201231860 六、發明說明： 【發明所屬之技術領域】 特別關於一種具有發光 本發明係關於一種發光農置 二極體晶粒的發光裝置。 【先前技術】 1有It:?體是由半導體材料所製成之發光元件，元件 :有::電極端子’在端子間施加電壓，通入極小的電 發釋出子電洞之結合，則可將剩餘能量以光的形式激 +同於一般白熾燈泡，發光 :屬冷發光，具有耗 · 狍姐碉々、赞无，具有$ =低、讀壽命長、無須暖燈時間、反應速度快等優點。 2上其體積小、耐震動、適合量產’容易配合應用上的 %求而製成極小或陣列式的模組，故可廣泛應用於昭明設 備、資訊、通訊、消費性電子產品的指示器及顯示裝置上 儼然成為曰常生活中不可或缺的重要元件之一。 請參照圖1所示，習知發光二極體組成的發光裝置1 包含-基板η、至少—發光二極體晶粒12以及—封膠體 13:圖1係以基板u上設置4只發光二極體晶粒，並 組成4個發光單元為例來說明。 其中，發光二極體晶粒12係設置於基板u之上表面 U1，並利用打線12ι與基板1]t上表面U1的線路層（圖 未顯不）電性連接，藉由線路層電性連接至外部電路，以 驅動發光裝置1。另外，封膠體13係分別覆蓋發光二極 201231860 晶粒12，以保護發光二極體晶粒12免受灰塵、或水氣、 或異物等污染而影響其發光特性。 然而，當發光裝置1作為顯示裝置時，不同的發光單 元之間的光線會彼此影響而造成干擾（cross talk )。另外， 發光單元的光線利用率也不高。 -因此，如何提供一種發光裝置，可避免發光單元彼此 _ 光線干擾的問題，又可提高光線利用率，已成為當前重要 課題。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種可避免發 光單元彼此光線干擾的問題，又可提高光線利用率之發光 裝置。 為達上述目的，依據本發明之一種發光裝置包含至少 一基板、複數發光單元、至少一凸出物以及一反射材料。 基板係具有一基板本體及一圖案化層，圖案化層設置於基 板本體。發光單元係設置於基板，各發光單元具有至少一 發光二極體晶粒，發光二極體晶粒係設置於基板，並與基 板電性連接。凸出物係對應設置於至少一發光單元的周 圍，凸出物實質上對位設置於圖案化層。反射材料係設置 於凸出物。 在本發明之一實施例中，發光二極體晶粒係以打線接 合或覆晶接合設置於基板。 在本發明之一實施例中，基板本體具有一上表面及一 201231860 下表面，圖案化層設置於基板本體之上表面，且基板具有 另一圖案化層設置於基板本體之下表面。 在本發明之一實施例中，基板本體具有至少一與凸出 物對位設置之通孔，通孔連接圖案化層及另一圖案化層。 在本發明之一實施例中，凸出物係為導體或絕緣體。 在本發明之一實施例中，當凸出物為複數時，兩相鄰 凸出物之間具有一間隙或無間隙。 在本發明之一實施例中，凸出物係連續或不連續地對 應設置於各發光單元周圍。 在本發明之一實施例中，凸出物的高度係大於發光單 元。 在本發明之一實施例中，凸出物的高度係介於50微 米至800微米之間。 在本發明之一實施例中，反射材料設置於凸出物的方 法係包含電鐘、或貼附、或喷塗。 在本發明之一實施例中，反射材料的材質係包含金 屬、或環氧樹脂或二氧化鈦與樹脂之混合物。 在本發明之一實施例中，金屬係包含銀、或鉻、或鎳。 在本發明之一實施例中，發光裝置更包括一封裝材 料，其係覆蓋發光二極體晶粒，封裝材料摻雜有螢光體。 在本發明之一實施例中，設置凸出物對應於發光單元 周圍之方法係包含：將一間隔材料對應設置於圖案化層上 以及進行加熱，以形成凸出物。 在本發明之一實施例中，間隔材料對應設置於圖案化 201231860 層上的步驟，係藉由網印、或印刷、或塗佈、或噴墨製程、 或直接放置。 ，本發明之一實施例中，凸出物的材質係包含金屬、 金屬氧化物、樹脂或妙膠。 . 料在本發明之一實施例中，凸出物的高度係小於封裝材 在本發明之-實施例中，凸出物的高度係小於等 光單元。 x 在本發明之—實施例中，凸出物與基板係形成 角，夾角大於60度。 在本發明之—實施例中，發光裝置更包括—蓋板，其 與基板對向設置。 、 在本&明之—實施例中，蓋板係為透光，並包含一勞 光膜片或一螢光層。 -署述’依據本發明之發光裝置係藉由凸出物對應 二可：先早兀的周圍，藉此’當發光裝置作為顯示裳置 的問免不同發光單元之間的光線彼此影響而造成干擾 二極體晶Hi凸出物還可作為設置封裝材料至該等發光 本。〃的擋膠結構，以簡化製程並降低製作成 笋出的反射材料设置於凸出物可使發光二極體晶粒所 率，進而可提=反射仙而提高其出光效 邛土先裝置之光線利用率。 凸出::料I:::之材料與圖案化層之附著力係大於 ”基板本體之附著力，可讓凸出物自動與圖案 201231860 化層自動對Wangn)，大大提升製程效率並減少成 【實施方式】 以下將參照相關式’制依本發料佳實施例之發 光裝置，其中相同的元件將以相同的符號加以說明。 第一實施例 請同時參照目2A及圖2B所示，其中，12a為本發 明第-實施例之發光裝置2的俯視圖，而目2 β _ 2 A 中直線A-A的剖視圖。 發光裝置2包含至少-基板2卜複數發光單元 至少-凸出物23以及-反射材料24。本發明之發光裝置 2例如可為一顯示裝置、一交通號誌、—照明裝置、一指 示裝置、-廣告看板、-光條（lightbar)或1光模組: 於此’並不予限制其使用態樣。 基板21係具有一基板本體211及一圖案化層212，基 板本體2U具有-上表面及一下表面，而圖案化層2i2^ 置於基板本體211之上表面。其中，基板21可為部分透 光、完全透光或不透光，而其材質可包含玻璃、或藍寶石、 或石英、或陶瓷、或玻璃纖維、或樹脂性材料、或金屬、 或高分子材料。於此，基板21的材質並不予以限制，並 以一雙層之印刷電路板為例。另外，圖案化層212可為導 熱的金屬材質，例如銅、或銀、或金。於此，係以銅為例。 發光單元22係設置於基板21。於此，發光單元22係 201231860 以二維陣列排列方式設置於基板本體211之上表面為例。 當然’發光單元22也可是其它的設置方式，例如是—維 排列、環狀排列或不規則排列設置於基板21。其中，各發 光單元22具有至少一發光二極體晶粒221，而發光二極體 曰曰粒22丨係以打線接合（wire bonding)或覆晶接合（汛 • chip)設置於基板本體211之上表面’並與基板2丨電性^ . 接。 曰在本實施例中，各發光單元22係具有一發光二極體 曰曰粒221，且係以打線接合於基板21，並與線路層（圖未 頌示）a性連接，並非與上述的圖案化層212電性連接。 藉由線路層電性連接至驅動電路，以驅動發光裝置2。發 光單元22例如可為紫外光、紅光、或綠光、或藍光、^ 藍綠光、或其他會發出可見光的發光二極體晶粒22ι或其 、·且。，使付發光單元22所發出的光線為單色光 光（例如為白光）。 次為混色 凸出物23係對應設置於至少一發光單元㈣周圍， =此’各凸出物23係分職應設置於各發光單元22 ==成二維_排列。另外’凸㈣23可連續地 ^地設置於各發光單元22周圍，且凸出物U上 晴化層212。也就是說，有凸出物23設置： 处·即有®案化層212之士番甘 可形成一封閉曲结 中，連續的凸出物23 矩护、… 封閉曲線的形狀實質上可為方形、或 J ^形、或二角形、或六邊形、或多邊形。在本f 施例中，複數凸一係連續並分別對=於 201231860 2 2::圍’且凸出物2 3所形成的封閉曲線係以圓形 緣體制性。另外，凸出物23係、可為導體或絕 等^屈 包含金屬、金屬氧化物、樹脂或石夕膠 4，而金屬的材質例如可為錫或銅》 22用二”、圖3所不，將凸出物23對應設置於發光單元 周=法係可包含步驟s〇1〜s〇2，其中步驟_為: 夺—間隔材料對應設置於圖案㈣212 而步驟搬 為.進行加熱以形成凸出物23。於步驟 應設置於圖案化…，而設置的方式= ::印、或印刷、或塗佈、或喷墨製程或直接放置將 仏材枓设置於對應的圖案化層212Ji，於此，並不加以 限制。其中’間隔材料可使用容易取得之材料，例如華司 washer )，其材質例如可為錫或錫合金。於此，間 的材料係以錫為例。另外，間隔材料的形狀可為方形、圆 形或其他與圖案化層212配合的形狀’而其高度（厚度） 係可介於〇·1〜0.8mm之間。 、於步驟搬之加熱製程（例如：回焊）時，間隔材料 遇熱會部分熔化或全部熔化而對準圖案化層212，冷卻後 則形成固態的凸出物23，並使凸出物23實質上係對位嗖 置於圖案化層212上。值得-提的是，於回焊製程前^ 於圖案化層212之周圍，例如内側及（或）外側塗上一層 防焊層（solder resist layer)，以避免間隔材料遇熱熔化時 溢出圖案化層212。其中，防焊層係可為環氧樹脂，俗稱 綠漆。 10 201231860 因此右以材料為錫的間隔材料設置於材料為銅的圖 案層212上時，於間隔材料熱熔時，圖案化層212與間 P:材料之間會形成例如為錫化三銅（C屯Sn)或五錫化六 銅（CU6Sn5 )的介金屬化合物（Inter-Metal C〇mpound， IMC)°當間隔材料贿於基板21上，以形成凸出物u 寺門Μ才料會因為形成介金屬化合物之故而自動與圖案 ':匕？ 212 ?準。因此’藉由圖案化層212之設置，即可於 該等毛光早7〇 22的周圍形成自我對位（selfalignment)的 23 ’以避免習知技術中凸出物23直接利用機械或 先子對位設置時所產生的誤差，而無法精確地設置於該等 發光二極體晶粒321之周圍。 人 ⑼’上述凸出物23與圖案化層212之間的關係僅 ' =例說明’並非限制凸出物23與圖案化層212的= 更廣泛地說’本實施例之凸出物23可在圖案化層212上 =成自我對位的現象，係主要由於凸出物 案化層犯的附著力（adhesiQn)或親和 圖 的材料與基板本體211材料（圖荦、 勿23 刊丁 1Λ :¾疋圖案化層212周jfj好粗、 23 著於圖案化層212上，而非沪喑而材枓此附 外的周圍材料上。#擴放而溢出於圖案化層扣之 以基板21的材質為FR_4之電路板為例，他4 :二纖維混合環氧樹叫xy)而成’ ： 化層以及絕綠的綠漆。由於凸出物23與圖案化二圖， 附者力係大於凸出物23與玻璃纖維、或環氡樹脂、或綠 201231860 漆_著力，而使得凸出物23附著於圖案化層犯。 於凸物23之材料與圖案化層212之附著力係大 之材料與基板本體211之附著力，可讓凸出 物23之材料自動與圖案 率並減少成本。 于旱A大k升製程效 凸出圖2精示’兩相鄰發光單元22對應之該等 兩=:具有一間隙。當然，在其它的實施例中， 隙。Α中，若對應之§亥等凸出物23之間亦可無間 與相鄰凸出物23之間具有-間隙， 程時’凸出物23對基板2!所產生的應 乂二基板21較不易產生翹曲現象而影響產品品質。 亩θ Π糾凸出物23與基板21之間係形成一夾角θ，夾 角二對=極體晶粒221 ’其中，夹角㊀係大於仙 角度係介於1〇0度至140度，以 由光二極體晶粒221所發出的光線，藉 由反射材料24反射出光。若炫_ 上表面之接觸& f 狀的間隔材料與基板21 矛面之接觸角（c〇ntactangle)h，於凝固後 α係大致不變，則接觸角α與夾角㊀實質上 一❹由於反射材料24的厚度相當薄，= ==1之間的夾角θ’幾乎等於凸出物23加反射 材枓24與基板21之間的夹角。 此外，凸出物23的高度係可介於 之間’並且大於發光單元22的高度。例如。201231860 VI. Description of the Invention: [Technical Field of the Invention] In particular, the present invention relates to a light-emitting device for a light-emitting agricultural diode. [Prior Art] 1 It: The body is a light-emitting element made of a semiconductor material, and the element: has: the electrode terminal 'applies a voltage between the terminals, and a small electric hair is released to combine the sub-holes. The remaining energy can be excited in the form of light + the same as the ordinary incandescent bulb, illuminating: it is cold illuminating, has the consumption · 狍 碉々 碉々, praise, with $ = low, long reading life, no need for warming time, fast response Etc. 2 It is small in size, shock-resistant, and suitable for mass production. It is easy to use with the application of % to make a very small or array module, so it can be widely used in Zhaoming equipment, information, communication, consumer electronics indicators And the display device has become one of the important components that are indispensable in normal life. Referring to FIG. 1 , a conventional light-emitting device 1 comprising a light-emitting diode comprises a substrate η, at least a light-emitting diode die 12 and a sealant 13 : FIG. 1 is configured to provide four light-emitting diodes on the substrate u. The polar crystal grains and four light-emitting units are taken as an example for illustration. The light-emitting diode die 12 is disposed on the upper surface U1 of the substrate u, and is electrically connected to the circuit layer (not shown) of the upper surface U1 of the substrate 1] by using the wire 12, by the circuit layer electrical property. It is connected to an external circuit to drive the light-emitting device 1. In addition, the encapsulant 13 covers the light-emitting diode 201231860 die 12 to protect the light-emitting diode die 12 from dust, moisture, or foreign matter and affect its light-emitting characteristics. However, when the light-emitting device 1 is used as a display device, light rays between different light-emitting units may influence each other to cause a cross talk. In addition, the light utilization rate of the light-emitting unit is not high. - Therefore, how to provide a light-emitting device can avoid the problem that the light-emitting units interfere with each other and improve the light utilization efficiency, which has become an important issue at present. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a light-emitting device which can avoid the problem of light interference between light-emitting units and improve light utilization. To achieve the above object, a light-emitting device according to the present invention comprises at least one substrate, a plurality of light-emitting units, at least one protrusion, and a reflective material. The substrate has a substrate body and a patterned layer, and the patterned layer is disposed on the substrate body. The light emitting unit is disposed on the substrate, and each of the light emitting units has at least one light emitting diode die, and the light emitting diode die is disposed on the substrate and electrically connected to the substrate. The protrusions are disposed corresponding to the periphery of the at least one light-emitting unit, and the protrusions are substantially aligned with the patterned layer. The reflective material is disposed on the projections. In one embodiment of the invention, the light emitting diode dies are disposed on the substrate by wire bonding or flip chip bonding. In one embodiment of the invention, the substrate body has an upper surface and a lower surface of the 201231860, the patterned layer is disposed on the upper surface of the substrate body, and the substrate has another patterned layer disposed on the lower surface of the substrate body. In an embodiment of the invention, the substrate body has at least one through hole disposed opposite the protrusion, and the through hole connects the patterned layer and the other patterned layer. In an embodiment of the invention, the projections are conductors or insulators. In an embodiment of the invention, when the projections are plural, there is a gap or no gap between the two adjacent projections. In an embodiment of the invention, the projections are disposed continuously or discontinuously around the respective lighting units. In one embodiment of the invention, the height of the projections is greater than the illumination unit. In one embodiment of the invention, the height of the projections is between 50 microns and 800 microns. In one embodiment of the invention, the method of providing the reflective material to the projections comprises an electric clock, or attaching, or spraying. In one embodiment of the invention, the material of the reflective material comprises a metal, or an epoxy resin or a mixture of titanium dioxide and a resin. In an embodiment of the invention, the metal system comprises silver, or chromium, or nickel. In an embodiment of the invention, the light emitting device further comprises a package material covering the light emitting diode die, the package material being doped with a phosphor. In an embodiment of the invention, the method of providing protrusions corresponding to the periphery of the light-emitting unit comprises: disposing a spacer material on the patterned layer and heating to form the protrusions. In one embodiment of the invention, the spacer material is correspondingly disposed on the patterned 201231860 layer by screen printing, or printing, or coating, or ink jet processing, or direct placement. In one embodiment of the invention, the material of the protrusions comprises a metal, a metal oxide, a resin or a fine glue. In one embodiment of the invention, the height of the projections is less than the encapsulant. In the embodiment of the invention, the height of the projections is less than the iso-optical unit. x In an embodiment of the invention, the projections form an angle with the substrate system at an included angle greater than 60 degrees. In an embodiment of the invention, the illumination device further includes a cover plate disposed opposite the substrate. In the embodiment of the present invention, the cover is light transmissive and comprises a working film or a phosphor layer. - the description of the illuminating device according to the present invention by means of the projections corresponding to two: the early squatting around, thereby 'when the illuminating device is used as a display skirt to avoid the influence of light between different lighting units The interfering diode crystal Hi protrusions can also serve as a packaging material to the illuminants.挡 挡 结构 , , 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化 简化Light utilization. Protrusion: The adhesion of the material I::: and the patterned layer is greater than the adhesion of the substrate body, so that the protrusions automatically and the pattern 201231860 automatically layer to Wangn, greatly improving the process efficiency and reducing the [Embodiment] Hereinafter, a light-emitting device according to a preferred embodiment of the present invention will be referred to, and the same elements will be described with the same reference numerals. The first embodiment is also referred to the items 2A and 2B, wherein 12a is a plan view of the light-emitting device 2 of the first embodiment of the present invention, and a cross-sectional view of the line AA of the object 2 β _ 2 A. The light-emitting device 2 includes at least a substrate 2, a plurality of light-emitting units, at least a protrusion 23, and a reflection. Material 24. The light-emitting device 2 of the present invention may be, for example, a display device, a traffic sign, a lighting device, a pointing device, an advertising billboard, a light bar or a light module: The substrate 21 has a substrate body 211 and a patterned layer 212. The substrate body 2U has an upper surface and a lower surface, and the patterned layer 2i2 is disposed on the upper surface of the substrate body 211. The substrate 21 can be The light is transparent, completely transparent or opaque, and the material thereof may include glass, or sapphire, or quartz, or ceramic, or glass fiber, or a resinous material, or a metal, or a polymer material. The material is not limited, and a double-layer printed circuit board is taken as an example. In addition, the patterned layer 212 may be a heat conductive metal material such as copper, silver, or gold. Here, copper is taken as an example. The light-emitting unit 22 is disposed on the substrate 21. Here, the light-emitting unit 22 is disposed on the upper surface of the substrate body 211 in a two-dimensional array arrangement. The light-emitting unit 22 may also be other arrangement manners, for example, Arranging, ring-shaped or irregularly arranged on the substrate 21. The light-emitting unit 22 has at least one light-emitting diode die 221, and the light-emitting diode particles 22 are wire bonded or The flip chip is disposed on the upper surface of the substrate body 211 and electrically connected to the substrate 2. In this embodiment, each of the light emitting units 22 has a light emitting diode 221 And playing The wire is bonded to the substrate 21 and is connected to the circuit layer (not shown), and is not electrically connected to the patterned layer 212. The circuit layer is electrically connected to the driving circuit to drive the light-emitting device 2. The unit 22 can be, for example, ultraviolet light, red light, or green light, or blue light, blue-green light, or other light-emitting diode crystals 22 i that emit visible light, or the light-emitting unit 22 The light is monochromatic light (for example, white light). The second color mixing protrusion 23 is correspondingly disposed around at least one light emitting unit (4), and the 'parts 23' are assigned to each light emitting unit 22 = = into two dimensions _ arrangement. Further, the 'convex (four) 23 may be continuously disposed around each of the light-emitting units 22, and the protrusion U may be etched over the layer 212. That is to say, there is a protrusion 23 provided: at that point, there is a case layer 212, the sage can form a closed curve, the continuous protrusion 23 is protected, the shape of the closed curve can be substantially Square, or J-shaped, or digonal, or hexagonal, or polygonal. In the present embodiment, the plurality of convex lines are continuous and respectively formed by a closed curve of = 201231860 2 2:: and the protrusions 2 3 are circularly rounded. In addition, the protrusion 23 can be a conductor or an absolute material including a metal, a metal oxide, a resin or a Shijiao 4, and the material of the metal can be, for example, tin or copper. The protrusions 23 are correspondingly disposed on the periphery of the light-emitting unit. The legal system may include steps s〇1 to s〇2, wherein the step _ is: the spacer-space material is correspondingly disposed on the pattern (four) 212 and the step is carried out to perform heating to form a convexity. Output 23. In the step should be set in the pattern ..., and the way of setting =: printing, or printing, or coating, or inkjet process or direct placement of the coffin 枓 on the corresponding patterned layer 212Ji, There is no limitation to this. In the case where the spacer material can be easily obtained, for example, a washer, the material thereof can be, for example, tin or a tin alloy. Here, the material is tin as an example. The shape may be square, circular or other shape matching the patterned layer 212 and its height (thickness) may be between 〇·1~0.8mm. The heating process is carried out in the step (for example: reflow) When the spacer material is partially melted or completely melted by heat The alignment of the patterned layer 212, after cooling, forms a solid protrusion 23, and the protrusion 23 is substantially aligned on the patterned layer 212. It is worth mentioning that before the reflow process Applying a solder resist layer around the patterned layer 212, for example, the inner side and/or the outer side, to prevent the spacer material from overflowing the patterned layer 212 when it is thermally melted, wherein the solder resist layer can be Epoxy resin, commonly known as green lacquer. 10 201231860 Therefore, when the material is tin-based spacer material is disposed on the copper pattern layer 212, when the spacer material is hot-melted, between the patterned layer 212 and the interlayer P: material Forming a metal-intercal compound (Inter-Metal C〇mpound, IMC) such as tin-copper (C屯Sn) or bismuth hexa-copper (CU6Sn5). When the spacer material is bribed on the substrate 21, a protrusion is formed. u The temple threshold is automatically matched with the pattern ':匕? 212' because of the formation of the intermetallic compound. Therefore, by the setting of the patterned layer 212, it is possible to form self around these hairs 7:22. 23' of selfalignment to avoid protrusions in the prior art 23 The error caused by the mechanical or the erect alignment is not accurately set around the illuminating diode 321 . The relationship between the protrusion (23) and the patterned layer 212 Only '=illustration' does not limit the protrusion 23 and the patterned layer 212. More broadly, the protrusion 23 of the present embodiment can be self-aligned on the patterned layer 212, mainly due to The adhesion of the projective layer (adhesiQn) or the material of the affinity map and the material of the substrate body 211 (Fig. 荦, 勿23 刊丁1Λ: 3⁄4疋 patterned layer 212 weeks jfj is thick, 23 is in the patterned layer On the 212, instead of the Humin, it is on the surrounding materials. #Expanding and overflowing the patterned layer buckle. The circuit board of the substrate 21 having the material of FR_4 is taken as an example. He 4: a two-fiber mixed epoxy tree is called xy): a layer and a greenish green paint. Due to the protrusions 23 and the patterned two figures, the attachment force is greater than the protrusions 23 and the glass fibers, or the toroidal resin, or the green paint, so that the protrusions 23 are attached to the patterned layer. The adhesion of the material of the protrusion 23 to the patterning layer 212 and the adhesion of the material to the substrate body 211 allows the material of the protrusion 23 to be automatically and patterned, and the cost is reduced. In the dry A large k-lift process, the embossing of Figure 2 shows that the two adjacent light-emitting units 22 correspond to the two =: have a gap. Of course, in other embodiments, the gap. In the middle, if there is a gap between the corresponding protrusions 23 and the adjacent protrusions 23, the two substrates 21 generated by the protrusions 23 on the substrate 2! It is less prone to warpage and affects product quality. Between the θ θ Π 凸 23 23 and the substrate 21 form an angle θ, the angle of the two pairs = the polar body 221 ′ where the angle is greater than the angle of the fairy is between 1 〇 0 degrees to 140 degrees, Light emitted by the photodiode die 221 reflects light by the reflective material 24. If the contact angle between the contact surface of the upper surface and the surface of the substrate 21 is c@ntactangle h, the α angle is substantially unchanged after solidification, and the contact angle α is substantially the same as the angle The thickness of the reflective material 24 is relatively thin, and the angle θ' between ===1 is almost equal to the angle between the protrusion 23 and the reflective material 枓24 and the substrate 21. Further, the height of the protrusions 23 may be between and greater than the height of the light emitting unit 22. E.g.
時，凸出物23的高度約為15。微米;於打線接合LI 201231860 出物23的高度約為微米’以避免各發光單以2所發 出之光線與相鄰的發光單元22互相干擾的問題。 & ^反射材制係設置於凸出物23，於此，反射材料μ 係設置於凸出物23之表面，且覆蓋凸出物23之外表面為 例。當然，在其它的實施例中，反射材料24亦可設置於 凸出物23之部分表面即可（例如内側表面）。本發明並不 限制反射材料24設置於凸出物23之全部或部㈣表面， 只要可協助將發光單元22所發出的光線反射並射出即可。 、反射材料24設置於凸出物23的方法係可包含電鑛、 或貼附、或喷塗’於此’並不限制其設置方式。料，反 射材料24的材質係可包含金屬、或環氧樹脂、或二氧化 鈦（叫)—與樹脂之混合物。而金屬係可包含銀、或絡、 或鎳’本貫施例係以銀為例。特別說明的是，當採用電鍵 方式設置反射材料24時’若兩凸出物23之間具有間隙，又 則需以導線將所有凸出物23連接導通，以利電”㈣ 進行。 因此，本發明將反射材料24設置於凸出物23，可使 發光二極體晶粒221所發出的光線藉由反射材料24的反 射作用而提高其出光效率，進而可提升發光裂置2之光線 利用率。 另外’發光裝置2更可包括一縣材料25，其係覆蓋 發光二極體晶粒221。其中，封裝材料25可摻雜有營光物 質。螢光物質受發光二極體晶粒221激發且光線在混光 後，可使發光裝置2產生所需要的色光，例如為白光。而 201231860 凸出物23 “度係可大於封裝材料25，以成為封裂材料 25的擔牆’猎輯牆的設置可簡化製程並降低料 營光物質的用量，進一步達成製作成本大幅降低的目的。 置二:本t明之發光裝置2係藉由凸出物23對應設 =先…的周圍’藉此，當發光裝置2作為顯示 f置時’可避免不同發光單元22之間的光線彼此影響而 =成干擾的問題。當發光裝置2作為背光模組時，凸出物 23則可，為設置封裝材料25至該等發光二極體晶粒切 之上的料結構，藉此可簡化製程並降低製作成本。另 夕曰卜’反射材料24設置於凸出物23之表面可使發光二極體 1 22!所發出的光線藉由反射材料24的反射作用而提 尚其出光效率’進而可提升發光裝置2之光線利用率。 另外，凸出物的高度也可視使用者的需求而加以調 7明〜圖4A所不’圖4A為另一態樣之發光 & 的剖視圖。 與發光裝置2不同的是，發光裝置2a之凸出物咖 =錢小糾裝材料25a。換言之，封歸料…係完 王後盍發光早70 22及凸出物仏。而凸出物23a的高度也 可小於或等於發光單元22。藉此，使凸出物23a不會因高 度較南而影響發光單元22的出光角度。 接者’睛參照圖4B所示，其為另一態樣之發光裝置 2b的剖視圖。 曰與發光裝置2不同的是，發光裝置2b之發光二極體 B曰粒221及凸出物23係設置於圖案化層212b上。另外， 201231860 基板21b更可具有另-圖案化層213，其係設置於基板本 體211之下表面。此外，基板本體211更可具有至少一與 凸出物23對位設置之通孔〇，而通孔〇係連接圖案化層 212b及基板本體211下表面之另一圖案化層213。其中， 圖案化層212及另一圖案化層213的材料分別為導熱良好 的金屬（例如銅）。當然，通孔〇内亦含有導熱良好的金 屬，例如為銅。 藉由圖案化層212b、213及通孔〇的設置可使發光二 極體晶粒211所產生的熱量經由圖案化層212b及通孔〇 導引至基板本體211下表面之另一圖案化層213，以增加 放熱面積，協助發光二極體晶粒211的散熱，藉此，可提 尚發光裝置2b的使用壽命。值得一提的是，雖然發光二 極體晶粒221係設置於圖案化層212b上，但並未與圖案 化層212b電性連接，與發光二極體晶粒221電性連接的 線路層（圖中未顯示），則亦設置於基板本體211的上表 面或下表面。在其它的實施例中，發光二極體晶粒221可 覆晶接合於基板21並直接設置線路層上。 請參照圖4C至圖4G所示，其分別為本發明另一態樣 之發光裝置2c至2g的俯視圖。 如圖4C所示，發光裝置2c之凸出物23c係連續地並 分別對應設置於各發光單元22的周圍，而其形狀係為方 形，且兩相鄰凸出物23c之間亦具有一間隙。而反射材料 24c係設置於凸出物23c之表面。當然，反射材料2牝也 可只设置於凸出物23c之内側表面。 201231860 如圖4D所示，發光裝置2d之凸出物23d係不連續地 但分別對應設置於各發光單元22的周圍，且兩相鄰凸出 物23d之間係具有一間隙。其中，不連續之意係表示設置 於各發光單元22的周圍之凸出物23d係具有斷開的部 分，可以說是有複數個凸出物23d對應設置於一發光單元 22的周圍，而反射材料24d係設置於凸出物23d之内側表 面。 如圖4E所示，發光裝置2e之凸出物23e係連續地並 分別對應設置於各發光單元22的周圍，而其形狀係為方 形陣列，且兩相鄰凸出物23e之間係無間隙。而反射材料 24e係設置於凸出物23e之表面。當然，反射材料24e也 可只設置於凸出物23e之内側表面。再者，凸出物23e之 材質係可為電導體且電性接地，以作為發光單元22之靜 電保護。 如圖4F所示，與圖4B之發光裝置2b不同的是，各 發光單元22f係分別具有二個發光二極體晶粒221。而反 射材料24f係設置於凸出物23f之表面。當然，反射材料 24f也可只設置於凸出物23f之内側表面。 另外，如圖4G所示，發光裝置2g之一凸出物23g係 連續地並分別對應設置於複數發光單元22g的周圍，而凸 出物23g之形狀係為方形，而反射材料24g係設置於凸出 物23g之表面。當然，反射材料24g也可只設置於凸出物 23g之内側表面。其中，各發光單元22g係分別具有複數 且呈一維直線排列之發光二極體晶粒221。換言之，發光 16 201231860 裝置2g係、為—光條（nghtbar)，基板2ι之尺寸大小，可 視需求裁切，甚至可與凸出物23g所圍繞的面積一樣大。 '出物23g還可作為封膠的擒牆結構，並可防止溢膠。 當複數發光裝置2g並排設置時，則可以組成大面積的發 光裝置。 此外，發光裝置2a至2g的其它技術特徵可參照發光 • 裝置2,於此不再贅述。 、x 第二實施例 月…'、圖5所示’其為本發明第二實施例之發光裝置 3的剖視圖。在本實施例中’發光裝置3係以顯示裝置為 例來說明。 ..發光裝置3與發光裝置2主要的不同在於，發光裝置 ‘ 3之發光二極體晶粒321係以覆晶接合設置於基板另 外’發光裝置3更可具有一蓋板36，其與基板3ι對向設 置以保護該等發光單元32。其中，蓋板36可為板材（紙 如et)或膜片（_)，並可為透光或部分透光。在本實施 例中，蓋板36係為透光，並可包含一營光膜片或一營光 層（圖未顯示）’以使發光裝置3形成所需之色光。 另外，各發光單元32可包含紅光、藍光以及綠光等 三個發光二極體晶粒321，即可混光而形成白光。當然， 發光二極體晶粒3 21的數量4可L7 η J双里乜了以疋四個，例如二個紅光 的發光二極體晶粒32卜再配上一個綠光和一個藍光的發 先二極體晶粒32卜由於，發光二極體晶粒321之尺寸較 小，故可使得發光單元32的尺寸大幅縮小，以使發光單 201231860 兀32對（之晝素的尺寸縮小’例如晝素的尺寸可只 0.5麵至！_，以提高顯示裝置的解析度。 盍板36之材f可包含玻璃、或藍寶石、或石英、或The height of the projections 23 is about 15. Micron; the height of the output 23 of the wire bonding LI 201231860 is about micrometers' to avoid the problem that the light emitted by each of the light-emitting sheets interferes with the adjacent light-emitting units 22 by two. The & ^ reflective material system is provided on the projections 23, and the reflective material μ is provided on the surface of the projections 23, and covers the outer surface of the projections 23 as an example. Of course, in other embodiments, the reflective material 24 may be disposed on a portion of the surface of the projection 23 (e.g., the inner surface). The present invention is not limited to the fact that the reflective material 24 is disposed on all or part (4) surfaces of the projections 23 as long as it can assist in reflecting and emitting light emitted from the light-emitting unit 22. The method in which the reflective material 24 is disposed on the projections 23 may include electro-mine, or attachment, or spray coating, and the manner in which it is disposed is not limited. The material of the reflective material 24 may comprise a metal, or an epoxy resin, or a mixture of titanium dioxide (or) and a resin. The metal system may comprise silver, or a network, or a nickel. The present embodiment is exemplified by silver. In particular, when the reflective material 24 is disposed by a magnetic key method, 'if there is a gap between the two protrusions 23, then all the protrusions 23 need to be connected and connected by wires to facilitate the electricity" (4). In the invention, the reflective material 24 is disposed on the protrusion 23, so that the light emitted by the LED 221 can improve the light extraction efficiency by the reflection of the reflective material 24, thereby improving the light utilization efficiency of the light-emitting crack 2. In addition, the illuminating device 2 may further include a county material 25 covering the illuminating diode 221. The encapsulating material 25 may be doped with a camping material. The phosphor is excited by the illuminating diode 221 And after the light is mixed, the light-emitting device 2 can generate the desired color light, for example, white light. And 201231860, the protrusion 23 can be larger than the packaging material 25 to become the wall of the sealing material 25 The setting can simplify the process and reduce the amount of light materials used in the camp, further achieving the goal of greatly reducing the production cost. Secondly, the illuminating device 2 of the present invention is provided by the protrusions 23 corresponding to the vicinity of the first ... thereby, when the illuminating device 2 is set as the display f, the light between the different illuminating units 22 can be prevented from affecting each other. = the problem of interference. When the light-emitting device 2 is used as a backlight module, the protrusions 23 can be used to set the package material 25 to the material structure of the light-emitting diodes, thereby simplifying the process and reducing the manufacturing cost. In addition, the reflective material 24 is disposed on the surface of the protrusion 23 so that the light emitted by the light-emitting diode 1 22! can improve the light-emitting efficiency by the reflection of the reflective material 24, thereby improving the light-emitting device 2 Light utilization. Further, the height of the projections can also be adjusted according to the needs of the user. Fig. 4A is a cross-sectional view of another embodiment of the illumination & Different from the light-emitting device 2, the convex material of the light-emitting device 2a is a small small correction material 25a. In other words, the seal is returned... After the Queen, the 盍 glows 70 22 and the bulge. The height of the protrusion 23a may also be smaller than or equal to the light emitting unit 22. Thereby, the projection 23a does not affect the light-emitting angle of the light-emitting unit 22 because the height is relatively south. The operator's eye is shown in Fig. 4B, which is a cross-sectional view of another aspect of the light-emitting device 2b. Unlike the light-emitting device 2, the light-emitting diodes B 221 and the protrusions 23 of the light-emitting device 2b are provided on the patterned layer 212b. In addition, the 201231860 substrate 21b may further have a further patterned layer 213 disposed on the lower surface of the substrate body 211. In addition, the substrate body 211 may further have at least one through hole 对 disposed opposite to the protrusion 23, and the through hole 〇 is connected to the patterned layer 212b and another patterned layer 213 on the lower surface of the substrate body 211. The material of the patterned layer 212 and the other patterned layer 213 are respectively metals (such as copper) that conduct heat well. Of course, the through-holes also contain a metal with good thermal conductivity, such as copper. The heat generated by the LED 211 can be guided to the other patterned layer on the lower surface of the substrate body 211 via the patterned layer 212b and the via hole 藉 by the arrangement of the patterned layers 212b and 213 and the via hole 〇. 213, in order to increase the heat release area, to assist heat dissipation of the light-emitting diode die 211, thereby improving the service life of the light-emitting device 2b. It is to be noted that although the LED 221 is disposed on the patterned layer 212b, it is not electrically connected to the patterned layer 212b, and is electrically connected to the LED 221 of the LED 221 ( It is also provided on the upper surface or the lower surface of the substrate body 211. In other embodiments, the LED die 221 can be flip-chip bonded to the substrate 21 and disposed directly on the wiring layer. 4C to 4G, which are respectively plan views of the light-emitting devices 2c to 2g of another aspect of the present invention. As shown in FIG. 4C, the protrusions 23c of the light-emitting device 2c are continuously and correspondingly disposed around the respective light-emitting units 22, and the shape thereof is square, and there is also a gap between the two adjacent protrusions 23c. . The reflective material 24c is provided on the surface of the projection 23c. Of course, the reflective material 2牝 may be provided only on the inner side surface of the projection 23c. As shown in FIG. 4D, the projections 23d of the light-emitting device 2d are discontinuously disposed correspondingly around the respective light-emitting units 22, and have a gap between the two adjacent projections 23d. The discontinuity means that the protrusion 23d disposed around each of the light-emitting units 22 has a broken portion. It can be said that a plurality of protrusions 23d are disposed correspondingly around a light-emitting unit 22, and the reflection is The material 24d is provided on the inner side surface of the projection 23d. As shown in FIG. 4E, the protrusions 23e of the light-emitting device 2e are continuously and correspondingly disposed around the respective light-emitting units 22, and the shapes thereof are square arrays, and there is no gap between the two adjacent protrusions 23e. . The reflective material 24e is provided on the surface of the projection 23e. Of course, the reflective material 24e may be provided only on the inner side surface of the projection 23e. Furthermore, the material of the protrusion 23e can be an electrical conductor and electrically grounded to serve as an electrostatic protection for the light-emitting unit 22. As shown in Fig. 4F, unlike the light-emitting device 2b of Fig. 4B, each of the light-emitting units 22f has two light-emitting diode crystal grains 221. The reflective material 24f is provided on the surface of the projection 23f. Of course, the reflective material 24f may be provided only on the inner side surface of the projection 23f. Further, as shown in FIG. 4G, one of the projections 23g of the light-emitting device 2g is continuously and correspondingly disposed around the plurality of light-emitting units 22g, and the shape of the projections 23g is square, and the reflective material 24g is disposed at The surface of the projection 23g. Of course, the reflective material 24g may be provided only on the inner side surface of the projection 23g. Each of the light-emitting units 22g has a plurality of light-emitting diode dies 221 arranged in a one-dimensional line. In other words, the illumination 16 201231860 device 2g is a nghtbar, and the size of the substrate 2 ι can be cut as needed, even as large as the area surrounded by the projection 23g. 'Export 23g can also be used as a sealing wall structure and can prevent overflow. When the plurality of light-emitting devices 2g are arranged side by side, it is possible to constitute a large-area light-emitting device. Further, other technical features of the light-emitting devices 2a to 2g can be referred to the light-emitting device 2, and will not be described again. The second embodiment is shown in Fig. 5, which is a cross-sectional view of the light-emitting device 3 of the second embodiment of the present invention. In the present embodiment, the light-emitting device 3 is described by taking a display device as an example. The main difference between the illuminating device 3 and the illuminating device 2 is that the illuminating diode 321 of the illuminating device '3 is provided on the substrate by flip-chip bonding. The illuminating device 3 can further have a cover 36, which is combined with the substrate. The 3 ι is arranged to protect the light-emitting units 32. The cover plate 36 may be a plate (paper such as et) or a diaphragm (_), and may be light transmissive or partially transparent. In the present embodiment, the cover 36 is light transmissive and may include a luminaire or a battalion (not shown) to cause the illuminating device 3 to form the desired chromatic light. In addition, each of the light-emitting units 32 may include three light-emitting diode crystal grains 321 such as red light, blue light, and green light, that is, light may be mixed to form white light. Of course, the number 4 of the light-emitting diode grains 3 21 can be L7 η J double-twisted with four, for example, two red light-emitting diode crystal grains 32 are further provided with a green light and a blue light. Since the size of the light-emitting diode die 321 is small, the size of the light-emitting diode 32 can be greatly reduced, so that the light-emitting single 201231860 兀32 pairs (the size of the halogen element is reduced' For example, the size of the halogen can be only 0.5 to ~_ to improve the resolution of the display device. The material f of the seesaw 36 can comprise glass, or sapphire, or quartz, or
Si :=璃纖維、或樹脂性材料、或高分子材料等透光 ^ ； 以蓋板36為破璃基板為例。因此，該等發 光單元32所發出之部分光線可經由反射j 光裝置3職㈣畫Γ 的出光側觀看發 36之了封裝材料35之外，亦可在基板31與蓋板 36之間填充液體’以增加發光單元％之導熱性， 液體可為高導熱材質。在選用液體時，應考慮絕緣性、腐 餘!生凝固點、熱膨m等特性，於此可翻油類或溶 劑類，油類例如為礦物油、切油（Silie_⑹）或甘油 (Glycerol) ’溶劑類例如為三曱苯（Mes办_)。彳 此外’發光裝置3更可包含至少—驅動元件（圖未顯 不及一連結勝37。驅動元件可相對於該等發光二極體晶 粒321叹置於基板31的另一側。驅動元件係用以驅動該 等毛光一極體晶粒32卜驅動元件例如包含一驅動積體電 路（ DnverIC)。若驅動元件為晶粒，則可利用打線接合或 设曰曰接σ方式⑶置於基板31 ;若驅動元件為封裝體或表面 接合元件，則可以表面接合方式設置於基板31。 連結膠37亦可稱為框膠，其係設置於基板31與蓋板 36之間’並連結基板31與蓋板36。連結膠37可例如為 底部填充膠（underfilUdhesive)，並可利用毛細現象參入 201231860 基板31與蓋板36之間；當然，連結膠37亦可塗佈於基 板31或蓋板36後，再將基板31與蓋板36進行貼合。連 結膠37的材質例如包含矽膠或環氧樹脂，以保.護發光裝 置3免於水氣或異物侵入而影響其發光效能及其壽命。值 得一提的是，若連結膠37之密封性良好，也可省略設置 . 封裝材料35的製程，以減少製造程序及降低製作成本。 . 此外，發光裝置3之其它技術特徵可參照發光裝置2, 於此不再贅述。 第三實施例 請參照圖6A及圖6B所示，其中，圖6A為本發明第 三實施例之發光裝置4的俯視圖，圖6B為發光裝置4之 . 該等基板41連接處的部分放大示意圖。發光裝置4包含 4 複數基板41及一蓋板46。各基板41具有複數發光單元 — 42。其中，基板41、發光單元42、凸出物43、反射材料 44、封裝材料45及蓋板46可參照上述所有實施例之技術 特徵或其技術特徵之組合，於此不再贅述。 該等基板41可以側邊相互鄰接或相互連結（tiling)， 而構成一大面積的顯示裝置，其中，相互鄰接時，基板41 * 可藉由連接元件（例如框架）、或利用黏合、或卡合等方 ‘ 式而與另一基板41相拼接，再與一蓋板46相互結合並形 成發光裝置4。其中，除可先利用另一個外框將四個基板 41抵接組合外，或可利用另一個比基板41還大面積的承 載板（圖中未顯示），以將四個基板41固定在承載板上， 再將該等基板41與蓋板46相互結合，以形成一大面積的 19 201231860 顯示裝置、照明裝置或背光源。需注意的是’各基板4i 於此係以-矩形為例，但也可以是圓形、搞圓形、其他多 邊形或是例如拼圖中的凹多邊形，而承載板可為透光或不 透光材質。另外，基板41的數量係非限制性，依不同的 設計與要求可有不同的個數及組合。 若兩基板41直接連接日夺，由於相鄰的基板y之間益 故無任何接縫產生’進而能提升發光裝置4的顯： «口負，且由於無縫拼接，當相鄰之基板41拼接時，分別 在各基板41上之發光單元42的發光二極體係為晶粒，故 各發光單元42之間隙可縮小至〇 3刪至lmm。因此，位 :不同基板41上，最罪近的兩個發光單元之間隙可控 制為人，、中基板41上之兩相鄰發光單元42之間隙相 同。由於該等發光單元42為排列規律，且拼接處不同基 板41之間的發光單元42也具有相同的間隙，因此人眼看 不出拼接痕跡，可提高發光裝置4之品質。 另外，在本實施例中，蓋板46之尺寸係大於基板4ι 的尺寸，若是由複數蓋板46與複數基板4 二:則蓋板46之尺寸要小於等於一基板41:= 使得該等基板q可以側邊相互鄰接或相互連結而構成大 面積的顯示裝置、照明裝置或背光模組。另外，本實施例 之發光裝置4除了可為矩陣拼接之外，亦可為條狀拼接或 以其他形狀來拼接。 执綜上所述，依據本發明之發光裝置係藉由凸出物對應 叹置於發光單元的周圍，藉此，當發光裝置作為顯示裝置 20 201231860 7 ’可避免不同發光單元之_光線彼此影響而造成 :::Γ，凸出物還可作為設置封裝材料至該等發光 曰曰;:之上的擋膠結構’以簡化製程並降低製作成 =另外’反射材料設置於凸出物可使發光二極體晶粒所 :先線猎由反射材料的反射作用而提高其出光效 率，進而可提升發光裝置之光線利用率。 此外藉由凸出物之材料與圖案化層之附著力係大於 凸出物材料與基板本體之附著力，可讓凸出物自動與圖案 :層自動對準㈤f_align)，大大提升製程效率並減少成 0 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與料，㈣其崎之等效似或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為習知一種發光裝置的示意圖； 圖2A為本發明第一實施例之發光裝置的俯視圖； 圖2B為圖2A中，直線Α·Α的剖視圖； 圖3為本發明之凸出物對應設置於發光單元周圍的流 程圖； 圖4Α至圖4Β為本發明另一態樣之發光裝置的剖 圖； 圖4C至圖4G分別為本發明另一態樣之發光楚置的俯 視圖； 201231860 圖5為本發明第二實施例之發光裝置的剖視圖； 圖6A為本發明第三實施例之發光裝置的俯視圖；以 及 圖6β為本發明第三實施例之發光裝置之該等基板連 接處部分放大示意圖。 【主要元件符號說明】 1、2、2a〜2g、3、4 :發光裝置 II ' 21、21b、31、41 :基板 III .上表面 12、221、321 :發光二極體晶粒 121 :打線 13 :封膠體 211、 311 :基板本體 212、 212b、213、312 :圖案化層 22、 22f、22g、32、42 :發光單元 23、 23a、23c、23d、23e、23f、23g、43 :凸出物 24、 24c、24d、24e、24f、24g、44 :反射材料 25、 25a、35、45 :封裝材料 36、46 :蓋板 37 :連結膠 A- A ·直線 Ο :通孔 S01〜S02 :步驟 22 201231860 α :接觸角 θ :角度 23Si:=glass fiber, or resinous material, or polymer material, etc.; the cover plate 36 is used as a glass substrate. Therefore, part of the light emitted by the light-emitting unit 32 can be viewed through the light-emitting side of the reflective device, and the liquid can be filled between the substrate 31 and the cover 36. 'In order to increase the thermal conductivity of the light-emitting unit%, the liquid can be a highly thermally conductive material. When selecting liquids, consideration should be given to the properties of insulation, corrosion, raw freezing point, and thermal expansion m. Here, oils or solvents can be used. Oils such as mineral oil, cut oil (Silie_(6)) or glycerol (Glycerol) The solvent is, for example, triterpene benzene (Mes Office). In addition, the 'light-emitting device 3 may further include at least a driving element (the figure is not similar to a connecting win 37. The driving element may be placed on the other side of the substrate 31 with respect to the light-emitting diode die 321 . The driving element system The driving element for driving the hair-emitting diodes 32 includes, for example, a driving integrated circuit (DnverIC). If the driving elements are dies, they can be placed on the substrate 31 by wire bonding or by means of splicing σ (3). If the driving component is a package or a surface bonding component, it can be surface-bonded to the substrate 31. The bonding adhesive 37 can also be referred to as a sealant, which is disposed between the substrate 31 and the cover 36 and connects the substrate 31 with The cover 36. The adhesive 37 can be, for example, an underfill adhesive, and can be incorporated into the 201231860 substrate 31 and the cover 36 by capillary phenomenon; of course, the adhesive 37 can also be applied to the substrate 31 or the cover 36. Thereafter, the substrate 31 and the cover 36 are bonded together. The material of the adhesive 37 includes, for example, silicone or epoxy resin to protect the light-emitting device 3 from moisture or foreign matter and affect its luminous efficacy and life. Worth mentioning If the sealing property of the bonding adhesive 37 is good, the process of setting the packaging material 35 may be omitted to reduce the manufacturing process and reduce the manufacturing cost. In addition, other technical features of the light-emitting device 3 may refer to the light-emitting device 2, and no longer 3A and FIG. 6B, wherein FIG. 6A is a plan view of a light-emitting device 4 according to a third embodiment of the present invention, and FIG. 6B is a portion of the light-emitting device 4. The light-emitting device 4 includes four plural substrates 41 and a cover plate 46. Each substrate 41 has a plurality of light-emitting units - 42. The substrate 41, the light-emitting unit 42, the protrusions 43, the reflective material 44, the encapsulating material 45 and the cover The board 46 can refer to the technical features of all the above embodiments or a combination of the technical features thereof, and details are not described herein again. The substrates 41 can be flanked to each other or tiling to form a large-area display device. When adjacent to each other, the substrate 41* can be spliced to another substrate 41 by a connecting member (for example, a frame) or by bonding or snapping, and then combined with a cover 46. The light-emitting device 4 is formed. In addition, the four substrates 41 may be abutted by using another outer frame, or another carrier plate (not shown) having a larger area than the substrate 41 may be used to The substrate 41 is fixed on the carrier plate, and the substrate 41 and the cover plate 46 are combined with each other to form a large area of 19 201231860 display device, illumination device or backlight. It should be noted that 'each substrate 4i is - Rectangular as an example, but may also be circular, rounded, other polygons or concave polygons such as in a puzzle, and the carrier plate may be a light transmissive or opaque material. In addition, the number of substrates 41 is unrestricted. According to different designs and requirements, there may be different numbers and combinations. If the two substrates 41 are directly connected to each other, no joints are generated due to the benefit of the adjacent substrates y, which in turn can enhance the display of the light-emitting device 4: due to seamless splicing, when adjacent substrates 41 During the splicing, the light-emitting diodes of the light-emitting units 42 on the respective substrates 41 are crystal grains, so that the gap between the light-emitting units 42 can be reduced to l3 to 1 mm. Therefore, the gap between the two adjacent light-emitting units on the different substrates 41 can be controlled as a person, and the gap between two adjacent light-emitting units 42 on the middle substrate 41 is the same. Since the light-emitting units 42 are arranged in a regular manner, and the light-emitting units 42 between the different substrates 41 at the splicing portions also have the same gap, the splicing marks are not visible to the human eye, and the quality of the light-emitting device 4 can be improved. In addition, in the present embodiment, the size of the cover plate 46 is larger than the size of the substrate 4, and if the plurality of cover plates 46 and the plurality of substrates 4 are two: the size of the cover plate 46 is less than or equal to a substrate 41: = such that the substrates q can be adjacent to each other or connected to each other to form a large-area display device, illumination device or backlight module. In addition, the light-emitting device 4 of the present embodiment may be spliced in a strip shape or spliced in other shapes, in addition to matrix splicing. In summary, the illuminating device according to the present invention is disposed by the projection corresponding to the periphery of the illuminating unit, whereby the illuminating device as the display device 20 201231860 7 'can avoid the influence of different illuminating units on each other. And cause::: Γ, the protrusion can also be used as a packaging material to the illuminating 曰曰;: the rubber structure on the 'to simplify the process and reduce the manufacturing = other 'reflective material can be placed on the protrusion Light-emitting diode grains: The first-line hunting improves the light-emitting efficiency by the reflection of the reflective material, thereby improving the light utilization efficiency of the light-emitting device. In addition, the adhesion between the material of the protrusion and the patterned layer is greater than the adhesion between the material of the protrusion and the substrate body, so that the protrusion is automatically aligned with the pattern: layer (f) f_align), thereby greatly improving process efficiency and reducing The above is only an example and not a limitation. Any equivalents or modifications of the present invention without departing from the spirit and scope of the present invention should be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light-emitting device; FIG. 2A is a plan view of a light-emitting device according to a first embodiment of the present invention; FIG. 2B is a cross-sectional view of a straight line Α·Α in FIG. 2A; The present invention is a cross-sectional view of a light-emitting device according to another aspect of the present invention; and FIG. 4C to FIG. 4G are respectively a light-emitting device of another aspect of the present invention; Figure 3 is a cross-sectional view of a light-emitting device according to a second embodiment of the present invention; Figure 6A is a plan view of a light-emitting device according to a third embodiment of the present invention; and Figure 6 is the light-emitting device of the third embodiment of the present invention. A partial enlarged view of the substrate connection. [Description of main component symbols] 1, 2, 2a to 2g, 3, 4: light-emitting device II ' 21, 21b, 31, 41: substrate III. upper surface 12, 221, 321 : light-emitting diode die 121: wire 13: sealant 211, 311: substrate body 212, 212b, 213, 312: patterned layer 22, 22f, 22g, 32, 42: light-emitting unit 23, 23a, 23c, 23d, 23e, 23f, 23g, 43: convex Output 24, 24c, 24d, 24e, 24f, 24g, 44: reflective material 25, 25a, 35, 45: encapsulating material 36, 46: cover plate 37: connecting glue A-A · straight line Ο: through hole S01~S02 :Step 22 201231860 α : Contact angle θ : Angle 23