201244267 六、發明說明： 【發明所屬之技術領域】 本發明係關於連接器及連接器裝置。 【先前技術】 以往’知道一種卡連接器5〇〇(例如，參照曰本實開 平6-1 1283號公報（專利文獻丨）），如第12圖所示，係相 互連接第一基板T1及第二基板（未圖示）之卡連接器5〇〇 ，於卡連接器500被搭載於第一基板T1之狀態下，卡連 接器500之一部分被配置於形成在第一基板τι的安裝用 開口 ΤΓ内。 另一方面，知道一種疊板連接器6〇〇(例如，參照曰 本特開平6-283238號公報（專利文獻2))，如第13圖所 示，係由搭載於第一配線基板T1之母連接器61〇、及搭 載於第二配線基板T2之公連接器62〇所構成，於連接器 610、620間之嵌合狀態下，陽連接器62〇之一部分被插 入形成於第一配線基板T1之安裝孔T1，内。 【發明内容】 [發明所欲解決之課題] 然而，於專利文獻1及專利文獻2所記載之技術中 ’具有嵌合於連接器間之狀態下的在連接器間之嵌合方 向’連接器裝置整體之尺寸大的問題。 在此，本發明係為了解決習知之問題而完成發明者 ，亦即，本發明之目的在於提供一種連接器及連接器裝 置’其可實現連接器裝置整體之低背化。 、 201244267 [解決問題之手段] 本發明之連接器f 有第-基板孔之第—某彡、有:第一連接器’其搭載於具 二基板；投影在與4 :及第二連接器，其搭載於第 嵌合方向正交的平面連接器及該第二連接器之間的 容於該第—基板 之该第二連接器之外形，係以收 前述之課題之外形内的方式形成，藉此，可解決 本發明之連接器萝番 第-基板孔；篦一I、·糸具有：第一基板，其具有 基板；及第。板，第一連接器，其搭載於該第一 該第-連接器及守楚- 第二基板；投影在與 面上之，筮a —連接器之間的嵌合方向正交的平 之外=:連接器之外形，係以收容於該第-基板孔 [發明效果]式形成’藉此，可解決前述之課題。 形成：本發明中’以收容於第-基板孔之外形内的方式 C器之外形’藉此，可實現在第-連接器及 。 益之間的嵌合方向的連接器裝置整體之低背化 【實施方式】 、下參照圖面，針對本發明之一實施例之連接器 裝置進行說明。 [實施例]. 本發明之一實施例之連接器裝置，如第丨圖所示， ί系由笛 —基板300、第二基板400、搭載於第一基板3〇〇 之第連接器1〇〇、及搭載於第二基板400之第二連接 201244267 器200所構成。第一連接器1〇〇與第二連接 成在與第一基板3 00及第二基板4〇〇之基板 向（以下稱為嵌合方向χ3)相互接近並嵌合而 第一基板300與第二基板400之間的連接器 以下之說明中，將與使第一連接器1 〇〇 器200相互接近之嵌合方向χ3正交的方向規 向XI及第二方向Χ2β第一方向XI及第二方 互正交。 第一連接器100係所謂插頭式連接器，女 圖所示，其具有複數個第一接觸體110、及 觸體110之第一殼體120。第—接觸體η0 120係藉由嵌入成型而一體成型。 第一接觸體110係由導電性之銅合金所 2〜第4圖所示，其於第二方向χ2之第一殼 側且在以既定間距排列於第—方向χι的狀 置有複數個。並列配置於第二方向χ2之第 的一側之複數個第一接觸體丨1〇、與並列配 向Χ2之第一殼體120的另—侧之複數個第一 ’係以藉由欲合方向Χ3及第—方向χι所規 為基準而呈面對稱地配置。 如第7圖所示，第一接觸體丨丨〇係呈一 第鳊子部丨11、連設於第一端子部1丨丨之 1U、連設於第一直線部112之第一接觸部ι 於第一接觸部113之端部的捲曲端部114。 器200係構 面垂直的方 電性連接於 〇 及第二連接 定為第一方 向X2係相 α第2〜第4 保持第一接 及第一殼體 成型，如第 體120的雨 態下分別配 一殼體120 置於第二方 •接觸體11 〇 定之平面作 體式地具有 第一直線部 1 3、及形成 201244267 第一端子部111係被焊接連接於形成在第一基板 3 00之表面3 10的焊墊3丨丨上（參照第2圖）。第一端子部 111係自第一殼體12〇朝第二方向χ2突出，且露出於第 一设體120之外部。第一端子部ln係具有：第一抵接面 111a ’其抵接於第一基板3〇〇之表面310上；及彎曲部 111b，其在由嵌合方向X3及第二方向χ2所規定之平面 内作彎曲且自第一基板300之表面31〇離開。彎曲部1Ub 係為了在第一端子部1 11與焊墊3 11之間的焊接作業時 ，藉由使焊料進入形成於彎曲部丨丨i b與焊墊3丨丨之間的 間隙内’而可容易形成焊料填充，以提高焊接強度為目 的所形成8 如第7圖所示，第一直線部丨丨2係沿第二方向χ2 延伸’其一部分被埋設於第一殼體12〇之第一本體部ΐ2ι 内。第一直線部1 12係形成在與除了上述彎曲部丨丨丨b以 外之第一端子部11 1的直線部分為一直線上。 第一接觸部113係沿嵌合方向χ3延伸，於第一連接 器100與第二連接器200之間的嵌合時’與第二接觸體 210之第二接觸部215接觸而被電性連接（參照第8圖） 。於本實施例中，如第7圖所示，於將第一連接器ι〇〇 搭載於第一基板300之狀態下，第一接觸部113超出第 一基板孔330而朝第一基板300之背面32〇側突出，如 第9圖所示，於第一連接器100與第二連接器2〇〇之間 的嵌合狀態下，以第一接觸部113進入第二基板孔43〇 内之方式設定敌合方向X3的第一接觸部113的尺寸。 201244267 如第7圖所示’捲曲端部11 4係將其一部分埋設於 第叙體120之第一突出部123内，以提高第一殼體12〇 與第一接觸體110之間的固接強度。 第设體12 0係由絕緣性樹脂所形成，如第3、第4 圖所示’其具有：平板狀之第一本體部121;第一凸緣部 122’其形成於第一本體部^之外緣；一對之第一突出 ap 1 2 3 ’其係在沿第一方向X 2相互分離而對向之狀態下 自第一本體部121分別朝向嵌合方向χ3突出所形成；一 對之銷部1 24，其係在沿第一方向X 1相互分離而對向之 狀態下自第一本體部121分別朝向嵌合方向Χ3突出所形 成；及容納部125，其係由第一本體部121、一對之第一 突出部1 23及一對之銷部〖24所界定，且於第二連接器 200側開口。 第一本體部1 21係於俯視之情況下呈矩形，如第7 圖所示’其具有：第一部分12ia，其於將第一連接器1〇〇 搭載於第一基板300之狀態下，在第一基板孔33〇之上 方位於第一基板300之表面3 1 0側；及第二部分1 2 1 b， 其於將第一連接器1〇〇搭載於第一基板3〇〇之狀態下位 於第一基板孔330内。第二部分12lb係於外緣具有在對 第一基板300進行第一連接器丨〇〇之安裝時，於將第一 連接器100載置於第一基板300之狀態下（亦即，未進行 第一接觸體110與第一基板300之間的焊接之狀賤），藉 由第一基板孔3 3 0之内側面限制於第一方向χ 1及第-曰 向Χ2移動的被限制面I21b-1。於將第一連接器* 載於第一基板300之狀態下（亦即，進行 ° < π ί第一接觸體 201244267 110與第一基板300之間的悍接之狀態），於被限制面 12 lb-Ι與第一基板孔330之内側面之間，在第一方向幻 及第二方向X2形成有間隙。如第3圖所示，於第—本體 部121 (第一部分121a)之表面存在未形成有後述的孔 之平坦面，此平坦面係於將第—連接器丨〇〇載置於第— 基板300時，具有作為藉由抬起第一連接器1〇〇進行運 送之運送裝置（未圖示）的吸附部（未圖示）所吸附保持之 被吸附部127的功能。 如第4圖所示，第一凸緣部122係形成於第—本體 部121之第一部分121a的外緣（第一部分12U之四邊） 。在嵌合方向X3之第一凸緣部122的厚度係以與在嵌合 方向X3之第一本體部121的第一部分12u之厚度^二 之尺寸所設定。於將第一連接器1〇〇載置於第一基板3〇〇 之狀態下，以在第一凸緣部122與第一基板3〇〇之表面 3 1 0之間形成間隔的方式構成第一殼體12〇。如此，藉由 構成第一殼體120，即使於第一殼體12〇、第一接觸體 110上產生尺寸及形狀上的略微製造誤差的情況下，於 將第一連接器100載置於第一基板300之狀態下，仍可 使第一接觸體11〇之第一端子部ιη的第一抵接面uia 確實地抵接於第一基板300之焊墊3 1 1。然而，第一凸 緣部1 22亦能對第一基板300之表面3 1 〇以物理性接觸 的方式構成。第一凸緣部1 22係於將第—連接器丨〇〇搭 載於第一基板300之狀態下’在嵌合方向χ3與對除了第 一基板孔330以外之第一基板300的基板部分重疊。亦 即’包含投影於第一基板300上之第一凸緣部122的第 201244267 一殼體1 20之外形，係以未被收容在與嵌合方向正交 的平面内之第—基板孔33〇之外形内的方式所形成。如 此，第一凸緣部122以在嵌合方向χ3與對除了第一基板 孔330以外之第一基板3〇〇的基板部分重疊的方式構成 ，藉此，即使在對第一連接器1〇〇施加了某種負荷或衝 擊的情況下，仍可避免對第—接觸體11〇施加過量之變 形負荷，可提高所謂連接器擺動強度…於本實施例 中，第一凸緣部122係形成於第一本體部121之第一部 刀121a的四邊，但具體之構成不限於此，亦能於將第一 連接器100搭載於第一基板3〇〇之狀態下，以第一殼體 120之至）一部分，在嵌合方向χ3與對除了第一基板孔 330以外之第一基板3〇〇的基板部分重疊的方式構成。 第一突出部123係用以支撐第一接觸體u〇之第一 接觸部1 13。於本實施例中，如第7圖所示，於將第一 連接器100搭載於第一基板3〇〇之狀態下，第-突出部 123係於第一基板3〇〇之背面32〇側突出，如第9圖所 不，於第—連接器1〇〇與第二連接器200之間的嵌合狀 =:，以第一突出部1,23進入第二基板孔430内之方式 «又定在嵌合方向Χ3的第一突出部123的尺寸。 銷4 124係在第一連接器1〇〇與第二連接器2〇〇之 ^的嵌〇狀態下’以進入形成於第二連接器200之第二 广^ 220的銷容納部223内（參照第5圖），且藉由銷容 、’内P 223之内側面限制於第一方向又1及第二方向乂2移 動之方式所形成。於本實施例中，如第7圖所示，於將 第連接器100搭載於第一基板300之狀態下，銷部124 201244267 係於第一基板300之背面32〇側突出，如第1〇圖所示， 於第一連接器1〇〇與第二連接器2〇〇之間的嵌合狀態下 以銷4 124進入第二基板孔43〇内之方式設定在嵌合 方向X3之銷部124的尺寸。 如第4或第7圖所示，容納部125係於第二連接器 2〇0側開口’於第-連接器⑽與第二連接器200之間 的瓜口時，以收容第二殼體22〇及第二接觸體之一 部分的方式所構成。 第2或第7圖所示之元件符號126係形成於第二殼 體120之孔’在第一接觸體110與第一殼It 120之嵌入 成型時’需要以模具之突起等抑制第一接觸體u〇的移 動，該孔係作為此結果而形成之孔。 第二連㈣2〇〇係所謂接受式連接器，如帛2、第$ 6圖所不’其具有複數個第二接觸冑21〇、及保持 觸體210之第一设體22〇。第二接觸冑川係欲 入第二殼體220内。 第二接觸體21〇係由導電性之銅合金所成型，如第 2、第5及“圖所示’其於第二方向χ2之第二殼體22〇 二兩側且在以既定間距排列於第—方向幻的狀態下分 •配置有複數個。並列配置於在第：方向χ2之第二殼體 的一側之複數個第二接觸體21G、與並列配置於在第 向X2之第一殼體22〇的另一側之複數個第二接觸體 21 ’係以藉由嵌合方肖Χ3及第—方向χι所規定之平 為基準而呈面對稱地配置。 如第8圖所示’第二接觸體21〇係呈一體式地具有 -10- 201244267 第二端子部2 1 1、連設於第二端子部21 1之第二直線部 212、自第二直線部212朝向嵌合方向χ3突出形成之被 保持部2 1 3、連設於第二直線部21 2之彈簧部2 14、及於 彈簧部214之前端部於第二方向X2突出的第二接觸部 215 ° 第二端子部211係被焊接連接於形成在第二基板 400之表面410的焊墊411(參照第2圖）。第二端子部211 係自第二殼體220朝向第二方向X2突出，且露出於第二 殼體220之外部。第二端子部211係具有抵接於第二基 板400之表面410上的第二抵接面211a。包含投影在與 嵌合方向X3正交的平面上（第一基板300)之第二端子部 211的第二連接器200的外形’係以被收容在第一基板 孔3 3 0之外形内的方式形成。另外，於本實施例中，如 第9圖所示，於第一連接器1〇〇與第二連接器2〇〇之間 的嵌合狀態下，以包括第二接觸體210及第二殼體220 之一部分在内’還使第二端子部211之一部分進入第一 基板孔330内之方式設定在嵌合方向之第二端子部 2 1 1的尺寸。 如第8圖所示’第二直線部212係沿第二方向X2 延伸。 如第8圖所示，被保持部213係自第二直線部212 朝向嵌合方向X3犬·出形成’且以被壓入形成於第二殼體 220之保持部225的固定狀態而保持。 彈簧部214係由連設於第二直線部212且沿嵌合方 向Χ3延伸之第一部分214a、連設於第一部分214a且沿 -11- 201244267 第二方向X2延伸之第二部分2 1 4b、及連設於第二 2 1 4b且朝向嵌合方向χ3延伸之第三部分2丨4c所構 整體形狀呈〕字狀。於本實施例中，如第8圖所示 將第二連接器200搭載於第二基板400之狀態下， 部分214c之一部分位於第二基板孔43〇内，並且第 分214c之另一部分在.第二基板孔43〇的上方位於第 板400之表面410側，如第9圖所示，於第一連接器 與第一連接器200之間的嵌合狀態下，以第三部分 之一部分位於第一基板孔33〇内之方式設定在嵌合 X3之第三部分214c的尺寸。 如第8圖所示，第二接觸部215係在位於第一 器100側之第三部分214c的前端部於第二方向 。於第一連接器100與第二連接器2〇〇之間的嵌合 彈簧部214發生彈性變形，第二接觸部215與第一 體1 1 〇之第一接觸部1 1 3接觸而被電性連接。 第二殼體220係由絕緣性樹脂所形成，如第5、 及第8圖所示，其具有：第二本體部221;第二凸緣部 ’其形成於第二本體部221之外緣；一對銷容納部 ，其係在於第一方向χι相互分離之位置分別形成於 本體部221 ; —對收容凹部224，其係在於第二方κ 相互分離之位置被凹設於第二本體部22丨；及—對 部225’其形成於在第二方向χ2之收容凹部224的 如第8圖所示，第二本體部221係具有·身 221a，其於將第二連接器2〇〇搭載於第二基板〔 部分 成， ，於 第三 三部 二基 100 214c 方向 連接 突出 時， 接觸 第6 ;222 223 第二 q X2 保持 兩外 部分 之狀 -12- 201244267 _下’在第二基板孔43G之上方位於第二基板彻之表 面410側；及第二部分2川，其於將第二連接器2〇〇搭 載於第二基板之狀態下位於第二基板孔㈣内。第 二部分22lb係於外緣具有在對第二純400進行第二連 接器200之安裝時，且在對第二基板彻載置第二連接 器200之狀態下（亦即，未進行第二接觸體2⑺與第二基 板400之間的焊接之狀態），藉由第三基板孔43〇之内側 面限制於第-方向X1及第二方向χ2移動的被限制面 22 lb_1。於將第二連接器200搭載於第二基板400之狀 態下（亦即，進行了第二接觸體21〇與第二基板4〇〇之間 的焊接之狀態），於被限制面221b_i與第二基板孔43〇 之内侧面之間，於第一方向χι及第二方向χ2上形成有 間隙。如第5圖所示，由一對之銷容納部223及一對之 收容凹部224所包圍的位置之第二本體部22丨（第一部分 221 a)的表面，係於對第二基板4〇〇載置第二連接器2㈧ 時，具有作為藉由抬起第二連接器2〇〇進行運送之搬運 裝置（未圖示）的吸附部（未圖示）所吸附保持之平坦狀的 被吸附部226的功能。 如第5、第6圖所示’第二凸緣部222係形成於第 二本體部221之第一部分22la的外緣（具體而言，在第 二方向X2之第一部分22丨a之二邊於將第二連接器 2〇〇載置於第二基板4〇〇之狀態下，以在第二凸緣部222 與第二基板400之表面410之間形成間隔的方式構成第 二殼體220。如此，藉由構成第二殼體220，即使在第二 凸緣部222、第二接觸體210產生尺寸及形狀上的略微 201244267 之製造誤差的情況下’於將第二連接器200載置於第二 基板400之狀態下，仍可使第二接觸體21〇之第二端子 部211的第二抵接面211a確實地抵接於第二基板400之 焊墊41 1。然而’第二凸緣部222亦能對第二基板400 之表面410以物理性接觸的方式構成。第二凸緣部222 係於將第二連接器200搭載於第二基板400之狀態下， 於嵌合方向X3與對除了第二基板孔430以外之第二基板 40 0的基板部分重疊。亦即，包含投影於第二基板4〇〇 上之第二凸緣部222的第二殼體220之外形，係以未被 收容在與嵌合方向X3正交的平面内之第二基板孔430 之外形内的方式所形成。如此’第二凸緣部222以在嵌 合方向Χ3與對除了第二基板孔430以外之第二基板400 的基板部分重疊的方式構成’藉此，即使在對第二連接 器200施加了某種負荷或衝擊的情況下，仍可避免於第 二接觸體210施加過量之變形負荷，可提高所謂連接器 擺動強度。又，於本實施例中’第二凸緣部222係形成 於第二本體部221之第一部分221a的二邊，但具體之構 成不限於此，亦能於將第二連接器200搭載於第二基板 400之狀態下，第二殼體220之至少一部分以在嵌合方 向X3與對除了第二基板孔430以外之第二基板4〇〇的基 板部分重疊的方式構成。 如第5、第6圖所示’銷容納部223係在第一方向 XI的第二本體部221之兩侧’且在於嵌合方向χ3貫穿 第二本體部221之狀態下形成’並於第一連接器丨〇〇與 第一連接器200之間的搬合狀態下，以容納形成於第一 -14- 201244267 殼體1 2 0之銷部1 2 4，限岳丨丨产够 限制在第一方向XI及第二方向 X2之㈣124的移動的方式構成。於本實施例中，如第 8圖所示’於將第二連接器2〇〇搭載於第二基板構之 狀態下’如第1〇圖所示，銷容納部223之一部分位於第 二基板孔430内，並且銷容納部223之另一部分在第二 基板孔430之上方位於第二基板4〇〇的表面41〇侧，於 第一連接器100與第二連接器200之間的嵌合狀態下， 以銷容納部223之一部分位於第一基板孔33〇内之方式 設定在嵌合方向X3的銷容納部223的尺寸。 收容凹部224係朝向第一連接器1〇〇側開口，收容 第二接觸體210之彈簧部214。於本實施例中，如第8 圖所示’於將第二連接器200搭載於第二基板400之狀 態下，收容凹部224之一部分位於第二基板孔43〇内， 並且收容凹部224之另一部分在第二基板孔430之上方 位於第二基板400的表面410側，如第9圖所示，於第 一連接器100與第二連接器200之間的嵌合狀態下，以 收容凹部224之一部分位於第一基板孔330内之方式設 定在嵌合方向X3收容凹部224的尺寸。 如第8圖所示’保持部225係在於嵌合方向X3貫穿 之狀態下形成於第二本體部221，且於固定狀態下保持 第二接觸體2 1 0之被保持部21 3。 如第2圖所示，第一基板3 00係具有形成有焊墊311 之表面310、背面320、及於嵌合方向X3貫穿於表背面 之矩形形狀的第一基板孔330。 201244267 如第2圖所示，第二基板400係具有形成有焊墊411 之表面410、背面420、及於嵌合方向X3貫穿於表背面 之矩形形狀的第二基板孔430。 第一連接器100與第二連接器200係在使第一基板 3 00之背面320與第二基板400的表面410相互對向之 狀態下相互嵌合。 於本實施例中，第一基板300及第二基板400係作 為硬質印刷電路基板構成◊然而，第一基板300及第二 基板400之具體態樣，不限於硬質印刷電路基板，例如 ’亦可為FPC等之可撓性基板。 於本實施例中，於第一基板300與第二基板400之 間設有間隔片（未圖示），如第9圖所示，於第一連接器 1〇〇與第二連接器200之間的嵌合時，於第一基板3〇〇 與第二基板400之間形成有既定之間隔S。然而，亦可 不於第一基板300與第二基板400之間設置間隔片，而 以第一基板300與第二基板400相互作物理性接觸的方 式構成。 於依此方式而獲得之本實施例的連接器裝置中，包 含投影在與嵌合方向X3正交的平面上之第二端子部211 的第二連接器2 0 0的外形，係以被收容在第一基板孔3 3 0 之外形内的方式所形成，藉此，於第一連接器10〇與第 二連接器200之間的嵌合時，包括第二接觸體210及第 二殼體220之一部分在内，第二端子部211之一部分亦 進入第一基板孔330内，所以，可實現在嵌合方向Χ3 之連接器裝置整體的低背化。 -16- 201244267 另外’第一接觸體110及第一殼體12〇之一部分被 配置於第一基板孔330内，並且第二接觸體21〇及第二 殼體220之一部分被配置於第二基板孔43〇内，藉此， 可實現在嵌合方向χ3之連接器裝置整體的低背化。 第一殼體120之銷部124與第二殼體220之銷容納 部223，係於第一連接器100與第二連接器200之間的 嵌合狀態下，以跨第一基板孔330内及第二基板孔430 内之又方而延伸的方式構成，藉此，不會阻礙連接器裝 置整體的低背化，可充分確保在嵌合方向χ3之銷部124 及銷今納。ρ 223的長度，因此，可實現第一連接器j 〇〇 與第二連接器2〇〇之間的圓順之嵌合、及在第一方向幻 及第二方向X2之第一連接器1〇〇與第二連接器2〇〇之間 確實的移動限制。 第一接觸體no之第一接觸部113與第二接觸體21〇 之彈簧部214的第三部分214c，係於第一連接器1〇〇與 第一連接器200之間的嵌合狀態下，跨第一基板孔 及第二基板孔430之雙方而延伸，並且，第：接觸體21〇 之第二接觸部215被形成於第三部分21 4c之第—連接器 ⑽側的前端部’藉此’不會阻礙連接器裝置整體的低 背化’可充分確保第一接觸體11〇與第二接觸之 間的有效接觸長度。201244267 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a connector and a connector device. [Prior Art] In the related art, a card connector 5 is known (for example, see Japanese Patent Application Laid-Open No. Hei 6-1 1283 (Patent Document No.)), as shown in Fig. 12, the first substrate T1 is connected to each other and In the card connector 5 of the second substrate (not shown), one of the card connectors 500 is placed on the first substrate τ1 in a state where the card connector 500 is mounted on the first substrate T1. Inside the opening. On the other hand, a laminated board connector 6 is known (for example, see Japanese Patent Laid-Open No. Hei 6-283238 (Patent Document 2)), as shown in Fig. 13, is mounted on the first wiring substrate T1. The female connector 61A and the male connector 62A mounted on the second wiring board T2 are configured. In the fitting state between the connectors 610 and 620, a part of the male connector 62 is inserted into the first wiring. The mounting hole T1 of the substrate T1 is inside. [Problems to be Solved by the Invention] However, in the techniques described in Patent Document 1 and Patent Document 2, the connector is formed in the fitting direction between the connectors in a state of being fitted between the connectors. The problem of large size of the device as a whole. Here, the present invention has been made in order to solve the conventional problems, that is, an object of the present invention is to provide a connector and a connector device which can realize a low profile of the connector device as a whole. 201244267 [Means for Solving the Problem] The connector f of the present invention has a first-substrate hole, a first connector, which is mounted on the two substrates, and a projection on the 4: and the second connector. The planar connector that is orthogonal to the fitting direction and the second connector that is disposed between the second connector and the second connector are formed in a shape other than the above-mentioned problem. Thereby, the connector of the present invention can be solved as a substrate-substrate hole; the first substrate has a substrate; and has a substrate; a first connector for mounting the first connector and the second substrate; the first connector is mounted on the surface, and the plane of the mating direction between the connector and the connector is orthogonal =: The external shape of the connector is formed by being accommodated in the first substrate hole [invention effect], whereby the above problem can be solved. Forming: In the present invention, 'the outer shape of the C is accommodated in the outer shape of the first substrate hole', whereby the first connector and the second connector can be realized. The connector device in the fitting direction between the benefits is low-profile. [Embodiment] A connector device according to an embodiment of the present invention will be described below with reference to the drawings. [Embodiment] A connector device according to an embodiment of the present invention, as shown in the figure, is a splicing substrate 300, a second substrate 400, and a connector 1 mounted on the first substrate 3A. The second connection 201244267 is mounted on the second substrate 400. The first connector 1A and the second connection are adjacent to each other and fitted to the substrate of the first substrate 300 and the second substrate 4 (hereinafter referred to as a fitting direction χ3), and the first substrate 300 and the first substrate In the following description of the connector between the two substrates 400, the direction XI and the second direction Χ2β in the first direction XI and the second direction are orthogonal to the fitting direction χ3 in which the first connector 1 is close to each other. The two parties are mutually orthogonal. The first connector 100 is a so-called plug connector, and the female connector has a plurality of first contacts 110 and a first housing 120 of the contacts 110. The first contact body η0 120 is integrally molded by insert molding. The first contact body 110 is made of a conductive copper alloy 2 to 4, and has a plurality of shapes arranged in the first direction on the first side of the second direction χ2 and at a predetermined pitch. a plurality of first contact bodies 丨1 配置 arranged on the first side of the second direction χ 2 and a plurality of first ' ′′s on the other side of the first housing 120 of the parallel alignment Χ 2 Χ3 and the first direction are arranged symmetrically as a reference. As shown in FIG. 7, the first contact body is a first sub-portion 11, a 1U connected to the first terminal portion 1A, and a first contact portion connected to the first straight portion 112. The curled end portion 114 at the end of the first contact portion 113. The device 200 is perpendicular to the galvanic structure and the second connection is defined as the first direction. The X2 phase is the second to the fourth. The first and the first housing are formed, such as the first body 120. A first housing portion 120 is disposed on the surface of the first substrate 300, and the first terminal portion 111 is soldered to the surface of the first substrate 300. 3 10 pads 3 (see Figure 2). The first terminal portion 111 protrudes from the first casing 12 toward the second direction χ2 and is exposed outside the first installation 120. The first terminal portion ln has a first abutting surface 111a' abutting on the surface 310 of the first substrate 3A; and a curved portion 111b defined by the fitting direction X3 and the second direction χ2 The plane is curved and exits from the surface 31 of the first substrate 300. The bent portion 1Ub is formed by inserting solder into the gap formed between the bent portion 丨丨ib and the pad 3丨丨 during the soldering work between the first terminal portion 1 11 and the pad 3 11 . It is easy to form a solder fill for the purpose of improving the soldering strength. As shown in FIG. 7, the first straight portion 丨丨2 extends in the second direction χ2, and a portion thereof is buried in the first body of the first housing 12〇. Department 2ΐ. The first straight portion 1 12 is formed on a straight line with a straight portion of the first terminal portion 11 1 excluding the curved portion 丨丨丨b. The first contact portion 113 extends in the fitting direction χ3, and is electrically connected to the second contact portion 215 of the second contact body 210 when the first connector 100 and the second connector 200 are fitted. (Refer to Figure 8). In the embodiment, as shown in FIG. 7 , in a state where the first connector ι is mounted on the first substrate 300 , the first contact portion 113 extends beyond the first substrate hole 330 toward the first substrate 300 . The back surface 32 protrudes from the side of the second substrate hole 43 in the state of the fitting between the first connector 100 and the second connector 2, as shown in FIG. The mode sets the size of the first contact portion 113 in the enemy direction X3. 201244267 As shown in Fig. 7, the crimped end portion 11 is partially embedded in the first protrusion 123 of the first body 120 to improve the fixation between the first housing 12 and the first contact body 110. strength. The first body 120 is formed of an insulating resin, as shown in FIGS. 3 and 4, which has a flat first body portion 121, and a first flange portion 122' formed on the first body portion. a pair of first protrusions ap 1 2 3 ' formed by being protruded from the first body portion 121 toward the fitting direction χ3 in a state of being separated from each other in the first direction X 2 ; The pin portion 1 24 is formed by being protruded from the first body portion 121 toward the fitting direction Χ3 in a state of being separated from each other in the first direction X 1 and facing each other; and the accommodating portion 125 is formed by the first body The portion 121, the pair of first protruding portions 1 23 and the pair of pin portions 24 are defined and open on the side of the second connector 200. The first main body portion 21 is rectangular in a plan view, and as shown in FIG. 7 'has a first portion 12ia in a state where the first connector 1 is mounted on the first substrate 300, The first substrate hole 33 is located on the surface 3 10 side of the first substrate 300; and the second portion 1 2 1 b is mounted on the first substrate 3 in the state where the first connector 1 is mounted on the first substrate 3 Located in the first substrate hole 330. The second portion 12lb is attached to the outer edge with the first connector 100 placed on the first substrate 300 when the first connector 300 is mounted on the first substrate 300 (ie, not performed). The shape of the solder between the first contact body 110 and the first substrate 300 is limited by the inner side surface of the first substrate hole 310 to the restricted surface I21b that moves in the first direction χ 1 and the first direction Χ 2 -1. In a state in which the first connector * is placed on the first substrate 300 (that is, a state in which a contact between the first contact body 201244267 110 and the first substrate 300 is performed), on the restricted surface Between 12 lb-Ι and the inner side surface of the first substrate hole 330, a gap is formed in the first direction and the second direction X2. As shown in FIG. 3, on the surface of the first body portion 121 (first portion 121a), there is a flat surface on which no hole to be described later is formed, and the flat surface is placed on the first substrate. At 300 o'clock, there is a function of the adsorbed portion 127 that is sucked and held by an adsorption unit (not shown) that is transported by the transport device (not shown) that lifts the first connector 1 . As shown in Fig. 4, the first flange portion 122 is formed on the outer edge (four sides of the first portion 12U) of the first portion 121a of the first body portion 121. The thickness of the first flange portion 122 in the fitting direction X3 is set to be the thickness of the first portion 12u of the first body portion 121 in the fitting direction X3. The first connector 1 is placed on the first substrate 3, and the first flange portion 122 is spaced apart from the surface 3 1 0 of the first substrate 3 to form a space. A housing 12 〇. Thus, by constituting the first casing 120, even if a slight manufacturing error in size and shape occurs on the first casing 12 and the first contact body 110, the first connector 100 is placed on the first connector 100. In the state of the substrate 300, the first abutting surface uia of the first terminal portion ι of the first contact body 11 can be surely abutted against the pad 3 1 1 of the first substrate 300. However, the first flange portion 1 22 can also be formed in physical contact with the surface 3 1 第一 of the first substrate 300. The first flange portion 1 22 is overlapped with the substrate portion of the first substrate 300 except the first substrate hole 330 in a state in which the first connector 300 is mounted on the first substrate 300. . That is, the '201240267 housing 1 20 including the first flange portion 122 projected on the first substrate 300 has a shape other than the first substrate hole 33 that is not accommodated in a plane orthogonal to the fitting direction. It is formed by the way inside the shape. In this manner, the first flange portion 122 is configured to overlap the substrate portion of the first substrate 3A except the first substrate hole 330 in the fitting direction χ3, thereby aligning the first connector 1 In the case where a certain load or impact is applied, excessive deformation load is applied to the first contact body 11〇, and the so-called connector swing strength can be improved. In the present embodiment, the first flange portion 122 is formed. The first portion of the first portion 121a of the first body portion 121 is not limited thereto, and the first connector 100 can be mounted on the first substrate 3, and the first housing 120 can be used. In some cases, the fitting direction χ3 is configured to overlap the substrate portion of the first substrate 3A other than the first substrate hole 330. The first protrusion 123 is for supporting the first contact portion 13 of the first contact body u. In the present embodiment, as shown in FIG. 7, in a state where the first connector 100 is mounted on the first substrate 3, the first protruding portion 123 is attached to the back side 32 of the first substrate 3A. Prominently, as shown in FIG. 9, the fitting between the first connector 1〇〇 and the second connector 200 is:: the manner in which the first protrusions 1, 23 enter the second substrate hole 430 « The size of the first protrusion 123 in the fitting direction Χ3 is also determined. The pin 4 124 is in the embedded state of the first connector 1〇〇 and the second connector 2 to enter the pin receiving portion 223 formed in the second wide 220 of the second connector 200 ( Refer to FIG. 5), and formed by the pinning, the inner side of the inner P 223 is restricted to move in the first direction and the second direction and the second direction 乂2. In the present embodiment, as shown in FIG. 7, in a state in which the connector 100 is mounted on the first substrate 300, the pin portion 124201244267 protrudes from the side of the back surface 32 of the first substrate 300, as shown in FIG. As shown in the figure, in the fitting state between the first connector 1〇〇 and the second connector 2〇〇, the pin portion in the fitting direction X3 is set so that the pin 4 124 enters the second substrate hole 43〇. Size of 124. As shown in FIG. 4 or FIG. 7 , the accommodating portion 125 is connected to the guilloche between the first connector ( 10 ) and the second connector 200 on the second connector 2 〇 0 side to accommodate the second housing. 22〇 and a part of the second contact body. The component symbol 126 shown in FIG. 2 or FIG. 7 is formed in the hole 'of the second contact body 120 when the first contact body 110 and the first case It 120 are insert-molded'. It is necessary to suppress the first contact by the protrusion of the mold or the like. The movement of the body u, which is the hole formed as a result of this. The second connection (four) 2 is a so-called acceptor connector, such as 帛2, $6, which has a plurality of second contacts 21, and a first body 22 that holds the contacts 210. The second contact is carried out in the second housing 220. The second contact body 21 is formed of a conductive copper alloy, as shown in the second, fifth, and "the second housing 22 of the second direction" and arranged at a predetermined pitch. In the first-direction phantom state, a plurality of the second contact bodies 21G are disposed side by side in the second direction of the second housing of the second direction, and are arranged in parallel in the first direction X2. The plurality of second contact bodies 21' on the other side of the casing 22 are arranged in plane symmetry with reference to the plane defined by the fitting side Χ3 and the first direction 。ι. As shown in Fig. 8. The second contact body 21 is integrally provided with a -10-201244267 second terminal portion 2 1 1 , a second straight portion 212 connected to the second terminal portion 21 1 , and a second straight portion 212 The held portion 2 1 3 protruding from the direction of the weir 3, the spring portion 2 14 connected to the second straight portion 21 2, and the second contact portion 215° protruding from the front end portion of the spring portion 214 in the second direction X2 The two terminal portions 211 are soldered to the pads 411 formed on the surface 410 of the second substrate 400 (see FIG. 2). The second terminal portions 211 The second housing 220 protrudes from the second housing 220 toward the second direction X2 and is exposed to the outside of the second housing 220. The second terminal portion 211 has a second abutting surface 211a that abuts on the surface 410 of the second substrate 400. The outer shape of the second connector 200 including the second terminal portion 211 projected on the plane orthogonal to the fitting direction X3 (the first substrate 300) is accommodated in the outer shape of the first substrate hole 3 3 0 In this embodiment, as shown in FIG. 9, in the fitting state between the first connector 1〇〇 and the second connector 2〇〇, the second contact body 210 is included. And a part of the second casing 220 is set to a size of the second terminal portion 21 1 in the fitting direction so that one portion of the second terminal portion 211 is further inserted into the first substrate hole 330. As shown in FIG. The second straight portion 212 extends in the second direction X2. As shown in Fig. 8, the held portion 213 is formed by the second straight portion 212 toward the fitting direction X3 and is formed by being pressed into The holding portion 225 of the second housing 220 is held in a fixed state. The spring portion 214 is connected to the second straight portion 212 and a first portion 214a extending in the fitting direction Χ3, a second portion 2 1 4b extending in the first portion 214a and extending in the second direction X2 of the -11-201244267, and a second portion 21b extending in the fitting direction χ3 The overall shape of the extended third portion 2丨4c is in the shape of a figure. In the present embodiment, as shown in Fig. 8, the second connector 200 is mounted on the second substrate 400, and a portion of the portion 214c is located. The second substrate hole 43 is located inside, and another portion of the first portion 214c is located on the surface 410 side of the first plate 400 above the second substrate hole 43〇, as shown in FIG. 9, the first connector is connected to the first connector. In the fitting state between the devices 200, the size of the third portion 214c of the fitting X3 is set such that one of the third portions is located within the first substrate hole 33'. As shown in Fig. 8, the second contact portion 215 is in the second direction at the front end portion of the third portion 214c on the side of the first device 100. The fitting spring portion 214 between the first connector 100 and the second connector 2 is elastically deformed, and the second contact portion 215 is electrically contacted with the first contact portion 1 1 3 of the first body 1 1 而Sexual connection. The second casing 220 is formed of an insulating resin, as shown in FIGS. 5 and 8, and has a second body portion 221 which is formed at the outer edge of the second body portion 221. a pair of pin accommodating portions respectively formed at a position where the first direction χ1 is separated from each other is formed in the body portion 221; and a accommodating recess 224 is recessed in the second body portion at a position where the second side κ is separated from each other 22对; and the opposite portion 225' is formed in the receiving recess 224 in the second direction χ2 as shown in FIG. 8, and the second body portion 221 has a body 221a for the second connector 2 Mounted on the second substrate [partially formed, when connected in the third three-part two base 100 214c direction, contact the sixth; 222 223 second q X2 to maintain the shape of the two outer parts -12-201244267 _ lower' in the second The upper side of the substrate hole 43G is located on the surface 410 of the second substrate; and the second portion is located in the second substrate hole (4) in a state where the second connector 2 is mounted on the second substrate. The second portion 22 lb is attached to the outer edge with the second connector 200 mounted to the second pure 400, and the second connector 200 is placed on the second substrate (ie, the second connector 200 is not performed). The state in which the contact body 2 (7) and the second substrate 400 are welded) is restricted by the inner side surface of the third substrate hole 43 to the restricted surface 22 lb_1 in which the first direction X1 and the second direction χ2 move. In a state in which the second connector 200 is mounted on the second substrate 400 (that is, a state in which the second contact body 21 〇 and the second substrate 4 进行 are welded), the restricted surface 221b_i and the A gap is formed between the inner side surfaces of the two substrate holes 43 and the first direction 及 and the second direction χ2. As shown in Fig. 5, the surface of the second body portion 22A (the first portion 221a) at a position surrounded by the pair of pin accommodating portions 223 and the pair of accommodating recess portions 224 is attached to the second substrate 4 When the second connector 2 (8) is placed on the crucible, the flat portion is adsorbed and held by an adsorption unit (not shown) that is transported by the second connector 2 (not shown). The function of the part 226. As shown in FIGS. 5 and 6, the second flange portion 222 is formed on the outer edge of the first portion 22la of the second body portion 221 (specifically, on the two sides of the first portion 22丨a in the second direction X2) The second housing 220 is configured to form a space between the second flange portion 222 and the surface 410 of the second substrate 400 in a state where the second connector 2 is placed on the second substrate 4? Thus, by constituting the second casing 220, even if the second flange portion 222 and the second contact body 210 generate a manufacturing error of a slight 201244267 in size and shape, the second connector 200 is placed. In the state of the second substrate 400, the second abutting surface 211a of the second terminal portion 211 of the second contact body 21 can be surely abutted against the pad 41 1 of the second substrate 400. However, the second The flange portion 222 can also be configured to physically contact the surface 410 of the second substrate 400. The second flange portion 222 is in a state in which the second connector 200 is mounted on the second substrate 400 in the fitting direction. X3 overlaps with the substrate portion of the second substrate 40 0 except for the second substrate hole 430. The second housing 220 of the second flange portion 222 on the second substrate 4 is shaped outside the second substrate hole 430 that is not received in a plane orthogonal to the fitting direction X3. The method is such that the second flange portion 222 is configured to overlap the substrate portion of the second substrate 400 except the second substrate hole 430 in the fitting direction '3, thereby even in the pair of second connectors In the case where a certain load or impact is applied, it is possible to avoid excessive deformation load applied to the second contact body 210, and the so-called connector swing strength can be improved. Further, in the present embodiment, the second flange portion 222 is It is formed on both sides of the first portion 221a of the second body portion 221, but the specific configuration is not limited thereto, and at least a part of the second casing 220 can be mounted in the state in which the second connector 200 is mounted on the second substrate 400. It is configured to overlap the substrate portion of the second substrate 4A other than the second substrate hole 430 in the fitting direction X3. As shown in Figs. 5 and 6, the pin housing portion 223 is in the first direction XI. Both sides of the second body portion 221 'and in the fitting side The crucible 3 is formed in a state of being inserted through the second body portion 221 and is in a moving state between the first connector 丨〇〇 and the first connector 200 to be accommodated in the first-14-201244267 housing 1 2 0 The pin portion 1 2 4 is limited to a configuration in which the movement of the (four) 124 in the first direction XI and the second direction X2 is restricted. In the present embodiment, as shown in FIG. 8 The device 2 is mounted on the second substrate structure. As shown in FIG. 1 , one portion of the pin receiving portion 223 is located in the second substrate hole 430 , and another portion of the pin receiving portion 223 is in the second substrate hole 430 . The upper side of the surface of the second substrate 4 is located on the side of the surface of the first substrate 100 and the second connector 200. One of the pin receiving portions 223 is located in the first substrate hole 33〇. The size of the pin housing portion 223 in the fitting direction X3 is set. The housing recess 224 is open toward the first connector 1 side, and accommodates the spring portion 214 of the second contact body 210. In the present embodiment, as shown in FIG. 8 , in a state where the second connector 200 is mounted on the second substrate 400 , one portion of the housing recess 224 is located in the second substrate hole 43 , and the recess 224 is accommodated. A portion is located on the surface 410 side of the second substrate 400 above the second substrate hole 430. As shown in FIG. 9, in the fitting state between the first connector 100 and the second connector 200, the receiving recess 224 is received. The size of the recess 224 is set in the fitting direction X3 so that a part thereof is located in the first substrate hole 330. As shown in Fig. 8, the holding portion 225 is formed in the second main body portion 221 in a state in which the fitting direction X3 is penetrated, and holds the held portion 21 3 of the second contact body 2 10 in a fixed state. As shown in Fig. 2, the first substrate 300 has a surface 310 on which the pad 311 is formed, a back surface 320, and a first substrate hole 330 having a rectangular shape penetrating the front and back surfaces in the fitting direction X3. 201244267 As shown in Fig. 2, the second substrate 400 has a surface 410 on which the pad 411 is formed, a back surface 420, and a rectangular second substrate hole 430 which penetrates the front and back surfaces in the fitting direction X3. The first connector 100 and the second connector 200 are fitted to each other with the back surface 320 of the first substrate 300 and the surface 410 of the second substrate 400 facing each other. In the present embodiment, the first substrate 300 and the second substrate 400 are configured as a rigid printed circuit board. However, the specific aspects of the first substrate 300 and the second substrate 400 are not limited to a hard printed circuit board, for example, It is a flexible substrate such as FPC. In this embodiment, a spacer (not shown) is disposed between the first substrate 300 and the second substrate 400. As shown in FIG. 9, the first connector 1 and the second connector 200 are provided. At the time of the fitting, a predetermined interval S is formed between the first substrate 3A and the second substrate 400. However, the spacers may not be provided between the first substrate 300 and the second substrate 400, and the first substrate 300 and the second substrate 400 may be in a crop-like contact with each other. In the connector device of the present embodiment obtained in this manner, the outer shape of the second connector 200 including the second terminal portion 211 projected on a plane orthogonal to the fitting direction X3 is accommodated. Formed in a shape outside the first substrate hole 303, thereby including the second contact body 210 and the second housing when the first connector 10 〇 and the second connector 200 are fitted One of the portions of the second terminal portion 211 also enters the first substrate hole 330, so that the entire connector device in the fitting direction Χ3 can be lowered. -16- 201244267 Further, one of the first contact body 110 and the first housing 12 is disposed in the first substrate hole 330, and one of the second contact body 21 and the second housing 220 is disposed in the second portion. The inside of the substrate hole 43 is formed, whereby the overall lowering of the connector device in the fitting direction χ3 can be achieved. The pin portion 124 of the first housing 120 and the pin receiving portion 223 of the second housing 220 are in a fitting state between the first connector 100 and the second connector 200 to span the first substrate hole 330. Further, the second substrate hole 430 is configured to extend in the other direction, thereby preventing the lower portion of the connector device from being lowered, and the pin portion 124 and the pin in the fitting direction χ3 can be sufficiently ensured. The length of ρ 223, therefore, the smooth fitting between the first connector j 〇〇 and the second connector 2 、, and the first connector 1 in the first direction and the second direction X2 The exact movement limit between the 〇〇 and the second connector 2〇〇. The first contact portion 113 of the first contact body no and the third portion 214c of the spring portion 214 of the second contact body 21 are tied to the fitting state between the first connector 1 and the first connector 200. And extending across both the first substrate hole and the second substrate hole 430, and the second contact portion 215 of the first contact body 21 is formed on the front end portion of the third connector 21b on the connector-side (10) side Thereby, the 'lower backing of the connector device as a whole is not hindered' can sufficiently ensure the effective contact length between the first contact body 11〇 and the second contact.
-—態以外之構成，係 同，所以，針對第—接觸體 其次’參照第1 1圖， 變化例進行說明。在此，； 111’的構成及第一基板30 — _ 與前述之連接器裝置完全相同，所以 -17- 201244267 110之第一端子部111 ’的構成及第一基板300之配置狀 態以外之構成，省略說明。 首先，於本變化例中，如第11圖所示，第一基板 300之表背面係與第1至第10圖所示之前述實施例相反 。亦即，於本變化例十，在使形成有焊墊（第11圖中未 圖示）的表面310與第二基板400對向之狀態下，配置第 一基板300。 另外，於本變化例中，第一接觸體1 1 0之第一端子 部111 ’係在第二方向X2中自第一直線部11 2的端部通 過第一基板孔330内而延伸至第一基板300的表面31〇 侧’被焊接連接於形成在與第二基板400對向之第一基 板300的表面310之焊墊（第π圖中未圖示）。 【圖式簡單說明】 第1圖為顯示本發明之一實施例之連接器震置的立 體圖。 第2圖為顯示將第1圖所示之連接器裝置截面化而 予觀察之立體圖。 第3圖為顯示第一連接器之立體圖。 第4圖為顯示自與第3圖不同之視點觀窣笛 器之立體圖。 I第-連接 第5圖為顯示第二連接器之立體圖。 第6圖為顯示自與第5圖不同之視點觀家坌一 器之立體圖。 祭弟一連接 第7圖為顯示第-連接器及第-基板之剖視圖。 第8圖為顯示第二連接器及第二基板之剖視圖。 -18- 201244267 第9 3 態的連接器 第10 器裝置之剖 第11 視圖。 第12圖 第13圖 【主要元件 100 110111,111 111a 111b 112 113 114 120 121 121a 121b 121b-l 122 123 124 為顯示使第一連接器及第 裝置之剖視圖。 圖為顯示銷部及銷容納部 視圖。 圖為顯示本發明之變化例 二連接器嵌合之狀 之附近部分的連接 的連接器裝置之剖 _ w命叼剖視歴 ，顯示習知之疊板連接器的剖韻 符號說明】 第一連接器 第一接觸體 第一端子部 第一抵接面 彎曲部 第—直線部 第一接觸部 捲曲端部 第一殼體 第一本體部 第一部分 第一部分 被限制面（第一被限制面） 第一凸緣部 第一突出部 銷部 -19- 201244267 125 容納部 126 127 被吸附 200 第二連 210 第二接 211 第二端 211a 第二抵 212 第二直 213 被保持 214 彈簧部 214a 第一部 214b 第二部 214c 第三部 215 第二接 220 第二殼 221 第二本 221a 第一部 221b 第二部 221b-l 被限制 222 第二凸 223 銷容納 224 收容凹 225 保持部 226 被吸附 300 第一基 部 接器 觸體 子部 接面 線部 部 分 分 分 觸部 體 體部 分 分 面（第二被限制面） 緣部 部 部 部 板 -20- 201244267 310 表 面 31 1 焊 墊 320 背 面 330 第 -« 基板 孔 400 第 _ 一 基板 410 表 面 411 焊 墊 420 背 面 430 第 —· 基板 孔 XI 第 _ 一 方向 X2 第 二 方向 X3 嵌 合 方向 -21 -The configuration other than the - state is the same as that of the first contact, and the variation will be described with reference to Fig. 1 . Here, the configuration of the 111' and the first substrate 30__ are completely the same as those of the above-described connector device, and therefore the configuration of the first terminal portion 111' of the -17-201244267 110 and the configuration of the first substrate 300 are different. , the description is omitted. First, in the present modification, as shown in Fig. 11, the front and back surfaces of the first substrate 300 are opposite to those of the foregoing embodiments shown in Figs. 1 to 10. That is, in the tenth modification, the first substrate 300 is placed in a state in which the surface 310 on which the pad (not shown in Fig. 11) is formed is opposed to the second substrate 400. In addition, in the present variation, the first terminal portion 111 ′ of the first contact body 1 10 extends in the second direction X2 from the end of the first straight portion 11 2 through the first substrate hole 330 to the first The surface 31 of the substrate 300 is soldered to a pad (not shown in FIG. π) formed on the surface 310 of the first substrate 300 facing the second substrate 400. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the connector being shaken according to an embodiment of the present invention. Fig. 2 is a perspective view showing the connector device shown in Fig. 1 in cross section. Figure 3 is a perspective view showing the first connector. Fig. 4 is a perspective view showing a viewfinder different from that of Fig. 3. I-connection Figure 5 is a perspective view showing the second connector. Fig. 6 is a perspective view showing a viewpoint of viewing from a viewpoint different from that of Fig. 5. The connection of the sacrificial brothers Fig. 7 is a cross-sectional view showing the first connector and the first substrate. Figure 8 is a cross-sectional view showing the second connector and the second substrate. -18- 201244267 Connector of the 9th state The section of the 10th device is the 11th view. Fig. 12 Fig. 13 [Main elements 100 110111, 111 111a 111b 112 113 114 120 121 121a 121b 121b-1 122 123 124 is a cross-sectional view showing the first connector and the first device. The picture shows the pin and pin housing views. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a connector device of a connection portion in the vicinity of a connector fitting shape according to a second modification of the present invention, showing a cross-sectional symbol of a conventional laminated connector. First contact body first terminal portion first abutment surface bending portion first straight portion first contact portion curled end first casing first body portion first portion first portion restricted surface (first restricted surface) a flange portion first protrusion pin portion -19- 201244267 125 accommodating portion 126 127 is adsorbed 200 second connection 210 second connection 211 second end 211a second abutment 212 second straight 213 is held 214 spring portion 214a first Portion 214b second portion 214c third portion 215 second connection 220 second housing 221 second portion 221a first portion 221b second portion 221b-1 is restricted 222 second convex 223 pin receiving 224 receiving recess 225 holding portion 226 is adsorbed 300 The first base connector body subsection line portion is divided into the body portion of the body portion (second restricted surface) edge portion plate -20- 201244267 310 surface 31 1 pad 320 Back surface 330 -« Substrate hole 400 _ a substrate 410 surface 411 pad 420 back 430 first - substrate hole XI first _ a direction X2 second direction X3 engagement direction -21 -