping the glass substrate The stage 92 is inverted upside down so that the glass substrate G becomes the lower side of the glass substrate holding platform 92. Thereby, the glass substrate G is peeled from the adsorption sheet 94 by falling in the direction of the arrow F by its own weight.
於該情形時，亦可藉由設置於玻璃基板保持平台之銷推頂玻璃基板G之非研磨面、或自設置於玻璃基板保持平台之孔向玻璃基板G之非研磨面噴吹空氣，而促進玻璃基板G自吸附片之剝離。此時，銷或空氣係首先自玻璃基板G之端部碰觸而使玻璃基板G首先自端部剝離即可。又，較佳為，將接收自吸附片94剝離落下而來之玻璃基板G之機構配置於玻璃基板G之落下方向，於接收玻璃基板G後，移載至下一步驟。 In this case, the non-polishing surface of the glass substrate G can be pushed by the pin of the glass substrate holding platform or the non-polishing surface of the glass substrate G can be blown from the hole provided in the glass substrate holding platform. The peeling of the glass substrate G from the adsorption sheet is promoted. At this time, the pin or the air first comes into contact with the end portion of the glass substrate G, and the glass substrate G may be first peeled off from the end portion. Further, it is preferable that the mechanism for receiving the glass substrate G which has been peeled off from the adsorption sheet 94 is placed in the falling direction of the glass substrate G, and after receiving the glass substrate G, it is transferred to the next step.
如以上說明般，於本發明之各實施形態中，介隔液體而將玻璃基板貼附固定於吸附片，故於研磨後，玻璃基板之吸附力亦不會變大。因此，為了吸附保持玻璃基板之研磨面而使用吸附墊、藉由銷推頂玻璃基板之非研磨面、自玻 璃基板之非研磨面噴吹空氣、又或者為了使玻璃基板與保持構件之位置關係倒轉而使上下反轉，藉此可將玻璃基板穩定地於短時間內自吸附片剝離。 As described above, in each of the embodiments of the present invention, the glass substrate is attached and fixed to the adsorption sheet via a liquid, so that the adsorption force of the glass substrate does not become large after polishing. Therefore, in order to adsorb and hold the polished surface of the glass substrate, the adsorption pad is used, and the non-polishing surface of the top glass substrate is pushed by the pin. The non-polishing surface of the glass substrate is blown with air, or the glass substrate is reversed upside down in order to reverse the positional relationship between the glass substrate and the holding member, whereby the glass substrate can be stably peeled off from the adsorption sheet in a short time.
以上，詳細地對本發明之玻璃基板之剝離方法及玻璃基板剝離裝置進行了說明，但本發明並不限定於以上之例，當然亦可於不脫離本發明之主旨之範圍內，進行各種改良或變形。 In the above, the glass substrate peeling method and the glass substrate peeling apparatus of the present invention have been described in detail. However, the present invention is not limited to the above examples, and various modifications may be made without departing from the spirit and scope of the invention. Deformation.
又，亦可向玻璃基板與吸附片之界面噴吹空氣(壓縮空氣)及水(高壓水)中之至少一者。以此方式，對上述界面賦予剝離之槽口而進一步變得易於剝離。 Further, at least one of air (compressed air) and water (high pressure water) may be sprayed onto the interface between the glass substrate and the adsorption sheet. In this way, the above-described interface is provided with a peeling notch and further becomes easily peeled off.
又，較佳為，於實施形態2~5中，在將薄板之玻璃基板自吸附片剝離之情形時，使銷之孔之角度及噴出空氣之孔的角度相對於玻璃基板保持平台之吸附片設置面之正交方向而傾斜。具體而言，較佳為，與玻璃基板G之端部對應之銷之角度係向玻璃基板的中央部傾斜，與玻璃基板之中央部對應之銷之角度係相對於非研磨面之正交方向平行。 Further, in the second to fifth embodiments, in the case where the glass substrate of the thin plate is peeled off from the adsorption sheet, the angle of the hole of the pin and the angle of the hole for ejecting the air are opposed to the adsorption sheet of the glass substrate holding platform. Set the orthogonal direction of the face and tilt it. Specifically, it is preferable that the angle of the pin corresponding to the end portion of the glass substrate G is inclined toward the central portion of the glass substrate, and the angle of the pin corresponding to the central portion of the glass substrate is orthogonal to the non-polishing surface. parallel.
如圖15所示，於沿相對於設置玻璃基板保持平台100之載置玻璃基板G之吸附片102之吸附片設置面100a的正交方向平行地形成之孔104而使銷106朝正上方上升、或者自孔104噴出空氣之情形時，玻璃基板G局部地撓曲，從而存在如於圖中以符號108所示般損壞之虞。 As shown in FIG. 15, the pin 104 is formed so as to be vertically upward along the hole 104 formed in the direction orthogonal to the direction in which the adsorption sheet installation surface 100a of the adsorption sheet 102 on which the glass substrate G is placed. Or, in the case where air is ejected from the hole 104, the glass substrate G is locally deflected, so that there is a flaw as shown by the symbol 108 in the figure.
與此相對，如圖16所示，於玻璃基板保持平台100之端部，以自端部朝向玻璃基板G之中央部之方式，相對於吸附片設置面100a之正交方向傾斜地形成孔104，從而使銷 106沿孔104傾斜地上升、或者噴出空氣。又，於玻璃基板保持平台100之中央部，與吸附片設置面100a之正交方向平行地形成孔104，從而使銷106沿孔104朝正上方上升、或者噴出空氣。於該情形時，玻璃基板G之端部向中央部局部地變形，因此不存在損壞之虞。 On the other hand, as shown in FIG. 16 , at the end of the glass substrate holding stage 100 , the hole 104 is formed obliquely with respect to the direction perpendicular to the adsorption sheet installation surface 100 a so that the end portion faces the central portion of the glass substrate G. Thus making a pin 106 rises obliquely along the hole 104 or ejects air. Further, in the central portion of the glass substrate holding stage 100, a hole 104 is formed in parallel with the direction orthogonal to the adsorption sheet installation surface 100a, so that the pin 106 rises upward along the hole 104 or discharges air. In this case, the end portion of the glass substrate G is partially deformed toward the center portion, so that there is no damage.
再者，於玻璃基板G之厚度為0.7 mm以下、較佳為0.5 mm以下、進而較佳為0.3 mm以下、最佳為0.1 mm以下時，發揮防止局部變形之效果。 In addition, when the thickness of the glass substrate G is 0.7 mm or less, preferably 0.5 mm or less, more preferably 0.3 mm or less, and most preferably 0.1 mm or less, the effect of preventing local deformation is exhibited.
詳細地、又參照特定之實施態樣對本發明進行了說明，但業者應當瞭解，可不脫離本發明之範圍與精神而實施各種修正或變更。 The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various modifications and changes can be made without departing from the scope and spirit of the invention.
本申請案係基於2011年7月4日申請之日本專利申請2011-148552者，其內容係以參照之形式併入本文中。 The present application is based on Japanese Patent Application No. 2011-148552, filed on Jan.
10‧‧‧玻璃基板剝離裝置 10‧‧‧ glass substrate stripping device
12‧‧‧玻璃基板保持平台 12‧‧‧Glass substrate retention platform
14‧‧‧吸附片 14‧‧‧Adsorption tablets
18‧‧‧玻璃基板剝離移載裝置 18‧‧‧ Glass substrate peeling transfer device
20‧‧‧吸附墊 20‧‧‧Adsorption pad
22‧‧‧支持板 22‧‧‧Support board
24‧‧‧導件 24‧‧‧ Guides
26‧‧‧氣缸 26‧‧‧ cylinder
30‧‧‧單片式研磨裝置 30‧‧‧Single-piece grinding device
32‧‧‧玻璃基板保持平台 32‧‧‧Glass substrate retention platform
34‧‧‧吸附片 34‧‧‧Adsorption tablets
35‧‧‧研磨平台 35‧‧‧ Grinding platform
36‧‧‧研磨墊 36‧‧‧ polishing pad
38‧‧‧振盪機構 38‧‧‧Oscillation mechanism
40‧‧‧玻璃基板剝離移載裝置 40‧‧‧glass substrate peeling transfer device
42‧‧‧支持板 42‧‧‧Support board
44‧‧‧吸附墊 44‧‧‧Adsorption pad
46‧‧‧氣缸 46‧‧‧ cylinder
48‧‧‧導件 48‧‧‧ Guides
50‧‧‧玻璃基板剝離裝置 50‧‧‧ glass substrate stripping device
52‧‧‧玻璃基板保持平台 52‧‧‧Glass substrate retention platform
54‧‧‧吸附片 54‧‧‧Adsorption tablets
56‧‧‧孔 56‧‧‧ hole
58‧‧‧孔 58‧‧‧ hole
60‧‧‧銷 60‧‧ ‧ sales
62‧‧‧管 62‧‧‧ tube
70‧‧‧單片式研磨裝置 70‧‧‧Single-plate grinding device
71‧‧‧玻璃基板剝離裝置 71‧‧‧ glass substrate stripping device
72‧‧‧研磨平台 72‧‧‧ Grinding platform
74‧‧‧研磨墊 74‧‧‧ polishing pad
76‧‧‧鉸鏈 76‧‧‧ Hinges
78‧‧‧玻璃基板保持平台 78‧‧‧Glass substrate retention platform
80‧‧‧吸附片 80‧‧‧Adsorption tablets
82‧‧‧孔 82‧‧‧ hole
84‧‧‧銷 84‧‧ ‧ sales
90‧‧‧玻璃基板剝離裝置 90‧‧‧ glass substrate stripping device
92‧‧‧玻璃基板保持平台 92‧‧‧Glass substrate retention platform
94‧‧‧吸附片 94‧‧‧Adsorption tablets
96‧‧‧旋轉機構 96‧‧‧Rotating mechanism
98‧‧‧玻璃基板剝離裝置 98‧‧‧ glass substrate stripping device
100‧‧‧玻璃基板保持平台 100‧‧‧Glass substrate retention platform
100a‧‧‧吸附片設置面 100a‧‧‧Adhesive sheet setting surface
102‧‧‧吸附片 102‧‧‧Adsorption tablets
104‧‧‧孔 104‧‧‧ hole
106‧‧‧銷 106‧‧ ‧ sales
圖1係表示本發明之玻璃基板剝離裝置之第1實施形態之概略構成的立體圖。 Fig. 1 is a perspective view showing a schematic configuration of a first embodiment of a glass substrate peeling apparatus of the present invention.
圖2係表示玻璃基板剝離裝置自吸附片剝離玻璃基板之狀況之剖面圖。 2 is a cross-sectional view showing a state in which a glass substrate peeling device peels off a glass substrate from an adsorption sheet.
圖3係表示單片式之研磨裝置之一例之立體圖。 Fig. 3 is a perspective view showing an example of a one-piece polishing apparatus.
圖4係表示單片式之研磨裝置之其他例之立體圖。 Fig. 4 is a perspective view showing another example of the one-piece polishing apparatus.
圖5係表示將藉由圖3之研磨裝置研磨後之玻璃基板自吸附片剝離之狀況之說明圖。 Fig. 5 is an explanatory view showing a state in which the glass substrate polished by the polishing apparatus of Fig. 3 is peeled off from the adsorption sheet.
圖6係第2實施形態之玻璃基板剝離裝置之主要部分之剖面圖。 Fig. 6 is a cross-sectional view showing a main part of a glass substrate peeling apparatus according to a second embodiment.
圖7係表示第2實施形態之作用之剖面圖。 Fig. 7 is a cross-sectional view showing the action of the second embodiment.
圖8係表示本發明之第3實施形態之剖面圖。 Fig. 8 is a cross-sectional view showing a third embodiment of the present invention.
圖9係表示第3實施形態之作用之剖面圖。 Fig. 9 is a cross-sectional view showing the action of the third embodiment.
圖10係第4實施形態之玻璃基板剝離裝置之主要部分之剖面圖。 Fig. 10 is a cross-sectional view showing a main part of a glass substrate peeling apparatus of a fourth embodiment.
圖11係表示將玻璃基板自吸附片剝離之狀況之說明圖。 Fig. 11 is an explanatory view showing a state in which a glass substrate is peeled off from the adsorption sheet.
圖12係表示於第4實施形態中併用第1實施形態之狀況之剖面圖。 Fig. 12 is a cross-sectional view showing the state in which the first embodiment is used in the fourth embodiment.
圖13係表示本發明之第5實施形態之剖面圖。 Figure 13 is a cross-sectional view showing a fifth embodiment of the present invention.
圖14係表示第5實施形態之作用之剖面圖。 Fig. 14 is a cross-sectional view showing the action of the fifth embodiment.
圖15係表示使銷相對於玻璃基板保持平台之吸附片設置面之正交方向平行地上升之情形時之問題點的剖面圖。 Fig. 15 is a cross-sectional view showing a problem in a case where the pin is raised in parallel with respect to the direction orthogonal to the adsorption sheet setting surface of the glass substrate holding stage.
圖16係表示使銷向相對於玻璃基板保持平台之吸附片設置面之正交方向傾斜之方向上升的狀況之剖面圖。 Fig. 16 is a cross-sectional view showing a state in which the pin is raised in a direction inclined with respect to an orthogonal direction of the adsorption sheet setting surface of the glass substrate holding stage.
32‧‧‧玻璃基板保持平台 32‧‧‧Glass substrate retention platform
34‧‧‧吸附片 34‧‧‧Adsorption tablets
40‧‧‧玻璃基板剝離移載裝置 40‧‧‧glass substrate peeling transfer device
42‧‧‧支持板 42‧‧‧Support board
44‧‧‧吸附墊 44‧‧‧Adsorption pad
46‧‧‧氣缸 46‧‧‧ cylinder
48‧‧‧導件 48‧‧‧ Guides
G‧‧‧玻璃基板 G‧‧‧glass substrate
Claims (13)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011148552A JP2014179355A (en) | 2011-07-04 | 2011-07-04 | Glass substrate peeling method and peeling device of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201307000A true TW201307000A (en) | 2013-02-16 |
Family
ID=47436945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101124071A TW201307000A (en) | 2011-07-04 | 2012-07-04 | Method for peeling glass substrate, and apparatus for peeling glass substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014179355A (en) |
| KR (1) | KR20140033433A (en) |
| TW (1) | TW201307000A (en) |
| WO (1) | WO2013005589A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585028B (en) * | 2013-01-30 | 2017-06-01 | 斯克林集團公司 | Detaching apparatus and detaching method |
| TWI593617B (en) * | 2013-03-28 | 2017-08-01 | 斯克林集團公司 | Detaching apparatus |
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| WO2014133007A1 (en) * | 2013-02-26 | 2014-09-04 | 日本電気硝子株式会社 | Method for manufacturing electronic device |
| JP5926700B2 (en) * | 2013-04-30 | 2016-05-25 | 東京応化工業株式会社 | Support body separating apparatus and support body separating method |
| WO2014182553A1 (en) | 2013-05-07 | 2014-11-13 | Corning Incorporated | Process and apparatus for forming shaped glass articles |
| JP6488912B2 (en) * | 2015-06-25 | 2019-03-27 | Ａｇｃ株式会社 | Packing method for substrate with adsorption layer and packing apparatus for substrate with adsorption layer |
| KR101684288B1 (en) * | 2015-12-28 | 2016-12-08 | 코리아테크노(주) | Separating protective film apparatus |
| KR102556329B1 (en) * | 2016-12-15 | 2023-07-17 | 세메스 주식회사 | Vacuum chuck supporting semiconductor substrate |
| KR102417000B1 (en) * | 2017-03-20 | 2022-07-05 | 주식회사 케이씨텍 | Substrate procesing apparatus |
| JP6993099B2 (en) * | 2017-04-27 | 2022-01-13 | 株式会社岡本工作機械製作所 | Chuck device |
| KR102354000B1 (en) * | 2017-06-08 | 2022-01-25 | 주식회사 제우스 | Reworking device of display part module and the reworking method using the same |
| CN107471107B (en) * | 2017-08-31 | 2019-06-21 | 深圳市雄华光学有限公司 | A kind of glass edge-grinding machine automatic clamping device |
| JP7143024B2 (en) * | 2018-08-28 | 2022-09-28 | 株式会社ディスコ | Chuck table and wafer processing method |
| KR102560167B1 (en) | 2018-10-04 | 2023-07-25 | 코닝 인코포레이티드 | Apparatus of supporting debonding and method for debonding using the same |
| JP7184621B2 (en) * | 2018-12-12 | 2022-12-06 | 株式会社ディスコ | Peeling method |
| CN113299576B (en) * | 2020-02-21 | 2022-11-22 | 济南晶正电子科技有限公司 | Mechanical film separating device |
| KR102608793B1 (en) * | 2020-05-25 | 2023-12-01 | (주)피엔피 | Flaking bath of stacked block with ultra thin glass |
| CN114311952B (en) * | 2021-12-16 | 2022-12-09 | 珠海市奥德维科技有限公司 | Diaphragm stripping platform |
| KR102472563B1 (en) * | 2022-06-28 | 2022-11-30 | 주식회사 아라(Ara) | System for detaching interleaving paper attached to glass substrate and gripper device included therein |
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| JPH1187477A (en) * | 1997-09-09 | 1999-03-30 | Toshiba Corp | Retaining device of substrate |
| JP2002154647A (en) * | 2000-11-15 | 2002-05-28 | Yotaro Hatamura | Substrate holder, holding method for substrate, and manufacturing method for liquid crystal display element using substrate holder |
| JP2003330031A (en) * | 2002-05-10 | 2003-11-19 | Seiko Epson Corp | Substrate holding apparatus, substrate sticking apparatus method for manufacturing electrooptic apparatus, and electronic equipment |
| JP2005243896A (en) * | 2004-02-26 | 2005-09-08 | Dainippon Printing Co Ltd | Treatment device |
| JP2005353811A (en) * | 2004-06-10 | 2005-12-22 | Dainippon Printing Co Ltd | Mounting device and mounting pedestal |
| JP5307970B2 (en) * | 2006-01-11 | 2013-10-02 | 旭硝子株式会社 | Method and apparatus for peeling large glass substrate |
| JP5024971B2 (en) * | 2007-04-19 | 2012-09-12 | 株式会社アルバック | Substrate holding mechanism and substrate assembling apparatus having the same |
| JP2009182256A (en) * | 2008-01-31 | 2009-08-13 | Tokyo Ohka Kogyo Co Ltd | Processing device for substrate and processing method for substrate |
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2011
- 2011-07-04 JP JP2011148552A patent/JP2014179355A/en not_active Withdrawn
-
2012
- 2012-06-22 KR KR1020137033600A patent/KR20140033433A/en not_active Application Discontinuation
- 2012-06-22 WO PCT/JP2012/066074 patent/WO2013005589A1/en active Application Filing
- 2012-07-04 TW TW101124071A patent/TW201307000A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585028B (en) * | 2013-01-30 | 2017-06-01 | 斯克林集團公司 | Detaching apparatus and detaching method |
| TWI593617B (en) * | 2013-03-28 | 2017-08-01 | 斯克林集團公司 | Detaching apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140033433A (en) | 2014-03-18 |
| JP2014179355A (en) | 2014-09-25 |
| WO2013005589A1 (en) | 2013-01-10 |
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