201110430 六、發明說明： 【發明所屬之技術領域】 本發明係一種發光二極體（led)散熱基板的製作方 法’尤其是一種能夠於導熱鋁基板上以網板印刷的方式將 絕緣膠僅設置於非封裝區域的發光二極體散熱基板，而令 LED與導熱鋁基板之間並無絕緣膠的阻隔，而使led能夠 迅速地將熱移除。 【先前技術】 隨著發光二極體（LED)產業的發展，為了因應市場需 求’在一封裝體中，LED的數量已經大幅提升，且LED的 發光功率也逐漸在改善，然而，這樣的改變所帶來的卻是 熱量的累積》當熱量無法有效地從led封裝體中散逸，所 以L E D晶粒溫度過高，則勢必會導致「光衰」現象，即光 在傳輸中的訊號減弱’因此造成LED使用壽命的減損。 因此，在LED封裝體中，位於LED晶片底部皆會結 合有一散熱基板，並藉此結合至一散熱模組，使得LED發 出的熱此夠經由散熱基板而傳遞至散熱模組，避免熱量累 積於LED封裝體中。 既有的散熱基板係在一導熱基板本體上全面塗佈絕緣 膠，再將一銅箔層與該導熱基板本體壓合，而在壓合的過 程中’絕緣膠受壓後會使得銅结層與導熱基板本體之間形 成一絕緣膠層，因此當201110430 VI. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a light-emitting diode (LED) heat-dissipating substrate, in particular, an insulating rubber can be disposed on a thermally conductive aluminum substrate by screen printing. The light-emitting diode of the non-packaged area dissipates the substrate, so that there is no barrier between the LED and the thermally conductive aluminum substrate, so that the LED can quickly remove heat. [Prior Art] With the development of the LED industry, in order to meet market demand, the number of LEDs has been greatly improved in a package, and the LED's luminous power is gradually improving. However, such a change What is brought is the accumulation of heat. When the heat cannot be effectively dissipated from the LED package, the temperature of the LED die is too high, which will inevitably lead to the "light decay" phenomenon, that is, the signal of the light is weakened during transmission. Causes the loss of LED life. Therefore, in the LED package, a heat dissipation substrate is coupled to the bottom of the LED chip, and is coupled to a heat dissipation module, so that the heat generated by the LED can be transmitted to the heat dissipation module via the heat dissipation substrate to prevent heat from accumulating. In the LED package. The existing heat dissipating substrate is integrally coated with an insulating glue on a body of the heat conducting substrate, and then a copper foil layer is pressed against the body of the heat conducting substrate, and during the pressing process, the insulating layer is pressed to make the copper layer Forming an insulating layer between the body of the thermally conductive substrate, so
遞至導熱基板本體的途徑， -%娄极孚骽接觸，而是其之間 存在’因此阻礙了 led將熱傳 使得散熱基板無法達到良好的 2〇1110430 散熱功效。 再者，當該導熱基板本體係由鋁所製成時，由於鋁很 谷易氧化，所以表面通常會形成一氧化鋁層，即使在焊接 之則除去該氧化鋁層，但焊接時產生的高溫仍然會使得鋁 表面迅速形成氧化鋁層，因此鋁基板無法以焊接的方式與 散熱模組結合。所以既有的散熱基板，可參考本國專利證 書第194556號之發明專利案以及本國專利公告第丨228947 號之發明專利案等’皆係於其底部塗佈錫膏，藉由錫膏使 得鋁基板與散熱模組得以接合。然而，錫膏内部仍然含有 樹脂絕緣膠等成分…因料熱的效果仍然不如直接焊接金 屬錫來的理想。所以既有散熱基板由於不能直接焊錫，因 此導致散熱基板無法有效發揮散熱的效果，故LED的使用 壽命仍然無法增加。 而既有欲將鋁與錫焊接的方法通常有兩種，其中一種 疋將紹的焊接面以砂紙磨光，再以烙鐵沾有焊#，於焊接The way to the heat-conducting substrate body, -% 娄 骽 骽 contact, but there is a 'between' and therefore the LED will heat transfer so that the heat sink substrate can not achieve good heat dissipation. Furthermore, when the thermally conductive substrate is made of aluminum, since the aluminum is easily oxidized, an aluminum oxide layer is usually formed on the surface, and the aluminum oxide layer is removed even when soldered, but the high temperature generated during soldering. The aluminum surface is still rapidly formed into an aluminum oxide layer, so the aluminum substrate cannot be soldered to the heat dissipation module. Therefore, the existing heat-dissipating substrate can be referred to the invention patent of the national patent certificate No. 194556 and the invention patent of the national patent publication No. 228947, etc., which are coated with a solder paste at the bottom thereof, and the aluminum substrate is made of a solder paste. Engaged with the thermal module. However, the inside of the solder paste still contains components such as resin insulating glue... The effect of heat is still not as good as that of direct soldering of metal tin. Therefore, since the heat dissipating substrate cannot be directly soldered, the heat dissipating substrate cannot effectively dissipate heat, and the life of the LED cannot be increased. There are usually two methods for soldering aluminum and tin. One of them is polished with sandpaper and then soldered with a soldering iron.
面上用力摩擦’ J_X磨去氧化層，使得錫附著於焊接面上， 之後移除鐵’即可進料接；然而此種的焊接Η並不能 確保铭表面完全無氧化層的存在，所以紹和錫之間無法完 全接合，而有脫落的可能。、 另外一種方式是在銘的焊接面上施以硝酸汞溶液，而 形成料合金’因此錫可焊接在㈣合金上，但焊接強度 並不高，尚須經由額外的加工，而且泉的導熱係數並不高， 因此無法適用於散熱基板的製作。 【發明内容】 L£D和導熱基板本體 本發明人有鑒於既有散熱基板在 201110430 之間尚有絕緣膠的存在，使得熱量無法迅速地由LED傳遞 至散熱基板，因此仍會造成LED的損耗，而減低使用壽命， 因此本發明人藉由其豐富的知識背景以及多年的研究之 後，發明出此發光二極體（LED)散熱基板及其製作方法》 本發明之目的在於提供一種讓LED能夠直接設置於金 屬導熱基板上，而使LED能夠迅速地將熱移除的發光二極 體散熱基板。 為達上述目的，本發明發光二極體（LED)散熱基板的 • 製作方法，其係包括： 提供一導熱鋁基板； 於該導熱鋁基板的頂面依照預先決定的線路圖案形成 複數凹部； 在該導熱鋁基板的表面進行防腐蝕處理； 於該導熱鋁基板的凹部内施以絕緣膠； 於該導熱鋁基板上形成具有線路和電鍍導線之銅箔 層’且依照該預先決定的線路封裝區域圖案露出該導熱鋁 •基板作為封裝區域的頂面，而形成一待處理基板； 將該待處理基板經過電鍍前處理後，沉浸於一化學鎳 錢液令’以無電解電鍍的方式在該待處理基板暴露於外的 金屬表面形成一化學鎳層，而獲得一無電解電鍍基板； 再於該無電解電鍍基板頂面之化學鎳層上形成金屬 層，該金屬層至少包括一層以喷錫而形成的錫層或以電鍍 而形成的金層或銀層； 去除電鍍導線後施加防焊油墨於需要防焊之金屬廣表 面，即獲得該發光二極體（LED)散熱基板。 201110430 其中，於該導熱鋁基板上形成具有線路和電鍵導線之 銅箔層係包括在一塑膠軟板上、下兩面分別壓合一上銅箔 和下銅箔而形成一銅箔軟扳，並依照該預先決定的線路封 裝區域圖案於該銅箔軟板形成複數穿孔，又以電鍍方式連 通二銅箔，再蝕刻該銅箔軟板以形成具有線路和電鍍導線 之銅箔軟板，再將該具有線路和電鍍導線之銅箔軟板於 150〜200 °C的溫度下與該導熱鋁基板進行壓合，使其與絕 緣膠接合，而路出該導熱鋁基板作為封裝區域的頂面，形 # 成該待處理基板。 其中’在該銅箔軟板形成複數穿孔後，尚包括初步於 該上、下銅箔以蝕刻方式形成線路和電鍍導線，再將該銅 结軟板浸在硫酸銅電鍍液中，以於該銅箔軟板表面以及穿 孔之避免形成厚度為1 〇" m ~ 1 5" m的鍍層。 較佳的是’該具有線路和電鍍導線之銅箔軟板係在 1 50〜200°C的溫度下進行壓合約30〜50分鐘。 其中，於該導熱鋁基板上形成具有線路和電鍵導線之 鲁銅猪層係包括將一銅羯片於150〜20CTC的溫度下與該導熱 紹基板進行壓合’使得銅羯片與絕緣膠接合而形成銅箔 層’並依照該預先決定的線路圖案在該銅箔層上將未與絕 緣膠接合的部分钱刻且移除’以形成線路與電鍍導線，並 露出該導熱紹基板作為封裝區域的頂面，形成該待處理基 板。 較佳的是’該銅结片係在150〜20(TC的溫度不與該導 熱鋁基板進行壓合約30〜50分鐘》 較佳的是’該凹部的深度至少為〇·05毫米，而 201110430 絕緣膠之厚户在I & Λ 又係小於0·05毫米（mm)。 "f圭frS 曰 、疋’該防腐钱處理係以鉻酸鹽（c「3+)皮膜或氟 I皮膜進仃皮膜處理，以形成一皮膜層。較佳的是，該 皮膜層的厚度為〇_卜1微米(㈣。 較佳的县，％ # i 疋 所施加的絕緣膠為環氧酚醛樹脂（phenyl ac ep〇xy)。該環氧酚醛樹脂屬於低膨脹係數的絕緣 更佳的疋，進行無電解電鍍時，係將該待處理基板先 、辛置換處理後，再沉浸於一化學鎳鍍液中，使得該導熱 板於暴露出來的表面形成一化學鎳層；同時以觸鍵的 方式使該銅IS線路與電链導線表面形成—化學錄層。 二較佳的是，該金屬層尚包括在形成錫層、金層或銀層 之刖在該化學鎳層上電鍍一銅層。該金屬層尚包括在形成 錫層、金層或銀層之前，並於電鍍該銅層之後在該銅層上 形成一鎳層，再使該錫層、金層或銀層形成於該鎳層上。 較佳的疋，％加該防焊油墨係以網板印刷的方式將防 焊油墨網印於該錫層、金層或銀層之表面，以露出無施以 絕緣膠之位置的金屬層以及用於打線之接點的金屬層。 本發明尚關於一種發光二極體（LED)散熱基板，其係 由上述方法所製成者。 本發明又關於一種發光二極體（LED)散熱基板，其係 包括： 一導熱鋁基板，其頂面形成複數凹部，各凹部的内部 填充有絕緣膠層； 一銅箔層，其係壓合於該絕緣膠層上，以作為線路； 201110430 複數化學鎳層，其係分別形成在該導熱鋁基板之表面 以及該銅箔層非與絕緣膠層接觸之表面；以及 複數金屬層，其係形成在該導熱鋁基板之頂面的化學 鎳層之表面，各金屬層至少包括一層錫層、金層或銀層； 以及 一防焊油墨層，其係設置於該金屬層需要防焊之表 面。 其中，該銅箔層係一銅箔軟板，該銅箔軟板包括一塑 籲膠軟板、分別設置於該塑膠軟板上、下表面的上、下銅箔 以及貫穿該塑膠軟板和上、下銅箔的複數穿孔，且部分穿 孔的壁面形成導接該上、下銅箔的金屬鍍層，以形成線路。 其中該金屬鍍層可為銅層。 其中’該銅箔層係由銅箔片所組成的。 較佳的是’該凹部的深度至少為〇 05毫米（mm)，而 絕緣耀層之厚度係小於0.05毫米（mm)。 較佳的是，各金屬層尚包括一電鍍銅層，其係設置於 S玄化學鎳層與該錫層、金層或銀層之間。 更佳的是’各金屬層尚包括一電鍍鎳層，其係設置於 該電鍍銅層與該錫層、金層或銀層之間。 較佳的是’該導熱鋁基板與絕熱膠層之間具有一皮膜 層。更佳的是，該皮膜層係由鉻酸鹽（Cr3+)皮膜或氟化鹽 皮膜所組成’該皮膜層的厚度為0·1〜1微米（/ym)» 。 較佳的是，該絕緣膠層為具有低膨脹係數特性的環氧 酚醛樹脂。 本發明之LED和導熱鋁基板之間僅有化學鎳層和金屬 201110430 層，因此沒有非金屬的絕緣膠阻礙，使得LED能夠順利且 迅速地將熱傳遞至導熱鋁基板，而且本發明之導熱鋁基板 底部能夠直接與散熱模組以焊錫的方式焊接，因此散熱效 果極佳，故迠避免LED產生光衰，而增加的壽命。 【實施方式】 在此所述的「無電解電鍍」又稱為「化學鍍」，因此 「無電解電鍍鎳」與「化學鎳」之用語可以互換使用。其 係在不通電的情況下，利用氧化還原反應於工件上形成均 勻鍍層的方法。其中無電解電鍍包括置換鍍（如離子交換或 電荷交換沉積)、觸鍍、實質上的化學鍍，此為所屬技術領 域中具有通常知識者所知悉的技術，但目前並無使用於改 善鋁基板的焊接特性方面。 在此所述的「電鑛前處理」在一般的情況下係指在電 鍍之前所進行的處理，而於本發明中係在無電解電鍵之前 所進行的處理’而處理方式相同，包括酸洗以移除工件表 面的皮膜、氧化層或鏽層等以增加鍍層附著力、除油以去 除工件表面的油脂以避免鍍層脫落。 請參看第一圖所示，本發明發光二極體（LED)散熱基 板的製作方法，其係包括以下步驟： 提供基板步驟（a)，請附加參看第二A和三A圖所示， 其係提供一導熱鋁基板（10); 頂面凹部形成步驟（b)’請附加參看第二b和三b圖 所示，其係於該導熱金屬基板（1 0)的頂面（1 2)是依照預先 決定的線路封裝區域圖案藉由蝕刻（etch)、壓鑄（die castjng) 或模具鑄造（mold-casting)形成複數凹部（11)，各凹部）） 201110430 的深度至少為0.05毫米； 防腐蝕處理步驟⑻’請附加參看第二C和三c圖所 不係在該導熱紹基板（10)的表面以絡酸鹽（c「3+)或氣化鹽 進行防腐餘處理’ 皮膜處理，而在該導熱銘基板（10): 表面形成厚度約為〇. Η微米（謂）的皮膜層（2〇); 網印絕緣膠步驟⑷，請附加參看第二D和三D圖所 不’其係於料熱㉟基板（1Q)之凹部（11)内的皮膜層上 以網板印刷的方式以該預先決定的線路封裝區域圖案施加 絕緣膠’ α形成複數絕緣膠層（3Q)，i使得封裝區域無絕 緣膠存在，該封裝區域係供之後LED晶片放置的位置各 絕緣膠層(30)厚度係小☆ 〇〇5毫米，由於環氧酚醛樹脂 (phenyl novolac epoxy)具有耐高溫和膨脹係數小的優點， 故本發明中較佳的絕緣膠為環氧酚醛樹脂； 形成具有線路和電鍍導線之銅箔層步驟（e)，請附加參 看第一 F和二F圖，其係在該導熱鋁基板（1〇)上形成具有 線路和電鍍導線之銅猪層（4Q)，且依照該預先決^的線路 封裝區域圖案露出該導熱鋁基板（1〇)未有絕緣膠層（3〇)覆 蓋之區域，即作為封裝區域的頂面（12)，而形成一待處理 基板（1 0a); 此步驟之第一實施例，係包括提供一塑膠軟板（41)以 及上、下銅箔（42, 43)(第四A圖）；並將該上、下銅箔（42, 43) 刀別壓合在一塑膠軟板（41)上、下兩面而形成一銅箔軟板 (4〇a)(第四B圖），該上、下銅箔（42，43)是作為二電極； 並依照該預先決定的線路封裝區域圖案於該銅箔軟板（40a) 以機械加工的方式形成複數穿孔（44)(第四C圖），或者可 201110430 依照需要額外進行#刻鑽孔，以方便線路的製作；並於該 上、下鋼箔（42, 43)進行鞋刻以初步形成線路和電錄導線； 之後再將該銅箔軟板（40a)浸在硫酸銅電鍍液中，以電鍍方 式形成厚度為1 0pm〜15//m的鍍層（45)，該鍍層（45)係形 成於該上、下鋼箔（42, 43)表面以及形成於穿孔（44)内壁（由 於在硫酸銅溶液中可加入活化劑，故於塑膠軟板（4彳）部分 外露的部分亦能產生鍵層），以連通該上、下銅箔（42, 43)(第 四D圖，僅顯示穿孔（44)壁面的鍍層）；而後再進一步蝕刻 該銅羯軟板（40a)以形成具有線路和電鍍導線之銅箔層 (4〇)(第四E圖），故能避免上、下銅箔（42，43)連通而產生 正、負極導通之短路的問題，並能夠讓之後LED的正負極 皆於上銅箔（42)打線，但其中一極係能藉由下銅箔（43)所 傳導，再請參看第二E圖所示，之後，將該具有線路和電 鍍導線之銅羯層（40)在]50〜2〇(rc的溫度下與該導熱鋁基 板（1〇)進行壓合約30〜50分鐘，使得該具有線路和電鍍導 線之銅箱層（40)與絕緣膠（30)接合，再請參看第二F圖所 示，壓合後，露出該導熱鋁基板（10)作為封裝區域的頂面 (12)(此時仍覆蓋有皮膜層（2〇))，而形成一待處理基板 (10a); 此步驟之第二實施例，請參看第三E圖所示，其係包 括將一鋼箱片（4〇，）在]50〜測。C的溫度下與料熱链基板 (1 0)進行壓合約30~50分鐘，使得銅箔片（4〇|)與絕緣膠（3〇) 接合，由於該導熱鋁基板（10)之凹部（11)的緣故，使得該 銅&片（40·)之表面形成凹&的結構，請附加參看第三f圖 所示其係依照該預先決定的線路圖案在銅箔片（4〇1)上蝕 201110430 刻出線路和電鍵導線，同時將未與絕緣膠層（3 〇)接合的部 分也ϋ刻移除而形成具有線路和電鍍導線之銅箔層（4〇)， 並露出該導熱鋁基板（10)的頂面此時仍覆蓋有皮膜層 (20))，而形成一待處理基板（10a);Friction on the surface 'J_X to remove the oxide layer, so that the tin adheres to the soldering surface, then remove the iron' to feed the joint; however, this kind of soldering flaw does not ensure that the surface of the surface is completely free of oxide layer, so It is impossible to fully engage with tin, but there is a possibility of falling off. Another way is to apply a solution of mercury nitrate to the welding surface of the mold to form a material alloy. Therefore, the tin can be welded to the (4) alloy, but the welding strength is not high, and additional processing is required, and the thermal conductivity of the spring is also required. It is not high and therefore cannot be applied to the fabrication of heat sink substrates. SUMMARY OF THE INVENTION L£D and thermally conductive substrate body The present inventors have in view of the existence of an insulating paste between the existing heat-dissipating substrate between 201110430, so that heat cannot be quickly transferred from the LED to the heat-dissipating substrate, so the LED loss is still caused. In order to reduce the service life, the present inventors have invented the light-emitting diode (LED) heat-dissipating substrate and the manufacturing method thereof after the rich knowledge background and years of research. The object of the present invention is to provide an LED capable of Directly disposed on the metal heat-conducting substrate, the LED enables the heat-removed light-emitting diode to quickly dissipate the substrate. In order to achieve the above object, a method for fabricating a light-emitting diode (LED) heat-dissipating substrate of the present invention includes: providing a thermally conductive aluminum substrate; forming a plurality of recesses on a top surface of the thermally conductive aluminum substrate according to a predetermined circuit pattern; The surface of the thermally conductive aluminum substrate is subjected to an anti-corrosion treatment; an insulating paste is applied to the concave portion of the thermally conductive aluminum substrate; a copper foil layer having a line and a plated wire is formed on the thermally conductive aluminum substrate; and the predetermined circuit package region is formed according to the wire The pattern exposes the heat conductive aluminum substrate as a top surface of the package region to form a substrate to be processed; after the substrate to be processed is subjected to pre-plating treatment, immersed in a chemical nickel liquid solution to be electrolessly electroplated Treating the substrate to the outer metal surface to form a chemical nickel layer, thereby obtaining an electroless plated substrate; forming a metal layer on the chemical nickel layer on the top surface of the electroless plated substrate, the metal layer including at least one layer to spray tin a tin layer formed or a gold layer or a silver layer formed by electroplating; after the electroplated wire is removed, a solder resist ink is applied to the metal requiring solder resist The surface of the light-emitting diode (LED) heat dissipation substrate is obtained. 201110430 wherein a copper foil layer having a line and a key wire is formed on the heat conductive aluminum substrate, and a copper foil and a lower copper foil are respectively pressed on a plastic flexible board and a lower surface to form a copper foil soft board, and Forming a plurality of perforations on the copper foil flexible board according to the predetermined circuit package area pattern, and connecting the two copper foils by electroplating, and etching the copper foil soft board to form a copper foil soft board having a line and a plating lead, and then The copper foil soft board having the circuit and the electroplated wire is pressed with the heat conductive aluminum substrate at a temperature of 150 to 200 ° C to be bonded to the insulating adhesive, and the thermally conductive aluminum substrate is taken out as a top surface of the package area. Shape # becomes the substrate to be processed. Wherein after the plurality of perforations of the copper foil soft plate are formed, the circuit and the electroplated wire are formed by etching in the upper and lower copper foils, and the copper soft plate is immersed in the copper sulfate plating solution for The surface of the copper foil soft board and the perforations are prevented from forming a coating having a thickness of 1 〇" m ~ 1 5" m. Preferably, the copper foil flexible board having the wiring and the electroplated wire is subjected to a compression contract at a temperature of 150 to 200 ° C for 30 to 50 minutes. Wherein, forming a copper porcine layer having a line and a key wire on the heat conductive aluminum substrate comprises pressing a copper enamel sheet with the heat conducting substrate at a temperature of 150 to 20 CTC to bond the copper enamel sheet with the insulating rubber. Forming a copper foil layer 'and removing portions of the copper foil layer that are not bonded to the insulating paste according to the predetermined circuit pattern to form a line and an electroplated wire, and exposing the thermally conductive substrate as a package region The top surface forms the substrate to be processed. Preferably, the copper foil is at 150 to 20 (the temperature of the TC is not contracted with the thermally conductive aluminum substrate for 30 to 50 minutes). Preferably, the depth of the recess is at least 〇·05 mm, and 201110430 The thickness of the insulating rubber is less than 0.05 mm (mm) in I & &. "f圭 frS 曰,疋' The anti-corrosion treatment is based on chromate (c "3+" film or fluorine I film) The film is treated to form a film layer. Preferably, the thickness of the film layer is 〇 _ 1 micron ((4). The preferred county, % # i 疋 applied insulating rubber is epoxy phenolic resin ( Phenyl ac ep〇xy). The epoxy phenolic resin is a better insulation with a low expansion coefficient. When electroless plating is performed, the substrate to be treated is first and symmetrically replaced, and then immersed in an electroless nickel plating solution. The heat conducting plate forms a chemical nickel layer on the exposed surface; at the same time, the copper IS line and the surface of the electric chain wire are formed into a chemical recording layer by means of a contact. Secondly, the metal layer further includes A copper layer is electroplated on the chemical nickel layer after forming a tin layer, a gold layer or a silver layer. The layer further includes forming a nickel layer on the copper layer after forming the tin layer, the gold layer or the silver layer, and then forming the tin layer, the gold layer or the silver layer on the nickel layer. Preferably, the solder resist ink is screen printed on the surface of the tin layer, the gold layer or the silver layer by screen printing to expose the metal layer without the position of the insulating glue and The invention relates to a light-emitting diode (LED) heat-dissipating substrate, which is manufactured by the above method. The invention further relates to a light-emitting diode (LED) heat-dissipating substrate, The system comprises: a thermally conductive aluminum substrate, the top surface of which forms a plurality of recesses, the interior of each recess is filled with an insulating layer; a copper foil layer is pressed onto the insulating layer to serve as a line; 201110430 plural chemical nickel a layer formed on a surface of the thermally conductive aluminum substrate and a surface of the copper foil layer not in contact with the insulating adhesive layer; and a plurality of metal layers formed on a surface of the chemical nickel layer on the top surface of the thermally conductive aluminum substrate Each metal layer includes at least one layer of tin a gold or silver layer; and a solder resist ink layer disposed on the surface of the metal layer requiring solder resisting. wherein the copper foil layer is a copper foil soft board, and the copper foil soft board comprises a plastic stamping glue a flexible board, upper and lower copper foils respectively disposed on the plastic soft board and the lower surface, and a plurality of perforations penetrating the plastic soft board and the upper and lower copper foils, and the partially perforated wall surface is formed to guide the upper and lower copper foils Metal plating to form a line. The metal plating layer may be a copper layer. Wherein the copper foil layer is composed of a copper foil sheet. Preferably, the recess has a depth of at least 毫米05 mm (mm). The thickness of the insulating glazing layer is less than 0.05 millimeters (mm). Preferably, each metal layer further comprises an electroplated copper layer disposed between the S-Shenzhen nickel layer and the tin layer, the gold layer or the silver layer. . More preferably, each of the metal layers further includes an electroplated nickel layer disposed between the electroplated copper layer and the tin, gold or silver layer. Preferably, there is a film layer between the thermally conductive aluminum substrate and the insulating layer. More preferably, the film layer is composed of a chromate (Cr3+) film or a fluoride salt film. The thickness of the film layer is from 0.1 to 1 micrometer (/ym). Preferably, the insulating layer is an epoxy phenolic resin having a low coefficient of expansion. There is only a layer of chemical nickel and metal 201110430 between the LED and the thermally conductive aluminum substrate of the invention, so that there is no non-metallic insulating glue hindering, so that the LED can smoothly and quickly transfer heat to the thermally conductive aluminum substrate, and the thermal aluminum of the invention The bottom of the substrate can be directly soldered to the heat dissipation module, so the heat dissipation effect is excellent, so the LED is prevented from being light-damped and the life is increased. [Embodiment] The term "electroless plating" as used herein is also referred to as "electroless plating". Therefore, the terms "electroless nickel plating" and "chemical nickel" are used interchangeably. It is a method of forming a uniform plating layer on a workpiece by a redox reaction without being energized. Among them, electroless plating includes displacement plating (such as ion exchange or charge exchange deposition), plating, and substantially electroless plating, which are known to those skilled in the art, but are not currently used to improve aluminum substrates. In terms of welding characteristics. The term "electric pre-treatment" as used herein refers to the treatment performed prior to electroplating in the general case, and the treatment performed prior to electroless electrolysis in the present invention, and the treatment is the same, including pickling. To remove the coating, oxide layer or rust layer on the surface of the workpiece to increase the adhesion of the coating and remove the oil to remove the grease on the surface of the workpiece to avoid the coating falling off. Referring to FIG. 1 , a method for fabricating a light-emitting diode (LED) heat-dissipating substrate according to the present invention includes the following steps: providing a substrate step (a), as shown in FIG. 2A and FIG. Providing a thermally conductive aluminum substrate (10); a top recess forming step (b) 'please refer to the second b and b, respectively, attached to the top surface of the thermally conductive metal substrate (10) (1 2) Forming a plurality of recesses (11) by etching, die casting, or mold-casting according to a predetermined line package area pattern, each of the recesses)) having a depth of at least 0.05 mm; Process step (8) 'please refer to the second and third c-pictures not to adhere to the surface of the heat-conducting substrate (10) with the acid salt (c "3 +) or vaporized salt for anti-corrosion treatment" film treatment, and On the heat-conducting substrate (10): the surface is formed to a thickness of about 〇. Η micron (called) film layer (2 〇); screen printing insulation step (4), please refer to the second and third D drawings Attached to the film layer in the recess (11) of the heat substrate 35 (1Q) by screen printing The predetermined circuit package area pattern is coated with an insulating glue 'α to form a plurality of insulating adhesive layers (3Q), i such that no insulating glue exists in the package area, and the package area is for the thickness of each insulating adhesive layer (30) at a position where the LED wafer is placed later. The small ☆ 〇〇 5 mm, because the phenyl novolac epoxy has the advantages of high temperature resistance and small expansion coefficient, the preferred insulating glue in the present invention is an epoxy phenolic resin; forming a line and a plated wire. Copper foil layer step (e), please refer to the first F and the second F drawings, which are formed on the thermally conductive aluminum substrate (1〇) to form a copper pig layer (4Q) having a line and an electroplated wire, and according to the predetermined The line package area pattern exposes the area of the thermally conductive aluminum substrate (1〇) which is not covered by the insulating layer (3〇), that is, as the top surface (12) of the package area, to form a substrate to be processed (10a); The first embodiment of this step includes providing a plastic flexible board (41) and upper and lower copper foils (42, 43) (fourth A picture); and the upper and lower copper foil (42, 43) blades Do not press together on the upper and lower sides of a plastic flexible board (41) to form a Foil flexible board (4〇a) (Fig. 4B), the upper and lower copper foils (42, 43) are used as two electrodes; and according to the predetermined circuit package area pattern on the copper foil soft board (40a) Forming a plurality of perforations (44) (fourth C-figure) by machining, or additional drilling may be performed as needed in 201110430 to facilitate the production of the line; and performing the upper and lower steel foils (42, 43) The shoe is engraved to form a preliminary line and an electric recording wire; the copper foil soft plate (40a) is then immersed in a copper sulfate plating solution to form a plating layer (45) having a thickness of 10 pm to 15 //m by electroplating. The plating layer (45) is formed on the surface of the upper and lower steel foils (42, 43) and on the inner wall of the perforation (44) (because the activator can be added to the copper sulfate solution, the plastic soft board (4彳) is partially exposed. The portion can also produce a key layer) to connect the upper and lower copper foils (42, 43) (fourth D-picture, showing only the plating of the walls of the perforations (44)); and then further etching the matte soft board (40a) ) to form a copper foil layer (4〇) with a line and an electroplated wire, so that the upper and lower copper foils (42, 43) can be avoided. The problem of short circuit between positive and negative conduction is generated, and the positive and negative electrodes of the LED can be wired on the upper copper foil (42), but one of the poles can be conducted by the lower copper foil (43), then please refer to As shown in the second E diagram, the copper germanium layer (40) having the wiring and the electroplated wire is then pressed against the thermally conductive aluminum substrate (1 〇) for 30 to 50 minutes at a temperature of rc 50 。. The copper box layer (40) having the line and the electroplated wire is bonded to the insulating glue (30), and then, as shown in the second F, after pressing, the thermally conductive aluminum substrate (10) is exposed as the top of the package area. Face (12) (here still covered with a film layer (2〇)), forming a substrate to be processed (10a); for the second embodiment of this step, please refer to the third E figure, which includes a The steel box piece (4〇,) is measured at 50~. Pressing the heat-chain substrate (10) at a temperature of C for 30 to 50 minutes, so that the copper foil (4〇|) is bonded to the insulating rubber (3〇) due to the concave portion of the thermally conductive aluminum substrate (10) 11), the surface of the copper & sheet (40·) is formed into a concave & structure, please refer to the third f diagram, which is in accordance with the predetermined circuit pattern in the copper foil (4〇1) ) etched 201110430 to scribe the line and the key wire, and also remove the portion not bonded to the insulating layer (3 〇) to form a copper foil layer (4 〇) with lines and galvanized wires, and expose the heat conduction The top surface of the aluminum substrate (10) is still covered with the film layer (20) at this time, forming a substrate to be processed (10a);
無電解電鍵步驟（f)’請附加參看第二G以及三ο圖 所示，將該待處理基板（1〇a)經過電鍍前處理後，去除未被 絕緣膠（30)覆蓋之部分的皮膜層（2〇);請附加參看第二H 和二Η圖，再將其沉浸於一化學鎳鍍液中，於該待處理基 板（1〇a)暴露於外的金屬表面以無電解電鍍的方式，並同時 以觸鍍的方式，將該待處理基板（10a)以及線路與電鍍導線 上形成一厚度約為3~5微米（pm)的化學鎳層（5〇)，而獲得 一無電解電鍍基板（1〇b); 基板底部貼附耐高溫膠帶步驟（g )，請附加參看第二^ 及三丨圖，為了避免該導熱鋁基板（10)底部進行後續形成 金屬層之處理，故在該導熱鋁基板（10)底部貼附有耐高溫 膠帶（51); 電鍍銅層步驟（h)’請繼續參看第二丨及三丨圖所示， 其係於該無電解電鍍基板（10b)頂面（12)之化學鎳層上 電鍍一電鍍銅層（60)，該電鍍銅層（60)之厚度約為1〇~15 微米（//m); 及二J圖所示， 而形成一電鍍鎳層 電鍍鎳層步驟（i)，請附加參看第二 其係在該電鍍銅層（6 0)上係電鍵錄， (7〇)，其厚度約為3〜5微米（//m);Electroless electroless key step (f) 'please refer to the second G and the third o, as shown in Fig. 2, after the substrate to be processed (1〇a) is subjected to pre-plating treatment, the portion of the film not covered by the insulating paste (30) is removed. Layer (2〇); please refer to the second H and the second diagram, and then immersed in an electroless nickel plating solution, and the substrate to be treated (1〇a) is exposed to the outer metal surface to be electrolessly plated. In a manner, at the same time, a chemical nickel layer (5 〇) having a thickness of about 3 to 5 micrometers (pm) is formed on the substrate to be processed (10a) and the wiring and the plating wire by a plating method to obtain an electroless plating. Plating substrate (1〇b); step (g) of attaching high temperature resistant tape to the bottom of the substrate, please refer to the second and third figures, in order to avoid the subsequent formation of the metal layer on the bottom of the thermally conductive aluminum substrate (10), A high temperature resistant tape (51) is attached to the bottom of the thermally conductive aluminum substrate (10); a step (h) of the electroplated copper layer is continued as shown in the second and third figures, which is attached to the electroless plated substrate (10b) An electroplated copper layer (60) is plated on the chemical nickel layer of the top surface (12), and the thickness of the electroplated copper layer (60) About 1 〇~15 μm (//m); and the two J diagram, and forming an electroplated nickel layer nickel plating step (i), please refer to the second system in the electroplated copper layer (60) The upper key is recorded, (7〇), and its thickness is about 3~5 microns (//m);
三K 喷踢、電鍍金或電鍍銀步驟（j)，請附加參看第二K及 圖所示，其係再於該電鍍鎳層（70)上噴錫或電鍍金或 12 201110430 銀而形成錫層或金層或銀層（8〇)。； 去除電鑛導線步驟(k)，請附加參看第二匕及三L圖所 不，其係以㈣的方式去除之前在無電解電鍵步驟中所使 用的導線，例如移除銅笛軟板電鐘導線的部分，並部分移 除該化學鎳層(50)、電鍍鋼層(6〇)、電鍍鎳層(7〇)以及錫層 或金層或銀層（8〇)，之後，將該導熱銘基板（10)底部的耐 高溫膠帶（51)移除； 防焊處理步驟⑴，請附加參看第二M及三_所示， ♦其係於該等金屬層狀結構表面以網板印刷的方式網印防焊 油墨’而形成-防焊油墨層（9〇)，並露出之後要封裝啦 的位置以及之後要用於打線的接點，最後獲得一發光二極 體散熱基板（1〇C) β 當該導熱鋁基板（10)進行無電解電鍍時，可使用一裝 設有整流器的不繡鋼槽，為了防止錄鍍液鑛在不鏽鋼槽的 槽土因此以一正極接在不鏽鋼鍍槽上，負極則接在一個 和不鐵鋼槽絕緣的極棒上，且該極棒設置在錄鍵液中。之 後將4銘基板沉浸於該鎳鍍液中，以辞置換處理後，該鋁 基板上暴露出的銘金屬部分會形成一化學鎳層；同時以觸 鍍的方式，亦即將鋁基板上暴露出的銅金屬與極棒接觸約 3 5秒即可在銅金屬表面形成一化學鎳層。 第一 Μ以及二μ圖所示，本發明之發光二極體（LED) 散熱基板（10c)，其係包括： 一導熱金屬基板（1〇)，其頂面（12)以預先決定的線路 封裝區域圖案間隔形成複數凹部（11)，各凹部（11)的深度 至少為50毫米（mm)，各凹部（11)的表面形成有由鉻酸鹽 13 201110430 (c「3+)皮膜或氣化鹽皮膜所組成之皮膜層⑽），該皮膜層㈣ -的厚度約4 on冑米，而各凹部⑴）内部以網印的方式 形成有絕緣膠層（30)，該絕緣膠層（3〇)為環氧紛链樹脂， 且其厚度小於約為〇.〇5毫米； 一鋼羯層（40)，其係壓合於該絕緣膠層（3〇)的頂面， 且具有線路； 複數化學鎳層（50)，其係分別形成在該導熱鋁基板（1 〇) 之表面以及該銅箔層 (4〇)之表面； • 複數金屬層’各金屬層包括形成在該導熱鋁基板（10) 頂面之化學鎳層（50)上之一電鍍銅層（6〇)、形成在該等電 鍍銅層（60)於該化學鎳層（50)對向之表面的電鍍鎳層（7〇)以 及形成在該電鍍鎳層（70)於該電鍍銅層（6〇)對向之表面的 錫層、金層或銀層（80); 一防焊油墨層（90)，其係局部塗佈在該金屬層表面以 及在該化學鎳層（50)於該導熱鋁基板（10)對向之表面。 請參看第四E圖所示’於本發明之一實施例中，該銅 • 箔層（40)包括一塑膠軟板（41)、分別設置於該塑膠軟板（41) 上、下表面的上、下銅箔（4 2，43)以及貫穿該塑膠軟板（々I) 和上、下銅箔（42, 43)的複數穿孔（44)，且部分穿孔（44)的 壁面形成導接該上、下銅箔（42, 43)的銅鍍層（45)，以形成 線路。 請參看第三E圖所示’於本發明之另一實施例中，該 銅箔層（40)係以一銅箔片（40·)所組成。 本發明依照客戶所要求的圖案在該導熱鋁基板（1〇)形 成凹部（1 1)’且以網印的方式將絕緣膠設置在該等凹部（1 ]) 201110430 中’能夠避免在LED和該導熱鋁基板（1〇)之間仍有絕緣膠 的存在’又能避免在之後的壓合步驟中絕緣膠受熱而會有 流動而相互連接的疑慮，使用時，led和導熱鋁基板（10) 之間雖然有一化學鎳層（5〇)和金屬層，但其亦為金屬，因 此沒有絕緣膠（含有非金屬的樹脂）的阻礙，所以led勢必 旎夠迅速地將熱傳遞至導熱鋁基板（10)，以避免LED產生 光衰，故能增加LED的壽命。 特別的是’由於本發明利用無電解電鍍的方式在導熱 φ症呂基板（10)表面形成化學録，因此當導熱銘基板⑽之底 部欲與一散熱模組接合時，能夠直接利用該導熱鋁基板（1〇) 底部的化學錦層（5〇)以焊錫的方式固定在該散熱模組上， 因為化學錄以及錫焊料皆為金屬，因此散熱效果極佳，所 以本發明能夠有效率地讓導熱銘基板（1 〇 )上的熱量傳遞至 放熱核，组’而避免纟導熱链基板和散熱模组之間產生一非 金屬界面’而且導熱效率能大於既有導熱基板本體的30% 以上，故能達到快速散逸熱量的目的。 • 【圖式簡單說明】 第一圖係本發明之流程圖。 第A至Μ圖係本發明一實施例之流程步驟的剖面示 意圖。 第一Α至Μ圖係本發明另一實施例之流程步驟的剖面 示意圖》 第四Α至Ε圖係本發明一實施例之銅箔軟板的製 程步驟的剖面示意圖。 表 上述剖面圖僅為使所屬技術領域中具有通常知識者能 15 201110430 夠了解本發明之内宠 η合所做的示意圖，並未呈現所屬技術領 域中具有通常知墦I比& %者皆能了解的細節部分，且所示之尺 厚度等6非依照實際比例繪製，故無意限制本發明的 尺寸和厚度。 【主要元件符號說明】 (a) 提供基板步驟 (b) 頂面凹部形成步驟 (c) 防腐钱處理步驟 (d) 網印絕緣膠步驟 (e) 形成具有線路和電鍍導線之銅箔層步驟 (0無電解電鍍步驟 (9)基板底部貼附耐高溫膠帶步驟 (h) 電錢銅層步驟 (i) 電鍍鎳層步驟 (j) 噴錫、電鑛金或電鑛銀步驟 (k) 去除電鍍導線步驟 (丨）防焊處理步驟 (1〇)導熱銘基板 （10a)待處理基板 (i〇b)無電解電鍍基板（1〇c)發光二極體散熱基板 (11)凹部 （12)頂面 (20)皮膜層 （30)絕緣膠層 (40)具有線路和電鍍導線之銅箔軟板（4〇’）銅箔片 (40a)銅箔軟板 （41)塑膠軟板 (42)上銅箔 （43)下銅箔 (44)穿孔 （45)鍍層 201110430 (50)化學鎳層 （51)耐高溫膠帶 (60)電鍍銅層 （70)電鍍鎳層 (80)錫層或金層或銀層 （90)防焊油墨層The three-K spray, electroplated gold or electroplated silver step (j), please refer to the second K and the figure, which is then tinned or electroplated with gold or 12 201110430 silver on the electroplated nickel layer (70) to form tin. Layer or gold layer or silver layer (8 inches). Steps to remove the electric ore wire (k), please refer to the second and third L drawings. The wire used in the electroless key step is removed in the manner of (4), for example, the copper flute is removed. Part of the bell wire, and partially remove the chemical nickel layer (50), the galvanized steel layer (6 〇), the electroplated nickel layer (7 〇), and the tin layer or the gold layer or the silver layer (8 〇), after which The heat-resistant adhesive tape (51) at the bottom of the thermal conductive substrate (10) is removed; the solder resist processing step (1), please refer to the second M and III, ♦ which is printed on the surface of the metal layered structure by screen printing The way to screen the solder-proof ink 'to form a solder-proof ink layer (9 〇), and to expose the position to be packaged afterwards and the contacts to be used for wire bonding, and finally obtain a light-emitting diode heat-dissipating substrate (1〇 C) β When the thermally conductive aluminum substrate (10) is subjected to electroless plating, a stainless steel groove equipped with a rectifier may be used. In order to prevent the recording of the liquid ore in the groove of the stainless steel tank, the positive electrode is connected to the stainless steel plating. On the slot, the negative pole is connected to a pole insulated from the non-iron steel trough, and the pole is arranged at Key solution. After the immersion substrate is immersed in the nickel plating solution, after the replacement treatment, the exposed metal portion of the aluminum substrate forms a chemical nickel layer; and at the same time, the aluminum substrate is exposed by the plating method. The copper metal contacts the rod for about 35 seconds to form a layer of chemical nickel on the copper metal surface. As shown in the first and second figures, the light-emitting diode (LED) heat-dissipating substrate (10c) of the present invention comprises: a thermally conductive metal substrate (1 〇) whose top surface (12) has a predetermined line The package area pattern is spaced apart to form a plurality of recesses (11), each recess (11) having a depth of at least 50 millimeters (mm), and the surface of each recess (11) is formed with a chromate 13 201110430 (c "3+) film or gas a film layer (10) composed of a salt film, the film layer (4) - having a thickness of about 4 on 胄m, and each recess (1)) is internally formed with an insulating glue layer (30), which is formed by screen printing. 〇) is an epoxy chain resin, and its thickness is less than about 〇. 〇 5 mm; a steel 羯 layer (40), which is pressed against the top surface of the insulating layer (3 〇), and has a line; a plurality of chemical nickel layers (50) respectively formed on a surface of the thermally conductive aluminum substrate (1 〇) and a surface of the copper foil layer (4 〇); • a plurality of metal layers 'each metal layer including the thermally conductive aluminum substrate (10) an electroplated copper layer (6〇) on the top surface of the chemical nickel layer (50), formed in the electroplated copper layer (60) in the chemistry An electroplated nickel layer (7〇) on the opposite surface of the layer (50) and a tin layer, a gold layer or a silver layer formed on the surface of the electroplated nickel layer (70) opposite to the electroplated copper layer (6〇) a solder resist ink layer (90) partially coated on the surface of the metal layer and on the surface of the chemical nickel layer (50) opposite the thermally conductive aluminum substrate (10). In one embodiment of the present invention, the copper foil layer (40) comprises a plastic flexible board (41), upper and lower copper foils respectively disposed on the upper and lower surfaces of the plastic flexible board (41) (4) 2, 43) and a plurality of perforations (44) penetrating the plastic flexible board (々I) and the upper and lower copper foils (42, 43), and the wall surface of the partial perforation (44) is formed to guide the upper and lower copper foils ( 42, 43) copper plating (45) to form a line. Please refer to the third E figure. In another embodiment of the present invention, the copper foil layer (40) is a copper foil (40· The invention comprises the concave portion (1 1)' formed on the thermally conductive aluminum substrate (1〇) according to the pattern required by the customer, and the insulating glue is disposed in the concave portion (1) by screen printing. There is no need for the presence of insulating glue between the LED and the thermally conductive aluminum substrate (1〇), which avoids the doubt that the insulating adhesive will be heated and connected to each other during the subsequent pressing step. When used, led and thermally conductive. Although there is a chemical nickel layer (5 〇) and a metal layer between the aluminum substrate (10), it is also a metal, so there is no hindrance of the insulating rubber (containing a non-metal resin), so the LED is bound to transfer heat quickly. To the heat-conducting aluminum substrate (10), to avoid the light decay of the LED, the life of the LED can be increased. In particular, because the present invention forms a chemical record on the surface of the heat-conducting ruthenium substrate (10) by means of electroless plating, When the bottom of the heat-conducting substrate (10) is to be bonded to a heat-dissipating module, the chemical layer (5〇) at the bottom of the heat-conducting aluminum substrate (1〇) can be directly soldered to the heat-dissipating module because of chemistry. Both the recording and the tin solder are metal, so the heat dissipation effect is excellent, so the invention can efficiently transfer the heat on the heat-conducting substrate (1 〇) to the exothermic core, and the group avoids the heat-conducting chain substrate and the heat-dissipating module. A non-metallic interface is generated between each other and the heat conduction efficiency can be greater than 30% of the body of the existing heat-conducting substrate, so that the heat can be quickly dissipated. • [Simple Description of the Drawings] The first drawing is a flow chart of the present invention. A to the drawings are schematic cross-sectional views showing the flow steps of an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing a process step of a copper foil soft board according to an embodiment of the present invention. The above cross-sectional views are only schematic diagrams for those skilled in the art to understand the intrinsic knowledge of the present invention, and do not have the general knowledge of the ratio of & The details that can be understood, and the thicknesses and the like 6 shown are not drawn to scale, and are not intended to limit the size and thickness of the present invention. [Main component symbol description] (a) Substrate step (b) Top recess forming step (c) Anti-corrosion processing step (d) Screen printing insulating step (e) Forming a copper foil layer step with wiring and plating wire ( 0 electroless plating step (9) attaching high temperature resistant tape to the bottom of the substrate (h) electric money copper layer step (i) electroplating nickel layer step (j) tin, electric or gold ore step (k) removal plating Conductor step (丨) solder resist processing step (1〇) heat transfer substrate (10a) substrate to be processed (i〇b) electroless plating substrate (1〇c) light emitting diode heat sink substrate (11) recess (12) top Surface (20) film layer (30) insulating layer (40) with copper foil soft board (4〇') copper foil (40a) copper foil soft board (41) plastic soft board (42) with wiring and plating wire Copper foil (43) under copper foil (44) perforated (45) coating 201110430 (50) chemical nickel layer (51) high temperature resistant tape (60) electroplated copper layer (70) electroplated nickel layer (80) tin layer or gold layer or Silver layer (90) solder mask ink layer
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