201107828 AU0904104 31682twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子裝置，且特別是有關於一種 在訊號接墊作特殊設計之電子裝置。 【先前技術】 近年來，隨著資訊技術、無線行動通訊和資訊家電等 # 各項應用的快速發展，為了達到更便利、體積更輕巧化以 及更人性化的目的，許多資訊產品的輸入裝置已由傳統之 鍵盤或Μ既荨轉變為觸控顯不面板（t〇uch display panel)。 在現今一般的觸控顯示面板設計中，以觸控感測模式的設 計原理分類，大致可區分為電阻式、電容式、光學式、聲 波式以及電磁式等，其中又以電阻式及電容式為主流；以 , 結構組成分類，則可分為外掛式（adhesive type)及内建 式（built-in type )兩種。 φ 以電阻式觸控面板而言，主要是藉由單點按壓之壓 力，使得原本分開的導電層相互接觸而導通，因而在導通 處產生一電壓降(voltage dr〇p);經由測量電壓降的位置， 可以判^按壓發生之處位於面板上的座標。就電容式觸控 面板而σ，主要原理是在其内外側導電層產生均勻之低壓 電場，當導體(如人類之手指）與之接_會產生靜電結 &因而產纟微小之電容變化；經由測量電容變化的位 置，可以判斷接觸發生點位於面板上的座標。 般而5 ’在觸控面_周邊會設計與驗面板内的 201107828 AU0904104 31682tw£doc/n 二件電性連接的訊號接塾，以將觸控面板 ^。上述找號触幼W金料細域蓋在 jii明導案所構成。然而，在形成上述之透明導 电圖案的似彳程序中因使用高腐錄之㈣液（例如王 tUir主會對下層之金屬接墊產生過渡蝕刻或腐蝕， 而造成金屬接墊的受損。 【發明内容】 σ因此’本發明提供-種電子裝置，其可以解決傳統訊 號接墊中之金屬接墊容易因過渡蝕刻而受到損害的問題。 本發明提出一種電子裝置，包括多個電子元件、多條 導線、多個訊號接墊以及至少一金屬圖案。電子元件設置 在一基板上。導線設置於基板上，並且與電子元件電性連 接。訊號接墊與導線電性對應連接。上述至少一金屬圖案 位於至少一部分的訊號接墊上，其_上述至少一金屬圖案 與導線不直接接觸。 ^ 本發明提出一種電子裝置，其包括多個電子元件、多 條導線、多個訊號接墊、至少一虛擬接墊(dummypad)以及 至少一金屬圖案。電子元件設置在一基板上。導線設置於 基板上，並且與電子元件電性連接。訊號接墊與導線電性 對應連接。至少一虛擬接墊是設置於基板上，其中所述至 少一虛擬接墊不與導線直接連接。至少一金屬圖案位於虛 擬接墊上’金屬圖案與導線不直接接觸。 基於以上所述，由於本發明之訊號接墊是設置在金屬 201107828 AU0904I04 31682twf.doc/n 圖案的下方，於軸訊號接墊時不會有傷害下層金屬 層之問題。此外，金屬圖案與導線為同材質之金屬&膜， 金屬圖案是作為製程中識別接合位置或接合效果之用，、不 ^ .與導線連接以避免金屬圖案有腐蝕時會一路沿著導線腐钱 而導致斷線。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例’並配合所附圖式作詳細說明如下。 【實施方式】 圖1A為根據本發明一實施例之電子裝置在尚未設置 電路板之如的示意圖，圖1B為根據本發明一實施例之電 子裝置在設置電路板之後的示意圖。圖2A為圖1A沿著剖 面線A-A’與剖面線β·β，的剖面示意圖，圖2B為圖1B沿 著剖面線Α-Α，與剖面線Β-Β，的剖面示意圖。 請先參照圖1Α以及圖2Α，在尚未設置電路板之前的 φ 電子裳置包括電子元件102、導線104、訊號接塾106以及 至少一金屬圖案108。在一較佳實施例中，電子裝置更包 含至少一對位標記150。 電子元件102設置在基板100上。基板1〇〇可為玻璃 基板、軟性基板或是矽基板。電子元件102例如是電容式 觸控元件、電阻式觸控元件或是顯示晝素結構。上述之電 容式觸控元件、電阻式觸控元件或是顯示晝素結構可為已 -知的任何形式之電容式觸控元件、電阻式觸控元件或是顯 示晝素結構，以下所舉之例僅為說明之用，但並非用以限 201107828 AU_4104 31682twf.doc/n 定本發明。 舉例而言，若電子元件102為電容式觸控元件，如圖 3所示，則電子元件1〇2包括第一觸控接墊1〇、第二觸控 接墊"20、_第一連接線12以及第二連接線。第·-觸控接墊 10沿著第一方向（例如X方向）排列，且相鄰的兩個第一 觸控接墊10之間藉由第一連接線12而電性連接在一起。 第二觸控接墊20沿著第二方向(例如是γ方向)排列，且相 鄰的兩個第二觸控接墊20之間藉由第二連接線22而電性 連接在一起。一般而言，在第一連接線12與第二連接線 22之相交之處設置有一絕緣層，以避免第一連接線12與 第二連接線22電性短路。在本實施例中，第一觸控接墊 1〇與第二觸控接墊20可分別為金屬材質或是透明導電材 質（金屬氧化物）。 另舉一例來說，若電子元件102為顯示畫素結構，如 圖4所不，則電子元件102包括掃描線乩、資料線DL以 及旦素釔構30 ’其中晝素結構3〇包括主動元件4〇以及畫 素電極5G。每-晝素結構3〇會與對應的_條資料線DL 以及對應的一條掃描線SL電性連接。 無論上述之電子元件102為電容式觸控元件、電阻式 元件顯7^畫素結構’其皆需與外部電路或裝置電 一、接，藉以使訊號能輸出或輸入電子元件1〇2。因此， 子元件脱會透過導線（或稱為引線）而與其他的 外。Ρ电路或裝置電性連接。 D月再參照圖1Α以及圖2Α，導線1〇4設置在基板100 201107828 AU0904104 31682twf.doc/n 上，且導線刚與電子元件1〇2電性連接。若電子 為電容式觸控讀（如圖3所示> m ^塾1〇與每—行的第二觸控接墊2G會分別與對應的一^ ¥線104電性連接，藉以將第一觸控接㈣與第二觸控二201107828 AU0904104 31682twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device specially designed for a signal pad. [Prior Art] In recent years, with the rapid development of various applications such as information technology, wireless mobile communication, and information appliances, many information products have been input in order to achieve convenience, volume, and humanization. From the traditional keyboard or Μ 荨 to the touch display panel (t〇uch display panel). In today's general touch display panel design, the design principles of the touch sensing mode can be roughly classified into resistive, capacitive, optical, acoustic, and electromagnetic, among which resistive and capacitive. For the mainstream; to, the structural composition classification, can be divided into two types of (adhesive type) and built-in type (built-in type). In the case of a resistive touch panel, the pressure of a single point of pressing causes the originally separated conductive layers to be in contact with each other to conduct, thereby generating a voltage drop (voltage dr〇p) at the conduction; The position of the press can be judged by the coordinates on the panel where the press occurred. In the case of a capacitive touch panel, σ, the main principle is to generate a uniform low-voltage electric field in the inner and outer conductive layers, and when a conductor (such as a human finger) is connected thereto, an electrostatic junction & By measuring the position of the change in capacitance, it is possible to determine the coordinates at which the contact occurrence point is located on the panel. In general, 5' in the touch surface will be designed and tested in the 201107828 AU0904104 31682tw£doc/n two-piece electrical connection signal to the touch panel ^. The above-mentioned number of the contacted W gold material is covered by the jii Ming guide. However, in the sputum-like procedure for forming the transparent conductive pattern described above, the high-corrosion (4) liquid is used (for example, the king tUir main causes a transition etching or corrosion of the underlying metal pads, thereby causing damage to the metal pads. SUMMARY OF THE INVENTION [The present invention provides an electronic device that can solve the problem that a metal pad in a conventional signal pad is easily damaged by transient etching. The present invention provides an electronic device including a plurality of electronic components, a plurality of wires, a plurality of signal pads, and at least one metal pattern. The electronic components are disposed on a substrate. The wires are disposed on the substrate and electrically connected to the electronic components. The signal pads are electrically connected to the wires. The metal pattern is located on at least a portion of the signal pads, and the at least one metal pattern is not in direct contact with the wires. The present invention provides an electronic device including a plurality of electronic components, a plurality of wires, a plurality of signal pads, and at least one a dummy pad and at least one metal pattern. The electronic component is disposed on a substrate, and the wire is disposed on the substrate, And electrically connected to the electronic component. The signal pad is electrically connected to the wire. At least one dummy pad is disposed on the substrate, wherein the at least one dummy pad is not directly connected to the wire. At least one metal pattern is located in the virtual connection The metal pattern on the pad is not in direct contact with the wire. Based on the above, since the signal pad of the present invention is disposed under the pattern of the metal 201107828 AU0904I04 31682twf.doc/n, the underlying metal layer is not damaged when the axis signal is connected. In addition, the metal pattern and the wire are the same material of the metal & film, the metal pattern is used to identify the joint position or the joint effect in the process, and is not connected with the wire to avoid corrosion of the metal pattern. In order to make the above features and advantages of the present invention more comprehensible, the following detailed description of the embodiments will be described in detail below with reference to the accompanying drawings. FIG. A schematic diagram of an electronic device according to an embodiment of the invention is not provided with a circuit board, and FIG. 1B is an electronic device according to an embodiment of the invention. 2A is a schematic cross-sectional view of the cross-sectional line A-A' and the cross-sectional line β·β, and FIG. 2B is a cross-sectional line Α-Α along the section line Β-Β Referring to FIG. 1A and FIG. 2B, the φ electrons before the board is not provided include the electronic component 102, the wires 104, the signal interface 106, and the at least one metal pattern 108. In a preferred embodiment The electronic device further includes at least one pair of position marks 150. The electronic component 102 is disposed on the substrate 100. The substrate 1 can be a glass substrate, a flexible substrate or a germanium substrate. The electronic component 102 is, for example, a capacitive touch component and a resistor. The touch element or the display of the pixel structure. The capacitive touch element, the resistive touch element or the display pixel structure can be any form of capacitive touch element or resistive touch element. Or the display of the structure of the halogen, the following examples are for illustrative purposes only, but are not intended to limit the invention to 201107828 AU_4104 31682twf.doc/n. For example, if the electronic component 102 is a capacitive touch component, as shown in FIG. 3, the electronic component 1〇2 includes a first touch pad 1〇, a second touch pad “20, _ first The connecting line 12 and the second connecting line. The first touch pads 10 are arranged in the first direction (for example, the X direction), and the two adjacent first touch pads 10 are electrically connected together by the first connecting wires 12. The second touch pads 20 are arranged along the second direction (for example, the γ direction), and the two adjacent second touch pads 20 are electrically connected together by the second connecting lines 22. Generally, an insulating layer is disposed at the intersection of the first connecting line 12 and the second connecting line 22 to prevent the first connecting line 12 and the second connecting line 22 from being electrically short-circuited. In this embodiment, the first touch pad 1 〇 and the second touch pad 20 are respectively made of a metal material or a transparent conductive material (metal oxide). For another example, if the electronic component 102 is a display pixel structure, as shown in FIG. 4, the electronic component 102 includes a scan line 资料, a data line DL, and a 钇 钇 structure 30 昼 wherein the 昼 结构 structure 3 〇 includes an active element 4〇 and the pixel electrode 5G. Each 昼-structure 3〇 is electrically connected to the corresponding _th data line DL and a corresponding one of the scan lines SL. The above-mentioned electronic component 102 is a capacitive touch component, and the resistive component is electrically connected to an external circuit or device, so that the signal can be output or input to the electronic component 1〇2. Therefore, the sub-element is removed from the other by wires (or wires). ΡThe circuit or device is electrically connected. Referring again to FIG. 1A and FIG. 2B, the wire 1〇4 is disposed on the substrate 100 201107828 AU0904104 31682twf.doc/n, and the wire is just electrically connected to the electronic component 1〇2. If the electronic device is a capacitive touch read (as shown in FIG. 3), the second touch pad 2G of each line is electrically connected to the corresponding one of the wires 104, respectively. One touch connection (four) and second touch two
墊2〇所感應到的訊號傳輪出去。若電子元件脱為顯示晝 素結構（如圖4所示），則每一條資料線DL與每-條掃 描線SL f分別與對應的一條導線1〇4電性連接，藉以將 驅動訊號輸人到各晝素結構3G +。在本實關中導線 1〇4為金屬f線，其可為於形成電子元件1〇2的過程之 一併定義出。 甙號接塾106设置在基板1〇〇上，且每一訊號接墊 與對應的一條導線104電性連接。在本實施例中，訊號接 墊106為透明導電材料，其例如是金屬氧化物，譬如為氧 化銦錫或是氧化銦鋅。類似地，訊號接墊1〇6也可為於形 成電子元件102的過程之中一併形成。 特別是，在本實施例中，有一部分之訊號接墊為虛擬 接墊106a。所謂虛擬接墊l〇6a —般不與電子元件102電 性連接’因而其不具訊號接墊106的功能。然，虛擬接墊 l〇6a是與訊號接墊1〇6同時形成，其可作為檢測、測試或 是修補之用。上述之虛擬接墊106a的材質包括金屬氧化物 或金屬。 在本實施例中，金屬圖案108位於虛擬接墊106a上， 而且金屬圖案108與導線1〇4不連接或是不直接接觸。換 言之，金屬圖案108與導線1〇4之間是斷開的。而由於金 201107828 AU0904104 31682twf.doc/n 屬圖案108與導線l〇4各自覆蓋於虛擬接墊10如上，因此 透過虛擬接墊106a，金屬圖案1〇8與導線1〇4之間仍有電 性連接的關係。另外，金屬圖案1〇8覆蓋虛擬接墊1〇6a 一半以上的面積。此外，在本實施例中，除了虛擬接塾1〇6.a.. 之外，訊號接墊106上則不設置有金屬圖案。 一般來說，在基板100上會覆蓋上一層覆蓋層12〇， 藉以保護電子元件102以及與電子元件1〇2電性連接的導 線104。然為了使訊號接塾1〇6能與後續裝置或元件電性 連接’覆蓋層120會裸露出訊號接墊106。 ® 對位標記150位於基板1〇〇上，並位於虛擬接墊1〇6a 的至少一側。在本實施例中，在虛擬接墊l〇6a的一側設置 有個對位標§己150，在訊號接墊160的一侧也設置有另 一對位標記150。對位標記15〇可為於形成電子元件1〇2 的過程之中一併定義出。對位標記15〇可供後續訊號接墊 160與電路板接合時之對位之用。 接著，請參照圖1B及圖2B，本發明之電子裝置更包 括電路板130，其設置在訊號接塾上，並且與訊號 φ 接墊106電性連接。在本實施例中，電路板13〇為一軟性 電路板，其包括基材丨32以及導電結構134，其中電路板 之導電結構134與訊號接墊1〇6電性連接。 在本實施例中，於電路板130與訊號接墊1〇6之間更 包括一異方性導電膠140。藉由異方性導電膠14〇可使電 路板130黏著於基板1〇〇上，並且使電路板13〇之導電結 構134與訊號接墊106電性連接。一般來說，電路板13°〇 201107828 AU0904104 3I682twf.doc/n 上之一個導電結構134會對應與一個訊號接墊1〇6電性接 觸。 承上所述’本實施例之電子裝置中的訊號接墊106並 非如傳統之接墊是由金蜃接墊與覆蓋.在金屬接墊上之透明 導電圖案所構成。因此，本實施例之訊號接墊1〇6不會有 因製程中使用高腐蝕性之蝕刻液而會對金屬接墊造成損傷 的問題。另外，本實施例之訊號接墊1〇6並非金屬接墊， 因而也不會有金屬容易因暴露在空氣中而氧化或鏽蝕的問 題。 再者’本實施例在虛擬接墊l〇6a上設置金屬圖案 108。後續在將電路板13〇接合在基板1〇〇上之後便觀察金 屬圖案108上之壓痕，藉以判斷電路板13〇之接合程序的 品質良莠參考。值得一提的是，因本實施例之金屬圖案108 僅設置在虛擬接墊106a上，因此即使金屬圖案1〇8因暴露 在空氣中而氧化或鏽蝕’但因虛擬接墊1〇6a不作為訊號傳 遞之作用，因此金屬圖案108的氧化或鏽蝕並不會對電路 板130輿訊號接墊1 〇6之間的接合或電性連接關係造成不 良的影響。 上述實施例之電子裝置是在虛擬接墊l〇6a上設置金 屬圖案108，而在訊號接塾106上不設置金屬圖案。然而， 在其他的實施例之電子裝置中，亦可不形成虛擬接墊’且 在訊號接墊106上皆設置有金屬圖案，詳細說明如下。 圖5A為根據本發明一實施例之電子裝置在尚未設置 電路板之前的示意圖，圖5B為根據本發明一實施例之電 201107828 AU0904104 31682twf.doc/n 子裝置在設置電路板之後的示意圖。圖6A為圖5A沿著剖 面線A-A’與剖面線B-B’的剖面示意圖，圖6B為圖5B沿 著剖面線A-A’與剖面線B-B’的剖面示意圖。 •〜請先參照圖5A以及圖6A ’本實施例與上述實，施例之 相同之元件以相同的標號表示，且以下說明將不對相同的 元件重複贅述。本實施例與上述實施例不同之處在於本實 施例並未設置有虛擬接墊，所有接墊皆為訊號接墊1〇6。 而每一訊號接墊106上皆對應設置有一個金屬圖案1〇8。 特別是，每一金屬圖案108覆蓋對應的訊號接塾1〇6 一半 以下的面積。由於每一金屬圖案108覆蓋對應的訊號接塾 106 —半以下的面積’因此訊號接墊1〇6大部分的面積仍 並未被金屬圖案108所覆蓋。 接著，請參照圖5B與圖6B ’在將電路板13〇設置在 基板100之訊號接塾106上之後’電路板130上之導電结 構134與訊號接墊1〇6電性連接。類似地，在本實施例中， 於電路板130與訊號接墊106之間更包括一異方性導電膠 140。藉由異方性導電膠140可使電路板130黏著於基板 100上’並且使電路板130之導電結構134與訊號接墊ι〇6 電性連接。一般來說，電路板130上之一個導電結構134 會對應與一個訊號接墊106電性接觸。 由於本實施例之訊號接墊106大部分的面積仍並未被 金屬圖案108所覆蓋。因此電路板130上之導電結構134 是與大部分被裸露出的訊號接墊106電性連接。換言之， 在本實施例中，電路板130之導電結構134主要仍是直接 201107828 AU0904104 31682twf.doc/n 與訊號接墊106電性連接，而非經由金屬圖案108才電性 連接。本實施例在訊號接墊1〇6上設置金屬圖案108之目 的主要是，在將電路板130接合在基板丨〇〇上之後可觀察 金脣圖案108上之壓·痕，.藉以判斷電路板」3〇·之接合程序 的品質良莠參考。 類似地，在本實施例之電子裝置中，訊號接墊1〇6是 设置在金屬圖案108下方。因此，本實施例之訊號接墊1〇6 _ 不會有因製程中使用高腐钱性之钱刻液而會對下層金屬層 造成損傷的問題。另外，本實施例之訊號接墊1〇6並非使 用金屬接墊，因而也不會有金屬容易因暴露在空氣中而氧 化或鏽蝕的問題。 再者’本實施例之金屬圖案1〇8僅設置在訊號接墊1〇6 的少部分面積上，且金屬圖案108不作為訊號接墊1〇6與 電路板130之電性連接的橋樑’因此即使金屬圖案因 暴路在空氣中而氧化或鏽姓，金屬圖案的氧化或鏽姓 並不會對電路板130與訊號接墊1〇6之間的接合或電性連 ® 接關係造成不良的影響。 在圖1A與圖1B之實施例之電子裝置是在虛擬接墊上 設置金屬圖案’而在訊號接墊上不設置金屬圖案。在圖5A 與圖5B之實施例之電子裝置中則是未形成有虛擬接墊， 且在訊5虎接塾上皆設置有金屬圖案。根據本發明之另一實 方&例’可以疋結合上述兩實施例。也就是，在電子裝置中 設計有虛擬接塾且虛擬接塾上覆蓋有金屬圖案，同時在訊 號接塾上也設置有金屬圖案’且訊號接塾上之金屬圖案僅 201107828 AU0904104 31682twf.doc/n 覆蓋訊號接墊一半以下的面積。 本於明Ί發月已以實施例揭露如上’然其並非用以限定 =之=2技術領域十具有通常知識者，在不脫離 發明之仵^ 内’當可作鮮之更動與稱，，故本 Μ關當視後附之”專利翻所界定者為準。 【圖式簡單說明】 施例之電子裝置在尚未設置 圖1A為根據本發明 電路板之前的示意圖。 板之ί二S據本發明-實施例之謂置在設置電路 示意^為圖1Α沿_線Α Α，與剖面線帥，的剖面 示意圖_為__面線Α_Α，與剖面線帥的剖面 圖3與圖4為根據本發明之實施例之電子元 立 圖。 Ί卞的不意 ㈣f 為根據本發明—實施例之電子裝置在尚未μ罢 電路板之前的示意圖。 内未故置 板之==據本發明-實施例之電子裂置在設置電路 示意為圖5Α沿著剖面線Α_Α，與剖面線Β β，的剖面 圖®為圖5Β沿著剖面線α_α’與剖面線β_β，的立,】面 12 201107828 AU0904104 31682twf.doc/n 示意圖。 【主要元件符號說明】 • 10、. 20:·感應接墊 12、22 :連接線 30 :晝素結構 40 :主動元件 50:晝素錄 SL:掃描線 DL :資料線 100 :基板 102 :電子元件 104 :導線 106 :訊號接墊 106a .虛擬接塾 108 :金屬圖案 • 120 :覆蓋層 130 :電路板 132 :基材 134 :導電結構 140 :異方性導電膠 150 :對位標記The signal sensed by the pad 2 is passed out. If the electronic component is off-displayed as a display element structure (as shown in FIG. 4), each of the data lines DL and each of the scan lines SLf are electrically connected to a corresponding one of the wires 1〇4, thereby inputting the driving signal. To each morpheme structure 3G +. In the present embodiment, the wire 1〇4 is a metal f-line which can be defined as one of the processes for forming the electronic component 1〇2. The nicknames 106 are disposed on the substrate 1 and each of the signal pads is electrically connected to the corresponding one of the wires 104. In the present embodiment, the signal pad 106 is a transparent conductive material such as a metal oxide such as indium tin oxide or indium zinc oxide. Similarly, the signal pads 1〇6 may also be formed in the process of forming the electronic component 102. In particular, in this embodiment, a portion of the signal pads are dummy pads 106a. The so-called virtual pad 16a is generally not electrically connected to the electronic component 102 and thus does not function as the signal pad 106. However, the virtual pad l〇6a is formed simultaneously with the signal pad 1〇6, which can be used for detection, testing or repair. The material of the dummy pad 106a described above includes a metal oxide or a metal. In the present embodiment, the metal pattern 108 is located on the dummy pad 106a, and the metal pattern 108 is not connected or directly in contact with the wire 1〇4. In other words, the metal pattern 108 is disconnected from the wire 1〇4. Since the gold 201107828 AU0904104 31682twf.doc/n genus pattern 108 and the wire 〇4 each cover the dummy pad 10 as above, there is still electrical continuity between the metal pattern 1 〇 8 and the wire 1 〇 4 through the dummy pad 106a. The relationship of the connection. In addition, the metal pattern 1〇8 covers an area of more than half of the dummy pads 1〇6a. In addition, in this embodiment, in addition to the virtual interface 1〇6.a.., the signal pad 106 is not provided with a metal pattern. Generally, a cover layer 12 is covered on the substrate 100 to protect the electronic component 102 and the wires 104 electrically connected to the electronic component 1〇2. However, in order for the signal contacts 1 to 6 to be electrically connected to subsequent devices or components, the overlay 120 will expose the signal pads 106. The registration mark 150 is located on the substrate 1〇〇 and is located on at least one side of the dummy pads 1〇6a. In the present embodiment, a pair of alignment marks 150 are disposed on one side of the dummy pads 100a, and another pair of bit marks 150 are disposed on one side of the signal pads 160. The alignment mark 15〇 can be defined together in the process of forming the electronic component 1〇2. The alignment mark 15 is used for alignment of the subsequent signal pads 160 when the board is bonded. Next, referring to FIG. 1B and FIG. 2B, the electronic device of the present invention further includes a circuit board 130 disposed on the signal interface and electrically connected to the signal φ pad 106. In the present embodiment, the circuit board 13 is a flexible circuit board including a substrate 32 and a conductive structure 134, wherein the conductive structure 134 of the circuit board is electrically connected to the signal pads 1〇6. In this embodiment, an anisotropic conductive paste 140 is further included between the circuit board 130 and the signal pad 1A6. The circuit board 130 is adhered to the substrate 1 by the anisotropic conductive adhesive 14 ,, and the conductive structure 134 of the circuit board 13 is electrically connected to the signal pad 106. In general, a conductive structure 134 on the board 13° 〇 201107828 AU0904104 3I682twf.doc/n will correspond to a signal pad 1 〇 6 for electrical contact. The signal pad 106 in the electronic device of the present embodiment is not composed of a metal pad and a transparent conductive pattern covering the metal pad as in the conventional pad. Therefore, the signal pads 1〇6 of this embodiment do not have the problem of damage to the metal pads due to the use of highly corrosive etching liquids in the process. Further, the signal pad 1〇6 of the present embodiment is not a metal pad, and thus there is no problem that the metal is easily oxidized or rusted by exposure to the air. Furthermore, this embodiment provides a metal pattern 108 on the dummy pad 16a. Subsequent to bonding the circuit board 13 to the substrate 1A, the indentation on the metal pattern 108 is observed, thereby judging the quality of the bonding process of the board 13〇. It is worth mentioning that since the metal pattern 108 of the embodiment is only disposed on the dummy pad 106a, even if the metal pattern 1〇8 is oxidized or rusted due to exposure to the air, the virtual pad 1〇6a is not used as a signal. The function of the transfer, therefore, the oxidation or rust of the metal pattern 108 does not adversely affect the bonding or electrical connection between the circuit board 130 and the signal pads 1 〇6. In the electronic device of the above embodiment, the metal pattern 108 is disposed on the dummy pad 106a, and the metal pattern is not disposed on the signal port 106. However, in the electronic device of other embodiments, the dummy pads are not formed and the metal pads are disposed on the signal pads 106, as described in detail below. 5A is a schematic diagram of an electronic device before a circuit board is disposed, according to an embodiment of the present invention, and FIG. 5B is a schematic diagram of the electric device 201107828 AU0904104 31682twf.doc/n sub-device after setting a circuit board according to an embodiment of the invention. Fig. 6A is a schematic cross-sectional view taken along line A-A' and hatching B-B' of Fig. 5A, and Fig. 6B is a schematic cross-sectional view taken along line A-A' and hatching B-B' of Fig. 5B. The components of the present embodiment that are the same as those of the above-described embodiments are denoted by the same reference numerals, and the description of the same components will not be repeated. The difference between this embodiment and the above embodiment is that the virtual pad is not provided in the embodiment, and all the pads are signal pads 1〇6. Each of the signal pads 106 is correspondingly provided with a metal pattern 1〇8. In particular, each metal pattern 108 covers an area less than half of the corresponding signal interface 1〇6. Since each of the metal patterns 108 covers the area below the corresponding signal interface 106, the majority of the area of the signal pads 1〇6 is still not covered by the metal pattern 108. Next, referring to FIG. 5B and FIG. 6B', after the circuit board 13 is disposed on the signal interface 106 of the substrate 100, the conductive structure 134 on the circuit board 130 is electrically connected to the signal pad 1〇6. Similarly, in the embodiment, an anisotropic conductive paste 140 is further included between the circuit board 130 and the signal pad 106. The circuit board 130 is adhered to the substrate 100 by the anisotropic conductive paste 140 and the conductive structure 134 of the circuit board 130 is electrically connected to the signal pad ι6. Generally, a conductive structure 134 on the circuit board 130 is electrically connected to a signal pad 106. Since most of the area of the signal pad 106 of this embodiment is still not covered by the metal pattern 108. Therefore, the conductive structure 134 on the circuit board 130 is electrically connected to most of the exposed signal pads 106. In other words, in the present embodiment, the conductive structure 134 of the circuit board 130 is still electrically connected directly to the signal pad 106, and is not electrically connected via the metal pattern 108. The purpose of providing the metal pattern 108 on the signal pad 1〇6 in this embodiment is mainly to observe the pressure/mark on the gold lip pattern 108 after the circuit board 130 is bonded on the substrate board, thereby judging the circuit board. The quality of the joint procedure of 3〇· is good reference. Similarly, in the electronic device of the embodiment, the signal pads 1〇6 are disposed under the metal pattern 108. Therefore, the signal pad 1〇6 _ of the present embodiment does not have the problem of damage to the underlying metal layer due to the use of high-corrosion money engraving in the process. Further, the signal pad 1〇6 of the present embodiment does not use a metal pad, and thus there is no problem that the metal is easily oxidized or rusted by exposure to the air. Furthermore, the metal pattern 1 〇 8 of the present embodiment is disposed only on a small portion of the signal pad 1 〇 6 , and the metal pattern 108 is not used as a bridge for electrically connecting the signal pads 1 〇 6 to the circuit board 130. Even if the metal pattern is oxidized or rusted due to a storm in the air, the oxidation or rust of the metal pattern does not cause a problem of bonding or electrical connection between the circuit board 130 and the signal pad 1〇6. influences. In the electronic device of the embodiment of Figs. 1A and 1B, a metal pattern ' is disposed on the dummy pad and no metal pattern is disposed on the signal pad. In the electronic device of the embodiment of FIG. 5A and FIG. 5B, a dummy pad is not formed, and a metal pattern is disposed on the interface. Another embodiment &example' according to the present invention may be combined with the above two embodiments. That is, a virtual interface is designed in the electronic device and the virtual interface is covered with a metal pattern, and a metal pattern is also provided on the signal interface, and the metal pattern on the signal interface is only 201107828 AU0904104 31682twf.doc/n Covers the area below half of the signal pad. The present invention has been disclosed in the above-mentioned examples. However, it is not intended to be limited to ===2 technical field 10 has the usual knowledge, and it can be used as a fresh change without weighing it. Therefore, it is subject to the definition of patents attached to it. The simple description of the electronic device of the embodiment is not shown in Fig. 1A before the circuit board according to the present invention. The present invention-embodiment is placed in the setting circuit, which is shown in Fig. 1 along the line _ Α Α, and the cross-sectional line diagram is _ _ _ 面 Α Α Α 与 与 Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α An electronic unit diagram according to an embodiment of the present invention. (4) f is a schematic diagram of an electronic device according to the present invention before the circuit board is not yet placed. For example, the electronic crack is set in the circuit as shown in Fig. 5, along the section line Α_Α, and the section line Β β, the section view® is shown in Fig. 5 along the section line α_α' and the section line β_β,] face 12 201107828 AU0904104 31682twf.doc/n Schematic. [Main component symbol description 】 10, 20: Inductive pads 12, 22: Connection line 30: Alizarin structure 40: Active component 50: 昼 录 SL SL: Scanning line DL: Data line 100: Substrate 102: Electronic component 104: Wire 106 : Signal pad 106a. Virtual interface 108: Metal pattern • 120: Cover layer 130: Circuit board 132: Substrate 134: Conductive structure 140: Anisotropic conductive adhesive 150: Alignment mark