201248019 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種風扇模組，且特別是有關於一種 適用於電子裝置的風扇模組。 【先前技術】 為因應現今電子產品高速度、高效能、且輕薄短小的 要求，使得各種可攜式（portable)電子裝置已漸成主流。 就筆記型電腦（notebook)而言，由於筆記型電腦無法提 供很大的空間來容置散熱系統，因此如何在有限的配置空 間中提高其散熱效率，乃是業界所專注的焦點之一。 一般而言，筆記型電腦通常會配備有風扇模組，用以 對筆記型電腦内部之發熱元件進行散熱。為了降低整體結 構的重量及厚度，風扇模組之用以容納散熱風扇的上蓋及 底板被設計成具有較薄的厚度，且散熱風扇與上蓋之間的 距離及上蓋與筆記型電腦内其它結構件之間的距離亦被設 計為較小。此種設計方式可應用於強調輕薄可攜的超薄形 筆記型電腦（ultra-thin type notebook )。 然而，厚度較薄的上蓋具有較低的結構強度，在散熱 風扇與上蓋之間距離較小且上蓋與筆記型電腦内結構件^ 間距離較小的情況下’上1容易因所述結構件的壓迫而產 生變形，使散熱風扇受到上蓋的壓迫而影響風扇模組的正 常運作。 201248019 【發明内容】 本發明提供一種風扇模組，具有較佳的結構強度。 本發明提出一種風扇模組，適用於一電子裝置。風扇 模組包括一底板、一上蓋、一側壁、一散熱風扇及一殼體。 側壁組設在上蓋與底板之間，其中側壁、上蓋與底板構成 一谷納空間。散熱風扇配置於底板上而位於容納空間内。 殼體疊設於上蓋上。 在本發明之一實施例中，上述之殼體與側壁一體成 型。 在本發明之一實施例中，上述之殼體覆蓋上蓋的一第 一部分且暴露上蓋的一第二部分。電子裝置的一結構件接 觸殼體，結構件與第二部分之間具有間隙而形成一入風 口’入風口連通容納空間。 在本發明之一實施例中’上述之上蓋具有一開口，開 口暴露容納空間，入風口透過開口連通容納空間。 在本發明之一實施例中，上述之殼體與底板之間具有 間距而形成一出風口’出風口連通容納空間。 在本發明之一實施例中，風扇模組更包括一支撐柱， 支撐柱位於出風口且支撐於底板與殼體之間。 在本發明之一實施例中，上述之殼體具有一延伸部， 延伸部連接於殼體的邊緣。支撐柱支撐於底板與延伸部之 間。 、 在本發明之一實施例中，上述之殼體與支撐柱一體成 型。 201248019 在本發明之-實施例中，上述之上蓋與底板的材質為 金屬。 在本發明之一實施例中，上述之殼體的材質為塑膠。 在本發明之一實施例中，上述之上蓋與殼體一體成 型。 ^本發明出一種風扇模組，適用於一電子裝置。風扇 模組包括-底板、一上蓋、—側壁及—散熱風扇。上蓋的 二第一，分的厚度大於上蓋的一第一部分的厚度。侧壁組 没在上蓋與底板之間，其中側壁、上蓋與底板構成一容納 空間。散熱風扇配置於底板上而位於容納空間内。 在本發明之一實施例中，上述之上蓋與側壁一體成 型。 在本發明之一實施例中，上述之電子裝置的一結構件 接觸第一部分。結構件與第二部分之間具有間隙而形成一 入風口，入風口連通容納空間。 在本發明之一實施例中，上述之上蓋具有一開口，開 口暴露容納空間，入風口透過開口連通容納空間。 在本發明之一實施例中，上述之上蓋與底板之間具有 間距而形成一出風口，出風口連通容納空間。 在本發明之一實施例中，風扇模組更包括一支撐柱， 其中支撐柱位於出風口且支撐於底板與上蓋之間。 在本發明之一實施例中，上述之上蓋與支撐柱一體成 型。 在本發明之一實施例中’上述之上蓋與底板的材質為 201248019 金屬 基於上述’在本發明的風扇模組中 體可增贿構強度，使上蓋受壓迫時不易產生^: =運:避免散熱風扇受到上蓋壓迫，以維持風扇模組的 為讓本备明之上述特徵和優點能更明顯易懂，下文 舉實施例，並配合所附圖式作詳細說明如下。 、 【實施方式】 圖1為本發明一實施例之風扇模組的立體圖。圖2為 圖1之風扇模組的爆炸圖。請參考圖i，本實施例的風扇 模組100包括一底板110、一上蓋12〇、一側壁13〇、一散 熱風扇140及一殼體150。侧壁13〇組設在上蓋12〇盥 板110之間，且側壁130、上蓋12〇與底板11〇構成一容 納空間160。散熱風扇140配置於底板11〇上而位於容納 空間160内。殼體15〇疊設於上蓋12〇上，且上蓋12〇位 於殼體150及底板110之間，其中殼體15〇與上蓋可 透過黏貼、鎖固或包覆射出的方式組裝在一起。在其它實 施例中，殼體150亦可藉由其它方式組裝於上蓋12〇，本 發明不對此加以限制。 在上述配置方式之下，疊設於上蓋12〇的殼體15〇可 增強整體結構強度，使上蓋120受壓迫時不易產生變形。 藉此，可避免散熱風扇140受到上蓋12〇壓迫，以維持風 扇模組100的正常運作。 201248019 本實施例的風扇模組100例如是用於筆記型電腦 (notebook computer)，用以對筆記型電腦内部的發熱元件進 行政熱。在其它貫施例中，風扇模組1〇〇可用於其它種類 之電子裝置’本發明不對此加以限制。 圖3為圖1之風扇模組應用於電子裝置的局部側視 圖。為使圖式較為清楚，圖3僅繪示出電子裝置的結構件 50。結構件50例如為電子裝置内鄰近風扇模組1〇〇的機殼 或元件，本發明不對此加以限制。請參考圖丨至圖3，在 本實施例中，殼體150覆蓋上蓋120的一第一部分122且 暴露上蓋120的一第二部分124。上蓋12〇具有一開口 126,開口 126暴露容納空間160。結構件5〇接觸殼體15〇, 結構件50與第二部分124之間具有間隙而形成一入風口 170’入風口 170透過開口 126連通容納空間16〇。此外， 如圖1所示，殼體120與底板no之間具有間距而形成一 出風口 180,出風口 180連通容納空間16〇。藉此，當風扇 模組100運作時，散熱氣流可透過入風口 17〇進入風扇模 組100 ’並透過出風口 180從風扇模組励排出，以利散 熱的進行。 在薄型化的電子裝置中，風扇模組1〇〇與結構件5〇 的配置位置會非常靠近。在上蓋12〇上疊設殼體15〇可提 升風扇模組100的結構強度，使上蓋12〇與散熱風扇14〇 不會因電子裝置薄型化的設計而受到結構件50壓迫。此 外’如上述方式將殼體15〇設計為僅覆蓋上蓋12〇的第一 部分122並暴露上蓋12〇的第二部分124，而在上蓋12〇 201248019 與結構件50之間形成入風口 170,可避免鄰近風扇模組1〇〇 的結構件50阻礙散熱氣流的流動。 本實施例中的風扇模組1〇〇還包括一支撐柱19〇。支 撐柱190位於出風口 180且支撐於底板11〇與殼體15〇之 間，以進一步提升風扇模組1〇〇的結構強度。詳細而言， 本實施例的殼體150具有一延伸部152，延伸部152連接 於殼體150的邊緣，支撐柱19〇支撐於底板11〇與延伸部 152之間。 ' 在本實施例中，底板110及上蓋12〇的材質例如為 鋁、鎂等金屬材料而具有較輕的重量及較佳的結構強度。 殼體150、支撐柱190及側壁130的材質例如為塑膠，使 殼體150、支撐柱190及側壁13〇能夠藉由射出成形的方 式同時被製造出，而為一體成型的結構。在其它實施例中， 底板110、上蓋120及殼體150可選用其它適當材料，本 發明不對此加以限制。 在其它實施例中，上蓋120也可與殼體150 —體成 型。在上蓋120與殼體150 —體成型的情況下，殼體15〇 可視為上蓋120的一部分，而使上蓋12〇在此部分具有較 大的厚度。以下藉由圖式對此加以詳細說明。 圖4為本發明另一實施例之風扇模組的立體圖。圖5 為圖4之風扇模組的爆炸圖。請參考圖4，本實施例的風 扇模組200包括一底板210、一上蓋220、一側壁230及一 散熱風扇240。上蓋220的一第一部分222的厚度大於上 蓋220的一第一部分224的厚度。側壁230組設在上蓋220 201248019 210之間’且侧壁23〇、上蓋22〇與底板2i〇構成 H間260。政熱風扇240配置於底板210上而位於 容納空間260内。 上述配置方式之下，上蓋220的第一部分瓜可增 強正體結構強度，使上蓋22〇受壓迫時不易產生變形。藉 此’可避免散熱風扇240受到上蓋22〇壓迫，以維持風扇 模組200的正常運作。 圖6為圖4之風扇模組應用於電子裝置的局部側視 圖。為使圖式較為清楚，圖6僅綠示出電子裝置的結構件 50、”。構件50例如為電子裝置内鄰近風扇模組細的機殼 或元件’本發明不對此加以限制。請參考圖4至圖6，在 本貝施例中’電子裝置的結構件5〇接觸第 22，姓 構件5〇與第二部分224之間具有間隙而形成一入風；； 270 ’入風口 270連通容納空間26〇。上蓋22〇具有一開口 226’開口 226暴露容納空間260,入風口 270透過開口 226 連通容納^間260。此外，如圖4所示，上蓋22()與底板 210之間具有間距而形成一出風口 28〇，出風口·連通容 納空間260。藉此，當風扇模組2〇〇運 透過錢口 270進入風扇模組·，並透過出二 風扇模組200排出，以利散熱的進行。 在薄型化的電子裝置中，風扇模組2〇〇與結構件知 的配置位置㈣常靠近。故上蓋22()增加厚度可提升風扇 模組200的結構強度，使上蓋22〇與散熱風扇24〇不會因 電子裝置薄型化的設計而受到結構件5〇壓迫。此外，如上 201248019 述方式將上蓋220設計為第一部分222的厚度大於第二部 分224的厚度，而在上蓋22〇與結構件5〇之間形成入風口 270，可避免鄰近風扇模組2〇〇的結構件％阻礙散熱氣流 的流動。 本實施例中的風扇模組2〇〇更包括一支撐柱29〇。支 撐柱290位於出風口 28〇且支撐於底板21〇與上蓋22〇之 間，以進一步提升風扇模組2〇〇的結構強度。 在f實施例中，底板210及上蓋220的材質例如為 鋁、鎂等金屬材料而具有較輕的重量及較佳的結構強度。 在其它實施例中’底板210及上蓋22〇可選用其它適當材 料’本發明不對此加以限制。此外，支撐柱29〇與上蓋22〇 可為一體成型。 表τ、上所述，在本發明的風扇模組中，疊設於上蓋的殼 ，可增強整體結構強度，使上蓋受壓迫時不易產生變形。 藉，、’可避免散熱風扇受到上蓋壓迫，以維持風扇模組的 正常運作。此外，可在出風口處形成支撐於底板與殼體之 間的支撐柱，以進一步提升風扇模組的結構強度。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本發明一實施例之風扇模組的立體圖。 201248019 圖2為圖1之風扇模組的爆炸圖。 圖3為圖1之風扇模組應用於電子裝置的局部侧視 圖4為本發明另一實施例之風扇模組的立體 圖5為圖4之風扇模組的爆炸圖。 圖6為圖4之風扇模組應用於電子奘 g。 电于衷置的局部側視 【主要元件符號說明】 50 :結構件 100、200 :風扇模組 110、210 :底板 120、220 :上蓋 122、222 :第一部分 124、224 :第二部分 126、226 :開口 130、230 :侧壁 140、240 :散熱風扇 150 :殼體 152 :延伸部 160、260 :容納空間 170、270 :入風口 180、280 :出風口 190、290 :支撐柱201248019 VI. Description of the Invention: [Technical Field] The present invention relates to a fan module, and more particularly to a fan module suitable for an electronic device. [Prior Art] In order to meet the requirements of high speed, high efficiency, light weight and shortness of today's electronic products, various portable electronic devices have become mainstream. As far as notebooks are concerned, since notebooks do not provide much space to accommodate the cooling system, how to improve the heat dissipation efficiency in a limited configuration space is one of the focuses of the industry. In general, notebook computers are usually equipped with a fan module to dissipate heat from the internal heating elements of the notebook. In order to reduce the weight and thickness of the overall structure, the upper cover and the bottom plate of the fan module for accommodating the cooling fan are designed to have a thin thickness, and the distance between the cooling fan and the upper cover and the upper cover and other structural components in the notebook computer The distance between them is also designed to be smaller. This design can be applied to ultra-thin type notebooks that emphasize thin and light portable. However, the thinner upper cover has a lower structural strength, and when the distance between the cooling fan and the upper cover is small and the distance between the upper cover and the structural member in the notebook computer is small, the upper one is easily caused by the structural member. The deformation caused by the compression causes the cooling fan to be pressed by the upper cover to affect the normal operation of the fan module. 201248019 SUMMARY OF THE INVENTION The present invention provides a fan module having better structural strength. The invention provides a fan module suitable for an electronic device. The fan module includes a bottom plate, an upper cover, a side wall, a heat dissipation fan and a casing. The side wall is disposed between the upper cover and the bottom plate, wherein the side wall, the upper cover and the bottom plate form a gluten space. The cooling fan is disposed on the bottom plate and is located in the receiving space. The housing is stacked on the upper cover. In an embodiment of the invention, the housing is integrally formed with the side wall. In one embodiment of the invention, the housing covers a first portion of the upper cover and exposes a second portion of the upper cover. A structural member of the electronic device contacts the housing, and a gap is formed between the structural member and the second portion to form an air inlet port. The air inlet communicates with the receiving space. In an embodiment of the invention, the upper cover has an opening, the opening exposing the accommodating space, and the air inlet is connected to the accommodating space through the opening. In an embodiment of the invention, the housing and the bottom plate have a spacing to form an air outlet ‘air outlet for receiving the receiving space. In an embodiment of the invention, the fan module further includes a support column, the support column is located at the air outlet and supported between the bottom plate and the housing. In an embodiment of the invention, the housing has an extension connected to an edge of the housing. The support column is supported between the bottom plate and the extension. In an embodiment of the invention, the housing and the support post are integrally formed. 201248019 In the embodiment of the present invention, the upper cover and the bottom plate are made of metal. In an embodiment of the invention, the housing is made of plastic. In an embodiment of the invention, the upper cover is integrally formed with the housing. The invention provides a fan module suitable for an electronic device. The fan module includes a bottom plate, an upper cover, a side wall, and a cooling fan. The thickness of the first and second portions of the upper cover is greater than the thickness of a first portion of the upper cover. The side wall group is not between the upper cover and the bottom plate, and the side wall, the upper cover and the bottom plate constitute a receiving space. The cooling fan is disposed on the bottom plate and is located in the receiving space. In an embodiment of the invention, the upper cover is integrally formed with the side wall. In an embodiment of the invention, a structural member of the electronic device contacts the first portion. A gap is formed between the structural member and the second portion to form an air inlet, and the air inlet communicates with the receiving space. In an embodiment of the invention, the upper cover has an opening, the opening exposing the accommodating space, and the air inlet communicates with the accommodating space through the opening. In an embodiment of the invention, the upper cover and the bottom plate have a spacing to form an air outlet, and the air outlet communicates with the receiving space. In an embodiment of the invention, the fan module further includes a support column, wherein the support column is located at the air outlet and supported between the bottom plate and the upper cover. In an embodiment of the invention, the upper cover is integrally formed with the support post. In an embodiment of the present invention, the material of the upper cover and the bottom plate is 201248019. The metal is based on the above-mentioned fan module of the present invention, and the strength of the body can be increased, so that the upper cover is not easily generated when pressed. The heat radiating fan is pressed by the upper cover to maintain the fan module. The above features and advantages of the present invention can be more clearly understood. The following embodiments are described in detail below with reference to the drawings. [Embodiment] FIG. 1 is a perspective view of a fan module according to an embodiment of the present invention. Figure 2 is an exploded view of the fan module of Figure 1. Referring to FIG. 1, the fan module 100 of the present embodiment includes a bottom plate 110, an upper cover 12A, a side wall 13A, a heat dissipation fan 140, and a housing 150. The side walls 13 are disposed between the upper cover 12 and the side plates 110, and the side walls 130, the upper cover 12 and the bottom plate 11 are formed into a receiving space 160. The heat dissipation fan 140 is disposed on the bottom plate 11A and located in the accommodation space 160. The housing 15 is stacked on the upper cover 12, and the upper cover 12 is disposed between the housing 150 and the bottom plate 110. The housing 15 and the upper cover can be assembled by attaching, locking or covering. In other embodiments, the housing 150 can be assembled to the upper cover 12 by other means, which is not limited by the present invention. Under the above arrangement, the housing 15 叠 stacked on the upper cover 12 增强 can enhance the overall structural strength, so that the upper cover 120 is less likely to be deformed when pressed. Thereby, the cooling fan 140 can be prevented from being pressed by the upper cover 12 to maintain the normal operation of the fan module 100. 201248019 The fan module 100 of the present embodiment is, for example, used in a notebook computer to perform an administrative heat on a heat generating component inside the notebook computer. In other embodiments, the fan module 1 can be used for other types of electronic devices. The invention is not limited thereto. 3 is a partial side elevational view of the fan module of FIG. 1 applied to an electronic device. In order to make the drawings clearer, FIG. 3 only shows the structural member 50 of the electronic device. The structural member 50 is, for example, a casing or an element adjacent to the fan module 1 in the electronic device, which is not limited by the present invention. Referring to FIG. 3 to FIG. 3, in the present embodiment, the housing 150 covers a first portion 122 of the upper cover 120 and exposes a second portion 124 of the upper cover 120. The upper cover 12A has an opening 126 that exposes the receiving space 160. The structural member 5 is in contact with the housing 15A, and a gap is formed between the structural member 50 and the second portion 124 to form an air inlet 170'. The air inlet 170 communicates with the receiving space 16 through the opening 126. Further, as shown in Fig. 1, a gap is formed between the casing 120 and the bottom plate no to form an air outlet 180, and the air outlet 180 communicates with the accommodation space 16A. Therefore, when the fan module 100 is in operation, the heat dissipation airflow can enter the fan module 100' through the air inlet port 17 and is exhausted from the fan module through the air outlet 180 to facilitate heat dissipation. In the thinned electronic device, the arrangement positions of the fan module 1〇〇 and the structural member 5〇 are very close. The housing 15 is stacked on the upper cover 12A to increase the structural strength of the fan module 100, so that the upper cover 12 and the heat dissipation fan 14 are not pressed by the structural member 50 due to the thin design of the electronic device. In addition, the housing 15 is designed to cover only the first portion 122 of the upper cover 12〇 and expose the second portion 124 of the upper cover 12〇, and the air inlet 170 is formed between the upper cover 12〇201248019 and the structural member 50. The structural member 50 adjacent to the fan module 1〇〇 is prevented from obstructing the flow of the heat-dissipating airflow. The fan module 1〇〇 in this embodiment further includes a support post 19〇. The support post 190 is located at the air outlet 180 and supported between the bottom plate 11〇 and the housing 15〇 to further enhance the structural strength of the fan module 1〇〇. In detail, the housing 150 of the present embodiment has an extension portion 152 that is coupled to the edge of the housing 150, and the support post 19 is supported between the bottom plate 11 and the extension portion 152. In the present embodiment, the material of the bottom plate 110 and the upper cover 12 is, for example, a metal material such as aluminum or magnesium, and has a light weight and a preferable structural strength. The material of the case 150, the support post 190, and the side wall 130 is, for example, plastic, so that the case 150, the support post 190, and the side wall 13 can be simultaneously manufactured by injection molding, and are integrally formed. In other embodiments, the bottom plate 110, the upper cover 120, and the housing 150 may be other suitable materials, which are not limited by the present invention. In other embodiments, the upper cover 120 can also be integrally formed with the housing 150. In the case where the upper cover 120 is integrally formed with the housing 150, the housing 15A can be regarded as a part of the upper cover 120, and the upper cover 12 can have a larger thickness in this portion. This will be described in detail below by means of the drawings. 4 is a perspective view of a fan module according to another embodiment of the present invention. Figure 5 is an exploded view of the fan module of Figure 4. Referring to FIG. 4, the fan module 200 of the present embodiment includes a bottom plate 210, an upper cover 220, a side wall 230, and a heat dissipation fan 240. A first portion 222 of the upper cover 220 has a thickness greater than a thickness of a first portion 224 of the upper cover 220. The side wall 230 is disposed between the upper cover 220 201248019 210 and the side wall 23 〇, the upper cover 22 〇 and the bottom plate 2 i 〇 constitute an H space 260. The thermal fan 240 is disposed on the bottom plate 210 and located in the accommodating space 260. Under the above configuration, the first portion of the upper cover 220 can increase the strength of the normal body structure, so that the upper cover 22 is less likely to be deformed when pressed. By this, the cooling fan 240 can be prevented from being pressed by the upper cover 22 to maintain the normal operation of the fan module 200. Figure 6 is a partial side elevational view of the fan module of Figure 4 applied to an electronic device. In order to make the drawings clearer, FIG. 6 only shows the structural member 50 of the electronic device, "the member 50 is, for example, a casing or an element adjacent to the fan module in the electronic device." The present invention does not limit this. Please refer to the figure. 4 to FIG. 6, in the embodiment of the present embodiment, the structural member 5 of the electronic device contacts the 22nd, and the gap between the surname member 5〇 and the second portion 224 forms an air inlet; 270' the air inlet 270 is connected to receive The upper cover 22 has an opening 226' opening 226 to expose the receiving space 260, and the air inlet 270 communicates with the receiving portion 260 through the opening 226. Further, as shown in FIG. 4, there is a gap between the upper cover 22 () and the bottom plate 210. The air outlet 28 is formed, and the air outlet is connected to the receiving space 260. Thereby, the fan module 2 is transported through the money port 270 into the fan module, and is discharged through the second fan module 200 to facilitate heat dissipation. In the thinned electronic device, the fan module 2〇〇 is often close to the structural position (4) of the structural member. Therefore, the increased thickness of the upper cover 22() can increase the structural strength of the fan module 200, so that the upper cover 22 is Cooling fan 24〇 will not be electronic The thinner design of the device is pressed by the structural member 5. Further, the upper cover 220 is designed such that the thickness of the first portion 222 is greater than the thickness of the second portion 224 as described above in 201248019, and is formed between the upper cover 22 and the structural member 5〇. The air inlet 270 can prevent the structure of the adjacent fan module 2 from obstructing the flow of the heat dissipation airflow. The fan module 2 in this embodiment further includes a support column 29〇. The support column 290 is located at the air outlet 28〇 And supporting between the bottom plate 21〇 and the upper cover 22〇 to further enhance the structural strength of the fan module 2〇〇. In the embodiment, the material of the bottom plate 210 and the upper cover 220 is, for example, a metal material such as aluminum or magnesium. Light weight and better structural strength. In other embodiments, the bottom plate 210 and the upper cover 22 may be other suitable materials. The invention is not limited thereto. Further, the support post 29〇 and the upper cover 22〇 may be integrally formed. Table τ, above, in the fan module of the present invention, the shell stacked on the upper cover can enhance the strength of the overall structure, and the upper cover is less likely to be deformed when it is pressed. The fan is pressed by the upper cover to maintain the normal operation of the fan module. In addition, a support column supported between the bottom plate and the housing may be formed at the air outlet to further enhance the structural strength of the fan module. Although the present invention has been implemented The disclosure of the present invention is not intended to limit the present invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a fan module according to an embodiment of the present invention. 201248019 FIG. 2 is an exploded view of the fan module of FIG. 1. 3 is a partial side view of the fan module of FIG. 1. FIG. 4 is a perspective view of a fan module according to another embodiment of the present invention. FIG. Figure 6 is a diagram of the fan module of Figure 4 applied to an electronic 奘 g. Partial side view of the device [Main component symbol description] 50: Structural member 100, 200: Fan module 110, 210: Base plate 120, 220: Upper cover 122, 222: First portion 124, 224: Second portion 126, 226: openings 130, 230: side walls 140, 240: cooling fan 150: housing 152: extensions 160, 260: accommodation spaces 170, 270: air inlets 180, 280: air outlets 190, 290: support columns