201232069 六、發明說明： 4 【發明所屬之技術領域】 • 本發明有關於一種導光板之製作方法，特別是有關於 一種導光板之光學微結構圖案之製作方法。 【先前技術】 傳統在導光元件表面製作光學微結構時，其中一方法 係利用雷射光束對一基材表面（例如導光元件本身或印壓 模具）依序進行高溫轟擊，使得此基材表面被雷射光束熔 ® 融後形成許多微型凹孔，以便直接於導光元件表面製作出 光學微結構，或者利用基材表面上之此些微型凹孔，於導 光元件之表面印壓出對應之光學微結構。 然而，利用雷射光束對基材表面進行高溫照射將無可 避免地導致熔渣喷濺現象，以致於各微型凹孔處形成火山 口之外觀，意即於微型凹孔之周緣形成一或多個突起物。 如此，無論是利用雷射光束直接於導光元件表面製作 出光學微結構，或者利用此些微型凹孔於導光元件之表面 ® 印壓出對應之光學微結構，微型凹孔周緣之突起物將因彎 折或崩塌掉落至微型凹孔内，而填補微型凹孔，導致導光 元件之導光性能的劣化。 更甚至，由於熔渣喷濺現象，此些突起物可能具有倒 鉤之外型，如此，當導光元件安裝於顯示裝置内，並與其 他光學膜相疊合時，導光元件之突起物將不利此些光學膜 與導光元件之緊密貼合，而減弱了出光效率，或者，導光 元件之突起物甚至導致此些光學膜因此被刮傷或刺破。 [S] 201232069 址防由此可見’上述光學微結構之製作過程仍存在不便與 、陷，而有待加以進一步改。 ^域莫不費盡心思來謀求解決之道，但長久以來 ^ 適用的方式被發展完成。 且禾見 如：能有效地消除微型凹孔之火山口現象，避 者述之後果’實Μ前重要研發課題之―，亦成爲 虽則相關領域亟需改進的目標。 ”、201232069 VI. Description of the Invention: 4 Technical Field of the Invention The present invention relates to a method of fabricating a light guide plate, and more particularly to a method for fabricating an optical microstructure pattern of a light guide plate. [Prior Art] When optical micro-structures are conventionally fabricated on the surface of a light-guiding element, one method uses a laser beam to sequentially bombard a substrate surface (for example, the light-guiding element itself or the printing mold) to cause high-temperature bombardment. The surface is melted by the laser beam to form a plurality of micro-recesses to form an optical microstructure directly on the surface of the light-guiding element, or to be printed on the surface of the light-guiding element by using such micro-recess holes on the surface of the substrate. Corresponding optical microstructure. However, high-temperature irradiation of the surface of the substrate with a laser beam inevitably causes slag splashing, so that the appearance of the crater is formed at each micro-recess, that is, one or more of the periphery of the micro-recess is formed. Protrusions. In this way, whether the optical microstructure is directly formed on the surface of the light guiding element by using the laser beam, or the corresponding optical microstructure is printed on the surface of the light guiding element by using the micro concave holes, and the protrusion of the periphery of the micro concave hole The micro-recessed holes are filled by being bent or collapsed into the micro-recessed holes, resulting in deterioration of the light guiding performance of the light guiding element. Moreover, even if the slag splashes, the protrusions may have a barb shape, such that when the light guiding element is mounted in the display device and overlaps with other optical films, the protrusion of the light guiding element The optical film and the light guiding element are disadvantageously adhered to each other, and the light extraction efficiency is weakened, or the protrusion of the light guiding element may even cause the optical film to be scratched or punctured. [S] 201232069 The address defense is thus visible. The manufacturing process of the above optical microstructure is still inconvenient and trapped, and needs to be further modified. ^ Domain does not bother to find a solution, but for a long time ^ the applicable method has been developed. For example, it can effectively eliminate the crater phenomenon of micro-recessed holes, and avoid the important research and development issues before the actual implementation, which has become an urgent need for improvement in related fields. ",
【發明内容】 、本發明揭露-種導光板之光學微結構圖案之 法，用以於一導光板之表面提供光學微結構圖案。、 、本發明揭露一種導光板之光學微結構圖案之势 法’用以於製作微型凹孔之同—階段中，—併 去除各微型凹孔處之火山口外觀。 5 本發明揭露一種導光板之光學微結構圖案之製作方 法’用以降低或甚至避免微型凹孔周緣之突起物因 填補微型凹孔之機會’進而避免導光板之導光性能造成劣 化0 、π奴W佝路一樘導光扳之光學微結構圖案之製 法’用以降低或甚至避免導光板於顯示裝置内破壞最 上之光學膜之機會。 且〇其 本發明揭露-種導光板之光學微結構圖案之製 法’包含-步驟為藉由一第一雷射光束轟擊_基材表面， 以致基材表面形成一微型凹孔，其中微型凹孔之周 至少一個突起物，以及另一步驟為藉由至 平二有 ^ 第一雷射光 201232069 束轟擊突起物，以便至少縮小突起物之尺寸。 本發明之一實施例，第一雷射光束之功率與第二雷射 光束之功率相同，且第二雷射光束之脈衝數小於第一雷射 光束之脈衝數。 本發明之一實施例，第二雷射光束之功率小於第一雷 射光束之功率。此外，第二雷射光束之脈衝數小於第一雷 射光束之脈衝數；或者，第二雷射光束之脈衝數相同於第 一雷射光束之脈衝數。 本發明之一實施例，第一雷射光束之功率小於第二雷 射光束之功率，且第二雷射光束之脈衝數小於第一雷射光 束之脈衝數。依據此實施例，更包含依據第一雷射光束轟 擊基材表面之座標，使第二雷射光束朝微型凹孔進行轟 擊，以致破壞突起物並形成一環狀凹部，其中環狀凹部環 繞微型凹孔，且環狀凹部之深度小於微型凹孔之深度。 本發明之一實施例，轟擊突起物之步驟之前，更包含 進行多次轟擊基材表面之步驟，以致基材表面分布多個微 型凹孔。 本發明之一實施例，每次藉由第一雷射光束轟擊基材 表面之步驟之後，直接進行藉由第二雷射光束轟擊此些突 起物之步驟。 本發明之一實施例，當微型凹孔之周緣具有多個突起 物時，藉由第二雷射光束轟擊突起物之步驟，更包含步驟 為，沿微型凹孔周緣之時針方向，間隔地轟擊微型凹孔周 緣之突起物，以破壞突起物並形成多個凹陷部。各凹陷部 之深度小於微型凹孔之深度。 201232069 本發明之一實施例，當微 物時，猝由第二雷射朵击蛊淑1孔周緣具有多個突起 . 9 轟擊突起物之步驟，更包含步驟 ;，凹孔周緣之時針方向，重疊地爲擊 =大起物，以破壞突起物並形成一環 ； %繞微型凹孔，且環狀凹部之深度小 本發明之-實施例，基材為—印壓模且二:：: =之製作方法更包括-步驟為，利用；壓模= 光板表面印壓出多個光學微結構圖案。 、、等 本發明之-實施例，基材為一印壓模 作方法更包括一步驟為利用印厂堅模具於 壓出多個凸出部’各凸出部之外型與微型凹孔之 補’以及另-步驟為利用轉印板於—導光板表面印 =出夕個光學微結構’各光學微結構之外型與 外型相同。 本發明之-實施例，基材為一導光板， 孔分布於該導光板之表面。 —微生凹 本發明之-種導光板之光學微結構圖案之製作方法包 3 一步驟為，依據基材表面之一座標，藉由一第一雷射光 束轟擊—基材表面’以致基材表面形成-微型凹孔，以及 1一步驟為’依據同-座標，藉由一第二雷射光束轟擊微 里凹孔，以致擴大微型凹孔之口徑。其中第二雷射光束之 功率大於第-雷射光束之功率，且第二雷射光束之脈衝數 小於第一雷射光束之脈衝數。 、綜上所述，本發明導光板之光學微結構圖案之製作方 法可不需另外採用加工手段去除各微型凹孔處之火山口外 201232069 觀，以省略加工製造之步驟，並節省加工成本及取得其加 工設備之成本。此外，也可避免導光板製作完成後，其導 光性能之劣化。 【實施方式】 以下將以圖示及詳細說明清楚說明本發明之精神，如 熟悉此技術之人員在瞭解本發明之實施例後，當可由本發 明所教示之技術，加以改變及修飾，其並不脫離本發明之 精神與範圍。 如上所述，有鑑於利用雷射光束對基材表面進行高溫 照射將無可避免地導致熔渣喷濺現象，以致於各微型凹孔 處形成火山口之外觀，將使火山口周圍之突起物可能因掉 落微型凹孔内而導致導光元件之導光性能的劣化，為此， 本發明藉由用以製作微型凹孔之雷射光束，於形成微型凹 孔之同一階段中，一併改善或去除各微型凹孔處之火山口 外觀。 請參閱第1圖所示，第1圖繪示本發明導光板之光學 微結構圖案之製作方法之流程圖。 此導光板之光學微結構圖案之製作方法，至少包含如 下步驟： 步驟（101):藉由一第一雷射光束轟擊一基材表面， 以致此基材表面形成至少一具火山口形狀之微型凹孔，其 中微型凹孔之周緣具有一個或多個突起物；以及 步驟（102):藉由一個或多個第二雷射光束分別轟擊 該些突起物，以縮小突起物之尺寸或完全移除此些突起物。 201232069 請參閱第2圖至第4圖所示。第2圖綠示第1圖步驟 (101)之於一實施例下之細部流程圖。第3圖繪示第1圖步 驟（101)之操作示意圖。第4圖繪示各微型凹孔處形成火山 口外觀之俯視圖（a)及剖視圖（b)。SUMMARY OF THE INVENTION The present invention discloses an optical microstructure pattern of a light guide plate for providing an optical microstructure pattern on a surface of a light guide plate. The invention discloses a method for forming an optical microstructure pattern of a light guide plate for use in the same stage of making micro-recessed holes, and removing the appearance of the crater at each of the micro-recessed holes. 5 The invention discloses a method for fabricating an optical microstructure pattern of a light guide plate to reduce or even avoid the opportunity of the protrusion of the periphery of the micro concave hole to fill the micro concave hole and thereby avoid the deterioration of the light guiding performance of the light guide plate. The method of making an optical microstructure pattern of a light guide is used to reduce or even avoid the opportunity for the light guide to damage the uppermost optical film in the display device. Moreover, the invention discloses that the method for fabricating the optical microstructure pattern of the light guide plate comprises the steps of: bombarding the surface of the substrate by a first laser beam, so that the surface of the substrate forms a micro concave hole, wherein the micro concave hole At least one protrusion of the week, and another step is to bombard the protrusion by the first laser light 201232069 to the size of the protrusion to at least reduce the size of the protrusion. In one embodiment of the invention, the power of the first laser beam is the same as the power of the second laser beam, and the number of pulses of the second laser beam is less than the number of pulses of the first laser beam. In one embodiment of the invention, the power of the second laser beam is less than the power of the first laser beam. Further, the number of pulses of the second laser beam is smaller than the number of pulses of the first laser beam; or the number of pulses of the second laser beam is the same as the number of pulses of the first laser beam. In one embodiment of the invention, the power of the first laser beam is less than the power of the second laser beam, and the number of pulses of the second laser beam is less than the number of pulses of the first laser beam. According to this embodiment, the method further comprises: bombarding the second laser beam against the coordinates of the surface of the substrate according to the first laser beam, so that the second laser beam is bombarded toward the micro recess, so as to damage the protrusion and form an annular recess, wherein the annular recess surrounds the micro a recessed hole, and the depth of the annular recess is smaller than the depth of the micro recess. In one embodiment of the present invention, the step of bombarding the protrusions further includes the step of bombarding the surface of the substrate a plurality of times such that the surface of the substrate is distributed with a plurality of micro-recessed holes. In one embodiment of the invention, the step of bombarding the protrusions by the second laser beam is performed directly after each step of bombarding the surface of the substrate by the first laser beam. In an embodiment of the present invention, when the periphery of the micro-recessed hole has a plurality of protrusions, the step of bombarding the protrusion by the second laser beam further comprises the step of bombarding the space along the circumference of the periphery of the micro-recess hole. A protrusion of a periphery of the micro-recess hole to break the protrusion and form a plurality of recesses. The depth of each recess is smaller than the depth of the micro recess. 201232069 According to an embodiment of the present invention, when the micro object is used, the cymbal has a plurality of protrusions on the periphery of the hole of the second laser. 9 the step of bombarding the protrusion further includes a step; the clockwise direction of the periphery of the concave hole, Overlap is a large hit to break the protrusion and form a ring; % around the micro-recess, and the depth of the annular recess is small. In the embodiment of the invention, the substrate is a stamp and the second::: The manufacturing method further comprises the steps of: utilizing; the stamper = the surface of the light plate is printed with a plurality of optical microstructure patterns. In the embodiment of the present invention, the substrate is a stamping die-making method, and the method further comprises the steps of: using a stamping die to press out the plurality of protrusions; 'And the other step is to use the transfer plate on the surface of the light guide plate = the optical microstructure of the outer surface. In an embodiment of the invention, the substrate is a light guide plate, and the holes are distributed on the surface of the light guide plate. - a method for fabricating an optical microstructure pattern of a light guide plate of the present invention. A step is to bombard a substrate surface by a first laser beam according to a coordinate of a surface of the substrate. The surface is formed - a micro-recessed hole, and the first step is 'based on the same-coordinate, and the micro-recessed hole is bombarded by a second laser beam, so that the diameter of the micro-recessed hole is enlarged. The power of the second laser beam is greater than the power of the first laser beam, and the number of pulses of the second laser beam is smaller than the number of pulses of the first laser beam. In summary, the method for fabricating the optical microstructure pattern of the light guide plate of the present invention can eliminate the processing of the crater outside the crater at each micro recessed hole without the use of processing means, thereby omitting the steps of processing and manufacturing, and saving processing cost and obtaining The cost of its processing equipment. In addition, deterioration of the light guiding performance of the light guide plate after completion of fabrication can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following description and the detailed description of the embodiments of the present invention, which can be modified and modified by the teachings of the present invention, The spirit and scope of the invention are not departed. As described above, in view of the high-temperature irradiation of the surface of the substrate by the laser beam, the slag splash phenomenon is inevitably caused, so that the appearance of the crater at each of the micro-recessed holes will cause the protrusions around the crater. The light guiding performance of the light guiding element may be deteriorated due to falling inside the micro concave hole. For this reason, the present invention is combined with the laser beam for making the micro concave hole in the same stage of forming the micro concave hole. Improve or remove the appearance of the crater at each micro-recess. Referring to Figure 1, Figure 1 is a flow chart showing a method of fabricating an optical microstructure pattern of a light guide plate of the present invention. The method for fabricating the optical microstructure pattern of the light guide plate comprises the following steps: Step (101): bombarding a surface of a substrate by a first laser beam, so that the surface of the substrate forms at least one crater-shaped miniature a recessed hole, wherein the periphery of the micro-recessed hole has one or more protrusions; and step (102): bombarding the protrusions by one or more second laser beams to reduce the size or complete movement of the protrusions In addition to these protrusions. 201232069 Please refer to Figures 2 to 4. Fig. 2 is a green flow chart showing the details of step (101) in the first embodiment. Figure 3 is a schematic diagram showing the operation of the first step (101). Fig. 4 is a plan view (a) and a cross-sectional view (b) showing the appearance of the crater at each of the micro recesses.
此步驟（101)於一實施例下更包括之細部步驟為： 步驟（1011 ):依據一包含多個光學微結構之光學微結 構圖案之設計，依據多個預知（預先已設定好）之座標，藉 由雷射產生器100分別輸出多個第一雷射光束2〇〇至基材 400表面，使得此些第一雷射光束2〇〇分別轟擊基材4〇〇 表面以熔融出許多微型凹孔41〇，且各微型凹孔41〇之周 緣具有一個或多個突起物420。由於此些凹孔之口徑具^ 米級尺寸大小’故稱之為微型凹孔41 〇。 需說明的是，由於上述之熔渣喷濺現象，使得各微型 凹孔410處所形成之火山口外觀無法每次皆完全—致。此 些突起物420可能大部分大致排列以圍繞於微型凹孔 之周緣，也可能部份落於前述之圍繞範圍外。而且此此今 起物420例如大小不-、或者，例如為多個非連續排= 此微型凹孔410之周緣之突起物420，或者甚至可处、 少-環形之突起物420等等。故，第4圖所示之微 410僅能視為其中一微型凹孔410之參考，並非音护 各微型凹孔410處所形成之火山口外觀皆如第4圖所厂斤有 請參閱第5A圖所示。第5A圖繪示第i圖步驟 於一實施例下之細部流程圖。 此步驟（102)之一實施例下，更包括細部步驟為： 步驟（1021):於對基材4〇〇表面進行多次第一雷射光 201232069 束200 (步驟（ιοί))之羼擊以分布多個微型凹孔4i〇於 基材400表面之後，再依序移至各個微型凹孔41〇，對各 個微型凹孔410之周緣進行第二雷射光束3〇〇(步驟（1〇2)) 之轟擊。 相反地’請參閱第5B圖所示。第5B圖繪示第1圖步 驟（102)於另一實施例下之細部流程圖。 此步驟（102)之另一實施例下，更包括細部步驟為： 步驟（1022):於每次對基材400表面施予一次第一雷 射光束200 (步驟（1〇1 ))之轟擊以產生單一個微型凹孔 410於基材400表面之後，直接對此微型凹孔410之周緣 進行步驟（102)之轟擊；接著， 步驟（1023 ):繼續進行另一次對基材400表面施予一 次第一雷射光束200 (步驟（101))之轟擊以產生另一個 微型凹孔410於基材400表面，再回步驟（1022)，以此類 推。 請參閱第6圖所示。第6圖繪示第1圖步驟（1〇2)之 一種操作示意圖。 上述各實施例中，無論是進行步驟（1021)或步驟 (1022) ’步驟（1〇2)可以是依據預先設計之路線，藉由 雷射產生器100分別輸出一個或多個第二雷射光束3⑻至 基材400表面對應於各微型凹孔41〇之周緣，以破壞各微 型凹孔410之周緣處所隨機分布之突起物42〇。 請參閱第7圖所示。第7圖繪示第1圖步驟（1〇2)後 多種微型凹孔410處之剖視圖。當此些第二雷射光束3〇〇 轟擊此些突起物420，此些突起物420被破壞而崩塌於基 201232069 材400表面後，便可能形成被縮小尺寸之突起物421(如第 7圖（a))’以致不再維持其原有高度。此外，此些突起物 421之頂面皆具有經由第二雷射光束300轟擊過之燒焦（黃 或黑色）痕跡（圖中未示）。燒焦痕跡之程度變化可係由微 型凹孔410之周緣朝遠離微型凹孔410的方向逐漸由深變 淺。 或者，此些突起物420被破壞後，基材401於此些突 起物420之對應位置形成多個朝基材401内凹陷之凹陷部 430(如第7圖（b)) ’凹陷部430 (包含外緣表面及内表面） 皆具有經由第二雷射光束300轟擊過之燒焦（黃或黑色） 痕跡（圖中未示）。具體來說，燒焦痕跡之程度變化可由微 型凹孔410之周緣（包含凹陷部430)朝遠離微型凹孔410 的方向逐漸由深變淺。此外，凹陷部430外側仍可能存在 微小突起物422。 或者，甚至經合適之調整下，第二雷射光束300對基 材402所產生之凹陷部430外側可以不具火山口的外觀， 為大致與基材402表面齊平之平面部423(如第7圖（c))。 如此，一旦此些突起物420不再維持其原有高度或不 存在時，將降低此些突起物420因彎折或崩塌掉落至微型 凹孔410内之機率，進而避免導光元件之導光性能劣化以 及刮傷或刺破上述之光學膜。 要瞭解到，由於第二雷射光束300轟擊此些突起物420 時，只藉由調整雷射產生器100之輸出參數來達成縮小尺 寸之突起物420、凹陷部430或者不具火山口外觀之凹陷 部 430。 201232069 f於縮小尺寸之突起物42G、凹陷部伽 凹陷部430之外觀及尺寸無法屢屢二致故 第7圖（a)、(bWc〇所示之微型凹孔：二故， 其中-種參考’並非意指所有微续月匕視為 如第7圖（小⑴心）所示。凹孔410周緣之外觀皆 ❿ 更具體來說，請參閱第8A圖及第8b =二/驟(1°2)於多個變化之-二 ^日:各她孔彻處之突起物被轟擊後之一種第 第8A圖揭露了步驟（]〇2) 細部步驟為： ’之其中-種細部變化，其 緣刚沿各微型凹請周 緣之時針方向C(見第4圖，例如順 並以第二雷射光戾3〇〇門卩5沾蛊奶 4逆時針）移動， 此突起物2 擊微型凹孔410周緣之此 ^起物420，以破壞突起物42()並形 ，’其中此些凹陷部43。環繞微型凹孔二= 皆小於微型凹孔410之深度di (第6 圖Cb)) ’且各凹陷部430之最大口 41〇之最大口徑W1 (第6圖⑴）。工白小於微型凹孔 所產Ϊ瞭SI ’由於各凹陷部430係由第二雷射光束300 各凹陷部彻之口徑大小、彼此間之間距 或朝基材4GG凹陷之深度D2等無法完全 ㈣凹_430僅能視為其中—種參考，二意 W斤有微型凹孔41〇周緣之凹陷部43〇外觀皆如第8b圖所 TTT® λ 201232069 請參閱第9A圖及第9B圖所示，第9A圖繪示第j圖 步驟（102)於多個變化之另一細部流程圖。第9B圖繪示各 微型凹孔410處之突起物42〇被轟擊後之另種俯視圖。 第9A圖揭露了步驟（1〇2)之其中—種細部變化，其細 部步驟為： 步驟（1025 )·使雷射產生器1〇〇沿各微型凹孔41〇周 緣之時針方向C (見第4圖，例如順時針或逆時針），重疊 地轟擊微型凹孔410之周緣，以移除突起物42〇，並於微 型凹孔410之周緣之對應位置形成一朝基材4〇〇凹陷之環 狀凹部440，其中環狀凹部44〇環繞微型凹孔41〇，且環狀 凹部440之深度D2小於微型凹孔410之深度D1。 要瞭解到，由於環狀凹部440係由第二雷射光束3〇〇 所產生，因此，環狀凹部44〇之尺寸大小或朝基材働凹 陷之深度D2等皆不定。故，第9B圖所示之環狀凹部44〇 僅能視為其中一種參考，並非意指所有微型凹孔41〇周緣 之環狀凹部440外觀皆如第9B圖所示。 然而，相較於上述依據預先設計之路線而輸出第二雷 射光束300至基材4〇〇表面對應於各微型凹孔41〇之周 緣，本發明也不排除依據每一微型凹孔41〇周緣之突起物 420，有目標性地針對單一突起物42〇進行各別轟擊。 上述各實施例中，當進行步驟O01)及步驟（102) 時’其具體操作上之原則為： 原則I:調整雷射產生器100之輸出參數，使得各第一 雷射光束200之功率與各第二雷射光束3〇〇之功率大致相 同，只是第一雷射光束200之脈衝數（pulses)，大於第二 201232069 雷射光束300之脈衝數（；pulses)。舉例來說，假設雷射產 生器100之輸出功率鱼無到最大值，稱之為0〇/〇〜100%。各 第二雷射光束300與各第一雷射光束200之功率約為雷射 產生器100之最大輸出功率的80〇/〇。此外，各第一雷射光 束200之脈衝數25發、各第二雷射光束300之脈衝數1〇 發。或者； 原則II :調整雷射產生器1〇〇之輸出參數，使得各第 一雷射光束200之功率大於各第二雷射光束300之功率。 舉例來說’假設雷射產生器1〇〇之輸出功率由無到最去 值，稱之為0%〜1 〇〇%。第一雷射光束的功率為雷射產生器 100之最大輸出功率的90%、其脈衝數為25發，第二雷射 光束的功率為雷射產生器100之最大輸出功率的80°/〇、其 脈衝數為5發。舉另一例來說，各第二雷射光束3〇〇之功 率可以只佔各第一雷射光束2〇〇之功率的1%至3〇%。 此外，當各第一雷射光束2〇〇之功率大於各第二雷射 光束300之功率時，第一雷射光束2〇〇之脈衝數不限需與 第二雷射光束300之脈衝數相同，也可以不同於第二雷^ 光束300之脈衝數。或者； 原則III :調整雷射產生器1〇〇之輸出參數，使得各第 田射光束200之功率小於各第二雷射光束3〇〇之功率， 且第雷射光束之脈衝數（pUises)大於第二雷射光束 3〇〇之脈衝數（pulses)。舉例來說，假設雷射產生器 之輸出功率鱼無到最大值，稱之為0%〜100%。第一雷射光 束的功率為雷射產生器1〇〇之最大輸出功率的、其脈 衝數為25發，第二雷射光束的功率為雷射產生器1〇〇之最 201232069 大輸出功率的90%、其脈衝數為5發。舉另一例來說，第 一雷射光束200可以只佔第二雷射光束3〇〇之功率的3〇% 至 80% 〇 要瞭解到’由於每-次發出之雷射光束於—基材上以 形成一I孔時’其功率之大小與凹孔之口徑相關，其脈衝 數之多券與凹孔之深度相關。請參閱第1〇圖所示，第1〇 圖繪示第1圖步驟（102)之另一種操作示意圖。因此’無論 各微型凹孔410之周緣具有單一或多個突起物 420，當進 行步驟（102 )且採用原則hi時，其細部步驟為： 鲁 依據先前第一雷射光束200轟擊基材400表面以致形 成一微型凹孔410之座標，使第二雷射光束3〇〇瞄準此微 型凹孔410之中心，對此微型凹孔41〇進行轟擊，使得此 些突起物420被破壞而形成一環狀凹部440 (參閱第9B 圖）。環狀凹部440環繞微型凹孔410，且環狀凹部440之 深度小於微型凹孔410之深度，環狀凹部440進而加大此 微型凹孔410之口徑。 因為第二雷射光束300之功率較第一雷射光束200之 # 功率大’因此’第二雷射光束300之轟擊廣度可涉及此微 梨凹孔410周緣之突起物420，故，藉由單一第二雷射光 束300來轟擊此微型凹孔410時，此微型凹孔410周緣之 此（些）突起物420便可形成被縮小尺寸之突起物421(如 第7圖（a));或者，於此微型凹孔410周緣形成環狀凹 部440 (參閱第9B圖）；或者，甚至經合適之調整下，第 二雷射光束300對基材402所產生之環狀凹部440外側可 •以不具火山口的外觀，為如第7圖（c)之平面部423。 201232069 此外，當採用原則III並以第二雷射光束300直接轟擊 微型凹孔410時，不僅可達到擴大微型凹孔410 口徑之目 的，也可僅以單一次數之轟擊便可至少縮小微型凹孔410 周緣之突起物420，進而節省使用雷射設備之製作成本及 製造時間。 關於上述之基材400〜402，基材400〜402於本發明之 一實施例中可為一導光板500，此些微型凹孔410排列形 成上述之光學微結構圖案P，且分布於導光板500之表面， 例如導光板500之出光面或入光面。 請參閱第11圖所示，第11圖繪示一導光板500之外 觀示意圖。導光板500具有相對之第一面510及第二面 520,以及環繞並連接第一面510及第二面520之四個第 三面530。第三面530稱為導光板500可呈現厚度之一面， 且任一第三面530的面積皆小於第一面510或第二面 520的面積。通常來說，導光板500之第一面510與第 二面520被設計為一出光面，且導光板500之其中一第 三面530被設計為一入光面。 導光板500可因其厚度大小、其軟硬程度或材質選 擇來決定其外型（例如呈片形或捲曲狀）。此導光板500 之材質例如可為聚對苯二曱酸乙二醋（polyethylene Terephthalate，PET)、聚碳酸 g旨（polycarbonate，PC) 或聚甲基丙烯酸曱醋（Poly(methyl methacrylate)，PMMA) 等透明材料。 此外，基材400〜402於本發明之另一實施例中也可為 一印壓模具，印壓模具是由一金屬材質或一塑膠材質所製 15 [s] 201232069 成。由於雷射光束之作用原理為利用雷射光束之能量熱熔 ' 印壓模具表面，且因為模具表面材料本身之内聚力以及其 ， 表面張力之作用，故雷射光束所轟擊印壓模具之處會形成 錐形之凹孔。如此，便可利用印壓模具作為模仁，進行射 出成型或熱壓成型以製作導光板及導光板表面之光學微結 構圖案。 請參閱第12A圖所示，第12A圖繪示一印壓模具於一 變化中印壓出一光學微結構圖案之操作示意圖。 此印壓模具為一印壓模板600。此些微型凹孔410對 ® 應上述光學微結構圖案之排列方式，且分布於此印壓模板 600之一平面上，用以對一導光板500或一轉印板800進 行壓印。 請參閱第12B圖所示，第12B圖繪示一印壓模具於另 一變化中印壓出一光學微結構圖案之操作示意圖。此印壓 模具為一印壓滾筒700。此些微型凹孔410對應上述光學 微結構圖案之此些光學微結構之排列方式，且分布於此印 壓滾筒700之一圓周面710上，以一轉印板800形成一微 • 孔聚集圖案K，用以對一導光板500或一轉印板800進行 壓印。 請參閱第12A圖、第12B圖或第13A圖所示，第13A 圖繪示本發明導光板500之光學微結構圖案之製作方法於 又一實施例下之後續流程圖。 當基材400〜402為印壓模具時，此導光板500之光學 微結構圖案之製作方法於步驟（102)之後更包含： 步驟（103):利用此印壓模具上之此些微型凹孔410， 16 201232069 於一導光板500表面印壓出一光學微結構圖案。如此，導 ‘光板500表面便可形成許多與此些微型凹孔410之外型互 • 補之凸出部（圖中未示）。 請參閱第13B圖所示，第13B圖繪示本發明導光板500 之光學微結構圖案之製作方法於再一實施例下之後續流程 圖。當基材400〜402為印壓模具時，此導光板500之光學 微結構圖案之製作方法於步驟（102)之後更包含： 步驟（104):利用印壓模具上之此些微型凹孔410， 於一轉印板800表面印壓出多個凸出部，其中各凸出部之 ® 外型與微型凹孔410之外型互補；以及 步驟（105)利用轉印板800上之此些凸出部，於一導 光板500表面印壓出多個光學微結構，其中此些光學微結 構之外型分別與微型凹孔410之外型相同。 本發明並不限制光學微結構之排列方式，例如為均勻 或非均勻，或例如以陣列方式排列或以線性方式排列。研 發人員可依實際需求或限制加以選擇或調整光學微結構之 排列方式。 • 需說明的是，此些第一雷射光束200與第二雷射光束 300可屬於铷雅各(Nd—YAG)雷射或二氧化碳（C02)雷射。 而且，由於各凹陷部係由第二雷射光束所轟擊而成， 勢必也會具有上述之熔渣喷濺現象，然而，因為第二雷射 光束之轟擊程度遠不及第一雷射光束之轟擊程度，故，各 凹陷部具有火山口的外觀遠不及各微型凹孔處之火山口外 觀明顯，因此，不會有先前技術所述之缺點及不便，甚至， 經合適之調整下，第二雷射光束所產生之凹陷部可以不具 201232069 火山口的外觀。 _ 綜上所述，本發明導光板之光學微結構圖案之製作方 * 法可不需另外採用加工手段去除各微型凹孔處之火山口外 觀，藉由用以製作微型凹孔之雷射光束，於形成微型凹孔 之同一階段中，一併改善或去除各微型凹孔處之火山口外 觀，以省略加工製造之步驟，並節省加工成本及取得其加 工設備之成本。 本發明所揭露如上之各實施例中，並非用以限定本發 明，任何熟習此技藝者，在不脫離本發明之精神和範圍内， * 當可作各種之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖繪示本發明導光板之光學微結構圖案之製作方 法之流程圖。 * 第2圖繪示第1圖步驟（101)之於一實施例下之細部流 程圖。 第3圖繪示第1圖步驟（101)之操作示意圖。 第4圖繪示各微型凹孔處形成火山口外觀之俯視圖（a) 及剖視圖（b)。 第5A圖繪示第1圖步驟（102)於一實施例下之細部流 程圖。 第5B圖繪示第1圖步驟（102)於另一實施例下之細部 201232069 流程圖。 ' 第6圖繪示第1圖步驟（102)之一種操作示意圖。 • 第7圖繪示第1圖步驟（102)後多種微型凹孔處之剖 視圖（a) (b) (c)。 第8A圖繪示第1圖步驟（102)於又一實施例下之細部 流程圖。 第8B圖繪示各微型凹孔處之突起物被轟擊後之一種 俯視圖。 第9A圖繪示第1圖步驟（102)於又一實施例下之細部 籲流程圖。 第9B圖繪示各微型凹孔處之突起物被轟擊後之另種 俯視圖。 請參閱第10圖所示，第10圖繪示第1圖步驟（102)之 另一種操作示意圖。 第11圖繪示一導光板之外觀示意圖。 第12A圖繪示一印壓模具於一變化中印壓出一光學微 結構圖案之操作示意圖。 • 第12B圖繪示一印壓模具於另一變化中印壓出一光學 微結構圖案之操作示意圖。 第13A圖繪示本發明導光板之光學微結構圖案之製作 方法於又一實施例下之後續流程圖。 第13B圖繪示本發明導光板之光學微結構圖案之製作 方法於再一實施例下之後續流程圖。 【主要元件符號說明】 19 [S] 201232069 100 ： 雷射產生器 700 :印壓滾筒 * 200 ： 第一雷射光束 710 :圓周面 - 300 ： 第二雷射光束 800 :轉印板 400、 401、402 :基材 101-102 :步驟 410 ： 微型凹孔 103 :步驟 420 ： 突起物 104-105 :步驟 421 ： 被縮小尺寸之突起物 1011 :步驟 422 ： 微小突起物 1021 :步驟 423 ： 平面部 1022-1023 :步驟 ® 430 ： 凹陷部 1024 :步驟 440 :環狀凹部 1025 :步驟 500 ： 導光板 C :時針方向 510 ： 第一面 Dl、D2 :深度 520 ： 第二面 Wl、W2 :最大口徑 530 ： 第三面 P:光學微結構圖案 600 ： 印壓模板 K:微孔聚集圖案 20The step (101) further includes the following steps in the embodiment: Step (1011): According to a design of an optical microstructure pattern including a plurality of optical microstructures, according to a plurality of predicted (pre-set) coordinates And outputting a plurality of first laser beams 2 to the surface of the substrate 400 by the laser generator 100, respectively, such that the first laser beams 2 轰 bombard the surface of the substrate 4 to melt a plurality of micro The recessed holes 41 are formed, and the periphery of each of the micro-recessed holes 41 has one or more protrusions 420. Since the diameter of the recessed holes has a size of 'm", it is called a micro recess 41 〇. It should be noted that due to the above-mentioned slag splashing phenomenon, the appearance of the crater formed at each of the micro recessed holes 410 cannot be completely completed every time. These protrusions 420 may be arranged substantially mostly to surround the periphery of the micro-recessed holes, and may also partially fall outside the aforementioned surrounding range. Moreover, the present 420 is, for example, not sized, or, for example, a plurality of non-continuous rows = protrusions 420 of the periphery of the micro-recess 410, or even arbitrarily, less-annular protrusions 420, and the like. Therefore, the micro 410 shown in FIG. 4 can only be regarded as a reference of one of the micro recesses 410. The appearance of the crater formed by the micro recessed holes 410 of the sound protection is as shown in FIG. 4, please refer to the 5A. The figure shows. Figure 5A is a flow chart showing the steps of the i-th step in an embodiment. In an embodiment of the step (102), the step further comprises the following steps: Step (1021): performing a plurality of first laser light 201232069 bundle 200 on the surface of the substrate 4 (step (ιοί)) After the plurality of micro-recessed holes 4i are distributed on the surface of the substrate 400, the micro-recessed holes 41 are sequentially moved to the respective micro-recessed holes 41, and the second laser beam 3 进行 is applied to the periphery of each of the micro-recessed holes 410 (step (1〇2) )) The bombardment. Conversely, please refer to Figure 5B. Figure 5B is a detailed flow chart of the first step (102) of another embodiment. In another embodiment of the step (102), the step further comprises the following steps: Step (1022): applying a bombardment of the first laser beam 200 (step (1〇1)) to the surface of the substrate 400 each time. After the single micro-recess 410 is formed on the surface of the substrate 400, the periphery of the micro-recess 410 is directly subjected to the bombardment of the step (102); then, the step (1023): continuing to apply another surface to the substrate 400. The bombardment of the first laser beam 200 (step (101)) once produces another micro-recess 410 on the surface of the substrate 400, back to step (1022), and so on. Please refer to Figure 6. Fig. 6 is a view showing an operation of the step (1〇2) of Fig. 1. In the above embodiments, whether the step (1021) or the step (1022) 'step (1〇2) may be performed according to a pre-designed route, one or more second lasers are respectively output by the laser generator 100. The light beam 3 (8) to the surface of the substrate 400 corresponds to the periphery of each of the micro recesses 41 to destroy the randomly distributed protrusions 42 周 at the periphery of each of the micro recesses 410. Please refer to Figure 7. Fig. 7 is a cross-sectional view showing a plurality of micro-recessed holes 410 after the step (1〇2) of Fig. 1. When the second laser beam 3 is bombarded with the protrusions 420, and the protrusions 420 are broken and collapsed on the surface of the base 201232069 400, a reduced size protrusion 421 may be formed (as shown in FIG. 7). (a)) 'so that it does not maintain its original height. In addition, the top surfaces of the protrusions 421 have burnt (yellow or black) marks (not shown) that are bombarded by the second laser beam 300. The degree of change in the burnt mark may be gradually changed from deep to shallow by the periphery of the micro-recess 410 toward the micro-recess 410. Alternatively, after the protrusions 420 are broken, the substrate 401 is formed at a corresponding position of the protrusions 420 to form a plurality of recesses 430 (such as FIG. 7(b)) recessed 430 (as shown in FIG. 7(b)). Both the outer and inner surfaces are included with scorch (yellow or black) traces (not shown) that have been bombarded by the second laser beam 300. Specifically, the degree of change in the burnt mark can be gradually changed from deep to shallow in the direction away from the micro-recess 410 by the periphery of the micro-recess 410 (including the depressed portion 430). Further, minute protrusions 422 may still exist outside the recess 430. Alternatively, even with appropriate adjustment, the second laser beam 300 may have no crater appearance on the outside of the depressed portion 430 produced by the substrate 402, and is a planar portion 423 substantially flush with the surface of the substrate 402 (eg, 7th) Figure (c)). Thus, once the protrusions 420 no longer maintain their original height or are absent, the probability that the protrusions 420 will fall into the micro-recess 410 due to bending or collapse will be reduced, thereby avoiding the guiding of the light guiding elements. The optical properties are deteriorated and the optical film described above is scratched or punctured. It is to be understood that, as the second laser beam 300 bombards the protrusions 420, the reduced size protrusions 420, the recesses 430, or the depressions without the crater appearance are achieved only by adjusting the output parameters of the laser generator 100. Part 430. 201232069 f The appearance and size of the reduced size protrusion 42G and the recessed portion dent depression portion 430 cannot be repeated. Figure 7 (a), (bWc〇 shows the micro recessed hole: two, of which - reference) It does not mean that all micro-continuation is considered as shown in Figure 7 (small (1) heart). The appearance of the periphery of the recessed hole 410 is more specific, please refer to Figure 8A and 8b = 2 / (1 °) 2) In the case of multiple changes - two days: a figure 8A after the projections of each of her Kongche were bombarded reveals the steps (] 〇 2) The detailed steps are: 'of which - a detail change, its The edge just moves along the circumferential direction C of each micro-concave (see Figure 4, for example, with the second laser 戾 3 〇〇 蛊 蛊 蛊 蛊 逆 逆 逆 4 4 4 , , , , , , , , , , , , , , , , , , , , , , 410 is the edge of the workpiece 420 to destroy the protrusion 42 () and shape, 'where the recessed portion 43. Around the micro recessed hole two = are smaller than the depth di of the micro recess 410 (Fig. 6b)) And the maximum diameter W1 of the largest port 41 of each recessed portion 430 (Fig. 6 (1)). The working white is smaller than the micro-recessed hole, and the SI' is not completely complete due to the size of the recessed portions of the second laser beam 300, the distance between them, or the depth D2 of the recessed toward the substrate 4GG. The concave _430 can only be regarded as one of the references, and the concave portion 43 of the peripheral edge of the micro-recessed hole 41〇 is the same as the TTT® λ 201232069 of the 8th figure. Please refer to the figure 9A and 9B. FIG. 9A is a flow chart showing another detail of the plurality of changes in step (102) of FIG. Fig. 9B is a plan view showing another projection 42 of each of the micro recesses 410 after being bombarded. Figure 9A discloses a detail change of the step (1〇2), the detailed steps of which are: Step (1025)·Making the laser generator 1 〇〇 along the circumference of each micro-recess 41〇 in the clockwise direction C (see 4, for example, clockwise or counterclockwise), the periphery of the micro-recess 410 is overlapped and bombarded to remove the protrusion 42〇, and a recess is formed toward the substrate 4 at a corresponding position on the periphery of the micro-recess 410. The annular recess 440, wherein the annular recess 44 surrounds the micro recess 41, and the depth D2 of the annular recess 440 is smaller than the depth D1 of the micro recess 410. It is to be understood that since the annular recess 440 is generated by the second laser beam 3 ,, the size of the annular recess 44 或 or the depth D2 toward the substrate 皆 is not constant. Therefore, the annular recess 44 所示 shown in Fig. 9B can only be regarded as one of the references, and does not mean that the annular recess 440 of the periphery of all the micro recess 41 is as shown in Fig. 9B. However, the output of the second laser beam 300 to the periphery of the substrate 4 对应 corresponds to the periphery of each of the micro recesses 41 较 compared to the above-described pre-designed route, and the present invention does not exclude each micro recess 41 〇 The peripheral protrusions 420 are targeted for individual bombardment against a single protrusion 42〇. In the above embodiments, when performing steps O01) and (102), the specific operational principle is as follows: Principle I: adjusting the output parameters of the laser generator 100 such that the power of each of the first laser beams 200 is The power of each of the second laser beams 3 is substantially the same, except that the pulse number of the first laser beam 200 is greater than the number of pulses of the second 201232069 laser beam 300 (pulses). For example, assume that the output power of the laser generator 100 has no maximum value, which is called 0〇/〇~100%. The power of each of the second laser beam 300 and each of the first laser beams 200 is about 80 〇 / 〇 of the maximum output power of the laser generator 100. Further, the number of pulses of each of the first laser beams 200 is 25, and the number of pulses of each of the second laser beams 300 is 1 burst. Or; principle II: adjusting the output parameters of the laser generator 1〇〇 such that the power of each of the first laser beams 200 is greater than the power of each of the second laser beams 300. For example, it is assumed that the output power of the laser generator 1〇〇 is from the lowest to the most value, which is called 0%~1 〇〇%. The power of the first laser beam is 90% of the maximum output power of the laser generator 100, and the number of pulses is 25, and the power of the second laser beam is 80°/〇 of the maximum output power of the laser generator 100. The number of pulses is 5 rounds. For another example, the power of each of the second laser beams 3 可以 may be only 1% to 3% of the power of each of the first laser beams. In addition, when the power of each of the first laser beams 2〇〇 is greater than the power of each of the second laser beams 300, the number of pulses of the first laser beam 2〇〇 is not limited to the number of pulses of the second laser beam 300. Similarly, it may be different from the number of pulses of the second lightning beam 300. Or; principle III: adjusting the output parameters of the laser generator 1〇〇 such that the power of each of the field beams 200 is less than the power of each of the second laser beams, and the number of pulses of the first laser beam (pUises) It is larger than the pulse number of the second laser beam 3〇〇. For example, suppose the output power of the laser generator has no maximum value, which is called 0%~100%. The power of the first laser beam is the maximum output power of the laser generator 1 , and the number of pulses is 25, and the power of the second laser beam is the maximum output of the laser generator 1 201232069. 90%, the number of pulses is 5 rounds. For another example, the first laser beam 200 can only occupy 3〇% to 80% of the power of the second laser beam 3〇〇. It is to be understood that 'since each time the laser beam is emitted from the substrate When forming an I hole, the magnitude of its power is related to the diameter of the recessed hole, and the number of pulses of the pulse is related to the depth of the recessed hole. Referring to Figure 1, Figure 1 is a schematic diagram showing another operation of step (102) of Figure 1. Therefore, no matter whether the periphery of each micro-recess 410 has a single or a plurality of protrusions 420, when step (102) is performed and principle hi is employed, the detailed steps are as follows: Lu bombards the surface of the substrate 400 according to the previous first laser beam 200. The coordinates of a micro-recessed hole 410 are formed such that the second laser beam 3 is aimed at the center of the micro-recessed hole 410, and the micro-recessed hole 41 is bombarded, so that the protrusions 420 are broken to form a ring. The recess 440 (see Fig. 9B). The annular recess 440 surrounds the micro-recess 410, and the depth of the annular recess 440 is smaller than the depth of the micro-recess 410, and the annular recess 440 further increases the diameter of the micro-recess 410. Since the power of the second laser beam 300 is greater than the power of the first laser beam 200, the bombardment breadth of the second laser beam 300 may involve the protrusion 420 around the periphery of the micro-pit recess 410. When the single second laser beam 300 is used to bombard the micro recess 410, the protrusion 420 of the periphery of the micro recess 410 can form a reduced size protrusion 421 (as shown in FIG. 7(a)); Alternatively, an annular recess 440 is formed around the periphery of the micro-recess 410 (see FIG. 9B); or, even with appropriate adjustment, the second laser beam 300 can be external to the annular recess 440 produced by the substrate 402. The outer portion of the crater is a flat portion 423 as shown in Fig. 7(c). 201232069 In addition, when principle III is used and the micro-recess 410 is directly bombarded by the second laser beam 300, not only can the aperture of the micro-recess 410 be enlarged, but also the micro-recess can be reduced by only a single number of bombardments. The protrusion 420 on the periphery of the 410 further saves the manufacturing cost and manufacturing time of using the laser device. In one embodiment of the present invention, the substrate 400 to 402 may be a light guide plate 500. The micro recesses 410 are arranged to form the optical microstructure pattern P, and are distributed on the light guide plate. The surface of the 500, such as the light exit surface or the light incident surface of the light guide plate 500. Referring to FIG. 11, FIG. 11 is a schematic view of a light guide plate 500. The light guide plate 500 has a first surface 510 and a second surface 520 opposite to each other, and four third surfaces 530 surrounding and connecting the first surface 510 and the second surface 520. The third face 530 is referred to as a light guide plate 500 that can assume one of the thicknesses, and the area of any of the third faces 530 is smaller than the area of the first face 510 or the second face 520. Generally, the first surface 510 and the second surface 520 of the light guide plate 500 are designed as a light exit surface, and one of the third surfaces 530 of the light guide plate 500 is designed as a light incident surface. The light guide plate 500 can be shaped (for example, in a sheet shape or a curl shape) depending on its thickness, its hardness, or material selection. The material of the light guide plate 500 may be, for example, polyethylene terephthalate (PET), polycarbonate (PC) or poly(methyl methacrylate) (PMMA). And other transparent materials. In addition, the substrate 400-402 can also be a stamping die in another embodiment of the present invention. The stamping die is made of a metal material or a plastic material 15 [s] 201232069. Since the principle of the laser beam is to use the energy of the laser beam to fuse the surface of the mold, and because of the cohesive force of the material of the surface of the mold and its surface tension, the laser beam will bombard the stamping mold. A tapered recess is formed. Thus, the stamper can be used as a mold to perform injection molding or thermoforming to form an optical microstructure pattern on the surfaces of the light guide plate and the light guide plate. Referring to Fig. 12A, Fig. 12A is a schematic view showing the operation of printing an optical microstructure pattern by a stamping die in a change. This stamping die is a stamping die plate 600. The micro-recess holes 410 are arranged in the plane of the optical microstructure pattern and are distributed on one of the planes of the stamping template 600 for imprinting a light guide plate 500 or a transfer plate 800. Referring to Fig. 12B, Fig. 12B is a schematic view showing the operation of printing an optical microstructure pattern by a stamping die in another variation. This stamping die is a press cylinder 700. The micro-recess holes 410 correspond to the arrangement of the optical microstructures of the optical microstructure pattern, and are distributed on one circumferential surface 710 of the platen 700 to form a micro-hole assembly pattern by a transfer plate 800. K, for embossing a light guide plate 500 or a transfer plate 800. Referring to FIG. 12A, FIG. 12B or FIG. 13A, FIG. 13A is a subsequent flow chart of another embodiment of the optical microstructure pattern of the light guide plate 500 of the present invention. When the substrate 400-402 is a stamping die, the optical microstructure pattern of the light guide plate 500 is further processed after the step (102): Step (103): using the micro recesses on the stamping die 410, 16 201232069 An optical microstructure pattern is printed on the surface of a light guide plate 500. In this way, the surface of the light plate 500 can be formed with a plurality of protrusions (not shown) which are complementary to the outer shape of the micro-recess holes 410. Referring to FIG. 13B, FIG. 13B is a flow chart showing a method of fabricating the optical microstructure pattern of the light guide plate 500 of the present invention in still another embodiment. When the substrate 400-402 is a stamping die, the optical microstructure pattern of the light guide plate 500 is further processed after the step (102): Step (104): using the micro-recess holes 410 on the stamping die a plurality of protrusions are printed on a surface of the transfer sheet 800, wherein the protrusions of the protrusions are complementary to the micro-recesses 410; and the step (105) utilizes the transfer board 800 The protrusions are printed on the surface of a light guide plate 500 with a plurality of optical microstructures, wherein the optical microstructures have the same outer shape as the micro recess 410. The invention does not limit the arrangement of the optical microstructures, e.g., uniform or non-uniform, or, for example, arranged in an array or in a linear manner. R&D personnel can select or adjust the arrangement of optical microstructures according to actual needs or constraints. • It should be noted that the first laser beam 200 and the second laser beam 300 may belong to a Nd-YAG laser or a carbon dioxide (C02) laser. Moreover, since each of the depressed portions is bombarded by the second laser beam, it is bound to have the above-described slag splashing phenomenon, however, because the bombardment of the second laser beam is far less than the bombardment of the first laser beam. To the extent that the depressions have a crater appearance that is far less visible than the crater at each of the micro-recesses, and therefore, there are no disadvantages and inconveniences described in the prior art, and even, with appropriate adjustment, the second mine The depression created by the beam may not have the appearance of the 201232069 crater. _ In summary, the method for fabricating the optical microstructure pattern of the light guide plate of the present invention can eliminate the appearance of the crater at each micro-recess hole by using a processing means, and the laser beam for making the micro-recess hole is used. In the same stage of forming the micro-recessed holes, the appearance of the crater at each of the micro-recessed holes is improved or removed to omit the processing and manufacturing steps, and the processing cost and the cost of the processing equipment are saved. The present invention is not limited to the embodiments of the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: Figure 1 shows the optical microstructure of the light guide plate of the present invention. Flow chart of the method of making the pattern. * Fig. 2 is a flow chart showing the detail of step (101) of Fig. 1 in an embodiment. Figure 3 is a schematic view showing the operation of the step (101) of Figure 1. Fig. 4 is a plan view (a) and a cross-sectional view (b) showing the appearance of a crater at each micro-recess. Fig. 5A is a detailed flow chart showing the step (102) of Fig. 1 in an embodiment. Figure 5B is a flow chart showing the detail of step (102) of Figure 1 in another embodiment 201232069. Figure 6 is a schematic diagram showing an operation of the step (102) of Figure 1. • Figure 7 shows a cross-sectional view (a) (b) (c) of various micro-recessed holes after step (102) in Figure 1. Fig. 8A is a flow chart showing the detail of step (102) of Fig. 1 in still another embodiment. Fig. 8B is a plan view showing the projections at the respective micro-recess holes being bombarded. Fig. 9A is a flow chart showing the detail of step (102) of Fig. 1 in another embodiment. Figure 9B shows another top view of the projections at each of the micro-recess holes being bombarded. Referring to Fig. 10, Fig. 10 is a view showing another operation of the step (102) of Fig. 1. FIG. 11 is a schematic view showing the appearance of a light guide plate. Fig. 12A is a schematic view showing the operation of printing an optical microstructure pattern by a stamping die in a change. • Fig. 12B is a schematic view showing the operation of printing an optical microstructure pattern in another variation of a stamping die. Fig. 13A is a flow chart showing a subsequent process of the optical microstructure pattern of the light guide plate of the present invention. FIG. 13B is a flow chart showing a subsequent method of fabricating the optical microstructure pattern of the light guide plate of the present invention in still another embodiment. [Description of main component symbols] 19 [S] 201232069 100 : Laser generator 700: press cylinder * 200: first laser beam 710: circumferential surface - 300: second laser beam 800: transfer plate 400, 401 402: Substrate 101-102: Step 410: Micro-recess 103: Step 420: Protrusion 104-105: Step 421: Reduced size protrusion 1011: Step 422: Micro-protrusion 1021: Step 423: Plane portion 1022-1023: Step® 430: recessed portion 1024: step 440: annular recessed portion 1025: step 500: light guide plate C: hour hand direction 510: first surface D1, D2: depth 520: second surface W1, W2: maximum aperture 530: third surface P: optical microstructure pattern 600: stamp template K: microhole pattern 20